October 14–18, 2018 Donald E. Stephens Convention Center Rosemont, IL TECHNICAL CONFERENCE October 14–18
ELECTRONICS EXHIBITION October 16–17
PREMIUM SPONSOR
Electronics Manufacturing Conference & Expo Conference is Co-located with IPC Fall Standards Development Committee Meetings Expo is Co-located with Sensors Midwest
www.smta.org/smtai
TECHNICAL CONFERENCE October 14–18
ELECTRONICS EXHIBITION October 16–17
SMTA International is the industry’s premier conference and exposition that collectively delivers focused technical solutions for today’s electronics assembly and manufacturing challenges. >> Over 130 technical papers from global experts, making it the conference where the industry’s most respected authors choose to present their research. >> 20 half day courses to enhance your career. Courses are taught by industry experts. >> Nine technical tracks addressing: • Advanced Packaging Technology • Manufacturing Excellence • Flux, Solder, Adhesives • Inspection/Counterfeit Electronics • Substrates • Women’s Leadership Program • Technical Innovations • Lead-Free Soldering Technology • Harsh Environments
EARLY REGISTRATION DISCOUNT! Register by
Friday, September 21 Full details on pages 34-35.
Discover the latest products and services >> The exhibition has everything you need to keep up with
rapidly changing technology, identify innovative solutions, and maintain your competitive edge. >> See new products and equipment during the Expo. >> Get immediate answers and experience unique one-on-one networking opportunities on and off the show floor.
TABLE OF CONTENTS Technical Advisory Committee . . . . . . . . . . . . 3 Global Board of Directors . . . . . . . . . . . . . . . . . . 3 Conference at a Glance . . . . . . . . . . . . . . . . . . . 4-5 Electronics Exhibition . . . . . . . . . . . . . . . . . . . . . . 6 Special Meetings . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 IPC Fall Standards Development Committee Meetings . . . . . . . . . . . . . . . . . . . . . 8 Special Events . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-11 SMTA Annual Meeting and Keynote Presentation . . . . . . . . . . . . . . . 9 Poster Session . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Livin' La Vida SMTA . . . . . . . . . . . . . . . . . . . . . . . 10 Career Center . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Fun Run . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Beer Tasting and Reception . . . . . . . . . . . . . . . 10
Metallographic Photo Contest . . . . . . . . . . . . . 11 Certification Program . . . . . . . . . . . . . . . . . . . . . . 11 Professional Development Courses . . . . 12-21 Sunday, October 14 . . . . . . . . . . . . . . . . . . . . . . . 12 Monday, October 15 . . . . . . . . . . . . . . . . . . . . . . 16 Spotlight Sessions . . . . . . . . . . . . . . . . . . . . . . 22-23 Technical Sessions . . . . . . . . . . . . . . . . . . . . . . 24-33 Monday, October 15 . . . . . . . . . . . . . . . . . . . . . . 24 Tuesday, October 16 . . . . . . . . . . . . . . . . . . . . . . 26 Wednesday, October 17 . . . . . . . . . . . . . . . . . . . 28 Thursday, October 18 . . . . . . . . . . . . . . . . . . . . . 31 Registration Information . . . . . . . . . . . . . . . . . . 34 Hotel & Travel Information . . . . . . . . . . . . . . . . 34 Registration . . . . . . . . . . . . . . . Inside Back Cover
The distinguished SMTA International Technical Advisory Committee includes electronics manufacturing and packaging experts representing all segments of the industry. The Committee designed the 2018 conference program to ensure that today’s latest trends and developments are fully addressed. Rob Rowland Conference Director Axiom Electronics LLC
Richard Coyle, Ph.D. VP of Technical Programs Nokia Bell Labs
Raiyo F. Aspandiar, Ph.D. Intel Corporation
Jay Gorajia Mentor, A Siemens Business
Andrew Mawer NXP Semiconductors
Donald Banks Abbott
Sa'd Hamasha, Ph.D. Auburn University
Iulia Muntele, Ph.D. Sanmina Corporation
Elizabeth Benedetto HP Inc.
Denis Jean Kester
Brian Roggeman Qualcomm Inc.
Lars Böttcher Fraunhofer IZM Berlin
Jeff Kennedy Celestica Inc.
Brook Sandy-Smith Indium Corporation
Keith Bryant YXLON International GmbH
Robert Kinyanjui, Ph.D. John Deere Electronic Solutions
Chrys Shea Shea Engineering Services
Bill Cardoso, Ph.D. Creative Electron, Inc.
Terry Kocour Lockheed Martin
Srinivas Chada, Ph.D. Stryker
Dale Lee Plexus Corp.
Marie Cole IBM Corporation
Pradeep Lall, Ph.D., MBA Auburn University
Priyanka Dobriyal, Ph.D. Intel Corporation
Pedro Martinez Intel Corporation
Trevor Galbraith Global SMT & Packaging
Lenora Clark MacDermid Enthone Paul Vianco, Ph.D. Sandia National Laboratories Charles G. Woychik, Ph.D. i3 Electronics Anny Zhang Indium Corporation
SMTA Global Board of Directors OFFICERS Jeff Kennedy, President Celestica Inc. Richard Coyle, Ph.D. Vice President Technical Programs Nokia Bell Labs Debbie Carboni Vice President Expositions KYZEN Corporation
Eileen Hibbler, Vice President Membership TEK Products Robert Kinyanjui, Ph.D., Treasurer John Deere Electronic Solutions Sal Sparacino Vice President Communications ZESTRON Americas
Gregory Vance, Secretary Rockwell Automation
STRATEGIC DEVELOPMENT COMMITTEE Matt Kelly, P.Eng., MBA, Chair IBM Corporation Martin Anselm, Ph.D. Rochester Institute of Technology
Rich Henrick Sanmina Corporation
William Capen Honeywell FM&T
Tim Jensen Indium Corporation
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SMTA International 2018 >> 3
GENERAL INFORMATION
SMTA International Technical Advisory Committee
CONFERENCE AT A GLANCE GENERAL INFORMATION
PROFESSIONAL DEVELOPMENT COURSES SUNDAY, OCTOBER 14 MONDAY, OCTOBER 15 7 am
7 am
Registration Opens
Registration Opens
8 am
8 am
8:30 am – 12:00 pm 9 am
10 am
11 am
8:30 am – 12:00 pm
PDC1: Design and Assembly Process Principles for High Density Flexible and Rigid Flex Circuits PDC2: Jump Start – a Free Introduction to SMT Process Basics and Troubleshooting PDC3: The Incredible Shrinking World of Electronics – Are Traditional DFM, DFR, DFF Methods Obsolete? PDC4: Reflow, Wave and Rework Soldering Process Optimization in Electronics Manufacturing PDC5: Tin Whiskers: A 2018 State of the Industry Assessment
9 am PDC11: Design and Assembly Process Challenges for Bottom Terminations Components (BTCs) such as QFN, DFN and MLF in Tin-Lead & Lead-Free World PDC12: Achieving High Reliability for Lead-Free 10 am Solder Joints – Materials Consideration PDC13: Solder Joint Reliability – Principles and Applications 11 am PDC14: Weeding Out PCB Fabrication Defects Before Assembly PDC15: Defect Analysis and Process Troubleshooting: Part 1
Noon
Noon
Lunch Break
Lunch Break
1 pm
1 pm
1:30 pm – 5:00 pm 2 pm
3 pm
4 pm
1:30 pm – 5:00 pm
PDC6: Utilizing IPC1782 – Component Traceability – to Reduce the Risk of Counterfeit Components, Improve Quality, Increase Reliability, Decrease Costs, and Drive Product Innovation PDC7: Interconnections: PCB and Solder – Not Just Your Normal Failure Modes Any More PDC8: Printing and Its Affect on Manufacturing Yield PDC9: New Developments in Selective Soldering Technology PDC10: Solder Paste Qualification Using the SMTA Miniaturization Test Vehicle
T R AC K K E Y
Advanced Packaging Technology (APT) Flux, Solder, Adhesives (FSA) Harsh Environments Applications (HE) Inspection Technologies (INS)
PDC16: Defect Analysis and Process Troubleshooting: Part 2 2 pm PDC17: Ball Grid Array: Design and Assembly of BGAs with Emphasis on Backward Compatibility 3 pm PDC18: Design for Excellence II: Physics of Failure PDC19: Reliability of Electronics – the Role of Intermetallic Compounds 4 pm PDC20: Surface Finish Alternatives to HASL for PCB Applications
Lead-Free Soldering Technology (LF) Manufacturing Excellence (MFX) Substrates/PCB Technology (SUB) Technical Innovations (TI)
SESSIONS – MONDAY, OCTOBER 15 7 am
7 am
Registration Opens 8 am
9 am
8 am
HE Track
TI Track
HE1 – Predicting Component Life for Harsh Environments 8:30 am – 10:00 am
TI1 – Smart Manufacturing for Electronics 8:30 am – 10:00 am
9 am
Refreshment Break
10 am
10 am
11 am
HE2 – Reliability of Lead-Free Solder Alloys in Automotive Environment 10:30 am – 12:00 pm
TI2 – Industry 4.0: Why Do We Need It? 10:30 am – 12:00 pm
11 am
Noon
Noon
Lunch Break 1 pm
2 pm
HE3 – New Materials and Methods for Electronic Products in Harsh Environments 1:30 pm – 3:00 pm
3 pm
HE4 – Improving Manufacturing Process to Provide Better Survivability 4 pm of Electronic Products 3:30 pm – 5:00 pm 5 pm
4 >> SMTA International 2018
TI Keynote Lunch 12:30 pm – 1:30 pm Break
TI3 – Blockchain and Predictive Field Reliability 2:00 pm – 3:00 pm
1 pm
Women’s Leadership Program Technical and Leadership Presentations 1:30 pm – 3:00 pm
3 pm
Refreshment Break TI4 – Additive Manufacturing (3D Printing) for Electronic Circuitry 3:30 pm – 5:00 pm
2 pm
Speed Networking with Table Topics 3:30 pm – 5:00 pm
Connection Reception 5:00 pm – 6:00 pm
SMTAssociation
4 pm
5 pm
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SESSIONS – TUESDAY, OCTOBER 16 7 am
Registration Opens
8 am
8 am
SMTA Annual Meeting & Keynote Presentation 8:00 am – 10:00 am
9 am
9 am
10 am
11 am
Noon
APT TRACK
APT1 – Trends in Advanced Packaging and 3D Interconnects 11:00 am – 12:30 pm
MFX TRACK
MFX1 – Solder Printing 11:00 am – 12:30 pm
1 pm
2 pm
3 pm
10 am
Refreshment Break SUB TRACK
FSA TRACK
SUB1 – Electroless FSA1 – Solder Paste Nickel Immerison Gold Development to Overcome Processing Considerations Component Challenges 11:00 am – 12:30 pm 11:00 am – 12:30 pm
Spotlight Series
Spotlight 1 11:00 am – 12:30 pm
MFX2 – Assembly Challenges 2:00 pm – 4:00 pm
SUB2 – Enhanced Copper Plating Technologies 2:00 pm – 3:30 pm
Noon
1 pm
Lunch Break APT2 – Assembly and Reliability of Bottom Termination Components 2:00 pm – 4:00 pm
11 am
Spotlight 2 1:30 pm – 3:30 pm
FSA2 – Solder Paste Rheology, Performance, and Aging 2:00 pm – 3:30 pm
2 pm
3 pm
4 pm
4 pm
SESSIONS – WEDNESDAY, OCTOBER 17 7 am
8 am
9 am
APT3 – Package Warpage Effects on Assembly and Reliability 8:00 am – 9:30 am
MFX3 – Void Reduction/ BTC Challenges in Assembly 8:00 am – 9:30 am
APT4 – Board Level Reliability 10:30 am – 12:00 pm
MFX4 – Cleaning & Coating 10:30 am – 12:00 pm
10 am
11 am
7 am
Registration Opens SUB3 – PCB Reliability 8:00 am – 10:00 am
8 am
FSA3 – Considerations for Assuring Reliable Assemblies 8:00 am – 9:30 am
9 am
10 am
Refreshment Break SUB4 – Surface Finish – What's New or Different? 10:30 am – 12:00 pm
FSA4 – Low Melting Point Materials Development 10:30 am – 12:00 pm
Spotlight 3 10:30 am – 12:00 pm
Noon
11 am
Noon
Lunch Break 1 pm
2 pm
1 pm APT5 – Advances in Technology for Power Packaging 1:30 pm – 3:00 pm
MFX5 – Reflow Technologies 1:30 pm – 3:00 pm
3 pm
SUB5 – Microvia Learning Lab 1:30 pm – 3:00 pm
Spotlight 4 1:30 pm – 3:00 pm
2 pm
3 pm
Beer Tasting & Reception on Expo Floor – Hall F
SESSIONS – THURSDAY, OCTOBER 18 7 am 8 am 9 am
7 am
Registration Opens APT6 – Reliability of Intermetallics in Various Interconnects 8:00 am – 9:30 am
MFX6 – Manufacturing Operational Challenges 8:00 am – 9:30 am
INS TRACK
INS1 – Inspection Applications 8:00 am – 9:30 am
LF Symposium
LF1 – Low Temp Solder Paste and its Process Development 8:00 am – 9:30 am
8 am 9 am
Refreshment Break 10 am 11 am
APT7 – Reliaiblity of Low Temperature Solder (LTS) Interconnects 10:00 am – 12:00 pm
MFX7 – Rework 10:00 am – 11:30 am
Noon
INS2 – Inspection 4.0 10:00 am – 12:00 pm
LF2 – High Reliability Pb-free Alloys, SAC305 and Beyond 10:00 am – 12:00 pm
INS3 – Inspection Capabilities 1:00 pm – 2:30 pm
2 pm
11 am Noon
Lunch Break
1 pm
10 am
LF3 – Properties and Behavior of Solders Containing Bismuth 1:00 pm – 2:30 pm
1 pm
LF4 – Reliability of Doped Sn Based Lead-Free Alloys 3:00 pm – 4:30 pm
3 pm
2 pm
Refreshment Break 3 pm
INS4 – Counterfeit Detection 3:00 pm – 4:30 pm
4 pm
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4 pm
SMTA International 2018 >> 5
GENERAL INFORMATION
7 am
ELECTRONICS EXHIBITION GENERAL INFORMATION
Discover the latest products and services from leading suppliers. Exhibit hall registration is FREE for attendees who register in advance. Lunch coupon ($8 value) for Tuesday and Wednesday is available at no charge. For more exhibitor information visit the Exhibit Info page at www.smta.org/smtai or contact Hannah Funk (hannah@smta.org) or Courtney Kalb (courtney@smta.org).
Exhibitor List (as of July 16) 5N Plus Micro Powders Acculogic Inc. ACL Staticide, Inc. Aegis Industrial Software Corporation AGI Corporation AIM Solder Akrometrix, LLC Allfavor Technology Alltemated Inc. Alpha Assembly Solutions/ MacDermid American Hakko Products, Inc. American Standard Circuits, Inc. Amerway Inc./Conecsus LLC Anda America & Hong Kong Apex Tool Group - Weller Ascentech LLC ASM Assembly Systems, LLC ASYS Group Americas Inc. Aven Tools, Inc. BEST Inc. BJ Electronics Co., Ltd. BlueRing Stencils Blue Thunder Technologies, Inc. BOFA Americas, Inc. BTU International CAIG Laboratories, Inc. CalcuQuote Circuits Assembly/UP Media Clariant Cogiscan Conductive Containers, Inc. Creative Electron, Inc. Crystal Mark, Inc. CTI Systems/ Conveyor-Technologies Dimation, Inc. ELANTAS PDG, Inc. Entrada Group EPTAC Corporation ERSA North America Esdman Co., Ltd. ESSEMTEC USA Eternity Technology Corporation Europlacer Americas Fancort Industries FKN Systek Fuji America Corporation/ Heller Industries 6 >> SMTA International 2018
Garland Service Company Glenbrook Technologies, Inc. Global SMT & Packaging GPD Global, Inc. Hanwha Techwin Automation Americas, Inc. Harimatec, Inc. HEPCO, Inc. Heraeus Electronics ICAPE Group IConnect007 Indium Corporation Inovaxe Corporation InsulFab PCB Tooling ITW EAE IPC JBC Tools USA Inc. Juki Automation Systems Kester KIC Koh Young America KOKI Solder America KYZEN Corporation Metallic Resources, Inc. METCAL (OK International) MicroCare Corporation MicroScreen LLC Mid America Taping & Reeling, Inc. MIRTEC Corporation Mycronic, Inc. National Technical Systems NCAB Group Nihon Superior Company, Ltd. Nikon Metrology, Inc. Nordson ASYMTEK Nordson DAGE Nordson EFD Nordson SELECT Nortec Humidity Omron Inspection Systems Optillia Instruments PACE Worldwide PalPilot International Corporation Panasonic Factory Solutions of America PARMI USA, Inc. Photo Etch Technology Pillarhouse USA, Inc. Qualitek International, Inc.
Quantum Storage Systems Rehm Thermal Systems, LLC Safari Circuits, Inc. Saki America, Inc. Scienscope Scoop SCS Exhibitions Ltd. SEHO North America, Inc. Seica Inc. Seika Machinery, Inc. Senju Comtek Corporation Shenmao USA, Inc. Simplimatic Automation Smart Sonic SMTA SMT Connect SMT Today Solderstar LLC Sonoscan, Inc. SPEA America, LLC Specialty Coating Systems Speedprint Technology StaticStop StenTech STI Electronics, Inc. Super PCB Surfx Technologies TAGARNO USA Technimark, Inc. Teradyne, Inc. Test Research, Inc. TEXMAC Inc. The Test Connection, Inc. Tintronics Industries TOPLINE Universal Instruments Corporation US Tech V-Tek, Inc. Viscom Inc. VisiConsult X-Ray Solutions America Corporation WNIE Ltd. Yamaha – Trans Tec America YXLON FeinFocus ZESTRON Zymet, Inc. SMTAssociation
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GENERAL INFORMATION
SMTA International Exhibitor Committee Debbie Carboni, Chair KYZEN Corporation Mick Austin ITW EAE
Timothy O’Neill AIM Solder
Sal Sparacino ZESTRON Americas
Bill Burnet Weller
Kristi Schilloff Universal Instruments Corporation
Sherry Stepp KYZEN Corporation
Hal Hendrickson Nordson Test and Inspection
Erika Sebens Alpha Assembly Solutions
Eric Moen AIM Solder
Robert Wallace Alpha Assembly Solutions
IMPORTANT MEETINGS Monday, October 14 Speaker Breakfast.......................................................7:00 am Women’s Leadership Program ........................1:30 pm Certification Committee......................................2:00 pm Women’s Connection Reception....................5:00 pm Tuesday, October 15 Speaker Breakfast.......................................................7:00 am Annual Meeting/Keynote Presentation.......8:00 am Chapter Officer Lunch........................................ 12:30 pm Ambassador & Membership Committee......5:00 pm
Wednesday, October 16 Speaker Breakfast.......................................................7:00 am Chapter Leadership Committee.......................8:00 am Training Committee.................................................9:00 am MarCom Committee..............................................2:00 pm Technical Committee.............................................4:30 pm Thursday, October 17 Speaker Breakfast.......................................................7:00 am
Sincere thanks to our SMTA International Sponsors! Premium Sponsor
Conference Tote Bags Sponsor
Expo Reception Sponsors Women’s Leadership Program Sponsor
Official Fiesta Sponsors
®
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SMTA International 2018 >> 7
Fall Standards Development Committee Meetings Contribute to the industry standards and guidelines that your company, customers and suppliers rely on. All SMTAI registrants are welcome to attend IPC committee meetings excluding those designated as “By Invitation.” Registration is required. For more information, including committee descriptions and current projects, visit www.ipc.org/fall-meetings. Topics
SPECIAL EVENTS
Assembly and Joining Cleaning and Coating Data Generation & Transfer/Documentation Electronic Documentation Technology Electronic Product Data Description Embedded Devices Environment, Health & Safety (EHS)
Flexible and Rigid-Flex Printed Boards High Speed/High Frequency Interconnections Management Packaged Electronic Components Printed Board Design Technology Printed Electronics Product Assurance
Saturday, October 13 8:00 am – 5:00 pm
5-22A J-STD-001 Task Group
Sunday, October 14 7-31B IPC-A-610 Task Group 7-31A/D-33A Joint Meeting – IPC-A-600 and Rigid Printed Board Performance Specifications Task Groups 8:30 am – 4:30 pm 5-21A IPC-7070 Task Group 10:00 am – 4:00 pm D-55 Embedded Devices Process Implementation Subcommittee 10:00 am – 4:00 pm D-64 Printed Electronics Final Assembly Subcommittee 3:00 pm – 4:30 pm 5-20/7-30 Joint Meeting Assembly & Joining Committee 4:30 pm – 6:00 pm CCC Committee Chairman Council (By Invitation) 8:00 am – 3:00 pm 8:00 am – 4:30 pm
Monday, October 15 8:00 am – 10:00 am D-32 Thermal Stress Test Methods Subcommittee 8:00 am – 12:00 pm 2-18H Conflict Minerals Data Exchange Task Group 8:00 am – 5:00 pm 5-22A/7-31B Joint Meeting – J-STD-001 & IPC-A-610 Task Groups 8:00 am – 10:00 am 5-31G Stencil Cleaning Task Group 8:00 am – 12:00 pm 3-11 Laminate/Prepreg Materials Subcommittee 8:00 am – 10:00 am 5-23B Component and Wire Solderability Specification Task Group 8:00 am - 12:00 pm Joint Session: 5-21F Ball Grid Array Task Group, 5-21G Flip Chip Mounting Task Group, 5-21H Bottom Termination Components Task Group, 5-22H Thermal Profiling Task Group, B-11 3D Electronic Packages Subcommittee 8:00 am – 12:00 pm 1-14 DFX Standards Subcommittee 10:15 am – 12:00 pm 5-23A Printed Circuit Board Solderability Specifications Task Group 10:15 am – 12:00 pm D-36 Printed Board Process Capability, Quality and Relative Reliability Benchmark Test Subcommittee 10:15 am – 12:00 pm 7-11 Test Methods Subcommittee 10:15 am – 12:00 pm 2-19A Critical Components Traceability Task Group 1:30 pm – 5:00 pm 2-17 Data Connect Factory Subcommittee 1:30 pm – 3:00 pm 3-12D Woven Glass Reinforcement Task Group 1:30 pm – 3:00 pm 5-32B SIR and Electrochemical Migration Task Group 1:30 pm – 3:00 pm 7-31M Fiber Optic Cable Acceptability Task Group 1:30 pm – 5:00 pm 1-10C Test Coupon and Artwork Generation Task Group 1:30 pm – 5:00 pm 2-18J Laboratory Report Declaration Task Group 3:15 pm – 5:00 pm D-35 Printed Board Storage and Handling 3:15 pm – 5:00 pm 5-31J Cleaning Compatibility Task Group 3:15 pm – 5:00 pm 3-12E Base Materials Roundtable Task Group 3:15 pm – 5:00 pm 5-33G Low Pressure Molding Task Group 3:15 pm – 5:15 pm 7-31MT IPC-A-640 Fiber Optic Training Advisory Committee 5:00 pm – 6:30 pm TAEC Technical Activities Executive Committee (By Invitation)
Tuesday, October 16 8:00 am – 10:00 am 1-10C Test Coupon and Artwork Generation Task Group – 2nd Session 8:00 am – 3:00 pm 2-18 Supplier Declaration Subcommittee 8:00 am – 10:00 am 5-33B Solder Mask Performance Task Group 8:00 am – 10:00 am 3-12A Metallic Foil Task Group 8:00 am – 5:00 pm 2-18B Materials Declaration Task Group 8:00 am – 10:00 am D-24D High Frequency Signal Loss Test Methods Task Group 8:00 am – 5:00 pm 7-31F IPC/WHMA-A-620 Task Group 8:00 am – 10:00 am B-10A Plastic Chip Carrier Cracking Task Group 8:00 am – 10:00 am 2-40 2-40 Electronic Documentation Technology Committee 8:00 am – 10:00 am 5-20T General IPC Training Advisory Committee Meeting 10:00 am – 12:00 pm 5-22ARR J-STD-001/Conformal Coating Material & Application Industry Assessment Working Group 10:00 am – 5:00 pm 7-31BV IPC-A-610 Automotive Addendum Task Group
8 >> SMTA International 2018
Product Reliability Rigid Printed Boards Terms and Definitions Testing Traceability and Trusted Supplier
10:15 am – 12:00 pm 5-22BT J-STD-001 Training Advisory Committee 10:15 am – 12:00 pm 2-30 Terms and Definitions Committee 10:15 am – 12:00 pm 5-32E Conductive Anodic Filament (CAF) Task Group 10:15 am – 12:00 pm D-24B Bereskin Test Method Task Group 10:15 am – 12:00 pm 4-33 Halogen-Free Materials Subcommittee 10:15 am – 12:00 pm 7-34T IPC-7711/7721 Training Advisory Committee 1:30 pm – 3:00 pm 5-24A Flux Specifications Task Group 1:30 pm – 5:00 pm 5-33A Conformal Coating Task Group 1:30 pm – 3:00 pm D-24C High Frequency Test Methods Task Group: Frequency-Domain Methods 1:30 pm – 5:00 pm D-31B IPC-2221/2222 Task Group 1:30 pm – 3:00 pm 7-31FT IPC/WHMA-A-620 Training Advisory Committee 1:30 pm – 3:00 pm D-33AT IPC-6012 Training Advisory Committee 3:15 pm – 5:00 pm 5-24C Solder Alloy Task Group 3:15 pm – 5:00 pm 5-32A Ion Chromatography/Ionic Conductivity Task Group 3:15 pm – 5:00 pm 3-11F UL/CSA Task Group 3:15 pm – 5:00 pm 2-18K Materials and Substances Declaration for the Aerospace, Defense, HE and Other Industries 3:15 pm – 5:00 pm 7-31AT IPC-A-600 Training Advisory Committee 3:30 pm – 5:00 pm 6-10D SMT Attachment Reliability Test Method Task Group
Wednesday, October 17 8:00 am – 10:00 am 7-31BT IPC-A-610 Training Advisory Committee 8:00 am – 12:00 pm 7-31BV IPC-A-610 Automotive Addendum Task Group 8:00 am – 12:00 pm 5-21H Bottom Termination Components (BTC) Task Group 8:00 am – 10:00 am 5-21E Solder Stencil Task Group 8:00 am – 12:00 pm 5-21G Flip Chip Mounting Task Group 8:00 am – 3:00 pm 7-31H/7-31K Joint Meeting IPC-D-620 and IPC-HDBK-620 Task Groups 8:00 am – 10:00 am D-15 Flexible Circuits Test Methods Subcommittee 8:00 am – 10:00 am D-22 High Speed/High Frequency Board Performance Subcommittee 8:00 am – 10:00 am 5-33AWG Conformal Coating Requirements Working Group 8:00 am – 12:00 pm 7-31FS IPC/WHMA-A-620 Space Electronic Assemblies Addendum Task Group 8:00 am – 12:00 pm 5-21F Ball Grid Array Task Group 8:00 am – 12:00 pm B-11 3-D Electronic Packages Subcommittee 8:00 am – 10:00 am 5-24B Solder Paste Task Group 8:00 am – 12:00 pm 7-35 Assembly and Joining Handbook Subcommittee 8:00 am – 12:00 pm 5-22H Thermal Profiling Guide Task Group 10:15 am – 12:00 pm 4-14 Plating Processes Subcommittee 10:15 am – 12:00 pm D-12 Flexible Circuits Specifications Subcommittee 10:15 am – 12:00 pm 5-33C Conformal Coating Handbook Task Group 1:30 pm – 5:00 pm 1-13 Land Pattern Subcommittee 1:30 pm – 5:00 pm 5-21M Cold Joining/Press-fit Task Group 1:30 pm – 3:00 pm 5-24F Underfill Materials Design, Selection and Process Task Group 1:30 pm – 3:00 pm 7-12 Microsection Subcommittee 1:30 pm – 5:00 pm 7-31J IPC-A-630 Box Build 1:30 pm – 3:00 pm D-11 Flexible Circuits Design Subcommittee 1:30 pm – 5:00 pm 5-22AS/5-22AD Joint Meeting J-STD-001 Space and Military Systems Working Group 3:15 pm – 5:00 pm D-21 High Speed/High Frequency Design Subcommittee 3:15 pm – 5:00 pm D-13 Flexible Circuits Base Materials Subcommittee 3:15 pm – 5:00 pm 5-32C Bare Board Cleanliness Assessment Task Group 3:15 pm – 5:00 pm 2-19B Trusted Supplier Task Group 5:30 pm – 7:30 pm MITMG Training Center and MIT Meet and Greet
Thursday, October 18 8:00 am – 12:00 pm 7-31J IPC-A-630 Box Build 8:00 am – 12:00 pm 5-21M Cold Joining/Press-fit Task Group 8:00 am – 10:00 am 3-11G Corrosion of Metal Finishes Task Group
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SPECIAL EVENTS SMTA Annual Meeting & Dual Keynote Presentation Tuesday, October 16 | 8:00 am – 10:00 am | Complimentary for All Attendees!
The F-35 Lightning II is a 5th Generation fighter, combining advanced stealth with fighter speed and agility, fully fused sensor information displayed to the pilot through the Helmet Mounted display (HMD), network-enabled operations and advanced sustainment. Lockheed Martin is the prime contractor, continuing its 100-year history of aircraft research and design with the Lightning II. Rockwell Collins – ESA Vision Systems is the supplier of the HMD, the industry leader in development of helmet mounted display technology for the last 33 years. According to standard industry accepted economic forecasting, the F-35 is responsible for more than 125,000 direct and indirect jobs, making it the single largest job generator in the Department of Defense program budget. The Lockheed Martin F-35 program teams with more than 1,400 domestic suppliers in 46 states and Puerto Rico to produce thousands of components from highly sophisticated radar sensors to the aircraft’s mid fuselage. This exciting presentation will provide an overview of the development of the F-35 HMD, and how pilots use the unparalleled capabilities that the HMD provides. Tony “Brick” Wilson is a graduate of the Air Force Institute of Technology with a M.S. in Aeronautical Engineering and the United States Naval Test Pilot School. In 2016, having completed 25 years Tony "Brick" Wilson, in the Navy, Tony Lead HMD transitioned to civilian life Developmental and joined Lockheed Test Pilot, Martin as a test pilot where Lockheed Martin he supports both the F-16 and F-35 programs. He has flown over 20 different types of aircraft including an experimental British Sea Harrier, the U-2 and the MiG-15. Brick has the distinction of being the first aviator to execute a shipboard arrestment when he successfully landed the F-35C aboard the USS Nimitz (CVN 68).
Ron Heberlein is a Pr. Program Manager at Rockwell Collins. He has led the design and development of military Helmet Mounted Display products since 2016, and started his work on the Ron Heberlein, F-35 Helmet Mounted Program Manager, display program in 2012 Rockwell Collins as the lead mechanical engineer. Ron has been involved with electronics design and optomechanical design since 2003 and has worked on Head-Up Displays, Enhanced Vision Sensors, and Helmet Mounted Displays for Boeing, Lockheed Martin, Gulfstream, Embraer, and Bombardier. Ron has a degree in Aerospace Engineering from Embry-Riddle Aeronautical University and holds patents in Heads-Up Display Alignment and Sensor Based Navigation Correction.
Congratulations to the 2017 SMTA International Conference Award Winners Winners will be recognized at the Annual Meeting. Rich Freiberger Best of Conference Presentation Solder Paste Qualification Testing for EMS Production Chrys Shea, Shea Engineering Services, and Raymond Lawrence Best Student Paper Effect of Cl2, NO2, RH and Temperature on Ag and Cu Corrosion in a Mixed Flowing Gas Chamber Bo Yuan, University of Delaware
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Best of Proceedings Paper 1st Place: Effect of Thermal Treatment on the Microstructure, Properties, and Reliability of Lead-Free Bismuth Containing Solder Alloys Andre Delhaise, Celestica, Inc. 2nd Place: Moisture Effects in Common Solderable RF Connector Dielectrics Part II: Characterization of Damage Threshold Moisture Level for Moisture Sensitive Polymers Jeff Jennings, Harris Corporation 3rd Place: Investigation of the Influence of Voids on the Reliability of Solder Joints by the Finite Element Method Christian Schwarzer, Heraeus Deutschland GmbH & Co. KG SMTA International 2018 >> 9
SPECIAL EVENTS
The World's Most Advanced Fighter Jet Helmet — From Development and Production to the Fight
FREE Professional Development Course Monday, October 15 | 8:30 am – 12:00 pm Room 51
Jump Start – a Free Introduction to SMT Process Basics and Troubleshooting Instructors: *Chrys Shea, Shea Engineering Services; Tom Foley, ASM Assembly Systems, LLC; Fred Dimock, BTU International; Keith Favre, FHP Reps; *Mike Buetow, Circuits Assembly Magazine SPECIAL EVENTS
The SMTA is kicking off this year’s SMTA International Conference technical program with a first-ever, free class for all conference attendees. The class features three industry experts offering their decades’ worth of knowledge and experience on stencil printing, component placement and reflow processing. Sign up for this course when you register online.
TI Keynote Luncheon The Connected Enterprise – Make Smart Manufacturing Work for You Monday, October 15 | 12:30 pm – 1:30 pm Room 48
Bob Murphy
Bob Murphy Senior Vice President, Operations & Engineering Services of Rockwell Automation will be presenting, "The Connected Enterprise – Make Smart Manufacturing Work for You". A box lunch will be provided so you must pre register. Select this option while registering online.
Women’s Leadership Program and Reception Monday, October 15 | 1:30 pm – 6:00 pm Room 47/49
We extend an invitation to everyone at SMTA International to attend the Women’s Leadership Program to promote diversity in engineering fields. Technical and Leadership presentations will be held on Monday afternoon from 1:30 pm – 3:00 pm. This will be followed by table topics and speed networking. Tables will be hosted by industry leaders. Show your support for inclusion and diversity in engineering fields by attending this session. The afternoon concludes with our annual Women’s Leadership Connection Reception with wine and hors d’oeuvres from 5:00 pm – 6:00 pm.
Poster Session Tuesday, October 16 | 12:00 pm – 2:00 pm Exhibit Hall
Industry experts displaying posters will be available to answer your questions.
10 >> SMTA International 2018
Livin' La Vida SMTA
Tuesday, October 16 | 6:00 pm – 9:00 pm Adobe Gila's Rosemont 5455 Park Pl, Rosemont, IL 60018
Grab your amigos and fiesta on Tuesday, October 16 as you enjoy great music, all you can eat tacos, fajitas, chips and salsa. Only $25 per person in advance ($30 at the door). All fiesta tickets include access to the buffet and a drink ticket. Order your fiesta tickets directly online when you register for the conference.
Career Center Tuesday, October 16 and Wednesday, October 17 Exhibit Hall
Stop by the Career Center at SMTA International to take your career to the next level. While there, you can get expert advice on interview preparation, resume building, LinkedIn, understanding the current job market, and to make sure you get the most out of your career in the electronics industry!
Fun Run Wednesday, October 17 l 7:00 am
You don't have to skip your run just because you are traveling. Join us for a 5 mile run on Wednesday, October 17 at 7:00 am in the Doubletree lobby. Select the free option when registering for SMTA International or bring some friends and show up that morning. Complimentary sport phone cases will be given to all runners.
Beer Tasting and Expo Reception Wednesday, October 17 | 3:00 pm – 4:00 pm Exhibit Hall
Help us recognize the companies who have supported the local SMTA events by bringing equipment, technology and knowledge to your engineers and operators across the globe. These companies' commitment and participation at the local level is what the SMTA is about. Celebrate with us on Wednesday, October 17 at 3:00 p.m. and sample beverages from our SMTA chapter regions (non alcoholic choices available).
Free for all to attend!
Microvia Learning Lab Wednesday, October 17 | 1:30 pm – 3:00 pm Room 48
In this Learning Lab, we will take a look at the currently accepted methods for microvia reliability testing and expose some weaknesses in the accuracy of those tests when compared to real world working environments. The presentations will be designed to increase awareness of this issue and foster discussion. Three elements: >> Current understanding of the problem and mitigation measures in place – J. Magera, Motorola >> FMEA Project Definition (“Fishbone”, Taguchi) – J. Baccam/D. Dupriest, Lockheed Martin >> Microvia Reliability Modeling and Simulation (ANSYS) – G. Lengacher/J. Harms, US Navy SMTAssociation
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Metallographic Photo Contest at SMTA International
As an engineer you use photographs to visualize your research, but getting high quality images of such small subjects is really as much an art as it is a science. Now you can get recognized for your metallographic photography skills! All you have to do is submit your high resolution images (both optical and SEM are accepted) to ryan@smta.org by August 31, 2018. Photos will be displayed in the exhibit hall. Winning photos will receive recognition for themselves and their companies along with a SMTA membership for a year!
SPECIAL EVENTS
Enter your photos in this year's contest!
SMT Processes and Lean Six Sigma Certification SMT Processes
October 16-18 Instructor: Jim Hall, ITM Consulting October 16 – Course (8:30 am – 5:00 pm) October 17 – Half day course + exam October 18 – All day exam (8:30 am – 5:00 pm)
About SMTA Certification Each SMTA Certification program is a three day course on topics in SMT Processes. The program concludes with an open and closed book examination. These challenging examinations require both written answers and calculations with the intent to enable the attendee to establish competitive credentials as “Certified” by the SMTA in SMT Processes. Who Should Attend? SMTA Certification is intended for manufacturing and process engineers. Additionally, production, design, test and quality engineering personnel, as well as SMT assembly managers who want to confirm their current competence at a fundamental level of overall process technology or are looking to improve the productivity and quality of an assembly process, should consider participating. Contact Jenny Ng for more information: jenny@smta.org or 952-920-7682
Visit the Certification web page on www.smta.org/certification for more information and registration. SMTAssociation
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SMTA International 2018 >> 11
PROFESSIONAL DEVELOPMENT COURSES
Half day (3.5 hours) educational courses are led by internationally respected professionals with extensive experience in the subject area. Course instructors deliver focused, in-depth presentations on topics of current importance to the industry, based on their research and industry experience. Courses are application oriented and structured to combine field experience with scientific research to solve everyday problems. Registration includes breaks, course materials and a Certificate of Attendance. FOUR courses are included in a VIP registration package. A GREAT value! Note: VIP registration cannot be shared. FULL details of all courses and instructor biographies can be found at www.smta.org/smtai. * Designates Speaker of Distinction
COURSES
Sunday, October 14
8:30 am – 12:00 pm
PDC1 Design and Assembly Process Principles for High Density Flexible and Rigid Flex Circuits Vern Solberg, Solberg Technical Consulting This tutorial focuses on implementing best design practices for flexible and rigid flex circuits, the study of alternative fabrication methodologies and planning for automated assembly process efficiency. Information presented will include the selection criteria for base materials for flexible circuit applications, alternative fabrication methodologies, SMT component selection and land pattern development, the requirements for documentation and features required to accommodate SMT-on-flex assembly processing. Course Objectives Furnish design professionals, systems engineers, assembly and test engineering specialists with a thorough understanding of the materials, fabrication process variations and preferred design practices for flexible and rigid-flex circuits. In addition, extensive
detail is furnished regarding preparation for automated SMT assembly including guidance in panel planning to best accommodate current assembly process methodologies. Topics Covered >> An Applications, standards and defining product use environments >> Flex circuit construction alternatives >> Flex and Rigid Flex circuit fabrication process variations >> SMT component selection and land pattern development >> Specifying base material, plating and coating >> Assembly process implementation
PDC2 Jump Start – a Free Introduction to SMT Process Basics and Troubleshooting *Chrys Shea, Shea Engineering Services; Tom Foley, ASM Assembly Systems, LLC; Fred Dimock, BTU International; Keith Favre, FHP Reps; *Mike Buetow, Circuits Assembly Magazine Solder Paste Printing >> Solder Paste Behavior • Properties & characteristics • Behaviors during the printing process • Printability differences between no-clean and water wash, tin-lead and lead-free >> Mechanics of the Printing Process • Alignment and gasketing • PCB support • Squeegee or direct print head motion • Paste setup & release • Area ratios and transfer efficiencies >> Troubleshooting Process Problems • 5-minute system check
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FREE COURSE FOR ALL ATTENDEES
• Typical defects and likely root causes to investigate Component Placement >> Placement Machine Fundamentals • Component Supply • Placement Head & Vision System • Nozzles & Grippers >> Placement Machine Software Fundamentals • Placement Program Optimization • Line Changeover Software • Line Productivity Software >> Drivers for High Quality Placement (continued)
SMTAssociation
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Sunday, October 14
8:30 am – 12:00 pm
(continued) Solder Reflow >> Purpose of Solder Reflow • Oven recipe • Profiles • Process Windows >> Material Properties • Solder • Eutectic • Non-eutectic • Flux with a Purpose
>> Profile shapes • Heating Rate • Soak • Spike • Cooling Rate >> Obtaining Profiles
PDC3 The Incredible Shrinking World Of Electronics – Are Traditional DFM, DFR, DFF Methods Obsolete? tooling design, SMT and PTH assembly process matching. The concept of manufacturing, test, reliability by design (XBD) will be presented. Topics Covered >> Component packaging impacts >> PCB design impacts and industry standards limitations >> SMT and PTH solder design impacts >> Components with thermal management impacts: • Component design • PCB Thermal balance: X, Y and Z axis • Trace routing • Equipment limitation/tolerance • PCB array tolerance >> Process tooling design >> Process control impacts >> Paste volume, thermal shock SMT and PTH, reflow process warpage >> Cleaning impacts >> Compatibility issues, low stand-off components
PDC4 Reflow, Wave and Rework Soldering Process Optimization in Electronics Manufacturing *Jasbir Bath, Bath Consultancy LLC Course Objectives The soldering processes for reflow, wave and rework soldering are essential processes to optimize to improve yield and reliability. The course will review reflow, wave and rework soldering materials and processes with a focus on optimization of preheat and soldering temperatures and times. It will cover typical soldering issues which can occur during reflow, wave and rework with a review of profiles which can be used to help address them with a review of board and component temperature ratings. It will discuss interactions with different board and components having different surface finishes in relation to microstructure and reliability for these processes and factors which should be optimized for improved results.
Topics Covered >> Reflow, Wave and Rework Soldering materials and processes >> Common Reflow, Wave and Rework Problems >> Component and Board Temperature Ratings and Component and Board Surface Finishes >> Microstructure and Reliability >> Case studies to optimize soldering processes
*Designates Speaker of Distinction SMTAssociation
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SMTA International 2018 >> 13
COURSES
*Dale Lee, Plexus Corp. Course Objectives Today’s electronic component packaging technologies of smaller packages (0201/01005/008003), finer lead pitch (0.4/0.35/0.3/…), bottom terminated components (QFN/LGA) and printed circuit board designs (high layer counts, finer lines, via in pad (VIP), increased copper thicknesses, copper routing, …), increased thermal sensitivity, trailing component, fabrication and assembly industry standards have impacted traditional assembly processes with addition of tight solder application, component placement, thermal management and soldering constraints. Using traditional, simplified mass production techniques are not be sufficient to achieve a high-yielding manufacturing process. This presentation will highlight elements of the impacts of these technologies on reliability and yield when not properly addressed in the design/assembly/inspection-test process, impacts of thermal connections on throughhole and surface soldering processes, introduce the elements of design for matched process (DFMP), and provide examples of several opportunities within the DFMP for yield improvement through manufacturing
Sunday, October 14
8:30 am – 12:00 pm
PDC5 Tin Whiskers: A 2018 State of the Industry Assessment *David Hillman, Rockwell Collins Course Objectives Tin Whiskers were investigated and "solved" in the 1950s so why are we talking about them in 2018? The objective of this tin whisker course is to: (1) Provide a basic understanding of a tin whisker phenomena; (2) Provide data and resources allowing an attendee to create a tin whisker mitigation protocol applicable for their product/use environment; (3) Provide an update of some of the latest industry tin whisker
investigations, testing results, and publicized product failures. Topics Covered >> Tin Whiskers 101 >> Tin Whisker Mitigations that You Don't Control >> Tin Whisker Mitigations that You Do Control >> Current Industry Tin Whisker Investigations
Sunday, October 14
1:30 pm – 5:00 pm
COURSES
PDC6 Utilizing IPC1782 – Component Traceability – To Reduce the Risk of Counterfeit Components, Improve Quality, Increase Reliability, Decrease Costs, and Drive Product Innovation *Cameron Shearon, Shearon Consulting Course Objectives This course will explain how to implement a traceability program to lower the risk of counterfeit components, increase Quality, increase Reliability, increase productivity, and develop products much faster with higher demand.
Topics Covered >> Define Risk >> Define Context for need of traceability >> Discuss benefits of traceability >> Discuss how to utilize state of the art tools at a high level how to implement a traceability program to meet regulatory and marketplace requirements
PDC7 Interconnections: PCB and Solder – Not Just Your Normal Failure Modes Any More *Dale Lee, Plexus Corp. Course Objectives Design densities for electronic assemblies have increased the interconnection density of PCB’s and component solder connections. This increase density has resulted in smaller via diameters for traditional and micro via hole, complex via structures, terminations of via holes into component mounting pads, decreased component mounting pads and increased diversity of routing terminations to component lead pads. This complexity in interconnection and density of interconnections combined with decreasing component lead pitches and lagging development of
industry standards to address these changes has created opportunities for new PCB and solder joint formation failure modes. As technology continues to march forward, new interconnection failure modes will continue to develop. This presentation will review many of the new PCB interconnection/PCB to solder joint/solder joint failure modes and methods for identification of potential failures/reliability and some recommended potential design/assembly process solutions.
PDC8 Printing and its Effect on Manufacturing Yield *Jasbir Bath, Bath Consultancy LLC Course Objectives The printing process is one of the most critical processes to optimize to improve manufacturing yield. The course will review stencil aperture requirements of a variety of components, stencil thicknesses, types of stencils, the printing process, printing DOEs, and solder paste use and selection in order to understand the key factors which need to be optimized for successful printing.
14 >> SMTA International 2018
Topics Covered >> Printing Processes and Stencil Types/Guidelines >> Common Printing Problems >> Solder paste material types >> Stencil design >> Print DOEs >> Component Trends >> Case studies for optimizing print volumes to reduce defects such as Head-in-Pillow
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Sunday, October 14
1:30 pm – 5:00 pm
PDC9 New Developments in Selective Soldering Technology
Topics Covered >> Automatic fiducial location and skew correction >> Automatic board warpage compensation >> Advanced drop-jet flux deposition >> In-process flux verification
>> Mitigation of no-clean flux residues >> Dual solder nozzle functionality and benefits >> Integrated wave soldering capability and advantages >> Ultra-fine pitch selective soldering >> Graphics-based programming advanced parameters >> Advances in solder nozzle design >> Traceability and data logging compatibility with FIS and Industry 4.0 protocols >> AOI solder joint inspection methodologies >> Automatic solder nozzle cleaning and solder nozzle tinning methods >> High-volume, high-performance soldering >> Simultaneous parallel and independent double processing modes >> Variable center distance soldering of multi-up panels >> On-the-fly continuous motion selective soldering
PDC10 Solder Paste Qualification Using the SMTA Miniaturization Test Vehicle *Chrys Shea, Shea Engineering Services Course Objectives This brand-new, half-day course focuses on solder paste and how to select the best one for an operation using the new SMTA Miniaturization Test Vehicle. Solder pastes have over 20 individual characteristics that must be considered during the selection process. Moreover, some characteristics conflict with each other and the tradeoffs must be carefully considered when determining the best process chemistry in order to avoid surprises on the production line. Many operations delay updating their soldering materials because of the high cost, lost production time, and complexity of the materials. These concerns have been met with a low-cost evaluation kit that minimizes line time, maximizes test efficiency, and demonstrates the tradeoffs in performance characteristics. The kit includes pre-designed PCB boards and components; an active spreadsheet to configure the PCB population, cost and sample sizes; stencil and vacuum board support designs; ODB++ database; placement files; SPI files; step-by-step directions for a 30-print DOE; an SMT soldering reference manual; directions for statistical reduction; and the customizable Score Card, which helps assemblers understand the tradeoffs involved and chose the best possible product. The hardware for the kit is available for purchase from commercial suppliers; the documentation and user files are available for FREE download from a website. This course discusses each characteristic of solder paste, how it impacts the SMT process, how the kit tests it, and how and why the board was designed. The Score Card is the key to customizing the test to a specific operation. Attendees will be encouraged to consider the solder paste characteristics on the Score Card as it relates to their SMT operations in an open discussion forum.
Topics Covered >> Kit Overview >> Solder Paste Characteristics • Categories and details >> PCB Design • Top Side Elements • Bottom Side Elements >> Components • Size Range • Cost Range • Bill of Materials Configurator Spreadsheet >> Nesting the Tests for Efficiency • One side sits for abandon test while the other side gets worked in a shear test >> Test Execution Order • Top Side • Bottom Side • Bottom Side • Top Side >> Data Collection and Reduction • Print • Reflow >> Score Card • Weighting each factor on importance to the specific operation and open discussion • Ranking each paste’s performance relative to each other • Category subtotals – Tradeoffs • Overall score >> Fatal Flaws • Graping • Voiding • Peaking • Wipe Sensitivity • Other >> Other uses for the SMTA MTV >> Q&A *Designates Speaker of Distinction
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SMTA International 2018 >> 15
COURSES
Bob Klenke, ITM Consulting Course Objectives Selective soldering technology is playing an increasingly critical role in the assembly and reliability of solder interconnections within mixed-technology printed circuit board assemblies. This course reviews new developments in selective soldering technology and outlines their impact upon the electronic assembly landscape. This workshop is based on real-world consulting experience with selective soldering processes procedures and techniques. Best practices together with potential solutions for improving manufacturing yields and reliability will be discussed in detail.
Monday, October 15
8:30 am – 12:00 pm
PDC11 Design and Assembly Process Challenges for Bottom Terminations Components (BTCs) such as QFN, DFN and MLF in Tin-Lead & Lead-Free World *Ray Prasad, Ray Prasad Consultancy Group Course Objectives Bottom Termination surface mount Components (BTCs) go by various names such as QFN, DFN, SON, LGA, MLP, and MLF, which utilize surface to surface interconnections. BTCs are like BGAs which also have hidden terminations, but they are also very different. BTCs do not have spheres but rather metallized terminations or pads underneath the package. This minor difference in the physical I/O shape makes all the difference in design, assembly and rework between BTCs and BGAs. COURSES
Since there are no leads or balls in BTCs to take up any slack from package or board warpage, you essentially need perfection in design and assembly process. When was the last time you saw every thing perfect on any manufacturing floor? One must also keep in mind that these parts are not the only components that must be mounted on the board. Look at any board. It will have other packages such as BGAs, fine pitch and even some through-hole components; and those components have their own unique design and assembly implementation requirements. So designing for BTCs may involve trial and error and lot of frustration by many companies. Additional frustration is caused by fast-paced changes in packaging technologies and the advent of Lead-Free has compounded the designer’s task.
The objective of the course is to get away from the trial and error approach and provide you successful design and process practices commonly used by the industry. This course will cover the practical details of BTC design and assembly processes. This course is based on Surface Mount Technology: Principles by Ray Prasad and Practice and IPC 7093 Design and Assembly Process Guidelines for BTCs also co-chaired Ray. This course identifies many of the characteristics that influence the successful implementation of robust and reliable BTC assembly processes. This is not a theoretical course. It is based on Mr. Prasad's over two decades of experience at Boeing, Intel and numerous clients and deals with "real-world" problems in lead-free and tin-lead BTC implementation.
Topics Covered >> Introduction • Pros and Cons of BTC • Pull Back Vs Non Pull Back • BTC Package Manufacturing Process >> Major Design Considerations for BTCs • Laminates and Surface Finish Considerations • Land Pattern and Stencil Design Guidelines • Component considerations >> Assembly Process Guidelines for BTC • Solder Paste Printing- the Key Process Step When it comes to inspection, BTCs pose even more • Reflow Process Guidelines challenge than BGAs. What you may see in visual • BTC Solder Joint Quality Requirements inspection may look bad but may really be acceptable. • BTC Rework Process And what you don’t or can’t see may really be critical. >> Key strategies in design and manufacturing And the fact that the Process Engineer must worry processes to prevent field returns about both too much solder and too little solder on the same BTC package makes the quality engineer nervous about field returns.
16 >> SMTA International 2018
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Monday, October 15
8:30 am – 12:00 pm
PDC12 Achieving High Reliability for Lead-Free Solder Joints – Materials Consideration Course Objectives This course covers the detailed material considerations required for achieving high reliability for lead-free solder joints. The reliability discussed includes joint mechanical properties, development of type and extent of intermetallic compounds (IMC) under a variety of material combinations and aging conditions and how those IMCs affect the reliability. The failure modes, thermal cycling reliability, and fragility of solder joints as a function of material combination, thermal history, and stress history will be addressed in details, and novel alloys with reduced fragility will be presented. Electromigration, corrosion, and tin whisker will also be discussed. The emphasis of this course is placed on the understanding of how the various factors contributing to the failure modes, and how to select proper solder alloys and surface finishes for achieving high reliability. Also will be presented are the desirable future alloys and fluxes in order to meet the challenge of miniaturization. Topics Covered >> Implementation Status >> Prevailing Materials • Prevailing Solder Alloys • Prevailing Surface Finishes >> Surface Finishes Issues • Issues of ENIG • Issues of ImAg >> Mechanical Properties • Shear & Pull Strength • Creep >> Intermetallic Compounds • Interaction of Cu and Ni • Effect of Cu Content in SAC • Effect of Ni in Cu Pad • Effect of Alloy Additives • Effect of Heat History • Formation of Interfacial Void
>> Failure Modes • Grain Boundary Sliding & Cavitation • Grain Coarsening • Grain Orientation • Lead Contamination • Mixed Alloys • Interfacial Voiding >> Thermal Cycle Reliability • Effect of Thermal Cycle Test Condition • Effect of PCB Surface Finish Cu vs Ni • Effect of Reflow Temperature • Reliability of Reworked SMT Joints >> Reliability of Through-Hole Joints • Large and Thick Board • Partially Filled Through-Hole >> Fragility • Fragility of Lead-Free Solder Joints • Effect of Component Finish • Effect of Alloy, PCB Surface Finish, Reflow History, and Strain Rate • Effect of IMC Thickness • Effect of Isothermal Aging • Effect of Thermal Cycling • Effect of Intermetallic Morphology • Novel Alloys with Reduced Fragility >> Reliability – Electromigration • Influence of Electromigration and Temperature on Resistance • Effect of Current Density & Back Stress on IMC Thickness • Effect of Current on IMC Thickness, Joint Temp and Strain • Effect of Electromigration on Mechanical Property • Effect of Cu UBM Thickness on Electromigration >> Reliability – Corrosion • SAC405 • Corrosion Resistance of PWB Finishes >> Tin Whisker
*Designates Speaker of Distinction SMTAssociation
@SMTAorg #SMTAI
SMTA International 2018 >> 17
COURSES
*Ning- Cheng Lee, Ph.D., Indium Corporation
Monday, October 15
8:30 am – 12:00 pm
PDC13 Solder Joint Reliability – Principles and Applications Jennie Hwang, Ph.D., H-Technologies Group
COURSES
Course Objectives The course emphasizes on practical, working knowledge, yet balanced and substantiated with science by outlining solder joint reliability fundamentals in fatigue and creep damage mechanisms via ductile, brittle, ductile-brittle fracture, and by discussing the critical “players” of solder joint reliability (e.g., manufacturing process, PCB/ component coating surface finish, solder alloys). Likely solder joint failure modes of interfacial, near-interfacial, bulk, inter-phase, intra-phase, voids-induced and surface cracks will be illustrated. To withstand harsh environments, the strengthening metallurgy to further increase fatigue resistance and creep resistance, and the power of metallurgy and its ability to anticipate the relative performance will be illustrated by discussing the comparative performance vs. metallurgical phases and microstructure. The question on whether a life-prediction model can assure reliability will be discussed. A relative reliability ranking among commercially available solder systems, as well as the scientific, engineering and manufacturing reasons behind the ranking will be outlined. Attendees are encouraged to bring their own selected systems for deliberation.
Topics Covered >> Premise – reliability, solder joint thermomechanical degradation – fatigue and creep interaction >> Solder joint failures modes – interfacial, nearinterfacial, bulk, inter-phase, intra-phase, voidsinduced, surface-crack, and others >> Solder joint failure mechanisms – ductile, brittle, ductile-brittle transition fracture >> Solder joint strengthening metallurgy >> Illustration of microstructure evolution vs. strengthening in Sn Cu+x,y,z and SnAgCu+x,y,z systems >> Solder joint voids vs. reliability – causes, effects, criteria >> Solder joint surface-crack – causes, effects >> Distinctions and commonalties between Pb-free and SnPb solder joints >> Thermal cycling conditions – effects on test results and test results interpretation >> Testing solder joint reliability – discriminating tests and discerning parameters >> Life-prediction model vs. reliability >> Solder joint performance in harsh environments >> What solder alloys are on the horizon and what impact will be on reliability >> Best practices and competitive manufacturing >> Ultimate reliability
PDC14 Weeding Out PCB Fabrication Defects Before Assembly Bihari Patel, Bihari Patel SMT Connection Course Objectives With the Lead-Free transition and green revolution changes completed at Assemblers and Fabricators to meet demands of higher densities for Printed Circuit Boards presenter will share his experiences. Global sourcing of PCBs is a reality with larger batch quantities, to prevent line stoppage and expensive rework, it is important that emphasis be placed on PCBs prior to assembly to highlight issues and prevent future issues prior to use. Ensuring quality PCBs are entering in the assembly process, resulting in higher first pass yield and reduced rework associated with PCB quality deficiency. This workshop will highlight any deficiency in PCB fabrication and ones following best practices will be exhibit their strengths against other fabricators. Will also cover key result areas in Assembly Process and Metal Core – LED PCBs their assembly challenges.
18 >> SMTA International 2018
Topics Covered >> Lead-Free and Leaded assembly of circuit boards showing defects experienced related to PCB fabrication >> 101 of PCB Fabrication for Contract Electronic Manufacturing and Original Equipment Manufacturer >> Process Control and applicable specifications for outgoing quality >> Descriptions with examples of applicable test methods, including reference to IPC documentation >> Top twenty defects will be highlighted and with emphasis on how to detect, report and get corrective actions for prevention >> Fabricator selection, source Inspection and ongoing preferred fabricator audits >> Case Studies >> Metal Core – LED PCBs and assembly challenges
SMTAssociation
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Monday, October 15
8:30 am – 12:00 pm
PDC15 Defect Analysis and Process Troubleshooting: Part 1 *Phil Zarrow & *Jim Hall, ITM Consulting
Monday, October 15
Topics Covered Introduction Prevention: Process Development and Validation Variation (Common Cause) Continuous Improvement Defect Definition Failure Reduced Reliability Process Indicator Special Cause vs. Common Cause Defect Identification Inspection Manual AOI X-Ray Test ICT Functional Contamination False Calls / Escapes Causes of Defects Special Cause vs. Common Cause Variability (repeatability) Accuracy Process not Optimized Root Cause Analysis 5 Whys” Cause and Effect Diagram Process Relationships Incoming Materials Handling Process Problems
COURSES
Course Objectives We don’t assemble electronics in “perfect world”. Defects happen! This course examines Failure and Root Cause analysis of PCBA defects, starting with clear definition of the generic types of defects and their impact, such as non-function, reduced reliability, etc. Detection and determination methodologies and procedures will be discussed. Cause and effect of defects relative to specific processes and equipment centers as well as materials are presented. Key causes of assembly problems and low yields are identified and resolved. This seminar is intended for anyone involved in directing, developing, managing and/or executing Failure and Root Cause analysis and defect resolution including managers, engineers and others in manufacturing, quality and design
1:30 pm – 5:00 pm
PDC16 Defect Analysis and Process Troubleshooting: Part 2 *Phil Zarrow & *Jim Hall, ITM Consulting Course Objectives We don’t assemble electronics in “perfect world”. Defects happen! This course examines Failure and Root Cause analysis of PCBA defects, starting with clear definition of the generic types of defects and their impact, such as non-function, reduced reliability, etc. Detection and determination methodologies and procedures will be discussed. Cause and effect of defects relative to specific processes and equipment centers as well as materials are presented. Key causes of assembly problems and low yields are identified and resolved. This seminar is intended for anyone involved in directing, developing, managing and/or executing
Failure and Root Cause analysis and defect resolution including managers, engineers and others in manufacturing, quality and design. Topics Covered Specific Processes General: wrong process, material, etc. Printing Placement Soldering Singulation Coating Mechanical Assembly Testing Specific Defect Examples and Causes Wrong Part Damaged Parts Shorts Opens Poor Wetting Insufficient Contamination New Specific Defects HiP / NWO Graping Pad Cratering CAF Conclusion Questions
*Designates Speaker of Distinction SMTAssociation
@SMTAorg #SMTAI
SMTA International 2018 >> 19
Monday, October 15
1:30 pm – 5:00 pm
PDC17 Ball Grid Array: Design and Assembly of BGAs with Emphasis on Backward Compatibility *Ray Prasad, Ray Prasad Consultancy Group Course Objectives Ball Grid Array (BGA) is one of many surface mount components but it brings unique challenges in both design and assembly of the mixed assembly products. There is great interest in BGA because it offers so many benefits such as real estate savings, high yield and better electrical performance. Despite these promises, there are many problems in BGA and CSP (Chip Scale Packaging). The need to implement lead-free simply compounds the problem due to intentional or unintentional mix of tin lead and lead-free components on a mixed assembly board. COURSES
This course is based on the latest revision (Jan 2013) of IPC-7095C “Design and Assembly Process Implementation for BGA, Rev C” currently chaired by Ray and his book Surface Mount Technology Principles and Practice. This is not a theoretical course. It is based on Ray’s years of experience in successfully implementing SMT at Boeing and Intel, and various clients including legal cases related backward compatibility. You will get insight into what to do about backward and forward compatibility issues when you have no choice but to deal with tin-lead and lead-free BGA on the same board and want to produce products that improve yield, reduce cost and keep away from legal troubles. In this course we will also talk about major defects such as pad cratering, head in pillow, as ball drop, smiling and frowning BGA and black pad and champing voids. And you will learn everything you
wanted to know about voids but were afraid to ask. We will talk about various types of voids in BGA, their impact and their minimization and acceptance criteria to meet industry standard. You will also get an insight into the interdependency of design and manufacturing to achieve higher yield, lower cost and faster time to market. Topics Covered >> BGA Component Styles: Tin-lead, No Lead and High Lead >> Industry Standard for BGA Design and Assembly (IPC-7095) >> Driving Forces for BGA >> Major Concerns with BGA: Moisture and Warpage >> BGA Design Rules and Guidelines – Impact of ball size, pitch and I/O count >> BGA Assembly Processes: Issues and Answers • Printing and Reflow Profiling Guidelines >> Backward & Forward Compatibility Issues and role of selective laser reflow >> Impact of Lead-Free on BGA Reliability >> Various Types of Voids in BGA, their impact, measurement and control >> Major Types of BGA Defects • Pad cratering, head in pillow, as ball drop, smiling and frowning BGA and black pad and champing voids >> BGA Repair >> Summary
PDC18 Design for Excellence II: Physics of Failure *Dock Brown, CRE, DfR Solutions Course Objectives Physics of Failure (PoF) also known as Reliability Physics, is a science-based approach for achieving Reliability by Design in electronic products. The methodology is based on research into the conditions that cause electronic components and materials to fail. A PoF analysis combines dynamic stress analysis of usage and environmental conditions with failure mechanism models to perform a durability simulation that identifies failure susceptibilities and calculated lifetime reliability behavior.
20 >> SMTA International 2018
Topics Covered General Concepts and Models Fitness for Use Five Pillars of DfX Requirements and Parameter Management Use Conditions Structured Design Process Control Process Capability Conceptual Product Space Model Product Life Expectations Materials and Processes Systems Technology Flow Model Rules vs Tools Material Degradation The Bathtub Curve Conformance Failures Random Failures Wear-out Failures Industry Standards PCB Board Material Selection Case Studies Physics of Failure in Boards Board Materials Board Mounting Internal Board Failure Solder Joint Failures Physics of Failure in Components Semiconductors Ceramic Capacitors Film Capacitors Electrolytic Capacitors Connectors
SMTAssociation
@SMTAorg #SMTAI
Monday, October 15
1:30 pm – 5:00 pm
PDC19 Reliability of Electronics – the Role of Intermetallic Compounds Topics Covered >> Intermetallic compounds – definition, fundamentals, characteristics >> Phase diagrams of Pb-free solders in contrast with SnPb >> Intermetallic compounds in the intrinsic materialPb-free vs. SnPb >> Formation and growth during production process and in product service life >> Intermetallic compounds – at-interface vs. in-bulk >> Effects from substrate compositions (hybrid module thick film pads, PCB surface finish, component surface coating) >> Gold embrittlement >> Different types of intermetallic compounds – effects on solder joint reliability (Ni/Au, Ni/Pd/Au, Ni/Pd, Cu) >> SAC alloys incorporated with various doping elements – characteristics, performance >> Effects on failure mode >> Effects on reliability
PDC20 Surface Finish Alternatives to HASL for PCB Applications *George Milad, Uyemura International Corporation Course Objectives Surface finish is about connectivity. It is the surface through which the connection from the board to a device occurs. Ball grid arrays, wire bonding pads, press fit, and contact switches are all outside the traditional realm of HASL and electrolytic nickel gold tab plating and require innovative solutions. This workshop will focus on the alternatives: electroless nickel/immersion gold, electroless gold, immersion silver, immersion tin, OSP, electroless palladium, direct gold on copper and the newcomer electroless palladium/immersion gold EPIG. Deposit description, thickness requirements, method of manufacturing, shelf life, application, limitations and relative cost will be covered in detail, from design thru assembly. A complete update on IPC Specifications will be presented.
Topics Covered >> Electroless Nickel/Immersion Gold( ENIG) >> Electroless Gold >> Electroless Nickel/Electroless palladium/flash Gold (ENEPIG) >> Direct Immersion Gold on Copper DIG >> Electroless Palladium on Copper >> Organic Solderability Preservative OSP >> Immersion Silver >> Immersion Tin >> Electroless Palladium Immersion Gold EPIG
*Designates Speaker of Distinction SMTAssociation
@SMTAorg #SMTAI
SMTA International 2018 >> 21
COURSES
Jennie Hwang, Ph.D., H-Technologies Group Course Objectives Intermetallic compounds play an increasingly critical role to the performance and reliability of solder interconnections in the chip level, package level and board level of lead-free electronics. This course covers the relevant and important aspects of intermetallic compounds ranging from scientific fundamentals to practical application scenarios. Intermetallic compounds before solder joint formation, during solder joint formation and after solder joint formation in storage and service will be examined. The course also discusses intermetallics at-interface and in-bulk, as well as the role of PCB surface finish/component coating in relation to intermetallics, in turn, to reliability. The difference between SnPb and Pb-free solder joint in terms of intermetallic compounds, which affects production-floor phenomena and the actual field failure, will be outlined. The course will also address the newer lead-free alloys that were recently introduced to the market. Attendees are welcome to bring their own selected systems for deliberation.
THE
Spotlight Series Complimentary Technical Sessions Held in Theater on Expo Show Floor * Designates Speaker of Distinction
Tuesday, October 16 Spotlight 1
11:00 am – 12:30 pm
Chair: William Capen, Honeywell FM&T
SPOTLIGHT SERIES
>> Strain Energy Model for Underfill *Reza Ghaffarian, Ph.D., Jet Propulsion Laboratory >> Solder Paste: Fundamental Material Property / SMT Performance Correlation for NWO, HnP, Solder Bridging and Printability Nilesh Badwe, Ph.D., Intel Corporation >> The Role of Nickel in Solder Alloys – Part 1: The Effect of Ni on the Behaviour of Sn-0.7Cu in Soldering and Coating Processes Kazuhiro Nogita, The University of Queensland; *Keith Sweatman, Tetsuro Nishimura, Nihon Superior Co. Ltd.
Spotlight 2
1:30 pm – 3:30 pm
Chair: Dennis Fritz, SAIC at NAVSEA Crane (Retired) >> Trusted Electronics. Recognizing and Addressing the Need Dean May, US Navy; Randy Cherry, Richard Snogren, Mark Kirkman, IPC >> Evaluating “Hybrid” Conformal Coating Chemistries and Processes to Expand the Performance Map for Circuit Board Protection Jim Stockhausen, Electronics & Engineering Materials ELANTAS PDG Inc. >> The Relatively of Harsh Environments and How to Improve Reliability *Michael Konrad, Aqueous Technologies >> Silicone Science Innovates New UV Curing Conformal Coatings Chelsea Quinn, The Dow Chemical Company
22 >> SMTA International 2018
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Wednesday, October 17 Spotlight 3
10:30 am – 12:00 pm
Chair: Bob Wetterman, BEST Inc.
Spotlight 4
1:30 pm – 3:00 pm
Moderator: Brook Sandy-Smith, Indium Corporation >> Rising Expectations for "High Reliability": A Panel Discussion Panelists: *Richard Coyle, Ph.D., Nokia Bell Labs *Dave Hillman, Rockwell Collins Terry Munson, Foresite, Inc. Kris Troxel, HP, Inc.
T R AC K K E Y Advanced Packaging Technology (APT) Flux, Solder, Adhesives (FSA) Harsh Environments Applications (HE) Inspection Technologies (INS) Lead-Free Soldering Technology (LF) Manufacturing Excellence (MFX) Substrates/PCB Technology (SUB) Technical Innovations (TI)
*Designates Speaker of Distinction SMTAssociation
@SMTAorg #SMTAI
SMTA International 2018 >> 23
SPOTLIGHT SERIES
>> Packaging’s Impact on Reliability Keith Donaldson, Chris Brown, Engineered Materials, Inc. >> Modeling Temperature Cycle Fatigue Life of Select SAC Solders *Michael Osterman, Ph.D., CALCE/University of Maryland >> Moving Beyond Paidea – Transforming our High Tech Educational Pipeline into one that Focuses on “Learning for Earning,” as well as “Learning for Learning” Tom Borkes, The Jefferson Project; *Martin Anselm, Ph.D., Rochester Institute of Technology; Jeffrey Dunihoo, Pragma Design, Inc.
Located in Upper Level, South Ballroom
TECHNICAL SESSIONS Monday, October 15
See track key on page 23.
Harsh Environments Track HE1
8:30 am – 5:00 pm
Predicting Component Life for Harsh Environments
8:30 am – 10:00 am
Chair: Sa'd Hamasha, Ph.D., Auburn University Co-Chair: *Babak Arfaei, Ph.D., Ford Motor Company >> Second Round Robin Evaluation of iNEMI Creep Corrosion Qualification Test *Prabjit Singh, Ph.D., Haley Fu, Dem Lee, Jeffrey Lee, Karlos Guo, Jane Li, Simon Lee, Geoffrey Tong, Chen Xu, IBM Corporation >> Process and Materials Interaction Investigation: Test Methods for Electrochemical Consistency in PCB Assembly Processes – Revisited Brook Sandy-Smith, Erron Pender, Adam Murling, Indium Corporation >> Testing and Mitigating Resistor Silver Sulfide Corrosion Pamela Lembke, *Marie Cole, Jacob Porter, Tim Tofil, Jason Wertz, IBM Corporation; Jim Wilcox, Mike Gaynes, Mike Meilunas, Universal Instruments Corporation; Holly Rubin, Nokia Bell Labs
HE2
Reliability of Lead-Free Solder Alloys in Automotive Environment
10:30 am – 12:00 pm
MONDAY SESSIONS
Chair: *Babak Arfaei, Ph.D., Ford Motor Company Co-Chair: Keith Howell, Nihon Superior Co. >> Developing Pb-Free Solders for Harsh Environment Applications *Mehran Maalekian, Ph.D., AIM Solder >> Effect of Component Density on Sn-3.0Ag-0.5Cu Solder Joint Reliability Under Harsh Environment Won Sik Hong, Ph.D., Jinju Yu, Chulmin Oh, Korea Electronics Technology Institute (KETI) >> Effects of Mixing Solder Sphere Alloys with Bismuth-Based Pastes on the Component Reliability in Harsh Thermal Cycling Francy John Akkara, Mohammed Abueed, Sa’d Hamasha, Ph.D., Jeff Suhling, Ph.D., *Pradeep Lall, Ph.D., Auburn University
HE3
New Materials and Methods for Electronic Products for Harsh Environments
1:30 pm – 3:00 pm
Chair: Robert Kinyanjui, Ph.D., John Deere Electronic Solutions, Inc. Co-Chair: *Raiyo Aspandiar, Ph.D., Intel Corporation >> How Wet is Wet – Robust Automotive Electronics in Humid Environment *Lothar Henneken, Daniel Markus, Daniel Koenig, Robert Bosch GmbH >> ASEP (Application Specific Electronics Package): A Next Generation Electronics Manufacturing Technology Victor Zaderej, Richard Fitzpatrick, Molex >> Fatigue and Shear Properties of High Reliable Solder Joints for Harsh Applications Su Sinan, Minghong Jian, Francy John Akkara, Mohammed Abueed, Sa’d Hamasha, Ph.D., Jeff Suhling, Ph.D., *Pradeep Lall, Ph.D., Auburn University
24 >> SMTA International 2018
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@SMTAorg #SMTAI
Monday, October 15 HE4
See track key on page 23.
Improving Manufacturing Process To Provide Better Survivability of Electronic Products
3:30 pm – 5:00 pm
Chair: *Iulia Muntele, Ph.D., Sanmina Corporation Co-Chair: Sa'd Hamasha, Ph.D., Auburn University >> Reducing Spatter in Flux Cored Solder Wires for Robotic Soldering Applications Chad Showalter, Arturo Espejo, Olga Spaldon-Stewart, Kyle Loomis, Kester >> The Effectiveness of 75% IPA/25% DI Extraction Solution on No-Clean Flux Residues David Lober, Marietta Lemieux, *Mark McMeen, STI Electronics; *Mike Bixenman, DBA, KYZEN Corporation >> Improved Condensation Testing to Evaluate Protection Performance of Conformal Coatings Under Different Condensation Levels *Martin Wickham, Ph.D., Ling Zou, National Physical Laboratory
Technical Innovations Track TI1
8:30 am – 5:00 pm
Smart Manufacturing for Electronics
8:30 am – 10:00 am
Chair: Trevor Galbraith, Global SMT Co-Chair: *Greg Vance, Rockwell Automation
TI2
Industry 4.0: Why Do We Need It?
10:30 am – 12:00 pm
Chair: *Marie Cole, IBM Corporation Co-Chair: Roy Starks, Libra Industries >> iNEMI Industry 4.0 Roadmap Dan Gamota, Jabil; Ranjan Chatterjee, Cimetrix >> ReMAP Industry 4.0 Irene Sterian, P.E., Celestica Inc. >> Panel Discussion Moderator: Trevor Galbraith, Global SMT Panelists: Dan Gamota, Jabil Ranjan Chatterjee, Cimetrix Irene Sterian, P.E., Celestica, Inc. *Greg Vance, Rockwell Automation *Jay Gorajia, Mentor, A Siemens Business
TI
TI Luncheon Keynote Presentation
12:30 pm – 1:30 pm
Chair: *Matt Kelly, P.Eng, MBA, IBM Corporation >> The Connected Enterprise – Make Smart Manufacturing Work for You Bob Murphy, Rockwell Automation
TI3
Blockchain and Predictive Field Reliability
2:00 pm – 3:00 pm
Chair: *Jay Gorajia, Mentor, A Siemens Business Co-Chair: Michael Ford, Aegis Software >> Blockchain Technology for the High-Tech Industry Quentin Samelson, IBM Corporation >> Predicting the Reliability of Handheld Devices Based on Field, Test Data and Mechanical Structural Analysis Awni Qasaimeh, Ph.D., Younis Jaradat, Ph.D., Eva Kosiba and Andrew Biondo, Zebra Technologies *Designates Speaker of Distinction SMTAssociation
@SMTAorg #SMTAI
SMTA International 2018 >> 25
MONDAY SESSIONS
>> An Overview of Smart Manufacturing in the IoT Era. Challenges and Solutions Glenn Farris, Universal Instruments Corporation >> How Do I Get Smart With IPC CFX? Michael Ford, Aegis Software >> Management Overview of the Smart Factory (Industrie 4.0) Principles and Affects in Electronics Manufacturing *Jay Gorajia, Mentor, A Siemens Business
Monday, October 15 TI4
See track key on page 23.
Additive Manufacturing (3D Printing) for Electronic Circuitry
3:30 pm – 5:00 pm
Chair: Gary Tanel, Libra Industries Co-Chair: Carol Primdahl, Krypton Solutions >> Fully Printed 3D Interconnects: Reducing Semiconductor Package Size and Reducing Manufacturing Complexity Bryan Germann, Optomec, Inc. >> 3D Printing of Multilayer PCBs and Non-Planar Circuitry Simon Fried, Nano Dimension USA >> Direct Digital Manufacturing for 3D Electronic Packaging Ken Church, Ph.D., nScrypt
Women’s Leadership Program
1:30 pm – 5:00 pm
FREE FOR ALL ATTENDEES
Chair: *Priyanka Dobriyal, Ph.D., Intel Corporation Co-Chair: Elizabeth Benedetto, HP Inc. Ambassador: Michelle Ogihara, Seika Machinery, Inc.
Presentations
1:30 pm – 3:00 pm
>> Optics and Electronics Irene Sterian, P.E., Celestica Inc. >> "WIT at RIT” – Women in Technology & Is Photonics Integration in our Future? *Martin Anselm, Ph.D., Rochester Institute of Technology >> Be Yourself: Getting Ahead by Being a Woman in a Man’s World Karyn Ross, Kayrn Ross Consulting MONDAY SESSIONS
Table Topic Group Discussion
3:30 pm – 5:00 pm
TUESDAY SESSIONS
>> Recognizing Your Own Leadership Qualities Hosted by *Martin Anslem, Ph.D., Rochester Institute of Technology (RIT) >> How to Relentlessly Reinvent Yourself Hosted by Karyn Ross, Karyn Ross Consulting >> Efficient Networking Hosted by Lenora Clark, MacDermid Enthone >> Work and Life Integration Hosted by Bill Barthel, Plexus Corp. >> Unconscious Biases: Real Actions to Overcome Hosted by Elizabeth Bennedetto, HP, Inc. >> Capitalizing on the Silver Tsunami Hosted by *Chrys Shea, Shea Engineering Services
Women’s Leadership Connection Reception
5:00 pm – 6:00 pm
Wine and hors d’oeuvres will be served.
Tuesday, October 16
See track key on page 23.
APT1 Trends in Advanced Packaging/3D Interconnects
11:00 am – 12:30 pm
Chair: *Andrew Mawer, NXP Semiconductors Co-Chair: Sue Teng, Cisco Systems >> Evaluation of High Speed Plating for Copper Post with Flat Top Shape and Improved Post Height Uniformity Yuki Itakura, Shinji Tachibana, Hisamitsu Yamamoto, Shigeo Hashimoto, C. Uyemura & Co., Ltd. >> Metallization of Glass Interposers *Charles Woychik, Ph.D., John Lauffer, David Bajkowski, Michael Gaige, Robert Edwards, Gordon Benninger, William Wilson, i3 Electronics >> Development of High Density Interconnect Technologies for Panel Level Packaging *Lars Böttcher, Fraunhofer IZM
26 >> SMTA International 2018
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@SMTAorg #SMTAI
Tuesday, October 16 MFX1 Solder Printing
See track key on page 23. 11:00 am – 12:30 pm
Chair: *Ray Lawrence, General Microcircuits Inc. Co-Chair: Ivan Roman, Continental Automotive >> Rational Application of Impractical Stencil Aperture Designs to Enable M0201 Heterogeneous Assembly *Jeff Schake, Mark Whitmore, ASM Assembly Systems >> Impact of Stencil Quality & Technology on Solder Paste Printing Performance Jonas Sjoberg, Jeffrey Len Yung Kwuan, Leon Rao, Evan Yip, Wisdom Qu, Indium Corporation, Asia-Pacific >> Evaluating the Next Generation of Stencil Stepping Technologies *Greg Smith, Blue Ring Stencils; *Chrys Shea, Shea Engineering Services
SUB1 Electroless Nickel Immerison Gold Processing Considerations
11:00 am – 12:30 pm
Chair: *Don Banks, Abbott Co-Chair: Mark Fulcher, Continental Automotive >> A Novel Electroless Nickel/Immersion Gold (ENIG) Surface Finish for Better Reliability of Electronic Assemblies Kunal Shah, Ph.D., LiloTree >> Can a Cyanide Free Immersion Gold Bath be a Viable Option in the Existing Final Finish Production Environments? Rick Nichols, Atotech >> Effects of ENIG Nickel Corrosion on Wetting Balance Test Results and Intermetallic Formation *Donald Gudeczauskas, *George Milad, Albin Gruenwald, Uyemura International Corporation
FSA1 Solder Paste Development to Overcome Component Challenges
11:00 am – 12:30 pm
>> Robust SMT No-Clean Solder Paste for SiP and 01005 Assembly *Ning-Cheng Lee, Ph.D., Xiaoqin Lu, Fen Chen, Indium Corporation >> The Influence of Aspects of Solder Paste Formulation and Soldering Process Factors on Voiding Under Large QFN Devices Matthew Jones, Tamara Goas-Fernandez, Barry Wenham, Henkel >> Rheology and Wetting Characterizations of Flux and Solder Paste for BGA Packages Jinlin Wang, Intel Corporation
APT2 Assembly and Reliability of Bottom Termination Components
2:00 pm – 4:00 pm
Chair: *Pradeep Lall, Ph.D., Auburn University Co-Chair: Satyajit Walwadkar, Ph.D., Intel Corporation >> The Influence of Printed Circuit Board Thickness on the Thermal Fatigue Reliability of Quad Flat No-Lead Packages *Richard Coyle, Ph.D., Nokia Bell Labs; David Ihms, Delphi; Jagadeesh Radhakrishnan, Intel Corporation; *Neil Hubble, Akrometrix; Jesse deWitt, Charmaine Johnson, Jeffrey Lee, iST-Integrated Service Technology Inc.; Greg Wu, Grace O’Malley, iNEMI >> As-Shipped Height vs. Mounted Height for LGA and BGA Packages *Robert Darveaux, Ph.D., Howard Chen, Shaul Branchevsky, Mahendra Harsh, Skyworks Solution, Inc. >> Reliability of TSOP/QFN/Passive Assemblies under Harsh and LN2 Thermal Cycles *Reza Ghaffarian, Ph.D., Jet Propulsion Laboratory >> Using Immersion Tin to Improve Reliability for Quad Flat No-lead ICs by Forming a 3D Solder Joint Rick Nichols, Atotech
*Designates Speaker of Distinction SMTAssociation
@SMTAorg #SMTAI
SMTA International 2018 >> 27
TUESDAY SESSIONS
Chair: Ursula Marquez de Tino, Ph.D., Plexus Corp. Co-Chair: Adam Murling, Indium Corporation
Tuesday, October 16
See track key on page 23.
MFX2 Assembly Challenges
2:00 pm – 4:00 pm
Chair: *Iulia Muntele, Ph.D., Sanmina Corporation Co-Chair: *Robert Boguski, Datest Corp. >> Cavity Board SMT Assembly Challenges *Dudi Amir, Brett Grossman, Intel Corporation >> How Does Printed Solder Paste Volume Affect Solder Joint Reliability? *Jasbir Bath, Bath Consultancy; *Greg Smith, BlueRing Stencils; *Tony Lentz, FCT Assembly, Inc. >> Qualitative Model Describing Hot Tear Above VIPPOs and Numerous Other Design Elements Günter Gera, Yin Jizhe, Udo Welzel, Robert Bosch GmbH >> Technology for Components with a High Position Accuracy *Jörg Trodler, Heraeus Electronics
SUB2 Enhanced Copper Plating Technologies
2:00 pm – 3:30 pm
Chair: *Lars Böttcher, Fraunhofer IZM Co-Chair: *Jörg Trodler, Heraeus Electronics >> High Elongation Electroless Copper Rogers Bernards, Judy Ding, Boen Li, Richard Retallick, Macdermid Enthone Electronic Solutions >> The Benefits of Using Insoluble Anodes in Acid Copper Plating *George Milad, Uyemura International Corporation >> Innovative CU Electroplating Process for Any Layer via Fill With Planer via Top and Thin Surface Copper Saminda Dharmarathna, Ph.D., Todd Clark, William Bowerman, Kesheng Feng, Jim Watkowski, MacDermid Enthone Electronic Solutions
FSA2 Solder Paste Rheology, Performance and Aging
2:00 pm – 3:30 pm
Chair: Hasnine Md, Kester Co-Chair: Dora Tuza, I Source Technical Services, Inc.
TUESDAY SESSIONS
>> How Worst-Case Shipping Scenarios Affect Solder Paste Performance: Part 2 Brook Sandy-Smith, Erron Pender, Indium Corporation >> Rheology of Flux and Solder Paste II: Shelf Life Study Fan Gao, Ph.D., Dinesh Amin, Jennifer Allen, Kyle Loomis, Kester >> Solder Powder Characteristics and Their Impact on Rheological Behavior of Solder Pastes Amir Nobari, Ph.D., Arslane Bouchemit, Ana Da Silva Marques, Sylvain St-Laurent, Gilles L’Espérance, 5N Plus Inc - Micro Powders
Wednesday, October 17
See track key on page 23.
APT3 Package Warpage Effects on Assembly and Reliability
8:00 am – 9:30 am
WEDNESDAY SESSIONS
Chair: *Robert Darveaux, Ph.D., Skyworks Solutions, Inc. Co-Chair: Thomas Zanatta, Zebra Technologies >> Effect of Package Warpage and Expansion Characteristics on Failure Modes in Board-Level Thermal Cycling *Andrew Mawer, NXP Semiconductors >> Warpage of Flexible-Board Assemblies with BGAs During Reflow and Post-Assembly Usage *Pradeep Lall, Ph.D., Auburn University >> Thermal Shadow Moiré to Cross-Section Correlation Study Jorge Arellano, Steven Perng, Cisco Systems; Edgardo Alvarez, Jabil Mexico; Neil Hubble, Akrometrix
28 >> SMTA International 2018
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@SMTAorg #SMTAI
Wednesday, October 17 MFX3 Void Reduction/BTC Challenges in Assembly
See track key on page 23. 8:00 am – 9:30 am
Chair: Neeta Argawal, Benchmark Electronics Co-Chair: Timothy O'Neill, AIM Solder >> Practical Verification of Void Reduction Method for BTC Using Exposed Via in Pad *Iulia Muntele, Ph.D., A. Garcia, R. Macias, D. Vazquez, R. Ibarra, M. Abtew, Sanmina Corporation >> Characterizing Voiding in BTC Center Pads *Chrys Shea, Shea Engineering Services; Neil Poole, Ph.D., Henkel Electronic Materials >> Solder Paste Selection Challenges For Bottom Termination Components (BTC) Attach *Anna Lifton, Westin Bent, Paul Salerno, *Jason Fullerton, Frank Andres, Alpha Assembly Solutions
SUB3 PCB Reliability
8:00 am – 10:00 am
Chair: *Lars Boettcher, Fraunhofer IZM Co-Chair: *Jörg Trodler, Heraeus Electronics >> BGA Pad Cratering and Peeling During SMT Reflow Joe Fuller, Amit Abraham, Aravind Munukutla, Ian Williams, Intel Corporation >> PCB Reliability – And How to Audit Your Supply Base to Insure it! Yashesh Sutariya, Saturn Electronics >> Influence of Bonding Parameters on Reliability of Cu Wire-Bonding to Electroless Ni/Pd/Au Plating *Yoshinori Ejiri, Takehisa Sakurai, Yoshinori Arayama, Yoshiaki Tsubomatsu, Kiyoshi Hasegawa, Hitachi Chemical Co., Ltd. >> Comprehensive Study of Various Short Failures on Printed Circuited Board Xiao He, Baojun Qiu, Daojun Luo, CEPREI
FSA3 Considerations for Assuring Reliable Assemblies
8:00 am – 9:30 am
Chair: *Phil Kinner, Electrolube Co-Chair: Nilesh Badwe, Ph.D., Intel Corporation >> Dissolution Rate of Specific Elements in SAC305 Solder *David Hillman, Ross Wilicoxon, Tim Pearson, Paul McKenna, Rockwell Collins >> Selective Soldering Design for Reliability Using a Novel Test Board and SIR Test Method *Mike Bixenman, DBA, David Lober, KYZEN Corporation; *Mark McMeen, STI Electronics; *Denis Jean, Kester Solder; Joe Clure, Kurtz Ersa >> Development of an Enhanced Low Melting Point Alloy Steven Teliszewski, Interflux Electronics N.V.; Albrecht Beck, ERSA North America
APT4 Board Level Reliability
10:30 am – 12:00 pm
>> Solder-Joint Reliability of a 0.65mm Pitch Molded Array Package for Automotive Applications *Burton Carpenter, Mollie Benson, *Andrew Mawer, NXP Semiconductors >> Characterization of SiP Assembly and Reliability Under Thermal Cycles *Reza Ghaffarian, Ph.D., Michael Meliunas, Jet Propulsion Laboratory >> Effective Approach to Enhance The Shock Performance of Ultra-Large BGA Components Weidong Xie, Ph.D., Mudasir Ahmad, Cherif Guirguis, Gnyaneshwar Ramakrishna, Jianghai Gu, Cisco Systems
MFX4 Cleaning & Coating
10:30 am – 12:00 pm
Chair: *Jason Keeping, P.E., Celestica, Inc. Co-Chair: *Jason Fullerton, Alpha Assembly Solutions >> CC-830 vs the Real World: Part 4. Understanding the Actual Failure Mechanism of Conformal Coatings that ‘Crack’ During Thermal Shock Testing *Phil Kinner, B. Turner, C. Allen, A. Duffy, Electrolube >> SIR Characterization of No-Clean Flux Residues Under the QFN Component Using Different PCB Board Design Options *Mike Bixenman, DBA, David Lober, KYZEN Corporation; *Mark McMeen, Collin Langley, STI Electronics >> Assessing the Implications of Fine Mesh Solder Powder on Flux Residue Removal Ravi Parthasarathy, M.S.Ch.E., ZESTRON Americas; Tim O’Neill, AIM; Terry Munson, Foresite *Designates Speaker of Distinction SMTAssociation
@SMTAorg #SMTAI
SMTA International 2018 >> 29
WEDNESDAY SESSIONS
Chair: Brian Roggeman, Qualcomm Technologies Inc. Co-Chair: Steve Murray, Northrop Grumman Corporation
Wednesday, October 17
See track key on page 23.
SUB4 Surface Finish – What's New or Different?
10:30 am – 12:00 pm
Chair: *Don Banks, Abbott Co-Chair: Lenora Clark, MacDermid Enthone >> How Does Surface Finish Affect Solder Paste Performance? *Tony Lentz, FCT Assembly, Inc. >> Surface Finish Panel Panelists: *Julie Silk, Keysight Techonologies *Lothar Henneken, Ph.D., Robert Bosch GmbH Rick Nichols, Atotech *Srinivas Chada, Ph.D., Stryker
FSA4 Low Melting Point Materials Development
10:30 am – 12:00 pm
Chair: Andy Behr, US Panasonic Co-Chair: Olga Spaldon-Stewart, Kester >> Novel High Reliability Low Temperature Solder Alloys *Ning-Cheng, Lee, Ph.D., Francis Mutuku, Jie Geng, Hongwen Zhang, Indium Corporation >> A Study on the Minimum and Maximum Temperatures of the Reflow Process in SMT Assembly on Paste Ccontaining Bismuth Alloys Combined With Lead-Free Solder Spheres *Martin Anselm, Ph.D., Priscilla Gomez, Tayler Swanson, Rochester Institute of Technology (RIT) >> Engineered Flux for Low Temperature Solders Ramakrishna Hosur Venkatagiriyappa, Ph.D., Harish H S, Manjuvani J, Vangapandu Bhaskar, Ramesh Kumar, Siuli Sarkar and Vikas Patil, Alpha Assembly Solutions
APT5 Advances in Technology for Power Packaging
1:30 pm – 3:00 pm
Chair: *Marie Cole, IBM Corporation Co-Chair: *Jim Wilcox, Universal Instruments Corporation >> New Soldering Technology for High Temperature Applications: Hot Powder Connection (HotPowCon) *Jörg Trodler, S. Käss, S. Fritzsche, D. Feil, T. Herberholz, Heraeus Electronics >> Liquid Dispensed Thermal Interface Materials for Electronics Applications John Timmerman, Ph.D., Henkel >> Investigation of Copper Sinter Material for Die Attach *Christian Schwarzer, Heraeus Deutschland GmbH
MFX5 Reflow Technologies
1:30 pm – 3:00 pm
Chair: *Ray Whittier, BAE Systems Co-Chair: *Chrys Shea, Shea Engineering Services WEDNESDAY SESSIONS
>> SMT Reflow Blower Velocity and Vibration Characterization Jason Stafford, Supriya Agrawal, Intel Corporation >> Operation and Repeatability Testing of a Vacuum Reflow Oven with Preliminary Void Reduction Data Fred Dimock, BTU International >> Void Reduction in Reflow Soldering Processes by Sweep Stimulation of PCB Substrate – DoE Tests *Viktoria Rawinski, Joe Clure, ERSA GmbH; Denis Jean, Marcel Buck, Kester
SUB5 Microvia Learning Lab
1:30 pm – 3:00 pm
Chair: Marc Carter, SAIC
FREE FOR ALL ATTENDEES
Industry surveys show that HDI technology has experienced a healthy growth from 2000 to present day. The actual CAGR from 2016 to 2017 was double digits. Technological advances are relying more and more on microvia designs. More use and testing has revealed that there are reliability concerns surrounding those designs. In this Learning Lab, we will take a look at the currently accepted methods for microvia reliability testing and expose some weaknesses in the accuracy of those tests when compared to real world working environments. The presentations will be designed to increase awareness of this issue and foster discussion. Three elements: >> Current understanding of the problem and mitigation measures in place – J. Magera, Motorola >> FMEA Project Definition (“Fishbone”, Taguchi) – J. Baccam/D. Dupriest, Lockheed Martin >> Microvia Reliability Modeling and Simulation (ANSYS) – G. Lengacher/J. Harms, US Navy 30 >> SMTA International 2018
SMTAssociation
@SMTAorg #SMTAI
Thursday, October 18
See track key on page 23.
APT6 Reliability of Intermetallics in Various Interconnects
8:00 am – 9:30 am
Chair: *Burton Carpenter, NXP Semiconductors Co-Chair: *Don Banks, Abbott >> Comparison of Reliability of Copper, Gold, Silver, and PCC Wirebonds Under Sustained Operation at 200C *Pradeep Lall, Ph.D., Auburn University; Shantanu Deshpand, Luu Nguyen, Ph.D., Texas Instruments >> Copper-Tin Intermetallics: Their Importance, Growth Rate, and Nature *Ron Lasky, Ph.D., Indium Corporation >> The Role of Nickel in Solder Alloys – Part 2: The Effect of Ni on The Integrity of the Interfacial Intermetallic in Sn-Based Solder Joints to Copper Substrates Kazuhiro Nogita, The University of Queensland; Keith Sweatman, Tetsuro Nishimura, Nihon Superior Co. Ltd.
MFX6 Manufacturing Operational Challenges
8:00 am – 9:30 am
Chair: Pedro Martinez, Intel Corporation Co-Chair: Warren Harper, Honeywell Aerospace >> Accelerating the Solder Paste Evaluation Process *Chrys Shea, Shea Engineering Services >> Requirements on a Class „0“ EPA – BASICS, STANDARDS, ESD Equipments and Measurements Hartmut Berndt, Dipl.-Ing., B.E.STAT ESD Competence Centre >> Experimental Study on the Capability and Performance of a Jetting Dispensing Unit In Components Fastening *Martin Anselm, Ph.D., Keyla Y. Bastardo, Rochester Institute of Technology (RIT)
INS1 Inspection Applications
8:00 am – 9:30 am
Chair: *Bill Cardoso, Ph.D., Creative Electron, Inc. Co-Chair: *Keith Bryant, YXLON International GmbH >> Characterize and Quantify the Production Inspection Capability of AXI for HiP Defects Herb Holmes, Intel Corporation >> Putting "Design” Back Into Design for Test in Today's PCB Products Zac Elliott, Mark Laing, Mentor, a Siemens Business >> Practical Implementation of Assembly Processes for Low Melting Point Solder Pastes Brook Sandy-Smith, Indium Corporation; *Martin Anselm, Ph.D., Rochester Institute of Technology (RIT)
APT7 Reliability of Low Temperature Solder (LTS) Interconnects
10:00 am – 12:00 pm
>> Low Temperature Solder Interconnect Reliability and Potential Application in Enterprise Computer and Automotive Electronics *Paul Wang, Ph.D., David He, Vivi Cao, Jopy Tan, Mitac International Corporation >> Low Melting Temperature Interconnect Thermal Cycling Performance Enhancement Using Elemental Tuning and Edgebond Application *Tae Kyu Lee, Ph.D., Andy Hsiao, Mohamed Sheikh, Imbok Lee, Young-Woo Lee, Edward Ibe, Karl Loh, Tae-Kyu Lee, Portland State University >> A Novel Approach To Determine Mechanical Fatigue Performance of Solder Material Using Single Solder Joint Test Satyajit Walwadkar, Ph.D., *Raiyo Aspandiar, Ph.D., George Hsieh, Kevin Byrd, Intel Corporation >> Thermomechanical Reliability of Low-Temperature Solder Alloys for Mid-Power LED Packages *Ranjit Pandher, Ph.D., Niveditha Nagarajan; Nicholas Herrick, Alpha Assembly Solutions
*Designates Speaker of Distinction SMTAssociation
@SMTAorg #SMTAI
SMTA International 2018 >> 31
THURSDAY SESSIONS
Chair: *Charles Woychik, Ph.D., i3Electronics Co-Chair: *Steve Greathouse, Plexus Corp.
Thursday, October 18
See track key on page 23.
MFX7 Rework
10:00 am – 11:30 am
Chair: Robert Kinyanjui, Ph.D., John Deere Electronic Solutions, Inc. Co-Chair: *Iulia Muntele, Ph.D., Sanmina Corporation >> Laser Rework Process John Burke, Naveen Kini, Ben Choi, Robin Zhu, Herrick Fu, Alex Dai, P.E., Western Digital >> Comparison Study Between Lead-Free Solder and Low Temperature Solder for Hand Soldering Rework Maria Mejias-Hernandez, Connie Lavinger, Intel Corporation >> Rework Practices for µLED’s and Other Highly Miniaturized SMT Components Neil O'Brien, FineTech
INS2 Inspection 4.0
10:00 am – 12:00 pm
Chair: *Keith Bryant, YXLON International GmbH Co-Chair: *Diganta Das, Ph.D., CALCE/University of Maryland >> Advancement of Solder Paste Inspection (SPI) Tools to Support Industry 4.0 & Package Scaling Abhishek Prasad, Ph.D., Larry Pymento, Srinivasa R Aravamudhan and Chandru Periasamy, Intel Corporation >> Combining Automated Advanced Process Control (APC) with Mounter Feedback to Revolutionize the PCBA Process Brent Fischthal, Koh Young America, Inc. >> Industry 4.0 for Inspection in the Electronics Industry *Ragnar Vaga, YXLON International GmbH >> Extending 3D MRS Technology to Address Challenging Inspection and Measurement Applications Tim Skunes, CyberOptics Corporation
INS3 Inspection Technologies
1:00 pm – 2:30 pm
Chair: *Robert Boguski, Datest Corp. Co-Chair: Todd McFadden, Bose >> X-Ray Inspection: New Capabilities and Methodology for PCBA Analysis Julien Perraud, Arnaud Grivon, Shaďma Enouz-Vedrenne, Thales Group >> Assessment of 2nd Level Interconnect Quality in Flip Chip Ball Grid Array (FCBGA) Package Using Laser Ultrasonic Inspection Technique Vishnu V.B. Reddy, Chidinma C. Imediegwu, Chong Ye, I. Charles Ume, Bryan Rogers, Cherif Guirguis, Kathy Derksen, Parimal Patel, Georgia Institute of Technology; Kola Akinade, Cisco Systems >> The Hygroscopic Capacity of Integrated Circuit Packages and Printed Circuit Boards Steven Watson, David Rathbone, Matthew Domanic, Kaitlyn Fox, VTO Labs
INS4 Counterfeit Detection
3:00 pm – 4:30 pm
Chair: *Terry Kocour, Lockheed Martin Co-Chair: Mac Butler, Northrop Grumman Corporation
THURSDAY SESSIONS
>> Essential Tools to Combat the Ingress of Counterfeit Materials *Cameron Shearon, Shearon Consulting >> Counterfeit Detection Using X-Ray Image as a Fingerprint *Glen Thomas, Ph.D., Creative Electron, Inc. >> Use of Component Documentation and Supply Chain for Counterfeit Avoidance *Diganta Das, Ph.D., CALCE/ University of Maryland
Lead-Free Soldering Symposium LF1
8:00 am – 4:30 pm
Low Temp Solder Paste and its Process Development
8:00 am – 9:30 am
Chair: *Jason Fullerton, Alpha Assembly Solutions Co-Chair: Anny Zhang, Indium Corporation >> iNEMI Project on Process Development of BiSn-Based Low Temperature Solder Pastes Part IV: Comprehensive Mechanical Shock Tests on POP Components Having Mixed BGA BiSn-SAC Solder Joints (continued) 32 >> SMTA International 2018
SMTAssociation
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Thursday, October 18
See track key on page 23.
(continued) *Raiyo Aspandiar, Ph.D., Jagadeesh Radhakrishnan, Kevin Byrd, Shunfeng Cheng, Scott Mokler, Kok Kwan Tang, Intel Corporation; Haley Fu, iNEMI; *Babak Arfaei, Binghamton University; *Morgana Ribas, Alpha Assembly Solutions; Jimmy Chen, Flex; Qin Chen, Eunow; *Richard Coyle, Ph.D., Nokia Bell Labs; Derek Daily, Senju Comtek Corp., Sophia Feng, Celestica Inc.; Mark Krmpotich, Microsoft Corporation; Brook Sandy-Smith, Anny Zhang, Indium Corporation; Greg Wu, Wistron; Wilson Zhen, Lenovo >> Low Temperature Soldering Reflow Optimization for Enhanced Mechanical Reliability *Morgana Ribas, Ph.D., H. V. Ramakrishna, Laxminarayana Pai, Raghu Raj Rangaraju, Suresh Telu, Bhaskar Vangapandu, Ramesh Kumar, Traian Cucu, Siuli Sarkar, Alpha Assembly Solutions >> The Impact of the Alloy Composition on Shear Strength of Low Temperature Lead-Free Solder Joints *Traian Cucu, Ph.D., Anna Lifton, Alpha Assembly Solutions
LF2
High Reliability Pb-free Alloys, SAC305 and Beyond
10:00 am – 12:00 pm
Chair: *Jeff Jennings, Harris Corporation Co-Chair: Jose M. Servin Olivares, Continental Automotive >> Effect Of Aging on SAC 305 Solder Joints Reliability in Accelerated Fatigue Shear Test Raed Al Athmneh, Mohammed Abueed, Dania Bani Hani, Sa’d Hamasha, Auburn University >> Reflow Profiling for Next-Generation Solder Alloys Brook Sandy-Smith, Indium Corporation; MB Allen, KIC >> Alloy Composition and Thermal Fatigue of High Reliability Pb-Free Solder Alloys *Richard Coyle, Ph.D., Joe Smetana, Nokia Bell Labs; *Dave Hillman, Rockwell Collins; Charmaine Johnson, Richard Parker, Brook Sandy-Smith, Hongwen Zhang, Jie Geng, Indium Corporation; Michael Osterman, Ph.D., University of Maryland/ CALCE; *Babak Arfaei, Ph.D., Ford Motor Company; *Andre Delhaise, Ph.D., Celestica, Inc.; Keith Howell, Nihon Superior Company, Ltd.; *Jasbir Bath, Bath Consultancy; Stuart Longgood, Delphi; Andre Kleyner, Sagg Computers; *Julie Silk, Keysight Technologies; *Ranjit Pandher, Eric Lundeen, and Jerome Noiray, Alpha Assembly Solutions >> Effect of TIM Compression Load on BGA Reliability *Lars Bruno, Ericsson AB; Nicholas Graziano, SUNY; Harry Schoeller, Universal Instruments Corporation
LF3
Properties and Behavior of Solders Containing Bismuth
1:00 pm – 2:30 pm
Chair: *Srinivas Chada, Ph.D., Stryker Co-Chair: Brook Sandy-Smith, Indium Corporation >> Crack Propagation Mechanism Study on Bismuth Contained Sn Base Lead-Free Solder Under Thermo-Mechanical Stress Imbok Lee, Aakash Valliappan, Young-Woo Lee, Tae-Kyu Lee, MK Electron Co., Ltd. >> Restoration of Microstructure and Mechanical Properties of Lead-Free Bismuth Containing Solder Joints after Accelerated Reliability Testing Using a Thermal Treatment *Andre Delhaise, Ph.D., Ivan Tan, Polina Snugovsky, *Jeff Kennedy, Celestica; Mikaella Brillantes, Doug D. Perovic, University of Toronto; David Adams, *David Hillman, Rockwell-Collins; Stephan Meschter, Ph.D., BAE Systems; Milea Kammer, Honeywell Aerospace; Ivan Straznicky, Curtiss-Wright >> Low-Temperature Soldering with Ordered Alloys Mo Biglari, A. Das, L.C.P. Krassenburg, J.H.G. Brom, N.J.A. van Veen, A.A. Kodentsov, Mat-Tech BV
Reliability of Doped Sn Based Lead-Free Alloys
3:00 pm – 4:30 pm
Chair: *Raiyo Aspandiar, Ph.D., Intel Corporation Co-Chair: Robert Kinyanjui, Ph.D., John Deere Electronic Solutions, Inc. >> Effect on Creep Rate of Alloying Additions to Ni-Stabilized Sn-Cu Eutectic Solders *Keith Sweatman, Tetsuya Akaiwa, Tetsuro Nishimura, Nihon Superior Company, Ltd. >> Long Term Isothermal Aging of Various BGA Packages Using Doped Lead-Free Solder Alloys *Anto Raj, Sharath Sridhar, Ph.D., Sivasubramanian Thirugnanasambandam, Ph.D., Thomas Sanders, Ph.D., John Evans, Ph.D., Wayne Johnson, Ph.D., Sa'd Hamasha, Ph.D., Auburn University >> The Effect of Bismuth, Antimony, or Indium on the Thermal Fatigue of High Reliability Pb-Free Solder Alloys *Richard Coyle, Ph.D., Joe Smetana, Nokia Bell Labs; *Dave Hillman, Rockwell Collins; Charmaine Johnson, Richard Parker, Brook Sandy-Smith, Hongwen Zhang, Jie Geng, Indium Corporation; Michael Osterman, Ph.D., University of Maryland/ CALCE; *Babak Arfaei, Ph.D., Ford Motor Company; *Andre Delhaise, Ph.D., Celestica, Inc.; Keith Howell, Nihon Superior Company, Ltd.; *Jasbir Bath, Bath Consultancy; Stuart Longgood, Delphi; Andre Kleyner, Sagg Computers; *Julie Silk, Keysight Technologies; *Ranjit Pandher, Eric Lundeen, and Jerome Noiray, Alpha Assembly Solutions *Designates Speaker of Distinction SMTAssociation
@SMTAorg #SMTAI
SMTA International 2018 >> 33
THURSDAY SESSIONS
LF4
REGISTRATION OPTIONS Early Registration Discount
Deduct 10% from your conference registration when you register by September 21!
Group Discounts
Register four people for a Technical Conference or VIP Conference package and take $50 off each registration! All must be from the same company and must submit their registrations at the same time. Deduct $50 from each! Not available on-site or on Speaker Registration.
Student Rates
Special rates are available for full time students. Please visit the SMTA International webpage to register online.
Exhibits Join us on October 16 from 10:00 am – 5:00 pm and October 17 from 9:00 am – 4:00 pm for unparalleled networking opportunities with leading companies. There is no cost to attend the exhibits.
Conference VIP Conference Package – Your Best Value Includes FOUR Professional Development Courses, Technical Sessions, Annual Meeting, Keynote Presentations, Exhibits Admission, and Proceedings. $8 coupon is available for lunch in the Exhibit Hall on Tuesday and Wednesday. Pick up in the SMTA membership booth.
Technical Conference Includes Technical Sessions, Annual Meeting, Keynote Presentations, Exhibits Admission, and Proceedings. $8 coupon is available for lunch in the Exhibit Hall on Tuesday and Wednesday. Does not include Professional Development Courses.
Single Day Includes a single day of technical paper sessions/tracks, Exhibits Admission, and Proceedings. Does not include Professional Development Courses.
IPC Fall Standards Development Committee Meetings Registration Options Combined SMTA International Conference and IPC Standards Development Committee Meetings Includes IPC committee meetings, technical sessions, Opening Session, Exhibits Admission, and Proceedings. $8 coupon is available for lunch in the Exhibit Hall on Tuesday and Wednesday. Pick up in the SMTA membership booth.
IPC Committee Networking Package Your registration fee includes IPC standards development committee meetings, entrance to the Exhibits and IPC lunches on Monday and Thursday. SMTA will provide a lunch coupon to use on the Exhibit Floor on Tuesday and Wednesday. Pick up in the SMTA membership booth.
IPC Standards Development Committee Meetings Your registration fee includes IPC standards development committee meetings, entrance to Exhibits and lunch coupon on the Exhibit Floor on Tuesday and Wednesday.
IPC Committee Awards/Networking Luncheons
Includes course materials, certificate, and breaks. Does not include Proceedings.
You will need to select Monday committee awards and/or Thursday networking luncheon. Tickets will be provided. You do not need to be attending an IPC meeting to purchase a lunch ticket.
Consent Clause
Additional Items
Registration and attendance at or participation in SMTA meetings and other activities constitutes as an agreement by the registrant to SMTA's use and distribution (both now and in the future) of the registrant or attendee's image or voice in photographs, videotapes, electronic reproductions and audiotapes of such events and activities by SMTA.
Livin’ La Vida SMTA
Half Day Courses
Adobe Gilas, 5455 Park PL, Rosemont, IL 60018 Grab your amigos and fiesta on Tuesday, October 16 as you enjoy great music, all you can eat tacos, fajitas, chips and salsa. Only $25 per person in advance ($30 at the door). All fiesta tickets include access to the buffet and a drink ticket. Order your fiesta tickets directly online when you register for the conference.
Proceedings Your registration fee includes conference proceedings for a VIP, Technical Conference or Single Day Conference Package.
Hotel and Travel Information SMTA International is held at the Donald E. Stephens Convention Center in Rosemont, Illinois.
REGISTRATION
Room blocks have been reserved at a rate of $185-$226 at the Aloft Chicago O'Hare, Hilton Rosemont/Chicago O'Hare, DoubleTree by Hilton Hotel Chicago O'Hare, Chicago Marriott Suites O'Hare, and Crowne Plaza. All hotels are within easy walking distance of the Convention Center. Book your reservations through our website to secure these rates. IMPORTANT NOTE: Room Block expires on Friday, September 21.
Please visit www.smta.org/smtai for full travel information. 34 >> SMTA International 2018
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CONFERENCE REGISTRATION CONFERENCE: October 14 – October 18, 2018 EXHIBITION: October 16 – October 17, 2018 Rosemont, Illinois
Visit www.smta.org/smtai to register today! REGISTER BY SEPTEMBER 21 and SAVE 10%! See previous page for all details on what is included with each registration category. GROUP DISCOUNT: Register four people from the same company/location and deduct $50 off each! Member rates apply to both SMTA and IPC members. Exhibit Hall Only
FREE! If pre-registered or $25 on-site MEMBER NON-MEMBER
SMTA International Conference VIP Package (your best value) Four PDCs are included
$1050 $1,250 Speaker/Chair: $800 $1,000
Technical Conference
$650 $850 Speaker/Chair: $350 $550
Single Day Conference
$350 $550 Speaker/Chair: $200 $400
Half Day PDCs $350 $450 Up to four included with a VIP registration, or you may register for them separately
IPC Standards Development Committee Meetings Options IPC Committee Meetings Plus SMTA International Conference
$675 $825
IPC Committee Networking Package $155 $180 IPC Committee Meetings
$60 $80
Additional Options
IPC Committee Awards Luncheon (Monday) Non-committee members may also attend
$50 each
IPC Committee Networking Luncheon (Thursday)
$50 each
Proceedings Livin’ La Vida SMTA (Tuesday)
$300 $25 early bird
$30 at the door
Fun Run (Wednesday) FREE! Important Note: Everything listed below comes to you at NO ADDITIONAL COST: • Exhibit Hall Lunch coupon ($8 value) on • Exhibit Hall Tuesday and Wednesday • Keynote Presentations • Poster Session • Annual Meeting • Beer Tasting & Expo Reception • Women’s Leadership Program • Fun Run • Spotlight Sessions
Cancellation Policy Cancellations will be refunded (less a $75 processing fee) if received by September 21. All requests must be in writing and all badges/tickets must be returned before a refund can be processed. Substitutions are allowed and encouraged. Cancellation after September 21 and “no shows” are subject to the full registration fee. Refunds will not be made until after the conference. SMTA reserves the right to cancel any course with less than 10 registrants.
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October 14–18, 2018