SMTA International 2020 Virtual Conference and Expo by Surface Mount Technology Association

VISION | INNOVATION | CLARITY • Share in the VISION with industry leaders. • See the INNOVATION that will influence the future. • Experience CLARITY all in one place.

PRE-EVENT GUIDE On-Demand Conference & Expo September 28 - October 23, 2020 Live Virtual Exposition September 28 - 30, 2020

EASY WAYS TO REGISTER

Online

What You Need to Know About the Virtual Conference and Expo

www.smta.org/smtai

The new virtual format will allow attendees to easily navigate within Phone a simulated conference center +1 952.920.7682 environment. Attendees will have access to the exhibit hall and virtual networking opportunities to interact and collaborate with other participants for a fully immersive experience. The exhibition is free to all and the live portion will take place September 28 - September 30. During this time, attendees will be able to roam the virtual show floor, view company products and demo videos, and privately chat with exhibitors 24 hours a day. Attendees will have continued access to the exhibit hall until October 23 without the option to chat live with exhibitors. Attendees who register for the Technical Conference will have exclusive access to over 100 technical presentations on-demand from September 28 - October 23 as well as the ability to download all papers in the conference proceedings. Don't forget to use and search for #smtai2020 on LinkedIn, Twitter, Instagram, and Facebook to connect with your peers and expand your professional circle during SMTA International.

Thank You to Our Premiere Sponsors!

JOIN THE BEST VIRTUAL EXPERIENCE OF 2020

Bringing the Industry Together

On-Demand Conference & Expo: September 28 - October 23, 2020 Live Virtual Exposition: September 28 - 30, 2020

Raiyo Aspandiar, Ph.D. Intel Corporation Conference Director

Richard Coyle, Ph.D. Nokia Bell Labs VP of Technical Programs

With so much uncertainty in the world, the electronics industry needs vision, innovation, and clarity now more than ever. SMTA International provides your best chance to reconnect with the global electronics manufacturing community and to stay competitive, identify challenges, innovate, and exceed expectations.

We invite you to attend the virtual SMTA International Conference and Exhibition. Join us from September 28 - October 23, 2020 for the On-Demand Conference & Expo and make sure to log in for the Live Virtual Exposition from September 28 - 30. We are proud of our legacy of providing an outstanding conference and exhibition experience and this year will be no different. The conference and exhibition are a unique opportunity for us to collaborate, share, and learn from each other and industry experts. SMTA International remains an exceptional event because we are able to attract an outstanding group of authors, speakers, exhibitors and volunteers. The team work and collaboration that goes into developing the conference and exhibition is exceptional â&#x20AC;&#x201C; it really highlights that SMTA is more than just an industry association, we are a family. Our technical program contains papers and presentations from true subject matter experts covering a wide range of electronic manufacturing topics. The Technical Advisory Committee and the SMTA staff, Officers and Global Board of Directors sincerely hope that SMTA International is a valuable and enjoyable experience for you and your company. See you online. Register today at www.smta.org/smtai. REGISTER TODAY AT WWW.SMTA.ORG/SMTAI

TABLE OF CONTENTS Join Us at SMTA International 1 Table of Contents 2 Conference At-A-Glance 3 Click Contest

Harsh Environment Applications (HE) Substrates/PCB Technology (SUB)

Lead-Free & Low Temp Soldering Technology (LF)

9 Manufacturing Excellence (MFX)

Advanced Packaging 4 Technology (APT)

Technical Innovations (TI) PCEA

Flux, Solder, Adhesives (FSA) 5

Professional Development Courses (PDC)

12 Special Events 13 Electronics Exposition 14 Womenâ&#x20AC;&#x2122;s Leadership Program 16 Young Professionals Program

CONFERENCE AT-A-GLANCE Learn About the Latest Research Studies and Manufacturing Technology Advancements The SMTA International Technical Conference includes over 100 presentations available on demand from September 28 - October 23. Each presentation is organized into the following technical tracks:

Track Advanced Packaging Technology (APT) Flux, Solder, Adhesives (FSA) Harsh Environment Applications (HE) Lead-Free & Low Temp Soldering Technology (LF) Manufacturing Excellence (MFX) Substrates/PCB Technology (SUB) Technical Innovations (TI) Printed Circuit Engineering (PCEA)

CLICK CONTEST All attendees are invited to join in on the fun! Receive points for your activity and engagement within the event! Explore the auditorium, lobby and exhibit hall to earn points and a chance to win prizes! See how you compare against other attendees on the contest leaderboard. 1st Place: Peloton Bike 2nd Place: Apple or Android Watch 3rd Place: Sonos or Bose Speaker

ADVANCED PACKAGING TECHNOLOGY (APT) Enhancing the Reliability of 3D Package by Analyzing Crack Behavior on TSV Through Structural Optimization and Comparing Material Properties of the Package Mehzabeen Kabir, The University of Texas at Arlington LFF BGA SMT and Rework Learnings Hemant Shah, Ph.D., Intel Corporation

10micron Pitch Wiring and Bump on Substrate Formed by Imprinting Technology to Apply Low Temperature Flip Chip Bonding Hiroshi Komatsu, CONNECTEC JAPAN Corporation 3D Integration Using Heterogeneous System-In-Package (HSIP) Technology Charles Woychik, Ph.D., i3 Microsystems A Case Study: The Influence of QFN Package Construction on Solder Joint Durability Tim Pearson, Collins Aerospace CBGA and CCGA Field Reliability Predictions Confirmed? Jennifer Bennet, P.E., IBM Corporation Cu Paste for Molded Interconnect Devices Yoshinori Ejiri, Hitachi Chemical Co. Design for Sustained High Temperature Operation of FCBGAs Based on ProcessPerformance Relationships Pradeep Lall, Ph.D., Auburn University

Metallic Corrosion Potential During the Cleaning Process David Lober, KYZEN Corporation Miniaturized Stacked Die QFN for Tire Pressure Monitoring System Applications Andrew Mawer & Vishrudh Sriramprasad, NXP Semiconductors Plasma Treatment Study of Copper Heatsink for Improved Adhesion of Thermally Conductive Adhesive Swagatika Patra, SMART Modular Technologies Power Subsystem Quality Improvement an E2E Approach Eric Swenson, IBM Corporation Process Development Challenges and DOE Study to Control Bondline Thickness During Heat Sink Attachment Using Thermally Conductive Adhesive Raghabendra Rout, SMART Modular Technologies Updates on the Industry Standards for SMT Moisture/Reflow Sensitive Devices Steve Martell, Nordson ES - Sonoscan Versatile TIM Solution with Chain Network Solder Composite Ning-Cheng Lee, Ph.D., Indium Corporation

FLUX, SOLDER, ADHESIVES (FSA) Flux and Flux Management in a Nitrogen Reflow Oven Fred Dimock, BTU International High Reliability SMT Solder Paste Evaluation Howard Osgood, Flex

Advanced SIR Testing for Trapped Solder Paste Flux Residue Karen Tellefsen, Ph.D., MacDermid Alpha Electronics Solutions Characteristics of Ultra-Fine Sn-Bi Base Solder Powders Arslane Bouchemit, 5N Plus Inc., Micro Powders Designing a Cleanliness Risk Profile on Leadless & Near Chip Scale Packages Mike Bixenman, MBA, DBA, Magnalytix Effect of Microstructure on Fracture Load Prediction of Solder Joints Mostafa Mohammadiamiri, Sharif University of Technology Fine Powder Investigation for Optimum Imperial 008004 Solder Paste Printing: Part I Adam Murling, Indium Corporation

Intermetallic Compounds Growth Analysis with Two Methods: X-Ray Diffraction Compared to the Combination of X-Ray Fluorescence (XRF) and Coulometric Stripping (CS) Jose Servin, Ph.D., VITESCO Nickel-Free Surface Finish Solution for 5G, RF, Microwave, High-Frequency-HDI PCB Applications-Relibility in Focus Kunal Shah, Ph.D., Lilotree Process Control Plan to Monitor Acceptable Levels of Flux and Other Residues William Capen, Honeywell FM&T Quality Control of Solder Paste Utilizing Electrochemical Impedance Spectroscopy Denis Barbini, Ph.D., Insituware Voiding Study on Soldered Chip and Power Transistor (BTC) Components with Different Lead-Free Solder Pastes Jasbir Bath, Koki Solder America

HARSH ENVIRONMENT APPLICATIONS (HE) An Effective Accelerated Method for AntiSulfur Corrosion Capacity Validation for Anti-Sulfur Type Electronic Passive Components Dem Lee, Intergrated Service Technology Combined Creep and Fatigue Loadings on SAC305 Solder Joint Mohammed Abueed, Ph.D., Auburn University

A Comparative Study of Mitigation Methods and Effect of Temperature on Sulfur Corrosion of 0201 Resistors Raghabendra Rout, SUNY Binghamton A Spray-Dip-Brush Applied Conformal Coating with Parylene Level PWB Protection Against Salt-Spray, Harsh Environment and Extreme Weather Conditions Robert Gelosa, AI Technology, Inc.

Development of Accelerated Environmental Exposure Tests that Target Specific Degradation Mechanisms Chris Genthe & Kelly Flanagan, Rockwell Automation Electrochemical Failures as a Function of Flux Volume Under Bottom Terminated Components Mark McMeen, STI Electronics Material Behavior of Aged SAC Solder Alloys Under Sustained Operation at Extreme Cold Temperatures at High-Strain Rates Pradeep Lall, Ph.D., Auburn University

SUBSTRATES/PCB TECHNOLOGY (SUB) Deposit Properties of Electroless Au/Pd/ Au Process for 5G Application Tetsuya Sasamura, Ph.D., Uyemura & Co.

PCB Embedding Technology for 5G MIMO Antenna Modules Lars Boettcher, Fraunhofer IZM Berlin

ENIG - Corrosion: When it Gets Critical and How is the Status in the PCB Industry? Britta Schafsteller, Ph.D., Atotech Deutschland GmbH

PIT Resistant Acid Copper Electroplating Process for Flash Etching Sean Fleuriel, MacDermid Alpha Electronic Solutions

Low Stress Reliable Positive Tone Photosensitive Polyimide Masao Tomikawa, Ph.D., Toray Industries

Single Step Metallization Process for the Filling of Through Holes with Copper Carmichael Gugliotti, MacDermid Alpha Electronic Solutions

LEAD-FREE & LOW TEMP SOLDERING (LF) An Alternative Lead-Free, LowTemperature Solder with Excellent Drop-Shock Resistance Hongwen Zhang, Ph.D., Indium Corporation Behaviour and Strengthening Effects of Sb in a Low-Bi Sn-Cu Solder Alloy Keith Sweatman, Ph.D., Nihon Superior Company Comparison of Surface Mount Yields for Tin-Bismuth Low Temperature Solder vs. SAC in an Aggressive Motherboard Design Kevin Byrd, Intel Corporation Constraint Parameters in Elastic-Plastic Fracture Mechanics Used to Describe the Fracture Behavior of Solder Joints Sadesg Mirmedhi, Sharif University of Technology Effect of a Ductile, Low Melting Point Alloy on the Hot Tear Defect on LeadFree Ball Grid Arrays Steven Teliszewski, P.E., Interflux Electronics NV Effect of Current Stress on the Microstructure Evolution of SnBiAg-SAC Mixed Solder Joints Faramarz Hadian, SUNY Binghamton Effect of Initial Volume Ratio and Reflow Temperature on the Microstructure of SnBiAg-SAC Mixed Solder Joints Eric Cotts, Ph.D., SUNY Binghamton Effect of New SAC-Bi Solder Pastes on Thermal Cycling Reliability Considering Aging Mohammed Belhadi, Auburn University

Enhancing Thermal Fatigue Reliability of Pb-Free Solder Alloys with Additions of Bismuth and Antimony Richard Coyle, Ph.D., Nokia Bell Labs High Thermal Reliability Sn-Ag-Bi Based Solder Alloy for Semiconductor Applications Watson Tseng, Shenmao Technology, Inc. High-Cycle Fatigue Test Development to Assess Pb-Free Solder Joints Rebecca Wheeling, Ph.D., Sandia National Laboratories iNEMI Project on Process Development of BiSn-Based Low Temperature Solder Pastes - Part VII: Mechanical Shock Test and Failure Analysis on Mixed SnAgCu-BiSn Solder Joints of FCBGA Components Jagadeesh Radhakrishnan, Intel Corporation Influence of Thermal Cycle Dwell Time on the Mechanical Properties of SAC-Bi Solder Joints Luke Wentlent, Ph.D., Universal Instruments Corp. Intermetallic Compound Growth and Gold Embrittlement Effect in Sn-Bi Low Temperature Solders in Contact with Electroless Nickel Emersion Gold (ENIG) Surface Finish Yaohui Fan, Ph.D., Purdue University Investigation of Reliability for IMS Substrates Joerg Trodler, Heraeus Deutschland GmbH & Co. KG

LEAD-FREE & LOW TEMP SOLDERING (LF) CONTINUED Microstructure Evaluation and Bail Shear Testing of SAC- Bi Pb-Free Solder Alloys Julian Rosas, University of Toronto Microstructure Evolution During Thermal Fatigue of a High-Ag SAC Solder Containing 5.5% Sb Chris Gourlay, Imperial College London

Investigation of SMT Processing on Inductors and Filters Using Low Temperature Solder Material Kinson Lu, Chilisin Group Low Melting Temperature Interconnect Thermal Cycling Performance Enhancement Using Elemental Tuning and Edgebond Application Tae-Kyu Lee, Ph.D., Portland State University Measurement of Change in CTE of PCBs Due to Single Phase Immersion Cooling and Impact of Changed Properties of PCBs on Solder Joint Reliability of BGA Package Sameer Dhandarphale, University of Texas at Arlington Mechanical Behavior of Low Temperature Solder Alloys Mehran Maalekian, Ph.D., Mat-Tech Microstructural Evolution in AuContaining SnPb and SAC305 Joints During Thermal Cycling of Leadless Chip Carriers Alyssa Yaeger, Purdue University

Reliability Behavior of Surface Mount Devices Assembled with Bismuth Bearing Low-Melt Solder Pastes Luke Wentlent, Ph.D., Universal Instruments Corp. Thermal Cycle and Drop Shock Performance of Homogeneous SnBi LTS and SAC Solder Joints Nilesh Badwe, Ph.D., Intel Corporation Thermal Reliability of Mixing BismuthContaining Solder Paste with SAC BGAs at Low Reflow Temperatures - Part 1 Raynier Fernandez Salomo, Rochester Institute of Technology Vibration Fatigue of High Reliability Solder Alloys in Ball Grid Array Packages Subjected to Isothermal Aging Process Arvind Karthikeyan, Auburn University Wetting Characteristics of SnBi Low Temperature Solder on Different Surface Finishes Pubudu Goonetilleke, Intel Corporation

Microstructure Development and Mechanical Properties of Bi-Containing SnAgCu Alloys for Advanced Semiconductor Devices Dominic Hurley, Purdue University 8

MANUFACTURING EXCELLENCE (MFX) Accelerating Continuous Improvement with Next Generation pH Neutral Cleaning Products Ravi Parthasarathy, M.S.Ch.E., ZESTRON

Low Melting Solder Affects Selective Soldering Settings and Materials Gerjan Diepstraten, ITWEAE

Accuracy Validation Finds Hidden Problems Affecting SMT Quality Michael Sivigny, CeTaQ Americas

New Device Validates Printer Accuracy and Squeegee Force During Singular Test Michael Sivigny, CeTaQ Americas

Assembly and Rework Challenges of Fine Pitch Bottom Termination Components Samaher Mashaareh, SMART Modular Technology

Pick-and-Place Feeder Density Within SMT and Electronics Assembly Terry York, Kulicke & Soffa Industries

Building a Better, Brighter, LED Headlamp with Top-Side Alignment Glenn Farris, Universal Instruments Corporation

Process Optimization for Reducing Solder Paste Splatter During Reflow Leon Rao, Indium Corporation

Contact Interconnect Challenges and Resolution-Part 2: Cable and Connector Contact Interconnect Integrity in Enterprise Server for DC Application Paul Wang, Ph.D., Mitac International Corporation

Reasons to Clean Circuit Assemblies Even When Using No-Clean Flux Michael Konrad, Aqueous Technologies

Design and Process Recommendation to Enable Pin in Paste Through Hole Soldering for SnBi Low Temperature Solder Sugadh Bakare, Intel Corporation Effect of Welding Temperature on Wettability of Sn-58Bi Bingjie Zheng, P.E., CEPREI Laboratory EMS Process Capability Qualification & Monitoring for Complex Aerospace & Defense PCBA : A Successful Implementation in India Sriranjani Sundareshan, Thales India Pvt High Efficiency, Low Maintenance Flux Removal Method for Solder Reflow Furnaces Paul Richter, BTU International

SMT Printing: The Wear of Stainless Steel Blades and its Effect on SMT Joint Quality, Part 1 Mark Curtin, Transition Automation, Inc. The Effect of Reflow Profile on the Soldering Performance of Tin-Bismuth Alloys Julia Del Re, AIM Solder Use of Flash Lamps to Achieve NonEquilibrium Soldering and Assembly Utilizing Conventional SAC Alloys Vahid Akhavan, Ph.D., NovaCentrix X-Ray Technology for Demanding Applications Keith Bryant, KB Consultancy Your Risk of Counterfeit Products - Sales and Supply Chains Rosemary Coates, Blue Silk Consulting

Learning from Low Temperature Soldering Product Level Certification and Proliferation Kok Kwan Tang, Intel Products (M) Sdn. Bhd.

TECHNICAL INNOVATIONS (TI) Anatomy of the On-Going Reliability Test (ORT) Process Dennis Lee, NVIDIA Corporation

How Quantum Computing Will Revolutionize Manufacturing Zohair Mehkri, Flex International

Automatic Reflow Profiling and Data Analytics Karl Pfluke, KIC

How The New IPC Digital Twin Standard Impacts Manufacturing Michael Ford, Aegis Industrial Software

Autonomous Driving Technology: Current State and Prevailing Challenges Dwight Howard, APTIV (Retired)

The 1%: What Can You Do With It? Andrew Scheuermann, Ph.D., Arch Systems

How Augmented and Virtual Reality Decentralizes Expertise Zohair Mehkri, Flex International

PCEA COLLABORATION PCA Signal Integrity Applications High-Speed & RF Circuits Require Understanding & Application EM Principles Michael Creeden, Insulectro Flex and Rigid Flex: Suggestions to Increase Flexibility Tara Dunn, Omni PCB Materials Science Improvements for Rigid Flex and Pure Flex PCB’s Geoffrey Leeds, Insulectro

Virtual Collaboration Within Today’s Printed Circuit Engineering Team Stephen Chavez, Collins Aerospace Z-Axis Interconnects - Transient Liquid Phase Sintering (TLPS) Materials Chris Hunrath, Insulectro

Microvias: Is Your Product Reliability at Risk? Gerry Partida, Summit Interconnect

LIVE PROFESSIONAL DEVELOPMENT COURSES (Pre-Registration Required)

Half day (3.5 hours) educational courses are led by internationally respected professionals with extensive experience in the subject area. Course instructors deliver focused, in-depth presentations on topics of current importance to the industry, based on their research and industry experience. Professional Development Courses are application oriented and structured to combine field experience with scientific research to solve everyday problems. Each course will be presented LIVE online at 10:30am - 2:00pm (US Central) PDC 1: Achieving High Reliability for Lead-Free Solder Joints - Materials Consideration Tuesday, September 29th Ning-Cheng, Lee, Ph.D., Indium Corporation PDC 2: Cost Conscious Test Strategies for Electronic Products (Including IOT & 5G) Thursday, October 1st Robert Hansen, Consultant PDC 3: Preventing Manufacturing Defects and Product Failures Monday, October 5th Jennie Hwang, Ph.D., H-Technologies Group PDC 4: PCB Designers Guide for Implementing Advanced Semiconductor Package Technologies- Flip-Chip, WLP, FOWLP, FOPLP, 2.5D and 3D Wednesday, October 7th Vern Solberg, Vern Solberg Consulting PDC 5: Design for Excellence III: The Digital Twin Friday, October 9th Dock Brown, CRE, ANSYS

PDC 6&7: Defect Analysis and Process Troubleshooting Part 1&2 Monday, October 12th (Part 1) Wednesday, October 14th (Part 2) Jim Hall & Phil Zarrow, ITM Consulting

PDC 8: Tips and Tricks for Cleaning Circuit Assemblies Friday, October 16th Michael Konrad, Aqueous Technologies PDC 9: Design and Assembly Process Challenges for Bottom Terminations Components (BTCs) such as QFN, DFN and MLF in TinLead & Lead Free World Tuesday, October 20th Ray Prasad, Ray Prasad Consulting PDC 10: Principles and Practice of Developing Soldering Profiles Thursday, October 22nd Ray Prasad, Ray Prasad Consulting

SPECIAL EVENTS Many events below are free, but may require pre-registration. All times listed in US Central.

Pre-Event Webinar Webinar: SMTA International ExplainedWednesday, September 16 | 12:30pm Answering Your Virtual Event Questions

Women’s Leadership Program Technical Presentations and Speed Chats

Wednesday, September 30 | 3:00pm

Connection Reception

Wednesday, September 30 | 5:00pm

Students and Young Professionals Mixology Class & Mixer

Tuesday, September 29 | 6:30pm

Jump Start Technical Program

Wednesday, September 30

Industry Veterans Gen X & Boomer Happy Hour

Tuesday, September 29 | 6:00pm

Chapter Officers Virtual Road Trip: Chapter Officer’s Meeting

Tuesday, September 29 | 12:30pm

Committee Meetings Membership and Ambassador

Friday, October 2 | 4:00pm

Exhibitor

Monday, October 5 | 11:00am

Marketing and Communications

Tuesday, October 6 | 2:00pm

Chapter Leadership

Wednesday, October 7 | 10:00am

Past Presidents

Tuesday, October 13 | 4:00pm

Training

Wednesday, October 14 | 2:00pm

Technical Advisory

Wednesday, October 21 | 2:00pm

ELECTRONICS EXPOSITION Now you can “walk” the show floor without your feet getting tired. See equipment and materials for printing, placement, soldering, cleaning, test and inspection as well as services to improve your manufacturing processes. Attendees will have the option for live text or video chat with exhibitors on September 28-30.

CURRENT EXHIBITORS (Exhibitor List as of September 4)

Aegis Software Akrometrix American Standard Circuits, Inc. A-Tek Systems Aven Inc. Cimetrix CIRCUITS ASSEMBLY Circuitnet Cluso North America Creative Electron, Inc. Datest ELANTAS PDG EMS NOW/Scoop Europlacer FlexLink Systems Fuji America Corporation Global SMT & Packaging I-Connect007 Inovaxe Corporation Insituware LLC IPC ITW EAE JBC Tools USA Inc. Koh Young Technology Kulicke & Soffa KYZEN Corporation MacDermid Alpha Electronics Solutions

Magnalytix MicroCare Corporation Mid America Tape & Reel MIRTEC Corporation Nix of America NSW Automation Omron Electronics Plasmatreat USA, Inc. Rehm Thermal Systems SCHUNK Electronic Solutions Seica Inc. Seika Machinery, Inc. SelecTech/StaticStop Smart Splice LLC Specialty Coating Systems Speedprint Technology Stencil.com/Photo Etch Technology STI Electronics, Inc. The Test Connection, Inc. Tintronics Tokyo Sango, Inc. US Tech Viscom, Inc. Vitrox WNIE ZESTRON Corporation Zymet

Interested in Exhibiting? Exhibitors at SMTA International understand that their potential clients respect knowledge and technical information. By exhibiting at SMTA International you align your company with the SMTA’s high standard of technical excellence. For more information visit smta.org/smtai or contact expos@smta.org. REGISTER TODAY AT WWW.SMTA.ORG/SMTAI

WOMEN’S LEADERSHIP PROGRAM Wednesday, September 30 3:00pm-5:00pm (US Central) Free for everyone and all are welcome! We extend an invitation to everyone to attend the Women’s Leadership Program to promote women in engineering fields. Show your support for diversity and inclusion by attending this live online session. Welcome Message Julie Silk, Keysight Technologies A Cruise Through Automotive Safety Systems Lenora Clark, MacDermid Alpha Automotive Team Quality Requirements Across Industries - More the Same Than Different Nancy Lange, Plexus Corp. It’s Been a Long Day, Come in for a “Fuel Stop” Speed Chats with topics on: • Unconscious Bias: Real Actions to Overcome • Keeping Your Balance While Working Effectively From Home • Relentlessly Reinvent Yourself

CONNECTION RECEPTION Wednesday, September 30 5:00pm-6:00pm (US Central) Free for everyone and all are welcome! The Womenâ&#x20AC;&#x2122;s Leadership Program will continue their annual gathering, hosting the Connection Reception on the evening of Wednesday, September 30th! RSVP Online at www.smta.org/smtai *RSVP by Monday, September 14th to receive your Road Trip Care Package! Included in this package are essential road trip items donated by companies dedicated to make sure you have great trip with SMTA!* (US Shipping Addresses Only)

YOUNG PROFESSIONALS PROGRAM Mixology Class & Mixer (Age 40 and Under) Tuesday, September 29th 6:30pm-8:00pm (US Central) | ZOOM FREE to attend! This mixology class is designed to educate and inspire with the history of alcohol, the origin of drinks, as well as demonstrate the proper techniques of crafting sophisticated cocktails. Join this interactive and hands-on class to learn to make 3 cocktails in a lively environment. Throughout the evening mingle with your SMTA peers in between cocktail instruction. Details of ingredients will be sent out prior to the class. Registration is limited to 100 seats. Jump Start Program Wednesday, September 30 On Demand | SMTA Virtual Booth FREE to attend! Our Jump Start Sessions will be pre-recorded and available On-Demand inside the SMTA virtual booth on the show floor. A great opportunity for young professionals and engineers new to the industry. Presentations Include: An Overview of Electronics Fabrication & Assembly Gary Tanel, Chairman of Electronics Alliance Stencil Printing 101: Chrys Shea, President of Shea Engineering Services Learning for Earning: Tom Borkes, Founder of The Jefferson Project And More!

GEN X & BOOMER HAPPY HOUR Tuesday, September 29 6:00pm-7:30pm (US Central) | ZOOM All are welcome! While we practice social distancing, we can still get together and enjoy drinks and conversation at SMTA International. We extend an invitation to industry veterans to join us on Tuesday, September 29th. Hope to see you there! 16

REGISTRATION IS EASY Visit www.smta.org/smtai to register today!

Expo Only Attendee

Full Conference Attendee

Free for all Individuals only attending the Expo

SMTA Members: $295 USD Non-Members: $395 USD

Includes: • Pre-Event Webinar: SMTAI Explained • Live Electronics Expo • On-Demand Electronics Expo • Students and Young Professionals Program • Women's Leadership Program

Includes: • Pre-Event Webinar: SMTAI Explained • Conference Proceedings • Live Electronics Expo • On-Demand Technical Presentations • On-Demand Electronics Expo • Students and Young Professionals Program • Women's Leadership Program

Speakers & Instructors Free for those only submitting required materials and not planning to stream other presentations (Will not receive proceedings access).

PDC REGISTRATION View each course online at www.smta.org/smtai

Speakers & Instructors Registration for those that will submit all required materials, access to view conference presentations, and a downloadable link to the proceedings (technical papers & presentations). SMTA Members: $150 USD Non-Members: $200 USD

SMTA Members: $125 USD Non-Members: $225 USD *For additional information about SMTA membership, please visit www.smta.org or contact the Member Services Manager Team at membership@smta.org or call +1 952-920-7682. **For additional exhibitor and virtual visibility registration information, please refer to the Exhibits and Sponsors Page at www.smta.org/smtai.

Media and Association Sponsors