Electronic Products - February 2013 by Amandio Cardoso

Electronic FEBRUARY 2013

PRODUCTS No-nonsense tools for the busy EE

Also In This Issue... • MEMS sensors • Low-cost enclosures • Energy-saving Forum

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CONTENTS Vol. 55, No. 9

Packaging

COVER STORY

Wireless technologies for the smart car

Product of the year Story Behind the Story: Digital power without the digital bus

OUTLOOK (Technology News) ◾ The next-gen ultracapacitor ◾ Photons made indistinguishable by quantum frequency conversion ◾ QED may not be QED

Product Trends: Applications in Industrial/Automation Electronics

Product Update: Relays & switches

Three easy industrial network applications Developing Bluetooth low energy ‘appcessories’

Industry Exclusive

The FIRST program for young people

Sensors & Transducers

Measuring gas flow with MEMS sensors

Packaging, Cabinets & Enclosures

NEW PRODUCTS

Getting the enclosure you need faster, for less money

Energy-Saving Forum

The next level in low-power microcontroller design Current analysis tools help optimize low-power system design

Cover Photograph Digital imagery by Don Wilber.

viewpoint: Sensing danger

Camera Serial Interface (CSI-2) sensors in embedded designs

ENERGy-SAvING INITATIvE SERIES

Our annual look at issues facing engineers designing wireless/networking products

FEATURES

14 18 24

PRODUCT UPDATE Relays & switches

DEPARTMENTS

WIRELESS/NETWORKING SPECIAL

36 38 40 43

OUTLOOK The next-gen ultracapacitor

Getting the enclosure you need faster, for less money

FEBRUARY 2013

48 49 50 53 56 57

Components & Subassemblies Integrated Circuits Test & Measurement Power Sources Optoelectronics Packaging & Interconnections

what’s ONLINE... electronicproducts.com Java technology for embedded systems IS2T

Researchers create robot that throws up to help prevent winter vomiting disease

From the Education Center: How NXP and Cherry’s battery-less, wireless switch works

Mathematical breakthrough could lead to actual teleportation

Secure mobile app replaces your house key

Low cost brings 3D printing home

Affordable luggage tracker keeps bags from being lost

New mobile app reads emails aloud

Want to see what the Editors are thinking? www.electronicproducts.com/ElectronicProductsBlogs.aspx Electronic Products Magazine (USPS 539490) (ISSN 0013-4953)—Published monthly by Hearst Business Communications Inc./UTP Division, 50 Charles Lindbergh Blvd., Suite 100, Uniondale, NY 11553. Periodicals postage paid Garden City, NY and additional mailing offices. Electronic Products is distributed at no charge to qualified persons actively engaged in the authorization, recommendation or specification of electronic components, instruments, materials, systems and subsystems. The publisher reserves the right to reject any subscription on the basis of information submitted in order to comply with audit regulations. Paid subscriptions available: U.S. subscriber rate $65 per year, 2 years $110. Single issue, $6.00. Information contained herein is subject to change without notice. No responsibility is assumed by the publisher for its accuracy or completeness. Postmaster: Send address changes to Electronic Products, PO Box 3012, Northbrook, Il 60065-3012. Phone 847-559-7317 ©2013 by Hearst Business Communications Inc./UTP Division. ALL RIGHTS RESERVED Publications Mail Agreement Number 40012807. Return Undeliverable Canadian Addresses to: Station A PO Box 12, Windsor, ON N9A 6J5

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VIEWPOINT

Sensing danger

How to make schools safe havens for learning, where adults and children know there is no threat of sudden, life-altering violence.

ne of the saddest statements about the Newtown tragedy is that it was not the first time such a thing had happened. According to the Web site stoptheshooting.org -- created by Alex Algard in 2009 to commemorate the victims of the Columbine shooting -- there have been 386 school shootings since 1992 and, in most cases, both the shooters and the victims have been under 19 years of age. While it may be possible to ban future access to certain types of weapons and ammunition clips, there are already a huge number of multiround, rapid-fire weapons in homes across the nation. Indeed, in the immediate aftermath of the Connecticut slaughter, with the prospect of new government regulation in the offing, single-day sales of such guns hit a new peak. It’s likely that these legally owned armaments will be around for some time to come. It is fitting for U.S. citizens to have a long and serious public dialogue about gun control, mental health services, violence and the media, and parental responsibilities and liabilities. But we cannot wait for the outcome of such discussions to protect the well-being of school children and teachers. We need to make sure that schools are safe havens for learning, where both adults and children know there is no threat of sudden, life-altering violence. From what I’ve seen, I believe that advances in magnetometer and other sensing technology make it possible today to set up unobtrusive ways to detect and pinpoint the presence of weaponry near and within the grounds of our schools. Take, for example, a device like the MC3316xMT magnetometer from MEMSIC, a 2012 Product of the Year recognized by Electronic Products for its small size, high ac-

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curacy, high sensing range, and low cost. By deploying a wireless network of such devices around schools, the sudden arrival of metallic objects of a certain size, ones that might pose a threat, could be detected. Sensor-location information could then be used to quickly train security cameras on the source, to determine whether there was any reason for further action. Creating such an early-warning system would give people a chance to prepare for any real threat -- to go into lockdown and alert proper authorities -- before any harm comes to anyone. Perhaps this ad hoc design isn’t ideal for a school security system, but as engineers, we do have the ability to create practical systems to protect such institutions. It’s something we owe our country and our kids. Richard Comerford

EdItoR’S NotE

Electronic Products Introduces QR Codes New for 2013, we’ve added QR Codes to all of our product sections with a “Buy Now” option available. Use your QR Code Reader smartphone app to scan the product and go instantly to our huge online inventory of electronic and engineering products at EEM.com, where you can buy or browse products instantly! John Filippelli

FEBRUARY 2013

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Electronic products

PRODUCT OF THE YEAR

The STory Behind The STory

EDITORIAL STAFF 516-227-1300 FAX: 516-227-1901 Bryan DeLuca Content Operations Director 516-227-1379 • bdeluca@hearst.com John Filippelli Managing Editor 516-227-1381 • jfilippelli@hearst.com Paul O’Shea Senior Editor 941-359-8684 • poshea@hearst.com Christina Nickolas Editor 516-227-1459 • cnickolas@hearst.com Jim Harrison Technical Editor 415-456-1404 • jpharrison@hearst.com Richard Comerford Editor 516-227-1433 • rcomerford@hearst.com Michael Kawa Steve Evanczuk

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Digital power without the digital bus

ver the past several years, low them to achieve their end goal. CUI has run into many inEase of use was a key driver of the stances with customers who NSM2P design, and the PV3012’s cyneeded/wanted the value proposicle-by-cycle auto-compensation was tion of digital power, but didn’t have key to the design choice. The ability to the necessary resources to impleprovide a customer with a plug-andment such a shift and/or they didn’t work module without any effort needwant to deal with the communicaed for compensation was critical. tion bus associated with digital powThe second focus for ease of use er. Typically, these customers were was access to the power management most concerned with one or two critand fault response features. The CUI ical power rails and they were OK module incorporates a simple threewith the existing performance of pin I2C header that allows the custheir traditional analog solutions. tomer to use a CUI USB-to-I2C donCUI had been providing digital power design on a custom basis for some time and was continually asked about the standardization of this concept. Early in 2012 the company decided to define and design a product that could help customers wanting to make the leap into digital but that had limited resources needed to commit to the digital design effort. The Novum team: (left to right) top row — Doug Lefferts, The result was the Roy Stai; 2nd row — John Sellers, Ryan Gibson; 3rd row — NSM2P, the industry’s Don Li, Ron Stull; Bottom row — Bruce Rose, Jeff Smoot, Mark Adams first self-compensating point-of-load dc/dc module family gle and the CUI Power GUI to make that needs no digital bus communithe necessary adaptations in timing cation. This product allows CUI’s and ramp rates, as well as fault recustomers the access to the highestsponse management. performance, highest-density digital During development, the NSM2P power module on the market withallows the customer to access and out the necessities of full digital imdynamically change the necessary plementation across their design. requirements from their design via In order to achieve a no-bus modthe I2C header, but when the module ule concept, CUI had to make the is shipped to the customer for promost critical decision of choosing a duction the I2C header is removed controller that would allow the flexand is shipped preprogrammed. ibility of design and the features/ With that in mind, one of the key technology that would allow for a features in the module is the ability self-contained optimum perforto store up to eight individual conmance module. Having worked with figurations. Thus CUI can ship a several controller companies, CUI single part number to the customer engineers decided that the technolthat in essence is eight unique conogy and benefits in the PV3012 configurations. troller from Powervation would alPaul O’Shea

Robert D. Wilbanks Group Controller

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FEBRUARY 2013

ANALOG INTEGRATION ISN’T FOR EVERYONE

© 2013 Maxim Integrated Products, Inc. All rights reserved. Maxim Integrated and the Maxim Integrated logo are trademarks of Maxim Integrated Products, Inc., in the United States and other jurisdictions throughout the world.

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OUTLOOK

News about Products...

Product Technology...

Product Applications

The next-gen ultracapacitor

Energy when and where you need it

lectrical double-layer capacitors or ultracapacitors flow through that external circuit from the negative to the positive electrode, powering an electricity-consumcan provide high power by delivering energy quicking device along the way. Over time, both plates will ly and recharge in seconds compared to hours for lose their charge, and the positive and negative ions will other technologies. They can withstand cold temperatures, shocks, and vibrations; and they can be charged break away and mix back into the electrolyte. and discharged hundreds of thousands of times before The MIT team performed detailed simulation studies they wear out. They also contain earth-abundant and that showed that the nanotube-enhanced ultracapacitor nontoxic materials, so they are much easier on the envishould be able to store more ions than conventional acronment than today's batteries are. However, ultracapactivated-carbon ones can, thereby achieving higher enitors have a serious drawback â&#x20AC;&#x201D; they have low energyergy storage. After testing many materials the researchstorage capacity. At an equivalent size, an ultracapacitor ers found a combination that worked â&#x20AC;&#x201D; a layer of can store only about 5% as much energy as a lithium-ion tungsten, then a thin layer of aluminum as the conducbattery. tor, and finally a top layer of It is this need for improved iron oxide, the catalyst for the energy storage in ultracaps that process. has pushed innovators such as The MIT research team MIT researchers to come up founded a startup company, with a design that not only deFastCAP Systems, to commerlivers energy quickly and can cialize the nanotube-enhanced be recharged in seconds, but capacitor along with systems to also has a long lifespan. The reenable its practical implementasearchers, who had funding tion. FastCAP, unveiled a carfrom the Ford-MIT Alliance, bon nanotube coated chip for looked at the design of a nano- A carbon-nanotube-coated chip for ultracapacitor design ultracapacitors, creating a novel tube-enhanced ultracapacitor version that can store twice as that has an electrode plate at the top and bottom with much energy and deliver seven to 15 times as much powcarbon nanotubes attached vertically. A liquid electroer as a conventional device can. Equipped with carbonlyte fills the space between the plates, and a porous sepananotube-coated electrodes, the new ultracapacitor uses rator down the middle keeps the plates from electrically low-cost, domestically abundant materials and a manushorting. facturing process similar to those by the solar industry. A voltage across the two plates induces an excess of New technologies enabled by the new ultracapacitor innegative charge (electrons) on the top plate and an exclude a new hybrid electric vehicle that combines fuel efcess of positive charge (the absence of electrons) on the ficiency with high performance and dramatically lower bottom one. As a result, the nanotubes are coated by cost. Further information can be found at www.fastcapsys tems.com. ions of the opposite charge. When the two plates are Paul Oâ&#x20AC;&#x2122;Shea connected by an external loop of wire, electrons will

Photons made indistinguishable by quantum frequency conversion

esearchers at NIST Center for Nanoscale Science and Technology were able to make photons emitted by quantum dots at different frequencies identical to each other by shifting their frequencies to match. This promises the beginning of making solidstate, single photon sources, including quantum dots,

more useful light sources for photonic quantum information science. The reason why quantum dot sources are so important is because of their high brightness, stability, and amenability to scalable fabrication technology. However due to frequency variations arising from nonuniform de-

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FEBRUARY 2013

OUTLOOK match the difference between the two input photon vice fabrication it has limited their usefulness. In the past researcher have focused on tuning the streams, causing the new photons to be at exactly the sources themselves, by inducing strain or by varying the same frequency. The team used an interference measureelectrical and optical fields ment to confirm that the fresurrounding the structures. quency-converted photons With the new approach the have become identical. Beteam was able to manipulate cause this method uses relathe photons after they are tively large nonlinear crysgenerated, rather than altertals for frequency conversion, ing the sources. future work will focus on For their test, the researchimplementing the converers used photons emitted sion method in smaller and from a semiconductor quanmore scalable device architum dot at two different fretectures. This research is requantum frequency conversion method uses two pump lasers ported in the October 5, quencies which are deter- The whose frequency difference is matched to the difference between mined by two of the dot’s the two input photon streams, causing the new photons from a 2012 issue of Physical Review different energy states. They nonlinear crystal to be emitted at exactly the same frequency Letters [“Two-photon interwere able to show that the (Courtesy of NIST). ference using backgroundphotons can be converted to the same frequency, or colfree quantum frequency conversion of single photons emitted by an InAs quantum dot,” S. Ates, I. Agha, A. or, using quantum frequency conversion, a process in which each a single photon stream is combined with Gulinatti, I. Rech, M. T. Rakher, A. Badolato, and K. light from a much stronger pump laser in a nonlinear Srinivasan, Physical Review Letters 109, 147405 (2012)] crystal which outputs photons at a frequency that is the and also reported in the November issue of Physics Tosum of the two inputs. day. For additional information, contact Kartik SrinivaAs shown in the image above, two pump lasers are san at 301-975-5938. used, with the frequency difference between them set to Christina Nickolas

QED may not be QED

ecent experiments done by a team of physicists at the Electron Beam Ion Trap (EBIT) facility at the National Institute of Standards and Technology (see photo) indicate that the theory of quantum electrodynamics (QED) — seen as a cornerstone of modern physics, explaining the behavior of electrons orbiting atomic nuclei — may require reformulation. Ironically, the term “QED” (from the Latin quod erat demonstrandum, “which was to be demonstrated”) is typically used to signal that a mathematical proof is complete; in this case, it seems further proof is required. The NIST Electron Beam Ion Trap seen here was used to experiment with highly charged titanium ions. The results indicated that the ions behaved in ways inconsistent with quantum electrodynamics (QED) theory.

The experiments were conducted at NIST using wavelength dispersive spectroscopy from the University of Melbourne to obtain precision diffraction profiles of highly charged atoms. The tests indicate that QED theory as currently formulated may not provide a complete picture of reality. According to a paper published in Physical Review Letters, the team from NIST (Gaithersburg, MD), Australian Synchrotron and The University of Melbourne, (Australia), and the University of

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Debrecen (Hungary) measured the strongest resonant transition in helium-like titanium (Ti20+). NIST physicist John Gillaspy, a member of the research team, explains: “If 20 of titanium’s 22 electrons are removed, it becomes a highly charged ion that looks in many ways like a helium atom that has been shrunk to a tenth its original size. Ironically, in this unusual state, the effects of QED are magnified, so we can explore them in more detail.” QED predicts that when an electron orbiting the nucleus collides with a passing particle, the electron gains energy and moves to a higher energy state, then decays back to its original state, emitting a photon of a characteristic frequency (color). The NIST team found that when electrons in Ti20+ are excited in this fashion, the ion gives off photons that are noticeably different in color than QED predicts. Gillaspy hopes the team’s finding will stimulate others to measure the emitted photons with even greater accuracy. Currently, the NIST team is preparing to release the results of measurements of other colors of light emitted from the exotic atoms that bolster the initial findings. For further information, contact John Gillaspy at 301-975-3236, or e-mail john.gillaspy@nist.gov. Richard Comerford

FEBRUARY 2013

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Industry

Exclusive

More about the FIRST programs for young people BY JIM HARRISON

Paul says the satisfaction that comes from working with a student on practical applications is definitely worth s you, hopefully, have seen from our article in Dethe effort. “When you see the kid light up about a realcember, Electronic Products Magazine is enamored world application they can solve, it’s extremely gratifying” with the group called FIRST. Our nation is facing a he said. He said the teams routinely change from having dearth of engineers, scientists, inventors, and technolo20% of them interested in going to college to 80%. gists. High school students are just not very interested in He suggests that if you want to join — pick an existing science and engineering. I guess it team with others that have some experience — it’s just a has become old hat. lot easier that way. His team meets for two hours a night, Recognizing this two nights a week. But when the project gets going, and dilemma over 20 the students want to win their contest vs other local years ago was teams, they spend a lot of other nights and weekends. Mr. Dean KaAnd then, if they go to the finals in St. Louis, there’s use men, and in his of vacation time and other commitments. The team at passion and determination to help young people discover Hilltop has twenty student members and four mentors, the excitement and rewards of science and technology he two of which are teachers. started FIRST (For Inspiration and Recognition of Science and Technology). His vision is “To transform our culture by creating a world where science and technology are celebrated and where young people dream of becoming science and technology leaders.” FIRST programs in grade, junior, and high schools involve students in after-school projects in robotics. The key to this successful organization is their volunteer mentors — engineers and scientists that give their time to advise the school teams. I decided to find a real-live mentor to interview and managed to track down Paul Koniarski, an electronics engiPaul and the Hilltop High team. Paul is seen here at the center, fourth from the right. neer at Qualcomm and Paul noted that there were times when it was midnight mentor at Hilltop High School in Chula Vista, CA. and the kids were right there, completely involved, and Paul’s been involved with FIRST since 2007, when he you just can’t walk away. So be forewarned. mentored the grade school version (FIRST Lego League) at To check it out, go to this website, which will give you his son’s 5th and 6th grade classes. He then followed his the e-mail address of your local contact: www.usfirst.org/ son into the middle school and then high school verregional-contacts. ■ sions. His son is now a junior and still on a FIRST team.

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FEBRUARY 2013

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The Best Place to Find Help in Creating Low-Power, Energy-Efficient Designs

ince it is cheaper and better for the operating modes, so the engineer must look through the environment to save energy in electronic datasheet for the mode most appropriate to a given application. Also, internal voltage references are often provided circuitry than to generate more of it in with microcontrollers. These references are used in ADCs as power plants, it would seem prudent that energy efficiency be considered in any embedded design activity. To reduce well as comparators and other analog circuits. Often, the power consumption without sacrificing performance current consumed by the voltage reference is not included requires choosing a combination of the right chips, software in the current specifications for the peripheral in use. Similarly, digital interface peripherals — such as UART, I2C, and and development tools. SPI — consume battery energy, too. Power consumption in a given device is highly dependent on many factors, including the semiconductor process In general, the power consumption of an MCU is dethat is used to make the device, operating temperature (there fined by power consumed in its different operating modes, is much higher leakage currents at higher temperatures), typically active and standby (variously called sleep, hiberoperating frequency, level of activity, and operating voltage. nate, etc.) for the CPU and on-chip peripherals, and taking into account the power consumed For many of these factors, power consumption can be reduced through into transition from one mode to telligent design if the engineer has another*. Written as an equation, the proper information on the perforTotal power consumed = Active mance of the device and the requiremode power + Standby (sleep) ments of a particular application. mode power + Wake-up power. The power budget used to select Once these numbers have been MCUs, for instance, is usually set by derived, a system designer can then the system-level parameters and befactor in the application’s duty Power consumption stages of a typical MCU. (Illustration gins with a thorough definition of courtesy of Silicon Laboratories) cycles — the amount of time the the parts’ intended mission, the acapplication expects to spend in tivities it will perform, and the desired service lifetime. But standby, active, and wake-up modes — to calculate an overchoosing a low-power MCU can be a time-consuming and all average power consumption number. difficult task. Even engineers with years of experience may Another important tool in determining power consumphave difficulty establishing a power budget if they rely tion can be found in an MCU’s development kit, which can solely on information from a single supplier’s website since reliably measure a prototype’s current consumption, and may a vendor will only provide data on its own brand parts. So to provide supporting software tools that can clearly show the do a proper comparison requires visiting a number of differcorrelation between the current being consumed and the ent sites, which can consume plenty of time. A better idea is code that’s running. The performance of the code you are to use a single site such as Mouser’s new Low Power applicaplanning to run cannot be overlooked; poorly written code itself may turn the unit into a power-hungry application, offtion training site, where you can gather the necessary parameters on a wide range of MCUs in one place. setting the advantages offered by a power-stingy device. Whether or not you collect data from one or multiple With designing for low power at the forefront of many sites, there are a few things you should note. Many dataengineers’ minds, Mouser’s Low Power application training sheets provide power consumption numbers for the microsite enables engineers to take a system-wide approach to controller without peripherals running. The additional power budget development and implementation. They can current drawn by the peripherals can be significant. also use it to quickly review new products and technologies, Consider current consumed by an analog-to-digital conget details on a specific application, or access a complete verter (ADC), which can vary across sampling speeds and library of low-power design resources. ■ BY MURRAY SLOVICK

* Optimizing Low Power Embedded Systems. Sachin Gupta and Madhan Kumar, Cypress Semiconductor

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Low Power Technology

Engineering

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Saving a (Battery) Life By Mouser Electronics, www.mouser.com, (800) 346-6873

ameras integrated into mobile phones used to be a selling point. Now, they’re just a standard feature in even the most basic model. The same can be said for many of the features now standard on most smartphones. At the same time that the demand for performance continues to rise, the expectation for power usage is that it continues to shrink. The need for increased battery life and lower energy consumption is leading designers to search for the latest power-saving solutions. To gain a clearer view of the new technological advancements shaping the energy-efficient future, we looked to Mouser Electronics, a leading global semiconductor and electronic components distributor that works with design engineers and buyers. Known for its rapid introduction of the latest products and advanced technologies for prototype development, the company is keenly positioned as a foremost design-fulfillment distributor inspiring a new generation of energy-friendly solutions.

Delivering more with less

One way that Mouser is helping design engineers tap into better energy efficiency is with their Low Power application training site. Engineers looking to stay within ever-lower power budgets can quickly review new products and technologies, get details on a specific application, or access a library of cuttingedge, low power design resources. “Much of today’s advanced design solutions require more than a list of part numbers in stock. The web experience also needs to be an informative one. Not

only does it need to contain the latest in low-power advancements, trends, and supporting product information, the site needs to let engineers access information in as few clicks as possible. The one component engineers have in short supply is time,” shares Kevin Hess, Mouser Vice President of Technical Marketing.

New low-power advancements

Recent game-changing developments seen at Mouser are the new low current 32-bit embedded microcontrollers (MCUs) that are steadily replacing former 8-bit applications. The end-result is a richer-featured product with greater efficiency at familiar price points. A key player for innovative solutions has been NXP Semiconductors, a company whose scalable MCU series is well positioned in the world of green solutions. NXP’s long-term strategic relationship with ARM allows early access to nextgeneration IP. This has led to the phenomenal flexibility of the LPC800, which includes a switch matrix that enables engineers to assign lean on-chip peripherals to any pin with a single line of code or click-in configuration. Additionally, this solution provides thoughtful features such as decoupling the SPI and processor clocks so the SPI can obtain data at speeds independent of the CPU clock. NXP has further challenged the status quo in power management with an I2C bus that allows the LPC800 to wait at near-zero power consumption without a system clock, and wake up upon a simple address match. NXP’s innovative line of MCUs finds energy savings in creative ways. To learn more about Low Power Technology, visit www.mouser.com/low_power. ■

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FEBRUARY 2013

Sensors & Transducers

Measuring gas flow with MEMS sensors Having proven their worth for accelerometer applications, MEMS sensors are also tackling gas-flow measurement Broad application

limited number of suppliers. A huge application is in accurately measuring natural gas in the residential market. Recently a number of companies ike piezoresistive, piezoelectric, have entered the market with MEMS and capacitive sensing techmass gas-flow thermal sensors that niques devices, sensors based are less costly and feature decent to on thermal microelectromechanical good levels of performance. Howevsystems (MEMS) have enabled moer, the principles emtion sensing in accelerployed to realize these ometers. These thermal sensors differ widely, sensors are less expenand affect one or more sive, more reliable, more important performance accurate, and smaller parameters such as size, than competitive apcost, dynamic range, proaches. Even though flow rates, and suscepticapacitive acceleromebility to vibration. ters can be manufacNot all thermal flow tured on a MEMS prometers are alike. Some cess, they suffer from thermal flow meters may much lower shock surachieve accuracy levels vivability and reliability of 1%. However others than thermal MEMS have accuracies in the 3 types, as do piezoresisto 5% range. A comparitive accelerometers. son of MEMS thermal Moreover, capacitive flow-meter technologies MEMS accelerometers with other technologies feature higher offset temillustrates that MEMS perature coefficients, thermal gas-flow techhigher offset drifts, highnology is superior in six er levels of hysteresis, are key areas: accuracy, dyrelatively more costly, namic measurement and are generally larger range, size, cost, power in package size. dissipation, and ruggedThus thermal MEMS ness (see Table). sensors have clearly There are several difproven their worth for ferent thermal flow-meaccelerometer applica- Fig. 1: The MFA1100R thermal gas-flow sensor module integrates the sensing element with on-chip signal-processing and software on a monolithic CMOS ter technologies. Some tions. However, the prin- process. measure the speed of the ciple of thermal sensing (HVAC) systems and fume hoods. gas flow as heat that is added to the can also be used for gas-flow meaAnalytical instruments, fuel cells flow stream disperses and are also surements. The MEMSIC MFA1100R and turbines also rely on accurate known as thermal dispersion flow gas-flow sensor' (Fig. 1) uses the same and rapid gas-flow measurements. meters. Others measure the temperathermal principle of operation as Such capabilities have been commerture difference between a heated MEMSIC's thermal accelerometer, cially available in the last few years, sensor and the ambient flow stream. providing much the same proven but until now have been relatively Thermal mass flow meters have benefits over other types of gas-flow costly, bulky, and available from a several major advantages. They're senosrs. BY YONGYAO CAI Director of Engineering MEMSIC www.memsic.com

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The need for gas-flow measurement is wide-spread. In the medical market, gas-flow measurements are critical in anesthesia delivery, chromatography, sleep apnea, spirometers, and ventilators. In the industrial sector, gas-flow measurement is needed for heating, ventilating and cooling

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relatively inexpensive and can measure the flow of some low-pressure gases that are not dense enough for Coriolis meters to measure. Both of these advantages give thermal flow meters their own unique niche in gas-flow measurement. They also allow for the monitoring of a one or more of the thermal characteristics (temperature, thermal conductivity, and /or specific heat) of a gaseous media to define the mass flow rate. But they have limitations, namely most of the gases they can measure accurately must be fairly clean and non-corrosive.

Underlying technologies

Let's examine several of the major types of gas-flow meter technologies currently being employed. The most common is the diaphragm/bellows type of meter used in residential locations and is over 100 years old. It measures the volume of the gas used. However, it is highly affected by temperature, pressure and humidity levels and heating-value compensation is required to measure the actual amount and value of the gas moving through the meter. A Coriolis gas-flow meter consists of one or more pipes with longitudinally or axially displaced section(s) that are excited to vibrate at resonant frequency. When the gas within the displaced section is at rest, both the upstream and downstream portion of the displaced section will vibrate in phase with each other. The frequency of this vibration is determined by the overall density of the

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pipe (including its contents). This allows the meter to measure the flowing density of the gas in real time. Once the gas begins to flow, however, the Coriolis effect comes into play. This effect implies a relationship between the phase difference in the vibration of the upstream and downstream sections and the mass flow rate of the fluid contained by the pipe. Coriolis meters have a high initial cost. Furthermore, they become expensive and unwieldy in line sizes above 4 inches although more recently line sizes have increased up to 12 to 14 inches. A thermistor, also known as a hotwire anemometer, is basically a resistor thermometer or a temperaturesensitive resistor. Thermistors are fragile devices and are susceptible to breakage and dirt. This makes them unsuitable for gas-flow temperature measurements. Ultrasonic flow meters sense gas flow by operating on two basic principles: transit time or time-of-flight and Doppler shift. The former type is the most common. In the time-of-flight configuration, a pair of transmitters/detectors is placed at a distance apart inside the gas flow channel, close to the channel wall in most cases. The time difference between the signal transmitted from up- to down-stream and the one from down- to up-stream is proportional to the gas flow rate. With the Doppler shift principle, an ultrasonic signal is transmitted across the flow channel and is deflected by the particles inside the flow stream. The measured Doppler

Measuring gas flow with MEMS sensors

frequency shift is proportional to the flow speed of the particles that are traveling at the same speed along with the flow stream. Multipath ultrasonic sensing is often used for natural gas flow measurement where multiple pairs of ultrasonic transducers are used in the same gas pipeline. Data obtained from these transducers is averaged to enhance measurement accuracy. Ultrasonic gas flow sensing is comparatively costly. It also requires use of temperature and pressure sensors to compensate for environmental temperature and pressure changes.

Into the vortex

A vortex-shedding flow meter makes use of a physical principle involving the formation of vortex swirls (vortices) downstream of an obstruction placed in a flowing stream. This is a bluff body that's called a shedder bar. Vortex flow meters are extremely versatile for measuring gases, liquids and steam. They're also reliable since they have no moving parts and fea-

ture relatively high accuracy. However, the presence of a bluff body in the stream of the gas or liquid flow may cause some drop in pressure of the medium being measured. Gas flow measurements can also be made using the turbine flow meter, also known as an axial turbine meter. It translates the mechanical action of the turbine rotating in the gas flow around an axis into a userreadable rate of flow. The turbine tends to have all the flow traveling around it. The advantage of this type of measurement is higher flow rates and less pressure loss than other approaches. Their disadvantage is that they are less accurate at low flow rates. Another common gas-flow measurement meter is a rotameter, part of a class called variable area meters. It measures the flow rate of liquid or gas in a closed tube. Flow rate is measured by allowing the cross-sectional area the fluid travels through to vary, causing some measurable effect. Several types of flow meters that

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rely on Bernoulli's principle, either by measuring the differential pressure within a constriction, or by measuring static and stagnation pressures to derive the dynamic pressure. These include the Venturi meter, the orifice plate the Dall tube, the Pitot tube and a multi-hole pressure probe.

Digital trends

In summary, the trend in gas-flow measurement technology is being helped by monolithic IC developments, particularly thermal-flow MEMS, enabling smaller, faster and cheaper flow sensors. This in turn is making sensor gas flow meters more modular and easier to interface with computers and transmission facilities, thus keeping up with a more efficient and modern digital world. Thermal MEMS gas-flow technology is proving its mettle in meeting residential, commercial, and industrial measurement needs. They're making their application more affordable, more flexible, and easier to use. â&#x2013;

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Working in close collaboration with NXP, element14 offers the LPC4357-EVB multimedia evaluation kit with ARM Cortex processors. The kit is a high-performance solution for developing DSP and MCU applications within a single architecture and development environment — and it costs only $98. The kit’s LPC4357 MCU is based on an ARM Cortex-M4 with an ARM Cortex-M0 coprocessor. The Cortex-M4 microcontroller provides highperformance DSP features such as single-cycle MAC, single instruction multiple data (SIMD), saturating arithmetic, and a floating-point unit. The Cortex-M0 coprocessor offloads many of the data movement and I/O-handling duties. element14 www.element14.com

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o find the latest information about industrial automation, we searched out opinions of some industry leaders. I posed three questions: 1. Are there any new trends in electronics for industrial automation that stand out to you right now? Dr. Stephan Zizala, head of industrial and multimarket microcontrollers at Infineon Technologies, tells us that “There is a large push around design for energy efficiency. This includes applications such as inverters in renewable systems, and an overall push to improve the efficiency of motor-drives. A second high profile area is networked control of systems. Third, the requirements for product reliability, such as extended temperature range operation, and long product lifetime before obsolescence, continue to grow. Finally, we see that the performance/ price evolution of devices based on widely used 32-bit cores is broadening the total addressable market for this class of microcontroller.” Ross Fosler, applications engineer with Cypress Semiconductor, says “When it comes to industrial automation, an important area of focus is power control… and standby efficiency is critical and the ability to report energy usage is critical.” 2. What is the emphasis for the design engineer in this area right now, from what you can see? Mike Ulch, supplier account manager at Newark / element14 says, “Engineers are doing more with less support, while facing tighter-than-ever time to market pressures. As a result, they depend more and more on consolidated tools and support systems…. We’ve seen the use of our own proprietary search and knowledge tool — the Knode — go up considerably on our element14 community.” Ross Fosler adds that “in terms of

Insight into current product developments power control, dynamic efficiency is critical. The industry has focused on static efficiency for a while; however, efficiency under conditions where the system is changing is becoming far more of a focus. And the challenge is significant; systems need to be smarter and more flexible to adapt. our pSoC programmable SoC is well suited for this trend.” 3. Are there any new components that are making a difference in industrial automation right now? Stephan Zizala is seeing traction around the Infineon XMC microcontroller family, which addresses the dual challenge of system hardware configuration and software complexity with a new approach to programming. He says “the two XMC device families feature fast embedded flash and operation at up to 125 °C. EEs appreciate application-specific peripherals including inverter control and real-time control for the XMC4000, and items for lower-end applications such as LED lighting and power supplies for the XMC1000. Addressing complexity, design engineers are now using an FpGA-like approach to combine different hardware peripherals. For example, working in a graphical environment, with our DAVE 3 development tools, engineers build up the complete application, map it automatically to the microcontroller hardware resources and then generate Ccode. Mike Ulch says, “in general, components that are smaller, low power, and “smart” are providing real value and real savings. Also, communication systems that allow many traditionally hard-wired components to be part of a network are in demand. An example is Eaton’s SmartWire-DT panel wiring solution that lets engineers do away with traditional wiring, saving labor and time. Ross Fosler says he suspects new control innovations are making a difference more than new components are. “Two exceptions are the introduction of silicon carbide (SiC) diodes and the newer GaN FETs. These devices are likely to introduce another step in performance….both efficiency and size,” says Ross. Jim Harrison ELECTRONIC PRODUCTS

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FEBRUARY 2013

Packaging, Cabinets & Enclosures

Getting the enclosure you need faster, for less money Following a few simple tips helps designers get their products to market on budget with the exact enclosure their design requires BY JOSIAH HAAS Vice President of Sales Bud Industries www.budind.com

hat distinguishes a simple metal or plastic box from a functional electronic enclosure? Most often, itâ&#x20AC;&#x2122;s the modifications necessary to allow access to the interior, stabilize and protect its contents, and present the appropriate appearance. Enclosures typically

is the final step in the design cycle, with time-to-market pressure leading many to demand 1 to 2 weeks delivery rather than the 4 to 6 weeks common in the past. Although enclosure suppliers can typically turn around modifications in up to 6 weeks, the most efficient ones can complete simple modifications in as few as five days with no charge for expediting. With a little planning and coordi-

The NEMA enclosures shown here exhibit a wide variety of cutouts and modifications that let the products they protect work in the way the designer intended.

need a minimum of one cutout for a power cable and often many other modifications, which can include holes, cutouts, tappings, gaskets, pre-assembly, and finishing. For many design engineers, specifying enclosure modifications

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nation with the right supplier, product designers can get their creations to market faster with exactly the enclosure their design requires. Here are a few tips that can speed and simplify the enclosure modification process:

Getting the enclosure you need faster, for less money

Identify needs

Identify your enclosure modification needs as you create your product design. If you figure out your enclosure requirements early, you’ll often be able to take advantage of a stock enclosure, which will cost substantially less and require far less lead time than a custom one. For example, with extra planning time, you have the flexibility to reposition the mounting screws on the PCB to line up with a stock enclosure’s mounting bosses, or you might select taller keys to accommodate a standard box’s depth.

Modifications

Make sure you know where the cutouts need to be and what tolerances are acceptable. Some components, such as a switch, may be connected to the PCB with a flexible cable, in which case the exact position of the cutout is not critical. However, with a component like a data port that’s mounted on the PCB, the cutout must be positioned

precisely in relation to the PCB mounting bosses. Tolerances depend on the precision of the equipment used, so ask the supplier of your components to verify the product’s tolerances so that the enclosure supplier provides a turn-key modification for you. Remember that two holes can be within tolerance and still not fit your design. If one hole is offset slightly

“Make sure you know where the cutouts need to be....with a component like a data port that’s mounted on the PCB, the cutout must be positioned precisely in relation to the PCB mounting bosses.” Enclosure suppliers can easily mill out a mounting boss or card guide that’s in the way or add tapped inserts to increase the stand-off to allow mounting the PCB closer to the front of the enclosure.

Selection

Find a supplier with a wide selection of sizes in the enclosure style you prefer. Standard sizes are almost always less costly than custom ones. If you select the right enclosure, some modifications may not be necessary. For example, a polycarbonate enclosure with a clear lid eliminates the need for cutouts for LEDs and displays. On the other hand, sheet metal boxes are formed by bending metal, so the additional cost for a custom dimension may be within your budget, while a custom plastic enclosure entails significant molding charges and long lead times. Look for suppliers who have invested in tooling, can produce modifications rapidly, and are equipped to accept customer CAD files. ELECTRONIC PRODUCTS

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FEBRUARY 2013

Packaging, Cabinets & Enclosures

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to the left and the other is offset slightly to the right, the combined distance may be significant. Inform your supplier which cut has the most critical tolerance so the other cuts can be made in relation to it. Other considerations you should keep in mind to streamline your modification order are: • Mounting. Are internal or external mounting provisions required? Your supplier may be able to add tapped holes or preassemble mounting brackets. • Grounding. Will certain areas or enclosure components need to be masked for continuity? Are ground points or studs needed? Suppliers can address these needs for you. • Draft angles. Cast boxes typically have a 1 to 2 degree taper, which enables the casting to be removed from the mold. This angle may affect mounted components, and should be taken into consideration when making modifications. • Wall thickness. Some components have minimum wall thickness that that they can mount to or maximum wall thicknesses that they can mount through.

Services

Take advantage of services that you would otherwise have to perform in house. Most enclosure suppliers offer pre-assembly of enclosure components, including cable glands and mounting brackets. Most will also apply decals and custom labels for easy shipment to your customers. The same is true of racks and cabinets. Rather than assembling custom components in house, it can save production time to order them pre-assembled. Locations of access panels, custom shelves, fans, vents, lock hasps, power strips, casters and levelers must be carefully specified. If a component needs special EMI protection, then the supplier can mount a die-cast aluminum box on the rack. Consider how a custom color could help differentiate your product in the marketplace, which could give you an edge in markets where competing products all appear similar. Many suppliers offer enclosures with a powder-coat finish.

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In-house or vendor

Carefully weigh the pros and cons of making enclosure modifications in house. The break-even quantity for saving money by making modifications yourself is around 50-100 pieces, but it also depends on the type of modification you need and the capabilities you have in house. If all you need is a drill press, it’s probably doable, but if you also have to pull a worker off the shipping dock to run it, make sure to factor in the cost of not shipping for a few hours or the cost of overtime. Other modifications, such as silk-screening or painting, require equipment you probably don’t own. Many OEMs who consider han-

“If [an OEM] absolutely must do modifications in house, they should plan for a certain amount of scrap. On some projects, the cost of modifications at the supplier will be just a fraction of the cost of scrapping an enclosure.” dling modifications in house don’t know they shouldn’t use the same drill bit for metal, plastic, and fiberglass, and they’re unaware of the torque speed required to cut a polycarbonate box without cracking it. Therefore, if they absolutely must do modifications in house, they should plan for a certain amount of scrap. On some projects, the cost of modifications at the supplier will be just a fraction of the cost of scrapping an enclosure. Here’s what’s involved in working with an enclosure supplier to handle the modification process. First, download or request a DXF or STEP file, which may be available on the manufacturer’s website. Then import the file into your CAD software and indicate where the modifications should be located. The supplier will work from your file. The vendor will then use its expertise to verify your

Getting the enclosure you need faster, for less money

design and ensure that it will perform as anticipated. Having the enclosure manufacturer make the modifications is usually the most economical decision. Order in the largest quantity that makes sense to minimize cost. On an automated milling machine, the run time is only 30 to 60 seconds per enclosure; setting up the machine takes the majority of time. Robotic equipment can modify multiple box sides with only one setup. Although job shops may be more cost competitive on shorter runs with just one setup, OEMs will incur extra freight costs and shipping time, and must deal with multiple suppliers.

• Evaluate your enclosure requirements during your design, with an eye toward stock enclosures.

Don’t wait

• Take maximum advantage of sevices offered by enclosure manufacturers.

Enclosures are part of the design and should not be left as an afterthought. Once product designers discover the ways that their suppliers can modify a stock enclosure, they have the freedom to focus on more critical parts of their jobs, reduce costs, and get products to market faster. ■

How Do I? Looking to lower your costs while finding the perfect enclosure? Try these Author’s Tips:

• Choose a supplier with a broad range of product offerings of the type you’ll need. • Carefully determine the modifications you‘ll need and how your design will impact their implimentation.

• Evaluate the real cost of making modifications inhouse, particularly scrap costs. • Make decisions as early as possible. Richard Comerford

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technology roundtable

Forum on Energy Saving BY JIM HARRISON

or this month’s forum on energy savings, which is always a hot topic, we asked five experts for their perspectives on three topics. 1. In the past 6 months, or so, have you seen any new designs that have a significant energy-saving factor to them? Larry Spaziani (Executive Director – Business Development, International Rectifier): Not only for the last 6 months but for the last 3 years, designs by our customers in the server and communications segments, in particular, have been emphasizing higher and higher efficiency — driven by the requests from their customers. We’ve been seeing the following trends more recently

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regarding efficiency: • Higher efficiency at three power points: Low load (10%), peak efficiency and full load (90-100%). This is because more and more SoC’s have operating modes that vary from energy-savings standby modes to highperformance turbo modes. • Higher accuracy in reporting current and power to the system. System engineers are using very accurate feedback from the power management devices like IR’s digital power management devices to control the exact

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FEBRUARY 2013

performance of their systems. • Digital bus capability on lower and lower output current pointof-load dc/dc converters. Whereas in the past, system engineers monitored just high-current devices, they’re now monitoring all their devices to as low as 3 A over the entire board. At IR, we continue to improve reporting accuracy and add PMBus features on our entire portfolio to meet and exceed these needs. Eric Hardt (Application Engineer, IXYS): There are several perspectives on ways designers look at the complete system level solutions very early in the design where historically each specialized team focuses on a component. This is especially true in power semiconduc-

Energy Saving Forum

tor packaging technology. Semiconductor companies are coming up with power MOSFETs and IGBTs in lowprofile, compact, and more energy efficient packages. There are also people thinking about alternative-energy sources for aiding design efficiency in designs and for capturing and reuse of otherwise wasted energy. Guido Remmerie (Director, Industrial ASSPs, ON Semiconductor): Since the Light+Building event in Germany earlier in 2012, we have seen the KNX standard (for building automation) become more visible and its application is becoming more widespread. There is more interest in building automation and the related energy savings, along with the increased comfort. There is also an increased offering of enabling products on the market. Several silicon suppliers now offer KNX modems for twisted pair while in the past it was a Siemensonly party. Several other companies have developed KNX SW stacks, and also microcontroller builders are useing the new transceivers as enablers for their CPUs in this market. Electronic Products subscriber John Massa (Datadog Systems, Hayward, CA) works with energy-saving systems all the time. He is currently working on LED street light retro fit systems and the converter design is getting greater than 90% efficiency from 120/220/270-Vac input to the LED assembly. Thermal design is an important factor here and John cautions that some street lamp systems out there do not have the thermal part of the design optimized and this will greatly effect longevity.

Subscriber Frank Neu (Project Engineer at Verlex) has not worked with any designs recently where energy saving was a priority. 2. How would you characterize the current state of â&#x20AC;&#x153;high efficiencyâ&#x20AC;? motor control? Are almost all new motors and controllers now sold of the high efficiency type? Do you think they can they be made more efficient at a reasonable cost?

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Eric Hardt: I would say that not all motor controls are at the highest state of efficiency. A distinction between motor and motor control has to be made as well. Example: Some BLDC motor applications have to meet very stringent BOM requirements such as in the automotive and telecommunication industry. These motors can range from single phase to 3-phase with efficien-

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FEBRUARY 2013

technology roundtable cies ranging from 20% (single phase) to less than 60% (three phase), and even sophisticated motor control algorithms such as sinusoidal control (sinusoidal PWM, field-oriented control) will not be able to increase their efficiency, unless more sophisticated electro-dynamic motor designs are chosen. However, using sophisticated motor control algorithm in conjunction

with inferior electro-magnetic BLDC designs may contribute to higher motor driver component lifetime (ball-bearing and electrolytic capacitors) and less electrical noise. This too is not always feasible because sophisticated motor control algorithms require MCUs with higher clock rates and more memory resources, which may be too expensive. In higher-profit-margin products

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such as white goods and heavy industry, motors of higher quality can be used, such as ACIM brushless and permanent magnet synchronous motors. They are typically driven with advanced motor control algorithms, as previously noted, and are using more powerful MCUs as well. Guido Remmerie: For sub-100-W motors, BLDC motors are being used more and more. Sensorless position control has become commonplace. There is still room for improvement at the level of the motor controllers and the algorithms used. This area should not require a major cost increase. John Massa: Motor control is gotten much more efficient in recent years. What needs to happen now is for the drive electronics to get smaller, more compact, easier to install. The FETs and IGBTs are available with lower on-resistance so the end use can get a more reasonable return on their investment — and that makes everyone happy. Frank Neu: I’ve been working with small motors, and we don’t see much improved efficiency there. These motors don’t take a lot of energy in the first place. 3. Are design engineers very “energy aware” right now. Is it a high priority, and if so are they energy careful out of concern for the environment or for other reasons? Larry Spaziani: Every engineer, component engineer, and purchasing agent involved with higher-performance systems such as networking, datacomm, telecomm, and servers is fully aware of energy performance. It has become part of the designer’s DNA over the last 12 to 24 months, as higher-efficiency systems are required. Some reasons are as follows: • With the explosion of wireless bandwidth, every aspect of data storage and networking is having exponential growth. However, every inch of space has been filled over the last several years to meet the demanding needs, and the new problem is how to expand without expanding space. The easiest answer is to replace outdated inefficient equipment with newer technology that realizes both higher density and lower power.

Energy Saving Forum

• Total cost of ownership (power requirements and electricity costs) are being monitored, or even passed down to end customers by cloud computer services and data centers. Engineers are crafting systems that can assure their end customers that (a) the new equipment reaches state-ofthe-art efficiency levels and (b) the on-board monitoring provides extremely accurate power reporting (to bill clients, or monitor and adjust system performance). Guido Remmerie: Energy awareness at the designer level is mainly driven by the specification imposed by the market, which is in turn driven by the need to operate on batteries and increase the battery life, or operate without batteries altogether. An example is the ZigBee GP (Green Power) profile intended for operation without batteries, just using the energy provided by physical actuation while pushing a button without intermediate storage or accumulation. This and similar initiatives enable a

new way of operation and comfort, but at the same time fuel low-energy developments. Eric Hardt: The demand for more efficient motor control has risen in the last two decades, and engineering efficiency awareness is driven largely by government regulation and cus-

“Are design engineers very ‘energy aware’ right now. Is energy a high priority?” tomer demand trying to satisfy markets regulated by these requirements. Some industry applications have to meet certain efficiency benchmarks and many motor control engineers are in the process of adapting to

those requirements by implementing and learning about more sophisticated control algorithms. Not only are design engineers very “energy aware” nowadays, but they are also placing a higher priority on designing lighter power conversion systems. “Weight reduction” in power systems translates into reduced greenhouse gas emissions in the production, shipping, and use of power products. Lighter products use fewer materials, require less energy to ship, and result in less heavy systems — a critical desired feature in the automotive, transportation, and portable electronic industries. John Massa: Yes. Engineers I talk with are very interested in anything that will help them save energy. They do this because it’s part of their job and also they feel a professional responsibility to do the right thing. Frank Neu: There’s been lots of talk about global warming, but a lot of us engineers aren’t so sure of the origins of this problem. We still always like to save power in our designs. ■

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The next level in low-power microcontroller design Current analysis tools help optimize low-power system design BY JASON TOLLEFSON Senior Product Marketing Engineer Microchip Technology www.microchip.com

“snapshot” as the code is executed. now, you have a link between consumption and execution. One example of a number of such tools that you can find now is the MPLaB rEaL iCE Power Monitor from Microchip, which is used in conjunction with the MPLaB rEaL iCE in-circuit emulator (see Fig. 1). all of the current-analysis tools on the market provide measurement and a graphical history of current values. However there are notable differences when it comes to the resolution of the current measurement and the level of integration to the related iDE. Power Monitor is a single-board solution that is integrated into the MPLaB X iDE, and features a measurement range of of 200 na to 1 a. The tool is fast, with a sampling rate of 1 MHz, so short current bursts can be detected. The Power Monitor also features current threshold break points, allowing you to quickly identify high-current-consuming code. The current and voltage are displayed within the iDE window as shown in Fig. 2.

ou’ve done your homework and selected a great low-power MCU. The sleep current is incredibly low, the run current is great, but somehow you are not meeting the application lifetime needs of your battery-powered design. you need to take current savings to the next level. selecting a low-power MCU has never been easier. Many vendors now offer MCUs that focus on low power. They include an arsenal of new lowpower modes, ready to wage war on your power problems. However, once you have selected your MCU, you are presented with an open array of choices for implementation. you need to know the impact of peripherals on power consumption: Can i leave an a/D converter on all the time and sample continuously, or must i implement a sampling methAchieving the next level: odology? should i shut down Fig. 1: Microchip Technology’s MPLAB REAL ICE emulator An example the CPU core while sending with Power Monitor attached. in low-power applications, there is data out the UarT? should i a lot of time spent waiting for something to happen. The implement a wait loop with a While instruction, or some applications remain in sleep for long periods of time, then other type of software structure? Without visibility into awake and execute the code. in sleep, there is often a timthese types of tradeoffs, it will be hard to answer these queser that must expire to awaken the MCU. in run, we often tions and even harder to improve your battery life. wait in a simple While (1) loop until an a/D or UarT finTo get to the next level, MCU selection is no longer ishes its operation. sufficient; you must understand the impact of your softCurrent-measurement probes can be used to evaluate ware on current consumption. ways for improving upon the current consumed, by allowing us to shed light on inefficient software. Help getting there This was very evident when Microchip was characterCurrent-analysis tools are beginning to come out that can izing run current on one of our newer MCUs, called the guide you to the next level. The plain old ammeter does PiC24FJ128ga310. This MCU had internal flash improvenot provide all real-time information needed. instead, it ments that should have reduced run current by nearly gives an average current. a current-analysis tool’s advanhalf. But, at first, the design team did not see the expected tage is tying current consumption directly back to softimprovements. ware, and capturing a historical current consumption

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while(1) } This setup resulted in a Power analyzer reading of 230 Âľa running at 1 MHz, which did not match with the expected result. The team realized that this type of software implementation did not take advantage of the MCUâ&#x20AC;&#x2122;s architectural improvements. Their next code looked like this: int main(void) { //Set ports to outputs void config_ports(void) //Gate off all peripherals eliminating switching current void PMD_on(void) //Nop(); //Endless loop to measure Run current while(1) {

Fig. 2: MPLAB X IDE with its integrated power monitor graph.

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int main(void) { //Set ports to outputs void config_ports(void) //Gate off all peripherals eliminating switching current void PMD_on(void) Nop(); //Endless loop to measure Run current

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Wireless/ Networking Special Camera Serial Interface sensors in embedded designs �� 36 Wireless technologies for the smart car �� 38 Three easy network applications �� 40 Developing Bluetooth low energy ‘appcessories’ �� 43

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Wireless/NetWorkiNg

Camera Serial Interface (CSI-2) sensors in embedded designs Microcontroller designs can make use of a CSI-2 image sensor connection BY TED MARENA Director of Solutions Marketing Lattice Semiconductor www.latticesemi.com/csi2bridge

practical data rate limit for a CSI-2 interface is less than 1 Gbit/s, but often it is less than 700 Mbits/s. For example, a high-definition 1080p60 video signal would be transmitted with four differential data lanes, each running up to about 500 Mbits/s. Figure 1 shows a typical block diagram.

he majority of cameras in highvolume consumer products, such as smartphones and tablets, use MIPI (Mobile Industry Processor Interface)based sensors. The most commonly used interface for this type of image sensor is the CSI-2 specification (Camera Serial Interface). CSI-2 consists of a unique physical bus that contains a differential clock and from one to four differential data lanes. This interface is called Figure 1: A CSI-2 sensor interface a D-PHY. What makes the D-PHY unique is that it can change “on the fly” from differential, to singleended signaling. High Speed (HS) mode is differential, and singleended mode is Figure 2. CSI-2 to CMOS Parallel Block Diagram called low power (LP). A high-performance video from a CSI-2 image In many of these applications the sensor will use the HS differential CSI-2 image sensor would be configdata mode. ured at power up and set to transmit The CSI-2 HS interface operates the frames in HS mode continuously. electrically as a SLVS (scalable-lowThis is free-running clock mode or voltage-signaling) standard device fixed high-speed mode. with a 200-mV common-mode voltThe challenge for these non-conage. The clock is DDR source synchrosumer-based camera designs is that nous, and the number of data lanes most do not use an applications profor a CSI-2 interface can vary from cessor, instead they may have an imone to four lanes. Each data lane age signal processor (ISP) or a microtransmits 8-bit serial data. The higher controller without a CSI-2 interface. the image sensor resolution and frame They may use a traditional CMOS bus rate, the more data lanes, and higher for their camera interface. MCUs with speed for each, will be required. The a parallel CMOS interface bus cannot

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be connected directly to a CSI-2 image sensor like an AP can. For these designs an external bridge is needed (see Fig. 2). A low-density FPGA is an ideal component for this bridge design, and reference designs are available for this method. For example, the Lattice MachXO2 FPGA has a bank of configurable differential I/Os that can be leveraged to support the CSI-2 HS interface. If the end application can use the CSI-2 image sensor in free-running clock mode, then the implementation is straightforward with a seamless connection between the devices. If both HS and LP modes need to be supported, then the MachXO2 FPGA can support this with external discrete components and additional I/O pins. From one to four data lanes are supported with data rates of up to 750 Mbits/s. The 1200 LUT density of the this FPGA can create a two-lane CSI-2 to parallel bridge to support the free-running clock mode. To support 1080p30 resolution, the device would consume 66 mW and require no external components. If the image sensor is used in both LP and HS mode, then the power consumption when in LP mode would be 30 mW. Overall, the FPGA density size and power will be dependent on the number of CSI-2 data lanes, the resolution, and how many modes are needed. This FPGA solution allows a user to configure a CSI-2 interface for specific requirements. ■

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Wireless technologies for the smart car The importance of improving safety and the overall driving BY YUJI NAKANISHI Strategic Marketing Manager Murata Americas www.murata.com

he 2013 fleet of new vehicles differs in design, passenger capacity, and driving abilities, yet all of the vehicles come with technologies that make them “smart.” Sensors for safety, fuel economy, and comfort, not to mention a wide variety of wireless communications options, are becoming more ubiquitous in vehicles of all makes and models. What is even more exciting is what smart-car technology will look like 10 years down the road. Car-to-car and even car-toinfrastructure communication, known as V2X, will be in future vehicles. Much of this current and futuristic technology is owed to advancements in automotive-grade components, which aid automakers in their pursuit of smarter cars. Taking a closer look at current automotive wireless communications is easy, as it has become a larger part of most drivers’ experience. Bluetooth capability, for hands-free dialing, WiFi, and cell phone connectivity (think OnStar) are included in many vehicles option packages. Now some auto manufacturers use the driver’s smartphone to provide wireless communication, eliminating the need to integrate cell function into their own systems. Wireless communications doesn’t just refer to the ability to sync a phone to the car. RF technology provides important safety and fuel economy capabilities. For example, radar is used for adaptive cruise control and forward crash avoidance. Ultra-

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sonic sensing provides back sonar (also known as rear obstacle detection) and automatic parking. For fuel economy and reduced emissions, real-time traffic information, through cloud communication to the navigation system, helps avoid traffic con-

gestion. Thus, wireless communication has grown to mean more than just an on-board GPS. Innovations in fuel economy, entertainment, and comfort will continue to advance, but 10 years from now, cars will have more wireless communication systems that focus on safety. There are international infield trials and approximately 3,000 vehicles currently being tested in Ann Arbor, MI, for vehicle-to-vehicle (V2V) and vehicle-to-infrastructure (V2I). This V2X capability will help prevent accidents and even aid emergency responders in reaching their destination without having to fight through traffic and congestion. The U.S. Department of Transportation’s Connected Vehicle program is expected to consider making this type of technology standard. Looking even further ahead, cars could ultimately have Auto Drive capabilities

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FEBRUARY 2013

by using a cloud connection and various sensors.

Automotive-grade components

None of these features would be possible without the use of automotivegrade components. To be clear, much of the technology behind the wireless communications mentioned above can be used in consumer electronics. For use in automotive applications, though, the same components found in televisions and mobile devices must meet much stricter automotive standards. An automotive environment is harsher compared to the consumer one, with higher temperatures, longer heat cycles, more intense vibrations and shocks, as well as humidity. The guts of wireless communications in automotive applications must be more robust in order to properly function. Another difference between automotive grade and consumer grade is the product life span. People easily replace phones, laptops, televisions, and other consumer products every few years, either because the product no longer works or because they want to upgrade to a newer model. However, cars and trucks are not so easily or inexpensively replaced. Given that, the technology inside automotive equipment needs to last much longer. Despite the challenges automotive wireless communications present, the importance of improving safety and the over-all driving experience will continue to push forward innovative technologies. ■

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Three easy industrial network applications 802.15.4 wireless is a proven and accepted technology that works BY TODD HANSON Director of Wireless Solutions Honeywell Sensing and Control http://sensing.honeywell.com

ndustrial wireless networks are becoming very popular due to proven wireless technology, especially 802.15.4, which can cost effectively handle a wide range of sensing, control, and management functions. The move from wired to wireless networks in industrial, manufacturing, and warehousing applications is to reduce costs, improve uptime, save energy,

and improve workplace safety. Installation costs are cut by eliminating many wiring expenses and cable-routing problems, while placing fewer restrictions on the location and placement of equipment. And wireless can reduce related costs for items like conduits and connectors. Another important factor is the speed of installation, particularly for factory floors that need to reconfigure their manufacturing and assembly lines quickly and efficiently. In wireless implementations, plant managers simply move the assembly machines to new locations and

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turn on the wireless network, eliminating the need to re-route cables or deal with new data cables.

Wireless to control and manage energy usage

Large manufacturing plants, especially in the automotive industry, often have numerous large doors that, if left open when not in use, can result in a waste of energy in heating and air conditioning. A wireless switch or position sensor on a door that communicates to a local server and then to the web enables easy monitoring of the open/ close status of these doors using an app for the smartphone or other web-connected device (see Fig. 1). Fig. 1: Wireless networks connected to the web can be monitored via a smartphone.

Wireless for industrial safety

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Most industrial plants and facilities use a combination of safety showers and eye washes for chemical exposure hazards. Having a notification system that informs plant management or EMS personnel that an emergency has occurred, is a rising requirement within these plants and is being reviewed by governing bodies as a pending regulation. These showers and eye baths can be located indoors or out, often in locations where it would be cost prohibitive to run a data cable. Wireless also allows these safety showers and alarm switches to be easily moved and repositioned. Many current safety showers use an in-line flow switch that activates auto-

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Three easy industrial network applications

Wireless/NetWorkiNg matically. These are often difficult to maintain and are subject to failure and costly to replace. It is simple and cost effective to use a wireless system to replace them (see Fig. 2). Fig. 2: Honeywell’s battery-operated Wireless Operator Interface (WOI) can be used for a safety shower or eye wash basin alert.

Most users prefer to install the switch so that an alarm is sent automatically upon actuation. In other cases, a simple manual wireless push button switch can send a true alarm to plant management.

Industrial wireless for airport security

Airport hangars are often located a distance away from their associated offices or security checkpoints. The challenge is to monitor the status of these doors, especially the small cutout doors that are used for personnel access when the main door is closed (see Fig. 3). If the large hangar door rolls up while the pocket door is open, it can result in expensive damage. And with the need for increased security awareness, being able to monitor and track access to aircraft is critical.

Fig. 3: Switches mounted on the small hangar access door provide security.

In addition to solving the problem of installing and maintaining long cable runs underneath the pavement, the hangar doors cause extensive moving and flexing of cables that often results in breakage. Using battery-powered wireless sensors, there is no need for either data or power cables. Additional security is provided by the network’s ongoing self-reporting – ensuring that the connections are secure and that battery power is adequate.

Wireless helps prevent truckstop thieves

Wireless networks are being installed in truck stops across the nation to help monitor remote diesel and gas pumps in order to prevent theft. Some truck drivers and operators have learned how to open the pumps and then set them so that they can pump fuel into their vehicles without it registering on the station’s controllers or cash registers. By attaching wireless sensors on the pumps that send an alarm to the office, the station operators know when a pump has been opened and can take corrective action. Installing a wireless 802.15.4 network is much less expensive than a hard-wired solution and only takes a few hours to set up and install. ■

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FEBRUARY 2013

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Wireless/NetWorkiNg

Developing Bluetooth low energy ‘appcessories’ What you need to know and what are the challenges when creating an ‘appcessory’ design for a smartphone BY JARLE BOE System Applications Manager Low Power RF Texas Instruments www.ti.com

ike most smartphone owners, I have a dream to make my own app. And like most app dreamers, I have discovered that most of the apps are already invented. But now, thanks to low-power and lowcost MEMs sensors, I have the chance to develop a new type of app with the Bluetooth Smart (Bluetooth low

energy) standard or a smartphone accessory designed to run an app or “appcessory.” Traditionally, Bluetooth has been used for streaming audio. With the Bluetooth low energy extension as part of the Bluetooth v4.0 specification, applications can operate for years on a single coin cell battery at the expense of lower data bandwidth between the accessory and the phone. Bluetooth low energy fosters the creativity of app developers to collect real world sensor data from advanced

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wireless sensors for an unlimited number of potential applications. Just like the launch of the iPhone created a new ecosystem of app developers with creative ideas, the launch of more Bluetooth low energy-enabled smartphones opens up a world of new app opportunities. However, there is still a challenge in that appcessory design requires a combination of skills and knowledge, including sensors, RF, hardware design, embedded firmware, and smartphone app development.

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FEBRUARY 2013

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Wireless/NetWorkiNg

Sensor design

In the last few years, an amazing number of advanced low-cost MEMS sensors with digital interface and very low power consumption have been released. In creating the SensorTag development kit, our goal was to make a Bluetooth low energy device with the maximum number of sensors while achieving years of battery life on a single coin cell battery. As shown in Fig. 1, we ended up with six sensors chosen for their very low sleep current and digital I2C sensor interface. Each of the sensors has separate enable signals and the sensor reading intervals are programmable to be optimized for various applications.

Hardware and RF design

However, you should make certain the module you are using is already certified by the certification authorities in the region you plan to sell your device.

Embedded firmware development

There are two types of Bluetooth low energy ICs on the market today. A network procesFig. 1: TI SensorTag block diagram with power numbers. sor is a standalone Bluetooth low energy deand other advantages including: vice that includes the software stack and radio in a single device. This al• The application and stack firmware can be upgraded from the smartphone app.

You can make your own RF design if you are experienced. If not, I recommend using a reference design. Do copy everything in the RF design accurately; use the same boardlayer buildup and thickness. Keep the same dimensions and distance between components, and be prepared to Fig. 2: The SensorTag user interface on an IPad. make a few spins of the board until the design is final. Note that products containing Bluetooth radios require radio certification from the FCC (U.S.), IC (Canada), and ETSI (Europe) to be sold in each region. FCC/ETSI/IC testing and paperwork normally require six weeks and cost $20,000 to $25,000. These three radio certifications will normally cover all the regulatory requirements needed to sell the device worldwide, but additional certifications may be required. Fig. 3: The complete SensorTag product, including concept For low-volume production drawings and iPad app designs, the use of an RF modlows you to use your own MCU and ule is recommended for further siminterface to the Bluetooth low energy plification. There are numerous Bluedevice through a serial interface like tooth low energy modules on the UART or SPI. The second option is to market. A collection of Bluetooth low use a flash-based SoC (system-onenergy modules can be found here: chip) with MCU, flash memory, and www.ti.com/ep0213-1. An additional radio on the same device as the apbenefit to using a module provider is plications. This approach gives the that most of the time modules are allowest power consumption and cost, ready certified for worldwide use.

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• Available flash memory space can be used for data storage to allow use of the Bluetooth accessory as a datalogger in “offline” mode when it is not connected to the smartphone. For example, a heart rate monitor can store data while you are running and load the data to your smartphone when you come home. • Reduced cost since the PCB is smaller and you need less components as there is no need for an external MCU. Bluetooth low energy firmware is based on a Bluetooth low energy software stack. There are several stacks on the market both paid and for free. To ensure compliance and interoperability, the software stack should be Bluetooth low energy certified.

Smartphone app development

For most developers of embedded hardware and software, the world of smartphone app development is a step too far. Fortunately, there are very good tools with Apple’s Xcode development environment, but the level of knowledge required to build your own app can still be high. To

Developing Bluetooth low energy â&#x20AC;&#x2DC;appcessoriesâ&#x20AC;&#x2122;

easily get started with a simple Xcode source project that shows how to connect and pair Bluetooth low energy accessories and collect sensor data, see www.ti.com/ep0213-2 and Figs. 2 and 3.

_App_on_App_store

Additionally, there other tools that make it even easier to write apps for Bluetooth low energy appcessories. Any engineer that has learned BASIC in school can write (or cut and paste) applications using techBASIC available from Byte Works, www.byte works.us. This program includes BASIC code examples to interface to Bluetooth low energy sensors and provide advanced mathematic functions and graphical presentation of the data. They also supply tools that convert your BASIC code to Xcode format for publishing your app on App store.

The pleasure of seeing the results of a wireless embedded product through an iPad app canâ&#x20AC;&#x2122;t be explained. Instead of navigating cumbersome menus on a small product display it is gratifying to use engineering skills to create smart touch interfaces that allow the display of all the hidden gems and features of

Certifications

After completing your hardware design, firmware programming, and app development, it is time to lean back and wait for your app to be approved. To submit apps to the App store you must be a member of the Apple App developer program, which costs $99 a year. When your app is submitted the first time, you should expect a two- to four-week cycle time for Apple approval. You can track current approval times on this web site: http://reviewtimes.shinydevel opment.com/. Any Bluetooth products must pass Bluetooth end product certification testing and you must be a member of Bluetooth SIG organization, which is free at the Adaptor level. All certified Bluetooth end products are listed on the Bluetooth product directory for free, giving your appcessory some great promotion: www.bluetooth.com/Pages/Prod uct-Directory.aspx. Bluetooth end product test time is normally four weeks, and typical cost for certification is approximately $3K. However, this fee is waived for designs that strictly follow a Bluetooth certified reference design (HW and SW), such as TIâ&#x20AC;&#x2122;s SensorTag. For more information about certification, check out www.ti.com/ ep0213-3.

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an embedded design. If you want to test out your own Bluetooth low energy â&#x20AC;&#x153;appcessory,â&#x20AC;? the complete design files for this project can be downloaded at: www. ti.com/ep0213-4. The source code for both the embedded firmware and app sample project can be downloaded at www.ti.com/ep0213-5. â&#x2013;

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1/8/13 3:28:32 PM

PROduCT

UPDATE Interlock switch provides integration options The dS series interlock switch provides latching or momentary actions to deliver a variety of integration options, including typical applications as a detection switch or a circuit interrupt in harsh environments. These single- or double-pole doublethrow switches are RoHS compliant and made of halogen-free material. The dS interlock pushbutton switch has rugged copper alloy, silver-plated common terminals and F5-rated, goldplated-over-silver alloy contacts. The dielectric strength of the dS switch is measured at 1,500 V (50 to 60 Hz at sea level) and insulated at 100 mΩ (minimum) with initial contact resistance rated at 30 mΩ. (Contact company for pricing — available now.) C&K Components www.ck-components.com

Snap-in keylock switches ideal for space-saving apps Offering a behind-panel dimension of 0.089 in. and panel cutout dimensions of 0.039 to 0.079 in., the SK series of snap-in keylock switches offers secure mounting and is ideal for designs requiring space-saving, minimum-security switching. The series housing and bushing are made of high-insulating, glass-fiber-reinforced polyester capable of withstanding 15 kV of electrostatic discharge, thus providing superior antistatic protection. In addition, these devices are offered with solder lug and 0.071 in quick connect for simple installation. Wire harness customization options are also available upon request, further simplifying setup. In addition, the SK keylock has a high dielectric strength of 500 V between contacts and case and a mechanical life rated at 30,000 operations minimum, while electrical life is at 10,000 operations minimum. Rated at 0.4 VA max at 25 V ac/dc, the SK Series also has an operating temperature range of 40 through positive 185F.(Contact company for pricing and availability.) NKK Switches www.nkkswitches.com

Relays target automotive, marine apps The R51 weatherproof relays feature shrouded 0.250-in. quick-connect terminals and are perfect for use in automo-

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tive, marine, tractor, lawn mower, recreational vehicles, golf carts and more. Features include SPST-NO and SPdT contact arrangements, 12- and 24-Vdc coil voltages, and 50-A current rating. In addition, the devices provide a mechanical life of 10,000,000 operations (18,000 operations/hr) and an electrical life of 100,000 operations (1,200 operations/hr). Operating temperature is –40° to 125°C. (Contact company for price and availability.) NTE Electronics www.nteinc.com

Metal pushbutton switch features ceramic actuator The MSM CS metal pushbutton switch features a patented highly durable ceramic actuator. The ceramic material is resistant to scratches, abrasions, impact, and chemicals. It is also hypoallergenic to the touch. The ceramic actuator allows for fully transparent backlighting in red, green, or blue, as well as a newly introduced bright white. The part has a low profile of 1.7 mm, with an impact rating of IK07. It is rated IP69K for seal protection against liquids and common chemical agents. The microswitch is uL, CSA and ENEC approved. different switch configurations are offered over a range of 30 Vdc to 250 Vac. Current rating ranges from 0.1 to 10 A, depending on switching voltage. The MSM CS is available in 19 and 22 mm mounting diameters and is equipped with quick connect terminals. The non-illuminated version offers a translucent actuating surface. Black lettering can be applied directly onto the ceramic material. Negative lettering to produce an inverse effect is also an option. (Contact company for pricing — available now.) Schurter www.schurterinc.com/new_switches

Split-image switch suits instrumentation panels Ideal for for high-density instrumentation panels and display areas in a compact footprint, the SW44863 split-image switch series feature SMT LEd’s on a built in PCB. Pushbutton lenses feature hidden legend lenses with multiple color options for backlighting. Switch ratings are 0.1 A resistive, 0.05 A inductive at 30 Vdc or 125 Vac. Other features of the SW44863 include an operating pressure of 32 oz. (± 5 oz), switch travel of 0.030

FEBRUARY 2013

Relays & switches in, weight of less than one ounce, and a rated life of 100,000 minimum actuations. Interconnect with PC pins to mount directly to the PCB. The part is SPST circuitry, one normally open circuit, momentary snap feel, and legends can be customized to panel requirements. The new switches can be provided with two or four LEds for split light segments. ($39.90 ea/1,000 — 7 to 8 weeks ARO.) Electro-Mech Component www.electromechcomp.com

W, and a coil voltage of 5 Vdc. The relay features gold-plated leads for improved solderability, with a standardized dual-in-line pin layout (2 mm raster). No external activation electronics are required. It is RoHS compliant and can perform millions of reliable operations. It is also available with parallel activation electronics. (Contact company for pricing — available now) Standex-Meder Electronics www.standexmeder.com

Relay series targets automotive The A17 series is a robust automotive relay in a small package. Noted for its high current/in-rush capabilities, the relay offers plug-in styling with maximum current rating of 20 A. This sealed relay is single pole single throw with coil suppression options of resistor or diode. Features include a contact rating 20 A at 14 Vdc N.O, contact resistance of less than 50 mΩ, an electrical life of 100k cycles, a mechanical life of 10 Mcycles, and a dielectric strength of 750 Vrms minimum coil to contact and 500 Vrms minimum contact to contact. Insulation resistance is 100 MΩ minimum at 500 Vdc. Shock resistance is 98 m/s2 for 11 ms and vibration resistance is 1.5 mm double amplitude 10~55 Hz. Operating and storage temperature is –40° to 85°C. Solderability is 260°C for 5 s. Weight is 13 g. The part measures 16.5 x 15.5 x 24.3 mm, and its contact material is AgSnO2. (From $0.82, depending on options and volume — available now.) CIT Relay & Switch www.citrelay.com

Reed relay comes in small packages Equipped with a new generation of drivers, the RM05-8A-S PCB mount reed relay module offers a 24% smaller footprint than its previous generations RM05-8A relay. Features include a minimum breakdown voltage of 210 Vdc, power switching up to 10

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edited by p.o’shea, c.nickolas, r.comerford and j.harrison Find samples, buy now and more at electronicproducts.com

PV MOSFET driver integrates turn-off The VOM1271 isolated photovoltaic (PV) MOSFET driver is offered in an SOP-4 surface-mount package that features integrated turn-off circuitry, and a secondary-side power supply. The device is optimized for high-side MOSFET drivers, isolated solenoid drivers, and custom solid-state relays (SSR), as well as automated test equipment. The PV MOSFET driver features an open circuit voltage up to 8.8 V typical and a short-circuit current up to 47 µA typical. The higher open circuit voltage allows designers to choose from a wider range of MOSFETs and the higher short-circuit current decreases the time required to charge the MOSFET’s gate. Its optical coupling provides isolation test voltage of 4,500 Vrms. $2.00 ea/1,000 — available now.) Vishay Intertechnology www.vishay.com

Sensor system is a full TPMS solution

DC-DC Converter Transformers

Components & Subassemblies

A system in package solution for tire pressure monitoring systems (TPMS), the MLX91802 combines an analog pressure sensor, a low-power sensor interface, and an MLX16 16-bit RISC-based microcontroller in a compact, pressure-ported, plastic SO16 package. Using MLX91802 Uni-ROM firmware, the device can be fully programmed without writing code. The firmware provides a complete solution for six TPMS modes — storage, parking, driving, pressure alert, fault, and test — defining the different modes’ features and transitions between them. Simple configuration tools let users set operating behaviors so that the sensor can be deployed in a customized TPMS module; configuration and customer data are stored in the sensors internal EE-

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PROM. (Contact Sue Brocious for pricing — samples available now.) Melexis www.melexis.com

Top-actuated pico switch delivers smallest footprint The KLT series of top-actuated pico switches features a small 1.4 mm dome within a patented new type of switch structure that reduces size and is claimed by the company to deliver the smallest footprint in the market. The series is ideal for mobile phones and handheld MP3 player accessories as well as any other professional devices where compact packaging is of the essence. Featuring actuation forces of 1.0, 1.6, and 2.2 N, these switches have a 30% tactile minimum and measure 2.7 x 1.85 x 0.55 mm. The halogen free and RoHS-compliant switch is currently in the prototype stage, and features a 300,000-cycle lifespan along with IP-68 rated sealing. Additional features include a maximum power rating of 0.5 VA, maximum voltage rating of 32 Vdc, and a temperature range of –40° to 85°C.(Contact company for pricing and availability) C&K Components, Newton, MA www.ck-components.com

Precision resistors have TCR of 0.2 PPM/°C The models VSM and VSMP (Z-Foil) resistors are available in five different sizes between 0805 and 2512 and feature low TCR and tight absolute tolerances. They offer a TCR of ±2.0 or ±0.2 ppm/°C over the range −55° to +125°C and resistance tolerance to 0.01%. The resistors offer load life stability to ±0.005% at 70°C, thermal stabilization time <1 s, and ESD rating of at least to 25 kV. Resistance range is 5 Ω to 125 kΩ. (From $10 each – available now.) Wilbrecht LEDCO www.wilbrechtledco.com

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Tiniest bipolar, beyondthe-rails ADCs have an internal reference

The ADuM5010, ADuM6010, ADuM521x and ADuM621x are the industryâ&#x20AC;&#x2122;s smallest isolated dc/dc converters. The devices use the proprietary isoPower isolated dc/dc converter technology to deliver 150â&#x2C6;&#x2019;mW output power and iCoupler data-isolation technology to reduce board space up to 75% compared to optocouplerbased solutions. The ADuM521x and ADuM621x integrate two channels of iCoupler data isolation technology. The converters provide regulated, isolated power, adjustable

between 3.15 and 5.25 V. The ADuM5010 and ADuM521x are certified for 2.5â&#x2C6;&#x2019;kV rms (1 minute) isolation, while the ADuM6010 and ADuM621x are certified for 3.75â&#x2C6;&#x2019;kV rms (1 minute) isolation. Register for a webcast on isolated interface solutions for industrial sensor and

monitoring applications at http://semi Buy Now nar2.techonline.com/s/adi_ jan2313. (From $1.54 to $3.36 ea/1,000 â&#x20AC;&#x201D; available now.) Analog Devices www.analog.com

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The MAX11166 and MAX11167 bipolar Âą5-V 16-bit A/D converters are claimed to be the smallest and the only 12-pin parts of their kind to integrate an internal reference with buffer â&#x20AC;&#x201D; all in a 9-mm2 package and saving at least 88% board space over competing solutions. These ICs feature Beyond-the-Rails technology, which supports Âą5-V input signal from a single positive 5-V rail. This technology eliminates the need for negative power supplies and simplifies designs. At 19.5 mW, 500 ksamples/s, and 1 ÂľA in shutdown mode, the ADCs are applicable for precision measurement data acquisition systems (DASs), industrial/process control, medical instrumentation, and automatic test equipment (ATE). The MAX11166 and MAX11167 communicate using an SPI-compatible serial interface at 2.5, 3, 3.3, or 5 V logic levels and have sample rates of 500 and 250 ksamples/s, respectively.Additional specs include 92.6 dB SNR, and best-in-class linearity of Âą0.5 LSB INL and Âą0.2 LSB DNL typically. There will be 18-bit extended resolution versions of these parts which are slated for introduction in the first half of 2013. (From $16.07 ea/1,000 â&#x20AC;&#x201D; available now.) Maxim Integrated www.maximintegrated.com

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PRODUCTS Power meters have innovative functions For performing stand-by-power, Energy Star, IEC62301, battery-charger, and other power measurements, the low-cost WT300 series digital power meters offer updated and innovative measurement functions, such as the

Test & Measurement edited by richardcomerford Find samples, buy now and more at electronicproducts.com

probe lets users view small signals using hypersampling and linear noise-reduction technology to provide noise levels three times lower than 8-bit oscilloscopes. (Scopes from $14,950; probes from $3,000 — scopes available now; probes can be ordered Feb. 1.) Agilent Technologies www.agilent.com/find/9000H

Instrument reads temp, pressure for cold plates Auto Range feature, which optimizes the range setting for maximum accuracy measurements, and the Average Active Power function, which makes it possible to measure power consumption under greatly fluctuating power conditions. The WT300 family consists of three models: the single phase WT310 with the capability of measuring currents from 50 μA to 20 A rms, the single phase WT310HC with current ranges from 1 to 40 A rms, and the two element or three element WT330 unit for split- or threephase circuits, which has ranges of 0.5 to 20 A rms. All models have voltage ranges from 15 to 600 V rms. (From $3,875 — available now.) Yokogawa Corp. of America tmi.yokogawa.com/us

12-bit scopes provide low-noise signal views The Infiniium 9000 H-Series consists of four high-definition oscilloscopes with bandwidths of 250 MHz, 500 MHz, 1 GHz, and 2 GHz. They not only offer up to 12-bit vertical resolution — 50% more than typical digital scopes — but also have the industry's deepest standard memory — up to 100 Mpoints/channel. Further, the scopes can work with the N2820A and N2821A ac/dc current probes, with sensitivity down to 50 uA and 5-A maximum current range. The combination of scope and

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The iFLOW-200 system assesses the thermal and hydraulic characteristics of cold plates, measuring coolant temperature at inlet and outlet, fluid flow rate/pressu re drop, and surface temperature. The instrument can be used to simulate a wide range of conditions so as to optimize cold-plate performance. The system measures coolant temperature from 0° to 70°C with ± 1°C accuracy and differential pressure to 103,000 Pa (15 psi). Distilled water is the reference coolant; for test comparisons, the system’s coolingVIEW software can also calculate thermal resistance and pressure drop as a function of flow rate for selected liquids. The system includes a pair of K-type thermocouples for measuring temperature changes of the coldplate’s surface. ($21,500 — available now.) Advanced Thermal Solutions www.qats.com/Products/ Temperature-and-VelocityMeasurement/Instruments/ iFLOW-200

Handheld checks both voice and data circuits The compact HT1000/2 handheld test set performs the functions needed for fast, thorough testing during telecommunication installations. By testing both voice and data circuits during copper-wire installations, the instrument provides a means for certifying the physical layer of the telephone network and its xDSL transmission characteris-

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FEBRUARY 2013

tics as well as the Home Phoneline Network Alliance (HPNA) data/video networks. With a touch of a button, the unit performs many of the 26 essential tests between the technician’s central office and the subscriber’s location. An automatic Super Stress mode provide a unique test that provides more sensitive test results, helping identify the most difficult short-loop imbalances during longitudinal balance testing. Dual-trace time-domain reflectometry (TDR) with a range of 16,000 meters is also provided, and wideband spectrum analysis can help identify the type of noise affecting a circuit under test. (From $2,250 — available 7 weeks ARO.) Megger www.megger.com

Portable tester measures PIM The PIM Master MW82119A is said to be the first high-power, batteryoperated, portable tester for analyzing passive intermodulation (PIM). One quarter the size and half the weight of alternative PIM testers, the MW82119A offers patented Distanceto-PIM (DTP) and 40-W testing. The compact housing is suited for toughto-access sites, such as remote radio-head (RRH) installations and indoor distributed-antenna systems (DAS). Six models are available to address major frequency ranges: upper and lower 700 MHz bands, 850 MHz, 900 MHz, 1,800 MHz, 1,900 MHz, and 1,900/2,100 MHz. Flexible power adjustment capability allows a single analyzer to conduct PIM testing on low-power DAS systems and highpower Macro Cells. (Contact company for pricing — available 4 to 6 weeks ARO.) Anritsu www.us.anritsu.com

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Now get a Spectrum Analyzer at oscilloscope prices • 9 kHz to 1.5 GHz Frequency Range • Typical -135 dBm Displayed Average Noise Level (DANL) • -80 dBc/Hz @10 kHz offset Phase Noise • Total Amplitude Uncertainty <1.5 dB • 100 Hz Minimum Resolution Bandwidth (RBW)

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250â&#x2C6;&#x2019;, 400â&#x2C6;&#x2019;W supplies offer medical approvals The MVAC series of 3 x 5â&#x2C6;&#x2019;in openframe ac/dc power supplies target industrial factory automation, communications and medical equipment. The supplies comply with the internationally recognized UL60601-1 third edition medical safety standard. The series is comprised of the 250â&#x2C6;&#x2019;W MVAC250, and the 400â&#x2C6;&#x2019;W MVAC400 power supplies. Both models offer an acâ&#x2C6;&#x2019;input voltage range from 90 to 264 Vac with active power factor correction and active inrush control. Each model is available with an output voltage of 12, 24 or 50 Vdc, as well as a 12â&#x2C6;&#x2019;Vdc 1â&#x2C6;&#x2019;A fan supply and an auxiliary 5â&#x2C6;&#x2019;Vdc 2â&#x2C6;&#x2019;A output. The ac/dc power supplies feature an

efficiency rating of 94% and are packaged in 1U open frame format measuring 5 x 3 x 1.4â&#x2C6;&#x2019;in. The MVAC250 delivers up to 170â&#x2C6;&#x2019;W output and the MVAC400 up to 250â&#x2C6;&#x2019;W without forced air flow. The supplies operate at full power from â&#x2C6;&#x2019;10Â° to +50Â°C with a start-up temperature down to â&#x2C6;&#x2019;20Â°C and derated operation from 50Â° to 70Â°C. (Contact compa- Buy Now ny for price and availability.) Murata Power Solutions www.murata-ps.com

Dustproof DIN rail module provides 50 W The HSA50 DIN rail module is a universal compact power supply with a 90 to 264â&#x2C6;&#x2019;Vac and 120 to 340â&#x2C6;&#x2019;Vdc input range. The power module targets rough environmental condi-

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PRODUCTS tions. It is available with the single outputs of 12, 24, and 48-V. The ambient temperature range extends from −25° to 70°C. The DIN rail power module measures 42 x 115 x 75 mm. It complies with protection class II, the Low Voltage Directive as well as the current EN standards for CE conformity. The DIN−rail module is also VDE and UL/cUL, 508 approved. It features overload regulation that ensures a safe start even up to a maximum over current of up to 1.6 times of the nominal current with decreasing output voltage. (Contact company for price and availability.) MTM Power www.mtm-power.com

Power managers remotely monitor devices The Minuteman RPM Series 8 and 16-port remote power managers allow users to remotely manage power for connected devices such as serv-

ers, switches, routers, modems, security devices, and telephone systems. Locked-up devices can be re-set from a desktop pc, laptop, smart phone or tablet. The remote power manager features a web-based interface, allowing the user to control power to attached devices using any standard web browser and a password, and can perform a power up, power down, or reboot. The 8-port RPMs are available in 1U horizontal or 0U vertical mount configurations and include an LCD display featuring a true RMS meter that displays current device load and are available in both 120 V

(RPM1581HVN) and 208 V (RPM2082HVI) versions. The 16-port 0U vertical mount models feature an LCD true RMS load meter, and are available in 120 V (RPM20161VN) and 208 V (RPM20162VI) versions. (Contact company for price and availability.) Para Systems www.minutemanups.com

World's first 6 Watt DC/DC-Converter in SIP-8 Package TMR 6 Series

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Power Sources Power supply serves system peripherals Suitable for use in peripheral devices in computing systems such as a thermal printer or bar-code scanner, the GT-21131-7224 switch mode power supplies qualifies as a limited power source (LPS) for ITE systems. Delivering a single output of 24 V from a universal input, the convectioncooled device measures 141 x 76 x 43 mm and comes in a polycarbonate non-vented case. The power supply includes an output regulation of ±5%, a line voltage regulation of ±1% at full load, and an output ripple voltage of ±1% or 50 mV (whichever is greater). Turn-on/turnoff overshoot is 5% maximum, with a hold-up time of 10 ms at nominal input and full load. (Contact company for price and availability.) GlobTek www.globtek.com

Chassis-mount ac/dc supply offers 25 W The CM25 series of ac/dc switching power supply offers 25−W regulated output power in a chassis mount case. The terminal block and output voltage adjustment potentiometer enable it to be used as a power solution for many applications. The ac/dc power supply has an input voltage range of 88 to 264 Vac. The series offers output voltages of 5, 12, 24 and 48 Vdc, with efficiencies up to 83%. The supply offers short-circuit, over voltage, and overload protection. It features a metal cage type chassismount case for air convection cooling, and is rated for 3,000-Vac isolation. ($10.50/ea — available now.) ConTech www.contech-us.com

350 W ac/dc supplies suit industrial apps The SHP350 series of single output rugged 350-W ac/dc power supplies suit industrial applications. They feature a power density of 6.6 W/in. 3 and provide a typical efficiency of 85% in a fan-cooled unit measuring 7.0 x 3.6 x 2.1 in. They meet the SEMI F47 Voltage Sag Immunity standard for factory automation equipment. The 350-W power supply series is made up of six single output models providing nominal output voltages from +12 to +48 Vdc. The output is

also capable of being adjusted within ±10%. A remote sense facility compensates for a voltage drop of up to 0.5 V. An auxiliary output provides an always-on +5-Vdc / 0.2-A output suitable for powering memory, logic or control functions. The supplies accept input voltages from 85 to 264 Vac. When operated from input volt-

ages above 180 Vac, the power supply has a peak power capability that can deliver up to 420-W output for up to 10 s. They operate from Buy Now −20° to +70°C, with derating at +50°C. ($152.10 ea/500 — available now.) XP Power www.xppower.com

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Optoelectronics edited by richardcomerford Find samples, buy now and more at electronicproducts.com

HIGHLIGHT

White, single-die LED is brightest new star Fulfilling a promise made in the laboratory three years ago, the XLamp XM-L2 LED delivers efficiencies up to 186 lm/W (at 1W, 25°C, 5,000K) — the highest of any single-die LED commercially available today. Driven at 10 W, a single LED can deliver a lumen output equivalent to a 75-W incandescent bulb. Built with SC3 silicon-carbide technology, the LED doubles the lm/$ figure, delivering 20% more lm/W than the previous generation. Thus lighting manufacturers can use fewer LEDs to deliver better lighting systems at a lower cost. The LED is designed to provide very high lumen output at an 85°C junction temperatures, suiting it for such applications as high-bay, indoor, and outdoor lighting. By leveraging the 5 x 5-mm footprint of previous-generation XM-L LEDs, the new LED fits users’ existing designs — without the necessity of changing optics or drivers — thereby shortening the fixture design cycle and improving time-to-market. Further, as a follow-on to the

to XM-L, the XM-L2 requires only 3,000 hours of LM-80 data for ENERGY STAR qualification, instead of the normal 6,000 hours. The XM-L2 LED is available in color temperatures ranging 2,700K (warm white) to 6,200K (cool white) and with minimum-CRI options of 80, 85, and 90, depending on color temp. The LED is UL-recognized and has a level-4 rating. (Priced competitively with other LEDs — samples available now; prod qty in Q1.) Cree www.cree.com

LED arrays to foster SSL design Presented as a platform for designing solidstate lighting (SSL), Vero LED arrays aim to simplify design integration and manufacturing and give designers a more flexible LED lighting solution. The products offer three primary innovations: a higher-flux-density LED array, an increase in lm/W by up to 20% over the company’s existing LED arrays, and a simplified assembly process that streamlines manufacturing and improves overall system reliability. The arrays provides application coverage with four form factors and will initially be available with performance ranging from 800 lm in warm white (3,000K) up to 20,000 lm in cool white (5,000K), with multiple CCT and CRI options, including the 97 CRI Decor product option. The arrays are compatible with a wide variety of standard drivers and optical components. (Contact Company for pricing — available Q1.) Bridgelux www.bridgelux.com

Ac and dc LED lamps replace halogens Designed as replacements for traditional 75W AR111 halogen lamps, the 12.5-W Vega Series GL-AR111-V2-12 Interior LED lamps employ a patented thermal design that helps boost heat dissipation. The lamps have luminous efficacies to 86 lm/W and 80% lower energy usage than traditional lamps. Warm white units provide up to 800 lm, while cool white ones deliver up to 1,080 lm. Each lamp provides illumination with a 28° beam. Lamps with built-in drivers are available in versions for 12 Vac/dc, 100 to 240 Vac, triac-dimable 100 to 120 Vac, and triac-dimable 200 to 240 Vac. Typical applications include spot, architectural, residential, commercial, retail, accent, hallway, and cabinet lighting. (Contact Rex Lin for pricing and availability.) GlacialLight Div., GlacialTech www.GlacialTech.com

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Packaging & Interconnections

edited by paulo’shea and richardcomerford Find samples, buy now and more at electronicproducts.com

Connectors solve LED bulb issues For use in incandescent-replacement LED bulb assemblies, the 9159-500 Series bottom-entry, card-edge connector was developed to solve space, cost, process, and reliability issues, eliminating the need for labor-intensive hand soldering of wires on PCBs in SSL applications. The surfacemount board-to-board connector system allows a perpendicular PCB to be mated to a top-mounted main FR4 or metal core PCB from the bottom side using standard pick and place equipment and reflow soldering. The connector is available in a range of 2 to 6 positions, which allows increased functionality, such as color control or specific line control. Featuring dual PCB slot widths, the connector is compatible with both 0.8 and 1.6-mm PCBs, and is available with or without a safety cap, either preassembled or separately. Through-board height is 1.00 mm with the cap and 0.6 mm without, to avoid interfering with light output. Rated for 10 mating cycles, 2 A per contact, 250Vac/dc, and use in temperatures ranging from −40°C to 120°C, the 2-mm pitch connector has gold-plated beryllium-copper (BeCu) spring contacts. The connector also has UL1977 approval and meets the UL94 V-0 flammability standard. (Contact Tom Anderson for pricing and availability.) AVX www.avx.com

Benchtop cold plate cools down to −100°F The LHP-1200CAS benchtop liquidcooled thermoelectric cold plate system is a cascaded cold plate system that offers cooling capabilities down to −100°F and direct-contact cooling down to −70°C. It is designed for laboratory use and can be used to cool components, materials, chemicals, and samples in applications within embedded technology, test and mea-

surement, life science, and laboratory research. The cold plate can be used with any of the three cascade accessories for low temperature cooling or without the cascade attachment for a larger cooling surface. The user can switch between internal or external RTD sensors for customized control. A programmable temperature controller with data logging software is included. A hinged cover and RS-232 communications are included. Universal input voltage is standard. (Contact company for price and availability.) Teca www.thermoelectric.com

Cold plate cools highpower devices The CP4 series liquid cold plates are designed for heatsinkable-type resistors, including the TAP600, TAP800, TA1K0, TA2K0, and various SOT227 resistor packages. They can also be used to remove heat from SCRs, rectifiers, diodes, thyristors, and other high-power semiconductor devices. of cold plate four-pass heatsinks. The cold plates are constructed with an aluminum 6063-T5 plate and copper tubing with a nominal wall thickness of 0.050−in. The copper mounting surface of the device features a thermal resistance of 0.43°C/W. Applications include variable speed drives, power supplies, robotics, and motor controls. (Contact company for price and availability.) Ohmite Manufacturing www.ohmite.com

SMP-type connectors go from dc to 40 GHz Optimized for high-frequency/highdata-rate RF coaxial applications, SMP Interface System 2062_ male and 2020_ female connectors are engineered to securely mate and maintain performance through 40 GHz. The ELECTRONIC PRODUCTS

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PRODUCTS 50-Ω subminiature devices additionally feature a VSWR of 1.18 max at 40 GHz. Male PCB connectors are available in vertical-surface-mount (VSM), VSM through-hole (for extra board retention), and in edge-mount configurations. They are offered in three levels of detent — full detent, limited detent, and smooth bore — which have different engage/disengage coupling forces. Female connectors accommodate semi-rigid- or conformablecable diameters of 0.047 in. or 0.085/0.086 in. The connectors come in a variety of standard gold and custom plating. (Male, from $6.67 ea /1,000; female, from $6.75 ea /1,000 — samples available now, prod qty from stock to 12 weeks.) Bomar Interconnect Products www.bomarinterconnect.com\SMP.htm

Smart thermal fans suit EV charging systems The KE732 smart-ac axial fans feature a ball-bearing design that delivers airflow up to 100 cfm. The smart-ac fans for electric vehicle charging systems are available in either 120- or 230-V. The thermally-controlled ac-fans provide energy savings because the fans operate only at a speed necessary to cool the EV charging system. They automatically slow when an optimal temperature is reached. (Contact com-

pany for price and availability.) Orion Fans/Knight Electronics Dallas www.orionfans.com

Connector sockets support USB 3.0 Designed for USB 3.0, four new connector sockets support 5Gb/s SuperSpeed data transfers — 10 times faster than HiSpeed USB 2.0. USB 3.0 is back-compatible with 2.0 and its new SuperSpeed data transfer mode is a so-called sync-n-go technology that minimizes wait time and optimizes power efficiency. The connector sockets are available in Type A and B Standard versions (896-46-00990-300000 and 897-46-009-90-300000, respectively) and in Micro USB horizontal- and vertical-mount versions (897-10-010-40-300002 and 897-10-010-00-300002, respectively). Standard Type A and B units have 9 pins, are fully shielded, and have plug-retention tabs and kinked locating legs for secure PCB retention. The 10-pin Micro USB 3.0 connectors are aimed at portable and handheld devices, and feature a 0.66-mm pitch to reduce board space requirements. (896-46-009-90-300000, $2.368 ea / 300; 897- Buy Now 46-009-90-300000, $2.599 ea / 320; 897-10-01040-300002, $1.030 ea / 1,500; 897-10-010-00300002, $1.184 ea / 900 — available now.) Mill-Max www.mill-max.com/PR631

Low-profile connectors optimize SWaP

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The Scorpion power/signal connector series’ 8.20-mm lowprofile version is designed to let users optimize size, weight, and power (SWaP). Like other members of the series, the connector’s modular tool design allows for a nearly limitless variety of customer-defined contact arrangements, while the molding process yields a one-piece insulator. With a variety of modules, customers can define connectors as wide as 101.00 mm. The low-profile versions module options include blanks/ spacers and size 12, 20, and 22 contacts; contact current ratings are 55, 12 and 3 A respectively. Standard conductivity contacts have resistance values as low as 1 mΩ, and highconductivity, 0.7 mΩ contacts are offered. Blanks/spacers let users separate power and signal contacts to meet creepage and clearance design criteria. Contact terminations include board-to-board, board-tocable, cable-to-cable, and panel-mount options. Additional features/accessories include connector-housing ventilation slots, an integral blind-mate system, an integral locking system, float mounts, panel-mount clips, and board locks. (Contact company for pricing and availability.) Positronic Industries www.positronic.com/scorpion

Recessed subracks improve enclosure EMC Pixus enclosures with recessed subracks within the enclosure frame prevent damage to card modules, limit exposure to dust, and offer additional EMI/RFI protection for improved electromagnetic compliance (EMC). Initially for

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Packaging & Interconnections 7U and 9U enclosures, the option can be recessed in various depths according to the customer’s requirements, accommodating 6U pluggable boards with 1U to 3U of space for various fan/airflow configurations, or 3U pluggable boards with 4U height. The design allows subracks and boards to be completely protected inside the enclosure frame; an optional side or bottomhinged door allows the case to be fully enclosed or even locked. Backplanes available include OpenVPX, CompactPCI/2.16, PCIe Gen2 or Gen3, VME64x, VXS, or custom. (About $2,500, depending on volume and configuration — available now.) Pixus Technologies www.pixustechnologies.com

Battery holder is free of printed circuit board Designed to allow secure “off-board” mounting of CR2032 coin-cell lithium batteries, Snap Dragon BHSD-2032 patented battery holders offer designers the flexibility to locate batteries anywhere there is physical room in a product — no soldering tools, chemicals, reflow/wave processing, or circuit board is required. Units can also be board mounted if desired, withstanding multiple 260°C solder reflows. The two standard-size (3.6 x 0.38-mm) power terminals on the LCP-resin base (solder lug) can serve as male connectors for mating with common quick-connect female terminals, or accept wire leads through holes in the nickel-plated phosphor-bronze/gold-flash terminals. The CR2032 battery is installed into the cover piece, and then snapped onto to the base piece to securely Buy Now hold the battery in place. (From $0.54 ea / 5,000 — delivery normally from distributor stock.) Memory Protection Devices www.batteryholders.com/snap-dragon.php

Feature-rich enclosures meet NEMA 4X reqs In-Box plastic electronic enclosures have the design features and attention to detail you would expect in consumer enclosures, but have been designed to cope with extremely demanding industrial environments. The NEMA 4Xrated units feature concealed mounting screws, and all lids — including the transparent Polycarbonate models — offer recesses for mounting product labels or large membrane keypads. Sixteen standard sizes are available with external dimensions ranging from 3.30 x 3.22 x 2.16 in. to 11.89 x 9.13 x 4.33 in. The enclosure are made of ABS (UL 94 HB) or Polycarbonate (UL 94 V-2); ABS models are impactrated to IK07 (2 joules), Polycarbonate to IK08 (5 joules). Standard color is light gray (RAL 7035). (From $18 — available now.) OKW Enclosures, Bridgeville, PA www.okwenclosures.com

OVER 800 STYLES AND OPTIONS IN STOCK Suitable for applications subject to high amounts of vibration and shock, Mill-Max pins and receptacles are available in diameters from .008” (.20mm) to .250” (6.35mm). Receptacles feature a 4 or 6 finger beryllium copper or beryllium nickel contact to ensure integrity of connection for use in the harshest environments. Don’t see what you need? Rapid prototyping and custom designs are our specialty.

www.mill-max.com/EP621

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Product mart

Electronic Products Presented by the Manufacturer

Turbo LightÂŽ Waterproof Led Panel Indicators

TurboÂŽ Miniature Piezoelectric Alarms

Tiny (approx.1â&#x20AC;?x1â&#x20AC;?) LED Panel Indicators provide BRIGHT output with super-sleek design. Available in variety of voltages and output up to 14,500 cd/m2! Rugged, tamper-proof, loprofile panel mount design is IP68 and NEMA 4X. Available in 5 colors and 3 brightness levels. ISO 9001:2000 registered company â&#x20AC;&#x201C; all products made in the USA.

Tiny (approx.1â&#x20AC;?x1â&#x20AC;?) piezoelectric alarms provide LOUD output with a super-sleek design. Available in variety of voltages and output up to 103dB! Rugged, tamper-proof, lo-profile panel mount design is IP68 and NEMA 4X. Optional manual volume control offers increased attenuation. ISO 9001:2000 registered company â&#x20AC;&#x201C; all products made in the USA.

Floyd Bell Inc.

Ultraâ&#x201E;˘ Loud Piezoelectric Alarms

Voice-Capable Alarms Replace Ambiguous â&#x20AC;&#x153;Beepâ&#x20AC;?

Tel: (614) 294-4000 Fax: (614) 291-0823 sales@floydbell.com www.floydbell.com

Ultra Loud selection of piezoelectric whoops, warbles, sirens, beeps and more offers 1000Hz lower frequency than industry counterparts. Available in variety of voltages and output up to 108dB! Rugged panel mount products are IP68 and NEMA 4X when used with optional gasket. ISO 9001:2000 registered company â&#x20AC;&#x201C; all products made in the USA.

Floyd Bell Inc.

Tel: (614) 294-4000 Fax: (614) 291-0823 sales@floydbell.com www.floydbell.com

Sometimes a â&#x20AC;&#x153;beepâ&#x20AC;? or â&#x20AC;&#x153;whoopâ&#x20AC;? doesnâ&#x20AC;&#x2122;t convey enough information. t "OOPVODFSÂ&#x2122; 4FSJFT BMBSNT GSPN 'MPZE #FMM QMBZ B QSF SFDPSEFE audio message or voice instructions up to ten seconds VQ UP E# t $IPPTF GSPN TUBOEBSE NFTTBHFT i8BSOJOH w PS DVTUPN NFTTBHF QSPEVDUJPO "OOPVODFSÂ&#x2122; 4FSJFT BMBSNT DPNF TUBOEBSE XJUI RVJDL DPOOFDU UFSNJOBMT BOE WPMUBHF SBOHF UP mU ZPVS BQQMJDBUJPO

Floyd Bell Inc.

888-FLOYD-BELL sales@floydbell.com www.floydbell.com

Very High Resolution, Low Distortion Lenses Very High-Resolution 29MM F/3.0 lens with minimal distortion and a flat field, used for measurement, machine vision and other high performance applications. Custom packaging, integrated filters and custom aperture ratios available. View outline drawing and detailed specs. Compatible with our focusing C-Mount adaptor. 19mm barrel, offered in a wide range of focal lengths. Design assistance available for custom lens assemblies.

advertiser index This index is provided as an additional service. The publisher does not assume any liability for errors or omissions. Absopulse Electronics Ltd.. . . . . . . . . . 54

KOA Speer Electronics, Inc. . . . . . . . . . 23

Advanced Power Solutions . . . . . . . . . 22

Linear Technology Corporation . . . . . . . . . . . Cover 4, 13

Agilent Technologies, Inc. . . . Cover 2, 41 AKM Semiconductor, Inc. . . . . . . . . . . 49 Allied Electronics Inc. . . . . . . . . . Cover 3

Universe Kogaku Lenses

Astrodyne Corp. . . . . . . . . . . . . . . . . . 54

Tel: 516-624-2444 info@ukaoptics.com www.ukaoptics.com/ new_top-29.html

Avnet Electronic Marketing. . . . . . . . . . 3 BUD Industries,Inc. . . . . . . . . . . . . . . . 26 Caton Connector Corporation . . . . . . 27 Coilcraft, Inc. . . . . . . . . . . . . . . . . . . . . 10 CUI Inc. . . . . . . . . . . . . . . . . . . . . . . . . 30 Digi-Key Corporation . . . . . . . Cover 1, 2 Equipto Electronics Corp. . . . . . . . . . . 25

â&#x20AC;&#x153;NomexÂŽâ&#x20AC;? Insulating Tubing & Bobbins NomexÂŽ is a calendered, aramid insulation paper that, when wound into an insulating tube with appropriate binders, offers superior high temperature resistance and high dielectric strength in insulating tubing and bobbins. NomexÂŽ also possesses excellent mechanical toughness, resilience and high mechanical strength. Full PDF Lit available at www.pptube.com.

Precision Paper Tube Company Phone: 847-537-4250 Fax: 847-537-5777 sales@pptube.com www.pptube.com More Than 75 Years - The Original

Floyd Bell Inc. . . . . . . . . . . . . . . . . 20, 60 GAIA Converter Inc. . . . . . . . . . . . . . . 27 GlobTek, Inc. . . . . . . . . . . . . . Cover 1, 53 Hammond Manufacturing Company Inc. . . . . . . . . . . . . . . . . . 24

Maxim Integrated Products, Inc. . . . . . . 9 Memory Protection Devices, Inc. . . . . . 5 METcase . . . . . . . . . . . . . . . . . . . . . . . . 57 MicroPower Direct, LLC . . . . . . . . . . . 55 Mill-Max Manufacturing Corp. . . . . . . 59 Mouser Electronics . . . . . . . . . . 7, 16, 17 MS Kennedy Corporation . . . . . . . . . . 42 National Instruments . . . . . . . . . . . . . 15 Omega Engineering Inc. . . . . . . . . . . . . 1 Pico Electronics, Inc. . . . . . . . . . . . . . . 48 Pduke Technology, Inc . . . . . . . . . . . . 53 Precision Paper Tube Company. . . . . . 60 Rigol Technologies. . . . . . . . . . . . . . . . 51 RTG, Inc. . . . . . . . . . . . . . . . . . . . . . . . 56

Integrated Power Designs, Inc. . . . . . . 31

Stanford Research Systems, Inc. . . . . . 39

International Manufacturing Services Inc. . . . . . . . . . . . . . . . . . . 40

State of the Art, Inc. . . . . . . . . . . . . . . 45

IXYS Corporation . . . . . . . . . . . . . . . . 28

â&#x20AC;&#x153;Nomexâ&#x20AC;? is a registered trademark of the DuPont Co.

Master Distributors . . . . . . . . . . . . . . . 21

Hittite Microwave Corporation . . . . . . 37

International Rectifier . . . . . . . . . . . . . 33

ÂŽ

Master Bond Inc. . . . . . . . . . . . . . . . . . 58

IXYS Integrated Circuits Division . . . . 47

TDK-Lambda Americas, Inc. . . . . . . . . 29 TRACOPOWER . . . . . . . . . . . . . . . 52, 54 Universe Kogaku (America), Inc . . . . . 60 Zilog Inc. . . . . . . . . . . . . . . . . . . . . . . . 34

Keystone Electronics Corp. . . . . . . . . . 19

For Reprints contact Wrightâ&#x20AC;&#x2122;s Media 877-652-5295

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10k

Fast, Low Power Data Acquisition ®

Achieve high precision on a tight power budget with the LTC 6362. Designed to drive 16- and 18-bit SAR ADCs on a single 5V 1mA supply, this fully differential amplifier features 200µV max VOS, input-referred voltage noise of just 3.9V/ Hz, –116dBc distortion at 1kHz, and 18-bit settling in 550ns. The LTC6362 easily scales and shifts AC- or DC-coupled signals to the input range of the ADC. It is ideal for driving the 18-bit 1.6Msps LTC2379-18 ADC with a digital gain compression feature ® that sets the full scale range to 10% to 90% of the reference voltage. For optimal system performance, the LT 5400 precision matched resistors maintain high accuracy over temperature and common mode voltage range.

Differential SAR ADC Amps Description

LTC6362

5mW, 18-bit settling in 550ns

LT6350

±5V, 1.9nV/ Hz, integrated resistors

LTC6247

1mA, 180MHz GBW

LTC6253

3.5mA, 720MHz GBW

LT6203

3.5mA, 100MHz GBW, 1.9V/ Hz

LT6201

165MHz GBW, 0.95nV/ Hz

LT1469

90MHz GBW, 75µV max VOS

Amplitude (dBFS)

Part Number

LTC6362 Driving the LTC2379-18 0 –10 –20 –30 –40 –50 –60 –70 –80 –90 –100 –120 –130 –140 –150

VS = 5V, 0V VOUTDIFF = 8.9VP–P HD2 = –116.0dBc HD3 = –114.9dBc SFDR = 110.1dB THD = –108.0dB SNR = 101.2dB SINAD = 99.9dB

Info & Free Samples www.linear.com/product/LTC6362 1-800-4-LINEAR

Design Note DN502 www.linear.com/dn502

100 200 300 400 500 600 700 800 Frequency (kHz)

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