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While working on the content for this MAY Edition of TimesTech Magazine, I noticed how restrictive the number of pages in a Magazine can open the world of electronics. Challenges undertaken but the believe extended by everybody was enough to make it's a reality. We see so many professional papers that were introduced to a few dozen people who attend convention and seminar sessions that could be of great interest to this Publication's Audience once they are properly converted to a Magazine Article format. Increasingly, engineers are sharing “DRAFTS” of what could be material of great interest to our readers, posted as updates on Social Media that only reach a restricted group of “Followers.” Often, that content contains valuable information that could be expanded into an extremely motivating Article. To those authors, please reach out to TimesTech.in. We can help share your efforts with the Engineering and Design Community and open doors to valuable interactions and additional business. We have interacted with several companies and engineers at recent Trade Shows and we have seen many interesting developments that we would like to share. Unfortunately, the little information we could collect is not sufficient to create a News Report, much less a serious Article for the Magazine. At certain stages of development, we understand only those in charge can provide the level of information our publication requires. Again, we would like to reiterate that we have multiple channels where we could—working together—make your work known. TimesTech, Website and Magazine is the perfect channel to discuss Technology at an early stage with an interested audience, particularly for development platform providers. In the last three years, we have invested heavily to reach out and personally meet industry leaders, and we are developing a new Article Series to reflect much of what we are learning. But as with any Technical Magazine, we need direct collaboration—even sometimes for things that are quite traditional, such as writing a product review. While some Companies are used to submitting their products for Media to review, Technology and Parts Manufacturers are less accustomed to the process (or not at all). TimesTech doesn't intend to evaluate products in a subjective way. We understand that writing for developers and even diy enthusiasts requires a different approach and we publish reviews that explain why our readers need what you have. The entire TimesTech team continues to work to fulfill that vision. We sincerely hope you enjoy reading the May issue of our magazine.

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Tech News

Government Bodies float tenders for 500 EV charging stations

E-waste sector will create half million jobs in India by 2025: IFC The electronic waste sector will create 4.5 lakh direct jobs by 2025 and another 1.8 lakh jobs in the allied sectors of transportation and manufacturing, International Finance Corporation (IFC), a member of the World Bank group, said. The IFC, which has been working in the e-waste sector since 2012, said under a programme launched by it in 2017, over 4,000 metric tons of e-waste has been collected from citizens and corporations and recycled responsibly under the programme launched by it in 2017, over 4,000 metric tons of e-waste has been collected from citizens and corporations and recycled responsibly under the programme. Praising the IFC at the conference on 'E-Waste Management in India: The Way Forward', Environment Ministry official Sonu Singh said the government was happy to see the commitment from the IFC in helping the sector grow in a responsible manner. "The e-waste sector has significant potential to contribute to the country's economy and generate employment. The electrical and electronics industry has been cooperating with the government and has shown considerable initiative for handling e-waste responsibly. "If the responsibility is shared between the government, producers, and consumers of ewaste, then efficient management of e-waste can be successfully achieved in India. We are happy to see the commitment from IFC in helping the sector grow in a responsible manner,â&#x20AC;? said Singh, Joint Director, Hazardous Substances Management Division, the Ministry of Environment.

Government bodies like Energy Efficiency Services Limited (EESL), Rajasthan Electronics and Instruments Limited (REIL) and National Thermal Power Corporation (NTPC) has floated tender for over 500 electric vehicle charging stations in the last two months. The announcements came just after the government notified Faster Adoption and Manufacturing of Electric Vehicles (FAME-II) scheme in India on February 29. The scheme proposed for establishment of 2,700 charging station in metros, other million-plus cities and smart cities. Delhi-based government body EESL has invited bid to set-up 200 fast chargers in Delhi and Andhra Pradesh. The bidder will have to give three years of on-site warranty and annual maintenance contract. Moreover, it will be also responsible for the finding location, supply and installation. Similarly, a public sector enterprise, Rajasthan Electronics and Instruments Limited (REIL), had floated a tender to put 270 electric vehicle charging points across various locations in the country. Out of the 270 chargers, 70 normal AC chargers, 170 DC fast chargers, and 30 DC fast chargers will be installed in cities like Ranchi, Bengaluru, Goa, Shimla, Hyderabad, Agra as well as on the Delhi-Jaipur-Agra and Mumbai-Pune highways. The bidder will have to undertake the annual maintenance services for a period of five years.

Apple Starts iPhone 7 Manufacture In India Giving an impetus to its India manufacturing plans, Apple has started the assembling of iPhone 7 at its supplier Wistron's facility in Bengaluru. Taiwanese industrial major Wistron already assembles iPhone 6S in the country. "We are proud to be producing iPhone 7 in Bengaluru for our local customers furthering our long-term commitment in India," Apple told IANS on Tuesday. The assembling of iPhone 7 began last month. Mr Wistron, which last year announced plans to invest Rs. 3,000 crore in the Narasupra industrial sector in Karnataka's Kolar district, started Apple operations with assembling low-end iPhone SE and later iPhone 6S. According to Wistron India head Gururaj A, the company would set up an iPhone making unit in the 43 acres of land allotted to it, with employment potential of over 10,000 people. The new Wistron facility is also set to manufacture a wider range of Apple's devices. Apple is slowly but steadily strategizing its plans to make deeper inroads in a country where over 450 million people use smartphones, and assembling iPhone 7 is another step towards gaining more ground. According to Tarun Pathak, Associate Director at Hong Kong-based Counterpoint Research, the Indian electronics market is growing fast and has gained a significant advantage on some of the competing countries. "I think to start with, it makes sense for Apple to localize assembling of models that have the potential to scale up and then slowly expands it to entire portfolio," Mr Pathak told.

08 TIMESTech | May 2019

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Tender Issued for 1.7 MW of Solar with Battery Energy Storage in Andaman and Nicobar India launches first electronic intelligence-gathering satellite The Indian Space Research Organisation (ISRO) has launched the first electronic reconnaissance satellite developed by the state-run Defence Research and Development Organisation (DRDO) to detect enemy radar and gather communications intelligence. Launched on 1 April from the Satish Dhawan Space Centre in Sriharikota aboard the indigenously designed Polar Satellite Launch Vehicle-C45 (PSLV-C45), the 436 kg Electro-Magnetic Intelligence Satellite (EMISAT) was placed into a 748 km sun-synchronous polar orbit about 17 minutes after lift-off, officials said. The ISRO’s Telemetry Tracking and Command Network in Bangalore is expected to bring the satellite to its final operational configuration, according to the Indian government’s Press Information Bureau (PIB). Official sources told Jane’s on 2 April that EMISAT’s payload was designed by the DRDO’s Defence Electronics Research Laboratory in Hyderabad as part of Project Kautilya, while the ISRO built the satellite’s body. The entire development project was completed in eight years and is modelled on Satellite with ARgos and ALtiKa (SARAL): a co-operative altimetry technology venture for oceanographic studies between the ISRO and France’s National Centre for Space Studies (CNES). Industry sources said the EMISAT is a derivative of the ISRO’s Indian Mini Satellite-2 (IMS-2) series of electronic intelligence satellites, which has a maximum launch weight of 450 kg and a payload of no more than 200 kg.

There has been a steady uptick in solar plus storage tenders in India lately. The Rajasthan Electronics and Instruments Limited (REIL), a public-sector enterprise operating in the electronics, information technology, and renewable energy segment, is the latest government agency to issue a tender to set up 1.7 MW of solar photovoltaic (PV) projects with battery energy storage system (BESS) in Andaman and Nicobar islands. This is an engineering procurement construction (EPC) tender, and the bid-submission deadline is May 4, 2019. A pre-bid meeting will be held on April 10, 2019. Bidders are required to pay bid security of ₹5 million (~$0.072 million). The projects will be developed on a turnkey basis. The scope of work includes the design, engineering, procurement, supply, packing, forwarding, transportation, unloading, storage at the site, site development, construction, erection, installation of equipment, testing and commissioning along with the associated transmission system. A 1 MW solar PV project with 0.5 MW/0.5 MWh (at the point of coupling) BESS will be set up in Havelock Island while another 0.7 MW solar PV project with 0.5 MW/0.5 MWh (at the point of coupling) BESS will be set up in Neil Island. The successful bidder will need to provide ten years of operation and maintenance services. The selected contractor will also have to install and set up the communication infrastructure to provide telemetry data to the state load dispatch center (SLDC). The bidder needs to also install and set up an ‘Energy Forecasting System’ to forecast the energy generation by the project at both of the locations on the island. The successful bidder will have to run the project for one year after commissioning for performance demonstration for the final acceptance. After that, the 10-year operation and maintenance contract will begin.

Gartner said that global IT spending will grow 1.1% in 2019 Continuation of enterprise IT spending in enterprise enterprise market continues to continue development in the market with traditional (nonclaud) offerings for new, cloud-based options. Worldwide IT expenditure is estimated to be $ 3.79 trillion in 2019, a growth of 1.1 percent from 2018, according to Gartner’s latest forecast, the data center system segment will experience the biggest drop in 2019 with a reduction of 2.8 percent. Due to the expected average sales price (ASP) in the server market driven by adjustment in the pattern of the expected component cost, mainly. Gartner’s research vice president John-David Lovelock said, “The strengthening of the US Dollar has increased the income of the US dollar, which is expected to revise the IT spending of 2019 from the previous quarter.” “Remember about 2019, the uncertain economic and political environment and the tremendous instability of the recession due to trade wars, the US dollar is going to be strong. In 2019, technology product managers along with

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their portfolio products will blend in with balance products. And they have to get more strategic and development will be in 2019 with those services which will be leveled with those big mare. Enterprises, who spend traditional (non-clock) offerings for new, cloud-based options, want to continue development in IT enterprises software market. In 2019, the market is projected to reach $ 429 billion from $ 399 billion to $ 7.1 billion in 2018. The biggest disorder has shifted to the application software so far, but Gartner expects the software infrastructure has increased in the near term, especially as a service (iPaas) and a service (aPaas) application platform. In the integration platform.

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Maiden Global Economic Zones (GEZ) Expo & Convention 2019 – Ground Report The first-ever Global Economic Zones (GEZ) Expo & Convention 2019 was inaugurated by Shri Amitabh Kant, CEO of the NITI Aayog at The Ashok, Chanakyapuri, New Delhi. Organised by the Export Promotion Council for EOUs & SEZs (EPCES) in collaboration with WBF International Centre Services (WICS), and managed by the Exhibitions India Group (EIG), the event provides a platform that allows sharing of good practices and experiences between special economic zones and highlights the role they have played in the development of the country. Speaking during the special address at the inaugural ceremony, Shri Amitabh Kant, CEO of the NITI Aayog said, “I am a firm believer in the fact that it is not possible for India to grow at high rates of 9-10% over a long period of time without exports. While we are growing at about 7%, we need to grow at 9-10% year after year for the next three decades or more to be able to lift our very young population above the poverty line. This is just not possible without exports.” He further added, “No country post World War II, whether it was Japan, Korea or China, has grown without exports. And, therefore, for exports to grow, we need the ease of doing business. On the subject of trading across borders, a lot has to be done. We are currently placed 86 globally, and need to become number one. Also, it is not possible to grow without size and scale, which can happen only

10 TIMESTech | May 2019

if we are able to create large economic zones, as has happened in Singapore and China.”

results in the foreseeable future. So typically we need to focus our efforts in manageable pockets.”

Talking specifically about the development activities in the State of Haryana, Shri Depinder Singh Dhesi, Chief Secretary, Government of Haryana said, “Our government has taken a decision, in principle, to set up what we call the ‘Panchgrams’, the five ‘Mega Cities’, each one having an area of 50,000 hectares; so cumulatively 2,50,000 hectares of activity all along the expressways. Of course, these things take time. The concept will evolve gradually, also taking into account what is happening with the rest of the nation and the world. As part of the Delhi-Mumbai Industrial Corridor, we already have a number of early-bird projects and definitely some of these will be in the shape of economic zones.”

Speaking about the event, Siddharth Singh, Chairman, WICS, India said, “This is the first event of its kind globally that is fully dedicated to special and other economic zones. Through this event we hope to provide a platform where we could discuss what role SEZs can play in the economic development of the country; about the success stories, where have we gone wrong, what were the pitfalls; and what are the loopholes that need to be plugged. We considered it necessary to provide a platform where these issues can be discussed between the stakeholders and policymakers; and that was the idea behind organising this event.”

Shri Anup Wadhawan, Secretary, Ministry of Commerce & Industry, Government of India said, “SEZs are extremely important instruments, if you look at their evolution historically, and the role they have played across the world, particularly in countries like China, and also in countries like India. For an economy-wide reform of the policy and regulatory framework, and of the soft and hard infrastructure required for economic development, this is not a practical exercise that is likely to yield

The inaugural session also witnessed the release of a knowledge paper by Mazars India titled, “Specializing the Easy Footprint”. The paper talks about the existing SEZ scenario in the country, and how policies, both at Union and State level, are encouraging manufacture investment and trading activities through a slew of incentives and rebates. At the launch of the knowledge paper, Ankur Malhotra, Director, Mazars Advisory, LLP, India said, “We have been closely working with Exhibitions India Group to conceptualise a range

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promotional needs of EOUs & SEZs in the country. It has a clear mandate to attract investment in SEZs (including FDI) and to market Indian SEZs abroad in order to attract units to SEZs. EPCES represents major industrial sectors, like textiles, garments & yarn, gem & jewellery, leather goods, food & agro products, electronics & software, pharmaceuticals & chemicals, engineering, minerals, granites & other stones, plastic & rubber goods, etc. EPCES is the only scheme-specific and multi-products exports promotion council. About Exhibitions India Group (EIG) of white papers including smart practices and logistics reforms shaping the Indian landscape. We are delighted to present this knowledge paper that illustrates the progress of economic zones in the country being centered around the EZ footprint.” Shri Babu Lal Jain, Chairman, Foundation for MSDG, India said, “The Foundation for Millennium Sustainable Development Goals, was formed in 2011 with a view to uplift those people who are below the poverty line and are suffering from the non-availability of the desired resources. The foundation is at the forefront in spreading awareness on government social welfare programmes, especially at the grass-

roots level.” Concluding the inaugural ceremony, Shri Prem Behl, Chairman, Exhibitions India Group stated, “The Union government has successfully introduced amendments to the SEZ Act 2005 in an effort to increase investment and manufacturing activity in these zones. It will be a while before the results of these actions will show. Meanwhile, the economy continues to reap benefits that trickle down right up to the labour force.” About Export Promotion Council for EOUs and SEZs (EPCES)

Exhibitions India Group is a trade promotion organisation creating opportunities for investments, joint ventures and technology transfers. Exhibitions India Group acts as an interface between businesses, government, academia, society, media, etc. Exhibitions India Group has been in existence since 1987, and is committed to providing satisfaction to its customers by organising quality and focused international trade shows through exceptional services, employee involvement, market intelligence and continual improvement.

EPCES has been set up by the Ministry of Commerce & Industry, Government of India, to service the export

Keysight Accelerates AAC Technologies’ Commercial Introduction of High-Performance 5G mmWave Front-End Solutions Keysight Technologies, announced that AAC Technologies (AAC), a leading provider of advanced miniaturized technology, used Keysight’s suite of 5G solutions to introduce high-performance 5G mmWave front-end solutions for next generation mobile phones and base stations. Following AAC’s announcement to invest in a research and development center in Singapore last year, the company chose Keysight’s 5G Waveform Generation and Analysis Testbed to validate its new 5G millimeter-wave (mmWave) radio-frequency front end (RFFE) solutions. The testbed leverages Keysight’s metrology-grade signal source and signal analyzers, as well as Keysight’s industry-proven software tools – Signal Studio (a signal creation tool) and 89600 VSA (a demodulation and vector signal analysis tool) – to confidently validate that their new 5G mmWave RFFE solutions comply to the latest 3GPP Release 15 standards.

leading provider to deliver 5G components that are critical for offering fast, reliable 5G connectivity to end-users,” said Roger Nichols, 5G program manager at Keysight. “Keysight’s 5G solutions, widely adopted by the mobile ecosystem around the world, enable wireless component makers to accurately validate designs for devices and base stations under a multitude of technically demanding scenarios.” AAC’s 5G mmWave device incorporates Anokiwave’s mmWave Core integrated circuits (ICs) to address demanding 5G technical requirements in a small form-factor by leveraging energy-efficient mmWave beamformer integrated circuits. AAC also selected Keysight’s high performance wafer-level measurement solutions (WMS), which are critical for optimizing device modeling to accelerate design validation workflow for radio frequency (RF) and mmWave components.

“We are proud to play an instrumental role in empowering a

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Going

Wireless

with wide bandgap semiconductor solutions Benefits of gallium nitride (GaN) HEMT in wireless power transfer

Milko Paolucci Applications Engineer for Consumer and Industrial Wireless Charging, Infineon Technologies AG

Peter Green Applications Manager for Renewable Energy, Infineon Technologies Americas Corporation

12 TIMESTech | May 2019

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ireless charging for portable devices dispenses with the need for conventional charger adapters with their associated cables and connectors. Although the technology has existed for some time, it only quite recently that smart phones, tablets and notebooks have been introduced that have this feature. It is expected to become widely adopted within the next few years. GaN technology has many unique attributes compared to the next best silicon alternatives. In this technical article the authors provide an introduction to the benefits of GaN power devices in class-D radio- frequency (RF) power amplifiers used in wireless charging applications with a special focus on the advantages of GaN HEMT devices over MOSFETs in the two power amplifier topologies that have been proposed for wireless power transfer according to the baseline specification of the Air Fuel Alliance.

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Resonant wireless charging and the Air Fuel Alliance standard Wireless charging systems currently available for some smart phones, tablets and other portable devices are mostly based on the inductive (Qi) standard, which operates by inductive coupling at frequencies in the 100 to 300 kHz range. This system allows charging of a single device only and this needs to be placed very close to the charger in a specific orientation. With the increased interest in wireless applications for transmitting power in the consumer market, alternative topologies such as Class-D enter officially under the attention of power conversion designers to leverage the advantages of resonant coupling.

TIMESTech | May 2019

Cover Story

These topologies are not new and are already used successfully in RF applications where the terminology â&#x20AC;&#x153;amplifierâ&#x20AC;? is widely used to describe them. The main appeal for these topologies employed in the transmitter section of the wireless charging system as shown in the Figure 1, is the achievable high efficiencies at operating frequencies in the MHz range. The Air Fuel Alliance (formed in 2015) proposes a method switching at 6.78MHz in the ISM (industrial, scientific and medical) frequency band that uses resonant inductive coupling in which high Q factor resonators enable power transfer over much greater distances using the much weaker magnetic fields in the peripheral regions. This enables the charging of several devices at the same time, which can be placed in any orientation. Faraday's law states that an electric potential is generated by a coil of wire when the magnetic flux enclosed by it varies. In wireless power transfer an RF power amplifier drives a power transmitting unit (PTU) consisting of a coil in a tuned circuit to produce a varying magnetic flux. A power receiving unit (PRU) also consisting of a coil in a circuit tuned to the same frequency, intersects the magnetic field so that a voltage is induced. This voltage depends on the rate of change of flux and number of turns. Output from the receiver coil is rectified and converted to the desired level for the portable device being charged. Coupling depends on the separation between the two coils, defined by the coupling factor k. A k of less than 0.5 represents a loosely coupled system as used in magnetic resonance coupling. Figure 1 shows the system blocks of the PTU and PRU. Microcontrollers with Bluetooth communication are used to request and regulate the amount of power transmitted as required by the devices being charged.

Figure 2: Class-D power amplifier simplified schematic

In order to understand the Class-D functionality it is useful to divide the schematic in two main blocks: 1. The switches: these will create a rectangular periodic waveform with VIN amplitude. 2. The filter: LC filter will create a sinusoidal waveform, removing as much as possible the harmonics, at the same frequency of the incoming squared waveform. The further operation done by the LC resonator is to block the DC voltage, therefore across the load there will be only an AC signal around the zero level. Given this simple understanding the voltage across the load can be easily calculated considering a sinusoidal current given by the first harmonic of the filter. At the resonant frequency the LC impedance is zero. The output voltage (peak to peak) at the load, considering the first harmonic, will be: VIN*2 VOUT = The output power will therefore be: VOUT 2 POUT = RLOAD In the design phase of a wireless charging transmitter normally the output power of the transmitting coil is one of the inputs (which is here indicated with POUT), meanwhile the input voltage is one of the design parameters. The second equation above provides, once the output power is known, a method to determine the input voltage necessary to reach that power (assuming 100% efficiency). VIN =

Figure 1: Wireless power transfer system blocks

Advantages of using GaN in Class-D power amplifiers Figure 2 shows a simplified schematic for a Class-D amplifier, which is very similar to an inverter which is converting a DC input to an AC output.

14 TIMESTech | May 2019

POUTRLOAD

The Class-D topology works in ZVS turn on commutation since the operating frequency is 6.78 MHz, therefore the commutation losses could be very high leading to low efficiency. This also depends on the input voltage but normally, since the transmitting antenna is not capable of high current operation (typical currents for transmitting antennas are in the range of 1-2 A) in order to be able to transmit a significant power, relatively high input voltages (50100 V) have to be used. So the combination of high voltage and high switching frequency requires ZVS operation. One of the most common methods to implement ZVS operation is to use an additional series LC network to create a triangular shaped current higher than the load current.

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IRL80HS120

VDR_HS [RG_EXT] RG_HS VIN

The simulations above were run with a pure resistive load, however considering that ZVS cannot be guaranteed under all working conditions the switching losses are also considered. Low QGD is desirable in this case to avoid excessive losses.

Tj TC_HS

VG_HS

Tcase [RTHJA] RTHCA_HS

VDR_HS TAmbient 5.89u

IRL80HS120 [RG_EXT] TAmbient

25 V1

RES_MID

CResonator

VSW

RG_LS VDR_LS

VDR_LS

LResonator

93.56

VSW

LZVS 330n VOUT

70 VIN

Tj TC_LS

Tcase

VG_LS

[RTHJA] RTHCA_LS

CZVS 1u ZVS_MID

RLOAD 20

TAmbient

ZVS_ESR

210m

Figure 3: Class-D simulation schematic with ZVS network

In order to guarantee ZVS operation the current created in that way has to ensure the transition of the middle point of the half bridge (VSW in Figure 3) before the dead time is expired. This gives the following design rule for the Class-D topology: QOSS TCOM = I Where QOSS is the output charge of the switch evaluated at the input voltage and â&#x2C6;&#x2020;I is the ripple current generated by the ZVS network (LZVS + CZVS). This equation shows that the lower the output charge of the switch the lower will be the ZVS ripple current, or in other words if the ripple current is fixed the lower is the QOSS the easier it will be to guarantee ZVS transition. The power losses related to the ZVS network are the dominant losses. They can be calculated as:

In terms of losses, GaN also has advantages compared to silicon solutions. It is possible simulate a class-D topology complete with ZVS network to check the performance (based on device models) and see the improvements expected using the GaN technology to replace silicon. As represented in Figure 4, the reduction of power losses between silicon and GaN is in the range of 30%. The simulations were run with equal dead times, however dead time optimization would further reduce the losses for GaN. It is also noticeable that the device area is half as much for the GaN solution, creating an increase of power density of more than double. Losses contribution comparison 3.50E-01 3.00E-01 2.50E-01 2.00E-01

Gate Charge Switch ON

1.50E-01

Conduction Body Diode

1.00E-01 5.00E-02 0.00E+00

Silicon

GaN

PZVS = IZVS_RMS2 ESRZVS

Figure 4: Loss comparison of GaN and silicon solutions

Where the IZVS_RMS is the RMS current through the ZVS network and the ESRZVS is the parasitic equivalent resistance of the ZVS network, which is predominantly concentrated in the ZVS inductor.

Summary of benefits of GaN in wireless power applications

ZVS operation depends on the load appearing resistive, which requires a suitable impedance matching network to be included. The system will maintain ZVS operation within a defined set of corner impedance values known as an impedance box. It is preferable to use switches with low QGD to yield lower losses in case of non-ZVS operation.

Ĺ¸ Lower gate charge loss

So, what advantages GaN can provide in Class-D? At system level the largest loss contribution is the DC resistance of the ZVS inductor and other resistances inserted in the ZVS path accounting for more than 50%. Once the ZVS inductor is chosen, these losses are related to the ripple current and therefore to the QOSS device parameter. Reducing QOSS will greatly improve the losses. The remaining losses are equally distributed between the upper and lower switches since this topology works with 50% duty cycle. At the device level the highest contribution comes from the gate charge (QG) therefore a device with lower gate charge is essential but also a lower threshold voltage is also desirable since this will lower the driving voltage allowing a further reduction of the driving losses.

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The advantages of GaN devices in wireless power transfer, which apply for class-D topology discussed are summarized as follows: GaN devices are typically driven with 5 V gate drive voltage as opposed to standard silicon MOSFETs typically driven around 10 V. The gate charge (QG) for the GaN device is about one fifth of that for a MOSFET or similar RDS(on) and VBRR, which results in dramatically lower gate drive current and far lower losses in the gate driver IC. In order to minimize gate charge loss it is preferable, not only choose low QG but also to use device technology with low gate threshold voltage allowing the designer to use lower driving voltage, decreasing therefore the overall losses related to the driving circuitry. The gate charge losses can be calculated as:

PGATE = QG_SYNC * f SW * Vdr Where the QG_SYNC is the gate charge at voltage Vdr without the QGD (since it is assumed a ZVS transition), fSW is the switching frequency and Vdr is the driving voltage.

TIMESTech | May 2019

Cover Story

Ÿ Body diode losses

Though GaN HEMT devices do not have an actual body diode like a MOSFET, they do exhibit a diode like behavior. Another important source of system losses is the body diode forward voltage, which is in fact higher in GaN devices. Losses occur due to the ZVS commutation during turn on, which can become relatively high if long dead times are chosen. To obtain best performance with GaN in class-D circuits the dead time should be reduced to avoid body diode conduction.

PDT =

VSD * IOUT * f SW * TDT

In the evaluation of the body diode losses it is important to compute the correct VSD value, which will vary with current and temperature. Ÿ Reverse recovery

Another contribution to the losses, which is difficult to quantify is the reverse recovery charge (QRR) associated with the body diode conduction during the dead time. Ÿ Since GaN devices do not include an actual body diode

structure in their structure, they have zero QRR. The reason why it is difficult to quantify these losses is mainly related to the fact that the QRR is highly dependent on the following operating conditions: forward current of the diode, di/dt, reverse voltage and temperature. The values provided in device datasheets are references for a designer measured under specific test conditions and these may have little relevance in the real application. Nevertheless with the relatively high switching frequency used in magnetic resonance power transfer, it is clear that a lower QRR will produce lower losses. The only question is related to the relative importance of these losses since the operating current and therefore the operating QRR are not high in this application.

Wireless charging design considerations when using GaN In the previous paragraph it has been explained why GaN technology provides many opportunities to increase the overall efficiency of the system. However, this does not come for free, the GaN technology has some attributes that need to be considered during system design. Design criteria to be taken into consideration: Ÿ Driving voltage accuracy

As specified in the datasheet, the absolute maximum rating for the VGS of a MOSFET is typically +/- 20 V. This provides the designer some freedom to keep the voltage regulator of the driving stage relatively simple and cheap. For GaN this is not the case. The absolute maximum rating is limited to roughly 5 to 6 V. This is mainly due to the diode nature of the gate structure. If during the operation the gate source voltage exceeds this limit in worst cases this could create severe damage to the device and at best reduction of the lifetime. For this reason the design of the voltage regulator used to create the driving voltage has to be done very carefully as the solution that works for silicon may not be suitable for GaN. The difficulties related to the capability of

16 TIMESTech | May 2019

keeping the gate source voltage below the absolute maximum rating are not only related to the driving voltage regulator accuracy but also to the operation during the dead time and the recharge of the bootstrap capacitor for driving the upper switch in the class-D implementation. During the dead time operation the bootstrap capacitor is recharged through the body diode of the lower switch. In the case of the GaN devices the body diode with high forward voltage provides an extra charge to the boot capacitor which could exceed both with spikes and with steady state the absolute maximum rating of the device. This overcharge depends on many parameters (bootstrap diode forward voltage, drain to source diode forward voltage, dead time, temperature), which has to be carefully evaluated. Ÿ Gate current

Behavior is different to silicon based products, in which gate is controlled through a gate oxide isolator. The gate connection for GaN devices takes the form of a Schottky barrier where the leakage current is consequently not in the range of nano-Amperes (nA) but milli-Amperes (mA). Care should be taken when selecting the gate drive voltage and drive network components. Ÿ Device area

As seen in the previous paragraph, GaN technology provides greater power density resulting from the low RDS(on) x Area figure. This results from the high conductivity of the electron gas (2DEG), which provides a very attractive feature to designers who want to increase the power density of their applications but also it creates some challenges. The fact that the area is smaller implies that there will be less contact area to extract the power dissipated inside the device. During the layout phase, the design of the power connections between the device(s) and PCB will be more challenging and the thermal resistance of the device could suffer. Since the most important thermal resistance is junction to ambient, which is mainly dictated by the PCB characteristics, the smaller dimensions of the GaN device package should not create too much additional thermal resistance. In any case particular care should be taken during the design of the PCB to minimize this thermal resistance since the smaller area of the GaN might partially counteract the advantage of the technology. Summary Energy efficiency, shorter charging time and higher power density have been on the agenda for engineers for a while in wireless power designs. The overall wireless charging market is growing at a rapid pace, requiring ever higher semiconductor performance to meet and even exceed endcustomers' needs. The application studies and measurements performed in this article demonstrate clear value for GaN HEMTs in wireless charging designs with class-D RF power amplifiers. GaN HEMTs allow us to push both efficiency and density frontiers in this application area.

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Test & Measurement

Anritsu Optical Spectrum Analyzer MS9740B Halves Evaluation Times

Ramp Up Production Line Efficiency for Optical Active Devices for 5G Mobile and Cloud Services Anritsu launch of its new Spectrum Analyzer MS9740B developed for evaluating the output characteristics of optical active devices used by optical communications systems.

processing times by up to half while overcoming problems of decreased measurement sensitivity caused by increased processing speed.

The MS9740B keeps the same measurement-sensitivity performance, functions, and size as its predecessor MS9740A while shortening measurement processing times by 50%, further improving production-line efficiency by optimizing the Spectrum Analyzer MS9740B optical receiver bandwidth settings, most commonly used by customers. This performance upgrade slashes optical active device inspection times and increases mass-production line efficiency.

Moreover, it retains optical active device (LD-Module, DFBLD, FP-LD, LED, WDM, and Optical Amplifier (NF and Gain)) measurement menu screens for evaluating devices. It supports all-at-once measurements of key evaluation items, such as optical center wavelength, level, OSNR, spectrum width, etc., and displays these results at one screen.

Development Background The spread of next-generation 5G mobile and Cloud communications services is expected to increase data traffic volumes massively. Networks supporting this infrastructure are experiencing explosive jumps in network traffic, which demands both increased module production and shorter inspection times to allow in-time deliver required for the rapid expansion and adoption of faster rate optical modules at 10G, 100G, and 400G bit. Product Outline The benchtop Optical Spectrum Analyzer MS9740B features wide dynamic range, high resolution, and fast sweep speeds over a wavelength range of 600 to 1750 nm. It supports multimode fiber input and is ideal for manufacturing and evaluating 850-nm band VCSEL modules. As well as keeping the same functions and performance as its predecessor, the MS9740B slashes measurement

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Key Feature Ĺ¸ Wide dynamic range and high-speed measurement at

optical receiver bandwidths used commonly by customers within production lines for optical active devices SMSR measurement at 45 dB minimum Maximum measurement processing time of 0.35s (sweeping 30-nm wavelength) Ĺ¸ Same key functions and performance as predecessor,

supporting various production-line environments Wide wavelength band (600 to 1750 nm) for evaluating all optical active devices Nine application menus for LD-module, WDM, etc., measurements Contact: Madhukar Tripathi, Anritsu India Pvt Ltd Mobile +91 9310 666466 Email : Madhukar.Tripathi@anritsu.com

TIMESTech | May 2019

IoT

INDUSTRY

Where NANOTECHNOLOGY The IoT and

MEET

Liam Critchley | Mouser Electronics The Internet of Things (IoT), Industrial Internet of Things (IIoT), and Industry 4.0 are significantly growing due to advances in the ability to record more accurate data and automated data analysis methods. Recent software, algorithm, and machine learning advances enabled the automation of many sensor networks to the point where an operator is not required unless notified by the system itself. These new sensor networks and data manipulation approaches are used in applications ranging from smart buildings to industrial production processes—where each environment is readily optimized based on the trends of the recently obtained data against the historical data. In many cases, they can automatically change the internal conditions themselves and will only notify the operator if an issue occurs or the data trends show that downtime is imminent. This has provided much higher efficiencies to a range of industries. While nanotechnology is not everybody's first thought when you think of the IoT, there are already ways in which nanotechnology is helping to propel this area of data optimization; and there will be areas that are likely to be used

18 TIMESTech | May 2019

commercially in the future. These areas range from the initial point-of-measurement to building an information exchange network using nanomaterials.

Improving The Capability Of Sensors At the heart of the IoT and Industry 4.0 are the sensors themselves. Perhaps the area that will benefit the most from nanotechnology is the initial data measurement. As software and data analysis approaches advance, they can work with a much greater amount of data; and the more accurate the initial data point is, the more accurate the whole IoT system is. The incorporation of nanomaterials as the “sensing materials” into various types of sensors is well-documented, with much greater efficiencies being afforded by their use. The small size of nanomaterials—in particular, 2D materials such as graphene—often provide a high surface area that can detect changes in an environment. Now, not every sensing mechanism is the same—some are remote, some are through absorption of molecules, and some are in response to a physical change (among others).

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IoT

Nanomaterials have various properties that enable these mechanisms to work efficiently—whether it is through measurable optical changes in the distance, adsorbing atoms at its surface, or the ability to be flexed, stretched, or compressed. Some nanomaterials can perform at least one, if not all, of these mechanisms. The high sensitivity, and therefore more accurate data points, is often due to the high electrical conductivity and charge carrier mobility of nanomaterials. When something is sensed (through adsorption, physical change, etc.), the sensing mechanism invokes a change in the electrical conductivity of the nanomaterial, which is then detected as a measurable response. Because the conductivity and charge carrier mobility within a nanomaterial are often high (i.e., high conductivity nanomaterials are usually used), the sensitivity is high, as very slight changes to the conductivity will provide a detectable response.

The Internet of Nano Things (IoNT)

possess a very small internal memory. Nevertheless, they can be placed in a specific location and transmit data to a larger nano-router, which then transmits the data over longer distances. Therefore, the nano nodes can often be the actual sensor component of the system. The nano nodes pass the data on to the nano-router, which is a nanomachine with a much larger computational power. Because they possess a much higher computational power, they act as an aggregator for all the surrounding nano nodes that obtain the initial data. They can then control the exchange commands between the nano nodes and send the information to the nano-micro interface device. These interface devices aggregate all the data from the nanorouters and transmit the data to the microscale (and vice versa) using a combination of nano-communication techniques and classical network protocols. The gateway then acts as the controller of the whole system and enables the data to be accessed anywhere via the internet. Conclusion Industry 4.0 is only just emerging and will continue to advance in the coming years. That is a given. However, even though conventional data transferring, cloud computing, and data manipulation approaches are used across many industries now, there may come a point—just like computing—where the transfer of data needs to occur through much smaller architectures. When the immediate need is there commercially, the groundwork being put into the IoNT will enable it to be used when Industry 4.0 really takes a hold across all industry sectors. About the author

The second area where nanotechnology can be combined with the IoT is in the creation of a physical network, composed of nanomaterials that facilitates the exchange of data through different components communicating with each other at the nano level. This is known as the Internet of Nano Things (IoNT). In terms of development, it is not yet at the level of other IoT systems, but it is attracting interest from the communication and medical sectors. One such example is in field-based applications, where remote sensing is required, or for measuring different points within a human body.

How The System Works As with any system, there are multiple components, and the IoNT is no different. There are also two common ways that these components communicate with each other, and these are through electromagnetic nano-communication (transmission and receiving of electromagnetic waves) and molecular communication (information encoded in molecules). As for the components themselves, there are four main areas of the IoNT that help to facilitate the transfer of information—these are nano nodes, nano-routers, nanomicro interface devices, and gateways. Nano nodes are the simplest and smallest component within the IoNT setup and is seen as a basic nanomachine. These small nanomachines are used to transmit data and perform basic computations. However, their small size (and energy) limits the distance that they can transmit data, and they

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Liam Critchley is a Writer, Journalist and Communicator who specializes in Chemistry and Nanotechnology and how the fundamental principles at the molecular level can be applied to many different application areas. Liam is perhaps best known for his informative approach and explaining complex scientific topics to both scientists and non-scientists. Liam currently has over 350 articles published across various scientific areas and industries that crossover with both Chemistry and Nanotechnology. Liam currently holds the position of Senior Science Communications Officer at the Nanotechnology Industries Association (NIA) in Europe and has spent the last few years writing for companies, associations and media websites located at all corners of the globe. Prior to becoming a writer, Liam completed two master's degrees in Chemistry with Nanotechnology and Chemical Engineering. Aside from writing, Liam is also a Member of the Advisory Board for the National Graphene Association (NGA) in the U.S., the global organization Nanotechnology World Network (NWN), and a Member of the Board of Trustees for GlamSci–A UK-based science Charity. Liam is also a member of the British Society for Nanomedicine (BSNM) and the International Association of Advanced Materials (IAAM), as well as a peer-reviewer for multiple academic journals. Source: https://www.mouser.in/blog/

TIMESTech | May 2019

IoT

Internet of THINGS

Vishal GOYAL Senior Technical Marketing Manager, Analog and MEMS Group, RF, Sensors and Analog Custom Products , Asean-ANZ and India, STMicroelectronics

Internet of Things Introduction As anyone with a TV or PC probably knows, the Internet of Things is a network that allows the “Things” to communicate to each other without need of human intervention. Prior to emergence of the IoT, the internet connected devices require humans to generate or consume information. Some examples of internet connected personal devices are smartphones, laptops, and desktops. And it has a long reach: the IoT enables devices such as smart personal devices, smart home devices, smart automotive or even smart city devices sense the desired data, process it, store it, and take relevant action. A smart pillbox can monitor if pills are taken on time, give reminders, inform well-wishers, and even order medicines before they run out. A smart lock can be opened or closed by a smartphone, monitor all activities, give time-based access to visitors, and alert the owner in case of unauthorized access.

20 TIMESTech | May 2019

You probably already own or use several IoT connected devices, and according to Stastita (1), by 2025 IoT devices are expected to number more than 75 billion, far outnumbering the UN’s forecast of 8.1 billion people on earth by that year (2). You can see why IoT is probably one of the biggest drivers for technology companies. Our IoT devices will make our lives more secure, safe, and comfortable, and help optimize the usage of resources. The architecture of an IoT device forms the window for the extended value chain to interact with the external world. IoT devices are also the main interface with the user so their form factors and features are very important marketable components of IoT. A typical IoT architecture consists of devices, gateways, the cloud and IoT applications. In this article, our focus is on devices and connectivity technologies with special emphasis on personal wearables.

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IoT

SPECIFICATIONS OF PERSONAL IOT DEVICES Activity detection The most common functions of wearable device are activity recognition and pedometer. They are detected by an accelerometer, one the most versatile sensors present in virtually every personal device. Over the years, accelerometers have become very advanced from simple acceleration detection to detecting many advanced movements directly as sensor output. As an example, the LIS2DW12 accelerometer from STMicroelectronics can detect 6D orientation, wake-up, freefall, and Tap functions. The sensor has a configurable noise mode to select between accuracy and current consumption and even has automatic sleep and wake-up functions.

needed that can be used for activities such as swimming, outdoor sensing, and marine industrial as well as remain safe from chemicals such as Chlorine and Bromine. The LPS33HW is one such sensor with features as an O-ring, water resistance to 10-bar (up to 90 meters depth), and is safe from the chemicals mentioned as well as salt. Contextual awareness Contextual awareness detects the environment based on audio input from a microphone. Measuring sounds, the device can detect if the user is in a mall, a stadium or a meeting room. By detecting the environment, they can directly configure the settings of a connected smartphone. Using an array of microphones, select listening is enhanced by echo cancellation, beam forming and source localization. Some important parameters of microphone are its SNR (Signal to noise ratio), AOP (Acoustic overload point), and power consumption. Microphones are also classified as having analog output or digital output, and being bottom port or top port (in a smartphone). Connected Most importantly, connectivity is what makes a device an IoT device. Connectivity enables devices to be connected to the IoT cloud via a smartphone, gateway, or directly to an infrastructure. Traditionally, IoT devices have been connected by Wi-Fi, Bluetooth, and Cellular technologies. However, the emergence of lower power RF technologies has expanded the scope and functionalities of IoT devices.

To enhance the accuracy and functionality of wearable electronics, a gyroscope, a sensor to detect angular velocity, is paired with the accelerometer. Previously gyroscopes consumed a lot of power so their usage in small battery personal devices was limited. But the advanced IMUs that combine gyroscope and accelerometer in a single IC not only consume little power but also contain many advanced features such as Finite state machines, custom gesture recognition, Smart FIFO, and external sensor interface. These features spare the resources of microcontroller from computing these outputs. The LSM6DSO is one such IMU from STMicroelectronics.

Bluetooth Low Energy [BLE] is a Wireless Personal Area Network [WLAN] technology aimed at novel applications in healthcare, fitness, security, and home automation solutions. BLE consumes a fraction of current of conventional Bluetooth and Wi-Fi while adding smartphone connectivity to devices. It works in 2.4Ghz frequency range, which is a worldwide license-free ISM band. BLE Mesh is a software solution for connecting multiple BLE devices in Mesh networks of IOT solutions. Theintroduction of the Mesh solution has made it possible to be connected even when devices are not in direct range of a network.

Compass and direction sensing A compass provides direction sense to the user and helps to guide drones. Using a magnetometer along with an accelerometer and gyroscope enables indoor navigation. Magnetometers are also used for some home automation solutions such as door open or close detection. Altitude detection Altimeters can enhance the functionality of a pedometer, assisting a rock climber, for example, and detect floor locations in indoor navigation. Wearable pressure sensors detect atmospheric pressure that is eventually used to measure altitude as well. Since a pressure sensor requires an opening for a diaphragm to detect the pressure, they also prone to water and chemical contamination. Therefore, a pressure sensor is

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The BlueNRG-2 from STMicroelectronics is an ultralow-power BLE 5.0 certified system-on-chip, which provides seamless connection with sensors, privacy 1.2, secure connection 4.2, 8dbm of output power, and a reliable BLE link to IOT devices. Besides, it supports standard fully compliant SIG BLE Mesh.

TIMESTech | May 2019

IoT

As the number of IoT devices exponentially multiply, the raw data sent from the sensors to the cloud sees the escalation in required data bandwidth and computational capabilities in the cloud. Artificial Intelligence can be utilized efficiently when some of the analysis moves closer to sensing nodes or on the edge. Edge computing offers data privacy and reduced bandwidth requirements as well as cloud computation. Edge computing means intelligent sensing and processing at the node itself, so the selection of these devices is very important. A smart node analyzes the data, runs sensor algorithms, estimates the context, and sends the data to the cloud for further processing.

DEVELOPMENT OF AN IOT SOLUTION Low-power Wide Area Network (LPWAN) technologies are another revolution in connectivity as they allow connectivity of several kilometers yet consume so little power that they can be powered by a non-rechargeable coin cell battery. Sigfox is a LPWAN technology which offers global cloud, long range connectivity, and consumes very low current. Sigfox devices can freely connect around the world without the need of any separate agreement or roaming charges with network operators. LPWAN technologies work in subGhz range that is not a global standard like 2.4 GHz. So LPWAN devices must be operated at different frequency ranges in different countries. To resolve this issue, Sigfox has introduced a new feature, called Monarch, to recognize radio service and manage radio frequency changes as per local regulations. STMicroelectronics has introduced a unique solution to combine BLE and Sigfox radio, S2-LP, into a common solution. The dual radio will offers long-range connectivity via Sigfox and Smartphone connectivity using BLE. Smartphone connectivity to Sigfox devices will enable User Interface [UI], over the Air firmware update [OTA], direct configuration and control.

INTELLIGENCE ON THE EDGE Artificial Intelligence and Machine Learning have evolved as the backbone computational technologies of IoT networks. Artificial Intelligence uses an assembly of nature-inspired computational methods, and machine learning refers to techniques that enable machines to recognize underlying patterns in order to make predictions and recommendations by analyzing data. An IoT cloud is capable of implementing these techniques.

22 TIMESTech | May 2019

As mentioned earlier, typical IOT architecture consists of devices, gateways, cloud and IoT Applications. A strong IoT solution consists of not only innovative devices but also open source hardware and software reference designs, vertical application solutions, and partnership with cloud makers. Successful IoT implementation also involves collaboration with all the stakeholders of the platform. For example, the STM32 ODE platform from STMicroelectronics offers stackable hardware and a modular software platform, over 131 software packages, three cloud SDKs, and several third party form-factor boards. Startups have a major role to play in the evolution of IoT as the number of use cases of IoT are huge and varied. An open source platform and strong ecosystem lowers the barrier of development, prototyping and commercialization of solutions based on its platform. CONCLUSION The Internet of Things is popularized with introduction of lowpower intelligent sensors, innovative connectivity technologies, and compelling use cases. In the future, every human is expected to own multiple wearable devices so the overall size of opportunity is massive. The exponential growth of IOT devices is both an opportunity and challenge in implementation. A successful IoT implementation requires the right partners with innovative technologies in sensors and connectivity.

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TIMESTech | May 2019

Company Watch

HONGFA RA GOTUR

A Company Grown to the Core of

Director I Indian Operations HONGFA GROUP - INDIA

Founded in 1984, Hongfa is a leading manufacturer of electromechanical relays, and is ranked No.1 in China and No.1 in Power relays & Latching relays globally. Hongfa specialises in developing, manufacturing and promoting relays. Hongfa has a sprawling factory space of around 7,50,000sqm and a 250,000sqm with new plant being set up last year.

Program (WTDP) lab. It is also approved by VDE Germany as a Test Data Acceptance Program (TDAP)-lab â&#x20AC;&#x201D; the only one in China and the sixth one in the world.

Achievements Hongfa has received many awards, including being ranked among the 'Advanced High-tech Enterprises on the National Torch Plan' by the Ministry of Science and Technology, and among the 'National Export Base for Automotive Components' from the Ministry of Commerce and the National Development and Reform Commission. It is the only Chinese relay manufacturing company to be ranked as 'China's Top Brand'.

Certification for Quality Assurance It has a full set of quality assurance systems including ISO9001, ISO/ TS16949, ISO14001, OHSAS18001, GJB9001A, and IECQ QC 080000.

Hongfa Facilities

Hongfa has an annual production capacity of 2 billion relays of 180 series and 60,000 specifications. It has 40 wholly or partially-owned subsidiaries, including Hongfa Europe GmbH and Hongfa America Inc. The company has a state level technical centre for post-doctoral research, an academician research station, and a testing and experimenting centre for relays and related products that is recognised by Underwriters Laboratories (UL), VDE and China National Accreditation Service for Conformity (CNAS). It has also been actively involved in formulating multiple national standards. Hongfa relays are currently being exported to over 100 countries. Hongfa's quality control system conforms to ISO/TS16949 standards. It has the biggest product testing centre in China, which is certified to undertake TUV and UL tests, and has VDE approval in China. This centre has signed a contract with VDE for preferred partnership. The company's lab is approved by CNAS and UL America as a Witness Test Data

24 TIMESTech | May 2019

HONGFA provides the cross reference to the customers. We analyze the data driven approach. We analyze each customer's requirements and send critical data from market from our research manufacturing teams. HONGFA offers innovative solutions for value addition. HONGFA insists customers/buyers should consider the manufacturing dates, batch code, and timely delivery, back ground of MFR/Disty and payment terms, while buying the relays from MFR/Disty. HONGFA ensures that they are getting the right quality with zero defect parts, at the right price at the right time with proper packing.

Hongfa as a Brand Already all most all the customers are well aware of Hongfa products wide range & quality. Besides advertising to create brand awareness, we also build credibility for our brand and wide range of products by sharing our knowledge and time. At Hongfa, we strongly believe in nurturing the future pillars of industry and in sharing our knowledge with the community. Also we actively share our technological knowhow by participating in exhibitions and through Print Media (Magazines ). Hongfa relays are currently exported more than 100 countries.

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Editorial Calendar

2019

July

June

May

ISSUE

Renewables, Alternative Energy

Cloud and Analytics, Block Chain, Big Data

Robotics and Automation

Internet of Things

Cover Story

Portable and Handheld Testers, Trend Setters in T&M

Photovoltaics & Future Green Technologies

x86 Chips And Arm Based Chips Deisgn and Prototyping

Embedded technology, Power Management Ics

RF and microwave

Tech-Focus

Multicore Software Development Technologies

Essentials of an ideal embdded computing system in a IoT Devices

Embedded Software Architecture and design optimization

General Embedded optimization Technologies

Industrial Automation & Control

Aviation & Defence Electronics

Telecommunication

Medical Electronics

Alternative Energy

Consumer Electronics

Electrical & Power

Automation

New Technologies Changing Electronic industry

A Dive into 2019 and Components Distributor Outlook

Future of Datacenters, Servers and Data world

OLEDs, and IoT Based Lighting

Make in India and Indian ESDM Sector Purview

Digital Transformation

Semiconductor Design and Embedded Software

AI ans M2M

OSRM, Philips, Samsung, Kwality

Mouser, Digi Key, Premier Farnell

Google, Renesas, Murata

Vicor, Heilind, RS Components

Infineon, TI, Analog Devices

Mornsun, Renesas

Texas instruments, Murata

ST, Infineon, Moxa

Company Focus

August

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A Comprehensive Look into the Electronics Industry

LED Base Lighting

Future Glance

September

AI & Machine Learning

LED Drivers, Circuit Deisgn and Embedded technologies

Real-Time Operating Systems for Embedded Applications

Industries Focus

October

LED Lighting, Complete Electronic Design Companies

User interfaces & Haptics, Microwave & RF circuits

Embedded System & Design

November

Tech Startups, SMBs, SMEs

Optimization Techniques for multicore processor

December

Editorial: edit@timestech.in

TIMESTech | May 2019

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Design

Build and Program FPGA-Based Designs Quickly with

Python and Jupyter Notebooks -Rich Miron, Digi-Key Electronics

Traditionally, designers turn to field programmable gate arrays (FPGAs) to accelerate performance in hardware designs for compute-intensive applications such as computer vision, communications, industrial embedded systems, and increasingly the Internet of Things (IoT). However, the detailed steps involved in conventional FPGA programming have been prohibitive, encouraging designers to seek alternative processing solutions, until now. The emergence of the Python Productivity for Zynq (PYNQ) development environment based on Jupyter notebooks addresses the issue of FPGA programmability. Using a development board designed specifically to support PYNQ, developers with little FPGA experience can rapidly implement designs able to take full advantage of FPGA performance for speeding computeintensive applications.

Why FPGAs? Engineers who need to employ complex, compute-intensive algorithms often rely on FPGAs to accelerate execution without compromising tight power budgets. In fact, FPGAs have emerged as a dominant platform for speeding artificial intelligence algorithms in edge-computing systems. Designed specifically for embedded applications, more advanced FPGA system-on-chip (SoC) devices integrate programmable logic (PL) fabric with a microcontroller. For example, the Xilinx Zynq-7000 SoC combines a dual-core

26 TIMESTech | May 2019

Figure 1: The Xilinx Zynq-7000 SoC combines a dual-core Arm Cortex-A9 processor, programmable logic fabric, and an extensive set of peripherals and interfaces needed in many embedded applications.

Arm Cortex-A9 processor system with up to 444,000 logic cells in its integrated programmable logic (PL) fabric (Figure 1). Along with its built-in processors and an extensive complement of peripherals, the Zynq SoC offers up to 2,020 digital signal processing (DSP) blocks, or slices. Using these resources, developers can configure the PL fabric into specialized processing chains needed to speed throughput in complex computeintensive algorithms. Besides reducing parts count, integration of the processors and PL fabric allows operations to occur

across on-chip buses rather than through off-chip access. This integration further simplifies the critical task of loading the PL fabric during power-on or reset sequences. In a typical microcontroller-based system built with an FPGA, developers needed to manage the sequence and security for loading bitstreams that program the FPGA. With the Zynq SoC, an integrated processor performs a conventional microcontroller's tasks, including managing the PL fabric and other on-chip peripherals. As a result, the FPGA loading process more closely resembles that of a conventional

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Design

microcontroller's boot process than a traditional FPGA bitstream initialization. This boot process occurs through a short sequence of steps managed by one of the Zynq's processors (Figure 2). At power-on or reset, the boot process starts when a Zynq processor executes a short piece of code from its read-only BootROM to fetch the actual boot code from a boot device. Along with code for configuring the processor system components, the boot code includes the PL bitstream as well as the user application. When boot code loading completes, the processor uses the included bitstream to configure the PL. After configuration and PL configuration are completed, the device begins executing the application included in the boot code.

encapsulated in pre-built libraries called overlays, which serve a similar role as software libraries in the development process and execution environment. During the boot load process, bitstreams associated with the required overlays configure the PL fabric. However, this process remains transparent to developers who take advantage of the overlay's functionality through the Python application programming interface (API) associated with each overlay. During development, engineers can combine software libraries and overlays as needed, working through their respective APIs to implement the application. During execution the processor system executes software library code as usual, while the PL fabric implements the functionality provided in the overlay. The result is the kind of accelerated performance that continues to drive interest in FPGAbased designs for increasingly demanding applications. As the name suggests, PYNQ takes advantage of the development productivity gains associated with the

Python programming language. Python has emerged as one of the top languages not only because of its relative simplicity, but also because of its large and growing ecosystem. Developers are likely to find software libraries needed for support services or specialized algorithms in repositories of open source Python modules. At the same time, developers can implement critical functions in C language because PYNQ uses the common C language implementation of the Python interpreter. This implementation provides easy access to thousands of existing C libraries and simplifies use of developer provided C language libraries. Although experienced developers can extend PYNQ with specialized hardware overlays and C language software libraries, PYNQ's strength lies in its ability to provide a high productivity development environment for any developer able to build a Python program. Itself an open source project, PYNQ builds on another open source project, the Jupyter notebook. Jupyter notebooks provide a particularly

Figure 2: In a boot sequence similar to conventional microcontrollers, a Xilinx Zynq-7000 SoC runs code from Boot ROM that loads and executes the boot loader, which handles subsequent stages including using a bitstream packaged in the boot code to configure the programmable logic fabric.

Even with simplified PL loading processing, developers have in the past been left to deal with the complex FPGA development process needed to generate the required bitstreams. For developers hoping to leverage FPGA performance, the conventional FGPA development process has remained a significant barrier to implementation. Xilinx effectively removed that barrier with its PYNQ environment.

PYNQ environment In PYNQ, PL bitstreams are

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Figure 3: A Jupyter notebook from a Xilinx sample repository combines descriptive text, executable code, and an output associated with an application. (Image source: Xilinx)

TIMESTech | May 2019

Design

effective environment for interactively exploring algorithms and prototyping complex applications in Python or any of the other supported programming languages, currently numbering over 40. Developed through community consensus under Project Jupyter, a Jupyter notebook combines lines of executable code with descriptive text and graphics. This capability allows individual developers to more effectively document their progress without moving to another development environment. For example, a developer can use a notebook that combines a few lines of code needed to view the data with the graphic generated by the code (Figure 3). The ability to contain code, output, and descriptive text is possible because a Jupyter notebook is a live document maintained in an interactive development environment provided by a Jupyter notebook server (Figure 4). In a Jupyter session, the server renders the notebook file in a conventional Web browser using HTTP, and a combination of HTTP and Websockets protocols for the static and dynamic content in the rendered document. On the back end, the server communicates with a code execution kernel using the open source ZeroMQ (Ă&#x2DC;MQ) messaging protocol.

Figure 4: In a Jupyter session, a notebook server renders the contents of a notebook file to a Web browser while interacting with a backend kernel that executes the code. (Image source: Project Jupyter)

In edit mode, the user can modify the text and code. In turn, the server updates the corresponding notebook file, which is a text file comprising a series of JSON key/value pairs. These pairs are called cells in the Jupyter environment. For example, the Web browser display of the Jupyter notebook shown earlier comprises a few cells for code and markdown text

28 TIMESTech | May 2019

(Listing 1). { "cell_type": "markdown", "metadata": {}, "source": [ "## Error plot with Matplotlib\n", "This example shows plots in notebook (rather than in separate window)." ] }, { "cell_type": "code", "execution_count": null, "metadata": { "scrolled": true }, "outputs": [ { "data": { "image/png": "iVBORw0KGgoAAAA[truncated]", "text/plain": [ "<matplotlib.figure.Figure at 0x2f85ef50>" ] }, "metadata": {}, "output_type": "display_data" } ], "source": [ "%matplotlib inline\n", " \n", "X = np.arange(len(values))\n", "plt.bar(X + 0.0, values, facecolor='blue', \n", " edgecolor='white', width=0.5, label=\"Written_to_DAC\")\n", "plt.bar(X + 0.25, samples, facecolor='red', \n", " edgecolor='white', width=0.5, label=\"Read_from_ADC\")\n", "\n", "plt.title('DAC-ADC Linearity')\n", "plt.xlabel('Sample_number')\n", "plt.ylabel('Volts')\n", "plt.legend(loc='upper left', frameon=False)\n", "\n", "plt.show()" ] }, Listing 1: A Jupyter notebook is a text file containing a series of JSON key/value pairs containing code sections, markup, and output such as these, which correspond to the rendered page shown in Figure 3. Note that the string corresponding to the .png image in that figure has been truncated here for presentation purposes. (Code source: Xilinx)

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Design

Aside from its documentation features, the power of the Jupyter environment lies in its ability to interactively execute code cells. Developers simply select the cell of interest in their browser (blue border in Figure 3) and click the run button in the Jupyter menu on the top of their browser window. In turn, the Jupyter notebook server hands off the corresponding code cell to a code execution kernel, which is the interactive Python (IPython) kernel in the PYNQ environment. Following code execution, the server asynchronously updates both the rendered Web page and notebook file with any output generated by the kernel. PYNQ extends this same approach to FPGA-based development by embedding the Jupyter framework including IPython kernel and notebook Web server on the Zynq SoC's Arm processors. The pynq Python module included in the environment provides programmers with the Python API needed to access PYNQ services in Python programs.

FPGA development environment Designed specifically to support PYNQ, the Digilent PYNQ-Z1 development kit lets developers quickly begin exploring FPGA accelerated applications simply by loading the available PYNQ bootable Linux image. The PYNQ-Z1 board combines a Xilinx XC7Z020 Zynq SoC with 512 megabytes (Mbytes) of RAM, 16 Mbytes of flash, and a microSD slot for additional external flash memory. Along with switches, buttons, LEDs, and multiple input/output ports, the board also provides connectors for expansion to third-party hardware through the Digilent Pmod (peripheral module) interface and through Arduino shields and Digilent chipKIT shields. The board also brings out the Zynq SoC's analogto-digital converter (ADC), called the XADC, as six single-ended analog input ports or four differential analog input ports. Digilent also supplies the separate PYNQ-Z1 productivity kit that includes a power supply, a micro USB cable, a microSD card preloaded with a PYNQ image, and an Ethernet cable to update or add Python modules. For the developer, the full capabilities of the SoC and board are readily available through a Jupyter notebook. For

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Figure 5: A Jupyter notebook included in the Xilinx sample repository demonstrates the simple design pattern associated with accessing hardware services for input/output transactions. (Image source: Xilinx)

example, accessing the board's Pmod interface to read the ADC and write digital-to-analog converter (DAC) values in a loopback test requires only a few lines of code (Figure 5). After importing the required Python modules,

the SoC PL is initialized with a â&#x20AC;&#x153;baseâ&#x20AC;? overlay (cell two in Figure 5). Like a conventional board support package, this base overlay provides access to board peripherals. Developers need only call imported

Figure 6: A Jupyter notebook included in the Xilinx sample repository shows how developers can quickly build a webcam face recognition system by combining hardware resources of the PYNQ-Z1 development board with powerful image processing functions available in the OpenCV library (cv2).

TIMESTech | May 2019

Design

modules to read and write the values (cell three in the Figure). In the sample notebook shown, the notebook server issues each cell in sequence and updates the notebook with generated results. In this case, the only output value is 0.3418, but any execution errors will show up as normal Python traceback stacks in line with their respective code cells.

Building complex applications Combined with the wide array of available Python modules, this deceptively simple approach to embedded applications development masks a potent platform for rapidly implementing complex, compute-

intensive applications. For example, developers can quickly implement a face detection webcam using the PYNQ-Z1 HDMI input and popular OpenCV computer vision library. After loading the base overlay and webcam interface, developers initialize an OpenCV camera object videoIn (Figure 6). Reading the video image is then as simple as a call to videoIn.read(), returning frame_vga in this example. In a subsequent step, managed as a separate cell in the notebook, developers create OpenCV (cv2) classifier objects using preset criteria and add bounding boxes to identify features (green for eyes and blue for faces in this example). In another pair

of cells, the application completes after displaying the output using the board's HDMI output (Figure 7). The ability to interactively build, test, and share discussion about complex software has made Jupyter notebooks a favorite among scientists and engineers working to optimize algorithms for artificial intelligence applications. As the work evolves, the notebook not only shows code and its output, but also the developers' analysis about the results, providing a kind of computational narrative that can be shared among team members and colleagues. Yet, developers need to understand that notebooks may be unlikely repositories for more production oriented efforts. For example, their inclusion of large hexadecimal encoded strings for image data (see truncated section in Listing 1) not only increases document size, but can complicate difference methods used by typical source version control systems. The interlacing of code and nonfunctional text can further complicate migration of code created in early analytical stages to production level development processes. For code exploration and rapid prototyping, however, Jupyter notebooks offer a powerful development environment. Conclusion FPGAs provide a necessary performance boost needed to meet the increasing demands of embedded systems designed for the IoT, computer vision, industrial automation, automotive, and many more. Although conventional FPGA development methodologies have remained obstacles for many developers, the emergence of the Python-based PYNQ development environment based on Jupyter notebooks offers an effective alternative. Using a development board designed specifically to support PYNQ, developers with little FPGA experience can rapidly implement designs able to take full advantage of FPGA performance for speeding computeintensive applications.

Figure 7: The final cells in the Xilinx webcam face detection notebook demonstrate use of OpenCV classifiers, whose results are used to add bounding boxes to the original images and displayed using the PYNQ-Z1 development board's HDMI output port.

30 TIMESTech | May 2019

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INDIAN

PCB

Manufacturing Industry

From an Agrarian Economy to a Global Manufacturing Hub Palak Kalra | TimesTech

Indian Electronics Ecosystem at a Glance

uelled by the phenomenal GDP growth in the last few years, India is poised to become the biggest consumer markets in the world, creating demand for high technology products and specifically, electronic products. the demand for electronics hardware is projected to shoot up from USD 45 billion in 2009 to USD400 billion by 2020 while the production is estimated to reach USD 104 billion by the year 2020, leaving a huge gap of USD 296 billion in demand and production. According to India Electronics and Semiconductor Association (IESA), the huge domestic demand is the major driving force behind the robust growth of India's electronics industry. The growing middle class, rising disposable incomes and favorable duty structures are some of the reason why. Citing large-scale public procurement needs that are driven by government projects like broadband connectivity to villages, rural electrification and e-governance programs as among the reasons, it said favorable ESDM policy initiatives and rising interest of MNCs and Indian enterprises in the sector have

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created a positive impact on the Indian ESDM value chain. The government has been reviewing the electronics manufacturing laws and policies to capitalize on the country's manufacturing capabilities. Bold steps such as demonetization have helped clear up many roadblocks. At first seemed like a hasty decision that would leave the economy crippled which fortunately never happened and instead, turned out to be a favorable move, luring foreign investors and global leaders to the Indian electronics sector from around the world. Furthermore, the governments timely counter measures to limit the impact and rigorous country-wide campaigning to promote practices like digital transaction, worked greatly in their favor. To accelerate the pace of growth in the electronics industries and meeting the estimated targets within the time period, the Indian government has been constantly reviewing and forming new policies to build a more relevant and manufacturing friendly ecosystem.

TIMESTech | May 2019

PCB

The need to power-up

The Indian PCB Manufacturing Industry Printed Circuit Boards (PCB) being one of the most commonly available as a cornerstone technology electronics manufacturing sector, empowering almost all the electronics devices you see around you, everyday. PCBâ&#x20AC;&#x2122;s are used as an insulating base for conductive strips with the purpose of assembling electronic circuits. The design of the board changes with the requirement of the electric circuit design. India meets the 70 per cent of the electronic components demand via imports, mostly for sophisticated components for Indian manufacturers to build. Curbing this increasing dependency on imports for sourcing electronic components is one of the toughest challenges the Indian Government faces. In order to make a mark in the global electronics manufacturing spectrum, powering up our electronics manufacturing sector is of utmost importance with Printed Circuit Boards (PCB) on top of the priority list. A PCB with its endless applications in all electrical and electronics devices; and thus the demand and elimination rate both remain high. According to an ELCINA study,

domestic market demand for PCBs will grow at a CAGR of 20.56 per cent over the period 2015-2020, and will reach over US$ 6 billion by 2020 from the current level of US$ 2.38 billion (Figure 1). Currently, only 35 per cent of this demand is met by local manufacturers. And for the remaining 65 per cent, India is still dependent on imports. The global market for flexible circuits is expected to grow much faster than that of rigid PCBs, since the former facilitates form factor reduction and eliminate connectors. However, the Indian market is slightly different from the rest of the world, as Indian PCB manufacturers are mostly focused on single-sided, double-sided and multi-layered PCBs with a layer count of four to six, in most cases. A good number of Indian manufacturers adopt the high-mix, medium-volume strategy where different types of PCBs are manufactured in low to medium volumes. There are around 200 PCB manufacturers in India out of which more than 60 per cent are very small.

Snapshot of Indian PCB Sector By 2020, the electronics market in India is expected to increase with a CAGR of -24-25% to USD 400 billion from USD 104 billion in 2015. Currently only 35% of this demand is met by local manufacturers. And for the rest 65%, India is still dependent on imports. Hence, PCB-being the backbone of electronics holds a huge demand in India-Current demand of USD 2.38 Billion represents the demand based on the total PCBs (which includes both the bare board PCBs and the populated PCBs) Current market size for bare PCBs is USD 1.2 Billion- Only 30% of this demand for bare PCBs is currently being met by local PCB manufacturers. Rest 70% is imported. *The market for PCBs is based on the consumption of bare board PCBs.

Electronics Consumption USD 104 billion Domestic Production USD 32.7 billion Current PCB Demand USD 2.38 billion Domestic Production of bare PCBs

Imported bare PCBs

Imported Populated PCBs

USD 360 Million

USD 840 Million

USD 1.18 Billion

Capabilities of Indian PCB Industry 200 PCB manufacturers are in India with more than 60% of them are very small and unorganised. PRODUCTION CAPABILITIES OF INDIAN PCB MANUFACTURERS

31%

24%

34%

36%

Rigid single sided Rigid double sided Standard multi-layer Flexible Circuits Others

Globally, the market for flexible circuits is expected to grow much faster than that for rigid PCB since flexible circuits can facilitate form factor reduction and elimination of connectors. However, Indian PCB manufactures are mostly focused on single-sided, double-sided PCBs and multi-layer PCBs with layer count of 4-6 in most of the cases.

62% 26%

32 TIMESTech | May 2019

High mix-medium volume strategy by Indian manufacturers-where different type of PCBs are manufactured in low to medium volume.

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PCB

SS DS ML Others

11% 13%

Total PCB Demand 36.69 Million SqM

2015

12%

22%

44%

38%

Total PCB Demand 73.44 Million SqM

2022

32% 29% Others include flexible PCBs, LED PCBs

Domestic market demand will grow at a CAGR of 20.56% in 2015-2020 and will reach over USD 6 Billion by 2020 from existing USD 2.38 Billion CAGR 2015-2020

2015-16

2016-17

2017-18

2018-19

2019-20

Automotive

34.82%

110

140

240

340

490

Mobile Phones

23.58%

310

408

612

723

Strategic

21.64%

214

257

310

422

570

Industrial

17.99%

404

467

617

808

924

Telecom

16.34%

221

264

272

382

471

Consumer Electronics

16.15%

790

950

1140

1380

1670

LED Lighting

16.00%

400

470

570

690

840

Computer Hardware

10.93%

250

280

310

360

420

Total

20.65%

2389

3138

3867

4994

6108

Demand for PCBs by 2020- for Consumer Electronics, Mobile phones and Computer Hardware Consumer Electronics

Ÿ Increasing demand for flat TVs (LED & LCD) is primarily driving the growth of this sigment Ÿ With the government directives to digitize entire pay TV network including cable TV, the set top

box market has gained significant momentum. Ÿ Though only double-sided and multi-layered PCBs are required for STbs, which are withing

USD $ 1670 Million+

Mobile Phone

India's capability. PCBs are imported for more than 90% cases. Ÿ In spite of having TV production units here, local PCB manufacturers fail to deliver the required

volume.

Ÿ 88.4 Mn smartphones are expected to be sold in India in 2015-16. Ÿ Leading mobile set manufactures like Samsung, Micromax, Lenove, Xiaomi, Karbonn, HTC

will be having their manufacturing base in India soon. USD $ 723 Million+

Computer Hardware

USD $ 420 Million+

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Ÿ Though today's mobile phones need complex, higher layer count PCBs and HDIs which

cannot be met by local capability, the immediate opportunity Indian manufacturers can grab is the mobile charger market which needs simple SS and DS PCBs. Ÿ Despite having a $5 billion strong PC market, Indian PCB market has limited opportunities in

this segment so far-because no component-level manufacturing is happening in India for computers/PC Ÿ Apart from PCs, printers, memeory cards and USB drives also need PCB in this segment which have huge domestic production potential. Ÿ HP, Lenovo, Samsung, Acer - having their production units here in India or source from EMS; If local PCB manufacturers build in the technical capability of providing higher-layer microvia technology and flexible circuits, the huge domestic market can be captured.

TIMESTech | May 2019

PCB

Demand for PCBs By 2020- for Telecom, Indstral and Strategic/defence electronics sector Telecom

Ÿ Rising tele-density in India is leading to higher demand for telecom equipment By 2020,

USD $ 471 Million+

Industrial Electronics

domestic production of telecom equipment would be USD $ 9.2 Billion. Ÿ In spite of being one of the large industry is mostly dependent on imports. Ÿ Department of Telecom (DoT) is focusing more on the growth of local manufacturing of telecom equipment which can lead to more opportunities for local PCB manufactures. Ÿ There has been an increased demand for automation and process control which call for. Ÿ Further demand for industrial electronics is expected to be driven by its applications in ageas

USD $ 924 Million+

Strategic

such as aftificial intelligence, robotics etc. Ÿ Local PCB manufacturers are supplying the demand for this sector currently; however need to

upgrade their volume and technology to become sole provider in future. Ÿ Almost everything that military and defence uses strating from weapon to other equipment or

USD $ 570 Million+

even clothing - have very sophisticated electronics integrated on it. And PCB is one basic requirement for all these uses. Ÿ Since Indian Defence manufacturing has been identified as a priority sector in 'Make in India' scheme and focus is on using indigeonous products'components - would spur more demand fro local PCBs.

Demand for PCB's by 2020- for Automotive Electronics and LED Lighting which are emerging as sunrise sectors for PCBs Automotive

Ÿ The booming Indian Automotive industry is driving the demand for automotive electronics. Ÿ With increasing digitisation of automobile controls, automotive electronics will continue to

grow and so will grow the market for PCB for auto components. Ÿ Electronics devices constitute up to 25-30 pc of auto component costs, this will offer a huge

USD $ 490 Million+

LED Lighting

opportunity for automotive PCB. Ÿ Indian manufacturers are already having the technical capability for few applications - need to

develop competency for advanced autp applications. Indian LED Lighting Market is forecasted to reach USD $20.9 billon by 2020. Key growth Drivers areDeclining LED Prices Favourable government initiatives to provide LED lights as subsidized cost and LED installation progects. Ÿ Increasing awareness. Ÿ Indian PCB manufacturers have the capability of meeting the complete demand of metal core PCBs for LED. Ÿ However, more than 90% requirement are being met through import - local manufacturers are losing out to cheap Chinese PCBs. Ÿ Ÿ Ÿ Ÿ

USD $ 840 Million+

Major Roadblocks Hampering Growth of the PCB Industry Ÿ Inefficient supply chain for raw materials Ÿ High capex requirements Ÿ Lack of access to new technology and state-of-art

manufacturing facilities Ÿ Other challenges include: Ÿ Unfair playing field, since companies from competing

countries have access to finance at much lower costs Ÿ Logistics inefficiencies

resulting in longer turnaround time frames and higher costs Ÿ Conflicting policies in operation across the various levels

within the electronics industry, from the components segment to finished products To get a better outlook of the PCB manufacturing industry we asked Ajaish Sehgal, Senior Manager at CIPSA TEC India, about various aspects of the PCB industry in India.

and infrastructural bottlenecks,

34 TIMESTech | May 2019

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Renewable Energy

ENERGIES

are important whether it is

PHYSICAL OR THROUGH POWER Silpi Sarkar | TimesTech Imagine life without power!! Plenty of time for unravelling the do's and don't namely gossips, outrage, probable works undone etc. The energy crisis can lead to such hegemony within us. Surprised or Shocked! If we don't think now we cannot act in future. From several decades ago economic growth basic ingredients is energy and there is always a crisis of energy due to global demand and the supply of energy is always less. Traditionally energy fuels can be classified into coal, oil and natural gas, fossil fuels (from plants and animals), atomic energy (Uranium usage). Almost coal, petroleum, nuclear, geothermal, solar, waste incineration plants as well as many natural gas power stations are thermal. There is urgent necessity to balance the crisis of energy supply by developing secure and sustainable sources of energy. Also, the consequences of non-renewable energy is deeply rooted viz., pollution, release of toxic green houses gases, smog, global warming, acid rains due to climate change etc. There were several instances where the non-renewable sources of energy can run out such as in the scenario of oil crisis of 1973. Also, in 2012 half of Mumbai due to system failure went into darkness plagued by blackouts for several hours affecting more than 600 million people which lead to massive outrage. Also, the non-renewable sources of energy namely coal which is used in production of thermal energy. As, per the Economic Times in India reports of the looming power crisis which leads too many roadblocks are evident. To maintain the fast pace of life electricity is the main sector where alternative energy can increase the surplus production. Coal supply is heavily depended on imported

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coal which causes increase power generation costs due to limited fuel availability. Also, land acquisition, installation of power projects are expensive thus escalating huge investments. Thus, there is need to conserve the energy by improvement of energy efficiency in the industry, power generation and promotion of renewable energy technologies. Thus it is important to restrict the usage of non-renewables form of energy and to look for the suitable renewables and alternatives.

Fig. 2 Coal fired power station in Nantong, China

What are the renewables and alternative energy sources? The renewable energies comes from Sun directly by solar heating, or indirectly by hydroelectric power, wind and from biomass fuels. The true renewable energy sources are replenished by natural processes when excessively used the renewable energy supplies can become exhausted. The energies are user â&#x20AC;&#x201C; friendly and key to low environmental

TIMESTech | May 2019

Renewable Energy

pollution. Renewable energies are basically carbon – free and economically viable

The renewable and sustainable energy supplies are – a) b) c) d) e) f)

Wind Power Solar Power Wave and Tidal Power Biofuels Heat Pumps Fuel cells

India's Scenario –The Step towards Renewable energy

India becoming a fast paced in being one of the developed nations the pressures are high to cut excess energy access. India and China plays a critical role to contribute the carbon emissions which addresses climate change. The challenge for India is to wean from the dependence on coal and fossil fuels which accounts for 59 percent of India's electric capacity. Thus India ranks fourth in global greenhouse gas emissions after China, USA, and the European Union. It is reported that Agence Francoise de Development (AFD) is extending a Line of credit (LoC) of 100 million (US$ 134.73 million) for a tenure of 15 years to M/s Indian Renewable Energy Development Agency Ltd. (IREDA) to finance renewable energy and energy efficiency projects in. Similarly, India has long clear sunny days, several perennial rivers with a long coastline thus ideal for generation of solar and hydroelectric power generation. Thus, Toshiba has started with supply of facilities such as turbines, generators to landmark hydropower projects as seen in Purulia pumped Hydro for West Bengal State Electricity Distribution Company and Teesta 5 for NHPC. The Toshiba Company delivers small to large hydro-power systems and micro-hydro equipment of remarkable design and efficiency. As, India has abundant solar power potential she has added 9 GW of solar power in past two years, with a total of 12 GW of total solar capacity. According to a report by Bloomberg New Energy Finance, an addition of 37 GW by 2020 henceforth India expands to grow of its solar market by 90%. Govt. of India has deployed of solar cells, solar pumps, in the Budget 2018, with allocation of Rs.48,000 corridor distributing 17.5 lakh solar pumps as part of the scheme “Kisan Urja Suraksha evam Utthaan Mahabhiyan (Kusum).” The scheme has objectives of setting 10,000 MW solar plants on barren lands to produce electricity. Greenpeace environmental group led a solar-powered electrification project in Dharnai village of Bihar. This 100-kilowatt micro-

36 TIMESTech | May 2019

grid is powering approximately 450 homes. Alternative renewables viz., hydroelectric—wind, solar, geothermal, and biomass—currently account for 13% of India total electricgeneration capacity, greater than twice as high a proportion as in the United States. But contrary to that the contribution is less in practice due to lack of transmission capacity and less incentives to purchase solar and wind power. India is working towards in production of 40% of its installed electricity capacity by 2030 from non-fossil fuels according to India's commitments for 'Paris Climate Accord'. Thus to achieve these she has to produce 100 gigawatt from solar, 60 gigawatt from wind, 10 gigawatt from biomass and 5 gigawatt from small hydropower by 2022. As, per the International Energy Agency's (IEA) Renewables Report, Solar and Wind represent 90% of India's capacity growth, thus it is beneficial for corporates to invest in contracts to develop power-generation capacity using technologies at cheaper prices. The increase of investments will give access to reliable, clean, affordable energy for huge population with energy consumption growth of 4.2% p.a. faster than major economies in the world. Nevertheless, optimally leverage of sophisticated technologies, harness proactive collaboration with several industries, academia, and energy innovation ecosystem will be aptly give rise to affordable renewable systems. Conclusion So, the bottom-line which can be taken by Indian Government for Alternate, Renewable energy sources are – a) Ensure Maximum Funding for Renewables Energy Source b) Implementation of rule by Government to purchase renewable energy distribution a minimum purchase of 15% by 2020. c) Plan flagship programs to demonstrate the effects of Renewable and Alternative energies d) Make pilot –projects to create awareness among people e) Aggressive promotion of clean and renewable energy efficiency practices in every household. In such a scenario, it is significant to build a sustainable future. Now we should question ourselves are we ready to unleash renewable energy to bring more affordability to ramp up the energy revolution? Hopefully time and the initiatives, corporates and the Government policies will bring a cleaner, greener India.

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New Products

Sensirion’s SVM30 Sensor Module, Measures tVOC, CO2eq, RH/T on Single Board

Renesas new touch-free UI, for example in the kitchen, users could adjust water temperature and flow rate through hand gestures near the faucets or adjust stove fan operation by holding a hand over the hood. The touch-free UI solutions allow customers to easily implement these interfaces in their embedded equipment. The reference designs are available for downloaded effective immediately. For more information: renesas.com

Mouser Electronics, is now stocking the SVM30 multi-gas, humidity, and temperature module from Sensirion. Featuring Sensirion’s CMOSens intelligent microsensor technology, the SVM30 is optimized for easy design-in and sensing performance in air purifiers, HVAC, smart home systems, and other indoor air quality applications. Mouser Electronics, offers accurate and stable monitoring of indoor total volatile organic compounds (tVOC), CO2 equivalent (CO2eq) concentration, temperature, and humidity. The module contains an SGP30 multi-pixel gas sensor with multiple metaloxide sensing elements as well as an SHTC1 humidity and temperature sensor. The complete sensor system integrates the sensing elements, analog and digital signal processing, analog-to-digital converter (ADC), calibration and data memory as well as a digital communication interface supporting the I2C standard mode. For more info: mouser.com

Touch-Free UI Solutions with Capacitive Touch-Key MCU For 2D/3D Gesture Control

Renesas Electronics introduced two touchfree user interface (UI) solutions to simplify the design of 2D and 3D control-based applications. Based on Renesas’ capacitive sensor microcontrollers (MCUs), the new solutions support the development of UI that allows users to operate home appliances, as well as industrial and OA equipment without touching the devices. The UI solutions make it possible for appliance and equipment manufacturers to quickly develop touch-free interfaces that increase the added-value of their products in terms of both equipment convenience and design. There are a variety of situations where touch-free operation is advantageous, such as when the users’ hands are wet, when the controls are out of reach, or when it is not safe for the user to touch the controls.

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IoTize TapNLink for Instant NFC, Bluetooth Available for Immediate Shipment Worldwide through Digi-Key

IoTize’s line of TapNLink products for Bluetooth and NFC communication is available to customers around the world from Digi-Key Electronics, a global electronic components distributor. Under a new distribution agreement, Digi-Key will resell a range of products from IoTize, designers and manufacturers of plug-n-play wireless connectivity solutions for microcontroller-based embedded systems. TapNLink products allow the user to take an existing MCU application that does not have wireless connectivity and add it using only 2 GPIO pins and without modifying the application’s original firmware. This approach is a Kickstarter for companies that are fast tracking their wireless integration projects to meet customers’ changing expectations. TapNLink reduces design effort and risks by a factor of ten, speeding time-to-market of smartphonebased interfaces for product configuration, monitoring, and control. Applications that would benefit from the instant wireless connectivity include factory machinery – control and monitoring, cable replacement, point-to-point data transfer, building automation, automated lighting, and inventory and tracking systems. For more information: www.digikey.com.

Programmable 12-channel RGB-LED Driver Enhances Lighting Effects for Smart Devices and Wearables With patented features to prevent distracting artefacts in “color-chasing” or “deep breathing” LED animation effects, the STMicroelectronics LED1202 12-channel LED driver enables smoother and more natural interactions with smart-home

devices, wearable electronics, and small appliances. The LED1202 can store eight programmable patterns and sequences and operate independently of the main controller, enabling the host system to save power while sophisticated lighting effects run continuously. 12-bit internal PWM dimming enables precision control of programmed sequences and the main controller can set 8-bit values for analog dimming via the driver’s I2C interface. Minimal external components are required to complete the driver circuit. With 12 output channels, a single LED1202 can drive four RGB LEDs at up to 20mA per channel. An innovative synchronization feature allows connecting up to eight LED1202 drivers to control larger LED arrays. In addition, superior low-current channel matching, within 2% (typical) at 2.5mA, enhances color consistency. Phase shifting between channels minimizes current ripple and prevents excessive peak demand. Built-in safety features include open-LED detection, over-temperature protection, and a fault-flag pin. For more information: st.com

Aerotech XC4 Single-Axis PWM Drive for Brushless DC, Brush DC, Voice Coil

Aerotech’s XC4 PWM digital drive is a single-axis motor drive designed for brushless DC, brush DC, voice coil, and stepper motors at up to 340 VDC operating voltage and 30 A peak current. All versions are compatible with the Automation 3200 motion platform utilizing the HyperWire motion bus. The digitally closed current loop and servoloop ensure positioning accuracy and rate stability. This allows loop closure rates up to 20 kHz as well as digital and analog I/O processing, data collection, process control, and encoder multiplication tasks in real time. Standard features include Safe Torque Off (STO), a data array consisting of over 4

TIMESTech | May 2019

New Products

million 32-bit elements, digital and analog I/O, one-axis Position Synchronized Output (PSO), dedicated home and end-of-travel limit inputs, and an enhanced current sense device. Encoder support includes squarewave, sine-wave, and absolute encoders. The standard XC4 accepts square-wave encoder feedback at rates up to 40 million counts-per-second. Sine-wave encoders can be multiplied by up to 16,384, producing high-resolution position feedback with the optional encoder multiplier feature. Each single-axis XC4 PWM digital drive has an optional I/O expansion board, greatly increasing the number of I/O points. This I/O board includes a dedicated PSO output and a PSO synchronization input, often used to synchronize process control with an external mode-locked frequency input.

the overall system. The A8060x device family is ideal for all types of automotive backlighting, including Audio-Video systems as well as instrument clusters and heads-up display (HUD). These devices offer a wide input range from single power supply from 4.5 to 40 Vâ&#x20AC;&#x201D;once started, it can continue to operate down to 3.9 V. This allows the parts to withstand stop/start, cold crank, double battery and load dump conditions encountered in automotive systems.

This driver IC comes with a comprehensive and configurable set of protection features to ensure high reliability and long lifespan of the driver. For adverse operating conditions and instable grids, the configurable brownout and -in function is built in. All relevant potential error conditions are monitored and protected, among them under- and over-voltage for input and output, open load and output shorted. An adaptive temperature guard additionally ensures the optimal thermal management.

For more information: infineon.com

XDPL8218 a high power factor, LED driver IC

Maxim Delivers the Most Compact 4Channel Automotive Power Management IC for Vehicle Camera Modules

For more information: aerotech.com

Latest LED Driver Family Eliminates PWM Audible Noise with Patented Control Method

Allegro MicroSystems, announced the A8060x family, their latest generation of advanced LED backlight drivers. The device family is designed with an innovative and patented Pre-Emptive Boost (PEB) control, eliminating noise that is typically audible. PEB control in the A8060x family substantially reduces Vout ripple and eliminates the common problem of audible noise from ceramic output capacitors during PWM dimming, while also requiring less output capacitance overall. Systems can achieve an LED brightness contrast ratio of 15,000:1 using PWM-only dimming at 200 Hz. A higher ratio of 150,000:1 is possible when using a combination of PWM and analog dimming. The ALT80600 and A80603 combine a switching converter with integrated MOSFET and four current sinks, while the A80601 and A80602 drive an external boost FET for higher output power. All devices can be configured in a boost or SEPIC topology to cover a wide range of application configurations. The switching converters are designed for low EMI, including programmable switching frequency, controlled switching slew rate, and programmable dithering. Further, a clock-out pin allows other switching converters to be synchronized to the A8060x switching frequency for enhanced EMI performance of

38 TIMESTech | May 2019

Infineon Technologies introduces the new member of its XDP LED controller series, the digital and highly integrated XDPL8218 for cost effective LED drivers. The device features a future proof design and combines a constant voltage quasi-resonant flyback controller with algorithms for high power factor (> 0.9) and low total harmonic distortion (THD < 15 percent).The XDPL8218 is the best choice for the primary side of dual-stage LED designs with a DCDC stage at the secondary. The device manages wide load ranges, responds quickly and stably to dynamic load changes, and enables high efficiency over a wide output range. The new LED driver IC supports full functionality for both AC and DC input in the nominal input voltage range of 100 V AC to 277 V AC or 127 V DC to 430 V DC. The built-in digital control automatically selects the optimal operation mode for the actual operating condition, e.g. quasi-resonant, discontinuous conduction or active burst modes. The XDPL8218 fits very well with linear driver ICs such as the BCR601 from Infineon that provide a voltage feedback to the primary side. This helps to reduce power losses in the pass-transistor. The XDPL8218 supports the easy design of high performance and innovative LED drivers. To this end, the digital parameter configuration enables real-time design changes with little effort shortening design cycles and reducing time-to-market. The compact bill of materials (BOM) minimizes system costs and allows for increased flexibility. Since the device can be used for multiple board variants, the number of stock keeping units reduces considerably.

With automotive camera modules becoming increasingly smaller, designers can now utilize the ultra-compact MAX20049 power management IC from Maxim Integrated Products, Inc., which integrates four power supplies into a tiny footprint. In addition to being the most compact power management IC for vehicle camera modules, it delivers the highest efficiency on the market today. The MAX20049 offers many options to support various output voltages, while also providing fault mitigation by flagging faults and shifts in output voltages. Flexible sequencing and fixed output voltages supporting various image sensors Fault Mitigation: flags faults and shifts in output voltages to ensure cameras are working as intended Once an over- or under-voltage signal is detected, the PGOOD pin will assert low Cycle-by-cycle current limit implemented by the respective converter if either output is shorted Low Noise: spread spectrum and 2.2MHz switching frequency mitigates electromagnetic interference (EMI) to meet CISPR low-noise specifications Ĺ¸

For more information: www.maximintegrated.com

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