IT Equipment Overview
Packaging Electronics to Meet BC Data Center
System Level
BlueGene P System Buildup Five Levels of BlueGene/P CFD Analysis
page 7,8 System
Rack Level Rack
112 Racks, 112x32x32
page 6
Cabled 8x8x16
32 Node Cards
Node Card
1.5PF/s 224 TB
Node Card
(32 chips 4x4x2) Level 32 compute, 0-1 IO cards page 5
13.9 TF/s 2 TB
Compute Compute Card
Level 1Card chip, 20 page 4 DRAMs
Chip Level Chip Power Mapping 4 processors page 3
13.6 GF/s 8 MB EDRAM
435 GF/s 64 GB 13.6 GF/s 2.0 GB DDR2 (4.0GB is an option)
Form Factors
Data Center Platforms
Rack-optimized – focus on medium/large business –
Traditional 19” rack
–
Entry – 1 to 4 sockets Mid-range – 4 to 16 sockets High-end – 8 to 100+ sockets Blades – highest density
24” or custom rack
High-end – custom
Server Form Factors
•
Usage - small business – – –
•
Rack-Mounted –medium/large business –
low cost
Processors – – –
Entry – 1 or 2 Mid-range – 2 or 4 High-end – 4+
Traditional 19” rack • • • •
Customer focus –
•
Pedestal or floor-standing form factor Quite often rackable Low density
•
–
Entry – 1 to 4 sockets Mid-range – 4 to 16 sockets High-end – 8 to 100+ sockets Blades – highest density
24” or custom rack •
High-end – custom
Form Factors
Rack-Optimized – Telecom
Focus on medium/large business 20” depth Long, supported life Traditional 19” rack 1 or 2 processors – 1U, 2U – Mid-range – 4+ processors – 3U and above – High-end – 4+ processors – 7U – Blades – transition from 1U/2U for higher density –
1U Layout IO Memory CPUs
Fans
Hard Drives
CD or DVD
Power Supply
Server Components
The idea of a bus is simple -- it lets you connect components to the computer's processor. Some of the components that you might want to connect include hard disks, memory, etc Each bus specializes in a certain type of traffic. One very common bus of this type is known as the PCI bus. These slower buses connect to the system bus through a bridge, which is a part of the computer's chipset and acts as a traffic cop, integrating the data from the other buses to the system bus.
Server Components
Typical Rack Mount Server
Cooling Ingredients in a Server Heat Sinks (1) Fans (2) Venting (3)
Network Equipment
http://tc99.ashraetcs.org/documents.html
Desktop Equipment's
Storage Equipment's
http://tc99.ashraetcs.org/documents/ASHRAE_Storage_White_Paper_2015.pdf
Open Compute Hardware • • •
Two Intel Xeon E-2600 processors and 16 DIMM slots per board Facebook designed 2xOpenU chassis with support for 1x HDD and 1x mSATA module with adapter Fans are 80x38 mm PMW 4-pin fans (choice of Delta, Sunon or Sanyo Denki)
Server Form Factors
42 U
=1U
1U = 1.75 Inches (44.45 mm)
1U
2U
4U
Roles of Server
• • • • • •
File & Print Application Server Database Server Web Server Email server Virtual server
Rack mounted Servers Examples
• Introduction to IT equipment Power and Cooling
Component Temperature Driven by Three Effects
3 Sources of Component Temperature Self Heating Air Heating System Ambient
© ASHRAE
Boundaries for Thermal Management
Design considerations include: • • • •
Usage Models Environmental conditions Rack & Room Level Airflow Protocols. Components selection, location, & configuration
© ASHRAE
Design considerations must be evaluated against: Cost Performance, Energy Objectives
Component Packaging to Meet Thermal Requirements
Processor Package Abbreviations:
Processor Package plus Cooling Components
T
= Temperature
TIM Material
= Thermal Insulating
IHS
= Internal Heat Sink
Rack level Cooling 2 KW Rack Requires - 300 CFM 300 CFM Typical Air-cooled Datacenter with raised floor set-up
Raised Floor
Typical air-cooled Data Center