CIRP Annals - Manufacturing Technology 69 (2020) 493 496
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Extended sub-surface imaging in industrial OCT using ‘non-diffracting’ Bessel beams Haydn Martin*, Prashant Kumar, Andrew Henning, Xiangqian Jiang (1) Future Metrology Hub, Centre of Precision Technologies, University of Huddersfield, UK
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Article history: Available online 17 May 2020 Keywords: Measuring instrument Optical Optical coherence tomography
A B S T R A C T
Optical coherence tomography (OCT) is an imaging technique which can provide sub-surface evaluation of defects in optically compliant components such as those manufactured by polymeric selective laser sintering. In OCT systems, achieving lateral imaging resolutions of <10 mm means that full-depth imaging requires multiple scans due to the limited depth of focus (DOF). We present a study on the application of ‘non-diffracting’ Bessel beams to extend system DOF and enable deeper imaging with a single scan. Such capability expands the potential for OCT as a rapid tool for sub-surface assessment, either in-line or in-process, by greatly reducing acquisition times. © 2020 The Authors. Published by Elsevier Ltd on behalf of CIRP. This is an open access article under the CC BY license. (http://creativecommons.org/licenses/by/4.0/)
1. Introduction Optical coherence tomography (OCT) is a non-invasive imaging technique which utilises broadband (low coherence) light to capture sub-surface information from within scattering media. Material and structural changes create refractive index variation throughout the media which lead to the scattering of light. Interferometric analysis of scattered light returning to the system allows the axial position (depth) of a given scattering point to be determined. 3D volumetric image of sub-surface structures can be built up by lateral scanning of either the sample or more commonly the imaging optics. Since OCT was first described in the early 1990s [1] substantial effort has been made to develop the technique into a tool for biological imaging and healthcare diagnostics. This has been made possible by the introduction of techniques to increase the acquisition rates such as rapidly scanning optics and light sources, high speed electronics and frequency domain analysis techniques which have enabled the demonstration of volumetric imaging at video rates. Although the primary driver for the development of OCT technology has been biomedical imaging applications there has also been continuous interest in the measurement of non-biological samples. This is especially true in areas where other commonly applied nondestructive evaluation techniques exhibit limitations. OCT axial (depth) and lateral resolutions can approach 1 mm and <10 mm respectively in ideal conditions, which is an order of magnitude improvement over high-frequency ultrasound imaging techniques, though this is generally obtained at the expense of a corresponding reduction in penetration depth. X-ray computed tomography (XCT) is becoming more prevalent but it is slow, expensive and lacks the
* Corresponding author. E-mail address: h.p.martin@hud.ac.uk (H. Martin).
sensitivity required to discriminate between materials in some circumstances e.g. polymer fibres and resins in some composites. Duncan et al. demonstrated the use of OCT to locate internal defects in lead zirconate titanate ceramic, single crystal silicon carbide and teflon coated wire [2]. Dunkers et al. used OCT to analyse fibre architecture, voids, cracking and debonding in glass reinforced polymer composites [3]. Wiesauer et al. introduced polarisation sensitive OCT to extend defect detection to include strain fields in polymer composites [4]. Yao employed OCT for the metrology of multilayer polymer films stacks which informed improvements to layer thickness consistency in the manufacturing process [5]. A 2007 review of non-medical applications for OCT by Stifter [6] outlines other manufacturing relevant studies of polymer foams, paper, injection moulded parts and microfluidics. More recently, OCT has been applied to defect detection in additive manufacturing (AM). Guan et al. showed the detection of sub-surface defects as well as the ability to discriminate between un-sintered and sintered powder in selective laser sintering (SLS) of monolithic polymer parts [7]. In microelectronics, OCT has been used to evaluate PCB protective coating thickness, and assess through-silicon vias which critical for the development of 3D integration in semiconductor manufacture [8]. Currently, in-situ and in-process measurement applications are being reported in laser materials processing for seam tracking and weld depth evaluation and laser materials processing [9]. A key requirement for imaging depth in OCT is that the interrogated material is not strongly absorbing in the wavelength range of illuminating light. In general, longer wavelengths will penetrate better at the expense of the achieved lateral imaging resolution. For this reason commercial OCT systems are often designed to operate at wavelengths of 800 900 nm, 1300 nm systems are used in more scattering media e.g. biological tissue, while for the imaging of ceramics 2 4 mm is better suited [10].
https://doi.org/10.1016/j.cirp.2020.04.017 0007-8506/© 2020 The Authors. Published by Elsevier Ltd on behalf of CIRP. This is an open access article under the CC BY license. (http://creativecommons.org/licenses/by/4.0/)