The Most Detailed BGA Reballing Skills for Phone Fix

The Most Detailed BGA Reballing Skills for Phone Fix As a professional phone fix technician, you must be familiar with BGA reballing operation, most of professionals generally start with baisc Phone BGA Reballing Kit and gradually shift to latest universal kits and stations. For cell phone repair beginners, it's very important to learn how to start BGA Reballing with right toolkit. There are lots of BGA Reballing kit and BGA rework stations available in the market. VIP FIX will list them all and introduce how to do the whole process of cell phone BGA reballing repairs.

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These are the essential tools of a Complete Cell

Phone BGA Reballing Kit: – Soldering Station is also known as Solder Iron, it is a hand machine that used for general phone fix soldering.

The main function is to supply heat to melt the Solder Metal so it can flow into the broken joints between the cell phone PCB and the Electronic Components. A

soldering iron is often composed of a heated metal tip with an insulated handle. However, it's more convenient for a soldering station

to control the heating

temperature. – BGA Stencils Chip Stencils are essential assistant for phone soldering work, which are

metal sheets with

lots of holes for Solder Balls on it. If it was made of high-quality steel, it can be heated directly by the Hot Air Gun to make this Soldering balls process easy and quickly. – Solder Balls are small balls made of solder, which can be randomly scattered across the surface of an SMT board. The main work of these solder balls is to provide the contact between the chip package and the printed circuit board, as well as between stacked packages in multichip modules. – Soldering Paste is mainly used for connecting the surface mount components to pads on the circuit board.

So, it helps a lot when sticking the electronic

components or solder balls on the mounted area.

– BGA Rework Station is a heat providing machine mainly used for attaching or removing the cell phone BGA Chips.

– Desoldering Wick is also known for desoldering wire or solder wick, its excellently braided 18 to 42 AWG copper wire coated with Rosin Flux, usually available on a roll in the market. The main work of this Desoldering Wick is to remove solder from a solder joint.

– BGA Chip Case is an universal holding stand who only made for holding Chips for Reballing.

• Besides the above reballing tools, what else you will need?

– Tweezers – PCB Holder – Soldering Flux

– Acetone or IPA Solution – ESD-Safe Cleaning Brush – Heat Resistant Kapton Tape or Clips • How to Use a BGA Reballing Kit 1. Desolder and remove the BGA IC from the cell phone PCB, you will need rework station and tweezers.

2. Clean the solder from the bottom of the IC and the PCB where the IC was soldered. You will need soldering iron and desoldering wick.

3. Select the right BGA stencil and place the IC on the stencil, you need to tightly hold it with clip or tape.

4. Apply solder paste from the other side of the stencil.

Solder paste will stick to the IC through the tiny holes in the stencil.

5. Apply hot air using SMD rework station. This will solidify the solder paste and it will form solder balls that will stick to the IC. 6. lean the IC with Acetone or IPA solution and remove it from the stencil.

7. BGA is ready to solder back to cell phone PCB. Need more phone fix technical knowledge and skills,

please contact VIP FIX Shop Team.