LINEA II Inline Wet Process Equipment for Cleaning, Texturing and PSG Removal
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LINEA II Inline Wet Process Equipment for Cleaning,Texturing and PSG Removal
LINEA II
Inline Wet Process Equipment for Cleaning,Texturing and PSG Removal
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Production of PERC Solar Cells →→ Single side polish etch with LINEA II →→ Rear side passivation with SINGULAR XP →→ PERCEUS Production Package for PERC solar cells
SINGULUS TECHNOLOGIES Developer, Enabler and Supplier for the PV Market SINGULUS TECHNOLOGIES is a supplier of manufacturing solutions and production equipment for the Markets Optical Disc, Semiconductor and Solar. With new machine concepts and manufacturing processes in the crystalline and thin-film solar technology SINGULUS TECHNOLOGIES establishes itself as development partner and equipment supplier for investments in new high-performance solar cell concepts. As market leader for Optical Disc production systems we have gained extensive know-how in vacuum coating, automation and process integration. SINGULUS TECHNOLOGIES cooperates with cell manufacturers worldwide and develops processes, which improve the efficiency of solar cells and at the same time reduce production costs. Evolutionary improvement in cell concepts like PERC (PERL/PERT), n-type material, IBC cell or heterojunction cells will drive the future of crystalline solar cells.
Other process applications improving cell performance →→ Complete production lines – SOLARE →→ ICP-PECVD coating equipment – SINGULAR →→ IPA-free wet process equipment – SILEX →→ LINEA II parasitic emitter etching and edge isolation →→ LINEA II isotexture or PSG removal →→ Wet process equipment for poly silicon chunk etching, cleaning & drying – MATERIA →→ Low-cost and high-efficient cleaning process (Upgrade SILEX with Ozone)
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Standard and Advanced Production Methods for Crystalline Solar Cells
ISOTEX
Acidic SDE / Isotexturing
LOAD ISOTEX RINSE
PorSi
PSG
P-SiO2 -Glass Removal
PSG-EE
RINSE CLEAN RINSE
DRY
LOAD
PSG ETCH
RINSE
DRY
RINSE
PSG ETCH
RINSE
DRY
UNLOAD
UNLOAD
UNLOAD
P-SiO2 -Glass Removal / Edge Isolation
EDGE LOAD ISOLATION
FC
LOAD
US RINSE CLEAN
US ACIDIC RINSE RINSE CLEAN CLEAN
DRY
UNLOAD
LOAD
POLISH RINSE ETCH
PorSi
DRY
UNLOAD
US-Clean / Alkaline / Acidic
PE
Polish Etching
RINSE
PorSi
RINSE CLEAN RINSE
LINEA II Inline Wet Process Equipment for Cleaning, Texturing and PSG Removal Today´s dominating solar cell concept is based on cells made from crystalline silicon. SINGULUS provides complete automated dry-in/dry-out solutions for wet treatment of Si-wafers in standard and high-efficiency cell lines. Current and future market requirements of machines, processes and materials for solar cell manufacturing sets new standards for cost reduction, productivity, process capability and integrability of wet-chemical production. The ongoing evolution of proven concepts in process management and the integration of innovative approaches are the basis for the development of a new generation of horizontal etching systems.
LINEA II is a horizontally working inline wet process platform for cleaning and etching of crystalline solar wafers. The SINGULUS LINEA II combines an advanced transportation system, sustainable and innovative processing modules with proven and efficient chemical etching and cleaning processes. In addition to proven processes like texture etching, PSG etching or RCA cleaning, the focus is on newer applications with one or two sides processes, such as polish etching, emitter echting and ozonebased or ultrasonic cleaning respectively. The highly integrated design, high throughput, high availability and low breakage rate make LINEA II attractive for solar cell manufacturers worldwide.
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Main Characteristics Effective, Economical, Flexible
Controlled, Precise, Intelligent
→→ Platform for all inline processes →→ Economical because of small bath volumes and high wafer throughput →→ Low exhaust volumes through intelligent airflow next to each wafer lane →→ Future-proof and flexible with modular process units →→ Easy integration of new or additional process options →→ From R & D tool to the fully integrated 10-lane facility
→→ Fully automated tool with integrated process control →→ Compact process chambers with innovative media and process management →→ Simple and robust „spider-chain“ wafer transport system without mechanical contacts on top side →→ Shadow-free contact of the wafer surfaces with the process media →→ Wafer tracking and wafer thickness measurement
Safe, Clean, User-Friendly →→ Safe for persons, environment and in the process →→ Cleanroom compatible design according to ISO and SEMI standards →→ Friction-free, gentle wafer transport through the process media →→ Excellent accessibility of the process chamber from all sides through the separation of process and installation modules
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Main Components 1. Housing Separated Process and Media Compartments for easy access 2. Load / Unload Conveyor →→ Automated feed-in of a wafer alignment by optional multiplex transfer unit →→ Automated take-out of wafers by optional single or multiplex pick-and-place unit →→ Safety interlock of automation interaction 3. Wafer Transport System →→ Motor-driven plastic conveyor chain for a gentle and reliable wafer motion and a minimum mechanical wafer stress →→ 1 to 10 wafer transport lanes →→ Effective media carry-over protection system between process sections
4. Integrated Process Control →→ Individual chemical bath management for filling and spiking of chemicals and DI-water →→ Temperature control of all heated and cooled process steps →→ Control of recirculation and injection flow rates →→ Transport speed control →→ Optional online/offline analysis of chemical compositions by titration, conductivity measurement and/or IR spectroscopy →→ DI-water resistivity measurement →→ Process data storage and loggings →→ Single wafer tracking and thickness measurement 5. Central Machine Control System →→ Siemens SIMATIC S7 PLC system →→ PC-based graphical user interface (WINCC) →→ Bus systems for internal communication of sub-assembly systems →→ OPC interfaces for external data exchange →→ Safety gas transmitter system
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WL-ISOTEX Technical Data Main Features
LINEA WL-ISOTEX1500
Wafer Material
LINEA WL-ISOTEX3000 Si MC, 125x125 mm, 156x156 mm, >150 µm N2, CDA, DI-water, PCW, HF, HNO3, KOH, HCl, (additive) waste drains electrical power 400 VAC/3/PE
Utilities Exhaust
5000 m3/h
6500 m3/h
Typical Etch Removal/Side
4-6 µm
4-6 µm
Main Features
LINEA WL-PSG1500
LINEA WL-PSG3000
Capacity 156 mm 125 mm
6 lanes / 1700 wph 6 lanes / 2000 wph
6 lanes / 3400 wph 6 lanes / 4000 wph
WL-PSG Technical Data
Wafer Material
Si MC, CZ, 125x125 mm, 156x156 mm, >150 µm N2, CDA, DI-water, HF waste drains electrical power 400 VAC/3/PE
Utilities Exhaust
2500 m3/h
3200 m3/h
Main Features
LINEA WL-PSG-EE1500
LINEA WL-PSG-EE3000
Capacity 156 mm 125 mm
6 lanes / 1700 wph 6 lanes / 2000 wph
6 lanes / 3400 wph 6 lanes / 4000 wph
WL-PSG-EE Technical Data
Wafer Material
Si MC, CZ, 125x125 mm, 156x156 mm, >150 µm N2, CDA, DI-water, PWC, HF, HNO3, KOH, waste drains electrical power 400 VAC/3/PE
Utilities Exhaust
5500 m3/h
7000 m3/h
Typical Etch Removal/Side
2-4 µm
2-4 µm
Subsidiaries Offices ←
←
Headquarters
China SINGULUS TECHNOLOGIES SHANGHAI Tel. +86 13918298537 greens.pan@singulus.com.cn
Latin America SINGULUS TECHNOLOGIES LATIN AMERICA LTDA. Tel. +55 1121 6524-10 rodolfo.mignone@singulus.com.br
France SINGULUS TECHNOLOGIES FRANCE S.A.R.L. Tel. +33 3 893111-29 singulus@club-internet.fr
Singapore SINGULUS TECHNOLOGIES ASIA PACIFIC PTE LTD. Tel. +65 674 119-12 sales@singulus.com.sg
Germany SINGULUS TECHNOLOGIES AG Niederlassung Fürstenfeldbruck Tel. +49 8141 3600-0 sales@singulus.de
Taiwan SINGULUS TECHNOLOGIES TAIWAN LTD. Tel. +886 2 2748-3366 sales@singulus.com.tw United States and Canada SINGULUS TECHNOLOGIES INC. Tel. +1 860 68380-00 sales@singulus.com
Thin Film Deposition
Surface Engineering
Thermal Processing
Wet Chemical
SINGULUS TECHNOLOGIES – Innovations for New Technologies SINGULUS TECHNOLOGIES develops innovative technologies for economic and resource-efficient production processes. SINGULUS TECHNOLOGIES’ strategy targets the use and expansion of its existing core competencies. This includes process technology and scientific solutions combined with mechanical and plant engineering. The core competence of SINGULUS TECHNOLOGIES rests on vacuum thin-film and plasma technology, wet-chemical processing as well as thermal process technology. SINGULUS TECHNOLOGIES is expanding this expertise in its core segments and is transferring the know-how to new application areas: consumer goods, entertainment, energy, mobility and semiconductors.
2_006 - 12/2015 MetaCom - Printed in Germany - Technical alterations reserved
SINGULUS TECHNOLOGIES AG Hanauer Landstrasse 103 D - 63796 Kahl, Germany Tel. +49 6188 440-0 Fax +49 6188 440-110 sales@singulus.de www.singulus.de