Bisinfotech Magazine May 2019 by Bis Infotech

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MAY 2019|` 80

BISinfotech DCP LICENSING NO. F.2(B-10) PRESS/2018 l VOL 1 l ISSUE 5 l TOTAL PAGES 60 l PUBLISHED ON 1ST OF EVERY MONTH

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EDITORIAL

EDITOR MANAS NANDI manas@bisinfotech.com CONSULTANT EDITOR NILOY BANERJEE niloy@bisinfotech.com SUB EDITOR JYOTI GAZMER jyoti@bisinfotech.com MARKETING MANAGER ARNAB SABHAPANDIT arnab@bisinfotech.com DESIGN HEAD SANDEEP KUMAR WEB DEVELOPMENT MANAGER JITENDER KUMAR WEB PRODUCTION BALVINDER SINGH SUBSCRIPTIONS S. RADHIKA radhika@bisinfotech.com MANAGER FINANCE KULDEEP GUSAIN accounts@bisinfotech.com Bisinfotech is printed, published, edited and owned

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Editor, Publisher, Printer and Owner make every effort to ensure high quality and accuracy of the content published. However he cannot accept any responsibility for any effects from errors or omissions. The views expressed in this publication are not necessarily those of the Editor and publisher. The information in the content and advertisement published in the magazine are just for reference of the readers. However, readers are cautioned to make inquiries and take their decision on purchase or investment after consulting experts on the subject. BisInfotech holds no responsibility for any decision taken by readers on the basis of the information provided herein. Any unauthorised reproduction of Bisinfotech magazine content is strictly forbidden. Subject to Delhi Jurisdiction.

BISINFOTECH|MAY 2019|VOL 1|ISSUE 05

ultinational companies from all over the world are increasingly setting up their research and technology centers in India. These facilities are mainly focused on the areas of R&D, BPM & IT. These centers are commonly known as Global In-house Centers. The main reason for shifting their research operations here in India are no longer just the cost factor. It is technology that is bringing companies here. India has clearly moved away from low cost outsourcing to technology domains like big data, analytics, mobility, artificial intelligence, machine learning, IoT, blockchain and robotics. These facilities are typically integrated with the core business as they are looked as an extended arm of the parent or onshore organizations. They typically have specialized knowledge of the business as they cater to only one customer as compared to a multitenant service provider. The operations by GICs give a margin to the parent organisation in many ways such as fast- paced data proliferation, improved capabilities and hyper-connectivity. Most GICs play a strategic role in building internal innovation capabilities for the parent and act as innovation centre. India today have more than 1500 GICs. These GICs collectively employ roughly 1 million people in India, being an important employment generator. To keep the edge, GICs are planning to invest further in analytics, traditional IT along with digital-age IT, domain expertise and leadership quality as well as cost excellence. GICs are attracting and retaining talented leaders to give direction to the entire enterprise. They are also investing in working processes that lead to high value generation. Finally, cost excellence is being planned to be achieved by paying earnest attention to improving efficiency and productivity. Happy Reading!

ManasNandi manas@bisinfotech.com

CONTENT PAGE

24 COVER STORY

FUTURE TRENDS IN SOC INTERCONNECT

24 08

14 ENGINEER'S DESK

HOW INSTRUMENTATION AMPLIFIERS HAVE EVOLVED

06 42

08 WHITE PAPER

ENERGY SAVING QUAD LOW SIDE INTELLIGENT POWER SWITCHES

54 TREND TAP

AI & IOT – MAKING A BUSINESS SENSE!

42 DIY

VIRTUAL PROTOTYPES 5 CONSIDERATIONS WHEN CHOOSING SOFTWARE DEVELOPMENT PLATFORMS

18 BIG PICTURE

MADHUKAR TRIPATHI SR. MANAGER|SALES AND MARKETING ANRITSU INDIA

22 BIG PICTURE

DANIEL LANG CHIEF MARKETING OFFICER TORADEX

06 AUTOMOTIVE FEATURE DO YOU HAVE THE RIGHT LEVEL OF SAFETY, EFFICIENCY AND RELIABILITY FOR YOUR EV CHARGING SYSTEMS?

39 A&D

F-21, THE JUGGERNAUT FOR INDIAN A&D

12 BIG PICTURE SAMBITSEN GUPTA ASSOCIATE DIRECTOR – FIELD APPLICATIONS AVNET INDIA

17 BIG PICTURE

RAJEEV SAMANTA REGIONAL DIRECTOR - SOUTH ASIA | TYCO SECURITY SOLUTIONS

COUNTRIBUTORS Greg Davis Sr. Product Marketing Manager for Microchip Technology’s Mixed Signal Linear Business Unit Michelangelo Marchese STMicroelectronics Rob Kaye Senior Technical Specialist at Arm STEVE FURBER School of Computer Science The University of Manchester Manchester M13 9PL, UK

ISSUE 05|VOL 1|MAY 2019|BISINFOTECH

Do you have the right level of safety, efficiency and reliability for your EV charging systems?

EV charging stations come in many different types and provide differing speeds (or levels) of charge to a vehicle. Most chargers can be classified into one of two types: 1. AC chargers, which provide alternating current (AC) power to a vehicle’s on-board charger from an electrical utility supply 2. DC chargers, which provide direct current (DC) power to a vehicle’s battery system, bypassing the onboard charger Some chargers may provide the means to perform AC or DC charging within the same unit. AC and DC chargers are also further classified into sub-types based on the differing levels of power they provide and the type of communication that occurs between the charging station and the vehicle. While they may differ in architecture, EV charging stations must meet three basic goals in order to be a viable solution for keeping EVs running on the road. They must be designed for

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safety, efficiency and reliability. This guide provides an overview of the different types of EV charging stations in the market, showing common architectures and how safety, efficiency and reliability are incorporated for the best designs.

AC Charging Stations

The role of an AC charging station is to safely provide power from the utility supply (grid) into the on-board charger inside of the vehicle. The vehicle’s onboard charger does the conversion of AC power into DC power to charge the vehicle’s battery. Due to space and weight constraints in the vehicle, onboard chargers and AC charging stations are typically limited to lower amounts of power (22 kW or less), which translates to a slow charging time (several hours). Fuses rated for AC protection serve to limit the amount of short-circuit or overload current that could flow in the event of a fault or failure in the system. Fuses also

protect the equipment itself from the risk of fire in the event that wiring and printed circuit boards carry excess current than intended due to the wearing of insulation or corrosion or oxidation on electrical conductors. For convenience and ease of maintenance, some fuses and fuse holders are provided with indicating features to let you know if a fuse has opened and which one has opened. Earth/ground faults are another risk of electrical shock for users or equipment damage. Exposure to moisture, miswiring and degradation of insulation on wiring are just some of the causes for earth/ground faults. Leakage currents to parts of the EV charging system that can be touched by users present a risk of shock if they are not limited to a safe level. Additionally, excessive amounts of leakage currents to earth/ground can cause arcing with enough energy to rupture equipment and potentially damage anything nearby the equipment. Earth/ground-fault relays are devices used

AUTOMOTIVE FEATURE

to detect these types of faults and signal the need for appropriate action to take place, which often involves disconnection of the power supply. Outside of safety, equipment performance and reliability are critical for the long-term survival of EV charging stations in outdoor environments. Electrical transients on the AC grid, such as surges due to lightning strikes or voltage fluctuations due to other loads on the electrical grid, tend to be problematic for sensitive electronics in EV charging stations. Overvoltage protection devices, such as metal-oxide varistors (MOVs) and transient voltage suppressor (TVS) diodes, are instrumental in absorbing transient energy from the grid and protecting sensitive systems downstream. Electrostatic discharge (ESD) events are also problematic for some of the “smart” features on AC charging stations, such as user displays with touch screens, communication ports, and antennas for wireless payment and communication systems. TVS diodes and polymer ESD suppressors are often the go-to solutions for reducing the risks related to ESD events.

DC Charging Stations

The role of a DC charging station is to convert power from the electrical grid (AC power) into DC power that can be directly fed into the vehicle’s battery

system for charging of the battery. Since the conversion from AC to DC power is being done in the charging station, these units can provide higher levels of power (50 kW to 350 kW and beyond) to the vehicle compared to AC charging stations. This translates to a faster charging time (30 minutes or less). Since DC charging stations are connected to the AC grid, fuses rated for AC protection are also instrumental for the connections to the grid. These AC fuses tend to be larger in nature since most DC chargers are installed on 3-phase utility supply (as opposed to single-phase supply connections for AC chargers). Additionally, earth/groundfault protection is an important feature to incorporate into a DC charging station design, not only for the AC grid side but also for the DC output side. Most DC chargers are designed with electrical isolation from the AC grid, and thus the DC side must maintain isolation from everything else, including earth/ground. Earth/ground-fault relays for DC voltage systems are instrumental in detecting if an electrical fault has occurred in which the isolated DC side has a leakage path to earth/ground. These systems are often employed to minimize the risk of shock hazards to users. Besides safety, efficiency in power conversion is a major challenge to

overcome when designing DC charging stations. The effectiveness of a design is often measured by the amount of power a charger can deliver to a vehicle versus the amount of power it takes from the AC grid. DC charging stations often employ several stages of AC/DC and DC/DC conversion to get the best level of performance while minimizing overall system size and cost. Efficiency in the power conversion process starts with power semiconductors. Power semiconductors are used to switch on and off the power source and to change the direction of power flow to create stages of alternating current that can be converted to differing levels of voltage or current. This switching action in the power semiconductors leads to heating which is ultimately lost to the surrounding environment and contributes to the reduction of power available for delivery to the vehicle. New enhancements to diodes, insulated-gate bipolar transistors (IGBTs) and metal-oxide semiconductor field-effect transistors (MOSFETs) have allowed these devices to become ever more efficient. Additionally, the commercialization of wide band-gap technologies, such as silicon carbide, have helped newer generations of semiconductors minimize their switching losses to the lowest levels in the market today. With the constant evolution of these power semiconductor devices, there also comes an evolution to the types of drive circuits used to switch these devices on and off. Newer IGBT and MOSFET gate drivers are pushing the boundaries to provide faster switching and higher levels of isolation between the low-voltage drive circuits and the high-voltage power semiconductors. Littelfuse’s application expertise has helped to design some of the most efficient next-generation power converters for EV charging stations.

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Energy Saving Quad Low Side Intelligent Power Switches Michelangelo Marchese

michelangelo.marchese@st.com Abstract- In this paper we present the new quad low side intelligent power switches specifically designed to minimize total power dissipation; thanks to its low Rds(on) per channel and unique in the market the programmable output current limitation and programmable cut-off delay time. Main features of the device, together with applications highlights -based on the company reference board specifically developed- are here reported.

I. INTRODUCTION This paper presents a monolithic high

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speed, fSW up to 100kHz, quad low side switches able to drive any type of load (resistive, inductive and capacitive) with one side connected to supply voltage (Vcc). The device is named IPS4260L, it has integrated on chip four 45V Power MOSFETs channels (260mď &#x2014; typical Rds(on) at 25 degrees Celsius) together with logic, driver, protections and diagnostic. The IPS4260L has been housed in the tiny Jedec standard HTSSOP 20 leads power package. The device is made by using the

STMicroelectronics Multipower-BCD technology; this is a STMicroelectronics Smart Power technology that allows the integration in the same chip both of the control part and of the power stage.

II. IPS4260L BLOCK DIAGRAM

The block diagram of the device is shown in figure 1. Looking at the block diagram you can note that each channel is fully protected. Built-in on silicon we have: Under-voltage lock-out, junction over-temperature protection, thermally independent for

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rail to discharge the load in fast way (see figure below) or have to connect the Vz pin to supply rail to discharge it in slow way.

Fig.2. IPS4260L Application circuit to drive very big inductive load in fast demagnetization.

Under-voltage protection avoids abnormal operations with very low supply voltages, while loss of ground protection switch-OFF the Power stages a soon as the ground references lost for any reason; thus avoiding the device destruction. The junction shut-down temperature for each channel has a typical value of 160 °C; it protects the channel in case of a generic over-load.

Fig.3 HTSSOP 20 power package

Fig.1. IPS4260L Block diagram.

each channel, programmable current limitation (using an external resistor RLIM connect between ILIM pin and SGND), inductive clamp (typically 58V) and supply rail wire break protection. Thanks to current limitation, cut-off time and thermal protections, each channel is self protected against load short-circuit and over-current. Due to the clamping chain at 58V it is realized a demagnetization circuitry; the device is indeed able to manage big inductive loads, discharging the inductive energy in fast way. If the inductive load is very big you have to connect a Zener or TVS diode between VZ pin and GND or Supply

The input blocks of the device are input/ output. They are TTL/CMOS compatible and designed in order to minimize input switching times, and to allow the connection of an optocoupler through a series resistor. The channels are switched ON with a minimum level input voltage > 2.0V. When the channel is in cut-off or thermal shutdown the relevant input pin is internal switched OFF through the open drain transistor. Open drain common status pins are able to drive directly a light emitting diode (LED), they give indications of both cut-off protection or junction over-temperature shut-down (FLT pin) and open load in OFF state or short to GND (OL pin).

III. NON-DISSIPATIVE SHORT CIRCUIT As before mentioned the IPS4260L device has a current limitation protection integrated settable using an external resistor. Together with the junction thermal protection and detection, included on each channel, the IPS4260L has also integrated what is called “non-dissipative short circuit block”, which is intended to limit dissipation of the device as a whole. This further protection avoids the PCB degradation in case of large number of channels in over-load conditions, due to the quick increase of device temperature.

Fig. 4. IPS4260L Waveform in over-load

In over-load condition, in fact, the output current is limited to ILIM for a time interval (tCOFF), which is defined by an external resistor (RCoD) connected between the CoD pin and SGND pin (see Fig.1 or 2). Channel turns off for tRES time and back on automatically so maintaining the channel junction temperature lower than TJSD (junction shutdown temperature). In Figure 4 over-temperature waveforms during over-load are reported. VINX represent the voltage applied to the INx pin, it goes down every time the FLT pin go down while the MCUx voltage stay constant. If the junction temperature reaches TJSD, the over-load channel will restart again only with junction temperature decreased down to TJSD - TJHYST (reset temperature). What is important to highlight is that the thermal protection acts only on the overload channel; non over-loaded channel continue to operate normally. IV. OPEN LOAD DETECTION IN OFF STATE In order to detect the open load fault in OFF state a pull-down resistor have to connect between the PGND line and the output pin (see Figure 5). In a normal condition, the current flows through the network made up of the pull-down resistor and the load. The voltage across the

ISSUE 05|VOL 1|MAY 2019|BISINFOTECH

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load is less than the minimum open load voltage, so the OL pin is kept high level. When an open load event occurs to one of the output, the voltage of the relevant output pins rises to a value lower than the minimum open load voltage and the fault condition is reported on the OL pin after a blacking time (tBKT), to reduce a noise interference. After this time the OL pin goes low to level, thus signalizing the open load.

Fig. 5. Open load detection in OFF state network

In figure 7 you can see the open load in OFF state functionality. The output voltage has been forced from 0V to 10V with a frequency of 10kHz in order to simulate the open load condition. In this figure the VOL goes down after the tBKT time (Typ. 16.5 s). V. REFERENCE BOARD AND APPLICATION TESTS In figure 9 a typical application circuit of the device IPS4260L is reported; it represents the output stage of a programmable logic controller designed for industrial automation or process control. We offer an User Manual and a dedicate graphical user interface (GUI) to drive it. In order to protect the device in low-side configuration from the harsh industrial conditions of power supply lines, usually optocouplers diodes are used to separate the application control circuits from the power supply, as well in the inputs as in the diagnostic pins.

In our example a 47uF capacitor has been selected. The toughest loads can be driven in factory automation/process control are the inductive ones; it is a common case to drive 1.15 Henry nominal load. The associated energy to manage such inductive loads is very appreciable, carrying out a sensible power dissipation and a very high junction temperature: IPS4260L was just designed to drive such a big loads using an external Zener or TVS diode connects between VZ pin and GND or Supply rail to discharge the load in fast way (see figure 2) or have to connect the Vz pin to supply rail to discharge it in slow way. Behavior with shorted load

Fig.9. Waveforms in short circuit conditions with “non-dissipative short circuit block” active (blu VFLT, yellow VIN, red IOUT, green VOUT)

Fig.6 Open load signalization delay In fig. 6 we show the waveforms of the generic Input pin voltage, the relevant Output voltage and the OL pin voltage when an open load event occurs and when it finish.

Fig.7 Open load in OFF state waveforms (yellow VOL, green Vout)

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Fig.8. IPS4260L Reference Board (STEVAL-IFP029V1) Transil diodes protect the Low Side Switch (LSS) against both positive and negative surge pulses to make the device compliant with IEC 61000-4-5. An electrolytic capacitor must be placed on the bus line (Vcc) in order to filter bus inductance effect making supply voltage stable and avoiding under voltage shut-down. The size of the electrolytic capacitor is selected based on the slope of the output current, the impedance of the complex power supply cables, as well as the maximum allowed voltage drop across the device. A low ESR capacitor is suggested, as close as possible to the LSS, in order to filter the power supply line for electromagnetic compatibility concerns.

Over-current and short circuit of the load to the supply voltage are the harshest events we must face during the digital output operation. In these bad events, the output stages must survive dissipating all the associated energy. Besides the loads, connected to the output stages, must be protected from the peak of current that could reach unexpected values. In order to safely manage very high peaks of currents during short circuit of outputs to the supply voltage a current limitation block is integrated on chip. As result only a current spike for a short time is allowed; just the time needed to intervene the current limitation circuitry, so trimming the maximum output current using an external resistor. It is the same during a hard over-load. Internally limited output current is not enough however; in fact, if short circuit or over-load duration last during the time, the power dissipated into the device as

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well as into the load, become important so In fig. 10, when the function of “noncausing an over-heating able to destroy dissipative short circuit block” is disabled, the device and/or the load involved. we see that need a first long step to Because of that “non-dissipative short reach the thermal junction shut-down. circuit block” has been built-in on chip After this the over-loaded channel is which limits the duration of the current switched OFF, so going to zero the output limitation condition of the over-loaded limited current. Diagnostic signal of the channels. The duration, named Cut-off over-loaded channel is normally high current delay time (TCoff,), is setting by until the thermal protection intervention an external resistor (RCoD) connected switching it OFF, at that time diagnostic between CoD pin and SGND ground in FLT pin and in relevant input pin go low plane. After this time the channels rest so signalizing the thermal intervention. in OFF for a time, named power stage Normal operation restarts when junction restart delay time (tres), to avoid the PCB temperature, TJ, comes back below the degradation in case of large number of reset threshold, TJSD - TJHYST, and the channels in over-load conditions and cycle begin again. to reduce the energy that flows in both Behavior with capacitive load device and loads. If during the TCoff the junction temperature of the over-loaded channels reaches the an internally set value (TJSD) the junction thermal protection blocks, one for each channel, switch OFF the channels. They restart only when Tj come back below the reset threshold. It is possible to disable the “non-dissipative short circuit block” connecting the CoD pin in short with SGND ground plane, thus only the junction thermal protection is active into the IPS4260L. Fig.11. Waveforms with capacitive load 3.3mF / 63V (yellow Vout, blue Iout, red Vflt)

Fig.10. Waveforms in short circuit conditions with “non-dissipative short circuit block” disabled (red VFLT, blue IOUT ) In figure 9 and 10 waveforms are reporting output current (Iout), in one channel, and diagnostic voltage (VFLT) during short circuit conditions; as you can see in both figures the output current, after a short peak, is limited at a fixed value. In figure 9, in addition, we report the output voltage of the relevant channel and the input voltage that follow the waveform of fault voltage because the input pins of the IPS4260L are used for diagnostic purpose.

IPS4260L can also drive a capacitive load without problems; it is able to drive capacitors with very high capacitance. In figure 11 waveforms are reported driving a 3.3mF/63V capacitor. Due to the big capacitance, the output current during capacitor charge is in current limitation, so that we do not see the real charging current but the limitation current externally set by the resistor. After the TCoof you can see the “non-dissipative short circuit protection” intervention, so that the power output loaded is switched OFF as well as per over-load or short circuit. When the capacitor is almost completely charged the current goes below the set current limiting: this is clearly shown in figure 13 where you can observe in the middle of the blue color waveform a sudden change of slope in the charging current until reaching zero value (capacitor completely charged). When the output capacitor is charged and you give a low voltage to the input the OL pin behavior corresponds to the short to GND case,

because of the voltage on it. This means that in OFF state (input voltage low) the diagnostic signal of OL pin (normally high) goes low (see truth table at figure 12).

V. CONCLUSION

A smart monolithic quad low side switches has been presented. The new intelligent power switch (IPS) provides improved accuracy to minimize energy losses and prevent system errors when faults occur. These advantages are achieved using ST’s latest generation Multipower-BCD technology, which allows a programmable over-load current limit to maintain stable power conditions while the system is recovering. By providing an integrated solution for four output channels, the IPS4260L also simplifies design, enhances reliability, and saves pcboard space. This new quad-channel IC is an important addition to ST’s portfolio of industrial IPS, which already includes single, dual, quad and octal-channels high side devices.

Fig.12. IPS4260L truth table

Fig.13. Thermal intervention with very high capacitive load in IPS4260L when the “non-dissipative short circuit block” is disabled (yellow Vout, blue Iout, red Vflt)

REFERENCES

[1] “IPS4260L Quad low-side intelligent power switch,” Datasheet, www.st.com. [2] “UM2297: Getting started with the STEVAL-IFP029V1 for the IPS4260L high speed quad low-side driver with dedicated GUI” User Manual, www. st.com.

ISSUE 05|VOL 1|MAY 2019|BISINFOTECH

BIG PICTURE

PASSIVES PLAY A MAJOR ROLE IN MAKING YOUR PRODUCT MORE SUCCESSFUL AND EFFICIENT

2019 has already proven to be an interesting year for the passive and interconnecting electronic components in India. It is expected that the government will focus and drive strong initiatives in the infrastructure projects after the elections, quotes Sambit Sengupta, Associate Director – Field Applications, Avnet India. Stating further with Niloy Banerjee of BISinfotech, Sambit underlines Avnet’s focus, strategies and the market dynamics of the passive and interconnecting electronic components market. Edited Nub.

SAMBIT SENGUPTA

Associate Director – Field Applications, Avnet India

How vigorously innovations are evolving in this passive and interconnecting electronic components market? There are widespread innovations happening in the interconnects and passive components market due to the rapid scale-up of new designs in Internet of Things (IoT) and Artificial Intelligence (AI). The main key component in any innovative product is sensor. Most established enterprises (whether SMEs or big original equipment manufacturers (OEMs))are looking at sensorization of their existing product offerings. They work with companies like Avnet who guides them on the optimization of component selection for their existing products. AI at Edge devices like SmartEdge Agileare helping to increase multiple passive and type-c connectors.

What macroeconomic factors are directly or indirectly affecting the development of the global Passive and Interconnecting Electronic Components market? Passives are not onlythe peripherals in any design board but they play a major role in making your product more successful and efficient. In the last one year, due to increased global demands the supply chain of passives was stretched. This affected the projects in automotive and industrial products. There were local programs like Aadhar and smart meter projects which gave a boost to passive and interconnect components. Avnet in India has a dedicated team of highly skilled professionals working on passives and interconnect components requirement which helped us to meet and exceed the demands of customers.

What challenges still hinder this sector? Factors such as shortage of materials, high lead time and need for reliable partners will hinder this sector. There has been little encouragement to local manufacturers hence the ecosystem is slow. Much of the materials can be innovated locally and catered to OEMs, but that will require strong support from local government. This sector requires strict quality assurance and there is always the grey market that affects the product performance. The role of purchaser at OEM matters greatly- to choose devices from the right sources. Avnet is working with its partners from reputable multinational companies and also works with Asia based manufacturers to meet the stiff price competitions while maintaining the quality of devices in market.

2019 has already proven to be an interesting year for the passive and interconnecting electronic components in India

2019 has already proven to be an interesting year for the passive and interconnecting electronic components in India.It is expected that the government will focus and drive strong initiatives in the infrastructure projects after the elections. The implementation of smart energy, secure Aadhaar based products, various connectivity products and OEM approved AIS-140 based vehicle tracking systems will accelerate the demand and potentially hit high doubledigit growth rates. However the second half of the year will show the trend at rapid scale up.

Lastly, If you want to shed some light on your focus into the Indian market and what key markets do you reckon to be the biggest consumers W h a t K e y f a c t o r s w i l l d r i v e t h e P a s s i v e a n d For Avnet, Automotive and Smart energy meterare our Interconnecting Electronic Components market in 2019? biggest markets.

BISINFOTECH|MAY 2019|VOL 1|ISSUE 05

ENGINEERS DESK

HOW INSTRUMENTATION AMPLIFIERS HAVE EVOLVED Greg Davis

Sr. Product Marketing Manager for Microchip Technology’s Mixed Signal Linear Business Unit

The need for instrumentation amplifiers

Instrumentation amplifiers (INA) are based on the same architecture as op amps. We could say that it is a somewhat specialized version of an op amp. Due to their high differential gain, they are used in amplification of micro-volt level sensor signals. At the same time, we can also reject high voltage common-mode signals. This is very useful in cases where we need to accurately capture a relatively small change in voltage or current, such as that produced by some sensors. INAs have several applications. For example, it’s present in a medical instrument used in vision correction eye surgery, where high accuracy is crucial. The instrument uses sensors to align laser stepper motors. If sensor signals are compromised in the equipment in the operating room, it can cause unexpected results. INAs are also used in factory presses. These machines bend metal into shapes by using thousands of pounds of force. To ensure safety, the machines use sensors that are designed to bring the machine to a stop in case it detects a human hand. The system could malfunction if there is interference from electrical noise from other equipment, leading to dire consequences. Therefore, the signal needs to be detected accurately from the sensors. Both the above instances demand that tiny sensor signals must be accurately amplified in all environments, which is exactly what instrumentation amplifiers are designed to do. Some things to consider while using INAs. Low power consumption allows the battery to be used over more of its depletion curve, thereby extending its life. Also, for compatibility with more sensors, a wide input voltage range is recommended, along with impedance matching at the input.

The INA inputs that amplify the differential voltage are connected to the sensor outputs. There are several sources of noise, both radiated and conducted. Switching power supplies, motors and wireless devices are some of the typical noise sources. Shielding and good PCB layout practices can help mitigate some of the noise, although some noise still gets through. Since most of that noise shows up as an in-phase, we can reduce this voltage and maintain good accuracy by superimposing common-mode voltage (VCM) on the differential input sensor voltage (VDM), and by using a properly designed instrumentation with good Common-Mode Rejection Ratio (CMRR). A minimum CMRR is typically specified at DC, while the AC CMRR performance is documented in performance curves.

The discrete difference amplifier

How INA designs evolved

Given the performance benefits that INAs offer, they have evolved to find applications across consumer, medical and industrial segments. There are several performance improvements seen in present-day instrumentation amplifiers, compared to original approaches. Here’s a look at some of the approaches. To set the context, the diagram in Figure 1 gives us a context into what we are trying to accomplish.

Figure 1: Sensor interface to INA block diagram

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Figure 2: Discrete difference amplifier

A simple difference amplifier works if you need to amplify the voltage difference across the sensor output. There are a lot of downsides, however. For example, if we refer to in Figure 2, which shows a simple implementation, VIN+ is biased to VREF (typically ½ the supply voltage) for single-supply applications. The operational amplifier is designed to amplify differential voltages and also provides good CMRR, but the circuit surrounding it can often overwhelm it. The ability of the op amp to reject common-mode signals is limited by any mismatch in the external resistors (including mismatch contributed by any divider network connected to VREF) limits. This results in reduced CMRR. It not possible for resistor tolerances to maintain a good CMRR that one expects from an INA are simply not tight enough. The equations below show how much the resistor mismatch affects CMRR. This equation uses a difference amplifier with G = 1V/V, and TR is the resistor tolerance,

ENGINEERS DESK

• If TR = 1%, worst case DC CMRRDIFF will be 34 dB • If TR = 0.1%, worst case DC CMRRDIFF will be 54 dB Where ‘K’ is the net matching tolerance of R1/R2 to R3/R4 K can be as high as 4TR (worst case)

The amplifier amplifies the differential voltage at the input, and the gain of the amplifier is: VOUT = G * VDM = (R1/R2) * (VIN+ - VIN-) + VREF The issue arises because the differential voltage (VIN- and VIN+) includes superimposed noise. Therefore, the common-mode voltage that is not rejected (as a result of poor CMRR) will be amplified. This will result in the output being corrupted by noise. There are other drawbacks too. Even the input impedance of an operational amplifier is typically high (MΩ to GΩ range), it gets both reduced and imbalanced due to the feedback path and reference. This loads the sensor and adds to the inaccuracies. Because of the poor gain accuracy in the presence of noise, this circuit is not useful for instrumentation purposes.

for most instrumentation amplifiers, is set by the ratio of internal resistors, R2/R1. The balanced signal paths from the input to the output yield excellent CMRR. System costs are lower since the design has a small footprint and fewer components, and is simple to implement. The design is also compatible with singlesource supplies using the VREF pin. There are some limitations, however, even with this design. The feedback architecture can substantially degrade the AC CMRR given that the three op amp INAs achieves high CMRR at DC by matching the on-chip resistors of the difference amplifier. In addition, this is an issue of mismatches and reduced CMRR over frequency due to parasitic capacitances that cannot be completely matched. The common-mode voltage input range is limited to ensure that internal nodes do not saturate. The VREF pin needs a buffer amplifier for optimal performance. Also, since the temperature coefficient of the external and internal gain resistors is not matched, it results in a decline in CMRR. Mathematically the gain accuracy depends on resistor matching:

Three operational amplifier IC Indirect current feedback

Figure 4: Indirect current feedback approach Figure 3: Three operational amplifier IC approach

The three operational amplifier IC is essentially a common INA packaged in a single integrated circuit (IC). The circuit is divided into two stages. The input stage consists of two inverting buffer amplifiers, while the output stage is a traditional difference amplifier. Trimmed resistor semiconductor designs make it possible to the internal resistors used throughout this design to a very close tolerance; resulting in a much higher CMRR. Loading of the sensors is minimized by the high impedance that the input stage amplifiers provide. The designer can select any gain within the operating region of the device (typically 1 V/V to 1000 V/V), using the gain-setting resistor, RG. The output stage is a traditional difference amplifier. The gain of the internal difference amplifier, which is typically G = 1 V/V

The Indirect Current Feedback (ICF) INA is made up of two matched transconductance amplifiers, GM1 and GM2, and a high-gain transimpedance amplifier (A3). It brings a novel approach to the voltage to current conversion process and does not rely on balanced resistors. Manufacturing cost is lower since it does not require internally trimmed resistors. Also, it does not require that the external resistors match any of the on-chip resistors. To ensure minimal gain drift, however, it is important that the RF and RG external resistors temperature coefficients match as closely as possible. Increased frequency does not cause the AC CMRR to decrease significantly. Also since amplifier GM1 rejects common mode signals, IDC CMRR is high. The input range for the three operational amplifier is limited to avoid internal node

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ENGINEERS DESK

saturation. By contrast, the ICF has an expanded range of operation since output voltage swing is not coupled to the input common-mode voltage. The second stage (GM2 and A3) differentially amplifies the signal and further rejects commonmode noise on VFG and VREF. For single-supply operation, we need to apply a bias to VREF. The ICF INA gain is:

Where VDM is the differential mode voltage

Typical applications

Figure 5 shows a few typical applications for an INA. It shows a variety of sensors that are accurately amplified by an INA that feeds a converter and microcontroller. Figure 5: Examples of a typical circuit using an INA with a sensor

Summary

There has always been a need to amplify small signals in the presence of noise; although that need has evolved with time. Approaches such as the discrete operational amplifier and integrated three operational amplifier have some disadvantages when used for this function. The discrete operational amplifier,

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despite being the simplest approach, is not suitable as an INA. The integrated three operational amplifier approach does have some significant advantages such as high DC CMRR, balanced and high input impedances with one gain resistor. At the same time, it has limitations around common-mode voltage and difficulty in matching internal versus external resistor temperature coefficients, resulting in gain drift. Additionally, there can be negative impact of impedance at the VREF pin on CMRR unless a buffer is used. The ICF approach too has a high CMRR (even at higher frequencies), a wider common mode voltage range and no on-chip trimmed resistors resulting in lower cost and low temperature coefficient gain drift. With INAs, designers have an excellent method to amplify microvolt level sensor signals. At the same time, the INAs reject high common-mode signals found in noisy environments.

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WE DON’T LIMIT OUR EFFORTS TO PRODUCING WORLD-CLASS PRODUCTS Our philosophy is to “get more out of less” and each one of our business practices is directed towards making the customer’s life easier narrates Rajeev Samanta l Regional Director - South Asia l Tyco Security Solutions on an interview with BISinfotech Consultant Editor, Niloy Banerjee, where he entails on Tyco’s advanced solutions for its customers and its bequest for Smart Cities Mission. Edited Nub

RAJEEV SAMANTA

Regional Director - South Asia l Tyco Security Solutions

How the business has been following the Tyco merger with Johnson Controls and what strategies does the merger bring to the Indian market? We put in well thought out strategies that worked well for the company at the time of the merger. The process was kept separate from routine business operations which allowed for consistency. Usually, it is easy to overlook customer experience at the time of such a big change, but in our case, there was an immense focus on maintaining outstanding customer experience. Post the merger; we have witnessed greater synergies in our work which has contributed to a larger stack of offerings. It has led to the development of a one-stop shop for customers interested in integrated solutions. Together, these factors have led Tyco to exponential business growth through 10 years of existence in the Indian market.

That one unique solution or service that our niche readers should know about? Every solution that Tyco brings to the market has something unique for the customer segment that it intends to cater. In the past, Tyco’s products across access control, video surveillance and intrusion have facilitated the construction of smart buildings - the benefits of which range from productivity gains to sustainability. Our engineering teams have developed some of the most advanced solutions for video surveillance, Access Control, and Intrusion Detection. Our solutions portfolio also comprises products that are cost-effective yet high quality and can be used in low-budget areas.

The unique business proposition of TYCO which keeps the company ahead of its competitors? Tyco’s unique business proposition goes beyond the product offering and includes one of the most significant parts of the business - a distinctive go-to-market strategy. We don’t limit our efforts to producing world-class products but also go a step ahead to provide stellar technical after-sales support. Our philosophy is to “get more out of less” and each one of our business practices is directed towards making the customer’s life easier. We also invest significant resources in adopting a holistic approach to protect our customer’s investments.

Security today is an inclusive word, defining, lifestyle, women security, better employment etc. Apparently, on physical or virtual world, ‘Security’ seems more critical than ever. What are your offerings and solutions/services to build a Safe, Smart City? Over time, the definition of security has also evolved to include sustainability, improved standard of living, and workforce efficiency as a larger concept. Lately, the discussion around smart cities has fueled the emphasis on the need for high-end and smart security. Tyco’s security solutions are well-suited to the address needs for everyone and everything. Our product/ solutions portfolio has the ability to distinctly address the specific needs of every customer segment. Moreover, all the solutions are compliant with cybersecurity norms which enable the creation of a threat-free security system.

Technology advancements to bring new threats challenging Security perennially. How you think security will shape in coming time and how we can envision a secure future slating Digital transformation as a business and value proposition than just proclamation? Technological advancement, dynamic security paradigms, evolving security ecosystem are universal truths - these factors will only cease to exist/evolve if the world stopped moving. It is a cycle - there will be newer threats to security and more effective solutions will be developed to tackle those. With advanced challenges, the industry will get positively pushed to develop newer solutions especially in the areas of deep learning and artificial intelligence. This will end up bringing proactivity in the security solutions space and change paradigms on a regular basis.

Lastly, how is your company aligning itself with Govt. initiative like ‘Smart Cities Mission’ and ‘Digital India’? The ‘Smart Cities Mission’ was launched to address the need of the hour - which is to build an ecosystem that enhanced the standard of living of resident communities. Tyco provides a variety of solutions that capture and analyze data points and turn them into information that enables better awareness for decision makers. These solutions aid the implementation of policies by law enforcement agencies. In the past, Tyco has provided state of the art integrated solutions which have powered smart city projects and have led the brand to provide a stream of benefits for the ecosystem.

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5G R&D IS CURRENTLY KEY DOMINATING MARKET IN INDIA

Indian telecom ecosystem has learnt from past and this time working parallel with global telecom technology. Government of India have set up high level committee for 5G work and supporting industry for various use cases of 5G, cites Madhukar Tripathi, Sr. Manager, Sales and Marketing | Anritsu India. In a candid interview with BISinfotech, the T&M industry veteran underlines the criticalities and testing trends in the emerging 5G environment. Edited Nub.

Madhukar Tripathi Sr. Manager, Sales and Marketing | Anritsu India

In addition to having faster speeds, larger capacity, multiple connections, and lower latency, 5G requires much more complex signalling to support coexistence with 4G and previous systems. As a result, for the complex signalling vendors developing 5G chipsets, wireless communications modules, and terminals such as smartphones must need to further evaluate messages (whether notified normally) sent and received in data communication etc. during signalling, as well as RF signal (tests, measurements) during signalling. Based on its experience in face-to-face consultations to help customers' engineering teams overcome difficulties in deploying 3G and 4G Long Term Evolution (LTE), Anritsu has accumulated key strengths in various technologies and knowhow, including signalling, protocol and RF measurement. Anritsu uses these strengths built over many years to offer customers optimized 5G measurement solutions supporting the fastest time to market (TTM). As part of the development of mobile communications systems through 3G and onwards to 4G, Anritsu has worked on evaluating customers' products in cooperation with vendors of chipsets and communications modules as well as terminal makers, helping accumulate know-how about various technologies, including signalling, protocol and RF measurement, and forming the basis of the company's product strengths. Today, the culmination of these strengths in 5G chipset evaluation is Anritsu's Radio Communication Test Station MT8000A measurement solution(supported both sub-6GHz and millimeter-wave), which has been adopted by worldleading customers including 5G chipset vendors for chipset signalling/protocol evaluations as well as for evaluating RF performance in OTA(Over The Air) environment with chamber. Customers using the MT8000A to develop commercial 5G products can now get ahead of the competition and shorten TTM.

Indian T&M market is full of opportunity. 5G R&D is currently key dominating market. All major chipset companies are investing for 5G ecosystem. Educational market is growing and need latest test instruments. Rental market is growing since all telco prefer low cost, short time use T&M. Many defence projects need T&M due to upgrade of telecom network used by them. Government initiative of Digital India, Broadband for all, and Smart Cities is creating demand for low cost I&M Test Instruments. Cable digitization is creating demand for many low cost T&M. Automotive electronics is other area which is creating demand for T&M.

What is the integral testing requirement in a 5G ecosystem and how is Anritsu simplifying it?

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Currently, according to you, what are the key markets in India for T&M and how strong is Anritsuâ&#x20AC;&#x2122;s foot in it.

What key challenges do you witness currently in the Indian market and is Anritsu keeping itself ahead of the curve?

Anritsu has been front runner to provide latest state of art test and measurement solution to telecom industry. Anritsu works closely with telecom industry and based on input, new test features are developed and offered to industry. 5G coming in picture test scenario is totally different & Anritsu is ready with 5G test UE, Chip test solution and network test solutions.

Key offerings of Anritsu which is dominating the Indian market currently?

Anritsu 5G Test solution knows as Radio Communication Test Station MT8000A is most powerful tool available in industry for 5G chip+UE test. The MT8000A is a test platform designed for the latest technologies required by 5G systems, such as wideband signal processing, beamforming, etc. It simulates base-station operations for testing the functions and performance of 5G terminals and chipsets in development, and one MT8000A

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units supports both the sub-6 GHz and mmWave bands used by 5G. Additionally, combined use with a radio anechoic chamber enables tests of mmWave signal quality and communications procedures in an OTA environment. The ME7834NR is an automatic system for both 5G NR operator acceptance and protocol tests as well as for 5G NR protocol and conformance tests. Operators already using the ME7834LA for LTE protocol tests can upgrade easily to the ME7834NR.

Anritsu has various 5G products and measurement solutions as well as the MT8000A.

Conformance Test Photograph

How soon do you see 5G coming into the Indian Telecom affair wherein our neighbouring country, for, eg – China has already made 5G a reality for their people? Indian telecom ecosystem has learnt from past and this time working parallel with global telecom technology. Government of India have set up high level committee for 5G work and supporting industry for various use cases of 5G.Due to large geography, procedural delay it may take some time to see 5G in India. Indian market is very price sensitive and adaption of 5G use cases must bring reasonable cost effective devices to make 5G success in India. Once spectrum is identified and allocated, teleco will be able to roll out network faster and 5G success will depend on devices availability.

Latest trends in the Telecom T&M segment in India?

Most of telecom operators are opting rental model of T&M.Telecom R&D, telecom production segment purchase T&M.

Name/Explanation • 5G NR Mobile Device Test Platform ME7834NR The ME7834NR is for performing the Protocol Conformance Test (PCT) and Carrier Acceptance Test (CAT) of 5G NR chipsets, communications modules, smartphones and other radio equipment. It is used for development and quality assurance of 5G terminals and for test-house certification. It supports both 5G NR SA and NSA modes, and covers the 3GPP-specified 5G communications band from sub-6GHz to mmWave when used in combination with an OTA chamber and RF converter. Existing ME7834 systems can also be upgraded to the ME7834NR specifications to support both conventional LTE/LTE-A/LTE-A Pro/W-CDMA and 5G protocol tests. • New Radio RF Conformance Test System ME7873NR The ME7873NR is an automated test system for 3GPP TS38.521 compliant 5G NR measurements. With design support for both 5G NR standalone (SA) and non-standalone (NSA) modes, combined use with the 5G over-the-air (OTA) chamber (CATR) covers the 5G frequency bands including the sub-6 GHz and mmWave bands. The flexible system configuration can be tailored to measurement conditions and an upgrade for 5G is available from the ME7873LA supporting RF and carrier acceptance inspection tests for LTE, LTE-Advanced (LTE-A), LTE-A Pro, and earlier W-CDMA mobile terminals, helping customers to configure a cost-effective RF test system matching all their requirements.

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INDUSTRY MARKET

X-RAY SCREENING & BIOMETRIC SYSTEMS STUDY The approximately US$ 7.8 billion market for security screening is highly likely to approach the revenues worth US$ 10 billion in the next two years. As indicated by a newly launched research report by Future Market Insights (FMI), more than half of the total demand for security screening is being accounted by the developed regional markets. East Asia however is cited as the most lucrative market for investors in security screening systems and solutions. Rapid growth in the economy, necessitating increasing expenditure on the national and infrastructural security, will continue to push deployment of reliable and advanced technology enabled security screening systems. While FMI’s analysis identifies an impressive rate of adoption within emerging economies, China, India, and Russia are more likely to be at the forefront of this growth, in the security screening market. Airports Generate Maximum Demand for Security Screening, Explosive Trace

Detectors Bestselling Over 2/5th of the global security screening demand is accounted by airports, which will remain the dominant application area for security screening systems manufacturers and suppliers. As government buildings are highly vulnerable owing to the voluminous sensitive information that they procure, public recreation areas such as malls are also cited as the next sensitive area for implementation of effective security screening. Border check points are also expected to emerge lucrative through coming years, in the security screening

market. Explosive trace detectors, currently accounting for nearly 1/4th share of the total sales of security screening systems, will reportedly witness strong growth in demand through the coming years. According to the report, X-Ray screening systems and biometric systems are also highly popular among the end-use application areas in security screening market. The collective market value share of the aforementioned security screening systems is just-under 50% and the report expects attractiveness of the latter to surge - with growing adoption of fingerprint and face recognition technologies. Smart Security Screening Trending in the Global Market Looking at the loopholes in current security screening models in terms of efficiency and sustainability, airports have been accelerating the industry’s shift to smart security screening solutions, over the recent past.

GLOBAL MAGNETIC SENSOR MARKET

Global Magnetic Sensor Market Is Driven by Internet-of-Things (IoT) in Various Industrial Applications, Smart Products, and Advancements in the Automotive Industry What is A Magnetic Sensor? A magnetic sensor is a small-scale micro electrochemical system (MEMS) device for detecting and measuring magnetic fields. This sensor acts as a transducer which varies its output voltage in reaction to a magnetic field. Key Applications Of Magnetic Sensor These type of sensors are used for proximity switching, speed detection, positioning, and current sensing applications. Moreover, these sensors also detect changes and disturbances in a magnetic field, like flux, strength, and direction. Future Market Insights (FMI) ‘Magnetic Sensor Market – Global Industry Analysis 2013-2017 and Forecast 2018-2028’ Report The global magnetic sensor market is expected to expand at a CAGR of 4.8% during the forecast period. The global

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magnetic sensor market was valued at US$ 1,906.1 Mn in 2018, and is projected to increase significantly to reach US$ 3,053.5 Mn by 2028.This growth is envisioned due to an increase in the demand for magnetic sensors for multiple applications in automotive and IoT. This report includes magnetic sensors which are based on Hall Effect, AMR (Anisotropic Magneto-Resistive), GMR (Giant Magneto-Resistance), and TMR (Tunnel Magneto-Resistance)

technologies. The global magnetic sensor market is categorized by technology, application, and region. By technology, the market is segmented as Hall effect, AMR (anisotropic magneto-resistive), GMR (giant magneto-resistance), and TMR (tunnel magneto-resistance). Key Statistics and Market Trends of Magnetic Sensor Market The Hall Effect sub-segment is expected to account for a relatively higher CAGR of 5.2% during the forecast period. The Hall Effect sub-segment also accounted for the largest market share of 45.4% in 2017. Moreover, technological advancements in vehicle technology, increasing electrifications, and the growing demand for smart products are some of the major factors which are fuelling the growth of the global magnetic sensor market. On the basis of application, the global magnetic sensor market is segmented by industrial, automotive, consumer electronics, and others.

INDUSTRY MARKET

PASSIVE & INTERCONNECTING ELECTRONIC MARKET The global Passive and Interconnecting Electronic Components market is valued at 26000 million US$ in 2018 is expected to reach 33600 million US$ by the end of 2025, growing at a CAGR of 3.2% during 2019-2025. Passive electronic components include capacitors, resistors, inductors, and transformers, while interconnecting components primarily encompass connectors and switches in addition to PCBs. Growing demand for consumer electronic such as portable music players, digital cameras and gaming consoles in addition to desktop PCs and laptops has been contributing to growth in the electronics industry. Enhancement and development in software is also giving rise to the need for compatible hardware. Electronic components are used in the automotive sector as well, which can be attributed to technological advancement and incorporation of communication, infotainment and navigation features such as global positioning systems (GPS).

Medical electronics is also a fast growing end-use sector. Portable electronics have been witnessing high adoption across the globe, spurred by remote communication facilities. Since these products are also used in integrated circuits, demand is expected to remain strong over the forecast period. As a result of growth in end-use industries in Asia Pacific, the market in this region is expected to remain the largest and fastest growing over the next few years. Transition towards communication standards such as 3G and 4G LTE is expected to be favorable for industry growth. Furthermore, growth

in Internet bandwidth and burgeoning adoption of Internet services in India, China and other nations is expected to result in corresponding demand for electronic devices and components. Large number of market participants has resulted in intense competition globally. Key industry players include 3M Electronics, Actel Corporation, Agilent Technologies Inc., Altera Corporation, Fairchild Semiconductor, Intel Corporation, Kyocera Corporation, ST Microelectronics, and Xilinx, Inc. among others. The progress of the international passive and interconnecting electronic components market is principally accompanied by the incessant inventions and overview of progressive and well-organized skills in the electronics manufacturing. The increase of consumer electronics for example Mobile handsets, Tablets, Laptops, Digital Cameras, Portable music players, and Gaming Consoles is giving a substantial thrust to the market.

ASEAN SAFETY SENSORS & SWITCHES MARKET FORECAST Adoption of safety sensors and switches across the ASEAN industries will be prominently driven by those based in Indonesia, Malaysia, and Thailand. FMI has positioned Philippines and Vietnam as high-growth economies in the region’s safety sensors and switches market. The market for safety sensors and switches in ASEAN countries is likely to grow by more than 8%, yearly, in 2019 as depicted in a new research study of Future Market Insights (FMI). Safety sensors and switches are being installed almost everywhere, especially in manufacturing and processing industries such as automotive, oil & gas, pharmaceuticals, and food and beverages, where the risk of institutional and personnel damage is high. The high demand from these industries due to personnel safety regulations is expected to push the growth of the safety sensors and switches market within the region. Automotive & Aerospace Industry Generating Notable Demand

According to the report, the oil & gas industry’s resurgence, soaring utilization of heavy duty machinery across verticals, and thriving pace of industrial automation and Industry 4.0 adoption will collectively necessitate the demand for streamlining of safety and security measures, thereby driving the revenue of ASEAN’s safety sensors and switches market. Currently, over 60% of overall demand for safety sensors and switches is underpinned by the industrial end use sector, a third of which is accounted by the automotive

and aerospace industry, followed by food and beverages industry operators. FMI’s analysis reveals that oil & gas, metal & mining, and packaging industries will demonstrate high growth potential in the near future, in terms of adoption of safety sensors and switches. The report attributes surging installations of safety sensors and switches across industrial space to the tightening regulatory framework related to workplace safety and security, particularly for industrial workers. ASEAN economies are looking forward to levy stringent safety regulations in the case of industries and commercial spaces to avoid any kind of damage or loss to property or life. This according to the report has created a potential opportunity for the safety sensors and switches market. Categorically, among all safety sensors and switches, pressure sensors and transducers are likely to hold a revenue share of over 2/5th of the total market value.

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WE PLAN TO USE TORIZON AS A PLATFORM AND EXTEND IT OVER TIME.

Torizon allows us to integrate partner software in our continued testing infrastructure, so our customers don’t need to worry about third-party software integration, notes Daniel Lang l Chief Marketing Officer l Toradex talking to BIS Consultant Editor, Niloy Banerjee, about Torizon, the recently announced software product and what the customers can look forward alongside Toradex’s way forward. Edited Nub

DANIEL LANG

Chief Marketing Officer l Toradex

You recently announced a software product. Please provide more details. We announced the beta of Torizon, an easy-to-use Industrial Linux platform. It comes free with our Arm-based SystemonModules. It is designed to provide an intuitive, secure base operating system that allows for easy overthe-air updates. This was based on feedback from our customers about the steep learning curve and maintenance effort required for our maximally customizable, production-quality Linux BSP based on the Yocto Project. We looked for alternatives, and after an in-depth evaluation of many OSs, such as Android, Windows 10 IoT Core, Commercial RTOS and different Linux flavors, we decided that for most of our target customers, a Linux-based system in the best choice. However, that meant we had to improve on ease-of-use. The result was Torizon, a small Linux distribution which contains an over-the-air update client and the docker container runtime. The containerization simplifies software maintenance. We also provide integration with popular tools, such as Visual Studio and Qt. It’s optimized for connected devices with secure and safe remote update capabilities.

time. Toradex has a large partner ecosystem for software and services.Torizon allows us to integrate partner software in our continued testing infrastructure, so our customers don’t need to worry about third-party software integration. You can also expect more functionality involving updates, device management, provisioning, and so on.

Why this shift in focus? We don’t really see it as a shift in focus. While Toradex continues to only sell hardware, we have always had most of our engineering efforts invested in software. Originally, Toradex became famous for its high-quality,intuitive Windows CE OS which was preinstalled on the SoMs. With the increasing popularity of Linux, Toradex focused on a highquality Linux BSP and support — and while the Yocto Project provided flexibility, it was difficult to make it as simple to use as Windows CE/ Windows Embedded Compact. With Torizon, we bring the simplicity back while taking advantage of the Linux ecosystem, so it’s ideal for people moving from Windows CE / Windows Embedded Compact while providing the quality required for industrial, medical and other critical applications.

Toradex provides an unmatched developer experience when it comes to industrial product development.

Do you plan on having similar products in the future? We plan to use Torizon as a platform and extend it over

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Tell us about your company’s 5-year growth plan? Toradex is growing fast, something we expect will continue in years to come. We are currently hiring all over the world.

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Over the next five years,we will continue expanding Torizonwith more services and features â&#x20AC;&#x201D; not only from Toradex, but also from our partners. With the increased connectivity, we see new requirements, such as better security and over-the-air updates. We will provide solutions that simplify these challenges for our target customers. There are also new hardware products in the pipeline, and you can expect more comprehensive integration with many of the peripherals our partners provide. This will further simplify product development.

What makes Toradex a global game-changer? Toradex provides an unmatched developer experience when it comes to industrial product development. Our documentation, ecosystem and support together provide a fast,low-risk way to bring a product to market. In the last 15 years, Toradex has built a track record of providing the highestquality products with over 10 years of availability and product support. Our focus on pin-compatibility allows customers to stay flexible and reuse their existing work for different products.

Your company is 15 years old now. What have been your top 3 contributions to the industry? - Ease-of-use for industrial embedded product development: As mentioned above, we simplified how hardware and software

development is done in our industry. - The direct online sales model: When we started selling our first product in 2005, we set a new standard for how to purchase computer modules, with a simple online store and transparent pricing. There are no contracts, no minimum order quantities, and no negotiations. This model worked especially well in Europe. We still have this as the core of our business, but we have also adjusted for regional differences,so weâ&#x20AC;&#x2122;re set up to better handle different kinds of customers. - Lowering the cost of ownership for products with small to medium volumes: Toradex focuses on customerswhose products run from a few hundred to a couple thousand pieces a year, so these are not high-volume products. We lower development and maintenance costs for these projects. We also make many technologies that were once available only for high-volume projects accessible to these customers.

Please provide a brief profile of yourself. I studied electrical engineering in Switzerland. In my early career, I worked for a big elevator company to connect them to the internet.I joined Toradex in 2005, when we launchedour first product. Initially, I worked on driver development and helping customersto integrate our modules. Over 10 years ago, I moved to Seattle, where I now serve as Chief Marketing Officer for Toradex globally.

FUTURE TRENDS in SoC Interconnect

STEVE FURBER

School of Computer Science The University of Manchester Manchester M13 9PL, UK

Abstract - Self-timed packet-switched networks are poised an additional IP block within a conventional (synchronous)

to take a major role in addressing the complex system design and timing closure problems of future complex Systems-onChip. The robust, correct-by-construction characteristics of self-timed communications enables each IP block on the SoC to operate in its own isolated timing domain, greatly simplifying the problems of timing verification. Design automation software can remove the need for expertise in self-timed design, enabling the on-chip interconnect to be treated as

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design flow. The paradigm shift from viewing the SoC design problem as a matter of organizing complex hierarchies of buses with multiple coupled timing domains, where every interface between timing domains must be verified carefully, to viewing the SoC as a problem in network design where those timing issues are automatically isolated, promises significant improvements in designer productivity, component reuse and SoC functionality.

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failure, whether due to noise or an error in timing or protocol, is likely to require a design iteration that will be expensive in both mask charges and time to market.

interconnect strategy is required to bring these risks back under control.

SOC INTERCONNECT EVOLUTION

Early SoCs used an interconnect paradigm inspired by the rackbased microprocessor systems of earlier days. In those rack systems, a backplane of parallel connections formed a ‘bus’ into which all manner of cards could be plugged. A system designer could select cards from a catalogue and simply plug them into the rack to yield a customized system with the processor, memory and interfaces required for any given application. In a similar way, a designer of an early SoC could select IP blocks, place them onto the silicon, and connect them together with a standard on-chip bus (see Figure 1). The backplane might not be apparent as a set of parallel wires on the chip, but logically the solution is the same.

INRODUCTION

The System-on-Chip (SoC) industry has developed rapidly over the last fifteen years from producing VLSI devices that integrated a processor and a few memory and peripheral components onto a single chip to today’s high-performance SoCs that incorporate hundreds of IP blocks. This progress is a consequence of Moore’s Law (which enables ever-higher levels of integration) and of market economics (where consumers demand ever-more functionality in smaller, lower-cost products with better battery life). Complex systems have always been hard to build and debug. Systems-on-chip are no different in this respect, but the economics of integrated circuit manufacture do not allow debugging by trial and error; the design must be ‘right first time’. As a result, SoC designers adopt disciplines that minimize the risk of design error. One such discipline is to be very systematic about the way interconnect is used on a complex chip. Any communication

FIGURE 1: EARLY (CIRCA 1995) SOC STRUCTURE BASED UPON A SINGLE SHARED BUS.

However, buses do not scale well. With the rapid rise in the number of blocks to be connected and the increase in performance demands, today’s SoCs cannot be built around a single bus. Instead, complex hierarchies of buses are used (as illustrated in Figure 2), with sophisticated protocols and multiple bridges between them. Communication between two remote blocks can go via several buses, and every section of every path must be carefully verified. Timing closure is a growing problem because there is so much that must be checked. Bus-based interconnect is being stretched to its limit, and as the limit is approached the risk of errors increases rapidly. A new

FIGURE 2: MORE RECENT (CIRCA 2000) SOC STRUCTURE BASED UPON A HIERARCHY OF BUSES.

An example of a complex system-on-chip that employs the hierarchical bus solution is the DRACO DECT-ISDN controller chip (see Figure 3) which was based around the Amulet3i asynchronous processing subsystem [1]. This chip incorporates two local processor buses serving the instruction and data requirements of the Harvard architecture Amulet3 processor core, the asynchronous multi-master MARBLE bus with production test support [2], and a bridge to a synchronous on-chip bus (SOCB in Figure 4) that serves the clocked telecommunication peripherals.

FIGURE 3: DRACO CHIP PLOT SHOWING THE ASYNCHRONOUS MARBLE BUS.

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COVER STORY

delays inherent in driving long wires. Of course, long wires still introduce end-to-end latency problems, but these are inherent in any on-chip communication system.

FIGURE 6: THE SMART CARD CHIP INCORPORATING THE PROTOTYPE CHAIN ONCHIP INTERCONNECT.

FIGURE 4: THE DRACO SYSTEM-ON-CHIP HIERARCHICAL BUS STRUCTURE.

NETWORKS-ON-CHIP

Where bus-based solutions reach their limit, packet-switched networks are poised to take over [3]. A packet switched network offers flexibility in topology (see Figure 5) and trade-offs in the allocation of resources to clients. Such a network has been developed at the University of Manchester [4] and demonstrated on a prototype smart card chip [5]. The layout of the smart card chip is shown in Figure 6, and the CHAIN interconnect can be seen as the top-level wiring and the small logic blocks associated with it.

FIGURE 5: A PACKET-SWITCHED NETWORK-ONCHIP OFFERS THE MOST FLEXIBLE INTERCONNECT STRUCTURE.

This Network-on-Chip (NoC) employs self-timed logic techniques to deliver a robust, correct-by-construction interconnection fabric that allows each client block to operate in its own fullydecoupled timing domain, thereby addressing system-level timing-closure issues.

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The principles of the CHAIN self-timed point-to-point interconnect are illustrated in Figure 7. The link employs a 1-of-4 data encoding to send 2 bits of data by switching one of the 4 data wires using a return-to-zero protocol.

FIGURE 8: A WIDE, LONG CHAIN CONNECTION WITH PARALLEL LINKS AND PIPELINE REPEATERS.

FIGURE 9: A CHAIN PIPELINE REPEATER. Sender C Receiver FIGURE 7: A CHAIN POINT-TO-POINT SELF-TIMED LINK.

Every transition is acknowledged, thereby ensuring that variations in transmission delay (due, for example, to crosstalk) are accommodated automatically. A 5th data wire is used to indicate endof packet, resulting in a 6-wire data link. This link has been demonstrated operating at a 500 MHz symbol rate (where each symbol is 2 bits of data) on a 0.18 micron CMOS process, yielding a data throughput of 1 Gbit per 6-wire link. Where a single link provides insufficient performance, multiple links can be deployed in parallel and individual links can be pipelined, as shown in Figure 8. An example of a pipeline repeater circuit is shown in Figure 9. Five Muller C gates form the synchronizing latches, holding the 1-of-4 data and the control bit. The 5-input NOR gate is a ‘completion detection’ circuit, indicating when one of the latches has been set. The repeater forms one stage of a Muller pipeline and can be used to divide long point-to-point links into shorter sections, thereby counteracting the throughput problems created by the

The switching technology in CHAIN comprises 2-to-1 multiplexers and 1-to-2 demultiplexers. With these components a range of standard network topologies can be implemented, such as a basic mux-demux topology, cross-bar mesh structures, and even an on-chip ring (see Figure 10). Although technically feasible, rings do not seem well-suited to on-chip interconnect as their efficiency depends on multiple packets being in transit simultaneously within the ring fabric, which does not occur with the latencies that arise on chip.

FIGURE 10: ALTERNATIVE CHAIN NETWORK TOPOLOGIES.

COVER STORY

NETWORK CONFIGURATION

Configuring anNoC to support the functionality and performance requirements of a complex SoC is still a daunting task. However, this is a task that can be addressed by design automation software. Silistix Limited, a company spun-out from the University of Manchester and formed around the NoC team, is developing sophisticated tools that will enable the interconnect fabric to be treated as just another synthesizable IP block integrated into the standard design flow (see Figure 11). This will eliminate the risks inherent in current bus-based interconnect methodologies and bring timing-closure problems down to manageable size.

FIGURE 11: THE SILISTIX SELF-TIMED NETWORKON-CHIP DESIGN APPROACH.

Once the full SoC interconnect requirements have been specified, the Silistix tools will generate the appropriate network structure, selecting link widths, pipeline repeaters and switching topology to meet those requirements at minimum cost. The tools fit into a conventional SoC design flow as shown in Figure 12, removing any need for the designer to have any knowledge or expertise in selftimed design.

FIGURE 12: THE SILISTIX SELF-TIMED NETWORKON-CHIP DESIGN FLOW.

FUTURE REQUIREMENTS

The Silistix tools will provide designerfriendly support for selftimed networkson-chip that will deliver a robust and cost-effective solution to the requirement for a systematic approach to on-chip interconnect for complex systems-onchip. Beyond this, the future presents many design challenges for on-chip interconnect. Quality-of-Service (QoS) support is an obvious next-step, and the feasibility of providing QoS support on an asynchronous NoC has already been demonstrated [6]. At present the cost of implementing QoS is high compared with a best-effort network such as CHAIN, where it is always possible to provide dedicated links for specific connections that require guaranteed performance. The current CHAIN technology assumes that on-chip logic is reliable. It is tolerant to delay variations, but it is not designed to recover from logic faults or failures. It may become necessary to design on the basis that on-chip logic is fallible, so that faulttolerance becomes a requirement for all on-chip functions, including interconnect. Interconnect could be made fault-tolerant by building redundancy into the fabric, but it is likely to be more cost-effective (at the low expected error rates) to implement error detection and retry capabilities into the interfaces, effectively adding faulttolerance as a layer on top of an unreliable fabric (as is the case with off-chip networks).

CONCLUSIONS

Packet-switched networks-on-chip are the clear solution to the problem of complex SoC interconnect, and future developments will see advances in these networks to improve their performance, flexibility, power-efficiency and functionality. Support for QualityofService protocols, fault-tolerance, secure communication and other similar high-level functions will emerge over the next few years to establish the NoC as the de-facto on-chip interconnect technology.

John Bainbridge at the University of Manchester. John was funded by EPSRC (the UK Engineering and Physical Sciences Research Council) through a PhD studentship and subsequently as a research assistant and research fellow. EPSRC’s support is gratefully acknowledged. The CHAIN technology is now owned by Silistix Limited who provided several of the diagrams in this paper.

REFERENCES

[1] J.D. Garside, W.J. Bainbridge, A. Bardsley, D.M. Clark, D.A. Edwards, S.B. Furber, J. Liu, D.W. Lloyd, S. Mohammadi, J.S. Pepper, O. Petlin, S. Temple, & J.V. Woods, “AMULET3i - an Asynchronous System-on-Chip”, Proc. Async 2000, Eilat, Israel, 4-6 April 2000, pp 162-175. [2] W.J. Bainbridge & S.B. Furber, “MARBLE: An Asynchronous On-Chip Macrocell Bus”, Microprocessors and Microsystems, 24(4), 1 August 2000, pp. 213-222. [3] W.J. Dally & B. Towles, “Route Packets, not Wires: On-Chip Interconnection Networks”, Proc. DAC 2001, ACM Press, New York, 2001, pp. 684-689. [4] W.J. Bainbridge & S.B. Furber, “Chain: A Delay-Insensitive Chip Area Interconnect”, IEEE Micro, special issue on the Design and Test of System-onChip 22(5), September/October 2002, pp. 16-23. [5] W.J. Bainbridge, L.A. Plana & S.B. Furber, “The Design and Test of a Smartcard Chip Using a CHAIN Self-timed Networkon- Chip”, Proc. DATE'04, Vol. 3, Paris, Feb 2004, p. 274. [6] T. Felicijan& S.B. Furber, “An Asynchronous On-Chip Network Router with Quality-of-Service (QoS) Support”, Proc. IEEE International SOC Conference, Santa Clara, CA, Sept. 2004, pp. 274-277. n

ACKNOWLEDGEMENTS

The CHAIN self-timed network-onchip technology that forms the basis of this paper was developed by Dr

ISSUE 05|VOL 1|MAY 2019|BISINFOTECH

TEST & MEASUREMENT

ANRITSU GETS IEEE802.11AC OTA SUPPORT Anritsu Corporation announces that its Wireless Connectivity Test Set MT8862A WLAN measurement solution has worldfirst support for IEEE802.11ac OTA (Over the Air) Tests. Product Outline The MT8862A is a tester for measuring RF TRx characteristics of equipment with built-in WLAN IEEE802.11a/b/g/n/ac functions (2.4 and 5-GHz bands). MT8862A supports network mode to communicate with the EUT using standard WLAN protocol messaging (WLAN signaling) for performing TRx measurements. Overview of Anritsu’s MT8862A WLAN Measurement Solution: CTIA/WFA CWG Test Plan Version 2.1 is a typical test specification and procedure for evaluating WLAN performance using OTA measurements; the standard test procedure is not only used in N. America but is also referenced by other regional test bodies and is expected to become

the de facto standard for the increasingly popular IEEE802.11ac specification. CTIA/WFA CWG Test Plan Version 2.1 stipulates the performance evaluation at various data rates over the air (OTA) (or on OTA environment). However, usually, it is very difficult that IEEE802.11ac equipment under test (EUT) outputs the specified/ fixed throughput stably for performance evaluations. With a patent-pending unique technology for controlling the data rate, MT8862A users

can easily perform RF TRx measurements at any data rate simply by setting at the GUI. Moreover, OTA test efficiency is improved because the connection is maintained even when changing the MT8862A data rate. Key Features ■ Helps Assure Communications Quality and Troubleshoot Faults ■ Simplifies Measurement

NI TEST UE OFFERING FOR 5G LAB AND FIELD TRIALS

Release 15 compliant 5G New Radio non-standalone system can help customers deliver 5G commercial wireless to market faster NI announced a real-time 5G New Radio (NR) test UE offering. The NI Test UE offering features a fully 3GPP Release 15 nonstandalone (NSA) compliant system capable of emulating the full operation of end-user devices or user equipment (UE). With the 5G commercial rollout this year, engineers must validate the design and functionality of 5G NR infrastructure equipment before productization and release. Based on the rugged PXI Express platform, the NI Test UE offering helps customers test prototypes in the lab and in the field to evaluate them on service operators’ networks. In addition, customers can perform Inter Operability Device Testing (IoDT), which is a critical part of the commercialization process to ensure that network equipment works with UE from any vendor and vice versa. The offering can also be used to perform benchmark testing to evaluate the full capabilities of commercial and pre-commercial micro-cell, small-cell and macro-cell 5G NR gNodeB equipment. Spirent has worked with NI to add 5G NR support to its existing portfolio of products. The NI Test UE offering provides a flexible system for evaluating 5G technology. Customers can use the SDR front ends to select

BISINFOTECH|MAY 2019|VOL 1|ISSUE 05

the sub-6 GHz frequency of their choice. The system scales up to one 100 MHz bandwidth component carrier and can be configured for up to 4x2 MIMO to achieve a maximum throughput of 2.3 Gb/s. The 5G NR Release 15 software includes complete protocol stack software that can connect with a 5G gNodeB while providing real-time diagnostic information. Customers can log diagnostic information to a disk for post-test analysis and debugging and can view it on the software front panel for a real-time visualization of the link’s performance.

TEST & MEASUREMENT

R&S LAUNCHES NEW SPECTRUM ANALYZER FOR 5G NR The manufacturers of RF components, transmitters and modules are facing complex measurement tasks on wideband RF signals and tight time-to-market requirements. Rohde & Schwarz addresses these users with its new midrange signal and spectrum analyzers.The new signal and spectrum analyzer families, with different frequency models cover up to 44 GHz. Ideal for advances of 5G NR technology, the R&S device enables engineers to analyze wireless communications signals in R&D and production with test solutions supporting 5G bandwidth and RF requirements. The R&S FSV3000 is designed to help users set up complex measurements in the simplest and fastest way possible. With its ease of use and high measurement speed, it is the right instrument for labs and production lines. It provides up to 200 MHz analysis bandwidth – enough to capture and analyze, for example, two 5G NR carriers at once. The R&S FSVA3000, with up to 400 MHz analysis bandwidth, a high dynamic

range and an outstanding phase noise of –120 dBc/Hz, delivers performance that was, until recently, reserved for high-end instruments. It enables users to perform highly demanding measurement applications such as linearizing power amplifiers, capturing short events and characterizing frequency agile signals. Both the R&S FSV3000 and R&S FSVA3000 can measure EVM values better than 1 % for a 100 MHz signal at 28 GHz. Together with the coverage of the 5G NR frequency bands up to 44 GHz, this makes the analyzers ideal for analyzing 5G NR signals. The new devices from R&S simplify troubleshooting rare events and setting up complex measurements. With the

event based action GUI, whenever a predetermined event occurs the corresponding action, such as saving a screenshot or I/Q data, is performed. Automeasurements shorten the setup time of the instrument itself. At the press of a button, parameters such as center frequency, span and amplitude reference are automatically set based on the applied signal, and in the case of a pulse signal, the gate sweep parameters are set. For standardcompliant measurements such as ACLR or SEM, the automeasurement feature selects the corresponding standard parameter table. In scenarios with automated production lines with complex measurements, external computers can take over the control of the instruments via SCPI commands. Furthermore, the embedded SCPI recorder makes it much easier to create executable scripts, since all manual input is translated into plain SCPI or into the syntax of common programming languages or tools such as C++, Python or MATLAB.

KUSAM-MECO LAUNCHES BATTERY QUALITY ANALYSIS KUSAM-MECO announces the newest addition to their large range of Digital Test & Measuring Instruments. The model KM 900 is a single quick testing total Battery Quality Analysis solution. It is a super tool for UPS Battery Field Management. It provides Battery Health Analysis under system loading condition. It can measure & display Impedance, Voltage, Temperature, Current & Capacity of Battery. It is most useful Tool for UPS. Back up Batteries in Industrial System-Telecom Renewal Energy Power Plant (Solar, Water, Wind), Recreational, Machine, Airplane, Military, Electric Vehicle & Battery related Industries (Manufacturing, Servicing of Batteries) of most Batteries including Lead Storage, Cells (Lead-Acid Batteries), Nickel-Cadmium Batteries, Lithium-ion Batteries & Nickel-Metal Hydride Batteries. It has abundant Data logging & accurate Trend Analysis Feature backed by Internal SD Card with storing capacity upto 7.5

million data in Text & Graphic mode. AC (Four-Terminal) method is used to measure the internal resistance by eliminating lead resistance & Contact resistance to obtain accurate results. Multiple Display LCD screen shows internal

resistance, voltage & temperature or voltage, current & temperature of the battery simultaneously. Its unique comparator function can provide reliable detection of battery deterioration. For current measurements AC & DC clamp adaptors are provided. It has Interface USB Host/Client 2.0. It has large 4” 32+240 pixel. High Resolution Monochrome LCD. The impedance measuring range is 4mΩ to 4Ω (4 ranges)/1µΩ resolution. The battery range is maximum 100V/ 1200Ah (model KM 900 basis) 3000Ah (model KM 900S Version). 6000Ah (model KM 900C). The voltage range is 4/40/300V. It can measure current (DC) 40/400A & AC Current (Ripple Current) 40/400A. Temperature measurement is -10°C to 100°C. Only model KM 900C has Capacity Measurement. The power supply is 7.2V, 2.7A NiMH Battery Pack. It can be use with AC Adaptor having output 12V/1A. It is Handy size & Height Weight (Only 1.2kg).

ISSUE 05|VOL 1|MAY 2019|BISINFOTECH

TEST & MEASUREMENT

QUECTEL ADOPTS KEYSIGHT’S 5G TEST SOLUTIONS Keysight Technologies announced the company’s 5G network emulation solutions have been selected by Quectel to accelerate commercialization of industrial internet of things (IoT), mobile broadband and fixed wireless access (FWA) applications. Quectel opted Keysight’s 5G RF DVT Toolset to support its strategic goal of providing a connected mobile ecosystem with commercial 5G modules. With the Keysight’s RF DVT Toolset Quectel will be able to validate protocol and radio frequency (RF) performance of new designs in both sub-6GHz (FR1) and mmWave (FR2) frequency bands. Peng Cao, senior director of Keysight’s Commercial Communications Group,

noted “Our collaboration with Quectel underscores the value leading industry players recognize in working with a proven supplier of 5G test solutions that support global deployments in all major 3GPP frequency bands.” Quectel said that with the Keysight collaboration they can achieve their

5G go-to-market goals and help build a smarter world. Leo Yao, 5G Product Director at Quectel, said “Our collaboration with Keysight enables us to leverage the same tools that leading chipset manufacturers and mobile operators use to validate new 5G NR products,”

TELEDYNE LECROY NEW PCIE SPECIFIED INTERPOSERS

Monitor and Analyze both Standard and Dual-Ported NVMe SSDs at PCIe 4.0 Teledyne LeCroy announced the availability of U.2/U.3 & M.2 interposer cards for analysis of both standard single-port and dual-port Solid-State Drives (SSDs) that support the PCI Express (PCIe) 4.0 specification. When used with the Summit Protocol Analyzer, the U.2/U.3 & M.2 Interposer Cards enable the capture and analysis of all PCIe bus traffic between a host backplane and a single- or dual-port 2-1/2” or M.2 SSD. The company boasts that it is the first to have introduced a PCI Express protocol analyzer with NVMe decoding functionality. Since that introduction, it has added decoding for SCSI Express (SOP/PQI) and SATA Express (AHCI/PCIe). The new U.2/U.3 & M.2 interposers support these protocols at data rates from 2.5 GT/s up to 16 GT/s and lane widths of two and four lanes. “The powerful and unique capabilities of this new interposer are most apparent when used in MultiPort mode, which gives the user time-synchronized protocol traces of both active ports of a dual-port drive, or active ports of two drives with a single protocol analyzer, reducing set-up time, simplifying trace comparisons and

BISINFOTECH|MAY 2019|VOL 1|ISSUE 05

minimizing equipment costs,” said John Wiedemeier, Senior Product Marketing Manager in the Protocol Solutions Group, Teledyne LeCroy. “Integrating all three PCIe SSD technologies (NVMe, SOP/PQI & AHCI/PCIe) into a single protocol analyzer, with interposers for two key drive implementations (2-1/2” and M.2), gives developers versatile tools that can show essential details regarding proper data transmission and bus performance. These tools have been critical for supporting the proliferation of solid-state drives in the cloud,” added

Wiedemeier. The U.2/U.3 Interposer supports up to four lanes in a standard PCIe 4.0 link configuration, or two ports each with two lanes in a dual-port 2-1/2” sized SSD. The M.2 Interposer supports up to four lanes of an M.2 device with a single PCIe 4.0 link configuration or two ports each with two lanes in a dual-port 30mm, 42mm, 60mm, 80mm or 110mm (all x30mm width) sized M.2 device. Availability The PCIe 4.0 U.2/U.3 & M.2interposers are now available to order.

SECURITY UPDATE

MATRIX INSIGHT 2019-JEDDAH & RIYADH HIGHLIGHTS Matrix conducted Matrix Insight 2019 Jeddah and Riyadh on 18th and 22nd April respectively from 09:00 AM to 12:30 PM. At the event, Matrix highlighted ETERNITY NENX, newly launched Unified Communication Platform for SOHO and SMB. Increasing number of Small and Medium organizations are migrating to leverage benefits of IP, for such applications, Matrix ETERNITY NENX is a perfect fit. Matrix Telecom domain also showcased its Comprehensive Telecom Solutions which includes IP-PBX, Communication Endpoints, Media Gateways, Mobile Application and much more, along with Matrix Hospitality solution Matrix will showcase futuristic technologies from the Security domain. The newly launched Face Recognition technology for authentication through IP Cameras/Tablet/Mobile alongside, Time-Attendance and Access Control solution will also be showcased at the event. Mobile being the next generation technology in the security domain, Mobile based Access Control solution will allo be an additional showcase at the event. The spotlight was also on the Biometric Door Controllers useful for applications in Time-Attendance, Access Control, Visitor Management, Cafeteria Management and many more. Matrix will present its Standalone Access Control solution with License Free Environment. The company’s expertise in enterprise-grade IP Video Surveillance

Solution designed, engineered and built specifically for growing multi-location organizations was also showcased. The entire solution focuses on automating processes, easy integration with Access Control and enhancing efficiency of organizations. A new range of Audio compatible and compact Professional Series IP cameras powered by SONY STARVIS series sensors with EXMOR technology and new Extreme series of Network Video Recorder (NVRX) was also demonstrated at the event. “Events like Matrix Insight are important to us because they give us the chance to connect with our partners, SIs and prospects. We look forward to explore and spread our footprints in the territory through this product expo, showcasing our innovative solutions that can help accelerate business growth”, said Ganesh Jivani, Managing Director.

TERADATA ANNOUNCES NEW OFFERINGS FOR VANTAGE Teradata now provides as-a-service offerings for analytics at scale in public, private and hybrid cloud environments Teradata announced three new offerings for its Teradata Vantage platform, reflecting Teradata’s commitment to offering as-aservice capabilities to meet the needs of their customers. These capabilities provide choice and flexibility for customers operating on Amazon Web Services (AWS) and Microsoft Azure, private cloud or hybrid cloud environments. New offers include (1) adding AWS Marketplace as a channel for consuming Teradata software on an as-a-service basis, (2) introducing a turnkey on-premises offer which provides key cloud benefits while remaining within customers’ data centers and (3) driving a new hybrid cloud disaster recovery service to complement a firm’s physical infrastructure with an on-demand secondary system in the cloud. By leveraging automation and Teradata’s unique expertise in managing complex analytic environments at scale, organizations can focus instead on finding answers to their toughest business

challenges. Teradata addresses these requirements and more as each new as-a-service offering extends the value and application of Vantage, Teradata’s flagship platform that was designed to simplify analytic ecosystems and de-risk decision-making, even at scale. In addition to providing access to 100 percent of an organization’s information, Vantage consolidates analytic silos into a single platform. The location of the data or workloads is not a deterrent, since the same Vantage software runs on every deployment option. “Vantage has already been picked up by customers faster than any other product in Teradata’s history,” said Reema Poddar, Chief Product Officer at Teradata. “We’re enormously proud of that, and we also

understand that many of our users would prefer to have as-a-service options for Vantage. We have delivered that capability and today we are extending it to ensure all of Teradata’s customers, regardless of where they stand in their cloud or analytic journey, have an as-a-service offering to choose from. Teradata Vantage is tailormade to help enterprises get the most return from their investments and focus on what truly matters: getting answers through real-time intelligence, not managing IT infrastructure.” Now available as-a-service on AWS, Microsoft Azure, Teradata Cloud and onpremises, Teradata Vantage empowers firms to consume the company’s marketleading analytic capabilities any way they prefer, in the environment they prefer. This choice and flexibility is highly supportive of a hybrid cloud environment and ensures that Teradata customers aren’t held back from, or forced into, decisions about when and how to leverage the cloud in conjunction with their on-premises analytic ecosystems.

ISSUE 05|VOL 1|MAY 2019|BISINFOTECH

FUTURE EYE

QUANTUM DOT IMAGING ADVANCES SAFELY?

Luminescing nanosized crystals are showing promise for peering deeply into body tissues, but first they need to be made safe. Quantum Dotsinvestigating deeply into body tissues are evolving vigorously. Though on initial stage of innovation, more work is required to ensure they are safe. According to a review published in the journal Science and Technology of Advanced Materials, a review team is working into the innovations in making Quantum Dots more safe and secure. Researchers at Japan's National Institute for Materials Science reviewed the latest studies on near-infrared quantum dots. These new studies have shown that they can be used for whole body imaging of animals, or to target specific tissues, such as tumors and lymph nodes. Quantum dots that absorb and emit

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near-infrared light waves are allowing researchers to look deeper into tissues than ever before. This is because infrared light scatters less in the human body than other wavelengths, providing clearer images than conventional fluorescent imaging techniques. Quantum dots have been made from a variety of elements and their compounds, including cadmium selenide (CdSe), mercury telluride (HgTe), lead selenide (PbSe), lead sulfide (PbS), indium arsenide (InAs), or simply from silicon (Si) or carbon (C), just to name a few. Quantum dots are tiny, nanometer-sized crystals that can be made from a variety of chemical elements and that can emit light in different colors according to their size. Research on their use for looking into the body and 'seeing' tissues, a variety

of techniques collectively referred to as biological imaging, has been rapidly evolving since the 1990s. Quantum dots using cadmium and lead are particularly toxic to cells and tissues; these metals also pose a risk to the environment. Some researchers have tried reducing toxicity by using a special nontoxic shell, but these protected quantum dots are not as effective for imaging as non-coated, non-toxic ones based on carbon, silicon or germanium. Silicon quantum dots in particular are promising because they are safe and very efficient at emitting light. The review team argues that near-infrared quantum dots show promise for biological imaging once safety issues are addressed and fabrication needs to require higher efficiencies.

TELECOM REPORT

INDIAN TELCOS TO WITNESS 7PC REVENUE GROWTH IN 2020 After two years of treading, the Indian telecom industry will see considerable growth. Research and ratings company, CRISIL lately reckons 7% revenue growth in 2020 fiscal owing to an expected increase in average revenue per user (ARPU) by 11% “Pricing aggression is expected to remain moderate and selective in fiscal 2020, given the new entrant (Reliance Jio) has revenue market share leadership in over 50 percent of the 22 circles,” said Hetal Gandhi, a director at Crisil Research, adding this may lead to an operating margin expansion by 3.50 percent to 31 percent in FY20, it said. The agency said despite consolidation, a “protracted tariff war” has pushed Arpu to a decadal low and as a result of the same, the industry revenues have fallen by 20 percent in the past two years or by a whopping `40,000 crore cumulatively. It can be noted that the September 2016 entry of the deeppocketed Jio has been blamed for a lot of ails of the telecom sector, which resulted in massive profit erosions, forced consolidation and also bankruptcies. The agency said the tariffs have “bottomed out” in the industry now, pointing out to the stable pricing. The top three telcos have almost equal revenue market share as of now, it said, adding any price-led aggression now can impact all adversely. Prices of prepaid plans of leading telcos have over the past six quarters converged at `4 per GB and have stabilised over the past two quarters, Gandhi said. Profitability is expected to look up, with operating margins expected to rise 3.50 percent to 31 percent in FY20, the report said. Combined operating profit of Vodafone Idea, Airtel and Jio will increase 20 percent to `56,200 crore from `46,100 crore in the year-ago period.

Explaining the dip in subscriber base that it foresees, it said while low tele-density will lead to increase in users, there is a dip in the urban areas as two-SIM discontinue the second connection. Network capex for the top three telcos is expected to moderate to `84,000-90,000 crore in FY20, down from `1 lakh crore in FY19. Improvement in bottomline and decline in capex, together with sizeable deleveraging plans will support a reduction in debt to `3.1 lakh crore, by March 2020, the report said. “Debt protection metrics are expected to improve, with the interest coverage and debt-to-Ebitda ratios touching 2.5x and 5.6x by March 2020, compared to an estimated 2x and 7.7x, respectively, as of March 2019,” another director at the agency Nitesh Jain said.

THE BOOMING TELECOM API PLATFORM MARKET API is an application programming interface and also an important element for today’s business processes. API acts as middleware software which forms interface among resources and applications in the device. Now, the global telecom API platform market is foreseen to exceed more than US$ 490 bn by 2024 at a CAGR of 23.5% between 2018 and 2024. Market Search Engine in its latest report, explores fundamental role for service provider which fit their telecom infrastructure and data in commercial business. Telecom API platforms allows its operator to set up its own API represent its service to all large external developers. Fast expansion in the mobile application market will produced requirement for

telecom APIs. The major driving factors of telecom API platform market are as follows: Competition among MNOs which drive the adoption of new revenue streams Growing digitization in MNOs push them

to accept API platform The restraints factors of telecom API platform market are as follows: Minimum adoption of telecom API platform between medium and small operators

ISSUE 05|VOL 1|MAY 2019|BISINFOTECH

INDUSTRY KART

DIGI-KEY SHIPPING IOTIZE’S LINE OF TAPNLINK PRODUCTS

Digi-Key is availing to its customers worldwide, IoTize’s line of TapNLink products for Bluetooth and NFC communication. Under a new distribution agreement, Digi-Key will resell a range of products from IoTize, designers and manufacturers of plug-n-play wireless connectivity solutions for microcontrollerbased embedded systems. TapNLink products allow the user to take an existing MCU application that does not have wireless connectivity and add it using only 2 GPIO pins and without modifying the application’s original firmware. TapNLink reduces design effort and risks by a factor of ten, speeding time-to-market of smartphone-based interfaces for product configuration, monitoring, and control. IoTize said that this approach is a Kickstarter for companies that are fast tracking their wireless integration projects to meet customers’ changing expectations. The Key Applications include: Factory machinery-control and monitoring Cable replacement Point-to-point data transfer Building automation Automated lighting Inventory and tracking systems. “We are very happy to announce our partnership with IoTize and offer their plug-n-play products to our global customer

base,” said Robbie Paul, Director, IoT Business Development at Digi-Key. “Their TapNLink line will help customers bring a configurable solution to any project by adding Bluetooth and NFC communication to existing MCUs and will be a strategic relationship moving forward.”

RS COMPONENTS RELEASES SIEMENS DIN RAIL POWER

ARROW, IBM’S IOT SOLUTION AIMS TO REINVENT AIRPORTS

RS Components has announced availability of a range of DIN rail power supplies from Siemens, which are suited to a wide range of industrial automation applications. The single-phase SITOP PSU6200 power supplies are slim and space-saving, with plug-in terminals that support easy electrical connection and are designed for use in distributed power applications in machine control boxes or in small cabinets. A key characteristic of the device is its very low power loss across the entire load range, especially in idle mode, which makes the units ideally suited for automated machines in plants that are often in standby operation.Featuring wide-ranging DC-compatible input voltages from 85 to 275V(AC) or 99 to 275V(DC), the series delivers output DC voltages from 12 to 15.5V at 2A, 7A, 12A, or 24 to 28V at 1.3A, 2.5A, 3.7A, 5A, 10A, 20A (depending on model). Overall, the characteristics, in conjunction with the series’ wide operating temperature range, means they can be deployed in multiple industrial application options. Another important feature of the series is the integration of advanced diagnostic capabilities, enabling the units to indicate their operating status and current utilization, as well as end-of-service life via LEDs. They also output a serial code via the diagnostics interface, which can be read via a digital input on a PLC and evaluated by a function block.

The Smart Airport Asset Management Solution, co-created with IBM, enables airport operators to improve the performance of escalators, moving walkways, baggage handling systems and potable water cabinets Arrow Electronics and IBM have joined forces and jointly launched the Smart Airport Asset Management Solution, an innovative IoT solution. Based on an Arrow-designed and sourced set of IoT sensors and gateways, the IBM Watson IoT Platform, and IBM Maximo Enterprise Asset Management software, the solution aims to provide airport operators with improved operational insights that optimize equipment maintenance to avoid downtime and improve the traveler experience. “This solution we have developed with our suppliers will help improve the customer experience and demonstrates the model that IBM and Arrow are implementing across the relationships at the heart of IoT,” said Aiden Mitchell, vice president of IoT for Arrow. The Smart Airport Asset Management Solution collects data such as temperature, vibration and motor fluid levels from sensors on motors and other moving parts in escalators, moving walkways and baggage handling systems. Also, the solution resolves frequent operational challenges that most negatively impact travelers according to an Airport Service Quality report from the Airport Council International.

BISINFOTECH|MAY 2019|VOL 1|ISSUE 05

INDUSTRY KART

MOUSER AVAILS MICRON 9200 NVME SSDS Mouser Electronics announced that it’s stocking the Micron 9200 Series of NVM Express (NVMe) solid state drives (SSDs). The device is sought as one of the first NVMe SSDs on the market with a capacity exceeding 10 TB and its offers high capacity, fast speeds, and low latency for high-performance functions such as application and database acceleration, online transaction processing (OLTP), highfrequency trading, and high-performance computing. Now available at Mouser Electronics, the Micron 9200 Series SSDs blend the capabilities of 3D NAND and NVMe technologies for enterprise storage. The devices are built on an innovative architecture that combines NVMe protocols on a PCIe connection to deliver fast enterprise flash performance up to 10 times’ faster than SATA SSDs, plus 3D

NAND high-density storage that conserves power and rack space. The 9200 SSDs deliver sequential read/write transfer speeds up to 5.5 and 3.5 GBytes per second, with random read/write transfer speeds up to 900K and 275K input/output operations per second (IOPS) to turn data into information with low latency

and high performance. The Micron 9200 includes three endurance classes: Micron 9200 PRO: For read-centric use at roughly 1 Drive Writes Per Day (DWPD) with 1.92TB, 3.84TB, and 7.68TB capacities. Micron 9200 MAX: For mixed-use workloads at about 3 DWPD with 1.6TB, 3.2TB, and 6.4TB capacities. Micron 9200 ECO: For less than 1 DWPD with 8TB and 11TB capacities. The Micron 9200 SSD family is designed as the storage foundation for the Micron SolidScale platform, providing greater capacity for more efficient workload optimization and reducing total cost of ownership. With the 9200, SolidScale will be capable of over 250 TB per node, scaling over 5 PB per rack of one of the highest performance NVMe SSD available in shared storage today.

NEW YORKER ELECTRONICS N2POWER SOLUTIONS’ OPSM

element14 INDUSTRY’S FIRST CONNECTOR E-GUIDE

New Yorker Electronics is distributing N2Power Solutions’ new Optimized Power Systems Manufacturing (OPSM). With an eye toward providing increased value to the manufacturing process for its customers, N2Power will now deliver on any power supply for an application – plus build the subassembly. N2Power has always provided modifications to its standard power supplies to meet customer need, the company’s OPSM ensures improved performance of the N2 units without the need to change build requirements. Instead of a customer having to take an off-the-shelf unit and design the metalwork upon which to build up all the individual parts from scratch, OPSM allows N2Power and franchise distributor New Yorker Electronics to supply a complete end solution whch results in reduction of assembly time, decrease in BOM and simplifying the entire process by turning cluttered line items into just one line item. N2Power customers, such as OEMs, receive complete custom power assemblies without having to purchase mounting brackets, nuts, bolts, stand-offs, screws, cables, connectors, external fans or other accessories. N2Power Product Key Features & Benefits include: • Green by design - many supplies achieve up to 93% efficiency • Some designs offer active current sharing and an OR’ing diode for redundancy • Single and multi-output models • I2C (PMBus) interface for digital power management • Remote on/off

Online reference tool from element14 provides detailed information on all connectors from leading brands element14 launches industry’s first Connector e-Guide. The new Connector e-Guide from element14 is a comprehensive online reference tool showcasing connectors from more than 30 of the industry’s most trusted brands. The new Connector e-Guide allows engineers to easily review and select relevant interconnect products from element14’s extensive connector catalogue by sight or by part number. The e-Guide uses large visuals to clearly display and categorise connectors in a single online hub, making it an invaluable tool for engineers who may need to find and replace an application’s damaged connector without knowing the part number to identify it. In addition, the e-Guide’s intuitive interface displays associated products and accessories, such as cable and wire, crimp tools and other installation aids. This key feature saves time by reducing the need to research supporting products so engineers can easily select the most suitable connectivity solution for their designs. Product Categories Covered by element14’s Connector e-Guide Include: PCB connectors High-speed I/O devices Circular connectors Terminal blocks and terminals Plug and socket connectors

ISSUE 05|VOL 1|MAY 2019|BISINFOTECH

INDUSTRY UPDATES

ADI NAMES DAN LEIBHOLZ AS CTO Analog Devices names Daniel Leibholz, Vice President of ADI’s Communications Business Unit, as the Chief Technology Officer (CTO), effective immediately. As CTO, Dan will develop and lead ADI’s technology strategy for applications across the company’s end markets. President and Chief Executive Officer of ADI, Vincent Roche noted that Leinholz’s combination of technology vision, experience developing ADI’s digital and analog offerings, and strong business background will help the company to further continue to deliver innovations of maximum impact for their customers and their markets now and into the future. In his previous role as VP of ADI’s

Communications Business Unit, Dan has overseen a period of tremendous

growth as the company has delivered best in class offerings for the 5G wireless and wired markets. Prior to assuming the position in Communications, Dan led a number of teams across ADI, including Digital Signal Processing and Consumer/Portable technologies. Previously, Dan has been a part of Advanced Micro Devices, Inc. (AMD), where he had served as an AMD Fellow and later, as a distinguished engineer at Sun Microsystems. “Our ambition to be ‘Ahead of What’s Possible,’ combined with our broad array of leading-edge technologies, positions the company for continued leadership in the years ahead”, commented Daniel

INFINEON'S JAPAN AUTOMOTIVE BIZ SPURS 25PC

ON SEMICONDUCTOR, GLOBALFOUNDRIES PARTNERSHIP

Infineon Technologies increased its automotive business in Japan by almost 25 % in 2018, according to the latest research from Strategy Analytics. The study claims that Infineon grew faster than any other of the top ten automotive semiconductor suppliers in the country. The company boasts that last week Toyota honored Infineon for five years of zero defect deliveries to its Hirose plant once again. Infineon has received awards from other automotive global players such as Hyundai-Kia, Bosch, UAES, Denso, and Mitsuba. Peter Schiefer, President of the Automotive Division at Infineon, on this achievement, “Receiving an award for half a decade of immaculate shipments makes us very proud. Our strong commitment to zero defects is one of the reasons why we have continuously outgrown the automotive semiconductor market in Japan since 2010.” Infineon delivers CAN transceivers to Toyota’s plant – devices that enable various electronic control units in cars to exchange data. Infineon said that for the second time in a row, it has received the most prestigious prize: the Honor Quality Award, presented to suppliers with a flawless quality record for four consecutive years. In addition, Infineon shipped more than seven billion automotive parts worldwide during FY 2018 and according to them, not even 0.00001 percent of them were object of a customer complaint.

ON Semiconductor Corporation and GLOBALFOUNDRIES have entered into a definitive agreement for ON Semiconductor to acquire GLOBALFOUNDRIES’ 300mm fab located in East Fishkill, New York. The total consideration for the acquisition is estimated to be about $430 million, Further, the terms of the agreement states, ON Semiconductor to increase its 300mm production at the East Fishkill fab over several years, and allows for GLOBALFOUNDRIES to transition its numerous technologies to the company’s three other at-scale 300mm sites. GLOBALFOUNDRIES will manufacture 300mm wafers for ON Semiconductor until the end of 2022 of which the first production is expected to start in 2020. The agreement also includes a technology transfer and development agreement and a technology license agreement. This provides a world class, experienced 300mm manufacturing and development team to enable conversion of ON Semiconductor wafer processes from 200mm to 300mm. ON Semiconductor will also have immediate access to advanced CMOS capability including 45nm and 65nm technology nodes. These processes will form the basis for future technology development at ON Semiconductor. Keith Jackson, president and chief executive officer of ON Semiconductor, said, “The acquisition adds additional capacity over the next few years to support growth in our power and analog products, enables incremental manufacturing efficiencies, and accelerates progress towards our target financial model. I am very excited about the opportunity this acquisition creates for customers, shareholders, and employees of the two companies and look forward to a successful partnership with GLOBALFOUNDRIES in the coming years.”

BISINFOTECH|MAY 2019|VOL 1|ISSUE 05

INDUSTRY UPDATES

INTEL’S JITENDRA CHADDAH NEW CHAIRMAN OF IESA India Electronics and Semiconductor Association (IESA) announces new Executive Council (EC) for the year 2019-20. This year, IESA has appointed Jitendra Chaddah (JC), Senior Director – Operations and Strategic Relations, Intel taking over as the Chairman. Speaking on the occasion, Jitendra Chaddah, Chairman, IESA said, “I feel extremely honored for taking up the position of IESA chairman at a time when the Indian electronics and semiconductor industry is poised for exponential growth. The opportunity for electronics system design and manufacturing is tremendous, given the rapid momentum around Industry 4.0, Artificial Intelligence, Cloud, Smart & Connected Devices, and 5G. This requires accelerated focus on entrepreneurship, innovation, IP creation and manufacturing in the ‘Intelligent Electronics’ space. I am looking forward to the continued partnership with the

industry, government and academia to achieve our goal of making India a global hub for design-led manufacturing in Intelligent Electronics.’ JC has over two decades of industry experience with excellent international exposure and experience of working in both emerging and mature markets – USA, Latin America, Asia Pacific. At Intel, he has played multiple leadership roles ranging from Program Management of large and complex programs to running operations and setting strategic direction for large R&D sites at different Intel locations. JC also plays a critical role

in leading multiple industry initiatives to accelerate technology adoption and innovation in the country. Recently, he led the conceptualization of Semiconductor Fabless Accelerator Lab (SFAL) and IESA’s Vision Summit. Currently Jitendra is the Senior Director, Operations and Strategy at Intel India, leading operations of Intel’s largest R&D center outside the US, forming strategic alliances with the tech eco-system and creating impactful initiatives for technology acceleration in partnership with Government, Academia, Media and Industry. “It gives me immense pleasure welcoming JC as the new chairman. We look forward to further strengthen our footprint globally with his visionary expertise & contemporary outlook in managing large enterprise products, leading vision groups with governments, fostering entrepreneurship, Start-Up culture, innovation and resilient academia relationships.

ANKER SELECTS CYPRESS’ USB-C CONTROLLER

ULRICH SPIESSHOFER STEPS DOWN AS ABB CEO

Cypress Semiconductor announced that its USB-C controller with USB Power Delivery (PD) was selected by Anker for integration into Anker’s new family of USB-C chargers. Anker’s new PowerPort PD chargers with Cypress’ EZ-PD CCG3PA USB-C controller aims to deliver high-speed USB-C charging performance in smaller form factors for greater portability. Cypress’s USB-C controllers are being widely adopted by the world’s top-tier electronics manufacturers including Anker. With the integration of Cypress’ EZ-PD CCG3PA with USB PD, Anker’s new family of PowerPort PD chargers deliver up to 2.5x faster charging times than standard USB-C power adapters. And because the EZ-PD CCG3PA controller is compact with a highly-integrated architecture, this helped enable Anker to reduce its own charger dimensions by up to 40%. “Cypress USB-C controllers provide our engineering team with the design flexibility and programmability required to build Anker’s new generation of USB-C fast-charging solutions,” said Steven Yang, CEO of Anker Innovations. “The new PowerPort chargers are the most versatile yet and will allow our customers to charge virtually any USB-C device at full speed.” “Anker is the recognized global leader in the charging market and these new products are an exciting showcase of the great benefits that our USB-C controller technology bring to our customers,” said Ajay Srikrishna, vice president of Cypress’ Wired Connectivity Business Unit.

ABB names Peter Voser as the interim CEO as Ulrich Spiesshofer steps down from the role he has held since 2013. The Board of Directors of ABB and Spiesshofer have mutually agreed that Peter Voser will hold the position, in addition to his current role, with immediate effect. An official search to find a new CEO has been initiated. Upon this mutual agreement, Voser commented, “On behalf of the Board and the employees of ABB, I would like to personally thank Ulrich for his dedication and commitment to ABB’s customers and employees not only as CEO but also in other executive roles at ABB since 2005. Under his leadership, ABB has been transformed into a global technology leader focused in digital industries. He strategically repositioned the company and built up growth momentum across all businesses. We wish him all the best for his future endeavors.” Peter Voser has been Chairman of ABB since April 2015. Prior to this, he was CEO of Royal Dutch Shell from 2009-2013, and CFO between 2004-2009. Between 2002 and October 2004, he was CFO of ABB and a key leader behind the successful turnaround of the company. Voser also brings a wealth of experience in board positions in leading companies such as a Roche, IBM, Catalyst, Temasek Holdings and PSA International in Singapore.

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INDUSTRY UPDATES

ARM’S NEW CFO IS FORMER UNISYS EXEC, INDER SINGH Arm appointed Inder M. Singh as Executive Vice President and Chief Financial Officer (CFO) with immediate effect. Singh will lead Arm’s global finance organization and report to Arm CEO Simon Segars. Commentng on hi9s new role, Inder M. Singh commented, “As CFO of Arm, I have a unique opportunity to help architect the future of one of the world’s most transformative technology leaders. I believe Arm is the only company at the center of the convergence of Artificial Intelligence, 5G and IoT and I look forward to defining the financial strategy for its next era of growth. “ Singh joins Arm from Unisys, which he joined in March 2016 and served as senior vice president and CFO. At Unisys, Singh led all finance functions including controllership, treasury, taxes, investor

relations, M&A and corporate strategy. Simon Segars, chief executive officer,

Arm added, “Singh’s experience and proven track record of finance leadership in Fortune 500 technology companies will be invaluable as Arm targets new growth opportunities fueled by 5G, automotive, IoT, hybrid cloud infrastructures and Machine Learning.” Prior to Unisys, Singh was managing director, technology, media and communications at SunTrust Bank. Singh also held financial leadership roles at Comcast Corporation, Cisco Systems and AT&T/Lucent Technologies and has a decade of experience as an equity analyst. Singh holds a bachelor’s and master’s degree in Engineering from Columbia University’s School of Engineering and Applied Science. He also holds an MBA in Finance from New York University’s Stern School of Business.

BRIAN DAVIS NEW PRESIDENT OF ASEAN FOR HONEYWELL

XILINX EYES SOLARFLARE ACQUISITION

Honeywell appoints Brian Davis as the new President of Honeywell ASEAN (Association of Southeast Asian Nations). Davis will succeed Briand Greer who will be retiring in June this year. Davis will be in charged with overseeing business across six main ASEAN markets including, Malaysia, Singapore, Indonesia, Philippines, Thailand and Vietnam. Davis will play a critical role in driving Honeywell’s growth in the region. Davis joined Honeywell in September 2006, holding multiple senior leadership roles, including most recently, Vice President of Asia Pacific (APAC), Commercial Aviation, under Honeywell’s Aerospace strategic business group. He also held the position of Aerospace leader for Honeywell International Sdn Bhd (HISB), the first multi-national company to have joined the Malaysian government’s Principal Hub Initiative in 2015. He brings along with more than 20 years’ experience in the airlines industry. Under his strong leadership, Honeywell’s APAC Commercial Aviation business demonstrated consistent growth while supporting a broad network of aviation and aerospace partners, customers and key stakeholders. Under Davis, Honeywell recently established its Aerospace aftermarket headquarters in Malaysia, with key decisionmaking level executives in place to accelerate response time to customers.

Acquisition Enables Converged SmartNIC Solutions to Address Dynamic Workloads in the Data Center Xilinx recently announced that it has entered into a definitive agreement to acquire Solarflare Communications, one of the leaders in high-performance, low latency networking solutions for customers spanning FinTech to cloud computing. The acquisition will further enable Xilinx to combine its industry-leading FPGA, MPSoC and ACAP solutions with Solarflare’s ultra-low latency network interface card (NIC) technology and Onload application acceleration software, to provide new converged SmartNIC solutions, accelerating Xilinx’s “data center first” strategy and transition to a platform company. Given Xilinx’s and Solarflare’s collaboration since the last two years on advanced networking technology for the last two years, the two companies recently demonstrated their first joint solution – a single-chip FPGA-based 100G SmartNIC, processing 100 million packets per-second receive and transmit, all at less than 75 watts. “The Solarflare team has worked very closely with Xilinx on next-generation networking technology and business collaboration since Xilinx became a strategic investor,” says Russell Stern, chief executive officer, Solarflare. “Our shared vision for the future of data center and cloud computing and the integration of our respective technologies makes this acquisition the ideal next step for our customers, employees, and investors, as well as the broader data center industry.”

BISINFOTECH|MAY 2019|VOL 1|ISSUE 05

A&D

F-21, THE JUGGERNAUT FOR INDIAN A&D Lockheed Martin and Tata Advanced Systems would produce the F-21 in India. Vivek Lall, vice president for strategy and business development, Lockheed, said, “While it is inappropriate for us to compare specific capabilities, the F-21 will give India a significant edge with greater standoff capability, greater staying power with less fuel burn, and network data linking capabilities across all platforms. The tactics India employs with the F-21 will also be different - uniquely developed by the Indian Air Force, he said. The F-21 multi-role fighter jet will give India a “significant edge” with greater standoff capability, American defence giant Lockheed Martin has said. The company claimed that producing it locally will also strengthen the country’s integration into the world-wide network of advanced fighter aircraft technology. Lockheed Martin during the Aero India show in Bengaluru in February unveiled the F-21 multi-role fighter jet for India, to be produced locally.

The Maryland-based company, which had earlier offered its F-16 fighter jets to India, said the F-21 addresses the IAF’s unique requirements and integrates India into the world’s largest fighter aircraft ecosystem. “The F-21 will meet all of India’s performance, capability and advanced technology requirements - the same requirements all other 4th generation

competitors are offering. As we pursue cutting-edge technologies for the F-21, some capabilities may be evaluated as discrete, integrated functions,” Lall said. Refuting reports that the F-21 fighter jet is rebranding of the F-16, Lall said that while aircraft structures may look familiar, the differences become clear when looking at the unique capabilities of the F-21.

L3 DELIVERS ELECTRONIC WAR- TELEDYNE DEFENSE ELECTRONFARE AIRCRAFT TO AUSTRALIA ICS DEBUTS ITS NEW WEBSITE L3 Technologies has been awarded a prime contract with an estimated value of more than $1 billion to deliver four aircraft known as the MC-55A Peregrine, with next-generation airborne electronic warfare (EW) capability to the Royal Australian Air Force (RAAF). The agreement includes four modified Gulfstream G550 aircraft with an integrated mission system that provides the latest EW capabilities. The company believes that Australia is a very important market and they look forward to a long and productive partnership with the RAAF and the local supplier base in support of the Peregrine program. “Our mission solution and electronic warfare capabilities are highly sought-after by our allies,” said Christopher E. Kubasik, L3’s Chairman, Chief Executive Officer and President. “As business jets are increasingly utilized for EW purposes, we have invested in miniaturizing our capabilities to deliver new resources for our customers.” The MC-55A Peregrine will be integrated into the Commonwealth’s joint warfighting networks, providing a critical link between platforms, including the F-35A Joint Strike Fighter, E-7A Wedgetail, EA-18G Growler, Navy surface combatants and amphibious assault ships, and ground assets to support the warfighter.

Teledyne Defense Electronics unveiled a new website today that provides a ‘single source’ on the web for accessing its comprehensive high tech offerings for global markets. Teledyne Defense Electronics employs over 2,000 people worldwide and serves as a joint suppler for numerous distinguished Teledyne brands. Each of those brands brings decades of engineering expertise and heritage in some of the most advanced technologies on the market today. With well over 100 highly-engineered product lines and service offerings spanning defense, commercial and industrial markets, TDE targets the majority of its products and technologies towards the needs of Airborne, Electronic Warfare, Energetics, Missiles, Radar, Satellite Communications, Space, and the Test & Measurement markets. In terms of research and development, TDE invests most heavily in technologies related to RF/Microwave Systems, Contract Manufacturing, Microelectronics, Interconnects, Energetics, Space and Satcom offerings. Visitors to the new Teledyne Defense Electronics website will find access to over 100 product lines by whichever method they choose: by market, by technology type, or by simple alphabetical listings.

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A&D

TDS WIN THE QUEEN’S AWARD FOR ENTERPRISE 2019 Teledyne Defence & Space (TDS) has been honoured with the prestigious Queen’s Award for Enterprise 2019 for International Trade said the company in its recent statement. The accolade for Teledyne Defence & Space is in recognition of both its innovative technology and its substantial growth in overseas earnings. TDS has expanded into new commercial markets like space, most recently with the award of a $95 million production contract to develop and manufacture critical microwave communication products to support the Airbus OneWeb mega constellation of Low Earth Orbit (LEO) satellites. “We are working to further expand our footprint in space to achieve our strategic goal of a sustainable, highly skilled, regional business enterprise recognised as a technology leader in the space

sector,”said Ian Skiggs, Vice President & General Manager of Teledyne Microwave Solutions UK, the parent company of TDS The Queen’s Award for Enterprise are the

most prestigious business awards in the UK, with winning businesses able to use the esteemed Queens Award emblem for the next five years.

BAE SYSTEMS’ NEW MISSION COMPUTER GETS PARTNERS

ATI HAS A NEW CHIEF DIGITAL AND INFORMATION OFFICER

Teledyne e2v, Wind River and CoreAVI announced that they will provide key technologies for BAE Systems’ new mission computer. A mission computer is the central hub that processes all mission critical data on an aircraft. Receiving information from various external subsystems, the mission computer processes the data and presents it to the pilot on various displays in the cockpit. The joint solution includes Wind River VxWorks industry-leading real time operating system running on Teledyne e2v Qormino Common Computer Platform, and CoreAVI supplying its temperature-screened AMD Embedded RadeonE8860 GPUs as well as its safety critical ArgusCore SC1 OpenGL 1.0.1 graphics drivers. Qormino QT1040-4GB is a smart, small and powerful Common Computer Platform from Teledyne e2vdesigned to respond to SWaP constraints (Size, Weight and Power). It combines a T1040 Quad PowerArchitecture e5500 core running at 1.4GHz, 4GB of DDR4 memory, on a Custom Teledyne e2v substrate, with a 64-bit memory bus and 8 bits of ECC (Error Correction Code), and will run VxWorks on BAE Systems’ platform. VxWorks provides the base platform that consolidates different applications meant to improve situational awareness for pilots. The real-time avionics system will gather and display information from multiple sources in order to create a comprehensive picture of the aircraft and airspace. The deterministic capabilities of the platform are crucial for the overall system on-board the aircraft that has to provide lowlatency response to the pilot.

Allegheny Technologies Incorporated announced that effective May 6, 2019, Timothy J. Harris will join ATI as Senior Vice President, Chief Digital and Information Officer. This newly created role will extend ATI’s position as an innovative leader producing advanced specialty materials and components by accelerating our digitization and automation strategy. Harris will lead ATI’s information and operations technology organization, developing and deploying a technology strategy to support the company’s growth in the future. He will report directly to Robert S. Wetherbee, ATI’s President and CEO, and serve on the company’s Executive Council. Harris has led information technology innovations and digital transformations in manufacturing and other industries. As Chief Information Officer at Andeavor, a Texas-based Fortune 100 refiner and marketer of petroleum products, he enabled a comprehensive digital strategy to automate and optimize Andeavor’s business, including leading an ERP transformation and integrating the company’s largest acquisition. His work also included initiatives to maximize the power of the cloud, mobility, and collaboration, and implement robust cybersecurity processes. Prior to Andeavor, Harris worked for Mylan, a global pharmaceutical company, where he led the IT infrastructure function and was later promoted to Chief Technology Officer and head of Global Technology Services responsible for developing a business application rationalization strategy and transforming IT into one global function across North America, Europe and India.

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A&D

BOEING TO BUILD 21ST CENTURY AEROSPACE IN INDIA Boeing has offered to build a 21st century aerospace ecosystem in India for codeveloping F/A-18 Super Hornet upgrades Eyeing India’s multi-billion dollar fighter jet market, Boeing has offered to build a 21st century aerospace ecosystem in India for co-developing F/A-18 Super Hornet upgrades as part of the country’s advanced medium combat aircraft (AMCA) programme. Two major American fighter jets manufacturers - Boeing and Lockheed Martin - are in the race for the Indian fighter jet market. Lockheed Martin has offered to shift its entire F-16 manufacturing base from US to India. “What we’re talking about is a complete ecosystem of capability – it’s building up supply chain, it’s building up engineering capacity, technical mechanical capacity. It is bringing the build, not the kit, to India,” Marc Allen, president of Boeing International and a member of the Boeing Executive Council, told PTI. Boeing has offered that future F/A-18 Super Hornet upgrades can be co-developed

with India, maximising performance, affordability, indigenisation for decades. The McDonnell Douglas F/A-18 Hornet is a twin-engine, supersonic, all-weather, carrier-capable, multirole combat jet, designed as both a fighter and attack aircraft. As a result, Allen argued, the impact will be transformational - building a next gen warfighter in India and a 21st century aerospace ecosystem with Hindustan Aeronautics Limited (HAL) and Mahindra along with Boeing industry’s partners (GE Aviation, GKN Aero, Northrop Grumman and Raytheon). “And that’s why the idea of being able

to service, both the Indian Navy and the Indian Air Force requirements together is so vital because it creates a volume that supports industrial development at a massive scale,” Allen said in response to a question. Boeing says that the ‘Make in India’ programme for the Super Hornet has been envisioned for aircraft made in India for India. The Super Hornet production line will exist in the US to meet the immediate needs of its American and international customers. India is to build an entirely new line, leveraging Boeing’s commercial and defence experience, Allen said.

BAE SYSTEMS NEW SOFTWARE- 500KM RANGE FOR BRAHMOS DEFINED RADIO ASSEMBLY SUPERSONIC CRUISE MISSILE BAE Systems unveiled its new general software-defined radio assembly for high reliability commercial and Department of Defense space applications. The SDR integrates the company’s RAD5545 Single Board Computer (SBC) with advanced Field Programmable Gate Array-based transceivers, enabling unparalleled flexibility, on-orbit re-programmability and increased capacity for signals processing. “The flexibility allowed by the general-purpose software defined radio for customers to reprogram missions makes this hardware a product our customers will be able to use into the future,” said Ricardo Gonzalez, director of Space Systems at BAE Systems. “Coupled with our RAD5545 technology, the processing power and capability enables our customers to apply their spacecraft to multiple missions that evolve over its lifespan.” The software defined radio’s (SDR) unique, upgradeable SpaceVPX architecture can accommodate an alternate transceiver or design improvement while retaining the integrity of the assembly. To facilitate broad application, it was designed to host third party hardware and mission intellectual property or algorithms. The SDR provides multiple receive and transmit channels that can be configured for different applications, like weather sensing, flexible communications payload, or specialized radio frequency sensing.

BrahMos Aerospace is a joint venture between India’s DRDO and Russia’s NPO Mashinostroyeniya. The missile is named after Brahmaputra and Russia’s Moskva. India and Russia are planning to increase the target range of BrahMos supersonic cruise missile to 500-kms. According to an ANI report, the two countries are now planning to increase the range of the world’s fastest anti-ship cruise missile to 500 kilometres! According to Alexander Maksichev, the managing co-director of BrahMos Aerospace company, hypersound will be attained with this increase in range. The missile has a current speed of 2.8 mach and the speed of hypersound will be attained through modernisation, resulting in figures of more than 4.5 Mach, the official was quoted as saying by ANI. Apart from this, serial production of the supersonic cruise missile started in March, the report says. BrahMos Aerospace is a joint venture between India’s DRDO and Russia’s NPO Mashinostroyeniya. The missile is named after Brahmaputra and Russia’s Moskva. BrahMos missile has been inducted in the Indian Navy and Indian Army and has also been tested successfully from Indian Air Force’s Sukhoi 30-MKI frontline fighter jet.

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Virtual Prototypes 5 considerations when choosing software development platforms

There are a few common questions that we get from customers when talking about virtual prototypes for software development which we will address in this blog. Let’s start with a summary on virtual prototypes Virtual prototypes (VPs) help developers get products to market faster by enabling software development prior to silicon availability, or with limited hardware access. VPs are simulation models of systems, or sub-systems that enable software development. They bring most value when used in parallel with the

BISINFOTECH|MAY 2019|VOL 1|ISSUE 05

hardware design, but still have a place once the hardware is completed. Using virtual platforms reduces the lag between hardware delivery and software readiness, speeding time to market. Within Arm we make extensive use of virtual prototypes when developing the development tools and software stacks in support of our IP. We do this so that our software is ready at the same time as the hardware becomes available as that is what our customers (and we) expect. It is the models (and a team of talented people) that let us do this. These models are also used for architecture exploration

and IP validation. Early software development with virtual prototypes Arm’s VP capability is centeredaround the programmer’s view models of our IP called Fast Models. We deliver VPs to our partners in two ways. Firstly there is a library pre-built platform called Fixed Virtual Platforms (FVPs) available off-theshelf for many of our processors and IP. Secondly there is the portfolio of models from which a partner can build their own VP using either Arm tools or solutions from our ecosystem partners.

With that in mind, let us move on to Yes and no! Inasmuch as the virtual the common questions about virtual platform simulates the instruction set one prototypes. could consider it to be an Instruction 1. Can I change a Fixed Virtual Platform? The source code for the FVPs is supplied as examples in the Fast Models product. These examples can be edited and extended as needed and can be used either as the start point for a custom VP or reference if designing your own. You will need a Fast Models license for this activity. The “fixed” aspect of the pre-built FVP is in the composition. It is supplied as a binary object so you can’t, for example, change components. However, there is still the scope to change many aspects of the platform through the comprehensive set of parameters that the FVP provides. Through parameters different functional blocks can be enabled or disabled and memory and cache configurations changed and so on. 2. Isn’t virtual prototype just a fancy name for an Instruction Set Simulator?

Set Simulator (ISS). However, the big difference is that a VP is a functional model of a system, or subsystem, albeit one modelled at an abstract level known as either “programmer’s view (PV)” or “loosely timed (LT)”. The VP simulates all the processors in the system, along with system IP and graphics subsystems. The processors could be different Arm cores or a mix of Arm processor IP from other vendors. An ISS would typically not model implementation defined features of the core (e.g. caches) and unpredictable behaviors. These are modelled in the Arm VPs. 3. Are virtual prototypes accurate enough for software development? As we have already mentioned these are abstract models. They don’t have detailed micro-architectural detail of the cores and they don’t implement the full timing. These are usually transparent to the software running on the processors.

For many developers, this raises a question about how much trust can be put in the simulation results. The models are validated against the same compliance kits and validation suites that are used in the IP validation process, ensuring their accuracy against the modelled hardware. The end result is that – in general – software that runs on the VP will run unmodified on the hardware. However, sometimes there may be reasons to stub out hardware components in the VP and that will entail software modifications. Plug-in modules improve correlation All simulation models trade off detail against performance. VPs are no exception to this. To broaden the scope of where these LT models can be used, we have developed various plug-in modules – pipeline models, branch prediction models, prefetch models – that improve the correlation of the model and the target IP at a cycle level. These are all switchable so that they do not impact simulation performance when not in use. Which leads us into the next question…

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DIY

4. Can a simulation-based approach be fast enough for developers? Simulation models will execute software slower than the target hardware in most cases. However the questions are whether this is a critical issue and what an acceptable level of performance is. There are many factors that affect simulation speed. We mentioned the level of detail in the model: this can have a big effect and care needs to be taken in writing efficient models to maintain simulation speed. One of the biggest speed boosts can often be as simple as using a workstation with a faster CPU and/or more memory to run the simulations. Simulations can be batched up and run in parallel using server farms. The detailed step-by-step execution is often not important, so the user isn’t typically waiting on the simulation. The simulation can run in the background while they get

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on with other jobs (as I write this blog I’ve got a model running). Typically, the VP will boot a high-level OS in a handful of minutes. Whilst not realtime, this is sufficient for most use cases. 5. Do virtual prototypes support continuous integration and regression testing? Given that you don’t need special purpose hardware to run virtual models/prototypes on and the inherent flexibility of the VP, it makes them the ideal environment for software development based around continuous integration. It is something we use here and many of our partners do, too. You can have tens or hundreds of simulations running on VPs distributed across compute farms. And these can be scripted up and the results analyzed programmatically. So yes, VPs are the ideal platform for continuous integration.

I’m happy to get involved with answering any other questions about virtual prototypes that you may have - so please, leave a comment below, or send a private message. You can also download and evaluate Fast Models and Fixed Virtual Platforms below. Rob Kaye Rob Kaye is a Senior Technical Specialist at Arm focusing on modelling. He has been with Arm for 11 years and on the Fast Models team for the last 6 of these. Prior to joining ARM Rob spent a combined 25 years working at Mentor Graphics on the development of hardware/software coverification solutions (and other simulation products) and at Texas Instruments in EDA development and ASIC applications engineering. n

ICT REPORT

IDENTITY & ACCESS MANAGEMENT DEPLOYMENTS The identity and access management market is set to witness strong Y-o-Y growth in 2019, at approximately 9% over 2018. . Rapid increase in cybercrime prevalence is necessitating effective and efficient IT security measures, which is primarily driving the identity & access management market. Future Market Insights (FMI) recently published a market research report, titled, Identity & Access Management Market – Global Industry Analysis 2013 – 2017 and Opportunity Assessment 2018-2028. According to the latest FMI report, an estimated incremental opportunity of over US$ 17 billion between 2018 and 2028, the global market for identity and access management is likely to observe an impressive growth outlook in years to come. Public Domain, IT & Telecom, and

Finance & Insurance – Key End Use Industries While several business verticals have been focused on heavy investments in physical identity management, it is highly likely that operators in public domain, finance and insurance sectors, and IT and telecom will continue to account for significant revenue shares in global market for identity and access management, in the near future. As suggested by the report, the collective share of public administration, finance and insurance, and IT and telecom companies in the global market value roughly equates 60%. Healthcare and media industries are positioned as the next lucrative end use segments for providers of IAM services and solutions. Approximately 60% of Demand Is Generated by Large Enterprises

As the demand for next-generation security solutions is constantly on rise, as reported in the recent past, the demand for identity and access management solutions will remain higher when compared to that for identity and access management services. Currently, a wide range of identity and access management solutions accounts for over 60% of the total market value, as indicated by FMI’s study. Among multi-factor authentication, single sign-in, access security, and directory management, a majority of consumers will continue to generate demand for directory management and access security. On-premise deployment of identity and access management solutions currently accounts for more than 55% of the overall global IAM deployment.

MANUFACTURERS WITH AI TO DOUBLE COMPETITIVENESS

TECH SPENDING IN 2019 TO SINK DRASTICALLY

Microsoft Asia and IDC Asia/Pacific released findings specific to the manufacturing sector for the study, Future Ready Business: Assessing Asia Pacific’s Growth with AI. Manufacturers are increasingly turning to emerging technologies to stay ahead of the competition. Those organizations that have started to adopt Artificial Intelligence (AI) believe it will nearly double their competitiveness (1.8 times) in the next three years. “Manufacturers in the Asia Pacific are slowly, but surely, seeing the importance of adopting a digital strategy and latest technologies. The Study found that 76% of manufacturing business leaders agree that AI is instrumental to their organization’s competitiveness in the next three years,” said Scott Hunter, Regional Business Lead, Manufacturing, Microsoft Asia. “To achieve supply chain excellence, and even develop new business models to address changing customers’ needs, integrating AI for their business is a must. Organizations which fail to adopt an AI-first strategy risk being left behind in today’s competitive market landscape.” “However, 59% of manufacturers have not adopted AI as part of their business today. This is a worrying sign for the industry that needs to thrive on innovation,” added Hunter. For manufacturers that have started their AI journeys, the top three business drivers to adopt AI include higher margins, higher competitiveness and business agility, as well as better customer relationships and outcomes. They are already seeing business improvements in the range of 17% to 24% today, and further improvements are anticipated in three years by at least 1.7 times. The biggest jumps are expected in driving accelerate innovation (2.0 times), and higher margins (1.9 times).

Global tech consulting firm Gartner said the overall growth rate for technology spending at $3.79 trillion will be just 1.1% in 2019, or a fourth of what the industry witnessed in 2018 when it was 4%. Gartner’s current outlook is just half of its earlier forecast. In studies in January 2019 and October 2018, Gartner had projected global tech spending to grow at 3.2%. No matter what digital transformation has kept on deck to outflow expenditure expected in the tech industry. 2019 seems to be surrender to all the gossips, as, the growth rate in tech spending for 2019 will shrink drastically from what was seen in 2018 due to weakening global economies and currency volatilities. Worse still, growth of IT services — a revenue stream key to Indian tech companies — will be muted at 3.5%, down from the brisk 5.5% registered last year. Except enterprise software market, where spending is expected to rise 7%, budgets in data centre systems, IT devices and others are all set to decline in 2019, the report finds. “Currency headwinds fuelled by the strengthening US dollar have caused us to revise our 2019 IT spending forecast down from the previous quarter,” Gartner VP (research) John-David Lovelock said. “Through the remainder of 2019, the US dollar is expected to trend stronger, while enduring tremendous volatility due to uncertain economic and political environments and trade wars.” According to Indian tech industry body Nasscom, the sector crossed $165 billion in revenues and marginally grew above their own guidance of 7-9%.

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INDUSTRY LAUNCH

Allegro’s Advanced LED Backlight Drivers Allegro MicroSystems recently announced the A8060x family, the company’s latest generation of advanced LED backlight drivers. The device family is designed with an innovative and patented Pre-Emptive Boost (PEB) control, eliminating noise that is typically audible. Features: • while the A80601 and A80602 drive an external boost FET for higher output power. • The switching converters are designed for low EMI

Applications: •A utomotive backlighting, including Audio-Video systems as well as instrument clusters and heads-up display (HUD).

Availability: These devices are all available in a compact 4x4 QFN-24 wettable flank with exposed thermal pad (ES suffix), a smaller package than direct competition.

MagnaMate ATHP Series of Power Connectors The MagnaMate ATHP Series is a rugged thermoplastic power connector series featuring the surety and high performance contact technology of RADSOK. Designed for various “xEV” applications, MagnaMate is IP67 and available in single or two-pole housings with rated current from 20A to 180A. MagnaMate includes optional integrated HVIL safety features and EMI shielding protection which can withstand temperatures ranging from -40°C to +130°C. Features: • M agnaMate ATHP Mini is a compact, low-profile two pole thermoplastic power connector. • Four (4) keying options for multi polarization.

Applications: • Electrical Air Condition • Battery Charger • Electrical Heater

Availability: QL (Quick Lok) is available in both Black and Orange housings.

Artesyn Four-Slot Case and Hold-up Module Artesyn Embedded Technologies announces four-slot case and a new hold-up module for its second generation MicroMP (µMP) series configurable AC-DC power supplies.

Features: • Maximum power output of 550 watts at 85-180 Vac and 1100 watts and 80-263 Vac.

Applications: •Industrial, medical, test and measurement, telecoms, process control and military and aerospace systems.

Availability: Artesyn's intuitive GUI-based control software, which can be downloaded free from www. artesyn.com/power/pmbusgui.

AVX First Multilayer VaristorTVS AVX Corporation has released the industry’s first multilayer varistor (MLV) transient voltage suppression (TVS) devices rated for 175°C operation.

Features: • The MLV provide extremely reliable bidirectional overvoltage protection across operating temperatures extending from -55°C to 175°C.

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Applications: • Automotive

Availability: Standard parts are shipped on tape and reel in quantities of 1,000, 4,000, and 10,000, and lead-time for the series is currently 12 weeks.

INDUSTRY LAUNCH

Diodes Incorporated New ReDriver Diodes Incorporated has introduced a ReDriver for the server, storage, and networking market segment.

Features: • The company’s PI3EQX16904GL is a PCIe 4.0 compliant, 2.5Gbps to 16Gbps, four-differential channel. • Linear ReDriver which provides programmable linear equalization, output swing.

Applications: • Networking • Enterprise • Server • Storage

Availability: The PI3EQX16904GL ReDriver is offered in a 42-contact TQFN (9mm x 3.5mm) package.

Infineon’s Families of IPMs Adds CIPOS Tiny Infineon Technologies expands it growing family of intelligent power modules (IPMs) with an addition of CIPOS Tiny. The device is a 3-phase inverter module and the newest generation of IPM to offer the highest power density for variable speed motor drives. Features: • By using the latest TRENCHSTOP IGBT6, it is possible to realize maximum efficiency with minimum footprint.

Applications: • high efficiency washing machines • fans, • compressors • industrial drives

Availability: The CIPOS Tiny IM393 series features a blocking voltage of 600 V and four output current class: Tiny S (6 A) / Tiny M (10 A) / Tiny L (15 A) / Tiny X (20 A).All eight devices can be ordered now. Infineon at the PCIM 2019

Intel’s New Agilex FPGA Family Intel has announced a brand-new product family, the Intel Agilex FPGA. This new family of field programmable gate arrays (FPGA) will provide customized solutions.

Features: • Compute Express Link: Industry’s first FPGA to support Compute Express Link, a cache and memory coherent interconnect to future Intel Xeon Scalable processors. • 2nd-Generation HyperFlex Architecture: Up to 40 percent higher performance, or up to 40 percent lower total power2compared with Intel Stratix10 FPGAs.

Applications: • Embedded, network and data center markets.

Lattice Semiconductor Releases Radiant Software 1.1 Lattice Semiconductor Corporation has released its Lattice Radiant Software 1.1, a full featured FPGA design suite with leading-edge design and implementation tools optimized for the company’s iCE40 UltraPlus family.

Features: • Intellectual Property (IP) packaging capability that enables external IP developers. • R adiant Software 1.1 utilizes a unified design database to implement data convergence.

Applications: • Package encrypted IP in the Radiant Software IP format.

Availability: Radiant Software 1.1 is now available for download from Lattice’s website and currently can be used with a free license.

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INDUSTRY LAUNCH

Most Power-Efficient Dual IO-Link Transceiver Designers can now enable smarter digital factories with the MAX22513 surgeprotected, dual-driverIO-Linkdevice transceiver with integrated DC-DC buck regulator from Maxim Integrated Products.

Features: • Small Size: Highly integratedICsimplifies design process and shrinks solution size by 3x compared to closest competitor; Integrated surge protection eliminates four TVS diodes compared to Maxim’s previous solution

Applications: • Industrial IOLink sensors and actuator devices.

Availability: • The MAX22513 is available at Maxim’s website for $3.75 (1000-up, FOB USA); also available from authorized distributors

Space Industry’s First Arm-Based MCUs Microchip Technology introduced the space industry’s first Arm-basedmicrocontrollers (MCUs) thatcombine the low-cost and large ecosystembenefits ofCommercial Off-the-Shelf (COTS) technology withspace-qualified versionsthat havescalable levels of radiation performance.

Features: • H i g h - p e r f o r m a n c e a n d low-power operation to provide long operating life for aerospace applications.

Applications: • Space and Aerospace

Availability: The SAMRH71 in CQFP256 ceramic package is sampling today, and the SAMV71Q21RT is available today in volume production quantities in four derivatives: • SAMV71Q21RT-DHB-E in ceramic prototype QFP144 package

Murata Unveils DC-DC Converters Murata Manufacturing has commercialized the multi-output MonoBlock type POL series highreliability DC-DC converters with high power density and low profile for FPGAs.

Features: • Small solution size including the product and external capacitors • High-speed load response with fewer external capacitors

Applications: • FPGA

Availability: Samples of the product are already available, and mass production will be started from June.

RECOM Adds REM2 Series DC/DC Converter RECOM expands its medical portfolio with the new REM2 series which offers versatile features and complete medical certifications. These modular DC/DC converters provide engineers with more freedom to develop their PCB layout, knowing that they will comply with the stringent regulations for medical certifications.

Features: • Medical grade DC/DC converter • 250VAC working, 2MOPP at 5000m • 5.2kVDC/1 minute isolation

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Applications: • Medical

Availability: • S amples and OEM pricing are available from all authorized distributors or directly from RECOM.

INDUSTRY LAUNCH

Renesas Liquid and Solid Material Detection Renesas Electronics launches Material Detection Solution, which detects materials or liquids easily and cost effectively without sensors, by connecting electrodes using Renesas' RX130 capacitive touch-key microcontrollers (MCUs).

Features: • Connects two thin-film electrodes and measures the capacitance between those electrodes using one of its touchkey MCUs.

Applications: • I ndustrial equipment • OA equipment • Home appliance

Availability: The Material Detection Solution is available now for free download at https://www. renesas.com/solutions/key-technology/ human-interface/material-detection.html.

New PrestoMOS Series of 600V Super Junction MOSFETs ROHM’s new lineup of PrestoMOS series is the R60xxJNx series, of 600V super junction MOSFETs that includes 30 new models. This seriesincreases design flexibility while maintaining what according to ROHM is industry’s fastest reverse recovery time (trr) optimized for EV charging stations and motor drive in home appliances such as refrigerators and Air Conditioners (ACs). Features: • Implementingself turn-ONcountermeasures minimize loss • Improving recovery characteristics reduces noise

Applications: • ACs • Refrigerators • Industrial equipment (i.e. charging stations)

High Voltage Single Layer Ceramic Disc Capacitors Vishay Intertechnology has introduced a new series of radial-leaded high voltage single layer ceramic disc capacitors in compact sizes.

Features: • The devices offer a capacitance range from 100 pF to 2000 pF — with standard tolerances of ± 20 % — voltages from 10 kVDC to 15 kVDC, and operate over a temperature range of -30 °C to +105 °C.

Applications: • Dental and baggage scanners • Medical and industrial X-ray applications • Pulsed lasers

Availability: Samples are available now from Vishay. Production quantities are available with lead times of eight weeks.

MEMS Chip With Accelerometer And Temperature Sensor STMicroelectronics unveiled LIS2DTW12 combination of a MEMS 3-axis accelerometer and a temperature sensor on a single die for use in space-constrained and battery-sensitive detectors such as shipping trackers, wearables, and IoT endpoints. The sensing accuracy of 0.8°C offers precision comparable with stand-alone standard temperature sensors. Features: • Ultra-low power consumption: 50 nA in powerdown mode, below 1 µA in active low-power mode • Very low noise: down to 1.3 mg RMS in lowpower mode

Applications: • Shipping trackers • Wearables • IoT endpoints

Availability: The LIS2DTW12 is specified from -40°C to +85°C and available now in the ultra-thin 2.0mm x 2.0mm x 0.7mm LGA-12 plastic land grid array package, priced from $0.99 for orders of 1000 pieces.

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SECURITY OUTLOOK

ENDPOINT SECURITY TOOLS FINALLY FAILS? Endpoint Security Platforms were dominated by anti-malware technology once. But today, Endpoint Security Platforms matches new enterprise and cybersecurity paradigms. Complementing further, Global security spending is forecast to reach $128 billion by 2020. To this, endpoint security spends comprising 24 percent of that total, and yet, over 70 percent of breaches originate on the endpoint. Based on findings from Absolute, a major endpoint resilience firm revealed that endpoint security tools and agents fail, reliably and predictably. Absolute, in its new 2019 Global Endpoint Security Trends Report analyzed data from six million devices and one billion change events over the course of a year. The complexity of endpoint device controls creates a false sense of security among organizations while, in reality, causing security gaps and significant risks due to regular and reliable tool failure. Staggering findings on endpoint security degradation include: • 42 percent of all endpoints are unprotected at any given time

• Two percent of endpoint agents fail per week, meaning 100 percent of endpoint security tools eventually fail – no tool is immune • 28 percent of all endpoints are unprotected by anti-malware with 21 percent of these endpoints unprotected due to outdated or broken agents and 7 percent due to missing agents • 100 percent of devices will have failed encryption controls at least once within one year • A l m o s t 1 i n 5 d e v i c e s b e c o m e unreachable due to client management tool failures • Client patch management agents fail around 50 percent more often than

encryption agents As cybercrime threatens to cost the world $6 billion annually in damages by 2021, organizations need to address these issues. IT and security teams must be able to better understand what is happening on their devices and respond to suspicious events to reduce security failures. Organizations should analyze the tools already in use to identify blind spots or opportunities to strengthen their defenses before adding more security controls. “Evolving security threats have caused enterprises to layer on more and more endpoint controls, increasing complexity, impacting performance, and in some cases the collision of these controls is leaving the endpoint exposed,” said Christy Wyatt, chief executive officer at Absolute. “This complexity of the landscape is making it increasingly difficult for IT and security to have visibility and control. Our research shows the vulnerability that is introduced when critical security controls collide or decay over time. In other words, increased security spending does not increase safety.”

HEALTH DATA THREATS & PREVENTIONS

We’ve never had more information about our health stored electronically than we do today, and the quantity being generated is steadily increasing. Wearables track our every step and heartbeat, test results can be viewed online, hospitals are using more IoT devices to help with our care – the list goes on. Protecting that data has been a struggle for some time. The United States passed legislation called HIPAA in 1996 to help keep medical information private. In 2016, a string of ransomware attacks across the United States and Canada frequently made the news for locking down hospital systems and patient data. Between the data generated within medical institutions and the data we generate on our own through medical devices, apps and at-home test kits, there’s no shortage of privacy and security challenges.This is reflected in

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the statistics: a popular paper from IEEE Access points out several reports, one of which found that 40% of the 43 health and fitness apps they inspected “imply high risk” to users’ privacy. Another found that of 24,000 health-related apps for iOS and Android, “95.63% of the apps pose at least some potential damage through information security and privacy infringement.” For hospitals, the threat surface is varied and hard to manage. According to Kayne McGladrey, IEEE Member and Director of Security and Information Technology at Pensar Development, “Medical institutions are deploying an increasing array of IoT devices from a variety of vendors. This is not always by choice of the medical institution; rather, as vendors have connected all of their products to the Internet, it forces buyers to adopt heterogeneous IoT technologies.”

Features that are meant to make life easier can also contribute to the issue. Karen Panetta, IEEE Fellow and Dean of Graduate Education, Tufts University, says “Third-party modules, add-ons, guest accounts and remote accessibility continue to be the access points of choice for these attacks.” A main reason ransomware attacks have continued is that they’re still profitable. It’s easy to get hung up on the injustice – after all, incapacitating a hospital’s computer system when people are receiving lifesaving treatment isn’t easy to stomach. But hospitals often pay the asking price that the hackers set. Why? McGladrey’s answer is simple: “The costs associated with paying a ransom in these environments would be considerably lower than the litigation and fines if people were to be harmed by the lack of availability or the destruction of medical data.”

SECURITY OUTLOOK

ONLY 37PC INDIAN COMPANIES SHOWS CONFIDENCE IN INTERNET SECURITY Companies globally could incur US$5.2 trillion in additional costs and lost revenue over the next five years due to cyberattacks, Finds Accenture Report. In a survey of more than 1,700 CEOs and other C-suite executives globally reveals that dependency on complex internetenabled business models outpaces the ability to introduce adequate safeguards that protect critical assets. The new report from Accenture had 100 respondents from large enterprises in India. The report named, Securing the Digital Economy: Reinventing the Internet for Trust explores the complexities of the internet-related challenges facing business and outlines imperatives for the CEO’s evolving role in technology, business architecture and governance. The report notes that cybercrime from a wide range of malicious activities poses significant challenges that can threaten business operations, innovation and growth, and the expansion into new products and services, ultimately costing companies trillions of dollars. More than US$753 billion hanging in

the balance, high-tech industry faces the highest risk followed by the life sciences and automotive industries, with US$642 billion and US$505 billion at risk, respectively. “Internet security is lagging behind the sophistication of cybercriminals, leading to an erosion of trust in the digital economy. Businesses need to drive industry wide collaboration to improve governance; fine tune their own business architecture including internal and external processes; and embrace technologies that enhance

digital safety,” said Anindya Basu, Geographic Unit and Country Senior Managing Director, Accenture in India. “It’s a complex problem to solve, but inaction is not an option. Lack of trust can weigh heavily on the bottom line.” Among the key findings: 77 percent Indian respondents believe that the advancement of the digital economy will be severely hindered unless there is dramatic improvement to internet security, More than half (59 percent) of respondents said they are concerned that the internet is getting increasingly unstable from a cybersecurity standpoint and they are unsure how to react. 64 percent of Indian respondents believe that addressing cybersecurity challenges will require an organized group effort, as no single organization can solve the challenge on its own. On internet security, seven out of 10 (69 percent) of executives would also welcome stricter business regulations imposed by a central organization or governing body.

NETWORK SECURITY FIREWALL MARKET TO BE $5.3 BN The global network security firewall market size is expected to grow from USD 3.0 billion in 2018 to USD 5.3 billion by 2023, at a CAGR of 12.2% during the forecast period. According to the market research report by ResearchAndMarkets. com,due to the growing momentum of interconnected devices, the risk of security breach increased as the fraudsters found alternatives such as SMS SPAMs and SMS fraud through grey routes to exploit personal information over the organization’s network. Realtime streaming analysis and filtering of SS7 vulnerabilities have been major components of network security firewall and firewall developers are using fraud detection techniques to monitor the traffic behavior of the network. Telecom organizations use network

security firewall tools to dynamically extract traffic patterns from the packets transmitted as well as received at the network and continuously check network behavior against malicious contents, and to report all detected anomalies. The telecom sector has revolutionized the world in terms of communication and technology in the last 3 decades. According to a report by the Global System for Mobile Communications Association (GSMA), the proliferation

of mobile devices and smartphones has resulted in 5.1 billion subscriptions of mobile services around the world, accounting for 67% of the global population in 2018. A total of 1 billion new subscribers have been added in the last 4 years since 2013. With an increased subscriber base, new threats have arisen that affect the global network and disrupt the services that CSPs offer. The telecom service providers deploy various network security measures to counter threats such as Denial of Service (DoS), Distributed Denial of Service (DDoS), phishing, and data theft. The security measures include Unified Threat Management (UTM), identity and access management, encryption, intrusion detection systems, antivirus, and firewalls.

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SECURITY OUTLOOK

INDIANS READY TO SHARE PERSONAL DATA Seven in ten consumers in India would be willing to share significant personal information, such as location data and lifestyle information, with their bank and insurer in exchange for lower pricing on products and services, reveals Accenture. The Accenture Study Financial Services Consumer Study found that more than two-thirds of Indian consumers would share that data for benefits including more-rapid loan approvals, discounts on gym memberships and personalized offers based on current location. At the same time, however, people believe that privacy is paramount, with nearly 81 percent consumers saying they are very cautious about the privacy of their personal data. Data security breaches were the secondbiggest concern for consumers in India, behind only feeling like their complaints are not dealt with in an acceptable

manner, when asked what would make them leave their bank or insurer. Rishi Aurora, a managing director at Accenture who leads its Financial Services practice in India noted, “The large number of people willing to share more of their personal data for more efficient services at better prices underscores the role of digital technologies in the distribution of financial services in India. At the same time, there’s also growing concern about safeguarding of this data, so financial institutions need to make that a top priority as they look to address their customers’ evolving needs. If consumers don’t see the level of personalization, offers and products they want from their banks or insurers, they will certainly look for it elsewhere.” Indian consumers showed strong support for personalized insurance premiums, with 76 % interested in receiving adjusted car

insurance premiums based on safe driving and 69 % in exchange for life insurance premiums tied to a healthy lifestyle. The vast majority of consumers (92 percent) would provide personal data, including income, location and lifestyle habits, to their insurer if they believe it would help reduce the possibility of injury or loss. In banking, 93 percent of consumers would be willing to share income, location and lifestyle habit data for rapid loan approval, and 91 percent would do so to receive personalized offers based on their location, such as discounts from a retailer. Nearly three-quarters (76 percent) of consumers want their bank to provide updates on how much money they have until their next pay day, with the same rate of respondents (76 percent) wanting savings tips based on their spending habits.

MARCH 2019’S MOST WANTED MALWARE: COINHIVE

Check Point Research has published its latest Global Threat Index for March 2019. The index reveals that while cryptomining services such as Coinhive have closed down, cryptominers are still the most prevalent malware aimed at organizations globally. As announced last month, both Coinhive and Authedmine stopped their mining services on March 8th. For the first time since December 2017, Coinhive dropped from the top position but, despite having only operated for eight days in March, it was still the 6th most prevalent malware to affect organizations during the month. At its peak, Coinhive impacted 23% of organizations worldwide. Many websites still contain the Coinhive JavaScript code today, though with no mining activity taking place. Check Point’s researchers warn that Coinhive may well reactivate if the value of Monero increases. Alternatively, other mining services may increase their activity to take advantage of Coinhive’s absence. During March, three of the top five most prevalent malware were cryptominers – Cryptoloot, XMRig and JSEcoin. Cryptoloot

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to their Cloud vendors for the compute resources used illicitly by cryptominers. This is a call for action for organizations to secure their Cloud environments.” March 2019’s Top 3 ‘Most Wanted’ Malware: 1. ↑ Cryptoloot - Crypto-Miner that uses the victim’s CPU or GPU power and existing resources for crypto mining - adding headed the Threat Index for the first time, transactions to the blockchain and closely followed by Emotet, the modular releasing new currency. It is a competitor trojan. Both had a global impact of 6%. to Coinhive, trying to pull the rug under it XMRig is the third most popular malware by asking a smaller percentage of revenue impacting 5% of organizations worldwide. from websites. Maya Horowitz, Threat Intelligence 2. ↑ Emotet- Advanced, self-propagate and Research Director at Check Point and modular Trojan. Emotet once used to commented, “With cryptocurrencies’ employ as a banking Trojan, and recently values dropping overall since 2018, we is used as a distributer to other malware will be seeing more cryptominers for or malicious campaigns. It uses multiple browsers following Coinhive’s steps and methods for maintaining persistence and ceasing operation. However, I suspect that evasion techniques to avoid detection. cyber criminals will find ways to earn from In addition, it can be spread through more robust cryptomining activities, such phishing spam emails containing malicious as mining on Cloud environments, where attachments or links. the built-in auto-scaling feature allows the 3.↑ XMRig- Open-source CPU mining creation of a larger haul of cryptocurrency. software used for the mining process of We have seen organizations being asked the Monero cryptocurrency, and first seen to pay hundreds of thousands of dollars in-the-wild on May 2017.

NETWORKING UPDATES

QUALCOMM ENABLE 5G WIRELESS ACCESS EQUIPMENT Qualcomm Technologies and Aquantia are working closely to support the design and optimization of next-gen 5G NR fixed wireless access broadband equipment for high-speed Internet delivery to the customer premises. The customer premises equipment (CPE) platform will comprise of the Aquantia AQtion Multi-Gig Ethernet Controllers AQC107 (10GbE) and AQC111C (5GbE), which can be used in conjunction with the Qualcomm Snapdragon X55 5G modem available from Qualcomm Technologies. Deployment in the United States is slated for the first half of 2020 and Aquantia has supplied samples of the reference design to early customers. The company further stated that the use of our 5G connectivity platform with Aquantia’s Multi-Gig wired backhaul in the connected home and enterprises can help support the growth of connected devices and provide unsurpassed user experience. “For more than 30 years,

Qualcomm has provided foundational wireless technologies that help to transform industries. We are continuing that legacy by providing a robust platform designed to support seamless 5G connectivity in the connected home and enterprises, powered by our second generation Snapdragon X55 5G modem with support for both mmWave and sub-6 GHz spectrum bands,” said Gautam Sheoran, Senior Director, Product Management, Qualcomm Technologies, Inc. By creating a wireless service model using 5G NR technology, this CPE platform

provides an optional method to deliver Multi-Gig Internet service to consumers. The CPE platform also offers a cost effective and efficient way to deliver improved Internet service in areas where laying new cables or fiber deployment is not practical. The delivery of 5G connectivity into the home, through the AQC107 and AQC111C will enable Internet-connected devices in the home to access rich media applications at lightning-fast speeds. The CPE platform specifically addresses the following concerns: The rise in demand for reliable and ultralow latency connectivity services The rapid increase in the development of connected IoT devices The continuous increase in data traffic “Use of the Snapdragon X55 5G modem with Aquantia’s Multi-Gig wired backhaul has the potential to create new business models beyond what has traditionally been offered by Internet service providers.

CISCO PARTNERS WITH BHARTI AIRTEL

FORTINET SD-WAN ASIC TO SECURE THE WAN EDGE

Airtel to offer Managed SD-WAN and Cisco Webex solutions to Indian enterprises and SMBs Bharti Airtel and Cisco have formed an alliance to offer advanced networking and connectivity solutions to enterprise and SMB customers in India. As India is becoming the fastest growing major economy in the world, it sees a strong growth in demand for nextgeneration connectivity solutions. This partnership will further leverage Airtel’s deep customer relationships and network to offer highly secure and cutting-edge digitization technology from Cisco in India. The terms of the alliance states that Airtel will offer Managed Software-Defined Wide Area Network (SD-WAN) services in collaboration with Cisco. Built on the Cisco-Viptela platform, Airtel’s Managed SD-WAN service will provide real-time analytics and in-built security. This solution will also include a centralized policy, and a management controller that will provide customers with a clear view of data flows across their networks and enable them to optimize data traffic to suit their business needs. The fully managed, resilient and dynamic central platform will result in helping businesses reduce networking capex and lower migration issues during the transition of applications and data to the Cloud.

Fortinet has launched new secure SD-WAN offerings, including the Fortinet claimed industry’s first SD-WAN ASIC, to further enable organizations to implement security-driven networking. Rajesh Maurya, Regional Vice President, India & SAARC, Fortinet commented, “The WAN edge is now a part of digital attack surfaces, but the edge of your network must never be a bottleneck. For branch offices, the ability to provide bestof-breed WAN Edge - including SD-WAN, WAN optimization, security and orchestration - with optimal performance and security is critical to enable the digital experience. Fortinet’s SoC4 SD-WAN ASIC allows organizations to realize securitydriven networking whether they have 100 or 10,000 branch offices.” As organizations adopt SD-WAN for faster and more cost-effective connectivity, security remains their top challenge. A recent report by Gartner revealed that “72% of the respondents said that security was their topmost concern when it comes to their WAN.” In response, Fortinet continues to empower customers to deploy security-driven networking with the following new innovations: SaaS and multi-cloud application usage is increasing and with it the need to make the WAN Edge “application aware.” Fortinet is introducing the industry’s first SoC4 SD-WAN ASIC, which delivers the industry’s fastest application identification and steering for more than 5,000 applications.

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TREND TAP

AI & IOT – Making A Business Sense!

AI fact has just not merely derived from AI fiction; it’s the future of marketing strategies already. As the evolution gets vigorous, businesses and other admirers should surely be cautious and well prepared. If they hurry to deploy the technology without firm benchmarks of how to deploy AI without clear business results, they risk wasting their investment in the innovation. To describe in this article, the power of AI with IoT, we should also know that this convergence have been there earlier. Data is essential for companies to penetrate down and create noteworthy experiences. It is evaluated that 99.5% of digital data isn’t dissected. The constant growth of data from both people and the Internet of Things (IoT) gadgets will just keep on developing. Companies can address the data difficulty just by picking up a cognitive advantage. In the coming years, Artificial Intelligence (AI) is an absolute necessity to remain aggressive. IoT and AI it isn’t that hard to understand what both have in common: data turned into information into intelligence into decisions for meaningful purposes across several use cases. We also will look a bit deeper though, among others at some areas where AI is changing the various technologies and levels in the bigger IoT and Industrial IoT picture. But the question remains, why AIempowered IoT remains the way to business achievement in the digital age. A recent report by the International Data Corporation (IDC) uncovers that by 2019, 100% of all powerful IoT endeavors will be supported by cognitive or AI abilities. The key: opening insights covered up in data. The immense volumes of data spouting from various IoT gadgets have limited value without AI innovations that are equipped for discovering important insights in the data. In an IoT circumstance, AI can help organizations take the billions of data points they have and boil them down to what’s extremely important. The general reason is equivalent to the retail applications, audit and break down the data you’ve gathered to discover patterns or likenesses that can be gained

BISINFOTECH|MAY 2019|VOL 1|ISSUE 05

from with the goal that better choices can be made. To have the capacity to call out potential issues, the data must be examined as far as what’s normal and so forth. Similarities, connections, and variations from the norm should be immediately distinguished dependent on the real-time flow of information. The data gathered, integrated with AI, makes life simpler with smart automation, predictive analytics, and proactive intervention. The last two years saw organizations gaining a lot of firms that work at the crossing point of AI and IoT. A lot of leading IoT platform vendors, for example, Amazon, IBM, Oracle, Microsoft etc. began offering integrated AI abilities, for example, ML-based analytics. The primary explanation for AI holding the reins in companies is its capacity to beat insights rapidly from mass amounts of data. Other than insights generation, the ground-breaking mix of AI and IoT empowers organizations to maintain a strategic distance from impromptu downtime, improve operational proficiency, empower new products and services etc. Technologies enabling digital transformation and Industry 4.0, as they are depicted in IDC’s third platform, for instance, it’s important to remember that they don’t live in splendid isolation. Just take some typical technologies (or rather technological areas) in a scope

of Industry 4.0: digital twins, virtual and augmented reality, cloud, big data, robotics, etc. It’s relatively obvious that they all work side by side with, for instance IoT and AI. Cognitive computing strategies, for example, face detection and acknowledgment, natural language processing, and character recognition innovation change the manner in which companies determine a value out of data. While IoT quickens and continues the development of data in tremendous amounts, the use of AI makes the data increasingly noteworthy. As such, the assembly of AI and IoT augments “connected intelligence”. Some of the clear advantages of AI and IoT • A rtificial Intelligence and IoT can make increasingly versatile learning and analytical frameworks that helps business to gather insights. • It e n c o u r a g e s s y n c h r o n i z a t i o n , correspondence, and integration in a superior manner • It illuminates organizations about proactive moves that should have been made so as to stay updated with the changes • The AI-empowered IoT frameworks are savvy, self-learning, and equipped for building up highly cognitive companies • Automated the procedures across the company and set up a highly collaborative environment

TREND TAP

What Is Driving Automotive In India? The Indian automotive OEM industry is already in a strong position. Globally, it is at the forefront of many segments— leading in two-wheelers, segment A cars, and tractors. The industry aspires to nearly triple vehicle sales by 2026, from 26 mn to 65 mn to 76 mn vehicles, across segments. These could be definitive tailwinds for the Indian automotive components industry, which has ambitions of its own by 2026—to double the contribution to manufacturing GDP with a four-fold growth in size and a six-fold growth in exports.

Make in India

For most major domestic and foreign OEMs across vehicle segments, India’s growing localization levels indicate the industry’s capability to produce a diverse portfolio. Top selling models across vehicle segments—hatchbacks, SUVs, premium sedans, commercial vehicles—have achieved 85 percent or higher localization. Market leaders in two-wheelers have started developing bikes that are 100 percent indigenous. And a very cost-sensitive segment such as tractors is at nearly 100 percent localization.

The Automotive HUD Market

The automotive HUD market is estimated to be USD 1.1 billion in 2019 and is projected to reach USD 4.3 billion by 2025, at a CAGR of 25.28% during the forecast period. Consumers are increasingly considering advanced automotive safety functions and technologies while making purchase decisions. Further, government regulations in the developed regions of North America and Europe are increasingly favoring automotive innovations and technologies that support vehicle and road safety. 3-D is the fastest growing segment of the automotive HUD market, by dimension type. The 3-D HUD technology is attractive to leading auto manufacturers because it is compact, does not require eye tracking, and provides a deeper field of view than the existing HUD displays. Passenger car is expected to be the largest vehicle

type segment in the automotive HUD market. The demand for such advanced technology is expected to increase in both developing and developed countries such as the US, Germany, the UK, China, and Japan, where there is faster adoption of advanced in-vehicle safety technologies. Europe is expected to be the largest growing automotive HUD market. Europe is projected to dominate the automotive HUD market during the forecast period. Owing to the large market for premium and luxury cars in the European countries and the rising consumer demand for active safety systems in mid-segment vehicles, the European region is the largest market for automotive HUDs.

The Market Model of the Future

Dominance of Mobility

Mobility remains dominated by personal vehicles, and the market is far from the tipping point at which services start to generate more revenues than vehicles. In the outcome economy context, purchasing decisions made for each ride are influenced by factors including availability, comfort, ease of use, reliability ratings and pricing. By contrast, revenues from mobility services are projected to soar to almost €1.2 trillion—with profits reaching as much as €220 billion. Fueled by constant improvements in autonomous vehicle technologies, global markets for mobility as a service are set to grow exponentially over the next decade.

Semiconductor on the Hot Seat

According to IC Insights most recent report on semiconductor industry drivers, industrial electronic systems are forecast to enjoy the second-fastest CAGR through 2021, 4.6 percent. This

growth includes increases in robotics, wearable health devices and systems promoting the Internet of Things help drive growth in this segment, the firm said. Other forecasted compound annual growth rates listed in the report include 4.2 percent for communication systems and 2.8 percent for consumer electronic systems. The personal computing segment is expected to have the weakest CAGR of all major semiconductor drivers through 2021, IC Insights said. The global automotive semiconductor market is expected to reach an estimated $67.5 billion by 2023 with a CAGR of 13.1% from 2018 to 2023. The future of the global automotive semiconductor market looks promising with opportunities for passenger cars, commercial, and electric vehicles. The major growth drivers for this market are increasing vehicle production, increasing electronic content per vehicle, and growing demand for advanced vehicle safety and comfort systems. Emerging trends, which have a direct impact on the dynamics of the automotive semiconductor industry, include the introduction of high efficiency power semiconductors, and development of smaller single-chips for radar sensors.

Automotive Sensor Market

According to Research for Markets, the Global Automotive Sensors Market is accounted for $23.89 billion in 2016 and is expected to reach $40.23 billion by 2023 growing at a CAGR of 8.1% from 2016 to 2023. Safety & control application segment is expected to witness high compound annual growth rate. The growth is attributed to raising awareness about vehicle safety, and increasing various regulations. Position sensors are leading the market by its market revenue due to high adoption in passenger cars. By geography, Asia Pacific is projected to register the largest market share and is anticipated to grow with a highest CAGR during the forecast period attributed to rising demand for safer vehicles and growing automobile industry in emerging economies such as China and India.

ISSUE 05|VOL 1|MAY 2019|BISINFOTECH

TREND TAP

'Internet Of Trend' Analysis IoT is now for years the most popular technology buzzwords of the year. As the IoT technology has evolved it has brought more questions than answers for the industry. The possibility of IoT is still reviewed as nascent as the gamut of connected technologies will be gigantic. Severe questions about the data collected by all devices and sensors of Io Tans its criticality. IoT will produce a tsunami of big data, with the rapid expansion of devices and sensors connected to the Internet of Things continues, the sheer volume of data being created by them will increase to an astronomical level. This data will hold extremely valuable insights into what’s working well or what’s not. Also, IoT will point out conflicts that arise and provide highvalue insight into new business risks and opportunities as correlations and associations are made. Also, IoT will alongside

Speed of big data analysis Accuracy of big data analysis The only way to keep up with this IoT-generated data and gain the hidden insights it holds is using AI (Artificial Intelligence) as the last mile of IoT.

Artificial intelligence (AI) and IoT

bring new technologies like AI, machine learning and many new cognitive technologies. Examples of such IoT data: • Data that helps cities predict accidents and crimes • Data that gives doctors real-time insight into information from pacemakers or biochips • Data that optimize productivity across industries through predictive maintenance on equipment and machinery • Data that creates truly smart homes with connected appliances • Data that provides critical communication between selfdriving cars That’s the good news, but it’s simply impossible for humans to review and understand all of this data with traditional methods, even if they cut down the sample size, simply takes too much time. The big problem will be finding ways to analyze the deluge of performance data and information that all these devices create. Finding insights in terabytes of machine data is a real challenge, just ask a data scientist. But in order for us to harvest the full benefits of IoT last mile (data), we need to improve:

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Artificial intelligence (AI) is the intelligence exhibited by machines or software. It is an academic field of study which generally studies the goal of emulating humanlike intelligence. John McCarthy, who coined the term in 1955, defines it as “the science and engineering of making intelligent machines” In an IoT situation, AI can help companies take the billions of data points they have and boil them down to what’s really meaningful. The general premise is the same as in the retail applications – review and analyzes the data you’ve collected to find patterns or similarities that can be learned from so that better decisions can be made. To be able to call out potential problems, the data has to be analyzed in terms of what’s normal and what’s not. Similarities, correlations, and abnormalities need to be quickly identified based on the real-time streams of data. The data collected, combined with AI, makes life easier with intelligent automation, predictive analytics, and proactive intervention.

AI in IoT applications:

Visual big data, for example – will allow computers to gain a deeper understanding of images on the screen, with new AI applications that understand the context of images. Cognitive systems will create new recipes that appeal to the user’s sense of taste, creating optimized menus for each individual, and automatically adapting to local ingredients. Newer sensors will allow computers to “hear,” gathering sonic information about the user’s environment.

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