Bisinfotech Magazine January Issue 2020

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Editorial India Eyeing solid and sustainable growth in 2020 India is set for a modest recovery after a loss of momentum, as reforms to simplify taxation, lighten business regulations and upgrade infrastructure start to bear fruit. Further reforms to modernise the economy are now needed to drive the creation of high-quality jobs, as well as measures to improve public services and welfare.

The latest OECD Economic Survey of India notes that while India has greatly expanded its participation in global trade in recent years, private investment remains relatively weak, the employment rate has declined amid a shortage of quality jobs, rural incomes are stagnating, and per-capita income varies considerably across states.

“India is now well established as a growth champion and a major player in the global economy,” said OECD Chief Economist Laurence Boone. “However, this slower pace of growth underlines the need to fully implement existing reforms and continue lowering barriers to trade to generate the investment and jobs India needs to raise living standards across the country.”

While many millions of Indians have been lifted out of poverty in recent years, too many have no formal employment benefits and little access to finance. Doing more to simplify complex labour laws – many of which discourage hiring by becoming binding as firms grow above stated thresholds – would help raise the share of quality jobs demanded by a fast-growing and well-educated youth population in a country where the vast majority of employment is informal.

India’s share of global goods and services exports reached

CONSULTANT EDITOR NILOY BANERJEE niloy@bisinfotech.com SUB EDITOR NITISHA DUBEY nitisha@bisinfotech.com MARKETING MANAGER ARNAB SABHAPANDIT arnab@bisinfotech.com DESIGN HEAD SANDEEP KUMAR

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WEB DEVELOPMENT MANAGER JITENDER KUMAR WEB PRODUCTION BALVINDER SINGH SUBSCRIPTIONS PRIYANKA BHANDARI priyanka@bisinfotech.com MANAGER FINANCE KULDEEP GUSAIN accounts@bisinfotech.com

BISINFOTECH|JANUARY 2020|VOL 2|ISSUE 01

2.1% in 2018, up from 0.5% in the early 1990s, thanks to a strong performance in sectors like information technology and pharmaceuticals. Addressing remaining infrastructure bottlenecks by modernising ports and adding roads will be key to boosting India’s competitiveness. Reducing restrictions to services trade imposed by trading partners and by India on imports would further boost trade in services, also giving a lift to manufacturing and the general economy.

ManasNandi

MANAS NANDI EDITOR manas@bisinfotech.com

Bisinfotech is printed, published, edited and owned by Manas Nandi and published from 303, 2nd floor, Neelkanth Palace, Plot No- 190, Sant Nagar,East of Kailash, New Delhi- 110065 (INDIA), Printed at Swastika Creation 19 DSIDC Shed, Scheme No. 3, Okhla Industrial Area, Phase-II, New Delhi- 110020 Editor, Publisher, Printer and Owner make every effort to ensure high quality and accuracy of the content published. However he cannot accept any responsibility for any effects from errors or omissions.

The views expressed in this publication are not necessarily those of the Editor and publisher. The information in the content and advertisement published in the magazine are just for reference of the readers. However, readers are cautioned to make inquiries and take their decision on purchase or investment after consulting experts on the subject. BisInfotech holds no responsibility for any decision taken by readers on the basis of the information provided herein. Any unauthorised reproduction of Bisinfotech magazine content is strictly forbidden. Subject to Delhi Jurisdiction.

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Contents 12 ELECTRIC VEHICLES

18 MARKET ANALYSIS

ELECTRIC VEHICLE CHARGING: HOW TECHNOLOGY AND SMART ENGINEERING WILL MAKE OUR ELECTRIC FUTURE

SEMICONDUCTOR INDUSTRY – MARKET BEHAVIORAL ANALYSIS

POSSIBLE

38 5G NETWORKS- ARE YOU SKILLED TO BUILD 5G NETWORKS

08 TECH FEATURE- 48V VEHICLE ELECTRICAL

SYSTEM MORE THAN JUST A BRIDGING TECHNOLOGY?

36

WITH THE BOOST IN IOT ADOPTION, SKILLING BECOMES VERY CRUCIAL FOR THE INDUSTRY

56 LED- POE TRENDS 2020 ANUJ DHIR, VP & BUSINESS HEAD, WIPRO LIGHTING

32 EV FEATURE- ARE YOU SKILLED TO BUILD 5G NETWORKS

17 2020 TECHNOLOGY PREDICTION – IEEE

Active

14 VICOR ACTIVE- FACTORIZED POWER

ARCHITECTURE: ACHIEVING HIGH DENSITY AND EFFICIENCY IN BOARD MOUNTED POWER

34 INDUSTRY KART- RS COMPONENTS INTRODUCES NEW SERIES OF CONVERTERS

42 INDUSTRY REPORT- NEW TECHNOLOGICAL ERA BEGINS FOR INDIAN RAILWAYS

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BISINFOTECH|JANUARY 2020|VOL 2|ISSUE 01

39 TECH COLUMN- KEY AREAS TO CONSIDER WHILE CHOOSING TECHNOLOGY PARTNER

40 AUTO VOICE- EXPLAINED WHY

AUTOMOTIVE INDUSTRY WILL BE THE BIGGEST CONSUMER OF IOT IN WILL BE 2020

24 T&M TECH TRENDS- KEYSIGHT SHARES TECHNOLOGY PREDICTIONS 2020 FROM A [PRECISION] ELECTRONIC TEST THINKTANK

57 RESEARCH - A SWEAT ANALYZER, WHICH DETECT NUTRIENTS

28 EV FEATURE- SOLAR ENERGY & EV CHARGING INFRASTRUCTURE

26 EXPERT'S COLUMN- AN IMMEDIATE NEED OF THE HOUR: SMART CITIES

37 VICOR ACTIVE- VICOR DCM™ POWERS THE TOYOTA AI BASKETBALL-PLAYING ROBOT “CUE3”

52 INDUSTRY LAUNCH- VISHAY PRESENTS IHDF EDGE-WOUND INDUCTOR

44 INDUSTRY UPDATES- TOSHIBA

COLLABORATES WITH CYPRESS SEMICONDUCTOR

22

ND

23|24|25 SEP 2020

Bangalore International Exhibition Centre (BIEC), Bengaluru / INDIA

TECH FEATURE

48V vehicle electrical system more than just a bridging technology?

High-performance semiconductors enable efficient and reliable solutions for a wide range of automotive 48V applications

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Dr.-Ing. Dusan Graovac

Christoph Schulz-Linkholt

Dr. rer. nat. Thomas Blasius

Director and Global Head of Automotive System Engineering Infineon Technologies

Principal System Architect Power Distribution Infineon Technologies

Automotive System Marketing Body Infineon Technologies

BISINFOTECH|JANUARY 2020|VOL 2|ISSUE 01

schematic visualization Market share of the drive concepts

In recent years, the development of the 48V vehicle electrical system has focused primarily on P0 and P1 configurations in the powertrain of mild hybrid vehicles. The motivation for this was the cost advantage compared to purely electric or plug-in hybrid vehicles, the lower development effort and the immediate CO2 reduction potential for the vehicle fleet. For many manufacturers, the introduction of these mild hybrid vehicles was the quickest and most cost-effective solution to achieve current limit values for the vehicle fleet.

For this reason, the 48V vehicle electrical system is often regarded as bridging technology until a sufficiently large HV (high-voltage) BEV (battery-powered electric vehicles) fleet has established itself worldwide to comply with the CO2 regulations. However, 48V technology offers far more potential than just bridging the gap to pure BEV vehicles.

To comply with the CO2 specifications, the 48V technology enables regenerative braking, intermediate energy storage and subsequent electrical support of the conventional combustion engine. Future limit values, however, do not seem to be reproducible with this concept. This is why many automotive manufacturers are turning towards

MHEV

FHEV PHEV BEV FCEV

ICE

2015

2020

2030

2040

Fig. 1: Schematic diagram of how the market share of ICE, 48V mild hybrid and electric vehicles would have to develop in order to meet future limit values.

TECH FEATURE

HV-BEVs. Figure 1 schematically illustrates how the market share of electric vehicles would have to develop in order to comply with future limit values. This explains why the 48V vehicle electrical system is often regarded only as bridging technology.

The purely electric car with zero local emissions is clearly the ideal solution from a technical point of view and must therefore be developed and promoted accordingly.

However, to rely solely on HV electromobility is a controversial matter of debate. There is a risk that the development of promising alternative concepts such as fuel cells or CO 2-neutral synthetic fuels will be undermined, thereby losing potential key technologies. In addition, the global switch to a purely electric vehicle fleet in terms of raw material production and energy generation cannot yet be presented as CO2neutral. In particular, the energy mix and the consideration of the production and recycling of HV batteries can have a negative influence on the carbon footprint. The decisive factor will be the time scale on which electromobility can be implemented for a CO2-neutral future and how the 48V vehicle electrical system can support this.

The following therefore focuses on the question of whether the 48V vehicle electrical system will only be a bridging technology in vehicles and whether there will be further potential for the 48V vehicle electrical system.

48V architectures and applications There are various integration options (P0 to P5) for the electrical machine (EM) in the powertrain. The basic functions 'boost' and 'energy recovery' with connected as well as 'coasting' with disconnected combustion engine can be realised in all configurations, whereby an automated starting clutch is necessary for disconnected operation. What the P2 to P5 configurations have in common – unlike the P0 and P1 configurations coupled to the crankshaft speed – is that they allow braking energy to be recuperated when the internal combustion engine is disconnected and enable purely electric driving within the performance range of a 48V system. The P4 and P5 architectures also allow an allwheel drive function on a 48V basis.

Fig. 2: Schematic illustration of a dual-voltage vehicle electrical system with 48V auxiliary units

Regardless of whether the drive is a HV-BEV, fuel cell or synthetic fuel, the 48V voltage level in additional units enables energy savings compared to 12V and simplifications for installation and operation in the vehicle compared to HV – and thus a corresponding potential for optimisation.

Depending on the drive concept, potential 48V applications are shown here as illustrated in Fig. 2 e.g. eTurbo (electric turbocharger) with 2 - 4 kW, eA/C (electric air-conditioning compressor) with 4 - 5 kW, electric heaters such as eCAT (electric catalyst heating), PTC auxiliary heaters or windscreen de-icing with 1 - 5 kW, ERC (electric drive and roll stabilisation) with 1 - 5 kW, pumps and fans up to 1 kW and other applications with high power density and/or continuous use. The development of these applications in the direction of 48V can currently be seen in secondgeneration mild hybrid vehicles with P2-P4 configurations and also as a third voltage level in the HV-BEV. If we look a little further into the future at the business segment of urban mobility or what is known as "Mobility as a Service (MaaS)" as an overall concept, this opens up further applications for 48V technology. In contrast to today's requirements for the HV-BEV with regard to a very long range (> 400 km) with ever shorter charging times, the main focus here is on cost, battery weight, insulation protection and short driving distances from 2 km to 20 km. There is sufficient time for charging during working hours, overnight or similar depending on the infrastructure and parking of the vehicle.

For this requirement, there are calculations that a 30 kW drive is sufficient to complete the urban and overland standard cycle with small city cars. In addition, a 48V BEV powertrain is approximately 25% cheaper than a HV 400V BEV powertrain in this operating cycle. Furthermore, there are already commercial vehicles with a payload of up to 1,000 kg based on a 48V BEV. Motorcycles and electric scooters as 48V BEV are also establishing themselves in the market, in some cases even with replaceable batteries.

All these implementations can use applications already developed or to be developed for the mild hybrid car, e.g. battery with battery management system (BMS), inverters, DC/DC converters and auxiliaries.

The question remains as to how the topic of "MaaS" will continue to develop. Here, even traditional car manufacturers are currently repositioning themselves and developing strategies on how to implement the transformation to a MaaS provider and thus define a completely new ecosystem. In these models the complete range of mobility is addressed and apart from the small urban vehicles for a few persons there is also a "shuttle POD" similar to EasyMile with up to 12 persons transport capacity, "people mover" similar to buses and "cargo mover" for the last mile service. Due to the greater weight compared to the small city car, higher power densities are required here. This could lead to the use of 48V not only for the traditional powertrain and auxiliary units, but also for steering, braking, driving stabilisation and possibly also for the wheel hub motor. Similar applications can be found in the truck, agricultural, construction machinery, forklift, special vehicle and aviation markets.

Even if only some of the above-mentioned applications, some of which are still far in the future, are implemented, this would significantly extend the 48V lifecycle.

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TECH FEATURE

isolation. The 48V vehicle electrical system is electrically coupled to the 12V vehicle electrical system using a DC/ DC converter.

Complete 48V portfolio Infineon offers a complete system of chipset solutions – from voltage regulators, transceivers and sensors to microcontrollers, smart power drivers and very low-resistance MOSFETs – for 48V systems.

Fig. 3: Block diagram for a 48 V micro hybrid system with the main semiconductor components

High-performance semiconductors for the 48V architecture Semiconductors in the 48V vehicle electrical system are used in particular for controlling electric motors and in the inverter for power distribution or for supplying the auxiliary units. They also provide the connection between the 48V and 12V electrical system levels by means of DC/DC converters.

Corresponding components are sensors, microcontrollers, power, supply, communication and driver ICs The block diagram (Figure 3) shows the basic layout of the semiconductors used to control a starter-alternator – the key component in the 48V vehicle electrical system. To power the microcontroller, the system voltage (48 V) is reduced to a level common for microcontrollers and other ICs. This is the essential function of the supply IC (safety system supply). It also performs additional tasks in the area of functional safety. The microcontroller enables both fieldoriented control of the electric motor and control of the exciter winding in alternator operation. For this purpose, complex timer units are implemented in the microcontroller.

In addition, it communicates with other control units of the vehicle via various communication buses (e.g. via CAN).

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With appropriate sensors, the rotor position and rotational speed of the electric motor rotor and the currents currently flowing in the inverter are measured and transmitted to the microcontroller. Smart sensor ICs can already process the measured data internally and make this data available to the microcontroller as digital values via a sensor bus. For precise motor control, it is also necessary to transmit the currents in the individual motor phases to the microcontroller.

For this purpose, either shunt resistors are used in the inverter or the currents are determined using magnetic field sensors.

Low-loss MOSFETs are often used as power stage ICs in the 48V vehicle electrical system, which are usually controlled and monitored by dedicated 3-phase drivers and switched to a safe state in an emergency. Other important components, in addition to the motor driver ICs, are high-performance gate driver ICs which, in conjunction with MOSFETs, provide highly reliable battery switches or safety switches for 48 V/12V

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The AURIX microcontroller family was initially very successful, especially in the area of powertrains, but also addresses other domains such as safety/security or driver assistance systems. In the meantime, the products of the latest AURIX generation TC3xx (40 nm with embedded flash) are in production and offer all the ingredients for high-performance and efficient designs. This allows designers to choose from a broad portfolio of scalable memory sizes, peripheral functions, frequencies, temperature and package options.

The multicore architecture of the AURIX TC3xx family contains up to six independently operating 32-bit TriCore processor cores and thus significantly boosts computing performance compared to the previous generation. TC3xx microcontrollers offer the ideal combination of real-time capability, data security and functional safety for ISO 26262 system requirements up to ASIL-D. The combination of the AURIX with the TLF35584 safety supply device is ideal. The external safety device not only provides the power supply, but also monitors it and the functional status (e.g. watchdog) of the microcontroller and is sometimes responsible for switching the system to a safe state (fail safe) in the event of a safety-relevant fault. This increases the availability of the system while allowing the microcontroller's error response to be individually configured.

Other important communication and power components for 48V systems are isolated CAN transceivers and bridge driver ICs (e.g. TLE9180).

48V applications are experiencing high demand for 80V and 100V MOSFETs for applications such as starter-alternators (belt-driven or integrated), DC/DC converters or battery main switches. Infineon's OptiMOS5 family offers a broad portfolio of low, scalable on-state resistors (down to 1.2 mW) and various packages such as the new TOLL (TOleadless), TOLG (HSOG-8), TOLT (top-side cooling for high performance), bare die and chip embedding.

48V systems also require precise and robust sensors for sensing the rotor position of BLDC motors as well as for current measurement. Basically, the sensors should take up as little space as possible, have low losses, be flexible and cost-effective and be highly precise, robust and safe in operation over the entire service life. By way of example, the Hall-based current sensor XENSIVTM TLI4971, the first member of Infineon's new "coreless" current sensor family, meets all these requirements. It measures currents up to 120 A and is supplied fully calibrated.

TECH FEATURE

to the fact that mild hybrid vehicles emit up to around 15% less CO2 than conventional powertrains.

Fig. 4: With chip embedding, the power density can be increased by a further 35%.

Chip embedding Infineon Technologies has partnered with Schweizer Electronic AG (https://www.schweizer.ag/en/home.html ) to develop power MOSFET chip embedding technology (Fig. 4). The technology can increases the performance of 48V systems up to 60% while reducing complexity in assembly and joining technology. In chip embedding, the MOSFETs are not soldered onto printed circuit boards as before, but integrated directly into them as so-called standard cell (MOSFET bare die in a copper leadframe). The thermal and electrical advantages associated with this enable significantly higher power density. At the same time, reliability can be increased, specifically in comparison to ceramic modules.

This allows developers to either increase the performance of a 48V system or make it more cost-effective. For example, integrated 48V starter-alternators make a major contribution

Conclusion Against the background presented here and the application examples mentioned, it certainly makes sense to make further investments and system optimisations for the automotive use of a 48V vehicle electrical system voltage. Infineon is therefore pursuing a consistent strategy of investing not only significantly in high-voltage technologies for electric vehicles, but also in 48V technologies and products. To implement this, a broad, scalable portfolio of high-performance semiconductors is available.

References: (1) S EG Automotive, Whitepaper, Transformation of the powertrain (2) Mahle International GmbH, H. Oechslen, ELIV Marketplace 2018, 48 V – Basis for flexible future Mobility (3) E VUM Motors GmbH, Product catalogue 2019 (4) H ANSER automotive 5-6 / 2017, Dr. D. Graovac and P. Leteinturier, 48V vehicle electrical system in mild hybrid vehicles (5) Toyota Motor Corporation, Shigeki Tomoyama, Executive Vice President, FY2019 3Q Financial Results (February 6, 2019) (6) H onda eMaaS Strategy in Honda meeting July 2018: https://global.honda/newsroom/news/2019/c190704eng.html

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Electric vehicle charging: How technology and smart engineering will make our electric future possible CARLOS CASTRO Global Director Integrated Circuits and Automotive Power | Littelfuse

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The number of electric vehicles (EVs) and plug-in hybrid electric vehicles (HEVs) is, at present, low compared to internal combustion engine vehicles. However, the switch to HEVs and EVs is accelerating. Forecasts are looking at about 40% growth by 2020, to 30.3 million vehicles from about 4.2 million vehicles in 2017. Numbers vary among reports, but all predict that in the next years we will see incredible growth in HEVs and EVs. The switch to electric is a quiet country lane today

BISINFOTECH|JANUARY 2020|VOL 2|ISSUE 01

that will become a six-lane highway tomorrow.

The speed of that transformation depends on many factors.

Currently, two of the biggest limitations are a lack of vehicle charging infrastructure and the time it takes drivers to charge their cars. That’s why developing a network of DC fast charging stations is so important.

Surprisingly, the growth in DC fast charging stations is modest because hybrid-electric cars do not use DC charging and

ELECTRIC VEHICLES

Figure 1 DC charging systems use a variety of circuit protection and power semiconductor technologies.

because not all completely electric cars are able to use fast charging. By 2023, experts predict there will be 2,000 DC fast charging stations, of which very few will be truly fast, having more than 50 kW of charging power.

Nevertheless, these charging stations will have an outsized impact on the electronics industry. The number of power semiconductors in a DC fast charging stations is so large that, even with low numbers of units, the total market for power semiconductor devices could reach more than 120 million devices by 2030. The growth rate for charging systems is expected to explode around 2030, and so the market for power semiconductor devices and associated components is expected to grow exponentially.

Driving growth Governmental regulation and legislation are driving this growth, as leaders in the United States, China and Europe push the switch to HEVs and EVs to meet the goals of CO2 reduction and higher fuel efficiency standards.

Consumers seem ready. The limited driving range on a single charge has been a challenge to consumer adoption. But

battery technology has been improving in the past several years. Battery charging capacity and power density are increasing at the same time battery cost is falling. With batteries becoming lighter and more powerful, we are seeing new electric cars with a driving range of 300 miles and even more, very close to the range of combustion engine cars. That’s sparking adoption. Another enabling technology has been the emergence of silicon carbide and gallium nitride power semiconductor devices and modules. EV charging stations at 50 kW and higher need high efficiency power conversion.

Every percentage of power loss creates an engineering challenge in how to deal with the heat dissipation.

Imagine that a consumer wants to charge his or her car at a DC fast charging station capable of delivering more than 50 kW. This involves extremely high levels of current and therefore losses in the charging cable overheating it. This means that designs will need cooling for the cable, a complexity that is not required for the older generation of charging stations.

The physics are driving the industry to seek new technologies that offer higher power efficiency during power conversion.

Design engineers are embracing Wide Band Gap (WBG) power semiconductor devices because those technologies lower power loss. SiC devices in particular have become very reliable and more affordable, and that is helping to enable the switch to electric vehicles.

Figure 2 SiC MOSFETs and Schottky diodes, like these from Littelfuse, are designed for EV charging applications by offering low power switching loss.

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Active

Factorized Power Architecture: Achieving high density and efficiency in board mounted power TOM CURATOLO

Principal Applications Engineer As motherboard loads and load power began to increase and density became even more challenging, power systems architecture evolved from a distributed DC-DC converter (or Brick) to IBA (Intermediate Bus Architecture). With IBA, a converter steps the 48V input down to 12V and multiple niPOLs (non-isolated point-of-load regulators) buck the 12V down to specific load voltage requirements.

Power system architectures adapted to solve the new challenges of a changing communications, computing and industrial world, driven by ever-increasing performance demands.

Today’s power requirements and lower (<<1V) PoL operating voltages, are placing new demands on IBA that now affect system performance. The increase in power and dynamicload requirements of many of today’s loads (CPUs, GPUs, AI processors) demand that their voltage regulators (VRs) be located as close as possible to the load input power pins. This significantly reduces power losses through printed circuit board or substrate copper power planes referred to as the Power Delivery Network, or PDN. Additionally, many loads require extremely high-current transient response (di/dt), which motherboard impedance can impact.

However, placing high-current voltage regulators close to high-power loads does have drawbacks for IBA due to the large number of VRs (niPOLs) required to support the high power. This in turn requires more space, leading to increased distance (impedance) from the load and lower overall efficiencies due to increased losses and subsequent lower dynamic performance. The conversion ratio of 12 to <<1V is also a serious obstacle for the multiphase buck niPOL array due to duty cycle limitations.

Factorized Power: The solution to today’s new power challenges

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Summarizing the trending challenges for power system design: 1. A very high current delivery capacity, from 500 to 2000A. 2. Loads requiring high dynamic performance

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3. Large PDN losses and impedances 4. E xpanding use of the 48V bus infrastructure, requiring a 48V to sub-1V capability Solving this high-current and high-density point-of-load (PoL) problem requires a different approach. Factorized Power Architecture™ (FPA™) is the solution.

Distributed power architecture and IBA both consist of conversion and regulation stages to get down to the point-of-load voltages. In the case of IBA, the regulation and conversion stage (Buck Regulators, niPOLs) follows the conversion stage IBC (Intermediate Bus Converter).

Factorizing these architectures delivers: •V oltage transformation (converting a voltage from one level to another) • Voltage regulation (controlling the converter output voltage to a target value even when the input voltage varies) A regulator has optimum efficiency when VIN = VOUT and loses efficiency as the regulator's input-to-output ratio increases. With a typical input voltage varying between 36 and 60V, the optimum output bus voltage would be 48V instead of the legacy 12V bus that is typical of IBA. A 48V output bus requires four times lower current than the 12V bus (P = V•I) and PDN losses are the square of the current (P = I2R), which reduces losses by 16 times. So placing the regulator first and regulating to a 48V output will achieve the highest efficiency.

As can be seen in this example, this regulator must accept an input that can sometimes swing lower than 48V, necessitating a buck-boost regulating stage to satisfy this aspect of the design. Once the input voltage is regulated, the next step is to convert the 48 to 1V. In the case of a 1V load requirement, the best transformation ratio would be 48:1. In that case, the regulator bucks or boosts the input to a 48V output and the transformer steps down the voltage from 48 to 1V. Given that a step-down voltage transformer increases current by the same ratio, an equivalent name for the transformer component is a

Active

Current Multiplier. In this case a 1A input current would be multiplied to 48A out. To minimize PDN losses of the highcurrent output, the current multiplier needs to be small so it can be positioned as close to the load as possible.

Energy storage and dynamic repsonse the FPA™ way

PRM™ Regulators and VTM™ Current Multipliers combine to form the Vicor Factorized Power Architecture™. These two devices work in partnership with one another, each fulfilling its specialized role efficiently to enable the complete DC-DC conversion function.

The PRM supplies a regulated output voltage, or ‘factorized bus’ from an unregulated input source. This bus feeds a VTM which transforms the factorized bus voltage to the level needed by the load.

Unlike IBA, FPA does not step down from an intermediate bus voltage to the PoL through series inductors. Instead of averaging down the intermediate bus voltage, FPA uses high-voltage regulation and “current multiplier” modules (VTM) with a current gain of 1:48 or higher to provide higher efficiency, smaller size, faster response and scalability to 1000A and beyond.

The components behind factorized power The PRM and VTM are the components that make FPA possible. The PRM uses a patented Zero‑VoltageSwitching (ZVS) buck-boost regulator control architecture to give high-efficiency step-up and step-down voltage regulation and soft start; maximum efficiency is achieved when VIN = VOUT, with 99.3% peak being achieved with the latest PRMs. The VTM current multiplier is a high-efficiency voltage transformation module using a proprietary Zero‑Current Switching / Zero-Voltage Switching (ZCS / ZVS) Sine Amplitude Converter (SAC™). It operates on a pure sinusoidal waveform with high spectral purity and common-mode symmetry.

These characteristics mean that it does not generate the harmonic content that the typical PWM type conversion has and generates virtually minimal noise. The control architecture locks the operating frequency to the powertrain resonant frequency, allowing up to 97% efficiency and minimizing output impedance by effectively canceling reactive components. This very low, non-inductive output impedance allows it to respond almost instantaneously to step changes in the load current.

The VTM responds to load changes regardless of magnitude in less than one microsecond with an effective switching frequency of 3.5MHz. The VTM's high bandwidth obsoletes the need for large point-of-load capacitance. Even without any external output capacitors, the output of a VTM exhibits a limited voltage perturbation in response to a sudden power surge. A minimal amount of external bypass capacitance (in the form of low ESR/ESL ceramic capacitors) is sufficient to eliminate any transient voltage overshoot.

For faster load transient response that is often required in demanding applications such as radar and ATE test heads, the SAC™ topology by virtue of employing a fixedratio converter has the advantage of not imposing the bandwidth limitations of an internal control loop struggling to maintain regulation. Thus, the VTM™ powertrain offers a unique capacitance-multiplication feature.

For example, the effective output capacitance is 2300 times the input capacitance when a VTM with a K of 1/48 is used. This means significantly less capacitance would need to be added downstream of the VTM. Energy (E) stored in a capacitor is:

Therefore, a small amount of capacitance at the 48V input to the VTM has the same effect as the bulky capacitance typically added to the 1V output of the multi-phase buck converters that are typically the niPOLs used in IBA.

FPA reduces capacitance and saves board space

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Active The benefits of FPA™ Factorized Power Architecture™ enables power system density and high-current demands to keep pace with rapidly advancing CPU, GPU and ASIC technologies. Some key advantages when designing a system with these power components include: •R educed real estate consumption near the CPU/GPU by 50% or more • Reduction by an order of magnitude in PDN and associated board losses • Unfettered performance by placing the PRM™ & Digital Controller in non-critical board edge areas • Simplified CPU I/O routing • Mitigated risk of placement near the processor's SerDes because of lower noise performance of the VTM™ • Ability to meet higher power needs because VTMs can be easily paralleled Overall efficiency for a power system – including the combination of a PRM and a VTM – operating from an unregulated DC source and supplying a low-voltage DC output typically ranges from 90 to 95%. With higher efficiency comes lower total heat dissipation, another important consideration in power systems design.

FPA: a scalable solution that can meet future demands of board-mounted power

As load currents continue to increase, Vicor has continued to enhance FPA to maximize current delivery and to further reduce density and the PDN to the point-of-load. Today Vicor offers a factorized Power‑on‑Package solution, consisting of MCDs (Modular Current Drivers) and MCMs (Modular Current Multipliers), where only the secondary side of the former VTM’s transformation stage is located at the point-of-load.

The regulation stage and the primary side of the VTM are now co-packaged into the MCD. The MCM can be mounted on the same package/substrate as the high-current processor.

The MCD, as is the case with a PRM, can be mounted far away from the current-multiplier stage, using board real estate that is not as critical for density.

Increasing numbers of applications are leveraging Factorized Power Architecture by providing 48V direct to PoL power conversion for CPU, GPU, ASIC and memory loads. This enhanced performance has been a boon for Artificial Intelligence (AI) computing, Radar and Automotive ADAS (Autonomous Driving and Safety) applications, where the demands for high density, high efficiency and low noise, outpace the conventional methods of power conversion.

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2020 Technology Prediction – IEEE SUKANYA MANDAL

IEEE Member and Data Science Professional “I think extended reality, 5G Networks and AI as-a-service would see more light in the year 2020, but it comes with its own challenges such as the following : • Extended reality although is existing for quite some time but it was mostly prevalent to the gaming industry. It needs to get its way through other industries as it has significant benefits. Also without mass adoption the cost to create such applications are high!

• 5G Networks: Billions of devices are getting connected but that poses a serious constraint on bandwidth and challenge to the security in terms of how things are managed over the network. Also speed is another factor that remotely connected sensor hub demands.

• AI as-a-service: While most companies have started to explore AI, but owning and maintaining such systems is a biggest challenge cost wise!

The biggest opportunities are the growth and adoption of 5G adoption worldwide, means a plethora of opportunities for IoT to thrive and expand.

Many solutions that are in ideation phase could see life. The sole reason being 5G is the solution to all challenges posed by IoT in terms of connectivity.

Extended reality mainstream adoption enables new doors towards many new opportunities. Besides, more adoption by industries means a reduction in cost. As more and more providers gives AI-as-a-service, we will see a massive growth of AI democratization.

Hence, the top 3 predictions for 2020 could be that IoT with 5G would be more prevalent; Industries would be more adoptive towards AI, more and more such industries would be data intensive and we will see a rise of extended reality application all over again.

DR. HARDIK PATHAK

IEEE Senior Member IEEE Industrial Application Society “ I believe that the 3 biggest challenges ahead in 2020 would be the implementation of Electric vehicle usage, harvesting solar energy and meeting power demands in the country. There are various opportunities ahead for India in 2020, as we look forward to getting efficient and economical solar infrastructure, minimizing the power losses to compensate the power demand. Moving forward we also await to see how there would be more employment opportunities created in diversified sectors”

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ISSUE 01|VOL 2|JANUARY 2020|BISINFOTECH

MARKET ANALYSIS

Semiconductor Industry – Market Behavioral Analysis The semiconductor industry as harped by other experts in this industry didn’t see a vital up run in 2019. But not getting cynical on how the market has behaved, BIS believes 2019 was a year experimenting over new innovations and pulling socks to apprehend the dynamic technological changes the industry underwent. Not some like a pie, but it was the bars the semiconductor industry was reconvening to ply as IoT, 5G washed the markets with its entrance. Going big, 2020 will further see sustainable development in these technologies and companies will keep the past learnings to innovate in the future.

Following a 12.8 plunge in 2019, global semiconductor market revenue will rebound to 5.9 percent growth in 2020—an 18-percentage point swing—according to IHS Markit | Technology, now a part of Informa Tech.

Global revenue will rise to $448 billion next year, up from $422.8 billion in 2019.

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BISINFOTECH|JANUARY 2020|VOL 2|ISSUE 01

MARKET ANALYSIS

Top Semiconductor Companies Revenue in Quarters With wooing automotive sector and entrant of IoT systems – RF semiconductor respired air in 2019. Drastic plunges reported in revenues might not have much of an effect companies as M&A and the risk to explore new emerging markets took major semiconductor companies in row. Worldwide semiconductor revenue is forecast to total $429 billion in 2019, a decline of 9.6% from $475 billion in 2018, according to Gartner, Inc.

Source: Electronic Specifier

What Went Wrong?

“The semiconductor market is being impacted by a number of factors. A weaker pricing environment for memory and some other chips types combined with the U.S.-China trade dispute and lower growth in major applications, including smartphones, servers and PCs, is driving the global semiconductor market to its lowest growth since 2009,” said Ben Lee, senior principal research analyst at Gartner. “Semiconductor product managers should review production and investment plans to protect themselves from this weaker market.”

The U.S. and China trade disputes were also a reason for bringing gloomy days for the semiconductor industry. U.S.-imposed restrictions on Chinese businesses are based on security concerns and will have a longer-term impact on semiconductor supply and demand. These combined issues will accelerate China’s domestic semiconductor production, as well as create local forks of technologies such as ARM processors. Some manufacturing will relocate outside China during the dispute and many companies will seek to diversify their manufacturing base to reduce any further disruption. The global NAND market has been in oversupply since the first quarter of 2018 and is now more pronounced as the near-term demand for NAND is weaker than expected.

Drivers of the Semiconductor Industry The two largest applications for semiconductor industry have been the PCs and smartphones.

But a slight change in the market sentiment can be seen as automotive preferably EVs and HEVs and 5G to take a leading part.

AI’s impact will be most felt in infotainment at US$8.5bn.

Source: Electronic Specifier

Source: Semiconductor Intelligence

MARKET ANALYSIS

Market Growth by Component type Memory chips are expected to continue to maintain the largest market share through 2022. Every application market is likely to grow through 2022, led by the automotive and data processing markets. Lifting these segments will likely be the demand for chips related to AI states PwC.

AI - The Next Takeover Artificial intelligence will likely be the catalyst that will drive another decade-long growth cycle for the semiconductor sector. PwC expects the market for AI-related semiconductors to grow from a current US$6bn in revenues to more than US$30bn by 2022, a compound annual growth rate (CAGR) of almost 50%.Although AI-driven use cases are expected to find their way across every industry segment over time, their adoption will likely be determined by the size of investment in the technology, the pace of its development and the speed at which its benefits are realized. AI is going to have a significant impact on the semiconductor industry. The biggest winners from the growth in edge AI are going to be those vendors that either own or are currently building intellectual properties for AI-related Application-Specific Integrated Circuits (ASICs). Traditional processing architectures based on the Skallar approach to processing, like CPUs, are set to lose out to Tensor-based processing architecture in fulfilling the demand for edge AI processing, as they are far more efficient and scalable at performing Deep Learning (DL) tasks.

ASICs by 2023, will overtake even GPUs as the architecture supporting AI inference at the edge, both in terms of annual shipments and revenues.

McKinsey & Company writes, AI applications have already gained a wide following, including virtual assistants that manage our homes and facial-recognition programs that track criminals. These diverse solutions, as well as other emerging AI applications, share one common feature: a reliance on hardware as a core enabler of innovation, especially for logic and memory functions.

What will this development mean for semiconductor sales and revenues? And which chips will be most important to future innovations? Opportunities for semiconductor companies across the entire technology stack. Analysis revealed three important findings about value creation: • AI could allow semiconductor companies to capture 40 to 50 percent of total value from the technology stack, representing the best opportunity they’ve had in decades.

• Storage will experience the highest growth, but semiconductor companies will capture most value in compute, memory, and networking.

• To avoid mistakes that limited value capture in the past, semiconductor companies must undertake a new valuecreation strategy that focuses on enabling customized, end-to-end solutions for specific industries, or “microverticals.”

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BISINFOTECH|JANUARY 2020|VOL 2|ISSUE 01

MARKET ANALYSIS

The 5G for Semiconductor Nearly nine in 10 semiconductor executives (88%) say that 5G, the next generation of wireless technology, will revolutionize their industry by offering new ways to provide products and services. This revolutionary impact is being driven by the high demand for 5G-enabled smartphones, growth in autonomous vehicle manufacturing, and the rise in government initiatives for building smart cities. The report also cites challenges that 5G network implementations pose for the semiconductor industry, including the high costs for technology and infrastructure advancements and the concerns around privacy and security writes Accenture in a report.

5G market would help the semiconductor industry to bounce back in 2020. As per the report, the global semiconductor market will bounce back to 5.9 per cent in 2020 reaching $448 billion, up from $422.8 billion in 2019 stated IHS Markit.

As 5G is more widely deployed, the technology will usher in lucrative new service opportunities for mobile network operators (MNOs). However, 5Gs greater impact will be changing mobile into a robust and pervasive platform that fosters the emergence of new business models and transforms industries and economies around the globe. Like other monumental innovations of the past, 5G promises to redefine work processes and rewrite the rules of competitive economic advantage. IHS Markit | Technology expects the rise of 5G to have profound positive impacts on human and machine productivity, ultimately elevating the living standards of people around the world.

By 2035, 5G will enable $1.3 to $1.9 trillion worth of economic output—in the United States alone. That’s nearly the same sum that U.S. consumers spent on automobiles in 2016. 5G will enable $1.3 to $1.9 trillion worth of economic output in the United States alone by 2035. Innovations enabled by 5G, including augmented reality, mission-critical services, fixed wireless access and the massive internet of things will drive this increase in economic activity. The growth of 5G will have a direct impact on chip sales. The smartphone business is the largest consumer of semiconductors of any industry, with $87.7 billion in global revenue this year. The global smartphone business is expected to return to annual unit shipment growth in 2020. This rise will boost semiconductor market revenue driven by the smartphone industry, with chip sales to this segment increasing by 7 percent in 2020, following a 22 percent drop in 2019. The worldwide semiconductor market will also benefit from growth in other areas including the automotive segment, the IOT, data centers and industrial.

Key Changes Impacting the Semiconductor Industry Top trends forcing change the semiconductor industry has been affected by three major trends in recent years that have been difficult hurdles to overcome: • Product performance may be peaking: Moore’s law states that the number of transistors, and hence the performance, in a dense integrated circuit will double approximately every two years, and it has been true for a long time. Computers have become smaller and faster over the past few decades lending credence to the theory. However, in recent years this phenomenon has slowed. Peak performance of

semiconductors may be starting to level out.

• Low economic profit in the industry: Most players in the industry have struggled to consistently generate profit.

Competition is fierce, and when a product is a commodity it can shrink margins. In some cases, profits made over a period of some years on in-demand products tend to be lost on future products that fail to take off. • Disruption in technology value chain: Many semiconductor companies experiencing a decrease in profitability have uncovered more value from integration, software, and service than from the sale of chips. Many companies now have more software engineers than hardware engineers, but they don’t get paid for these costs by their customers. Essentially, they are offering more and getting less

MARKET ANALYSIS

IoT & IIoT Impact in Semiconductors The industrial sector is the poster child of IoT, and it is undergoing disruption with the advent of the digital age. IoT solutions often create a communication network in the industrial sector that extends far beyond the walls of the factory and out in the field to suppliers, distributors, and logistical organizations serving the enterprise.

This network helps fuse physical realities with new technologies creating interconnected digital enterprises that are capable of better informed decision making. Sensors track individual products as they make their way through a plant, onto trucks, and out into warehouses, creating a digital record along the way. The overall Industrial Internet of Things (IIoT) market is currently fragmented across sensor manufacturers, edge devices manufacturers, platform vendors, network providers, and analytics software solution providers. Semiconductor manufacturers, as outlined earlier, are dominant players and form the basic building blocks of the devices segment in the IIoT solution stack. The advent of advanced analytics and connectivity has extended the IIoT solution stack from devices to platform, gateways, and application software. By 2020, the electronics content market for manufacturing and energy is expected to reach $76 billion. Finally, services which include consulting, implementation, and operations are expected to reach $164 billion. IIoT platform standards are beginning to form based on open-source architectures. This benefit allows software developers to develop applications on top of the platform to perform a multitude of operations.8 It also allows hardware/sensor manufacturers to connect to the platform with minimal effort. Thus, semiconductor companies should forge alliances with platform providers to create devices that can easily integrate with the third-party platform.

Automotive in Semiconductors The vehicle production has increased in recent years, and more and more vehicles are increasingly incorporating vehicle electrical systems that require power diodes and voltage regulators of exceptional reliability. From the past few years, cutting-edge technologies are increasingly incorporated into the mass production of cars, including matrix LED lights, enhanced lidar sensors, and ADAS systems.

The industry has also witnessed improvements in 3D mapping applications, EV batteries, and augmented-reality technologies, such as head-up displays. Moreover, 5G networks are enabling the next generation of mobility solutions in the sector.

Semiconductors have enabled most of the recent innovations in automotive technology, including vision-based, enhanced graphics processing units (GPUs) and application processors, sensors, and DRAM and NAND flash. As cars become even more complex, demand for automotive semiconductors will continue to rise steadily and provide a major new long-term growth engine.

The age of digitization and miniaturization of electronic components will see a major impact in 2020. And new materials like GaN and SiC will rev-up in this year also new form of components packaging and design cycle will be kept in mind throughout the year.

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References: IHS Markit | Technology report of October, 2019, PwC | Global (Opportunities for the global semiconductor market, Electronic Specifier | Semiconductors back to growth in 2020, McKinsey&Company | Mobility trends: Whatâ&#x20AC;&#x2122;s ahead for automotive semiconductors, Report of April 2017 | BY Stefan Burghardt, Seunghyuk Choi, and Florian Weig, Gartner report on Industrial Sector by IIoT. Semiconductor Intelligence Report | Semiconductor back to growth in 2020

BISINFOTECH|JANUARY 2020|VOL 2|ISSUE 01

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1. New realms of measurement will grow in importance in 2020: Measurement based tools of many kinds are key enablers for the technology-based products and solutions we incorporate into our daily lives, and it will transform as disruptive technologies come into play.

• In 2020, advanced applications related to 5G, will explode, using higher frequencies and smaller geometries.

To support this growth:  N ew classes and labs for design and simulation, over the air testing, antenna systems and measurements will be incorporated into the core engineering curriculum.  New measurement science (hardware, software and calibration) will be developed and made part of mainstream offerings.  Developers of new electronic products and solutions will use different tools, specifications and terminology to specify and validate their designs.

• In 2020, the use of software in implement-

BISINFOTECH|JANUARY 2020|VOL 2|ISSUE 01

ing technology will remain prevalent, es p ec i a l l y i n net working and position or navigation-based smartphone applications. As a result, softwareon-software measurement will see a strong surge and therefore, so will emphasis on interoperability among software tool chains. New standards and certifications will be created, impacting development processes, as well as the marketing required to ensure consumers are aware of what a software-centric product can and cannot do.

• In 2020 there will be a substantial rise in specialized processors, such as GPUs and chips, that implement Artificial Intelligence or AI architectures which determine how a network processes and routes information and maintains security, privacy, and integrity. Quantum computing and engineering will continue to be in an aggressive hype phase in 2020, but the ability to control, measure, and error-correct quantum systems as the number of qubits grows will be important from the start.

• As measurement and operation of the computer blends, those interested in building practical quantum computers will require knowledge about measurement technologies and techniques before the quantum computing goes into the mainstream.

2. Data silos will be connected to extract development insights: Leading compa-

nies collect data but typically store it in functional silos: R&D design, pre-production validation, manufacturing, operations and services.

• In 2020, companies will start connecting these silos of data using modern cloud architectures, such as private on-premises clusters, or public sites like AWS or Azure. With the data centrally available, teams will correlate performance through the development process, from early design to manufacturing to field deployment and close the loop back to design.

The benefits for these teams include the rapid collection and reformatting of data, faster debugging of new product design, anticipation of manufacturing issues, and improved product quality.

• To achieve these gains, teams will invest in a computing infrastructure, determine how to store the data, including file location and data structure, as well as choose analytic tools to select and process data to identify anomalies and trends. In addition, teams will change the way they work to shift attention to data-driven decisions.

3. 5G and the Data Center: New 5G capabilities in 2020 will put pressure on networks, revealing new data center and network chokepoints.

• Industrial IoT applications will increase access requests and mobile automotive IoT applications will stretch latency demands. Edge computing will become more important to process the increased access requests and meet stringent latency requirements.

• Higher data speeds will place more demands for faster memory, faster data busses, and faster transceivers in the data center. Meeting the speed and flexibility demands will be one reason, but customer traceability through the

T&M TECH TRENDS

network for application monetization will be the main driver to upgrade to the latest standards.

• In 2020 we will see advanced design, test and monitoring capabilities that ensure networks and products deliver the performance and failsafe reliability expected. The industry will experience closer collaborations between chipset and product manufacturers, software companies, network carriers, cloud hosting companies and international standards organizations to build tomorrow’s networking infrastructures.

4. Challenges will Abound to get 5G to Maturity: 5G represents technical evolution and revolution on many fronts creating new technical challenges that span many domains.

• In 2020 the industry will move from a small group of early-movers who have commercialized initial 5G networks, to a global community in which multiple operators in every continent and in many countries will have commercial 5G networks.

• The early adopters will add scale and those who launch in 2020 will quickly resolve issues in their initial deployments.

Second-generation devices and base stations will be added to the market, and the standards will have another new release in 3GPP’s Rel-16.

• Key technical challenges for the industry in 2020 will be: ensuring performance in mid-band (3.5-5GHz) frequencies, moving mmWave to mobility, transition planning to a full Stand-Alone (SA) 5G network, and resolving architectural decomposition and standards for centralized RAN and Mobile-Edge computing (MEC).

5. The “Internet of Things” will become the “Interaction of Things”: IoT will rapidly move into the mainstream with widening commercial acceptance, increasing public-sector applications and accelerated industrial deployments • In 2020 we will see an increased level of “smart” experiences when the “Internet of Things” – a collection of devices connected to the internet – becomes the “Interaction of Things” – a collection of things that are communicating and working effectively and efficiently with each other.

• There will be powerful devices working with other powerful devices to act quickly and efficiently in the background independent of direct human intervention. Mission-critical applications, such as remote robotic surgery in the area of digital healthcare or autonomous driving in the area of smart mobility, will feel the impact of this shift.

• While these applications will benefit from the “Interaction of Things”, new solutions will be developed to ensure they do not suffer from the “Interference of Things”, especially when communication failure and network disturbances can bring about devastating or lifethreatening consequences. The same will be true of Industry 4.0 applications and smart city applications. Uptime will not be optional.

6. Digital twins will move to the mainstream: Digital twins, or the concept of complete replicate simulation, are the nirvana of design engineers.

• In 2020, we will see digital twins mature and move to the mainstream as a result of their ability to accelerate innovations. To fully realize the technology’s benefits, companies will look for advanced design and test solutions that can seamlessly validate and optimize their virtual models and real-world siblings to ensure that their behaviors are identical.

7. 2020 will not be the year of the autonomous vehicle. Active cruise control, yes. Full autonomy, we have a couple years to go: The quantity and sophistication of sensors deployed in vehicles will increase in 2020, but fully autonomous vehicles will require more ubiquitous 5G connectivity and more artificial intelligence. Here is where we see the industry on each of those areas: • The ratio of fleets sales with EV or HEV powertrain will grow from single-digit percentage ratio to double-digits in 2020 tripling the shipped units compared to last year.

• The first C-V2X network will hit the streets in China, but they will be operating on an LTE-V network until 5G Release 16 evolves the standard.

• T he technical advances for sensors and in-car networks will continue to evolve on a fast pace, needing faster

in-vehicle networks. In 2020, Gigabit Ethernet based in-car networks become a reality and significantly improved sensor technology enables artificial intelligence developers to hit new performance levels.

8. System level design, test and monitoring will experience a dramatic transformation: The connected world will force a shift in how performance, reliability, and integrity are evaluated.

• In 2020, realizing the full potential of sensor systems connected to communication systems connected to mechanical systems will require new ways to test at the system level.

• T oday, there are available tests for radar antennas and a radar transceiver module. However, testing a multi-antenna radar system integrated into a car will require a different testing approach. The same is true for data centers, mission critical IoT networks, automobiles, and a wide range of new, complex, 5G-enabled applications.

• In 2020, the electronics industry will emphasize system-level testing as the definitive, final step to assure end-to-end performance, integrity and reliability across the increasingly connected world.

9. Education will shift to prepare the next generation of engineers: Universities will adopt holistic, integrated, and multidisciplinary curricula for engineering education.

• A c a demia w ill t a p into i nd us tr y partnerships to keep up with the accelerating pace of technology and incorporate certification programs, industry-grade instrumentation and automation systems into teaching labs to train students on current, real-world applications.

• To address IoT, Universities will combine methodology from basic electronics, networking, design engineering, cybersecurity, and embedded systems, while increasing emphasis on the impact of technology on society and the environment.

• To address artificial intelligence, automation and robotics, Universities will mainstream currently niche topics such as cognitive science and mechatronics into required learning.

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ISSUE 01|VOL 2|JANUARY 2020|BISINFOTECH

An Immediate Need of the Hour: Smart Cities

JACOB A THOMAS

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Chief Technology Officer (CTO) Athenta Technologies

BISINFOTECH|JANUARY 2020|VOL 2|ISSUE 01

Smart technology is challenging, convincing and converting the human ecosystem in a million different ways. Letâ&#x20AC;&#x2122;s go back a century, technology was emerging to support us, provide aid and thus follow us. Soon an altered technology started walking along with us and not long ago technology has started ruling our lives. Smart technology today drives Smartphones, Smart TVs, Smart Cars, Smart Grids, Smart Homes and now Smart Infrastructure as well.

A smart city is the development of a region or a city using information and communication technologies to enhance the performance and quality of urban services such as energy, connectivity, transportation, utilities, and others.

A smart city is developed when 'smart' technologies are installed to change the nature and economics of the

EXPERT'S COLUMN

surrounding infrastructure. The cloud-based applications collect and manage data in real-time to help the enterprises and residents make better decisions that improve the quality of life.

Building a smart city requires massive investments; it is, however, one of the best possible changes that can be brought into one’s lifestyle. The smart cities are designed for optimum usage of space and resources along with the optimal distribution of benefits. Schools, roads, hospitals, and other public properties improve significantly. Smart city technologies tackle severances of the system saving both money and time. An advancing technology helps one realize and acknowledge their needs to develop their lifestyles and adapt to everyday demands.

Since there existed a scope wherein technology could be incorporated in our daily lives beyond smart tools, today technology is being injected into our lives directly with the growth of smart cities across the globe. The existence of smart cities has improved the quality of life, a level or two higher than what it was earlier. The first idea of a smart city that pops up is a city with smart infrastructure, but a smart city is indeed smarter with the constant influence of IoT (Internet of Things) and AI (Artificial Intelligence).

Cities in 2019 can be compared to living entities they grow while becoming more complex over time. While the cities are growing in terms of intelligence, in terms of technology yet the most pressing issue the need for utility improvements and monitoring of crimes fail to be the same. An alarming rate of criminal offences adds on to the urgency to build up a smart city.

With safety and security one of the key worries, building up a ‘safe city’ is the need of the hour, security cameras would not only keep criminals at bay but would work efficiently in managing traffic, tracking the pedestrian flow while informing planning decisions.

An intelligent layer of technological backbone would not only promise security and safety but assure electricity supply, adequate water supply, solid waste management, sanitation and citizens’ participation for good governance forms the base of a smart city. Smart cities are preoccupied with the ability to integrate multiple types of data originating from heterogeneous sources along with voice, video, data, and sensors communication interfaces.

Taking examples from the existing smart cities, it is quite evident that smart cities pose as potential job creators. Newage profiles witness higher growth mostly ICT, e-Governance and Data & Analytics sectors. Whether data is being used for the prevention of crimes, intelligence gathering, public health, surveys or investigations; surveillance will hold a lot of importance for citizens.

Smart cities comprise of IIMS (Integrated Infrastructure Management System) which further includes communication network across the city, optimization of workforces, converged logical & physical inventory, power sources management, citizen sources management as well as Fire management.

A proactive awareness and adoption of security solutions have to be achieved for a successful set up of smart cities. Highly advanced security solutions are advanced in terms of overall infrastructure, sustainable real estate, communications, and market viability.

Smart cities are planned to be environment-friendly, there exists a presence of smart devices which can track the purity of air, along with other health-related and environmental factors. A smart city shall therefore only reach a good position if it proves itself against the social and psychological needs of the population.

The Indian economy has witnessed remarkable growth in areas of surveillance. With the emergence of opportunities multiple challenges come along, effective use of data and technology providing the only way forward. Smart cities aim to improve infrastructure while reducing costs, in order to foster innovation to enhance the quality of life.

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ISSUE 01|VOL 2|JANUARY 2020|BISINFOTECH

Solar Energy & EV Charging Infrastructure

W

RANAJAY MALLIK SRA-SAIL STMicroelectronics

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BISINFOTECH|JANUARY 2020|VOL 2|ISSUE 01

ith the push to move to electric mobility at a national scale, and with the government being very enthusiastic about deployment of electric vehicles, the electronic industry can expect to see a lot of activity around indigenous development and manufacturing. While electric vehicles are being worked upon by major OEMs, an ecosystem for development of chargers, charging stations and software & cloud services is steadily being built. Established companies as well as various start-ups, have started working on these areas and results are starting to show. However, there is still a lot of opportunity to make even better, the electronics side of it. The government, with the help of BIS, ARAI, EESL and other bodies, has already released technical specifications on charging stations and some of the original specifications like the AC-001 and the DC-001 have already been developed and charging stations have been deployed at select locations. The newer guidelines require the charging stations to be equipped with multi standard chargers, viz. AC Type 2, the CCS and the CHADEMO, in addition to the lower power AC and DC-001. However, these systems are reliant entirely on the grid, are subject to real estate availability at prime urban and semi-urban locations, and the question of the grid being ready and equipped for these added loads, still remains. This is where, solar energy and storage comes into picture to not only supplement the grid but to also work standalone at feasible locations across the country. Fortunately, India has seen successful solar deployment and the abundance of solar energy due to its geographic

EV FEATURE

visible to the end user. Information exchange and the user interaction is taken care of, here. It would typically consist of a TFT screen with touch sensing, NFC card readers for authentication or payments, and maybe also a Bluetooth interface for more advanced features. The vehicle is physically connected to any of the output ports: AC slow charge for smaller vehicles and e rickshaws, AC fast charging for some classes of vehicles and of course, DC fast charging. The user has to authenticate himself, set his charge preferences and he needs to wait till the charge session is over. However, the more complex functions go on behind the scene, which are controlled and monitored by the central controller in conjunction with many different other modules.

location. The one-time installation and capital expense, works well for at least 20-25 years, with the return on investment, taken care of in a few years. The energy input henceforth, becomes virtually free. The subsequent sections will illustrate a feasible implementation that may be adopted to harness solar energy, store it and use it for EV charging. It will touch upon energy harnessing & storage schemes, distributed battery management, power conversion and connectivity, which are the basic building blocks for a modular, scalable, solar powered EV charging station. A typical solar EV charging station implementation is depicted through the diagram below. The major building blocks are self-explanatory.

Figure 1: Solar EV charging station functional blocks

There is the user side, which basically depicts the functionalities

Power flow and energy management: The system has 3 sources of power. First and foremost, are the solar panels.

The sizing estimation is beyond the scope of this article, but, it is typically a few kilowatts at the minimum. A panel would typically produce at rated irradiance, about 150W/square meter. The solar panels feed the MPPT module. This is a DC-DC converter with a maximum power point tracking algorithm running inside it. These are typically very high efficiency units, running at excesses of 98% electrical efficiency. These are typically multiphase interleaved buck or buck-boost converters, and operating levels are at a few hundred volts at both the input and output side. Isolation may or may not be a requirement, but most implementations are galvanically isolated for regulatory and safety reasons. The output feeds a common DC bus, from which downstream energy may be provided to the load. The implementation may be analog, fully digital or a mix of analog and digital control.

The second source is the grid. This may be optional, as the intent is to maximize the usage of solar. However, in areas where intermittent grid is available, or where the solar insolation is not entirely sufficient for operation year-long, or during certain seasons, grid helps in fulfilling the demand. Since the system is essentially a solar energy storage setup, it is also possible to use this station to supplement the grid, during peak hours or as a solar farm, using bidirectional grid tied inverters. With proper policies in place for exporting to the grid from solar farms or from captive plants with nett metering, this serves a dual purpose too.

The third source and the sink/storage, is the battery. The trend these days is to use Li Ion batteries which have very high cycle life, lends itself well to quick charging, very high depth of discharge and very high volumetric efficiency. It is possible to house these batteries underground, to save real estate. These Li Ion battery packs are arranged in a suitable series parallel combination, and in several strings. The batteries terminate themselves into a junction box and termination unit, which also functions as a supervisor. Each battery has a data port, typically CAN or RS485, and these are daisy chained and fed to this termination unit, which then has a top level view of the health and status of every individual battery, string or the entire battery bank. This is essentially a data concentrator and a switching unit, putting battery packs IN or OUT of circuit.

In addition, this communicates with the central controller to decide the charge and discharge of the batteries.

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EV FEATURE

The following diagram makes the power system architecture quite clear. This is a modular system, to allow for suitable expansion, and modules are typically expandable and 3-5kW each with a communication bus, typically CAN or MODBUS/RS485. The central controller is able to configure the modules as per the functional requirement at any point of time: be it charge management, be it load management or be it diagnostic checks. There is a provision within the controller to also monitor the energy usage, basically kWh consumed, kWh stored and kWh generated/exported. It can also communicate with industry standard energy meters for billing and tariff setting purposes.

The master central controller is the brain of the station. It performs functions starting from identifying and engaging the user/subscriber till ensuring the vehicle is charged in an optimal manner. It is a powerful combination of high performance computing, connectivity and sensing. The major functionalities are as 1) U ser ID and payment: This is the most visible functionality as far as the user is concerned. This is done through a smart card, an OTP, NFC enabled phones or even Bluetooth.

All these sub systems are controlled by the MPU/MCU on board.

2) P ower management: This is the most critical yet invisible part of the station. The system controller continually monitors the power scenario: supply and demand. Then it decides how to fulfill the demand, from the supply. Whether solar alone is able to supply the load, or is a combination of solar and storage is needed or it needs partial input from the grid as well. There may be scenarios, where there could be excess availability or excess demand. It is intelligent enough to route power correspondingly, by altering the settings of the various power blocks described above.

Figure 2: The power system architecture at the back end

The major power management blocks: The DC DC converter block is fed from the DC bus. Depending on the type of vehicle connected, and the demand raised by the vehicle BMS for the required voltage and current, the central controller configures the DC DC converter over the communication bus. This option is typically for DC fast charging, and multiple DC DC converter modules would work in tandem to fulfill the load. The DC AC inverter, is also fed from the DC bus, but this caters to vehicles which can only accept AC to charge or for general slow charging applications. The bi-directional inverter serves two purposes: It either feeds the DC bus to fulfill the demand or, it exports power back to the grid, when the charging station is lying idle or is needed to supplement the grid during peak hours. The key figures of merit for any power conversion block these days are: 1. V ery high efficiency: >95% end to end, are now realistic figures 2. V ery high power densities: Smaller and even smaller systems, as real estate is a significant deployment cost

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Both of the above points are met with, using advancements in silicon. Wide band gap semiconductors, especially silicon carbide devices, are able to work at very high switching frequencies, at much higher junction temperatures and with higher efficiencies. In addition to this, there is an automatic reduction in the size of the passive components like magnetics and capacitors. Better magnetics materials also lend to smaller and low loss designs handling much higher powers.

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3) Connectivity: These days, stations and deployments need to be connected to the cloud for remote monitoring and control. It has to talk to the CMS (Central Management System) periodically, to report transactions, parametric, diagnostics and operational data. It also needs to take operational commands and settings from the CMS. So a multitude of connectivity options, both wired and wireless is provided. 3G/4G, Wi-Fi, Ethernet and even LoRa has been used for remote monitoring.

4) P rotections, diagnostics and fault reporting: The system, in order to prevent malfunction, has very fast acting protection mechanisms that may be triggered by external events like surges or lightning strikes, or due to operational issues, accidental or deliberate misuse/ abuse or from short circuits, over temperature or over voltage/over current conditions. To keep operational costs low and to have minimal downtime, systems are able to self-report issues that may arise from time to time.

Modular build allows pin pointing which faulty section needs to be replaced at the field, so the technician can arrive well prepared.

A brief explanation of how a solar EV charging system may be deployed, has been given above. Feasible working solutions and various sub-modules may be experienced at the STMicroelectronics India Development center in Noida, and it is possible to customize designs as per the needs of the OEM. E Mobility and EV charging infrastructure is one of the key focus areas and relentless research is being done to address high performances in all the functional blocks described above. End to end silicon for realizing realistic EV Charging stations, is available, along with many reference designs, to keep the time to market small.

SECURITY UPDATES

FarEye Ranks Again on Deloitte Technology Fast 50 India 2019 FarEye, has been recognized among ‘Deloitte Technology Fast 50 India 2019’ and has been ranked amongst the top 25 companies based on their percentage revenue growth over the past three financial years.

During this period, FarEye’s turnover grew by 242.5 percent.

The Deloitte Technology Fast 50 India program, which was launched in 2005, is conducted by Deloitte Touche Tohmatsu India LLP (DTTILLP), and is part of a truly integrated Asia Pacific program recognizing India's fastest-growing and most dynamic technology businesses (public and private) and includes all areas of technology - from internet to biotechnology, from medical and scientific to computers/hardware.

FarEye has been featured on the list for the fourth consecutive year starting from 2016 until this year. Founded in 2013 by Kushal Nahata, Gautam Kumar and

KUSHAL NAHATA CEO & Co-founder, FarEye Gaurav Srivastava, FarEye is a machine learning-based predictive logistics platform for businesses to execute, track, collaborate, predict and optimize the movement of goods. It has empowered global leaders like DHL, Walmart, Amway, and many others, achieve growth, happier customers and higher margins.

Commenting on the same, Kushal Nahata, CEO & Co-founder, FarEye said, “Since 2013, FarEye has matured

into a well-acknowledged player facilitating over 10 million transactions per day across 20+ countries for more than 150 customers. After becoming marketing leads in APAC & Europe, we have recently announced our plans to explore the US supply chain and logistics market. Amidst this exciting phase, the honor and continually improving ranking in Deloitte Technology Fast 50 list is very motivating.”

Barracuda Launches Cloud L&T-Chiyoda Deploys Trend Security Guardian integration Micro’s Security Solutions Barracuda Networks has announced a Barracuda Cloud Security Guardian integration with Amazon Detective, a security service from Amazon Web Services (AWS) that is designed to easily analyze, investigate, and quickly identify the root cause of security findings or suspicious activities.

Barracuda Cloud Security Guardian is an agentless Softwareas-a-Service (SaaS) solution designed to provide visibility into the security posture of cloud workloads, facilitate compliance, and automate remediation of security incidents.

Amazon Detective is designed to automatically collect log data from customers’ AWS resources and uses machine learning, statistical analysis, and graph theory to help users visualize and conduct faster and more efficient security investigations.

With the Amazon Detective integration, Barracuda customers can get further insight into threats or violations that are exposed by Cloud Security Guardian. For example, if Cloud Security Guardian detects a policy violation in a specific region, the customer can drill down into Amazon Detective and investigate: Was there a breach due to the violation? If so, what was the extent of the breach?

Was there lateral impact due to the violation? If so, what account or Amazon Elastic Compute Cloud (Amazon EC2) instances were infected?

Trend Micro Incorporated has offered advanced security solutions to L&T-Chiyoda Limited for its endpoints, providing them state-of-the-art protection and business resilience.

Trend Micro Apex One which was successfully implemented on the endpoints provides maximum protection through automated detection and response. Trend Micro ScanMail Suite for IBM Domino, an on-premises secure email gateway gives top-of-the-range protection against targeted email attacks and spear phishing. For L&T-Chiyoda Limited, Connected Threat Defense was the key to holistic and complete security.

This was made possible with Trend Micro’s solutions that were integrated with third-party perimeter firewall using API, providing comprehensive security. And with Trend Micro Apex Central, it is extremely simple and effective to monitor and act upon the security findings within the organization in a timely manner.

On why they implemented Trend Micro’s solutions, Bihag Acharya, Deputy General Manager, L&T-Chiyoda Limited said “The rapid change in our business model mandated use of a modern and futuristic security solution. We were looking for a solution that could provide multiple layers of security and protection by use of multiple techniques like intrusion prevention, file/URL reputation, machine learning, behavioural analysis, application control, vulnerability management, zero-day threats and ransomware protection along with remediation without manual intervention.

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EV FEATURE

IMPORTANCE OF BATTERY MANAGEMENT SYSTEM (BMS) IN EVS ADITYA RAJ VERMA

Co-founder and Chief Technology Officer EVI Technologies The Royal Swedish Academy of Sciences awarded Nobel Prize in Chemistry, 2019 to John B. Goodenough, M. Stanley Whittingham and Akira Yoshino for development of lithium ion batteries, a battery born in late 90’s. At that moment everyone was clueless about the power, lithium was bringing in its gauntlet. The revolution was tremendous and today from ipod shuffle to electric trucks everything carries lithium in its pocket. Recent customers of lithium are the electric vehicles, a transportation running on the same principle as of a battery toy car. 312, while Delhi’s AQI still says severe, similar are the number of EV’s running on its road as compared to 3 million vehicles registered. While the technology of electric vehicle is as old as lithium battery, still the mere number raises question on its innovation and evolution.

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Why EV manufacturer chose lithium battery over other battery technology?

The beauty embodied in lithium battery packs is the energy they can carry in the required volume. High energy density of lithium batteries make it perfect for electric vehicle, lighter and efficient. Charging is always a concern for any EV owner and with faster charging rate of lithium packs outshines other technologies. Lithium charges at faster rate and reduces the

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refuelling time of the vehicle.

Moving on to the construction of lithium cell -the chemical structure, solid electrolyte and stable encapsulation make it suitable for application prone to mechanical vibrations and impacts. The lithium cells are found performing at same efficiency in both stationary and mobile applications. As the saying “every technology stays ideal only in text books”, lithium brings a good amount of constraints and restrictions in its usage.

Why lithium battery needs a manager?

Any organization or team outperforms when it has a best manager. Lithium batteries with birth deficiencies need proper monitoring and control to utilize its full potential. Thermal instability has always remained a greatest hurdle in its design and application. The efficiency falls considerably at higher operating temperature. VRLA (Valve regulated Lead Acid) batteries still prove a good choice for low end EV’s because of robust nature, thermal stability and natural cell balancing.

Though lithium brings higher energy density, faster charging rate, low self discharge and longer life cycle but these features only shine when the manager is around. Over charging is another prime concern with lithium batteries usage therefore

EV FEATURE

charging need to be closely & accurately monitored.

Lithium battery packs comprises of multiple cells connected in series and parallel configuration, hence cell balancing is the important aspect for efficient power delivery. Imbalance cell causes internal loading of battery reducing state of charge and increasing failure rate. Cell balancing mechanism is required for proper battery pack operation and higher cell life. Battery management system or BMS plays the role of a manager for lithium batteries maintaining and enhancing its performance with protection against hostile conditions to prevent irreversible failure.

What is battery management system (BMS)?

As the name is self explanatory, a system designed to manage and control a battery unit for proper operation. Initial designs only incorporated protection components i.e. fuses, FET switches with analog comparators sensing deviation and pulling the completely battery unit down in case of abruptions. With due of course of time, lithium batteries found application in electronic devices, storage system, power backup system and need of more sophisticated BMS arouse rapidly. A modern BMS comprises of multiple blocks integrated together to build a complete lithium battery unit: 1. Power Delivery Unit (PDU), comprises of FET switch and gate driver circuit which control the outgoing and incoming power in the battery. Cell balancing with individual current bypass FETs are also part of the PDU. Few specific PDU also manages regenerative braking power 2. Sensing and measurement, comprises of on chip or external ADCs to compute cell voltages, junction temperature and charge/discharge current. SAR based ADC provide high sampling rate and resolution. Modern BMS chip have SARADC based AFE integrated in it.

3. Communication block, comprise of CAN transceiver, RS232 transceiver for communicating with parallel battery packs or with the vehicle control unit 4. Central processor manages the above blocks with embedded algorithm taking decision as per inputs and battery state. It also manages external and internal communications of BMS. “To make a best lithium battery pack just manage its voltage, current & temperature and this is what a BMS does” Why BMS is important for an EV? “EV uses lithium battery pack and BMS is ought to become the integral part of EV” 600+ words you have read, before the article steps into the importance of BMS in EVs, as stated in the title. Well similar are the number of feature and functions BMS brings to EV power train. The anatomy of an electric vehicle state battery as a fuel and better is fuel to energy conversion, smoother will be the ride.

Loading is critical aspect of battery technology and managing the power delivery becomes the prime task of the BMS. Constant load as in case of electronic devices, power requirement is rather uniform and never stresses the BMS and the battery.

Electric vehicle are non uniform load or to be precise an erratic loading system, where battery needs control over the power delivery. BMS acts as power controlling unit preventing

sudden abruption in load current to affect lithium cells. Further, the loading transients range in milliseconds and require an effective management to avoid high discharge rate.

Electric vehicle is a subset of the vehicle therefore needs a fuel gauge. Coulomb counting, a part of BMS precisely measure the state of charge and compute the drive range.

This mitigates the range anxiety of any EV owner. Further, refuelling or recharging battery bank from any charging station requires BMS integrated battery unit for information exchange with the charger. It is because of BMS, you can refuel your vehicle with same rate and efficiency at any public charging station.

Diving deep into the EV architecture, various small auxiliary loads as headlamps, dashboard, and cooling unit also draws power from main battery bank. Motor controller can communicate with BMS and efficiently manage the power demand. Auxiliary loads are not intelligent to communicate with BMS therefore it independently manages these loads without reducing efficiency on the power train.

Existing BMS design primarily focused on managing lithium cells and has outperformed on every benchmarks. Still, achieving best efficiencies in transportation remain a dream requiring a more advance and upgraded BMS. Briefly stating in bullets the characteristics of EV BMS: • EV BMS should have a variable power control and delivery system rather than digital switch based PDU shutting system down at low SOC • EV BMS should be able to communicate with motor controller and override motor controller decisions in cases of abruptions and failure • EV BMS should have a TMS (Temperature Management System) for battery bank rather than having only temperature probes. Low power cooling unit can be the part of TMS • EV BMS should have PDU designed to support regenerative braking • EV BMS should have higher processing and faster ADCs for better response to transient load • EV BMS should have auxiliary load management component to power EV auxiliaries • EV BMS should also have telematics module for enabling battery swapping technologies • EV BMS should support all global charging standards CCS, Chademo and GB/T. How will be an EV BMS? As the electric vehicles are evolving so is the battery technology.

Future BMS will be smarter and faster, with on chip analytics to compute accurate drive range and adapt to load changes with no comprise on power delivery. The BMS will support any kind of charging protocols with no firmware or hardware reconfiguration. The BMS will support infinite battery stacking and any cell configuration. The EV BMS will enable vehicle to grid capability, authorize charging transactions, book charging slots and standardize BMS design for an electric vehicle.

Wrapping up with a remark from Elon Musk, “A product is broken if it requires a manual”, where battery management system (BMS) can eliminate the need of a manual to operate a battery bank.

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INDUSTRY KART

RS Components Introduces New Series of Converters

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RS Components (RS) has added a range of enclosed switchmode power supplies (SMPS) from Recom that feature an integrated mains filter ideal for powering single-board computers such as the Arduino, BBC Micro:bit or Raspberry Pi, including its touchscreen.

Offering a wide selection of DC/DC converters and AC/DC power supplies compliant with international safety standards, Recom is a leading European power supply maker that has many decades of expertise in developing leading-edge converter technologies covering the 0.25W to 960W power range.

Aimed squarely at electronics designers, the new RAC05-K/ C14 series of isolated AC/DC converters offers a selection of five devices with 3.3V, 5V, 12V, 15V and 24V DC output voltages, respectively, enabling use in an extensive selection of industrial applications.

Providing an 85 to 264V AC universal input voltage and energy efficiencies up to 86%, the DC output terminals offer safe extra-low voltage (SELV) capability meaning they can be touched in safety. The units also deliver protection against short circuits and overload and overvoltage.

The series’ patented design means a complete 5W supply can fit into the standard C14 mains filter housing and at lower cost

than many power supplies or mains filters alone. In addition, the supply comes with the standard IEC ‘kettle connector’ input mounting hole, which means that installation time is only a few seconds.

The metal case also provides secure fixing and delivers high thermal dissipation capability, which allows a wide operating temperature range, from –40 to +60°C, without derating.

The series is CE marked and EN/IEC/UL certified and is shipping now from RS in the EMEA and Asia Pacific regions.

Digi-Key Named a Top Ten Distributor by HC360

Arrow, Geniatech and ON Semi's Multi-Sensor IoT

Digi-Key Electronics was honored as a Top Ten Distributor by HC360 at the 2019 China Internet of Things Industry Conference & Awards Ceremony.

The awards were jointly organized by HuiCong Electronics and HuiCong IOT websites. The winners were selected by users of hc360. com, a panel of expert judges and market research.

“Digi-Key Electronics is thrilled to receive this award for the second time in a row,” said Tony Ng, vice president, global sales for Digi-Key Electronics. “We are fully committed to the China market. On top of the nonstop increasing product selections, we continue to invest in local customer services and product delivery. Supporting local engineering demand and innovation are critical to our continued success in the country.” “We are pleased to include Digi-Key in this group of top distributors,” said Suyu Yu, HuiCong Electronics Assistant General Manager. “They are in fine company among other top distributors in our region, and we look forward to great things to come from them.”

Arrow Electronics has collaborated with ON Semiconductor and original design manufacturer Geniatech to develop MuSeOn 1.1, an industrial, proof-of-concept workplace safety solution. MuSeOn 1.1 is a Multi-Sensor-Online wearable device based on ON Semiconductor`s RSL10 Sensor Development Kit. The platform features RSL10, the industry’s lowest power Bluetooth 5 radio SoC, and comprises five industrial-grade sensors that can measure, detect and identify varying environmental conditions. It is integrated with local wireless and cloud services that enable companies to monitor working environments in real-time to maintain and improve safety levels for employees.

In addition to being extremely energy efficient, RSL10 from ON Semiconductor incorporates an on-board processing core, several peripherals, integrated power management and large internal memory. MuSeOn 1.1 features sensors for air quality, humidity, pressure and temperature, allowing for recognition of the wearer’s activity, together with indoor navigation and positioning. There is an ambient light sensor with wide operating range and an omnidirectional, stereo digital microphone. MuSeOn 1.1 has a dual RFID interface and is housed in an IP65-rated case. Arrow, Geniatech and ON Semiconductor designed the multi-sense device and its firmware. Arrow also supplies the industrial gateways based on the Geniatech IoT Developer Board 4 and is instrumental in the integration with leading cloud platforms.

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INDUSTRY KART

element14 Invests in a Range of TE Connectivity element14 has invested in an even broader range of TE Connectivity products to help design engineers find the best-fit component for their projects. element14 has made significant investment in the range of TE Connectivity products available for customers across its global distribution network during the current calendar year. Customers in APAC can now access over 100,000 TE Connectivity products with almost 10,000 in stock for fast delivery.

TE Connectivity is the world’s largest connector supplier and a significant manufacturer of relays, passives, cable and wire, as well as sensors and antennas. To help retain a competitive edge in today’s advanced automotive, industrial, aerospace, defence, marine and data applications, customers seek connector and sensors solutions that are engineered to reliably transmit data, power and signals, even in the harshest

environments.

TE Connectivity is at the cutting edge of innovation in emerging technical trends in industrial, consumer devices, ITE, rail and transportation and their rugged and reliable products can handle the heaviest responsibilities and optimise a system’s performance, building-in reliability right from the start. element14 provides access to over

950,000 products across a broad range of suppliers. Customers seeking to purchase TE Connectivity products can now streamline their buying processes and reduce cost of purchase by coming to element14 for all their needs.

Simon Meadmore, Global Head of IP&E, element14 said, “In significantly extending our portfolio for TE Connectivity products we are improving support for a wide spectrum of our customer base. We are dedicated to providing our customers the means to be ready for tomorrow and helping them to participate in emerging industry trends such as electric vehicles, 5G, Industry 4.0 and robotics.” element14 offers local language service, multi-channel sales approach and supply chain proposition, making it easier to find the right product for any design and ensuring faster delivery and better after-sales support.

Farnell ‘High Service Distributor of the year for 2019’

New Yorker Electronics Releases N-Channel MOSFET

Farnell was named High Service Distributor of the year for 2019 by Panasonic at the Panasonic Distribution Conference in Munich, on 21 November 2019.

The award, for Farnell’s business in EMEA, recognises Farnell’s continued investment in the Panasonic range and business performance in the year.

Farnell doubled its level of inventory of Panasonic products in the last 18 months, including key New Product Introductions such as Panasonic’s range of Anti-vibration capacitors. This increased inventory, coupled with Farnell’s service proposition in Europe, including local sales teams, next day delivery and 24/5 technical support enabled Farnell to deliver for more Panasonic customers than any other distributor during the period. The extension of Farnell’s Panasonic range follows significant investment in the business since acquisition by Avnet in 2016. Farnell now has the widest range of Panasonic parts of any High Service Distributor. Farnell has also invested $60m in a new distribution centre in Leeds, United Kingdom, which will be fully operational from early 2020. The new distribution centre will enable full Date & Lot code for Panasonic products and double Farnell’s capacity to ship products to customers on a daily basis. Chris Breslin, President of Farnell, Global said “Farnell and Panasonic have built a strong relationship over many years, based on delivering value for Farnell customers and Panasonic.

New Yorker Electronics is now distributing a Vishay N-Channel MOSFET that provides the lowest maximum RDS(on) rating at VGS = 10V and increases power density as the RDS(on) cuts conduction power loss.

The Vishay Siliconix SiRA20DP TrenchFET Gen IV N-Channel MOSFET provides the lowest gate charge (Qg) for devices with maximum RDS(on) <0.6mΩ, thus enabling high efficiency for DC/DC conversion. The Vishay SiRA20DP N-Channel 25V device also features a gate-drain charge/gate-source charge ratio that reduces switching related power loss. The Vishay Siliconix SiRA20DP N-Channel 25V MOSFET reaches the lowest RDS(ON) in its class by reducing any switching-related power loss. This is achieved by optimizing the total gate charge (Qg), gate-drain charge (Qgd) and Qgd/gate-source charge (Qgs) ratio. The very low Qgd Miller Effect charge enables passing through plateau voltage faster.

The SiRA20DP is a 100% Rg and UIS tested TrenchFET Gen IV MOSFET. Typical applications include synchronous rectification, high power density DC/DC, synchronous buck converter, OR-ing, load switching and battery management.

The Vishay MOSFET is housed in the conventional PowerPAK SO-8 design, delivering higher power density with no change to its package dimension or its pin configuration. A 10mil clip reduces any package-contributed resistance by 66-percent, maximizing the performance of the silicon.

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BIG PICTURE

With the boost in IOT adoption, skilling becomes very crucial for the industry

NEETI SHARMA

Senior Vice President TeamLease Services

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A massive change is underway in the automotive sector, which has begun to adopt the Internet of Things (IoT) at several levels. The most powerful syndrome amidst this change is the “Data Syndrome”, irrespective of who adopts it – OEMs, dealers, or ancillary companies. Harnessing the power of data and embracing the market challenges and opportunities will be possible by understanding and using data for business growth.

Adoption of IoT at production level has helped boost productivity and save costs.

Moreover, it is automating core processes thereby improving quality and allowing auto makers to stay competitive. This does not mean lesser human involvements though. Truth is, human involvement is, and always will be, integral, since AI does not possess the power to think spontaneously and tentatively like a human mind, yet. At the workplace too, IoT helps auto makers track processes, train employees with augmented reality or virtual reality and deploy robots on their shop floors. The fact is that manual work and tracking often leads to human error, preferences, lapse in processes, deferments, all of which are negatively impacting productivity and ROI. Needless to say, if operations and processes are getting automated,

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SUDEEP SEN

Head of Industrial, Manufacturing and Engineering Verticals TeamLease Services employment will get impacted. With the continuous evolution in the field of IoT where more devices are going online every day, the need for human interference is reducing in various departments. At the same time, breakthroughs are creating more positions of employment all around the world. Companies are opening up new and unique designations related to IoT management all over the world, fulfilling the need for trained IoT professionals to run the machinery. There will be 30% increase in profiles like Technical Lead / Technical Manager for the product engineering services for automotive domain. Additional emphasis will also be on design and development of automotive control units and automotive networking and diagnostics solutions. Data analyst will be required for the technical units and the demand for real-time monitoring and entertainment is also likely to increase by 30%. Semi-tech profiles capable of working in shifts to provide technical support for international clients will need a combination of tech aptitude as well as ability to offer technical assistance.

In the domestic market, additional focus will be on regional language support.

These profiles will be in good demand and will grow in an incremental range of 18 to 20%.

In short, humankind and its skill set are

evolving with the advancement in technology. Greater automation replaces the need for the workforce in lower tiers and opens up avenues for smarter brains on top of the hierarchy. Businesses will undoubtedly benefit from the continuous evolution of IoT since their processes became lag-free; everything becomes transparent and more centralized for better control and efficiency. By 2022, trends such as digital twin, fog and edge computing, AR, VR and MR, 5G and IoT are projected to play a crucial role in making India a front-runner in IoT adoption. The overall market opportunity for fog computing is pegged to rise to 18.2 billion USD; VR, AR and MR technologies are projected to reach 147.4 billion USD by 2022. The number internet connected “things” by 2020 is pegged at 50 billion.

The focus is shifting towards building a skilled workforce that can leverage the relevant technology and business processes. There needs to be more tri-party efforts to understand the gap in terms of demand and supply when it comes to skilling students. There is an immediate requirement for tech labs and schools to upgrade in such a way that gaps post completion of the educational courses are not wide and employers can readily hire without worrying about cost of training.

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YOU BELIEVE IN TOMORROW? WE CONVERGED IT TODAY! JOIN THE SPECTACLE OF RELEVANCE Reach Us : advt@bisinfotech.com T : +91- 8802315661

ARE YOU SKILLED TO BUILD 5G NETWORKS The desire for speed is what has driven humans to reach for higher potentials and if you are looking at the enabling device that’ll fulfil these expectations, than its undoubtedly the one that you would be holding in your hand or close to your heart in your shirt pocket - The “Mobile phone” and the technology that would enable your humble mobile phone to be armed with the invincibility of downloading huge chunks of data at blazing speeds in real-time environment will be 5G. 5G would also be a key enabler to the successful implementation of smart cities, it would provide a ready mix of speed, capacity, efficiency & throughput, which would make it a game changer of sorts on the smart city enabling technology ecosystem. It would also act as the primary tech disruptor in many other allied business delivery areas.

But is the Industry ready to deliver

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Here’s the problem in a nutshell. The industry currently has a workforce, that has the skills for the wrong century, the industry skillsets required to get ready for the 5G onslaught needs professionals who can understand and build the ICT and telecom infrastructure for the 21st-century. But the way most people perform these jobs today is still stuck to that in the previous decade.

Further what’s even more surprising is the fact that, on-the-job training isn’t enough to close this gap. The recent World Economic Forum report found that 63% of workers in the US said they’ve participated in job-related training in the past 12 months, yet employers are reporting the highest talent shortages since 2007.

Things in India are even more alarming, considering the work culture that gives even lesser importance to the adherence

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NINAD DESAI District Chair, BICSI India

to following the industry standard best practices.

What can individuals do to change the tide

For embracing the required skills that you do need to acquire, consider step changes. In telecom project management, we are trained to break down large problems into smaller chunks that can be more easily solved, one at a time. You’re not going to turn yourself into an ICT infrastructure expert overnight. But you can acquire basic skills leading in the direction you want to go.

A skilled Fiber Optic splicer would have all the necessary skills to perform a splice, however, he now would need to know the updated requirements to make a splice that’s changed in its type (single fiber to ribbon) has much better quality (low loss and reflectance with dual testing) along with the knowledge on latest preparation tools and equipment’s that are now available to make his job easier and better.

So, look at credentials in telecom infrastructure design, outside plant, data centers, telecom project management & optical fiber installation to help you be at the leading edge of the 5G learning curve.

In Summary, there’s no doubt that 5G would deliver economic value to its consumers, telco’s, industry constituent’s and end consumers, however giving just supply-side solutions like 5G, may not be enough. Going ahead and building a quality world class ICT infrastructure would be the right way to address the challenge, as well as reap the benefits of 5G for the betterment of the country’s growth and economy & this requires an all-round effort from all the constituents of the ICT & telecom industry.

TECH COLUMN

Key areas to Consider while Choosing Technology Partner

PURVA SHAH

Marketing Professional | VOLANSYS In today’s hypercompetitive marketplace, technology partnerships have acquired greater strategic importance and complexity.

Partnerships have always been considered as a perilous strategy while selling new products/services, touching new customer segment and entering into an unfamiliar market. As per the recent report by a private firm, “53% technology companies are in the planning phase for both defining their own digital strategy and building out a partner ecosystem.” They have proven to be tarnished to be worked out in a short time frame.

Both B2B and B2C companies are in an invisible race of capturing new source of monetization, developing innovative user experiences, and expanding distribution. The growth of an organization does not only depend on what company can do, but also on the capabilities, functions, channels, and insights they can knock off by partnering with others.

When strategic technology partners function together at high capacity, it creates multiple revenue streams for both the companies, and opens the wide scope to sell to a larger market. The more enterprises a company is partnered with, the more gain of market-access it gets. Hence, the company is more likely to increase both sales and revenues.

Benefits of technology partnerships

Industry

Identify industry into which product/solution falls before introducing it in the highly competitive environment. This is the kind of industry you are trying to disrupt, and you hope your technology partner understands, - such as • Automotive • Retail/ecommerce • Healthcare • Security & Surveillance • Education (EdTech) • Finance (FinTech) Teams that already have industry-specific development experience are more likely to be acquainted with concepts and common technologies to make well-versed decisions as strategic consultants.

Technology

How to choose an appropriate technology partner?

Proper emphasise on the competitive edge can be a differential factor for determining success or failure. Project and requirement analysis can help filter the companies and makes it easier to choose the one to be partnered with. Below are some of the areas where the project analysis could be resourceful: • Product highlight and unique value proposition • Technology and resource requirements • Final product offering comparing with current market status • Targeted industry and current technology trends Applying the analysis of above points can address the three major areas: Industry, Technology, and Process.

Fig1: Key areas to consider while choosing technology partner

If any technology or tech stack is identified as a competitive edge priority, then this segment deserves serious attention!

Technology covers a vast range of features and within each of those, more decisions are required to properly execute the project.

• The type of domain you are targeting – embedded systems, SoC manufacturing, mobile app, web platform, cloud computing, data science, or IoT? The list is enormous!

• Which tools/languages are required? What sort of database?

Which framework? What hardware platform is suitable?

Which cloud platform suits the solution? What sort of testing is needed? With more specific needs, more specialized partner is required for successful execution.

Process

Narrow down the key focus for the given process to identify the way you want to execute the solution.

• Check if you want to create a proof of concept or if you have it already and want to build something mostly to scale?

• Whether you want to add resources to build up existing team that can run faster in the deployment?

Process can categorize companies based on where they operate within the product lifecycle. It is important to line up the teams that are the most suitable for the current stage or next stage.

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EXPLAINED WHY

AUTOMOTIVE INDUSTRY WILL BE THE BIGGEST CONSUMER

OF IOT IN 2020

RANJEET KOUL

Vice President and Country Manager for APAC and MEA Region, Aeris Communications

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The phenomenon of Internet of Things (IoT) is still considered a trigger for the next digital revolution however it is already here and changing lives. It is expected that by 2020 there will be more than 20

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billion IoT devices in use. Especially, in the automotive industry, it has helped evolve vehicles driven by humans to self-driven vehicles. IoT has improved management capabilities and is leading

us to a future of intelligent, autonomous vehicles. A tremendous solution like GPS has helped in assisting us with locations or collecting large chunks of data from our devices.

AUTO VOICE

However, in this era, a lot of time and energy was channelized in manually processing data for understanding the efficiency and proper functioning of the critical components of automobiles and monitor the wear and tear to drive new alloys for endurance. The next use case for analytics kicked off when automobile giants started paying attention to consumer desires to have it all– the economy of mass production, design options to fit an individual’s taste and needs, and the highest possible quality. The need to offer a greater variety of product models within the limits of mass production gave rise to multiple quality assurance methods to produce standard and exchangeable

parts to reduce manufacturing costs. This in turn sparked the demand for design reengineering and establishing better understanding of efficiency and power of the vehicles using data.

The next big move in use of analytics came with the use of analog sensors in cars. In 1950’s, basic sensors for low oil pressure warning lights and charging system warning lights on the instrument panel existed. However, there were no computers during that time to monitor specific conditions of the car. It was only in the early 1970’s that we see examples of electronic fuel control using sensors developed by Bosch and used on brands like Mercedes Benz, VW, Porsche, and Datsun. Electronically controlled systems using sensors became more popular in the late 70’s and early 80’s in response to U.S. EPA emissions standards requiring the use of catalytic convertors.

Many computer controlled automotive systems used sensors primarily to improve fuel control to and to reduce tailpipe emissions.

Today, sensors are majorly used to monitor everything from raindrops on the windshield to cautioning us when it’s due for an oil change. The data garnered from automobiles are sensorbased techniques to record and analyse performance of critical automobile systems, or satellite-based techniques such as tracking vehicle position and recording external circumstances.

Even the data collection techniques for automobiles have improved over the years by using current technology tools like mobile devices, wearables, Big Data, Business Intelligence, Cloud and Social Media. The prime focus of these collection techniques is to enhance customer experience and achieve better vehicle health.

Today, IoT communications is helping automotive OEMs better understand their vehicle’s performance and driving behaviour. The technology has made easy for the OEMs to understand the relation between Man and the Machine with a lot more sophistication. It has also enabled OEMs to develop and evolve relationships by having informed conversations with their customers, dealers, suppliers and deliver new, innovative value-added services, such as, infotainment, user-based insurance

and even financing. Even fleet operators, including companies that offer taxi services such as the Uber and Ola, on-demand services like Zipcar, car rental companies like Hertz, and even the commercial enterprises such as the FedEx are getting more connected cars because telematics data can help improve safety, keep assets wellmaintained, avoid accidents, improve route-planning, and optimize supply chain logistics, among many other benefits.

As per a research by Accenture, the total business value of connected car services will reach $123 billion by 2020, rising to $618 billion by 2025. A single connected car could deliver as much as $6,188 over its lifetime.

While early adopters are clearly keen to realise the financial advantages, safer drivers and safer roads are also the key driver of IoT technology. Some analysts predict that the automotive sector will generate up to $199 billion in revenue in 2020 as a result of M2M technology, with the highest growth rates expected in Asia Pacific. By this time the automotive M2M market is expected to grow to almost 1.3 billion connections, driven predominantly by the need for manufacturers to fit new cars with emergency assistance devices.

However, beyond emergency assistance, the data the cars generate can provide a wide range of anonymised traffic information that helps public services better understand motorway networks.

Vehicle suspension data collected from cars can also help authorities detect faults in the road before they develop into potholes.

However, one of the major concernis cybersecurity. It dominates the autonomous car industry and must be addressed as part of OEM efforts to shift their business model. Ransomware in 2017 caused serious service outages for several OEMs, In the nutshell, the adoption of IoT by the automotive industry is only likely to accelerate with increasing regulatory demands, the opportunity to drive up revenues whilst driving down costs, and the growing customer expectations to be offered the very latest entertainment and support services become more predominant. And without doubt, the automobile sector was and will always remain the most loyal consumer of IoT.

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INDUSTRY REPORT

NEW TECHNOLOGICAL ERA BEGINS FOR INDIAN RAILWAYS The Minister of State for Railways, Suresh Angadi has recently said that the Indian Railways will be well served by the deployment of 2600 MSS Terminals designed and developed by wireless communication and semiconductor solutions company Saankhya Labs in partnership with ISRO and Bharat Electronics Ltd. Angadi said this while visiting the office Saankhya Labs, accompanied by senior officials from the Ministry of Railways. Angadi was referring to the Real-time Train Information System (RTIS) project that is being executed by the Centre for Railway Information Systems (CRIS) in collaboration with ISRO. As part of the Phase I implementation of RTIS, Bharat Electronics Limited (BEL) commissioned the RTIS network deploying over 2600 MSS terminals on locomotives of Indian Railways. Saankhya Labs is the Satcom Technology partner for BEL in the RTIS project.

The RTIS is primarily used for acquisition of train movement data, including that of arrival, departure and run-through timings at the stations enroute. The trains hauled by RTIS enabled locomotives gets tracked and plotted automatically in the Control Office Application (COA) at Central Control office. Saankhya Labs supplied the Satcom modems and hub-side equipment for RTIS project. The end-to-end solution

was indigenously designed, developed and manufactured in India, all powered by Saankhya’s award-winning patented Software Defined Radio (SDR) chipsets.

Highlighting the development, the Minister of State for Railways, Suresh Angadi said, “I am delighted to see cuttingedge indigenous technology being deployed in the service of the nation. This is a very important initiative by the Indian Railways in partnership with ISRO, BEL, and Saankhya Labs.

The benefits of this will be far-reaching and help the railways improve upon its operational efficiency include timings and safety.

The system generates huge volumes of data in real time that will further help streamline operations of the Indian Railways.”

Parag Naik, Co-founder and CEO of Saankhya Labs said “Saankhya Labs would also like to thank Indian Railways, CRIS, ISRO and BEL for providing us an excellent opportunity to deploy our Satcom solution. Over 8 billion passengers commute on Indian railways annually and RTIS is bound to have a profound impact on the efficient running of the network. We are glad to be part of it. Saankhya Labs looks forward to bringing unique technology and solutions enabling ongoing transformation of Indian Railways, all powered by indigenous technology”.

DELHI GOVERNMENT SHARES THE EV POLICY 2019

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The Delhi government has released the draft for the Electric Vehicle Policy 2019 that aims at the frequent use of electric vehicles in the national capital.

The policy draft states that the primary goal is to improve Delhi's air quality by bringing down emissions from the transport sector. As a result, the policy will seek the rapid adoption of Battery Electric Vehicles (BEVs) in such a way that they contribute 25 per cent to the overall new vehicle registrations by 2024." The road tax and registration will be waived off for all battery electric vehicles, during the period of this policy. The EV Policy will be valid for three years from the date of implementation.

The draft of the Delhi EV Policy was first put out in the public domain in November

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last year and suggestions and comments from the stakeholders including nonprofit think-tanks, academic experts, EV and battery manufacturers, as well as multilateral bodies and concerned individuals. It new policy draft takes into consideration all the suggestions, according to the government.

The Delhi EV Policy will be focussing on electric two-wheelers and shared transport vehicles including the likes e-threewheelers, buses and freight vehicles, since they contribute to the majority of the vehicular pollution, according to the government. The policy suggests that electric two-wheelers constitute only 0.2 per cent of annual two-wheeler sales, electric cars contribute 0.1 per cent to car sales, while electric three-wheeler

sales at almost nil at present.

The Delhi government is targeting the induction of 35,000 within a year that will include two/three and four-wheelers. This will include 1000 EVs for last-mile deliveries and 250 public charging or swapping stations around Delhi. Furthermore, the government is targeting to register about five lakh EVs in the next five years, which will help save about `6000 crore in oil and liquid natural gas imports, as well as 4.8 million tonnes of CO2 emissions.

This, the government says is equivalent to avoiding nearly one lakh CO2 emissions from petrol cars over their lifetime. The EVs will also help avoid 159 tonnes of 2.5 ppm tailpipe emissions. The policy further suggests that it plans to make the city, the EV capital of India.

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For Website

INDUSTRY UPDATES

Toshiba Collaborates with Cypress Semiconductor Cypress Semiconductor has recently announced that Toshiba Electronic Devices & Storage Corporation (“Toshiba”) has selected Cypress’ Semper NOR Flash for its next-generation ViscontiTM family of automotive Advanced Driver Assistance Systems (ADAS).

Architected with an embedded Arm Cortex -M0 processing core, the Semper family is purpose-built for the most demanding automotive environments where high-density and functional safety compliance are required. The Toshiba ViscontiTM ADAS SoC is specifically targeted for major automobile makers working toward Autonomous Driving level 2.

The Cypress Semper NOR Flash family leads the industry in Functional Safety compliance and was the first flash to be designed specifically to meet the ISO26262 automotive functional safety standard, reaching ASIL-B compliancy.

Semper NOR Flash also supports automotive temperatures up to +125°C

(AEC-Q100 Grade 1) and meets the density and performance requirements for storage in ADAS applications through Autonomous Driving level 5.

“For the Toshiba ViscontiTM5 ADAS SoC, it is critical that the integrated components selected for the design

are field-proven, built to the highest standards of safety and reliability, and will have the endurance required for advanced ADAS applications,” said Takeshi Sugahara, Technology Executive of Toshiba Electronic Devices & Storage Corporation. “Cypress’ failsafe storage solutions are a key to enable our ViscontiTM5 platform to exceed our customers’ expectations and requirements for next-generation automotive designs.”

“Cypress is proud of its success in providing the world’s most advanced and reliable fail-safe storage products with integrated compute core and functional safety for automotive applications,” said Amr El-Ashmawi, vice president of marketing, Memory Products Division at Cypress. “As the world’s number one market share provider of automotivegrade flash, we look forward to continuing our collaborative work with Toshiba for delivering next-generation ADAS systems in this growing segment of the automotive market.”

Lattice to Host the Embedded ROHM AvailS KX132-1211 Vision Alliance and KX134-1211

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Lattice Semiconductor has announced that it will host the upcoming Vision Industry and Technology Forum, a program series created by the Embedded Vision Alliance (EVA).

The Vision Industry and Technology Forum provides EVA members with the latest information on embedded vision technology trends, standards, market drivers, and applications.

“Embedded vision is an increasingly popular Edge application for many of the markets we serve, particularly AI/ML-enabled smart vision systems for industrial and automotive. Industry events like the Vision Industry and Technology Forum are important venues where Lattice can connect with partners and customers and keep them updated on our latest innovations in low power embedded vision technology,” said Deepak Boppana, Senior Director, Segment and Solutions Marketing, Lattice Semiconductor.

“From our award-winning sensAI™ solutions stack to our CrossLink™ FPGA family optimized for embedded vision, Lattice enables developers to quickly and easily add low power, smart vision capabilities to new or existing products.”

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ROHM Group Company Kionix recently announced the availability of accelerometers, KX132-1211 and KX134-1211, ideal for high accuracy, low power motion sensing applications in the industrial equipment and consumer wearable markets.

In recent years, as factories have begun to save labor costs and increase efficiency, the concept of predictive maintenance for detecting abnormalities before equipment malfunctions has gained broad acceptance. This has increased the need for machine health monitoring along using sensors to detect equipment conditions (i.e. motor vibration). The KX134-1211 is a 3-axis accelerometer optimized for machine condition monitoring. Advanced Data Path (ADP) technology allows noise filtering and sensor signal processing normally carried out by the MCU to be performed by the accelerometer. They contribute to reducing MCU load and power consumption together with improved application performance. In addition, to meet industrial requirements, the sensing frequency and acceleration detection ranges have been increased to 8,500Hz and ±64g, respectively, while supporting operating temperatures up to 105°C. At the same time, the sensor itself consumes less than half the current (0.67μA in low power mode) compared to conventional products.

INDUSTRY UPDATES

Infineon to Demonstrate Innovation at CES 2020

Honeywell Inaugurates Global Packaging Lab

Infineon Technologies will demonstrate innovations in semiconductor-based products that help connect the real and the digital world.

Safe and secure connections are built around advanced sensor technologies, dependable computing, hardwarebased security, and highly efficient power semiconductors.

At CES 2020, Infineon will show critical building blocks used in the consumer and automotive industries to make the Internet of Things and big data revolution possible.

Smarter, cleaner and safer automotive solutions at the Westgate Pavilion booth #1700 Intelligent and efficient automobile fleets are part of the smart cities of tomorrow. With decades of experience and an ecosystem of industry partners, Infineon is helping to create the personal transportation infrastructure of the 21st century.

Component and system demonstrations will include compact, high-performance radar modules and lidar components to support advanced driver assist systems and increasing levels of autonomy, sensor fusion technologies to seamlessly blend data from all sensor systems, in-vehicle gateways and vehicle-to-X communication technologies as well as security technologies to assure software validity and guard against attempted attacks.

Honeywell has recently announced the inauguration of a new state-of-the-art global packaging laboratory at the Honeywell India Technology Center (HITC) in Gurgaon, Haryana.

The new laboratory will support regional and global partners in the pharmaceutical and adjacent packaging industries and focus on providing superior technical services to customers as well as support Honeywell’s growing New Product Development initiatives. Akshay Bellare, president, Honeywell India, unveiled the laboratory. The new Gurgaon HITC packaging laboratory facility is now the Honeywell center of excellence for global and domestic technical projects for the healthcare packaging division.

As local and multinational pharmaceutical companies continue to expand into highly regulated markets such as the U.S. and Europe, organizations seek to provide the highest quality products in a rapidly evolving regulatory landscape.

Given the expected growth of pharmaceutical packaging market by 2023, companies will require new packaging technologies that allow them to launch drugs faster while reducing operational costs.

“Honeywell is committed to strengthening packaging technology for the future with our expertise in the pharmaceutical sector,” said Akshay Bellare, president, Honeywell India.

Electrolube to Launch New UV Coatings, Resins & Gap Fillers Electrolube is set to launch an innovative range of UV Conformal Coatings, Thermal Management solutions and Encapsulation Resins at this year’s IPC APEX EXPO, held at the San Diego Convention Centre, CA, from 4-6 February.

The company’s commitment to the evolving needs of its customers saw the launch of these new products reach an unprecedented level of success at Productronica recently, where Electrolube’s newly redesigned stand highlighted their escalating global growth and strong global position as a complete solutions provider of electro-chemicals.

At IPC APEX EXPO, Electrolube will demonstrate its advanced technical capability to the US market by launching solutions that really help manufacturers speed up production and increase reliability and lifetime of products.

The company will display a range of new rapid curing UV conformal coatings that enable immediate board

handling with a full cure guaranteed within 6-12 hours due to the chemical secondary cure mechanism. One of the biggest advantages of the new range is its capability to significantly reduce production time. vastly. Most systems can take between 8 to 14+ days, and even longer in many cases, whereas Electrolube’s UV coatings fully cure in

less than 12 hours.

Electrolube’s next generation UV cure conformal coating products are solventfree, VOC-free and provide unrivalled performance in harsh environments, including high resistance to cracking during thermal shock cycling. The range features UVCL, a single component, medium-low viscosity dual cure coating with secondary moisture cure, ensuring complete cure in shadow areas. The ‘Plus’ version of UVCL, UVCL-P, is a transparent, flexible coating which is extremely resistant to thermal shock and offers improved coverage and protection, along with a guaranteed chemical cure in 6 hours thanks to its unique secondary cure mechanism. An ‘xtra’ version of UVCL, UVCL-X, is a green-opaque coating that can be applied at up to 300 microns and has a higher maximum operating temperature of 150°C. UVCL-X shares the benefits of UVCL-P and increases ease of inspection.

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INDUSTRY UPDATES

Maxim’s Gate Driver Provides Best-in-Class Power Efficiency

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With the MAX22701E isolated gate driver from Maxim Integrated Products, designers of high-voltage/high-power systems can improve power supply efficiency by up to 4 percentage points over competitive solutions, reducing power loss and the resulting carbon footprint by 30 percent.

The driver IC is intended for use in switch-mode power supplies within industrial communication systems for solar power inverters, motor drives, electric cars, energy storage systems, uninterrupted power supplies, data farms and high-power/high-efficiency power supplies.

“As our customers adopt SiC technology to deliver smaller and more efficient power supply systems, we enable maximum system efficiency with increased system uptime,” said Timothy Leung, director, Industrial and Healthcare Business Unit at Maxim Integrated.

Many switch-mode power supply applications are adopting wide-bandgap silicon carbide (SiC) transistors to improve power efficiency and transistor reliability. However, the high switching frequency incurs transients that generate noise,

which either disrupts operations or requires extensive mitigation.

The MAX22701E offers the industry’s highest common-mode transient immunity (CMTI) of 300kV/µs typical to deliver industry-leading reliability. CMTI is up to 3x higher than the closest competitor, which results in increased system uptime.

Best-in-class driver propagation specs (35ns typical which is 2x lower propagation delay than the closest competitor) and propagation delay matching between the high-side and lowside gate drivers (5ns maximum which is 5x lower than the closest competitor) helps to reduce the transistor’s dead time. This, in turn, improves power efficiency up to 4 percentage points. In the 90 percent efficiency range, every 1 percentage point in efficiency results in about a 10 percent improvement in power loss. For example, improving efficiency from 90 to 94 percent results in an approximately 30 to 40 percent reduction in wasted power (6 versus 10 points of wasted power.) The MAX22701E is available in an 8-pin narrow body SOIC package (3.90mm x 4.90mm) with an extended temperature range of -40-degree to +125-degree Celsius.

Microchip Introduces Early Access Program

NXP Acquires Marvell’s Wi-Fi & Bluetooth Connectivity Assets

Microchip Technology is opening the Early Access Program (EAP) for the PolarFire system-on-chip (SoC) field programmable gate array (FPGA). The platform offers the world’s first hardened real-time, Linux® capable, RISC-V-based microprocessor subsystem on the award-winning, mid-range PolarFire FPGA family, bringing class-leading low power consumption, thermal efficiency and defense grade security to embedded systems.

Qualified EAP customers can start designing now with Microchip’s Libero® SoC 12.3 FPGA design suite and SoftConsole 6.2 integrated development environment for the embedded developer. Customers can also debug their embedded applications today using Renode, a virtual model of the microprocessor subsystem. “Delivering the industry’s first RISC-V based SoC FPGA along with our Mi-V ecosystem, Microchip and its Mi-V partners are driving innovation in the embedded space, giving designers the ability to develop a whole new class of power-efficient applications,” said Bruce Weyer, vice president of the Field Programmable Gate Array business unit at Microchip. “This in turn will allow our clients to add unprecedented capabilities at the edge of the network for communications, defense, medical and industrial automation.”

NXP Semiconductors has recently announced the completion of the acquisition of the wireless connectivity assets from Marvell, pursuant to the terms of the previously announced agreement from May 2019.

In May 2019, NXP agreed to acquire Marvell’s wireless connectivity portfolio in an all-cash, asset transaction. The acquisition will enable NXP to deliver complete, scalable processing and connectivity solutions to its customers across its end markets, including tailored security and a full suite of wireless connectivity spanning Wi-Fi, Bluetooth, Bluetooth Low Energy, Zigbee, Thread and Near Field Communications (NFC).

Speaking on the occasion, Mr. Sanjay Gupta, Vice President and India Country Manager said, “We are delighted to announce the closure of deal with Marvell. The combined expertise of Marvell’s Connectivity business with NXP will help in creating better and meaningful solutions in the areas of connectivity, IoT and security for our customers. From NXP India perspective, this has led us to come up with our 4th R&D Centre in Pune to work on the full suite of wireless connectivity spanning Wifi and Bluetooth Low Energy technology. Additionally, the acquisition will also increase our engineering headcount to over 2300 in India”.

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INDUSTRY UPDATES

STMicroelectronics Updates TouchGFX Suite

Vishay R&D Grant for Alternative Energy Related Product

STMicroelectronics has updated the TouchGFX user-interface software framework for STM32 microcontrollers, adding new features that enable smoother and more dynamic user interfaces and lower demand on the memory and CPU. TouchGFX is a free tool in the STM32 ecosystem. Comprising two parts -- TouchGFX Designer PC tool for designing and configuring rich user interfaces, and TouchGFX Engine software that runs on the end-device to secure high UI performance -- the latest version 4.12 contains updates to both. Users can now build sophisticated user interfaces on one-chip display solutions without external RAM or flash, save power for longer battery life, and benefit from easier development to get to market faster. In TouchGFX Engine, a partial framebuffer mode now allows the buffer to operate using as little as 6KB of RAM. A fully functioning user interface can now have just 16KB of RAM, so that small STM32 MCUs can deliver great user experiences without external memory. Also new, 8-bit luminance (L8) with 16-bit, 24-bit, and 32-bit palettes reduces demand for flash memory. Even with this smaller memory, TouchGFX maximizes performance by leveraging the STM32 Chrom-ART Accelerator to accelerate graphics and handle sophisticated effects. There is also a new cacheable container with dynamic bitmap that reduces CPU loading to run smooth and fluid animations at high frame rates.

Vishay Intertechnology has recently announced that the company's facility in Borgaro Torinese, Italy, has received an industrialization of research results (IR2) R&D grant from the European Union and the Regional Government of Piedmont.

The SINERGY project (power Semiconductor for INtegrated ENERGY distribution) being funded by the grant at Vishay Italiana in Borgaro will focus on emerging applications for private and public sustainable mobility, the production of energy from renewable sources, and the efficient conversion of energy. In addition to strengthening Vishay Semiconductor Italiana in the energy conversion market, the grant is providing opportunities for recent graduates to be involved in engineering and technology transfer to production and the market, as well as funding a number of higher education apprenticeships at the Vishay facility.

"Through the additional resources provided by the IR2 measure, the Vishay Italiana facility in Borgaro is becoming a source of significant component design and manufacturing innovations for solutions aimed at the automotive and industrial markets," said Johan Vandoorn, Executive VP / Chief Technical Officer at Vishay Intertechnology. "We thank the European Regional Development Fund and the Regional Government of Piedmont for the opportunity to further enhance the work of the Vishay team at Borgaro Torinese."

Renesas Electronics Launches World’s Smallest Photocouplers Renesas Electronics has recently announced five new 8.2mm creepage photocouplers that are the world’s smallest isolation devices for industrial automation equipment and solar inverters.

With a package width of 2.5mm, the RV1S92xxA and RV1S22xxA photocouplers reduce PCB mounting area by 35 percent compared to competitive couplers. They help designers shrink equipment size, increase robot axes, and improve factory floor productivity. They also meet the needs of the zero-energy house that requires smaller solar equipment for more installations in limited space. The RV1S92xxA and RV1S22xxA photocouplers are ideal for DC to AC power inverters, AC servo motors, programmable logic controllers (PLCs), robotic arms, solar inverters, and battery storage and charging systems. The RV1S9260A 15 Mbps communications coupler and RV1S9213A intelligent power module (IPM) driver are the first photocouplers to use tiny LSSO5 packages with a 0.65mm pin pitch, half the pitch of conventional packages. With a package height of 2.1mm, the photocouplers can be directly mounted on the backside

of a PCB, freeing up valuable space for topside mounted components. Three times infrared reflow soldering provides maximum flexibility. The RV1S92xxA photocouplers’ electric isolation and high CMR noise rejection (50 kV/µs) protects low voltage microcontrollers and I/O devices from high voltage circuits when transferring high-speed signals.

The RV1S2281A and RV1S2211A are DC input and low DC input, transistor output photocouplers, and the RV1S2285A is an AC input, transistor output coupler. The RV1S22xxA devices also provide 8.2mm creepage distance, 2.5mm package width and 2.1mm package height. They come in LSSOP packages with a 1.30mm pin pitch. All five photocouplers deliver 5000 Vrms reinforced isolation and high temperature operation to withstand harsh operating environments. “The RV1S92xxA and RV1S22xxA photocouplers give designers a variety of functions and the layout flexibility to significantly reduce equipment size and maximize factory floorspace,” said Philip Chesley, Vice President, Industrial Analog and Power Business Division at Renesas.

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T&M UPDATES

Anritsu Releases BERTWave MP2110A Anritsu Corporation (President Hirokazu Hamada) has strengthened the sampling oscilloscope function of its BERTWave MP2110A by releasing a Clock Recovery Unit (CRU) option for generating a trigger clock from a 53-Gbaud PAM4 optical signal. Since this is a built-in CRU it offers excellent operability at a lower price than external designs. In addition, combined use with other already released options supports all-in-one evaluation of various types of PAM4 optical modules for cost-effective development and manufacturing of PAM4 optical modules now being actively installed on networks.

The all-in-one BERTWave MP2110A platform is composed of a sampling oscilloscope for evaluating optical waveforms, and a BERT for measuring bit error ratio (BER). The MP2110A oscilloscope can be configured to support various applications by selecting additional bit rates and interfaces of the electrical and/or SMF/MMF inputs. Adding this new option completes all-in-one support for all current IEEE standards, enabling

evaluation of all types of PAM4 optical modules without requiring a trigger clock.

Additionally, production throughput can be increased by selecting the 4ch oscilloscope to measure multiple channels all-at-once, helping configure a flexible test system matching the site requirements at optimum cost.

BERTWave MP2110A Features • Selection of built-in 1/2/4ch sampling

oscilloscope BERT options • World-beating sampling oscilloscope level sensitivity for analyzing optical signals ranging from 26G NRZ to 53G PAM4, plus built-in CRU option • BERT with same waveform quality and high sensitivity as expensive R&D models, with clock recovery built-in as standard • Fast, reliable measurement using built-in PC

ASR-2000 Series Programmable AC/DC Power Source

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The ASR-2000 series, an AC+DC power source aiming for system integration or desktop applications, provides both rated power output for AC output and rated power output for DC output.

Nine ASR-2000 output modes are available, including 1) AC power output mode (AC-INT Mode), 2) DC power output mode (DC-INT Mode), 3) AC/DC power output mode (AC+DC-INT Mode), 4) External AC signal source mode (AC-EXT Mode), 5) External AC/DC signal source mode (AC+DC-EXT Mode), 6) External AC signal superposition mode (AC-ADD Mode), 7) External AC/DC signal superposition mode (AC+DC-ADD Mode), 8) External AC signal synchronization mode (ACSYNC Mode), 9) External AC/DC signal synchronization mode (AC+DC-SYNC Mode).

The ASR-2000 series provides users with waveform output capabilities to meet the test requirements of different electronic component development, automotive electrical devices and home appliance, including 1) Sequence mode generates waveform fallings, surges, sags, changes and other abnormal power line conditions; 2) Arbitrary waveform function allows users to store/upload user-defined waveforms; and 3) Simulate mode simulates power outage, voltage rise, voltage fall, and frequency variations. When the ASR-2000 series power source outputs, it can also measure Vrms, Vavg, Vpeak, Irms, Iavg,

BISINFOTECH|JANUARY 2020|VOL 2|ISSUE 01

Ipeak, IpkH, P, S, Q, PF, CF, 40th-order Voltage Harmonic and Current Harmonic. In addition, the Remote sense function ensures accurate voltage output.

The Customized Phase Angle for Output On/Off function can set the starting angle and ending angle of the voltage output according to the test requirements. V-Limit, Ipeak-Limit, F-Limit, OVP, OCP, OPP function settings can protect the DUT during the measurement process. In addition to OTP, OCP, and OPP protection, the ASR-2000 series also incorporates the Fan fail alarm function and AC fail alarm function.

T&M UPDATES

Choice for High Performance Semiconductor Components Teledyne had acquired e2v in March 2017 and counts now more than 11 000 employees across Europe, America and Asia.

The firm has the flexibility to address various markets with the most demanding requirements, such as Aerospace & Defense, Avionics, Space and Industrial and Instrumentation. Working to make customers' systems safer, secure and more differentiated by delivering tailored high performance semiconductor subsystems and signal & data processing solutions, is what they do best!

Teledyne e2v's "Data and Signal Processing Solutions" Business Unit has made innovation its key priority by developing components which accelerate the digitization of microwave signal systems, striving toward completely software defined antennas that utilize world-leading data conversion technologies directly in the antenna. This makes Teledyne e2v lead the world in Analogue to Digital converters (ADC) and Digital to Analogue Converters (DAC) with the potential to enable new advanced solutions in Space microwave frequency communication systems. As a result, Teledyne e2v's team bring a world-class

renowned design expertise in Broadband Data Converters, which, for instance, led to put on the market the EV12DS480 DAC and EV12AQ600 ADC. These two products are both widely used in Space applications and are part of the extended Teledyne e2v semiconductors offer in data converters. Other state of the art data converters are the Quad Family used in high-end Test & Measurement applications and the EV12AD550 Dual channel ADC for Space applications.

The Business Unit has also supplied for over 30 years' High Reliability commercial processors based on commercial architectures that have been characterized, qualified, and repackaged to satisfy the most severe environmental conditions, including Space.

Teledyne e2v's microprocessor offer addresses critical functions and is qualified to high temperature ranges (-55°C to +125°C) with leaded or RoHS finished package options. The QorIQ® Power Architecture® and ARM® processor portfolio offers the highest performance for small form factor/power-efficient applications.

Spirent Collaborates with China Mobile Spirent Communications has announced the successful outcome of its collaboration with China Mobile to create a realistic 5G device test system.

The YuHeng evaluation system incorporates Spirent’s radio frequency (RF) channel emulation technology and has been developed by China Mobile to help compare the performance of new 5G chipsets and consumer smartphones from leading global manufacturers.

As 5G progresses beyond initial rollouts, the number of end-user handsets, broadband modems and other devices coming into the market is increasing rapidly. The new YuHeng system allows operators and device manufacturers to test their RF solutions in the lab with the latest 5G

base stations (gNodeB) that employ sophisticated new radio technologies such as massive MIMO beamforming.

Devices under test are positioned within an RF anechoic chamber and are driven by a commercial base station, allowing the system to evaluate the performance of the device’s antenna configuration, baseband algorithms, hardware and software design.

Spirent’s Vertex RF Channel Emulator is used to replicate real-world indoor and outdoor effects that can influence radio efficiency, such as multi-path loss, reflections, absorption, delay, doppler frequency shift and antenna polarization.

Both downlink and uplink propagation channels are modeled by the system,

and multiple types of device-in-motion simulations can be created to replicate real-world scenarios such as walking in an urban environment or traveling in a vehicle on a highway.

“We are delighted to have had the opportunity to collaborate with the China Mobile Group Device Company team on the YuHeng project,” said Peter Tan, Spirent’s VP for Greater China & East Asia. “This innovative solution is the first of its kind and enables China Mobile to thoroughly assess and benchmark the growing number of new 5G smartphones, devices and chipsets for performance in test environments that realistically replicate a wide variety of authentic radio and motion conditions.”

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T&M UPDATES

Yokogawa, Saudi Basic Industries Corp IN ALLIANCE Yokogawa Electric Corporation has recently announced that it has entered into a strategic alliance framework agreement to accelerate collaboration with Saudi Basic Industries Corporation (SABIC), ranked among the world's largest petrochemical manufacturers.

The agreement includes selection of Yokogawa as a preferred supplier of control systems. SABIC is a public company based in Riyadh, the capital city of the Kingdom of Saudi Arabia, and is composed of four strategic business units: petrochemicals, specialties, agrinutrients, and metals.

To date, Yokogawa has delivered integrated control systems in some SABIC plants such as a large ethylene plant (1,000kt/year) in Jubail.

Under this alliance agreement, Yokogawa will promote localization in Saudi Arabia, and its integrated control systems and safety instrumented systems will

be preferentially selected for plants operated by SABIC in the Middle East and Asia-Pacific regions. Additionally, Yokogawa will promote manufacturing excellence by collaborating with SABIC on innovative digitalization technologies, as well as energy optimization programs.

Through the co-innovation of solutions and the co-creation of value with our

customers and partners, Yokogawa aims to contribute to a sustainable society.

Yokogawa established Yokogawa Saudi Arabia in 2006 and Yokogawa Service Saudi Arabia in 2007. Under the Saudi government's Nitaqat Program, Yokogawa is in the top Platinum Saudization tier.

In support of the country's promotion of female employment, the company has established an engineering team composed of only females in Saudi Arabia and supports projects for female engineers in the gulf countries.

Since April 2007, Yokogawa has been providing a one-year Graduate Engineer Training Program and shorter internship programs that are specially tailored to the needs of the Saudi job market, targeting recent graduates and students of Saudi universities and colleges for both male and female. So far more than 550 Saudi trainees have benefited from these programs.

Spirent Wraps 2019 with Ixia, Nozomi Networks to Tremendous Number of Deals Help Industrial Manufacturers

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Spirent has recently announced that it closed more than 100 5G-related deals during 2019. The surge in 5G business is being driven by accelerated deployment timetables that require complex testing and the need to incorporate assurance into new, next-gen networks for guaranteed quality. Spirent is now engaged in more than 150 global 5G initiatives with a broad mix of operators, device makers, network equipment manufacturers, academic institutions, government and cloud providers.

More than half of Spirent’s 5G business is taking place in the Asia-Pacific region as countries like South Korea gain traction with customized offerings tailored to data-hungry subscribers consuming high-bandwidth content such as AR and VR. In China, the company is supporting nationwide efforts to prepare the transport network and data center architecture for mass market deployments. About one-third of Spirent’s 5G deals are in the Americas, with the remainder across Europe. 5G transport, 5G core and 5G RAN projects comprise the majority of deals as operators pursue a range of network rollout strategies.

“If you took the industry’s pulse early last year, all eyes were on 2020 for mass movement in 5G, but those timetables have been turned on their heads as operators navigate an expanding set of market dynamics that demand speed and scale,” said Spirent Head of 5G, Steve Douglas.

BISINFOTECH|JANUARY 2020|VOL 2|ISSUE 01

Keysight Technologies has announced collaboration with Nozomi Networks, the leader in industrial cyber security and operational visibility, to deliver a joint solution that enables utilities, oil and gas facilities, and other industrial manufacturing sites to identify and defend against cyberattacks.

Industrial operational technology (OT) networks are vulnerable to cyberattacks through connections to the Industrial Internet of Things (IIoT), as well as the convergence with traditional IT networks, which add complexity.

According to Gartner, "although there are still distinctive OT security and IIoT security markets, the direction of this market is to converge IIoT into a 'digital security' market covering IT, OT, IoT and the physical security markets."1 This evolution creates specific security concerns to OT. The new joint solution from Ixia, a Keysight business, and Nozomi Neworks includes an Ixia Vision network packet broker (NPB), which collects data from all locations connected to an operational network and delivers it to Nozomi Networks Guardian for real-time processing and analysis.

Ixia's aggregation of traffic removes duplicate packets and unwanted traffic to improve performance and visibility into critical systems and processes, delivering comprehensive, automated visibility to secure connected operational environments.

NEW LAUNCH Vishay Presents IHDF Edge-Wound Inductor Vishay Intertechnology has recently introduced a new IHDF edge-wound, through-hole inductor with rated current up to 72 A and saturation currents up to 230 A for industrial and military applications.

Features: • Vishay Dale IHDF-1300AE-10 operates over a demanding temperature range from -55 °C to +125 °C with low AC and DC power losses and excellent heat dissipation.

Applications: DC/DC converters, inverters, and motor and switching noise suppression, and high power switchmode power supplies in high current, high temperature applications, including industrial solar systems and charging stations for electric vehicles, as well as military defense systems.

Availability: Available Now

Toshiba Launches General-Purpose System Power IC Toshiba has recently announced the launch of "TB9045FNG," a general-purpose system power IC with multiple outputs achieving functional safety for automotive applications. The new IC is available in four versions, with output voltages ranging from 1.1V to 1.5V. Features: • The highest automotive safety integrity level prescribed in the ISO 26262 functional safety standards.

• The new IC integrates various failure detection functions.

Availability: Mass production started in December.

Applications: Automotive

TDK Adds Two New Types for Audio Lines TDK Corporation has expanded the MAF series of noise suppression filters with two new MAF1608GAD-L types that are designed for audio lines.

Features: • Insertion height of just 0.6 mm and are able to suppress noise at cellular frequencies from 1 GHz and Class D amplifier noises and ensure high attenuation quality.

Applications: The new components are especially suitable for smart speakers and external speakers for tablets that require power levels of 2 W or higher as well as for headphones and microphones.

Availability: Mass production began in December 2019.

Renesas Low-Power RL78 Prototyping Board Renesas Electronics has launched the RL78/G14 Fast Prototyping Board – a low-cost, functionrich board to enable rapid product development for IoT endpoint equipment. Renesas also introduced the RL78/G1D BLE Module Expansion Board, which users can combine with the new prototyping board to add Bluetooth Low Energy wireless communication functions (Note 1) with ease.

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Features: • Easily affordable and has an on-board emulator circuit with the same functions as the E2 Emulator (E2 Lite), removing the need to purchase additional debugging tools.

BISINFOTECH|JANUARY 2020|VOL 2|ISSUE 01

Applications: Motor control in portable equipment and IoT sensors, as well as a wide range of IoT endpoint equipment, such as home appliances, industrial equipment, building automation, and health care equipment.

NEW LAUNCH MORNSUN Releases the Latest SCM13xxA Series MORNSUN has recently released the latest IC, SCM13xxA series, which include SCM1301ATA (1A output) and SCM1316AFA (6A output), these two step-down buck ICs can meet multiple application requirements with high reliability and cost-effectiveness.

Features: • The wide input voltage range is from 4.5V ~ 40V. • The SCM1301A operates at 0.7MHz fixed frequency with small external components to being able to achieve low output ripple voltage.

Applications: It can be widely used in intelligent instrument, car charger, rechargeable portable devices and Industrial distributed power applications.

Availability: Available Now

Mitsubishi Electric to Launch SLIMDIP-W Mitsubishi Electric Corporation has recently the coming launch of its SLIMDIPTM-W, a new highperformance intelligent power module (IPM) that will enable washing machines, air conditioners and various small-capacity motor drives to achieve reduced motor noise and consume less power.

Features: • Less noise enables downsizing and reduced total cost of inverter systems • Flexible wiring pattern simplifies layout design of inverter systems

Applications: Washing machines, air conditioners and various small-capacity motor drives.

Availability: Sales of the SLIMDIP-W will begin on January 15, 2020.

Family Details and Opens Early Access Program Microchip Technology has opened the Early Access Program (EAP) for the PolarFire system-on-chip (SoC) field programmable gate array (FPGA). The platform offers the world’s first hardened real-time, Linux capable, RISC-V-based microprocessor subsystem on the award-winning, mid-range PolarFire FPGA family, bringing class-leading low power consumption, thermal efficiency and defense grade security to embedded systems.

Features: Applications: • Qualified EAP customers can start designing now with Linux plus real-time applications Microchip’s Libero SoC 12.3 FPGA design suite and SoftConsole 6.2 integrated development environment for the embedded developer.

Availability: Available Now

Cuffless Blood-Pressure Measurement Solution Maxim Integrated Products has introduced a solid-state blood-pressure monitoring solution to more conveniently track this critical health indicator. Design engineers can develop bloodpressure trending solutions with the MAXREFDES220# reference design from Maxim. Comprised of a complete integrated optical sensor module, a microcontroller sensor hub and a sensing algorithm, the MAXREFDES220# optical blood-pressure trending solution can be embedded into smartphones or wearables.

Features: • Best Blood-Pressure Measurement Accuracy Without a Cuff • Ease of Design • Faster Time to Market

Applications: Smartphones and Wearables

Availability: Available Now

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ISSUE 01|VOL 2|JANUARY 2020|BISINFOTECH

NEW LAUNCH ST New Ready-to-Use Development Packs STMicroelectronics has introduced two $99 ready-to-use development packs that enable all types of users from large corporations to smaller companies, independent designers, hobbyists, and schools to utilize LoRa’s long-range, low-power wireless IoT connectivity for tracking, positioning, metering, and many other applications.

Features: • E ach pack includes proprietary gateway software and ST’s I-CUBE-LRWAN endnode software.

Applications: Tracking, positioning, metering, and many other applications

Availability: Both development packs are available now and developers can benefit from the market-proven STM32 ecosystem bringing LoRaWAN protocol stacks, free integrated development environments (IDEs) such as Keil MDK-ARM, as well as a comprehensive software toolset including the STM32CubeMX MCU initializer and configurator.

Infineon Introduces New IGBT7 Chip Infineon Technologies has introduced the new IGBT7 chip for its well-known Easy housing platform in March. Now it is taking the state-of-the-art TRENCHSTOP IGBT7 to the arena of medium power: in the standard industry package EconoDUAL 3.

Features: • Based on the new micro-pattern trench technology.

• TRENCHSTOP IGBT7 chip performs with much lower static losses compared to the IGBT4.

Availability: Available Now

Availability: Commercial, construction and agricultural vehicles (CAV), servo drives, as well as solar and UPS inverters.

New PRIMERGY Model with High-Speed Virtual Switch Fujitsu has recently announced the Japan launch of a new model in its FUJITSU Server PRIMERGY series of PC servers(1), the PRIMERGY RX2530 M4p, which features a high-speed virtual switch optimized for 5G(2) communications. The new model comes equipped with the Intel Xeon Gold 6138P processor with integrated FPGA(3) as standard and includes a virtual switch for performing packet processing in a virtual network.

Features: • Low latency in packet processing in a virtual environment • E asy to convert existing virtual networks into high-speed networks

Applications: Fujitsu will leverage this and other technologies to support an ecosystem of new services in the 5G era and contribute to the DX (digital transformation) of its customers.

Availability: Available Now

New Coating, Resin & Thermal a Success in Germany Converter Electrolube has recently launched to great acclaim, a new range of cutting-edge thermal management, encapsulation resin and UV conformal coating products at Productronica Munich.

The new products garnered a high level of interest due to their impressive impact upon increasing throughput and reliability for manufacturers.

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Features: • The new polyurethane resin, UR5645 is a tough, two-part encapsulation system.

• D eveloped for protection of electrical components.

BISINFOTECH|JANUARY 2020|VOL 2|ISSUE 01

Applications: Automotive and marine environments

Availability: The new polyurethane and epoxy resins are available in user-friendly kit sizes to meet every need, from prototyping and product development to full production.

NEW LAUNCH Artesyn Introduces LCC600 series Artesyn’s LCC600 series of fully enclosed conduction cooled AC-DC power supplies comprises four models, offering main output voltages of 12 V, 28 V, 36 V or 48 V.

Features: • Universal 90–264 Vac input and are optionally available.

• LCC600 series power supplies are especially suitable for use in harsh environments.

Applications: Telecommunications antenna and base station equipment, control consoles and outdoor/indoor signage – a constant current mode is provided for LED lighting/Horticultural Lighting.

Availability: Available Now

Analog Devices’ Two New Module Regulators Analog Devices has recently introduced the LTM4668 and LTM4668A µModule® regulators, quadoutput DC/DC regulators with up to 4.8A output capability. The new devices integrate switching controllers, power FETs, inductors and support components, easing the design process while reducing power consumption and board space.

Features: • 0.6V to 1.8V Output Voltage (LTM4668); 0.6V to 5.5V Output Voltage (LTM4668A) • 1.2A DC, Parallelable, Output Current on Each Channel

Applications: Telecom, networking and industrial applications.

Availability: The LTM4668 and LTM4668A are available today in 6.25mm x 6.25mm x 2.1mm BGA packages.

Red Lion Layer 3 Gigabit Ethernet Switch Red Lion Controls has recently announced the release of their innovative new NT328G Layer 3 Ethernet switch. Offering 28 high-speed ports (24-Gigabit, 4-10 Gigabit) and reliable wire-speed switching performance.

Features: • Layer 3 routing that provides the ability to route across VLANs or subnets—versatility that ensures scalability.

Applications: Oil & Gas, Water &Wastewater, Energy, Transportation, and video and security sectors, as well as other bandwidthintensive industrial applications.

Availability: Available Now

NIMS Launches Stretchable Vibration-Powered Device NIMS and AIST developed a liquid electret material capable of semi-permanently retaining static electricity. They subsequently combined this material with soft electrodes to create the first bendable, stretchable vibration-powered device in the world.

Features: • Device is highly deformable and capable of converting very subtle vibrations into electrical signals.An electret material capable of semi-permanently retaining an electrical charge can generate voltage as its distance to the associated electrode changes.

Applications: Development of healthcare-devices, such as self-powered heartbeat and pulse sensors.

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ISSUE 01|VOL 2|JANUARY 2020|BISINFOTECH

PoE Trends

2020

Anuj Dhir, VP & Business Head, Wipro Lighting

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With the emergence of IoT and Big Data, Smart and Connected digital lighting-based solutions are the way forward as they will bring in intelligence & functionality into lighting systems, enhance user experience and deliver desired outcomes for customers.

The technological advancements in the lighting domain have taken the world by storm. Today, smart lighting solutions based on innovation have emerged as the paramount forces that assist commercial businesses in increasing their overall productivity and efficiency with respect to the operations.

Intelligent lighting technology enabling users to control lighting through connected devices such as smart phones, tablets is the recent trend in the industry. This upcoming technology is helping to enhance employee comfort, productivity and safety through personalized control of work spaces, enables performance tracking due to real-time updates on lighting system status. It also provides for historical data and analysis to continually improve operations and experiences, thus helping facility managers to gain insights and in turn manage spaces effectively.

Another upcoming trend to witness is the emergence of the importance of human centric lighting intended to promote a personâ&#x20AC;&#x2122;s well-being, mood and health. It can improve concentration, safety and efficiency in workplaces or educational environments. By changing color of light and/or intensity of light, workspaces are willing to provide bio-dynamic light based on human circadian rhythm for increased employee concentration, cognitive performance, alertness and in general well-being.

As a leader in Lighting Solutions, we have

BISINFOTECH|JANUARY 2020|VOL 2|ISSUE 01

always made sure that we provide our customers with the Gold Standard in Lighting Innovation. Design & Innovation have become a way of life at Wipro and cutting-edge work is happening on new products and new technologies. Internet of Lighting (IoL)ÂŽ is our first step in that direction in offering our customers best of breed solutions in Lighting & beyond.

Wipro Lightingâ&#x20AC;&#x2122;s alliances with International Technology companies will usher a new revolution in work-lives. We have collaborated with Cisco for providing Power over Ethernet (PoE) based humancentric lighting solutions for new age workspaces to enable improvement in workspace productivity and enhanced employee well-being.

Power over Ethernet, also known as PoE, is one such smart lighting solution that uses high-quality LED luminaires along with analogue and digital controls to provide an appropriate lighting effect. It facilitates network deployment and uses network cables instead of common electrical wiring to carry the electrical power.

Savings on energy, ease of operations, personalization, and formulation of a connected network are some of the major benefits associated with PoE. Furthermore, PoE also enables the scope of a customizable environment and is recognized as a perfect fit for a variety of modern institutions. Here are some of the application areas where PoE will leverage multiple benefits in the upcoming year.

1. Smart offices Lighting conditions of a workplace are known to affect the mood and behaviour of the people. While dull and low lighting can make people feel lethargic, the

right lighting conditions can make them feel energized and attentive. Since PoE ensures better lighting conditions and savings on the utility bills, it becomes one of the best smart lighting solutions for office spaces. Moreover, it also allows smart devices in an office space to work cohesively. This helps in the development of a connected system that eventually helps offices to gain a precise control over their operations and total energy usage.

2. Healthcare Healthcare units use a highly complex system of connected devices and consume a significant amount of energy.

This increases their total expenditure and eventually makes good healthcare facilities a costly affair. However, integration of PoE can largely benefit the healthcare units as well as the public. A PoE lighting setup uses smart sensors that ensure personalized lighting conditions with apt intensity and colours to enhance the overall comfort levels.

3. Manufacturing Manufacturing is another industry vertical that has acknowledged digitization in operations. According to the top commercial lighting manufacturers, a manufacturing plant is one of the places that can benefit the most with PoE lighting as it encourages IT integration.

It is considered as a truly networked solution that can connect to IoT networks, server networks, and broader building automation initiatives to make the overall system communication easy.

Furthermore, PoE lighting solutions can also be used in smart home automation and a variety of other sectors like education, event management, etc.

TECH RESEARCH

A Sweat Analyzer, which Detect Nutrients

In a new paper published in Nature Biotechnology, researchers led by Wei Gao, Assistant Professor of medical engineering, describe a mass-producible wearable sensor that can monitor levels of metabolites and nutrients in a person’s blood by analyzing their sweat.

Previously developed sweat sensors mostly target compounds that appear in high concentrations, such as electrolytes, glucose, and lactate. Gao’s sweat sensor is more sensitive than current devices and can detect sweat compounds of much lower concentrations, in addition to being easier to manufacture, the researchers say.

The development of such sensors would allow doctors to continuously monitor the condition of patients with illnesses like cardiovascular disease, diabetes, or kidney disease, all of which result in abnormal levels of nutrients or metabolites in the bloodstream. Patients would benefit from having their physician better informed of their condition, while also avoiding

invasive and painful encounters with hypodermic needles.

“Such wearable sweat sensors have the potential to rapidly, continuously, and noninvasively capture changes in health at molecular levels,” Gao says. “They could enable personalized monitoring, early diagnosis, and timely intervention.”

Gao’s work is focused on developing devices based on microfluidics, a name for technologies that manipulate tiny amounts of liquids, usually through channels less than a quarter of a millimeter in width.

Microfluidics are ideal for an application of this sort because they minimize the influence of sweat evaporation and skin contamination on the sensing accuracy.

As freshly supplied sweat flows through the microchannels, the device can make more accurate measurements of sweat and can capture temporal changes in concentrations.

Until now, Gao and his colleagues say, microfluidic-based wearable sensors were mostly fabricated with a lithography-

evaporation process, which requires complicated and expensive fabrication processes. His team instead opted to make their biosensors out of graphene, a sheet-like form of carbon. Both the graphene-based sensors and the tiny microfluidics channels are created by engraving the plastic sheets with a carbon dioxide laser, a device that is now so common that it is available to home hobbyists.

The research team opted to have their sensor measure respiratory rate, heart rate, and levels of uric acid and tyrosine.

Tyrosine was chosen because it can be an indicator of metabolic disorders, liver disease, eating disorders, and neuropsychiatric conditions. Uric acid was chosen because, at elevated levels, it is associated with gout, a painful joint condition that is on the rise globally. Gout occurs when high levels of uric acid in the body begin crystallizing in the joints, particularly those of the feet, causing irritation and inflammation.

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ISSUE 01|VOL 2|JANUARY 2020|BISINFOTECH

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