Bisinfotech Magazine July 2019 by Bis Infotech

Content 10

EDITOR MANAS NANDI manas@bisinfotech.com CONSULTANT EDITOR NILOY BANERJEE niloy@bisinfotech.com

The Internet of Things: Simplifying or Mystifying the User’s Experience?

SUB EDITOR JYOTI GAZMER jyoti@bisinfotech.com MARKETING MANAGER ARNAB SABHAPANDIT arnab@bisinfotech.com DESIGN HEAD SANDEEP KUMAR WEB DEVELOPMENT MANAGER JITENDER KUMAR WEB PRODUCTION BALVINDER SINGH SUBSCRIPTIONS PRIYANKA BHANDARI priyanka@bisinfotech.com MANAGER FINANCE KULDEEP GUSAIN accounts@bisinfotech.com Bisinfotech is printed, published, edited and owned

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IOT COLUMN

INDUSTRY UPDATE 05 Infineon to Buy Cypress Semiconductor 06 TCG Intends to Develop “World’s Tiniest TPM” 07 Analog Devices, First Sensor to Develop LIDAR

ROBOTICS 12 Service robotics and drives challenges

INDUSTRY KART

54 Mouser new Skyworks’ Wi-Fi 6 Front-End Module 55 Rechargeable Li-ion Coin Cell Batteries 55 Avnet Promotes Jessica Daughtee to CMO

TECH FEATURE 20 Thyristors high surge level protection for Smart LED Street Lighting

BIG PICTURE 16 Sai Krishna Mopuri M anaging Director Analog Devices India 23 Tony Ng Vice President|Global Sales Digi-Key 28 Gilles Garcia D irector, Business Development|Communication BU|Xilinx 30 Meenu Singhal VP -Industry Business Schneider Electric-India 36 Hitesh Dharmdasani Director AnexGATE

LED FEATURE 18 Photometry Testing: A Scientific Measurement Methodology of Perceived Brightness of Light to Human Eye

T&M SPECIAL 24 The T&M War-Affair

MARKET GLANCE 42 Global Magnetic Separator Market Report - FMI 43 Consumer Electronics to Propel MCU Market 44 $3Bn GaN & SiC Power Semi Market by 2025 45 Global Automotive Transceivers Market

A&D 38 The War of Innovations in Defense & Military Electronics

TECH COLUMN 08 How Sensors Can Make Life Safer and More Sustainable

INDUSTRY UPDATES

INFINEON TO BUY CYPRESS SEMICONDUCTOR Infineon Technologies and Cypress Semiconductor Corporation announced that the companies have signed a definitive agreement under which Infineon will acquire Cypress for US$23.85 per share in cash, corresponding to an enterprise value of €9.0 billion. With the acquisition of Cypress, Infineon will consequently strengthen its focus on structural growth drivers and serve a broader range of applications. This will accelerate the company’s path of profitable growth of recent years. Cypress has a differentiated portfolio of microcontrollers as well as software and connectivity components that are highly complementary to Infineon’s leading power semiconductors, sensors

and security solutions. Combining these technology assets will enable comprehensive advanced solutions for high-growth applications such as electric drives, battery-powered devices and power supplies. Reinhard Ploss, CEO of Infineon, said: With this transaction, we will be able to offer our customers the most comprehensive portfolio for linking the real with the digital world. This will open up additional growth potential in the automotive, industrial and Internet of Things sectors. This transaction also makes our business model even more resilient. We look forward to welcoming our new colleagues from Cypress to Infineon.” Combining Infineon’s security expertise and Cypress’s connectivity know-how will

accelerate entry into new IoT applications in the industrial and consumer segments. In automotive semiconductors, the expanded portfolio of microcontrollers and NOR flash memories will offer great potential, especially in light of their growing importance for advanced driver assistance systems and new electronic architectures in vehicles. Further, with the addition of Cypress’s strong R&D and geographical presence in the U.S, Infineon bolsters its capabilities for its major customers in North America along with other important geographical regions. The company adds to its R&D presence in Silicon Valley and gains presence, as well as market share, in the strategically important Japanese market.

SANAN IC EXPANDS WAFER FOUNDRY PORTFOLIO

ST EXHIBITED AT MWC SHANGHAI 2019

SANAN INTEGRATED CIRCUIT (Sanan IC) announces the commercial release of its 150mm gallium nitride (GaN) on silicon wafer foundry services. The new 150mm gallium nitride (GaN) on silicon wafer foundry is established for the latest high voltage AC/DC and DC/AC power electronics applications in the global market. Sanan IC’s new G06P111 is a 650V enhanced-mode high-electron-mobility transistor (E-HEMT) GaN process which adds to the company’s power electronics wafer foundry portfolio of wide bandgap (WBG) compound semiconductors. It includes 100mm and 150mm silicon carbide (SiC) for high voltage Schottky Barrier Diodes (SBD). Leveraging years of high volume GaN manufacturing experience by Sanan Optoelectronics Inc., its parent company, for the LED market, Sanan IC is able to complement its foundry services with in-house MOCVD growth capabilities of high voltage, low leakage GaN-on-silicon epitaxial wafers with high uniformity. “The launch of our 650V GaN E-HEMT process technology exemplifies our commitment to advanced compound semiconductor manufacturing for serving the global market”, said Jasson Chen, Assistant General Manager of Sanan IC. “We view GaN-on-silicon as a complimentary technology to silicon carbide as key wide bandgap semiconductors of choice for today’s high voltage, high power electronics industry. Component suppliers and system designers are migrating to wide bandgap semiconductors over traditional silicon for enhanced performance, efficiency, and reliability in high power analog designs. Sanan IC is well positioned for success in serving this high growth, large-scale power electronics market”.

STMicroelectronics will be a part of the Mobile World Congress (MWC) Shanghai 2019 to be held on the 26-28 June. ST’s theme being “If it’s smart, we’re there,” the company will showcase some of its industry-leading products and solutions for IoT and Smart Driving, addressing Sensors, AI & Processing, Connectivity, Security, Automotive, and Analog & Power. • Sensors • I & Processing • Connectivity • Security • Automotive • Analog & Power Other ST solutions on display at MWC Shanghai 2019 include: ST60 mmWave wireless short-range, low-power highbandwidth transceiver, dual RF development board with BLE and sub-GHz, in-vehicle monitoring, ST25 Series NFC tag and reader, ST21NFCD, ST53, ST54 and ST33 eSE/eSIM, smart power supply, and a wide range of the STM32 MCU and MPU (microprocessor) devices.

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INDUSTRY UPDATES

TCG INTENDS TO DEVELOP “WORLD’S TINIEST TPM” Trusted Computing Group (TCG) announced to launch a new project to create the “world’s tiniest Trusted Platform Module (TPM)”. Many manufacturers want to build devices that include Roots of Trust for Measurement (RTM), Storage (RTS) and Reporting (RTR) so that these devices can work securely within the TCG Measurement and Attestation framework. Today, TPM chips are used to implement the RTS and RTR in a highly secure manner. As IoT adoption continues to grow, a rising number of devices are so small that the inclusion of a full TPM chip might be impractical due to factors such as cost, space and power. TCG’s new Measurement and Attestation RootS (MARS) Subgroup has been formed to develop specifications that will enable manufacturers to build compliant chips with very little overhead for them and their customers. “In a nutshell, we want to specify what the tiniest TPM needs to be so it can be

integrated directly within the host chip. This will ensure that devices that aren’t big enough to integrate a separate TPM will still be able to retain the required RTS/RTR capabilities. In turn, this will allow greater reach of trusted computing technologies over a wider set of devices and use cases”, said Tom Brostrom, Chair of the MARS Subgroup. The first prototype for such a TPM was exhibited during TCG’s members’ meeting

held in Warsaw, Poland. The team also agreed on the scope of its work, which will focus on the hardware requirements necessary to control and operate the primitives supporting the RTS and RTR, and the software API to access them. A number of TCG’s other ongoing projects were also progressed during the members’ meeting, including work on specifications for secure software and firmware updates for embedded systems. Security in the Internet of Things (IoT), including industrial applications and the automotive industry was another key focus. Dr. Joerg Borchert, President of TCG, said, “As an international standard, TCG’s TPM is widely deployed and a proven solution. This makes our technologies ideally suited to deliver on the new security needs emerging as we move towards a world where everything is connected. The work undertaken at our latest members’ meeting will ultimately deliver the specifications needed to achieve this.”

WHY COMPANIES LIKE QUAL- TE MAKES ACQUISITION OFFER COMM INVESTING INTO SIFIVE TO FIRST SENSOR

Qualcomm Ventures is the newest investor in SiFive, the RISC-V processor IP startup. The investment of Qualcomm is aimed to unearth the potential of the RISC-V architecture in wireless and mobile. SiFive announced it raised $65.4 million in funding, with another $11m for its Chinese sister company SaiFan China. SiFive also said it has achieved its 101st design win. The company is claiming it has significant traction in embedded markets as device manufacturers rapidly adopt domain-specific application processor designs to enable efficient computing in edge devices. It puts this down to the scalable capabilities of RISC-V that enable semiconductor companies to move through the selection, customization and enhancement phases of designs in just months. Qualcomm’s participation in SiFive’s latest funding round attracted notice since the wireless chip maker is a long-time customer of Arm. “SiFive has established itself as a leader in the RISC-V space, making significant contributions to the broader semiconductor industry through its unique design methodology,” said Quinn Li, who heads Qualcomm Ventures. The company had already raised $50.6 million in April 2018, though not all the investors from that round came in again on this latest round – notably Western Digital Capital, Samsung Venture Investment and Intel Capital.

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TE Holding and TE have also entered into a business combination agreement with First Sensor which outlines the key parameters that will strengthen their combined position in the market of sensor technology. Further, TE Connectivity has announced decision to make offer for all outstanding shares of First Sensor AG. The acquisition aims to extend TE’s global leadership in highly engineered sensors, particularly in industrial, medical and transportation applications. Upon completion, the transaction would bring together First Sensor’s solutions, including lowpressure sensing and photonics, with TE’s operational scale, customer base and existing sensors technologies into a more comprehensive global sensing solutions offering for customers. “Adding the First Sensor portfolio and customer set to TE’s already extensive sensors offering will provide additional application solutions in key growth industries,” said Terrence Curtin, chief executive officer of TE Connectivity. “The business combination agreement announced today with TE represents an exciting new chapter for First Sensor, allowing our market-leading portfolio to be part of a larger, more integrated offering available to a deeper and broader customer pool, ” said Dr. Dirk Rothweiler, chief executive officer of First Sensor AG.

INDUSTRY UPDATES

ANALOG DEVICES, FIRST SENSOR TO DEVELOP LIDAR Analog Devices has collaborated with First Sensor AG to develop products and solutions aimed at speeding the launch of autonomous sensing technology serving unmanned automotive, aerial and underwater vehicles in transportation, smart agriculture, industrial manufacturing and other industries. As the terms of the agreement, Analog Devices and First Sensor are developing offerings that shrink the LIDAR signal chain to enable higher system performance as well as reduce size, weight, power and cost for manufacturers designing sensing and perception technology into their autonomous safety systems. The companies also plan to develop other LIDAR products that will serve automotive and industrial manufacturing applications. “The first step in our working together is to optimize ADI’s industry leading transimpedance amplifiers (TIAs) with First Sensor’s avalanche photodiodes (APDs) so we can offer our customers more powerful and efficient LIDAR solutions, and better support the mass

commercial launch of LIDAR systems into the autonomous transportation market,” said Stewart Sellars, general manager, LIDAR, Analog Devices. Having years of experience, ADI has been developing sensor technology for transportation safety. Recent developments include multi-channel TIAs specifically designed to convert wide dynamic range photocurrent into a low-impedance voltage signal. First Sensor’s LIDAR APDs, are highly sensitive

detector arrays that convert light into photocurrent. Optimizing the interconnection between the APDs and TIAs is critical as it significantly influences the noise floor and bandwidth achieved. Improvements in these two parameters directly translate to LIDAR systems which can detect objects at longer range and with higher precision, said Analog Devices. Dirk Rothweiler, CEO of First Sensor, added, “Adapting APDs and TIAs to each other is a logical next step in this evolution. By expanding our cooperation with Analog Devices, our customers will benefit from better LIDAR receiver performance.” First Sensor and Analog Devices will each offer a common evaluation board with which system manufacturers can test the combined solution. This partnership marks Analog Devices’ next phase in implementing its Drive360 autonomous driving solutions strategy. ADI’s Drive360 suite of technologies leverage ADI’s core competencies in high performance MEMS, RF/mmWave, and photonics/optics technologies.

BMW, JLR TO DEVELOP ELECTRIC CAR COMPONENTS

INTEL ANNOUNCES NEW CHIEF PEOPLE OFFICER

BMW and Jaguar Land Rover have announced plans to jointly develop electric motors, transmissions and power electronics. The partnership aims to lower the costs of developing electric cars. This announcement comes aligning with the trend of global automakers deleveraging the cost of developing new technologies in today’s age of high paced technological advancements. The technologies currently have become outdated far quicker than in the past, limiting the time frame for carmakers to amortize their R&D costs. In face of this, manufacturers are increasingly pursuing collaborations and joint ventures to not only split the costs of development but also advantage from the economies of their combined scale. The agreement between the two carmakers will enable both BMW and Jaquar Land Rover to take advantage of efficiencies arising from shared research and development and production planning as well as economies of scale from joint procurement across the supply chain. Nick Rogers, Jaguar Land Rover’s Engineering Director, said, “The transition to ACES [Autonomous, Connected, Electric, Shared] represents the greatest technological shift in the automotive industry in a generation.

Intel’s Sandra Rivera will take on a new role as the company’s Chief People Officer and Executive Vice President replacing Matt Smith and reporting to CEO Bob Swan. Riviera wil further lead the human resources organization and serve as steward of Intel’s culture evolution as it transforms to a data-centric company. Previously, Rivera was responsible for the Network Platforms Group, and served as Intel’s 5G executive sponsor. I am confident Sandra, as chief people officer, will help us accelerate our transformation and position our Intel team to play a bigger role in our customers’ success”, added Bob Swan With Rivera transitioning to her new role, Intel will combine its network infrastructure organization with its programmable solutions organization spearheaded by Dan McNamara. Commenting on her new role, Riviera said, “Our people are our greatest asset and are the fuel by which we extend our rich history and success of driving technology innovations that positively impact the world. The culture evolution work that we’re driving forward is integrally tied to our business transformation. You can’t have one without the other.”

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TECH COLUMN

How Sensors Can Make Life Safer and More SustainableÂ

YOSHINORI MATSUMOTO

IEEE Member and Professor, Department of Applied Physics and Physico-Informatics|Keio UniversityÂ

Current cities get their supplies of food, water and electricity from the outside, then send large amounts of waste to be disposed of outside as well, which is not a sustainable cycle. Smart cities need to at least try to save some energy and recycle things for the environment, and smooth traffic using the IoT. Stoppage of lifelines due to natural disasters like major earthquakes is a constant threat. City life is also in danger of collapsing if water resources or food supplies are exhausted due to societal or environmental changes. It is important to prepare the environment and infrastructure in other viable regions so that people can escape from cities during emergency situations.As abandoned cities in ancient civilizations show, cities sometimes cannot survive as conditions change, and that makes it important to have a plan. We should face the facts that the current sensitive supply of food and water with petroleum as our main fuel source requires serious planning on how to maintain our communities before we lose them for good. AI sensors have many potential uses in industries such as healthcare and manufacturing where expensive and power-consuming devices are deployed. When it comes to the environment, new uses are still emerging.For example, image sensors with AI that can judge natural phenomena and send results as text are a possibility. We could see prediction/ support systems share environmental

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measurements through the IoT and the cloud, allowing experts in remote areas around the world to incorporate the insights and make decisions. It started when I developed an environmental sensing system that can measure weather, radiation or PM2.5 information using sensor and IoT technology. The data transmits through Wi-Fi or LPWA networks and is collected by a cloud system. The cloud system then analyzes the data using machine learning. I also developed a smartphonetype PM2.5 measuring instrument, which provided real-time concentration readings of particulate matter 2.5 (PM2.5), a dangerous substance that causes various

diseases, with map positioning data.A venture company I knew made them into a product. The staff at the Japan Weather Association saw the product and thought it could be applied to healthcare and environmental measurements in Africa, and that proposition was adopted by the Ministry of Economy, Trade and Industry.Last year, I was asked to support the project as the developer of the sensor and went to Rwanda. There I realized the necessity of inexpensive, low-running-cost devices in developing countries and decided to work on its development, together with the same venture company and the Japan Weather Association.

The Internet of Things: Simplifying or Mystifying the User’s Experience?

MANISH JAIN

AVP &Head of Engineering, Digital Lifestyle Solutions at Comviva

It’s been quite a while since the Internet of Things (IoT) made its debut in the technology space. Since then, of course, it has gained enormously in terms of technology, availability of connected devices and customer uptake. This, simply put, can be attributed to the very real advantage it offers, in terms of transforming the way customers live and work. Now to dive in deeper. Today, the developer has a plethora of technologies and protocols to choose from. The list includes (but isn’t limited to) Zigbee, RFID, Thread, NFC, 6LowPAN, Bluetooth, Z-Wave etc. of course, the choice depends on

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the application itself, in terms of power utilization, battery life, security, data usage efficiency etc. In short, IoT is here to stay. Let’s take a look how…

The Rise and Rise of IoT

Gartner has predicted that the connected things numbers will reach 20.4 billion by 2020 and Internet of things endpoint spending to reach $2925B by 2020. Similarly, IDC has predicted the revenue opportunity of $1.7T for the ecosystem by 2020.

IOT COLUMN

Sounds familiar? If so, then you’re probably an IoT fan already.

But, challenges remain

Constant innovation in wireless technology, reduced costs of manufacturing, changing business models and advancements in security models are leading to a surge in the uptake. Consequently, the world is becoming more and more connected. IoT devices are making in-roads into the lives of people at a speed never seen before. Here’s more data to support the argument. Imagine that if the predictions are correct, you may expect at least 3-4 devices every individual by year 2020. Considering IoT penetration of 40-50%, the devices per actual user may be to the tune of 6-7 But, it doesn’t end here. The question that arises naturally, what is these devices used for? Does one really need these? The answer (in my opinion) is yes to both questions. Here’s the explanation. Today, from the leaders of the technology industry to the startups (yes, even start-ups) are feverishly working on IoT-based applications. The bottom-line, of course, is to net customers by offering never-seen-before innovations. The basic idea is to change the method of how to access devices that have been around forever. At the top of the list (in my opinion) include smart homes, smart cities, connected cars, connected health and wearables. Of these, smart homes top the pecking order. This is a reality today, no matter which domain one considers. Here’s whyit offers multiple benefits. The user can control their home appliances (or “things” in the Internet of Things) by a mere click on their handheld devices. This entails switching the devices on or off, monitoring ongoing activities, using smart assistants to control devices, et all.

However, there exists fine print-like all technologies, really. While there is no argument that IoT devices are steadily making their presence felt in the everyday lines of customers, things are getting increasingly complicated. Permit me to delve deeper into this. Is one usually aware of the number of applications on one’s mobile device? Now to stretch the argument a bit-can one usually define a timeframe of how long the applications have been on the device? Or, for that matter, how long they are likely to stay? Interestingly, keeping and discarding applications on one’s mobile device is based on several factors. For instance, it may be difficult for the user to juggle between the multiple applications on their device. Or, simply put, to conserve the device’s memory and battery life, to limit the number of notifications received, the list is endless. Currently, the model for IoT devices entails every device manufacturer providing their own application for controlling appliances. So, assuming one purchased a smart bulb from vendor A, then one would need this vendor’s application to control it. The result? An unwanted overhead on the customer, as they would not only have to juggle multiple applications but remember which application controls what. So, dear reader, is one’s life simplified or further complicated? So is there a solution…. The solution is to opt for a model that aggregates the devices for the consumer. The device manufactures should congregate on a common platform, so that multiple devices can be controlled from a single common user interface, or, a common application for the devices. This would entail providing customers with the option of adding, configuring and controlling the devices in question. From a single place, of course!!! Manufacturers can, needless to say, continue with their business. The difference would result in providing the devices at the same time and on a common platform. Now, put this in context of the issue posed in the challenges section. Isn’t this, by all means, a doable solution? Creating a win-win for customers?

To Conclude

In my opinion, the model ought to do wonders for the uptake of IoT, in the future. Not that the future was in any doubt, it’s just that this would definitely streamline the entire process, do good to all parties involved and provide a fillip to IoT start-ups.

About the Author

Manish Jain, AVP &Head of Engineering, Digital Lifestyle Solutions at Comviva. Manish brings to the table over 17 years of work experience in the telecom value added services Industry, spanning research and development projects and product conceptualization and development. A core techie at heart, he has filed for over 20 patents that include inventions around network nodes and handset-based solutions and finance. He holds a bachelor’s degree in Electronics and Communication from Delhi College of Engineering, as well as an MBA in Operations.

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and drives challenges

Service robotics

ROBOTICS

A look into power MOSFET and package technologies for best performance of drives in service robotics applications 12

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ROBOTICS

Robotics is undergoing a phase of accelerated growthin the industrial and consumer segments across the globe due to factors such as market readiness, technology maturity and delivered value.Semiconductor firms are introducing advanced technologies for robotics to meet this growing demand. New power semiconductors allow more effective, reliable and multi-dimensional service robot designs. Service robots are highly complex systems. They stress the boundaries of ever compact designs with high efficiency and reliability. These robots are as small in size as robust in technical parameters and requirements. To meet customer expectations, one needs to take into consideration a multitude of design factors like energy efficiency, as well as long life batteries, small form factor and excellent thermal management of the hardware. Other consumer priorities may include the software element for connected service robots data protection, authentication and authorization. Oftentimes, the success of a robotics project hinges on the availability and scalability of the required semiconductor solutions.In this article we discuss the use cases and benefits of different drives technologies for robotics with a special focus on MOSFETs, packages, as well as high switching frequency solutions such as gallium nitride (GaN).

System architecture in service robotics

The most common architecture for robots features all or a portion of the following components: a central processing unit (CPU), battery management unit and chargers, power management unit, wireless communication (COM) modules, sensors and drives modules (brushed and brushless motors), as well as ongoing human machine interface (HMI). The main CPU acts as the central brain and carries most of the intelligence of the system. This processor is responsible for the system coordination and commands different modules to execute their tasks in a scheduled and independent way. The remaining modules execute instructions, and report status back to the main CPU.

Figure 1: Common robotics system architecture block diagram

Most service robots are battery-driven to ensure flexibility in their movements. These robots feature on-board charger enabling direct connection to the AC grid. In these cases, a charger is included in the robot to generate a high voltage DC level that the power management unit will process further down. Increasingly, there is a growing trend to develop and utilize wireless charging capability in robots that are required to work continuously,so that it can charge even during performance. The battery management unit takes care of the battery’s overall condition, including health and safety aspects, and also protects it against system overvoltage or overcurrent. In the battery module, security – including authentication– is a key factor to be considered. Batteries also rely on general purpose microcontrollers to implement auxiliary functions like metrology or monitoring. A power management unit supplies power to the different components in the robot by controlling the required voltage rails – 12V, 5V or 3,3V – in a stable manner for the rest of modules. It is possible with buck converter controllers or linear regulators – fixed and adjustable. Robots are being increasingly equipped with wireless communication modules, generally conducted over Wi-Fi or Bluetooth,to link them to other systems such as other robots or control units that command complete robot fleets in real time.In many cases, a local controller is responsible for the communication process, working as a gateway between the robot’s main controller and the external world. Sensors can bring added value to service robotics designby enabling a more precise understanding of the environment, which is especially useful when the robots are deployed in complex environments such as a crowded warehouse. Commonly, position sensors (Hall sensors, encoders), speed, angle or current sensors are used in drives. Other types of sensors such asradar sensors for motion sensing (distance and direction), barometric pressure sensors or 3D image sensors for object recognition may be added to boost the robot’s autonomous capabilities. Depending on what the design requires, the drive module can be composed ofa brushless DC (BLDC) motor, a brushed motor or both.The designer willchoosea BLDC motor together with a set of position sensors when accurate positioning, high speed or quiet operation are required. When alow performing motor control (slow, low accuracy) is sufficient, a brushed motormay be usedto reduce the cost of the overall design.A combination of both brushed and brushless motors can co-exist in certain robotics applications to meet the performance and cost efficiency goals at the same time. Robots are also expected to have an ongoing interface with humans. In cases where information or feedback is required to be shared with the user, human-machine dialogue can be achieved with either a simple or a highresolution display, at times also by using LED lights. To augment this human-machine interface, the service robot can be equipped with voice input and output devices to enable it to interact verbally with the user. Now that we have briefly understood the main technological

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ROBOTICS

structure behind service robots, in the next section we will explain how conduction losses affect the overall performance of a robot and what semiconductor solutions and technologies are available to counter these losses.

How to reduce switching and conduction losses

To reduce power losses, battery life can be optimized through more efficient robot drives.In drives applications, both conduction and switching losses are in the focus. In an effort to make lives easier and safer, Infineon has been innovating continuously to improve figures of merit of MOSFETs with special focus on reduced RDS(ON) (drain to source ON resistance) and gate charge (capacitance) of the MOSFET, minimizing both types of losses from one generation to the next. Different losses are observed depending on the control method. When synchronous rectification is used, the low-side MOSFETs are turned on if the current freewheels through their body diodes. This dramatically reduces the conduction losses of the body diode (PLoss = IF x VF) as the RDS(ON) value of the MOSFETs gets lower and lower with new generations; however, the low-side diode is still one of the main sources of losses. To address this issue, Infineon has developed MOSFETs with integrated Schottky diodes that reduce the forward voltage, therefore minimizing the power loss in the diode. These products are referred to as OptiMOS™ FD (Fast Diode) and can be identified by the suffix –LSI, e.g., BSC010N04LSI.

role in both high-side (‘HS’) and low-side (‘LS’) MOSFETs. There are three main findings related to this figure: 1. Switching losses are negligible in the low-side MOSFET as soft-switching is granted. 2. The most dominant source of losses is the conduction loss in low-side diode. 3. Infineon’s LSI (Fast Diode) version of MOSFET with integrated Schottky diode reduces the conduction loss by approximately 25 percent. This reduction depends on system conditions such as current level. Switching losses are strongly connected to switching frequency; the higher the switching frequency, the higher the losses. Common frequencies in robotic inverters range from 10 kHz to 40 kHz. Infineon’s best-in-class OptiMOSsolutions offer low RDS(ON) and low-charge MOSFETs to significantly reduce both types of losses. It is important to note that losses are inevitable and heat is always produced in the power switches. Because of that,thermal management is one of the key challenges in drives designs, especially in high power density devices such as those found in small robotic arms.Infineon’s DirectFET™ packagesare dual-side cooling packages with direct connection between the metallic package and the silicon die inside that directly connected to the PCB on the bottom side, minimizing thermal resistances to the exterior. These packages efficiently spread the heat from the junction to the bottom of the PCB, and from the top through the metal package into the air or an optionally used heat sink for more rigorous cases. In addition to its extra low profile, this package is the perfect choice for space constrained designs. Figure 3 shows a comparison of thermal resistances between DirectFET and D2Pak packages. DirectFET has less than half of the thermal resistance of D2Pak (8.1°C/W as opposed to16.8°C/W).

Figure 2: Power loss breakdown showing conduction (‘Cond-‘) and switching (‘SW-‘) losses in high-side (HS) and low-side (LS) MOSFETs as well as body diode (D) losses. Conduction of low-side body diode is dominant and can be reduced by usage of LSI parts.

Figure 2 shows a power loss breakdown measured in a three-phase inverter using block commutation PWM (6 steps) with synchronous rectification. The supply voltage is 18 V and the selected MOSFET for the comparison is BSC010N04 in both LS and LSI versions. The candle diagram clearly shows that both conduction (‘Cond-‘) and switching (‘SW-‘) losses have an important

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Figure 3: DirectFET™ packages allow optimized thermal design in high density drives. Comparison of thermal resistances between DirectFET™ and D2PAK packages

ROBOTICS

High switching frequency drives solutions

Engineers can benefit from using gallium nitride (GaN) devices in their applications. Several GaN attributes make it a perfect choice for high switching frequency power applications:lower on-resistance resulting inlower conduction losses than silicon alternatives, less capacitance resulting in less switching losses, as well as improved body diode reverse recovery. Increasing the switching frequency can help improve a drive’sperformance, for example by reducingthe torque ripple. In other applications such as power supplies, this technique can also be used to effectively reduce the size of magnetic components. As the switching frequency increases, controllers have to be adapted. PWM resolution must be considered to ensure that the complete loop can stay under the required accuracy. Infineon offers microcontrollers like XMC4100 family with high resolution PWM modules for such high resolution loop purposes.The processing capability of the microcontroller must also be considered when switching frequency increases. Assuming a cycle-by-cycle control, less time is then available to finalize new duty cycle calculations. Infineon offers a broad portfolio of controllers with wide range of performance, from XMC1000 family ARM®-Cortex™-M0 at 32MHz to XMC4000 family ARM®Cortex™-M4F at 144 MHz, as well as AURIX™ when higher level of functional safety and performance is required. Increasing the control loop execution frequency leads to better dynamics of the motor, resulting in more accurate control.

of control loops in XMC1000 family compared to standard implementation (hardware versus software calculation). Figure 4 shows a comparison of the execution time of cosine and division functions often utilized in motor control algorithms such asfield oriented control (FOC).

Summary

In order to develop the next generation of robotic solutions and devices, engineers need to work around the design parameters of drives.There is a choice of different semiconductor solutions from which they can choose tofine-tune their designs. The technical parameters such as switching frequency and thermal resistance of end products set the requirements for drives. To build a welloptimized system, designers have to minimize the losses – both conduction and switching losses – and optimize thermal management. MOSFETs with integrated Schottky diodes can reduce the forward voltage, resulting in minimal power loss in the diode. Engineers can also take advantage of new package designs like DirectFET that offer optimized thermal management.New wide bandgap solutions like GaN devices will establish the foundation of higher switching frequency drives. For Infineon’s A-Z service robotics product offeringof more than a hundred productsincluding drives and robotics related solutions, please visit www.infineon.com/servicerobotics.

Author bio:

Pablo Yelamos Ruiz holds a Bachelor degree in Electronic Engineering. He joined Infineon Technologies in Munich as an application engineer for the XMC™ microcontrollers specializing in motor control and digitally controlled SMPS. After more than 10 years in Munich, he moved to Infineon in El Segundo, California, to work as Power Management Application Engineer with a focus on battery powered drives such as power tools, robotics and drones. Today he manages the Application Engineering group for battery-powered drives. Prior to Infineon, he worked as an analog designer for Qimonda with focus on DRAM and Flash memory products.

Figure 4: Normalized execution time for cosine and division functions with a standard ARM® Cortex™-M0 without MATH co-processor (Standard) and with XMC1300 utilizing the integrated MATH coprocessor and DIVIDE unit.

Infineon’s product offering also covers a special MATH coprocessor (including both a CORDIC unit for trigonometric calculations and a division unit) dedicated to motor control calculations. This co-processor reduces the execution time

PABLO YELAMOS RUIZ

Application Engineer, Infineon Technologies AG

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ANVESHAN IS NOT JUST ANOTHER DESIGN CONTEST OR HACKATHON

Anveshan is not just another design contest or hackathon. It is a program designed to bring out and support innovative engineering and business ideas that solve real world problems by enabling academic and industry partnership cited Sai Krishna Mopuri, Managing Director at Analog Devices India. Niloy Banerjee from BIS got alongside veteran Mopuri who further underline on ADI’s flagship Anveshan Fellowship program, this year’s focus and it has been pinnacle in abridging industry-student gap and help propelling innovation for a better society and living. Edited Nub.

Sai Krishna Mopuri Managing Director |Analog Devices India

How is the Anveshan program propelling the Indian Engineering Students Community? Anveshan fellowship provides a platform for the Indian Engineering Students Community to pitch, develop and prototype their innovative engineering ideas. This is an outreach program open to the students of all engineering colleges across India. With technical and financial support from Analog Devices, students stand to gain from their interactions with the industry experts while still in their academic institutes. They gain access to Analog Devices’ products and tools which gives them ammunition to solve real-world problems using readily available technology from ADI, the global leader of analog, mixed signal and DSP integrated circuits.

There is a talent pool gap between the academics and the industry, how does Anveshan fill this gap? Engineering design contests, product contests, hackathons, coding challenges, etc have multiple objectives and the important among them is to identify and reward distinguished talent. A true engineer is expected to possess not only the theoretical knowledge, but also know how to use that knowledge to solve real world problems. While our education system needs sweeping changes to bridge the gap between academic and industry perspectives, programs such as Anveshan help in that direction albeit in a small way. By reaching out to the engineering institutes across the country, small and big, we try to provide equal opportunities to every engineering student of this country. Success of Anveshan comes from strong support, collaboration and cooperation from academic institutes and How can an engineering student participate in this flagship the student engineering community. fellowship program and what does he/she take back How can Anveshan Design Fellowship play thought from this program? leadership initiative to encourage young minds If you are a student of any engineering college in India, you can participate in the Anveshan fellowship program by first Anveshan encourages students to think of problems / ideas that identifying a problem in the areas suggested in Anveshan have social impact, to study existing solutions, and challenges website, form a team with your fellow students, write and submit them to prove uniqueness of their solution. The screening

What differentiates the Anveshan Program from other fellowship programs? Anveshan is not just another design contest or hackathon. It is a program designed to bring out and support innovative engineering and business ideas that solve real world problems by enabling academic and industry partnership. In this program students are paired with technical experts from Analog Devices to help review, refine and realize their ideas. Students are provided necessary technical tools and financial assistance during the fellowship. The students and the mentors work together collaboratively as a team. Students are encouraged to think ‘innovation with impact’ as opposed to ‘innovation in isolation’.

your project proposal on the Anveshan website. Once your proposal is selected for funding, you will be assigned a mentor or two to guide you as you develop your solution. The details of the fellowship program, submission procedures, guidelines and timelines are provided in the Anveshan website. A participant in Anveshan gets opportunity to put his/her academic learnings into practice. A student gains full circle of knowledge by combining the two half circles of knowledge, theoretical and practical. Working with experts from Analog Devices, students develop industry connections, get testimonials and recommendations, enhance chances of getting jobs or starting own ventures.

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process evaluates business potential, value capture, and strategic thinking in the submitted proposals. Experienced mentors guide the young innovators to identify techniques and tools to achieve an efficient and cost-effective solution, to identify and build a team that has right skillsets, to know their customer, to analyse business and go to market strategies, and so on. During the fellowship period, a young innovator is guided to think of his/her solution holistically from all aspects of engineering, business and social impact.

What has been the major focus of Anveshan 2019 and how many states / cities have participated this year? Anveshan 2019 was about challenging the students to design the future which will have a societal impact for India. The main focus was to come up with innovative and smart solutions in Healthcare, Agriculture, Sustainable environment, Industrial automation, Renewable energy, and Smart transportation. This year, the students were also encouraged to design more around ADI platforms to bound the time to a successful Minimum Viable Product or MVP. Students from 12 States 35 cities participated in Anveshan 2019.

How is the presence of ADI and its operations in the Indian market? ADI has been in India since 1995. ADI’s engineering teams in India develop diverse technologies and products that provide signal processing solutions in multiple end markets including industrial, automotive, communications, consumer and healthcare. We design Digital, Analog and RF integrated circuits, develop software and systems to solve toughest engineering challenges for our customers. Our engineering teams have full product ownership and comprehensive capability to develop products from ideation to production. India has great engineering talent and ADI has successfully tapped into that talent over the years. ADI India is a key and strategic offshore facility for Analog Devices.

As an engineering professional with over 25 years’ experience in global semiconductor industry, I see bright future for India semiconductor industry. The future of India tech industry depends primarily on the student talent and attitude.

Over the years, what kind of encouragement and involvement have you witnessed of engineering students in Anveshan? In the first edition of Anveshan in 2012, we had participation from a few premier Engineering institutes. Over the last few years we have seen the participation surge and it is exciting to see entries from many parts of India, especially from colleges in tier2 cities and towns! The complexity of the problems that students choose to address has also seen a big leap. Students who have got the Anveshan exposure share their experience with their juniors leading to repeat entries from many colleges over the years.

on society and business, use of Analog Devices products and technology, effectiveness of the solution, completeness of the solution, minimum viable product or working prototype, how the team presented and demonstrated, and so on.

What are the different criteria’s under which the teams will be judged? We look at multiple dimensions in evaluating the teams and their ideas. The criteria starts from the relevance of the problem chosen by the team, exploration of existing solutions, innovation and uniqueness of the proposed solution, impact of the idea

Lastly, you being a techhoncho what are your golden words for the budding engineers and the Engineering community of India? As an engineering professional with over 25 years’ experience in global semiconductor industry, I see bright future for India semiconductor industry. The future of India tech industry depends primarily on the student talent and attitude. My advice to the budding engineers is to stay focused on learning and develop deep technical expertise, especially in the formative years of your career. Attitude and approach to innovation is very important. Keep up with fast paced technology trends and never stop learning. Be a student forever, be inquisitive, be open and flexible. Don’t be afraid to make mistakes but own up to them and learn from them.India got the most precious asset – the people with great engineering talent. As an engineering community, we need to challenge ourselves to move up in value stack and provide strong technology & global leadership. This is good time to be in technology sector as we see strong growth and great prospects for Indian and multi-national technology companies.

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Photometry Testing A Scientific Measurement Methodology of Perceived Brightness of Light to Human Eye

SAURABH SRIVASTAVA

Manager - Business Development, Products|TÜV Rheinland India

The measurement of quality and quantity of light absorbing analyte in a solution is the basic principle of Photometry technology. This technologydescribes the process of safety measures which is observed in performing reproducible measurements of total luminous flux, electrical power, luminous intensity distribution, and chromaticity, of solid-state lighting (SSL) products for illumination purposes under standard conditions. It covers LED-based SSL products with control electronics and heat sinks incorporatedin those devices that require only AC mains power or a DC voltage power supply to operate. It also covers SSL products in a form of luminaries (fixtures incorporating light source) as well as integrated LED(Light Emitting Diodes) lamps.To ensure safety, manufacturers are now accountable for delivering products and components

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with the right photometric properties. For example, to manage a building, warehouse, or any large facility, we need to understand the benefits that indoor lighting can bring. Conventional lights waste a lot of energy that is dissipated as heat instead of light. LED lamps are the latest and most exciting technological advancement in the lighting industry. These are small, solid light bulbs which are extremely energy efficient and long-lasting. There are instruments which are used to measure the intensity of lights by comparing between an unknown intensity and a standard or known intensity. It is all about “brightness perceived by the human eye.” Visual brightness of a light source depends on the amount of radiation it emits and on its spectral composition on the visual response function of the observer viewing it. Every

LED FEATURE

working condition of the luminaire, in terms of electrical and ambient temperature measurements. To characterize visual comfort and SSL product performance, total luminous flux, efficacy, luminous intensity distribution data is used to inform a range of other lighting metrics.To compare two different products, parameters such as luminous intensity distribution, Isocandela power, beam angle, LOR andutilization factor table are required. Integratingsphere describes color characteristics,total radiant power (spectral content) of SSL products, from which chromaticity coordinates, Correlated Color Temperature (CCT), and Color Rendering Index (CRI) can be derived. Typically, a product’s Spectral Power Distribution (SPD) is presented in a graph format, which allows the viewer to evaluate the relative amount of radiant power across the range of wavelengths in the visible spectrum (expressed in nanometers, nm), or approximately380 – 780 nm. The photometric test reports can be useful for preliminary product screening. An experienced user will be able to detect potential challenges in terms of uniformity and glare for an appropriate distribution of a specific application. A product cannot be simply characterized as low or high performance. To overcome this gap, geometric parameters, reflectance characteristics of illuminated surfaces lighting software can be used.The data garnered from Photometry testing enables a complete analysis to ensure requirements are fulfilled.

Our offerings

human being has a different visual response. To standardize the process, precise photometry is required. If we think about a manufacturing warehouse, a cricket stadium or a highway or movie theatre, different spaces require a desired level of lighting. With the help of photometry testing, a lighting designer can simulate whether the proposed lighting is delivering the required intensity. The basic photometric data of a luminaire consist of a set of values of luminous intensity in a different direction, produced by direct photometric measurement. Measurement of intensity distribution involves photometric and angular measurements using Goniophotometerunder controlled

TÜV Rheinland offers state-of-the-art testing services to ensure lightingproducts complies with the prescribed safety standards, and are of high quality. We provide a competitive advantage through our neutral and internationally recognized test mark. TÜV Rheinland conducts test on energy efficiency, usability and safety of lighting products, whether lamps, lights, and LEDs are designed for personal or industrial use, with mains power or run on batteries. We provide support ranging from intermediate testing during product development to the international approval of your products. Certification with our test mark enables our customers to access national and international markets quickly. TÜV Rheinland stands for quality and safety for people, technology and the environment. To know more about our services, please visit: https://www. tuv.com

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Thyristors high surge Smart LED St BENOIT RENARD

Thyristors Product Marketing, Discrete & Filter Division, Automotive and Discrete Group.

LED Smart street lights are growing each year asreplacements of incandescent or gas lights. Worldâ&#x20AC;&#x2122;s LED street light installations are progressing from 8 % of total lights in 2013 to a forecasted share of 55 % in 2025 . In India, the potential energy consumption savings on municipal street lighting â&#x20AC;&#x201C; switching

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SIDDHARTH GHOSH

Technical Marketing Automotive and Discrete Group to LED - is more than 8 Terawatt Hours . From this assessment, the Indian government has started in 2015 the Street Lighting National Program (SLNP), to replace old lamp technologies to low consumption LED lights ranging from 18 to 190 W.Today a total of 8 Millionunits has been replaced in the country and more

e level protection for treet Lighting than 35Million units will be installed in the next few years. Mission profile defined by SLNP demands a high-quality LED design, with a minimum50,000-hour life span. The manufacturer has to give warranty for 7 years. To achieve this reliability, several conditions for safety and electric compliance have to be passed. One of the biggest challenge is overvoltage surge withstanding. The minimum mandatory level is 4 kV, required by the Bureau of Indian Standard for classic LED driver, as defined in IEEE C64.41.2-2002. Keeping in mind that street lights are deployed under very harsh environment which is very prone to lightning strikes on the Line,as well as the life expectancy is quite high, so, the drivershould be designed to sustain the stresses it goes through. Typically, 6 or 8 kV surge testis the key recommendation to enhance the reliability of the LED power supply. STMicroelectronics proposes Thyristors SCR-based protection, with improved safety, reliability, efficiency and accuracy versus state-of-the-art solution. Classic strategy in case of overvoltage surge is the crowbar function. Usually, with Metal Oxide Varistors (MOV), the overvoltage is clamped at a specific voltage level, allowing to protect the DC downstream of the application, for example, the MOSFETs of the converter are mainly able to withstand

maximum an 800 V voltage. MOV offers limited reliability in term of maximum acceptable power and repetition.Indeed, MOVs surge capabilityis specified with a de-rating curve of maximum current and number of surges (ageing effect).Above this limit, MOVs show signs of electric failure, with degradation of leakage current and clamping voltage. Once the MOV clamping voltage is below the AC input Line voltage, the MOV is in permanent conduction, leading to device burning. Thereby, the MOV is not recommended in application where high number of high level surges could occur. Furthermore, the high cost of street light module replacement is of course a good incentive to improve this performance. To face the above challenge, STMicroelectronics proposes a circuit able to avoid any risk of MOV burning for safety purpose â&#x20AC;&#x201C; among others advantages. The Figure 1 shows the circuit diagram of the solution based onHigh temperature SCR from STMicroelectronics TN5015H-6I SCR, 50 A / 600 V.In this circuit,the SCR triggers the protection, a TransilTM diode controls protection voltage threshold level, and the MOVabsorbs the surge energy. All are on-the-shelves devices of power electronics.

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TECH FEATURE

Figure 1: High level surge protection circuit (left part) and operation principle (right part)

The operation principle is the following: when a lightning surge is applied to the AC Line, for example a standard 1.2/50 usvoltage wave shape, the voltage is rising quickly across the application DC bus. While the DC voltage stays below the break over voltage of the TransilTM, the SCR remains in OFF-state. Once the overvoltage reaches the breakdown voltage of the TransilTM, the current flows through it and the SCR gate. As soon as this current is equal to the SCR minimum required gate current IGT (15 mA for the TN5015H-6I), the SCR is triggered in ON-state. Then, the overvoltage is applied to the MOV which is able to absorb the extra power from the surge. The overcurrent induced by the stress, defined as a standard 8/20 us current wave shape, flows through the MOV and the series SCR. To withstand such a high current from the stress, the SCR offers a very good robustness to overcurrent, with a specific specified parameter called IPP; for example, IPP = 1500 A for an 8/20 us current shape for the TN5015H-6I. Once the overcurrent is reaching zero crossing, the SCR is automatically turned off thanks to its holding built-in function. The Figure 2highlights the IPP overcurrent surge capability of the SCR TN5015H-6I. The waveform (left part) is the 8/20 us waveform of current through a TN5015H-6I under test. The maximum gate current in this case is 350 mA (zoom at SCR triggering in the right part) and the maximum nonrepetitive rate of current (dI/dt)OC is 250 A/us. The device safely withstands the current stress without any risk.

Figure 2: IPP specification of the SCR TN5015H-6I

Benefits of such a solution are the safety andthe reliability of the system, which can thenfulfill thelife span requirement. In the same time, the solution improves the overall standby

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efficiency of the system and the accuracy of the protection. Safety improvement has been previously demonstrated. If the MOV fails, i.e. if its clamping voltage is abnormally low, there is no risk to have MOV burning as the SCR in series is in OFF-state, blocking the input voltage, thenthere is no current through the MOV. In case of next surge occurrence, the SCR will be triggered by overvoltage through the TransilTM, and the protection will be ON for onlya line half-cycle until the next current zero crossing. It means amaximum conduction of few milliseconds, not enough to burn the MOV. Moreover, regarding reliability improvement, in case oneof the three devices of the circuit is failed separately in short-circuit or in open circuit, the application is still working, ensuring lighting main function to fit the reliability requirement of 50 000 hours of life span. The solution allows a better standby efficiency of the application. Higher is the surge level requirement, the higher is the MOV power ratings. High MOV power ratings induce high leakage current, which impact the stand-by losses of the LED module. Typical leakage current of a 14 mm / 391 V MOV is 1.6 ÂľA, when applying a 320 V RMS input voltage. This leakage current can increase a lot with ageing and number of surges as explained previously. Thus, adding a series SCR allows to limit the leakage current in the MOV at 0.1 ÂľA in the same conditions. It means 16 times less stand-by losses. Of course, as the SCR is a solid-state silicon device, leakage current is more stable and predictable with time than amorphous-state MOV. Finally, the accuracy of the protection is well set-up as the maximum voltage across the LED DC downstream is the breakdown voltage of the TransilTM before SCR triggering, for example 603 V with a 0.8 A current for BZW04-376 TransilTM from STMicroelectronics. The maximum voltage across the downstream after SCR Triggering is the MOV clamping voltage at the overcurrent level. In any case, the voltage well manages accurately to prevent any risk of damage, particularly in case the voltage is higher thanthe rated voltage of the SMPS MOSFETs (Rated VDC in Figure 1). In 2015, Indian government launched a massive project of energy savings in the country. Switching from incandescent or gas lamps to efficient and smart LED lights seemingly proves to save quite few Terawatts hours. In the stringent power line conditions and to make drivers reliable with time, STMicroelectronics proposes high level overvoltage surge protection circuit, based on SCR Thyristors. The high surge current capability of SCR technology, such as TN5015H-6I High Temperature SCR, seems the perfect solution for the over voltage surge condition for the Indian street light, compare withtraditional stand-aloneMOV-based solution. In addition to reliability performance, the solution improves the application safety, protecting from MOV burning. Finally, the circuit also brings benefits of lower stand-by losses and accuracy level for DC/DC devices protection. n

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WE CONTINUE TO PROVIDE 24X7 TECHNICAL SUPPORT, WE ARE ALSO BUILDING AN FAQ DATABASE

While we continue to provide 24x7 technical support, we are also building an FAQ database so we can let engineers teach engineers from around the world. We encourage them to utilize our Technical Forum to find answers, share, and even teach, explains Tony Ng, Vice President, Global Sales, Digi-Key to Niloy Banerjee from BISinfotech. Tony also bears his views on Indian electronic distribution market and how is Digi-Key positioning as a company in this growing indigenous market. Edited Nub.

Tony Ng Vice President|Global Sales|Digi-Key

What according to you (key trends) is driving the current electronic component distribution market?

up the product promotion of large & small component manufacturers who are focusing on technologies and new product development. Contents, inventory availability, ease of purchase, and consolidated global shipment solutions are becoming more and more important.

The new generation of Intel CPUs are creating new demands on laptops, desktops, and even servers. Implementation of 5G infrastructure has started and it will be followed by 5G What has been the key impact of globalization in electronic handsets/tablets and all 5G enabled industrial/commercial distributor industry and how it has changed sales, service applications. Electronic vehicles are also steadily driving the and logistics and way of doing business? demands.

Today, customersâ&#x20AC;&#x2122; are demanding and seeking huge Product life cycle gets reduced and new products are launched amount of technical service and support, how does your more frequently than ever. Manufacturers run into a shorter company ascertain the evolving customer demands? window to get their ROIs. All these make it more important to have the right selection of components at the right quantity Yes, we continue to see engineering inquiries from components when needed. The addition of courier shipment solutions is selection, application of an IC, reference solutions, and also needed on top of the large volume forwarding solutions. even component testing. As an eCommerce leader in the What are your strategies of expansion and reach to the electronics distribution industry, we continue to support (and last mile of every major region? drive from a certain point of view) the digital transformation of technical services. While we continue to provide 24x7 technical support, we are also building an FAQ database Digi-Key has been working with our courier partners on so we can let engineers teach engineers from around the innovative solutions to the last mile delivery to each major world. We encourage them to utilize our Technical Forum market of the world. We continuously drive down that delivery (https://forum.digikey.com/) to find answers, share, and cycle time. In some key markets, we will also be aggressive to have the proper business set up in order to enable that even teach. last mile delivery. How has e-kart or online business impacted the distribution Lastly, how do you see India as a market? market?

Overall, it reduces the time to market (component selection, design, prototype build, and HMLV production needs) and enables the ever-reducing product life cycle. It speeds

Yes, India is a high potential market for our industry. In the short/mid-term, its export business will be positively impacted by the US-China tariff dispute. In the long term, its increasing

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The T&M War-Affair Smaller, more technologically capable military forces, the push to do more with less when it comes to test and measurement are stronger than ever. Logging an overall test and measurement equipment market from USD 25.7 billion in 2018 to USD 32.3 billion by 2024, aerospace &defense is said to be the key catalyst. The global electronic test equipment market for aerospace and defense will undergo significant transformation over the next five to eight years with the advent of new technologies changing customer requirements. Leading A&D vendors are working toward higher frequencies, greater bandwidth availability, and multi-channel solutions and adding functionality to their existing systems. There is also a strong focus on repeatable measurements in these areas. The Industrial Internet of Things (IIoT) or Industry 4.0 and changing customer requirements will lead to the adoption of new business models by test and measurement vendors.Radar and electronic warfare (EW) applications hold the highest market share followed by military communications (public safety and private mobile radio); and satellite and intelligence, surveillance, and reconnaissance (ISR) signals intelligence (SIGINT) applications. Antenna technology has become and continues to remain a dominant segment, with advanced radar systems witnessing greater penetration than in the past. Testing such systems not only requires wider bandwidths, but also high resolution along with lower phase noise, lower pre-dynamic range, and higher signal fidelity. This segment is dominated by major two Test and Measurement players - National Instruments (NI) &Keysight Technologies. BIS strives to script their frame of reference, outlook and expertise in this domain.

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T&M SPECIAL

Architectures for Electronic Warfare (EW) systems With the exponential development in Electronic Warfare (EW) systems, it is imperative to ensure their functional accuracy and reliability,by consistently optimizing the existing Test and Evaluation (T&E) capabilities. The new systems must be equipped to identify and effectively neutralize radar threats with precision. The growing complexity EW environment dictate these systems to seamlessly adapt and respond to cognitive countermeasures while successfully navigating through highfidelity emitters. In order to ensure error-free operations, there is a need to place emphasis on R&D which focuses on efficient system integration, testing algorithms, running simulations with potential effects such multi-reflections and interference. The potential threats in the EW ecosystem can be simulated using an agile signal generator, with multi-interface options, which can ably switch frequencies as well as settle amplitudes.

in radar, electronic warfare (EW), and signal intelligence (SIGNT) are moving to multiple, distributed apertures to deliver higher performance and support emerging beamforming technologies. This requires synchronization multiple RF/microwave channels for communications and sensing.As commercial technologies are adapted for cyber-attacks, every dB of sensitivity counts to improve stand-off range and countermeasures. There is need to improve sensitivity, so you can better monitor the airwaves, intercept, and deflect increasingly difficult to find signals. Make in India in A&D Segment We can witness clear impact of Make in India initiative, with the growing demand for Test and Measurement equipments across the spectrum. We have seen significant growth in handheld equipments as well as high end equipments, depicting activities in entry level manufacturing as well as high cutting-edge R&D and complex workflow manufacturing. With the given trends, we are quite hopeful about the fundamentals getting in place, with clear opportunity of getting them strengthened further. With stable government in place and clear focus on economy boost, we’ll witness the blocks coming in place to make India one of the key global hubs.

Trends in T&M for A&D Evolutions in targets, electronic warfare (EW), and countermeasures require complex signal generation and analysis for advanced simulation and testing of multiple emitters. The challenges in detection, avoidance, electronic warfare and countermeasures evolves as technology advances. There is need for quick adaptation to new, complex threats with scalable signal Flagship Product simulation by creating complex, Few of our flagship products for high pulse density EW scenarios and A&D segment are: simulation of Angle of Arrival (AoA) • N 5193A UXG X-Series Agile and kinematics (moving platforms) Signal Generator – It helps test simultaneously. sooner & increase confidence Keysight solution is a combination in EW systems by generating of UXGs, calibration hardware and signal simulations when needed. Sandeep Kapoor software, along with Signal Studio Moreover, it uses pulse descriptor application software, that has been words (PDWs) to generate long Regional Marketing Head – EMEIA configured to simulate an electronic pulse trains & individually control and India | Keysight Technologies battlefield with thousands of emitters. pulse characteristics. In all cases, the testing of today's systems benefits from high performance test equipment — • N5194A UXG X-Series Agile Vector Adapter 50 MHz to 20 analog and vector signal generators, spectrum analyzers, GHz–It is rapidly adaptable to provide the multiple channel vector signal analyzers, vector network analyzers and more. and port configurations needed and ensures coherency From simulations of an arriving wave front with multiple emitters across multiple sources with calibration of amplitude, phase, to testing of precision components in a receiver, our solutions and time. are ready for the complexity of EW test applications. • Signal Studio for Multi-Emitter Scenario Generation– This Drivers of Current A&D Industry create validated, performance-optimized multi-emitter The growing demand for multi-mission capable Military and scenarios for electronic warfare test from 0 to 40 GHz. It Defense machinery and system electronics require us to define radar emitters in a graphical user interface using deploy complex systems which have a broader bandwidth, parameters such as amplitude, frequency, pulse width, wide frequency range and real-time processing capacity. modulation-on-pulse, PRI, coherent processing interval, Radar systems, communications on the move and satellite and mechanical and electronic antenna scan modulation. innovations are driving the need for higher frequencies and Further, it defines antenna dwells to simulate radars with more bandwidth to support uninterrupted connections. This electronically scanned arrays, combine radar emitters into requires precise measurement, analysis and interpretation of multi-emitter scenarios and automatically computes Angle results in these new spectrum environments.Many technologies of Arrival kinematics.

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T&M SPECIAL

GLOBALLY, A&D AND EVEN SPACE SYSTEMS ARE BECOMING MORE COMPLEX Make in India is a great initiative. The initiative aims to reduce the dependence on foreign technology and products for India’s security needs. In spirit, through this initiative, India wishes to have access to the core enabling IP of the system to ensure safety and security of the system and to modify and upgrade it as and when needed in future.

Tarun Gupta Business Development Manager |Aerospace & Defense - EMEIA| National Instruments

What are the new architectures and capabilities needed What are the key factors driving the current A&D industry to solve new challenges in application areas such as and how is NI aligning to them? Electronic Warfare (EW) systems? • Defense budgets and passenger air travel are at all-time •In this highly complex and innovative area, customer require highs. Investments in RADAR/EW innovation are at all-time things like: highs. The “race to space” is heating up with more and 4 Multi-channel, phase coherent RF measurements in frequency more countries planning manned missions to the moon bands up to 40+GHz and beyond. Space/satellite innovations and the trend 4 The ability to stream large amounts of data across a bus, towards smallsats/cubesats are changing the long standing backplane, or even over the air paradigms of the satellite industry. 4 The capability to perform real time, deterministic, inline • N I continues to invest in and build upon a modular, signal processing on multiple channels in parallel scalable, software-defined platform for the automated 4 T he ability to create or simulate dozens to potentially test and automated measurement of components and thousands of multi-emitter scenarios to test and validate subsystems within aerospace and defense. We deliver RADAR or EW system performance a better, more flexible way for our customers to test and 4 High dynamic range to detect both large and small signals validate the functionality of their mission-critical assets, within a single system ensuring their quality and reliability, and ultimately helping 4 H igh instantaneous bandwidth to be able to monitor, keep our customers on time and on budget. process, and/or create signals across a wide spectrum of What scope does the Indian A&D sector offer to T&M frequencies simultaneously. players today? What are the major challenges in the What are the new trends that you see evolving in space? test & measurement for the Aerospace and Defense Globally, A&D and even Space systems are becoming sector? more complex. These systems work on higher bandwidths, • Digital Transformation – the need to acquire, process, store, are software centric and inter-connected. Such systems and analyze extremely large amounts of data to extract pose significant test challenges to T&M vendors as the insights that will improve operational efficiency, as well as conventional approach of rack and stack instruments with the need to connect and remotely manage dozens to vendor defined measurements is no more relevant. T&M potentially thousands of test assets and systems across the vendors face the same challenges in India as well but with enterprise. an additional fact that defense expenditure in India has • Electrification – the migration towards More-Electric and been consistently growing and there is a significant business All-Electric Aircraft (MEA and AEA), and the associated test opportunity. Big defense programs in India like LCA, AMCA, and simulation challenges. UAV, Aircraft Carrier, AEW&CS, etc. offer lot of opportunities • S tandardization – driving leverage and re-use across to T&M vendors. organizations by standardizing test architectures across Another fact worth mentioning is that Indian A&D and Space divisions, projects, or programs sector is moving towards more indigenous content in systems

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T&M SPECIAL

and control over the IP. This is required of T&M systems as well. There is a growing focus towards instruments that can be programmed by users and the IP retained locally. Finally, Indian A&D research agencies, though working on some cutting-edge technologies itself, is very willing to learn from the best practices followed by T&M vendors in other developed countries like US and in Europe. For example, the standardization initiatives in US have been going on for past two decades and have gone through multiple iterations. Some of those experiences and case studies can be very helpful for Indian organizations.

develop their own test and measurement solutions. We have also invested in developing a local ecosystem of partners to offer turnkey solutions based on open and well published - PXI platform. The IP is developed locally and thus can be modified in future. With this approach we have been gaining traction in many A&D programs for T&M requirements. Ownership of IP comes at a cost. Government must be prepared to offer some competitive advantage to vendors who develop IP locally as compared to foreign vendors who have already recovered the NRE and can offer systems at lower cost. This also means that private vendors may have to work very closely with Government entities and come out After the Make in India campaign, the Indian Government with specifications of systems to be developed. The existing has focused on the A&D segment much more than in procurement procedures do not support such initiatives. the past. How do you see India as a market for your products What is your flagship product for A&D segment? and what, in your opinion, still needs to be done to match Vector Signal transceiver from NI has been doing very the global scenario? Make in India is a great initiative. The initiative aims to reduce well for Indian A&D industry. NI recently launched (release the dependence on foreign technology and products for attached) a Vector Signal Transceiver extending the India’s security needs. In spirit, through this initiative, India frequency range up to 40GHz. With an on-board FPGA and wishes to have access to the core enabling IP of the system Vector Signal Analyses/ Generation Capabilities, this product to ensure safety and security of the system and to modify opens-up several new frontiers for NI. What differentiates this and upgrade it as and when needed in future. This falls in product is its capability to make real-time measurements on line with National Instruments’ approach of Software Defined wideband signals and also run complex models on its FPGAs T&M solutions based on open platforms. We provide our users to simulate real-world operational scenarios for System level open platform and tools to program them, so that they can validation of RADAR and EW systems.

EXPANSION OF VECTOR SIGNAL TRANSCEIVERPRODUCT FAMILY AUSTIN, Texas – June 4, 2019– NI (Nasdaq: NATI), the provider of a software-defined platform that helps accelerate the development and performance of automated test and automated measurement systems, today announced the PXIe-5831 vector signal transceiver (VST) to further address time-to-marketchallengesfor X-band, Ku-band and Ka-band radarand satellite communications (SATCOM) components and systems. As theelectromagnetic spectrum rapidly evolves to keep up with expanding requirements in areas like the electronic battlefield and SATCOM, engineers need to reduce the time it takes to prototype, validate and test radarand communicationsystems at higher frequency bands. The PXIe-5831 VST with modular millimeterwave (mmWave) heads expands the VST product family to provide frequency coverage up to 44GHz. It delivers 1 GHz of instantaneous bandwidth for generation and analysis and features a high-performance FPGA, so users can perform faster and optimized

measurements, inline signal processing and high-speed data transfer. “When the first VST was released in 2012, it revolutionized the way high-performance RF test sets were developed, offering the dependability of calibrated RF measurements, the flexibility of userprogrammable inline processing and the ability to program in LabVIEW or leverage existing VHDL IP,” said Luke Schreier, vice president and general manager of NI’s aerospace, defense and government business. “By extending that capability to even more radarand SATCOM frequencies, we are helping address the schedule, cost-of-test and quality issues inherent in the development of complex transmit/receive systems. As a company, we also gainsignificant technology leverage between these applications and the commercial 5G sectors, which enables us to more efficiently support the product.” The PXIe-5831 combines the PXIe-5820 baseband VST with the PXIe-3622 vector signal upconverter/downconverter for direct RF generation and analysis

from 5 to 21GHz.Modular mmWave heads further expand coverage to include frequencies from23 to 44GHz with integrated and calibrated switching for up to 32 channels. This enablesmultichannel beamformer and phased-array measurements without the need for additional infrastructure. The PXIe-5831 complements NI’s modular instrumentation portfolio of more than 600 PXI products, ranging from DC to mmWave. It also offers NI platform features such as high-throughput data movement using PCI Express Gen 3 bus interfacesand performssubnanosecond synchronization across PXI modules with integrated timing and triggering. Users can take advantage of the productivity of LabVIEW software,the flexibility of the LabVIEW FPGA Module and a vibrant ecosystem of partners, add-on IP and applications engineers. These benefits help them adapt to fast-changing technology and demanding technical requirements so they can deliver new systemson time and on budget.

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XILINX POSITIONED ITSELF IN THE FOREFRONT OF 5G INNOVATION AND DEPLOYMENT This year, during Mobile World Congress in Barcelona (Spain), Samsung announced they were using Xilinx in all their 5G systems which would be deployed in Korea. Conveying the technologies, expertise and market dominance in the 5G market, BISinfotech’s Niloy Banerjee had an extensive chat with Gilles Garcia – Director, Business Development, Communication BU, Xilinx. Garcia shrewdly underlines Xilinx plans for 5G in India, scopes and challenges in the market, their technical expertise and much more during the interview. Edited Nub.

Gilles Garcia Director, Business Development|Communication BU|Xilinx

What are the key focuses of Xilinx in the 5G Domain?

1. Radio / MMIMO 2. Du/CU disaggregation with Acceleration requirements for Virtualization in the CU 3. Baseband with harden LDPC FEC required 4. Fronthaul (Converge access)

What are your specific plans for 5G in India?

with new challenges (latency, Telco-DC, Bandwidth, 5G infrastructure, Converge access) India operator needs to think about the disaggregation / 3GPP Split they want to implement, this would have an impact on the network infrastructure requirement (Fronthaul), as well as in the CU/DU requirements (Servers, acceleration, virtualization). The MMIMO (Massive Mimo) which can be also used in 4G networks to improve the coverage/densification would be a first important step to prepare for the 5G Power of the solutions, fibers to the sites, MMWave to the site without fibers are also challenges/questions that would have to be addressed by local operators. I’m seeing opportunities for local India vendor to innovate and get a larger share into the India 5G deployment to answer all those challenges

We are working with the world leader OEMs and Top India Operators to provide the right platforms an support the to come deployment. Our technology & platform is also used by TOP ‘Start-ups’ driving technology innovation into the 5G Space in India. We have been deeply involved in the 4G deployment in the TOP Leader INDIA operator, we are planning to be part Though most analysts purview that networks of 5G will be of the 5G deployment as well. We have been working very mostly commercialized in 2020 and in the other hand, closely with IITM to jump-start the 5G Testbed installation and deployment so 5G vendors looking for selling / installing their Xilinx has already ready portfolio catering to 5G. What key systems in India would have a specific and centralized test suite market strategies is the company mulling to foray into this market early? and hardware to comply with.

What challenges and scopes do 5G has in this indigenous market?

5G is not a 4G evolution, it is a complete new network architecture,

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Xilinx positioned itself in the forefront of the 5G innovation and deployment, since we have been working for years with top OEMs on their 5G systems and we have been deployed in most (to not say all) Pre-5G deployments. We have been involved

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from the beginning on the 3GPP efforts driving the specs for Xilinx lately collaborated with Samsung helping deploy the 5G. This allow us to have developed 5G Efficient products/ first commercially available 5G NR in Korea, alike this, can solutions (Xilinx UltraScale + Zynq MPSOC& RFSOC, as well as we expect these ecosystems working in India? power efficient, and performance leadership solutions At Mobile World Congress in Barcelona (Spain), February Xilinx is deeply involved with local vendors in India on the 5G 2019, Samsung announced they were using Xilinx in all their space to support the 5G India ecosystem. 5G systems, that would be deployed in Korea. Xilinx is not previewed with TOP OEM plans for India , we are Ou RFSOC device has been receiving innovation award all continuously working with them to improve their solution with over the world for its capabilities, integration and efficiency it our technology is provided for 5G systems (MMIMO, BASEBAND, BACKHAUL) Korean deployment seems to have been a success, so let see how this will pan out in India. Xilinx has moved beyond the Flexibility with reliability is key for traditional FPGA to deliver new 5G, for eg, different standards, flexible, adaptable processors and multiple bands etc are critical. How platforms. What key facets does this will Xilinx solutions simplify these new strategy include? criticalities? Xilinx is always working closely with More standards. More spectrums, more its customers and watching the bands, means more flexibility required market requirements to determine to cope with those requirements. our roadmap. On the 5G market, it This is playing in favour of Xilinx was clear that the market will need Strength (Flexibility, programmability, more ‘integration’, less power, more adaptability. performances, and as such we Our portfolio has been designed to added into our roadmap the Xilinx simplify the life of System vendor by UltraScale+ ZYNQ RFSOC where we doing more integration to remove integrated DAC/ADC, Direct RF, complexity from the system design LDPC & polar code and other wireless (i.e: DAC/ADC integration, Direct RF requirements to deliver the perfect integration…) part for 5G systems from MMIMO (a single RFSOC can deliver a 16T16R How strong is Xilinx partners’ with integrated DAC/ADC, and as ecosystem in the 5G domain? such a 64T64R can be done with 4 chips compare to the 32 chips We have a large and healthy 5G required before). ecosystem partners. At MWC 2019 What will be the next move of Barcelona, we had several Press Xilinx in the 5G business? released with partners (around ORAN, Samsung,…). Xilinx announced last October our Lastly, other chip companies are new Versal family (7nm) 1st ACAP also strongly entering into this product (adaptive Compute market, what will keep Xilinx ahead Acceleration Platform) with new of their competitors and any key capabilities for Wireless (AI Engine), announcements you want to share? that will address the challenge of the beamforming complexity for Competition is always a good sign, example, as well as allowing other this mean you have addressed algorithms to run more efficiently. the right market. Xilinx has a large R&D annual budget to How is Xilinx helping in India to build a sustainable 5G continue to innovate, our Versal 7nm announcement is ecosystem? clearly showing the innovation Xilinx will bring to the market starting late CY19. We are already engaged with Top OEMs Xilinx is deeply involved into the India system vendor ecosystems on this new technology to see how they can leverage it in (Tejas, Mavenir, C-DOT, CoreEI…) as well as software vendors their next-generation systems. like Radisys (now RJIO), Mavenir / Altiostar for the 5G stacks. Our 7nm portfolio that we announced is driving Xilinx leadership Xilinx is also involved with IITM to support the government to in a new era, with an innovative architecture that will bring drive 5G india to the reality (refer to the announcement did innovation to customers for their next generation systems. last year on the TEST BEDs for 5G). Refer to our ACAP announcement for more information.

More standards. More spectrums, more bands, means more flexibility required to cope with those requirements. This is playing in favour of Xilinx Strength (Flexibility, programmability, adaptability).

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BUSINESS AS USUAL SIMPLY WON’T WORK IN THE INDUSTRY 4.0 ECONOMY Business as usual simply won’t work in the Industry 4.0 economy. The hyper-connected world is too fast. We need a new approach — one that promises speed, agility, and the ability to see and address customer problems in a better way , cited Meenu Singhal, VP -Industry Business, Schneider Electric-India. During an exclusive interview, Singhal also slates on how India is preparing for Industry 4.0, strategies and challenges ahead. Edited Nub.

Meenu Singhal VP -Industry Business|Schneider Electric-India

• Big Data Analytics – “Doing more with more”, is essentially what the analytics side of Big Data is all about. The industry has recognized that the sheer amount of data that can be and is being captured needs to looked at in simple and meaningful ways. Really, what value is data if it just sits in a database without providing valuable insight that drives timely business decisions. • Mobility – Technology is becoming increasingly mobile. It only serves to say that the upstream industry that is spread over a significant distance continues to explore any efficiency they might gain through further adoption of upstream mobility solutions. This is driven both by the connection of field devices and equipment as well as the connectivity and enablement of the field workforce. • IT/OT Convergence – The boundary between information technology and operational technology continues to be blurred. This has been going on for several years already within the Oil and Gas sector and will continue for the foreseeable future as the drive to become more efficient with better visibility drives this. This convergence is occurring in the traditional supervisory control and up into advanced process control and optimization.

Five major technological advancements are driving digitization in the industrial sector, paving the way for EcoStruxure: • Connectivity – standards-driven connectivity has allowed for the large-scale deployment of wireless sensors. In addition, the sensors themselves have become much more costeffective. The combination of these two factors is rapidly increasing the deployment of IIoT. • M obility – the proliferation of smart devices means communication has become pervasive. User experiences are easy and rich, and technologies such as user recognition are driving even more efficiencies for industries. • Cloud – sharing data and working at the same time using the same database to improve efficiency where not possible before. Use of the cloud also means that you can manage your facilities and assets remotely from anywhere, and it enables you to acquire the specialist skills you need to run your business, regardless of the geographic location of those skills. • Analytics – the increasing use of analytics in Industry is providing the context and ability for operators to become real-time business decision makers. This resulting optimization can be felt at every level of a company. • Cyber security – with digitization comes an even greater need to safeguard industrial assets. Embedded security

How is India preparing for Industry 4.0 and sectors likely to be impacted by the trend?

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What are the smarter strategies India should adopt for smart manufacturing?

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layers in control, safety, and SCADA systems enable Industry to benefit from mobile and cloud computing.’

economy • Greater business continuity through advanced maintenance and monitoring possibilities How can Indian firms move towards Industry 4.0 – Strategies • Higher quality products as a result of real-time monitoring, Firms should amend? IoT-enabled quality improvement and cobots • Better working conditions and superior sustainability Business as usual simply won’t work in the Industry 4.0 economy. • Personalisation opportunities that will earn the trust and The hyper-connected world is too fast. We need a new loyalty the modern consumer approach — one that promises speed, agility, and the ability Future of Industry 4.0, Smart Manufacturing and Automation to see and address customer problems in a better way. in the Indian scenario? As the world’s first cross-industry open ecosystem, Schneider Electric Exchange takes our long-time extended enterprise innovation to another level by allowing everyone to create, Whether the world calls it Industry 4.0, the Industrial Internet of collaborate, and scale relevant business solutions across industry Things (IIoT), or Smart Manufacturing, the power of technology boundaries. As we know that no company can work in a silo is being felt throughout the industrial world and fundamentally to advance real change. Technology resources, public and changing value chains and production methods. Indeed, so private communities, and a digital marketplace — accessible great is the change that Capgemini Digital Transformation at the same time — bring together a personalized experience Institute predicts that smart factories could add as much as with the collective intelligence of an open community of $1.5 trillion to the overall output of the industrial sector in the solvers, passionate about energy and process automation. next five years. This is because of the turbo-charge effect of Where is the differentiating value? For technology companies, smart technology, which is enabling factories to produce where the ability to scale can make or break a proof of more while lowering costs. concept, the community platform empowers you to broaden While the majority of Indian factories are not 100 per cent your geographic and market reach. For system integrators, Industry 4.0 complaint, many companies are taking baby it connects you quickly to technical resources in a digital steps, and choosing projects that make sense. The reason why workspace. For design offices, you can access reference they are interested in smart factories is clear - the rest of the designs for energy-efficient buildings. For plant and facility world is doing it and India must keep pace being competitive. managers, you can qualify partners to begin work immediately. Lastly, how is your company dressing up for Industry 4.0? For industrial enterprises looking for more productivity and more sustainability, the platform simply brings a vast array of solutions (through connectivity, transparency, traceability, Contributing to Industry 4.0, Schneider Electric’s vision in data sharing and management, the capacity to prevent terms of Smart Automation in India is to transform more than 100 factories into smart factories by 2020, and also ensure issues through asset optimization and management). that 80 per cent of the energy requirement is met through What are the benefits of 4.0 and challenges that the renewables by 2030. industry will face? As a step in this direction, has transformed one such establishment Industry 4.0: the challenges into a green factory by retrofitting and upgrading its existing As Industry 4.0 continues to change the way we interact with facilities with new, tech-powered solutions.Located about an the world around us, new challenges arise. Here are the main hour’s drive from Hyderabad, this is one of the 200 factories challenges you may face in the not so distant future: the global multinational corporation operates. • New (Digital) business models — the definition of a new strategy The company also seeks to facilitate digital transformation of • Revamp needed in organization and processes to maximise industrial automation markets through what it calls EcoStruxure new outcomes architecture, IoT technologies and integration software. • Understanding your business case We strengthened our deliverables around Industry 4.0 with • Conducting successful pilots, be ready for taking risk and acquisition of AVEVA, which adds natural synergies to IIOT failures, Change Gears. platforms for Schneider.The software is integrated with the • Helping your organization to understand where action is machine components that carry out the manufacturing needed process, making it possible for new businesses to automate, • Change management, something that is too often overlooked improve efficiencies and improve profitability. Schneider, which • Shifts around company culture entered India is 1963, now has 24 manufacturing facilities and • The genuine interconnection of all departments employs over 20,000 people. Apart from smart factories, it is • Workforce readiness - Recruiting and developing new talent also looking to engage with Smart Cities projects as it had worked with Naya Raipur (Atal Nagar). Industry 4.0: the benefits The world is witness to a paradigm shift in energy production Similar to digital transformation, the benefits of Industry 4.0 will and management and this has paved the way for the fourth ultimately help a business become smarter and more efficient. industrial revolution. Being a global leader, Schneider Electric is • Enhanced productivity through optimisation and automation committed to investing and creating innovative, future-ready • Real-time data for real-time supply chains in a real-time products that can meet the needs of industry 4.0.

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FUT

iot

Organised By:

FcDC

BISinfotech

U RE CIT Y D e s ign C ont e s t Innovative Design Award Partner Give Your Design ideas The Biggest Platform. Make Industry Aware of Popular designs and get awarded. The biggest chance is here! This unique contest is open to all students, engineers and anyone who is between 18 to 30 years of age. Bringing unparalleled opportunities and countless concepts, this year the Future City Tech D-Zine Contest focuses on developing;

â&#x20AC;&#x2DC;Smart Things for Smart Cities.â&#x20AC;&#x2122; Projects Include: 1. Enabling Sustainability And Developing Smart Homes 2. Mobility is Critical 3. Enhancing Quality of Everyday Life 4. Designing for Urban Farming 5. Smart Waste Management of Future 6. Energy Efficient Building Control 7. IoT Designs for Future Cities

What You Take Back: No Step-Way To Bag Prizes for your design. Just Enter, Share Design and Win Big Prizes and a Chance to Sit With Industry Veterans and Discuss Your And Future of Electronics Together. When and How: The contest will run from 15th May 2019 to 10th September 2019 . The winning entry will be selected by BIS Infotech handpicked Industry Expert Team. More Details: www.iot-contest. bisinfotech.com

TECH SPEC

Consumers Failing to Embrace AI Benefits Consumers lack trust in artificial intelligence (AI) and don’t understand the extent to which it can make their interactions with businesses better and more efficient. Despite AI delivering the types of customized, relevant experiences people demand, many consumers still aren’t sold on the benefits. These relevations were made in a recenr research report, conductedby research firmSavanta and unveiled at PegaWorldin Las Vegas. The report surveys5,000consumers around the world on their views around AI, morality, ethical behavior, and empathy. With many businesses turning to AI to improve the customer experience, it’s important for organizations tounderstand their customers’ perceptions, concerns, and preferences. Key findings of the study included: •C onsumers are cynical about the companies they do business with: Sixty-eight percent of respondents said that organizations have an obligation to do what is morally right for the customer, beyond what is legally required. Despite this, 65 percent of respondents don’t trust that companies have their best interests at heart, raising significant questions about how much trust they have in the technology businesses use to interact with them. In a world that purports to be customer centric, consumers do not believe businesses actually care about them or show enough empathy for their individual situations. • T here are serious trust issues with AI: Less than half (40 percent) of respondents agreed that AI has the potential to improve the customer service of businesses they interact with, while less than one third (30 percent) felt comfortable with businesses using AI to interact with them. Just nine percent said they were ‘very comfortable’ with the idea. At the same time, one third of all respondents said they were concerned about machines taking their jobs, with more than one quarter (27 percent) also citing the ‘rise of the robots and enslavement of humanity’ as a concern. •M any believe that AI is unable to make unbiased decisions: Over half (53 percent) of respondents said it’s possible for AI to show bias in the way it makes decisions. Fiftythree percent also felt that AI will always make decisions based on the biases of the person who created its initial instructions, regardless of how much time has passed.

• People still prefer the human touch: Seventy percent of respondents still prefer to speak to a human than an AI system or a chatbot when dealing with customer service and 69percent of respondents agree they would be more inclined to tell the truth to a human than to an AI system. And when it comes to making life and death decisions, an overwhelming 86 percent of people said they trust humans more than AI.

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• Most believe that AI does not utilize morality or empathy: Only 12 percent of consumers agreed that AI can tell the difference between good and evil, while over half (56 percent) of customers don’t believe it is possible to develop machines that behave morally. Just 12 percent believe they have ever interacted with a machine that has shown empathy. One of the critical ways organizations can increase customer trust and satisfaction is to use all the tools at their disposal and demonstrate more empathy in their interactions. But empathy is not a common corporate trait – especially when trying to maximize profitability. As AI becomes increasingly important in driving customer engagement, companies need to think about how to combine AI-based insights with human supplied ethical considerations. “Our study found that only 25 percent of consumers would trust a decision made by an AI system over that of a person regarding their qualification for a bank loan,” said Dr Rob Walker, vice president, decisioning and analytics at Pega. “Consumers likely prefer speaking to people because they have a greater degree of trust in them and believe it’s possible to influence the decision, when that’s far from the case. What’s needed is the ability for AI systems to help companies make ethical decisions. To use the same example, in addition to a bank following regulatory processes before making an offer of a loan to an individual it should also be able to determine whether or not it’s the right thing to do ethically. “An important part of the evolution of artificial intelligence will be the addition of guidelines that put ethical considerations on top of machine learning. This will allow decisions to be made by AI systems within the context of customer engagement that would be seen as empathetic if made by a person. AI shouldn’t be the sole arbiter of empathy in any organization and it’s not going to help customers to trust organizations overnight. However, by building a culture of empathy within a business, AI can be used as a powerful tool to help differentiate companies from their competition.”

TECH SPEC

Rise in Connected IoT Devices to Generate 79.4 ZB of Data in 2025

There will be around 41.6 billion connected IoT devices, or "things," generating 79.4 zettabytes (ZB) of data in 2025, reveals the latest findings from International Data Corporation (IDC). In the IDC report, Worldwide Global DataSphereIoT Device and Data Forecast, 2019-2023 it predicts that as the number of connected IoT devices grows, the amount of data generated by these devices will also grow. Some of this data is small and bursty, indicating a single metric of a machine's health, while large amounts of data can be generated by video surveillance cameras using computer vision to analyze crowds of people, for example. There is an obvious direct relationship between all the "things" and the data these things create. IDC projects that the amount of data created by these connected IoT devices will see a compound annual growth rate (CAGR) of 28.7% over the 2018-2025 forecast period. Most of the data is being generated by video surveillance applications, but other categories such as industrial and medical will increasingly generate more data over time. While it's not surprising to see industrial and automotive equipment represent the largest opportunity of connected "things," IDC expects to see strong adoption

of household (e.g., smart home) and wearable devices in the near term. Over the longer term, however, with public safety concerns, decreasing camera costs, and higher bandwidth options available (including the deployment of 5G networks offering low latency, dense coverage, and high bandwidth), video surveillance will grow in adoption at a rapid rate. Drones, while still early in adoption today, show great potential to access remote or hard to reach locations and will also be a big driver of data creation using cameras. Further, IDC also predicts that the video surveillance category will drive a large share of the IoT data created, the industrial and automotive category will see the fastest data growth rates over the forecast period with a CAGR of 60%. This is the result of the increasing number of "things" (other than video surveillance cameras) that are capturing data continuously as well as more advanced sensors capturing more (and richer) metrics or machine functions. This rich data includes audio, image, and video. And, where analytics and artificial intelligence are magnifying data creation beyond just the data capture, data per device is growing at a faster pace than data per video surveillance camera. "As the market continues to mature, IoT

increasingly becomes the fabric enabling the exchange of information from 'things', people, and processes. Data becomes the common denominator â&#x20AC;&#x201C; as it is captured, processed, and used from the nearest and farthest edges of the network to create value for industries, governments, and individuals' lives," said Carrie MacGillivray, group vice president, IoT, 5G and Mobility at IDC. "Understanding the amount of data created from the myriad of connected devices allows organizations and vendors to build solutions that can scale in this accelerating data-driven IoT market." "Mankind is on a quest to digitize the world and a growing global DataSphere is the result. The world around us is becoming more 'sensorized,' bringing new levels of intelligence and order to personal and seemingly random environments, and Internet of Things devices are an integral part of this process," said David Reinsel, senior vice president, IDC's Global DataSphere. "However, with every new connection comes a responsibility to navigate and manage new security vulnerabilities and privacy concerns. Companies must address these data hazards as they advance new levels of efficiency and customer experience."

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THE UPCOMING YEARS SEEM TO BE VERY PROMISING FOR THE INDIAN SECURITY MARKET. Security cannot be a one point solution. A security mechanism reduces the risk of an organization, it does not make it zero. With an extensive knowledge about the current scenario of the security industry, Hitesh Dharmdasani l Director l AnexGATE talks to Sub-Editor, Jyoti Gazmer about the company and its alignment with the ‘Make in India’ project alongside other interesting insights.

Hitesh Dharmdasani Director l AnexGATE

Security has recently become a vital issue. What are AnexGATE’s security-oriented goals? That is true, security is more important than ever, the threat landscape is changing and is affecting not just big organizations but even smaller organizations. Being able to provide the best in class security technologies for interconnectivity of an organization's point of presence, is our primary goal. Being on the front foot on the latest attacks to networks and building defences in a layered manner has helped us get closer to that goal. Secondly on a more technical perspective, we are having engaged discussions with customers and channel partners to cut through jargon while working on security solutions. Simplifying and breaking down an organizational security policy into real implementable action items has helped our customers go a long way.

Research reports stated that ‘major cyberattacks take place also due to the lack of knowledge’. What are your thoughts on it? I agree, in fact, cyber-attacks become major threats due to lack of knowledge and lack of technical sanitation. WannaCry was such an example where the threat could be mitigated to a large extent only if users updated their Operating Systems. Something as simple as installing software updates can go a long way.

How does AnexGATE simplify the security infrastructure? AnexGATE was conceived in India and hence has mainly been built for the Indian market. We have observed this in our non-urban deployments that the primary security of our customers is “Insider theft” than “outsider theft”. Manageability of IT infrastructure is also a concern since skilled talent is in shortage in non-urban centers. All our products integrate together to be managed and monitored from one single dashboard in our cloud. Being able to solve these problems greatly, this simplifies security infrastructure for our customers. The AnexGATE appliances software is designed in such a way that the user interface is made very simple

Can you elaborate on the company’s recent collaboration with PUC examinations? Our collaboration with PUC has been for the last three years. It is for them that we have designed and implemented a tightly integrated system of biometric verification, CCTV surveillance and secure VPN connectivity. Owing to this, there has been no Question paper leak for the last 3 years due to the dramatic risk reduction. While no system is fool proof, Karnataka Secure The security concerns over the social media apps, like the Examination System reduces this risk drastically by introducing spyware attack that was announced WhatsApp earlier accountability and biometric verification of the trail of flow of sensitive information. The automated real time alert system is last month. Would you like to explain how can a user avoid such incidents? the key feature of this solution.

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The particular attack came to light due to a vulnerability in the way WhatsApp initiates and handles Voice calls. Although WhatsApp was quick to fix the vulnerability, if people do not update the app to the latest version, the vulnerability remains. In general, with social media, the key is to think before you share. People do not realize that information on the internet is permanent. A lot of companies hold on to data even after an account is deleted, once you put something out there, it is there forever. Hence, I would strongly urge customers to think before you click. If it's too good to be true, it's probably not true

Businesses are scrutinizing the advantages of a Firewall Security. What is your notion and AnexGATE’s expertise on this? Security cannot be a one point solution. A security mechanism reduces the risk of an organization, it does not make it zero. Firewall security by itself is not a panacea, but it is one layer of an organizational defence structure. A Firewall appliance on the network edge combined with a host based security system and a stringent policy on maintaining up-todate software go hand in hand. AnexGate realises that in a modern business environment, there are multiple points of presence. This necessitates that all points of presence of a business entity are securely interconnected and managed from a centralized location. This helps them to set stringent data flow policies and control how every byte of data is consumed and moved in an organization. It is important thatorganizations reviews its firewall security policy from time to time and update the configuration in AnexGATE’s / their firewall.

placed in vital points in an IT workflow. It is very gratifying to see the government incentivising building products in India. AnexGATE has been designing, developing and making network security products since early 2006. We would like to imagine that the make in India effort even translates to large scale SMT facilities in India that will be the icing on the cake. By being make in India, AnexGATE has the biggest advantage of being able to quickly customise as per Indian customer requirements. We have specially designed AnexGATE appliances for Indian conditions where the Internet is still not stable at many locations and also falls short of bandwidth requirements.

AnexGATE was

conceived in India and hence has

mainly been built for the Indian market. We have observed this in our non-urban deployments that the primary security of our customers is “Insider theft” than

Lastly, a few words on how you perceive the Indian security market and what are the way forwards? The Indian security market is having enormous potential. In a country as huge as ours, it is just in the recent years that everyone has access to the internet. With more and more people going online every minute than the rest of the world, even small businesses are embracing technologies and are more open than ever to use cloud software and new age technologies. With all this comes the risk and requirements for security professionals and solutions to mitigate these risks. The upcoming years seem to be very promising for the Indian security market.

How has the security progress shaped in India? What is the current security landscape in India? The security landscape in India has much more potential than where we currently stand, mainly from a policy point of view. We strongly believe that there is a need of an Indian entity to vet and certify security products made and sold in India. Currently, there is a dependence on foreign organizations specifically for certification. By having an Indian entity, our dependence on foreign entities for certification of security products will reduce. We are working with industry associations in trying to increase awareness on this issue.

“outsider theft”.

How does AnexGATE align with the current Make in India movement? We feel that the make in India movement is a very welcome change, broadly speaking, indigenous security products made in India are better for us in the long term. Building security products is a difficult and time consuming process and often involving very high degree of vetting since these products are

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The War of Innovations in Defense & Military Electronics

Electronic Warfare came into its own during the Second World War where it was used extensively by the Allies against the German air navigation systems used to guide the Luftwaffe in night raids. This was termed as â&#x20AC;&#x2DC;The Battle of the Beamsâ&#x20AC;&#x2122;. There are several other examples of its use. However, the Tobruk (Africa) Campaign is well documented. While the British had excellent theatre-level intelligence; thanks to their exceptional code breaking capability, the tactical-level intelligence was lacking.On the other hand, high density power electronics with high efficiencies,typically more than 90 percent are becoming the defacto requirement for high-end mission critical military platforms such as radar, fighter jets, UAVs, and weapon systems where size, weight, and power are limited. Meanwhile, Gallium Nitride based RF components are beginning to populate military RF applications. Exploring further on the possible opportunities, technologies in military and warfare electronics, we did an extensive article articulating the salient future of military and warfare electronics.

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compact and lightweight, have extended runtime, and are able to operate in temperatures from -30 to 140 degrees Fahrenheit. Nevertheless, greater advances are required for in- or on-uniform power handle everything currently in development for wearable computing. Wearable Computing Devices Other areas where todayâ&#x20AC;&#x2122;s wearable computing technology is lacking include secure communications with anti-spoofing, anti-jamming, and non-interception; non-interference among worn devices; onboard data processing; response to abnormal readings; and even smaller sizes.A warfighterâ&#x20AC;&#x2122;s combat uniform, loaded with a vast array of wearable computing devices, is, essentially, an Internet of Things (IoT) application in a personal area network (PAN). Networking wearable sensors Linking wearable sensors to in-uniform medical response systems like automatic tourniquets, injections of common medications, and application of blood-clotting agents, is a future possibility. Thin Films and Other Materials Modern warfare has made impressive strides in the past century, especially in the areas of communications, RADAR and surveillance. On the opposite side of the coin are the military SIGINT (SIGnalINTelligence) systems which attempt to detect, copy, jam and geolocate signals emitted by radios, RADARs, etc. as a means of providing the commander with a reasonable visualization of the Battlefield and with an EOB (Electronic Order of Battle). Military SIGINT platforms are taxed to the limit of modern technology in trying to cover the spectrum from HF to Ka band, sometimes over an enormous dynamic range. This paper will attempt to present a general overview of current and future Army SIGINT systems along with the role thin films (such as ferrites, ferroelectrics, magnetostatic films, metamaterials, etc) can play in devices such as filters, phase shifters, limiters, smart antennas, etc. for extending their usefulness into the 21st century.

Technology Breadth

Batteries and Their Territories Batteries represent the major limitation on the expanded implementation of wearable computing devices â&#x20AC;&#x201D; from communications to health monitoring to chemical/biological/ radiological (CBR) sensors to helmet-mounted displays of real-time maps and data from other warfighters, other units, field headquarters, UAVs, satellites, and manned airborne platforms. Lightweight, long-lasting, fast, and field-rechargeable batteries are in heavy demand.Battlefield deployments away from supply depots typically last for 72 hours or longer. Under these circumstances, short-lived batteries could prove fatal to warfighters relying on in-uniform communications and other devices.Lithium thiol chloride batteries, while not rechargeable, meet many of those requirements. They are

Jammers To the layman, a jammer is synonymous with EW. It is undoubtedly the most visible component of EW. Modern jammers are significantly different from their decade-old cousins. Equipment such as the Krasukha-4 or the Turkish KORAL ground-based jammer can generate very high power output over a broadband of frequencies which can be effective at distances up to 300km; a big jump from the previous generation of jammers which had limited ranges and effectiveness while in broadband jamming mode. Some reports also suggest that equipment such as the Russian communications suppression station Murmansk-BN is capable of jamming about 20 spot frequencies at ranges up to 5,000km. In order to achieve these high ranges, jammers are no longer restricted to the line-of-sight mode and even use reflected signals from the ionosphere. Shoot and scoot capability is available to these high power jammers based

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jamming over a narrow band in a pseudo random sequence, intended in degrading the signal by just the minimum quantum so as to make it unintelligible at the receiving end.

on high mobility trucks with built-in generators. Such mobility was feasible earlier in low power stand-alone jammers. Future jammers are likely to be expendable (including air dropped) and mounted on unmanned ground vehicles. Anti-Frequency Hopping Techniques Frequency agile EW systems were developed in order to counter the emergence of Frequency Hopping (FH) radios. The development of FH techniques is an interesting study in itself. What started as a low hop rate, narrow band FH, has graduated to very high rate hopping, over a broadband and low linger duration.Presently, proliferation of FH sets has seen the virtual extinction of the single frequency tactical radio which was the mainstay in most armies till even a decade back. Barrage jamming was traditionally used as a means to counter narrow band FH links. Present day EW systems are high hop rate systems with very low ‘look through’ time, thereby enabling interception and jamming of even complex FH signals. The technique is called ‘Follow On’ jamming. The physics of transmission of electro-magnetic waves, however, puts a technical limit on the reduction of ‘look through’ time, hence follow on jamming techniques have their own limitations. Modern trends in anti FH techniques such as Pulsed Noise Proactive Jamming resemble a mix of proactive barrage

Breaching the Electronic – Cyber – Optical Gap The term ‘spectrum warfare’ is being used to denote the blending of electronic and optical warfare, while Cyber-EW systems are simultaneously emerging in mainstream military space. Spectrum warfare seeks to combine EW technologies such as electronic jammers, interception, radars, electronic spoofing and deception along with electro-optical technologies such as infrared sensors, multi-spectral and hyper spectral sensors, visible-light sensors and laser technologies. There is a trend to develop integrated programmes and equipment so that the enemy can be targeted across the spectrum including optical. The convergence of Cyber and Electronic Warfare is a natural progression. While EW is the coarser and close-in tool, Cyber Warfare is more targeted and specifically focused on chosen computer systems, networks and applications. Interestingly the US Army has updated its field manual and released FM 3-12 on “Cyber and Electronic Warfare Operations” in April 2017. The EW systems of the future will have Cyber Offence and Defence capability and will operate at the cutting edge of the Tactical Battle Area (TBA), a distinct shift from the strategic level at which cyber operations are focused presently. Such equipment will have the capability to carry out cyber malware injection off the air into the networks of the adversary including air gapped and off-line systems. Bridging the Military-Civil Divide Traditionally, EW has been restricted to the military domain and was a niche technology. However, the development of EW systems has followed the growth trajectory of communication systems. The growth of communication technologies such as microwave, radio, WiFi and cellular services has been powered by the establishment and quick adaptation of common worldwide standards and protocols. A large segment of

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military communications also adopted these standards and protocols due to the ease of procurement and integration. In the domain of EW too, a similar trend was seen and it became easy to buy a jammer or a direction finding system off-the-shelf at relatively low prices. This brought about a proliferation of use of EW systems like jammers in purely non-military role or at best, a law enforcement role. The manufacture of hardware for advanced EW systems is likely to see a similar trend and components, designs and manufacturing is likely to go the dual use way, especially equipment required in large numbers (IED jammers, cell phone jammers, cell phone interceptors and direction finders) which will be used in anti-terrorist operations and for homeland security. Use of Non Standard Protocols The advanced EW systems being used for pure military use which can effectively disrupt and paralyse the operations of the enemy, are however likely to see a greater reliance on non-standard protocols, non-standard modulation schemes and proprietary wave forms. It is in a way going back on the methodology used in the older versions of EW equipment which used unique protocols specific to the manufacturer and equipment type. Unmanned and Autonomous EW Systems The cognitive capability of the soldiers operating EW systems was a key factor in determining the success of operations. Armies have been known to place selected and specially trained personnel at the controls of such equipment. Modern systems are however witnessing a distinct shift from intimate human control to fully automated systems. This is understandable considering the speed of operations and the data volume to be handled. EW systems of the future once programmed for certain tasks, are likely to operate in autonomous mode. The associated technologies are closely guarded, since advanced heuristics, machine learning and data analytics can add extract much more from similarly placed hardware and equipment. Software Defined Radio (SDR) based EW DRs have transformed the way radios are used in the battlefield. These sets are agile and the same platform provides the ability to use different frequency bands, modulation schemes, FH Rates, FH Bands, power output, gain and other parameters. Due to their versatility, these sets can switch over to the EW role while free from communication role. Now that SDR is a reality and increasingly the traditional radio inventory of armies across the world is being changed to SDR, many short range and discrete EW functions are likely to be taken over by such sets in the TBA. The SDR sets are also likely to be deployed closer to the enemy forces than traditional EW equipment, thus

enhancing the effectiveness to interfere with the enemy links. The defense market for embedded electronics designers continues to be a growth area. While increased use of commercial off-the-shelf (COTS) technology has lowered the cost and therefore the spending in unmanned systems, it is fueling more innovation, especially in small platforms. Radar Radar continues to be the hottest growth area for military electronics, especially with modernization efforts. Man-Portable Electronics Market The man-portable military electronics market is expected to register a CAGR of 4.89% during the forecast period (20192024), to reach a market value of USD 6.13 billion, by 2024. Growing terrorist activities and increasing military spending by nations across the world are enabling the respective armies to procure more man-portable military electronic systems for

enhancing their land-based warfare capabilities. These trends are expected to help the market during the forecast period. The emphasis on the modernization of soldiers is growing in various countries. The focus on this is expected to drive in more investments for the man-portable military electronics market in the years to come.Research in powered exoskeleton technologies is expected to provide growth opportunities for the market years to come. Embedded computing technology will enable AI systems such as cognitive EW, cognitive radio, cognitive radar etc. The DoD is only going to rely more on the COTS suppliers as they are the ones who take all those wonderful commercial processors, algorithms, etc. -NILOY@BISINFOTECH.COM n

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MARKET GLANCE

GLOBAL MAGNETIC SEPARATOR MARKET REPORT - FMI The global magnetic separator market is estimated to witness modest growth in 2019, and reach a market value of around US$ 1,200 million. The global magnetic separator market will register a Y-o-Y growth rate of nearly 3.0% over that attained in 2018. Magnetic separator is a type of separation and sorting equipment, mainly used for separating magnetic minerals mixed in non-magnetic minerals such as removal of metallic and ferrous materials from a mixture with the help of magnetic force. Additionally, the global sales of magnetic separators are expected to be fuelled by growing mining and several processing industries across the globe. Robust customer demand for magnetic separators from recycling industry, chemical industry, and food and beverages industry is expected to propelling the growth of the magnetic separator market during the forecast period.

Oceania Emerging as a High Potential Storehouse of Opportunities

In the past five years, the Oceania region witnessed substantial growth in mineral production. In 2012, the Oceania region accounted for a share of 5.1% in the global mineral production, while in 2017, the Oceania region accounted for a share of more than 7.0%. Increasing mineral production in the region is expected to increase the demand for mineral sorting and separation equipment. Consequently, increasing the demand for magnetic separators. The rising number of metallic contamination incidents in several food and beverage products have triggered a great demand for enhanced safety. Government authorities have formed several regulations to improve the operational safety and thus, there has been a greater demand for high performance magnetic separators in the food and beverages processing industry. The East Asia market is expected to dominate the global magnetic separator market, owing to its relatively large consumption for separation and sorting equipment in mining and other industries. North America and Europe magnetic separator markets are expected to

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experience modest growth, owing to being mature magnetic separator markets. Countries/regions such as Australia, Japan, India, Brazil, and ASEAN being at the forefront in the mining industry are expected to generate significant opportunities in the global magnetic separator market. Significant growth in demand for magnetic separators is also anticipated to be witnessed in countries of Middle East and Africa, owing to substantial requirement for separation and sorting equipment such as magnetic separators in mining, chemicals, cement, steel, and other industries.

Influx of Application Opportunities in â&#x20AC;&#x2DC;Recyclingâ&#x20AC;&#x2122; to Favor Demand Growth

On the basis of intensity type, the high gradient segment is foreseen to experience substantial growth in the magnetic separator market. However, owing to its low cost and high demand, the low intensity type magnetic separator segment is expected to account for a prominent volume share in the global magnetic separator market. On the basis of product type, pulley separator sales are expected to witness a growth of approx. 4.0 percent during the forecast period, which is mostly driven by its increasing applications in several industries with the primary intention of preventing metallic contamination. By material type, dry type magnetic

separator is considered more into demand among the customers. The segment is expected to account for more than two third of the total market during the forecast period. By cleaning type, self-cleaning magnetic separator is considered more into demand among customers. The segment is expected to account for more than two third of the total market during the forecast period. On the basis of end-use industry, owing to increasing concern towards recycling of waste, scrap metal, and other materials, the recycling end-use industry segment is expected to project maximum growth during the forecast period. Some of the key manufacturers involved in the magnetic separator market are Eriez Manufacturing Co, Nippon Magnetics, Inc., LONGi Magnet Co., Ltd, Metso Corporation, OutotecOyj, Noritake Co., Limited, A AND A MAGNETICS, INC, SLon Magnetic Separator Ltd., KANETEC CO.,LTD., Shandong Huate Magnet Technology Co., Ltd, Douglas Manufacturing Co., and Inc., among others. Magnetic separators have significant applications in metal and mineral mining industry, recycling industry, food and beverages processing industry, chemical industry, steel industry, foundry industry, plastic industry, cement industry, water, and wastewater treatment, among others.

MARKET GLANCE

CONSUMER ELECTRONICS TO PROPEL MCU MARKET The global Microcontroller market was estimated to be worth US$1.472 billion in 2018 and a new research further claims that it will see a moderate growth during the forecast period. The report titled, “Global Microcontroller Market - Forecasts from 2019 to 2024” further reveals that the demand for microcontrollers will witness a rise during the forecast period owing to an increase in the demand for consumer electronics worldwide. Furthermore, the increasing penetration of electronics in automotive industry and the budding automation in manufacturing industries will further propel the market in the coming years. This research study examines the current market trends related to the demand, supply, and sales, in addition to the recent developments. The report includes, major drivers, restraints, and opportunities to

provide an exhaustive picture of the market. The analysis presents in-depth information regarding the development, trends, and industry policies and regulations being implemented by the relevant agencies. Further, the overall regulatory framework of the market has been exhaustively covered to offer stakeholders a better understanding of the key factors affecting

the overall market environment. Identification of key industry players in the industry and their revenue contribution to the overall business or relevant segment aligned to the study have been covered as a part of competitive intelligence done through extensive secondary research. Various studies and data published by industry associations, analyst reports, investor presentations, press releases and journals among others have been taken into consideration while conducting the secondary research. Major industry players profiled as part of the report are Renesas Electronics, Microchip Technology, NXP Semiconductor, and Texas Instruments Incorporated, STMicroelectronics, Infineon Technologies AG, Cypress Semiconductor Corporation, Panasonic Corporation, Analog Devices

RF TUNABLE FILTER MARKET GROWTH SCENARIO RF tunable filters are used in various high-end mobile phones, tablets, laptops, wearable devices, smart TVs, PCs, cordless phones, and other consumer electronic devices. RF tunable filter market is expected to grow from USD 55.4 million in 2018 to USD 87.0 million by 2023, at a CAGR of 9.43%. The growth of this market is mainly driven by the factors such as the growing demand for smartphones and connected devices and increasing use of long-term evolution (LTE) network. RF tunable filters based on MEMS capacitors and digitally tuned capacitors are the most popular types of tunable filters used in consumer electronic devices. These tunable filters are widely used in smartphones to minimize the manufacturing cost. Also, these tunable filters are used in smartphones due to the rising telecommunication data traffic as they provide high temperature stability in small cells. Radar systems to hold the largest share of the RF tunable filter market by 2023 Radar systems are expected to hold the largest share of the RF tunable filter market based on systems, in terms of value, by 2023. Highly reliable RF tunable filters, which can be used even in harsh environmental conditions for proper communication, are required to adhere to military standards. These standards include environmental, electromagnetic capability; nuclear survivability; and electrical characteristics of a digital interface. In military systems, RF tunable filters are mainly used in handheld and software-defined radios, radar systems, and test and measurement systems. The RF Tunable Filter Market for Smart Cities The RF tunable filter market for smart cities is expected to grow at the highest CAGR from 2018 to 2023. The growth of the market

for this vertical is attributed to the successful implementation of smart city projects, which heavily depends on technologies such as data communications, cloud, mobility, and sensors that collectively form the IoT. Rapid developments in these areas, in recent years, have enabled better connectivity of objects, resulting in the complete development of smarter ecosystems. The introduction of Internet Protocol version 6 (IPv6) allows the connectivity of almost every real-world object with the internet. This connectivity of objects enables better understanding of their behavior, resulting in better decision-making. The RF Tunable Filter Market in APAC to Grow The Highest CAGR The RF tunable filter market in APAC is expected to grow at the highest CAGR during the forecast period. The growth of this market can be attributed to the high adoption of smartphones; rapid shift toward high-speed mobile technologies (for instance, the shift from 3G to 4G); high consumption of mobile services, including video, social media, e-commerce, and financial services; and huge military expenses in countries such as China, India, Japan, and South Korea.

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MARKET GLANCE

$3BN GAN & SIC POWER SEMI MARKET BY 2025 The power semiconductor devices are witnessing high adoption for different power applications, fueling the growth of the market. In a recent report stating on the GaN and SiC power semiconductor market, it is poised to rise from USD 400 million in 2018 to over USD 3000 million by 2025. In an earlier article BIS strived to identify the potential of SiC and GaN. According to a 2019 Global Market Insights, Wider Band Gap (WBG) devices have made it possible to make small packaged and compact electronic devices which have high power density. The power semiconductor industry is aiming to develop devices with less weight and low-cost creating opportunities for the market. As conventional silicon-based devices are approaching their material limits, silicon carbide and gallium nitride are becoming more popular and are being adopted across various industry verticals due to its higher dielectric field strength than silicon. Moreover, wider bandgap and thermal energy allow it to withstand higher temperatures and voltages, making it an ideal substitute for silicon. The GaN and SiC power semiconductor market has significantly emerged as the devices are finding their applications in areas such as PV inverters, hybrid & electric vehicles, UPS and other power applications. Various power industries are affected by energy loss, particularly during power conversions. Efficiency is a crucial factor for industries to ensure better performance. Limitations to achieve the required efficiency often lead to high costs. As a result, semiconductor industries are focusing on adopting materials with more power-suitable characteristics, giving significant growth opportunities to the GaN and SiC power semiconductor market. These Gallium nitride power devices hold high growth potential to be used in several

power semiconductor applications. The material can be used to enhance the electronic performance and power capacity. GaN offers several benefits over conventional silicon in transistors due to its features such as high-power density, miniaturization of systems and increased efficiency. While silicon has been majorly used for many years in the power semiconductor industry, companies are increasingly focusing on improving GaN device reliability for high power systems. The exponential growth of GaN is expected to drive GaN and SiC power semiconductor market growth. The semiconductor industry developments are one of the key factors influencing the market. The U.S. is the dominant region considering the market share in the global semiconductor industry with over USD 200 billion in 2018, which is almost half of the global sales according to the Semiconductor Industry Association (SIA). Moreover, the U.S. semiconductor industry spends one-fifth of its revenue for R&D activities, making it an important region for the market.

PRIVATE COMPANIES HELPING SPACE ELECTRONICS GROW

The worldwide space electronics industry analysis revealed that the market generated $1.27 billion in 2018 and will propel further at a CAGR of 5.22% during the forecast period between 2019-2024. The report titled, “Global Space Electronics Market: Focus on Producttype, Component, Application, and Subsystem - Analysis and Forecast, 20192024” offered by ResearchAndMarkets. com’s offering, notes that the market is expected to witness a high growth rate owing to the significant technological advancements across the electronic components, especially microprocessors and field-programmable gate array (FPGAs). Moreover, collaboration between space agencies and private companies to develop an advanced and miniaturized component is further leading the growth

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in the global market, such as the alliance announced last year, where, U.S. Air Force Research Laboratory and NASA awarded a contract to the Boeing Company. Space contains a high degree of radiations that can potentially cause

anomalies in the operability of space electronics components. The challenge for the market growth was revealed to be Single-event effects (SEEs), electrostatic discharge (ESD), total ionizing dose (TID), and cumulative radiation damage. Component designing is crucial and is done in such ways that electrical components can operate and survive reliably in high-radiation environments. The components used in the space are either radiation-hardened or radiation-tolerant depending upon the mission. There have been continuing advancements in semiconductor and electronics technology, leading to the development of small and light-weight electronic products. Small satellites have a huge potential for easy and cost-effective access to space.

MARKET GLANCE

GLOBAL AUTOMOTIVE TRANSCEIVERS MARKET Global automotive transceivers market is estimated to be worth $4.43 billion in 2017 and is expected to garner atleast $7.19 billion by 2025, registering at a CAGR of 6.2% from 2018 to 2025 according to a report by Allied Market Research Growth Drivers The report further stare states the major drivers of the global automotive transceivers market are • rise in demand for economical and luxury vehicles due to rise in disposable income of the consumers • increase in demand for advanced, comfort, and convenience feature in vehicles, stringent government regulations toward automotive safety norms • r i s i n g e l e c t r o n i c i n t e g r a t i o n i n automotive • rising popularity of autonomous vehicles and trend of connected car devices are expected to create lucrative opportunities in the near future. LIN Protocol Still Dominates Previously, the LIN protocol held the largest share in 2017, contributing nearly one-third of the total market, as LIN is cheap serial communication interface based on a master-slave architecture

that reaches speeds of up to 20 kbps. Moreover, it assures connectivity between various peripheral sensors and actuators for doors and windows, which is expected to further supplement the growth of the segment. The FlexRay segment is expected to manifest the fastest CAGR of 8.5% during the forecast period. The report also includes an in-depth analysis of the other segments such as CAN and others (Ethernet, K-Line, MOST). Heavy Commercial Vehicle Takes Over Passenger Vehicles The heavy commercial vehicles segment is projected to manifest CAGR of 8.1% through 2025, owing to rise in use of

advanced safety, comfort feature, and increase in ration of heavy commercial vehicles and taking over the record held by the passenger vehicles segment in 2017. LAMEA Market Expected to Grow at a CAGR of 8.9% The market across Asia-Pacific region held the largest share in 2017, contributing more than half of the market, owing to high adoption rates of smart mobility services, government regulation, rise in concerns toward safety systems, and surge in trend toward adopting non-fossil fuelbased vehicles in the region. However, the market across LAMEA is expected to register the fastest CAGR of 8.9% during the forecast period, owing to increase in automobile production due to rising population and industrialization. Major market players The global automotive transceivers market report provides a detailed analysis of the major market players such as Broadcom Corporation, Infineon technologies, Cypress Semiconductors, Maxim Integrated, NXP Semiconductors, Microchip Technology Inc., STMicroelectronics, Robert Bosch GmbH, Toshiba Corporation, and Texas Instruments Inc.

AUTOMOTIVE JUGGERNAUT FOR EDA SOFTWARE MARKET Electronic design automation software comprises of multiple tools and applications. The EDA software over the years have evolved in response to progressively aspiring goals for high performance, low power and decreased design cycle time. According to recent report, the market of Electronic design automation market is well expected to grow US$10.31 Bn in 2018. At a CAGR of 12.0% during the forecast period 2019 - 2027, to account for US$28.27 Bn by 2027. EDA software simplifies integrating tools to the customers’ demand which is normally a complicated job. The complex requirements of the end-users regarding highly stable and accurate product positioning is addressed with the help of EDA. Rising complexities and cost challenges faced by the industries for

implementation of expensive complex designs is key influencer driving the electronic design automation market. Key trend which will predominantly effect the electronic design automation market in coming years is demand for machine learning in EDA software to gain significant momentum in the electronic design automation market. This evolution in the EDA software is also expected to meet the unfulfilled need for methods, models and tools that would allow faster and more accurate design and verification of microelectronic systems and circuits. A behavioral approach, lately, has been discovered to be able to achieve these goals. Therefore, the machine learning to the EDA tools business is having a substantial impact. The technology is anticipated to cut the cost of designs by

enabling the tools to provide solutions to usual issues, which might take longer for the design teams to resolve manually. This not only reduces the cost but also paves the path for novel designs and more semiconductor chips from more businesses. Additionally, the appropriate software enable companies address cost-related and time-to-market challenges thoroughly, via process optimization. Thus, various industries including, consumer electronics, telecom, aerospace & defense, and industrial among others are implementing electronic design automation depending on the requirements. The continuous advancements in the consumer electronics and automotive industries would further raise the demand for electronic design automation market over the forecast period.

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INDUSTRY LAUNCH

New Multi-Channel, Mixed-Signal RF Converter Platform Analog Devices has pulled back the curtains on a new mixed-signal front-end (MxFE) RF data converter platform that combines high-performance analog and digital signal processing for a range of wireless equipment such as 4G LTE and 5G millimeter-wave (mmWave) radios. Features: • The new AD9081/2 MxFE platform allows manufacturers to install multiband radios in the same footprint as singleband radios.

Applications: The new multi-channel MxFE platform meets the needs of other widebandwidth applications in 5G test and measurement equipment, broadband cable video streaming, multi-antenna phased array radar systems and low-earth-orbit satellite networks.

Infineon Unveils New Certified NFC Type 4B Tag Infineon Technologiesenables seamless connectivity by providing handset manufacturers with reference tags for interoperability testing with all types of internationally standardized NFC protocols.Infineon introduced NFC reference tags based on the SECORA Pay security solution. Features: • Type 4B Tag is the first product worldwide certified by the NFC Forum that supports the contactless Type B protocol. • Users can activate services via NFC connectivity without having to open an app.

Applications: Handset manufacturers

Availability: The NFC reference tags are based on Infineon’s SPA1.1 module, a new innovative packaging solution. The Type A and Type B NFC tags are available in pairs and can be sourced online via Infineon’s security partner Universal Smart Card.

Processors & Industrial Displays Lattice Semiconductor Corporation announced availabilityof the latest in a series of new reference designs featuring the Lattice CrossLink FPGA for video bridging applications.

Features: • Support single DSI input (RGB888 or RGB666) to single or dual channel LVDS output (RGB888 or RGB666) • Support single CSI-2 input (RGB888, RAW8, RAW10, or RAW12) to single- or dual-channel RGB888 LVDS outputs (RGB888)

Applications: Industrial device customers

Littelfuse New SPD2 Series Type 2 Surge Protection Devices Littelfuse launches its SPD2 series of Type 2 surge protection devices. Transient overvoltage, or power surges, can damage components and drive added costs to repair or replace as well as create unplanned downtime.

Features: • Capability to clamp and withstand highenergy transients to prevent disruption, downtime, and degradation or damage to equipment

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Applications: The SPD2 series is DIN-rail mounted for electrical cabinets and comes in a wide range of operating voltages including DC power for solar applications. The product is ideal for power distribution, electrical loads, industrial controls, computers and communications as well as HVAC or medical equipment.

INDUSTRY LAUNCH

Bi-Directional Current Sense Amplifier with PWM Rejection Maxim pioneers theMAX40056 bi-directional current sense amplifier with patented pulse-width modulation (PWM) rejection which provides the designers toimprove motor efficiency and reduce vibration. This high speed, wide-bandwidth amplifier extends Maxim’s industry leadership in precision, high-voltage current sense amplifiers into motor control applications, said the company. Features: • Fastest Settling Time • Highest Accuracy • Increased Performance

Applications: • DCMotor Control • Base Station • Datacenter • Battery Stack

Availability: The MAX40056 is available at Maxim’s website for $1.19 (1000-up, FOB USA); also available fromauthorized distributors

Microchip Adds Single-Port USB Smart Hub ICs Microchip Technology has extended itsportfolio of leading USB automotive products and added new single-port products to its USB 2.0 Smart Hub IC family, giving automakers more options to fit varying design needs. Features: • single-port ICs in smaller footprint packages • optimizing a customer’s Bill of Materials (BoM) • lowering total system costs

Applications: These diverse USB solutions support smartphones, tablets and other connected devices, without compromising signal integrity.

Availability: Both USB products are offered in a 40-pin VQFN package, compliant with the USB 2.0 specification and have passed AEC-Q100, grade 3 testing. The USB4712 is available for $1.60 and the USB4912 is available for $1.89, each in 10,000-unit quantities.

400 Watt 8th Brick DC-DC Converters Compliant with USB 2.0 Murata has recently introduced its DSE Series, a fully isolated, 12Vout, 400W eighth brick DC-DC converter with a DOSA compliant digital interface to support the PMBus standard for communication and control

Features: Offers advanced power conversion technology, including a 32bit ARM processor that controls critical conversion functions and delivers a digital interface for use in the end system application.

Applications: • Telecommunications • Networking • Wireless • Pre-amplifiers

Availability: Available Now

NXP Announces Secure Ultra-Wide Band Ranging Technology NXP Semiconductors recently announced the development of UWB technology designed for a broad range of markets, including mobile, automotive, Internet-of-Things (IoT) and industrial markets announced at its annual developer conference in the Silicon Valley. NXP UWB provides access to accurate localization capabilities. Doors and points of entry will open once approaching them. Features: • UWB higher bandwidth channel provides greater instantaneous precision than existing wireless technologies in challenging environments, leading to an accuracy of a few centimeters.

Applications: • Mobile, automotive, Internet-ofThings (IoT) and industrial markets.

Availability: NXP is sampling solutions to its early access partners and will be demonstrating UWB capabilities at NXP Connects.

ISSUE 07|VOL 1|JULY 2019|BISINFOTECH

INDUSTRY LAUNCH

New Highly Flexible Gate-Driver System Power Integrations has unveiled the new SCALE-iFlex gate-driver system for IGBT, hybrid and siliconcarbide (SiC) MOSFET power modules with blocking voltages from 1.7 kV to 4.5 kV. The system contains a central Isolated Master Control (IMC) and one to four Module-Adapted Gate Drivers (MAGs). The IMC provides a 4.5 kV blocking voltage. Features: • R eady-to-use gate driver solution optimized for power modules from 1200 V to 3300 V blocking voltage • Supports IGBT, Hybrid (Si-IGBT/SiC-Diode) and Full-SiC MOSFET power modules

Applications: Wind turbine inverters, industrial drives and the main propulsion and auxiliary inverters for railway applications, said the company.

Availability: The SCALE-iFlex IMC and MAG gate driver system is available in August 2019. A typical use-case set comprising one IMC, four MAGs and associated cables is priced at $693 in 100 piece quantities.

AC/DC Modules for IoT and Industrial Automation RECOM announced its newest addition to low power AC/DC portfolio, RAC04-K/277 series.

Features: • 80 to 305VAC input voltage range • 150% peak power capability • Wide temperature range: -40°C to +90°C

Applications: Automation, industry 4.0, IoT, household, and home automation.

Availability: Samples and OEM pricing are available from all authorized distributors or directly from RECOM.

New Processing-In-Memory for Next-Gen AI Chips Renesas Electronics has developed an AI accelerator that performs CNN (convolutional neural network) processing at high speeds and low power to move towards the next generation of Renesas embedded AI (e-AI), which will further accelerate increased intelligence of endpoint devices. Features: • Ternary (-1, 0, 1) SRAM structure PIM that can adjust its calculation bit number according to the accuracy required • High-precision/low-power memory data readout circuit that combines comparators and replica cells

Applications: Wearable equipment and robots.

High Accuracy Seismic Detection Sensor Module ROHM announces the availability of an ultra-compact high accuracy seismic detection sensor module, BP3901. The devices for accurately detecting vibration when an earthquake occurs and for stopping operation of equipment have garnered increased interest to prevent secondary disasters caused in the aftermath of an earthquake.

Features: • Enables high Accuracy Earthquake Detection in a Compact Module Form Factor ROHM’s sensor adds the following 2 functions that further improve detection accuracy.

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Applications: • Smart meters (power, gas) • U n m a n n e d t r a n s p o r t vehicles • Automatic doors

Availability: The samples are available as of now. The product will be available in OEM quantities by August 2019

INDUSTRY LAUNCH

Schneider Electric RevealsEasyPact EXE MV Circuit Breaker Schneider Electric has launched the brand new EasyPact EXE MV vacuum circuit breaker. With EasyPact EXE, panel builders get the main MV circuit breaker and modular kitswith all the components needed to customize fixed- and withdrawable-type switchgear solutions. Features: • With panel builders in mind, EasyPact EXE helps them tackle availability issues, long delivery times, and growing cost pressures. • The product takes just five days* to arrive after ordering online from Schneider Electric’s Ecoreal MV platform. • EasyPact EXE circuit breakers are robust and reliable.

Availability: Available Now

GNSS Offering With New ROM-Based Module STMicroelectronics has expanded its GNSS product offering with the Teseo-LIV3R ROMbased module. The module which is competitively-priced provides ST’s full GNSS algorithm capability for cost-conscious tracking and navigation devices.

Features: • O dometer functionality with three trip counters and reached-distance alert, • Geofencing capabilities with up to eight configurable circles

Applications: Battery-sensitive applications.

Availability: The Teseo-LIV3R is in volume production. The 9.7mm x 10.1mm LCC18 module is priced from $7.3 for orders of 1000 pieces.

TI Minimize Footprint and Maximize Performance Texas Instruments has launched to what according to them is the industry’s smallest currentsense amplifier in a leaded package and the smallest, most accurate comparators with an internal 1.2-V or 0.2-V reference. Features: • Reduce overall system size • Improve system efficiencies • Increase performance and protection • Integration in a tiny package • Lower power, longer battery life

Applications: • These new devices are optimized for a variety of personal electronics, enterprise, industrial and communications applications, including peripherals, docking stations and notebooks.

Availability: Production quantities of the INA185 are now available through the TI store and authorized distributors in a SOT-563 package, measuring 1.6 mm by 1.6 mm.

Vicor Launches New 800VBus Converter Module Vicor has introduced the800V BCM4414- a 1.6kW, isolated,1/16 fixed-ratio, bus converter module(BCM),that can operate froma 500V to800V input voltage,to deliver SELV output voltages with 97.7% peak efficiency.

Features: • Adding tothe existing Vicor700V BCM4414. • Creates a family of products with reinforced isolation (4,242VDC) and bidirectional voltage conversion capability.

Applications: • Addresses the need forincreased density and performance in Industrial and Military 3-phase AC power supplies • H igh-voltage DC transmissionsystems for tethered unmanned vehicles.

Availability: The BCMs are available in either M-Grade (-55 to 100°C) or T-Grade (-40 to 100˚C).

ISSUE 07|VOL 1|JULY 2019|BISINFOTECH

TRADE SHOW

electronica India and productronica India Gear Up To Be Colossal This Year

electronica India growthand productronica India move to the plush India Expo Centre in Greater Noida due to their exponential After a tremendous response in Bengaluru last year, electronica India and productronica India are back with their next edition for the year 2019.With approximately 600 exhibitors from 28 countries and footfall exceeding 25,000 trade fair visitors in 2018, both the shows are growing at an exponential rate. To accommodate the influx of exhibitors and visitors and to enhance the exhibiting experience for both, the show organizer,MesseMuenchen India,has moved the venue to India Expo Centre at Greater Noida, New Delhi. “Greater Noida is the ideal location for electronica India and productronica India since it is amanufacturing base for numeroussectors like mobile, consumer electronics, LED and automotive companies among many others”, assertsBhupinder Singh, CEO of MesseMuenchen India.The new venue is designed to provide top notch amenities. Outfitted with sizable warehousing, advance security along with good metro and road connectivity, it is a lucrative blend of technology and world-class facilities. The trade fairs are the ideal platform for exhibitors to showcase their latest innovations and get a strong foothold in the market. With the participation of eminent players,the shows focuson bringing the best of the industry under one roof, for the visitor’s advantage. “electronica India and productronica India havegarnered the reputation of flagship show for the sector with increased domestic and international participation”, remarksSingh. These thoughts were echoed by Falk Senger, Managing Director of MesseMünchen GmbH. “We have observed a rapid upsurge

BISINFOTECH|JULY 2019|VOL 1|ISSUE 07

in the footprint at electronica India and productronica India. Considering the response from last year, the trade fairs are most definitely scaling to new heights.” Co-located shows Indian Printed Circuit Association Expo (IPCA Expo) is the optimal platform for companies dealing with PCB technology. IPCA Expo aims to promote advance education in the science and application of electronic packaging. SmartCards Expo is India’s only trade fair focusing on smart card technologies and their applications. It is organized along with IoT India Expo, e-Security Expo, RFID India Expo, Biometrics India Expo, Digital Payments India Expo and Artificial Intelligence India Expo. Quintessential platform for networking and business expansion The trade fairs conduct a series of interactive sessions and programs for its participants. The idea is to bridge the gap between buyers and sellers and give significant insights on the current trends dominating the industry. Series of programs at the shows: • CEO forum • Advantage India summit • e-Automotive conference • India PCB Tech conference • Buyer-Seller forum The upcoming edition of electronica India and productronica India will take place from September 25–27, 2019 in Delhi NCR at the new venue – India Expo Centre, Greater Noida. Find out more about the trade fairs at www.electronica-india. com and www.productronica-india.com.

Modular Malware ANSHUMAN SINGH

Senior Director, Product Management Barracuda Networks Barracuda researchers have seen a spike in the use of modular malware since the beginning of 2019. A recent analysis of email attacks targeting Barracuda customers identified more than 150,000 unique malicious files in the first five months of the year. Here’s a closer look at modular malware and ways to help detect and block attacks. Cybercriminals use email to deliver modular malicious software, also known as modular malware. An ever-increasing trend, modular malware provides an architecture that is more robust, evasive and dangerous than typical document-based or web-based malware. Modular malware includes—and can selectively launch—different payloads and functionality, depending on the target and the goal of the attack. Most malware is distributed as a document attachment that is sent via spam to widely-circulated email lists. These email lists are sold, traded, aggregated, and revised as they move through the dark web. Once an infected document is opened, either the malware is automatically installed, or a heavily obfuscated macro/script is used to download and install it from an external source. Occasionally, a link or other clickable item is used, but that approach is much more common in phishing attacks than malware attacks. With the rise of botnets executing commands provided by cybercriminals and malware written for widespread distribution, modularity has become the new norm. Malware authors are increasingly organized and continue to adopt and implement software-industry practices, including quality assurance and testing, to improve the success of attacks. In response to the demand to meet multiple needs with one widely-distributed malware file, modular malware has evolved to become more feature-rich and flexible. Detecting and Blocking Modular Malware: The rapidly evolving threat environment requires a multilayered protection strategy—one that closes the technical and human gaps—for every organization to maximize its email security performance and minimize the risk of falling victim to sophisticated attacks like modular malware.

• Gateway Defense Advanced inbound and outbound security techniques

BISINFOTECH|JULY 2019|VOL 1|ISSUE 07

Next Big Cyber Threat in 2019 should be deployed, including malware detection, spam filters, firewalls, and sandboxing. For emails with malicious documents attached, both static and dynamic analysis can pick up on indicators that the document is trying to download and run an executable, which no document should ever be doing. The URL for the executable can often be flagged using heuristics or threat intelligence systems. Obfuscation detected by static analysis can also indicate whether a document may be suspicious.While many malicious emails appear convincing, spam filters and related security software can pick up subtle clues and help block potentially-threatening messages and attachments from reaching email inboxes. If a user opens a malicious attachment or clicks a link to a drive-by download, an advanced network firewall capable of malware analysis provides a chance to stop the attack by flagging the executable as it tries to pass through. In addition, encryption and DPL help secure against accidental and malicious data loss. Plus, email archiving is critical for compliance and business-continuity purposes. • Resiliency Backup helps recover from data deletion, and continuity ensures that critical emails can get sent during a potential outage. • Fraud Protection Stop attacks that can bypass the email gateway. Artificial intelligence should be used for spear-phishing protection, and DMARC validation detects and prevents email and domain spoofing. • Human Firewall This top layer of email defense for every business is the most critical. Make phishing simulation and training part of securityawareness training. Ensure end users are aware of new types of attacks, show them how to identify potential threats and transform them from a security liability into a line of defense by testing the effectiveness of in-the-moment training and evaluating the users most vulnerable to attacks.

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INDUSTRY KART

MOUSER NEW SKYWORKS’ WI-FI 6 FRONT-END MODULE Mouser Electronics announces shipment of SKY85726-11 front end module (FEM) from Skyworks Solutions. The 5 GHz WLAN device is ideal for Wi-Fi 6 (802.11ax)-based Internet of Things (IoT) systems, offering a fully integrated solution in a compact 3 × 3 mm form factor. The Key Features of the Skyworks Solutions SKY85726-11 FEM, available from Mouser includes; Integrated 802.11ax 1024 QAM, 5GHz PA, LNA with bypass, and T/R switch Frequency range: 5.15GHz to 5.925GHz Fully matched input and output Integrated logarithmic power detector and directional coupler Transmit gain: 32dB Receive gain: 13dB Output power: MCS11, +16dBm, -43dB EVM MCS9, +20dBm, -35dB EVM MCS7, +21dBm, -30dB EVM

Package type: QFN-16 Package dimensions: 3mm x 3mm Mouser is also stocking the Skyworks SKY85726-11EK1 evaluation

ELEMENT14 LAUNCHES GROUND-BREAKING RASPBERRY PI 4 COMPUTER

element14 announced the launch of the new Raspberry Pi 4 Model B Computer also known as the most powerful Raspberry Pi model ever made. The Raspberry Pi 4 Model B Computer offers significant enhancements in processor speed, multimedia performance, memory and connectivity that will make it attractive to general desktop computer users, hobbyist and makers, and professional developers working with compute-intensive embedded applications such as computer vision and Artificial Intelligence (AI). “This truly is a Raspberry Pi for everyone,” says Hari Kalyanaraman, Global Head of Single Board Computers at element14. “Our research has highlighted the widespread use of Raspberry Pi products by professional engineers in both prototyping and commercial production; across a wide range of applications from IoT, AI, and industrial automation and control, to predictive maintenance. With more memory options, true Gigabit Ethernet, USB 3.0 and increased processor performance, all at an attractive price,

BISINFOTECH|JULY 2019|VOL 1|ISSUE 07

the new Raspberry Pi 4 Model B is well positioned to accelerate its adoption for industrial applications.” The Raspberry Pi Trading Chief Executive, Eben Upton termed it as the most powerful model ever because the extra power and range of memory options support the needs of professional design engineers. AI and machine learning data can be processed right on the board, reducing the need to send data to the cloud and addressing real-world concerns about privacy. The Key Features of the Device include: The Raspberry Pi 4 Model B Computer is the first model to use a 28nm SoC, delivering a significant increase in performance and energy efficiency. Processor: A quad-core ARM Cortex-A72 64-bit processor clocked at 1.5GHz enables the Raspberry Pi 4 Model B to run up to three times faster than its predecessor. Video and Sound: Two micro HDMI ports support dual-display output at resolutions up to 4K.

board, which includes SMA connectors and pinouts to help engineers demonstrate the capabilities of the SKY85726-11 FEM.

HIROSE OPTS FOR HEILIND ASIA PACIFIC AS DISTRIBUTION PARTNER Heilind Asia Pacific has expanded inventory of electronic components and solutions from Hirose Electric and hereon, will be the authorized distributor for the company. Hirose Electric based in Japan is a global connector manufacturer offering a broad range of interconnect devices including RF, coaxial, boardto-board, wire-to-board, circular, micro USB, FPC/FFC, and industrial power connectors. Hirose Electric supports advanced technologies in the consumer electronics, medical, industrial and automotive markets etc. “Hirose is one of the world’s leading providers of interconnect devices; we are much honored to be the authorized distributor of Hirose. The cooperation will definitely strengthen our supply capacity of connectors and other electronic components to the Asia market.” said Andrew Tan, Regional Product Marketing Manager of Heilind Asia Pacific.

INDUSTRY KART

RECHARGEABLE LI-ION COIN CELL BATTERIES New Yorker Electronics is distributing an advanced new rechargeable coin cell battery that delivers the world’s highest mAh Capacity. Ideal for such electronic devices as fitness bands, security devices, smart watches, dash cams and memory backup, the Illinois Capacitor RJD Series battery is different in design from other lithium ion coin-cell batteries. A new encapsulation technology significantly increases storage capacity by utilizing the complete space within the cell case.Not only has the energy density per cell been improved, the failure rate is superior to older designs.

Encapsulation, unlike conventional stacking construction, has resolved

older manufacturing issues which can affect safety and reliability. As a result, RJD Series batteries allow manufacturers to offer new levels of performance without product redesign. With the increased performance levels, product run time can be increased by 20% or more vs. a conventional lithium rechargeable coin cell battery. Alternatively, if product size is most critical, performance levels can be maintained with a physically smaller cell. Because of the internal encapsulation construction, UL-Listed RJD cells offer greater reliability and safety.

AVNET PROMOTES JESSICA DAUGHTEE TO CMO

RS COMPONENTS SHIPS HIROSE INDUSTRIAL CONNECTORS

Avnet announced the internal promotion of Jessica Daughetee to chief marketing officer (CMO), reporting to MaryAnn Miller, chief administrative officer (CAO). Daughetee has most recently served as vice president of global content, marketing and media. Under the new role, Daughetee will be responsible for overseeing the strategy, planning and development of Avnet’s global marketing initiatives including: advertising, branding, communications, content, creative services, digital strategies, events, press relations, social media and web. She brings more than 20 years’ experience across the marketing and communications spectrum to the CMO role. MaryAnn Miller, chief administrative officer, Avnet, commented, “I’m so pleased to announce the promotion of one of our own top women leaders to this important position. As CMO, Jessica will continue to drive awareness for the differentiated value of Avnet’s ecosystem and demand for Avnet’s solutions.” Jessica joined Avnet in 2016 as vice president of digital marketing, responsible for leading the development and deployment of the global digital strategy and marketing communications. Prior to joining Avnet she held several diverse senior-level marketing and communications positions at three top Fortune 500 companies, including Intel. There, one of the areas she was responsible for overseeing was the Intel Inside Program. She transformed the program to achieve increased marketing return on investment (MROI) by influencing and aligning partner investments to Intel’s business priorities and significantly expanded Intel’s global marketing reach to 169 countries. “Jessica has a talent for creatively tackling business challenges through smart strategy, and a unique ability to translate that into action to drive measurable impact across our global business,” added Avent CEO, Bill Amelio.

RS Components has introduced a highly robust series of connectors for industrial applications from Hirose The ix Industrial series meets all the requirements for space-constrained applications and can support I/O signal transmission speeds of up to 10 Gigabits per second. The connectors possess the potential to reduce installation space by up to 75% compared to RJ45 based solutions. The new Hirose series supports CAT5e (1-Gbps) and CAT6A (10-Gbps) cabling and features an optimized rugged and reliable EMI and ESD shielding design. The Key Characteristics of the Series Include availability with two keying codes for Ethernet and nonEthernet applications IEC PAS 61076-3-124 standard compliant a current rating of 1.5A for all 10 contacts 3A capability on pins 1, 2, 6 and 7 voltage rating of 50V 5000 mating cycles operating temperature of from –40 up to +85°C The connector receptacle can be mounted in parallel with a pitch distance of only 10mm, which enables close sideby-side positioning of multiple connectors on a single PCB. The receptacle shell is PCB mounted via through-hole solder legs to enhance PCB retention, and the wire-termination unit and cable clamp are integrated into a single plug shell. Additionally, the snap-in I/O plug connector offers a positive metal lock, which provides a clear tactile click to ensure secure mating. The ix Industrial series is suitable for a range of industrial applications including factory automation controllers, industrial robotics, servo amplifiers, PLCs and many others such as security systems.

ISSUE 07|VOL 1|JULY 2019|BISINFOTECH

SECURITY REPORT

May 2019’s Most Wanted Malware: Patch Now to Avoid the BlueKeep Blues Check Point Research has published its latest Global Threat Index for May 2019. The Research team is warning organizations to check for and patch any systems vulnerable to the ‘BlueKeep’ Microsoft RDP flaw (CVE-2019-0708) in Windows 7 and Windows Server 2008 machines, to prevent the risk of it being exploited for ransomware and cryptomining attacks. The BlueKeep flaw affects nearly 1 million machines accessible to the public internet, with many more within organizations’ networks. The vulnerability is critical because it requires no user interaction in order to be exploited. RDP is already an established, popular attack vector which has been used to install ransomware such as SamSam and Dharma. The Check Point Research team is currently seeing many scanning attempts for the flaw, originating from several different countries globally, which could be the initial reconnaissance phase of an attack. In addition to the relevant Microsoft patches, Check Point is providing both network and endpoint protections to this attack. Maya Horowitz, Threat Intelligence and Research Director at Check Point said: “The biggest threat we’ve seen over the past month is BlueKeep. Even though no attacks have yet been seen exploiting it, several public proof-of-concept exploits have been developed. We agree with Microsoft and other cybersecurity industry observers that BlueKeep could be used to launch cyberattacks on the scale of 2017’s massive WannaCry and NotPetya campaigns. One single computer with this flaw can be used to deliver a malicious payload that infects an entire network. Then all infected computers with Internet access can infect other vulnerable devices worldwide – enabling the attack to spread exponentially, at an unstoppable pace. So it’s critical that organizations protect themselves – and others – by patching the flaw now, before it’s too late.” Other significant malware news in May was the developers of the GandCrab Ransomware-as-a-Service affiliate program announcing on the last day of the month that they were ceasing operation, and asking their affiliates to stop distributing the ransomware within 20 days. The operation has been active since January 2018, and in just two months had infected over 50,000 victims. Total earnings for its developers and affiliates are claimed to be in the billions of dollars. A regular in the Top 10 Most Wanted Index, GandCrab was frequently updated with new capabilities to evade detection tools.

May 2019’s Top 3 ‘Most Wanted’ Malware:

*The arrows relate to the change in rank compared to the previous month. The three most prominent Cryptominers – Cryptoloot, XMRig, and JSEcoin continue to top the malware index, each with a global impact of 4%.

1. ↔ Cryptoloot – Crypto-Miner, using the victim’s CPU or GPU power and existing resources for crypto mining – adding

BISINFOTECH|JULY 2019|VOL 1|ISSUE 07

transactions to the blockchain and releasing new currency. It was a competitor to Coinhive, trying to pull the rug under it by asking less percent of revenue from websites. 2. ↔ XMRig – Open-source CPU mining software used for the mining process of the Monero cryptocurrency, and first seen in-the-wild on May 2017. 3. ↔ JSEcoin – JavaScript miner that can be embedded in websites. With JSEcoin, you can run the miner directly in your browser in exchange for an ad-free experience, ingame currency and other incentives.

May’s Top 3 ‘Most Wanted’ Mobile Malware:

This month Lotoor is the most prevalent mobile malware, up from 2nd in April. Triada drops from 1st to 3rd, while Hiddad climbs back up from 3rd to 2nd. 1. ↑ Lotoor – Hack tool that exploits vulnerabilities on Android operating system in order to gain root privileges on compromised mobile devices. 2. ↑ Hiddad – Android malware which repackages legitimate apps and then released them to a third-party store. Its main function is displaying ads, however it is also able to gain access to key security details built into the OS, allowing an attacker to obtain sensitive user data. 3. ↓ Triada – Modular Backdoor for Android which grants super user privileges to downloaded malware, as helps it to get embedded into system processes. Triada has also been seen spoofing URLs loaded in the browser.

May’s Top 3 ‘Most Exploited’ vulnerabilities:

In May we saw a comeback of traditional attack techniques (probably caused by the decrease in Cryptominers’ profitability), with SQL Injections techniques leading the top exploits vulnerabilities list with a global impact of 49%. Web Server Exposed Git Repository Information Disclosure and OpenSSL TLS DTLS Heartbeat Information Disclosure ranked second and third, impacting 44% and 41% of organizations worldwide respectively. 1. ↑ SQL Injection (several techniques) – Inserting an injection of SQL query in input from client to application, while exploiting a security vulnerability in an application’s software. 2. ↑ Web Server Exposed Git Repository Information Disclosure – information disclosure vulnerability has been reported in Git Repository. Successful exploitation of this vulnerability could allow an unintentional disclosure of account information. 3. ↓ OpenSSL TLS DTLS Heartbeat Information Disclosure (CVE2014-0160; CVE-2014-0346) – An information disclosure vulnerability exists in OpenSSL. The vulnerability is due to an error when handling TLS/DTLS heartbeat packets. An attacker can leverage this vulnerability to disclose memory contents of a connected client or server.

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CHINA ELECTRONICS FAIR CHENGDU JULY 11-13, 2019 CHENGDU, CHINA

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10TH EDITION INDIA SYMPOSIUM JULY 19, 2019 CHENNAI, INDIA

INDUSTRIAL ROBOT, SMART SENSORS AND ACTUATORS, INFORMATICS AND SECURITY

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BEIJING INTERNATIONAL CONSUMER ELECTRONIC EXPO AUGUST 02-04, 2019, BEIJING, CHINA

LIGHTING AND CONSUMER ELECTRONICS

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AUTOMOTIVE WORLD SEPTEMBER 05-07, 2019 PORTMESSE NAGOYA, JAPAN

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NEPCON NAGOYA SEPTEMBER 18-20, 2019 PORTMESSE NAGOYA, JAPAN

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Please make the Cheque/DD in favour of SAUR ENERGY INTERNATIONAL TO PAY THROUGH PAYTM /CREDIT /DEBIT CARD/ ONLINE LOG ON TO:

https://www.saurenergyinternational.com/ Kindly Send At This Address: C - 133, 3rd Floor, Lajpat Nagar - 1, New Delhi - 110024

Terms & Conditions: This is a limited period offer. Please write your name and address on the reverse side of the cheque or DD. Please allow 3-4 weeks for processing of your subscription. All outstation cheques should be payable at par. Saur Energy International will not be responsible for postal delays, transit losses or mutilation of subscription form. 1st copy will be dispatched by premium courier service and rest will be delivered by ordinary post only. Please include pincode for prompt delivery of your copy. All disputed shall be subjected to the jurisdiction of competent courts in Delhi only.