Bisinfotech Magazine July Issue 2020

R.N.I. No: DELENG/2019/77352 l VOL 2 l ISSUE 07 PAGES 64 | PUBLISHED : 1 JULY 2020

MAY 2020 80.00

JULY 2020

India Wearing The Wearables

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R.N.I. No: DELENG/2019/77352 l VOL 2 l ISSUE 05 l TOTAL PAGES 60 l PUBLISHED ON 1ST OF EVERY MONTH |WWW.BISINFOTECH.COM

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Manufacturing

lifeline for medical devices Cover story

T&M for

Manufacturing Test

Pit-Stop With EV Innovators Efficient Positive Rail to a Unipolar Negative Supply

INTERVIEW:

Dr. RA Gotur Hongfa Group

INTERVIEW:

Bharat Kaushal

MD, Hitachi India

SEI SAUR ENERGY INTERNATIONAL

Publishing Group

Prevent Electric Vehicle Recalls

The Challenge Of Powering Industrial IoT Applications

THE GAME OF DRONES

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Editorial

India can excel in electronics manufacturing

We have the geographic, demographic & a favourable political advantage now. Also we have the necessary technical skills. If we can just get all of these together then, we can very well compete. India has always been seen as a top destination for IT services, but today, the IT hardware sector also is trying to make a mark on the world map.

With the current standoff hotting up, India hopes that many large companies will look at India as an alternate destination.

Offsetting the India disability, support has to be given for a short period. It is not that the industry requires support from the government endlessly; it is only for a fixed period of time which is already on the offer. This support are in the form of tax rebates, refunds, etc.

Also I would like to say that the electronics industry offers India an opportunity as well as a challenge.

The challenge comes from the fact that we are a large consuming nation and we consume electronics by different sectors of the economy. Be it consumer electronics, be it industrial electronics, be it information technology; consumption is going to happen.

The challenge is, there is very little electronics manufacturing happening in the country. And most of the components that go into the manufacturing industry are imported.

That is the challenge we are facing as we, as a nation, are going to consume electronics and a lot of it is going to be CONSULTANT EDITOR NILOY BANERJEE niloy@bisinfotech.com

•Vol - 02 / 07

SUB EDITOR NITISHA DUBEY nitisha@bisinfotech.com

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MARKETING MANAGER ARNAB SABHAPANDIT arnab@bisinfotech.com DESIGN HEAD DEEPAK SHARMA

WEB DEVELOPMENT MANAGER JITENDER KUMAR WEB PRODUCTION BALVINDER SINGH SUBSCRIPTIONS PRIYANKA BHANDARI priyanka@bisinfotech.com MANAGER FINANCE KULDEEP GUSAIN accounts@bisinfotech.com

imported, putting the country in a net foreign exchange negative deficit scenario.

Now is the opportunity which comes from the fact that we as a nation have the capability to manufacture electronics because we have got the geography, demographics and technical skills. So, with the right policies, we can build electronics manufacturing in the country.

With the right support, we can expand to make them export led manufacturing units.

Now the NPE 2.0 (National Policy on Electronics) very clearly shifts from the old strategy of import substitution to an export-led strategy. If we create an export-led manufacturing strategy, we can have enough value addition in India to have foreign exchange positive.

ManasNandi

MANAS NANDI EDITOR manas@bisinfotech.com

Bisinfotech is printed, published, edited and owned by Manas Nandi and published from 303, 2nd floor, Neelkanth Palace, Plot No- 190, Sant Nagar,East of Kailash, New Delhi- 110065 (INDIA), Printed at Swastika Creation 19 DSIDC Shed, Scheme No. 3, Okhla Industrial Area, Phase-II, New Delhi- 110020 Editor, Publisher, Printer and Owner make every effort to ensure high quality and accuracy of the content published. However he cannot accept any responsibility for any effects from errors or omissions.

The views expressed in this publication are not necessarily those of the Editor and publisher. The information in the content and advertisement published in the magazine are just for reference of the readers. However, readers are cautioned to make inquiries and take their decision on purchase or investment after consulting experts on the subject. BisInfotech holds no responsibility for any decision taken by readers on the basis of the information provided herein. Any unauthorised reproduction of Bisinfotech magazine content is strictly forbidden. Subject to Delhi Jurisdiction.

Contents 36 TECHNICAL PAPER

12 BIG PICTURE

ADD AN EFFICIENT POSITIVE RAIL TO A UNIPOLAR NEGATIVE SUPPLY

India is a Strategic and Emerging Market for Hitachi

30 BIG PICTURE - UNLIKE OTHER COMPANIES, HONGFA HAS ITS OWN RELAY TESTING LAB

28 TECH FEATURE - THE GAME OF DRONES

42 AUTOMOTIVE - EVOLUTION OF IN VEHICLE INFOTAINMENT

47 AUTOMATION - EXPERIENCE LEADING EDGE DEVELOPMENT & INTEGRATED SOLUTIONS WITH MITSUBISHI ELECTRIC

08 ANALOG SIGNALS - OPTIMISING ANALOG SIGNALS TO SERVE OUR DIGITAL WORLD

20 T&M FEATURE - EVOLUTION OF T&M FOR MANUFACTURING TEST

44 TECHNICAL ARTICLE - THE TRY-BEFOREYOU-BUY ROUTE TO ENERGY EFFICIENT POWER DESIGN

•Vol - 02 / 07

58 WEARABLES - HOW'S INDIA WEARING

06

THE WEARABLES?

48 CASE STUDY - EASY AND SECURE REMOTE ACCESS FOR IMPROVED MACHINERY SERVICES

50 BIG PICTURE - TELEDYNE

E2V’S TECHNOLOGIES LEAD INNOVATIONS IN A&D AND BEYOND

61 5G - WHAT YOU NEED TO KNOW ABOUT 5G

34 COVID-19 - A MANUFACTURING LIFELINE FOR MEDICAL DEVICES

55 WHITE PAPER- SUPPRESSING ACOUSTIC NOISE IN SWITCHED-MODE POWER SUPPLIES

53 TECHNOVATORS -SHIFTING

ORBITS WITH ARTIFICIAL INTELLIGENCE IN SPORTS

24 VICOR - LEVERAGING BUS CONVERTERS IN REGULATED DC-DC APPLICATIONS

32 WHITE PAPER - MICROBRICKTM: A

SIMPLE SOLUTION TO BUILDING EFFICIENT HIGH DENSITY DC/DC CONVERTERS WITH A WIDE INPUT VOLTAGE RANGE

ANALOG SIGNALS

JULY 2020

Mark Patrick Mouser Electronics

W

e live in an analog world, but our experience of it is increasingly mediated by digital technology. If you look at the sky, you’ll see it is one of an infinite number of colours. If you look at a digital image of the sky, it can only be shown as one of a relatively limited number of fixed shades. And if you look at a compressed digital image of the sky, for example in an online video, you will often see the colour banding that reveals the gap between analog reality and digital representation.

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We can usually live with such shortcomings in digital media.

But when an analog signal forms the key input to a digital control system, we need to take more care of it. After all, no-one would drive a car whose brake sensors could only report that the brakes are ‘fully on’ or ‘fully off’. It just isn’t safe.

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OPTIMISING ANALOG SIGNALS TO SERVE OUR DIGITAL WORLD

And so we can see that it is increasingly important to maintain the integrity of the analog signals that provide the raw materials for digital systems. Without robust analog input signals, the most sophisticated control systems in the world are just guessing.

Even so-called ‘digital sensors’ rely on analog sub-systems that contain the core analog sensor, conditioning circuitry and an analog-to-digital converter (ADC) that turns the input signal into a digital number that can be easily used by the rest of the system. Designers therefore still need to understand how to capture and process a low-frequency analog signal correctly, so that it can be presented to an ADC for conversion into the digital domain for onward processing. This is especially true for those working on sensor-based systems such as the Internet

of Things (IoT) devices. Such sensor nodes are quite likely to suffer from low signal levels, reduced supply voltages that limit signal-to-noise ratios, and electromagnetic interference (EMI) in their operating environments.

Optimizing analog signal capture

A typical analog signal chain usually includes a signal source (often a sensor), buffering to protect the sensor’s operation from the influence of subsequent circuitry, filtering to remove noise and other unwanted signal components, amplification to make the signal easier to measure, and then the ADC. Each of the active elements, and their associated passive components, plays an important role in ensuring that the signal’s integrity is preserved so it can be faithfully converted into the digital domain.

The design process begins with understanding the source signal’s amplitude and its susceptibility to EMI. Most sensors output a DC voltage proportional to the parameter being measured, which could be light, temperature, pressure or many other physical parameters. Sensors often produce relatively weak signals, which makes them susceptible to EMI that can ruin the integrity of the ADC’s measurement. To counter this, it makes sense to place a follower circuit, such as a non-inverting amplifier based on an operational amplifier (op-amp), as close to the sensor as possible. Putting the follower circuit close to the sensor stops long signal traces acting as antennae that pick up ambient electrical noise. If it’s not possible to protect the signal in this way, it may make sense to shield long traces between the sensor and its follower circuit.

JULY 2020

The gain of the follower circuit is determined by the ratio of the resistors R2 and RF shown in Figure 1 below. These resistors’ values affect the amplitude of the signal passed down the signal chain, with a follow-on effect on factors such as signal to noise ratio and the accuracy of the analog to digital conversion. If the exact level of gain is critical to the circuit design, it is important to specify resistors with tight tolerances.

If a circuit needs to achieve a very precise amount of gain then it’s possible to specify matched resistors, such as the Maxim MAX5491LC parts. These mount two resistors, matched in value to within 0.035% of each other, in a SOT23 package.

Mounted this way, the resistors also exhibit a very low thermal o drift of 2ppm/ C over the operating temperature range of o o –40 C to +85 C.

The circuit offers low noise and zero drift because the two op-amps are co-packaged. Its low input bias current of 50pA and input offset voltage of 0.7µV means it has little effect on high-impedance signals, and so it can accurately amplify signals from any sensor. The common-mode input impedance of the circuit is around 100GΩ.

Figure 1: A non-inverting amplifier based on an op-amp.

The single op-amp circuit shown in Figure 1 will act as an ideal buffer, especially for driving a signal from remotely located sensors down long signal lines. It is simple to use but needs careful configuration to achieve the levels of precision needed to amplify small signals accurately.

Texas Instruments also offers a dual op-amp part, the highprecision OPA2156. It has a very low maximum offset voltage of +200µV, a low bias current of +5pA and low thermal drift of +3µV/oC> this makes it a very low-noise, high-precision buffer amplifier. The device can also swing both its input and output between its supply rails, has a bandwidth of 25MHz, o and a high slew rate of 40V/ s. This makes it useful for highspeed sensing applications. It is supplied in an eight-pin SOIC package and operates over the industrial temperature range o o of –40 C to +125 C.

ANALOG SIGNALS

Figure 2: A dual op-amp circuit can overcome some of the inaccuracies found in a single op-amp (Source: Analog Devices).

One way to overcome the limitations of a single op-amp is to use a matched pair of op-amps mounted in one package.

The circuit in Figure 2 below is often used with dual op-amps, such as the Analog Devices’ ADA4522 series.

Figure 3: Application example of a differential photodiode amplifier (Source: Texas Instruments).

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For example, theory tells us that the op-amp’s output should be zero if the potentials at the two inputs are the same. In practice, a small error voltage, known as the input offset voltage, is usually present. If the op-amp draws a lot of power to operate this can also affect very weak sensor signals.

Designers should, therefore, consider the input impedance of the op-amp (which often reaches MΩ), and the input bias current required by the op-amp to operate as part of their sensor-signal buffering strategy.

09

JUNE 2020

Some sensors have outputs that can be set up to work with a variety of op-amp configurations to achieve the correct amplification of their signals. Figure 3 shows a photodiode sensor that delivers an output current of 0µA to 90µA, and an output voltage ranging from –5V to +5V. Adding a capacitor to the feedback loop has created a filter, which reduces the amount of additional discrete filtering needed. For example, the 2.7pF capacitor in this example creates a filter cut-off frequency of 1MHz.

‘model’ of it is the quantization noise. It can be countered by increasing the resolution of the ADC.

Choosing the right data converter

For example, the Texas Instruments ADS1219 is a precision, 24bit ADC whose inputs can be configured as four multiplexed single-ended inputs or as a pair of differential inputs. It has an onboard buffer stage, which means that high-impedance signals can be directly connected to it. The ADC also has a programmable gain stage for further signal conditioning. The digital interface is a two-wire, 1Mbps I2C-compatible bus, and the part is housed in either a 16-pin WQFN or TSSOP package.

ANALOG SIGNALS

The circuitry described so far is meant to ensure that a relatively fragile analog signal, subject to corruption by external noise sources and poor circuit design, can be presented for measurement in the best condition possible. The next step is to ensure that its translation from the analog to the digital domain is as accurate as possible. Specifying the right ADC is critical to this process. Making this choice requires a good understanding of the various parameters that affect an ADC’s ability to transform an analog input signal into the kind of digital output that enables overall system design goals to be met.

The four primary parameters of any ADC are resolution, speed, accuracy, and noise.

Resolution is often confused with accuracy but is entirely different. The resolution of an ADC defines the number of different values it can output, which is usually encoded as a set of binary digits. For example, a 1bit ADC can output two values, while a 4bit ADC can output 16 different values.

This resolution figure also, therefore, defines the smallest incremental change that the ADC can output, as well as its smallest output value. In the case of the 4bit ADC, therefore, the smallest value and the smallest increment that could be recorded would represent one-sixteenth of the total range of the converter.

Accuracy, on the other hand, defines how faithfully the digital output represents the analog input and includes any offsets or nonlinearities within the ADC. In general, increasing resolution helps raise the accuracy of the conversion.

•Vol - 02 / 07

Speed affects applications such as video processing since an ADC’s conversion rate should be at least twice as fast as the highest frequency that needs to be captured in the source signal. (If you think of an ADC’s input as a basic sine wave, you can see that you need to sample it at least twice per cycle to accurately represent it). In many sensing applications, though, especially if you’re measuring physical parameters such as temperature, the conversion rate of the ADC is rarely a concern.

10

All ADCs generate some form of quantization noise as a by-product of the conversion. Going back to our sine wave input, the digital output will be a series of numbers that, given a fast enough ADC, would show a sine-wave shaped curve defined by a series of discrete steps. The difference between the true analog representation of the signal and the digital

It's important to choose an ADC that strikes the right balance between resolution, accuracy, conversion speed, and quantization noise, as well as enough channels to sense all the necessary signals. But ADCs are the gateway between the analog and digital world, and so it is equally important to consider how the ADC will interact with its digital host system.

Summary

As our analog world becomes increasingly mediated by digital technology, it is vitally important to do a good job of capturing, buffering, filtering and conditioning real-world analog signals so that they can be accurately represented digitally. This demands a strong understanding of how sensors work, the characteristics of their outputs, and how those outputs need to be conditioned for conversion. This analog signal chain will invariably include op-amps, discrete components, and data converters, each of which has to be thoughtfully specified to achieve the correct point and systemic performance of the target device.

BICS, Avnet Silica Accelerate Global IoT Deployment

Digi-Key Partners with Truphone

BICS has joined forces with technology solutions provider, Avnet Silica, to deliver IoT connectivity to OEMs, devices and applications. The collaboration will enable Avnet Silica to directly embed 2G, 3G, 4G, NB-IoT and LTE-M/Cat-M1 connectivity via BICS’ SIM for Things IoT global solution. This will also accelerate the deployment of Low Power Wide Area Networks (LPWAN) by solving many technical, operational and commercial challenges, helping hardware manufacturers deploy new IoT solutions around the world.

Digi-Key Electronics has recently announced that it has partnered with Truphone to bring cellular IoT connectivity services to manufacturers worldwide. The partnership will provide customers with connected cellular devices and a fully managed service.

Digi-Key will use Truphone’s state of the art SIM technology, allowing users to connect IoT devices to network providers from the moment they switch their device on. The technology requires no complicated activation process, it is simply connectivity from the touch of a button. The partnership will provide manufacturers of all sizes with industry-leading IoT connectivity services starting with device and application management. The Truphone network supports 2G, 3G, 4G and CAT-M1/LTE-M worldwide – with a single SIM card – and gives every customer access to its IoT Connectivity Management platform. Truphone’s simple prepaid SMS and data plans (which provide coverage in multiple countries across a three-year period) simplify the connectivity process, so manufacturers can focus on what they do best—building their application.

Additionally, mobile operators can capitalise on the opportunity to provide connectivity to a greater range of devices by opening up their networks to support the surging IoT demand.

An increasing number of mobile operators have partnered with BICS to support M2M connectivity, with BICS being able to offer NB-IoT/LTE-M connectivity in more than 30 countries worldwide.

Arrow Offers Free Consultation to Startups Arrow Electronics has recently announced it will offer free consultations to local technology startups and the innovation community at its Arrow Open Lab located at Hong Kong Science Park. The initiative is part of Arrow's commitment to supporting technology enterprises, startups, and the academic community to create, make and manage 5G-ready and AI-powered edge and endpoint devices for commercialization or R&D development. Millions of AI-powered IoT edge or endpoint devices being deployed on 5G networks will profoundly change the way we live, do business and interact with each other and the environment.

INDURSTY KART

JULY 2020

The free consultations aim to help technology companies configure the electronic system architecture design of their edge endpoints/devices for delivering optimal results across 5G networks and AI technology. Arrow's engineers and technical experts will provide insights and recommendations across the development roadmap including: • Selecting the system architecture with the most desirable and power-efficient computing for running AI algorithm (CPU vs FPGA vs GPU vs ASIC) • Integrating a massive network of AI-powered sensors to yield actionable data insights • Understanding 5G-specific protocol performance validation and standard and regulation compliance

•Vol - 02 / 07

• Formulating end-to-end security strategy with bi-directional network and node authentication to ensure secured access of data

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JULY 2020

•Vol - 02 / 07

BIG PICTURE

In a most extensive interview with Niloy from BIS, Bharat Kaushal, Managing Director of Hitachi India shares insights on the company’s long legacy in the Indian market. The veteran also underlines on key trends and technologies shaping New India. Added, Bharat shared about Hitachi India’s expertise, focus, the changing healthcare sector, urban mobility, e-Governance etc.

Edited nub below.

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&

JULY 2020

INDIA IS A STRATEGIC EMERGING MARKET FOR HITACHI Hitachi India – Transforming Lives.

Building a Sustainable Nation.

Development and e-Governance to drive Digital India initiatives of the nation.

Hitachi’s partnership with India dates back to the 1930s with importing of table fans and later on went on to supply steam engines followed by Turbines for the Bhakra Nangal Dam. Since then Hitachi has been mounting its footprints in India and solidifying its position with presence of around 28 group companies (as of December 31st, 2019) and approximately 12,000 employees (as of December 31, 2019) fueling the transformation of India.

Through its solid foundations, Hitachi is belligerently contributing, by localising its infrastructure capabilities through sprucing up capacity in India. The geographic advantage of setting up manufacturing capacity in India allows Hitachi to offer state of the art technology not just to the Indian market, but also to South-East Asia, South Asia, Middle East, Africa, etc., enabling it to contribute in value creation across different parts of the world.

We are now in a new era, one in which globalization and rapid evolution of digital technologies such as the Internet of Things (IoT), Artificial Intelligence (AI) and robotics are bringing significant changes to society. Social Innovation is combining new technologies such as IoT, AI, Robotics, Big data with Advanced Analytics, capable of achieving a forward-looking affluent society that balances economic advancement with the perseverance of social problems.

The diversified product solutions offered

by Hitachi and its commitment to the government of India’s initiative of Make in India and supply to the world, Tata Hitachi Construction Machinery Company Ltd. a Hitachi group company, is exporting to Africa and the Middle East, its hydraulic excavators designed and produced in India based on specifications for emerging countries. Hitachi Hi-Rel Power Electronics Pvt. Ltd. is exporting UPS (Uninterruptible Power Supplies) to the Middle East countries.

Offering financial inclusivity to India and to the world, Hitachi Terminal Solutions Trends Shaping Urban Mobility in India Private Limited is exporting Cash India?

Recycling Machines (CRMs) to countries including South Africa. Contributing to Mobility flows have become a key an energy reliant India, high-efficiency dynamic in the rapid transformation of amorphous distribution transformers are Indian cities, requiring state-of-the-art exported to various countries in Africa urban transportation infrastructure; smart including Ghana, Kenya, Uganda, and mobility solutions for the movement of Ethiopia. Hitachi Metals (India) Pvt. Ltd. people and goods between cities and is the business counter for supplying within cities are imperative. While India amorphous metals to Indian transformer has long been struggling to ensure mobile comfort for its citizens, issues like makers.

BIG PICTURE

At Hitachi, we consider SDGs as an important thread that binds the businesses for realizing a sustainable society and improving people's quality of life through solving global, social and environmental issues. We have significantly contributed to achieving the SDGs through our Social Innovation Business, which also serves as a source of sustainable growth for us Every solution offered by Hitachi is a reflection of its commitment. to work towards making this society a comfortable place to live.

Hitachi is committed to ‘Powering Good’ by co-creating solutions that are enhancing Social, Environmental and Economic values of the society and the customers. With our decades of legacy, we have been Powering Technology and contributing towards improving the Quality of Life of the citizens and empowering them more than ever before.

•Vol - 02 / 07

Hitachi is at a vantage point to efficiently deliver Social Innovation Business solutions combining its OT, IT and products. Hitachi has been partnering to work with the government in achieving a sustainable society by developing a robust framework for a smooth transition to Society 5.0 and help resolve various social challenges through new-age digital technologies. A leading partner to the Indian government, Hitachi is efficiently collaborating with the government in Railways, Finance, e-Education, Agriculture, Urban

In September 2015, under the United Nations Development Program, the United Nations adopted the 2030 Agenda for Sustainable Development, with Sustainable Development Goals (SDGs) as its core.

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JULY 2020

•Vol - 02 / 07

BIG PICTURE

last-mile connectivity, optimisation of existing capacity, the feasibility of varied transportation modes and safety demand immediate attention.

14

With India planning to scale-up and surge ahead on the economic front, greater emphasis is being given to infrastructure development across the country. A significant part of this key activity revolves around urban mobility and connectivity.

With rapid urbanisation happening in the country at an unprecedented pace and millions of people commuting across burgeoning metro cities on a daily basis, the pressure is mounting on public transport systems. Mass Rapid Transport System (MRTS) has, therefore, emerged as one of the most effective means of mobility for people in the country’s Tier1, Tier-2 and Tier-3 cities and Metrorail has been playing a noteworthy role. To cope up with these challenges, urban transportation infrastructure in India requires a big investment and large-scale up-gradation. This could be addressed and resolved through meticulous planning and implementation of varied types of MRTS network including Metrorail, Metrolite for achieving multi-modal connectivity.

India is one of the emerging economies which needs to focus on building infrastructure and meet basic requirements for people from different strata of society. What is required is a balanced focus on extending transportation infrastructure, as well as leveraging smart technology solutions augmented with artificial intelligence (AI) and machine learning (ML) to quickly improve the efficiency and capacity of public transportation, and to create a high-quality MRTS. With a planned and well-defined structure, MRTS can contribute towards building seamless connectivity from first mile to the last mile to achieve an integrated multi-modal transport system, which will be an important contributor towards achieving the $5 trillion economy target set by the government. Through its Social Innovation Business (SIB) solutions, Hitachi is powering good to build a sustainable society.

Hitachi’s comprehensive urban mobility solutions are empowering citizens and are enhancing the environmental value of customers by collaborating in the automotive industry’s transition to low-carbon-footprint EVs. Hitachi’s growing partnership in the successful implementation of Metro Rail Systems is consistently demonstrating the comprehensive urban mobility solutions and its pioneering capability in Advanced Train Control, signalling (CBTC) and Telecommunication Systems, Rolling stocks and Seamless open-loop transit systems.

Hitachi through Hitachi MGRM Net is CoCreating solutions to digitally transform citizen’s healthcare ecosystem with the aim to accomplish Greater Transparency and elevate the patient experience, significantly.

Envisaged to enrich a citizen’s entire lifecycle, M-Star enabled digital Healthcare solutions platform like e-HR is supporting government’s progressive healthcare schemes like Ayushman Bharat and Mission Indradhanush among others, Hitachi is contributing to building an inclusive Healthcare system at the very grass-root level.

A robust mass transportation system is key to low carbon footprint society, which is high on the country’s Social Development How technology is shaping the Goals. Therefore, by actively contributing agriculture sector, Hitachi India's to major urban projects like the Kolkata prowess in it?

Metro Rail Corporation (KMRC) and Navi Mumbai Metro Rail (CIDCO), Hitachi is The new-age agriculturists are deploying contributing towards minimizing vehicular innovation and technology to foster a pollution and density while increasing new green revolution, and precision citizen’s productivity through faster and farming is emerging as a popular feature of this transition. Precision agriculture is enhanced commuting experience. the application of the correct amount Creating new benchmarks for India’s of inputs at the right time to the crop to urban transportation system through increase the productivity and maximise Social Innovation Business, Hitachi aspires the yield. The use of GPS allows precise to Power Good and build a sustainable mapping of farmlands. This, along with appropriate software, informs the society. farmers about the status of their crops Technology shaping the healthand identifies the area of the farm that requires water, fertiliser or pesticide, care sector and Hitachi India's enabling them to make well-informed expertise and focus into it? decisions.

Today, more than ever, Healthcare Industry needs comprehensive digital For the government, self-sufficiency in food interventions to offer sustainable solutions and agriculture is essential to a citizen’s to the patients. The IoT and AI-enabled well-being. The digital agri-transformation comprehensive Advanced Analytics by Hitachi MRGM Net nurtures the Solutions are revolutionizing digital patient Connected Farmer Ecosystem enabling care and critical hospital applications. the creation of crop portfolio, crop Predictive Maintenance helps healthcare protection, crop insurance and access professionals evaluate assets, diagnose to Intelligent Market Channels helping or predict problems through advanced farmers thrive, by Optimizing Price and analytics, and take timely decisions Best Yield Quality. for maintenance or other appropriate actions. With the world evolving and It covers all aspects of the agriculture challenging health issues are being comprehensively. Educating farmer foreseen, digital technology is going groups on the latest technologies in to play a pivotal role in integrating and farming, Agriculture Extension, remote uniting the Universe. From predictive help for issues in agriculture, promotion of to preventive, digital technology will the agriculture as an enterprise, required drive innovations in how patient’s needs knowledge sharing and training are all are addressed, and health issues are part of the program. diagnosed.

JULY 2020

With the experience and expertise of over 100 years in Operational Technology (OT) and 50 years in Information Technology (IT), Hitachi has helped India become equipped for the IoT era and drive the country’s digital transformation. With Hitachi's innovative and globally recognised OT (Operational Technology) X IT solutions and data analytics, customers progress from IoTenabled interactive devices to artificial intelligence (AI)-enabled devices with the cognitive functions of living beings. This shifts how technology touches live and fuels the digital revolution. Through this technological leap, Hitachi introduces a new world of possibilities for policymakers, businesses and organisations to enhance the quality of life.

Hitachi partners with the Government of India’s progressive projects, such as the Make in India and Digital India initiatives, to take a predominantly agrarian India into the IoT era, a leap that is critical to the nation’s emergence as a global production and economic powerhouse.

With its superior technology innovation and global expertise, Hitachi helps address India’s unique challenges.

The technological evolution in India is transforming the lives of citizens and

e-Governance instituting for a better governance and Hitachi India's role in empowering the government and citizens

• With a people-first motto, the government of Andhra Pradesh strives to provide an agile and efficient public service delivery system benefitting nearly 50 million citizens, in a 360-degree life cycle approach through its Real Time Governance (RTG) initiative. With the help of Real Time Governance, in partnership with Hitachi, The Andhra Pradesh government can now swiftly resolve citizen grievances and monitor infrastructure projects, incidents, weather and climatic events across the state in real time, leveraging technology services. Big data sets gathered from various sources with the help of Hitachi are leading to insightful decisions to vibrantly transform citizen services. Blending technology and citizen centricity, Real Time Governance revolutionize governance in Andhra Pradesh, catalyzing government operations to create a safer, more efficient and sustainable society.

e-Governance has moved beyond government departments. It is about transforming the way governments work and reinvent people’s participation in the democratic process. e-Governance provides a platform to integrate solutions and services between Government-toCitizens (G2C), Government-to-Business (G2B) and Government-to-Government (G2G), empowering both the government Hitachi’s contribution towards and the citizen like never before. building a Knowledge-Driven Over the years, numerous initiatives have been undertaken by various State Governments and Central Ministries to promote e-Governance in a holistic manner and improve the dissemination of public services to the citizens. This encapsulates, an evolving countrywide infrastructure reaching down to the remotest of villages and large-scale digitisation of records to enable easy, reliable access over the internet.

India is a leader in the public sector led social change by using technology to drive e-governance measures. Several government schemes and its deployment in India are a true testimony of social innovation which is constantly easing the lives of common citizens.

With innovation and expertise, Hitachi provides a diversified range of information technology solutions across various sectors to empower the citizens of India, transform the economic landscape and continue to remain a part of India’s great growth story.

Our technologies are an illustration of how we are impacting the lives of millions every day.:

Economy?

Hitachi understands the power of data to build a robust e-Learning infrastructure in the country. Already touching 5 million students Hitachi through Hitachi MGRM Net is helping bring transparency, accessibility, accountability, security and compliance to the education system.

Aimed at leveraging Information & Communication Technology (ICT) for enhancing the academic delivery system in schools under Kendriya Vidyalaya Sanghathan, KV Shaala Darpan is an e-Governance platform for all Kendriya Vidyalayas in the country. It aims to improve quality of learning, efficiency of school administration, governance of schools & service delivery to key stakeholders namely, students, parents, teachers, community and schools.

BIG PICTURE

The Government of India is driving India’s growth story with transformative initiatives like the Smart Cities Mission, Make in India and Digital India. By harnessing Information Technology (IT), Operational Technology (OT), Internet of Things (IoT) and big data analytics, the government is redefining the way it engages with the citizens.

Disruption fueled by future technologies lights a new path for governments to address rapid urbanisation challenges.

Organisations are moving swiftly from “closed innovation” to co-creation and strategic partnerships to keep pace with technological advancement and innovation at greatly enhanced speeds.

While IoT has been driving the technology at a scale in India, we will see various technologies with widespread adoption as well, like cybersecurity and data analytics, among others.

Hitachi’s innovative technology has ignited a social revolution. Brought to the forefront are technologies like IoT, AI, robotics and so on, that touch every sector. Through digital technologies, Hitachi reforms social and business infrastructure to empower citizens more than ever as they reimagine how goods and services are delivered.

Revolution through the cashless economy and new game-changing technologies from the payment gateway to smart cards India’s banking sector has undergone a paradigm shift in the past two decades.

The role of technology has grown from being a mere cog in the strategic framework of companies to driving,

•Vol - 02 / 07

IoT, cloud and Big Data future and current scenario

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shaping and redefining business models and revenue streams.

While the digital interface in FinTech has grown by leaps and bounds, cash remains an equal catalyst in bridging the conventional vs digital gap.

The Government’s push to improve digital knowledge through initiatives spanning infrastructure, literacy and ease of accessing digital services has had a significant impact. These include building the digital infrastructure by creation of Unified Payments Interface-based ecosystem to boost payment transactions, making high-speed internet available at low costs, increasing smartphone penetration and more. The burgeoning rural sector is also paving the way for a transformation in how cash and digital payments are accessed through multifarious platforms.

•Vol - 02 / 07

BIG PICTURE

The rise of e-commerce, innovation in payments technology using artificial intelligence (AI), Blockchain, Internet of Things (IoT) and real-time payments; and the introduction of mobile Point of Sale (POS) devices and QR codehas led to a reduction in the cost of acceptance infrastructure and also contributed to its growth. The technology levered Aadhaar programme is the biggest disrupter in financial inclusion delivery as it enables targeted transfers of government benefits.

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Hitachi Payment Services (HPY), a leading player in the payments space and a part of the Hitachi group, has been revolutionising the cash and digital payment channels in the country with over 55,000 ATMs (including Cash Recycling Machines), 1.3 Million POS devices (includes mobile POS and QR) and 3,500 White Label ATMs besides Toll and Transit Solutions across the country.

helpful from the merchant’s perspective as the merchant can accept various payments through a single device.

The e-commerce market has grown exponentially in the past few years. For this segment, HPY’s state-of-the-art, agile and secure Internet Payment Gateway provides a faster and single-click checkout experience for top payment gateways. Hitachi Payment Services and State Bank of India (SBI) entered into a Joint Venture (JV) for the establishment of state-of-the-art card acceptance and future-ready digital payment platform for India. The JV combines the unparalleled distribution network, customer trust of SBI with cutting edge technology and services of the Hitachi Group in areas such as digital payments technology, services, big data, analytics and artificial intelligence. The JV will provide a comprehensive suite of payment options to customers and merchants focusing on areas such as roll-out of a nationwide card acceptance infrastructure, quick response (QR) code acceptance, Unified Payment Interface (UPI), mass transit sector and e-commerce businesses. To support the Government’s recently launched ‘one nation, one card’ initiative, Hitachi Payment Services in a strategic collaboration with SBI created an open loop card-based ticketing system on qSPARC 2.0 (NCMC) standards for Noida and Nagpur metros. HPY’s open-loop system is designed to help people use the same card for both transits as well as retail payments. HPY’s toll and transit solutions for Metros, Buses and Electronic Toll Collection (ETC) provides commuters with a satisfying experience that blends the convenience of travel with secured digital payments. HPY's solutions seamlessly integrate payment systems with auto gates (accepting open and closed-loop card solutions) and automatic fare collection system, thereby transforming the fare collection process. With over a billion transactions occurring daily, Hitachi is disrupting the payments landscape of India, thus enabling greater financial inclusivity.

Hitachi Payment Services has been at the forefront of developing digital payment infrastructure with its range of solutions, which includes end-to-end POS processing services, e-commerce processing services, reconciliation and settlement services, Key leadership focus of Mr Bharat Kaushal in Hitachi risk management services as well as toll and transit solutions. India after his incumbency?

HPY's end-to-end POS processing services enable seamless and secure cashless payments. Its inhouse developed switching After working for 25 years in the investment banking sector, platform is PCI DSS compliant, device and communication I took this challenging opportunity on June 1st, 2017 to be agnostic that also supports several initiatives of Digital India the first Indian head of Hitachi India and feel truly honoured Stack like UPI and Bharat QR. With end-to-end turnkey to be appointed at this position. India is a strategic and merchant acquiring managed services that include Merchant emerging market for Hitachi. I believe that my experience Onboarding and Management, Merchant and Transaction Risk in promoting cross-border business relationships between management, Settlement and Reconciliation Services, Asset the Japanese and Indian government and companies is a Management Services and Field Services, HPY is contributing unique advantage for Hitachi to achieve unprecedented to the rapid growth of electronic payment channels in the growth. With strenuous efforts, I will continue to work towards aggressively expanding Hitachi’s Social Innovation Business, country. develop novel solutions and draw upon Hitachi’s wealth of It's customised offering of an Integrated POS payment platform, technologies and expertise to provide a diversified range of is the next generation payment mechanism for POS devices information technology solutions in various industrial sectors, that enables Bharat QR, UPI and wallet transactions apart empowering the citizens of India, transforming the landscape from standard card payments via the POS device. It is also of Indian economy and aligning with India’s growth.

JULY 2020

element14 New Range of Mouser Electronics New Innovative Power Solutions Product Insider: June 2020

Last month, Mouser launched more than 416 new products ready for same-day shipment.

Some of the products introduced by Mouser last month include: • Texas Instruments MSP430FR600x Ultrasonic Sensing and Measurement SoCs TI’s MSP430FR600x SoCs offer an integrated ultrasonic sensing solution module that provides high accuracy for a wide range of flow rates to help achieve ultra-low-power metering.

• AVX Automotive EV/HEV Solutions AVX automotive electric vehicle and hybrid electric vehicle (EV/HEV) solutions meet the needs of a range of applications, including power conversion, advanced driver-assistance systems (ADAS), lighting, active body control, and powertrain.

New Yorker Electronics New Rochester Electronics Vishay Thin Film Resistors Partners with ISSI New Yorker Electronics has just released the new Vishay Dale PATT and PLTT High Temperature Thin Film Resistors. Vishay’s proven precision thin film wraparound resistors are ideal for use in oil industry precision applications requiring low noise, long term stability under high temperature, ultra low temperature coefficient of resistance, and low voltage coefficient. They are also used in military, telecommunications and industrial applications. The high temperature Vishay Dale PLTT has an operating temperature range from -55°C to 215°C. The series has stable film and performance characteristics and has a very low noise and voltage coefficient (less than -30 dB, 0.1 ppm/V).

The PLTT0603 case size is qualified to AEC-Q200 for automotive applications. It has anti corrosion resistant film with special passivation method (SPM) and is UL 94 V-0 flame resistant.

The surface mount resistor has wraparound gold over nickel barrier terminations.

The PATT Precision Automotive High Temperature Thin Film Chip Resistor is also AEC-Q200 Qualified. The terminations consist of an adhesion layer, a leach resistant nickel barrier and gold plating that is compatible with high temperature solder systems.

Rochester Electronics, world’s largest continuous source of semiconductors has recently announced partnership with Integrated Silicon Solution Inc. (ISSI) On the partnership Steve Jensen, Rochester Electronics Vice President Global Supplier Development said, “Rochester is excited to announce our partnership with Integrated Silicon Solution Inc. ISSI is technology leaders designing and developing high-performance integrated circuits for the industrial, medical, automotive, and communications markets. Their focus on high-speed and low power SRAM, low and medium density DRAM and NOR flash memory align closely with our strategy to expand our solution offering for our global customers.”

“ISSI has an unparalleled reputation in the memory business for long-term support with minimal die changes and no end of life. This 30-year plus strategy provides the foundations for our support to the Industrial, Medical, and Automotive market segments and helps them manage their long-term costs. Rochester with their history and focus on lifecycle management, is the perfect partner to support and enhance and expand on our 30-year track record in these areas.

INDURSTY KART

Mouser Electronics is focused on the rapid introduction of new products and technologies, giving customers an edge and helping speed time to market. Over 800 semiconductor and electronic component manufacturers count on Mouser to help them introduce their products into the global marketplace.

Mouser's customers can expect 100% certified genuine products that are fully traceable from each manufacturer.

•Vol - 02 / 07

element14 has enhanced its semiconductor portfolio with a new range of compact, highly energy efficient power, motion control, and sensor solutions by Monolithic Power Systems (MPS). Since the company was established in 1997, MPS has patented many ground-breaking technologies, including its most notable achievement of integrating an entire power system onto a single chip, which continues to drive their highly integrated systems today. Its mission is simple: to provide green, practical, and compact solutions that help to reduce total energy consumption. MPS is the fastest growing power semiconductor company, specialising in the manufacture of small, energy efficient and easy-to-use power modules. The modules are commonly used in systems to support industrial applications, telecom infrastructures, cloud computing, automotive and consumer applications. Design engineers will benefit from MPS’ specialised single-package power modules which integrate a maximum number of components, including the inductor, to provide an entire power system in one device. Integrating all components into a single package accelerates the design process and provides greater flexibility for customers to focus on configuring a device’s attributes.

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2020

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JULY 2020

T&M FEATURE

Evolution of T&M for Manufacturing Test Bridging digital divide is possible with low cost hand phone availability across world. Today’s young generation is always on move and willing to be connected all time everywhere & others also have wish to remain connected with dear ones.

All this is possible when we have good quality smartphone or other devices and telecom network. Smartphones/ Devices made this possible (Always connected) and has been very instrumental in increasing productivity across many vertical such as retails, railways, traffic control & management or reporting etc. All smartphone manufacturers need best test and measurement solutions to meet Time to Market (TTM) demand & establish brand rapport. Manufacturing test solution must be cost effective and support all current technologies. & possible to scale up for future requirements. Every second counts in manufacturing environment and this is money-i.e. shorter test duration leading to more testing which mean more product ready to deliver. Lowers test cost with less test time in production area is key consideration for any manufacturers.

Anritsu Test & Measurement solutions are used in many consumer electronics devices such as Smartphone, Data Cards, Data Dongle or other CPE- Customer Premise Equipment and commercial telecom network systems such as Base Station or BTS or Antenna or Cable or Optical Fibre Cables or transport network or components such as RF or optical modules used in telecom networks.

This article covers Smartphone , Antenna and Optical Modules manufacturing test details.

Best Solution for Smartphone Manufacturing Smartphone Evolution

Smartphones and tablets are showing remarkable success and the market continues to grow. In particular, smartphones are incorporating various new technologies, such as LTE, multiple antennas using MIMO, and connectivity wireless, like WLAN and Bluetooth.

•Vol - 02 / 07

Smartphone Production Challenges

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Today's smartphones use 3G and LTE cellular wireless technologies with MIMO antennas for faster data transfer rates.

With more RF components, smartphone manufacturers need more calibration and testing. As well as meeting the need for faster data communications, the fusion of cellular wireless and connectivity wireless technology is essential to smartphones.

Madhukar Tripathi

Head –MARCOM & OPTICAL PRODUCTS, ANRITSU INDIA PVT. LTD

In implementing connectivity wireless, the module maker tests the connectivity wireless technology when the smartphone vendor purchases connectivity wireless modules for their smartphone. However, when implementing both cellular wireless and connectivity wireless in one chipset or when mounting a connectivity wireless chipset on-board (CoB: Chip on Board), the smartphone manufacturing vendor tests the connectivity wireless technology. The many RF components and wireless technologies to test complicate the calibration of the test system by adding splitters and switches and control software. In addition, the many wireless technologies to test increase production costs through additional investment in test equipment at production ramp-up. In future smartphone manufacturing, a key issue in adapting to multiple wireless technologies is how to simplify test systems and cut production costs.

Test System Simplification

In terms of antennas today (smartphone RF components), smartphones incorporate cellular TRX, cellular RX diversity, WLAN/Bluetooth, GPS RX, and digital broadcast antennas.

One piece of wireless test equipment with multiple connectors would be ideal in cutting production costs when testing these multiple RF paths. Moreover, from the viewpoint of test system simplification, one piece of wireless test equipment with internal devices such as splitters and switches and calibrated RF connection ports would be perfect. The Universal Wireless Test Set MT8870A has four RF connection ports on a TRX test module. Test Port 1 and Test Port 2 are full duplex, while Test Port 3 and Test Port 4 are half duplex. The TRX test module has a Vector Signal Generator (VSG) and a Vector Signal Analyzer (VSA) connected to each RF port via a switch (Figure 1). All test ports are calibrated at the port edge.

JULY 2020

Universal Wireless Test Set

MT8870A

The MT8870A is a test instrument for mass-production of various wireless communications equipment and modules. Up to four high-performance test units can be installed in one main unit.

The Universal Wireless Test Set MT8870A has been specifically designed for the high volume manufacturing test of cellular and connectivity wireless devices and modules supporting 5G NR sub-6GHz, LTE, LTE-V2X, NB-IoT, Cat-M, V2X 802.11p, WLAN and Bluetooth etc. An MT8870A instrument mainframe can contain up to four TRX Test Modules MU887000A/01A each capable of independent control by an external PC. Each module has an integrated Vector Signal Generator and Vector Signal Analyzer to perform both transmitter and receiver RF tests. The MT8870A with the MU887000A/01A test module can be controlled by an external PC.

Cutting Future Production Costs

To meet future smartphone needs for faster data communications, the trend is towards installation of 802.11ac and LTE technologies. Supporting both 802.11ac and 802.11a/b/g/n requires an instrument with a measurement bandwidth of 160 MHz on the production line. Since today's LTE will extend into the 4-GHz band with LTE-Advanced, any LTE test instrument must support future frequency bands.

The MT8870A has a wide measurement bandwidth of 160 MHz required for testing 802.11ac as well as a contiguous frequency range from 10 MHz to 6 GHz. In addition, since it runs measurement applications for both cellular and non-cellular wireless technologies including connectivity wireless, it is the ideal all-in-one measurement platform for cutting investment and production costs for both future cellular and non-cellular wireless technologies.

Today’s smartphones are using MIMO antenna technology for faster data communications, and are also fusing cellular wireless with connectivity wireless technology. Smartphone manufacturers adapting to multiple wireless technologies face the twin challenges of how to simplify future test systems and cut costs. The MT8870A with four RF ports on each module helps simplify test systems. Furthermore, with support for the 160-MHz wide bandwidth required for testing 802.11ac, a contiguous frequency range from 10 MHz to 6 GHz, and measurement applications for both cellular and non-cellular wireless, the MT8870A helps cut future investment and production costs.

T&M FEATURE

Conclusion

Universal Wireless Test Set MT8870A

TRX Test Module MU887000A/MU887001A

• Built-in signal generator and signal analyzer • 160 MHz wide measurement bandwidth • Wide frequency range from 10 MHz to 6 GHz • One module supporting multiple wireless standards Supported standards: 5G NR sub-6GHz, LTE/LTE-Advanced, LTE-V2X, NB-IoT, Cat-M, W-CDMA/HSPA, TD-SCDMA, GSM/EDGE, CDAM2000/1xEV-DO, WLAN 802.11a/b/ g/n/p(V2X)/ac/ax, Bluetooth v5.0, ZigBee, Z-Wave, FM/RDS, GPS/Galileo/GLONASS/BeiDou/QZSS, DVB-H, ISDB-T/ISDB-Tmm • Built-in audio analyzer/audio generator

RF System, Components Manufacturing

High-volume manufacturing requirements are driving the latest generation of vector network analyzers (VNAs). Mobile devices, network equipment, and data centers are being designed for commercial trends such as higher-speed mobile data.

These devices need to be produced in very high volumes at low costs. Therefore, production throughput is an extremely important parameter for these applications. Recognizing today’s production requirements, VNA suppliers are making an effort to deliver RF/microwave VNAs capable of increased throughput in high-volume manufacturing environments Anritsu’s new Performance ShockLine MS46500B Series of VNAs lowers the cost of test and speeds time to market in numerous testing applications to 8.5 GHz. These applications include mobile network equipment design and manufacturing, mobile devices, automotive cables, high-speed data interconnects, and system integration components.

The ShockLine family of VNAs provides a range of solutions to meet the demands of any manufacturing floor. Offering

•Vol - 02 / 07

• Designed for high volume smartphones, tablets Automotive, IoT devices and wireless modules manufacturing test applications • Supports WLAN, cellular, Bluetooth, and other connectivity wireless applications • 4 high performance modules in one small chassis • Supports simultaneous measurement of multiple wireless standards • One license enables the associated capabilities on all installed modules

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solutions that meet a variety of size, performance, and cost requirements, these products provide fast sweep speed and wide frequency range – minimizing test times and maximizing throughput. ShockLine VNAs provide manufacturers with:

Optimized performance: With 15 models to choose from, ShockLine VNAs lower the cost-of-test without sacrificing performance, as compared to other VNAs on the market where generally more complex and higher priced VNAs must be selected for the same applications.

Durability: No keypads or touchscreens on the ShockLine VNAs

T&M FEATURE

increases durability by eliminating these fragile components that can cause maintenance issues.

Speed: ShockLine VNAs are optimized for excellent

manufacturing throughput. Fast sweep speeds, remote control through modern USB or Ethernet interfaces, minimal overhead in SCPI, and driver programming interfaces all add up to give ShockLine VNAs fast measurement speeds and great throughput.

Size: All of the ShockLine VNAs come in small, robust chassis

that enable manufacturers to optimize production space and lower their overall cost-of-test. Smaller instruments enable better use of production floor and test rack space, and allow for the VNA to be placed closer to the Device Under Test (DUT), which minimizes or eliminates costly cabling and other fixturing.

Ease of use: With common software, all the ShockLine models have the same graphical user interface (GUI) and remote control software. Transitioning from one model to another is very efficient, and allows manufacturers to keep higher performance models in the lab and more cost effective models on the production floor. The common software also enables faster development and deployment of test programs, speeding the time-to-market.

World-class customer support: with a 3-year warranty, all ShockLine models come with global support and service when needed.

Manufacturing and Evaluating Optical Modules and Devices

Data volumes are growing exponentially as providers offer new applications. On the other hand, data centers are trying to hold down system equipment costs while manufacturers of optical modules require less expensive but expandable test instruments supporting the transition from 10G to 25G and higher bit rates. The BERTWave MP2110A is targeted at production of optical module for 100 GbE/ 25 GbE and combines a BERT (Bit Error Rate Test) and Sampling Oscilloscope (Eye Pattern Analysis) in an All-in-one cabinet. It increases optical module production efficiency and helps reduces production costs.

Eye pattern analysis. Incorporating a BERT and sampling oscilloscope into the All-in-one BERTWave MP2110A greatly simplifies measurement system configuration.

Installing the BERT and sampling-oscilloscope options for up to 4ch in one unit makes it easy to implement simultaneous TRx measurements of optical modules, such as multichannel QSFP, and devices using an easily configured and controlled measurement system. This helps cut growing measurement times as the number of channels increases with development of multichannel optical modules and devices.

Model Comparison for the Manufacturing Environment

With 15 models to choose from, the ShockLine family of VNAs has a solution to meet the test and measurement requirements in a manufacturing environment. Compact and durable, the ShockLine family of VNAs are ready-to-use right out of the box.

Poor Efficiency, Long Time No Switching Necessary, Simple Measurement System

•Vol - 02 / 07

Configuring Efficient Measurement System: Integrated BERT and Sampling Oscilloscope

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With a BERT and sampling oscilloscope in one box, measurement results can be captured all at once along with simultaneous Eye pattern display. As a result, all the measurement results needed to evaluate multi-channel optical modules and devices can be seen at a glance, reducing measurement times by large margins.

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In addition to using a BERT, sampling oscilloscope and spectrum analyzer, manufacturing inspection of optical modules and devices requires optical attenuators and optical switches.

Anritsu’s product line of Optical Attenuators G0350 to G0355 series and Optical Switches G0344 to G0349 series is the total solution for evaluating optical modules and optical devices.

Target Applications

• 25G/100G Optical Transceiver Module (CFP2/CFP4/QSFP28/ SFP28) • High-speed optical engine • Active Optical Cable (AOC)/Direct Attached Cable (DAC) • Optical devices (TOSA/ROSA In this way we find that selection of right test and measurement tool is very important for manufacturing sector. Its help manufacturing sector to deliver products in time and quality product to society.

Infineon Introduces Semper™ Secure Infineon has recently announced the addition of Semper Secure to its award-winning Semper NOR Flash memory platform. Based on Semper NOR Flash’s fieldproven and robust smart memory architecture, Semper Secure NOR Flash is the first memory solution to combine security and functional safety in a single NOR flash device to deliver the security, safety, and reliability required for the most advanced connected automotive, industrial, and communications systems.

The proliferation of connected systems is driving the need for ever greater system security. Semper Secure NOR Flash provides a trusted solution to meet demanding requirements and protects critical system information. Having a secured flash solution is especially important when the NOR Flash is placed outside of a processor, making it vulnerable to a variety of attacks. Semper Secure is the only NOR Flash solution that serves as a hardware root-of-trust to provide end-to-end protection. Additionally, the Semper Solution Development Kit enables easy system integration to accelerate time-tomarket and reduce total cost-of-ownership.

T&M FEATURE

• All-in-one: BERT + Sampling Oscilloscope • Fast measurement: Simultaneous BER measurements and Eye pattern analysis • Low price: Functions and performance for manufacturing • Excellent usability: Simple GUI • Compatibility: Command compatibility with MP2100A/B • Stability: Stable built-in CPU

Mitsubishi Electric to Invest in EKEElectronics Mitsubishi Electric Corporation has announced recently that it has acquired a 34% share in EKEElectronics Ltd., a Finnish manufacturer of train information systems.

The company aims to strengthen product competitiveness of train control and management system (TCMS) and to establish technology of support system for condition-based maintenance (CBM). This capital alliance will allow Mitsubishi Electric to drive business collaboration with EKE-Electronics in order to enhance its train information systems business in overseas market. Today, there are growing needs in the railway industry for improved customer services, faster responses to operation troubles, more efficient maintenance activities enabled by IoT and analytic technology that collects and analyzes various big data from the trains in operation. In the worldwide railway market, including Europe, the world's largest market, the railway system is expected to be enhanced by utilizing digital technology, which may consequently further increase the value of the information-based equipment.

•Vol - 02 / 07

Flexible Configuration

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Leveraging Bus Converters in Regulated DC-DC Applications Comparative Study of Yeaman Topology vs. Factorized Power Architecture™

David Bourner

AUTHOR: Maurizio Salato Abstract

FPA™ (Factorized Power Architecture™) has provided leverage in solving demanding power challengeswhich call for high levels of efficiency, power density and superior power handling and dynamic load capability. A variant on FPA that utilizes a Power Component Methodology is described. Solutions framed within the FPA framework are compared against those instantiated in the YT (Yeaman Topology). A description of the investigation methods used and outcomes of various tests to establish performance metrics follow. Practical aspects of applying power components to both FP and YT architectures are followed by a summary of salient attributes for each system.

VICOR

Background

The need for high-density, high-efficiency power conversion has led industrial research toward advanced power-system architectures.[a][b] These approaches involve optimized sub systems, often implemented as power components that out perform traditional, discrete designs from electrical, thermal and mechanical assembly standpoints.[c][d] This paper presents a comparison between Factorized Power Architecture (FPA)[a] and Yeaman Topology (YT)[e] in a regulated, high-density DCDC application. YT can maximize the use of bus converters in array configuration[f], therefore achieving higher density and higher efficiency than FPA, if input and output voltage ranges in the application can be maintained relatively constant and their relative ratio is close to an even integer.

A building-block based approach to power converter design

•Vol - 02 / 07

Resonant converters have been known for quite long time[g] and most power supply designers have some level of experience with resonant topologies. A major drawback of such topologies lies in the parametric tuning required in order to guarantee performance over line and load ranges. With inexpensive digital controls being available, optimization of resonant converters has been simplified and algorithms have been built to support it, often in real-time fashion.[h] However, system scalability issues are present, as parametric distribution of standard discrete parts (and in particular their parasitic elements) is simply too large to allow for simple, linear scale design as the converter is sized for different power levels.

24

In order to overcome these issues, power components have been proposed, where typical power supply functions are implemented (like, for example, regulation, isolation, transformation, etc.) with highly efficient resonant topologies. [i] Tight control over converter parameters and tuning is

performed at power component level; the same components are designed to easily operate in a variety of configurations, from simple arrays to completely new power conversion schemes. Let’s briefly describe the attributes of the considered schemes: the FPA and the YT.

Attributes of the FP and YT architectures

For the purpose of this study, two classes of functionality are considered. The first class consists in a PRM™ (pre-regulator module); it provides non-isolated buck-boost conversion based on ZVS buck‑boost switching. The second class consists in either a VTM™ (voltage transformation module) or a BCM (bus converter module); both are based on SAC™ (sine amplitude converter) topology: a soft-switching DC-DC fixed-ratio transformer offering galvanic isolation and a highefficiency power processing architecture between their primary and secondary sections.

FPA is a system-partitioning rationale that exploits the functional concentration and heightened power density that this approach has demonstrated over CPA (centralized power architecture) or DPA (distributed power architecture) based solutions. The PRM may be its first stage, establishing a fixed voltage which is factored down by a fixed-ratio VTM. Figure 1 shows the FPA ‘kernel’. When a PRM and VTM are linked together, all the attributes of conventional step-down DC-DC conversion can be brought to bear in an environment that accommodates many different operating input voltage ranges, output voltage, current and output power levels.

Figure 1 Factorized Power Architecture block diagram Obviously, the resulting efficiency will be simply the product of the two power components' efficiencies, as shown in Equation 1. nTOT = – nPRM • nVTM

(1)

YT exploits FPA as a foundation, adding an independent input-power-processing channel in series with the FPA's output power port. The PRM’s regulation is now brought out on remote-sense lines to include the series-connected output ports of both the BCM® as well as the VTM output port. So, instead of processing all of the power through cascaded

JULY 2020

PRMs and VTMs, most of the power burden is taken up by the higher-efficiency BCMs that do not have regulation capability, leaving the regulation of voltage and the processing of a small part of the output power through the YT to the PRM, factored through the VTM. Figure 2 shows the YT basic block diagram.

tester: One for a lower load than the other, saving cost as a universal block that could resource both test-head requirements.

One of the test-head loads calls for a power solution to source a continuous maximum steady-state load current of 75A at 7.4V, sourced from a 38 – 55V DC power supply. In the other test head, a continuous peak current of 112A is needed. Figure 3 shows the YT topology and component resource allocation required in order to match the needs of the application. Figure 4 shows the corresponding FP configuration.

Application #2

This application is focused on servicing a dynamic load requirement in which a heavily-loaded power system, already drawing 120A at 6VDC, needs to provide a 65A step in load current within 8.7μs or at a rate of 7.5A/μs, with output voltage varying during the onset of load by no more than ±100mV. The issue of the transient response capability of the topologies can be addressed from the viewpoint of the first application.

Figure 2 Yeaman topology block diagram

nTOT = (nPRM •nVTM ) • VOVTM + nBCM • VOBCM VOUT

(2)

The opportunity for YT is therefore to process majority of power through the single stage, highest‑efficiency BCM, and “topoff” the output with enough voltage to achieve regulation.

Figure 3 YT experimental-set-up block diagram, showing DC voltage ranges across various devices

VICOR

In this case, because the output current is common to BCM® and VTM™ stages, the resulting efficiency is an average of the two power paths (PRM™ + VTM and BCM) weighted by the portion of the output voltage that each path contributes, as shown in Equation 2.

Tests and outcomes Description of two test applications

Power designers working in molecular computing, IC test equipment and military application areas seem to be on the leading edge of the search for a switched DC-DC converter system that is robust in its operation, yet performs with high precision and speed in the face of very demanding loads.

They call for ideal load-line characteristics in both static and dynamic modes of operation.

Application #1

This application comes from the IC test arena. It is the principle subject of investigation in this study. The customer had a plan to incorporate the same power cell in different parts of the

Figure 4 FP experimental-set-up block diagram, showing DC voltage ranges across various devices

Summary of experimental results

Table 1 shows a summary of metrics for both FP and YT topologies drawn up for the 75 and 112A continuous-currentdraw scenarios sketched out as part of options in the first application. The targets are couched in terms of the final area and volume of the power solution. These are exceeded by both topologies.

•Vol - 02 / 07

There are two things that a power designer has to accomplish in order to get a power system to work optimally: Minimal hardware resources need to be matched against the customer’s basic power and voltage input / output specification. The selected hardware option then needs to be arranged to be able to successfully start up autonomously into the load and to then perform in accordance with dynamic specifications associated with either a stepped or pulsed load.

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Table 2 compares the performance metrics for the systems whose physical attributes are detailed in the previous table.

These data are interesting to examine, because the power component requirement i.e., the number of devices used is the same irrespective of architecture. So we can continue on with a fair comparison of the solutions along the lines of SWaP (Size, Power Output and Cost), a clear indication being that the YT is more power dense.

It can be seen in Table 1 that the YT configuration can provide higher levels of DC current compared with the FP arrangement.

Figure 6 Module line and load efficiency characteristics

At the lower average current, the FP can support a higher transient capability. In the higher continuous DC demand scenario, the maximum transient limits are the same.

VICOR

Table 1 Salient target specifications and attainable physical metrics

References

Table 2 Performace metrics for each power system implementation

In spite of the non-optimal architecting of the YT in this application, it was found that there is an efficiency advantage when using the YT instead of the FP architecture. Figures 5 and 6 show the efficiency characteristics of the FP, YT systems working across their permitted ranges of line and load conditions.

•Vol - 02 / 07

Figure 7 shows the transient characteristics of the YT system to give the reader a picture of the dynamics associated with startup as well as the system’s dynamic response. These deserve some comments before summarizing the salient aspects of the different topologies, the subjects of this paper.

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Figure 7 Stepped-load test of YT example hardware. Trace C1 (olive) shows output voltage, C2 (red trace) the input current and C3 (blue trace) output load current

Figure 5 Efficiency characteristics vs. line and load

[a] Vicor Inc., “Factorized Power Architecture and VI Chips”, VICOR White paper, October 2013 [b] Vinciarelli, P., “Power Components Come of Age,” 2013 Twenty-Eight Annual IEEE Applied Power Electronics Conference (APEC), Long Beach, CA, March 17 – 21, 2013, Opening Plenary Session [c] Salato, M., "Datacenter power architecture: IBA versus FPA," 2011 IEEE 33rd International Telecommunications Energy Conference (INTELEC), pp.1 – 4, 9 – 13 Oct. 2011 [d] Russell, A.T.; Oliveira, E.M.A., "Sine Amplitude Converters for efficient datacenter power distribution," 2012 International Conference on Renewable Energy Research and Applications (ICRERA), pp.1 – 6, 11 – 14 Nov. 2012 [e] Salato, M.; Makrum, P., "350V to 12V DC “Yeaman Topology power system," 2010 International Conference on Energy Aware Computing (ICEAC), pp.1 – 4, 16 – 18 Dec. 2010 [f] Yeaman, P., "Using BCM® Bus Converters in High Power Arrays", Vicor Application Note, February 2011 [g] Mamon, M.; Hiramatsu, R.; Harada, K.; Sakamoto, H., "A Resonant Converter with PWM Control," Third International Telecommunications Energy Conference, 1981. INTELEC 1981, pp.247 – 249, 19 – 21 May 1981 [h] Weiyi Feng; Mattavelli, P.; Lee, F.C.; Dianbo Fu, "LLCconverters with automatic resonant frequency tracking based on synchronous rectifier (SR) gate driving signals," Twenty-Sixth Annual IEEE Applied Power Electronics Conference and Exposition (APEC), 2011, pp.1 – 5, 6 – 11 March 2011 [i] Salato, M., "Datacenter power architecture: IBA versus FPA," IEEE 33rd International Telecommunications Energy Conference (INTELEC), 2011, pp.1 – 4, 9 – 13 Oct. 2011

JUNE 2020

Electrolube Announces New Stock of IPA Wipes Electrolube announces the pre-saturated cleaning wipes are back in stock and can be used for a diverse range of cleaning requirements.

Features: • Electrolube IPA100 wipes are tough lint-free in a handy tub of 100 for any engineer or design engineer’s workbench.

• Made up of 70% Isopropanol and 30% demineralised water, they are designed to wipe away the toughest of materials.

Applications: The IPA100 wipes are not only ideal for all general cleaning applications

Availability: Available Now

Moxa High-performance Railway Computers

Features: • Fanless design with metal housing • Intel Core i7/i5/i3 or Intel® Celeron® high-performance processor • 2 hot-swappable 2.5-inch HDD or SSD storage expansion slots

Applications: Railway onboard and wayside applications

Availability: Available Now

Holtek Announces its New Cortex-M3 Series

New Launch

Moxa has launched a new series of high-performance wireless-ready railway computers, the V2406C Series. The V2406C computers are compliant with EN 50155:2017 and EN 50121-4. Designed for heavy-duty data processing tasks, the V2406C computers are built around an Intel Core i7/ i5/i3 or Intel Celeron high-performance processor and come with up to 32 GB RAM, one mSATA slot, and two hot-swappable HDD/SSD for storage expansion.

Holtek announces its new Arm Cortex-M3 series Flash MCU, the HT32F12364. The device provides high efficiency, rich memory configurations, high price-performance ratio as well as low power consumption.

Features: • The device supports an operating speed of up to 72 MHz, an operating voltage range of 1.65V~3.6V and has a temperature range of -40°C~85°C. • In addition, the device provides an independent VDDIO pin.

Applications: Fingerprint identification, smart door locks, etc.

Availability: Available Now

Maxim Offers Ultra-Reliable Arm Cortex-M4F Microcontroller

Features: •High Reliability: ECC-protected flash and SRAM prevent bit flips for higher uptime; secure boot and crypto hardware enhance reliability.

Applications: Industrial, healthcare and internet of things (IoT)

Availability: Available Now

•Vol - 02 / 07

Reduce power consumption and size while increasing reliability of industrial, healthcare and internet of things (IoT) applications with the MAX32670 low-power Arm Cortex-M4 microcontroller (MCU) with floating-point unit from Maxim Integrated Products.

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JULY 2020

THE GAME OF DRONES

TECH FEATURE

Introduction

Unmanned Aerial Vehicles (aka UAVs) have tremendous potential in the emergence of novel applications in various areas ranging from Medicine, defense, personal and enterprise security or search and rescue applications for several industries. Lately, there has been heavy investment in the development of UAVs and multi-UAVs systems that can collaborate and complete missions more efficiently and economically. Emerging technologies, such as 4G/5G networks have significant potential on UAVs equipped with cameras, sensors, and GPS receivers in delivering IoT services. UAV is an all encompassing term that is used to refer to all things that fly while being controlled remotely. The market is one of the most quickly growing and innovative sectors of the IoT and presents a huge commercial and strategic opportunity for telecommunication operators and their technology partners.

Everyone is talking about them, but in plain English, what exactly are drones?

A drone is an unmanned aircraft or ship that is guided remotely or autonomously. Here is a multi-copter drone, named so on account of it’s many propellers.

UAV stands for Unmanned Aerial Vehicle, something that can fly without a pilot on-board. Above is a quad-copter UAV, named so on account of it’s 4 propellers.

This paper focusses on the infusion of Artificial Intelligence into the already available drone tech with the purpose of better capabilities that can be leveraged across multiple industrial segments. The case studies that would be covered address a range of solutions that span Search & Rescue, Low Altitude airspace management, Disaster Response and similar.

•Vol - 02 / 07

The Game of Drones

28

Having understood the basic terminology used, let us get into a bit more depth as to how the drone technology can be infused with some bearing of intelligence. In the context of any device deemed “smart, we essentially refer to its ability of harnessing valuable date, interpreting it and then using the

Roshana Atmaram

Director - Digital Security Solutions, Infineon Technologies India

inferences for decision making. The approach, architecture, protocols and systems that go into making the UAV intelligent is what is being referred to as the “Game of Drones”.

Infusion of AI and Drones

The concept of artificial intelligence widely understood by technologists is the ability of a software program to accept a continuous flow of input data and use this data to build a knowledge base that can be accessed when attempting to arrive at a logical conclusion or decision. The emphasis for such a system is the continuous flow of data and here is where the drones can provide the stream of information to be plugged into the AI module. So, how do these systems communicate and interact in order to provide a solution that is fit for purpose.

The answer lies in the realm of the Internet of Things (IOT).

With a gathering of connected devices a ll a ro und us , and always on, there is a steady stream of status information being transmitted to any listener.

Consider the illustration as seen here. The homes, Ambulance, vehicles, buildings, people are all invisibly connected through the internet. A drone that is in the airspace above can potentially perform one of the following operations: - Search and Find ( a thing, a person, a situation ) - Passively scan and report back - Capture images and relay them back - Follow and track Now, where does the monitoring element come in?

Reviewing the possible activities that a drone can perform as indicated above, all of it falls under the uber term of monitoring.

Easily adapted to reconnaissance, the crucial advantage of drone technology has is that it can cover large expanses of land in a relatively low time and cost. It is quite evident that much of the expense in using a drone is attributed to the skill and cost of the pilot that is controlling it remotely.

Here is where the opportunity for infusing artificial intelligence becomes a possibility.

Instead of a person, it would be an AI that controls the drone, receives the data stream and can draw up inferences and make some decisions as well. This can be a 24x7 arrangement since it is a fully automated end to end system. Artificial intelligence and drones are a match made in tech heaven. Pairing the realtime machine learning technology of AI with the exploratory abilities of unmanned drones gives innovators a multitude of opportunities and solutions. Infineon’s OPTIGATM Connect eSIM solutions are a perfect fit and offer all the required capabilities to enable such applications.

In the following sections of this paper, we shall get into the depth of use cases for emergency response teams that deal with real time situations.

Some organizations are developing a platform for the use of ERTs and safety of the public. The AI powered drones are enabled to map areas, track objects and provide analytical feedback in real-time.

Officers receive raw data captured by a set of drones and turn it into actionable insights for police, fire and other emergency teams. A centralized operations centre enables multiple drone users to collaborate, view what each drone sees and even trace a drone’s flight pattern in real-time.

The AI-powered software assists SWAT teams in gathering scene intelligence, FIGURE 4: INFINEON’S assessing damage OPTIGATM TRUST M IS AN AUTHENTICATION after hurricanes and SOLUTION FOR IMPROVED tornadoes and even SECURITY AND REDUCED SYSTEM COST employs thermal imaging to locate missing persons. The

With the tremendous demand for online purchases getting higher and higher, technology giants like amazon and Walmart, are looking at highly automated and efficient systems. A start-up in California is building AI powered drones to assist with the mapping and the designing of large-scale warehouses and factories.

In addition to tracking the in-house inventory these intelligent devices can perform a depth analysis on current stock via flight video. The secondary benefit of such a system is that it can also use the data from inventory monitoring to develop valuable analytics on popular products hence enabling a faster supply chain. A scan of the shelves could notify a trigger for a reorder and automatically track and add new inventory.

It is very clear that the utilization of drones is increasing in all fields from FIGURE 5: OPTIGA™ TPM Agriculture to Industry, (TRUSTED PLATFORM MODfrom Government to ULE) OFFERS TO PROTECT THE INTEGRITY AND AUprivate organizations THENTICITY OF EMBEDDED DEVICES AND SYSTEMS and from Smart Cities to Rural area monitoring. More than ever before, drones play key problemsolving roles in a variety of sectors — including natural disaster relief, security and construction. With their ability to increase efficiency and improve safety, drones have become important tools for everyone from firefighters to farmers.

With Infineon’s Battery and Wireless Charging Authentication solutions, the efficiency and reliability of drone operations can be greatly improved.

Fig 4: OPTIGA™ TPM (Trusted Platform Module) offers a broad portfolio of standardized security controllers to protect the integrity and authenticity of embedded devices and systems.

Let’s consider the concept of The Internet of Drone Things (IoDT) . It is envisioned as the inevitable direction of Drones backend via Internet of Things, Smart Computer vision, Cloud Computing, advanced wireless communication, big data, and high-end security techniques. With IoDT based implementations, all the existing sectors will become intelligent and smart for performing monitoring, search and rescue and more.

On the Horizon

Smart UAVs are so popular, in fact, that they're now used on more than 400,000 jobs sites worldwide. And this is only going to grow further.

Imagine a world where the smart drones keep us safe, help to survey the large crop fields to make sure they are healthy, be the first responders FIGURE 6: INFINEON in climate triggered ENDEAVORS TO MAKE disasters and the list LIFE EASIER, SAFER & GREENER goes on.

I would like to leave you with the image of a world that is safer, cleaner and greener.

We as global citizens and women in tech, should endeavor to build and deploy reliable scaled drone systems powered by AI.

•Vol - 02 / 07

FIGURE 3 : INFINEON’S OPTIGATM CONNECT ESIM SOLUTION CAN BE USED FOR MULTIPLE IOT APPLICATIONS

OPTIGATM Trust M would help to properly authenticate eligible entities and can help to setup the transport encryption in the TLS protocol, to protect the privacy critical video/audio data. OPTIGA ™ Trust M is a secure root of trust which stores certification and its keys in a tamper resistant manner. Also, the TLS handshake is entirely handled inside this chip.

Another use case that has been of immense interest is the incorporation of neural network’s into the drone abilities of camera based search. A recent article published in one of the leading technology magazines referred to a platform called as Neurala. This platform is a deep learning neural network that helps drones to identify and manage complex situations.

A typical situation would be to monitor an area or public space like a stadium or auditorium. Its abilities extend to the inspecting of large industrial equipment, like telephone towers, and generate a real-time damage report allowing the required agencies to arrive on the stop in a timely manner knowing what to expect and what is needed to fix the situation.

It has come to be known that a unique application of the has been done in Africa. The Neurala-powered drones are used to combat elephant poaching in Africa. The artificially intelligent drones use the company’s image recognition technology to monitor elephant herds and spot possible poachers miles before they reach the elephants. Now, isn’t that simply amazing!

TECH FEATURE

JULY 2020

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JULY 2020

HONGFA

BIG PICTURE

Has its Own Relay Testing Lab

Dr. RA Gotur

Director India Operations, Hongfa Group

Q

Which sectors are witnessing the real growth trajectories for Indian Relay market?

As per our data, Hongfa is a leading player in Power Electronics, Home appliance (kitchen electronics), HVAC, Automotive, Solar (Lighting) smart metering, medical& Industrial Infrastructure.

Based on the enquires, and conversion of enquiries into business, we see a stable growth in the above said industries. In these segments, there are emerging cutting-edge technology products and as well as existing mature products.

In the last two quarters the business has seen a jolt due to COVID – 19 pandemic. The scenario is not only in India but also globally. During these times, Hongfa is having a stable growth in business and there is no major surge or sudden fall as of now even during COVID – 19 pandemic noted Dr. RA Gotur | Director India Operations | Hongfa Group. While talking to Niloy from BIS, the veteran also extended his words on the growing Indian market, trends, Hongfa’s strategies post COVID-19 and innovations complementing the Indian relay market. Edited Nub Below.

Q

In these few last Quarters, how has been Hongfa products demand in the Indian market, what new initiatives has the company taken to drive new sales?

In the last two quarters the business has seen a jolt due to COVID – 19 pandemic. The scenario is not only in India but also globally. During these times, Hongfa is having a stable growth in business and there is no major surge or sudden fall as of now even during COVID – 19 pandemic. As you know, Hongfa is holding the major share in the Indian market, its products (relays) has a presence in almost all applications Mr. Gotur, your expertise in relay market is unparalleled, across the board. Hongfa believes its strength is from the how do you think COVID-19 will change the market R&D stage during the product development. As such every dynamics and its larger impact for a longer period of time? day there is a new development and our product specialists Noting an old say, “Necessity is the Mother of Invention.” do contribute in assisting the development. In a long term Hence, according to my perspective, I see (covid-19) as run, the participation does convert into business as the new a new avenue for ramping the global economic growth. product become mature in the market from cutting-edge For example, though sanitizing was in existence, it has now technology stage. attained importance across the world. Obviously, the necessity Miniature relays, low contact resistance are new trends has paved way for new products for consumer safety. From what further trends do you see in the Indian relay market the electronic industry, the contribution is UV based-lighting for quicker and efficient sanitizing purpose. In similar way, and Hongfa’s portfolio to compliment these new trends?

I expect the other industrial verticals do contribute for the We have relays to meet every need of the customer. As of now, India is heading towards developing e-vehicle segment. worlds’ healthy living in the coming years.

•Vol - 02 / 07

Q

30

Q

JULY 2020

Hongfa’s current market share in India and strategies to expand its dominance in the sub-continent?

Hongfa is NO.1 & the largest manufacturers of relays in the World. As of now we have around 60% market share in India.

We believe in healthy competition. We wish others do grow along with us.

Q

Product testing, standards, certification, R&D strength of Hongfa?

You know, Hongfa has its own relay testing lab; very few companies in the world do have the testing facility inhouse.

Hongfa has all certification from the international certifying agencies. For more details kindly visit our website ( www. hongfa.com )

Q

Hongfa’s any new innovation and ground-breaking technology?

Given today’s situation of (Covid-19), we feel contact less operation may be the upcoming need of the hour. We feel components such as REED Switches, Relays, Hall Effect Sensors etc. can contribute more towards the development of products related to contact less operation.

Q

Credibility, Visibility and Adaptability are said to be the key for a Brand’s image? What is Hongfa’s strategy to give customers a bigger and better picture about its brand?

HONGFA has already become every engineers PET in today’s

Q

Key USP of Hongfa which ousts its competitors?

We followed and invested a lot in ‘3Ds’. Dedication, Determination and Devotion. It is our USP.

Q

Pre and Post sales or let’s say, service-driven marketing is key in current market. Hongfa’s understanding of customers need and retention strategy?

Today, Hongfa has achieved the lowest PPM than the prescribed industry standards. It is because of the above said ‘3Ds’. From my point of view serving customers post sales is very important. It really helps with feedback and scope of improvement. Obviously, the combination of Design stage participation, maintaining the low PPM and post sales serving are the KEY of business growth.

Q

Lastly, any major announcements expected from Hongfa in coming time?

Relays are basically a switch which works on electromagnetic.

It might be possible a relay with AI do come and become more designers’ friendly. Due to COVID 19 pandemic No major announcement is expected presently. Once the situation improves you can look forward to. Hongfa corporate team is already on the job.

BIG PICTURE

Q

market. I believe, it cannot be possible without serving the expectations of every engineer. So in a single word I will say “dependability” is the picture of Hongfa’s Brand.

•Vol - 02 / 07

We foresee EV relays will be major demand in the auto sector, renewable energy sector etc.

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JULY 2020

microBRICKTM: A Simple Solution to Building

Efficient High Density DC/DC Converters with a Wide Input Voltage Range

Roy Shoshani

vice president, Power and Linear IC division,

WHITE PAPER

Vishay

One of the biggest challenges in system design is powering the next generation of microprocessors, DSPs, FGPAs, and ASICs used in servers, telecom equipment, and IoT systems.

Maximizing performance and high power delivery becomes even more difficult as processors get faster, space availability diminishes, and power requirements increase – such as in 5G small cells, radio units, and robots. Consequently, these emerging applications demand high efficiency, high power density DC/DC conversion solutions. System designers need these DC/DC solutions to be simple to work with, even while delivering features such as a wide input voltage range and ultrafast transient response. For maximum performance, the best solution will integrate multiple functions into a single, compact package.

Designers have many options today to choose from, varying not only by supplier but also by the level of integration. At one end of the spectrum are traditional solutions that combine an IC controller, discrete MOSFETs, and numerous passive components. This “discrete” approach provides a high level of flexibility and potential lower bill of materials cost, but on the other hand requires a longer design and validation time. It is a riskier strategy too, given the high level of technical expertise it requires. More recently, solutions combining integrating the IC controller and power MOSFETs into a single package have emerged. This approach provides higher efficiencies while enabling faster switching frequencies and more features and protections in compact packages. On the far end of the integration spectrum are various module solutions in which both active and passive devices are combined into a single package. Until now, however, they have often remained out of reach due to higher prices. This mainly because the large component size and low production volumes tend to increase manufacturing costs.

•Vol - 02 / 07

Semiconductor manufacturers are working to improve product performance and lower costs with innovations in silicon and new wide band gap materials. This same process is resulting in smaller and smaller package sizes.

32

A smaller package comes at a cost, however. One of the main challenges in DC/DC converters is how to dissipate the heat caused by a much higher level of power density. As the component cross section gets smaller and smaller, component

density is pushed higher and thus the PCB temperature goes up, since most of the component heat is dissipated through the PCB even if a heat sink is available. This approach might be acceptable for a given design but poses an obstacle to scaling in future products.

With this challenge in mind, Vishay engineers have developed a new type of DC/DC converter module, microBRICKTM, in which the package size is almost coequal to just the inductor, with the same respective dimensions. In other words, the real estate area occupied by the IC and power MOSFET has been shrunk to nearly zero size, yet they still provide improved performance over typical solutions.

Figure 1. DC/DC integration evolution As an innovative packaging solution, microBRICK offers several advantages, both thermal and electrical. It addresses the problem of heat dissipation in two ways. In the first, the highest temperature component (typically the power MOSFETs) is thermally coupled to a larger cooler component (the inductor).

This thermal structure provides a superior thermal solution as the inductor acts like a built-in heatsink.

The second advantage, which is also thermal, is to better utilize the large area available under the inductor for improved MOSFET power dissipation purposes. Placing the MOSFET underneath the inductor allows a much larger effective cross section to the PCB without any additional area penalty.

From an electrical perspective, the 3D structure of the Vishay

JULY 2020

This unique structure provides lower conduction losses and superior thermal performance which results in a lower junction temperature.

Meanwhile, the lower temperature of the high efficiency microBRICK module enables improved reliability and a wider safe operating area to support higher ambient temperatures or to compensate for smaller board space.

Measuring only 10.6 mm by 6.5 mm with an industry-low 3 mm profile, Vishay’s microBRICK modular solution offers a < 30 % smaller area and > 50 % smaller volume when compared to the closest competing module. Unlike BGA and LGA packages, the device’s wettable flank power QFN package improves the board level reliability (BLR) capability and simplifies assembly and testing while providing production with automatic inspection (AOI) capability.

Figure 2. microBRICK package Perhaps most impressively, the SiC931 is capable of delivering 20 A continuous current at an up to 2 MHz switching frequency, while providing an adjustable output voltage down to 0.6 V from an input rail of 4.5 V to 24 V. Additionally, the architecture supports ultrafast transient response with minimal output

capacitance and tight ripple regulation at very light loads.

Figure 3. microBRICK SiC931 efficiency The efficiency performance of the SiC931, as shown in Figure 3, was measured at room temperature on a 2 in. x 2 in. 6-layer PCB with no airflow.

Building a high efficiency DC/DC converter with a wide input voltage range is greatly simplified with microBRICK, which integrates the controller, power stage, and inductor in a single compact package. Just a few off-the-shelf resistors and capacitors are required in order to complete the design using a microBRICK module.

The overall smaller solution size enabled by the microBRICK products provides a more affordable total solution compared to other modules while still improving the DC/DC performance such as efficiency and transient response.

The SiC931 is the first member of the microBRICK family. Other members, sharing the same form factor, include the SiC967 and SiC951. The SiC967 features a 4.5 V to 60 V input voltage range with 6 A output current. The SiC951 offers a 4.5 V to 20 V input voltage range and 20 A output current supporting a PMBUS 1.3 compliant digital interface with full configuration and telemetry capabilities.

WHITE PAPER

module eliminates the PCB interconnect resistance between the inductor and the switching node. This parasitic resistance is governed by the PCB’s top Cu layer thickness (typically less than 2 oz) and as a part of total losses is of the same magnitude as the MOSFET’s RDS(on) and the inductor’s DCR.

•Vol - 02 / 07

Author Roy Shoshani vice president of the Power and Linear IC division of Vishay, a role he has held for more than eight years. He started his tenure at Vishay as a design manager 14 years ago, and since then has held a series of senior management positions in the power IC space. Shoshani earned his electrical engineering degree from Technion Israel Institute of Technology and has also worked for both Siliconix and Harmonic.

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JULY 2020

â&#x20AC;˘Vol - 02 / 07

COVID-19

A Manufacturing lifeline for medical devices

34

As COVID-19 increases its deadly grip on India and the surge in the number of cases that test positive, intensive care units (ICUs) of hospitals are constantly meeting challenges associated with the pandemic. Along with the shortage of protective gear and PPEs, hospitals are also facing a shortage of ventilators. To cope with the demand, manufacturing companies across the globe and in India, are ramping up production to deliver them on time.

According to a study by John Hopkins University in Baltimore, US, and the Washington and New Delhi-based Centre for Disease Dynamics, Economics and Policy (CDDEP), ventilator demand is soon to touch the 1 million mark. However, the study estimates that the current availability of ventilators in India is between 30,000 and 50,000 units, which points to the urgent need to manufacture ventilators.

Manufacturing Challenges

The target seems aspirational to say the least, looking at the current state of lockdown where the supply chains are severely affected. There are multiple challenges that exist, starting with the lack of components. As with any medical equipment, ventilators are comprised of some common, easily available components along with complex parts such as the pump system and the valves, which are hard to come by.

Processes like 3D printing work for some custom components or small batch items, but not for the kind of scale needed for producing complex products. When borders get shut down and supply chains get regionalized, the availability of parts becomes a big issue.

An added challenge is clinically testing the equipment once it is manufactured and then being able to rapidly scale the

JULY 2020

lines out of the window. What used to be a 12 to 24-month timeframe, is now being crunched to days and weeks in an unprecedented manner.

Manufacturing companies such as Flex are taking an innovative route to address the acute shortage of ventilators by working with non-traditional companies like automakers who have substituted their production lines to meet the demand.

While the automakers are not familiar with the highly regulated world of medical device manufacturing, they have the advantage of having a different set of supply networks, which helps them to access the skill sets of different people and their capabilities. It is a tremendous collaborative effort, which is working towards saving lives and getting the products out to market. These unprecedented times have also resulted in lateral thinking across the manufacturing process with elements of reverse engineering, as well as 3D printing and other advanced techniques taking center stage in the fight to make the necessary sub-components like valves and pumps, in the volumes required.

Vice President – Operations at Flex India

tests, so that the ventilators can go out to hospitals. For something like a ventilator, the testing device is an artificial-type lung that the ventilator has to be tested against; to make sure that it has the right flow rate and the right pressure control.

Manufacturing partners step up

Given the massive demand for ventilators and the quick turnaround times, manufacturers of ventilators are relying on their manufacturing partners who have to have the requisite expertise in medical device technologies, with a global industry footprint, as well as a global network of certified materials and component suppliers. They can also discover alternate supply chain sources to relieve bottlenecks.

Meeting this critical need for ventilators has also meant throwing the traditional rulebook for manufacturing time-

Examples of such innovation are coming from all industries from fashion, food, auto, to hi-tech – where manufacturers are re-tooling themselves to make life saving medical supplies.

With the world slowly easing lockdowns and trying to return to some semblance of normalcy, the need for ventilators and other related equipment will only go up. Governments all over the world are looking at manufacturing companies to come forward and save the day. It is obviously challenging for manufacturers who work with complex technologies to suddenly shift, but they are doing it. Most have started to successfully retool their production lines to fight the Covid-19 pandemic, to play their part in keeping the world safe.

•Vol - 02 / 07

Sekaran Letchumanan

During this critical time when the World Health Organization has asked the private sector to join global efforts to tackle Covid-19, companies are making their assembly lines available and are helping to ramp up the supply of ventilators.

In Brazil, the Flex team went from never having produced a medical product before - to getting regulatory registration and approval completed, building new infrastructure to install oxygen, setting up production lines, doing product assembly training by video conference, learning a new quality system and how to do validation, testing and regulatory documentation, and completely producing clinical units, all in a months’ time.

COVID-19

While ventilators are key, they are by no means the only equipment witnessing increased demand. Given the increased capacity that is being built in hotel rooms and dormitories to support increased patient numbers, IV infusion pumps, oxygen concentrators, or a basic portable system to generate oxygen for patients with compromised lung functions, are also being increasingly sought after.

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JULY 2020

TECHNICAL PAPER

ADD AN

•Vol - 02 / 07

Senior Applications Engineer, Analog Devices

Efficient Positive Rail to a Unipolar Negative Supply Introduction

Sometimes you need a positive power supply, and the most available rail (or only available rail) is negative. In fact, negative-to-positive voltage conversion is used in automotive electronics, and the biasing circuitry for a variety of audio amplifiers, and industrial and test equipment. Even though power is distributed in many of these systems via a negative—relative to ground—rail, the logic boards, ADCs, DACs, sensors, and similar devices found in them still require one or more positive rails. This article presents a simple, low component count, efficient circuit for the generation of a positive voltage from a negative rail.

Circuit Description and Power Train Functionality

36

Victor Khasiev

Figure 1 shows a complete solution for efficient conversion of a negative voltage to a positive voltage. This particular solution uses a boost topology. The power train includes switching MOSFETs, bottom Q1, top Q2, inductor L1, and input/output filters. The synchronous high efficiency boost controller IC regulates output voltage by changing the state of the switching MOSFETs in the power train. For the purposes of describing this circuit, system ground (SYS_GND) serves as the reference regarding polarity, with a negative—relative to SYS_GND—input rail (–VIN), and positive—relative to SYS_GND—output rail (+VOUT). The converter works as follows. If transistor Q1 is on, then current flows from the SYS_GND to the negative rail. The transistor Q2 is off and inductor L1 stores energy in its magnetic field. To complete the switching period, Q1 turns off, and Q2 turns on. Current starts to flow from the SYS_GND to the +VOUT rail, discharging L1 energy to the load.

Figure 1. A negative-to-positive converter electrical schematic, with VIN –6 V to –18 V (–24 V peak) and with VOUT +12 V at 6 A.

Basic Expressions for the Power Train Components Selection

The topological diagrams in Figure 2 of the switching behavior illustrate the negative-to-positive converter behavior. For the first interval of a switching cycle, over a length of time defined by the duty cycle, the bottom switch, BSW, is shorted and the top switch, TSW, is open. The voltage across the inductor, L, is equal to –VIN. Throughout this interval, current in inductor L increases, generating a voltage polarity matching –VIN across the inductor. At the same time, the output filter capacitor discharges, supplying current to the system load.

JULY 2020

the power train components. For final selection and detailed design, please use LTspice® modeling and simulation.1

Converter Control Description and Functionality

Sensing of the output voltage and level shifting of the control voltage are managed by the current mirror based on the PNP transistors Q3 and Q4. The feedback current IFB (1 mA in this circuit) determines the value of the resistors in the feedback loop.

The second interval of the cycle flips both switches—BSW is open and TSW is shorted. The polarity across inductor L changes, and the inductor starts sourcing current (stored in the first interval of the cycle) to both the load and COUT, the output filter capacitor. The inductor sees a corresponding decrease in current over this part of the cycle. The volt-second balance of the inductor defines the duty cycle, D, of the converter in continuous conduction mode.

Calculating Timing and Component Stresses

Here are the formulas describing the timing and stresses of the power train components.

The duty cycle determines the on/off time of the switches

WThe average value of the input current, IOUT, is input current

The peak value of the inductor current

where RFB(T) is the output voltage sensing resistor.

The feedback circuit presented in Figure 1 is an inexpensive solution, but tolerance of discrete transistors can be affected by the differences in base emitter voltage and temperature variations. To improve accuracy, a matched pair transistor can be used. Control of the converter power train is left to the LTC7804 boost controller. This chip was selected due to its high efficiency by means of synchronous rectification, easy implementation, high switching frequency operation (if a small inductor size is desired), and low quiescent current.

Test Results and Topology Limitations

This solution was meticulously tested and verified. Figure 3 shows that efficiency remains high over a wide range of load currents—reaching 96%. Note that as the absolute value of the input voltage decreases, the input and inductor current increases. At a certain point, the inductor current can exceed the maximum, or saturation current, on the inductor. The derating curve showing this effect is shown in Figure 4. The maximum load current is 6 A in the range from –9 V to –18 V, falling below that for input voltages with absolute values below –9 V. Thermal performance is shown in Figure 5 for the solution board in Figure 6.

TECHNICAL PAPER

Figure 2. Negative-to-positive converter topological diagrams.

where VC is the reference voltage of error amplifier.

The voltage stress on the switching MOSFET

The average current through the bottom MOSFET

These expressions are useful for a general understanding of the functionality of the topology and for preliminary selection of

Figure 3. Efficiency curve for VIN –12 V and –18 V with natural convection cooling.

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The average current through the top MOSFET

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Figure 4. Output current derating curve for absolute value input voltages below –9 V.

Figure 6. Converter photo.

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TECHNICAL PAPER

Conclusion

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Figure 5. Thermal image of the converter with VIN –12 V and VOUT +12 V at 6 A, using natural convection cooling with no air flow.

About the Author

This article presents a complete solution for a very efficient and relatively simple design for adding a positive rail to a unipolar negative power supply using a boost controller. It also provides electrical schematics and calculations for timing, power conversion components, and electrical stress. Test data confirms high efficiency and good thermal performance.

Furthermore, the boost topology used in this solution gives the designer the option to use a prequalified boost controller, saving development time and cost. Conversely, qualifying a boost controller for a negative-to-positive converter can prequalify it for future boost applications.

Victor Khasiev is a senior applications engineer at ADI with extensive experience in power electronics both in ac-to-dc and dc-to-dc conversion. He holds two patents and wrote multiple articles. These article relate to using ADI semiconductors in automotive and industrial applications. They cover step-up, step-down, SEPIC, positive-to-negative, negative-to-negative, flyback, forward converters, and bidirectional backup supplies. His patents are about efficient power factor correction solutions and advanced gate drivers. Victor enjoys supporting ADI customer by answering questions about ADI products, designing and verifying power supplies schematics, laying out printed circuit boards, and troubleshooting and participating in testing final systems. He can be reached at victor.khasiev@analog.com.

JUNE 2020

Vicor WiBotic Autonomous Wireless Charging Solutions As robotic fleets reshape logistic, delivery and inspection industries, the demand for more efficient and flexible charging solutions is increasing while the feasibility for these fleets to be managed manually and recharged ad hoc by a 24/7 rotation of personnel is decreasing. The next step is toward enhanced autonomy, whereby normal operations can be sustained without human intervention, which is where WiBotic comes in.

Features: Applications: • Driving the next generation of robotic autonomy Wireless Charging Solutions • Vicor Zero-Voltage Switching (ZVS) regulator powers wireless charging innovation

Availability: Available Now

Murata Third Generation of MEMS Sensors

Features: • The SCC3000 series components combine a high-performance angular rate and accelerometer sensor components.

Applications: Safety critical automotive applications.

Availability: Available Now

Microchip New 3kW Transient Voltage Suppressor

New Launch

Murata has developed a 3rd generation of MEMS (Micro-Electro-Mechanical Systems) 4DoF (four-degrees-of-freedom) and 5DoF (five-degrees-of-freedom) inertial sensors that realize highperformance for safety critical automotive applications.

Microchip Technology announces newly-expanded portfolio of Transient Voltage Suppressor (TVS) vertical arrays – the MDA3KP Transient Voltage Suppressor (TVS), a 3kW diode family of more than 25 products with different screening levels, polarities and qualification standards.

Features: • Only available technology offering a comprehensive voltage range tested to a high reliability standard and qualified based on the MIL-PRF-19500 JANTX level equivalence standard.

• Divert excess current around sensitive components to protect them from electrical overstress.

Availability: Available Now

MORNSUN 120-350W ACDC Converter LOF Series

Features: • The safety regulation of LOF series input-output meets international medical regulations 2xMOPP. • LOF series with active PFC function will be safer and more reliable in practical application.

Applications: Low leakage current (<0.1mA) is suitable for BF medical equipment and non-patient contacting devices, and it also meets industrial application standards.

Availability: Available Now

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MORNSUN latest open-frame ACDC Converter LOF series can meet the standard of the medical industry, and comes with the power of 120/225/350W. The power density of LOF products is upgraded, and the dimension is reduced by 59% ((LOF120: 3"×2"×1.2" (1W/cm3), LOF225: 4"×2"×1" (1.7W/cm3), LOF350: 5 "×3"×1" (1.4W/cm3)) compared with conventional products. It will provide more layout space for customers.

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Multiphysics Simulations to design & deliver transformational Electronic Products We are witnessing a Silicon Renaissance era! Massive investment & innovation in Silicon technology is enabling development of transformational electronic products & applications like 5G, IoT, Autonomous vehicles, Mobile, HPC, AI.

TECH ARTICLE

There is great interest among system companies like Cisco, Google, Facebook, Microsoft and Amazon to design their own Silicon, in addition to the mainstream chip suppliers. Idea being to design and optimize the entire system across chippackage-board to achieve the best performance, power, reliability, and other goals.

Fundamental enablers for these innovation & development include advancements in Silicon-technology (shift from Planar to FinFET to GAA devices) and advancements in packaging technologies such as WLP & 2.5D/3D ICs (multiple chips / chiplets stacked in a single system).

electronics products, by using the best computational sciences and multiphysics simulation.

Let us take an example of simulating a 3DIC system where multiple chips & chiplets are stacked horizontally / vertically Nayan Chandak Director of Application in a single system. We are Engineering, Ansys consuming massive amount of power in very small footprint, which introduces power-integrity & thermal challenges, and in-turn mechanical stability issues like warpage. High speed signals running in close proximity introduces electromagnetic effects & signal-integrity issues.

Similarly, power-noise has a clear impact on performance/ timing, and it is very severe at advanced nodes like 7 nm & below.

To deliver these transformational products using the latest Silicon and Packaging technology, the industry has unprecedented challenges to solve. The most complex SoCs are packing over a trillion transistors in a single system. On-chip signal speeds are hitting 112 Gbps. Operating voltages are near threshold in 500 mV range. And these high-speed systems, with extremely dense packed transistors, are burning high power ranging from tens of Watts to 15 KWs! It is a huge challenge to meet the desired PPA matrix. In addition, we need to ensure reliability (reliable operation over designed lifetime), and now increasingly security as systems go into mission critical areas like autonomous vehicles and defense.

Traditional approaches to solve these challenges in Silos is clearly inadequate. One needs to look at Multiphysics aspect to assess and address complex interdependencies.

â&#x20AC;˘Vol - 02 / 07

For example, one needs to read in data for these trillion transistors & rest of the pieces (package, interposer, TSVs, etc) and compute power/timing/voltage/temperature/etc. for each of them. This is extremely data and compute intensive.

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Risk is all around us â&#x20AC;&#x201C; while meeting the time-to-market, PPA matrix, and time-to-yield. But we are not powerless. There are proven strategies that shed risk and give you more predictability and more control. That is where Ansys Semiconductor simulation products kick-in. Multiphysics nature of these problems make Ansys uniquely situated to address them. Our mission is to empower customers to deliver these transformational

To solve these, Ansys developed a new platform called SeaScape, based on big-data and elastic compute principals, as shown in image. Multiple engines to analyze power/timing/ variability/reliability are tightly integrated allowing one to solve for complex interdependencies & Multiphysics problems. In the center you see Ansys RedHawk-SC, meant for powerintegrity analysis for SoCs. And then the other pieces like 3DIC and Chip-Package-Board analysis extension, Thermal Analysis, Thermo-Mechanical analysis, Electromagnetic

JULY 2020

Variability Analysis.

Seascape platform allows you to intelligently visualize this massive data and perform actionable analytics, similar to other big-data system like Google Search and Maps. It enables modeling comprehensive workflows to capture failure mechanisms and deliver signoff confidence.

All the major foundries, including TSMC and Samsung, have certified Ansys RedHawk-SC and other Multiphysics solutions across all advanced process technologies. There are number of customer proof-points, with over 40 presentations from top-semiconductor companies in DAC (Design-AutomationConference) in last 2 years.

About Author: Nayan Chandak is Director of Application Engineering at Ansys.

He has over 17 years of experience in EDA/Semiconductor Industry with a primary focus on solving Power-Noise-Reliability challenges for advanced SoCs, 3DICs, and Custom-designs.

He works with top Semiconductor design companies across the globe to help them build Multiphysics Simulation flows & methodologies. Nayan holds a Masters degree in Microelectronics from IIT Bombay and Bachelors in Electronics Engineering from NIT Nagpur.

Infineon Presents SECORA ID S for Region-specific Electronic ID Cards

NAWA Technologies’ Ultracapacitors for IoT Devices

With SECORA ID, Infineon Technologies AG offers an easy-to-integrate security platform for contactless digital ID documents. The first product variant, SECORA ID S, is a particularly flexible, Java-based solution. It simplifies and accelerates the design and production of region-specific sovereign documents such as eIDs in card format. The solution includes the security chip, the operating system and applets while meeting the increased security requirements of sovereign applications: chip and operating system are certified according to Common Criteria EAL 6+.

As a system solution, SECORA ID S offers many advantages: - The security chip SLC52G provides highest protection of the individual data of the card holder and a storage capacity of up to 800 kByte.

- The chip was developed at Infineon’s competence center for contactless technologies in Graz, Austria; it offers outstanding performance for contactless data transfer.

- The Java Card Standard v3.0.5 software facilitates and accelerates development and testing of electronic ID cards.

NAWA Technologies’ next-generation ultracapacitors will revolutionise the growing global market for IoT devices, offering huge benefits in operational lifetime, cost, efficiency, safety and environmental impact.

As the world becomes more connected, IoT devices can be found in billions of products. They play a crucial role in our daily lives, from bringing added convenience in domestic applications, like wifi-enabled electrical appliances – such as smart meters – to improving the quality of our food by monitoring its condition during transportation. Constantly tracking factors like pressure, location, proximity, smoke, gas and light, IoT devices can be found everywhere from our homes to extreme environments including deep under the sea or at altitude in aerospace.

The database is completely open and allows design/CAD teams to build custom applications for Chip-Package-Board design, like Mobile App development.

Thanks to this wide variety of applications and usage conditions, the number of IoT devices across the world is expected to grow exponentially, from 25 billion in 2020 to 80 billion before 2030*.

TECH ARTICLE

So where does Ansys solutions fit in SoC design-cycle? There are multiple EDA tools enabling RTL to Layout Design flow shown in the airplane image below. Ansys solutions comes in play when simulating complex Multiphysics problems. To deeply simulate and analyze, establish golden reference and actionability for Electromagnetics, Mechanical, Thermal, Power & Power-Integrity, Reliability, and more. Ansys provides the necessary sign-off confidence or the wings for your Electronic design to take off!

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analysis (with integration of industry’s gold standard Ansys HFSS & Ansys RaptorX solutions), Early Power Analysis and power-optimization, Analog-Mix-Signal simulation, ESD, and

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Prabha B V

AUTOMOTIVE

Lead Architect, Elektrobit

Evolution of In Vehicle Infotainment

Today we cannot imagine driving a vehicle without Infotainment.

In Vehicle Infotainment (IVI) has become ubiquitous in the developed markets and is fast becoming ubiquitous in the developing markets.

IVI has undergone a tremendous transformation since 1930â&#x20AC;&#x2122;s when Motorola introduced the first AM radio fitted inside the car. The major factors for this transformation are:- 1) Increase in the average time spent inside the car everyday 2) Consumers demand for entertainment, safety, security, convenience and consistent user experience across different channels; 3) Revolution in the adjacent consumer electronics industry especially smart phones; 4) Regulatory and legal requirements.

Over the years the buying pattern of the consumer has also undergone tremendous shift. From taking buying decisions based on the power delivered by the vehicle and the exterior look of the vehicle to now based on the overall experience delivered by the vehicle.

All these changes are fast transforming the vehicle to become the third living space where the occupants will enjoy spending time in a safe, secure and convenient environment coupled with entertainment.

The below diagram illustrates software architecture of a simple infotainment system with CD player support:

Over the years, with constant demand for new feature additions, the complexity of the infotainment system has also increased enormously. The below diagram (Automotive Android) illustrates the new generation software architecture that help cater the new generation feature set:

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Evolution of IVI

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Technology has played a pivotal role in this evolution.

Technology has also evolved leaps and bounds in the past 9 decades. To understand how the technology has evolved, let us look at the below two illustrations.

Reference: Automotive Android Architecture

JULY 2020

How Technology is enabling the market trends

highlight of the Adaptive platform is that it allows dynamic linking of services and clients during ECU runtime which makes it much more flexible for the application developers. Platform also utilizes C++14 to allow feature rich and fast development of ARA applications.

The above diagram shows different parts of AUTOSAR Adaptive platform. You can find the specification documents of each different software module in the AUTOSARweb page (https:// www.autosar.org/standards/adaptive-platform/adaptiveplatform-1803/).

To realize the market trends, the services/ components illustrated in the above diagram serve as the platform components.

Elektrobit (www.elektrobit.com), is one of the few companies that are developing products that implement the Adaptive AUTOSAR. Elektrobit’s Adaptive Platform product is called EBcorbos and you can find more information about that in the following web page - https://www.elektrobit.com/products/ ecu/eb-corbos/.

Automotive industry the world over is embracing these new technology trends to remain competitive in the market, albeit at the different pace based on the geography.

The market trends warrant the need for a powerful, high speed, hardware agnostic E/E architecture which is scalable. The above diagram illustrates the Adaptive autosar architecture on top of a high-performance computer. The usage of powerful high-performance processors provide the flexibility to host a wide range of applications (running on different operating systems) on it through the use of Hypervisor.

Adaptive AUTOSAR is standardization of the AUTOSAR runtime for Adaptive Applications (ARA). This architecture can be used to implement functionalities like autonomous driving, over-theair software updates, IoT (Internet of Things) features, media streaming and other services in the future cars. The important

AUTOMOTIVE

• Smart Digital cockpit –Improved digital cockpit experience for drivers, passengers enabled via multi modal user experience which gives a higher degree of personalization • Artificial intelligence – Collecting, analyzing and making inferences to present appropriate and personalized information to the driver • Heads up display – Presenting meaningful information of the inside and outside environment of the vehicle, on a headsup display, to the driver to assist the driver therefore making the drive safer • In-vehicle health – Monitoring the driver’s health and taking appropriate actions in case of risky or emergency situations. Additionally, monitoring driver for any distractions and triggering alerts • Multi-modal user interaction – Multiple ways of user interaction with the infotainment system such as touch, gesture, voice, eye movement • Improved ADAS as a Step towards an Autonomous Future – Features such as lane departure warning, blindspot warning, emergency braking will assist the driver to function efficiently • In-Car Commerce and On-Demand Connected Car Services - New apps in OEM’s Appstore enables drivers to place advance drive-thru orders with selected retailers, pay for fuel, make hotel and dinner reservations. In-dashboard access roadside assistance is another highly requested feature.

Such connected apps can gauge data from the vehicle and transmit it to the maintenance team so that they could arrive well-prepared.

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Market Trends

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The try-before-you-buy route to energy efficient power design Evaluation platforms help pick SiC components in power conversion circuits.

TECHNICAL ARTICLE

Xuning Zhang, Levi Gant, Littelfuse, Inc. The quest for greener energy production and consumption has put a premium on high-efficiency power circuitry. In that regard, many modern power supplies and converters operate at much higher voltages that allow use of lower currents to minimize I2R losses. Silicon carbide (SiC) MOSFETs and diodes are important elements of these new high-power, high-voltage power conversion circuits.

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Figure 1 The gate drive evaluation platform includes the motherboard, two plug-in gate driver modules, and the heatsink and fan to support up to 5kW of output power.

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SiC MOSFETs provide low on-resistance and can switch back and forth between on and off states rapidly. Consequently, they dissipate much less power than insulated gate bipolar transistors (IGBTs) which have slower turn-off speeds and higher turn-off switching power loss. In addition, silicon carbide’s wide bandgap enables SiC devices to operate at high voltages. In contrast, silicon-based MOSFETS can’t realize both high blocking voltages and low on-resistances. As a result, SiC devices are becoming integral in high-power applications.

Because of the high power levels SiC devices deal with, designers must evaluate both the SiC devices themselves and their gate driver circuits. SiC technology is still relatively new, and device performance under a wide range of conditions is not fully characterized.

An evaluation platform will enable design engineers to evaluate SiC MOSFETS, SiC Schottky diodes, and gate driver circuits under continuous operation in converter circuit applications.

The evaluation platform will aid in accelerating design cycles for successful, SiC-based power converter design and assist in speeding the time-to-market for the end product.

Design challenges for power conversion circuits To maximize power output and efficiency of power conversion circuits, designers must ensure that: • The power devices can perform at rated power and current and deliver enough power to the load • The circuit minimizes internal power loss for maximum efficiency • The design incorporates protection circuitry for the SiC power devices • Printed circuit board (PCB) layout minimizes parasitic inductances and capacitances • EMI emissions are within allowable limits • The design uses a minimum of passive components to help keep down cost, size, and weight • The gate driver helps realize the above goals and assists in maintaining thermal performance within specified temperature ratings.

Figure 2 Simplified diagram of the gate drive evaluation platform. The power configuration is a half-bridge output stage. Not shown are the decoupling capacitors positioned close to the SiC devices to maintain the supply voltage during device switching. The decoupling capacitors and the capacitor across the SiC devices act as a low-pass filter to remove switching noise on the DC supply line. Below, parasitic capacitance and inductance in the gate drive loop.

JULY 2020

Figure 3 Gate driver switching loss test using a buck converter as a load. Visible here are the gate drive voltage, MOSFET drain-source current, and MOSFET drain-source voltage.

Recommended drive voltages are 15 to 20 V to switch the MOSFET to its on-state and a voltage of 0 to -5 V to switch the MOSFET to the off-state. The peak output current for the gate drive can range from 1 to 15 A depending on the MOSFET

Traditionally, optocouplers would provide the isolation. Newer IC technology can employ inductive or capacitive isolation.

The new methods are known as digital isolator techniques. The optocoupler and the digital isolator have both advantages and disadvantages. The optocoupler sources current which makes its input less susceptible to EMI. However, optocouplers can’t handle data transmission rates as high as those of digital isolators and bring longer pulse-width distortion times.

Pulse-width distortion time refers to signal delay time through the driver IC. In a half-bridge power conversion topology, excessive delay can create waveform distortion and lowfrequency noise.

Optocoupler performance varies with the drive voltage, temperature, and device age. Digital isolator-based drivers have more stable parameters over temperature. Because digital isolators operate with a voltage input, they can be more susceptible to EMI. But all in all, the digital isolator’s more stable operating parameters makes it a better choice than optocouplers in gate drivers for power conversion circuits using SiC MOSFETs. With high-power circuits, protection mechanisms are necessary to prevent device thermal runaway and device and circuit damage from fault conditions. Gate driver ICs that incorporate protection circuitry are highly recommended.

Gate drive ICs should have de-saturation (de-sat) protection, soft turn-off during a fault condition, a Miller clamp circuit, and under-voltage lock out (UVLO).

De-sat protection circuitry turns off a MOSFET in the event of a load short-circuit. Soft turn-off avoids a large transient voltage overshoot and turns off the MOSFET during a shoot-through failure (where both MOSFETs are momentarily on simultaneously). A Miller clamp circuit prevents the shoot-through condition by draining current from the parasitic drain-gate capacitance to avoid a transient rise in the gate voltage. The clamp circuit keeps the MOSFET from turning-on when it should be in the off-state. If the voltage supply for either the gate driver input or for the isolated output circuit gets too low, the UVLO circuit turns off the gate drive to protect the MOSFETs

TECHNICAL ARTICLE

power handling capacity. The driver needs to provide a high pulse current to reduce MOSFET switching loss during switching transients. In addition, high continuous current with small external gate resistances reduces driver temperature during high-frequency switching of the SiC MOSFET. The high dv/dt caused by fast SiC MOSFET switching makes high common-mode currents flow through the gate driver and the rest of the power conversion circuit. High commonmode currents can affect the voltage reference node in the control circuit, causing incorrect operation. The magnitude of the common-mode current is determined by the MOSFET dv/ dt and the impedance in the common-mode current path.

Consequently, the gate driver IC and its power supply both need a high isolation impedance to reduce common-mode current. The isolation capacitance of the gate driver should be less than 1 pF. The isolation capacitance of the power supply should be under 10 pF.

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A gate drive evaluation platform helps designers address all these challenges. The platform can operate at high power levels continuously to characterize the performance of the selected SiC MOSFETS and diodes. The platform also enables the comparison of different gate drivers under multiple test conditions. Gate drivers can be evaluated for thermal performance, EMI immunity, and the capability to drive the power components so they operate at high efficiency. Finally, the platform allows analysis of the design for efficiency improvements, electromagnetic interference (EMI) emissions, cost, size, and weight.

The gate drive evaluation platform is essentially a power stage reference design consisting of a motherboard with two SiC MOSFET-SiC Schottky diode pairs in a half-bridge configuration.

The half-bridge circuit can output a maximum of 5 kW with an 800-Vdc bus voltage. The motherboard can accommodate two separate gate driver module boards, one for each switch position. Thus, different gate driver integrated circuits and gate driver designs can quickly and easily mount on the motherboard to evaluate gate driver performance and how the driver impacts output power.

The third major element of the gate drive evaluation platform is the thermal management, a heatsink and a fan that cools the MOSFET-diode pairs. The heatsink-fan subsystem enables the power circuit to deliver up to 5 kW continuously with the MOSFET-diode pairs switching at frequencies up to 200 kHz. The gate drive evaluation platform’s printed circuit board layout minimizes both loop inductance and coupling between the power circuit and the gate circuit. The two gate driver circuits allow independent evaluation of both the top and bottom gate-driving qualities.

The selection of SiC MOSFETs and diodes and the selection of the gate driver are the most important decisions for the power conversion design. The MOSFET must have the voltage, current, and power specifications to meet the converter requirements.

The gate driver has more sophisticated requirements. It should have a wide voltage range and enough output current to drive the power MOSFET.

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TECHNICAL ARTICLE

from improper switch timing. These protection circuits ensure a more robust and safe power conversion circuit.

PCB board layout has a major impact on the performance of dynamic circuits such as high-efficiency power conversion circuits. Parasitic capacitance and inductance from PCB traces and ground planes add to the parasitic capacitance and inductance in the circuit. Parasitic components in the gate drive loop degrade MOSFET switching performance.

Gate-source capacitance forces a higher driving current from the gate driver IC. Stray inductance boosts gate-source voltage overshoot and leads to ringing during MOSFET switching.

To minimize the stray capacitance and inductance, keep the gate path as short as possible by placing the gate driver, the gate resistor, and the decoupling capacitor close to the MOSFET gate. Minimize loop inductance by routing the gate return path directly below the gate supply trace. Maximize the distance between the MOSFET gate traces and the drain traces to reduce the size of the gate-drain capacitance. This practice cuts the current entering the gate which reduces the Miller effect.

Additionally, ground planes under power conversion circuits add capacitive coupling; avoid use of ground planes for MOSFET switching-based power conversion circuits. All these PCB layout recommendations have been implemented in the gate drive evaluation platform to avoid design, layout, and test of a custom test board.

The 10-Ω gate resistor eliminates differences in the performance of the gate drivers. The 10-Ω gate resistor does slow MOSFET transient switching speed which increases switching loss. The differences between the high-output-current driver and the low-output-current driver are more significant. The MOSFETs switch faster when the high output current driver is used with a lower gate resistance. The lower gate resistance does exhibit more ringing during a switch transition than the higher gate resistance. The designer must find the optimum combination of gate driver, gate resistance, and MOSFET to minimize switching loss.

Figure 5 MOSFET turn-on transient with two different driver ICs and a 10-Ω and 2-Ω gate resistor. Green trace: IXDN614. Gray trace, IXDN602

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Figure 4 Waveforms resulting from test conditions: input voltage = 800V, output voltage = 400V, switching frequency = 100kHz, and output power = 2.5kW

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The gate drive evaluation platform can easily compare switching loss and switching transients using different gate drive ICs. Consider the case of evaluating gate drivers for a buck converter operating under continuous switching conditions.

The buck converter operates at 100 kHz and will output 2.5 kW. The drive capabilities of driver ICs and the external gate resistances used will influence the SiC MOSFET switching transients and the overall switching losses. In this test, the first gate driver has a drive current rating of 14 A and the second has a drive current rating of 2 A. Each gate driver was tested with a 10-Ω and a 1-Ω gate resistor.

The gate drive evaluation platform can help evaluate driver IC thermal performance thanks to the heatsink and fan that enable the MOSFETs to operate in a continuous switching output state. The platform can also be used to test driver protection functions.

In a nutshell, gate drive evaluation platforms are a tool that facilitates the evaluation of SiC devices and the gate drivers. With gate drive modules plugged into the motherboard, designers can easily compare the efficiency and thermal performance with different gate driver ICs. Designers can use the PCB layout techniques on the evaluation platform and the component recommendations to overcome the design challenges of SiC devices to develop efficient, thermallycontrolled, and protected power conversion circuits. As a result, the evaluation platform enables faster design of efficient power conversion circuits and speeds product time-to-market.

JULY 2020

Experience Leading Edge Development & Integrated Solutions with Mitsubishi Electric Jitendra Joshi

Sr. Manager, Marketing Department for Controller, Software & e-F@ctory Solutions, Mitsubishi Electric India

The e-F@ctory utilizes cutting-edge control like iQ-R platform and high-speed networking technologies like CC-Link IE and CC-Link IE TSN to visualize information and coordinate with high-level Manufacturing Execution Systems (MES) to improve production while reducing Total Cost of Ownership (TCO). In India, Mitsubishi Electric's e-F@ctory provides Smart Manufacturing Solutions through more than 20 Alliance Partners such as Wipro, Schaeffler, Cognex, Entrib Analytics and more. Our “Edgecross” platform offers software development flexibility to the partners, so as to meet exact customer needs. The e-F@ ctory Alliance addresses the need of smart manufacturing for industries like Automotive, Pharma, F&B, among many others.

Along with its e-F@ctory concept, the global leader in electric and electronic equipment for residential, commercial and industrial applications have also developed Production Line Improvement Technology, a new technology for the efficient design of production floor layouts and material flows as well as the accurate estimation of productivity. MAISART “Mitsubishi Electric’s AI creates the State-of-the-ART in technology” using deep learning, big data analysis and reinforcement learning

As we move to the realization of more Industry 4.0 implementations, as part of an ongoing industrial transformation journey, the use of Collaborative Robots (Cobots), which are designed to work alongside people in/among others manufacturing , warehousing, logistics and healthcare, is expected to grow rapidly in the next few years. Mitsubishi Electric has also launched its MELFA Assista series of robots that work collaboratively with humans based on safety features, such as collision detection and strict compliance with the international safety and robotic standards ISO 10218-1 and ISO/ TS15066. The series also will introduce an intuitive engineering software, RT Visual Box, for quick, easy system deployment.

MELFA Assista and RT Visual Box will help customers with more efficient production, reduced Total Cost of Ownership (TCO) of robotic manufacturing systems, and meeting new needs for adequate distancing of workers in manufacturing sites.

AUTOMATION

techniques “Maisart” offers compact, product-based AI solution to create smarter factories.

The goal for Mitsubishi Electric is to develop products that our customers can use safely and reliably, and, to only deliver products that fully satisfy their needs. Mitsubishi Electric’s leading-edge development is highly regarded internationally for its efforts to improve quality in every process, whether product development, design or production, as well as in aftermarket service following delivery. With flexible manufacturing processes focused on continuing our legacy and evolving, we provide high-performance, high-quality products that help make our customers more competitive.

As the third-largest Asian economy, India remains an attractive investment destination due to the sheer size and choice of its consumer market. With expected growth and intent to boost demand which is evident from the multiple reforms and measures announced, automation suppliers for the products like PLCs, Software and IoT solutions will see major demands coming. Factory Automation is becoming more and more digital with IIoT and with India being preferred destination for manufacturing, it becomes imperative to increase competitiveness and build efficient value chain with our Products and Solutions.

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The Automation Industry is on the rise and is contributing towards increasing productivity, improving quality, consistency and reduced costs in manufacturing sectors. Mitsubishi Electric serves its customers as a comprehensive Factory Automation (FA) Solution Provider. Along with developing products and solutions that match customers’ needs, Mitsubishi Electric utilizes its advanced technology to provide reliable solutions with an eye on the next generation of manufacturing.

For a smart factory to be achievable, the real-time utilization of production shop floor data and efficient connectivity with IT systems are essential. With Mitsubishi Electric’s IIoT solution e-F@ctory, we offer seamless connectivity between shop floor and IT systems and analyse on a real-time basis with optimal efficiency. With continuously enhanced performance on a wide range of Factory Automation products, Mitsubishi Electric uses e-F@ctory to optimize all aspects of production and coordinate information between MES high-level information systems and production floors. The Edge computing component of e-F@ctory solution comprises of MELIPC (Industrial PC) and RDA ensure Analysis of the shop-floor data on real-time basis. The real-time feedback ensures immediate corrective actions and reduces losses.

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CASE STUDY

JULY 2020

48

Easy and Secure Remote Access for Improved Machinery Services

Article By: Moxa

Introduction Maximum uptime is key for machine productivity. Therefore, a customer required a timelier and more efficient after-sales service from a leading manufacturer of mechanical power presses in order to ensure improved machine performance and effective troubleshooting. The mechanics power press machine is very complex. Its setup is just as complex, as its installation and commissioning take one full month. At the request of the overseas customer, the manufacturer installed the Moxa Remote Connect (MRC) gateway in the power press machine to enable a timely remote after-sales service.

end-to-end connections.

With the MRC connection, only the computer that runs the MRC client needs to install a controller software license for remote access. Compared to RDC, MRC saves on computers and the license costs associated with each remote machine.

More importantly, engineers can now save time and money on unnecessary trips by solving the customer’s problems directly from their office. In fact, if more and more machines were equipped with MRC gateways, engineering teams would be more readily available to efficiently serve their customers from anywhere in the world.

At first, the machine builder adopted Windows-based Remote Desktop Control (RDC) technology, but security risks and System Requirements additional costs came at a high price. Windows-based RDC A secure connection between engineers and the machines requires a Windows-operated computer to be installed at without an add-on computer Remote access controlled by the factory so that the machine has remote connection machine operators in the field capabilities. However, the Windows-based computer by itself An easy network connection that does not require extensive is susceptible to security risks, and the possibility of attacks IT expertise for both engineers and machine operators increases even more when the computer connects to the Moxa Solution Internet. Needless to say, a cyberattack will result in a shutdown Among remote connection solutions, Moxa's MRC solution of factory operations. To preempt security risks, the machine stands out for a number of reasons: end-to-end and fullybuilder needs to adopt complex IT-related firewall equipment, integrated security, ease-of-use, cloud-based flexibility, which is time-consuming and hard to manage. Also, each and proven reliability in harsh factory conditions. Only three computer running RDC on the machine side requires a costly components—MRC gateway, a cloud server, and client controller software license, making a remote connection software— are needed to build the cloud-based remote veryexpensive in order to conduct machine maintenance access connection. or troubleshooting.

The machine provider integrated the LTE version of the MRC Instead of RDC, the machine builder adopted the new gateway into its mechanical equipment to enable 4G cellular cloud-based MRC remote access technology that hosts the connectivity, which enables out-of-band remote access to MRC server on Amazon’s AWS cloud platform to manage isolate this connection from local machine networks. end-to-end secure tunnels between the engineering team (as a MRC client) and the press machine (connected behind The second investment was signing up for AWS to host the MRC the MRC gateway) for easy and secure remote diagnostics, server that administrates different user roles and privileges for maintenance, and troubleshooting. The MRC server can end-to-end interconnections and management. support a mesh-type tunnel infrastructure that is scalable to connect computers (via MRC clients) and machines (via MRC The MRC client software is installed for free on the computers gateways)—up to 5000 devices to create many-to-many, at the engineering team’s side, so the engineer can simply

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press a button to request a remote connection to a specified machine.

Microchip, KIOXIA America Complete 24G SAS End-to-End Storage Testing

Vitesco Technologies, ROHM Sign a Partnership Agreement

Microchip Technology and KIOXIA America have recently announced the successful completion of the industry’s first 24G SAS End-to-End Storage interoperability testing. Industry-standard 24G SAS Infrastructure delivers improved performance, security and reliability to data center, cloud, hyperscale and enterprise server/ storage customers while preserving existing investments in SAS infrastructure.

Vitesco Technologies and ROHM Semiconductor have recently signed a development partnership, beginning in June 2020. Vitesco Technologies will use SiC components to further increase the efficiency of its power electronics for electric vehicles (EV). Through their higher efficiency SiC semiconductors make better use of the electric energy stored in a vehicle battery. Thus, an EV has a longer range, or the battery cost can be reduced without impacting the range.

This interoperability testing demonstrates that Microchip’s industry-leading suite of 24G SAS products and KIOXIA 24G SAS Solid-State Drives (SSDs) can be utilized together as part of next-generation storage solutions. Microchip’s 24G SAS tested products included the SmartROC 3200 PCIe Gen 4 Tri-Mode RAID On Chip (ROC) Controller, the SmartIOC 2200 Input/ Output Controller (IOC), and the SXP 24G SAS expander. New server and storage systems can be deployed utilizing these proven components that increase system performance while maintaining backward compatibility with existing infrastructure.

Created to complement the latest PCIe Gen 4 data center input/output (I/O) specifications, the 24G SAS (SAS-4/SPL-5) standard doubles the storage interconnect bandwidth of the prior SAS standard, eliminates bottlenecks at the CPU host interface, and allows more efficient use of both new and legacy storage infrastructure. 24G SAS includes robust Forward Error Correction (FEC) that supports the broad range of enterprise-quality server/storage use cases while minimizing system costs.

Squeezing out the best performance level by SiC Vitesco Technologies is already developing and testing SiC technology in an 800-volt inverter concept to confirm the efficiency potential of the technology. The approach of this program is to look at the complete system of inverter and motor to identify the best combination of device technology and switching strategy.

In this context SiC semiconductors – e.g. SiC MOSFETs for 800-volt battery systems – offer more efficient switching in the inverter (higher frequency, steeper switching slopes) and cause fewer harmonic losses in the electric motor. Also, SiC technology is a key enabler for super-fast charging technology that uses 800 volts.

In the course of the cooperation ROHM and Vitesco Technologies will work on creating the optimum combination of ROHM’s SiC technology for high volume manufacturing and best fit of inverter design for highest efficiency.

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The timely remote services by machine engineers over the Why Moxa simple and secure MRC connection met the customer’s Fully-integrated secure connection with end-to-end datarequirements. At the same time, the machine maker took encryption full advantage of the collected data on machine status and Cloud-based interconnections and security management operation conditions, and made valuable recommendations for for service scalability machine operations to ensure less wear and tear and optimal With one simple click, engineers with no IT background can performance. To maintain this improved after-sales maintenance access remote machines with no complex firewall settings service in their business model, the machine maker’s possible and IP management strategy forward is to install the MRC gateway in their machines Easy for non-IT background operators to set control for access shipped around the world. security Transparent tunnels suitable for existing software tools Out-of-bound LTE cellular connection for isolated protection from local networks

CASE STUDY

The remote connection is simple and secure; it is controlled by machine operators through the local on/off control of the MRC gateway in the field. Operators can control and limit remote access to specified devices and services connected to the MRC gateway, which enables a rolebased access control with an embedded firewall under whitelist control.

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Teledyne e2v’s Technologies Lead Innovations In A&D And Beyond Anthony Fernandez

Vice President Teledyne e2v Asia Pacific

From space market to R&D efforts into RF Softwarisation, Teledyne e2v enriches leading partnerships to innovate into emerging technologies such as AI/ML, 5G. Emphasizing on semiconductor packaging and the impact of miniaturization, Anthony Fernandez | Vice President | Teledyne e2v Asia Pacific takes Niloy from BISinfotech into the voyage of the company’s history and heritage, business strategies and excellence to innovation to be a leader in the technology space. Edited Nub Below.

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1. How would you like to introduce Teledyne e2v as a The Proof is all around you — Everywhereyoulook™. company and its company heritage etc.

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Teledyne e2v is part of Teledyne Technologies, a publiclytraded US corporation headquartered in California. Teledyne Technologies provides enabling technologies for aerospace and defence, and industrial growth markets such as factory automation and medical imaging. Teledyne e2v’s microwave, semiconductor and imaging technologies enable many of the products and services you use every day.

Established in 1947, Teledyne e2v (then known as English Electric Valve Company Ltd.) began manufacturing magnetrons for defence radar systems. Over seven decades, through R&D investment and M&A, e2v expanded its core RF (radio frequency) and microwave business to include highperformance CCD and CMOS imaging sensors, and a range of high-reliability semiconductor solutions. The company also

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In March 2017, e2v was acquired by Teledyne Technologies for £627 million ($789m), becoming Teledyne's largest acquisition to date. Every business within e2v is highly complementary to Teledyne and contributes to a balanced portfolio of highly engineered products that serve a wide range of demanding applications, including: • RF Power solutions for defence electronic countermeasures, radiotherapy cancer treatment machines, radar systems, satellite communications amplifiers, industrial heating, cargo screening, ProWave® industrial processing systems, missile control safety and arming devices, and digital television transmitters.

• Imaging solutions including CCD and CMOS sensors and cameras, for space and earth observation imaging, science and life science imaging, machine vision, ophthalmology and dental x-ray systems.

• High-performance, ultra-reliable semiconductor solutions addressing critical functions across the entire signal chain – covering data converters, interface ICs, microprocessors, analog switches, voltage references, digitizers, logic, memory and RF devices. Serving the avionics, industrial, medical, military, scientific and space sectors, the company is recognized as a world leader in re-engineering and up-screening commercial technologies to deal with the most demanding of application scenarios.

As a result of our track record of innovation and technological breakthroughs, Teledyne e2v continues to be involved in many high-profile ground-breaking programmes, including: • Airbus A380 • Boeing 757, 767, 747, 777, and 787 • Many NASA and European Space Agency missions such as the Hubble Space Telescope upgrade project • US Patriot air and missile defence system • Eurofighter Typhoon Our success is built on long-established relationships with industry partners. The combination of our strong in-house technical capability, and links with technical authorities and universities, ensures that we can bring together the right level of expertise for a diverse range of technical challenges.

years, thanks to Teledyne e2v’s expertise of transforming the latest commercial grade processors into spaceflight-ready models. In a first for a European mission, Teledyne e2v’s re-engineered PC7448 microprocessors will be used at the heart of Thales Alenia Space’s OBC that serve the Lightning Imager (LI) systems on EUMETSAT’s next generation Meteosat geostationary meteorological satellites. (Source: https://www. teledyne-e2v.com/news/teledyne-e2v-delivers-first-spacegrade-commercial-processors-to-thales-alenia-space-foruse-in-a-european-satellite-mission/) Many of Teledyne e2v’s products are developed through strategic partnerships with leading semiconductor vendors – such as Logic-X, a provider of high-quality sensor processing products that solve its customer’ embedded and edge processing challenges. Teledyne e2v and Logic-X are collaborating on the design and development of an FPGA mezzanine card (FMC) that incorporates two of the latest Converter chips from Teledyne e2v. Those are the EV12DS460A and the EV12AS350B. The EV12DS460A is a ground-breaking DAC which provides an analog bandwidth extending beyond 7GHz facilitating multi-band, direct digital synthesis up to K-band (26.5GHz), with a very short latency of 3 clock cycles. The EV12AS350B is set to be the only 12-bit resolution ADC on the market that combines signal digitization at 5.4GSps, input bandwidth in excess of 4.8GHz and latency as low as 26 clock cycles with a noise floor of -150dBm/Hz. (Source: https://www.teledyne-e2v. com/news/teledyne-e2v-and-logic-x-are-collaborating-onthe-design-and-development-of-an-fpga-mezzanine-cardfmc-that-incorporates-two-of-the-latest-converter-chipsfrom-teledyne-e2v/) The Interstellar H2020 Project is funded by the EU Commission and Teledyne e2v is leading the development of two data converters to help bridge the RF world. These are an Analogto-Digital (ADC) converter and a Digital-to-Analog (DAC) converter. The Interstellar project is a consortium led by Teledyne e2v and supported by Thales Alenia Space, Airbus Defence and Space and the Fraunhofer Institute. The total budget for the project is 7.3 million Euros and the EU has contributed 6.2 million Euros of this. Teledyne e2v is investing even further into the project to drive the progress of the data converter technology. (More detail, please visit: https://www. teledyne-e2v.com/products/semiconductors/interstellar/)

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expanded its global operations, with sales, technical support and manufacturing facilities established across North America, Europe and Asia Pacific, and employing c. 1,600 people.

3. Semiconductor packaging technologies as miniaturization, light-weight and high pin count has become critically important?

In 2017, Teledyne e2v has set a European mission first by re-engineering commercial microprocessors that provide Thales Alenia Space with a major increase in processing speed and power for lightning imaging satellites’ on-board computer (OBC). Thales Alenia Space has gained a 10-times increase in the processing speed and power for its OBC, with the design and qualification process cut by up to four

have distributed processing, for example for active antennas.

This is only possible if the device is small enough. This has the critical system benefit of lowering the flow of data through the system.

Another important point is the amount of processing is increasing, especially with Artificial Intelligence. Our customers need to

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2. Few leading customers of Teledyne e2v where There is higher and higher complexity, and a race towards Teledyne e2v’s core offerings are empowering and SWaP: Size, Weight and Power. Having smaller devices enables innovating companies? smaller satellites, reducing power also. It is also possible now to

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focus on the service they are delivering to their users, hence they have lower resources to develop hardware. Teledyne e2v supplies the market with the Qormino module, which is already qualified for aerospace use. It saves a lot of design effort and time to our customers, and this is one of the benefit of system in package.

We are now investing a lot into System In Package (SiP), both for RF modules and digital modules. It is key in that respect to have privileged links with key component suppliers, like we have with NXP and setting up with Xilinx. We are part of some ecosystems, and the latest press release on AQ600 and DD700 interfacing with the Xilinx KU060 FPGA is a good example of what we are doing to propose advanced SiP to our customers.

Teledyne e2v is setting up a global supply chain for Aerospace and Defence markets. Traditionally SiP approach is with high volumes market, but there is now a real need to have a dedicated supply chain for these low volumes, high end markets.

BIG PICTURE

4. Teledyne e2v’s partner ecosystem and strategies to be at par with this growing competitive market?

We have a long-standing partnership with NXP Networking division, this partnership will celebrate its 40 years in 2021. It started when our company was Thomson CSF and they were Motorola semiconductors. Both companies and business units have been through acquisitions and name changes, through changes of leadership and key persons, but the partnership has been pursued uninterrupted since then.

In 1981 it started by taking Motorola processor technology to Aerospace and Defence applications. We have pioneered the delivery of processors into autonomous flying systems that are autopilot flight computers. Today through this partnership we supply processor technology into most aircraft flight computers and engine control systems. Together with our ecosystems partners such as NXP and the flight certified RTOS vendors we have decades of successful history in enabling autonomous flight.

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We now expand the delivery of multicore processor technology to space, enabling embedded AI on nanosatellites, such as this non-governmental program QlevErSat (Source: https:// www.csug.fr/en/the-grenoble-university-space-centrebegins-development-of-a-smart-nanosatellite-for-earthobservation-662321.kjsp?RH=10511530961228894)

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Teledyne e2v now extends its partnership program to include Xilinx for the Space market, and develops cutting-edge solutions optimized to work with brand new innovations now emerging in space-grade programmable logic. These engineering advances relate specifically to the accompanying data storage, data processing and data conversion elements. (more details please visit https://www.teledyne-e2v.com/ products/xilinx-ecosystem-solutions/

Last but not least, Teledyne e2v invests its own R&D efforts into RF Softwarisation technology. If you want to know more about our latest microwave data converter developments, download the white paper to discover some of the key technologies shaping our near future electronic data converters.

This leads to unprecedented data converter technology operating at up to Ka-band frequencies without any forms of analog frequency conversion. System designers have full control of the frequency spectrum from the digital side, from the FPGA. The first component announcement of this new era of data conversion technology is EV12DD700. It will be followed by more device to be announced in the coming 12 months.

5. AI/ML, 5G is coming big, Teledyne e2v’s focus into it?

Embedded AI applications in everything that flies are naturally a key focus for Teledyne e2v through our partnerships with NXP Networking division. We will continue to leverage our multi-decade experience in Autonomous flight in the aircraft industry and strengthen our ecosystem with reference designs for flight electronics. For example, our latest module called Qormino® combine NXP quad-core QorIQ® processors (using PowerPC or ARM® architecture), with 4GB DDR4 memory on a substrate was designed to respond to SWaP (Size, Weight and Power) constraints while supporting high-reliability constraints and performance requirements of flight computers.

We also invest into creating platforms to run AI on nanosatellites, enabling earth observations satellites to pre-analyses events and situations faster on the satellite and reduce the volume of data to be downloaded from the satellite. (Reference: https:// www.eenewseurope.com/news/ai-boost-earth-observationsonboard-cubesats/page/0/1) In terms of 5G, mobile wireless technology continues its rapid generational development over the last twenty years from 3G to 4G, and now onto 5G networks, one technological problem has been consistent throughout; automatic/calibrated testing of required high frequency components. The most difficult testing challenge for RF ATE and Field Test Systems is simply calibration, repeatability, and correlation of measured performance results in order to verify that they meet required specification limits. Now, as the future of wireless technology transitions to 5G components, Teledyne e2v’s monolithic quadchannel, multi-port input ADCs utilizing unparalleled on-chip high frequency cross point switch input circuit technology, allows for auto-calibration and measurement techniques in either RF ATE and/or Field-Testing environments. Teledyne e2v’s EV12AQ605 and EV10AQ190 (12 and 10 bit quadchannel ADCs with cross point switch input circuit technology) enables RF ATE and Field-Tester developments to focus on auto-calibrated test measurements for both single channel and multi-port 5G devices.

Prashanth Pollishetty CEO, OrbitShifters USA

Shifting Orbits with Artificial Intelligence in Sports

In an exclusive interview with OrbitShifters Inc Founders Mr.Prashanth Pollishetty | CEO & Mr. Mahesh CV | Chief AI Officer. The ‘Technovator’ shares the company’s snow-balling story and how the AI-front company believes to change the digitization spree of major sectors using next-gen technologies like Artificial Intelligence, Deep Learning & Computer Vision.

A story worth unveiling below.

1. Artificial Intelligence market growth is driven by an increasing adoption of cloud-based applications and services, and rise in the connected device market. How do you see this market evolving in India?

The adoption of Artificial intelligence in India is already moving at a rapid pace and it has begun to mimic western countries and bridge the gap of the IT revolution.

Microsoft recently bagged 10B dollar cloud computing contract with US government after a tough battle with Amazon, Google and Oracle. Based on how the market is evolving, I believe we may see a similar situation or dynamics within India. As the government of India is already keen to focus on digitization and AI initiatives, private firms will flock to win big contracts which directly add to pool of funds to develop new technologies.

TECHNOVATORS

Chief AI Officer, OrbitShifters India

2. What are the different AI use cases OrbitShifters is working on?

Our major area of focus now is towards Sports & Games, to solve problems of following roles: Coaches, Broadcasting companies and Brand sponsors. To deliver real-time off-field analytics based on videos. That includes automatic event identification, player profiling, identification of injuries, brand frequency, automatic highlights.

We have been heavily working on Deep Learning, Computer Vision to automate the process. A small change in Sports & Games Industries unlocks millions of dollars for those traditional sectors.

3. What are the major expectations of the organizations from an Artificial Intelligence solution provider? How do you strategize to meet and exceed these expectations?

As an AI solution provider, the expectations are at large. Since the inception of IT, we are seeing the fastest paradigm shift in the history of technology. Many industry leaders are using AI as a core component in their corporate strategy as well as their business enablers.

We at OrbitShifters are setting right expectations on the outcome

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Mahesh Kumar CV

TECHNOVATORS

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and results. Results are incremental as many companies are trapped in Pilot mindset and only a small percentage was able to see the value. So for us it’s all about educating and creating awareness to our clients on the outcomes.

4. What are the major factors that differentiate Orbit Shifter from its competitors offering similar solutions?

TECHNOVATORS

We focus strongly on three major factors for our customers when we deliver solutions: • Create new recurring revenue streams • Enable new business models • Safeguard existing sales Customer experience • Personalized touch points • Ensure end to end service quality • Improve Net promoter score Efficiency • Augment human workforce to reallocate headcount • Realize cost and investment savings • Speed up process times

5. Sports Vision is an Artificial Intelligence powered platform for multiple sports analytics. How does Sports Vision help to rate player of soccer using rating model and produces match highlights automatically?

Our proprietary machine learning based algorithms rates the players based on the standard FIFA based data points.

It caters to the needs of expensive clubs to draft based on single match, league, season and year over year ratings.

Our exciting match highlights feature is another game changing idea that helps any sport to post highlights on social media within a matter of minutes by cutting a ton of time to manual generate the highlights.

6. How do you manage to deliver your customised AI product with the right functional attribute to the organizations in real-time and at right cost?

When we started we focused on the journey of a client/ customer and spent ample time to understand what would delight our customers.

We manage those expectations as mentioned earlier by thoroughly providing awareness, education and a quick prototype which comes with options to consider on timeline, scaling and money.

7. How did OrbitShifters go about SportsVision initially?

We immersed ourselves in the USA & Australia (Sports club/ franchise companies) and cast a wide net within Sports & Games industries to target several problems. We also did a lot of Ideation workshops to understand the customer pain & problems, 60-day ‘Ignite and Show’ pilots and we surrounded ourselves with lot Industrial folks and Sports SME who shared their knowledge with us.

8. What challenges/obstacles did you face in your journey so far?

During the initial days, we faced 4 challenges: 1) ACCESS: Access to Business users/Operational heads who would benefit from Applied AI Solution instead of meeting IT teams.

2) TANGIBILITY: The industrial world is used to tangibility; Digital AI solutions are typically very intangible in the electromechanical world.

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3) ‘$’ IMPACT: Creating value calculators which linked AI outputs to Business Outcomes and resulting in ‘$’.

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4) RESOURCES: Creating a new culture is always difficult to hold and retain resources on a long term basis.

You’ve already hired Y number of people approximately. What would be your pitch to folks out there to join your Organization?

Why does your organization matter in the world?

The digital renaissance in Sports Industry is just getting started.

You can either power it using AI or watch it from the sidelines.

Join us if you want to power the next-generation digital Sports & Games companies.

Suppressing Acoustic Noise in Switched-Mode Power Supplies

Axel Schütz|Mark Schoppel| Florian Haas,

Traco Power

However, it is a different situation with switched-mode power supplies (SMPSs). Noises such as humming or whining may even be interpreted as a warning signal. Although power supplies are made up of a large number of electronic components, when they are operating nothing should be moving. Therefore, there shouldn’t be any noise, should there?

The most common cause of disturbing noise from AC power supplies typically used to result in a low-frequency 100 or 120 Hz hum. And, as power supplies have moved on in terms of their complexity and structure, the range of sound waves emitted from them have changed too. However, most audible noises should not be a cause for concern.

Perception & Effect

Humans can hear sound waves in the 16 Hz to roughly 20 kHz frequency range (figure 1). But whether or not a sound causes distraction or irritation depends also upon the perception of that sound in the environment where it is being generated.

Figure 1: Audible frequency range of the human ear An industrial power supply unit that generates audible noise probably does not constitute an actual problem for people, since most people in its vicinity will experience it in the context of other background noises as a normal part of

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When sitting in a car, the engine noise we experience is something completely normal. After all, the engine compartment contains a machine with moving parts in it. Some of us would even define this noise as very pleasant. In fact, manufacturers of cars and other products actually have entire research departments dedicated to tinkering about with – an creating – pleasurable sound experiences.

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working in factories. Other noises, thanks to their frequency and volume, may also mask the frequencies generated by a power supply, an effect studied in psychoacoustics and used in the compression of audio in MP3s. Such supplies are also typically built info control panels with closed doors that also help to dampen any audible noise that may be generated.

In a different environment, such as an office, the reaction to power supply noise will be significantly different. A whining or buzzing from an electrical device will likely be perceived as being unpleasant and may even raise concerns about its safety.

Causes & Background

WHITE PAPER

The magnetic fields

If a current-carrying conductor is located in a magnetic field, it is generally subject to a force. The effect of this force is greatest when the current and magnetic field directions form a 90° angle. In such cases, the impacting force is vertical to the flow of current and direction of the magnetic field. Three fingers of the right hand can be used to determine the direction of this force using Fleming’s Figure 2: Right/left hand rule right-hand rule (figure 2) In the context of a transformers and some inductors, an iron core can also suffer from an effect known as magnetostriction, an effect first identified by James Joule in 1842. It causes ferromagnetic materials to change shape or dimension during the process of magnetisation that results from current flowing through the component’s conductor.

As well as leading to frictional heating, these tiny changes in material volume often generate audible noise too.

Figure 3: Piezo effect as demonstrated in materials such as quarz The reverse piezoelectric effect causes a length change in these materials when electrical voltage is applied. This actuator effect converts electrical energy into mechanical energy. Changes in voltage also alter the geometric mass of ceramic capacitors, resulting in them acting like tiny speakers that emit pressure waves into the vicinity.

Switching Topologies and Feedback Loops

The drive to ever more efficient power conversion means that switching topologies are being integrated into even the simplest power supply products. The primary switching frequency chosen in such designs will often be selected to lie above the limit of human perception (>20kHz). However, in switching solutions that rely on changing their switching frequency to adapt to changing load and input voltage, this may drop into the audible range in order to maintain optimal conversion efficiency.

In fixed frequency solutions, features such as cycle skipping or burst mode operation can result in a switching pattern that falls into the audible range, despite the switching frequency itself lying above 20kHz. If the solution displays regular switching pulses broken irregularly by periods of two or more skipped pulses, this may indicate issues with the feedback circuit (figure 4). Here it is worthwhile reviewing the feedback circuit components and the operating region of any optocouplers.

Transformers often utilize Fe-Si steel (known as silicon steel) with varying silicon content that helps to increase the electrical resistivity of the iron. 6% silicon steel provides the optimum level of reduction in magnetostriction but must be traded against increased brittleness.

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The Piezo Effect

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A further cause of noise results from the piezo effect. The word 'piezo' is derived from the Greek word for pressure. In 1880, Jacques and Pierre Curie discovered that pressure in various crystals, such as quartz, generated electrical charge. They called this phenomenon the 'piezo effect'. Later, they noticed that electrical fields can deform piezoelectric materials. This effect is known as the ‘reverse piezo effect'.

Figure 4: Issues in the feedback circuit can result in irregular pulseless periods (bottom graph) in fixed-frequency switching designs.

Determining and Resolving Audible Noise Issues

With SMPSs becoming increasingly more compact thanks to the push for ever higher power densities, it can be challenging

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Figure 5: The capacitor in the snubber circuit can be swapped out for a metal film type, or a larger resistance can be tried.

Suntsu Celebrates Longtime Partnership Suntsu Electronics has recently celebrated 10 years of partnership with PaC components Pte Ltd. Since 1995 PaC Components has specialized in electrical components distribution all throughout Asia. They have regional offices in China, India, Malaysia, Thailand, Vietnam, with their headquarters in Singapore.

PaC has truly become an established distributor and solutions provider. Since our partnership began in 2006, PaC and Suntsu have grown together and supported many customers.

Director of Sales, Robert Rangel said, “PaC Com is always there to help when we need local support and we love working with their team”.

PaC prides itself in always improving customer service and encouraging open communication and flexibility to ensure success. Their ultimate direction is to provide an effective, efficient and one stop solution for all valued customers and suppliers without losing focus. Gina Lum from PaC Components chimes in, “We look forward to many more good years with Suntsu.”

It should be borne in mind that, for all of the possible approaches highlighted, the repetition of verification and production testing will be highly likely.

Summary

Both the force impact of current-carrying conductors in magnetic fields and the reverse piezo effect of capacitors are primarily responsible for the audible noises emitted by power supply units. And, despite advances in simulation, audible noise typically only becomes apparent once a design has been physically built, and sometimes only once a quantity of power supplies has been prepared for pre-production.

Although most audible noise in power supplies should raise little cause for concern from a perspective of functionality or safety, it can be annoying and even be perceived as a quality issue by customers. By following some of the simple tips provided here, components acting as noise sources can be quickly identified and, using the suggested approaches, be replaced, affixed or changed to minimise or eradicate the errant sounds being generated.

WHITE PAPER

Ceramic capacitors that undergo high dv/dt swings often prove to be audibly noisy and tend to be found in clamp and snubber circuits, as well as in the output stages. To test whether they are the noise source, they can be replaced by capacitors with alternative dielectrics such as metal film, or their series resistor could be increased. Should the audible noise be reduced, a permanent change in component should be evaluated. Changing clamp circuits to use Zener diodes can also help. Problematic output stage capacitors could be swapped out for a different dielectric or replaced with equivalent value parallel ceramic capacitors if space allows

If magnetic components are the noise source, first ensure that the input voltage and output load are always within the specified range. Increasing capacitance on the input side can help if the input voltage is sometimes dropping too low.

Dip varnishing of transformers, and dip varnished and potted inductors, are one approach to reducing noise. Long core length transformers also tend to resonate more audibly than those of short core length. Where possible, consider changing to an alternative shorter core that can still accommodate the required number of windings.

TUV Rheinland, DiSa Signed Strategic Cooperation Agreement TUV Rheinland Hong Kong Limited (TUV Rheinland) and DiSa Digital Safety Pte. Ltd. ("DiSa") has recently signed a strategic cooperation agreement.

TUV Rheinland and DiSa agreed to cooperate in the field of UV-C Disinfection Automated Guided Vehicles (AGVs) in the global market. The Agreement specifies DiSa and TUV Rheinland joint synergetic development of markets, including the strengthening of cooperation in the fields of research and development testing of AGVs and to further expand into certification. This cooperation will leverage on their strengths and experience in order to promote competitiveness in the transportation and other related industry.

"Through our cooperation, we hope to establish an excellent partnership with TUV Rheinland and I am excited that TUV Rheinland has given us this strategic opportunity to work with their team. This will serve as an encouragement and motivation to DiSa commitment as we tap into diversified business in these challenging economic times", said Eddie Chng, MD and Group CEO of DiSa Limited.

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to even determine which component exactly is the audible noise source. Assuming that the design is operating correctly from an electrical standpoint, one approach is to use a nonconductive object, such as a chopstick, to apply light pressure to individual components on the circuit board while the device is operating. Changes or reductions in noise, especially amongst prime candidate components, such as ceramic or magnetic devices, may provide a good starting point.

If there is no safe non-conductive probing device to hand, a rudimentary ear trumpet can be created from a sheet of paper. Rolled up into a cone, the small end’s aperture can be directed toward suspect components to evaluate noise generating sources.

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How's India Wearing The Wearables?

Director- Marketing & Business Development, Glide Technology

Sanket Patel

Founder & CEO, GOQii

Vishal Gondal

WEARABLES JULY 2020

JULY 2020

The India wearables market has shown steadfast growth with another record year as the shipments of wearables devices saw an impressive 168.3% year-over-year (YoY) growth in 2019, closing the year with 14.9 million units, according to the recent data from the International Data Corporation’s (IDC) Worldwide Quarterly Wearable Device Tracker, 4Q19.

While emphasizing the growth of tech wearables in Indian market Vishal Gondal from GOQii says, GOQii is India's largest selling fitness tracker with highest market share in the wearable industry. GOQii retained its leadership position with 20.8% share in the Indian wearable market according to a recent IDC finding in January 2020. The growth trajectory in the Indian wearables market will continue to ascend strongly due to its high demand by users. Given the ongoing pandemic, health has taken CenterStage, hence the need for fitness’ wearables will only increase further.

Glide Technology’s Sanket Patel noticed huge adoption of wearables around the world. He says, Indian Consumers also have adopted on-body tech devices in the day-to-day life.

Startup ecosystem of India is also taking this opportunity to come up with different use cases and developing innovative products in the Wearable space. Indian Consumers are becoming conscious about fitness & healthcare parameters as well as safety. They are open to try out different wearables available in the market.

Different sectors and demands

Wearables have gained a lot of popularity and their demand is increasing day by day. Major companies are focusing to make new wearables products and engaging its customers with advance features.

The usage of wearables is seen in the workplace, corporates as well as other industries also. Healthcare and manufacturing have seen an exponential growth in wearable tech as a means of boosting productivity, reducing errors and communicating large amounts of data remotely, shared Gondal.

He also added, Law enforcement is the latest upcoming industry due to Covid-19. Policemen are at the frontline battling the virus, and hence are open to using fitness smart bands as a preventive measure. Recently, Bollywood superstar Akshay Kumar donated GOQii Vital 3.0 smart bands to the Mumbai and Nashik police.

Challenges & Scopes

For any businesses, hands free nature becomes quit useful. Tracking the emergency and rescue team becomes easy thus making the workplace more efficient and safe. Hands-free access to important data and information through smart glasses and smart watches helps researcher, engineers, and technicians to be more efficient at their work.

WEARABLES

Indian Market for Wearables Technology

While sharing his prospective towards demand of wearables, Patel said, wearable technology is poised for massive growth and seeing continuous innovation in the domain of fitness, health, security, safety – women, child, elderly, lifestyle and so on. In the time of Covid-19 Pandemic, start-ups are developing wearables for tracking coronavirus positive people, their activities and location history.

Due to rising awareness and soaring healthcare costs people are also coming to terms with the fact that prevention is better than cure. Users are now welcoming options that can assist them in leading a healthy lifestyle which in turn has opened new growth avenues for fitness and preventive healthcare players. There has been a paradigm shift from curative care to preventive healthcare. There is a lot of momentum in the Indian market, thus the industry will be able to sustain the level of growth over the coming years, elaborated Gondal.

The need of wearable electronics is gradually covering all over the market. But, the problem is how much it is going to sustain in the market.

Citing on the challenges in Indian market Gondal stated, the Indian market showcases huge potential in the wearables, one of the challenges is to manufacture in India. GOQii have recently launched the GOQii Vital 3, the world’s first smart wrist band that can detect body temperature, an early symptom of COVID-19 infection. And, now with the PM Narendra Modi’s clarion call to be Vocal to be Local, GOQii has plans to explore manufacturing it in India.

While agreeing on the same topic, Patel said, Indian wearable

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Growing demands of wearable technology has become a basic requirement for all of us. If you see, there are lots of people in our surrounding who wear some kind of fitness tracker, health watches, heart beat or blood pressure calculator, etc.

These kinds of technology have motion sensors that take the snapshot of your day to day activity and sync them with mobile devices or laptop computers. It can be comfortably worn on a body. Now, the time of smartphone has upgraded into a new version and it is the biggest innovation for today’s generation. So, BISInfotech in its latest edition focusing on wearable electronics and its demands. In this exclusive article, Vishal Gondal, Founder & CEO, GOQii and Sanket Patel, Director- Marketing & Business Development, Glide Technology talks with Nitisha Dubey about the importance of Wearable Technology and its scope for future.

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market is price-sensitive, where majority of consumers prefer wearable priced below INR 5000. Importing sensors as well as manufacturing the final product outside India makes the base price of Wearable costly.

According to him, price-point and lack of infrastructure for manufacturing are biggest challenges for producing and selling wearables in India.

Latest Trends

WEARABLES

The wearable devices are already seeing lots of innovations, they are not only just tracking and monitoring devices. In the current time, there is an urgent need for the start-up and technology communities around the world to innovate around solutions for the COVID-19 pandemic.

Gondal said the development of rapid wearable diagnostic tools to identify and isolate COVID-19 cases, as well as solutions for remote monitoring of suspected or asymptomatic cases, will be critical to humanity’s long-term success against the virus. Machine learning algorithms are allowing the transformation of simple sensor input into more actionable health or activity data. The algorithms are collecting data and analysing the information that results in health outcomes. Such a technological breakthrough will be a step ahead in preventive healthcare that is the need of the hour.

Patel shared, growth of Wearables in the healthcare field is tremendous, we are also observing traction for wearable with different sensors such as Accelerometer, Gyroscope, Proximity, Temperature, Pressure, SpO2, GSR, PM 2.5, and more. Location Trackers, Fitness Trackers, SoS Devices, Sports Wearable, and Smart Watches are currently trending in India as well as abroad. Technology is advancing in terms of communication, payments and location tracking through NFC, Wi-Fi, GPS & BLE 5. It is making easier to implement tracking, payments and access control in the wearable devices.

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Expertise: Glide Technology & GOQii

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Glide Technology provides product engineering services including hardware design, firmware & software development and testing services for Wearable & IoT Products. Patel shared that the company focus is always on designing latest technology products for our clients. They come up with new ideas and we help them to convert that idea into product. We help them in Feasibility of Product, Product Architecture, Hardware Design, Software Solution, Prototype Development, Testing and Maintenance of the product. We also work with our global ecosystem

partners for aesthetic design and manufacturing of wearable products. We have worked on diverse wearable projects such as SoS Watch, Hybrid Smart Watch, Location Tracking and Access Control Device, Smart Jewellery Product, Wearable Ring and many more.

GOQii is a smart-tech-enabled preventive healthcare platform that brings together the entire preventive healthcare ecosystem. The company is a pioneer in wearable based smart-tech-enabled fitness and healthcare. It's Smart Health Ecosystem integrates tools for real-time personalized coaching both remote as well as through GOQii Play- an in-app live video coaching platform, an explosive high-growth Health e-commerce store, scheduling health check-ups, a health locker and insurance discounts based on health management data. Given the state of 'Sickcare' delivery infrastructure in India, the company strongly believes that preventive healthcare is the only viable, long-term, mass-market solution. As one of the official partners of the ‘Fit India Movement’ GOQii is a strong supporter of Narendra Modi’s vision of making 1.3 crore Indians fit and healthy.

According to a study done by Statista, the number of connected wearable devices worldwide will rise to 1.1 billion in 2022, a significant increase from the 526 million reported in 2016.

So, the future of wearables is bright. As technology advances and wearable capabilities expand, the companies will go according to flow. The time will come soon when we see the drastic changes in wearables technology and its special features will amaze us.

Wearables will allow for better personal monitoring, whether for health purposes or just learning your routine. This means better scheduling and health knowledge, and unfortunately, if we’re not careful, it means better ads being delivered to us on digital platforms. Wearables are the final step to fully integrate digital infrastructure with a very analog life that we’ve kept for thousands of years.

JULY 2020

PART 2

What You Need To Know About 5G Contributed By -

element14 is a Community of over 700,000 makers, professional engineers, electronics enthusiasts, and everyone in between.

Since our beginnings in 2009, weâ&#x20AC;&#x2122;ve provided a place to discuss electronics, get help with your designs and projects, show off your skills by building a new prototype, and much more. We also offer online learning courses such as our Essentials series, video tutorials from element14 presents, and electronics competitions with our Design Challenges.

Radio technologies have evolved over the recent decades, from early analog cellular systems to 4G LTE. And now, with 5G or fifth-generation wireless technology, we will see higher speed, lower latency, and the ability to connect several devices simultaneously. This eBook will discuss the basic concepts of 5G, the 1G to 5G evolution, a comparison between different generations of cellular technology, and more. We hope you will find this guide to 5G useful.

CHAPTER 6 5G TECHNOLOGIES AND TECHNIQUES Multiple technologies and techniques have been developed for 5G standards inclusion. These new techniques and technologies enable 5G to offer a dynamic and flexible service. The 5G technologies being developed include: Millimeter-Wave communications: These use frequencies considerably higher in the frequency spectrum. It opens up several new spectrums and also wide channel bandwidth potentially 1 - 2 GHz. However, this poses new challenges to handset development, where maximum frequencies and bandwidths hover around 2 GHz and 10 - 20 MHz, respectively.

For 5G, frequencies above 50GHz represent hard challenges when it comes to circuit design, technology, and the way the system gets used, as such frequencies do not travel far and obstacles completely absorb them. Different countries also allocate different spectrums dedicated to 5G. Waveforms: New waveforms have elicited a lot of interest.

OFDM has been successful in 4G LTE and several high data rate systems. However, it suffers from limitations in a few circumstances. The other waveform formats discussed include Universal Filtered Multicarrier (UFMC), Filter Bank Multi- Carrier (FBMC),

and Generalized Frequency Division Multiplexing(GFDM). A perfect waveform does not exist. OFDMA brings superlative overall performance without leaning too heavily on processing power.

Multiple Accesses: Several new access schemes are under investigation for 5G technology. The list of techniques under consideration includes OFDMA, IDMA, SCMA, NOMA, MUSA, and PDMA. The most probable format, however, is OFDMA. Note: These acronymns are defined in the glossary. Massive MIMO with Beam Steering: Even though MIMO is used in a range of applications from LTE to Wi-Fi, the antennas are fairly limited. The use of microwave frequencies makes possible the use of multiple antennas on a single piece of equipment, due to the antenna sizes and spacing in wavelength terms. Such an arrangement would allow beams to be piloted to offer superior performance. Dense networks: Cell size reduction makes for better overall effective use of that available spectrum.

Techniques must be adopted to ensure that tiny cells present inside the macro-network and subsequently deployed as femtocells operate as planned. Considerable challenges are encountered during the addition of extra cells to a network, and methods are being created to avoid such a possibility.

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5G

element14 Community Team

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5G

JULY 2020

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PART 2

CHAPTER 7 ■ E-health, hazardous environments, rescue missions 5G APPLICATIONS/USE CASES ■ Vehicular communication The three broad use cases of IMT 2020 or 5G are: ■ Drones Enhanced Mobile Broadband (eMBB): The eMBB parallels 5G service is operational in many countries. Such earlythe modern mobile broadband evolution, enabling bigger generation 5G services are termed 5G non-standalone data volumes and improving the user experience. A prime (5G NSA). The technology used is a 5G radio which builds on example is the support of higher end-user data rates. Typical an existing 4G LTE network infrastructure. The 5G eMBB applications include: NSA will be quicker compared to 4G LTE. However, the highUHD video (4K, 8K), 3D video speed and low-latency 5G technology the industry ■ Tactile Internet, Cloud gaming, & Broadband kiosks has concentrated on is 5G standalone (5G SA). It should be ■ Remote classroom, Holographic calls commonly available before or by 2022.rate services and ■ Virtual Reality (VR) and Augmented Reality (AR) reducing control signaling. It is thus vital that 5G offers seamless ■ Real-time simulation and training compatibility with dense heterogeneous networks, to satisfy the insatiable demand of real-time traffic so that end-users WHAT YOU NEED TO KNOW ABOUT 5G can reliably connect to their network.

Massive Machine Type Communication (mMTC): mMTC corresponds to services characterized by a large device Fifth-generation wireless (5G), as the name implies, is fifthpopulation, like remote sensors, equipment monitoring units, generation wireless technology, engineered to increase the and actuators. The requirements for such services include low responsiveness and speed of wireless networks. 5G subscribers device cost and economical device energy consumption. This will enjoy faster downloads and greater network reliability. enables a lengthier device battery life, extending to several years. Each device takes in and generates only relatively Data transmission through 5G wireless broadband connections small quantities of data. It follows that support for high data happens at blinding speeds, over 20 Gbps by some estimates. rates has reduced importance in this instance.

The numbers surpass wireline network speeds, and also provide a latency of 1 ms or even lower for specific uses that need Typical mMTC applications include: realtime feedback (latency refers to the time consumed by ■ Smart Home devices to mutually respond over wireless networks). 5G makes ■ Smart City possible a drastic rise in data amounts transmitted over wireless systems, due to more accessible bandwidth and innovative Ultra-Reliable Low Latency Communication (URLLC): These antenna technology. These 5G networks are powered by services need extremely low latency and mmWave (millimeter-wave) technology. tremendous high reliability. Examples include traffic safety, factory automation, and automatic control.

5G connectivity enables businesses to be superefficient.

Consumers can quickly access a huge quantity of information.

Typical URLLC applications include: Connected autonomous cars, immersive education, and ■ Industrial Automation industrial IoT are only three products and services which ■ Self-driving vehicles could utilize 5G.