Bisinfotech Magazine March 2019

www.bisinfotech.com

MARCH 2019|` 80

BISinfotech DCP LICENSING NO. F.2(B-10) PRESS/2018 l VOL 1 l ISSUE 3 l TOTAL PAGES 64 l PUBLISHED ON 1ST OF EVERY MONTH

Gospel Of Industrial Tech

SEMICONDUCTOR | T&M | LED | A&D | SECURITY | CLOUD & DATA | TELECOM

PRESSURE SENSORS AND

STATE OF THE FIELD

SWITCHED

CAPACITOR

CONVERTER FOR

HIGH POWER

APPLICATIONS

GIRISH

KAMALA

DIRECTOR & COUNTRY HEAD AUTOMOTIVE SALES | INFINEON

HIGH-FLEETS FOR INDIAN A&D

www.bisinfotech.com

YOU BELIEVE IN TOMORROW? WE CONVERGED IT TODAY! JOIN THE SPECTACLE OF RELEVANCE Reach Us : advt@bisinfotech.com T : +91- 8802315661

LETTER FROM THE EDITOR EDITOR MANAS NANDI manas@bisinfotech.com CONSULTANT EDITOR NILOY BANERJEE niloy@bisinfotech.com The pressure sensor market is likely to witness high growth in the SUB EDITOR coming years, driven by advancements in MEMS technology and JYOTI GAZMER its rapid adoption in connected devices, growing demand from jyoti@bisinfotech.com automotive and medical device industries, increasing adoption of pressure sensors in consumer goods and wearable’s, and stringent government regulations. The pressure sensor market was valued MARKETING MANAGER at USD 7.88 Billion in 2016 and is expected to reach at USD 11.30 ARNAB SABHAPANDIT Billion in 2023 with a growing CAGR of 5.27%. Factors such as the arnab@bisinfotech.com increased demand for smart and wireless pressure sensors and regulatory initiatives in the developed markets have propelled the adoption of pressure sensors. Pressure sensors are widely DESIGN HEAD used for control and monitoring applications. The demand SANDEEP KUMAR for high-performance, cost-efficient, and reliable sensors has increased, leading to a higher spending in R&D activities WEB DEVELOPMENT MANAGER by market vendors. Technological proliferation and JITENDER KUMAR advancements in nanotechnology and micro-technology are expected to propel the market growth.

In this issue we have spoken to 2 of the biggest WEB PRODUCTION organizations Infineon and STMicroelectronics to BALVINDER SINGH understand this very dynamic segment.

Also it seems like everyone these days is spouting SUBSCRIPTIONS about the internet of things and how connected S. RADHIKA devices and wearable’s have and will continue radhika@bisinfotech.com to shake our lives. From wrist watches to smart appliances, we can already see this trend come to a maturity. However, it is in the industrial internet Bisinfotech is printed, published, edited and owned by Manas Nandi of things where the real societal impacts will and published from 303, 2nd floor, Neelkanth Palace, Plot No- 190, manifest in the years ahead. As a confluence Sant Nagar,East of Kailash, New Delhi- 110065 (INDIA), Printed at Swasof factors make IIoT more available, We have tika Creation 19 DSIDC Shed, Scheme No. 3, Okhla Industrial Area, Phaseamalgamated a comprehensive story on IIoT – Strategies to Amend in 2019.

II, New Delhi- 110020 Apart from this there are various illuminating articles for you in this special march issue.

Editor, Publisher, Printer and Owner make every effort to ensure high quality and acHope to keep you pinned for the entire curacy of the content published. However he cannot accept any responsibility for any efmonth.

Happy Reading!

ManasNandi manas@bisinfotech.com

fects from errors or omissions. The views expressed in this publication are not necessarily those of the Editor and publisher. The information in the content and advertisement published in the magazine are just for reference of the readers. However, readers are cautioned to make inquiries and take their decision on purchase or investment after consulting experts on the subject. Saur Energy International holds no responsibility for any decision taken by readers on the basis of the information provided herein. Any unauthorised reproduction of Bisinfotech magazine content is strictly forbidden.

Subject to Delhi Jurisdiction.

CONTENT PAGE

40

06

HIGH EFFICIENCY, HIGH DENSITY, SWITCHED CAPACITOR CONVERTER FOR HIGH POWER APPLICATIONS

RSA-RELATED CYBERSECURITY INVESTING TRENDS

12 IIOT – STRATEGIES

10 BIG PICTURE

32 A&D FEATURE

26 BIG PICTURE

50 SECURITY NATIVE

46 EVOLVE TECH

IIOT – STRATEGIES TO AMEND IN 2019

HIGH-FLEETS FOR INDIAN AEROSPACE & DEFENSE MARKET

CYBERSECURITY RISE UP BOARD AGENDA ACROSS INDIA

53 SERVER TRENDS

TOP 6 SERVER TRENDS TO RULE IN 2019

14 COVER STORY PRESSURE SENSORS AND STATE-OF-THEFIELD

GIRISH KAMALA DIRECTOR & COUNTRY HEAD FOR AUTOMOTIVE SALES | INFINEON

GAUTAM DUTTA SENIOR DIRECTOR MARKETING SIEMENS PLM SOFTWARE INDIA

ULTRATHIN SEMICONDUCTOR HELP DEVELOPS ELECTRON LIQUID AT ROOM TEMPERATURE

54 ICT UPDATES

MICROSOFT UNPLUGS THE POTENTIAL OF AI IN INDIA

DESIGN END

HIGH EFFICIENCY, HIGH DENSITY, SWITCHED CAPACITOR CONVERTER FOR HIGH POWER APPLICATIONS Jian Li, Jeff Zhang, Ya Liu, and Marvin Macairan

06

BISINFOTECH // MARCH 2019

Analog Devices, Inc.

END DESIGN

capacitor stores and transfers the energy from input to output. Despite the advantages of charge pump designs, switched capacitor converters are traditionally limited to low power applications, due to the challenges presented in startup, protection, gate drive, and regulation.

The LTC7820 is a fixed ratio, high voltage, high power switched capacitor controller that yields small and cost-effective solutions for high power, non- isolated intermediate bus applications with fault protection. The LTC7820’s features include: 4 Low profile, high power density, capable of 500 W+ 4V IN max for voltage divider (2:1): 72 V 4VIN max for voltage doubler (1:2)/inverter (1:1): 36 V 4Wide bias VCC range: 6 V to 72 V 4Soft switching: 99% peak efficiency and low EMI 4 Soft startup into steady state operation 4 Input current sensing and overcurrent protection 4 Integrated gate drivers 4 Output short-circuit/OV/UV protection with programmable timer and retry 4Thermally enhanced 28-lead 4 mm × 5 mm QFN package

Figure 1. A 48 V to 24 V/20 A voltage divider with a power density of 4000 W/in3.

The power density of a dc-to-dc converter is generally limited by bulky magnetic components, especially in applications where the input and output voltages are relatively high. Inductor/transformer size can be reduced by increasing the switching frequency, but this reduces converter efficiency because of switching-related losses.

It is better to eliminate the magnetics altogether with an inductorless switched capacitor converter (charge pump) topology. Charge pumps can increase power density as much as 10× over a conventional converter without sacrificing efficiency. Instead of an inductor, a flying

Figure 2. Estimated solution size features 5 mm maximum height.

48 V to 24 V/20 A Voltage Divider with Power Density of 4000 W/In3

Figure 1 shows a 480 W output voltage divider circuit featuring the LTC7820. The input voltage is 48 V and the output is 24 V at up to 20 A load. Sixteen 10 µF ceramic capacitors (1210 size) act as a flying capacitor to deliver the power. The approximate solution size is 23 mm × 16.5

07

BISINFOTECH // MARCH 2019

DESIGN END

mm × 5 mm as shown in Figure 2 and the power density is as high as 4000 W/in3.

High Efficiency

Since there is no inductor used in the circuit, all four MOSFETs are soft switched, greatly reducing switching-related losses.

The converter can achieve high efficiency as shown in Figure 3, where the peak efficiency is 99.3% and the full load efficiency is 98.4%.

The thermograph in Figure 4 shows a balanced thermal design with a hot spot temperature about 82.3°C in an ambient environment of 23°C and no forced airflow.

Prebalance Prevents Inrush Currents

In addition to impressive efficiency and thermal performance, the LTC7820 includes a proprietary prebalance method to minimize inrush current in voltage divider applications. The LTC7820 controller detects the VLOW_SENSE pin voltage before switching and compares it with the VHIGH_SENSE/2 internally. If the voltage at the VLOW_SENSE pin is much lower than VHIGH_SENSE/2, a current source injects 93 mA of current at the VLOW pin to pull VLOW up.

If the voltage at VLOW_SENSE is much higher than VHIGH_SENSE/2, another current source sinks 50 mA from VLOW to pull it down. If the voltage at VLOW_SENSE is near VHIGH_SENSE/2, that is, within the preprogrammed window, both current sources are disabled and the LTC7820 starts switching.

Figure 5 shows the enormous input inrush current that occurs at start-up without precharging—more than enough to damage the MOSFETs and capacitors. In contrast, no excessive inrush current is observed after the prebalance method is applied, as shown in Figure 6.

Figure 4. Thermal test at 48 V input, 24 V output at 20 A, and 200 kHz switching frequency.

Figure 5. Start-up waveform without prebalance shows large inrush current.

Figure 3. Efficiency at 48 V input, 24 V output, and a 200 kHz switching frequency.

08

BISINFOTECH // MARCH 2019

Figure 6. Startup waveform with LTC7820 prebalance shows elimination of inrush current.

END DESIGN

Tight Load Regulation

Even though the LTC7820-based voltage divider is an open-loop controlled converter, load regulation is tight due to its high efficiency. As shown in Figure 7, the output voltage drops only 1.7% at full load.

Figure 7. Load regulation.

Protection Features

The LTC7820 includes protection features to ensure high converter reli- ability. Overcurrent protection is enabled through a sensing resistor on the high voltage side. A precision rail-to-rail comparator monitors the differential voltage between the ISENSE+ pin and the ISENSE– pin, which are Kelvin connected to a sensing resistor. When the voltage at ISENSE+ is 50 mV higher than the ISENSE–, an overcurrent fault is triggered, the FAULT pin is pulled down to ground, and the LTC7820 stops switching and starts retry mode based on the timer pin setup.

Further protection is available through the OV/UV window comparator. In normal operation, the voltage at VLOW_SENSE should approach half of VHIGH_SENSE. A window comparator monitors VLOW_SENSE and compares it to VHIGH_SENSE/2.

The hysteresis window voltage can be programmed and is equal to the voltage at the HYS_PRGM pin. With a 100 kΩ resistor on the HYS_PRGM pin, the VHIGH_SENSE/2 voltage must be within a (VLOW_SENSE ±1 V) window dur- ing startup and normal operation. Otherwise a fault is triggered and the LTC7820 stops switching.

About the Authors

Jian Li received his M.S. degree in control theory and control engineering from Tsinghua University, China, in 2004, and a Ph.D. degree in power electronics from Virginia Tech, United States, in 2009. At present, he is an applications engineering manager for power products at Analog Devices. He holds nine U.S. patents and has published over 20 transaction and conference papers.

He can be reached at jian.li@analog.com.

Xu (Jeff) Zhang was born in Beijing, China. He received his B.S. and M.S. degrees in electrical engineering from Tsinghua University and his Ph.D from University of Colorado at Boulder. He joined Linear Technology (now Analog Devices) in 2010 and is currently a power IC design engineer in the Power by Linear™ Group. He can be reached at xu.zhang@analog.com.

Ya Liu is a senior application engineer with Analog Devices in the power products applications group in Milpitas, California. Currently, he is the primary applications support for switch-capacitor con- verters and hybrid converters. He also supports PSM controllers and analog buck controllers.

Ya Liu received his B.S. degree from Zhejiang University, Hangzhou, China, and an M.S. degree from Virginia Polytechnic Institute and State University (Virginia Tech), Blacksburg, both in electrical engineering. He is the holder of two Chinese patents and three U.S. patents. He can be reached at ya.liu@analog.com.

Marvin Macairan is currently an associate applications engineer for Analog Devices’ Power by Linear™ application group. He is responsi- ble for supporting application engineers and optimizing demo boards that highlight ADI power products. He attained an M.S. in electrical engineering from California Polytechnic State Univeristy, San Luis Obispo. He can be reached at marvin.macairan@ analog.com. n

Conclusion

The LTC7820 is a fixed ratio high voltage, high power switched capaci- tor controller that meets the power density demands of bus converters, high power distributed power systems, communications systems, and industrial applications. No inductors are needed.

09

BISINFOTECH // MARCH 2019

BIG PICTURE

GIRISH KAMALA Director & Country Head for Automotive Sales | Infineon IN INDIA, THE MAJOR MARKETS ARE TWO WHEELERS AND PASSENGER VEHICLES

The rapid expansion of the automotive industry is inducing high demand for pressure sensors, which in turn is driving the expansion of the global pressure sensors market. Getting alongside with the giants in this business, Niloy Banerjee, Consultant Editor held the steering with Girish Kamala, Director & Country Head for Automotive Sales, Infineon to yield the potential of Pressure Sensor technology & market and Infineon’s leading solutions influencing this technology and applications. Edited Nub.

Q

What are the current technologies evolving in the Pressure Sensor Market?

Capacitive MEMS Technology – MEMS Capacitive Pressure Sensor has recently gained more advantage over micromachined piezo resistive pressure sensor due to higher sensitivity, low power consumption, lower dependence from temperature effects and IC compatibility. The spectrum of capacitive pressure sensor application is increasing, hence it is essential to review the path of technological development and further prospective of micro-machined capacitive pressure sensor.

Q

What are the major types of Pressure Sensors in the market and their applications and your key focus?

10

Pressure sensors are classified in terms of pressure range they measure, operating temperature, and most importantly, the type of pressure they measure. Pressure sensors are named according to their purpose or application.

The same technology may be used under different names.

Absolute pressure sensor - This sensor measures the pressure relative to perfect vacuum.

Gauge pressure sensor - This sensor measures the pressure relative to atmospheric pressure.

Vacuum pressure sensor - It is a sensor that measures absolute pressure relative to a vacuum.

Differential pressure sensor - This sensor measures the difference between two pressures, one connected to each side of the sensor.

BISINFOTECH // MARCH 2019

Differential pressure sensors are used to measure many properties, such as pressure drops across oil filters or air filters, fluid levels or flow rates.

Sealed pressure sensor - This sensor is similar to a gauge pressure sensor except that it measures pressure relative to some fixed pressure rather than the ambient atmospheric pressure.

Various pressure sensors i.e. MAP, BAP, TPMS and SAB are used in various automotive applications in engines, exhaust systems, tire pressure monitoring and pedestrian safety to name a few.

MAP sensor- For lower emission, better combustion and increased efficiency The manifold air pressure (MAP) is an important parameter to compute the air- fuel ratio provided to the engine for lower emission due to better combustion and increased efficiency. For cost sensitive engine systems, a MAP sensor shows the potential to complement or even substitute mass air flow (MAF) sensors. In addition manifold pressure data can be used to compute diagnostics of leakages and malfunctions of the exhaust gas recirculation valve.

BAP sensor- Precise and fully integrated sensor The barometric air pressure (BAP) is an important parameter to compute the air-fuel ratio provided to the engine and for controlling spark advance to optimize engine efficiency.

TPMS - Helps to boost car safety levels by warning drivers of any loss in tire pressure The tire pressure monitoring systems (TPMS) not only provides safety features but also supports energy efficiency, as a vehicle with tires that are not

PICTURE BIG

properly inflated consume more fuel and results in higher tire wear. Pressure-related downtime is a significant cost factor for operators of commercial vehicles. We offer TPMS sensors covering all tire pressure ranges, making us a leading provider of these safety-critical components for automotive system suppliers.

SAB - Our safety pressure sensors make cars safer Every year thousands of pedestrians are severely injured in traffic due to slow or failing sensing elements. Infineon´s safety pressure sensor family support new safety systems that increase the protection of pedestrians and car occupants in the event of a collision. Infineon safety pressure sensors deliver a reliable signal with benchmark reaction time in the industry.

Even though only 2 sensors are needed, the exact impact position over the complete front side can be calculated granting reduced system cost.

Q

Report says, high cost and complexities related to the installation and maintenance of these sensors are restraining the growth of the global Pressure Sensors market during the assessment period. What is your take on it?

the growth in demand of MAP pressure sensor in the future.

TPMS will increase the life of tire from wear and tear and also improve fuel efficiency due to proper air pressure in tire.

Q

Lastly, your flagship product-line in this sector?

TPMS – SP37 / SP40 – This IC helps to boost car safety levels by warning drivers of any loss in tire pressure. Furthermore, these important safety features also support energy efficiency, as a car with tires that are not properly inflated consumes more fuel and the tires wear down more quickly. Pressurerelated downtime is a significant cost factor for operators of commercial vehicles.

We offer TPMS sensors covering all tire pressure ranges, making us a leading provider of these safety-critical components for automotive system suppliers.

MAP – The KP215F1701 is a miniaturized Analog Manifold Air Pressure Sensor IC based on a capacitive principle. It is surface micro-machined with a monolithic integrated signal conditioning circuit implemented in BiCMOS technology. The Considering specifically India, how is Pressure Sensors sensor converts a pressure into an analog output signal. The market shaping in India? calibrated transfer function converts a pressure of 10 kPa to 115 kPa into a voltage range of 0.4 V to 4.65 V. The chip is In India, the major markets are two wheelers and passenger packaged in a “green” SMD housing. The sensor has been vehicles. Due to BS6 emission regulation from April 2020, primarily developed for measuring manifold air pressure, but demand for Electronic fuel injection will grow, leading to can also be used in other application fields. The high accuracy and the high sensitivity of the device makes it a perfect fit for advanced automotive applications as well as in industrial and consumer applications.

BAP - The KP236N6165 is a miniaturized Analog Barometric Air Pressure Sensor IC based on a capacitive principle. It is surface micro-machined with a monolithic integrated signal conditioning circuit implemented in BiCMOS technology.

The sensor converts a pressure into an analog output signal.

The calibrated transfer function converts a pressure range of 60 kPa to 165 kPa into a voltage range of 0.2 V to 4.8 V. The chip is packaged in a “green” SMD housing. The sensor has been primarily developed for measuring barometric air pressure, but can also be used in other application fields. The high accuracy and high sensitivity of the device makes it a perfect fit for advanced automotive applications as well as in industrial and consumer applications.

We see a trend for down-sizing engines as this helps to increase fuel-efficiency and to decrease emissions. Pressure sensors help achieve this downsizing without compromising on comfort/performance. That is why the total pressure sensor market for combustion engine vehicles shows a higher growth than the total combustion engine vehicle market itself (more pressure sensors per car). These pressure sensors are usually fully automotive qualified and run with very low DPM rates according to automotive requirements i.e. installation and maintenance are not seen as different to other sensor classes (e.g. magnetic sensor, inertia sensor).

Q

11

BISINFOTECH // MARCH 2019

IIoT – Strategies to Amend in 2019

12

Just after IoT taking the mainstream and the tech industry advocating on IoE, the metaphor of IIoT has seen extravagant growth. By 2025, the global industrial IoT market is expected to reach 933.62 billion dollars. The scope of cloud applications and scalability are two of the factors that will drive the additional growth across all industries within it. In an era of stiff marketing strategies which accumulates risks, thought leaders cites investment as inevitable and unavoidable. In 2018, IIoT lauded an extravagant market-lead with the spur of automation while the known digitilastion doing its bit. We have been writing

BISINFOTECH // MARCH 2019

and perennially focusing on the convergence of software and hardware future, considerably, investment in newer technologies or rather opting a new infrastructure churning new ROI has been imperative.

IIoT – The New Gamut of Opportunities

According to IDC, global enterprises will spend $1.7 trillion on digital transformation in 2019. As manufacturers continue digital transformation journeys they are now looking to enter the transformation 2.0 phase, in which they will use new

STRATEGIES IIOT

by IIoT and execute an organisation’s AI strategy.

End-to-End Communications Security Becomes A Norm

Reducing security vulnerabilities will remain a primary focus. With the rising number of IoT devices, hackers and cybercriminals are continuously finding new ways to compromise IoT devices and networks.

In the 2019 fight against cybercrime, multi-layered, end-to-end security throughout the IoT data chain – from end nodes to the gateway to the Internet and finally end users’ application platforms – will be imperative. Advanced Encryption Standard (AES) can be paired with Transport Layer Security (TLS) protocol to enable such a versatile end-to-end security. AES is an open encryption standard widely employed for data link layer encryption in low-power IoT networks, while TLS is an applicationlayer cryptographic protocol for secure web communications.

Adoption of these industry-standard, well-proven solutions is crucial to protect the integrity and confidentiality of IoT data against imminent cyber-threats.

Digital Twin Advances Operational Excellence

Digital Twins are said to revolutionize Industrial IoT and be one of the biggest game-changer in 2019. A Digital Twin is a near real-time virtual representation of a physical object or process built to optimize business performance. By creating a complete digital footprint of critical assets, the digital twin enables industries to detect physical issues more quickly, predict outcomes more accurately, and design and build better products, systems, and processes.

For example, manufacturers can use digital twins to create a virtual representation of a field asset. Then as data is captured from smart sensors embedded in the asset it provides visibility into real-world performance and operating conditions.

Manufacturers can also simulate that real-world environment for predictive maintenance.

McKinsey predicts linking the physical and digital worlds could generate 11.1 trillion a year in economic value by 2025, while Gartner predicts that roughly half of all large industrial companies will be using digital twins by 2021. As more industries focus on reducing operating costs and extending the life of equipment, we will certainly see a spike in Digital Twin applications and uses cases in 2019. technologies to create even more opportunities and address new challenges on the factory floor. Digital transformation 2.0 takes the benefits of infrastructural changes even further to create new efficiencies. Technologies including IIoT (Industrial Internet of Things), artificial intelligence (AI) and blockchain will serve as the pillars to support this second wave of transformation.

Is Workforce Ready for IIoT?

As manufacturers implement IIoT, they may realise that the skill set of their labour force also needs to evolve with IIoT. Today’s manufacturing technician must possess new digital skills that allow them to easily decipher real-time analytics. When it comes to AI, for manufacturers to truly tap the vast potential of this technology, they need to employ data scientists in 2019.

Data scientists can collate the vast amounts of data provided

Integrating IIoT

Another tricky challenge faced by the IIoT implementation is the integration of the information technology (IT) and operational technology (OT). And, it is important to securely integrate the two without data loss or the introduction of vulnerability.

This makes adopting IIoT technology financially impossible and logistically impractical for many operational businesses.

Mostly, IoT devices are commonly developed as independent solutions, and in best-case scenarios, they are injected into the manufacturing process to become a part of the system.

However, integration between the information technology (IT) and operational technology (OT) lacks effective connectivity and synchronization. Therefore, it needs to replace either the entirety of their equipment or rely on faulty connectivity. n

13

BISINFOTECH // MARCH 2019

PRESSURE SENSORS AND STATE-OF-THE-FIELD

14

Pressure is one of important quantities in the environment like temperature, humidity etc even the human can’t sense it directly in our normal life domain. However, the pressure sensor has good and enough sensitivity to measure the few Pascal of pressure changing (i.e 1Pa = 8cm altitude change) even if you can’t feel the difference of pressure when you move up or down and sensing of pressure sensor can be used to provide significant information for our life in various applications and the usage of pressure sensing is becoming more diverse in different application domains from Automotive to Consumer markets.

According to latest market analysis report, global pressure sensor market is being growth CAGR of 7.3% over the forecast period 2018 to 2023 and it’s expected to 6.7B USD in Y2023

BISINFOTECH // MARCH 2019

from 4.4B USD in Y2019 and its market is being driven by mainly automotive segment with high pressure range sensor but consumer market segment shows the fastest growth market for pressure sensor from Y2013 when pressure sensor started to be used in mobile phone and portable application and there are more new applications are coming with pressure sensor to user and the market will be more growth and diverse application is coming to us with pressure sensor.

Figure 1 in below shows ST pressure sensor evolution since 1st barometric pressure sensor was announced on 2011. The ST has announced the new pressure sensor almost every year adopting new features or enhancement what customers request and ST has enhanced the performance and improved robustness to diverse environmental condition with unique

STORY COVER

ST Microelectronics has plan to prepare more wide portfolio of pressure sensors and broaden market segment to Industrial and automotive application with high volume manufacturing capability, reliable quality and high performance what ST built up in consumer market.

Sensing technology on Pressure Sensor

Mainly resistive & capacitive different sensing technology are being used on pressure sensors and each technology has own pros and cons because of different own characteristic of resistive and capacitance. ST has full capability of both technologies (i.e ST is market leader of inertial MEMS Sensor which is capacitive technology) and ST had applied the resistive technology for pressure sensor considering good linearity & sensitivity of piezo resistive technology and capability of compensation of weak TCO (temperature coefficient offset)

by ST dedicated temperature compensation method and high-tech technology embedded in the sensors and the Package technology would be also one of key important factor to decide the performance as it will be explained in next paragraph.

Figure 2. Sensing (resistive & capacitive) & Package (Full-molded & Cavity) Technology comparison of pressure sensor.

HYUNG JOON BAE

MEMS Sensor Division Product marketing Division site : ST Agrate (Italy), STMicroelectronics ST own technology of sensor and package solution and it contributes ST to take leadership in the consumer & mobile phone markets.

Sensing element of pressure sensor was designed with piezoresistors of Wheatstone bridge on membrane as like Figure 3 and it’s mechanically designed to change the resistance according to pressure applied to membrane. This technology can give good linearity and sensitivity to measure the pressure values at wide range of pressure but resistor itself has variation by temperature so it causes bad TCO and it needs to be compensated by temperature sensor. All of ST pressure sensors embeds the temperature sensor near to sensing element to compensate TCO variation caused by temperature using dedicated algorithm embedded in sensor and it’s one of differentiated feature then competitors who normally need compensation algorithm working outside of sensor like Application process or MCU etc.

Figure 1. ST Pressure sensor evolution.

Figure 3. Piezo-resistor on Wheatstone bridge of ST pressure sensor

15

BISINFOTECH // MARCH 2019

COVER STORY

Robustness to environment in manufacturing and market.

Package robustness is one of important factor to be considered in the application because air flow need to be secured for pressure measurement in the sensor device but it can cause inferior robustness to diverse environmental condition.

Most of pressure sensors are designed with cavity package solution which has empty space inside of IC to secure the air flow for pressure measurement. However, this package structure could be weakness to environment of final application manufacturing or real-user condition because the sensor can be contaminated or damaged through holes on package during manufacturing and it can be reliability failures under harsh user condition. ST was aware of this package weakness through ST predecessors produced on Y2013 and ST has developed innovative package solution to minimize the air flowing on full-molding package to be superior robustness to end customer manufacturing process and harsh user condition.

With tiny form factor on full-molding package, the LPS22HH also enhances robustness of reliability to control the features of air flow monitoring application which can be exposed to harsh condition like vacuum cleaner, air conditioner and FAN controllers.

For further information, https://www.st.com/content/st_com/ en/products/mems-and-sensors/pressure-sensors/lps22hh.html The LPS33HW as water-resistant pressure sensor is designed to be durable up to 10Bar Water pressure with unique cylindrical metal package and the electric components inside of IC can be also protected by potting GEL to water or other harsh chemicals.

With superior robustness package & pressure noise equivalent to 6.5cm, the LPS33HW can enhance the feature of vertical position on wearable watch application which can be used for swimming or diving and water depth monitoring inside of water tank, washing machine and agriculture IoT application.

Superior robustness PKG of LPS33HW can contribute to extend the coverage of design on diverse application such as e-cigarette application which can use pressure sensor to detect and monitor puff of smoking without risky of sensor damage and defect by e-juice (nicotine)

Figure 4. Package structure of ST pressure sensor vs general cavity PKG

It’s one of state of art package for pressure sensor in ST to be differentiated with other pressure sensor competitors and this solution was proven in the market with several hundred Mpcs shipment from Y2014 for diverse applications.

Wide portfolio pressure sensors in ST

Pressure sensor market is one of growing market with more diverse applications which request different performance specification and robustness to harsh condition. ST has mainly two different group of pressure sensors, barometric pressure sensor and Water-resistant pressure sensor which can cover different market and different specific performance application.

The LPS22HH as barometric pressure sensor is so accurate and stable that manufactures can eliminate one-point calibration (OPC) after soldering to increase throughput and efficiency.

With a pressure noise equivalent to 5cm, the LPS22HH enhances controls such as collision avoidance & altimeter control for Drone or other unmanned vehicles. Its superior accuracy also enhances features of smartphones and sport watches and indoor navigation for vertical position etc.

Figure 6. LPS33HW 10Bar Water resistant pressure sensor, 3.3x3.3x2.9mm

For further information, https://www.st.com/content/st_com/ en/products/mems-and-sensors/pressure-sensors/lps33hw.html Some applications where pressure sensor could be useful are GPS application such as tracking and Telematics Wearable for rock climbing to detect height Appliances such as Fan, Air conditioners, Air purifier to monitor Air flow Vaccum Cleaner to detect if the dust bag is full Indoor navigation to detect the floor Enhanced Pedometer to monitor the altitude during a workout Weather monitoring station E-Cigarette to detect the puff.

Washing machine to detect and control the water depth

.. . .. . .. .

n

16

Figure 5. ST LPS22HH high precise pressure sensor, 2x2x0.73mm

BISINFOTECH // MARCH 2019

TEST & MEASUREMENT

TEST & MEASUREMENT EQUIPMENT MARKET - A $32.3BN OPPORTUNITY 5g, Automotive and the growing need of aerospace & defense technologies are said to be the key drivers, as earlier written by us, Test and Measurement (T&M) is one sector which has a huge potential to grow. The studies revealed the overall test and measurement equipment market is expected to grow from USD 25.7 billion in 2018 to USD 32.3 billion by 2024, at a CAGR of 3.90% during the forecast period, therefore, making it more viable that the industry is headed to become a big business.

The market is growing due to the increasing demand for this equipment in end-use sectors, such as automotive & transportation, aerospace & defense, IT & telecommunications, education & government, semiconductor & electronics, industrial, and healthcare.

The test and measurement equipment market is expected to grow at the highest CAGR in the

offerings.

Additionally, Ethernet (IEEE 802.3) is a widely used protocol in automotive manufacturing. In the automotive industry, many processes are controlled through computers, and Ethernet is one of the most suitable protocols for computer-enabled communication.

General purpose test equipment segment to grow at the highest CAGR in the test and measurement equipment market during forecast period

The general purpose test equipment segment includes oscilloscopes, signal generators, digital multimeters, logic analyzers, spectrum analyzers, Bit Error Rate Tester (BERT), network analyzers, power meters, electronic counters, modular instrumentation, Automated Test Equipment (ATE), and power supplies.

The characteristics of the aforementioned types of equipment include large size, bulky displays, slightly complicated control systems, and customer user interfaces. This scenario is expected to change to an extent, owing to the demand for small-sized tools and integration of various test and measurement equipment into one offering.

Most of the test and measurement equipment now offers high bandwidth, greater accuracy, and higher resolution than that in the earlier equipment. Some of the prominent applications for equipment under this category are IT & telecommunications, healthcare, automotive, and industrial sectors.

healthcare sector during the forecast period. There is a significant potential for growth of the test and measurement equipment market in this sector due to the development of new healthcare equipment, patient-monitoring systems, and personal emergency reporting systems.

Automotive and transportation segment projected to lead the test and measurement equipment market during forecast period Among the end-use applications considered, automotive and transportation is estimated to be the largest contributor to the overall test and measurement equipment market in 2018.

The increasing number of automotive manufacturing hubs in the world implementing advanced automation technologies for production is expected to boost the demand for test and measurement equipment

India - The Next Space for Test and Measurement Equipment Market The test and measurement equipment market, by geography, has been broadly classified into North America, Europe, APAC, and RoW. In terms of value, North America is estimated to account for the largest share of the market in 2018 owing to the fact that a majority of the leading industry players have a presence in this region.

The market in APAC is expected to grow at the highest CAGR between 2018 and 2024. The governments of Asian countries, such as Japan, China, and India are undertaking initiatives to encourage industries to establish manufacturing and R&D facilities in their countries.

For instance, the Indian government started the Make in India program to increase foreign investments and businesses in India. Initiatives like these are expected to boost the test and measurement equipment market.

17

BISINFOTECH // MARCH 2019

TEST & MEASUREMENT

ANRITSU’S MT8000A VALIDATES MEDIATEK’S 5G MODEM Anritsu announced MediaTek‘s Helio M70 5G modem has achieved the maximum downlink and uplink throughput using Anritsu’s Radio Communication Test Station MT8000A, providing a flexible test platform for ultrafast, large-capacity 5G communications using wideband signal processing and beamforming.

With its cutting-edge NSA and SA modes, the all-in-one MT8000A supports sub-6 GHz and mmWave RF tests as well as protocol tests for development of advanced 5G technologies, such as 4x4 MIMO, to increase data speeds in the sub-6 GHz band.

MediaTek’s Helio M70 is the leading 5G modem with both LTE and 5G dual connectivity (EN-DC), supporting every cellular generation from 2G to 5G. Designed for 3GPP Release 15 compliance and supporting initial non-standalone (NSA) and future standalone (SA) 5G network architectures, the Helio M70 can connect to 5G NR and 4G LTE bands worldwide while supporting High Power User Equipment (HPUE) and other key carrier features.

“Working with Anritsu, we’ve thoroughly tested our Helio M70 5G modem to ensure it’s ready for the market rollout of ultra-fast connectivity with 5G networks.” said JS Pan, General Manager of Wireless System Design and Partnership at MediaTek. “With multimode support - for 2G, 3G, 4G and 5G connectivity Helio M70 powered devices will give consumers a seamless connectivity experience wherever they go.”

“We are working with MediaTek to help accomplish its vision of advanced 5G technology benefitting everyone.” added Yoshiyuki Amano, Anritsu’s Vice President. “Our tests with the MT8000A have verified that the Helio M70 makes full use of 5G maximum downlink and uplink throughput speeds.”

MediaTek will be demonstrating its Helio M70 at MWC 2019, taking place Feb. 25-28, 2019 in Barcelona. MediaTek’s booth will be located in Hall 6 at Stand 6C30.

MICROLEASE, ELECTRO RENT EUROPE MERGE

18

Microlease and Electro Rent in Europe have announced the start of the integration of their European operations. The two companies will merge over the coming months to join the global Electro Rent Corporation. It will also consolidate the Microlease and Livingston brands into Electro Rent during this time.

This combination will mean better service and support to customers, as well as access to a greater pool of equipment for immediate availability as well as increased technical expertise.

Together the new group will have combined equipment assets worth over $1.1 billion, making its inventory the largest in the industry. With a team of highly technical experts covering all aspects of engineering, along with lease and asset management specialists, Electro Rent Corporation will be able to service a wider range of customers and solve the biggest technical and financial test and measurement challenges they face.

“Test equipment users will benefit from a unique brandindependent source with fast access to the widest range of equipment,” said Peter Collingwood, CEO EMEA, Electro Rent Corporation. “We look forward to sharing the benefits of this global collaboration across both Microlease and Electro Rent customers bases, offering expert applications and solutions advice without any disruption during the rebranding process.”

Offering over 200 high-quality brands to buy, rent or lease, Electro Rent Corporation also provides world-class asset

BISINFOTECH // MARCH 2019

optimisation to help companies maximise their investments.

As well as benefiting customers, this combination will also serve employees and partners who will benefit from global investment. “We will be able to better serve our markets with an expanded equipment fleet and broader geographical coverage”, continued Peter… “This will ensure we have excellent availability levels and a higher level of technical service.”

The move to a single identity as Electro Rent Corporation was made possible when the UK’s Competition and Markets Authority (CMA) cleared Microlease and Electro Rent Europe to operate as a single entity. The North American headquarters are based in West Hills, CA, while EMEA operations will continue to be run out of the London offices.

TEST & MEASUREMENT

CONFORMANCE & PERFORMANCE TESTING OF IN-VEHICLE Spirent Communications announced the launch of Spirent Automotive ComTT, the first universal test platform for the validation of Multibus technologies for in-vehicle networks.

While automotive OEMs worldwide are adopting automotive Ethernet networking, traditional technologies such as Controller Area Network (CAN), CAN with Flexible Data-Rate (CAN FD) and Local Interconnect Network (LIN) will continue to be used for many years. The combination of these various technologies challenge design engineers in several new ways, but Spirent’s new universal platform helps to address these challenges by enabling rigorous conformance and performance testing of both automotive Ethernet and traditional in-vehicle networks.

Automotive Ethernet requires new, complex methodologies for validation.

These include application-layer functionality as well as conformance to the multiple test standards associated with the Network layer, such as OPEN TC8/11, Avnu AVB and RFC2544/2889.

Furthermore, “gateway testing” between automotive Ethernet and traditional networks also needs to be resolved.

At present, engineers utilize two different test platforms, one for traditional bus technologies and one for Ethernet network testing in order to perform full validation of electronic control units (ECUs) and gateways. Spirent Automotive ComTT is the first platform to combine both test methodologies in one device supporting multiple test systems.

“Spirent Automotive ComTT provides a universal approach to switch/network testing, data-logging and analysis,

ECU simulation and cyber security testing, thereby improving test cycles, accelerating time-to-market and reducing costs,” said Thomas Schulze, Director of Marketing and Business Development for Spirent’s automotive business. “By working closely with our automotive vendor customers, we were able to develop this platform which allows them to simplify the verification of their devices in different phases of design and validation, making the path to certification even easier.”

VIAVI 5G NETWORK TESTING AND ASSURANCE PORTFOLIO Viavi Solutions showcased its Lab To Field - 5G network testing and assurance portfolio in a live demonstration at Mobile World Congress in Barcelona, February 25-28, 2019. Recognized as the foremost solution set to facilitate 5G network evolution and speed time to market, VIAVI Lab To Field includes testing systems that are in use with leading base station manufacturers and network service providers worldwide.

Select highlights of VIAVI Lab To Field deployments include: • VIAVI wireless and optical networking lab validation systems have enabled the acceleration of 5G network development in China • VIAVI field instruments supported the installation and activation of RAN for the first commercially available 5G

network in the United States •V IAVI supported a Tier-1 U.S. service provider in deploying 5G New Radio (5G-NR) over a dual mode-capable Massive MIMO radio.

“With 55 commercial networks expected by the end of 2019, this is the year the promise of 5G becomes reality,” said Oleg Khaykin, President and Chief Executive Officer, VIAVI. “As we deliver critical validation, verification and visibility to leading equipment manufacturers and service providers, we see a clear and pervasive drive across the industry to accelerate the availability of 5G services in the market.”

VIAVI Lab To Field

Lab To Field enables complete 5G lifecycle testing — from wrap-around

base station validation and IoT emulation in the lab, to verification in the field and beyond for optimum performance and service assurance.

VIAVI Will Be Demonstrating:

• T M500 – the de facto standard for lab validation of network performance as experienced by end users, across multiple cells and different radio access technologies. TM500 is in use with almost every base station manufacturer across the world • T eraVM 5G Core Emulator – the first mobile core emulator compliant with 3GPP standards, enabling complete, end-to-end 5G base station testing and validation, simplifying the development lifecycle of gNodeB (gNB) base stations for a more agile, 3GPP-compliant network

19

BISINFOTECH // MARCH 2019

INDUSTRY UPDATES

INFINEON 4TH GEN REAL3 TIME-OF-FLIGHT IMAGE SENSOR Infineon Technologies presents the 4th Generation of its REAL3 image sensor IRS2771C at Mobile World Congress 2019 in Barcelona, Spain.

The 3D Time-of-Flight (ToF) single chip is especially designed to meet the requirements of the mobile consumer device market and, in particular, demand for higher resolutions with small lenses. The wide range of use cases includes secure user authentication like the face or hand recognition to unlock the device and confirm payments. In addition, the 3D ToF chip enhances augmented reality, morphing and photo (e.g. bokeh) effects and can be used to scan a room.

Measuring only 4.6 x 5 mm, the image sensor features a 150 k (448 x 336) pixel output that comes close to the HVGA standard resolution. This makes the resolution four times higher than that of most ToF solutions on the market today.

The pixel array is highly sensitive to 940 nm infrared light and provides unbeaten outdoor performance. This is enabled by the patented Suppression of Background Illumination (SBI) circuitry in every pixel.

Due to its high level of integration, each IRS2771C image sensor is essentially a

miniature single-chip ToF camera. This dramatically reduces the overall bill of materials and the actual size of the camera module without compromising on performance and keeping power consumption to a minimum.

“Its robustness against ambient light and its energy efficiency make this imager unparalleled in the market,” said Philipp von Schierstaedt, Vice President and responsible for Infineon’s RF & Sensors business. “With the new image sensor generation, Infineon can further extend its leading position. Every device manufacturer can increase the value of their devices with the new REAL3 chip, while customizing the design and

speeding up time to market”.

Through its long-standing partnership with pmdtechnologies, Infineon has gained profound expertise in algorithms for processed 3D point clouds (a set of data points in space produced by 3D scanning).

Reaching beyond Infineon’s hardware expertise, customers can thus expect a comprehensive offering including tooling and software.

“The fruitful collaboration has proven that best-in-class 3D ToF systems are only achievable by designing the depth sensing system from scratch – from cutting edge ToF pixel, imager and module design to advanced signal processing,” added Bernd Buxbaum, CEO of pmdtechnologies.

“Our customers leverage pmd’s vast experience from 15 years in developing and manufacturing best-in-class 3D ToF products.”

Availability Developed in Graz, Dresden and Siegen, Infineon’s new 3D image sensor chip bundles Infineon’s expertise at its German and Austria sites. Samples of the chip will be available in March and volume production is scheduled to start in Q4 2019.

VICOR ADDS NEW DC-DC CONVERTER CHIP MODULES

20

Vicor announces the launch of its four new DC-DC converter chip modules ideal for defense and industrial applications The new entries in the extensive DCM family are available in the 3623(36 x 23mm) ChiP (Converter housed in Package) with an unrivaled power density of 1,032W/ in3. The new 80W DCM ChiPs, feature a wide-input voltage range of 9V to 75V and are available with nominal output voltages of 12V, 24V, 28V and 48V. The DCM ChiP is a DC-DC converter module that provides a proven, faster power system design option than alternate discrete solutions. DCMs operate from an unregulated, wide-range input to generate an isolated, regulated DC output. By utilizing a high frequency, zero-voltage switching (ZVS) topology, DCMs consistently deliver high efficiency across their entire input voltage range.

BISINFOTECH // MARCH 2019

The new DCMs are used broadly across defense and industrial applications where tighter output voltage regulation is required. These applications include

UAV, ground vehicle, radar, transportation and industrial controls. The DCM ChiPs are available in M-grade, which can perform at temperatures as low as -55°C.

UPDATES INDUSTRY

ARM HELIUM FOR COMPUTING PERFORMANCE Arm introduces Arm Helium technology.

The M-Profile Vector Extension (MVE) for the Arm Cortex-M series processors touts to enhance the compute performance of the Armv8.1-M architecture on the secure foundation of Arm TrustZone.

Helium is said to deliver up to 15x more ML performance and up to 5x uplift to signal processing for future Arm Cortex-M processors, unlocking new market opportunities for our partners where performance challenges have limited the use of low-cost and highly energyefficient devices.

In addition to the added performance and lower development costs, SoC design and development teams will immediately recognize other benefits including: • O ptimized cost, power and design efforts by consolidating functionality • Simple deployment of TrustZone due to Armv8.1-M being designed to Platform Security Architecture (PSA) specifications

• Single toolchain for both control and signal processing software development • Easier software development due to a comprehensive set of tools, models and libraries from the well-established Helium ecosystem, many of which are already being used by Cortex-M developers today For the most constrained embedded systems where energy efficiency is prioritized, historically the solution has been coupling a Cortex processor with a DSP in SoCs, which adds complexity to both hardware and software design. As we look to incorporate more ML capabilities

on to these devices, several existing SoC development challenges are intensified and require a higher level of expertise in utilizing different toolchains, programming, debugging and working with complex proprietary security solutions.

Armv8.1-M with Helium eliminates these challenges by delivering real-time control code, ML and DSP execution without compromising efficiency. In turn, millions of software developers will be able to securely scale intelligent applications that take advantage of DSP capabilities across a wider range of devices, enabling enhanced support for emerging applications across three key categories; vibration and motion, voice and sound, and vision and image processing. This will improve the user experience in future devices such as sensor hubs, wearables, audio devices and industrial applications powered by next-generation SoCs based on Cortex-M with Helium technology.

INTEL BUYS HYDERABAD-BASED SEMI STARTUP Intel Corporation has acquired Hyderabad-based semiconductor startup, Ineda Systems, for an undisclosed amount, in an allcash deal sealed in last week, according to TOI. The deal which had been sealed last week is more in the nature of an acquihire- a transaction in which a company is acquired mainly for the skill sets of its workforce rather than products or services.

With this acquisition, Intel will get a ready-made experienced SOC (System On a Chip) team to help build a world-class discrete GPU business.

Founded in 2011, by industry veterans from US and India Dasaradha Gude and Balaji Kanigicherla, Ineda was working with an ultimate goal of becoming a leader in developing low power SOC’s (System On a Chip) for the use in both consumer and enterprise applications.

Ineda operates in the sphere of autonomous driving, artificial intelligence and Internet of Things (IoT). The company has even managed to raise over $60 MN from high profile investors, including Cisco, Samsung Catalyst Fund, Qualcomm Ventures, Walden-Riverwood Ventures and Imagination Technologies, among others.

Intel has some ambitious plans in the area of graphics and has been working towards building a stronger team to scale its business and strengthen its current products and solutions.

Hence, instead of only focusing on acquiring businesses for their products and services, Intel is adding more people

capabilities.

Currently, Intel has a few hundred engineers engaged in software development in Hyderabad. But with acquisition of Ineda and its plan to set up a global technology center in Hyderabad it will be increasing its headcount. The new Hyderabad center may have around 1,500 engineers initially, which may be ramped up to 5,000 people.

21

BISINFOTECH // MARCH 2019

INDUSTRY FUTURE

ON-CHIP ANALYTICS ARCHITECTURE FOR ML AND AI UltraSoC announces a significant extension of its embedded analytics architecture. UltraSOC allows designers and innovators to incorporate powerful data-driven features into their products.

Developers in the automotive, storage and high performance computing industries can now integrate even more sophisticated hardware-based security, safety and performance tuning capabilities within their products, as well as reaping substantial time-to-market and cost benefits of using UltraSoC in the system on chip (SoC) development cycle.

The new features allow SoC designers to build on-chip monitoring and analytics systems with up to 65,000 elements, allowing seamless support for systems with many thousands of processors.

Future iterations will allow even higher numbers of processors for Exascale systems.

In addition to this dramatically improved scaling capability, new System Memory

Buffer (SMB) IP allows the embedded analytics infrastructure to handle the high volumes of data generated by multicore systems, and to cope with “bursty” real-world traffic.

The new UltraSoC architecture is capable of monitoring effectively unlimited numbers of the internal building blocks that make up the most complex SoC products – and to analyze the impact on system-level behavior of the interactions between them.

Such heterogeneous multicore chips are becoming increasingly common, particularly in enabling the artificial intelligence and machine learning technologies required in leading edge applications such as driverless cars.

Dave Ditzel, Founder and CEO of Esperanto, commented, “Esperanto’s mission is to enable the most energyefficient high-performance computing systems for artificial intelligence, machine learning and other emerging applications. That requires us to put

over a thousand RISC-V processors and AI/ML accelerators on a single chip; UltraSoC’s ability to match that level of scaling with monitoring, analytics and debug capabilities is a vital enabler for our business.”

UltraSoC CEO, Rupert Baines, said, “Our solutions are unique in the market in their ability to deal with multiple heterogeneous processors, standard and proprietary bus structures and even custom logic. This dramatic extension of our architecture takes us even further ahead of traditional solutions – both in the debug and development arena, and in allowing our customers to incorporate in-life monitoring capabilities to ensure security, functional safety and real-world performance optimization.”

UltraSoC’s system-level monitoring and analytics capabilities extend beyond the chip’s core processing components to all parts of the system – which may include thousands of IP blocks and subsystems, buses, interconnects and software.

ST SPURS GAN-ON-SILICON FOR 5G WIRELESS NETWORK

22

STMicroelectronics and MACOM Technology Solutions Holdings announced the 2019 expansion of 150mm GaN-onSilicon production capacity in ST’s fabs, and 200mm as demand requires.

The expansion is designed to service the worldwide 5G Telecom buildout. This builds upon the broad GaN-on-Silicon agreement between MACOM and ST announced in early 2018.

The global rollout of 5G networks and move to Massive MIMO (M-MIMO) antenna configurations is expected to create a substantial increase in the demand for RF Power products.

Specifically, MACOM estimates there will be a 32x to 64x increase in the number of Power Amplifiers required. In turn, this is expected to more than triple dollar content over the course of a 5-year cycle of 5G infrastructure investment and thus drive an estimated 10x to 20x decrease in the cost per amplifier.

“Major base station OEMs understand they need wide bandgap GaN performance

BISINFOTECH // MARCH 2019

with transformational cost structures and manufacturing capacity to meet 5G antenna cost, range and energy efficiency targets in the field. By teaming

with ST, we believe MACOM is uniquely poised to provide it all — performance, cost and high-volume supply chain,” said John Croteau, President and CEO of MACOM. “We anticipate that our joint investment at this early stage in bringing on more capacity positions for us to service up to 85% of the global 5G network buildout.”

“ST has built a strong foundation as a global leader in Silicon Carbide and we are now moving forward with RF GaN-onSilicon, which will enable OEMs to build a new generation of high-performance 5G networks,” added Marco Monti, President of the Automotive and Discrete Product Group, STMicroelectronics. “While Silicon Carbide is ideal for certain power applications such as automotive power conversion, GaN-on-Silicon provides the necessary RF performance, scale, and commercial cost structures to make 5G a reality. With this move ST and MACOM aim to unlock the industry bottleneck and fulfill the demand for 5G buildouts.”

ESDM INDUSTRY

IESA, MEITY AND STPI DRAWS FUTURE OF ESDM INDUSTRY India Electronics and Semiconductor Association (IESA) concluded its flagship event - the Vision Summit 2019.

Under the theme, “Intelligent Electronics and automation- Unleashing the USD 400 billion opportunity”, the 14th edition of the vision summit, featured a powerful line-up of speakers.

Few names included, Dr. Walden C. Rhines (CEO, Mentor Graphics- a Siemens Business), Nivruti Rai (Country Head Intel India and VP Data Center Group, Intel Corporation) and other industry experts offering their views on the future of semiconductor and electronics industry by exploring trends, challenges, and opportunities shaping the Indian industry.

The inaugural session was presided over by Shri. Gopalakrishnan – IAS, Joint Secretary, MeitY, Govt. of India and Dr. Omkar Rai, Director General, STPI. Both highlighted the importance of nurturing the start-up ecosystem in the country to promote innovation and encourage innovative disruption.

Key Announcements at Vision Summit 2019 • MoU signed with MeitY: IESA signed an MoU with MeitY to focus on strengthening the start-up ecosystem.

As a part of this engagement, IESA will be the industry partner for the Ministry’s start up focused activities

• Letter of Intent with Software Technology Parks of India (STPI): STPI will be unveiling over twenty software and hardware focused Centres of Excellence (CoE) across India. The aim of these CoEs will be to spur exchange of ideas, promote knowledge sharing, and support entrepreneurs with market access, technology and mentorship.

IESA exchanged a Letter of Intent with STPI to be the industry partner for the hardware focused CoEs across India.

As part of this engagement, a digital online platform – E-Playground - will be introduced to connect all stakeholders of the start-up ecosystem.

• Report on the ESDM sector: Dr Satya Gupta, IESA, Executive Council & CEO SenZopt and Ajay Jalan, Founder &

Managing Partner, Next Orbit Ventures prepared by Frost and Sullivan, launched an industry report on the Semiconductor & Electronics Market in India. Highlights of the report: o T he Indian ESDM industry is expected to grow at a CAGR of 21.6% by 2025.

This is four times the global growth rate o The Electronic Product Market has the potential to expand to USD 497 billion by 2025. Smart Phones, Defence and Engine Control Units are the demand creators o 3 0 products across all segments of electronics constitutes over 79% of the revenue o The demand for domestic wafer has the potential to reach 17.3 million in volume by FY’25. The top 30 products would contribute to 71% of the total wafer requirement in FY’25 While presenting the ESDM report, Dr Satya Gupta, IESA, Executive Council & CEO SenZopt, announced that its member campaigns contributes USD 20 billion to the ESDM market with 2.5 lakh direct jobs and 10 lakh indirect jobs. He also said “India has had a very good success in the tech services industry for last 2 decades. We have the right talent and leadership to embark on the entrepreneurship journey. Govt and IESA should work together to enable these innovators to develop end-to-end solutions for India and global market place. Vision Summit is the key platform

to have discussions and deliberations to build a vibrant ESDM solutions eco-system in the country.”

Rajesh Ram Mishra, President, IESA said, “The difference between consumption and production of electronics in India is going to create USD 300 billion import burden for our country. Our aim is to reduce this gap by at least USD 100 billion through Intelligent Electronics initiatives, design-led manufacturing and skill building. The mega trends of Industry 4.0, Smart Cities, 5G, AI & ML, Healthcare and Wellness are providing opportunities for large number of start-ups from India to work towards bridging this gap as well as cater to the world need.

Anil Kumar Muniswamy, Chairman, IESA and Managing Director, SLN Technologies said, “IESA continuously works to bring all relevant stakeholders on a common platform to deliberate on how we can create a strong ESDM ecosystem in the country. Our aim is to put in place the right policies and infrastructure, encourage start-ups and entrepreneurs by providing support, and work with the industry to provide the right mentorship and guidance for the growth of this industry. With India being the bright spot on the global business map, we believe that now is the right time to drive innovation and disruption in this industry. This year, Vision Summit is pushing the boundaries of creating solutions to make India a global designled manufacturing hub.”

23

BISINFOTECH // MARCH 2019

INDUSTRY UPDATES

LITTELFUSE UNVEILS GEN2 650V SIC SCHOTTKY DIODES Littelfuse has introduced two secondgeneration series of 650V, AEC-Q101qualified silicon carbide (SiC) Schottky Diodes.

The LSIC2SD065CxxA and LSIC2SD065AxxA Series SiC Schottky Diodes are available with a choice of current ratings (6A, 8A, 10A, 16A or 20A). They offer power electronics system designers a variety of performance advantages, including negligible reverse recovery current, high surge capability, and a maximum operating junction temperature of 175°C, so they are ideal for applications that require enhanced efficiency, reliability, and thermal management.

When compared to standard silicon PN-junction diodes, the 650V Series SiC Schottky Diodes support dramatic reductions in switching losses and substantial increases in the efficiency and robustness of a power electronics system. Because they dissipate less energy and can operate at higher junction temperatures than Si-based solutions,

24

they allow for smaller heat sinks and a smaller system footprint. This provides end-users with all the advantages of more compact, energy-efficient systems and the potential for a lower total cost of ownership.

The Key Applications for 650V Series SiC Schottky Diodes include: •p ower factor correction (PFC), • buck/boost stages in DC-DC converters, • free-wheeling diodes in inverter stages, • high-frequency output rectification and •e lectric vehicle (EV) applications.

“These new series are our first 650V SiC Schottky Diode offerings; all our previous releases were 1200V-rated devices, so we can now address a wider range of

applications and further complement the Littelfuse SiC MOSFET portfolio,” said Christophe Warin, Silicon Carbide Product Marketing Manager, Semiconductor Business Unit at Littelfuse. “Their AEC-Q101 qualification puts these diodes in a higher class than similar devices in terms of quality and reliability.”

The 650V Series SiC Schottky Diodes offer these Key Benefits: • A EC-Q101-qualified diodes exhibit exceptional performance in demanding applications.

• Far lower switching losses than silicon bipolar diodes and fast, temperatureindependent switching behavior make these devices suitable for highfrequency power switching.

• The positive temperature coefficient enables safe operation and ease of paralleling.

• T h e 1 7 5 ° C m a x i m u m o p e r a t i n g junction temperature provides a larger design margin and relaxed thermal management requirements.

CYPRESS LOW-POWER BLUETOOTH MCUS

LATEST CII FCC-360 SERIES CONTACTOR

Cypress Semiconductor announced it is sampling two lowpower, dual-mode Bluetooth 5.0 and Bluetooth Low Energy (BLE) microcontrollers (MCUs) that include support for Bluetooth mesh networking for the Internet of Things (IoT).

The new CYW20819 and CYW20820 MCUs each provide simultaneous Bluetooth 5.0 audio and BLE connections, delivering low-power wireless solutions that enable music and voice commands for battery-powered fitness bands, health monitoring devices, and voice remotes. Designers can also use the solutions to develop low-cost, low-power Bluetooth mesh network devices that can communicate with each other—and with smartphones, tablets and voice-controlled home assistants—via simple, ubiquitous, and hub-free Bluetooth connectivity.

The CYW20819 Bluetooth/BLE MCU has the ability to maintain Serial Port Profile (SPP) protocol connections and Bluetooth mesh connections simultaneously while the CYW20820 offers the same features and integrates a power amplifier (PA) with up to 10dBm output power for long-range applications up to 400 meters and whole-home coverage. This provides classic Bluetooth tablet and smartphone connections while enabling a low-power, standards-compliant mesh network for sensorbased smart home or enterprise applications.

TE Connectivity has released its newly developed CII FCC-360 contactors. The 60-amp contactors are smaller, lighter and offer higher resistive contact ratings than similar products on the market.

“As a new platform application, the CII FCC-360 contactors address the growing demand within the aerospace market for smaller, lighter contactors with more switching power. And they provide an excellent solution for 60-Hz power switching, which is increasingly important to aerospace engineers,” said Randy Biddix, product manager for TE’s Aerospace, Defense and Marine division.

TE’s compact CII FCC-360 contactors are engineered to save valuable space and weight in power distribution systems, COTS (Commercial Off the Shelf) equipment and 50- and 60-Hz military ground and shipboard systems, among other applications. The new contactors also offer higher resistive ratings than other similar products on the market and are rated at 60 amps for both 28 VDC and 115 VAC 60Hz/400Hz switching.

Designed to the performance standards of MIL-PRF-6106, the durable CII FCC-360 contactors employ a double make contact design that helps reduce wear over time and economized coils that promote faster switching.

BISINFOTECH // MARCH 2019

UPDATES INDUSTRY

MINIATURIZED RF CONNECTOR SYSTEM & CABLE ASSEMBLIES Molex has recently launched a compact 2.2-5 RF Connector System and Cable Assemblies designed to deliver high frequency and low passive intermodulation (PIM).

In conjunction with the 2.2-5 consortium, Molex developed the 2.25 form factor by adapting and miniaturizing the proven 4.3-10 form factor. Molex 2.2-5 RF Connectors are 53 percent smaller than 4.3-10 connectors, and capable of frequencies up to 6 GHz. “Existing connector form factors are pushing the power limits and space constraints in modern mobile telecommunications. Network designers need increasingly compact connectors, while still achieving low PIM,” commented Darren Schauer, Product Manager, Molex. “The 2.2-5 Connector

System and Cable Assemblies are ideal for compact antennas, mobile communications and wireless radio applications.”

Wireless and 5G network infrastructures require coaxial jumpers that can deliver premium electrical performance and robust environmental capabilities to withstand the elements. Molex 2.2-5 RF Cable Jumpers are factory fabricated and provide a IP68 NEMA rating when

mated, protecting the connector system from dust and water ingress.

Molex offers custom assemblies integrating 2.2-5 Connectors in a range of mating options for design flexibility, ease of installation, and optimal electrical performance. The IP68 2.2-5 System features an air dielectric interface enabling superior bandwidth and low insertion loss in 5G networks and any application where space and signal capacities are critical.

“The next generation of small RF connectors, Molex 2.2-5 Connector System and Cable Assemblies enable telecommunications and wireless service providers to build powerful mobile networks with the lowest interference over a range of distances,” added Schauer.

MURATA EXPANDS LQW32FT SERIES INDUCTOR

ON SEMI UNVEILS RSL10 SENSOR DEVELOPMENT KIT

Murata Manufacturing has expanded the lineup in the LQW32FT Series of inductors which are ideal for automotive PoC circuits.

These products are characterized by a wideband, high impedance.

The 1210 inch size (3.2 x 2.5 mm) with an inductance of 47 μH/500 mA, 22 μH/550 mA, and 10 μH/500 mA (at an ambient temperature of 85°C) was already released, but the 4.7 μH/850 mA, 3.3 μH/950 mA, 2.7 μH/975 mA, 2.2 μH/1000 mA versions are being added to handle the higher signal speeds and larger currents of the PoC automotive interface. Mass production started in January 2019, and samples are now available.

The application of PoC in SerDes devices to reduce weight by transmitting video data from automotive cameras and power on the same coaxial cable is growing in automotive applications.

Until now, it was necessary to use multiple inductors with large and small inductances for the purpose of maintaining a wideband, to have high impedance to handle wideband signals in the circuit processing unit, and to separate the signals and the power supply in PoC. However, the LQW32FT Series is able to reduce the number of inductors used from the previous requirement of multiple inductors to contribute to the miniaturization and space reduction of the overall system, as well as lower DC resistance.

ON Semiconductor recently announced the introduction of the RSL10 Sensor Development Kit, designed to provide engineering teams with a comprehensive platform for developing IoT applications with cutting-edge smart sensor technology, and enabled by the industry’s lowest power Bluetooth Low Energy radio.

The RSL10 Sensor Development Kit brings together the highly integrated RSL10 System-in-Package (RSL10 SIP) with a range of advanced low power sensors from Bosch Sensortec. The development platform provides 9 degrees of freedom (DoF) detection and environmental monitoring, including ambient light, Volatile Organic Compounds (VOC), pressure, relative humidity and temperature. An ultra-low noise digital microphone is also included, along with a user-programmable RGB LED, three programmable push-button switches, and 64 kbit of EEPROM. Commenting on the introduction of the RSL10 Sensor Development Kit, Peter Weigand, Vice President of Marketing, Bosch Sensortec, said: “We were excited to work with ON Semiconductor on the RSL10 Sensor Kit. This small form-factor platform includes Bosch Sensortec’s highly integrated BME680 environmental sensor to detect a broad range of gases for air quality applications, as well as our BMM150 geomagnetic sensor and the BHI160 smart sensor for high accuracy motion sensing. The RSL10 Sensor Kit combines motion and environmental sensing with the ultra-low power capabilities of the Bluetooth 5 certified RSL10 to enable a new class of consumer and industrial IoT applications with improved sensor technology and longer battery life.”

25

BISINFOTECH // MARCH 2019

BIG PICTURE

GAUTAM DUTTA

Senior Director Marketing | Siemens PLM Software India SIEMENS CONTINUES TO LEAD THE PLM MARKET IN INDIA

Notching one of the major interviews, Gautam Dutta, Senior Director Marketing, Siemens PLM Software India elaborates to Niloy Banerjee, Consultant Editor, about their PLM business and how the company is leading in innovation and market-share by leveraging a comprehensive, scalable, and fully optimized "Digital Enterprise". Edited Nub.

Q

Q

The digitalization of products and production has brought tremendous change in the Indian manufacturing industry. In its initial avatar, PLM helped manufacturing companies in the form of computer-aided design (CAD) manufacturing (CAM) and Computer Aided Engineering (CAE) tools integrated with storage / retrieval, workflow, visualization and collaboration.

But as the industry demands grew, companies became global, product complexity increased, information sharing became more complex and program management became key to product development process, the OEM manufacturers and suppliers had to look at their extended enterprise and processes more holistically to optimize resources at every step of the Product lifecycle – from product design, production planning, production engineering, production execution to post-sales services.

With the new age integrated Industry software solutions, manufacturers are able to facilitate new-age manufacturing methods and productivity tools such as digital twin concepts for product process & performance, the process of product reinvention, Product lifecycle Management (PLM) integrated with Application Lifecycle Management (ALM) for embedded application software, , program management across extended enterprise, product costing, Manufacturing Operations Management, additive manufacturing among many other new solutions , thereby saving time, labor hours and the overall costs with maximum effect and minimum wastage.

Increasingly, manufacturers are incorporating emerging technologies to streamline their production processes for scalability and this is where integrated industry software solutions have started being recognized for their refreshed business value potential.

To survive disruption in the digital age, manufacturers must rethink every aspect of their business, become a digital enterprise, and take advantage of the new and disruptive technology drivers across each phase of their product development operation to become flexible, reduce endto-end product development cycle time, minimize errors / vulnerabilities, increase yield and create new business opportunities.

Digitalization is making inroads into every industry, disrupting current leaders, and creating new demands and business opportunities.

Though different requirements are needed by industries, the processes across enterprises are almost similar. With a fully optimized "Digital Enterprise", manufacturers enjoy a competitive edge over a traditional business in terms of responding better to market challenges and introduce disruptive innovations earlier to market. In the recent times, it is mentioned often that digital technologies can help create level playing field for Small and medium businesses (SMB) against larger enterprises by fostering flexibility which helps them take advantage of mass customization.

Siemens PLM Software is investing in development and acquisition of relevant technologies to take the pole position in merging engineering insights of the virtual and physical world so that product development time and cost could be reduced significantly, mass customization needs could be met with increased flexibility and products are realized as per requirement, first time right. Siemens provides a fully integrated and adaptable software solutions across customers’ entire value chains, addresses their needs from initial conceptual design, manufacturing planning and monitoring execution through service and support software technology for both the products and plants that produce them. Creating and sharing precise digital twins of each stage of the product design, development and manufacturing is fundamental for transforming into a digital enterprise. Siemens portfolio of products addresses each of the domains with industry-leading technologies across all areas.

To predict product performance, Siemens combines system simulation, 3D CAE and test across all critical attributes earlier and throughout the entire product lifecycle. By combining physicsbased simulations with insights gained from data analytics, the innovation platform helps optimize design and deliver innovations faster and with greater confidence.

MindSphere from Siemens is a cloud-based, open IoT operating system that connects products, plants, systems, and machines, enabling to harness the wealth of data generated by the Internet of Things (IoT) with advanced analytics.

Utilizing augmented and virtual reality tools, Siemens has also been able to devise solutions to offer a first-hand virtual experience of the assembly line, allowing real-time change implementation by

Digital Industrial Revolution is nudging new principles for product lifecycle management (PLM). How pivotal is PLM for today’s businesses?

26

BISINFOTECH // MARCH 2019

Is Digital Enterprise a reality, if so, how is Siemens PLM software collaring with the change?

PICTURE BIG

27

BISINFOTECH // MARCH 2019

BIG PICTURE

simply dragging a machine from its existing location, to a new one and automatically getting the revised line layout.

Siemens helps companies of all sizes around the world to transform the way they create, design and manufacture and helping them to develop innovative products and services. Our customers are better equipped to respond successfully to the changes market dynamics and turn the challenges of digitalization into a business opportunity.

here. The team in India works with large enterprises and major R&D organizations, as well as small to mid-sized manufacturers providing solutions to help them achieve a sustainable competitive advantage by making real the innovations that matter. The growth engine of India is the mid-size engineering manufacturers who make a variety of industrial equipment like valves, motors, pipes, or switches, electrical goods, household appliances as well as components or sub-systems for other OEMs. They have a need to innovate, develop IP and produce quality What are the technological transformations which are helping goods that compete in the global arena. To achieve this, they the PLM software technology to grow? need confidence in their day-to-day engineering decisions.

Tier 1 manufacturers in India have predominantly been the leaders Manufacturers face a multitude of challenges today, including in adopting product lifecycle management solutions. They can constant pressure to meet the ever changing demands, increase afford to invest in solutions that enable integration with their global productivity and quality while keeping cost down. They also have manufacturing locations, customers, and vendors. The technology to face new governance and regulations while contemplating is yet to reach small and medium enterprises. However, the trend with demanding customer service standards. has changed, Industry software including PLM has been finding These issues are driving the development of holistic automation takers in tier-II and tier-III industries, majorly small business companies technology and process driven solutions to reduce the turn-around also looking to invest in such solutions to move up the value chain time and facilitate the introduction of improved product and and deliver better product quality and reliability. In recent times, services in a seamless manner.

PLM vendors are focusing on developing customized out-of-theA large number of trends and technologies are affecting the box solutions to cater to growing client needs and enable faster future of product lifecycle management such as AI/ML, Big deployment for better product management and scalability. With Data, Cloud & Big Data, Mobility, Robotics, Simulation & System increased internet penetration, a lot of vendors are incorporating integration and these are synergizing to result in explosive growth emerging technologies to streamline their production process and of automation and manufacturing software adoption by Indian for scalability. Siemens is supporting manufacturers in India with industry as a whole. Connected devices are already changing pioneering concepts and technologies as they advance toward the way we communicate with a particular product. The industrial the future of manufacturing. Siemens role for these companies is internet of things (IIOT) is rapidly opening up a whole new world to provide them with the foundation they need for a complete to manufacturers. digital transformation.

With the Internet of Things (IoT) generated data, important insights However, research and innovation to develop smart products will of even the smallest of customer requirements have become encourage the adoption of PLM in India but lack of awareness readily available and improves our understanding of customer and traditional ROI concerns will restrain the market growth. requirements. This further allows to monitor products enabling Siemens lately acquired Austemper Design Systems. What manufacturers to track performance on a real-time basis with key strategy has been behind the acquisition? the help of data and its analytics. In such circumstances, the deployment of high-end connected technology can help manufacturers with enhanced visibility and traceability of product- This acquisition was Siemens’ digitalization strategy and investments in the IC market, to help customers quickly bring to market specific insights throughout the product lifecycle.

Additionally, connected PLM is ushering new possibilities by enabling innovations in autonomous vehicles, smart factories and smart manufacturers to integrate multiple systems and gain insights into cities enabling customers to realize innovation. the product development process. In the current industry scenario, Adding Austemper technology to the Mentor IC portfolio, along PLM appears to be at the forefront of this transformational process with the Teamcenter portfolio and Polarion ALM software, will and the digital technologies are helping the natural evolution in give customers the ability to develop and test digital twins of integrating Product Lifecycle Management (PLM), Application their systems for the highest degrees of functional safety before Lifecycle Management (ALM), Electronic Design Automation manufacturing and deployment.

(EDA), Manufacturing Operations Management (MOM) software The innovation platform for the digital enterprise where the customers can model the possible, creating the digital twin of what portfolios.

Siemens has also successfully deployed innovative technologies needs to be realized physically. Our innovation platform creates from manufacturing to energy management to transportation an orchestration layer for operations evaluating alternatives to embrace the power of data in a digital and connected world. optimize production.

Q

Q

Q

28

Q

How pivotal is India as a market for Siemens PLM Software Can you elaborate on ‘Digital Twinning’ and why this interesting – what major scopes and challenges does it inculcate for concept spurring across industries? the company?

With increasing demands and requirements for next-generation smart products that are complex, the current processes can make India is also a significant source of innovation for Siemens, with the current development processes obsolete and irrelevant. global product development and delivery teams located Smart factories with digitally enabled and driven smarter, faster

BISINFOTECH // MARCH 2019

PICTURE BIG

and cheaper robots, along with additive manufacturing processes are disrupting factories and transforming the entire manufacturing domain. Digital twin means an integrated multiphysics, multi-system simulation of a complex product, which functions to mirror the life of its corresponding twin. Digital twin consists of three parts- (i) the virtually defined product including its subsystems (ii) the physical product and (iii) the links between physical and virtual product.

It serves as a bridge between the physical world and the digital world. Digital twin is different from a Computer Aided Design (CAD) model, which is entirely the digital definition of the product and it is also different from IoT that captures the physical characteristics of the product.

Digital twin is characterized by the two-way interactions between the digital and physical worlds, which may result in many benefits. In the physical world, the real product can be made smarter to actively adjust its real-time behaviour according to the recommendations made by the virtual product or the twin. Whereas in the virtual world, the digital version of the product can be made more realistic to accurately reflect the real-world state of the physical product.

Before building physical counterparts, digital twin creates a virtual-physical connection that lets you analyze how a product performs under a number of conditions and make necessary adjustments in the virtual world to ensure that the physical product will perform exactly as planned in the field. It leverages the ability to the companies to enable a fully digital enterprise and get their products to market faster than their competitors by eliminating the need for multiple prototypes, reduces total design and production time, better quality of the final product outcomes.

Depending upon on what stage of the product lifecycle it models, there are three types of digital twin- Product, Production and Performance.

This combination of all three digital twins is known as a digital thread that brings together all the data from all stages of the product and production lifecycles.

Digital twins will change how businesses produce, design, predict and self-heal.

Q

What are your strategies for Indian market and any major clients with which Siemens is working? Alongside, how important is the Startup sector for Siemens which is rowing a billion-dollar potential?

The focus is to utilize technologies that aid in streamlining the entire product development process to ensure superior product design and

Digitalization is making inroads into every industry, disrupting current leaders, and creating new demands and business opportunities.

a lower lead time in developing new products.

The potential in India market for PLM is immense.

With deeper internet penetration, PLM is finding many takers in India, to support product planning, collaborative product development, and validation and manufacturing planning among others. The backbone of PLM software, Teamcenter, is the fundamental integrating platform working in the background to connect and bring together the multitude of operations of large companies including manufacturing OEMs and machine builders.

It offers an immense level of data construction and sharing abilities, even including vendors and aftersales dealers into the network. Its recent feat has been the successful implementation of Teamcenter at Daimler, wherein Siemens has been able to deploy a fully customized solution set for the automotive giant and run it without encountering any bugs, within a few months of the release of the extremely critical software. This concatenation and condensation of the entire value chain for a company has improved work efficiencies by up to 40 percent by reducing the human time consumed in doing regular tasks.

On the other side, NX is one of the company’s strongest CAD tools, helping clients run their product designing activities on the software.

Coupled with its CAE platform, Simcenter allows analysis within the system, utilizing finite element modelling, computational fluid dynamics and multi-body dynamics, to virtually gauge the impact of forces using tools like NX CAE, LMS Virtual Lab and LMS Test Lab, engineers are able to further improvise product designs. One successful application of its designing tools lies at Fiat Chrysler Automobiles (FCA). The automotive major, that recently introduced the Jeep Compass SUV in the Indian market, has seen the vehicle and powertrain engineering of the compact crossover take place entirely on NX and the group also relies heavily on Teamcenter to seamlessly flow the designs through its entire global work chain.

Ease of doing business in India is also playing a crucial role in making India the global manufacturing hub. Siemens will continue to follow its two fold strategy to upgrade and add new products to cater to the evolving needs of the manufacturers and also to add new customers. The company has a strong focus on the industrial sectors like automotive, machinery - construction, power, textiles defence, aerospace, automobile, pharma, apparel, retail and packaging.

The government initiatives such as Smart cities, Digital India, Make-in India, etc. have driven a lot of SMEs to feed into industries such as aerospace,

29

BISINFOTECH // MARCH 2019

BIG PICTURE

auto ancillary and automotive which are amongst the biggest adopters of PLM in India. Siemens is an active participant in this program. The company is also committed to utilizing the enormous talent pool available in India for software development in its new and emerging business areas globally, including India. Siemens is expanding its commitment to education, not just by providing software but also by supporting programs that engage students in design and problem solving.

engineering, production execution, and service to form a digital representation between the virtual enterprises based on models and the real enterprises based on automation technologies.

Siemens has built a portfolio that already enables our customers to integrate important parts of the product- and production life­ cycle and digitally supports their entire value-added chain. We call this the digital enterprise software suite.

With our solutions, we help companies weave the digital thread they need in product ideation all the way through product How real is AI and ML and as mentioned by few critics is it utilization. The products and solutions in our Smart Innovation a new corridor of opportunities or an unbridled innovation? Portfolio provide the foundation our customers need to create a fully digital enterprise. This portfolio includes the products and It’s no secret that artificial intelligence (AI) has been a pervasive solutions to transform operations now and meet any future needs. topic lately. AI and ML abilities in a machine are programmed to Siemens’ partners in India such as TCS, IBM, Wipro, HCL, and other achieve fast problem solving skills. With such capabilities, enterprises companies act as authorized system integrators for Siemens and and manufacturers can store a huge amount of data that can provide engineering, installation, and training support to clients. be further processed and utilize to fine tune product quality in the While there are other market players, Siemens offers end-to-end shortest turn-around time with minimum overheads.

PLM portfolio with a higher market share in cPDM. Data scientists are helping to build prediction models through Only Siemens has the solutions across the entire value chain to machine learning techniques, which enable companies to weave Digital Thread in “Ideation => Realization => Utilization” optimize product quality and reduce potential field failures and – realize innovation. performance issues. Understanding what happens next – and Lastly, how is Siemens aligning with government’s major when – empowers companies to make proactive decisions, initiatives like, Digital India and Make in India? schedule preventative maintenance, disrupt fatal sequences of events and significantly reduce the volume and severity of potential issues. Companies can now utilize big data – including Siemens visions India as a great destination offering huge growth IoT data – to make proactive decisions that will increase actual potential for its business in the coming future as the company is product performance, perceived product performance and already witnessing a lot of interest coming in from its customers, as well as the Indian government towards adoption of industrial enhance the overall customer experience.

With rapid digitization, a large number of tech startups have digitalization tools to be future-ready. come into existence working on advanced technologies to offer Siemens has been aggressively pursuing its Manufacturing Excellence solutions in the areas of ecommerce, healthcare, retails and others. initiative in India, in absolute alignment with the Prime Minister’s Siemens sees a lot of potential in predictive maintenance where “Make-In-India” campaign. With its differentiated initiatives to AI can help reduce costs. The solutions are deployed on edge impart technical knowledge digitally, Siemens aims to reach scores devices, operating data is consistently gathered, processed, of youth across the country and empower them to contribute analyzed, and stored. Ai and ML driven predictive tools can towards India’s manufacturing excellence. monitor the health of critical machine components. For example, In recent years, Siemens had enhanced its R&D and Global one will receive a notification of pending maintenance when an delivery support footprint in India, with offices in Pune, Bangalore algorithm is 95% confident that a critical component will fail or and Chennai with nearly 2000 top-grade engineers, further cause errors within certain hours. AI algorithms can increase the strengthening its commitment to India’s make in India initiative. process efficiency by recommending the most efficient path for Siemens PLM has been working with government to establish optimizing usage of materials, minimizing energy consumption, and domain-centric Centers of Excellence (COE) that have become minimizing functional errors or quality checks. Many developed valuable assets for sharing knowledge, providing a steady supply and developing countries are investing more and more in of skilled industrial manpower, and introducing new technology such transformational technologies to achieve manufacturing and necessary guidance to industries. excellence. It can be accurately predicted that manufacturing Siemens also launched its digitalization platform, 'Mindsphere', in India, along with four application centers in Pune, Noida and will soon be dominated by smart factories.

Gurgaon (two), around 900 software developers, data specialists What key solution is Siemens catering today for the Indian and engineers work together with customers to develop digital market and how it outstands from other available competitive innovations for data analysis and machine learning. products available in the market?

In India, the opportunities are not confined to traditional areas like Automotive, Machinery, Construction, Pharmaceuticals or Siemens continues to lead the PLM market in India. Today, successful process companies. A lot of activity is happening in food and manufacturers are using Siemens PLM Software solutions for beverages, mobility (highways, ports, high-speed trains, metros, innovation and growth. With Siemens Digital Enterprise solutions, etc.), Aerospace, defense and smart infrastructure. With new enterprises are able to integrate and digitalize their entire value government initiatives such as Make in India and Digital India, a lot chain, building consistent and seamless digital platform covering of SMEs and existing players are associating with these industries. all steps from product design to production planning, production Siemens is an active participant in supporting such growth areas.

Q

Q

Q

30

BISINFOTECH // MARCH 2019

A&D

FEATURE

High-Fleets for Indian Aerospace & Defense Market

In

32

dia Aerospace & Defense Market is expected to grow at a significant pace owing to growing need for the modernization of Indian armed forces. The modernization drive aims to leverage advanced military technology to improve the operational capabilities.

Need for improvement in areas such as battlefield support systems, situational awareness, non-lethal weapons, and artificial intelligence is expected to drive the India aerospace & defense market over the next seven years.

India has emerged as the most attractive destination for defence and aerospace technologies in the world. The country already has a large ecosystem—comprising defence, aerospace, avionics, hardware, technologies, equipment, services, products and tools--built by government bodies and private players. Interestingly, the country has over 3,000 micro, small and medium enterprises (MSMEs) that are exclusively focused on defence and aerospace related areas.

India’s aerospace and defence market is expected to reach $23 billion by 2024, as per a forecast by Global Market Insights, Inc. The market comprises of cyber security, homeland security, border security, MRO (maintenance, repair and operations), modelling, training and simulation, logistics, tanks, armoured

BISINFOTECH // MARCH 2019

fighting vehicles, artillery, mine warfare, communication equipment and technology, aircraft, helicopters, missiles, amphibious warfare, submarines, destroyers, frigates, corvettes etc.

There is increased demand for lightweight materials in order to reduce the weight and increase fuel efficiency of an aircraft.

Several Indian startups are working in this space.

The global aerospace and defence materials market size is estimated to reach $27.44 billion by 2025, indicating a CAGR of 4.3 per cent, says Grand View Research Inc. Edition after edition, the biannual defence exposition Aero India has been attracting hundreds of visitors and millions of dollars of investments from all around the world especially from US, UK, Germany, Israel, Russia and many European countries.

Multi-million dollar business contracts and trade interactions are expected to emerge out of this edition of Aero India as well, as per industry observers.

Cybersecurity the New Aerospace & Defense Destination Changing geopolitical situations on the country’s borders is necessitating continuous improvement in defense equipment. This

FEATURE

is propelling new procurement to replace obsolete equipment to bring in readiness. Growing demand is attracting many local industry participants such as Larsen & Toubro, Tata, and Mahindra, in addition to global players including Boeing, BAE Systems, and Israel Aerospace Industries. The entry of newer players in the industry is anticipated to increase competition and drive innovation, thus driving the India aerospace & defense market over the next seven years.

Air segment of the India aerospace & defense market is expected to witness significant growth. The Air Force is planning to increase its surveillance capabilities by acquiring airborne warning & control systems. The sector is anticipated to strengthen its transport fleet to improve its strategic and tactical lift capabilities. The force is also planning to acquire newer fighter platforms such as fifth-generation aircrafts and MMRCA. Homeland security segment is expected to increase at a significant rate, due to growing social unrest in the country, thus propelling the India aerospace & defense market growth.

The government intends to leverage the capacities of private engineering & design and IT sector in the country to meet homeland security demands. The government is undertaking

A&D

several projects that include counter terrorism, border infiltration, maritime security, critical infrastructure security, intelligence, police modernization, and safe city surveillance.

Growing proliferation of visual devices to train aircrew and maintenance staff is expected to propel the modelling, training, and simulation (MTS) services growth. Regional technology players such as Tata Technologies are partnering with India aerospace & defense market players to deliver optimized solutions across modelling and simulation services.

Aerospace & defense equipment are extensively used by the Indian military, navy, and the air force. Thus, the large -scale production of aircrafts, communication equipment, helicopters, and missiles in the country have contributed significantly toward augmenting India aerospace & defense market revenue. In addition, the escalating need for increasing the aircraft fleet size with the inclusion of supporting aircrafts such as rescue, emergency & repair, and medic aircrafts have been forecast to impel the business landscape.

Partnership is the Key To Success Noting that the Indian government’s strong emphasis on

33

BISINFOTECH // MARCH 2019

A&D

34

FEATURE

BISINFOTECH // MARCH 2019

building manufacturing sector, some producers of high-tech and high-spec products said they were working on being in the Indian market for the longterm. “With the ‘Make in India’ initiative, we have been very focused on looking for ways to collaborate further with the Indian industry,” said Jim Jackalone, Director of Sales and Marketing at Cobham Aerospace Communications, a UK-based global technology and services innovator.

Underlining the working relationship with Indian aviation heavyweights such as Tata Industries and Hindustan Aeronautics Ltd for over 70 years, he said, almost all aviation platforms uses some Cobham equipment.

address the generally perceived lack of product certification, qualification and standardisation of products made in India.

“We would like to support with testing and evaluation services,” said Sophie Lane, head of strategic engagement at QinetiQ, which qualifies product and services required by the UK Armed Forces.

Some of the established vendors to international manufacturers expressed their keenness to relocate plants to India where global supply chain is in the making for multi- billion dollar domestic and export-oriented industries.

The UK-based Vaayu is seeking “a right Indian partner” as it is in the process of setting up representative office in India by end of this year. “India is a big

According to officials of the aviation and aerospace industries participating in the ongoing Singapore Airshow 2018, there is a growing respect for the Indian market as new innovations and products with advanced technologies are being designed with provision for India’s requirements. “India is going through a big modernisation programme and we are proposing our new communications solutions,” said David Knight, Global Sales Manager Air Defence at Frequentis UK Ltd, sharing his views of the Indian market.

Frequentis UK Ltd is a global supplier of communication and information solutions. London-based QinetiQ, which offers support of testing and evaluation services, expressed their willingness to

market,” said Brue Allison, Sales Director at Vaayu, the supplier and stockist of recycled but upgraded material and parts for maintenance, repair and operation of major aircraft companies including Lufthansa and Lockheed Martin.

The Semiconductor of Things The Global semiconductor market in military and aerospace industry to grow at a CAGR of 7.53% during the period 2018-2022. Global Semiconductor Market in Military and Aerospace Industry 20182022, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth

FEATURE

prospects over the coming years. To calculate the market size, the report considers the revenue generated from the sales of products such as memory, logic, MOS microcomponents, analog, and others. According to the report, the increasing upgrading and modernization of aircraft will drive the market growth.

Globally, aircrafts are being modernized with the incorporation of advanced electronics and systems in the machines to equip pilots for safe flying. Modern electronics are more accurate and weigh less, that aids in reducing the fuel usage and emissions. The growing use of UAVs will be a key trend driving the market growth. An UAV or drone, are aircrafts that are remotely controlled by drone pilots. In addition to military sector, these drones are finding their applications in sectors such as logistics. These UAVs are used to deliver aid packages to disasteraffected areas.

A&D

private mobile radio); and satellite and intelligence, surveillance, and reconnaissance (ISR) signals intelligence (SIGINT) applications. Antenna technology has become and continues to remain a dominant segment, with advanced radar systems witnessing greater penetration than in the past. Testing such systems not only requires wider bandwidths, but also high resolution along with lower phase noise, lower pre-dynamic range, and higher signal fidelity. Aerospace electronics and avionics continue to advance at a rapid pace, with few signs of slowing down. The demand for advanced test solutions is driven by compute-intensive, high-speed, and high-bandwidth avionics and electronics.

Lot to Test from T&M Segment – India to Lead

The Industrial Internet of Things (IIoT) or Industry 4.0 and changing customer requirements will lead to the adoption of new business models by test and measurement vendors. A&D companies are ready to support the latest technological developments with substantial investments in R&D as new technology adoption and migration is the order of the day.

In the Asia-Pacific region, tremendous growth opportunities are forecast in the near future, especially in China and India, along with increased defense spending in Japan and South Korea. A similar trend is observed in Europe, especially among the European member nations of the North Atlantic Treaty Organization (NATO) and Russia. As the A&D industry (both military and commercial) is again experiencing growth, the global electronic test equipment market for A&D is expected to record increasing annual revenue growth from 2017 to 2022. Frost & Sullivan foresees sustained single-digit growth, resulting in a 3.7% compound annual growth rate (CAGR) from 2017 to 2024.

Radar and electronic warfare (EW) applications hold the highest market share of 54.4%, followed by military communications (public safety and

With the increased complexity of aerospace and defense systems, customers face challenges in the testing, validation, and verification of these modern devices. This trend is changing the face of test and accelerating the need for flexible and scalable test solutions.

Aerospace and defense companies are also placing greater emphasis on test.

The demand for accurate and effective testing is felt throughout the end-to-end aerospace and defense supply chain today. This trend is due to the increased pace of technology change, system complexity, and changing standards and regulations.

-NILOY@BISINFOTECH.COM n

35

BISINFOTECH // MARCH 2019

INDUSTRY KART

MOUSER’S LAST LEG GENERATION ROBOT SERIES Mouser Electronics in its new hour-long video featuring celebrity engineer Grant Imahara’s panel discussion from the 2018 Electronic Components Industry Association (ECIA) Executive Conference.

Titled “How Robotics Will Shape Our Future,” the panel discussion is the final episode of the Generation Robot series from Mouser’s award-winning Empowering Innovation Together program.

This exclusive video features Imahara leading a lively panel discussing the frontiers of robotics with a focus on how they are causing us to rethink the way we live and work. Imahara is joined by the following panelists: • Ayanna Howard, Professor and Chair of the School of Interactive Computing in the College of Computing at the Georgia Institute of Technology • Magnus Egerstedt, Steve W. Chaddick School Chair and Professor in the School of Electrical and Computer Engineering at the Georgia Institute of Technology

• Dominik Boesl, Vice President, Senior Corporate Innovation Manager and Technical Fellow at KUKA Robotics The Generation Robot series is sponsored

by Mouser’s valued suppliers Analog Devices, Intel, Microchip Technology and Molex.

“The 2018 EIT series from Mouser has been one of the most interesting projects of my career,” stated Imahara. “I’ve been able to share my love of robotics and really highlight the innovations

that prove we are definitely living in ‘Generation Robot’ — where humans and robots coexist on all levels of life and work. Seeing what comes next will be truly mind blowing.”

The ECIA Executive Conference is the only conference where senior management teams from the electronics industry's leading companies, representing the entire supply chain, gather to understand and address cross-enterprise challenges.

NAVITAS, DIGI-KEY ONLINE DISTRIBUTION PARTNERSHIP

36

Navitas Semiconductor and Digi-Key Electronics today announced a distribution agreement to provide worldwide, 24-hour availability and accelerate market penetration and revenue ramp of GaNFast power ICs. The world's first GaNFast power ICs enable power systems to simultaneously achieve MHz-frequency and highest-efficiency operation. These advances translate to smaller, faster, lighter and lower cost power conversion in mobile fast chargers and adapters, IoT, TVs, EV/Hybrid, LED lighting, and new energy solutions.

"Navitas is extremely excited to partner with Digi-Key," said Stephen Oliver, Vice President of Sales & Marketing for Navitas.

"GaNFast ICs are the ideal, easy-to-use, robust, 'digital-in, power-out' solution and now, with Digi-Key's best-in-class service, this technology is readily available to every power electronics designer around the world."

The NV6113, NV6115, and NV6117 single GaNFast power ICs are 650V-rated and available in the tiny 5x6mm QFN package.

A series of videos and technical papers introduces GaNFast technology, applications and end-customer examples. Product datasheets and application-specific design kits enable fast implementation for new and upgraded designs.

"Digi-Key is proud to offer the world's first GaNFast power ICs from Navitas. Integrating the GaN gate driver, GaN FET,

BISINFOTECH // MARCH 2019

and GaN logic into a single package simplifies the circuit design," said David Stein, Vice President of Global Supplier Management at Digi-Key. "Our 24/7 global support network with the integration of GaNFast power ICs will be a powerful combination to accelerate the development of a new class of power systems."

KART INDUSTRY

AVNET REJIGS EXECUTIVE PROMOTIONS Avnet has announced two significant leadership promotions.

MaryAnn Miller, senior vice president, chief human resources officer and global marketing & communications, has been promoted to chief administrative officer, reporting to CEO Bill Amelio.

In her new role, Miller will work closely with Avnet’s senior leaders to accelerate the progress of their multi-year strategic plan. This includes strengthening the alignment and value proposition of Avnet’s unique solutions ecosystem and driving the performance of new high margin business segments.

Ken Arnold, vice president of human resources for the Americas, has been promoted to senior vice president and chief people officer, reporting to CEO Bill Amelio.

Arnold has been with Avnet for 21 years and brings a breadth of human resources knowledge and operations experience to the role. During his time at Avnet, Mr. Arnold has played a pivotal role building a strong talent acquisition

MaryAnn Miller

and management capability to ensure Avnet can achieve its growth and transformation objectives.

“MaryAnn has deep expertise across multiple disciplines, and her thoughtful perspective and balanced approach will serve Avnet well in her new role,” said Bill Amelio, Avnet CEO. “Ken’s extensive knowledge and understanding of the

Ken Arnold

company, combined with his stellar reputation of high-integrity, passion for people, and collaborative approach will bring fresh new perspective and energy to our people management practices.

These executive promotions are an important part of Avnet’s leadership succession process and demonstrate the depth of our talent pipeline.”

ARROW REPORTS Q4 AND YEAR-END 2018 RESULTS Arrow Electronics reported fourth-quarter (Q4) 2018 sales of $7.92 billion, an increase of 5 percent from sales of $7.54 billion in the fourth quarter of 2017.

Fourth-quarter net income of $231 million, or $2.63 per share on a diluted basis, compared with net income of $54 million, or $.60 per share on a diluted basis, in the fourth quarter of 2017.

In the fourth quarter of 2018, changes in foreign currencies had negative impacts on growth of approximately $107 million or 2 percent on sales and $.06 or 3 percent on earnings per share on a diluted basis compared to the fourth quarter of 2017.

“We are helping customers create, make, and manage their electronic products at unmatched scale. This is driving tremendous growth for our suppliers, and for Arrow, as evidenced by our second consecutive year of growing sales by more than $3 billion,” said Michael J. Long, chairman, president, and chief executive officer.

“We are proud to be enabling next-

generation technologies and products that are making our world better.”

Global components fourth-quarter sales of $5.26 billion increased 6 percent year over year. Americas components sales increased 5 percent year over year.

Europe components sales increased 9 percent year over year. Sales in the region, as adjusted, increased 13 percent year over year. Asia-Pacific components sales increased 7 percent year over year. “We are well-aligned to the long-term trends of growing electronic content in key end markets such as transportation, industrial, and aerospace and defense,” said Long.

Global enterprise computing solutions fourth-quarter sales of $2.66 billion increased 2 percent year over year. Global enterprise computing solutions sales, as adjusted, increased 6 percent year over year. Americas sales increased 4 percent year over year. Sales in the region, as adjusted, increased 9 percent year over year. Europe sales decreased 1 percent

year over year. Sales in the region, as adjusted, were flat year over year. “We have positioned the company to lead the edge computing paradigm with our leading software, hardware, and security capabilities,” added Long.

Full-year 2018 sales of $29.68 billion increased 12 percent from sales of $26.55 billion in 2017. Net income for 2018 was $716 million, or $8.10 per share on a diluted basis, compared with net income of $402 million, or $4.48 per share on a diluted basis, in 2017.

“We executed well in 2018, and continue to see good returns on our organic investments. Operating income, excluding certain items, increased 16 percent compared to a 12 percent increase in sales. Fourth-quarter cash flow from operations was $263 million as our business model generates substantial cash in lower growth environments,” said Chris Stansbury, senior vice president and chief financial officer.

37

BISINFOTECH // MARCH 2019

INDUSTRY KART

RS COMPONENTS, AVX SIGNS DISTRIBUTION AGREEMENT RS Components has announced a global distribution agreement with AVX Corporation, a leading manufacturer of advanced passive components as well as interconnect sensor, control, and antenna solutions. The agreement enables RS to support the full AVX portfolio and give customers faster access to new products.

The move comes as AVX continues to extend its families of innovative components for high-growth application areas such as IoT. The agreement provides RS customers access to further high-performing capacitors including polymer capacitors for RF power amplifiers and filtering. In addition to sensors and antennas, the evolving portfolio also includes multilayer inductors, circuitprotection devices, interconnect solutions and fuses in small SMD sizes.

Augmenting RS’s comprehensive range of passive components from leading brands, the AVX portfolio complements the even wider selection of semiconductors, magnetics, connectivity solutions, electromechanical parts and enclosures that help customers fulfil a high proportion of the bill of materials for each of their products.

RS also offers a rich selection of engineering essentials including test and measurement equipment, safety products, and access to design tools through the DesignSpark online community.

“Forging our new relationship with AVX

extends the selection of high-quality, market-leading products we can offer our customers to build their latest innovations,” said Andy Keenan, Vice President, Board-level Electronics at RS. “Bringing important new AVX launches to market will enable us to further grow sales and deliver top performance.”

Graeme Dorkings, Vice President, Global Distribution Sales at AVX, quoted: "We are delighted to expand our relationship with

Electrocomponents plc and in particular, RS. For many years, a limited range of AVX products has been available through RS, but we have worked hard to expand the product portfolio, and have exciting plans for further growth around our new focus products. The extensive customer base in Europe and Asia, as well as the outstanding design tools available from RS, make them a great fit for AVX.”

RA, STACKED POLYESTER CAPACITORS FROM CDE

38

New Cornell Dubilier Electronics (CDE) Non-Inductive Multilayer Metalized Polyester Film Capacitor features a Small Size, High dV/dt Capability, Very Low ESR at High Frequency and a SelfHealing Capability New Yorker Electronics has announced it will be stocking the new Cornell Dubilier Electronics (CDE) Type RA Multilayered Polymer Capacitors for 125°C operation.

Type RA capacitors are constructed using stacked metalized polyester protected with an impregnated sealant, which eliminates the need for an external

BISINFOTECH // MARCH 2019

case. This rugged package style offers the highest energy density technology available for switching power supplies, DC to DC converters and other high ripple current applications.

These non-inductive multilayer metalized polyester through-hole film capacitors features a small size, high dV/dt capability, very low ESR at high frequency and a self-healing capability. They are ideal for use in high frequency switching power supplies, noise suppression, EMI reduction and long-life applications.

The self-healing capacitors are

infused with a microcrystalline polymer sealant and exterior tape wrap that protects the capacitor element from moisture, allowing it meet 85°C / 85% RH requirements for demanding military vehicles and aerospace applications.

Available in capacitance values ranging from 0.1µF to 10.0µF, voltage ratings of 100, 250, 400 and 500Vdc, Type RA capacitors are terminated with radial leads to cover a broad range of applications in power electronics where high density capacitors are needed for board-level DC filtering.

DESIGN

LED

ROHM'S NEW HIGH-RELIABILITY 1608-SIZE WHITE CHIP LED ROHM today announced the availability of the SMLD12WBN1W, a White chip LED with 1608 (1.6x0.8mm) size that achieves class-leading reliability. This new package offers superior mountability and long operational life, which makes it ideal for use in display panels (e.g. temperature control displays) in industrial and compact consumer equipment.

In recent years, the need to improve both design quality and visibility of industrial equipment has increased the use of compact White LEDs for numerical displays and visual indicators in these applications. High-reliability LEDs are required to guarantee no degradation in luminosity even with continuous operation for over 10 years. However, achieving this has not been possible until now due to the use of epoxy or silicone resins for molding of typical White chip LEDs. These types of material could not provide enough reliability to prevent degradation in luminosity or provide enough package strength to facilitate mounting on circuit boards. ROHM has been providing 1608-size chip LEDs in colors ranging from Red to Green, and now it is adding White to this product range to meet market demand. The adoption of a new material that combines the benefits of epoxy and silicone resins made it possible to achieve class-leading reliability of White chip LED in such a small package.

ROHM’s tests have demonstrated that the SMLD12WBN1W maintained 100% of its luminosity after operating for 1,000 hours (@25°C, IF=20mA). This represents an improvement of 20x in operational life when compared to other similar products available in the market. Additional tests showed that the package strength was improved 25 times with the new material when compared to products using silicone resin.

This will contribute to significantly reducing the occurrence of failures during fabrication when mounting on circuit boards.

ROHM is committed to continue developing highly reliable LEDs and to strengthen its product lineup while focusing on increasing usability.

Key Features

To address this issue, the SMLD12WBN1W utilizes a new material for the sealing resin that maintains 100% luminosity during operational testing (25C, IF=20mA, 1,000hrs). This results in approx. 20x longer life when compared to the residual luminosity shown under the same conditions by similar products available in the market.

2. 25x higher package strength than those using silicone resin

Although light intensity degradation can be improved by adopting silicone resin, the molding becomes easier to detach from the substrate. Measures to enhance mounting strength such as adding reflectors to compact LEDs cannot be used, and damage to the molding section remains a challenge.

The use of a new resin material improves the molding strength by 25x when compared to products using silicone resin even at high temperatures (Ta=150C). This minimizes defects during mounting on circuit boards, thus achieving superior mountability.

Lineup 1. Successfully maintained 100% luminous intensity during operational testing (25°C, IF=20mA, 1,000hrs) Traditionally, Red and Green LEDs used in display panels of industrial equipment are less prone to cause yellowing of the resin due to light energy. Therefore, luminosity degradation has not been regarded as a problem. Epoxy resins with high mold hardness are commonly adopted for compact molded type LEDs. However, in the case of LEDs with a short wavelength (λD<527nm) such as White, the resin may turn yellow due to the energy of the light.

39

BISINFOTECH // MARCH 2019

COVER STORY

RSA-RELATED CYBERSECURITY INVESTING TRENDS With thousands of cybersecurity operators, practitioners, entrepreneurs, researchers, and investors converging on the Moscone Center in just a few weeks’ time, we thought it would be appropriate to analyze VC investment trends in cybersecurity by geographic region. And, as many people who have attended RSA over the years know, RSA is often the time when blockbuster acquisitions are announced. So we thought it would be interesting to investigate how much cash some of the largest publicly-traded cybersecurity companies had in their war chests.

Consistent with our previous post, we’re seeing a strong upward trend in VC investment in cybersecurity companies globally with the West Coast leading the way with close to $2.5 billion in funding. While the investment in West Coast cybersecurity companies over the years is more pronounced with distinct peaks and valleys, the East Coast and Rest of World investment steadily increases at a more moderate pace. These trends in West Coast investments are primarily driven by “mega-deals” (deals over $100 million). West Coast “mega-deals” by year were:

40

BISINFOTECH // MARCH 2019

This is starkly contrasted with a steadier, but slower pace of growth of investment on the East Coast. Whereas the West Coast had 18 “mega-deals”, the East Coast had just one two over this period (BlueVoyant, formerly BlueteamGlobal, which was a bit less of a VC deal anyway), and Cybereason.

The average deal size per region generally follows the amount of investment per region. These metrics seem to back what we have been seeing, stylistically, from investors in these regions.

The West Coast tends to put more money to work (and more money earlier) than the East Coast. The West Coast also sees more and bigger exits than the East Coast. Our perspective is that neither approach is necessarily better than the other.

Some companies aren’t able to sustain the growth expectations that huge amounts of capital injections require. On the other hand, some are able to not only sustain that growth, but even accelerate it with large capital injections.

As is shown in the first chart, VC investment in cybersecurity companies outside of the US has been steadily increasing, keeping pace with the East Coast. Much of this investment outside of the US has been driven by China, the UK, and Israel.

This may come as no surprise to those in the industry. Each has

TRENDS SECURITY

tons of highly-technical security talent, often honing those skills within government agencies before moving on to start their own companies. And, of course, there is significant access to capital in these developed economies, both private and government.

Heading into RSA 2019, we pulled the cash and short-term investment balances of more than 30 publicly-traded cybersecurity companies over a 5-year period. As you can see, this aggregate balance has nearly doubled over this period of time and is on a steep upward trajectory. Of course, not all of this cash will be used for acquisition purposes, but a significant portion may. Additionally, keep in mind that this does not include large security businesses which are divisions of major firms such as Microsoft, Cisco, IBM, EMC (RSA), HP, Intel (McAfee). Additionally, this does not include private equity firms that have invested significantly in cybersecurity companies of late. This trend is great news for cybersecurity start-ups and investors alike, as it is potentially indicative of acquisitions in the future.

As we can see in the above chart, this trend is mostly driven by major incumbents that are adding significant cash to their balance sheets as their businesses grow, become more profitable, and more stable (with some exceptions). One major incumbent, Palo Alto Networks ended 2014 with approximately $675 million in cash. They ended 2018 with over $3.2 billion as they were able to borrow $1.7 billion in convertible notes in 2018. VMware (not included in the above chart as it is a significant outlier) grew its cash balance from $7 billion to $13.5 billion over the same period. Though they just announced an $11 billion cash dividend in late 2018. Juniper Networks grew

its cash balance from almost $2 billion to over $3.5 billion during this period. These companies are mounting significant war chests and are looking for opportunities to augment (in some cases) single digit growth rates with high-growth, nextgeneration cybersecurity products.

Generally speaking, VC investment in cybersecurity has been occurring at a grueling pace, particularly on the West Coast and in Israel. I think while the exits keep coming, as they have in the past few years and the IPO markets are open and generally healthy, we think weâ&#x20AC;&#x2122;ll continue to see investment in this space. We also believe that the cybersecurity market is ripe for M&A in the coming years as publicly-traded cybersecurity companies are building up their balance sheets, looking to start-ups to drive innovation, and looking for a wider breadth of products to offer CISOs that are tired of deploying and maintaining new one-off solutions.

Notes:

1. When fiscal years did not match calendar years, we used the closest reporting period possible.

2. If the company has not reported earnings as of the time of this analysis, we used the most recent quarterâ&#x20AC;&#x2122;s financial results. n

41

BISINFOTECH // MARCH 2019

TELECOM NATIVE

COAI PROPOSES FINANCIAL SUPPORT FOR 5G TRIALS IN INDIA Industry body COAI has written to the Telecom Department saying financial support and subsidies should be provided to facilitate major 5G trials in India.

COAI also asked permissions and fee on network equipment purchases need to be waived for the entire trial period. The Telecom Department, it said, must give instructions for allocation of spectrum for trials to telecom service providers and Original Equipment Manufacturers (OEM) partners free of cost for the duration of the trial, the Cellular Operators' Association of India (COAI) said in the recent letter.

COAI noted that in line with the 5G trials being conducted and planned across the globe, the report released by the 5G high Level forum in August 2018 had also emphasised the need for technology demonstration and major trials pertaining to 5G in India.

This, it said, would help in raising awareness of 5G applications, stimulate the local R&D ecosystem to develop innovative applications tailored to Indian needs

and help local telecom operators better understand the technology and business models for 5G amongst others.

COAI has said that Internet of Things (IoT) services should also be considered as part of the proposed trials, and that the operators should be allowed to choose their OEM partners independently, and select sites as per market dynamics and respective 5G strategies.

"DoT should support and facilitate stakeholders regarding the availibility of site locations for 5G trials. DoT must provide financial support to all concerned stakeholders related to deployment backhauls, site acquisition, civil works and

trials manpower and related operational expenses...," COAI said in the letter dated February 7, 2019.

The mobile association said that the government should provide requisite financial support and subsidies to facilitate the major 5G trials and subsequent penetration of 5G services in India. "For example, DoT (Department of Telecom) must issue instructions for allocation of spectrum for trials to the telecom service providers and OEM partners free of cost for the duration of the trial," it said.

The stipulated permissions and charges related to network equipment purchase, and deployment, like import licence and custom fee, should be waived off for the entire period of the trial, it said.

"In addition, the concerned authorities should also waive off the charges to lay optical fibre cables to 5G sites and core locations for Gigabit connectivity," COAI said adding that this would facilitate that trials are conducted in a smooth manner.

GOVT STALLS CHINESE 5G COMPANIES FOR TRIALS IN INDIA

42

The government is yet to take a decision on whether to allow Chinese gear makers to take part in 5G trials, said Telecom secretary Aruna Sundararajan.

The announcements were made on the heels of the launch of India’s first locally developed chips for 4G/LTE and 5G modems by Signalchip.

“We have not taken a decision on whether they (Chinese companies) can take part in 5G trials,” Sundararajan told reporters on Wednesday, adding that, “several countries have expressed security concerns from Chinese players, and we will study those issues.”

The government would examine all security-related issues on the back of apprehensions raised by various countries.

Earlier in January, Sundararajan had said that Huawei had applied to the government to participate in the trials. She had said that the department has formed a panel which was looking into the duration, quantum of spectrum, locations and other parameters for the upcoming 5G technology-driven trials.

“Post June, we’ll be planning 5G auction, and the notice inviting applications (NIA) document is in progress,” Sundararajan said.

Comments from the top Department of Telecommunications (DoT) official come at a time when Huawei has come under increasing global scrutiny after the US raised security concerns regarding 5G equipment, given their perceived proximity to the Chinese government.

BISINFOTECH // MARCH 2019

The US has asked its allies to ban 5G gear from Huawei. Canada, Japan, New Zealand, Australia and Poland have acquiesced.

Huawei has now sought evidence from the US and accused other governments of wrongdoing, and has said that such information, if any, should at least be disclosed to carriers.

Huawei has called upon India to have its own judgement, saying it is awaiting the government’s approval on trials which it can start within a month of receiving airwaves.

India’s telecom operators on Wednesday held a meeting with their counterparts in other markets, global lobbying groups, data protection firms and government agencies to know their views about Huawei, ZTE and concerns over data security.

90PC PLUS OPERATORS FEAR ENERGY COSTS FOR 5G In-depth survey reveals a good sense of optimism about the services 5G will enable and the interplay with edge computing.

Vertiv, together with technology analyst firm 451 Research finds that majority of telecoms operators surveyed believe the 5G era will start in earnest in 2021 in all geographies, with 88 percent of respondents planning to deploy 5G in 2021-2022.

However, more than 90 percent of respondents believe 5G will result in higher energy costs and are interested in technologies and services that improve efficiency.

This is consistent with internal analysis

by Vertiv, which finds the move to 5G is likely to increase total network energy consumption by 150-170 percent by 2026, with the largest increases in macro, node and network data center areas.

The survey questioned more than 100 global telecoms operators about the opportunities and potential obstacles of deploying 5G services and the impact on edge computing adoption. Vertiv and 451 Research shared details of

the findings at Mobile World Congress on February 27th in Barcelona, Spain.

“In India 5G will add more impetus to the app-based economy and improve user experience. India has the potential to be a global frontrunner in deployment and use of 5G networks, however, there are concerns around investments in deployment by service providers in India. Apart from investment another big concern is the high cost of electricity in India, which is crucial for service providers to manage the operations of networks. In the current scenario of tariff wars between the top three players, we expect the service providers to look for technologies that will optimize running costs when the 5G networks will be deployed,” said Dinesh Dhut, director – telecom, Vertiv India.

Regarding edge and 5G specifically, the survey reveals that a large majority of operators have deployed (37 percent) or plan to deploy (47 percent) edge compute that is aligned with mobile infrastructure – also called multi-access edge computing (MEC).

“This survey brings us clarity on telecom

operators’ hopes and fears around 5G and edge deployments,” says Brian Partridge, research vice president for 451 Research.

“The two toughest connectivity challenges for supporting 5G topologies were revealed to be upgrading access and aggregation layer networks and adding new backhaul links. Survey respondents indicated that the availability of high-quality connectivity to distributed POPs and ease of site acquisition were viewed as the most critical enablers to 5G success. We were frankly surprised by some of these results and believe it brings clarity to the level of transformation the industry now faces.”

As well as the important touch-points between 5G and edge computing, the study from 451 Research and Vertiv examines some of the potential obstacles to 5G adoption and, importantly, the measures operators can take to mitigate them, such as Energy Savings as a Service (ESaaS). According to the survey, more than 90 percent of respondents said they are either extremely or moderately interested in ESaaS.

43

BISINFOTECH // MARCH 2019

TELECOM NATIVE

ERICSSON JOINS O-RAN ALLIANCE Ericsson has joined the O-RAN Alliance, a group of leading telecom service providers and suppliers with the commitment to evolving radio access network (RAN) architecture and orchestration built on openness, intelligence, flexibility and performance.

As a member, Ericsson will focus on the open interworking between RAN and network orchestration and automation, with emphasis on AI-enabled closed-loop automation and end-to- end optimization, to lower operating cost and improve end-user performance.

In addition, Ericsson will also focus on the upper-layer function as specified in 3GPP to provide interoperable multivendor profiles for specified interfaces between central RAN functions, resulting in faster deployment of 5G networks on a global scale.

Erik Ekudden, Senior Vice President and Chief Technology Officer, Ericsson, noted: “Ericsson is a strong supporter of openness in the industry, and the benefits this has on global ecosystems and innovations. Our ambition is to actively support and drive discussions and developments around future RAN

architectures and open interfaces.

The O-RAN Alliance is an important coalition that creates an arena for these discussions, complementing other standardization and open-source initiatives in the industry which we are already active in.”

Ericsson’s engagement with the O-RAN Alliance is based on the future needs of mobile network service providers, and how networks must evolve to

enable broad range of services with strong focus on quality, performance and security.

The O-RAN Alliance was formally formed at Mobile World Congress Shanghai on June 27, 2018 as a network operator-led effort to drive openness and intelligence in the RAN of next-generation wireless systems. At the end of 2018, the O-RAN Alliance was opened also for nonservice providers to join.

HPE, SAMSUNG JOIN FORCES TO SPUR 5G ADOPTION

44

Partners to deliver virtual radio access network and 5G core solutions to advance telecommunications networks’ 5G readiness Hewlett Packard Enterprise (HPE) and Samsung Electronics have joined forces to jointly provide solutions that help communications service providers (CSPs) accelerate 5G deployment. Offerings will include solutions for virtual radio access networks (vRAN) and for 5G core networks, enabling CSPs to capitalize on the demand for data-intensive, lowlatency services.

Fully leveraging the potential of 5G requires a transformation of telecommunications networks towards an open-standards based architecture, including the replacement of the current proprietary edge appliances with virtual radio access networks (vRAN)

BISINFOTECH // MARCH 2019

running on standard-IT systems. With this collaboration, HPE and Samsung will combine their respective strengths in edge-to-core infrastructure, data management and radio networks to provide end-to-end solutions that enable a fast and smooth 5G transition.

“5G enables a new world of interconnectivity and will transform every sector in society, from automotive to healthcare,” said Phil Davis, President Hybrid IT, Chief Sales Officer, HPE. “HPE is proud to join forces with Samsung to support communications service providers as they evolve their infrastructures to effectively deliver new 5G services to consumers and businesses.”

As per the partnership agreement, a 5G vRAN solution will be made commercially available through Samsung, leveraging Samsung’s vRAN software solutions and

system integration services and the new HPE Edgeline EL8000 Converged Edge System which delivers high performance and low latency in a compact and ruggedized form factor, equipped with edge-optimized serviceability and remote systems management. This vRAN solution will enable CSPs to decouple network functions from the edge infrastructure to deliver flexible, agile and cost-effective offerings for customers.

HPE and Samsung will also deliver joint 5G core solutions. The initial offering will consist of Samsung Packet Core software products and selected HPE 5G core network function (NF) software products utilizing the HPE Shared Data Environment (SDE) and service-based architecture (SbA), to streamline the transition to 5G and address periods of overlap of 5G with 4G and 3G.

NATIVE TELECOM

MOBILY EXPANDS USE OF VIAVI LOCATION INTELLIGENCE Viavi Solutions announced that Etisalat Group Company Mobily has expanded their use of VIAVI location intelligence, selecting the NITRO GEO solution to enable increased operational efficiency and capacity for improved profit margin.

Mobily is a leading provider of telecom and IT services, operating one of the largest mobile networks in Saudi Arabia.

Mobily enhanced their deployment of VIAVI location intelligence, deploying the NITRO GEO solution along with NITRO Mobile Traffic Storage Agents to optimize their network and services in real time and achieve key performance improvements crucial to business value, including: • V IP Assurance: Isolate and resolve priority subscriber issues more quickly • Device Analysis: Detect 4G devices using the 3G network only, enabling Mobily to inform those customers by SMS they can change the user setting for better performance

• T a r g e t e d N e t w o r k & S e r v i c e Optimization: Analyze how much time users spend with specific services at each location within network cells in order to identify top revenue generating services and cells for optimization.

“Mobily is at the forefront of technology innovations that enable peak performance and service assurance across their entire mobile network,” said Karl Grabner, Senior Director of EMEA Sales, VIAVI. “As leading service providers like Mobily prepare to deploy 5G alongside legacy 2G, 3G and 4G technologies, they require locationaware, automated and scalable solutions like NITRO GEO to manage and optimize increasingly complex services and network architectures.”

“VIAVI location intelligence enables us to harness key insights for a targeted, subscriber-centric approach to optimization, delivering the best

possible customer experience,” said Abdulaziz AlBarrak, General Manager of Optimization, Mobily. “With the ability to optimize quality of experience for our most high-value subscribers, we can target network and service improvements to deliver maximum return with minimal investment.”

Built on NITRO Mobile – a real-time intelligence platform capturing, locating and analyzing all mobile events across RF, RAN, xHaul and core – the NITRO GEO solution enables Mobily to leverage deep insights throughout their network for maximum performance optimization. Working in concert with the complete portfolio of VIAVI location intelligence solutions, NITRO Mobile connects virtual and physical test instruments with software-based assurance and optimization agents and applications. Moreover, the NITRO platform enables new revenue streams through monetization of rich data sets.

FIRST 5G SIM TO UNLEASH NEXT GEN NETWORKS The new 5G SIM provides improved data privacy, enhanced protection against hacking and seamless 5G global roaming Gemalto announces the industry-first 5G SIM in order to meet operator requirements for the new generation of network deployments which will emerge in 2019.

Compliant with the latest ETSI 3GPP specifications and SIMalliance recommendations, the 5G SIM is defined by them as the only solution capable of securing 5G network access. The Gemalto 5G SIM brings not only improved data privacy and seamless 5G global roaming imposed by the latest standards but is also the first to add enhanced protection against hacking to anticipate future requirements.

The Gemalto 5G SIM will be available in all SIM form factors (removable SIM, M2M SIM, eSIM), during the first half of 2019. Key benefits of the new 5G SIM include full anonymization of end-to-end subscriber identities thanks to onboard identity encryption; it eliminates the

potential to misuse such information to locate and trace individuals, or collect personal data, and ensures mobile operators comply with regulations such as GDPR. In addition, trusted environment resilience will help operators secure the entire SIM lifecycle, eliminating exposure to hacking attacks and accidental breaches. A seamless 5G roaming experience is also supported, maximizing revenues and enhancing the customer experience.

Gemalto has been working closely with key 5G industry stakeholders around the

world in the development of 5G SIM, through standardization, prototyping and testing.

“The 5G SIM provides the foundation of trust in this next generation mobile network for operators and other stakeholders in the eco-system” said Emmanuel Unguran, EVP Mobile Services & IoT Business Unit, for Gemalto. “It will help operators unleash the full 5G potential, maximize their network investments, and simplify new service deployment with full backward compatibility to previous 3G/4G technology.”

45

BISINFOTECH // MARCH 2019

EVOLVE TECH

ULTRATHIN SEMICONDUCTOR HELP DEVELOPS ELECTRON LIQUID AT ROOM TEMPERATURE

46

By bombarding an ultrathin semiconductor sandwich with powerful laser pulses, physicists at the University of California, Riverside, have created the first "electron liquid" at room temperature.

The achievement opens a pathway for development of the first practical and efficient devices to generate and detect light at terahertz wavelengths -- between infrared light and microwaves. Such devices could be used in applications as diverse as communications in outer space, cancer detection, and scanning for concealed weapons.

The research could also enable exploration of the basic physics of matter at infinitesimally small scales and help usher in an era of quantum metamaterials, whose structures are engineered at atomic dimensions.

The UCR physicists published their findings online Feb. 4 in the journal Nature Photonics. They were led by Associate Professor of Physics Nathaniel Gabor, who directs the UCR Quantum Materials Optoelectronics Lab. Other co-authors were lab members Trevor Arp and Dennis Pleskot, and Associate Professor of Physics and Astronomy Vivek Aji. In their experiments, the scientists constructed an ultrathin sandwich of the semiconductor molybdenum ditelluride between layers of carbon graphene. The layered structure was just slightly thicker than the width of a single DNA molecule.

They then bombarded the material with superfast laser pulses, measured in quadrillionths of a second.

"Normally, with such semiconductors as silicon, laser excitation creates electrons and their positively charged holes that diffuse and drift around in the material, which is how you define a gas," Gabor said. However, in their experiments, the researchers detected evidence of condensation into the equivalent of a liquid. Such a liquid would have properties resembling common liquids such as water, except that it would consist, not of molecules, but of electrons and holes within the semiconductor.

"We were turning up the amount of energy being dumped into the system, and we

BISINFOTECH // MARCH 2019

saw nothing, nothing, nothing -- then suddenly we saw the formation of what we called an 'anomalous photocurrent ring' in the material," Gabor said. "We realized it was a liquid because it grew like a droplet, rather than behaving like a gas."

"What really surprised us, though, was that it happened at room temperature," he said. "Previously, researchers who had created such electron-hole liquids had only been able to do so at temperatures colder than even in deep space."

The electronic properties of such droplets would enable development of optoelectronic devices that operate with unprecedented efficiency in the terahertz region of the spectrum, Gabor said. Terahertz wavelengths are longer than infrared waves but shorter than microwaves, and there has existed a "terahertz gap" in the technology for utilizing such waves. Terahertz waves could be used to detect skin cancers and dental cavities because of their limited penetration and ability to resolve density differences. Similarly, the waves could be used to detect defects in products such as drug tablets and to discover weapons concealed beneath clothing.

Terahertz transmitters and receivers could also be used for faster communication systems in outer space. And, the electronhole liquid could be the basis for quantum

computers, which offer the potential to be far smaller than silicon-based circuitry now in use, Gabor said.

More generally, Gabor said, the technology used in his laboratory could be the basis for engineering "quantum metamaterials," with atomscale dimensions that enable precise manipulation of electrons to cause them to behave in new ways.

In further studies of the electron-hole "nanopuddles," the scientists will explore their liquid properties such as surface tension.

"Right now, we don't have any idea how liquidy this liquid is, and it would be important to find out," Gabor said.

Gabor also plans to use the technology to explore basic physical phenomena.

For example, cooling the electron-hole liquid to ultra-low temperatures could cause it to transform into a "quantum fluid" with exotic physical properties that could reveal new fundamental principles of matter.

In their experiments, the researchers used two key technologies. To construct the ultrathin sandwiches of molybdenum ditelluride and carbon graphene, they used a technique called "elastic stamping." In this method, a sticky polymer film is used to pick up and stack atom-thick layers of graphene and semiconductor.

TECH EVOLVE

WATERPROOF GRAPHENE ELECTRONIC CIRCUITS DEVELOPED FOR NEXT-GEN SENSORS A team of European researchers has discovered that when this two-dimensional material is integrated with the metal of a circuit, contact resistance is not impaired by humidity.

This finding is known to help develop new sensors-the interface between circuits and the real world- with a significant cost reduction.

The many applications of graphene, an atomically-thin sheet of carbon atoms with extraordinary conductivity and mechanical properties, include the manufacture of sensors.

These transform environmental parameters into electrical signals that can be processed and measured with a computer.

Due to their two-dimensional structure, graphene-based sensors are extremely sensitive and promise good performance at low manufacturing cost in the next years. To achieve this, graphene needs to make efficient electrical contacts when integrated with a conventional electronic circuit. Such proper contacts are crucial in any sensor and significantly

affect its performance.

But a problem arises: graphene is sensitive to humidity, to the water molecules in the surrounding air that are adsorbed onto its surface. H2O molecules change the electrical resistance of this carbon material, which introduces a false signal into the sensor.

However, Swedish scientists have found that when graphene binds to the metal of electronic circuits, the contact resistance (the part of a material's total resistance due to imperfect contact at the interface) is not affected by moisture.

"This will make life easier for sensor designers, since they won't have to worry about humidity influencing the contacts, just the influence on the graphene itself," explains Arne Quellmalz, a PhD student at KTH Royal Institute of Technology (Sweden) and the main researcher of the research.

The study, published in the journal ACS Applied Materials & Interfaces, has been carried out experimentally using graphene together with gold metallization and silica substrates in transmission line model test

structures, as well as computer simulations.

"By combining graphene with conventional electronics, you can take advantage of both the unique properties of graphene and the low cost of conventional integrated circuits." says Quellmalz, "One way of combining these two technologies is to place the graphene on top of finished electronics, rather than depositing the metal on top the graphene sheet."

As part of the European CO2-DETECT project, the authors are applying this new approach to create the first prototypes of graphene-based sensors.

More specifically, the purpose is to measure carbon dioxide (CO2), the main greenhouse gas, by means of optical detection of mid-infrared light and at lower costs than with other technologies.

In addition to the KTH Royal Institute of Technology, the companies SenseAir AB from Sweden and Amo GmbH from Germany are likewise participants in the CO2-DETECT project, as is the Catalan Institute of Nanotechnology (ICN) from Barcelona.

ELECTRONIC DEVICES SOS, ADVANCED EMP TO COMBAT An electromagnetic pulse (EMP) emitted by a nuclear weapon exploded high above the United States could disable the electronic circuits of many devices vital to military defense and modern living.

These could include complicated weapon systems as well as phones, laptops, credit cards and car computers. Also in trouble might be home appliances, gas station pumps and bank accounts.

Fortunately, military equipment is designed to be immune to various levels of EMP and the validity of its designs — and some civilian designs as well — have been tested and improved by a “friendly” EMP generator installed in a recently renovated facility at Sandia National Laboratories.

The ElectroMagnetic Environment Simulator (EMES) consists of a hippopotamus-sized Marx generator

that sits alone in a small laboratory.

The large capacitor bank stores electrical energy and releases it upon command.

The resulting blast of energy, in the form of an electromagnetic pulse, can be focused on a target every 15 minutes.

Absorbers at the far end of the test chamber gobble up the energy not absorbed by the object being tested.

“An EMP pulse generated by an adversary would be an attempt to disrupt our communications or other equipment,” said Leonard Martinez, the Sandia researcher in charge of the timing and firing control system. “Recent advancements now enable us to provide that pulse within a microsecond of the unit’s timing requirement.” The idea is to explore the effects of the energy pulse by testing an item at critical times during its processes. Learning when and

where a problem may occur in the unit permits engineers to design better EMP shielding to prevent such upsets.

Sandia’s EMES testing process involves trundling components into the target area, subjecting them to the rapidly peaking EMP and then removing them to make way for the next item to test. Preliminary results are provided immediately, said Martinez, and a longer report with more extensive analysis is issued later.

If the device passes the specification level test at normal energy requirements, its owners may ask the test facility to increase the EMP electric-field amplitude in incremental steps to determine the device’s capabilities at higher threat levels. “This gives the customer a better level of confidence about their product,” said Martinez.

47

BISINFOTECH // MARCH 2019

HOW CONVERGENCE OF TECHNOLOGY CAPPED THE GROWING STARTUP BUSINESS IN INDIA?

48

Consultancy firm KPMG, in its latest report on India’s start-up ecosystem, has said an explosion of the Internet, higher literacy rates and greater exposure to outside working has fuelled sectorbased innovation and, hence, start-ups originating in IT, artificial intelligence, IoT, finance, healthcare, biotechnology, education, agriculture, and logistics, amongst others.

These believed transformations have helped the startups in India to reach 50,000 from 7000 in a decade, according to a latest KPMG report.

The report on the Indian startup ecosystem, suggests that the number of startups have taken a steep rise in the past decade

BISINFOTECH // MARCH 2019

(2008-2018), which is a seven-fold increase from the previous figure.

“To this effect, we are seeing the emergence of multiple start-up hubs within the country, including Mumbai, and other metropolitan cities,” KPMG said in the report.

It added that the country has witnessed significant growth in the number of startups in tier-II and III cities such as Jaipur, Kochi, Ahmedabad and Pune.

Of the 14,565-odd start-ups approved under the country’s ‘Start-up India’ initiative in 2018, the highest number are from Maharashtra. Globally, Mumbai was ranked seventh in terms of growth in VC deals secured in 2015–2017, as compared

to the 2010–2012 period.

“To this effect, we are seeing the emergence of multiple start-up hubs within the country, including Mumbai, and other metropolitan cities,” KPMG said in the report.

It added that the country has witnessed significant growth in the number of startups in tier-II and III cities such as Jaipur, Kochi, Ahmedabad and Pune.

Of the 14,565-odd start-ups approved under the country’s ‘Start-up India’ initiative in 2018, the highest number are from Maharashtra. Globally, Mumbai was ranked seventh in terms of growth in VC deals secured in 2015–2017, as compared to the 2010–2012 period.

EYE MARKET

FOUR CHINESE OEMS RANK IN THE TOP 10 SEMICONDUCTOR CUSTOMERS IN 2018 – GARTNER Samsung Electronics and Apple remained the top two semiconductor chip buyers in 2018, representing 17.9 percent of the total worldwide market, according to Gartner. This is a 1.6 percent decrease compared with the previous year.

However, the top 10 OEMs increased their share of chip spending to 40.2 percent in 2018, up from 39.4 percent in 2017.

“Four Chinese original equipment manufacturers (OEMs) — Huawei, Lenovo, BBK Electronics and Xiaomi — ranked in the top 10 in 2018, up from three in 2017. On the other hand, Samsung Electronics and Apple both significantly slowed the growth of their chip spending in 2018,” said Masatsune Yamaji, senior principal analyst at Gartner. “Huawei increased its chip spending by 45 percent, jumping in front of Dell and Lenovo to the third spot.”

Eight of the top 10 companies in 2017 remained in the top 10 in 2018, with Kingston Technology and Xiaomi replacing LG Electronics and Sony (see Table 1). Xiaomi rose eight places to the 10th position, increasing its semiconductor spending by $2.7 billion in 2018, a 63 percent growth year over year.

Table 1. Preliminary Ranking of Top 10 Companies by Semiconductor Design TAM, Worldwide, (Millions of Dollars) 2017 Ranking

2018 Ranking

Company

2017

2018

2018 Market Share (%)

Growth (%) 2017-2018

1

1

Samsung Electronics

40,408

43,421

9.1

7.5

2

2

Apple

38,834

41,883

8.8

7.9

5

3

Huawei

14,558

21,131

4.4

45.2

3

4

Dell

15,606

19,799

4.2

26.9

4

5

Lenovo

15,173

17,658

3.7

16.4

6

6

BBK Electronics*

11,679

13,720

2.9

17.5

7

7

HP Inc.

10,632

11,584

2.4

9.0

13

8

Kingston Technology

5,273

7,843

1.6

48.7

8

9

Hewlett Packard Enterprise

6,543

7,372

1.5

12.7

18

10

Xiaomi

4,364

7,103

1.5

62.8

Others

257,324

285,179

59.8

10.8

Total

420,393

476,693

100.0

13.4

TAM = total available market *BBK Electronics includes Vivo and OPPO Note: Numbers may not add to totals shown because of rounding Source: Gartner (February 2019) The continued market consolidation in the PC and smartphone markets had a significant impact on the semiconductor buyers’ ranking. The big Chinese smartphone OEMs, in particular, have increased their market domination by taking out or purchasing competitors.

As a result, semiconductor spending by the top 10 OEMs increased significantly, and their share reached 40.2 percent of the total semiconductor market in 2018, up from 39.4 percent in 2017. This trend is expected to continue, which will make it harder for semiconductor vendors to maintain high margins.

Another factor impacting the market was memory prices. While the DRAM average selling price (ASP) has been high in the past two years, it is now declining. However, the impact is limited, as OEMs will increase their memory content when the ASP declines and also invest in premium models.

Gartner predicts that the share of total memory chip revenue in the total semiconductor market will be 33 percent in 2019 and 34 percent in 2020, higher than its 31 percent share in 2017.

“With the top 10 semiconductor chip buyers commanding an increasing share of the market, technology product marketers at chip vendors must allocate a majority of their resources to their top 10 potential customers,” said Mr. Yamaji.

“It is crucial that they take advantage of the open budget that is available due to the weakening memory ASPs and encourage customers to use advanced chips or increase memory content.”

Gartner clients can get more information from “Market Insight: Top 10 Semiconductor Chip Buyers, Worldwide, 2018 (Preliminary).”

49

BISINFOTECH // MARCH 2019

SECURITY NATIVE

CYBERSECURITY RISE UP BOARD AGENDA ACROSS INDIA

50

EY GISS) 2018-19 – India edition finds 70% of Indian organizations plan to increase their cybersecurity budgets, wherein, 62% of the boards are taking active steps to strengthen their cyber security understanding A latest security survey cites that cybersecurity has become a boardroom concern for organizations across verticals, revenue bands and geographies.

India currently ranks second in terms of targeted attacks, with one of the highest number of cyber threats detected in India.

EY’s Global Information Security Survey (EY GISS) 2018-19 – India edition launched the latest security survey in New Delhi in the presence of Dr. Gulshan Rai, Cyber-Security Chief, Prime Minister’s Office, Government of India.

The latest EY GISS India edition captures responses of 230 C-suite leaders representing India’s most recognized organizations with revenues ranging from less than USD 10 million to over USD 10 billion.

In India, while 62% of the boards are taking active steps to strengthen their cyber security understanding only 46% of boards or executive management teams have a comprehensive understanding of information security to fully evaluate cyber risks and related preventive measures. The interest in cybersecurity reporting at board level has grown from attempts to understand technology to the point where boards now have a fiduciary responsibility to manage cybersecurity risk.

However, only in 30% of organizations surveyed, board members are taking an ultimate responsibility for cybersecurity.

Speaking at the launch of the report, Dr. Gulshan Rai, CyberSecurity Chief, Prime Minister’s Office, Government of India said, “As we accelerate towards becoming a trillion-dollar digital economy, building the right framework for cyber resilience and security is critical for the country. The need of the hour is to enable and foster a cyber-secure culture and ecosystem. The Government on its part has taken a number of initiatives in this direction; however, the involvement of each citizen and all organizations to make it a collective and coordinated movement is must for the success of the cyber secure eco system.”

Commenting on the findings, Burgess Cooper, Partner - Cyber Security, EY India said, “In comparison to the previous years, organizations are planning to spend more on cybersecurity, devoting more resources for improving their defences, and working harder to embed security-by-design. With the rise in digital movement and subsequent exponential increase in. data generation, there is a growing realization that security is also about maintaining the continuity of business operations — and not restricted to only security of data and privacy.”

The survey highlights that while 70% of Indian organizations plan to increase their cybersecurity budgets, only 19% have a sufficient budget to provide the levels of cybersecurity and resilience as required. Furthermore, the survey reveals that 69% of organizations are still spending a very limited portion of their overall IT budget on cybersecurity with lower level of awareness of where their most critical information and assets are, and inadequate safeguards to protect these assets.

BISINFOTECH // MARCH 2019

The survey highlights major challenges that limit the value delivery as well as the operational effectiveness and efficiencies of the information security function • While 56% of the organizations consider cyber security as an integral part of their strategy and plans, skills shortage has emerged as a key overarching problem wherein even organizations from relatively well-resourced sectors are struggling to recruit the talent they require • 69% of organizations say their information security function is at least partially meeting their needs, and 70% of the organizations agree that their information security function needs improvement • 32% respondents have cited careless or unaware employees as their topmost vulnerability with the most increased risk exposure, over the last 12 months • 46% of respondents have no program – or an informal program – for one or more of the following - threat intelligence, vulnerability identification, breach detection, incidence response, data protection and identity and access management.

Sector insights:

• 87% of the organizations in the Technology sector, and 70% of the organizations in the telecom sector regard careless employees as the most likely source of attack • 84% of Consumer products and Retail brands do not have a functional Security Operations Centre (SoC) which reflects that nearly half of the companies are unable to detect the occurrence of a cyber-attack. Additionally 90% them do not have a direct representation for information security at the board level • 25%-50% of additional funding is required over existing security budget to better protect against emerging threats by 100% of Telecom organizations, 92% of Technology organizations, and 58% of Power and Utilities organizations. However, 75% of the organizations in the Consumer products and Retail have identified that more than 50% of the additional funding over existing security is required • Almost 75% of organizations in the Power and Utilities sector have reported an absence of adequate or formal programs for threat intelligence, vulnerability identification, breach detection and incident response

REPORT SECURITY

2018 - CYBERCRIMINALS DROPS BASIC DDOS OPERATIONS The Kaspersky Lab DDoS Q4 Report covering statistics of the last quarter and the whole of 2018 highlights a 13% decline in the overall number of DDoS attacks when compared with the statistics from the previous year. However, the duration of mixed and HTTP flood attacks is growing, which suggests that malefactors are turning to more sophisticated DDoS attack techniques.

The low cost of DDoS-as-hire makes such attacks one of the most affordable cyberweapons for evil competitors or internet trolls.

Businesses, regardless of their size or industry, can face this threat and suffer revenue and reputation losses in case legitimate users and customers cannot access company’s web resources. Despite the number of DDoS attacks falling in 2018, it’s too early to rejoice as the decrease of the amount of attacks does not mean a decrease in their severity.

According to Kaspersky Lab researchers, as more and more organizations adopt solutions to protect themselves from simple types of DDoS attacks, 2019 will likely see attackers improve their expertise

to overcome standard DDoS protection measures and bring overall complexity of this type of threat to the next level.

Although the number of attacks is decreasing, analysis from Kaspersky Lab experts has found that the average attack duration is growing. Compared with the beginning of the year, the average length of attacks has more than doubled – from 95 minutes in Q1 to 218 minutes in Q4.

It is notable that UDP flood attacks (when the attacker sends a large number of UDP packets to the target’s server ports in order to overwhelm it and make it unresponsive for clients), which are accounting for almost half (49%) of the DDoS attacks in 2018, were very short and rarely lasted more than 5 minutes.

Kaspersky Lab experts assume that the decline in the duration of UDP flood attacks illustrates that the market for easier to organize attacks is shrinking.

Protection from DDoS attacks of this type is becoming widely implemented, making them ineffective in most cases.

The researchers propose that attackers launched numerous UDP flood attacks to test whether a targeted resource is not

protected. If it immediately becomes clear that attempts are not successful, malefactors stop the attack.

At the same time, more complex attacks (such as HTTP misuse) which require time and money, will remain long. As the report revealed, HTTP flood method and mixed attacks with HTTP component, which shares were relatively small (17% and 14%), constitute about 80% of DDoS attack time of the whole year.

“When most simple DDoS attacks do not achieve their aim, those people earning money by launching such attacks have two options. They can reconfigure the capacities required for DDoS attacks towards other sources of revenue, such as cryptomining. Alternatively, malefactors who orchestrate DDoS attacks have to improve their technical skills, as their customers will look for more experienced attackers. Given this, we can anticipate that DDoS attacks will evolve in 2019 and it will become harder for companies to detect them and stay protected,”– comments Alexey Kiselev, Business Development Manager on the Kaspersky DDoS Protection team.

MHI FIRST ASIAN COMPANY TO JOIN CHARTER OF TRUST Mitsubishi Heavy Industries (MHI) signed a letter of intent to join the Charter of Trust for Cybersecurity in Tokyo, expanding the Charter's reach into Asia.

The membership is expected to be concluded by the end of September, 2019. As the 17th Charter partner, MHI will be the first Asian company to become a member of the global cybersecurity initiative.

"Cybersecurity is the key enabler for a successful implementation of the Internet of Things, as well as protecting critical infrastructure", said Joe Kaeser, President and CEO of Siemens. "And cybersecurity also knowns no boundaries. That's why we highly appreciate Mitsubishi Heavy Industries joining us as the first big Asian company, making the digital world more trustworthy and secure. This will make our joint initiative even more global."

"We are honored to be invited by Siemens

and the other signatories to join the Charter of Trust for Cybersecurity", said Shunichi Miyanaga, president and CEO of MHI. "Cybersecurity is a focal area for MHI, and we continue to place importance on developing next-generation solutions in this area. We hope to contribute to making this effort more global."

The Charter of Trust was initially announced

at the Munich Security Conference in 2018. Initiated by Siemens, it calls for binding rules and standards to build trust in cybersecurity and further advance digitalization.

In addition to Siemens and the Munich Security Conference, the companies AES, Airbus, Allianz, Atos, Cisco, Daimler, Dell Technologies, Deutsche Telekom, Enel, IBM, NXP, SGS, Total and T?V S?d signed the Charter.

On February 15, 2019, the BSI German Federal Office for Information Security, the CCN National Cryptologic Center of Spain and the Graz University of Technology in Austria joined as associate members.

Charter of Trust member companies have also worked out baseline requirements to make digital supply chains more secure.

The partners recently announced to implement these requirements in their own supply chains.

51

BISINFOTECH // MARCH 2019

SECURITY UPDATES

MATRIX SECURES MANUFACTURING GIANT 24X7 A Manufacturing giant in Maharashtra has the distinct mark of making India’s 1st Diesel Engine and Iron Mold Ploughs. The company’s legacy dates to 1922.

This company is the reason behind a new wave of industrialization in some of the towns in Maharashtra while preserving their rich heritage.

monitoring was the requirement. Centralized Control - The company is divided into various branches which are located at various places in Satara. This gave rise to the need for a centralized solution at a centralized location from where all other sites can be monitored at a time.

Challenges

To cover the large monitoring area, Matrix provided IP Bullet and Dome Cameras that have greater Field of View when compared to other brands. According to the requirement, various cameras were installed at different locations such as reception area, canteen, security area, entrance, production area, etc. These cameras also provide exceptional low

Large Area to Monitor - The company is spread across a wide area employing more than three thousand people. Being an established and trusted brand, maintaining quality is crucial and therefore, every area needs to be under surveillance. For this reason cameras producing good quality image and can cover a greater area for

52

Solution Offered

light images which aid in providing highclass security.

For storing the streamed videos, Matrix offered Network Video Recorders. These NVRs have features such as Adaptive Recording which aid in storing more data in a dened space.

Moreover, it has Intelligent Video Analytics such as Intrusion Detection and Motion Detection which were also applied. Instant notifications and alerts ensured real-time security of the premises.

Results:

• Centralized Control • 24X7 Real-time Surveillance • Higher Security with Intelligent Video Analytics

UNISTAL ENTERPRISE SECURITY SOLUTION FOR SMES

BLACKBERRY LEGACY OF SECURITY CHURNS, BUYS CYLANCE

Unistal Systems launches Protegent Enterprise Security Solution/Activity Reporter with an aim to provide high-level security for SMEs and large enterprises.

This software touts to be also helpful for organizations in complying with GDPR norms by keeping track of the employees’ activities and monitoring all the connected devices in the network.

Citing on the new rollout, Alok Gupta, Co-founder and Managing Director at Unistal Systems Pvt Ltd. said, “Nowadays, data has become one of the most important aspects for any company and it is a challenge for them to keep it safe and secure.

With our product, enterprises can actively monitor all the connected devices in a network. Activity Reporter also gives the administrator the choice to see the screen of the user’s system with just a single click. Its unique features will act as a foil for anyone who wishes to do any fraudulent activity in the organization” Activity Reporter is an effective employee performance monitoring software, which captures the data on employees’ active and idle time during the office hours.

This software will make it easier for the HR department to ensure that the corporate costs spent on employees are not wasted.

The software will also help management to better understand each employee’s strengths & weaknesses and eradicate the unproductive behavior.

Activity Reporter consists of various modules which give the administrator distinct choices and levels of monitoring the connected system.

BlackBerry has finally completed its previously-announced acquisition of Cylance – a Californian based artificial intelligence and cybersecurity company.

“Today BlackBerry took a giant step forward toward our goal of being the world’s largest and most trusted AI-cybersecurity company,” said John Chen, Executive Chairman and CEO, BlackBerry. “Securing endpoints and the data that flows between them is absolutely critical in today’s hyperconnected world. By adding Cylance’s technology to our arsenal of cybersecurity solutions we will help enterprises intelligently connect, protect and build secure endpoints that users can trust.”

Cylance’s machine learning and artificial intelligence technology is a strategic addition to BlackBerry’s end-to-end secure communications portfolio.

Notably, its embeddable AI technology will accelerate the development of BlackBerry Spark, the secure communications platform for the Internet of Things (IoT).

As the President of BlackBerry Cylance, Stuart McClure will continue to apply his visionary math-based approach to threat detection, prevention, and response, as well as lead the business’ large team of highly-skilled engineers and data scientists that deliver trusted products and services for more than 4,000 companies around the world.

Companies interested in learning more about BlackBerry Cylance’s AI-driven endpoint protection, detection and response capabilities are encouraged to visit its booth (North Hall, #6145) at RSA Conference 2019 from March 4 – 8 in San Francisco. Financial information regarding BlackBerry Cylance will be made available during the company’s fourth quarter earnings call in March 2019.

BISINFOTECH // MARCH 2019

TRENDS SERVER

Top 6 Server Trends to Rule in 2019 Servers to continue playing a pivotal role in helping organizations modernize their datacenter Today, with the emergence of a datadriven ecosystem, the dynamics of the Indian IT industry has changed significantly.

With the proliferation of smart devices, connected sensors and the constant and insatiable need for data-driven insights, IT has moved from back office functionality to forefront executive strategy.

Therefore, in order to stay relevant in the future, the efforts to transform the legacy/ traditional IT infrastructures have gained a lot more importance for businesses across verticals. Servers form the foundation of the modern IT infrastructure – running a variety of workloads from database to software-defined storage.

As we move ahead in the year 2019, amongst the gamut of factors driving the growth of server industry, Dell EMC shares the top 6 trends which will dominate the server market: • I T m u s t b e t h e e n a b l e r o f Transformational Journey: Servers are the bedrock for the modern datacenter, helping businesses become more nimble, intelligent, competitive and adaptive. Hence, businesses must transform and embrace the digital world, with a new business model benefiting from advanced technologies like data analytics, AI, ML and DL • The Edge is real: The expectations of IT hardware, software and datacenter infrastructure will continue to evolve in 2019. The edge evolution will provide vast potential for how customers and providers use, analyze and distribute data. The creation of POCs (edge proof of concepts) in 2019 will allow all parties to vet and test new technologies and associated cost models • The Journey to kinetic Infrastructure continues: The terms “composable infrastructure” and “server disaggregation” entered the mind sets of many enterprise IT departments in 2018. 2019 will also see the rise of technologies that allow the composition of certain classes of components. Therefore, it will be a

year of acceleration on the kinetic Infrastructure journey • D ata Science business disruption leads need for AI/ML/DL: In 2019, the boundaries of Information technology will be stretched to their limit as the “data creation” IT economy transitions to one of “data consumption.” Thus, as the volume and variety of data, an organization needs to analyse grows, there will be an increasing need to utilize data enriched techniques like artificial intelligence/machine learning/ deep learning to help transform this data into information • D a t a : O n - p r e m r e p a t r i a t i o n i s happening: As the cloud model continues to mature, companies are recognizing the challenges around public cloud and have started to repatriate data and workloads back to on-premises. To fight the challenges around public cloud, a hybrid cloud model has quickly emerged as a much more appropriate solution for a majority of businesses. This data/ workload placement transition is known as cloud repatriation •S ecurity threats are the new exponential: 2019 will see yet another year of the exponential growth in security threats. Greater focus on

encryption will emerge, requiring any data at rest to be encrypted, whether at the edge or in the datacenter, along with robust encryption key management “Increasing workloads due to penetration of emerging technologies has forced IT infrastructure to deliver modern capabilities that adapts and scales with business needs. We, at Dell EMC believe that 2019 holds a goldmine opportunity for the server industry as the customers give prime importance to transforming their IT infrastructure, says Mr. Manish Gupta, Senior Director & General Manager, Compute & Networking Group, Dell EMC India. With our industry leading server portfolio, we are confident that we are the right digital partners for our customers, helping them to generate their best business potential.”

Dell EMC offers a holistic server portfolio of industry-leading 14th generation PowerEdge servers, which offer scalable business architecture and intelligent automation. The server portfolio also delivers a robust layer of security, across the hardware and firmware.

Simultaneously, it offers a cyber-resilient architecture that extends across every aspect of the server, including the embedded server firmware, the data stored in the system, etc., which is the need of the hour.

53

BISINFOTECH // MARCH 2019

ICT UPDATES

MICROSOFT UNPLUGS THE POTENTIAL OF AI IN INDIA In a latest whitepaper titled ‘Age of Intelligence’, Microsoft underlined the potential of AI for India. Also, detailing on the country’s readiness for AI, the whitepaper titled ‘Age of Intelligence’ outlines challenges and opportunities with respect to AI. Microsoft’s latest whitepaper on AI also envisions on how appropriate government policies, technological advancements including growing internet penetration and connectivity help reap benefits of digital transformation in years to come.

Focus on making India a digital economy, mobile phone penetration, reduced data costs are all collaborating to make for an environment conducive to extend connectivity and services to the underserved segments of the population, Microsoft said in a whitepaper on AI, unveiled at the NASSCOM Technology and Leadership Forum (NTLF) 2019.

Furthermore, Microsoft called for the technology industry to actively partner and engage to help realize India’s aspirations in AI, given that many of

the initiatives outlined need technology as the backbone to achieve scale, efficiency and sustainability. Cloud infrastructure and rapid deployment of intelligent cloud services will play a key role in driving AI adoption in the country.

Anant Maheshwari, President, Microsoft India, said, “Our ambition is to enable a human-centered approach to AI. India is currently at an inflection point in the adoption of AI. Building on the four foundational pillars – enabling digital transformation across industries, forging coalitions for innovation, building a future-ready workforce and creating sustained societal impact will unlock and accelerate the potential of AI. All of this should be done within an over-arching ethical framework for AI development and usage.”

In this paper, Microsoft presents an industry point of view on the ‘age of intelligence’ that this world is embarking upon, wherein intelligence will be experienced in every facet: in products and services, in the way individuals communicate, how organizations

function and collaborate, and how society and countries evolve. Microsoft AI is a vision for empowerment – for every developer to innovate, every organization to redefine industries and every individual to transform society.

Developers to innovate Microsoft is democratizing AI and is making the technology used in building its own AI applications available on Azure to empower developers and institutions in solving their most difficult problems.

For instance, a challenge in India relates to inclusion- given India’s linguistic diversity and literacy.

This results in a digital language barrier, with services not being easily accessible to all citizens. AI is playing a key role in removing this barrier, by enabling voice recognition, text to speech and translation for all key Indian languages.

Once that is fully available, all services can be offered to all citizens, in the language of their choice. Microsoft is closely working with developers to bring these services to all major Indian languages.

LTI TO ACQUIRE GERMANY BASED NIELSEN+PARTNER

54

Acquisition establishes LTI as a leading global partner for Temenos WealthSuite Larsen & Toubro Infotech has signed a definitive agreement to acquire NIELSEN+PARTNER (N+P), an independent Temenos WealthSuite specialist, headquartered in Hamburg, Germany.

N+P is a leading partner of Temenos in Europe and APAC. The company is well-recognized for its market-leading capabilities in Temenos WealthSuite, including Triple’ A Plus, Data Source and Channels. With presence in major Banking and Wealth Management hubs like Switzerland, Luxembourg, and Singapore, N+P also provides IT Consulting, digital and software engineering services to major enterprises.

This acquisition is synergistic to Syncordis acquisition that LTI announced in 2017.

Syncordis is the leading Temenos T24 Core Banking Platform specialist with widespread presence in Europe, whereas

BISINFOTECH // MARCH 2019

N+P has built comprehensive expertise in the front office of Temenos WealthSuite.

Together with Syncordis, N+P strengthens LTI’s capabilities as a global expert of Temenos suite of products and enriches company’s offerings to Banking clients.

Upon integration, N+P’s Temenos business will be consolidated under the brand of Syncordis, while software engineering business will operate and expand as part of LTI Germany.

Sanjay Jalona, Chief Executive Officer & Managing Director, LTI, said: “Temenos is the world leader in banking software.

Since the Syncordis acquisition, this has been a fast-growing practice for us, enabling resilient relationships and rich, cross-selling opportunities. The acquisition of N+P will help us further establish LTI as a formidable player in the fast-growing market for Temenos and help our clients navigate their digital transformation journey. I welcome the employees and

clients of N+P to LTI family.”

Manuel Brunckhorst, CEO, N+P said: “Joining forces with strategic and complementary partners like LTI and Syncordis is the next logical step to accelerate our growth, enhance our capabilities and extend our services, both for Temenos, as well as software engineering services. We are very excited about the future and continuing our journey with our existing and new clients, employees and partners.”

Guillaume Desjonqueres, CEO, Syncordis said: “Syncordis has been growing at a faster pace since its acquisition by LTI. With LTI acquiring N+P, we are entering into a new phase, expanding both our Temenos offerings and our footprint outside of Europe. In line with our strategic vision, Syncordis and N+P together with LTI will provide complete and innovative services to Temenos clients in the Banking and Wealth Management space, globally.”

UPDATES ICT

NEW STARTUP CONSIDERATIONS VITAL FOR ANGEL TAX In a drive to boast and bring clarification on angel tax for the Indian startup, Union Minister Suresh Prabhu said an entity shall be considered a startup upto 10 years from its date of incorporation / registration instead of the existing period of 7 years.

"An entity shall be considered a startup if its turnover for any of the financial years since its incorporation/registration hasn’t exceeded Rs 100 Crore instead of existing Rs 25 crore," he said.

He also said that the considerations of shares received by eligible startups for shares issued or proposed to be issued by all investors shall be exempt up to an aggregate limit of Rs 25 crore.

The minister added that all investments into eligible Startups by Non-Residents, Alternate Investment Funds- Category I registered with SEBI shall also be exempt under Section 56(2)(viib) of Income Tax Act beyond the limit of Rs 25 crores.

Funds from angels are subjected to over 30% tax if it is more than the fair market value (FMV). Introduced in Section 56

at capital.

But with most startups taking years just to break-even, treating part of the hard-won cash that came in from angels as taxable income, even before a company begins to make money seems unwarranted.

Conditions apply

of the I-T Act in Budget 2012, it explicitly states that companies - from mature private enterprises to small startups – are liable to pay taxes on money invested

A startup will be eligible for exemption if it is a private limited company which is recognized by DPIIT and is not investing in building or land appurtenant thereto; land or building, or both, not being a residential house; loans and advances, other than those extended in the ordinary course of business; capital contribution made to any other entity; shares and securities; a motor vehicle, aircraft, yacht or any other mode of transport, the actual cost of which exceeds ten lakh rupees, other than that held by the startup; and jewellery other than that held by the startup as stock-in-trade in the ordinary course of business.

MICRO FOCUS BUYS INTERSET FOR CYBERSECURITY EXPERTISE Micro Focus has acquired Interset. The addition of this predictive analytics technology adds depth to Micro Focus' Security, Risk & Governance portfolio, and aligns with the company's strategy to help customers quickly and accurately validate and assess risk as they digitally transform their businesses.

Interset unlocks the power of user and entity behavioral analytics (UEBA) and machine learning to furnish security professionals with the most-advanced technique for executing rapid and accurate threat-detection analysis. The technology will accelerate Micro Focus' delivery of a more-robust UEBA offering and help drive deeper data insights across security and operations that are necessary to execute on the company's SecOps Analytics vision.

"Sec u ri ty i s at th e he a r t of e v e r y organization, and perhaps never more so than as they implement their digital transformation initiatives and leverage emerging technologies to better predict

and take action on credible threats," said John Delk, Senior Vice President and General Manager of Security, Risk & Governance at Micro Focus. "Micro Focus recognized that an even more advanced analytics ecosystem was needed to assist in this journey, and we identified Interset as a critical addition to our strategy."

Interset has achieved a strong reputation in the market with software that has been proven in key verticals – energy, critical infrastructure, high-tech, aerospace, defense and government – where threat detection is at a premium. The technology will supplement Micro Focus' Big Data analytics software, Vertica, and add additional value to Micro Focus ArcSight – the world's leading real-time correlation engine – to deliver a highly differentiated cyber-security solution.

"The combination of the Interset technology with Micro Focus' broad security portfolio is a powerful combination that will produce a level

of protection that will be unmatched in the market," noted Mark Smialowicz, Interset's Chief Executive Officer. "Our 'Data In, Intelligence Out' methodology will deliver an even-more complete set of benefits for our combined customers – allowing them to leverage near real-time information to address both immediateand long-term threats."

The Key attributes of the Interset technology include: • Extensible analytics – With multiple use cases out of the box – including inside threats, targeted attacks, and fraud – the technology eliminates the need for expensive product consultations and customization.

•P rincipled math – The software utilizes a growing library of more than 350 proven machine-learning and advancedanalytics models, applying them to both events and entities, to yield a highly accurate means of detecting, connecting, and quantifying high-risk behaviors.

55

BISINFOTECH // MARCH 2019

ICT UPDATES

LENOVO TRUSCALE INFRASTRUCTURE SERVICES Lenovo launched the Lenovo TruScale Infrastructure Services, its comprehensive as-a-Service offering. Lenovo TruScale is a subscription-based offering that allows customers to use and pay for data center hardware and services – on-premise or at a customer-preferred location – without having to purchase the equipment.

Lenovo is introducing Lenovo TruScale Infrastructure Services, a new take on procuring IT resources via a consumptionbased, subscription model. With this new consumption model, customers never take capital ownership of the hardware or other IT assets and pay for what they use each month as part of their operating expenses.

Further, Lenovo’s ThinkSystem and ThinkAgile product portfolios are available through this offering, which includes hardware installation, deployment, management, maintenance and removal.

The Lenovo TruScale offering is unique in that it is a true consumption-based model with no required minimum capacity commitment. With Lenovo TruScale Infrastructure Services, customers only pay for capacity when their workloads are actively running.

Additionally, capacity can be scaled up or down to accommodate business needs,

ensuring IT infrastructure is right-sized, all the time. Lenovo’s unique metering solution remains outside of the customer’s data plane – providing the advantages of cloud-like economics with the security of on-premise hardware. Monthly pricing structures are simple and all-inclusive of associated services (maintenance, support, remote monitoring and system health) in one bill.

“Lenovo’s TruScale as-a-Service offering is truly revolutionary, changing how IT departments procure and refresh their data center infrastructure. With our subscription-based model, customers pay for what they use, eliminating upfront capital purchase risk,” said Laura Laltrello, Vice President and General Manager of Services at Lenovo Data Center Group. “Our offering can be applied to any configuration that meets the customer’s needs – whether storagerich, server-heavy, hyperconverged or high-performance compute – and can be scaled as business dictates.”

“Lenovo is accelerating our customers’ Intelligent Transformation and digital journey by providing them with a new way of securing and deploying infrastructure. By eliminating the capital expense of purchasing IT equipment

and replacing with a subscription model, customers can now focus on supporting their business growth, knowing that they’ll have the right flexibility across their environment,” said Roderick Lappin, Senior Vice President and Chief Customer Officer at Lenovo Data Center Group.

“Lenovo TruScale Infrastructure Services combines the economic flexibility of cloud with the security of on-premise data, giving customers more agility, efficiency and simplicity in how they operate.”

“At Lenovo, we always start by understanding our customers’ strategic objectives. Agility is one of the most challenging issues that we often see amongst our customers, particularly in Asia Pacific where the landscape is so diverse that they are as likely to be a small startup as they are to be an enterprise.

As customers look to refresh their data center from legacy, older infrastructure to more workload-based infrastructure, Lenovo TruScale’s flexibility and agility will be crucial in providing effective and cost-efficient solutions for their data center needs without locking them into rigid architectures or software,” commented Sumir Bhatia, President, Asia Pacific, Lenovo Data Center Group.

TATA ELXSI, NOS TO DELIVER INTELLIGENT AUTOMATION

56

Tata Elxsi and NOS announce the launch of the Digital Operations Transformation Toolbox (DOTT 2.0) for communication and entertainment service providers.

The DOTT 2.0 offers an intelligent operations automation framework built using open source technology for user-defined service definition, zero touch provisioning, validation and scheduling of field partners for provisioning and testing scenarios thus enhancing customer digital experience.

It also provides an extensible roadmap for service rollout and monitoring use cases, enabling communication service providers to launch new services rapidly.

“The roll-out of digital transformation initiatives at NOS was aimed to enhance subscriber experience improving operational efficiency across our entire

BISINFOTECH // MARCH 2019

portfolio. With the right blend of our rich domain knowledge and Tata Elxsi’s design, technology and digital capabilities, we have developed a framework that blends the existing and next-gen technologies for faster and cost-efficient service delivery for our customers and us”, said Judite Reis , Director of Network Operations at NOS. The digital operations transformation toolbox enables provisioning of existing services through re-defined simplified processes and allows the capability to achieve speedy completion of new service launches. This toolbox replaces the complicated operational procedures done earlier using disparate systems, thereby bringing down costs and reducing process latencies significantly.

For instance, Digital Provisioning Services

such as IP VPN, which took several hours for completion earlier, can now be automated and be completed under thirty minutes.

“We are delighted that our design & technology services have helped NOS achieve its digital transformation and customer satisfaction goals. Tata Elxsi’s DOTT 2.0 framework has helped in bringing significant productivity gains, the capability to launch services faster and generate additional revenues,” said Rajagopalan R, Dy. CTO & Head of Network Transformation Technologies, Tata Elxsi. “In addition to operations automation, we have also integrated our user design tool to make existing processes more intuitive, easy-to-use and future-ready.”

NETWORKING UPDATES

CISCO FOSTERS SKILL DEVELOPMENT PROJECT IN GUJARAT Aligned with its commitment to accelerate digital transformation in the country, Cisco announces the signing of a Letter of Intent (LOI) with the Government of Gujarat, to further digital training and skill development across the State.

In a multi-departmental undertaking, several programs with the Directorate of Employment & Training (DET), the Gujarat Knowledge Society (GKS), Directorate of Primary Education (DPE) and Commissionerate of Health (CoH) are set to be implemented over the next 12 months.

With the aim to improve digital skills, Cisco will expand its Networking Academy program into all Government ITIs (Industrial Training Institutes) in Gujarat, bringing its world-class curriculum to ITI students.

Cisco will work with NGO partner Quest Alliance to deliver employability skills in 100 ITI’s. Cisco will work with Gujarat Knowledge Society, Comissionarate of Technical Education to launch the Networking Academy Program in Government, Polytechnic and Engineering Colleges.

In an effort to improve skill sets of healthcare employees within the State, Cisco will work with the Commissionerate of Health (CoH) to pilot employability skills for nurses from Government Hospitals and nursing students in Govt Colleges. Cisco will carry out a pilot for Telemedicine in the state to provide better hospital access in a remote rural area. Additionally, Cisco’s NGO partner Indus Action will leverage digital tools to enhance the implementation and monitoring of Right To Education (RTE) Act programs related to inclusive education.

In 2016, Cisco invested in the State of Gujarat by setting up an Internet of Things (IoT) Innovation hub to develop and customize digital technologies and solutions with the International Centre for Entrepreneurship and Technology (iCreate) and helped implement a Smart City project in the Gujarat International Finance Tec-City (GIFT City). Cisco also set up networking academies in 11 ITIs and trained over 2000 students in digital skills over the last 12 months.

Shri. Vijay Rupani, Honourable Chief Minister, Gujarat, said,

L-R: Shri. Vijay Rupani, Honourable Chief Minister, Gujarat; Michael Timmeny, Senior Vice President and Chief Government Strategy Officer, Cisco; Harish Krishnan, MD, Public Affairs and Strategic Engagements, Cisco India & SAARC; Anil Nair, Managing DirectorCDA, Cisco India & SAARC

“We are committed to make the state of Gujarat a leader in the digital economy and bring benefits of digitization to its citizens. The partnership with Cisco is a step towards this direction and enables our dream of a better quality of life for the people of Gujarat. As one of the fastest growing states of the country, Gujarat has always focussed on developing the skills of its people. Through investing in the talent of its people, Gujarat ensures its path towards economic growth and sustainable prosperity.”

Michael Timmeny, Senior Vice President and Chief Government Strategy Officer, Cisco, quoted, “This partnership is aimed at bridging the digital skill-gap in the country and enabling citizens to become technology innovators and problem solvers of the future. Through its digital education initiatives, Gujarat is fostering an environment to make collaboration and innovation possible, and Cisco is a proud partner.”

VERIZON GETS VNO LICENSE IN INDIA

58

Verizon India announces that the company has been accolade with Unified License for Virtual Network Operator (VNO) Internet Service Provider (ISP).

Extended by the country’s Department of Telecommunications, the VNO license allows Verizon to re-sell internet services from other telecommunication service providers in India.

This, in turn, will enable Verizon’s enterprise customers to take advantage of the company’s entire suite of Managed Network Services - including Software Defined Networking (SDN) and Virtual Network Service

BISINFOTECH // MARCH 2019

(VNS) bundles - with internet connectivity directly sourced from local providers.

The addition of a VNO License extends Verizon service offerings to its enterprise customers which already includes National and International Long Distance (NLD/ILD) services and Internet Services Provider (ISP) License.

“We are grateful to the Department of Telecommunications for the license which will allow our customers to speed up their network deployments by allowing us to offer a full end-to-end managed service experience which includes internet

connectivity. A robust virtual network is the backbone of any business transformation and the proliferation of virtual networks will further help India achieve its goal of a Digital India by enhancing connectivity across the country,” commented Robert Le Busque, Managing Director of Verizon’s Australia, New Zealand and India.

India opened up the resale of its telecom services market through the introduction of VNO’s in 2016. VNO’s are service delivery operators, who rely on the network and support of local infrastructure providers for telecom services to end users / customers.

UPDATES NETWORKING

WHAT'S THE STATE OF 5G DEPLOYMENTS WORLDWIDE? VIAVI Solutions has revealed new industry data demonstrating just how quickly 5G networks are rolling out worldwide, with 55 commercial 5G networks expected to be live before the start of 2020 — the year that 5G was originally expected to debut. As an indicator of the pace of commercialization, VIAVI has renamed this report – now in its third year – The State of 5G Deployments.

A total of 13 commercial 5G networks were launched during 2018, including both mobile and fixed wireless deployments. As the race to deliver 5G rapidly escalates, VIAVI findings indicate that deployments will more than triple this year, with 42 new network launches anticipated in 2019.

As a result, a total of 55 live 5G networks are expected to be in service by the end of this year. A large proportion of these deployments will be located in Europe and the Middle East (21 and 14,

respectively), followed by 10 in Asia, 8 in the Americas and 2 in the Australasia region.

The pace of commercial deployments is a clear indication of the competition to offer 5G services. At this time last year, only 28 service providers had reported that they were in field trials with 5G architecture. This rapid escalation of deployment plans comes in spite of the fact that 3GPP standards for 5G are not expected to be final until 2020. Thus, even though the schedule for network launches has accelerated, service providers need to be careful about finalizing architectures, and detailed technical information about deployment plans is still limited at this point.

“5G represents a paradigm shift in the way that networks are designed, deployed and managed, introducing inherent complexities in the architecture

as well as exacting demands on performance and latency,” said Sameh Yamany, Chief Technology Officer, VIAVI. “The anticipated improvements that 5G offers will depend on precise operation of multiple elements throughout the network. As service providers worldwide deploy and activate their commercial networks, they are relying on VIAVI 5G test solutions, from the lab to the field, to ensure optimal customer experience and quality.”

The data was compiled from publicly available sources for information purposes only, as part of the VIAVI practice of tracking trends to enable cutting-edge technology development.

The State of 5G Deployments serves as a companion document to the VIAVI Gigabit Monitor, a visual database of gigabit internet deployments worldwide.

ERICSSON COMMUNICATIONS BROADBAND NETWORKS • Industry digitalization and modernization of the land mobile radio (LMR) communications is driving demand for critical broadband network solutions • New portfolio comprises Critical Network Capabilities, Critical Broadband Applications, and Flexible Deployments for Private Networks • Enables service providers to meet critical communication needs in industries such as public safety, energy and utilities, transportation, and manufacturing Ericsson has launched its critical communications broadband portfolio for service providers. This will enable service providers to meet the business-critical and mission critical needs of industries and public safety agencies as digitalization and modernization of *land mobile radio communications increases.

To meet critical communications users’ needs, Ericsson has developed a new portfolio comprising three offerings: Critical Network Capabilities; Critical Broadband Applications; and Flexible Deployments for both local private networks, and nationwide mission-critical LTE networks.

Per Narvinger, Head of Product Area

Networks, Ericsson, said, “We see growth opportunities for service providers and government operators by addressing new segments with LTE/5G networks. Our critical broadband portfolio will enable our customers to effectively secure the critical communication needs of sectors such as public safety, energy and utilities, transportation, and manufacturing.”

Critical Network Capabilities This offering includes advanced features for critical network performance and covers the following: high network availability; multi-network operation with spectrum sharing techniques; and coverage and capacity for critical applications. It also includes network security capabilities that ensure network services are maintained even when the infrastructure is under attack. Finally, quality of service, priority and preemption all guarantee latency performance and capacity requirements during high load and congestion.

The critical network capabilities include new features that simplify the rollout of broadcasting services across nationwide areas. Another new feature enables

radio access sites to operate in fall-back mode, should the network connection fail. This offering also includes deployable systems that allow temporary coverage for disaster recovery and operations in rural areas without existing coverage.

Critical Broadband Applications This offering covers Ericsson Group-Radio that provides mission-critical push-to-talk, data and video services. This will enable, for example, blue light personnel such as the police to be more effective in performing community services that require advanced mobile broadband.

Flexible Deployments for Private Networks New business models are emerging for industries. From owning and operating their own networks, critical industries are now procuring private networks and services that leverage service providers’ existing network assets and operations – without compromising required local control.

Ericsson’s flexible deployments for private networks range from network slicing to fully dedicated networks, enabling service providers to offer scalable, critical broadband network solutions and services for critical industries.

59

BISINFOTECH // MARCH 2019

EVENT LIST NAME, DATE &VENUE

TOPIC

CONTACT DETAILS

INDIA SMART UTILITY WEEK 2019 MARCH 12-16, 2019 MANEKSHAW CENTRE, NEW DELHI

INTERNATIONAL CONFERENCE & EXHIBITION ON SMART UTILITIES FOR SMART CITY

Website : www.isgw.in E-mail : isuw@isuw.in

IESS INDIAN ENGINEERING SOURCING SHOW MARCH 14-16, 2019, CHENNAI TRADE CENTER, CHENNAI, TAMIL NADU, INDIA

INTERNATIONAL TRADE FAIR FOR MECHANICAL ENGINEERING

Website : www.iesshow.in E-Mail : eepcho@eepcindia.net

SEMICON CHINA 2019 MARCH 20-22, 2019, SNIEC, SHANGHAI, CHINA

INTERNATIONAL TRADE FAIR FOR SEMICONDUCTOR TECHNOLOGY

Website : www.semiconchina.org E-mail : semichina@semi.org

ELECTRONICA CHINA MARCH 20-22, 2019 SNIEC, SHANGHAI, CHINA

INTERNATIONAL TRADE FAIR FOR ELECTRONIC COMPONENTS, SYSTEMS AND APPLICATIONS

Website : www.electronicachina.com E-mail : tanja.stuermer@messe-muenchen.de

ELTEFA STUTTGART MARCH 20-22, 2019 STUTTGART

TRADE FAIR FOR ELECTRICAL ENGINEERING AND ELECTRONICS

Website :www.messe-stuttgart.de E-mail : info@messe-stuttgart.de

CEF CHINA ELECTRONICS FAIR APRIL 09-11, 2019 SHENZEN, CHINA

INTERNATIONAL ELECTRONICS FAIR

Website : www.icef.com.cn E-mail : cefinfo@ceac.com.cn

AERO APRIL 10-13, 2019 FRIEDRICHSHAFEN GERMANY

INTERNATIONAL TRADE FAIR FOR GENERAL AVIATION

Website :www.aero-expo.com E-mail : datenschutz@messe-fn.de

GLOBAL SOURCES CONSUMER ELECTRONICS SHOW APRIL 11-14, 2019, HONG KONG

TRADE FAIR FOR ELECTRONIC PRODUCTS AND ACCESSORIES

Website : www.globalsources.com E-mail : visit@chinasourcingfair.com

HONG KONG ELECTRONICS FAIR APRIL 13-16, 2019 HONG KONG

INTERNATIONAL TRADE FAIR FOR ELECTRONIC PRODUCTS AND SERVICES

Website : www.hktdc.com E-mail : exhibitions@hktdc.org

NEPCON CHINA APRIL 24-26, 2019 SHANGHAI

EXHIBITION ON SURFACE MOUNT TECHNOLOGY AND ELECTRONICS

Website : www.nepconchina.com/en E-mail : Daniel.wang@reedexpo.com.cn

PCIM EUROPE NUREMBERG MAY 07-09, 2019 NUREMBERG

INTELLIGENT MOTION, RENEWABLE ENERGY, AND ENERGY MANAGEMENT

Website :www.pcim-europe.com E-mail : info@mesago.com

SMART CITIES INDIA 2019 EXPO MAY 22-24, 2019 NEW DELHI, INDIA

DEVELOPING SMART CITIES FOR OUR CITIZENS

Website :www.smartcitiesindia.com E-mail : aruns@eigroup.inm

ENGINEERING EXPO MAY 24-26, 2019, AUTO CLUSTER EXHIBITION CENTER, PUNE, MAHARASHTRA, INDIA

INTERNATIONAL TRADE FAIR FOR MECHANICAL ENGINEERING

GUANGZHOU ELECTRICAL BUILDING TECHNOLOGY JUNE 09-12, 2019, GUANGZHOU, CHINA

ELECTRICAL ENGINEERING, BUILDING AND HOME AUTOMATION

Website : guangzhou-international-lighting-exhibition. hk.messefrankfurt.com E-mail : lucia.wong@hongkong.messefrankfurt.com

CHINA ELECTRONICS FAIR CHENGDU JULY 11-13, 2019 CHENGDU, CHINA

INTELLIGENT MANUFACTURING. CIVIL-MILITARY INOSCULATION. ELECTRONIC COMPONENTS

Website : www.icef.com.cn E-mail : cefinfo@ceac.com.cn

AUTOMOTIVE WORLD SEPTEMBER 05-07, 2019 PORTMESSE NAGOYA, JAPAN

TECHNOLOGIES SUPPORTING THE EVOLUTION OF CAR ELECTRONICS EXHIBITED TOGETHER

Website :www.automotiveworld-nagoya.jp E-mail : car-nagoya@reedexpo.co.jp

NEPCON NAGOYA SEPTEMBER 18-20, 2019 PORTMESSE NAGOYA, JAPAN

ELECTRONICS DEVELOPMENT / IMPLEMENTATION EXHIBITION

Website :www.nepconjapan-nagoya.jp E-mail : visitor-eng.inw-n@reedexpo.co.jp

ELECTRONICA INDIA SEPTEMBER 25-27, 2019 GREATER NOIDA, INDIA

INTERNATIONAL TRADE FAIR FOR ELECTRONIC COMPONENTS, SYSTEMS AND APPLICATIONS

Website :electronica-india.com E-mail : info@mm-india.in

ELECTRONICASIA OCTOBER 13-16, 2019 HONG KONG

ELECTRONIC COMPONENT & TECHNOLOGIES

Website : www.enggexpo.in E-mail : info@enggexpo.in

Website : m.hktdc.com E-mail : hktdc@hktdc.org

AIRTEC MUNICH OCTOBER 14-16, 2019 MUNICH

AEROSPACE MEETS AUTOMOTIVE – INNOVATIONS IN MOBILITY

Website :airtec.aero E-mail : airtec@demat.com

EMOVE 360° MUNICH OCTOBER 15-17, 2019 MUNICH

TRADE FAIR FOR MOBILITY 4.0 – ELECTRIC, CONNECTED, AUTONOMOUS

Website :www.emove360.com E-mail : info@munichexpo.de

CHINA ELECTRONICS FAIR SHANGHAI OCTOBER 30- NOVEMBER 01, 2019 SHANGHAI

EXHIBITION OF ELECTRONICS AND INFORMATION INDUSTRY IN CHINA

EP CHINA SHANGHAI NOVEMBER 05-07, 2019 SHANGHAI

INTERNATIONAL TRADE FAIR FOR ELECTRONIC COMPONENTS, SYSTEMS AND APPLICATIONS

Website : www.epchinashow.com E-mail : power@adsale.com.hk

SEMICON EUROPA MUNICH NOVEMBER 12-15, 2019 MUNICH

INTERNATIONAL TRADE FAIR FOR SEMICONDUCTOR TECHNOLOGY

Website :www.semiconeuropa.org E-mail : semiconeuropa@semi.org

PRODUCTRONICA MUNICH NOVEMBER 12-15, 2019 MUNICH

INTERANTIONAL TRADE FAIR FOR INNOVATIVE ELECTRONICS PRODUCTION

Website :productronica.com E-mail : info@productronica.de

MODELL + TECHNIK STUTTGART NOVEMBER 21-24, 2019 STUTTGART

THE FAIR AROUND MODELLING AND ELECTRONICS

Website :www.messe-stuttgart.de E-mail : info@messe-stuttgart.de

AUTOMECHANIKA SHANGHAI DECEMBER 03-06, 2019 SHANGHAI

TRADE FAIR FOR AUTOMOTIVE PARTS, ACCESSORIES, EQUIPMENT, AND SERVICES

Website :automechanika-shanghai. hk.messefrankfurt.com E-mail : auto@hongkong.messefrankfurt.com

INDIA INTERNATIONAL ELECTRONICS AND SMART APPLIANCES EXPO DECEMBER 12-14, 2019, DELHI

INDIA INTERNATIONAL ELECTRONICS & SMART APPLIANCES EXPO

Website : www.ieae.co.in E-mail : info@ieae.co.in

CONSUMER ELECTRONICS SHOW JANUARY 07-10, 2020 LAS VEGAS USA

5G AND INTERNET OF THINGS (IOT), BLOCKCHAIN, AUTOMOTIVE

Website : www.ces.tech

EMBEDDED WORLD FEBRUARY 25-27, 2020 NUMBERG , GERMANY

EMBEDDED TECH

Website : www.embedded-world.de

don't compete with rivals, make them irrelevant

Website : icef.com.cn E-mail : cefinfo@ceac.com.cn

India's No. 1

B2B Media on Industrial Tech

60

BISINFOTECH // MARCH 2019

www.bisinfotech.com

FEBRUARY 2019|` 80

BISinfotech Gospel Of Industrial Tech

S E M I C O N D U C T O R | T & M | L E D | A & D | S E C U R I T Y | C L O U D & D ATA | T E L E C O M

R F PHASED ARRAYS TRANSCEIVERS BEAMFORMING

SECURING EMBEDDED SYSTEMS IN INDUSTRIAL

ENVIRONMENTS POWER MANAGEMENT FOR ENERGY HARVESTING SYSTEMS

‘HACK’ TO STAYING

SECURE IN 2019

SUBSCRIBE India's Premier MAGAZINE ON

ELECTRONICS &

TECHNOLOGY INLAND SUBSCRIPTION RATE FOR

BISINFOTECH

Price

Number of Issue

1 Year 2 Years 3 Years

950/1900/2800/-

Ask your office/corporate communication to subscribe it for you.

BISInfotech will keep you updated with latest news, design, opeds, veterans and policy befitting the global trends.

Name:

Email:

Job Title:

Subscriber's Mobile:

Department:

Your Tel:(Off) with code

Company:

Subscription Duration: 1 Year 2 Year

3 Year

My Cheque/DD No.:

Dated:

Address: City:

State:

Pin no.:

For `:

(RES) with code

Drawn on:

Please make the Cheque/DD in favour of

SAUR ENERGY INTERNATIONAL TO PAY THROUGH PAYTM /CREDIT /DEBIT CARD/ ONLINE LOG ON TO:

https://www.subscriptions.bisinfotech.com/ Kindly Send At This Address: C - 133, 3rd Floor, Lajpat Nagar - 1, New Delhi - 110024

Terms & Conditions: This is a limited period offer. Please write your name and address on the reverse side of the cheque or DD. Please allow 3-4 weeks for processing of your subscription. All outstation cheques should be payable at par. Saur Energy International will not be responsible for postal delays, transit losses or mutilation of subscription form. 1st copy will be dispatched by premium courier service and rest will be delivered by ordinary post only. Please include pincode for prompt delivery of your copy. All disputed shall be subjected to the jurisdiction of competent courts in Delhi only.

bis-TI Numbers Iso.pdf

1

13/2/2019

5:59 PM