Bisinfotech Magazine March 2020

A FULL SPECTRUM OF RF E XPERTISE The future holds unforeseen challenges. Lowest latency communications can help overcome the toughest challenges.

Analog Devices’ system-level expertise in RF, microwave and millimeter wave technology helps unlock the entire wireless spectrum, and the opportunities that come with it.

Learn more at analog.com/RF.

ANALOG.COM/RF

Editorial How coronavirus will affect the Global HighTech Industry?

Less consumption, idle factories, broken global supply chains. It's not just the Chinese economy that is suffering from the spread of the coronavirus — but the moment of truth is yet to come.

The coronavirus epidemic is spreading further in China.

Around 45 million people in the Chinese province of Wuhan are cut off from the outside world. As a precaution, Beijing had given the financial system an unusually high injection of 1.2 trillion yuan (€156 billion, $171 billion) to keep the domestic money market and banking system functioning. In addition, import duties on goods that are important in the fight against the disease were eased.

Supply chain disruptions

The outbreak of the coronavirus is meanwhile rippling through the global manufacturing supply chains, affecting all the industries. The entire semiconductor and electronics industry is heavily in short on supplies.

Executives of industry suppliers warned that plants in other continents were just weeks away from being forced to close. The entire industry depends on a global network of suppliers, with parts originating from China often passing through companies in several countries before being built into complete equipment.The fabless operations of IC design lead to less demand on direct labor, compared to foundries and OSAT companies; consequently, the IC design industry has not been as affected by the outbreak as other semiconductor industries. Also, in recent years EDA companies and foundries have been expanding their cloud-based design and verification environments; through these cloud-based environments, IC designers may be able to compensate for operational and output deficiencies

CONSULTANT EDITOR NILOY BANERJEE niloy@bisinfotech.com SUB EDITOR NITISHA DUBEY nitisha@bisinfotech.com MARKETING MANAGER ARNAB SABHAPANDIT arnab@bisinfotech.com DESIGN HEAD DEEPAK SHARMA

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WEB DEVELOPMENT MANAGER JITENDER KUMAR WEB PRODUCTION BALVINDER SINGH SUBSCRIPTIONS PRIYANKA BHANDARI priyanka@bisinfotech.com MANAGER FINANCE KULDEEP GUSAIN accounts@bisinfotech.com

involved in having their employees work from home.

Whether they are successful in doing so depends on the IC designers’ magnitude of capital expenditure and degree of integration for cloud services.

The largest concentration of the fibre optics supply chain can be found in Wuhan, home to Fiberhome, YOFC, and Accelink, among other companies, which together comprise 25% of the global optical fiber production capacity. 5G base stations place higher demand in both the quantity and quality of optical fiber cables, with 5G optical fiber demand estimated at double that of 4G. Let’s hope for the best and continue to make our future more secure and developed.

ManasNandi

MANAS NANDI EDITOR manas@bisinfotech.com

Bisinfotech is printed, published, edited and owned by Manas Nandi and published from 303, 2nd floor, Neelkanth Palace, Plot No- 190, Sant Nagar,East of Kailash, New Delhi- 110065 (INDIA), Printed at Swastika Creation 19 DSIDC Shed, Scheme No. 3, Okhla Industrial Area, Phase-II, New Delhi- 110020 Editor, Publisher, Printer and Owner make every effort to ensure high quality and accuracy of the content published. However he cannot accept any responsibility for any effects from errors or omissions.

The views expressed in this publication are not necessarily those of the Editor and publisher. The information in the content and advertisement published in the magazine are just for reference of the readers. However, readers are cautioned to make inquiries and take their decision on purchase or investment after consulting experts on the subject. BisInfotech holds no responsibility for any decision taken by readers on the basis of the information provided herein. Any unauthorised reproduction of Bisinfotech magazine content is strictly forbidden. Subject to Delhi Jurisdiction.

Contents 08 Smart Gas Meters

12 Power Solutions

ATEX AND THE POWER MANAGEMENT OF SMART GAS METERS

MORNSUN OUTSTANDING POWER SOLUTIONS FOR IOT SYSTEMS AND DEVICES

14 5G- NEW REPORTS ASSERTS RAPID SURGE IN THE SPREAD OF 5G

20 WIRELESS SENSING NODE- RAPIDLY

PROTOTYPE AND DEBUG A WIRELESS SENSING NODE USING A SINGLE PLATFORM

28 SMT- HOW TO TAKE YOUR SMT PRODUCTIVITY TO NEW HEIGHTS

34 INTERVIEW- TELEWORLD AND SAMSUNG

WILL BE ORIENTED TO INDUSTRY CONNECT AND/ OR SMART CITY B2B PRIVATE NETWORKS

38 DECENTRALIZED 48-V POWER- SOLVE

AUTO ELECTRIFICATION CHALLENGES WITH A DECENTRALIZED 48-V POWER

42 IOT IN AGRICULTURE - IOT IN AGRICULTURE AND FARMINGNEEDS

46 5G- 5G WILL BE A GAME CHANGER FOR

TELECOM OPERATORS: OUR PREDICTIONS FOR 2020

50 IP THEFT- ANOTHER GLOBAL PANDEMIC WE’RE NOT TALKING ABOUT: THEFT OF IP

54 T&M- ROHDE & SCHWARZ ENHANCES TEST INSTRUMENTS PROMOTION

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16 INDUSTRY 4.0- A PERFECT SOLUTION FOR

COMMUNICATIONS IN PROCESS AUTOMATION— HOW ANALOG DEVICES’ FIDO5000 PREPARES JUMO FOR INDUSTRY 4.0

24 HARDWARE SECURITY- IOT NODES NEED SIMPLIFIED HARDWARE SECURITY IMPLEMENTATION

32 5G TESTING- 5G FUELS INNOVATIONS IN RF TEST & MEASUREMENT

36 INDUSTRY 4.0- THE IMPACT OF INDUSTRY 4.0

41 EV- WRITTEN BY UJJWAL BHARDWAJ, FOUNDER, ELECTRIFUEL PRIVATE LIMITED

45 SMART HOME APPLIANCES- 3 WAYS

TO PROTECT IOT SMART HOME APPLIANCES FROM CYBER ATTACKS– IEEE

48 INDUSTRY UPDATES- ARM TO

DEMONSTRATE ITS SPECIALITY AT MWC 2020

51 AUTOMOTIVE- TOYOTA AND PANASONIC PARTNER TO SPECIALISE IN AUTOMOTIVE PRISMATIC BATTERIES

55 IOT- SIEMENS’ MINDSPHERE CONTINUES INDUSTRIAL IOT MOMENTUM

STEP 3

STEP 1

Build-to-order not an option?

Search our inventory.

STEP 2 Not in inventory?

Smart Gas Meters

ATEX and the Power Management of Smart Gas Meters The article has been contributed by Texas Instruments

Smart meters have become very reliable and practical in the last decade. As their increasing ability to provide real-time data monitoring, advanced alarms and remote operation led to greater global demand, so too arose an equivalent demand for ultra-low-power electronics.

Smart meters need to keep their power-consumption levels as low as possible, but that poses a challenge for electronics suppliers. For example, one requirement for smart gas meters is 10 years of battery life. Smart meters are also expected to reliably function in extreme environments and weather conditions. Gas meters function in an explosive atmosphere, so they must include protections to operate safely.

ATEX, derived from the French phrase “ATmosphère Explosive,” is another name for European Directive 2014/34/EU, which aims to regulate explosion protection in industries that have explosive environments. In this article, I’ll explain how the TPS62840 step-down converter in the DGR package [1] can help system and equipment design teams meet aspects of the ATEX Directive [2] and achieve battery lifetime goals.

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The ATEX certification ATEX is a European Union directive for standardization that covers “equipment and protective systems intended for use in potentially explosive atmospheres.” [2] Explosive atmospheres may occur when flammable gases, vapors, mists or even dust mixed with air accumulate. The ATEX certification aims to minimize or completely eliminate the risk of ignition in such atmospheres and to limit harmful effects in case of an explosion.

Explosive atmospheres are present in various industries. In the chemical industry, chemical processes may create explosive mixtures of combustible gases and liquids. Gas suppliers inherently operate in a potentially explosive environment because gas is flammable. Wood processing companies, waste management companies, energy production companies and refineries also operate partially or fully in environments with explosion hazards. These industries use a lot of electrical and mechanical equipment and the safety of their operation in such environments is always a concern.

There are different equipment groups and categories within

safety requirements for power-management integrated circuits (ICs) in residential gas meters, along with what you have to consider when designing an IC for this application.

How can power design engineers achieve ATEX certification in residential gas meters?

In order to reduce explosive hazards, the ATEX standard considers ignition sources as the most important factor. For power-management ICs, ignition sources are usually: • Electric sparks. The amount of electric energy content of the spark determines its risk as an ignition source.

• High surface temperatures.

• Electrostatic discharge, which cause electric sparks and a sudden increase in temperature.

The probability of any of these three events occurring has to be limited or eliminated to ensure safety. The IC package choice for an ATEX-compliant device is the most important contributor in controlling ignition sources. In general, the parameters that reduce such ignition risks are the IC package’s power dissipation capability and its electrical pinout.

ATEX - depending on the environment, the nature of the explosive atmosphere and the frequency of its occurrence.

Table 1 lists the classification of explosive atmospheres caused by mixtures of air and gases, vapors or mists. Residential smart gas meters usually fall in category 3 zone 2, the last row of the table.

Package power dissipation capability Electronic device development has been moving toward smaller and more integrated and compact designs; so have IC packages. These smaller packages pose a challenge when it comes to thermal management, however, especially at high loads. Whereas a quad flat no-lead package (QFN) and a wafer chip-scale package (WCSP) are more suitable for applications where solution size is a priority, larger packages achieve superior thermal performance and keep device temperatures relatively low, even at high loads.

A high thermal performance very-thin shrink small-outline package (HVSSOP) is a thermally enhanced package with an exposed pad soldered directly to the printed circuit board (PCB). The exposed pad increases the power dissipation capability as much as 1.5 times over standard shrink smalloutline packages (SSOP) and thus reduces the device’s operating temperature. A lower self-temperature rise also enables a higher range of ambient temperatures. Figure 2 shows how an HVSSOP device dissipates around 80% of its heat through the exposed pad, with the help of the thermal vias below it. The rest of the heat mainly dissipates through its leads to the ambient environment. [3]

Figure 2: The power dissipation of an HVSSOP device Table 1: Classification of different zones for explosive environments [2]

Although ATEX is European and not harmonized with equivalent American, Canadian or Asian standards, many aspects of the standards are very similar. Let’s review the ATEX intrinsic

Figure 3 shows a thermal image of the TPS62840 in the HVSSOP operating at a 25°C ambient temperature, with an input voltage (VIN) of 6.5 V and an output voltage (VOUT) of 3.6 V at a load (ILOAD) of 750 mA, which is the full load of the device.

The device maintains a maximum temperature of 30.1°C while BISINFOTECH •Vol - 2/03 •March 2020

09

Smart Gas Meters the inductor has a maximum temperature of 32.7°C. These are less than 10°C temperature rises.

Moreover, as shown in Figure 6, the VIN and GND pins are separated by a no-connect pin, which increases their spacing to around 1 mm. This amount of spacing mitigates board-level electromigration risks in humid environments and increases the IC reliability.

Figure 6: The pinout of the TPS62840 in the DGR package Figure 3: A thermal image of the device at a full load

Package electrical pinout In addition to the excellent thermal performance, the electrical pinout and the structure of the package leads are also important. The HVSSOP has a big pitch and thin leads, which enables greater distances between each lead and adjacent leads, and eventually between their PCB land patterns.

Figures 4 and 5 show the package dimensions and its PCB land pattern. You can see that the distance between the pins on the PCB land pattern is about 350 µm. This is suitable for ATEX intrinsic safety protection, which requires more than 300 µm of spacing for zone 2 protection. [2]

Electrical performance In addition to ATEX-compliant features, the TPS62840 in the DGR package has an ultra-low quiescent current (IQ) of 60nA, and can prolong the battery lifetime of devices that rely on it for power management by increasing efficiency at light loads. With modern microcontrollers having different modes and load currents that can go very low to reduce energy consumption, the device still maintains efficiency of 80% at a load of 1 µA, as shown in figure 7. The device also has a wide input voltage range of up to 6.5 V, allowing you to choose different battery technologies (alkaline, lithium-thionyl chloride or lithium-ion) that suit your system best.

Figure 4: The HVSSOP dimensions Figure 7: The efficiency curve of the device vs. the load current at VOUT = 3.6 V

Figure 5: The HVSSOP’s PCB land pattern

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Conclusion The increasing adoption of smart water, heat, gas and electricity meters, along with the safety requirements imposed by the ATEX Directive, present challenges for power-management design engineers. A long battery life of 10 years or more, an ATEX-compliant IC and very efficient performance at different load profiles are a few requirements that this market needs.

With its package’s power dissipation capability and electrical pinout, as well as an extremely low 60 nA IQ, the TPS62840 in the DGR package meets the needs of smart meters and other ultra-low-power systems.

Meeting the demands of modern rail applications

Up to 120W, 10A continuous

Up to 90.8% peak efficiency

Up to 532W/in3 power density

OV, OC, UV, short circuit & thermal protection

Vicor ChiP DCM2322 is the next step in the evolution of rail power The DCM2322 family are isolated, regulated DC-DC converter modules that address the requirements of modern rail applications while building on Vicor’s 20+ years of proven track record in the rail industry. The DCM2322 has a package size of 23 X 22 X 7mm and an array of input voltages that match global rail standards.

Utilizing high frequency, zero-voltage switching (ZVS) topology, the Vicor rail DCM product line delivers power dense products that have high efficiency across the entire input voltage range. vicorpower.com/rail

For more information call 080-22868889 or email kfathima@vicorpower.com

Power Solutions

Mornsun Outstanding Power Solutions for IoT Systems and Devices IoT, or the Internet of Things, is the technology that has allowed everyday objects to connect to the Internet (and to each other) in order to send and receive information. IoT is what allows you to unlock your front door from your smartphone or adjust the temperature of your home from anywhere. We refer to these devices as “smart devices” (smart locks or smart thermostats) because their ability to send and receive data allows them to make intelligent decisions and be controlled without a physical presence.

The Growing IoT Industry Experts predict that there will be 75.44 billion connected devices worldwide by 2025, and the impending introduction of 5G technology will no doubt further increase the demand for IoT-enabled devices. The IoT market itself, which includes hardware, systems integration, software, telecom and data services, is expected to reach $520 billion in 2021, which is more than double the amount spent in 2016. According to Gartner, the sensor market is expected to continue evolving new technology and packaging, which will make it possible

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to find new applications for sensors.

Figure 1. Internet of Things (IoT) connected devices installed base worldwide from 2015 to 2025 (in billions): Source - Statista Powering IoT Applications The sensors and other electronic components that comprise

IoT devices all need the same thing: compact, efficient, and reliable power. All smart systems some form of power input, be

AC/DC converter also powers the system microcontroller through a high-efficiency K78L05-500R3 DC/DC converter that includes output short-circuit protection and a no-load input current as low as 0.2mA. Figure 2.HVAC system Smart Greenhouse Controller Agriculture is another early adopter of IoT smart technology. A

typical example of a smart agricultural farming is a greenhouse controller. The system needs to be able to power a variety of actuators for the control of temperature, moisture, light intensity (shade) and pesticides depending on the inputs from a variety of sensors. These actuators and sensors typically run off as 24V DC supply, but the primary power source is a mains AC supply. The LI120-20B24R2 AC/DC Din Rail converter provides a 24V DC bus for use by the sensors and actuators.

The WRF2405S-3WR2 is 3W DC/DC converter, providing 3kV DC isolation with self-recovering short circuit protection, and supplies 5V for the main control unit and display. it DC/DC converters or AC/DC converters, and there is also a requirement to provide a level of direct communication via RS232 / RS485 or CANBus. Mornsun provides the power solutions that the growing IoT market demands, meeting all the key requirements listed above -- wide voltage ranges, isolation, accurate and stable DC voltage, and compact size. Mornsun’s extensive suite of over 50 different IoT-enabling power products that are appropriate for use in a wide variety of smart applications. The range of products include; • AC DC solutions from 1W to 60W, • DC DC converters from 200mW to 250W • Isolation levels from 1000V to 6000V • RS232/RS485/CANBus controllers Some typical applications of the integration of all these products can be found below.

Figure 3. Agricultural greenhouse controller Mornsun is Your IoT Power Solution Expert The demand for IoT devices is growing, and so is the demand for efficient, compact, and economical power solutions that

Smart Thermostat A smart thermostat is one of the most common IoT-enabled devices in today’s interconnected homes. This device needs power: low cost, compact size, high density , and a very low input current. Not every power supply is suitable for a smart thermostat application. However, MORNSUN has a one-stop solution for this application. The 3W LS03-15B12R2S(dimension: 35x18x11mm) is an ideal AC/DC Converter to provide a DC bus which can then power an optocoupler drive via a B1212S2WR2 2W isolated high-density DC/DC converter. The same

support a wide voltage range. At Mornsun, we not only offer a large portfolio of products to meet your IoT power needs, but many of these products can be customized for your designs.

Contact us today and find out how we can help bring your smart designs to life.

BISINFOTECH •Vol - 2/03 •March 2020

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5G

New Reports Asserts Rapid Surge in the Spread of 5G New industry data is demonstrating a rapid surge in the spread of 5G technology. As of January 2020, commercial 5G networks have been deployed in 378 cities across 34 countries, according to the new VIAVI report “The State of 5G Deployments,” now in its fourth year.

The country with the most cities with 5G availability is South Korea with 85 cities, followed by China with 57, the United States at 50, and the U.K. with 31 cities. In terms of regional coverage, EMEA leads the way with 168 cities where 5G networks have been deployed, Asia is second with 156 cities, with 54 cities covered by 5G across the Americas. Deployments include both mobile and fixed wireless 5G networks.

As the battle for 5G supremacy heats up, VIAVI findings indicate that a number of operators are blanketing the largest population centers, with as many as five communications service providers (CSPs) deploying 5G in cities such as Los

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Angeles and New York.

“For 5G operators there is a heady mixture of optimism and fear,” said Sameh Yamany, Chief Technology Officer, VIAVI. “The optimism is related to a plethora of new commercial applications that could change operator economics for the better, even though they may not feel the commercial impact for some time. The immediate fear is that they will get left behind in the short-term marketing battle by rivals operators if they’re not fast enough in their landgrab.”

Sameh continued, “Nonetheless, very quickly, the overarching driver will change from simply having 5G network availability to having the best 5G networks. Even as operators continue their 5G build-out, they will simultaneously have to shift gears from network validation and verification through to advanced analytics and automated network troubleshooting. The race for the best 5G network has only just begun.”

Industry 4.0

A Perfect Solution for Communications in Process Automation— How Analog Devices’ fido5000 Prepares JUMO for Industry 4.0 THOMAS BRAND

Field Applications Engineer Analog Devices India The shift toward digitization driven by Industry 4.0 and the Industrial Internet of Things (IIoT) can be seen in industrial automation technology.

The production floor is changing. Individual production sites are being networked; they communicate with one another and between different company divisions or even across company boundaries. The effectiveness of overall production can be significantly increased through condition monitoring and optimization of mechanical installations and technical systems. However, this requires constant communication between all participants in the enterprise, whether human or machine, to exchange countless volumes of data and a wide variety of parameters.

Figure 1. An application example of the various participants in a networked factory.

Figure 2. Transformation from a simple analog sensor to a smart sensor. A smart analog sensor includes the complete signal chain and the processing unit.

Where connectivity was once handled relatively simply— the analog sensor signals from the various systems were transmitted to a central controller and digitized there—in the era of Industry 4.0, digitization is shifting toward the sensor.

The implementation of so-called smart, intelligent sensors that

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can be integrated anywhere in a complex network allows them to pass on the digital form of the recorded physical quantities over the network. As shown in Figure 2, apart from the actual measurement parameter sensing, this intelligent sensor unites a major part of the signal conditioning and processing in one housing.

Furthermore, the smart sensors are often already equipped with a bus interface. Through the digitization of the measured parameters, significantly more data can be transmitted and at a faster speed. Another advantage lies in the more robust signal transmission. Through the digital signal transmission, signal changes and interference can be lessened or even completely prevented. In addition, in the ideal case, the bus-enabled sensors can be connected to the network via plug and play, meaning they are automatically detected by the control unit. If one sensor fails, the others continue to function.

However, all of this requires an omnipresent, highly reliable, and real-time-capable network extending from the individual sensors and actuators to the machines and finally to the complete systems. Ethernet—especially Industrial Ethernet—has emerged as a key set of communication standards. Compared with previous field buses, Industrial Ethernet provides decisive advantages such as efficient and synchronous transmission of larger data volumes on a shared transmission medium. In addition, Industrial Ethernet offers the possibility to create the entire communication on a uniform basis, which complements the classical Ethernet with real-time extensions for determinism.

It was precisely for this type of application that Analog Devices launched a real-time Ethernet multiprotocol (REM) switch chip family, the fido5000 family, to the market last year. The family features two TSN-enabled Ethernet ports to realize, for example, line, ring, star, and redundant star network topologies. In addition, any host processor can be connected with the switch chip through its configurable memory bus interface. The flexibility of the fido5000 REM switch allows developers to future-proof their designs despite constantly evolving standards because it supports every current Industrial Ethernet protocol.

Among others, these advantages were realized by the JUMO Group, an internationally operating, German family-run SMB located in Fulda. JUMO develops and manufactures products and system solutions for measurement, control, and analysis of physical and chemical quantities for a

wide variety of industries, including food, air conditioning, mechanical engineering, chemical and pharmaceutical, packaging, and water and wastewater. Everywhere in these industries, a variety of process data must be communicated over large networks. And that’s an ideal application for the fido5000 and the reason why it is used in one of the latest JUMO designs, the DICON touch.

The JUMO DICON Touch The DICON touch is a 2-channel process and program controller that can be visualized via a TFT color graphics screen and can be operated intuitively by touch. Besides providing the RS-422/RS-485 MODBUS® RTU, Ethernet, and PROFIBUS® DP interfaces that were previously available, the latest DICON touch also makes it possible to connect and communicate with a PROFINET controller. This is enabled by its integrated fido5000 2-port switch, which allows simple network topologies to be established. The network application has integrated features that include evaluation of registration data, setup configuration, and web server functionality for online visualization, which are available along with the PROFINET real-time data exchange. Conformity to the PROFINET standard and compatibility with applications from various manufacturers are guaranteed through certification.

Figure 3. The DICON touch 2-channel process and program controller—the first JUMO product that has a PROFINET interface.

ADI and JUMO have a longstanding partnership. Through the acquisition of Innovasic in 2016, ADI was able to expand its Industrial Ethernet portfolio. This makes it possible for ADI to offer its customers access to a series of Industrial Ethernet applications—a fact that has already been demonstrated in the cooperation with JUMO and that has positively influenced the relationship between the two companies.

With JUMO, ADI moved beyond being a supplier of individual components and into the role of being a true design partner.

“With Analog Devices, we gained a competent partner that has supported us extremely professionally in developing the PROFINET interface for our multichannel process and program controller JUMO DICON touch,” said Klaus Otto,

product manager at JUMO GmbH. Such partnerships are a major focus for ADI and will be expanded in the future. What distinguishes ADI in these partnerships is in how the cooperation takes place and the ways in which the respective strengths are used to the benefit of the collaboration. For example, Analog Devices offers its partners comprehensive expertise in the area of Industry 4.0 by addressing the latest technologies and tackling tough challenges at an early stage.

Consequently, ADI has moved beyond what one thinks of as a traditional semiconductor company—ADI pushes the boundaries of silicon technology and invests heavily in software, systems expertise, and expert knowledge. This knowledge is combined with an unsurpassed selection of capabilities that cover the complete signal chain from sensor to cloud. Challenges are addressed at the system level. This accelerates the development process and leads to a shorter time to market for the product. Therefore, competitiveness is increased by starting the next generation of products earlier. ADI helps its partners with what they need—either as a passive partner in the background or as an active partner that contributes its technologies, experiences, and talents to the collaboration.

Specifically in the development of the DICON touch, ADI has a solution for the requirement of designing all devices based on the Ethernet protocol PROFINET. The challenge was to develop a device that was as universal as possible to offer customers a large number of possibilities. The DICON touch was to be developed as a modular, powerful concept: with a simple plug-in card and an integrated PHY for standard Ethernet or, alternatively, with an extended plug-in card with PROFINET functionality. “In the development, we placed special focus on an individual PROFINET solution that was not yet available on the market with such a functional range,” said Klaus Otto. In addition to the fido5000 REM switch chip, the integrated RapID platform was used in the development of the DICON touch. It demonstrates a complete solution based on the fido5000 as an embedded design. It combines the fido5000 switch chip, a communication processor, JTAG interface, and PHYs, as well as different memories like Flash ®, SDRAM, and EEPROM, all on one board. The next generation of this RapID platform will include a more powerful and power-saving ARM® Cortex®-M4 processor as a communication processor, on which additional processes can be implemented depending on the requirements. For the development of the DICON touch, the properties of the existing RapID platform, like the availability of common precertified Industrial Ethernet protocols, were very much in JUMO’s interests. The possibility to download all relevant information on the RapID platform, including circuit diagrams and layout data, considerably reduced development time.

Another interesting feature of the RapID platform, which is also on the DICON touch, is the dynamic, integrated web server that can be used to read or change network parameters as well as input and output data in a very simple way. Also, it is possible to configure the PHY via RMII and I²C interfaces. In addition, the PROFINET module can be updated on startup because the firmware is mirrored on the DICON touch.

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Industry 4.0 thereby one focus of the company’s security developments.

The fido5000- based RapID platform was supplemented with security features that offer key management, secure boot, secure updates, and secure memory access to protect against cyberattacks.

Figure 4. The fido5000-based RapID platform is available as an evaluation kit.

Thus, the RapID platform’s flexible configuration for the DICON touch also enables firmware updates and network access. There were also no limits placed on creativity in the development of the DICON touch. For example, the standard blinking LEDs, an important feature of PROFINET, were not implemented on the electronics. Instead, the complete LCD display of the DICON touch will blink.

Cybersecurity also played a key role in the development of the DICON touch. Cybersecurity for industrial controllers cannot be addressed with a one-size-fits-all solution. Instead, a farreaching approach must be taken based on the risk assessment for the system. As part of its security strategy, Analog Devices concentrates on making all of its Ethernet components as secure as possible. Current Industrial Ethernet and TSN solutions are

Conclusion With the fido5000 family and the RapID platform, ADI offers its partners a perfect solution for their applications so that they will be able to meet future requirements such as real-time capability, reliability, security, etc. In this context, ADI offers its customers not just the pure product but also the possibility of cooperation or support for their development. The advantages of such cooperation have been demonstrated by the example of the new JUMO DICON touch process controller. The project’s success yielded a secure, reliable, and forward-looking solution that was jointly developed within a manageable amount of time.

About the Author Thomas Brand began his career at Analog Devices in Munich in 2015 as part of his master’s thesis. After graduating he was part of a trainee program at Analog Devices. In 2017, he became a field applications engineer. Thomas supports large industrial customers in Central Europe and also specializes in the field of Industrial Ethernet. He studied electrical engineering at the University of Cooperative Education in Mosbach before completing his postgraduate studies in international sales with a master’s degree at the University of Applied Sciences in Constance. He can be reached at thomas.brand@analog. com.

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Wireless Sensing Node

Rapidl y Pr otot y pe and Debug a Wir eles s Se ns ing Node Us ing a Single Platf or m RICH MIRON

Applications Engineer | Digi-Key Electronics From HVAC and factory automation to automotive, medical, and consumer electronics, developers of wirelessly connected sensing devices are continually challenged to iterate quickly and cost effectively, while at the same time meeting evergrowing regulatory, interoperability, and performance challenges. While it’s often tempting to design a wireless sensor product from scratch to differentiate it with respect to performance and size, it’s quicker and more cost effective to use off-the-shelf kits that are designed for rapid prototyping and development, and that have established ecosystems for support and scalability.

Once such platform is Texas Instruments’ LPSTK-CC1352R LaunchPad SensorTag Kit. The kit combines a wireless microcontroller (CC1352R), sensors, multiple wireless interfaces, relatively high performance, and low power consumption—all in a small, compact form factor with a vast and well-proven ecosystem of software and tools support.

This article describes the evolving nature of wireless sensor product design and prototyping, and introduces the CC1352R SensorTag Kit and how to get started with it.

Why use a wireless sensor prototyping kit?

Wireless sensor devices present a tricky problem for designers.

They need to realistically be able to last at least one to 10 years in the field before their batteries need to be replaced in order to minimize maintenance. They also need to be capable of some level of on-board processing and analysis, as doing this as close as possible to the edge of the Internet of Things (IoT) network reduces the amount of data that needs to be exchanged, which in turn reduces power consumption and makes better use of available wireless bandwidth.

Wireless bandwidth presents its own issues, as designers have to choose from among multiple wireless stacks, including Bluetooth, Thread, and Zigbee operating at sub-gigahertz (GHz) frequencies or 2.45 GHz. Each has its own advantages and disadvantages with respect to how it uses available bandwidth, power, and processing resources. Choosing from among them requires careful analysis of the application requirements with respect to data rates, range, number of expected nodes, network topology, latency requirements, duty cycle, power consumption, networking protocol overhead, interoperability, and regulatory requirements.

It’s relatively easy to pick the right interface for a fresh

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“greenfield” deployment; however, it’s often the case in Industrial IoT (IIoT) applications that there are already wireless networks deployed so the designer needs to decide whether to connect directly to other nodes using the same interface, or use another interface that may be better for the application, and then connect the old to the new through a gateway.

These are all application-related decision trees that designers need to work through; but when it comes to prototyping and developing an idea, it’s rarely worth designing an interface from scratch and then choosing an associated processor and sensors, not to mention the investment in time and resources for software development and integration. It’s true that “roll your own” designs can have benefits for ultra-high production volumes for mass-market designs. However, in many cases engineers designing a node for their own factory production line only need a few nodes in order to get data from some motors, a certain point on a production line, or a thermometer—so high volumes aren’t a design requirement.

In such cases, a ready-made kit is perfect.

If higher volumes may be required, off-the-shelf RF modules are available that are pre-certified and regulatory compliant.

These can accelerate prototyping and keep development and deployment costs down, as they come with rich firmware and software support. In these cases, designers still have to piece together the required platform processor, sensors, and associated software elements for each sensor and additional block.

This is okay when the designer already knows which wireless interface they have to use. However, when still in the consideration stage for multiple designs across multiple applications, with legacy and often non-interoperable wireless interfaces, a more integrated, flexible approach to wireless sensor prototyping and development is required.

Sensor Tag: A comprehensive wireless sensor prototyping platform

A better approach is to find an off-the-shelf platform that integrates the core elements of a wirelessly enabled sensing and processing node—with the sensors, software, and ecosystem to support a designer—while still allowing for exploration and differentiation at higher layers of the software development stack. This is what Texas Instruments (TI) offers with its LPSTKCC1352R LaunchPad SensorTag Kit (Figure 1).

Figure 1: The LPSTK-CC1352R LaunchPad SensorTag Kit has everything a designer needs to prototype and develop a wireless sensor application.

(Image source: Digi-Key, based on Texas Instruments material)

The kit is based on TI’s CC1352R multi-band wireless microcontroller (MCU), around which it has added environmental and motion sensors and software—all in a removable enclosure with an external sub 1 GHz swivel antenna, two-wire female-to-female cable, a 10-pin flat ribbon cable for a JTAG connection, and a quick-start guide. Not included, but recommended to go with the kit are TI’s LAUNCHXL-CC1352R1 SimpleLink Multi-Band CC1352R Wireless MCU Launchpad Development Kit as well as two AAA batteries, though the SensorTag can also run off a CR2032 coin cell battery using a special battery holder that can be attached to the rear of the board.

The heart of the SensorTag Kit is the CC1352R multi-band wireless MCU (Figure 2). This is part of the TI SimpleLink MCU platform, which is designed to provide all the building blocks for a secure, low-power connected topology.

Figure 2: TI’s CC1352R multi-band wireless microcontroller meets FCC, CE, and IC certification for dual-band operation at 2.4 GHz and sub 1 GHz and forms the heart of the LPSTK-CC1352R LaunchPad SensorTag Kit. (Image source: Texas Instruments)

The CC1352R microcontroller is FCC, CE, and Industry Canada (IC) certified for dual-band operation at 2.4 GHz and sub 1 GHz, which encompasses Bluetooth Low Energy (BLE), Thread, Zigbee, IPv6-enabled low-power wireless personal area networks of smart objects (6LoWPAN), and other IEEE 802.15.4g physical layer (PHY)-based proprietary protocols, including TI’s SimpleLink TI 15.4-Stack (sub 1 GHz and 2.4 GHz).

Using a Dynamic Multiprotocol Manager (DMM), it is able to run multiple protocols concurrently.

The radio’s receiver has a sensitivity of -121 dBm (decibels referenced to 1 milliwatt (mW)) in the SimpleLink long-range mode; -110 dBm at 50 kilobits/s (kbps); and -105 dBm for Bluetooth at 125 kbps (with an LE coded PHY). The maximum transmit power is +14 dBm in the sub-GHz bands, where it draws 24.9 milliamps (mA), and +5 dBm at 2.4 GHz, where it draws 9.6 mA. The device’s standby current is notable at 0.85 microamps (µA)—with full RAM retention. It is also IIoT ready with a standby current of 11 µA at 105˚C. A designer can play with various standby modes and analog-to-digital converter (ADC) sampling rates to optimize for low power.

The ADC can, for example, be set to sample at 1 hertz (Hz), at which point the system draws 1 µA. The processor at the heart of the CC1352R is based on a 48 megahertz (MHz) Arm Cortex-M4F core supported by 352 Kbytes of in-system programmable flash, 256 Kbytes of ROM for protocols and library functions, and 8 Kbytes of cache SRAM. It supports over-the-air (OTA) upgrades and has an AES 128 and AES 256 accelerator.

Optimized for low BOM

One of the issues RF front-end designers face is the number of additional discrete passive components that are required for filtering, impedance matching, and other functions. These increase the BOM and complicate layout. To simplify the implementation of the CC1352R, TI worked with Johanson Technology to develop a custom integrated passive component (IPC) package measuring 1 x 1.25 x 2 millimeters (mm) that brought the component count down from 23 to three (Figure 3).

Figure 3: Working with Johanson Technology, TI developed an IPC to simplify the implementation of the TI CC1352R that brought the passive component requirement down from 23 to three. (Image source: Digi-Key Electronics, from Johanson Technology material) BISINFOTECH •Vol - 2/03 •March 2020

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Wireless Sensing Node While four sensors come with the SensorTag Kit, if more or different sensors are required, they can be chosen from and quickly added using TI’s BoosterPack LaunchPad plug-in modules. The four sensors that are included with the SensorTag Kit are:

toggle LEDs, read button status, and update the firmware using OTA Download (OAD) capabilities (Figure 5). At this point, designers can also push data to the cloud from the mobile device.

The TI HDC2080 humidity and temperature sensor The TI OPT3001 ambient light sensor The TI DRV5032 Hall effect switch The TI ADXL362 accelerometer The layout and connections to the sensors are shown (Figure 4).

Figure 4: The SensorTag kit comes with sensors for humidity and temperature, ambient light, acceleration, and Hall effect. (Image source: Texas Instruments)

The connectors are LaunchPad compatible so that along with sensors, BoosterPack peripherals such as LCD displays, or even custom circuits can be easily connected.

Getting started with the LPSTK-CC1352R LaunchPad SensorTag Kit

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To get started with the LPSTK-CC1352R LaunchPad SensorTag Kit, download the SimpleLink CC13x2 and CC26x2 software development kit (SDK). This version is validated for Rev. E devices only, so for Rev. C or earlier, use v2.30.00.xx. Once downloaded, go to the SimpleLink Academy where there are step-by-step instructions and examples.

Figure 5: Designers can start experimenting with the LaunchPad SensorTag Kit over a BLE connection to a smartphone or tablet loaded with the SimpleLink Starter app for both iOS and Android platforms.

(Image source: Texas Instruments)

To get sample data quickly, the kit is pre-programmed with a Bluetooth 5 (BLE5) project called Multi-Sensor that connects over a BLE connection to smartphones and tablets that have the SimpleLink Starter app for both iOS and Android. Using this initial connection, designers can start looking at sensor data,

Along with BLE, the LPSTK has two more examples: One uses the LPSTK as a Zigbee light switch; the other uses it as a sensor node in an 802.15.4 network. All three example projects are available in the SDK as follows:

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Multi-Sensor: < simplelink_cc13x2_26x2_sdk install location>\examples\ rtos\CC1352R1_LAUNCHXL\ble5stack\multi_sensor • TI DMM sensor node: \CC1352R1_LAUNCHXL\dmm\ dmm_154sensor_remote_display_oad_lpstk_app • Zigbee switch: \ CC1352R1_LAUNCHXL\dmm\dmm_zed_switch_remote_ display_oad_app

• Connect the two-pin jumper cable to the top pins of RXD and TXD (grey wire to RXD, white wire to TXD) • Connect the other end of the two-pin jumper to pins 12/ RX and 13/TX on the LaunchPad SensorTag (grey to 12/ RX, white to 13/TX) • Connect the LaunchPad to a PC or laptop The full setup should look something like what is shown in Figure 7.

Complementing SimpleLink and the Starter app, TI provides the SysConfig, a unified graphical user interface (GUI) tool for enabling, configuring, and generating initialization code for the various SimpleLink SDK components, including TI drivers and stack configuration for BLE, Zigbee, Thread, and TI-15.4 (Figure 6).

Figure 7: For debug, the SensorTag needs to be connected to the LAUNCHXL-CC1352R LaunchPad development kit using the Arm 10pin JTAG cable and the two-pin UART cable, both supplied in the SensorTag kit. (Image source: Texas Instruments)

Figure 6: Complementing SimpleLink, TI’s SysConfig is an easy-touse collection of graphical utilities for configuring pins, peripherals, radios, subsystems, and other components. (Image source: Texas Instruments)

As with any system design, it’s rare that some degree of debugging is not required. For this stage, the SensorTag is designed to be used with the onboard XDS110 debugger in a LaunchPad development kit (in this case, the LAUNCHXLCC1352R mentioned earlier), hence the inclusion of an Arm 10-pin JTAG cable and a two-wire UART cable. Once connected, these allow for full debug, programming, and UART communication.

To connect the cables follow the steps below: • Disconnect the isolation jumpers on the LaunchPad • Connect the Arm 10-pin JTAG cable to the XDS110 OUT header on the LaunchPad SensorTag • Connect the other end of the Arm 10-pin cable to the JTAG header on the LaunchPad SensorTag

It’s worth noting that because a running image can’t update itself, an incoming OAD image needs to be stored in a temporary location while it’s being received. This temporary location can be reserved in internal flash or off chip. In either case, once the image download is completed, a Boot Image Manager (BIM), which is permanently resident on the SensorTag device, is used to determine if a new image is valid and if it should be loaded and run (based on an image header).

The BIM is particularly useful, for example, in that it allows the designer to revert to the original out-of-box image after an OAD. To do this, hold BTN-1 (left button) on power-up or during a reset and the BIM will revert to the out-of-box image (i.e., Multi-Sensor).

Conclusion While there are many wireless interfaces to choose from when implementing a wireless sensor node, developers don’t have to spend time and resources prototyping for each interface to see which one works best for a given application. Instead, using the LPSTK-CC1352R SensorTag Kit and associated LaunchPad hardware, software, and ecosystem, designers can quickly and easily mix and match interfaces, use one or more simultaneously, and add and swap BoosterPack sensors as needed.

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Hardware Security

IoT Nodes Need Simplified Hardware Security Implementation Deck: An overview of what an IoT node needs for a faster and simpler implementation of robust security.

RAMANUJA KONREDDY Project Engineer, Product Marketing, MCU32 Microchip Technology Inc. The amalgam of ultra low-power computing and connectivity in the Internet of Things (IoT) is at a crossroads. At one end of the spectrum is the promise of design transformation in automotive, industrial, smart home, medical, and more. At the other end is the frequent and regular news of security breaches; ranging from malware that is unleashed leading to Distributed Denial of Service (DDoS) to battery-drain attacks having the potential of jeopardizing the whole premise and promise of IoT. These security breaches of edge devices leave a lot of the vulnerabilities exposed, which is cause for major concern for IoT developers.

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The recent hack of a casino through unprotected IoT nodes is an example of how security breaches can occur. Hackers were able to exploit the vulnerabilities in the connected thermometer of a fish tank in a casino, and subsequently, access the high-roller database of gamblers.

Naturally, this brings us to other IoT systems such as home automation which is extremely vulnerable to such breaches, with thermostats, refrigeration and HVAC systems all interconnected.

Banks and commercial establishments could are also vulnerable to poor-security CCTV connections across data networks.

Figure 1: Physical and remote security threats to an IoT node and

power consumption while adding robust security.

Last but not the least, low-cost IoT node designs require a simple mechanism for the implementation of security that abstracts low-level security details to avoid complexity, does not have steep learning curves and avoids substantial overhead expenses.

Simplifying Embedded Security

their respective Counter Measures, built into embedded systems to protect against the attacks. (Image: Microchip)

Conventional security practices are usually implemented at the server and gateway levels, but power consumption and the small footprint of edge devices can be constraining when adding robust security in IoT node designs. One must not forget that security application development does add significant overhead in terms of design time and cost.

IoT developers can counter various security vulnerabilities while maintaining low power consumption. How? What kind of security framework can be implemented early in the design cycle? And how can low-cost microcontrollers (MCUs) with hardware security features be leveraged to simplify security implementation?

Facets of IoT Node Security

An IoT node design must be robust enough to provide security against communication attacks, malware and physical attacks. To prevent communication attacks or man-in-themiddle attacks, a common practice is to use a crypto module that carries out encryption, decryption and authentication.

Arm® TrustZone® technology restricts access to specific memory, peripheral and I/O components. The MCU is partitioned into trust and no-trust zones and sensitive data is isolated from the non-critical data. Secure boot ensures that the MCU starts up in a known good state, and when implemented with Arm TrustZone, can provide an environment that can help counteract malware.

Physical security of an IoT node can be enhanced with antitampering pins for preventing board-level tampering. . In case of breach of the board or the enclosure, the anti-tampering pins can be programmed to provide multiple responses, including erasing confidential or critical data. But we need to have anti-tampering protection for chips as well, to protect against t cloning and intellectual property (IP) theft.

In addition to the above mentioned aspects, it is essential to establish a hardware root of trust, which can be accomplished with a secure boot and enhanced by a secure key provisioning mechanism.

Today, applications must satisfy several parameters: low power, highly safe and secure, peak performance and must be time and cost-effective. IoT node designers need to strive to strike a balance between low power usage and security. For IoT edge devices running on batteries, power usage is crucial which in turn, demands MCUs that can drastically reduce

An example of an MCU that simplifies the implementation of these security features is the SAM L11 microcontroller, which had security deeply embedded during the silicon design phase itself. It runs at 32 MHz with a memory configuration of up to 64 KB Flash and 16 KB SRAM. To illustrate what developers should look for to introduce security early in the design cycle in MCUs, we’ll take a closer look at four key security elements included in the SAM L11.

1. Immutable Secure Boot The SAM L11 includes a Boot ROM design to facilitate an immutable secure boot. It has an onboard Crypto Accelerator (CRYA) that accelerates AES, SHA and GCM algorithms computation for encryption, decryption and authentication and NIST-compliant TRNG for random number generation.

2. Trusted Execution Environment Arm® TrustZone® technology allows the creation of a secure zone within the SAM L11 which when combined with immutable secure boot, creates a Trusted Execution Environment (TEE) to counteract malware effectively. The TEE enables the IoT nodes to take remedial action whenever they encounter malware. It avoids the downtime of critical functions and helps to significantly improve the reliability of IoT nodes.

3. Secure Key Storage In addition to tamper pins providing protection against board-level tampering, the SAM L11 has an active shield on 256 bytes of RAM that can resist chip-level microprobing and data remanence issues to provide secure storage for volatile keys. It also has a dedicated 2KB of Flash that can be scrambled to store non-volatile keys, certificates and other sensitive data. The secure key storage on the device protects systems from software and communication attacks and provides developers with an option to erase the sensitive data in case of tampering.

Comprehensive Security Solution Framework

The SAM L11 is supported by a Comprehensive Security Solution Framework that provides end-to-end security which spans key provisioning at a secure facility during the silicon manufacturing phase, to implementation of security modules during application development, to remote firmware upgrades anytime during the lifecycle of the device. The framework includes Trustonic’s Kinibi-M security software that abstracts the lower level details of the device’s security features to provide a modular GUI-based interface for designers to choose the relevant security module for their application. For example, the secure bootloader which is provided by this framework eliminates the effort of sifting and sorting through hundreds of BISINFOTECH •Vol - 2/03 •March 2020

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Hardware Security pages of the datasheet on the embedded developers side to create one. Developers can quickly implement secure bootloader to secure their firmware upgrades as the security framework is thoroughly defined. This does 2 things: eliminates the need for training on embedded security and brings down cost and time of development significantly.

The hardware security features deeply embedded within the SAM L11 microcontrollers helps embedded designers carry out key provisioning at Microchip’s secure facility using Trustonic's Root of Trust (RoT) flow.

Figure 2 shows various modules provided by the framework to simplify the security implementation.

Figure 2: End-to-end security solution

A Comprehensive Security Solution Framework helps embedded developers who are new to security, to quickly learn security implementation and reduces overhead expenses. Within no time, developers can easily implement robust security in various application use cases as depicted in the figures below.

The device features picoPower technology, which ensures low-power consumption in active and sleep modes, with industry-leading ULPMark scores certified by EEMBC. It also offers various power saving modes and low-power techniques to provide flexibility, so designers can conveniently implement security without taking a hit on power consumption

Conclusion

IoT edge devices are being connected at an unprecedented rate, far outpacing the rate of security deployed in them.

One of the reasons could be that security is an afterthought in the embedded application space. The other reason could be the limited number of MCUs available in the market that incorporate robust security like the 64 KB Flash or below to meet the price point of constrained IoT nodes.

However, while embedded security vulnerabilities are opening new attack vectors for hackers, a new crop of microcontrollers are simplifying security implementation for IoT node developers which enables them to configure and deploy security features quickly and efficiently, and cost effectively.

Tags: IoT node security, hardware security, security MCU, LoRa, Sigfox, LPWAN, SAM L11, TrustZone, key provisioning, secure boot, secure bootloader, authentication, encryption, hash, AES, SHA, crypto wallet, home automation, industrial IoT (IIoT), battery powered, low power

Resources

● SAM L11 Xplained Pro Evaluation Kit ● SAM L11 Microcontroller Family

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SMT

How to Take your SMT productivity to new heights New paradigms in consumer buying patterns are putting pressure on PCB Manufacturers to become a whole lot more flexible. And although efforts are made to streamline and optimize, the big picture is not changing.

The challenge to become more flexible surpasses manufacturing – it requires the whole business process to change. We’ve uncovered some of the most shocking statistics in manufacturing today which, when viewed as part of an overall business process, are mind-blowing.

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Challenge

Productivity. It's a growing concern for the entire SMT industry. Last-minute customer requests. Increasingly complex boards.

Stock accuracy and inventory issues. And more and more changeovers together with an increasing number of new product introductions. The result, according to one study, is record-low productivity for many operations – often as little as 20%, with as much as 75% overstock. And although most managers are aware of these facts, they've felt powerless. Until now. Initiatives like Industry 4.0 and Smart Factory are high on the agenda for many companies.

Solution

To be successful in today's fast-paced electronics industry, you need to be able to handle it all – from smaller batch sizes and increasing board complexity, and a wide variety of advanced ICs with I/O counts increasing by the minute, to chip components barely visible to the naked eye. From innovative feeder technology and automated traceability systems, to comprehensive software solutions covering the entire chain of electronics assembly, Your SMT machine partner should offer one integrated solution, tailor-made for today's complex production environment. They should bring their passion for innovation to any type or size of production. These machines should help you improve the visibility of your planning, and provide accurate stock levels in real time and supply the technology to build the most complex boards with perfect accuracy and solder joints of unsurpassed quality. These systems should help you proactively replenish your assembly lines, and the material

JUKI AUTOMATION SYSTEMS JUKI Automation Systems supplies leading SMT assembly solutions for the Electronic Industry throughout the world. Their customers typically have their roots in EMS – Electronic Manufacturing Services, Automotive as well as Industrial and Consumer Electronics. JUKI Automation Systems is pioneer in introducing modern, modular placement and in doing so presented the first placement machine to the market in 1987. JUKI Automation Systems GmbH is part of the JUKI Corporation – a market-listed Japanese company with almost 6,000 employees in the business areas of electronic assembly systems and sewing machinery. The company has its headquarters in Nuremberg, Germany and surmises the central logistics hub for Europe, the Middle East and Africa. We pride ourselves with our renowned 3-year warranty on JUKI systems as well as providing comprehensive customer service thanks to our technical 24-hour-hotline.

handling software keeps track of every for current and future enchantments and reel, making sure your machines never accuracy with repeatability.

If you are planning to setup a new SMT stop due to a missing component.

Placement equipment’s are the most production line it is recommended to make a detailed set of questioncritical & important chunk of SMT naire of planned production line configuration. ApproxiMycronic requirements. This will help mately half of the cost to narrow down your list of total investment is and help to make a needed to acquire purchase decision pick and place Mycronic is a Swedish high-tech for best suited machine with company that has been active in equipment selecfeeders to setup the electronics industry for more than tion to meet your a surface mount 40 years. This global organization with specific needs. production lines. subsidiaries, agents and distributors

supports industry leaders in more than 50 1. Speed countries. Mycronic’s global footprint The speed of comensures that they have a deep ponent have direct market understanding and can impact on your provide rapid support for all our Selection of a pick production quantity. customers who rely on an efficient production. and place machine is a The placement speed very complicated process of machine measured in that demands a lot of reserch and component per hour placement home work to meet your production re- (CPH). quirements. Choice of machine depends Component placement rate impacted on your PCBA types and number of parts by the board size, types of components to be placed, production volume needs and feeders used. If the board size is bigger and types of components are more, the placement head will have to travel FUJI Corporation more distance and due to that placement rate will get decreased.

Since its establishment in 1959, Fuji Corporation The makers of pick and place equiphas used its guiding precept and the company ment’s rated their machine speed motto to help break through many barriers and based on IPC 9830 standard. But in real continue journey, maintaining the leadership scenario manufactures quoted speed position in Surface Mount Technology. With its "World-First" and "Industry-First" de-rated by 30 to 40% that needs to be technologies, Fuji Corporation develops and manufactures SMD placement machines considered. So before finalizing suitable with unparalleled reputation, quality, durability and reliability. Fuji Corporation has placement machine you must consider become the world's largest supplier of SMT placement equipment. This foresight and innovation have kept Fuji on the leading edge of SMT development and the production volume to cater your achieving with its solutions: current needs and also it is critical to Lowest Cost of Production.Highest Life Span of the machines. consider future demands to meet speSustained Accuracy and repeatability over period of time. cific needs.

Best ways to select SMT pick and place machine

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SMT 2. Type and size types tape feeders. But in actual cases Hanwah Considering your production needs, your larger components in tape and reel selection of equipment also depend upon and parts supplied sticks tubes occupy the type and size of components you are multiples of 8mm slots. The components After developing the first Chip mounter planning to place. Each machine have supplied in bulk and waffle packs affects in 1989, Hanwha Precision Machinery their limitations for handling the maxiinput slots requirements directly. has become a leading worldwide mum and minimum size and While doing in-house study it Panasonic Smart Factory solutions provider, weight of component is important to take into offering Surface Mount Technology in tune to machine consideration that how (SMT) mounters, semiconductor specifications. For many types and Panasonic System Solutions Company equipment, insertion and assembly example equipnumber of comof North America – Process Automation automation equipment, Machine ment needed ponents needed operates under the Panasonic Corporation - a Tool, Collaborative robots, industrial to place 0805, in product asglobal manufacturing leader known worldwide automation equipment, and 1206 etc. s e m b l y a n d for innovation and quality. Comprised of over 500 integrated software solutions. We do loaded accordingly companies, Panasonic manufactures and markets this to develop customer-oriented componumber of a wide range of products for business, industrial, and consumers; thereby enhancing and enriching lifestyles solutions that deliver greater efficiency, nents are feeder slots throughout the world. Effective manufacturing starts with machine versatility, and value. different processes, equipment, parts and software. Solutions are that can should have needed to drive throughput and efficiency as well handle 0402, for specific as maximize your ROI. No matter if you’re high mix/ 0603, BGA, jobs. in market have different software interlow volume, low mix/high volume, or anywhere in between, Panasonic equipment, MES CSP and other faces. Some of them are user-friendly and software, and other services can improve odd shaped 4. Accuracy & Re- easy to operate but some require more throughput and efficiency while components. peatability time in manual data entry and making keeping quality reliably high.

So the selection of your As per experts recom- it difficult in editing and optimisations. machine benchmark will mendations the accuracy So it is an important criteria for selection be based on the fact that it will of pick and place that you are of equipment which should be easy to handle different components parts that searching must have an acprogram and edit to keep setup needs to be accurately placed on board curacy of +/-.001” with a time low while improving ASM proper vision aliment for cantering and fine pitch lead of 12 the performance. inspection of larger components sizes. mil repeatability.

Depending upon the production vol- However low cost 7. Support and Digitalization is changing everything. As umes it is advised to invest in 2 different machine would training the world's largest supplier of best-in-class placement machines in SMT line to meet not give such an Apart from techequipment and technological process partner capacity for different components types. accuracy. nical features, for the electronics industry with almost 15,000 support and employees, ASM today supports electronics 3. Feeder slots and maximum feeder 5. Solder Paste training also manufacturers all over the world in setting up their Integrated Smart Factory. capacity and adhesive plays a very ASM want to help make the world a better, safer, The machine manufactures benchmark dispensing important role more comfortable and more sustainable place. the feeder slot capacity based on 8mm Many pick and in machine seTo this end, ASM offers customers complete, place equipment lection.

In case networked and highly integrated hardware Autotronik suppliers offer opif the machine and software solutions and are at their side as a competent, long-term partner tions that can place goes down you are when it comes to setting up components and able to get support to Smart Factories. dispense solder paste or trouble shoot machine Autotronik is a global company with glue with common XY table. quickly to meet supply chain approximately 200 employees. They For low production volume, buildrequirements. are your specialist for SMD stencil ing prototypes or PCB assembly in which Suppler must have a skilled manpower, printer, pick and place machines you do not want to invest for dedicated availability of spare parts shipment on and reflow ovens of low-to mediumstencil or foil it is advised to buy a place- timely basis, support to trouble shoot Series and complete SMT production ment machine with dispending capabil- machine on phone calls and if required lines. Autotronik’s global commitment ity. But the selection must be based on service engineers are available on a very allows them to bring together the the volume requirements as same head short notice also. best components of all continents needs to use both operations that slower Before finalizing your supplier it is better to into an outstanding product. Thus, down the through put. talk to several companies having equipAutotronik is able to use techniques that find otherwise only in large series ment’s that you are searching and try to machines use.

6. Software programming get information how they offer service Different equipment that are available contracts with machines.

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SMT Updates Global Surface Mount Technology (SMT) Equipment Industry Poised to reach over US$2.7 Billion by the year 2025, High-Speed Placement Equipment will bring in healthy gains adding significant momentum to global growth.

Representing the developed world, the United States will maintain a 7.8% growth momentum. Within Europe, which continues to remain an important element in the world economy, Germany will add over US$91.6 Million to the region’s size and clout in the next 5 to 6 years. Over US$94.6 Million worth of projected demand in the region will come from Rest of Europe markets. In Japan, High-Speed Placement Equipment will reach a market size of US$221.1 Million by the close of the analysis period. As the world’s second-largest economy and the new game changer in global markets, China exhibits the potential to grow at 6.5% over the next couple of years and add approximately US$346.7 Million in terms of addressable opportunity for the picking by aspiring businesses and their astute leaders. Presented in visually rich graphics are these and many more need-to-know quantitative data important in ensuring quality of strategy decisions, be it entry into new markets or allocation of resources within a portfolio. Several macroeconomic factors and internal market forces will shape growth and development of demand patterns in emerging countries in Asia-Pacific. The shifting dynamics supporting this growth makes it critical for businesses in this space to keep abreast of the changing pulse of the market.

Z-AXIS Invests $1Mn in PCB Assembly Equipment

Keltron has Inaugurated New SMT Reflow Facility

Z-AXIS has added more than $1 million worth of equipment for surface mount technology (SMT) printed circuit board assembly (PCBA) manufacturing at its electronics design and contract manufacturing center near Rochester, NY. The equipment, placed into service in December 2019, includes four (4) new MY300 robotic pick-and-place machines from Mycronic Inc. Z-AXIS is the first manufacturer in the eastern USA to install Mycronic’s new MY300HX and MY300EX models, which further advance Mycronic’s signature features of high part placement speed, rapid change-over capabilities, advanced machine vision, and industry-leading control software

Keltron has introduced a surface mount technology (SMT) reflow station at its Karakulam unit in Thiruvananthapuram. The 3.92-crore facility will enable Keltron to carry out soldering/ fabrication work on circuit boards automatically. According to Keltron officials, it will enable the State government undertaking to attract more orders in the space electronics sector Each new SMT assembly line at Z-AXIS features: • A Mycronic MY300HX pick-and-place machine, with rated and provide higher quality electronic packages to clients such as the Vikram Sarabhai Space Centre. The SMT reflow speeds of up to 45,000 parts per hour • A Mycronic MY300EX pick-and-place machine, with speeds station comprises stencil printer, pick-and-place machines, reflow over and dry storage cabins. The machines have been of up to 10,000 parts per hour sourced from Sweden, China and Malaysia. Industries Minister • A Speedline SP710 AVI automatic stencil printer E.P. Jayarajan inaugurated the facility.

• An automatic board feeder • A Pyramax 98 solder reflow oven • A Nordson YESTECH B3 Automated Optical Inspection (AOI) system BISINFOTECH •Vol - 2/03 •March 2020

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5G Testing

5G Fuels Innovations In RF Test & Measurement

PAUL GOWANS Wireless Strategy Director, VIAVI Solutions As operators worldwide deploy 5G networks, the transition from 4G to 5G is generating growth in the test and measurement space for radio frequency (RF) technologies. In fact, recent research suggests that the RF test equipment market will be worth $3.7 billion by 2025, representing a compound annual growth rate (CAGR) of more than five percent.

Advancements in radio technology are key to achieving the 5G vision. However, deploying and supporting complex 5G network architectures is not a simple endeavor. The 5G new radio (NR) standard introduces flexible spectrum usage with scalable numerology, dynamic time-division duplexing (TDD), massive multiple input multiple output (M-MIMO) and beamforming — all of which will create greater challenges in the field for RF engineers to validate, test and optimize the 5G network.

Moreover, while visibility of the radio is important in a 5G mobile assurance and optimization system, it’s only part of the

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story. 5G networks involve more components than previous generations – including network functions in the radio access network (RAN) and core, transport, backhaul, midhaul and fronthaul. In addition, with Multi-access Edge Computing (MEC) and Ultra-reliable Low Latency Communication (URLLC), the RAN is becoming the new core with more intelligence moving to the network edge. Thus, a complete system is needed to facilitate the detection and identification of root causes for failures, impairments, congestion and other issues in any of the components.

To achieve this requires greater visibility for insight into all aspects of the network, including the demand or load on the network, the state of the network configuration and impairments in all the components, and the response of the network in terms of performance. Additionally, the detection, root-cause analysis and resolution of problems requires that all factors are correlated for proper testing. What’s more,

operators will be looking at trends in terms of how a network is behaving over time.

Impact of M-MIMO, Beamforming 5G networks will have much greater capacity and improved resiliency through M-MIMO and beamforming. By focusing the transmitted energy of beams more strategically, spatial variations in RF will become more granular.

The nature of M-MIMO and the separation of the radio into beams translates into radio characteristics that vary significantly over ever shorter distances. As such, it’s vital for operators to determine the suitability of an environment for M-MIMO. A number of factors will determine the appropriate degree of M-MIMO, including the type of deployment, environmental dynamics and how well the beam lock is maintained. As such, operators will need to understand the performance of the radio down to the resolution of individual beams and inter-beam management.

In addition, the benefits of M-MIMO will vary with environmental conditions, and these conditions must be understood as operators determine where to deploy and optimize M-MIMO. As such, the ability to manage cells and their neighbor relationships will give way to managing the way beams interact, with the overall goal of ensuring that inter-beam mobility operates seamlessly with intra-cell, inter-cell, intercarrier and inter-technology mobility. 5G operators will need to determine how these mechanisms are performing, and they’ll need performance metrics down to highly granular location accuracy to troubleshoot and resolve issues. This is a big change for the industry moving from a cell-centric world to a beam-centric world.

Conformance Testing 5G networks also depend upon complex conformance testing for devices and base stations before they’re released to the marketplace. Conformance tests are important for developing a baseline of functionality in user equipment (UE) and base stations, as well as validating transmitter and receiver characteristics and performance. Radio resource management (RMM) and protocol testing are needed for devices, while RF parameters are used as a baseline to test base stations.

Meanwhile, conformance testing for UEs depends upon radio access, demodulation and signaling tests, as well as validation by certification organizations to ensure they comply to the latest 3GPP specifications.

Impact on QoE A key factor to consider when testing 5G is how to assure quality of experience (QoE) for the end user. Unlike with previous generations, however, the end users on 5G networks also will include a significant number of machines in addition to humans. As such, current methodologies for testing and measuring voice, video and data quality to end users needs to be expanded to include massive machine-type communications (mMTC)).

The International Telecommunication Union (ITU) has identified three primary use cases for international mobile

telecommunications 2020 (IMT-2020): enhanced mobile broadband (eMBB), URLLC and mMTC. Each of these use cases demands different ways of measuring QoE, especially in the RAN. This fuels the need for expanded test methodologies that incorporate new parameters with higher frequencies and wider bandwidths. With a beam-centric environment encompassing 3D, Location Intelligence will be even more important, providing granular insight into the RAN, subscribers and services coupled with App-aware data.

As 5G networks grow to support applications like connected cars, network performance will become absolutely crucial.

Delay, jitter and other network issues could result in disastrous results, meaning 5G QoE testing needs to be verifiably traced and transparent to certified international standards bodies, as opposed to proprietary network equipment manufacturer (NEM) specifications or techniques.

5G RF Network Performance The primary use cases for 5G RF network performance management build on those for existing 4G networks, including: • The ability to enumerate best beam identification with geolocated mapping of users and events to aid problem drill-down • Optimization of network configuration with consideration given to both the geographic distribution of subscribers and traffic demand.

• Identification of poorly performing UEs with the ability to drill down to identify root cause issues • Automation of subscriber-centric optimization.

Effective mobile assurance and optimization solutions must amplify the ability of a network engineer to visually assess these use factors to determine when an issue should be escalated, as well as to drive automation in networks. This is extremely important for 5G networks, which incorporate additional dimensions of configuration and adaptability through features like full dimension MIMO (FD-MIMO) and network slicing.

For example, over-shoot and interference issues can now be addressed in more powerful and subtle ways because FDMIMO can set an effective tilt-profile for individual subscribers vs. a single value of tilt for all users in a cell. Likewise, network slicing and segregation of resources becomes more valuable when analysis is based on distribution of subscribers, subscriber classes and associated demands per slice.

Without question, operators will benefit tremendously from 5G networks that support a new breed of services across virtually all verticals. Yet to do so, 5G networks must provide mobile assurance, geolocation and optimization systems from the outset. Mobile assurance solutions for 4G and older technologies must be fit for rapid evolution to 5G, with flexible deployment in the end-to-end network that enables them to respond to the physical location of functional splits, thus ensuring support for 5G non-standalone (NSA) and standalone (SA) networks, along with coexistence with 4G infrastructure.

By implementing robust testing procedures along with mobile assurance, geolocation and optimization solutions, operators will ensure rich user experiences and create new service opportunities for any 5G architecture evolution.

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Interview

TELEWORLD AND SAMSUNG WILL BE ORIENTED TO INDUSTRY CONNECT AND/OR SMART CITY B2B PRIVATE NETWORKS

Franco Zaro

Director-Business Development Valid

Oh! Telecom industry is undergoing mind-boggling transformations. From the TELCOs to network integrators and designers all are set to explore possibilities of new generation 5G networks. Amidst all, Samsung recently acquired TeleWorld and a telecom industry veteran Franco Zaro | Director of Business Development | Valid ratifies it to be not just another acquisition but a strategic move by Samsung to underline itself a leader in the 5G space. During the e-interaction he mentioned, TeleWorld and Samsung will be oriented to Industry connect and/or smart city B2B private networks. There is a highly interesting and huge field to explore for companies like Samsung and Teleworld, considering there are currently few vendor options such as Ericsson, Nokia and Huawei. Lote more interesting revelations in this below edited nub.

Q

Please share your experience as a Director, business development at Valid.

I have over 20 years of hands-on experience in the telecom space. Prior to my current position, I worked in the engineering field as a senior engineer for Nokia Networks. Following that, I made my move to Valid, where I started out leading the sales engineering teams. This experience led me to my current position as director of business development at Valid. In this role, I lead our initiatives related to promoting and commercializing our software/solutions. My focus is on converged technologies within three verticals: mobile solutions for payments and identification, RFID tracking for security solutions, and telecom.

Q

Given your experience, you have seen a paradigm shift in the telecom industry, any anecdotes you can provide of your experience or trends shaping the telecom industry?

My experience in the telecom space has been a long ride, and I have certainly witnessed the change of paradigms and the constant evolution of technology. If I focus on my experience in telecommunications and go back to the nineties — I was part of the massive implementation of cellphone networks. At that

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time, companies like Ericsson and Nokia were overwhelmed by massive requests and dancing with millions on revenue and communications were based more on hardware (HW), which is very different from the current state. Consider, HW is a single server and all system interactions are managed by software that maximizes HW capacity. This led to the fall of Nokia phones after the arrival of the Smartphones and the rise of Apple, evolving the network with LTE and now 5G. In the past, we had ideas on how to connect the people and the world in general, but we were always limited by the network capacity — the rise of 5G eliminates that limitation.

Q

How was the year 2019 for the global telecom industry?

What will be your future plans for the growth of the industry?

In 2019, the telecom space saw the consolidation of basically 10 years of previous changes. Telcos changed their commercial models by reinventing and optimizing their business with a focus on B2B services. They also improved quality and pricing in an effort to retain clients that were faltering in their loyalty.

In my opinion, for the upcoming years, convergence will be key to integrating systems, networks and processes within a

Regulations seem to be the main pain nowadays as society is not entirely ready and still learning how to coexist with an What approaches do you think Teleworld/Samsung will integrated environment. Especially an environment that has take to streamline end-to-end support of 5G? the ability to collect evidence of topics that we may consider Looking from a network point of view, it is likely that TeleWorld private. I believe the concept of privacy should be re-evaluated and Samsung will be oriented to Industry connect and/or based on motives and triggers and be formalized. smart city B2B private networks. There is a highly interesting Do you think this acquisition will help set Samsung apart and huge field to explore for companies like Samsung and in the race to lead the 5G smartphone market?

Teleworld, considering there are currently few vendor options such as Ericsson, Nokia and Huawei. There is also a good Samsung already has a strong presence in the smartphone chance Samsung/TeleWorld could be an alternative to large market and I believe this decision is more oriented to consolidate B2B-focused businesses, as Samsung devices providers that have captured the initial market-share. have a natural advantage in this space. The B2B U.S. market What is your opinion of TeleWorldâ&#x20AC;&#x2122;s network design, testing is huge and this move could push foreign providers, such as and optimization services?

Nokia, Ericsson and Huawei out of the picture. By doing so, I foresee that the world will change in the next decade from the U.S., via Teleworld Solutions, could have an additional being a communication-reactive based operation to a presence and access to 5G networks. However, I do want highly integrated real-time ecosystem. The adoption of this to note that patents, owned by Huawei, Ericsson and Nokia concept will create a huge need for large companies like could impact the cost.

Samsung to partner with companies like TeleWorld to assure Building 5G infrastructure will be expensive, what initial success in terms of customer experience, project fulfillment investments might take time to materialize? and user adoption.

Initial investments that will likely take time to materialize due What are the main loopholes which may create problems to a larger period of rollout include patents, development, for the 5G market globally? equipment and highly educated workers. very connected world.

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Reach Us : advt@bisinfotech.com T : +91- 11- 46504585 BISINFOTECH â&#x20AC;˘Vol - 2/03 â&#x20AC;˘March 2020

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Industry 4.0

The Impact of

INDUSTRY 4.0 JAVED AHMAD

Senior Vice President, Global Supply Chain-India, Middle East & Africa Schneider Electric India In the wake of the fourth industrial revolution, the world is witnessing a huge change in the entire production process, especially, in terms of management and supervision that has been altered to become more integrated, yet flexible. To stay relevant in these times of cut-throat competitions in the global environment, there is a constant need of continuous evolution in the production systems of manufacturing companies to accommodate the ever-changing demands of markets.

Industry and markets are few of the first things to be impacted by these changes. Having a snowball effect, it eventually rolls down to affect the whole life cycle of the product, allowing it to adopt new means of production, and of conducting a

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business. The renewed processes have, however, boosted the whole competitiveness of enterprises, which is a good thing.

Industry 4.0 has also provided a new meaning to some of the greatest inventions of the previous decades. The internet boom in the recent years has revolutionised the ways of utilising computers, automations and robots, introducing better opportunities, and giving them a whole new purpose of existence. The incredibly cheaper solutions provided by the fourth industrial revolution has impacted the entire manufacturing industry in such a way that now the whole process of monitoring, gathering and analysing data for realtime decision making has become super sleek.

bringing commendable changes in production and supply chains, materials and processes. In the next few years, this technology is envisaged to experience significant growth throughout the world.

• Increased Efficiency With 5G Gone are the days of slower systems. The rise of the Industry 4.0 will be powered by an increased use of 5G technology.

With an increased number of consumers updating their services for their personal electronic devices, factories are also making similar changes in the way that they operate. A fast internet connection will raise the value of tools, in turn, will increase productivity. A greater bandwidth will be formed as workers will be continuously connected with the tools that are needed to complete job, and machines will be able to take advantage of it as well.

• More Use of Cloud Technology Optimizes Production Ease and availability of cloud technology will boost productivity to an optimum level. It will make decision making easier, based on the real data it stores. Cloud technology has been around for a long time, however, this year it will be used to optimize production, making it the most sought after trend of the year.

• Transformation in Product Design AR and VR will transform the way people used to work to design products. The use of augmented reality and virtual reality will allow designers to make changes in the design and features of products, mitigating the need of investing time in prototypes. This will go a long way in saving resources on designing and developing products in the future.

Major trends • Lowering Energy Use Among the emerging trends of Industry 4.0, one that needs an accelerated processing is minimised energy use. The abrupt growth of industries, owing to back-to-back industrial revolutions across the world has taken a toll on the environment. However, Industry 4.0 will, reportedly, see the trend of minimizing the amount of energy used by factories. An excessive use of energy in the manufacturing processes not only impacts the environment, but also increases the costs of production.

• The Internet of Things (IoT) The IoT technology has become very popular among consumers in a very short time. The charm of this technology lies in its capabilities like dissecting software issues and fixing its own operating systems. The devices that are part of IoT uses wireless signals to transmit information. In the business world, this technology is performing exceptionally well by

• Artificial Intelligence (AI) for Technology Maintenance Smart factories will become the heart of this Industry 4.0.

Considering the increasing popularity of artificial intelligence (AI) in every sphere of this revolution, a major trend to be looked forward in 2020 has to be a growth in the types of technology that are capable of maintaining themselves.

Automation and AI coming together in a smart factory setting will make monitoring of products easier.

Future of Industry 4.0 The fourth industrial revolution has the potential to create a market that is customer-centric, flexible, and efficient enough to cater to the growing demands faster than ever; one that prioritizes customer satisfaction. Product optimization can be considered as another significant advantage of Industry 4.0, which is being materialized by the concept of ‘Smart Factory’.

Research in different fields, like IT security will also be hugely influenced by adopting the technologies of Industry 4.0.

Industry 4.0 has the potential of increasing resource efficiency in manufacturing significantly with vast amounts of data getting harvested allowing predictive maintenance and cost efficiency. To keep up with the transformation that is occurring and meet the changing customer demands, companies should upskill their current workforce to take on new work responsibilities made possible by Internet 4.0 and to recruit new employees with the right skills.

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Decentralized 48-V Power

Solve Auto Electrification Challenges with a Decentralized 48-V Power For nearly a decade, billions of dollars have been spent annually to meet automotive CO2 emissions standards. This new approach to electrification could be the next big breakthrough.

PHIL DAVIES, Vicor Manufacturers of cars, trucks, buses, and motorcycles are rapidly electrifying their vehicles to increase the fuel efficiency of internal combustion engines and reduce CO2 emissions.

There are many electrification choices, but most manufacturers are opting for a 48-V mild-hybrid system rather than a fullhybrid powertrain. In the mild-hybrid system, a 48-V battery is added alongside the traditional 12-V battery.

This increases power capability by 4X (P = V × I), which can be used for heavier loads, such as the air conditioner and catalytic converter at startup. To increase vehicle performance, the 48-V system can power a hybrid motor for faster, smoother acceleration while saving on fuel. The additional power can support steering, braking, and suspension systems, plus add new safety, entertainment, and comfort features.

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Introducing a 48-V mild hybrid system has tremendous upside once designed-in. Overcoming the hesitancy to modify the long-standing 12-V power distribution network (PDN) may be the biggest challenge. Changes in power delivery often require new technologies that need extensive testing and may require new suppliers to deliver on the automotive industry’s high safety and quality standards. But the advantages far outweigh the conversion cost, a fact that’s being discovered by the data-center industry as it moves to a 48-V PDN. For the automotive industry, a 48-V mild-hybrid system provides a way to rapidly introduce new vehicles with lower emissions, longer range, and higher gas mileage. It also delivers new and exciting design options for higher performance and features while still reducing CO2 emissions.

1. Most centralized 12-V architectures are large, heavy, and present a single point of failure.

How to Maximize a 48-V PDN Adding a 48-V battery to power the heavier powertrain and chassis-system loads provides options to engineers. Now there’s a choice of adding systems that can deal directly with a 48-V input, or to retain legacy 12-V electromechanical loads such as pumps, fans, and motors and instead convert the 48 V to 12 V via a regulated dc-dc converter.

To manage change and risk, existing mild-hybrid powerdelivery systems are slowly adding 48-V loads, but they still use a large centralized multi-kilowatt 48- to 12-V converter that feeds 12 V around the vehicle to the 12-V loads.

However, this centralized architecture doesn’t take full advantage of a 48-V PDN, nor does it utilize the benefits of available advanced converter topologies, control systems, and packaging.

The vast majority of these centralized dc-dc converters (Fig. 1) are bulky and heavy, since they use older, lowfrequency switching PWM topologies. They also represent a single point of failure for many critical powertrain systems.

A different architecture to consider is decentralized power delivery (Fig. 2) with modular power components. This power-delivery architecture uses smaller, lower-power 48- to 12-V converters, distributed throughout the vehicle close to the 12-V loads. The simple power equations P = V × I and PLOSS = I2R explain why 48 V is more efficient than distributing 12 V.

2. A decentralized 48-V architecture places multiple smaller, lowerpower converters closer to the 12-V loads.

For a given power level, the current is 4X lower at 48 V than in a 12-V system and has 16X lower losses (Figs. 3 and 4). At one-quarter of the current, the cables and connectors can be smaller, lower weight, and cheaper. The decentralized power architecture also has significant thermal management and power-system redundancy benefits.

3. Higher currents in the traditional centralized architecture create greater losses; standard converters are about 94% efficient.

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Decentralized 48-V Power

4. Decentralized 48-V architectures reduce losses by distributing lower currents and generating less heat; Vicor has developed converters that are 98% efficient.

Modular Component Benefits for Decentralized Architectures A modular approach to a decentralized power delivery is highly scalable (Fig. 5). The 48-V output from the battery is distributed to the various high-power loads in the vehicle, maximizing the benefits of lower current (4X) and lower losses (16X) and resulting in a physically smaller and lowerweight PDN. Depending on a load power analysis of the various distributed loads, one module can be designed and qualified for the right power granularity and scale to be used in parallel arrays.

In this example, a 2-kW module is shown (Fig. 5, again). As noted, the granularity and scalability are system-dependent.

By using distributed modules instead of a large centralized dc-dc converter, N+1 redundancy is also possible at a much lower cost. This approach also has advantages if load power changes during the vehicle development phase.

Implementing the Decentralized Architecture in Higher-Voltage Battery Systems In the case of pure electric vehicles or high-performance hybrid cars, high-voltage batteries are used due to the high power demands of the powertrain and chassis systems. A 48-V safety extra-low-voltage (SELV) PDN still has significant benefits for OEMs, but now the power-system designer has the additional challenge of high-power 800- or 400- to 48-V conversion.

This high-power dc-dc converter also requires isolation, but not regulation. Better voltage regulation is one benefit of decentralizing the placement of 48- to 12-V converters.

By using regulated point-of-load (PoL) converters, the high-power upstream converter can employ a fixed-ratio topology. This is extremely beneficial due to the wide input-to-output voltage range of 16:1 or 8:1 for 800/48 and 400/48, respectively (Fig. 6). Using a regulated converter over this range is very inefficient and presents a large thermal-management problem.

6. Fully electric vehicles can take advantage of the same hybridelectric modular approach, with only the addition of an upstream fixed-ratio converter.

5. A decentralized, modular approach to a 48-V mild hybrid system reduces losses by 16X.

Instead of implementing changes to a full ground-up custom power supply, engineers can either add or eliminate modules.

Another design advantage is reduced development time as the module is already approved and qualified.

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It would be very difficult and costly to decentralize this high-voltage isolated converter due to safety requirements in distributing the 400 V or 800 V. However, a high-power centralized fixed-ratio converter can be designed utilizing power modules instead of a large silver-box dc-dc converter.

Power modules of the right level of granularity and scalability can be developed and then easily paralleled for a range of vehicles with differing powertrain and chassis electrification requirements. Fixed-ratio bus converters (BCM) developed by Vicor are also bidirectional, which supports various energyregeneration schemes. Due to the sine amplitude converter (SAC) high-frequency soft-switching topology, BCMs achieve efficiencies over 98%. They also feature power densities of 2.6kW/in.3, which reduces the size of the centralized highvoltage converter.

Phil Davies is VP of Sales and Marketing for Vicor Corp.

EV

EV DEMANDS

And Its Importance In Our Society UJJWAL BHARDWAJ Founder, Electrifuel Private Limited India is witnessing the beginning of the Electric Revolution, with Government's push with Policies and initiatives like FAME and FAME-2 and low running cost is making EVs a Logical choice, especially for Short intracity commute, and this is a major force behind the success of electric two-wheelers with sales exceeding projectionsand four-wheelers too, are picking up pace, more and more models are launched with a better range per charge.

The future of mobility is electric, it's obvious.

Days of Internal Combustion Engine (ICE) Vehicles are numbered, they are dependent on Fossil fuel which is not as abundant as assumed, and world’s fossil reserve is estimated to last not more than 50 more years. Also, with efforts to counter climate change, governments globally are committing to curb carbon emissions hence strict actions are being taken to like strict emission standards for ICE vehicles effectively making them more expensive and push Electric Vehicles via Fiscal and non-fiscal incentives.

There are numerous factor driving the EV demand in India like, EVs inherently have lower operating costs than ICE vehicles as the cost of Electricity is several times lower than Petrol or Diesel and lower maintenance costs due to fewer moving parts in EVs. We will see a bifurcation in EV Demand, where two-wheelers will leading the charge with high growth and four-wheelers and other segments following with slower growth reason behind this is the slower transition of four-wheeler Auto-industry while the two-wheeler market had taken head start which got a

boost with better than expected uptake.

The Demand for EVs especially two-wheelers will be initially met by small and medium-sized enterprises as evident by the rise of such Electric 2 wheeler or Electric Scooter manufacturers in almost every State and Region, some of these based in tier-3 cities where they have made name for themselves in their local market and made a significant socio-Economic impact as they not only generate direct employment but also entrepreneurial opportunities like Dealerships.

And these will act as a catalyst to increase the EV Demand as the whole ecosystem is rising around them, Not only EV manufacturing but Charging infrastructure is also getting traction with public charging stations providing business opportunities with very less Logistical effort and Capital investment as compared to Fuel pumps and they are popping up fast everywhere starting with national highways and hot spots in major cities.

The Growing EV demand is also shaping future job prospects which have been recognized by Academic institutions and courses are being offered to address the need of workforce for the Budding EV Industry, these curated Courses will arm the future job seekers with the relevant skillset.

This growing Demand is like 'a metaphorical train of opportunities that has blown its horn before departure and is now picking speed, it will leave the platform soon', the ones who had listened to that signal have boarded this train others are running to catch it.

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IoT in Agriculture

IOT IN AGRICULTURE AND FARMING

Vishal Goyal Group Manager – Technical Marketing South Asia and India |STMicroelectronics Ltd

Agriculture is the primary source of food all over the world. It not only provides the food but raw materials for many industries and contribute significantly to the growth of GDP and economy of any country. It is also the main source of income in many countries.

With the evolution of urbanization, weather change and increasing population, agriculture sector is facing many challenges. There is a strong need to increase the production per unit area. Traditional method farming have led to degradation of farms because of uncontrolled use of resources, fertilizers and pesticides.

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Smart agriculture has emerged as an important step towards increasing output and optimizing the use of resources. Smart agriculture is also very important towards organic farming and growing the type of fruits, vegetables or food grains demanded by consumers.

Smart farming is not only important for crops but also for livestock. Technology can help to increase the output of livestock, improve their health and avoid any outbreak or spread of diseases. IoT in agriculture consists of sensors, processing, connectivity, gateway and cloud solutions optimized in their working according to specific use cases.

right quantity of water. In IoT enabled irrigation, the irrigation depends on the soil moisture rather than a prefixed or predetermined interval based irrigation.

LIVESTOCK MONITORING In IoT enabled farms, livestock such as sheep, pig, chicken and cows are monitored for their health to identify any disease, insemination period and activeness. IoT enabled sensors are fitted into ear or other parts of livestock body to monitor their body temperature and activeness. A livestock with abnormal temperature can be quarantined and provided medical care to avoid the outbreak of the disease to other livestock.

The activeness in livestock is not only linked to health but also quality of the output. Milk production from active cow which is more than from an idle cow.

IoT enabled farms also monitor the ambience in which livestock are kept to ensure they are in proper living condition.

GEO FENCING In large farms livestock are allowed to roam and live in natural condition. While they are not locked, it is important to ensure their safety and that they do not stray out of the farms. So they need to be monitored using GPS enabled tracker. The tracker consists of motion sensor to monitor their motion and GPS enabled geo fencing to generate alert if livestock moves out of designated area.

ARCHITECTURE FOR IOT ENABLED SMART AGRICULTURE

ROLE OF IOT IN AGRICULTURE USE CASES CROP MONITORING

To get the maximum productivity of crops soil and the environment need to be monitored for humidity and temperature. It is important not only to monitor not only absolute humidity and temperature but the change over a shorter and longer period of time. This data can be correlated with ideal profile for the crop. This monitoring also helps to identify when and how much pesticides and fertilizer need to be used to minimize their usage.

GREEN HOUSE As the demand of variety of fruits and vegetables is growing it becomes important to create ideal condition for a particular type of plant to grow and flourish. IoT enabled greenhouses monitor their ambient condition and adjust to avoid any deviation.

REMOTE IRRIGATION Remote Irrigation is the next step of monitoring they control the irrigation depending upon the soil and ambient temperature and humidity. IoT enabled irrigation systems not only save water but also ensure that crops are provided with just the

A typical IoT system in agriculture consists of following blocks - Sensors - Signal conditioning - Processing & Security - Power Management - Connectivity - Positioning STMicroelectronics can cater to every block as mentioned above with wide range of semiconductor devices, In the article we will specifically focus on sensors and connectivity that form the basis of any IoT system.

SENSORS

Sensors are used to detect external inputs which act as a basis of any IoT system.

- Accelerometers are used to detect motion, activity level, intrusion in the farm etc. Ultra low power LIS2DW12 accelerometer from STMicroelectronics has a configurable noise mode to select BISINFOTECH â&#x20AC;˘Vol - 2/03 â&#x20AC;˘March 2020

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IoT in Agriculture between accuracy and current consumption and even has automatic sleep and wake-up functions to optimize power - Humidity and Temperature sensors are used for soil monitoring, ambient Air monitoring and livestock health monitoring. These sensors provide critical input for IoT enablement in agriculture use cases. HTS221 from STMicroelectronics is a Humidity and Temperature sensor combo and include a sensing element and an analog front end to provide the measurement information by digital serial interface. The sensing element consists of a polymer dielectric planar capacitor structure able to detect relative humidity variations. The STTS22H is an ultra-low-power, high accuracy, digital temperature sensor offering high performance over the entire operating temperature range.

The STTS22H is a band gap temperature sensor coupled with an A/D converter, signal processing logic and an I²C/SMBus 3.0 interface all in a single ASIC. - Pressure sensor can detect atmospheric pressure that is eventually used to measure altitude as well. Since a pressure sensor requires an opening for a diaphragm to detect the pressure, they also prone to water and chemical contamination.

Therefore, a pressure sensor is needed that can remain safe from chemicals such as Chlorine and Bromine. The LPS33HW is one such sensor with features as an O-ring, water resistance to 10-bar (up to 90 meters’ depth), and is safe from the chemicals mentioned as well as salt.

CONNECTIVITY

Connectivity in agriculture may be viewed from below application requirements Range: For indoor monitoring short range RF technologies such as Bluetooth, BLE and Wi-Fi are preferred as they can collect data from sensor nodes and send them to gateway for further propagation. For monitoring large farms long range technologies such as GPRS and LPWAN such as Sigfox are preferred as they give connectivity directly to telecom infrastructure. Mesh technologies such as BLE Mesh and 6LowPan can enhance the range of short range technologies and make them suitable to be used outdoor.

Power Consumption: Most of the use cases in agriculture are powered by non -rechargeable batteries so technologies such as BLE, RF subGhz and LPWAN such as Sigfox are preferred over Wi-Fi, Bluetooth and GPRS that consume exponentially higher power.

Therefore, we focus on BLE and subGhz in this article as they seem to be the most suitable connectivity technologies in agriculture ecosystem.

Bluetooth Low Energy [BLE] is a Wireless Personal Area Network [WLAN] technology and consumes a fraction of current of conventional Bluetooth and Wi-Fi while adding smartphone connectivity to devices. It works in 2.4Ghz frequency range, which is a worldwide license-free ISM band. BLE Mesh is a software solution for connecting multiple BLE devices in Mesh networks of IOT solutions. The introduction of the Mesh solution has made it possible to be connected even when devices are not in direct range of a network.

The BlueNRG-2 from STMicroelectronics is an ultralow-power BLE 5.0 certified system-on-chip, which provides seamless connection with sensors, privacy 1.2, secure connection 4.2,

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8dbm of output power, and a reliable BLE link to IOT devices.

Besides, it supports standard fully compliant SIG BLE Mesh.

Low-power Wide Area Network (LPWAN) technologies are another revolution in connectivity as they allow connectivity of several kilometers yet consume so little power that they can be powered by a non-rechargeable coin cell battery. Sigfox is a LPWAN technology which offers global cloud, long range connectivity, and consumes very low current.

To offer advantage of both short range and long range technologies in a combined solution, STMicroelectronics has introduced a unique solution to combine BLE and Sigfox radio, S2-LP, into a common solution. The dual radio offers long-range connectivity via Sigfox and Smartphone connectivity using BLE. Smartphone connectivity to Sigfox devices will enable User Interface [UI], over the Air firmware update [OTA], direct configuration and control.

INTELLIGENCE ON THE EDGE

One of the most important aspect of IoT in agriculture is to be able to analyze data of individual crops or livestock and relate them to actual productivity. Artificial Intelligence uses an assembly of nature-inspired computational methods, and machine learning refers to techniques that enable machines to recognize underlying patterns in order to make predictions and recommendations by analyzing data. But as the number of IoT enabled agriculture devices are numerous, the raw data sent from the sensors to the cloud sees the escalation in required data bandwidth and computational capabilities in the cloud.

Artificial Intelligence can be utilized efficiently when some of the analysis moves closer to sensing nodes or on the edge.

Edge computing offers data privacy and reduced bandwidth requirements as well as cloud computation. Edge computing means intelligent sensing and processing at the node itself, so the selection of these devices is very important. A smart node analyzes the data, runs sensor algorithms, estimates the context, and sends the data to the cloud for further processing.

CONCLUSION

As agriculture is the backbone of any society and burdened with ever increasing population it becomes imperative to maximize productivity and use the available resources optimally. IoT enabled agriculture can help to achieve the desired outcome and help to take informed decision. With the advent of ultra-low power and precision technologies it is now possible to connect every possible crop and livestock with IoT. A successful implementation requires working with right partners and leader in technology. STMicroelectronics is a preferred choice for IoT customers worldwide who are benefitted in cutting edge technologies it introduces.

Smart Home Appliances

3 Ways to Protect IoT Smart Home Appliances from Cyber Attacks– IEEE Using IoT devices and appliances to manage one’s home is an increasingly common practice in most modern-day households.

Home assistants, smart doorbells and internet-connected household appliances communicate via IoT technologies. Though prevalent in our lives, securing these devices from cyber-attacks is still a major challenge technologists and manufacturers face.

News reports about compromised IoT devices being responsible for a large-scale botnet is not unheard of— when a network of private devices become infected with malicious software.

The botnet can launch denial-of-service attacks, steal data, inundate users with spam or even access devices and their connection without the owner’s knowledge.

“Manufacturers need to be held more accountable with regards to road maps for updates for any devices they sell,” says IEEE Senior member Kevin Curran. “Even something which seems innocent, such as an IoT-connected coffee maker, could be hacked, and allow attackers to know our pattern of use. From that, they can make predictions as to when we are at home or not.”

Here are three ways to protect yourself and your devices from cyber invasion.

Make Stronger Passwords “Whenever you buy an Internet-Connected device, such as a router, baby monitor or connected closed circuit tv (CCTV), change the default password,” says Curran. “In fact, every device you purchase that has a default password should be changed on first use. There are search engines which crawl the web for connected IoT devices, and hackers will try default passwords on those devices.” If you do not change your password, “you are basically leaving your keys in the door,” says Curran.

Another tip to making your passwords stronger is to use different passwords on all sites.” Install a reputable password manager which will create complex strong passwords and store them

in an encrypted file on your own computer,” suggests Curran.

Update Your Devices Immediately Sometimes updating your smart, or IoT-connected devices is the last thing on your “to-do” list, and it’s easy to forget to update your mobile app. But making sure your devices, like your smart assistant, home security device or baby monitor are using the most recent software is an easy way to ensure your safety from potential hacks. “The one aspect that I wish everyone knew was the importance of timely patches to software and operating systems,” says Curran. “Running the most recent versions of your mobile operating system, security software, apps and web browsers is among the best defenses against malware and other threats.” “When you see a message on your computer or mobile to update, then do so immediately,” adds Curran. “These updates often contain security patches which protect against new vulnerabilities.”

Buy Devices From Manufacturers Committed to Protecting You Only buy devices from manufacturers committed to ensuring your family’s security and privacy is protected. Do some research before you buy a smart device to see if the company has had trouble with cyber-attacks in the past. “Organizations need to ensure they deploy IoT devices with sufficient security policies in place, such as firewalls, and intrusion detection and prevention systems,” says Curran. “But they also need to ensure they cater for the confidentiality of their customers’ data.” But the truth is, consumers should always be looking out for themselves and stay educated about the ways to protect themselves. “We have too many vulnerabilities because people still assume that someone else is handling it, or the system is handling it, and they don’t have to worry about it,” says IEEE senior member Steven Furnell. “Having taken the responsibility on board, you then need to understand and follow the baseline good practice.”

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5G

5G will be a Game Changer for Telecom Operators: Our predictions for 2020 John Giere, President |Enea Openwav As we kick off 2020, we open a new dimension in wireless communications technology. 5G is here and expected to supercharge devices and communication networks in a big way. Based on our industry expertise and analysis, following are the predictions and trends of what our team of experts expect to unfold this year.

Prediction 1: 5G will amplify live streaming and viewing experience

As 5G rolls out to deliver faster mobile networks, higher capacity and lower latency, mobile operators are working on new services and product offerings on their advancing 5G networks. 5G is drastically transforming mobile video, delivering high-end gaming experience to consumers.

Majority of mobile operators are creating new partnerships with OTT service providers to enhance the delivery of sports and gaming coverage to consumers.

There has been a surge of traffic generated by myriad of streaming services such as Netflix, Amazon Prime, Hulu, Sling TV, CBS All Access, Philo, YouTube TV and HBO Now. Infact 2019 witnessed the addition of even more new streaming channels, including Apple TV+ and AT&T TV and then came the giant of entertainment Mickey Mouse to the wireless stage in the form of Disney +.

Our live data shows that the Disney + service quickly reached #1 in Canada within days and is already rising rapidly in the US. According to media industry sources, Disney could reach its 60 - 90 million subscribers much earlier than its 2024 goal. This result will have profound competitive implications for mobile operators and a host of new streaming protocols planning their future. In 2020, new streaming services are expected from NBC Universal Peacock (launching in April); HBO Max (expected in the spring); Discover/BBC (some time in 2020).

Prediction 2: With 5G, Cloud Gaming advances

in 2020

5G networks will support cloud game streaming, enabling consumers to play digital games on their handsets without the need to own or install a copy of the game. 5G networks will eventually empower cloud gaming services and gamers will demand low latency, high-definition immersive experiences.

These subscription-based services will give consumers access to a high-end gaming experience without requiring additional hardware. Operators believe that cloud gaming could represent 25% to 50% of 5G data traffic by 2022, based on the rapid progression of cloud gaming services in recent months. Cloud gaming services have already kicked off, with

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Google Stadia, GeForce NOW, PlayStation Now, Shadow, Vortex and Parsec already leading the pack.

To attract a premium consumer segment and deliver an authentic gaming experience, operators will have to get rid of buffering, stalling and latency levels, as these will not work and poor results will be career ending. Operators will need to deploy a mix of software technologies to build networks that support up to four times more bandwidth than what currently exists on today’s networks – or it could be game over for their subscribers!

Prediction 3: Unified 5G data management layer: The way data is managed and processed demands new thinking

Mobile carriers have access to lots of data and there is tremendous potential to convert that data into new insights, which can be a new revenue streams in the future. The advent of 5G has seen an evolution from managing just subscriber data to managing a whole variety of data, including information on policy, session, application and configuration. And, while some of this data may be stateful, increased virtualisation means much of it will be stateless. All of it, however, must be made available in real time to authorised applications, which may or may not reside in the cloud.

For mobile carriers this means embedding not only mobility but also AI/ML. This AI/ML requirement should connect to every partner they choose to work with and every piece of software they purchase to put in their network.

To achieve success in this transforming telecom landscape, it is important that mobile operators build a common data layer across their 5G applications and replicate data quickly and cost effectively as needed. As 5G networks become mature over 2020, operators will turn to these data layers to deliver new revenue by extending their capability to support 5G slices and stateless core services, while also delivering data at the edge for performance-sensitive, ultra-reliable low-latency applications like streaming and cloud gaming.

The way forward in 2020

In 2020, we will witness a range of streaming services, more immersive games and disruptive applications. In order to enrich the quality of experience, 5G will present operators with both challenges and opportunities as they migrate to next generation networks. 2020 holds the promise of significant new revenue opportunities for mobile operators, capitalising on 5G’s promise of high speed and ultra-low latency to expand their service offerings.

A&D UPDATES

IIT Mandi Organises a National Workshop for Aerospace Indian Institute of Technology Mandi has organised a National Workshop on ‘Advanced Composites for Aerospace: Design, Manufacturing and Condition Monitoring Perspective’ from 11th to 15th February 2020.

Designed especially for researchers and engineers, the workshop helped participants to understand and implement state-of-the-art concepts of design, manufacturing and conditioning monitoring pertaining to advanced composite for aerospace application.

For the workshop, the Institute hosted eminent scientists from Aeronautics Research & Development Board (AR&DB), the aerospace research wing of Defence Research and Development Organisation (DRDO), who provided the exposure to cutting edge research perspectives on composites in the aerospace industry.

Speaking during the conference, Prof. Timothy A. Gonsalves, Director, IIT Mandi, said, “Artificial Intelligence (AI) is taking over the world. Almost everything is automated

Military Drone Market Size to Reach USD 21.76 Billion by 2026 The global Military Drone Market size is set to gain traction from their increasing demand from the defense sector as they possess high surveillance capability.

Besides, these drones are nowadays equipped with several state-of-the-art technologies, namely, cloud computing-based services, multi-sensor data fusion for UAV navigation, and artificial intelligence (AI).

It would affect the market positively in the coming years.

As per the report, the Military Drone Market size is projected to reach USD 21.76 billion by 2026, at a CAGR of 12.4% during the forecast period. However, it stood at USD 7.93 billion in 2018.

Increasing Border Disputes in Developing Nations to

Propel Growth Armed forces worldwide are mainly focusing on bolstering their defense domain owing to increasing transnational security threats, as well as border security issues.

This, in turn, is upsurging the expenditure on defense in the developing economies.

The countries in Asia Pacific, for instance, are at present going through several border disputes. China is focusing on enhancing its defense sector with the help of government support.

The government of China spent USD 177.61 billion on improving combat capabilities and developing infrastructure for the armed forces. These factors are anticipated to propel the military UAV market growth in the coming years.

these days and we should know how to utilise this technology to remain valuable in the market. IIT Mandi became the first IIT to introduce a full-fledged B. Tech. course in Data Science to address the need of the hour.”

Over the last decade, composite materials have found large scale applications in aerospace industries. With the advent of cheap sensor technologies and powerful computational facilities, condition monitoring has come up as another avenue to ensure safety and serviceability of composite materials used in the aircrafts. The one week workshop was designed to introduce theoretical and practical aspects of composite material research to engineers and researchers to make them equipped to solve problems. The workshop was particularly beneficial for engineering students, engineers and scientists working in various institutions.

Jointly sponsored by Solize and Mathworks, the workshop was attended by more than 100 participants including students and faculty members from Engineering Institutes, Colleges, Polytechnics and Practicing Engineers and Researchers from Industries and R&D Institutions. The workshop provided a thorough idea of Micro-Macro mechanicsbased analysis of composite using ANSYS and DIGIMAT software; hands-on experience of Condition Monitoring of composites and Manufacturing techniques for a wide range of composite materials.

Teledyne e2v Solutions at Singapore Airshow 2020 Teledyne e2v will be exhibiting its class-leading capabilities in data and signal processing solutions at Singapore Airshow 2020, from February 11 to 14, 2020.

Teledyne e2v and partner Emerges, will be at booth B11, displaying high reliability, feature-rich semiconductor products, which enable demanding aerospace and defense applications.

Here are some highlights: Data Converters Teledyne e2v focuses on high sampling and high bandwidth data conversion solutions enabling direct conversion architecture and leading to SWAP-C improvements. This is complemented by specific exclusive features such as synchronization capabilities with serial interface support, and multiple

channels within a single device. For example: • EV12AQ600: the most advanced, versatile 12-bit ADC featuring a cross-point switch enabling multi-channel operation. Available from commercial to space qualified levels, including military grade. Developed under the INTERSTELLAR H2020 project in partnership with Thales Alenia Space, Airbus Defense & Space, and the Fraunhofer Institute, and is funded by the European Commission.

• EV12AD550: the first dual channel, S-band capable, 12-bit ADC sampling at up to 1.6GSps. It is focused on advanced space telecommunication and SAR payloads requiring high-reliability and has been certified QML-V in 2019.

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Industry Updates Arm to Demonstrate its Speciality at MWC 2020

Xilinx Adds Advanced Machine Learning Capabilities

Arm CEO Simon Segars will join fellow business leaders in an MWC Under Simon’s leadership, Arm has been at the forefront of multiple efforts to tackle socio-economic and environmental issues through initiatives such as 2030 Vision.

Simon will share his insights into balancing business success with positive societal change during a panel discussion on trust, transparency, and sustainable and responsible leadership styles. The Arm booth will host a number of leading ecosystem partners showcasing innovative demonstrations.

Arm’s new Total Computeapproach for innovative new mobile experiences and use cases for the 5G era.

Xilinx has announced a range of new and advanced machine learning (ML) capabilities for Xilinx devices targeted at the professional audio/ video (Pro AV) and broadcast markets.

Additionally, Xilinx unveiled the industry's first demonstration of a programmable HDMI 2.1 implementation on its 7nm Versal devices. Xilinx is showcasing these capabilities and more at Integrated Systems Europe (ISE) 2020, taking place this week in Amsterdam. These and other highly adaptable Xilinx solutions for the Pro AV and broadcast markets are designed to help customers reduce costs and future proof investments while keeping pace with new usage models and evolving industry standards.

Mitsubishi Electric’s New Technology for Controlling Robots

Moxa Releases Ethernet EDS-2000-EL and EDS-2000-ML Series

Mitsubishi Electric Corporation has recently announced that it has developed a technology for controlling in-building mobile robots used for cleaning, security, delivery and guidance, as well as next-generation electric wheelchairs, using building dynamic maps* to achieve cooperative interaction between the robots, etc. and building facilities, such as elevators and access control systems. By supporting the safe, efficient movement of people and In-Building Mobilities in buildings, the new technology is expected to reduce the workloads of building-management personnel and help realize smart buildings** in which people and robots coexist safely.

Moxa has launched the brand new series of industrial unmanaged Ethernet switches – the EDS-2000-EL and EDS2000-ML Series. These new series have truly demonstrated Moxa’s engineering excellence to add advanced features in unmanaged switches with extra small footprint. In order to help expand the networks with ease, Moxa has made the EDS-2000EL and EDS-2000-ML Series reliable, easy-todeploy and versatile to fit a variety of industrial applications.

The EDS-2000-EL Series is known for its extreme small size, almost as small as a credit card, but jam-packed with advanced features. Unlike traditional unmanaged switches, the robust EDS-2000-EL Series enables Quality of Service (QoS) for critical data transmissions to ensure reliable Ethernet connectivity, whether deployed in a machine or in the field.

The more data points you can connect, the more business insights you can leverage. For industrial applications, especially in harsh environments, the need for rapid and reliable network expansion is even more crucial for safety and productivity.

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Renesas, Panthronics Announce Collaboration

Schneider Electric Partners with BYPL

Renesas Electronics Corporation and Panthronics jointly announced they are collaborating to bring best-in-class solutions to the consumer, industrial, and Internet of Things (IoT) markets. The collaboration realizes technical leadership in performance, size reduction, lower BOM and power consumption, while offering OEMs faster time to market.

Renesas is pairing its wireless charging ICs with Panthronics’ near-field communications (NFC) readers and controllers to accelerate adoption with a broader set of customers and applications.

Panthronics NFC solutions deliver highest power and connectivity for wireless charging applications thanks to their patented sine wave driver architecture.

BSES Yamuna Power Limited (BYPL) and Schneider Electric have signed a far-reaching Memorandum of Understanding (MoU). The partnership seeks to make electricity usage safer, smarter and sustainable using cutting edge technology and creating awareness. This will be accomplished through two programs and working closely with the Resident Welfare Associations (RWAs), Industrial Welfare Associations and nominated local electricians in East and Central Delhi.

Tieto, ST Partner to Develop Central Control-Unit

Dialog Semiconductor Buys Adesto Technologies

Tieto and STMicroelectronics have announced their collaborative efforts to develop Central ControlUnit (CCU) software to run on STMicroelectronics’ popular Telemaco3P platform.

Accelerating electrification and connectivity requirements of vehicles are pushing for greater and greater processing power and uncompromised cybersecurity. In turn, automakers’ demands for Central Control Units meeting connectivity, data privacy, security, and over-the-air update needs have led ST to develop the Telemaco family of automotive, multiprocessor SoCs (systems-on-chips) and its associated Telemaco3P Modular Telematics Platform (MTP), which provides an open development environment for prototyping advanced Smart Driving applications. The secure and safe Telemaco3P automotive SoC is the industry’s first microprocessor to embed an isolated Hardware Security Module for state-of-theart security. The module provides safety measures for the implementation of ASIL-B-qualified systems.Tieto’s Software R&D services division and ST are developing vehicle CCU software and next-generation telematics solutions based on the Telemaco3P platform. Tieto aids customers with system integration as well as design and development of a wide range of secure Smart Driving applications. These applications will support high-throughput wireless connectivity, over-the-air firmware upgrades, and car-to-car communication solutions.

Program 1: Preventing electrical mishaps through electrician trainings Program 2: Home Automation Solutions for consumers & preventing electrical shocks

Dialog Semiconductor and Adesto Technologies Corporation have signed a definitive agreement for Dialog to acquire all outstanding shares of Adesto. Adesto accelerates Dialog’s expansion into the growing IIoT market that enables smart buildings and industrial automation (Industry 4.0), seamlessly driving cloud connectivity. Headquartered in Santa Clara, California, Adesto has approximately 270 employees and an established portfolio of industrial solutions for smart building automation that fully complements Dialog’s manufacturing automation products. Adesto’s solutions are sold across the industrial, consumer, medical, and communications markets.

Benefits of Transaction The combination: Scales Dialog’s IIoT sector capabilities by combining industrial connectivity, smart metering and building automation solutions, and access to more than 5,000 customers, the majority of which are new for Dialog Complements Adesto’s industrial wired connectivity portfolio with Dialog’s wireless portfolio (BLE, Wi-Fi) for smart building and industrial applications. Cloud-connectivity adds further differentiation to Dialog’s existing Industrial solutions Enables full system solutions for wearables, hearables, and other IoT applications.

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IP Theft

Another Global Pandemic we’re not talking about: Theft of IP

NIKHIL TANEJA

Managing Director-India, SAARC & Middle East

Every day we see new headlines about coronavirus: thousands more diagnosed, temperature checks on airplanes, subways and even in grocery stores, the World Health Organization holding press conferences to calm global fears. However, very quietly the common flu goes unnoticed. While every headline reminds us that as of February 14, we have seen 60K cases and 1350 fatalities in China, the common flu has seen 19 million cases and 10,000 death in the US this season, per the CDC. While this isn’t surprising, it does say something about human psychology; we tend to overly fear things that are new and overestimate the risk of scary headlines (i.e., coronavirus) where we have no experience to compare. But at the same time, we underestimate the risk of common things we see every day (i.e., the flu). Even though people seem much more concerned about coronavirus, we are much more likely to be affected by the common flu.

Sensationalized or Rational?

There is a strong similarity between today’s world health situation and the current behavior of nation state attackers.

Just like coronavirus headlines, nation state attack headlines are about election meddling: Did the Russians interfere in the 2016 U.S. presidential election or the 2016 UK Brexit vote? Are the 2020 Presidential elections going to be safe?

Certainly these concerns are very real (per the FBI, Russian government hackers did have a very sophisticated campaign dedicated to misinformation through social media as well as hacking the email server of the Democratic nominee). And public sentiment now has governments worldwide mobilizing: task forces are bolstering election security, unplugging election infrastructure from the public internet, and in general hardening their election process against hackers. All of this is being done to both safeguard democracy and calm widespread fears that elections might not be free and fair.

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Contrast this with a much bigger state sponsored hacking initiative, the theft of intellectual property (IP) across the enterprise and university research community globally. There are no sensational photos of spies throwing large suitcases filled with patents out the windows of Fortune 50 companies.

However, according to the Commission on the Theft of American Intellectual Property, stolen IP from China alone is costing the U.S. economy up to $600B annually.

To put this in perspective, this is equivalent to stealing a company the size of Facebook, every year!

However, even though the FBI has over 1,000 active investigations of IP theft allegedly conducted by China, enterprises are not mobilizing. Businesses don’t see themselves as targets and do not recognize the threat. Meanwhile, over 300 universities were penetrated in 2018, targeting research and patents from over 100,000 professors.

Just like people underestimate the flu, businesses and universities globally are chronically underestimating the threat of nation state IP theft. Nation states are stealing IP in green energy, manufacturing, aviation, military, telecom, nuclear energy, hi tech, finance, and healthcare, among other industries.

Sure, coronavirus and election meddling may scare you, but nation state IP theft can “kill” your business or university.

About Radware Radware (NASDAQ: RDWR), is a global leader of application delivery and application security solutions for virtual, cloud and software defined data centers. Its award-winning solutions portfolio delivers service level assurance for business-critical applications, while maximizing IT efficiency. Radware’s solutions empower more than 10,000 enterprise and carrier customers worldwide to adapt to market challenges quickly, maintain business continuity and achieve maximum productivity while keeping costs down. For more information, Please visit www. radware.com.

AUTOMOTIVE Analog Devices Collaborates with Jungo to Improve Vehicle Safety

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Renesas Collaborates with 3db Access to Bring Secure Ultra-Wideband Solutions

Analog Devices has recently announced collaboration with Jungo to develop a Time-ofFlight (ToF) and 2D infrared- (IR) based camera solution to enable driver- and in-cabin monitoring in vehicles.

The combination of ADI’s ToF technology with Jungo’s Codriver software is expected to enable the monitoring of vehicle occupants for levels of drowsiness and distraction by observing head and body position as well as eye gaze.

The solution is also expected to enable smart vehicle interaction based on face, body, and hand gestures, and offer a facial recognition capability that identifies indivduals in the cabin and gives them access to features such as infotainment personalization, personalized services, and ridesharing payments.

“The collaboration between ADI and Jungo opens the door to new and innovative augmented reality applications beyond today’s gesture control,” said Vlad Bulavsky, product line director, Automotive Connectivity and Sensing, Analog Devices. “We believe our work together can bring cabin sensing with ToF-based driver- and occupant monitoring to the next level and improve vehicle safety.”

3D ToF is a type of scannerless LIDAR (Light Detection and Ranging) that uses high power optical pulses in durations of nanoseconds to capture depth information (typically over short distances) from a scene of interest.

Renesas Electronics Corporation and 3db Access have jointly announced that Renesas will license 3db UWB technology and will collaborate to bring best-in-class secure access solutions to the connected smart home, Internet of Things (IoT), Industry 4.0, mobile computing, and connected vehicle applications.

The collaboration combines each company’s technical leadership in performance, size reduction, ultra-low power consumption, and security to deliver breakthrough multireceiver UWB solutions to the global market.

Renesas is augmenting its microcontrollers (MCUs) and RF connectivity capabilities with 3db Access’ field proven secure ranging UWB chips, which are designed for use in smartphones, smart watches, automobiles, and other IoT applications.

This will accelerate a roadmap of ICs and modules that leverage both companies’ strengths and product portfolios to bring best-in-class UWB solutions to market. The collaboration also gives Renesas customers access to advanced UWB solutions that are IEEE 802.15.4z dual HRP/LRP compliant and utilize an RF architecture that achieves 10x lower power consumption through the support of LRP-mode. 3db devices also provide the smallest UWB silicon area compared to competitive ICs. “We are excited with the prospects of collaborating with 3db Access to provide our customers with the products and tools they need to quickly jumpstart their development for indoor positioning, mobile payments and asset tracking,” said Dr. Amit Bavisi, Vice President of Engineering, IoT and Infrastructure Business Unit at Renesas.

China to go Commercialize AV Production by 2025

Toyota and Panasonic Partner to Specialise in Automotive Prismatic Batteries

A recent survey of self-driving vehicle testing published

by Beijing’s Innovation Center for Mobility Intelligent (BICMI) said that 77 AVs of 12 China-based companies including Tencent, Baidu, Audi, Toyota, Daimler, Chongqing Jinkang, Nio, Beijing New Energy, Pony.ai, Didi, NavInfo, and Beijing Sankuai , were tested over 1.04 million kilometres on the roads of the capital city in 2019.

Beijing is one of the few cities in the world that mandates the disclosure of testing done by AV manufacturers on its city roads—the distance covered, the size of the fleet and most importantly the number of autonomous system failures experienced or the number of times a human driver had to take over.

The BICMI report concluded that there was mechanical or software systems failures in only 14 per cent of the cases of disengagement from the autonomous system, whereas in 86 per cent of cases, standby drivers had taken over to change planned routes.

Toyota Motor Corporation (Toyota) and Panasonic Corporation (Panasonic) announced recently that they have decided to establish Prime Planet Energy & Solutions, Inc., a joint venture specializing in automotive prismatic batteries.

This decision comes just over a year since the two companies announced on January 22, 2019 that they had concluded a business integration contract and a joint-venture contract toward the establishment of a new company.

Toyota and Panasonic have also decided the outline of the joint venture.

Batteries-as solutions for providing energy for automobiles and various other forms of mobility, and as solutions for various kinds of environmental issues-are expected to fulfill a central role in society going forward-a role that supports people's lives.

The joint venture announced by Toyota and Panasonic will develop highly competitive, cost-effective batteries that are safe and feature excellent quality and performance (in terms of capacity, output, durability, etc).

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NEW LAUNCH AAEON Compact Board for AI AAEON has announced the PICO-WHU4, the latest compact board designed for embedded artificial intelligence, and edge computing. Built on the PICO-ITX form factor and powered by 8th Generation Intel Core Processors, the PICO-WHU4 is a powerful and compact solution.

Features: • The PICO-WHU4 is built to offer high performance computing in a compact size.

• 8th Generation Intel Core i3/i5/i7 and Celeron processors (formerly Whiskey Lake) combined with support for up to 16 GB of DDR4 RAM.

Applications: Wide range of applications.

Availability: The PICO-WHU4 is also available as a turn-key solution, the PICO-WHU4-SEMI compact embedded system.

Infineon XDP Digital Power XDPS21071 Infineon Technologies has launched the XDP digital power XDPS21071, the first flyback controller in the industry with zero-voltage switching (ZVS) on the primary side to achieve high efficiency. This controller is aimed at fast-charging applications such as USB-PD or QuickCharge.

Features: • The XDPS21071 is a high-performance digital flyback controller.

• Integrated dual-MOSFET gate driver and a 600 V depletion startup unit.

• It supports fixed-frequency switching up to 140 kHz.

Applications: Optimized for variable output application.

Availability: Available Now

Littelfuse Gate Drive Evaluation Platform Littelfuse has recently announced the Gate Drive Evaluation Platform (GDEV). The new evaluation platform helps designers evaluate SiC MOSFETs, SiC Schottky diodes, and other peripheral components like gate driver circuitry, so that they can better understand how silicon carbide technologies will behave in converter applications under continuous operating conditions.

Features: • Evaluate continuous operation of SiC power MOSFETs and diodes under rated voltage and rated current, delivering real power to the load.

Applications: • Automotive EC/HEV Charging Stations • Industrial Power Supplies • Datacenter Servers

Availability: Available Now

Microchip Introduces PIC18-Q43 Microchip Technology next generation PIC18-Q43 family helps developers bring higher performing solutions to market faster. The family’s combination of peripherals offers users greater versatility and simplicity when creating custom hardware-based functions with easy to use development tools.

Features: • Configurable peripherals are smartly interconnected to allow near zero latency sharing of data, logic inputs or analog signals.

• The PIC18-Q43 family helps reduce board space, BoM, overall costs and time to market.

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Applications: Real-time control and connected applications, including home appliances.

Availability: Available Now

NEW LAUNCH Relec Electronics Avails Melcher XRCM60 Series Relec Electronics has announced the imminent availability of the new Melcher XRCM60 Series DC-DC converters. The XRCM60 have an ultra-wide input voltage range.

Features: • Ultra-wide input (16.8V to 137.5V continuous) • EN50155, EN50121-3-2 & EN45545-2 compliant • 5 Year warranty • High efficiency

Applications: Suitable for the most costsensitive applications, without any compromise in quality.

Availability: Available Now.

ROHM Announces Availability of Shunt Resistors ROHM recently announced the availability of shunt resistors, GMR50 series, delivering industryleading 4W rated power (at electrode temperature TK=90°C) in the compact 5.0mm×2.5mm (2010 type package) size.

Features: • This new series combines a revised electrode structure with optimized device design.

• The result is a 39% smaller mounting area over conventional 4W rated products.

Applications: Automotive systems & industrial equipment.

Availability: Available Now.

TDK B43707* and B43727* Series TDK Corporation has recently presented the new B43707* and B43727* series of EPCOS aluminum electrolytic capacitors with screw terminals. They are designed for rated voltages of between 400 V DC and 450 V DC and cover a capacitance range from 1800 µF to 18,000 µF. Features: • Compact dimensions from 51.6 mm x 80.7 mm to 76.9 mm x 220.7 mm (d x h) • High ripple current capability of up to 63.9 A AC at 100 Hz and 60 °C

Applications: • Power supplies, frequency converters or UPS systems.

• Converters in photovoltaic and wind power plants.

Availability: Available Now

Industry’s Smallest 36-V, 4-A Power Module Texas Instruments (TI) has introduced the industry’s smallest 36-V, 4-A power module in a quad flat no-lead (QFN) package. The TPSM53604 DC/DC buck module’s 5-mm-by-5.5-mm footprint enables engineers to shrink the size of their power supply by 30% while reducing power loss by 50% when compared to similar competing modules.

Features: • Shrink and simplify the power solution • Efficiently dissipate heat at high ambient temperatures • Easily meet EMI standards

Applications: Factory automation and control, grid infrastructure, test and measurement, industrial transport, and A&D.

Availability: The TPSM53604 is now available from TI and authorized distributors.

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T&M

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Agilent Introduces New Smart-Connected Turbomolecular Pumps

Anritsu with Samsung Achieve Approval for 5G NR Standalone Mode Test

Agilent Technologies has introduced two new models of turbomolecular pumps to their innovative TwisTorr turbo pump range, both with a more compact design and smart capabilities.

The Agilent TwisTorr 305 FS and TwisTorr 305 IC pumps both come with smart connectivity, a new feature for Agilent turbomolecular pumps. An app called Vacuum Link, which can be installed on Apple or Android phones, enables users to communicate remotely with the pump, so they can quickly and easily type commands and modify parameters, to control the pump.

The TwisTorr 305 FS pump is a standalone unit, featuring an external remote controller. The TwisTorr 305 IC pump features an integrated controller, and very small footprint making it particularly appealing for original equipment manufacturers and other companies that want to integrate the pump in an instrument.

The compact design of these pumps means they can fit into smaller spaces and be mounted in any position.

An advanced function enables users to extract log files so they can share pump operating data easily, saving time.

Anritsu Corporation has announced that its joint collaboration with Samsung Electronics’ System LSI Business on 5G New Radio (NR) Standalone mode (SA) has achieved approval of key test scenarios by the Global certification Forum (GCF) and PCS Type Certification Review Board (PTCRB).

As we progress into 2020 and later, a number of operators will be starting trials of SA mode networks leading to commercial deployments. Anritsu, along with Samsung, is proud to be able to help the industry achieve their targets by enabling standard test regimes for devices support NR SA. These tests are defined by 3GPP TS38.521, TS38.523, and have been verified with Samsung’s 5G New Radio (NR) Exynos modem on Anritsu ME7873NR RF Conformance Test System (TP250) and ME7834NR Protocol Conformance test platform (TP251). “Anritsu’s test solutions are an essential platform to ensure 5G New Radio performance of our Exynos modem solutions,” said Woonhaing Hur, senior vice president of System LSI protocol development at Samsung Electronics. “Through close collaboration with partners such as Anritsu, we’re able to test and verify 5G standalone registration in detail to optimize our modem’s 5G performance.

Keysight Partners with Samsung Electronics

Rohde & Schwarz Enhances Test Instruments Promotion

Keysight Technologies has announced an extended collaboration with Samsung Electronics' LSI Business to validate dynamic spectrum sharing (DSS) technology used in the smartphone maker's new 5G modem.

Samsung has used Keysight's 5G network emulation solutions to accelerate the development of its radio frequency (RF) solution, Exynos RF 5510, as well as its newest 5G modem, Exynos Modem 5123, which supports DSS technology.

"We're pleased to extend our collaboration with Keysight on 5G technology to support the development and commercialization of Samsung's next generation 5G solutions to ensure that they meet the outstanding performance needed for tomorrow's 5G devices," said Woonhaing Hur, vice president of System LSI protocol development at Samsung Electronics. "Together with key collaborators such as Keysight, we're able to deliver cutting-edge solutions that touch the lives of people around the world every day."

This emerging technology supports flexible use of existing spectrum allocations across low-, mid- and high- frequency bands by dynamically switching between LTE and 5G NR coverage based on traffic demand. Mobile operators' deployment of DSS in their networks will accelerate deployment of 5G services and support global sales of 5G smartphones predicted to reach 1 billion by 2025, according to Strategy Analytics. "We're excited to once again showcase our 5G technology leadership by being the first test vendor to successfully validate the DSS feature on Samsung's new Exynos modem," said Kailash Narayanan, president and general manager of Keysight's wireless test group.

Rohde & Schwarz continues the well-received promotion for its distribution range instruments.

The company extends the opportunity for its customers to purchase fully equipped devices at an unrivaled price now through June 30, 2020.

Last year, Rohde & Schwarz started the first-of-its-kind promotion for the line of entry-level bench instruments under the slogan “Everything you need. And more.” It offered customers unique discounts for fully equipped instruments.

The promotion was available for oscilloscopes, spectrum analyzers, power supplies and power analyzers with all the available options included in the price directly at the point of purchase. The pre-configured instruments let customers maximize their investments when building or completing their benches. With well-established Rohde & Schwarz quality and precision, these instruments offer incredible performance for everyday applications like EMI debugging, power integrity, battery simulation and low speed serial bus debugging.

Bob Bluhm, Vice President of Value Instruments at Rohde & Schwarz, said, “The market’s response to our promotion has exceeded our expectations, which is why we decided to extend it until the end of our fiscal year. The success inspired us to enhance the promotional range to include also handheld spectrum analyzers, a signal generator and our mid-range oscilloscope.”

March 2020 •Vol - 2/03 •BISINFOTECH

IOT Aeris Partners with Omnicomm to Strengthens its IoT Solutions Capabilities

Siemens’ MindSphere Continues Industrial IoT Momentum

Aeris Communications has recently announced its partnership with Omnicomm to launch fuel monitoring solution in India.

With this collaboration, Aeris will add fuel monitoring feature from Omnicomm in its portfolio of packaged IoT solutions to address fuel pilferage across segments like logistics & transportation, construction equipment, locomotives, etc.

“While you may trust your drivers, have you effectively removed the temptation to ‘commit a crime of opportunity?’ Is your fleet at risk for fuel theft or shrinkage that you are unaware of? Unfortunately, as the price of oil increases, there is an increasing chance that your fleet could be at risk from fuel theft. We at Aeris have entered into a strategic partnership with India’s leading fuel monitoring company ‘Omnicomm’.

This complements our IoT suite and opens up a new market segment in India and SEA market” said Sameer Mahapatra, Country Sales Head-India & SAARC at Aeris Communications Fleet Industry.

The Industrial Internet of Things (IIoT) has the potential to significantly improve global productivity and growth, with Accenture estimating that this latest wave of digital innovation will accelerate the reinvention of sectors that account for almost two-thirds of world output and add US$14.2 trillion to the global economy by 2030.

As companies around the world continue to develop IIoT strategies and implement solutions, they are increasingly partnering with Siemens and choosing MindSphere, the cloud-based, open Internet of Things (IoT) operating system, as the foundation of their IIoT programs. Recently, Siemens was among the select companies that Forrester invited to participate in The Forrester Wave: Industrial IoT Software Platforms, Q4 2019 evaluation.

In this evaluation, Siemens’ MindSphere was cited as a Leader in Industrial IoT Software Platforms. Over the past year, MindSphere significantly grew its partner program, and announced major new customer wins and Siemens’ expansion of the Mendix platform.

Tata Technologies and PTC Partner to Provide Digital Solutions

Tata Elxsi Partners with Tata Motors for Connected Vehicle Platform

Tata Technologies has partnered with PTC to provide nextgeneration Smart Manufacturing & Digital Transformation solutions to the manufacturing industry worldwide.

As a Platinum Global Systems Integrator (GSI) of PTC, Tata Technologies will leverage its rich domain knowledge in manufacturing and global experience in product engineering to deliver differentiated digital transformation solutions through the innovative PTC product portfolio.

Tata Technologies will support the entire suite of PTC solutions including the ThingWorx, Vuforia, Windchill, Creo, and Servigistics solutions.

This collaboration will further augment Tata Technologies’ strong capabilities in Product Engineering, PLM, Product manufacturing services and strengthen the bouquet of Smart Manufacturing solutions including Digital Twin, AR/ VR solutions thereby helping Tata Technologies develop innovative solutions to address business challenges of the manufacturing industry.

Warren Harris, CEO and MD, Tata Technologies said, “Tata Technologies with a vision of ‘engineering a better world’ enables the manufacturing industry to build and realize better products. Through this global collaboration, we aim to further accelerate our customer’s digital transformation journey by offering targeted solutions that leverage our intimate understanding of the manufacturing industry and PTC’s solution portfolio.”

Tata Elxsi partnered with Tata Motors in developing their unified Connected Vehicle Platform that powers the Nexon EV range of electric cars.

With a collaborative approach, Tata Motors & Tata Elxsi developed a cloud based IoT Platform which provides Tata Motors with a common standard technology stack that delivers the scalability and high performance required to support the entire range of electric, commercial and passenger vehicles.

Tata Motors is in the process of offering the connected Vehicle feature as a key differentiator to most of its BS6 range of Passenger & Commercial Vehicles. Nexon EV, “India’s own Electric SUV”, is the very first application enabled vehicle, with a number of connected vehicle features.

This unified cloud native approach will enable data & analytics synergies for Tata Motors, across product development, customer use cases, dealerships, allied businesses and service networks, enabling innovations in customer experience, offerings, services and business models.

“In line with Tata Motors stated objective of offering differentiated products based on our CESS philosophy (Connected, Electrified, Safe & Shared), we are delighted to have partnered with Tata Elxsi which not only allowed us to take the decision of developing a native platform for the Connected Vehicle Program, but also helped us to jump start and meet the critical product launch timelines.

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5G

Cavli Wireless with Maker Village Launch First 5G Test Lab

56

Cavli Wireless and Maker Village are collaborating to launch India's first 5G network test lab in Q3 2020.

The lab will enable IoT OEMs and ODMs to test their prototypes in real-world settings to fast track the product development processes, and will mark the first time Indian engineering teams have access to a local cutting-edge, fully functional test platform with 5G coverage.

The lab will go live just in time to help 5G technology's momentous transformation of cellular technologies, such as Narrowband IoT (NB IoT) and long-term machine type communication (LTE-M), into mass adoption.

When asked about the significance of this initiative, John Mathew, Chief Technology Architect, Cavli Wireless said, "The launch of 5G technologies is expected to have a transformative effect on society, especially with the development of smart cities. Cavli, with its innovative suite of solutions, is here to ensure that IoT solution developers are able to experience the power of 5G technology, through the test platform that will be set up."

"Cavli Wireless is proud to collaborate with Maker Village

and pioneer to bring the 5G test network lab for the IoT startups in India. We are confident this platform will inspire startups and companies across the globe to prepare their

Fujitsu Granted Japan's First Private 5G License

NEC, Mavenir to Deliver 5G Open vRAN Solution

Fujitsu has announced that it was granted Japan's first private 5G radio station provisional license by the Kanto Bureau of Telecommunications.

As a next step, Fujitsu will establish a radio station emitting private 5G radio waves in order to verify private 5G network systems at its Shin-Kawasaki Technology Square office in Kawasaki, Japan.

In the spring of this year, Fujitsu will also move to open a "FUJITSU Collaboration Lab," which will serve as a dedicated co-creation space for collaborating with customers and partners to workshop and verify use cases utilizing private 5G. Moving forward, Fujitsu will continue to apply for private 5G licenses for its other office locations, plants, and group companies in Japan, offering support for customers in various industries to achieve their own digital transformation projects to deliver new value and business innovations.

First Step to Unlocking New Business Potential through UltraFast Private 5G Networks The introduction of private 5G, which allows companies and local governments to operate their own, ultra-fast private networks, is expected to accelerate business innovation in response to the diverse needs of individuals and communities throughout society. Private 5G network technology promises to unlock numerous business applications in a variety of industries, such as accelerating the deployment of IoT in manufacturing, creating secure networks for seamless remote operations and enhancing surveillance at construction sites and medical facilities.

NEC Corporation and Mavenir have announced a collaboration to deliver a 5G Open virtualized RAN (vRAN) Solution to the Japanese Enterprise Market. This will open up Local/Private 5G Network opportunities for enterprises, regional authorities and other organizations.

Under this collaboration, NEC and Mavenir will jointly work on 5G Open vRAN and Local 5G business developments and establish a simple and cost-efficient ecosystem in the market. The collaboration will bring together NEC's expertise in IT, network and system integration and Mavenir's field-proven cloud-native network technology.

Mavenir delivers an Open vRAN solution that provides strategic differentiation by enabling multisource Remote Radio Units (RRUs) to interwork with the virtualized, containerized, Cloud Base Band software over ethernet Fronthaul (FH), using the O-RAN open interface, overcoming the traditional constraints of the proprietary walled garden specifications used by other traditional equipment vendors.

NEC actively promotes an open, virtualized infrastructure model in support of the 5G era, utilizing IT, orchestration and network expertise. Moreover, the NEC ecosystem contributes to vRAN via interoperability testing between multiple vendors' equipment that is compliant with O-RAN fronthaul specifications.

This joint collaboration will continue to provide value-added solutions for customers worldwide.

March 2020 â&#x20AC;˘Vol - 2/03 â&#x20AC;˘BISINFOTECH

IoT products and prototypes for the latest 5G technology standards," added Mathew.

The test network will be available with 5G SA and NSA modes (supporting sub-6Ghz bands), alongside the LTE NB-IoT and CAT-M for LPWAN side of the IoT. Access to this 5G test network will be free of charge to enable IoT startups in the country to develop 5G-ready IoT solutions that are compliant with global standards.

Cavli will provide 5G test network users, with complimentary six-month access to their global IoT connectivity platform that enable users to power M2M local data connectivity for their solutions across the globe by virtue of Cavli's data partnerships with telecom operators.

Industry Kart Avnet and Sequans Announce a Distribution Agreement

TGR2050 Series Now Available From element14

Sequans Communications and Avnet has recently announced a distribution agreement whereby Avnet will promote and sell Sequans’ IoT chips and modules and will exclusively promote and sell Monarch Go, an LTE-M/NB-IoT modem component designed for and certified by Verizon.

Monarch Go enables new IoT devices to launch on Verizon with no additional testing required, significantly reducing time to market.

The objective of the Sequans and Avnet agreement is to serve target markets by leveraging the industry-leading wireless components of Sequans and the extensive engineering expertise and distribution power of Avnet. In addition to Monarch Go, Avnet will resell and promote Sequans’ other IoT module solutions, including solutions for IoT/ M2M, broadband/CBRS, and all of their associated evaluation and development kits.

“Avnet is a leader in marketing and selling IoT solutions, continually expanding its suite of IoT components for developers, focused on accelerating the growth of the ecosystem,” said Nick Taluja, VP of sales, Sequans. “Extending the reach of our chips and modules via Avnet’s extensive worldwide marketing channels will ensure that our IoT modules and solutions get to customers who need them as quickly as possible.”

element14 has recently announced the availability of the TGR2050 series of next generation Radio Frequency (RF) signal generators from Aim-TTi. Electronic design and test engineers will benefit from the small footprint and lightweight design of the new-to-market TGR2050 Series, offering the best price/performance ratio in its class.

These RF signal generators build upon Aim-TTi’s reputation for manufacturing high-quality and reliable products and are now available for same day despatch from element14 The TGR2050 series includes TGR2051 and TGR2053 RF signal generators which provide exceptional performance with high signal purity, high frequency accuracy and stability, a large signal amplitude range, low phase noise and fast amplitude and/or frequency sweeps. Extensive and flexible analogue and digital modulation capabilities make these signal generators ideal for research and development, test and service work.

Both models also offer improved functionality with intuitive touch screen operation. Advanced remote-control connectivity accommodates sophisticated new automated systems and compatibility with Aim-TTi's previous RF instruments, ensuring simple integration with existing systems.

Microchip and Arrow Electronics Announce Collaboration

Mouser Electronics and Sony Electronics Sign Global Agreement

Microchip Technology and Arrow Electronics have announced an engineering services collaboration to simplify connectivity and security across industrial, smart building and energy markets.

According to NIST, cybersecurity and privacy risks for IoT devices can be thought of in terms of three high-level risk mitigation goals, including protecting: device security, data security, and individuals’ privacy. Arrow will augment Microchip’s smart, connected, secure portfolio with engineering services so that original equipment manufacturers (OEMs) can decrease their time to market and meet requirements in recent government legislation and NIST IoT security guidelines3.

“Technology, pervasively, is embedded in everything.

Every industry and every system are being fundamentally shaped by connected edge technology — it is happening in our homes, our work and our factories,” said Mitch Little, senior vice president of worldwide client engagement at Microchip Technology. “These intelligent edge systems are running fundamental and critical executions, and they must be secure.”

Microchip’s range of secure product features span secure root of trust, secured communication, crypto authentication, certificate management, cloud provisioning, data security, encryption services, secure boot and IP protection.

Mouser Electronics has announced a global distribution agreement with Sony Electronics to distribute Spresense development boards for edge computing solutions. As part of the agreement, Mouser now offers Spresense high-performance development boards, enabling designers to quickly create solutions for a diverse range of implementation areas including logistics, robotics, artificial intelligence (AI), audio, and the Internet of Things (IoT).

The Spresense Main Board (U.S. and Japan, Europe, China) is based on the powerful multicore CXD5602 microcontroller with GPS functionality by Sony. The Arduino-compatible development board is a compact, highly versatile solution that can be used both as a standalone device or with an extension board.

The Main Board supports a applications such as high-performance drones, time-lapse cameras, and smart speakers.

The Extension Board (U.S. and Japan, Europe, China) offers additional features and hardware connectability to the Main Board, including Arduino Uno-compatible headers, a micro-SD card slot, extra USB port, and 3.5 mm headphone jack.

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NAME, DATE &VENUE

EVENT LIST TOPIC

CONTACT DETAILS

INDIA SMART UTILITY WEEK MARCH 03-07, 2020 DELHI

SMART UTILITIES FOR SMART CITIES

Website : http://www.isgw.in/

IIOT INDIA & XELERATE INDIA MARCH 05-06, 2020 GURGAON, INDIA

SMART MANUFACTURING & SMART INFRASTRUCTURE

Website : http://iiotindia.co.in/

INDIA ENTERTAINMENT TECHNOLOGY EXPO MARCH 13-15, 2020 AHMEDABAD

ELECTRONICS & TECHNOLOGY

Website : https://www.iet-expo.com/

SEMICON CHINA MARCH 18-20, 2020 CHINA

AI CHIPS, 6G CHIPS, ADVANCED MEMORY TECHNOLOGY, 3D INTEGRATION

Website : http://www.semiconchina.org/en

Premier MAGAZINE ON

ELECTRONICS & TECHNOLOGY

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PRODUCTRONICA CHINA MARCH 18-20, 2020 CHINA

PRODUCTS & TECHNOLOGY

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CHINA ELECTRONICS FAIR APRIL 09-11, 2020 CHINA

ELECTRONICS FAIR

Website : http://www.efaircn.com/spring/

ELECTRONICS PRODUCTION EQUIPMENT AND MICROELECTRONICS

Website : https://www.nepconchina.com/ general_info/Introduction

ELECTRICAL AND ELECTRONICS EXPO APRIL 24-26, 2020 BENGALURU

ELECTRICAL AND ELECTRONICS

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LED EXPO MUMBAI 2020 MAY 07-09, 2020 MUMBAI

ELECTRONICS FAIR

Website : https://led-expo-mumbai. in.messefrankfurt.com/mumbai/en/planningpreparation/exhibitors.html

SMART CITIES INDIA EXHIBITION MAY 20-22, 2020 DELHI

SMART CITIES

Website : https://www.smartcitiesindia.com/ City-Leaders-Conclave.aspx

SECUTECH EXPO MAY 07-09, 2020 MUMBAI

ELECTRONICS AND SECURITY

Website : http://www.secutechexpo.com/

ELECTRONICS FAIR

Website : https://elecxpo.in/

POWERGEN INDIA JUNE 23-25, 2020 NEW DELHI

POWER

Website : https://www.powergen-india.com/

SMART CITIES INDIA EXPO JULY 7-9, 2020 NEW DELHI

SMART CITIES

Website : https://www.smartcitiesindia.com/

POWER ASIA AUGUST 21-23, 2020 DELHI

ELECTRONICS FAIR

Website : http://www.powerasia.in/

ELECTRONICA AND PRODUCTRONICA INDIA SEPTEMBER 23-25, 2020 BENGALURU

ELECTRONICS FAIR

Website : https://electronica-india.com/ index.html

SMART CARDS EXPO SEPTEMBER 23-25, 2020 BENGALURU

SMART CARD TECHNOLOGY & APPLICATIONS

Website : http://smartcardsexpo.com/

LIGHT INDIA OCTOBER 15-17, 2020 DELHI

SMART LIGHTING, HOME AND BUILDING AUTOMATION TECHNOLOGY

Website : https://light-india.in.messefrankfurt. com/newdelhi/en/facts-figures.html

LIGHT + LED EXPO INDIA DEC 3-5, 2020 DELHI

ELECTRONICS FAIR

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ELECTRONICS, POWER AND ENERGY

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POWER

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ELECXPO JUNE 26-28, 2020 CHENNAI

POWER 2 DRIVE INDIA DEC 15-17, 2020 MUMBAI

INDIA POWER EXPO JANUARY 20-21, 2021 MUMBAI

58

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