Bisinfotech Magazine October 2019

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| OCTOBER 2019

BISinfotech R.N.I. No: DELENG/2019/77352 l VOL 1 l ISSUE 10 l TOTAL PAGES 60 l PUBLISHED ON 1ST OF EVERY MONTH |WWW.BISINFOTECH.COM

Low Power Short-range Protocols for IoT Integration Testing For Bluetooth Low Energy

BACKGROUND

Power Solutions for IoT Systems ISSUE SPECIAL

IOT IN FARMING LEVI GANT

Xuning Zhang, Ph.D. Littelfuse, Inc.

SAMBIT SENGUPTA

Associate Director – Field Applications | Avnet India

RICH MIRON

Applications Engineer Digi-Key Electronics

SEI SAUR ENERGY INTERNATIONAL

Publishing Group

Content 39

EDITOR MANAS NANDI manas@bisinfotech.com

Tech Solution That Will Shape The Transport Management System For Future Smart Cities

CONSULTANT EDITOR NILOY BANERJEE niloy@bisinfotech.com SUB EDITOR NITISHA DUBEY nitisha@bisinfotech.com MARKETING MANAGER ARNAB SABHAPANDIT arnab@bisinfotech.com DESIGN HEAD SANDEEP KUMAR WEB DEVELOPMENT MANAGER JITENDER KUMAR WEB PRODUCTION BALVINDER SINGH SUBSCRIPTIONS PRIYANKA BHANDARI priyanka@bisinfotech.com MANAGER FINANCE KULDEEP GUSAIN accounts@bisinfotech.com Bisinfotech is printed, published, edited and owned

by Manas Nandi and published from 303, 2nd floor, Neelkanth Palace, Plot No- 190, Sant Nagar,East of Kailash, New Delhi- 110065 (INDIA), Printed at Swastika Creation 19 DSIDC Shed, Scheme No. 3, Okhla Industrial Area, Phase-II, New Delhi- 110020 Editor, Publisher, Printer and Owner make every effort to ensure high quality and accuracy of the content published. However he cannot accept any responsibility for any effects from errors or omissions. The views expressed in this publication are not necessarily those of the Editor and publisher. The information in the content and advertisement published in the magazine are just for reference of the readers. However, readers are cautioned to make inquiries and take their decision on purchase or investment after consulting experts on the subject.

BisInfotech holds no responsibility for any decision taken by readers on the basis of the information provided herein. Any unauthorised reproduction of Bisinfotech magazine content is strictly forbidden.

Subject to Delhi Jurisdiction.

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BISINFOTECH|OCTOBER 2019|VOL 1|ISSUE 10

INDUSTRY UPDATES 06 Infineon and Synopsys collaborate to accelerate AI 07 New Manufacturing Facility of Electrolube in China 08 Power Integrations One-Millionth GaN-Based InnoSwitch3 IC 09 Schneider Electric Launches Dedicated EcoStruxure in India

DESIGN 10 How to Monitor Soil pH and Moisture Level 14 Mornsun Outstanding Power Solutions for IoT Systems and Devices 22 Why it’s tough to characterize SiC power MOSFETs 26 Selecting Right Low Power Short-range Protocols for your IoT Solutions

BIG PICTURE 16 PAUL GOWANS W ireless Strategy Director VIAVI Solutions

AUTOMOTIVE 18 Making the software-defined car safe

TECH FEATURE 20 Simple Realization of a Fully Integrated 4-Wire RTD Temperature Measurement System for High Precision Measurement Applications

INDUSTRY MARKET 29 IoT Devices Driving Digital Temperature Sensors Market 30 Sterilization Technologies and Contract Services Market 31 Magnetic Resonance Imaging Systems Market Study

BLUETOOTH 32 Essentials for Integration Testing Bluetooth Low Energy

FEATURE 36 Smart sensor solution for horticulture market

OPED 38 Data Center Racks: A Key Element for DCIM Industry 40 IoT Will Play A Significant Role In The Age Of Smart Farming

T&M UPDATES TELECOM 51 Hughes India Launches Maritime Mobility Services

46 VIAVI NSC-100 to Speed Network and Service Validation

INDUSTRY UPDATES

Infineon and Synopsys collaborate to accelerate AI In order to support AI-driven solutions with its future automotive microcontrollers, Infineon Technologies AG has started collaboration with Synopsys.

Artificial intelligence (AI) and neural networks are becoming a key factor in developing safer, smart and ecofriendly cars.

Next generation AURIX microcontrollers from Infineon will integrate a new highperformance AI accelerator called Parallel Processing Unit (PPU) that will employ Synopsys’ DesignWare ARC EV Processor IP. AI and neural networks are fundamental building blocks for future automated driving applications such as object classification, target tracking, or path planning.

Furthermore, they play an important role in optimizing many other automotive applications, helping to reduce the cost of ECU systems, improving their performance and accelerating time-to-market.

“By developing the PPU together with

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Synopsys we make sure that our future microcontrollers will provide the safety features, throughput, and powerefficient performance necessary to meet increasing AI computational requirements,” said Peter Schäfer, head of the microcontroller business line of Infineon’s Automotive Division. “This will prepare the AURIX for data-hungry automotive applications such as future gateways, domain and zone controllers, engine management, electro-mobility and advanced driver assistance systems.”

“In many AI-driven applications, safety is paramount,” said Joachim Kunkel,

General Manager of the Solutions Group at Synopsys. “Combining the processing power and safety features of our ARC EV Processor with the proven architecture of the AURIX will enable the development of automotive systems at the highest levels of functional safety.”

The EV Processor is supported by Synopsys’ MetaWare EV Development Toolkit for Safety, which speeds safety-compliant application software development for automotive designs. The resulting AURIX toolchain will support model-based designs, enabling the latest software design strategies and reducing the increasingly demanding automotive time-to-market.

Furthermore, by supporting convolutional neural networks, the PPU will help pave the way to holistic security systems. It will enable layered security concepts supporting techniques for intrusion detection and prevention systems like deep packet inspections or system entropy monitoring.

AT&S India receives ELCINA Award

Fujitsu and PeptiDream partner for research and development

AT&S India has won the 44th ELCINA award for Excellence in PCB Manufacturing at national level. AT&S India was adjudged as the award winner for the year 2018-19 in the category of large companies by an accomplished panel of eminent experts from both industry and government. This award is conferred in recognition of the overall excellence in manufacturing of printed circuit boards along with efforts to increase manufacturing output, investments in technological upgradation and increase in production capacity. Sunil Banwari, MD & COO, AT&S India and M S Latesh Kumar, Senior Engineer – Product Engineering, received the award on behalf of the company from the Secretary, Ministry of Electronics and Information Technology (MeitY), Government of India, Ajay Prakash Sawhney at a top class celebration in Greater Noida near New Delhi. The printed circuit boards manufactured by AT&S India are the enablers for key global electronic trends in Automotive, Industrial and Medical applications, including miniaturization, machine-to-machine communication for wearables, networking of vehicles, and internet of things amongst others. The ELCINA award for Excellence in PCB Manufacturing is awarded in consideration of strict parameters based on export of printed circuit boards, rate and consistency of growth in manufacturing revenue.

Fujitsu Limited and PeptiDream has announced to joint research and development in the area of peptide drug discovery, using Fujitsu’s Digital Annealer, which employs next-generation computing architecture to quickly solve combinatorial optimization problems.

By combining Fujitsu's proprietary high-speed, quantuminspired computing technology with PeptiDream’s advanced knowledge and wealth of experimental data in unique peptides, the companies seek to develop revolutionary in silico drug discovery technology.

“In searching and optimizing unique peptides, it is very important to have an understanding of a peptide’s stable conformation in water and its stable conformation when the peptide interacts with a protein. In analyses using conventional computers, even at their fastest, these calculations took several days. We are very pleased to collaborate with Fujitsu and its Digital Annealer on the potential for reducing the time required for these calculations to a fraction of what is required today. Through this collaboration, we would like to substantially improve the efficiency of the unique peptide search process and contribute even further to the creation of innovative new drugs”, said EVP Keiichi Masuya, Ph.D, PeptiDream.

BISINFOTECH|OCTOBER 2019|VOL 1|ISSUE 10

INDUSTRY UPDATES

Si-Ware launches small, lightweight NeoSpectra-Scanner Honeywell Powers India’s Auric And Faridabad Smart City Honeywell has stated that it is working with the Aurangabad Industrial Township Ltd. and Faridabad Smart City Ltd. to run cities more effectively and improve citizens’ living standards through smart building technologies and services that seamlessly connect an array of city services, including emergency response, traffic management, road congestion, crowd monitoring, pedestrian safety, and crime prevention.

The Aurangabad Industrial City and Faridabad smart city project were inaugurated this weekend by Shri Narendra Modi, Honorable Prime Minister of India. The Smart Cities Mission aims to use technology to improve the quality of life of residents as well as drive economic growth in 100 cities across India. For the Faridabad project, Honeywell supplied, installed, tested and commissioned a command and control system, and is supplying a CCTV surveillance system, automatic number plate recognition cameras, a facial recognition system, a red-light violation detection system, an adaptive traffic control system, IoT sensors for smart parking and smart roads, and cybersecurity.

Si-Ware Systems has introduced the first handheld material analysis scanner with plug-and-play development capability for rapid deployment in the field or on the factory floor.

The NeoSpectra-Scanner is built around Si-Ware’s award-winning NeoSpectra spectral sensor technology, with a wide spectral range for many applications. A market-ready tool for resellers, it is expected to help drive on-site material analysis into a broad range of industries. The NeoSpectra-Scanner enables users to add on-site intelligence in their operations, instantly identifying and quantifying composition of materials used in farming, food processing, and industry. With the device’s streamlined 5-step application development, resellers and direct users can quickly deploy the tool to the field for their market of choice.

“We have seen a high degree of interest in handheld material analysis from several key industries,” said Dr. Bassam Sadaany, Business Unit Manager, Si-Ware Systems. “They wanted to avoid the lag time of sending samples to a lab and also wanted their teams to have an out-of-the-box and cost-effective solution that didn’t require hours of development or calibration time. We developed the NeoSpectra-Scanner to enable both resellers and in-house teams to easily and quickly develop critical applications for almost any field or industrial environment.”

The NeoSpectra-Scanner offers a number of advantages over other portable scanners on the market. In addition to being smaller, lighter, and hardware- and software-ready, the scanner has a large spot size (up to 10 mm) for measuring non-homogenous materials such as grains and soils.

New Manufacturing Facility of Electrolube in China Electrolube made a grand opening of its new 8,800-squaremetre manufacturing facility in Zhuji, in the Zhejiang province of China, on the 23rd August.

Many guests including leaders of local Government, clients and distributors attended the special occasion to celebrate the growing success of Electrolube in China.

Key speeches were given by the Group Managing Director, Ron Jakeman, the newly appointed CEO and Vice President of HK Wentworth’s Asia operation, Sharon Zhang, and one of Electrolube’s longstanding distributors. HK Wentworth’s Asian operation has now moved from its former Beijing-based manufacturing facility, where it has been situated since 2002, to the new state-of-the-art manufacturing site in Zhuji. The extensive relocation comes as a result of the company’s phenomenal growth in China over the past 17 years. In line with HK Wentworth’s strategic objectives to take Electrolube China to the next level of growth and development, the new factory houses 5 floors and provides enormous capacity to expand the manufacturing

capability of Electrolube products, which include Conformal Coatings, Thermal Management Materials, Encapsulation Resins, Contact Lubricants, Cleaning Solutions and Service and Maintenance Aids.

Group Managing Director, Ron Jakeman, comments, “The relocation of our manufacturing operation to Zhuji is the culmination of an exciting year for us as the company continues to go from strength to strength. This is a very dynamic time for Electrolube and the move forms part of our strategic plan to drive the organisation forward and build on Electrolube’s thriving reputation in the Asian electronics industry.”

Sharon Zhang, CEO and Vice president of Electrolube China, adds, “We are all very excited to start this new part of the journey to support our customer base in Asia from our new world-class manufacturing facility. The new manufacturing facility in Zhuji combined with our extensive R&D facility in Suzhou represents a real coup for Electrolube China and we will continue to support the local domestic market as well as export Electrolube products all over the world.”

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INDUSTRY UPDATES

Power Integrations One-Millionth GaN-Based InnoSwitch3 IC

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Power Integrations has recently announced the delivery of its one-millionth InnoSwitch 3 switcher IC featuring the company’s PowiGaN gallium-nitride technology.

In an event at the Shenzhen headquarters of Anker Innovations, Power Integrations CEO Balu Balakrishnan presented the onemillionth GaN-based IC to Anker CEO Steven Yang. Anker is a leading manufacturer of chargers and adapters, supplying retailers worldwide with powerful, compact USB PD adapters and a wide range of chargers and adapters for laptops, smart mobile devices, set-top boxes, displays, appliances, networking gear and gaming products.

InnoSwitch3 offline CV/CC flyback switcher ICs with PowiGaN technology are up to 95% efficient across the load range.

Very low switching and conduction losses of PowiGaN primary switch allows delivery of as much as 100 W from a space saving InSOP 24D surface mount package in enclosed adapter applications without requiring a heatsink.

Quasi-resonant InnoSwitch3-CP, InnoSwitch3-EP and InnoSwitch3-Pro ICs combine the primary power switch, primary and secondary control with safety isolated high speed link (FluxLink™) in between, as well as the secondary SR driver and feedback circuits in a single surface-mounted package. The superior switching performance of PowiGaN

technology results in substantially higher efficiency, enabling very compact adapter designs.

Commented Balakrishnan, “Anker is a world leader in compact charger design, and was the first high-volume customer for InnoSwitch3 products with PowiGaN. I’m pleased to recognize Anker’s foresight and technical excellence, and to thank Mr. Yang for his critical contribution to the first successful massmarket deployment of high-voltage GaN technology.”

Added Yang, “By using PowiGaN-based InnoSwitch3 ICs we are able to offer USB PD chargers that are compact, lightweight, and capable of delivering high power output.

We are excited to use this innovative new technology to help us achieve our goal to charge everything faster. We are confident this advancement will help us keep gaining positive market feedback and customer response.”

Qualcomm announces XR Enterprise Program

ROHM announces BD81A76EFV-M availability

The Program enables enterprise solution providers by connecting the ecosystem with Qualcomm Technologies’ transformative technology to help accelerate XR collaboration, innovation and adoption in key business verticals.

The program brings XR technologies and products based on the Qualcomm Snapdragon XR Platform, together with enterprise solution providers to collaborate, innovate and help drive AR and VR adoption in a range of industries including manufacturing, energy, healthcare, aerospace, education, insurance, retail, transportation and architecture, engineering and construction (AEC). The Qualcomm XR Enterprise Program allows inaugural members – the enterprise solution providers – to be part of a global community that offers access to technical support resources, promotional opportunities, co-marketing, joint planning and business development and matchmaking with other members for the collective goal of accelerating the enterprise XR segment to help increase operational efficiencies, worker satisfaction & safety and impact the bottom line. “Qualcomm Technologies views the enterprise as a critical segment for growing the overall XR industry and we are committed to furthering adoption by bringing together the best hardware and software solutions providers to meet the respective demands of a business’ function and use cases,” said Brian Vogelsang, senior Director of Product Management, Qualcomm Technologies, Inc.

ROHM has recently shared the availability of the latest LED driver IC, the BD81A76EFV-M, optimized for LCD backlight in instrument cluster, center information displays and car navigation.

Unlike conventional drivers with 4 channels that support LCDs up to 8”, this IC provides 6 channels of output (with 120mA per channel) that can support LCD panels of up to 10-12” class. At the same time original buck-boost control ensures compatibility with both small and large LCDs using a single driver. This makes it possible to develop a common design of LCD control board suitable for conventional panels along with the latest largesize displays.

In recent years, to improve both visibility and design in the automotive field, LCDs are being used in an increasing number of systems including instrument clusters, head-up displays and car navigation. In addition, larger screen sizes are being demanded. They require a greater number of high brightness LEDs for backlight as well as LED drivers featuring multi-channel operation and advanced dimming features that can prevent flicker effects.

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INDUSTRY UPDATES

Schneider Electric Launches Dedicated EcoStruxure in India Partners with Microsoft to help Oil, Gas & Petrochemical Industry become more efficient, profitable and sustainable Launch of EcoStruxure to leverage government’s thrust on self-sufficiency in Oil, Gas & Petrochemical Sector • CapEx improvements of 20% for energy and process solutions scope across the project lifecycle • Unplanned downtown reductions of 15% • Drive efficiency across the entire value chain of Oil, Gas & Petrochemical Industry • Business profitability improvements of 3% In a move that promises to boost India’s rapidly evolving oil & gas sector, Schneider Electric launches EcoStruxure Power & Process (EP&P) to drive efficiency and augment profitability.

The company has partnered with Microsoft to create commercial internet of things (IoT) solutions in the areas of energy management and automation, thus bringing power and process systems together. Through this platform, Schneider Electric aims to address the challenges of market volatility in the O&G sector, while reducing CapEx and OpEx by 20-30% When power and process management systems operate as separate silos, industrial organisations soon find themselves at a competitive disadvantage. Separate teams of engineers and programmers are needed to build up and maintain operations.

As a result, the cost of supporting these complex, customised interfaces across the lifetime of the asset is high and it restricts the organisation’s ability to respond to changing market conditions.

With the introduction of EP&P in the Indian market, companies in the oil, gas & petrochemical sector can break down the traditional barriers between power and process control systems to solve critical engineering and operating challenges. This

can result in better returns on capital employed (ROCE), with a 20% reduction in CapEx, 15% reduction in downtime, and 3% growth in profitability. Speaking on the launch, Anil Chaudhry, Zone President & Managing Director, Schneider Electric India said- “Marketplace changes and technology advancements are making the once daunting task of converging power and process systems an attainable, cost-justifiable goal. The Indian hydrocarbon sector is at the cusp of major transformation as companies across the value chain step up their efforts to boost India’s self-sufficiency in oil and gas, expand refining capacities, and set up pipeline infrastructure for transportation across the country. Through our partnership with Microsoft we aim to deliver real/tangible solutions and measurable business results for oil and gas players, improve efficiency, bring down cost of running operations and raise profitability.”

SMART announces Novel Integrated Silicon III-V Chips The Singapore-MIT Alliance for Research and Technology (SMART) has announced the successful development of a commercially viable way to manufacture integrated Silicon III-V Chips with high-performance III-V devices inserted into their design.

III-V chips are made from elements in the 3rd and 5th columns of the elemental periodic table such as Gallium Nitride (GaN) and Indium Gallium Arsenide (InGaAs). Due to their unique properties, they are exceptionally well suited for optoelectronics (LEDs) and communications (5G etc) boosting efficiency substantially.

“By integrating III-V into silicon, we can build upon existing manufacturing capabilities and low-cost volume production techniques of silicon and include the unique optical and electronic functionality of III-V technology,” said Eugene Fitzgerald, CEO and Director,

SMART, MIT’s Research Enterprise in Singapore. “The new chips will be at the heart of future product innovation and power the next generation of communications devices, wearables and displays.”

Kenneth Lee, Senior Scientific Director of the SMART LEES research program adds: “However, integrating III-V semiconductor devices with silicon in a commercially viable way is one of the most difficult challenges faced by the semiconductor industry, even though such integrated circuits have been desired for decades. Current methods are expensive and inefficient, which is delaying the availability of the chips the industry needs. With our new process, we can leverage existing capabilities to manufacture these new integrated Silicon III-V chips costeffectively and accelerate the development and adoption of new technologies that will power economies.”

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BIG PICTURE

How to Monitor Soil pH and Moisture Level Maintaining proper soil moisture and pH is a fundamental requirement for plant health, whether applied in largescale agriculture or simple home gardens. To measure these soil characteristics, however, developers need to design costeffective precision analog signal chains able to convert raw data to useful information required for specific soil measurement applications.

One approach to achieving these goals of precision is to use a reference design with appropriately flexible software.

A good example of such a solution is the EVAL-CN0398-ARDZ board and software package from Analog Devices.

This article discusses the applications and requirements associated with monitoring soil moisture and pH before introducing the Analog Devices CN0398 board and reference design. The article explains how the major components used in the CN0398 design address key design requirements and examines their role in the overall application. The article finishes by showing how developers can use the CN0398 board and associated software package to rapidly evaluate and customize soilmonitoring applications.

The need for accurate soil measurement

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The need to maintain proper soil water content and pH level is a fundamental requirement for plant growers at any scale

BISINFOTECH|OCTOBER 2019|VOL 1|ISSUE 10

RICH MIRON

Applications Engineer Digi-Key Electronics

of production. Soil water deficiencies directly translate into reduced photosynthesis for any plant, as well as a decline in other biological processes such as nitrogen fixation in important legume crops such as soybeans.

Similarly, changes in soil from fertilization or natural phenomena can dramatically impact soil pH, leading to a reduction in essential microbes and soil nutrients. In some crops, improper soil pH in early growth stages leads to lower growth rates and final yield.

Without suitable soil monitoring systems, soil moisture and pH can shift to unfavorable values, resulting in eventual deterioration of plant health. Together, the Analog Devices EVAL-CN0398-ARDZ board and software package provide a complete soil monitoring design that developers can employ directly or modify to meet their unique requirements.

Analog Device’s CN0398 board and reference design were created specifically for use with external moisture, pH, and temperature sensors in soil measurement applications. Its on-board circuitry comprises a complete multi-sensor design required to produce moisture and pH output data accessible through its serial interface. Even with its extensive functionality, the design consumes a maximum of only 1.95 milliamps (mA) and provides powersaving features, including the use of pulse-width modulation (PWM) for powering external sensors.

DESIGN

Developers can use the CN0398 to jumpstart custom hardware designs or use the board with the Analog Devices EVALADICUP360 Arduino-compatible baseboard. Designed as an Arduino shield, the CN0398 plugs directly into the baseboard providing a platform for rapid application development.

To speed software development, engineers can take advantage of Analog Device’s ADuCM360_demo_cn0398 open-source software package designed for use with the CN0398 sensor board, ADICUP360 baseboard and Analog Device’s CrossCore Embedded Studio. Along with basic drivers and system support utilities, the software package includes complete C++ source and header files, including a complete soil measurement software application.

The combination of the Analog Devices board set and software package provides developers with a complete hardware design and software application ready for immediate use in soil measurement applications. Just as important, the CN0398 hardware reference design and sample software provides the blueprint for rapid development of custom soil measurement systems able to meet the unique requirements of these applications.

Sensor signal processing

The CN0398 hardware design includes three separate subcircuits for external moisture, pH and temperature sensors. Each subcircuit provides all the circuitry required to interface with each type of sensor. As a result, developers need only plug each sensor into its corresponding connector on the CN0398 board and provide power to begin sensor operations. This functionality is built around the Analog Devices AD7124-8, which combines an extensive signal conditioning front end with a 24-bit sigma-delta (Σ-Δ) analog-to-digital converter (ADC) (Figure 1).

its ADR3433 voltage reference as the analog supply (AVDD) and voltage reference (REFIN1) (Figure 2). As described below, designs for each of three sensor circuits requires only a few additional components.

Figure 2: Using the Analog Devices AD7124-8, developers can implement sensor designs with few additional components beyond specific sensor input circuits and a precision voltage reference such as the Analog Devices ADR3433. (Image source: Analog Devices)

Moisture measurement

Soil moisture systems typically determine water content by taking advantage of the difference in the dielectric constant of water (80) versus air (1). For these systems, developers drive a simple 3-wire sensor such as a TE Connectivity Measurement Specialties HPP809A033 sensor with an excitation voltage to generate an output voltage proportional to soil water content.

In the CN0398 design, the soil moisture front end uses an Analog Devices ADP7118-2.5 low dropout (LDO) linear regulator to provide a stable excitation voltage (Vsensor) for the sensor (Figure 3). To supply the LDO, developers can draw power from the ADICUP360 baseboard or from their custom designs.

Figure 3:The Analog Devices CN0398design usesthe company’s ADP7118-2.5low dropout (LDO) regulator to provide a stable Vsensor voltage source for a capacitive moisture sensor. (Image source: Analog Devices) Figure 1: With its integrated signal chain and ADC, the Analog Devices AD7124-8 simplifies design of multi-sensor systems required for soil measurement. (Image source: Analog Devices)

The AD7124-8’s signal multiplexer can route eight differential or 15 single-ended inputs through its integrated programmable signal chain to the on-chip Σ-Δ ADC and digital filter for conversion and conditioning. Developers use the AD7124-8’s serial interface to connect the device to an MCU host for device control and data conversion.

Because of its extensive functionality, developers can meet a wide range of design requirements with few additional components beyond the sensor circuits and a stable voltage source. For the CN0398 reference design, Analog Devices uses

Although the ADP7118 can provide a continuous sensor voltage level, power consumption concerns and the specific requirements of some moisture sensors dictate the use of a pulsed source for driving the sensor. To address these requirements, developers can supply the sensor with voltage pulses by driving the LDO’s enable (EN) port with an MCU PWM output.

Using its integrated signal conditioning circuit and ADC, the AD7124-8 can reliably sample and convert the voltage output of a moisture sensor. For soil measurement applications, however, the relationship between the converted sensor data and soil moisture can be complex.

In assessing soil moisture, soil health experts typically compare

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DESIGN

soil moisture levels in terms of soil volumetric water content (VWC), which is the ratio of water volume to total soil volume.

Moisture sensor manufacturers typically provide equations for converting the output of their sensors to VWC. Still, soil conditions or the nature of the application itself can require theuse of a conversion equation more suited to their own unique situation.

Analog Devices demonstrates the use of either approach in its sample software package. By enabling the USE_MANUFACTURER_ MOISTURE_EQ to define in the CN0398.h header file, developers can elect to use the manufacturer’s recommended piecewise conversion formulas or a standard conversion equation provided in the software. Here, the sample read_moisture() routine generates a moisture output depending on the sensor output voltage range if USE_MANUFACTURER_MOISTURE_EQ is defined (Listing 1). If the define is commented out in the CN0398.h header, the routine can convert thevoltage to moisture using the provided mathematical expression.

Figure 4: In the Analog Devices CN0398 design, an Analog Devices ADA4661-2op amp provides a buffer between a typical highimpedance pH sensor and the Analog Devices AD7124-8 analog input. (Image source: Analog Devices)

Although the design relies on a single supply voltage, pH sensors typically generate bipolar voltage output. In this case, however, the AD7124-8 provides a simple way to bias the sensor to a suitable level above ground. The AD7124-8 integrates an internal bias voltage generator that sets the common-mode voltage of a channel to AVDD/2. As in this case, designers can use an AD7124-8 output pin to deliver this bias voltageto the low side of the pH sensor (VBIAS in Figure 4). Developers can easily restore the biased input to a bipolar digital result in software.

TheADuCM360_demo_cn0398 open-source software package includes a sample read_ph() routine that illustrates the process of converting pH sensor output voltage to pH values. As with the soil moisture routine, the pH sample routine demonstrates the use of two different approaches for generating pH values (Listing 2).

Listing 1:The Analog Devices CN0398 software package provides a sample moisture routine that demonstrates how developers can use manufacturer conversion formulas or equations to convert moisture sensor voltage to useful moisture data. (Code source: Analog Devices)

pH measurement

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A typical pH sensor such as that in the SparkFun ElectronicsSEN10972pH kit exhibits an equivalent circuit characterized by a high impedance voltage source. Even using an ADC with an integrated signal conditioning front end, experienced developers typically add abuffer between the sensor output and ADC input in these situations.

Accordingly, the pH sensor circuit in the CN0398 design includes an Analog Devices ADA4661-2 op amp (Figure 4). Well-suited to low-power applications such as sensor circuits, the ADA46612 is a precision op amp that features single-supply operation, low power consumption, and low offset voltage across its full operating voltage range.

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Listing 2:Analog Device’s sample routine for reading pH sensor values illustrates use of the standard Nernst equation, or built-in calibration values to convert pH sensor voltage output to pH values. (Code source: Analog Devices)

By setting a variable use_nernst to true in the sample package, developers can generate pH using the standard Nernst equation.

Set to false, the variable causes the routine to use the values created during a two-point calibration procedure, typically performed using reference pH buffer solutions such as those in the SparkFun SEN-10972 pH kit. The sample software routines

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come with set default calibration values using NIST lookup tables for different pH buffer solutions and temperaturecorrected pH values ranging from 0°C to 95°C. Developers can replace the default values with their own custom calibration data, or easily modify the code to support both default and custom values.

Temperature measurement

As illustrated above in Listing 2, pH depends on temperature, either explicitly as in the Nernst equation, or implicitly in custom calibration values. Additionally, temperature impacts sensor sensitivity and the signal chain. Although the AD7124-8’s integrated temperature sensor (see Figure 1 again) can address some of these concerns, reliable soil measurement depends on accurate temperature readings. Accordingly, the CN0398 temperature sensor channel is designed to ensure accurate readings from an external 3-wire PT100 resistance temperature detector (RTD) such as the Adafruit Industries 3290.

As with any resistive sensor, RTDs require an excitation current to allow measurement of temperature-dependent voltage changes. Typically, developers using resistive sensors need to augment their sensor designs with external drivers, regulators and current sensors to maintain excitation current at precise levels. With the AD7124-8, however, developers need only add the appropriate passive networks required to support a 3-wire configuration (Figure 5).

resistor RREF, resulting in a ratiometric measurement. At the same time, IOUT2 produces a voltage drop across the RTD’s RTD SENSE lead resistance that cancels the voltage drop across the RTD+ lead resistance.

As with the moisture and pH sensors, conversion of resistance values to temperature requires an appropriate transfer function.

For a typical RTD, the relationship between temperature and resistance can be reliably expressed mathematically. Even so, two different mathematical expressions need to be used for temperatures above and below 0°C. The ADuCM360_ demo_cn0398 open-source software package supports both methods,as well as a simple linear conversion(Listing 3).

Listing 3: For converting resistance values to temperature, an Analog Devices sample routine illustrates the basic design pattern for selecting the appropriate method based on static definitions (USE_LINEAR_TEMP_EQ) or dynamic values (resistance < R0). (Code source: Analog Devices)

Figure 5:To drive a 3-wire resistance temperature detector (RTD), the Analog Devices CN0398 design uses programmable constantcurrent sources integrated in the Analog Devices AD7124-8. (Image source: Analog Devices)

Integrated in the AD7124-8, a pair of constant current generators provide excitation at various fixed levels from 50 to 1000 microamps (µA), including the 500μA level used in the CN0398 design. Developers set the current level and output pin by programming the IOUTx and IOUTx_CH bits in the device’s IO_CONTROL configuration register, respectively. As part of its initialization routine, the CN0398 software package sets ADC channels AIN11 and AIN12 as output pins for two 500 μA excitation currents, IOUT1 and IOUT2.

Although the current generators are sufficiently accurate for many applications, developers can easily eliminate the impact of current variation by using a ratiometric measurement technique. The CN0398 temperature hardware sensor circuit shown in Figure 5 uses this approach. Here, the same IOUT1 current passes through the RTD and a precision reference

As shown in Listing 3, the sample read_rtd() routine allows developers to select a simple linear conversion macro, PT100_RESISTANCE_TO_TEMP, defined in the CN0398.cpp module. Alternatively, developers can use the more complex mathematical expressions provided in the read_rtd() sample routine. In this case, the 0°C inflection point for choosing the appropriate expression is implicit in R0, which is the RTD resistance at 0°C.

Conclusion

To build soil measurement systems, engineers face an array of challenges in both hardware and software. Hardware designs must address sensor interface requirements, while software must accommodate different approaches for converting raw data to useful information.

The Analog Devices CN0398 board and ADuCM360_demo_ cn0398 open-source software package address both aspects of soil measurement system design. Used in combination with Analog Device’s Arduino-compatible ADICUP360 baseboard, the CN0398 board and software provide a complete soil measurement solution.

Developers can use this turnkey solution to create soil measurement applications,or extend the associated reference design and sample software to build custom solutions.

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BIG PICTURE

Mornsun Outstanding Power Solutions for IoT Systems and Devices MORNSUN Marketing Team IoT, or the Internet of Things, is the technology that has allowed everyday objects to connect to the Internet (and to each other) in order to send and receive information. IoT is what allows you to unlock your front door from your smartphone or adjust the temperature of your home from anywhere. We refer to these devices as â&#x20AC;&#x153;smart devicesâ&#x20AC;? (smart locks or smart thermostats) because their ability to send and receive data allows them to make intelligent decisions and be controlled without a physical presence.

The Growing IoT Industry

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Experts predict that there will be 75.44 billion connected devices worldwide by 2025, and the impending introduction of 5G technology will no doubt further increase the demand for IoT-enabled devices.

The IoT market itself, which includes hardware, systems integration, software, telecom and data services, is expected to reach $520 billion in 2021, which is more than double the amount spent in 2016.

According to Gartner, the sensor market is expected to continue evolving new technology and packaging, which will make it possible to find new applications for sensors.

Figure 1. Internet of Things (IoT) connected devices installed base worldwide from 2015 to 2025 (in billions): Source - Statista

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DESIGN

Powering IoT Applications

The sensors and other electronic components that comprise IoT devices all need the same thing: compact, efficient, and reliable power. All smart systems some form of power input, be it DC/DC converters or AC/DC converters, and there is also a requirement to provide a level of direct communication via RS232 / RS485 or CANBus. Mornsun provides the power solutions that the growing IoT market demands, meeting all the key requirements listed above -- wide voltage ranges, isolation, accurate and stable DC voltage, and compact size. Mornsun’s extensive suite of over 50 different IoT-enabling power products that are appropriate for use in a wide variety of smart applications. The range of products include; • AC DC solutions from 1W to 60W, • DC DC converters from 200mW to 250W • Isolation levels from 1000V to 6000V • RS232/RS485/CANBus controllers Some typical applications of the integration of all these products can be found below.

Smart Thermostat

A smart thermostat is one of the most common IoT-enabled devices in today’s interconnected homes. This device needs power: low cost, compact size, high density , and a very low input current. Not every power supply is suitable for a smart thermostat application. However, MORNSUN has a one-stop solution for this application.

The 3W LS03-15B12R2S(dimension: 35x18x11mm) is an ideal AC/DC Converter to provide a DC bus which can then power an optocoupler drive via a B1212S-2WR2 2W isolated high-density DC/DC converter.

The same AC/DC converter also powers the system microcontroller through a highefficiency K78L05-500R3 DC/DC converter that includes output short-circuit protection and a no-load input current as low as 0.2mA.

Figure 2.HVAC system

Smart Greenhouse Controller

Figure 3. Agricultural greenhouse controller

Agriculture is another early adopter of IoT smart technology. A typical example of a smart agricultural farming is a greenhouse controller. The system needs to be able to power a variety of actuators for the control of temperature, moisture, light intensity (shade) and pesticides depending on the inputs from a variety of sensors. These actuators and sensors typically run off as 24V DC supply, but the primary power source is a mains AC supply. The LI120-20B24R2 AC/DC Din Rail converter provides a 24V DC bus for use by the sensors and actuators. The WRF2405S3WR2 is 3W DC/DC converter, providing 3kV DC isolation with self-recovering short circuit protection, and supplies 5V for the main control unit and display.

Mornsun is Your IoT Power Solution Expert

The demand for IoT devices is growing, and so is the demand for efficient, compact, and economical power solutions that support a wide voltage range. At Mornsun, we not only offer a large portfolio of products to meet your IoT power needs, but many of these products can be customized for your designs. Contact us today and find out how we can help bring your smart designs to life.

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BIG PICTURE

HOW T&M WILL MOVE AHEAD IN 2020?

Paul Gowans, Wireless Strategy Director, VIAVI Solutions inscribes the expected trends and challenges in 2020 for semiconductor automatic test equipment (ATE), radio frequency (RF) test, digital test, electrical and environmental test, and data acquisition (DAQ). Paul discusses with Niloy from BIS about the Indian T&M market, global trends, the impact of 5G and the ways to test sophisticated communications networks. Edited Nub.

PAUL GOWANS Wireless Strategy Director, VIAVI Solutions

Q

Trends and growth drivers expected in the industry?

With the commercialization of 5G, there will be a prevailing trend toward always-on, seamless connectivity and substantial increases in bandwidth, fundamentally transforming the way enterprises and consumers interact with technology. The Internet of Things (IoT) will make use of ubiquitous connectivity to enhance traditional markets and create entirely new ones.

Likewise, we will see growth in industrial automation and the proliferation of smart infrastructure. These 5G use cases may require high data rates or very low latency and strict service level agreement (SLA) enforcement.

Q

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Global scenario and India as a market in 2020?

In India, the use cases for 5G will be specific to the local market. Service providers should determine which implementations will meet the country’s needs, and how best to deploy 5G to suit these use cases effectively and efficiently. For example, 5G technology offers service providers in India the opportunity to monetize large amounts

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5G will improve existing services and support expanded possibilities for the future

performance of these new services and use cases will depend on the network’s ability to provide improved bandwidth, low latency, as well as high reliability and resiliency. This task will be complicated by new features and complexities introduced by 5G technology, including antenna beamforming, flexible spectrum use, dynamic time-division duplexing, and massive MIMO antenna configurations.

Q

Testing sophisticated communications networks in 2020?

Optimization and assurance of the 5G network is crucial to delivering on the promise of the technology. Deployment and maintenance of complex 5G network architecture presents new challenges to network technicians; particularly for RF engineers in the field. of data and analytics for industries Network quality and performance will hinge on the ability to successfully such as tourism and retail. validate, test and optimize the 5G Complexity of 5G and the way network — before, during and after forward? deployment.Moreover, increased Without question, 5G will improve automationwill be critical to supporting existing services and support expanded the sheer volume and complexity of possibilities for the future. Yet the network parameters and decision points.

Q

THE

ROAD TO

YOUR FUTURE

FACTORY

WITH

5G

Making the software-defined car safe JEFF PHILLIPS

Head of Automotive Marketing National Instruments The automotive industry has been experiencing many disruptive and transformational forces these past years. The majority of these are technology-related as more electronics and software is deployed within new car models. The convergence of the automotive and technology industries aims to deliver safer and more energy-efficient vehicles that offer seamless integration with personal electronics and are exciting to drive. Automotive and technology companies have been collaborating for some time now, with infotainment systems seen as perhaps the first convergence point. However, the demand for hybrid and electric vehicles has accelerated the need for electronics-based systems. Electric traction motors require high-power drive controllers, and batteries require constant management to optimize their capacity for maximum range. The need to deliver high current switching capabilities for the controller and service high compute workloads have introduced a different set of semiconductor suppliers into the automotive supply chain.

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In some cases, traditional semiconductor suppliers whose

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products previously used for simple comfort control applications, for example, have found themselves displaced in favour of the more powerful semiconductor devices. Likewise, many switches are now replaced by touchscreen controls as the infotainment system has become the focal point for not only music, radio and navigation, but as the control interface to a host of the vehicleâ&#x20AC;&#x2122;s emerging software-defined advanced driver assistance systems (ADAS). ADAS functions such as adaptive cruise control (ACC), blind-spot warning, and lane-departure warnings are becoming commonplace in todayâ&#x20AC;&#x2122;s vehicles, expanding the number and complexity of the electronic control units (ECUs) used. The software required by these complex systems has become ever more sophisticated as has the techniques to make them utilize the hardware resources more efficiently. Virtualization and hypervisor concepts, commonplace in data centre applications are increasingly prevalent within ECUs. Incorporating all such innovations into our vehicles has been daunting for the automotive industry, presenting some

AUTOMOTIVE

ADAS functions, introducing a further complexity to the test environment automotive manufacturers need to ensure compliance against automotive and government safety regulations.

significant challenges. One major obstacle has been how to make sure all the software-defined systems operate together in a predictable, reliable and safe manner. Traditional test regimes used across the automotive industry have not kept pace with the amount of technology now deployed within a vehicle, slowing the speed with which new vehicle platforms are brought to market. For example, in some cases, ECUs have been tested individually, one after another rather than testing multiple units at the same time in a parallel manner. Most notably is the fact that many ADAS systems, for example, an emergency braking system, are operating at extremely high speed using a solid-state radar with steerable beamforming features. Such situations introduce not only complexity in terms of the number of possible test conditions to be checked, but the speed with which the test equipment needs to operate.

Further, software reliability and safety certifications such as ISO26262 has introduced formal software integrity levels of compliance to validate the many lines of code used to deliver semi- or fully autonomous driving. The nature of many safety functions also involve interdependence on other

Embracing a different approach to vehicle test is crucial for the automotive industry as they move to a world where a software-defined vehicle is standard. Conformance to internationally recognized safety standards is an important step forward to engender consumer confidence. Technology test in the IT world is equally important and well established.

However, our laptop computer crashing or needing to be reset, something that we all regularly encounter, doesnâ&#x20AC;&#x2122;t have the potentially fatal and direconsequencesthat an ECU crashing would when driving along a busy major route.

Automotive manufacturers need to embrace a new world of test, one that involves parallel testing of individual ECUs and modules, rapid automated testing across a wider range of test conditions, and a holistic test approach that encompasses all vehicle functions. A new approach to the test environment is required, one that can adapt further as the automotive and technology worlds converge even closer. By doing so, and by learning from test innovations already used in the technology industry, automotive manufacturers can gain competitive advantage, avoid unnecessary costs, and build trust with consumers.

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Simple Realization of a Fully Integrated 4-Wire RTD Temperature Measurement System for High Precision Measurement Applications

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For a wide variety of products, manufacturing processes require highly precise and reliable temperature measurement technologies. Temperature is often measured through direct contact with a sensor, for example, through immersion of a sensor in liquid or through contact with the surface of a machine.

Aside from thermistors and thermocouples, resistance temperature detectors (RTDs) are especially suitable because of their fast response times and superior sensitivities up to a few hundred μV/°C. They can also be used for measurement over a very wide range of –200°C to +800°C with

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THOMAS BRAND Field Applications Engineer

Figure 1. Comparison of 2-, 3-, and 4-wire measurements.

nearly linear behavior. RTDs are available in a variety of versions, for example, with

2, 3, or 4 wires, offering a high degree of application flexibility.

TECH FEATURE

To generate the measurement voltage, the RTD requires an excitation current.

Depending on the RTD type, the voltage level varies from several tens to a few hundreds of millivolts. The accuracy of the measurement system depends not only on the temperature sensors but also on the selection of suitable measuring instruments, the system configuration, as well as the measurement circuit type.

Depending on the number of wires, RTD sensors can be used in 2-, 3-, or 4-wire measurement circuits. A comparison of these different measurement circuits is shown in Figure 1.

In the 2-wire measurement circuit, the two wires that supply the RTD with excitation current (I) are also used to measure the sensor voltage. Due to low sensor resistance, even relatively low wire resistances RL produce relatively high measurement inaccuracies. In 3- or 4-wire measurement systems, this error can be minimized because the sensor

excitation occurs via separate wires and the sensor’s measurement wires are placed directly on the measuring device inputs, which usually have a high impedance.

Due to the low voltage drop across the RTD, the signals are, unfortunately, very prone to being noisy. Long measurement wires should hence be avoided whenever possible. The noise can be reduced through amplification of the voltage as close as possible to the signal source or the RTD. In addition, sensitive analog-todigital converters (ADCs) with a good signal-to-noise ratio (SNR) should be used for further data processing. Σ-Δ ADCs such as the AD7124 family from Analog Devices offer a fully integrated, 24-bit, low noise analog front end (AFE), which is ideal for high precision measurement applications. The inputs can be selectively configured as differential or single-ended/ pseudo differential inputs. The AD7124 family also has an integrated digital filter and a programmable amplifier stage, making it ideal for low voltage applications. The circuit depicted in Figure 2 shows a 4-wire measurement configuration example using the AD7124.

Figure 2. A 4-wire RTD temperature measurement configuration with the AD7124.

The analog pins AIN2 and AIN3 on the AD7124 are configured as differential inputs and measure the RTD voltage.

The excitation current for the RTD is drawn internally from the analog supply voltage AVDD and supplied via AIN0. The excitation current flows simultaneously through the reference

resistor RREF1, operating as a precision resistor, causing a voltage drop that is then detected via the reference pins REFIN1(+) and REFIN1(–). The voltage drop created is directly proportional to the voltage drop across the RTD. This ratiometric configuration ensures that changes in the excitation current have no effect on overall system accuracy.

RREF2 generates an offset voltage that is required for proper operation due to the ADC’s active internal analog buffers.

The buffers are needed to filter the readings prior to analog-to-digital conversion, thereby providing antialiasing and reducing noise. Alternatively, it would also be possible to connect all analog inputs and the reference inputs with discrete RC filters. Calibrating the measurement system (zeroscale and full-scale calibration) to minimize gain and offset errors before starting the measurement is also easy with the AD7124.

Conclusion With AFEs such as the AD7124 family, RTD temperature measurement systems can be realized relatively easily. They offer a very good combination of high accuracy, low power, and low noise, suitable for high precision measurement applications and for power-saving portable devices. In addition, the level of integration and flexibility of these ADCs simplifies the design architecture and help to shorten the design cycle for measurement applications (for example, temperature, current, voltage, etc.) using different types of sensors.

About the Author Thomas Brand began his career at Analog Devices in Munich in 2015 as part of his master’s thesis. After graduating he was part of a trainee program at Analog Devices. In 2017, he became a field applications engineer. Thomas supports large industrial customers in Central Europe and also specializes in the field of Industrial Ethernet.

He studied electrical engineering at the University of Cooperative Education in Mosbach before completing his postgraduate studies in international sales with a master’s degree at the University of Applied Sciences in Constance. He can be reached at thomas.brand@ analog.com.

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Why itâ&#x20AC;&#x2122;s tough to characterize SiC power MOSFETs

LEVI GANT

Xuning Zhang, Ph.D., Littelfuse, Inc.

Switching transients and parasitics can combine to thwart the accurate measurement of important MOSFET operating parameters.

Additionally, the extremely fast switching speeds of SiC MOSFETs also present challenges when characterizing the devices. For example, equipment selection can affect test and measurement accuracy. The highly sensitive design and integration schemes of the driving and power stages also play a role in minimizing voltage spikes, EMI, and switching losses.

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Silicon carbide (SiC) power MOSFETs get a lot of attention because they can switch fast while maintaining high blocking voltages. But their superior switching qualities also have potential drawbacks.

Parasitic inductances caused by lessthan-optimal board layouts, along with the SiC MOSFETâ&#x20AC;&#x2122;s fast dv/dt and di/dt qualities, can create voltage and current overshoot, switching losses, and system instability problems. To head off such difficulties, designers must understand SiC MOSFET switching qualities in depth.

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Ensuring test and measurement accuracy

Circuit and package parasitics and the high-speed switching of SiC MOSFETs all complicate characterization tasks. The fast dv/dt and di/dt amplify measurement inaccuracies, voltage/current ringing, etc.

High dv/dt can produce large transient voltage spikes, as well as common-mode noise that can appear as damped oscillations. High di/dt generates noise that can couple with nearby magnetic fields. These effects can be difficult to

measure and diagnose. It takes special tools and test methods to uncover hidden problems before they emerge during product qualification stages or as infant mortality failures. And it takes tools with exceptional bandwidth and dynamic range to characterize SiC power devices that are switching high levels of power at high speeds.

Differential probes are commonly used for high-voltage measurements of this type. But though they offer built-in galvanic isolation, they have relatively limited bandwidth. In contrast, passive voltage probes have enough bandwidth but lack galvanic isolation. Additionally, many passive voltage probes are not rated for high voltages. If this is the case, a traditional voltage divider must be designed into the circuit as well, introducing another resistive load. All things considered, the best option for these voltage measurements is a passive

DESIGN

tests and not for continuously operated systems.

Optimizing power loop layout

voltage probe with a voltage rating high enough to capture high dv/dt transients.

Four methods are commonly used for measuring current: a Rogowski coil, an active current probe, a current transformer, or a coaxial current shunt.

Each method presents both pros and cons.

For example, an active current probe and a Rogowski coil are unobtrusive in terms of incorporating them into the test circuit. However, they typically lack the bandwidth to measure current ringing effects.

A current transformer likely has enough bandwidth to capture ringing frequencies.

But it requires that current pass through its aperture – sometimes a tight bottleneck — and can’t make dc measurements, a drawback it shares with the Rogowski coil.

The current shunt also requires a bottleneck in the circuit and is not galvanically isolated like the other three options. But it is often the best way to measure current during characterization because it captures all frequencies, from dc up to megahertz. It should be noted, however, that the current shunt has a low power dissipation. So it is only appropriate for measurements in pulsed

Most power circuits actually contain two main circuits: the gate drive loop and the power loop. In the power loop, high levels of voltage and current switch at extremely fast edge rates. This phenomenon leads to voltage and current overshoot and ringing. The extent of overshoot and ringing relates to the amount of parasitic inductance and capacitance in the power loop.

One primary concern is voltage overshoot during turn-off. This overshoot is characterized by the product of the di/ dt and power loop inductance. A high di/dt is desirable, so designers must keep the power loop inductance as low as possible. Peak-voltage overshoots that approach the device’s maximum voltage rating put the device at greater risk of catastrophic failure. If excessive parasitic inductance in the power loop can’t be avoided, designers could be forced to limit the speed at which the devices switch or to implement a multi-level topology, at the cost of greater design complexity and more components.

Another concern is electromagnetic interference. During switching, severe ringing in the current waveforms can turn the power loop into an antenna, broadcasting megahertz-band frequencies. This noise broadcast by the power loop can potentially couple into other sub-circuits, perhaps causing inadvertent device turn-on and shootthrough, nearby peripheral circuit malfunctions, or failure to comply with mandated electromagnetic compatibility regulations.

The first principle of optimizing the power loop layout should be to keep the board compact and simple, minimizing the overall power loop area. The ideal scenario would be a loop that consists of only one point in space, that is, no trace/ wire at all. A more realistic scenario is a loop with an outgoing path that overlaps with (is mirrored by, on another PCB layer) the return path, a practice known as lamination. In portions of the loop where lamination is not possible (such as the pins of a through-hole component), power paths should be wide enough to accommodate the current but as

short as possible to maintain a compact overall loop.

The use of decoupling capacitors is another good practice for optimizing the power-loop layout. The process of switching at high speeds creates higher-order harmonics of the switching frequency (fs) and transient-related frequencies (ftrans) that extend well into the megahertz range. Typically, the dc link capacitor acts as a notch filter, eliminating oscillations corresponding to fs and its harmonics of appreciable amplitude; however, it does not suppress ftrans frequencies, which can couple into neighboring traces and circuits.

To suppress peaks associated with ftrans, connect relatively high-farad film capacitors across the dc link and place them as close to the power transistors as possible to minimize the associated loop inductance.

Gate driver design

The gate drive has two main purposes: to turn power switches on and off in a stable, well-controlled manner and to protect power stages when necessary. However, these tasks can be difficult without proper design layout and integration of the gate drive with the power stage. Common problems include unnecessary switching losses, gate-voltage overshoot and ringing, and EMI from the power loop that makes the control circuit malfunction.

Even a modest level of common-source inductance (LCSI) will resist fast changes in current and boost switching losses. In the presence of high gate and source loop inductance (LG and LS), high values of di/dt can lead to overshoots in the voltage that appears at the device gate.

Oscillations in the gate voltage waveform can lead to inadvertent turn-on and, as a result, potentially catastrophic shootthrough events. Hammering the device gate repeatedly with excessive voltage can also degrade device reliability and lifetime.

Best practices to optimize the design and integration of the gate driver circuit include reducing the effect of inductive coupling between the gate and power loops. Wherever possible, place these two loops in orthogonal planes. Next, just as with optimizing the power loop, minimize the total gate loop area through a combination of lamination

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and shortening of path lengths. Finally, to reduce common-source inductance, decouple the gate and power loops by using packages with a dedicated Kelvin source, such as the four-lead TO-247 or the seven-lead TO-263.

Double-pulse testing offers a way to evaluate a SiCdevice’s switching performance accurately on a per-cycle basis. This test involves turning the device on twice.

A double-pulse test setup. In this test, an inductive load is in parallel with a free-wheeling device in the upper switch position. These elements make up the free-wheeling path for current during DUT turn-off states. The DUT occupies the lower switch position. This testing configuration is useful for studying switching energy and gate charge characteristics of the DUT. The width of the first turn-on pulse, in conjunction with the inductor value and bus voltage, determines the current amplitude through the device during turn-off. During the period between the first and second turn-on pulses, the energy stored in the inductor circulates through a free-wheeling device. This action allows the device to see the same set of operating parameters during the rising edge of the second pulse, the turn-on event.

In a double-pulse test, an inductive load is placed in parallel with a free-wheeling device in the upper switch position. These elements make up the free-wheeling path for current during DUT turn-off. The DUT occupies the lower switch position. This testing configuration is useful for studying switching energy and gate charge qualities of the DUT. The waveforms of interest are gate-source voltage (VGS), drain-source voltage (VDS), and drain current (ID).

In this test, voltage-controlled relays di sconn ec t the d c p owe r s up p ly (positive and negative rails) from the test setup. The dc link capacitance is sized so it can maintain the desired bus voltage throughout the test after being disconnected from the dc power supply.

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This improves measurement conditions by minimizing the risk of ringing during transient events caused by ground loops.

If the system can’t accommodate a dc link capacitor big enough to allow for disconnection from the dc voltage supply, the dc link capacitance must still be large enough to maintain dc voltage during device switching.

Results of a double-pulse test performed with an 800-Vdc bus voltage and a device current of 20 A. Top, captured waveforms from double-pulse test (10 μsec/div). Middle, magnified portions of the waveforms above that correspond to the turn-off transient waveforms (50 nsec/div). Bottom, magnified portions of the top waveform that correspond to the turn-on transient waveforms (50 nsec/div). These events are used to characterize the switching behavior of the MOSFET in terms of its switching energy, switching speed, rise and fall times, voltage overshoot, etc.

The high switching speed of SiC MOSFETs means the dv/dt and di/dt can exceed 80 V/nsec and 5 A/nsec respectively under certain test conditions. Because these devices are switching on and off within tens of nanoseconds, the measurement probes must have adequate bandwidth, good dynamic performance, and loading capacitance that is small.

Matlab is a useful tool for determining the numerical values of device switching qualities. Once the raw data is imported, the VDS and ID must be properly deskewed. A nearby graphic gives an example of plots generated for the turn-on and turn-off transient voltage (VDS), current (ID), and instantaneous power. Switching energy calculations and switching behavior of the DUT can be derived from these waveforms. The waveforms indicate that, during the turn-off event, a ~70-V overshoot takes place, dv/dt = 68.72 V/nsec, di/dt = 1 A/ nsec, and turn-off loss is ~60 μJ. During the turn-on event, a ~10-A overshoot takes place, dv/dt = 39.47 V/nsec, di/dt = 5.2 A/nsec, and turn-on loss is ~270 μJ. Note that switching loss values are obtained via integration of instantaneous power.

The double-pulse technique has proven useful for characterizing SiC MOSFET switching losses, as well as for other typical dynamic parameters such as switching times, gate charge, and reverse recovery.

References

An application note covers the Littelfuse Dynamic Characterization Platform: Double-pulse test waveforms after postprocessing.

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BIG PICTURE

Selecting Right Low Power Short-range Protocols for your IoT Solutions

By- Volansys

IoT applications are growing by leaps and bounds in various industries with a multitude of use cases ranging from personal to industrial areas. However, technological advancements have made it difficult to choose wireless connectivity for designing specific applications focusing on particular industry needs. In this blog, we bring more clarity about possible options. We will provide various technical measures with broad classification for each popular wireless technology. Based on that, you can decide which wireless technology is best suitable for your IoT solution. The blog will also provide highlights about the brief background of each technology, the strength of each protocol, and core application areas.

Some of the broad parameters to make decisions are as follows: ● Type of Industry application ● Easy access to technology & hardware availability ● RF Band of operation & application range ● Addressing security concerns ● Technology Support ● Data rate

1) Bluetooth Low Energy (BLE)

Bluetooth Classic, the predecessor of BLE is much popular due to its availability in smartphones for music streaming, audio calling. Bluetooth standard’ specification is managed

by Special Interest Group (SIG), which has released the latest specification which is Bluetooth 5.0.

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BLE 5.0 is becoming prominent in the IoT world for a significant-

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DESIGN

good range of connectivity as well as the inclusion of the mesh profile in the standard specification. Due to the major adoption of BLE by various semiconductor companies, it’s the first choice as wireless connectivity for personalized IoT solutions in different consumer industries.

Usage of BLE is getting very popular as different industries are adopting applications based on that and getting benefited too. Let’s take the example of a few industry applications getting very popular, Asset Tracking solution using BLE beacons.

IoT Gateway plays a very critical role in the entire solution.

Another industry example is in the Healthcare segment where a hospital can use a BLE beacon wrist band for pa tients to track their movement, manufacturing units where they can track the movement of materials using BLE beacons. BLE gateway can collect the position of employees and report to mobile or cloud applications.

Nowadays, after BLE 5.0 mesh profile introduction, Asset Tracking solutions are being made with BLE mesh. Building automation, Commercial lighting, and Sensor network are major areas where BLE 5.0 mesh is being used.

BLE can also be used in applications where direct communication between the device and smartphone is required. For example, while tracking the flow of customers in a specific department of the megastore, BLE beacons can be used to interact with customers’ smartphones to derive flow data.

Another example is wearable smart devices, such as fitness trackers - user’s smartphone will interact with tracker directly to retrieve fitness data.

Following are a various technical parameter, s for Bluetooth Low Energy (BLE 5.0):

makes it the most prominent standard for creating WPAN on a large scale. It supports 65535 devices in the network to create an application that requires large networks. ZigBee also supports various topologies like a star and peer-to-peer.

Strength of Zigbee technology compared to other IoT Protocols ● The stack is standardized at all layers which helps in integration across different vendors ● Supports highly scalable mesh networks (in thousands) along with a self-healing feature ● Low-energy consumption Following are various technical parameters for ZigBee:

2) ZigBee

ZigBee protocol is being used since long (around 1990) even before the emergence of the Internet of Things in industrial automation. ZigBee is popular in industrial automation due to the effective creation of Wireless Personal Area Network (WPAN) for Wireless Sensors. ZigBee Alliance was formed in 2005 to announce the first ZigBee specification 1.0. Before that, the ZigBee protocol was known with IEE802.15.4-2003 specifications. After the formation of ZigBee Alliance, further specification revision has been published, with the latest ZigBee 3.0.

ZigBee supports adaptable duty cycle, low coverage radio and low data rates which helps in achieving ultra-low power consumption and efficiency. This characteristic of ZigBee

3) Z-Wave

Z-Wave is primarily used for home automation applications.

Z-Wave was introduced back in 1999 by Danish company Zensys. It supports a mesh network to communicate device to device. Silicon Labs maintains the Z-Wave specification and provides chips that support Z-Wave. Z-Wave can be used for home automation applications primarily as it supports a maximum of 232 nodes in a mesh network, which is very less compared to other protocols. There are two types of devices, controller and slave. The Controller is generally connected to the internet and serves as a gateway for remote access of slave devices over the internet.

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In 2014, Thread Group was announced. Apple Inc. joined Thread Group in August 2018, raising hopes of gaining popularity of Thread protocol.

Thread uses 6LoWPAN at the lower layer and operates on 2.4 GHz ISM band like other protocols. Thread has a clean separation between the network layer and application layer. In fact, Thread defines mesh by providing a strategy to route datagrams on IPv6. The thread protocol does not track the application layer state. At the application layer, a protocol like CoAP can be used. Hence, Thread matches to standard TCP/IP protocol, where the network layer and application layer are different.

Thread protocol is more suitable in systems where multiple application protocols need to be used. Application layer should have low data rate need and shall support IPv6, that’s the minimum requirement.

In Thread protocol, there is one edge router called the Border router and multiple slave or end devices. The border router is having internet connectivity and serves as a gateway for remote access to end devices. If global IPv6 addresses are being used in mesh, any end device in the mesh can be reached directly using its IPv6 address. There is no single point of failure in the Thread network. Network heals itself automatically.

To make products with Z-Wave, it is required to purchase chips from Silicon Labs and Z-Wave stack from Z-Wave Alliance.

Also, certification from the Z-Wave Alliance is needed for the made product.

Following are various technical parameters for Z-Wave protocol:

Recently, Thread Group released 1.2 version of Thread protocol. Thread protocol is being used in residential and commercial settings. To further extend commercial usage of Thread protocol, Thread 1.2 has added Commercial Extensions and refined with specific functionality. Commercial Extensions makes some important improvements to the commissioning process, the number of devices able to connect on a network, and the way these networks are configured and managed.

Following are various technical parameters for Thread protocol:

4). Thread

While the above information can be greatly useful, due to its dependence on multiple aspects, deciding on the selection of Low Power Wireless Technology for your application can still be challenging and sometimes overwhelming.

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Thread is the recent invention in IoT protocol history. It’s an IPv6 based low power mesh networking protocol for IoT.

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Note: The content of this blog is based on the personal knowledge of any research work done by any individuals.

There are figures and images used in this blog that are used from their individual promoters’ content or websites such as Zigbee, Z-Wave Alliance, BLE Promoters Group (SIG), and Thread Group promoters. Figures are kept with the best of our knowledge and not to mislead by any manner.

INDUSTRY MARKET

IoT Devices Driving Digital Temperature Sensors Market The Digital Temperature Sensors Market key players have dealt with multiple challenges in extending the deployment of these sensors to various industries. With regular investment in R&D of these sensors to become more adaptable to different environments, newer breakthroughs are emerging consistently. Without temperature sensors, some of the most important functions provided by the internet of things technology such as heating, cooling, ventilation, and others will cease to exist. The rising demand for temperature sensors in machinery deployed in different kinds of manufacturing units will help the digital temperature sensors market in attaining noticeable growth in the upcoming years. During the forecast period 2019-2025, the market will grow with a CAGR of 11% and has been evaluated to have sold 3.8 billion units in 2018.

APAC Region Leading The Digital Temperature Sensors Market The Asia Pacific region has emerged as the global leader of the digital temperature sensors market and had a share of 42.36% out of the total revenue earned by the market globally in 2018. The manufacturing industries present in China and India have acted as the propelling factor behind the growth of the digital temperature sensors market. In China, 40.5% out of the total gross domestic product in 2017 was contributed by manufacturing industries alone. Temperature sensors are used in optimizing and controlling production environments for manufacturing products that are identical in every aspect.

Moreover, both India and China are extensively spending on sending space crafts to explore the deep space. The Indian Space Research Organization, for example, achieved some very important spatial targets in the past 5 years. In July 2019, ISRO launched Chandrayaan-2 which is Indiaâ&#x20AC;&#x2122;s second mission to the moon. Digital temperature sensors form an important component of space missions where they are used in monitoring both the temperature outside as well maintaining optimum temperatures inside. Temperature sensors in space are required to measure extremely high-temperature environments, especially those resulting from solar flares

or high energy. This requirement in space has provided growth to the regional digital temperature sensors market in the APAC region.

The Internet of Things Technology Impacting the Digital Temperature Sensors Market Internet of things technology is practically redundant without active sensors that are constantly collecting information related to their environments. As per the calculations of David Evans, futurist at Cisco, every second, 127 devices become connected to the Internet.

Furthermore, according to technology giant Ericssonâ&#x20AC;&#x2122;s predictions, by the end of 2023, 3.5 billion cellular connections will get added to the IoT network. These statistics are reflective of the growing demand for IoT technology in everyday life and its increasing acceptance from the consumers. This visible growth in IoT technology-powered devices would not have been possible without the use of sensors or actuators. Digital temperature sensors are used in a variety of devices that form an important component in routine human life. For example, air conditioners equipped with the internet of things technology make immense use of temperature sensors. Not only do they provide comfort to consumers by optimizing both the room temperature and the compressor settings, but also help in the conservation of the environment by reducing additional power usage.

Similarly, through IoT platforms, the digital temperature sensors market has attained further growth. Some of the common industries featuring deployment of temperature sensors include the health, agriculture, and manufacturing industries. In agriculture, temperature sensors are extensively used to monitor the temperature of

the soil and the water for optimizing crop growth. Ground robots fitted with temperature sensors have become commonly used in farming practices to meet the ever-growing agricultural demand. Furthermore, temperature sensors help in making farming more environmental-friendly by assessing the amount of water and nutrients that might be optimum for different plants. This reduces the unnecessary expenditure of both financial and natural resources in agriculture.

Smart Homes Generating A High Demand For Temperature Sensors Since the human population is inversely proportional to the number of natural energy resources present on Earth, smart homes that could help in the conservation of the environment have become the need of the hour. Using different types of sensors, smart homes help in the reduction of excessive power usage by optimizing the environment. According to IndustryARC, the smart homes market earned a revenue of $70 billion to $75 billion in 2018 and has been evaluated to grow with a CAGR of 12%-15%. The importance of having a smart home in everyday life is increasing owing to the comfort they provide, especially to the geriatric and the handicapped population.

By reduction of manual controls and making the house safer, the smart homes market will experience tremendous growth, thus elevating the digital temperature sensors market growth.

Temperature sensors are used in many devices in a smart home. Some of the most common uses of digital temperature sensors include ventilation, heating and cooling, fire detection, safety, and others. Without involving manual control, temperature sensors can completely automate the heating and cooling of any smart home environment. Moreover, they are also deployed in kitchens where early smoke detection is facilitated by these sensors. This symbiotic relationship between temperature sensors and smart homes has helped the digital temperature sensor market is experiencing noticeable growth.

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electronica India and productronica Ind • 674 exhibitors from 18 countries • 26,310 visitors • 1,500+ meetings at the Buyer-Seller forum

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electronica India and productronica India 2019, a marquee event that gave a glimpse of the future, in the rapidly evolving area of Electronics System Design & Manufacturing (ESDM), ended today on a high note. The record-breaking edition saw participants from across the world revealing new and exciting trends for the growing electronics industry in India. electronica India and productronica India 2019 along with the co-located trade fair IPCA Expo, were spread across 33,000 square meters, with 674 exhibitors from 18 countries showcasing their latest technologies, products and services. 26,310 visitors attended the trade fairs and the supporting programs to see the futuristic solutions on display at the exhibition grounds.

The number of visitors rose by 35 percent over the previous Delhi edition. Jointly held with IPCA Expo and Smart Cards Expo, the synergies between the trade fairs have resulted in the setting of these new records. The trade fairs took place from September 25–27, 2019 at the India Expo Centre, Greater Noida.

“We are pleased with the response the trade fairs and the supporting programs received. We plan on stepping up the game a few notches more and outdoing ourselves in the next

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editions,” commented Mr. Bhupinder Singh, CEO of Messe Muenchen India.

“The 2019 editions of electronica India and productronica India have shown remarkable growth in the international and domestic participation. We are glad to be providing this stage to the global brands to reach out to the growing Indian market,” commented Mr. Falk Senger, Managing Director of Messe München GmbH. The exhibition covered a variety of interesting segment hinged around concepts like semiconductors, electronic components, Surface Mount Technology (SMT), Electronic Manufacturing Services (EMS), Printed Circuit Board (PCB), amongst others.

The growth potential of the Indian electronics market is highlighted by the presence of countries and regions pavilions, from China, Korea, Singapore, Taiwan (Chinese Taipei) and the United Kingdom showcasing their latest products to support the growing manufacturing market in the region.

“The quality of customers at electronica India is beyond our expectations. The show also gives us the opportunity to increase our brand image and awareness. Association with electronica India has been very fruitful for the past seven years and we look forward to the future opportunities,” commented Alex Oh, Senior Sales Manager, Hirose Electric Singapore Pte Ltd. "We have been participating in productronica India in the

dia set new record with the 2019 edition past ten years and we can see very good response. Every year the size of the trade fair and number of visitors is increasing. productronica India is one of the medium, which helps us to demonstrate our equipment to the existing and new customers,” explained S. S. Bist, General Manager, Maxim SMT Technologies Pvt. Ltd. “This is our fifth year of participation in electronica India and we thank this platform for the opportunity to address our customers and extend our brand awareness. We are looking forward to increasing our business in India and electronica India supports our strategy. The response has been very good and we had interesting meetings,” said Selva Kumar, Director - Operations, Nichicon Electronics India Pvt. Ltd. Supporting Program – Conferences and Forums The 3-day event also hosted supporting programs designed to fulfil the needs of the growing electronics industry. The India PCB Tech conference, which aims to create a focused knowledge forum to promote the PCB industry in India, was highly appreciated.

The e-Automotive conference provided powerful, engaging, disruptive and progressive strategic focal points to the stakeholders of the automotive industry and the CEO Forum focused on “Realizing the vision of a trillion US$ digital economy– The role of components and design led manufacturing”. The

sessions and workshops covered the entire electronics ecosystem and discussed the key concerns shared by the industry.

The Buyer-Seller forum saw a remarkable attendance with a high interest from the electronics community to make new contacts and build future business prospects who engaged in more than 1,500 meetings. Some of the participating buyers were Amararaja Electronics Ltd, Denso India Pvt Ltd, Havells India Ltd, Liebherr Appliances India Pvt Ltd, Napino Auto & Electronics Ltd., Robert Bosch Engineering & Business Solutions Pvt Ltd, Samsung Electronics India Pvt Ltd, Secure Meter Ltd, Valeo India Pvt Ltd, Vivo Mobile India Pvt Ltd, Whirlpool Corporation.

Mr. Manish Khosla, Purchase Head, Magneti Marelli Powertrain India Pvt. Ltd. shared: “The buyer seller platform is an excellent platform as we are able to meet number of suppliers in a short span of time, the good factor and benefit is we were able to meet global suppliers who otherwise are not easily available for face to face meeting.”

Part of the event was a hand-shake ceremony of Messe Muenchen India with Samsung Electronics preceded by Mr. Bhupinder Singh, CEO of Messe Muenchen India and Mr. KwangWoon Bae, Vice President Procurement of Samsung Electronics. The trade fairs furnish a conducive platform for Samsung Electronics to procure locally and source from India for their largest manufacturing unit in the country.

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BIG PICTURE

By- Volansys

Essentials for Integration Testing

Bluetooth Low Energy

IoT has been around for a while, but the current detonation in interest is due to the massive price drops of sensorscombined with near ubiquitous connectivity. As per the recent report

by IDC, Worldwide technology spending on the Internet of Things to reach $1.2T in 2022, attaining a CAGR of 13.6% over the 2017-2022 forecast period. Bluetooth technology is widely used in IoT in various smart applications for connecting over short distances (up to 100m) using short-wavelength radio transmissions in the unlicensed industrial, scientific, and medical (ISM) band from 2400.0 to 2483.5 MHz.

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Bluetooth device communicate from one device to another in multiple modes – - Unicast: Source sends and receives messages to multiple destinations establishing one-to-one device communication.

- Broadcast: Source send messages to multiple destinations establishing one-to-many device communication.

- Multicast (Mesh): Multiple Source and destinations establishing many-to-many device communication.

BLE is marketed by Bluetooth Special Interest Group (SIG).

Bluetooth SIG manages the certification process which needs to

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be followed by any Product using Bluetooth Wireless Technology.

All these products must be Bluetooth SIG qualified and satisfy the requirements of the Bluetooth license agreements and specifications. SIG owns the logo as shown below and word “Bluetooth” –

Further process for qualifying Bluetooth enabled product can be followed at below link on Bluetooth website -

Bluetooth Protocoland Tests –

Integrationlevel tests for BLE involves the verification of

BLUETOOTH

advertisement data, handshake process (initiate communication and negotiate transfer parameters), connectionprocess, bonding process, packet data format. This can be achieved by two ways – 1. C onnecting with any BLE device acting as Master to verify services and data exchange 2. “Spy” between communications using Sniffer application.

Every Bluetooth device has a unique MAC Address and clock.

Master controls the clock and hopping frequency.

Source and Destination at various layer plays different roles which needs to be thoroughly verified for UUT (Unit under Test – One Bluetooth Device acting as Scanner and another as Advertiser) which are discussed in this Blog. Below are the terms synonymously used for Source and Destination at each layer –

Link Layer

Link Layer is the layer in between Physical Layer and L2CAP Layer. It mainly plays the role of advertising, establishing connection and discovering services. The below state diagram depicts the workflow at Link layer –

Scanning

There are two different scanning modes: Passive scanning – Controller only supports data reception and doesn’t support transmission.

Active scanning – Scan requests are transmitted. Scanner issues SCAN_REQ packet and advertiser responds with SCAN_RSP packet.

Initiating

The Scanner selects a suitable advertiser on basis of advertising data. The scanner can send a connection request to an advertiser if the advertiser signals a connection opportunity.

Once CONNECT_REQ packet is sent, scanner becomes the Initiator.

Connection

Once theconnection is successfully established, both devices are in “connection” state. Initiator becomes master and advertiser becomes slave. They exchange data packets at regular intervals termed as connection events (this connection is handshaking and data exchange happens only after handshaking is successful). BLE connections maintain a Piconet Network structure where single masterco-ordinates for connection events with slaves called pico. Data transfer rates vary from 200 to 2,100 kbps at the application.

BLE Packet forms the fundamental building block of the Link Layer. BLE Packet Data Format can be broadly divided as below –

BLE has two types of packet – • Advertising Packets – Find and connect to nearby devices • Data Packets – Data transfer between two connected devices

Standby: Default state Advertising: The device sends advertising events in the 3 advertising channelsat regular intervals (rest 37 are data channels)as shown in below image.

Below are the different Advertising Packet types as per the Protocol Data Unit (PDU) –

Follow the steps from below link to setup Nordic BLE Sniffer and Wireshark setup for packet capture – nRF_Sniffer_UserGuide_v2.2 Below are the test cases which can be verified using the Wireshark Packet Analyzer – 1. Verify that Peripheral Device advertises <Required data> in clear text 2. Verify the advertisement algorithm of the Peripheral Device when it is advertising and not connected. (Advertisement algorithm includes the number of advertising events and duration in between them)

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BLUETOOTH

3. Verify the advertisement algorithm of the Peripheral Device during handshake.

4. V erify the advertisement events after UUT is paired and bonded.

Generic Access Profile (GAP)

GAP defines the device roles, advertising modes and bonding procedures.Security Manager, a part of GAP can be designed as per the security needs for the system. “Pairing” and “Bonding” processes are controlled through GAP:– Pairing: Central and peripheral devices exchange the encrypted keys which is authenticated and accepted to establish the connection.

Bonding: Information from the pairing process is stored on the devices such that the pairing process is not repeated, and reconnection is established whenever device is nearby.

Three primarily pairing methods are – 1. Just Works – Encryption key is shared between central and peripheral.

2. Passkey Display – Random Key is generated on one device and other needs to enter the same.

3. Out of Band - This supports another BLE radio for sharing the key.

Using the same setup as above, below are the test cases which can be verified using the Wireshark packet capture – 1. V erify the Key Exchange pairing process at packet level.

2. V erify the Advertising Hop Sequences.

Follow the below link to install nRF Connect Emulator App nrFconnect App Below are the test cases which can be verified using the nRF Connect App – 1. Verify the Services available for discovery after connection is established.

2. V erify the services available like Device Information Service(UUID 0x180a) to get the Manufacturer details, Hardware, Firmware and Software strings data, Generic Access Profile (UUID 0x01800), Generic Attribute Profile(UUID 0x1801).

3. Verify the Custom Services (Unknown Services as shown in below screenshot) available.

4. Verify the Characteristics for Service and properties enabled for those characteristics like Read, Write etc.

5. Verify the defined data sent and received using the Data Read and Write feature.

Generic Attribute Profile (GATT)

Bluetooth device acts as GATT Server or Client.GATT identifies hierarchy to organize attributes such as services, characteristics.

Attribute is grouped data and UUID (Universally Unique Identifier) is a 16-byte assigned to each attribute. GATT Attribute’ hierarchy can be understood from below Image –

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Services consist collection of data required to accompolish a particular function. Characteristics contain User Data. Below flow shows communication of data packets between client and server

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Conclusion: With the advent of Bluetooth Low Energy (BLE) supported from version 4.0, now itis being widely used in consumer market because of Low Energy and low power demand in consumer market (the BLE was invented and formalized by Bluetooth SIG).To help ensure the successful implementation of Bluetooth low energy in these new, low-power designs, test solutions must be able to conduct the necessary tests based upon the Bluetooth standards, quickly and cost efficiently.

BIG PICTURE

Smart sensor solution for horticulture market SAMBIT SENGUPTA Associate Director â&#x20AC;&#x201C; Field Applications|Avnet India

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Global horticulture market,especially in India, is growing at a scorching pace.

India's horticulture production is estimated to rise by 1 per cent to record 314.67 million tonnes in 2018-19. According to government reports, this growth is 10 percent higher than the past five years' average production.The horticulture stress can be attributed mainly to a shift towards short duration crops.In India, there are many marginal farmers who grow horticulture produce in small patches of land. With shrinkingland holdingsand a lack of proper land titles, these farmers are fast turning to horticulture for quick returns.Large landowners also earn more margin from horticulture. As a result,we seea horticulture boomsweeping India.

Todayâ&#x20AC;&#x2122;s horticulture industry is datacentered, precise, and smarter than ever.

The internet of things allows farmers to stay connected to their fields like never before.

Using a sensor based smart solution, farmers can become more effective and efficient. Most horticulturists or farmers consider maintaining a healthy soil moisture and water balance as the most essential parameters for producing high

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quality horticultural crops. Under-watered plants suffer from nutrient deficiencies, stunting and wilting. Conversely, overwateringcauses plants to be susceptible to diseases and less tolerant to dry conditions. Addressing the concerns of its customers, Avnet Indiadeveloped a new solution that allows local farmers to remotely access real-time information about rainfall, temperature changes, wind conditions, air pressure, and humidity

for their precise location. This optimizes labor, water usage and crop health to employ precision agriculture.

The smart sensor solution is easy to install and maintain.Farmers simplyhave to insert the rugged sensor into the soil to be tested, and the volumetric water content of the soil is reported in percentage along with other parameters (at multiple levels).

This is how the system architecture of the solution looks like:

FEATURE

The sensors in theagricultural producecan be connected to the application server in multiple ways, such as using public low-power wide-area network (LPWAN) like LoRa or Sigfox. After which, they can be connected to a platform like IoTConnect, which provides ready-to-use data visualization as well as analytics that can be customized to a large extent if required by the deployment scenario.

The ready-to-go app pairs them with any smartphone through BLE. The major features of this solution include: 1. M easurement ofvolumetric water content inthe soil 2. Capacitance-type sensor responds immediately to changes in soil moisture content for better irrigation decisions 3. The major parameters being measure are: soil moisture, soil temperature, air temperature, air humidity, light intensity andbattery status 4. L oRa, Sigfox and BLE connectivity options 5. Easy parameters configuration through mobile app 6. Data visualization and analytics using IoTConnect platform

By maintainingoptimal conditions that minimize plant stress, the sensor solution enables farmers to make better crop management decisions and increase horticulture production. Avnetâ&#x20AC;&#x2122;s capabilities and connected ecosystem provide a holistic approach to smart horticulture solutions for the next generation.

UNVEIL IN THIS SPACE! www.bisinfotech.com

Reach Us : advt@bisinfotech.com T : +91- 11- 46504585

OPED

Data Center Racks: A Key Element for DCIM Industry - Global Data Center Rack Server Market is growing at projected CAGR of 19.95% and estimated to reach the value of USD 90.56 Billion by 2021 - Growing demand for advancements in Data Center Infrastructure and storage spaces are the key driver in rack industry, especially in IT, Telecom, BFSI, Healthcare, Retail and Public Sector verticals

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Growing demand of advanced infrastructure deployments in various industries and technologies like IoT, Cloud and Big Data generating voluminous data are the key drivers for data center rack market. The increasing demand of data center cabinets to accommodate the electrical equipment and connecting paraphernalia of storage systems and networks is making the companies invest heavily in their data center infrastructure components. Also, companies are expanding the existing data center facility by adding additional storage spaces, which require racks to arrange the IT equipment systematically. Thus, we can see more consumption of data center racks in the market.

Currently, organizations have a complexity factor associated in setting up and maintaining their data centers wisely.

Wastage of space and resources, increase in energy consumption, high temperature inside the data centers, maintaining uptime and performance etc., are the key challenges faced by data center managers. Data center racks give a technically modern and intelligent solution to address these challenges.

They also serve as an integral part in the adoption of colocation data centers, modular data centers and hyper scale data center connectivity.

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DC Racks boosts Data Center Performance

Data center, being a key component in IT infrastructure, needs to be well monitored and maintained to avoid downtime disturbances, breaches and other complications. Rack architecture helps to organize the Both active and passive Components that are essential to run the data center continuously.

Smart assembly of data racks will help to reduce the extra space occupied, enabling in preserving the resources.

Rack vendors with their innovation and technology Along with proper Air flow management accessories adding lot of intelligent components such as Intelligent Locks/ access, Intelligent PDU, Intelligent Climate monitoring & assent management strips/ sensors to serve various business needs. With the significant initiatives taken up in the data center rack industry, different types of racks such as Medium & High Density Rack, Seismic Racks are available to boost overall data center performance and efficiency, leading to business success.

RAVI RAJU

Brand Head, Director – Sales & Support NetRack center from bad forces from physically accessing servers. Compromising of data causes a negative impact on the organizational ability to operate and leads to reputational damage.

Thus, data center should be designed, built and maintained with robust technologies which can withstand physical damages, corporate thieves and natural disasters. This enables business continuity yielding better growth.

•B etter ROI: By designing and deploying data center racks that can operate efficiently and cool down the temperature inside the data center, one can reduce CAPEX and OPEX costs, hence increasing the ROI of the businesses.

• I ncrease Performance: Having a forward-looking design which will overcome common hardware failures such as breakdown, outages etc., and enables organizations to utilize the data center to its maximum potential, pushing business numbers.

Enable 100% Uptime with Intelligent • Increase Operational Efficiency: Use Hardware Design of smart technologies in infrastructure Currently, data centers are integrating more departments, functions, programs making its continuity a priority. It is equally important for organizations to opt for an intelligent hardware design for their data centers to overcome the conventional issues and maintain 100% uptime. It’s high time that organizations start rethinking of data center rack designs, a few reasons are listed below.

• Better Business Continuity: Along with the cyber security, physical security is equally important to protect data

such as cooling modules, bio-metric access, smart switches and sensors etc., pave way for an improved performance of entire equipment, reaching ideal efficiency.

Companies must look for vendors, who cater technically advanced data center cabinets with enhanced rack designs. It will definitely help to overcome conventional problems faced in DCIM industry and enable to perform well in the competitive markets.

Tech Solution That Will Shape The Transport Management System For Future Smart Cities

The Indian government’s ambitious plan to develop over 100 smart cities has put technology at the forefront of necessary infrastructural changes.

Smooth operations in smart cities can only be achieved when information from different sources are combined and shared in real-time with various stakeholders, including transport.

Transportation has a major role in the development of a smart city. Integrated with Information and Communication Technology and ensuring easy commute options, an intelligent transport management system is smooth, quick and without hassles. It is also very safe and reliable, improving the quality of living of the residents.

Following are some of the technology solutions required to aid the transport management necessary for a smart city: • C CTV cameras: Usually used for monitoring purposes, a closed-circuit television camera produces images or recordings for management and surveillance purposes.Brands like CP Plus and Hikvision are offering a wide array of the security solutions. Its

products are best known for their robust performance and long service life.

years, in optimal conditions, many times, continuously in a 24/7 mode.

• V i d e o w a l l s : W i t h t r a f f i c e v e r increasing, the only way to avoid total congestion every day is good data gathering, monitoring, and planning. This is where a video wall becomes the most important element of the management eco-system. The setup was not very successful earlier as multiple televisions or monitors put closely together to enable a singular large display surface had large frame (or bezel) around each television display surface. This completely tore down the effect of a single canvas and ruined the visual performance.

Global technology major Barco's rearprojection video wall modules, highquality displays, controllers and video wall management software visually present real-time signals coming from highway sensors, vehicle GPS systems and other intelligent transportation systems to the operators allowing flexible distribution of unlimited video and data feed across multiple sources.

The video walls have specific burn-in effects that allow them to play for many

• Traffic detection sensors: This will help in controlling traffic congestion and also observe traffic violations based on vehicular event pattern. Brands like TE Connectivity and Keyence India provide sensors and connectivity essential for applications that enable collection of data and ensuing analysis and better management in the transport segment.

Applying the above-mentioned technologies to a smart city will enable quicker and more reliable transport.

In order to fruitfully integrate these elements, a monitoring module or data management software is necessary.

Integrated monitoring systems are important for centralized command and control, allowing real-time monitoring of all aspects related to transport with a minimum number of human operators required.

Incorporating these technology solutions will ensure that the transport sector of Indian smart cities functions smoothly, powering the cities to a bright future.

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IoT Will Play A Significant Role In The Age Of Smart Farming ALOKE BARUA

Sr. Product Marketing Engineering, Microchip Technology

Microchip cultivating into the Agri and secure solutions that are set to • With all things IoT, security is an extremely Business? revolutionize both the outdoor and indoor important and vital consideration for Microchip Technologyis prevalent across a wide range of market sectors, offeringtotal system solutions for both direct and indirect suppliers of the agribusiness.We have enabled many different types of clients and system integrators within these sectors, to develop and manufacture products using our wide product portfolio, includingsecure,smart and connected sensor evaluation platforms such as the PIC-IoT WG and AVR-IoTWG development boards.

Key offerings into this domain?

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As a powerhouse solutions provider for the Internet of Things (IoT), Microchip Technology is enabling smart, connected

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agriculture space.

• T he PIC-IoT WG and AVR-IoTWG development boards implement three key modules: the ATECC608 CryptoAuthentication™device and encryption element (secure), anindustry leading PIC® and AVR® microcontroller (smart) and the ATWINC1500 WiFi™network controller (connected).

Designed with a modular approach, together these devices provide simplicity, flexibility and expandability.

Through this approach, it is easy to make adjustments, like switching the Wi-Fi module for BLE (Bluetooth® Low Energy) or LoRa® (Long Range) wireless instead.

preventing sensor cloning, halting network breaches and providing protection against data theft. The ATECC608 is a very robust hardware solution that enables these different levels of security.

• Equipped withMicrochip’s MCP9700 temperature sensor andan ambient light sensor, thedevelopment platforms allow designersto easily prototype common sensor node types.They can also expandthe capability of their prototype by adding one of more than 500 availableMikroE™click boards™.

• T o enable seamless operation and rapid development of the end sensor product, Microchip provides software

OPED

running AWS FreeRTOS. • As the industry’s lowest power LoRaSiP for long range, low power designs, Microchip’s SAM R34/R35 devices support low power IoT applications and provide sleep modes down to 790 nanoamps, to enable a multiyear lifetime for sensor batteries. The SAM R34/R35 family’s ultra-low power performance combined with rich set of radio and peripheral features makes it ideal for a variety of longrange applications where longevity of battery life is of paramount importance, including smart agriculture.

the vitality of both crops and livestock.

Role of Data in Smart Farming?

Data, whether it is audio, visual or environmental, is central to smart farming.

IoT will form the backbone of the closed loop-controlled system that is crucial to the unimpaired and healthy growth of crops and livestock. These systems require dependablefeedback to ensure stable operation — and data is the source of that feedback.

IoT applications in Agriculture business?

Automation, closed-loopsystems with real

Current challenges in Agriculture timecontrol, remote monitoring, data system and how can Microchip collection and data analytics are just simplify them? some of the IoT applications revolutionizing

libraries through its MPLAB®Code Configurator (MCC) for all three modules andeachavailable Click™ board.

• Microchip offers a range of intelligent edge computing platforms including a solution for Amazon Web Services (AWS) Greengrass. By running Greengrass on a Microchip device such as the ATSAMA5D2, you can link numerous edge nodes to Amazon’s cloud-based web services, for a cost-effective intelligent gateway solution. By using Microchip’s AWS gateway solution, you can concentrate data and services at the edge devices, which reduces unnecessary data relays to the cloud, thereby lowering the overall solution cost. Your Microchippowered gateway, running AWS Greengrass core, can provide local services to sensors deployed in the end agricultural application. As an example, a temperature and moisture sensor for soil monitoring could be implemented as an AWS edge node using our PIC32MZ MCU-based platform

Microchip Technology provides smart, connected and secure sensor evaluation platforms (those mentioned above) that are enabled with cloud service providers for those system integrators looking to supply the agricultural market sector.

We are also providing smart, connected and secure hub platforms, such as the ATSAMA5D2 microprocessor family, that act as the gateway to Microchipcloud partners or as interfaces to edge computing platforms.As an example, the SAMA5D2 offers full AWS Greengrass compatibility and security integration.

Edge computing platforms such as these enable continued operation with intermittent or low bandwidth cloud connectivity and lower cloud operating costs.

These solutions helpagricultural professionals, like growers and farmers,capture real time responses to environmental changes or livestock requirements—driving the ability to modify, automate and better vital parameters such as light, heat, humidity, soil nutrients, animal feed and water for both plants and livestock alike.

Role Of IoT in Smart Farming Business and your Expertise?

IoT will play a significant role in the age of smart farming.Automation, remote site control and monitoring, data collection and real time response to changing conditions in the outdoor or indoor environmentwill help farming professionals save time and costs, while enabling them to make more informed decisions for

the agri-business today.

Internet of Things and Innovative Farming?

Connected devices, such as Microchip's SAM R34/R35 Low Power LoRa® Sub-GHz System-in-Package Familyare helping track cattle, monitor irrigation and better enable machines, such as smart tractors.

Long-range communication?

Long range wireless communications will be enabled through standards such as LoRa®. Often situated in rural areas without cellular phone towers, LoRa allows for private, long range networks to be installed for relatively low cost when compared to cellular.

India as a market for Microchip in this segment?

More than half of the population in India relies on agriculture as their primary source of livelihood, even more so for the rural areas. With agriculture being a vital part of India’s economy, sustainable natural resource management is critical for the future growth of this sector in India.

Optimizations through smart, connected and secure sensor modules and control solutions that can be implemented with various Microchip products, can help maximize output and minimize waste.

Microchip has a large presence in all major cities throughout India. We’reprepared to help engineerswith any design challenge as they create the next generation of innovative solutions for smart farming.

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HQ_IMG_The_Elephant_In_The_Room.jpg

Customer Satisfaction Depends on Reliable Machining Processes PATRICK DE VOS

MSc, Senior Consultancy Specialist & Technical Education Programmes Manager Seco Tools

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When planning and implementing machining processes, manufacturers generally focus on manipulating elements of their internal operations and may lose sight of the end purpose of their work: assuring customer satisfaction.

To a great extent, customer satisfaction is based on minimizing the time between the placement of the customer’s order and delivery of the finished product. In the past, manufacturers minimized lead times by machining thousands of identical parts and creating large inventories from which they could ship products immediately.

This low-mix, high volume production (LMHV) scenario enabled manufacturers to meet customer needs in a timely way throughout gradual development of the machining process and unanticipated production errors and interruptions.

Today’s market requirements, however, are radically different. Customers increasingly order small batches of

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products tailored to specific needs. As a result, manufacturers rarely make long production runs. Groups of duplicate components are not produced in the thousands, but rather in hundreds, tens or even single units. These high-mix, lowvolume (HMLV) scenarios leave no room for ongoing process development or unanticipated interruptions. Manufacturers are under pressure to develop machining processes that are totally reliable beginning with the first part. Immediate speed, consistency and predictability are paramount.

Nevertheless, many manufacturers continue to focus on what they call “efficiency,” developing manufacturing processes aimed nearly exclusively at maximum output and minimal cost. They unintentionally ignore “the elephant in the room” – the crucial priority of satisfying their customers, especially customer demands for timely delivery.

QRM

Conceived in the early days of the HMLV era, a concept called Quick Response Manufacturing (QRM) underscores the critical role of time in the manufacturing process. QRM strategies, along with zero-waste and process optimization efforts, provide a roadmap that can put manufacturers on a path to minimize lead time and thereby maximize customer satisfaction.

Rajan Suri, a professor of industrial engineering at the University of WisconsinMadison in the 1990s, recognized looming changes in manufacturing markets, particularly the trend towards HMLV production. In 1993 he founded the Center for Quick Response Manufacturing. The Center’s purpose is to create partnerships between the university and manufacturing companies to develop and implement ways to reduce lead times. QRM strategies are often applied in addition to lean, Six

Sigma and similar process improvement initiatives.

The Traditional Approach

Production managers in traditional machining environments seek maximum machine utilization above all. If a machine is standing still, it is not efficient and is costing money, not earning it. The goal is to produce large batches for inventory.

Parts in stock buffer fluctuating customer demand.

In HMLV manufacturing, however, a job is put into production not for stock, but to fulfill a customer order for a limited number of specific components. There is no buffering inventory.

Further complicating the situation are factors such as so-called “hot jobs” that arrive unexpectedly in response to emergency circumstances or special requests by important customers. If all of a facility’s machines are running, other jobs will be delayed to deal with the hot jobs. Then the delayed jobs themselves become hot jobs, lead times increase, and chaos begins to creep into the production process.

A no th e r i s s u e i s t he t e nd e nc y of manufacturing staff to concentrate on finding ways to meet internal goals, such as achieving 100 percent on-time delivery.

Planning often is carried out with those internal goals in mind. For example, shop personnel may know that completing a certain job takes one day, but will allocate two days to account for interruptions by hot jobs or other possible delays.

Planners add a time cushion to avoid incidents of “acoustic management” – being reprimanded by management.

However, if similar behavior is common throughout a shop, two weeks of lead time can grow to perhaps seven weeks. Ontime delivery performance as measured internally may be 98 percent, production personnel are happy to meet internal goals, but the customer who needed the product in two weeks is not happy at all.

The traditional manufacturing environment has systemic limitations (see figure 2). In the figure at left is a highway with minimal traffic that symbolizes underutilization of resources and, as applied to manufacturing, high production cost per finished workpiece. The over-utilized highway at right, jammed with stopped vehicles, represents the chaos and

extended lead times that result when errors occur or unexpected jobs vie for space on the production highway. The middle image illustrates a balanced and cost-efficient approach to output and utilization of resources.

Roadmap for HMLV Production

In a HMLV production environment, first time part yield and consistent quality in production of non-identical workpieces is key. The objective is to provide customized products where the part in a one piece batch costs the same as a part in a million piece batch and immediate delivery is assured.

Producing good parts from the start depends on establishing a troublefree and reliable machining process. It currently is fashionable to point to the newest production techniques and digitalization technologies as solutions to machining problems. However, speed, consistency and flexibility always have been, and still are, based on a foundation of operational excellence as well an educated manufacturing staff with a positive mindset and motivation. (see sidebar).

Before discussing digitization and optimization, it is necessary to look at the workshop operations overall, determine where waste of time and resources occurs, and develop methods to minimize it.

After that, the emphasis shifts to process quality or reliability.

A Zero-Waste Workshop

Reducing lead times requires elimination of waste in the manufacturing process.

A zero-waste workshop does not overproduce parts, fully utilizes workpiece material, and does away with extra movement for semi-finished parts.

Wasteful and time-consuming activities in the machining process itself include production of burrs, bad surface finishes, long chips, vibration, and machining errors that create unacceptable parts.

Bad parts must be reworked or rejected and remade, either of which adds waiting time to the production process.

Even producing part quality that exceeds customer requirements represents wasted time and money. Shops must realize that it is necessary to achieve only the lowest possible workpiece quality that meets customer specifications and functional requirements.

If a part tolerance is five microns, achieving three microns is wasteful. Higher quality tooling and more precise operating processes will be required to meet the tighter tolerance, but a customer will not pay for the unrequested higher quality.

The job will be a money-losing proposition for the shop.

Respecting Constraints

The first phase in establishing a balanced machining process is choosing tools with load capacity that meets or exceeds the mechanical, thermal, chemical, and tribological loads present in the metalcutting operation.

Phase two involves selecting cutting conditions that recognize the constraints put on a machining process by real-world factors. A cutting tool possesses broad capabilities, but specific realities constrain the range of effective application parameters.

For example, tool capabilities change according to the power of the machine tool in use. Machining characteristics of the workpiece material may limit cutting

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speed or feed rate, or complex or weak workpiece configurations may be prone to vibration. Although a vast number of cutting condition combinations will work in theory, reality-dictated constraints will narrow trouble-free choices to a certain selection of parameters.

Applying cutting conditions outside the constraints of the specific situation will have negative consequences, including higher costs and lower productivity. The majority of the problems experienced during machining result from a lack of respect for the constraints that physical realities place on the cutting process.

When cutting conditions do not exceed real-world constraints, the operation is safe from a technical perspective.

However, not every technically safe combination of cutting conditions will produce the same economic result and changing cutting conditions will change the cost of the machining process.

Aggressive but technically safe cutting conditions will speed output of finished workpieces. After a certain point, however, output will slow because the aggressive cutting parameters also will result in shorter tool life, and multiple tool changeovers will consume excessive time.

Accordingly, the third phase of achieving a balanced machining process involves determining the optimal combination of cutting conditions for a given situation. It is essential to establish a working domain where combinations provide the desired levels of productivity and economy. After the combinations are put into production, episodes of troubleshooting to solve specific problems are usually required, as well as ongoing process analysis and optimization.

Versatile Tooling

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While high-performance, specialized tools can boost output speed, recognizing process constraints may prompt the choice of tools developed for versatility.

When tools are selected for maximum productivity and cost efficiency in machining a specific part, a change from one workpiece configuration to another may require emptying the machine turret completely and replacing all the tools.

In HMLV situations where smaller runs of different parts change frequently, that changeover time can consume all of the productivity gains resulting from use of

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maximum-productivity tooling.

In cases where tool performance is stretched to the maximum, some operators will reduce cutting parameters in fear of tool failure and disruption.

Versatile tooling, on the other hand, is applicable across a wider range of cutting conditions than productivity focused tooling, although at less-aggressive parameters. When versatile tooling is applied to process a variety of different workpieces, actual machining may be somewhat slower or more expensive, but the reductions in setup time, scrap, and lead time make up the difference and then some.

Conclusion

Customer satisfaction is the goal of any business relationship, and a key element of customer satisfaction in manufacturing is timely delivery of machined components.

HMLV production scenarios put pressure on manufacturers to optimize their operations to reduce lead times and speed delivery. Applying the concepts of Quick Response Manufacturing and zero-waste and optimization initiatives enables manufacturers to achieve the speed and reliability needed to fulfill customer demands for timely delivery while also assuring manufacturing profitability.

Smart People As Well As Smart Machines

The complex and changing nature of HMLV production scenarios appears to be an excellent situation for the implementation of the latest manufacturing technology including internal digitalization via smart machines and data analytics, external digitalization via an integrated supply chain and web-based connection with customers to correlate supply and demand. The wave of new technology apparently minimizes the value of human input in manufacturing operations.

But on the contrary, the rapidly changing elements in HMLV production scenarios increase the importance of human input.

The complicated operations require a form of traditional craftsmanship that involves creativity and flexibility to quickly adapt to the continually changing parts, workpiece materials and cutting conditions.

Above all, manufacturing staff must have the positive mindset and motivation necessary to confront and solve the new and varying challenges presented by HMLV production.

Gaining that mindset involves ongoing internal education that demonstrates to shop personnel that the solution to productivity issues doesnâ&#x20AC;&#x2122;t necessarily involve large expense and high technology. The mindset includes realizing the critical importance of satisfying the customer. Lessons learned while improving an operation or a family of operations can be reapplied and expanded to include similar situations throughout an entire shop.

Shop-floor experience can be supplemented with organized education initiatives such as the Seco Technical Education Program (STEP), a welldeveloped and practical program designed to familiarize users with the latest tooling systems and techniques.

Combining practical experience in process analysis and improvement with organized education programs is the key to establishing a culture of problemsolving and process improvement that will support ongoing manufacturing success. Complementing that education are interactive information resources such as the Seco My Pages digital portal, an online site designed to aid tool procurement and delivery, find better ways to apply tools, optimize processes, and gain engineering assistance.

In maximizing the benefits of HMLV machining, management must move away from the systemic limitations of traditional high-volume machining. It is essential to concentrate on reinforcing the role of employees in providing the mindset and creativity necessary to establish a balance between output and flexibility that will consistently assure complete customer satisfaction.

T&M UPDATES

For autonomous vehicles, NI tests computing platform NI has recently announced a solution to test the computing platform for autonomous vehicles (AVs).

NI’s solution for testing the complex computing platform consists of modular hardware with a configurable set of I/O that includes power measurements, thermal performance, automotive networks, sensor interfaces and PCB electrical measurements.

AVs are among the most complex systems being tested today.

At the heart of the AV is a powerful computing platform that analyzes the environment around the vehicle and determines the appropriate action to help ensure the safety of the car and its surroundings.

As automotive companies design and build their own AV supercomputers that combine automotive-specific networks and sensors with consumer electronic components for this computing platform, a critical balance must be struck between high computing power and adequate efficiency.

Validating this balance in the computing hardware requires a flexible test platform that can continually be adapted through software. By working with lead customers, NI has proven that it can meet the challenges of today and tomorrow with a single platform for testing automotive networks, digital protocols, sensor interfaces and power consumption capabilities. This test platform, scalable to production, is ideal to test the custom supercomputers that will enable the deployment of AVs. ​ “With over 40 years working with teams automating V&V test

systems, NI is a trusted advisor for helping test engineering groups maximize test effectiveness, enabling them to release quality products efficiently and confidently,” said Chad Chesney, General Manager and Vice President, Transportation, NI. The inherent flexibility in the modular design of NI’s solution means that automotive test teams can add measurement capabilities to the test system without buying a new system or starting from scratch.

The footprint of the PXI-based system is also much smaller than that of a system composed of benchtop instruments.

The holistic platform approach simplifies system complexity and reduces the burden on test teams to integrate disparate pieces of test equipment. ​

Keysight organizes Keysight World 2019 in India

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Keysight Technologies has recently hosted Keysight World 2019 in Delhi and Bangalore.

Keysight World brings together Keysight thought leaders, technological advances, breakthrough design/test/optimization strategies, and leading-edge solutions on a global scale to inspire, enable, and accelerate the realization of your innovation. Keysight World serves as an excellent environment for industry leaders to connect with stakeholders involved with all aspects of the electronic and semiconductor value chain; address test and measurement challenges; and experience real-world solutions. ‘’Since customers play an integral role in the success of Keysight, Keysight World helped in bringing our customers together and served as a platform for them to network and exchange ideas. At Keysight, we believe that these seminars add value to our customers and their businesses,’’ said Sudhir Tangri, VP & Country General Manager India at Keysight Technologies.

Sandeep Kapoor, Director Marketing (Europe, MEA and India), Keysight Technologies said, ‘’the program was designed to

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provide experiences through real-world product demonstrations, technical presentations and networking among industry experts. Keysight World was a great platform to learn from industry leaders and technical experts about the latest industry directions and technologies. We saw a lot of interest from our customers and industry experts in Keysight World. We had a strong panel of speakers who shed light on innovative solutions and topics that are key for our stakeholders.”

Keysight World focused largely on 5G technologies, Aerospace and Defense, Automotive & Energy, High-Speed Digital & Data Center Infrastructure and Network & Security Test.

Paradigm shifting moves in test technology for aerospace defense & military, trends and opportunities in 5G, evolution of high-speed server and computing interfaces, breakthrough electric vehicle innovations to market faster, keeping up with network data speeds - 400G and beyond, test considerations for next generation WiFi, were few of the topics covered in the sessions.

T&M UPDATES

VIAVI NSC-100 to Speed Net- Yokogawa releases MT300 work and Service Validation Series Digital Manometers

First of its kind instrument to combine PON, Ethernet and Wi-Fi testing with OneCheck Viavi Solutions launches new NSC-100, the first in a new class of field test instruments called the Network & Service Companion.

The NSC-100 integrates passive optical network (PON), Ethernet and Wi-Fi test capabilities together with the automated test process known as VIAVI OneCheck.

This compact, rugged device was designed to address demand from service providers for intuitive instruments that frontline technicians and contractors of any skill level can pick up and begin using to speed residential, small business and enterprise Ethernet network deployment and maintenance up to 10G. The pace of broadband network deployment continues to increase worldwide, with the VIAVI Gigabit Monitor showing gigabit Internet penetration growing by approximately 60 million people from 2018 to 2019. Of those connections, 88 percent are based on fiber to the premises (FTTP), and further extensions into the premises via Wi-Fi or Ethernet are common. Field technicians are therefore expected to validate or troubleshoot multiple types of networks and services. The challenge for techs and contractors has always been how to validate the network plus the service distribution – whether residential or business – quickly, comprehensively and correctly, thus reducing turn up time, return visits and operational expense.

Yokogawa Test & Measurement Corporation has recently released the MT300 digital manometers.

It is a new product series that will succeed the MT200 digital manometers used in a broad range of applications such as the calibration of measuring instruments, development and production of electronic devices, and plant maintenance. The MT300 series digital manometers feature a number of enhancements that include an extended measurement accuracy guarantee period.

Development Background With the increasing need to conform to a variety of standards used in product development and production processes, measurement instruments need to be calibrated more frequently. In addition, as data is periodically collected for use in quality control, there is the need to improve the management of acquired data and enhance the convenience of data collection. Based on its long years of experience with pressure measurement products, Yokogawa Test & Measurement has developed a new series of digital manometers with enhanced performance and new functions that meet its customers’ latest needs.

Market-leading multi-frequency, multi-GNSS RF simulator now has even greater performance and flexibility Spirent Communications announces the launch of its enhanced GSS9000 Series GNSS constellation simulator.

Providing significantly-improved capability, flexibility and performance, the GSS9000 Series has been updated to meet the ever-more-demanding test needs of high-performance satellite navigation systems. Spirent already leads the market in multi-frequency, multiGNSS RF constellation simulators, and the enhanced GSS9000 Series’ enriched features and capabilities raise the bar for GNSS development and test still further.

“We’re seeing the number of GNSS signals growing all the time, and an ever-increasing number of the receivers and systems we rely on every day are making use of these signals to improve accuracy, availability and continuity,” said Spirent Managing Director of Posi-

tioning, Martin Foulger. “That’s why it’s important that GNSS testing today and going forward reflects the reality of real-world situations, where simultaneous generation and testing of all signals is vital.”

The enhanced GSS9000 Series addresses this need by doubling the number of supported channels (320 in a single chassis) while maintaining its full performance specification, including in key areas such as signal iteration rate and low latency, under maximum signal dynamics. These attributes, together with the ability to produce a comprehensive range of emulated multi-GNSS, multi-frequency RF signals, enables full and future-proofed testing of advanced applications.

“Because the GSS9000’s dedicated platform and software are designed from the ground up to work together, there is no need for a trade-off between capacity

and performance,” says Foulger. “The newly-enhanced platform provides full control and verification at maximum performance across all channels at all times, removing any need for our customers to compromise their testing regimes.”

Greater signal flexibility is also built into the enhanced GSS9000 Series, through its open API and flexible system architecture.

This delivers a highly-sophisticated arbitrary waveform generator (AWG) capability.

It also provides unrivalled coverage and support for all current Signal-in-Space Interface Control Documents (SIS ICDs), with even greater flexibility for both system and signal evolutions. This includes builtin and user-defined parameter controls for generation of non-current SIS ICD PRN codes, navigation data content, navigation data rate, chipping rate, edge shaping and modulation types.

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INDUSTRY LAUNCH

Tiny, MEMS-based, OpenIMU330 IMU ACEINNA announces new ACEINNA OpenIMU330B, a MEMS based, small form factor high-performance 6-DOF inertial measurement unit that enables autonomous vehicles to accurately stay on track during turns and complicated maneuvers.

Features: • This triple-redundant architecture, combined with the small, low-cost packaging.

• C hallenging performance, reliability and cost requirements of the automotive market.

Applications: ADAS Systems, Electronic Stability Control, Lane Keep Assist applications, etc.

Availability: ACEINNA Navigation Studio developer tools and GUI are found on our developer site.

Arm’s Automation to IoT Connectivity Analog Devices has recently announced a simple power solution that maximizes efficiency and minimizes electromagnetic (EM) emissions of motion systems.

Features: • The ADuM4122, an isolated, dual-drive strength output driver that uses iCoupler technology.

• The ADuM4122 controls how fast or slow a MOSFET or IGBT turns on or off by user command, on the fly, thereby controlling motor currents.

Availability: Available Now

HOLTEK New HT66F0184 A/D Flash MCU Holtekannounces the release of a new device addition to its A/D Flash MCU with EEPROM range, the HT66F0184.

Features: • A streamlined product to the HT66F0185 device.

• High accuracy HIRC, a 10-bit A/D converter and an LCD Driver

Applications: Household appliances, consumer goods, electric tools, industrial control and other applications, such as electric vehicle instrumentation, thermostats, agitators and other products.

Availability: With regard to packaging, the device is supplied in 24pin SOP/SSOP and 28-pin SOP/SSOP package types.

Infineon New OptiMOSIR3826 (A) M Infineon Technologies AG has recently presented the new OptiMOS IR3826 (A) M integrated point-of-load DC-DC voltage regulator. It is a fully integrated and highly efficient device in two versions (IR3826AM for 16 A and IR3826M for 23 A).

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Features: • The voltage regulator can operate from an input voltage of 12 V (5 V to 17 V).

• Provide up to 16 A or 23 A continuous current.

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Applications: N e t c o m r o u t e r a n d switches, datacom, telecom base stations, server and enterprise storage.

Availability: BThe devices are fully RoHS2 compliant without an exemption to accommodate future regulations.

Both current ratings are offered in PQFN package with 5 mm x 6 mm footprint for easy scalability.

INDUSTRY LAUNCH

MediaTek’sNew MT8516 2-Mic Development Kit MediaTek announces the MT8516 2-mic development kit for Alexa Voice Service (AVS). The reference solution aims to help developers build high-quality voice-assistant products, reducing development costs and accelerating the integration process for creating far-field products with Alexa built-in, including multi-room music (MRM) capabilities.

Features: • The MT8516 kit is an integrated hardware and software solution ideal for a wide range of voice assistant devices and audio applications.

• Quad-core ARM Cortex-A35 application processor, operating up to 1.3 GHz to process user inputs faster.

Applications: Smart devices including speakers, sound bars, smart home hubs, industrial applications and smart home appliances.

NXP introduces its chipset, SR100T NXP has officially announced its secure fine ranging chipset, SR100T.It has designed to bring remarkably precise positioning performance tailored for next-generation UWB-enabled mobile devices. With the SR100T, mobile devices will be able to communicate with connected doors, points of entry, and cars to open them once approaching.

Features: • Lights, audio speakers, and any other connected device with UWB sensing capability.

• The new UWB-based chipset, SR100T, amplifies and builds on NXP’s connectivity.

• Mobile ecosystem expertise, and proven security architecture.

Applications: The SR100T expands NXP’s mobile wallet solution to include spatial awareness for new handsfree access applications.

Automotive-Qualified 200 V Qspeed Diodes Power Integrations announces that its 200 V Qspeed diodes – LQ10N200CQ and LQ20N200CQ – are now available with AEC-Q101 automotive qualification. Qspeed silicon diodes use merged-PIN technology to offer a unique balance of soft switching and low reverse recovery charge (Qrr). This results in low EMI and reduced output noise, which is especially important for in-vehicle audio systems.

Features: • Industry’s lowest reverse recovery charge, typically 32.4 nC at TJ of 125°C and a diode softness ratio of 0.39.

• Minimizes high-frequency EMI inherent in the Schottky rectifiers often used in Class-D power amplifier output stages.

Availability: The LQ10N200CQ and LQ20N200CQ diodes are produced in IATF 16949-certified facilities. Devices are available now; the LQ10N200CQ and LQ20N200CQ are priced at $0.60 and $0.74 respectively in 10,000 quantities.

Multiple Tiers of Snapdragon 5G Platforms in 2020 At IFA 2019, Qualcomm Technologies announces their plans to accelerate 5G global commercialization at scale by expanding its portfolio of 5G mobile platforms across the Snapdragon 8 Series, 7 Series and 6 Series in 2020.

Features: • Support features and frequency bands globally and has the potential to make 5G accessible to more than 2 billion smartphone users.

• Software-compatible 5G mobile platforms and take advantage of the Snapdragon 5G Modem-RF System.

Availability: Devices based on the Snapdragon 6 Series 5G Mobile Platform are expected to be commercially available in the second half of 2020 proliferating 5G globally.

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INDUSTRY LAUNCH

RECOM launches RAC03-K RECOM has recently introduced the smallest 3 watt solution on the market. RAC03-K is a versatile converter, which can be used in a wide range of applications due to complete certifications for ITE and household standards.

Features: • Compact 1in² footprint.

• Output power of 3 watts from -40°C to 60°C and 2 watts up to 80°C. • Easiest to use modular power solutions in the industry.

Applications: Automation, industry 4.0, IoT, household, and home automation.

Availability: Samples and OEM pricing are available from all authorized distributors or directly from RECOM.

STM32H7 MCUs WithDual-Core Performance STM32H7 microcontrollers (MCU) from STMicroelectronics are the industry’s highest-performing ArmCortexM general-purpose MCUs. The new devices leverage a 480MHz version of the Cortex-M7, the highest performing member of Arm’s Cortex-M family, and add a 240MHz Cortex-M4 core.

Features: • Efficient L1 cache, and adaptive real-time ART Accelerator.

• MCUs set new speed records at 1327 DMIPS and 3224 CoreMark executing from embedded Flash.

• ST’s Chrom-ART Accelerator delivers an extra boost to graphics performance.

Availability: Available Now

TDK presents ultrasonic sensor disks TDK Corporation launches a new series of ceramic-based EPCOS ultrasonic sensor disks.This disk has two standard types, first is B59050Z0206A030, sensor of this disk has a diameter of 5.0 mm and thickness of 1.02 mm.

Features: • Serial resonance frequency of 2000 kHz. • Thickness oscillation mode (axial).

• Offers a radial mode of oscillation at 285 kHz, and is suitable for operation in air.

Applications: Automotive: Park assist and blind spot monitoring systems, level measurement, interior monitoring Industrial: Flow metering, level sensing, collision avoidance systems

New proximity sensorby Vishay The optoelectronics group of Vishay Intertechnology recently introduced a new proximity sensor that offers a sensing distance of up to 30 cm.

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Features: • Combining an IR emitter.

• Photo detectors for proximity, amplifiers, and ADC circuitry into a single package.

• A programmable interrupt function and supports the I²C bus communication interface for efficient object and collision detection in a wide variety of consumer and industrial applications.

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Availability: Ideally suited for use in smart home, industrial, office, and toy products.

TELECOM

Hughes India Launches Maritime Mobility Services Hughes Communications India announces the launch of commercial maritime mobility services in India.

HCIL was the first to receive a Flight and Maritime Connectivity (FMC) license in India, which permits the company to provide mobility services within 125 kilometers of the Indian coastline.

Now, as the first to offer satellite maritime services in India, HCIL enables reliable and ubiquitous connectivity to vessels sailing in domestic waters – as well as internationally, through roaming partnerships with select maritime providers. “Maritime operators in India – whether cruiselines, shipping companies or offshore oil operators – are eager to connect their vessels, crews and passengers with high-quality, satellite broadband – and we are ready to serve them today,” said Partho Banerjee,

president and managing director, Hughes Communications India Ltd. “We estimate that more than 500 Indian vessels will use Indian maritime services in the next three years to stay connected. Two customers have already signed on for our maritime mobility service offering.” Until now, ships entering Indian territorial waters were required to shut down their VSAT connections; now, they can connect to HCIL’s high-speed Ku-band satellite network. This connectivity ensures that ships and their crews switch seamlessly to the HCIL network (much like terrestrial mobile roaming), with uninterrupted data and voice applications from the port of origin to the port of destination.

HCIL’s maritime mobility services deliver high capacity and efficiency, enabling broadband access that can be used

to monitor weather patterns, cut fuel costs, file regulatory documents, order supplies from sea to save time in port, and improve safety, among other uses.

For crew and passenger welfare, the services make it possible for people at sea to browse the internet, check social media, watch videos and more – with the quality comparable to that of terrestrial broadband connectivity.

The HCIL maritime service offering includes the Hughes JUPITER™ System platform domestically and provides for roaming among international waterways with global ecosystem partners.

The JUPITER System is the next generation platform for very small aperture terminal (VSAT) networks, designed and optimized for broadband services over both highthroughput and conventional satellites.

Ericsson Buys Niche AI workforce, Deepens Indian Centre The company started India wing of Global Artificial Intelligence Accelerator (GAIA) last year to develop open source solution to modernise telecom network, using AI and machine learning.

Ericsson has acquired workforce of Niche AI for its Bengalurubased artificial intelligence centre under undisclosed financial details. Ericsson is looking for more buyouts to build a team of 150 high-tech engineers for India operations this year, a senior company official said.

The company started India wing of Global Artificial Intelligence Accelerator (GAIA) last year to develop open source solution to modernise telecom network, using AI and machine learning.

“We are looking at both organic hiring, one by one through recruitment off the market, as well as what you might call as inorganic, which is more through acquisitions and acquihires (acquiring only talents). One such company that we have acquired is Niche AI,” Sanjeev Tyagi, Head of Ericsson R&D Bengaluru told.

Ericsson has plans to have a team of around 300 highly qualified engineers in GAIA by end of 2019 of which half are expected to be located in India.

“We continue to be on our target and towards our objective we have hired more than 75 engineers between Bangalore and Chennai and with a couple of dozen more expected to join in the coming months and we continue to recruit actively,” Tyagi said.

The company is acquiring talents from companies for GAIA and not their assets like patents, clients etc.

“The exponential growth in IoT devices will mean that the traditional methods of managing networks are no longer going to scale and that is an area where we are going to need self-organizing, self-healing, self-governing networks using AI and ML. We’re also looking at leveraging machine learning techniques to optimize the volume of signalling needed between a 5G handset and the radio base station so as to conserve battery life,” Tyagi said.

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TELECOM

5G spectrum auctions can be held by 2020: Telecom Minister Telecom Minister Ravi Shankar Prasad has recently announced that 5G spectrum auctions in India will take place by the end of 2019 or by early next year, reports The Hindu.

“The government has ensured that India’s auction of the spectrum will be done in a fair and transparent manner,” said Prasad. In June, the Department of Telecommunication (DoT) had outlined a plan to hold next spectrum sale by December 2019, however now it might get delayed till early next year.

Largest auction of airwaves: This would be the government’s largest spectrum auction, where over 8,200 MHz of airwaves at an estimated total base price of INR 5.86 lakh crore, will be up for sale, besides the sale of 4G spectrum. It is worth noting that the central government earned INR 65,789 crores from spectrum auctions of 2G, 3G, and 4G in 2016.

He also said, “DoT has noted the problems faced by the industry, which is reeling under the debt of INR 8 lakh crore and the government will give its support. He ensured “the government will be open to assist, facilitate, guide and motivate and in return, they would expect TSPs to reinforce their own management,

technology, and services”.

“All policy initiatives have been done, starting from the spectrum trading to spectrum sharing. A communications policy is already in place,” he added.

The telecom sector’s debt is nearly INR 8 lakh crore, with that of Bharti Airtel at INR 1.16 lakh crore and Vodafone Idea’s at INR 99,300 crore at the end of June quarter. Reliance Jio Infocomm is the only company that has registered profits in the telecom industry.

TRAI’s recommendations: The Telecom Regulatory Authority (TRAI) had suggested a base price for 5G airwaves at INR 492 per MHz. It proposed a sale of a minimum of 20 Mhz blocks, however, the DoT had asked TRAI to reconsider its recommendations. TRAI continued with its stand on the recommendations for pricing and said it had considered all the relevant factors, including methodology, assumptions, and developments in the telecom sector before giving its views.

SMART to commercially manufacture Silicon III-V Chips

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SMART’s III-V chips are made from elements in the 3rd and 5th columns of the elemental periodic table such as Gallium Nitride (GaN) and Indium Gallium Arsenide (InGaAs).

Due to their unique properties, they are exceptionally well suited for optoelectronics (LEDs) and communications (5G etc) – boosting efficiency substantially.

SMART“By integrating III-V into silicon, we can build upon existing manufacturing capabilities and lowcost volume production techniques of silicon and include the unique optical and electronic functionality of III-V technology,” said Eugene Fitzgerald, CEO and Director, SMART, MIT’s Research Enterprise in Singapore.

“The new chips will be at the heart of

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future product innovation and power the next generation of communications devices, wearables and displays.”

Kenneth Lee, Senior Scientific Director of the SMART LEES research program adds: “However, integrating III-V semiconductor devices with silicon in a commercially viable way is one of the most difficult challenges faced by the semiconductor industry, even though such integrated circuits have been desired for decades. Current methods are expensive and inefficient, which is delaying the availability of the chips the industry needs. With our new process, we can leverage existing capabilities to manufacture these new integrated Silicon III-V chips cost-effectively and accelerate the development and adoption of

new technologies that will power economies.”

The new technology developed by SMART builds two layers of silicon and III-V devices on separate substrates and integrates them vertically together within a micron, which is 1/50th the diameter of a human hair. The process can use existing 200mm manufacturing tools, which will allow semiconductor manufacturers in Singapore and around the world to make new use of their current equipment.

The cost of investing in a new manufacturing technology is in the range of tens of billions of dollars, thus this new integrated circuit platform is highly cost-effective and will result in much lower cost novel circuits and electronic systems.

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BISinfotech Announces Winn BISInfotech – A leading Indian Industrial Tech (Print & Online) B2B Media at the recent ep-India (electronica &productronica India, 2019) announced the winners of its annual Future City IoT Design Contest(FCDC).

This year, the FCDC contest logged more than 1200 registrations congregating colleges, organizations, hobbyists, design engineers and top innovators from India.

Mouser Electronics was the premium distribution partner and ROHM, the Innovative design award partner.

The breath-taking contest awarded top 5 prototypes whose design explored a new dimension for future cities with unique IoT technologies. There was a tie between 3 prototypes for the 3rd position.

The recognitions were chosen under top three categories, i.e. Most Cutting Edge Design, Jury’s Choice Design, 3 Innovative Designs.

1st Prize - Asfaleia Mayank Sinha from Capgemini India developed an IOT-based Home security system named Asfaleia. The main purpose of this system is to make the home security affordable to the common man of India. The structure of the system is such that it is highly modular and expandable and has very low maintenance cost.

Mayank quoted, “We got an amazing platform to share our prototypes. Thanks to BISinfotech for introducing this platform for young minds like us. I’m extremely happy to learn new projects from BISinfotech and would also like to thank Mouser Electronics and ROHM for their support to young engineers.

ners of FCDC Contest, 2019 TOP 3 INNOVATIVE DESIGNS

1. SMART FIT FOR POULTRY INCUBATORS GOUTHAM RAJ.K – COIMBATORE

2nd Prize - IoT Enable Man-Hole for Smart City Ishwariy Joshi from Birla VishvakarmaMahavidyalaya Engineering College developed portable IoT based T-style equipment, which can easily be fitted below drainage Man-hole cover. It is mainly used for Real-time tracking of Drainage overflow, where we can see the exact location on the web portal and also notification can be sent via any Messaging server.

Ishwariyquoted, “Glad to have this opportunity from BISinfotech. BISinfotech gave us the opportunity to showcase our talent. I hope we together take India to the vision of future cities integrated with smart systems and modules.

2. ADVANCED TRASH MANAGEMENT WITH IOTA SHEBIN JOSE JACOB – KERALA 3. SMART ENERGY MONITORING AND CONTROLLED SMART SECURITY AKSHANSH MALIK – JODHPUR Total 45 designs were shortlisted in the finals. Jury selected top three prototypes. Cash prize was sponsored by Mouser Electronics and the winners also received development kits from ROHM semiconductors.

The 90-days-long challenge, the participants showed intense participation spree. Where BISinfotech along with Mouser and ROHM gave technical resources and guidance throughout the contest.

SECURITY UPDATES

Kaspersky & Ingram Micro Conduct Partner Program

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Kaspersky recently conducted a very successful partner engagement program with its national B2B distributor Ingram Micro in four metro cities - Bangalore, Hyderabad, Chennai and Mumbai. The series of events saw active participation from 200+ partners who were engaged in strategic discussions around taking Kaspersky’s wide enterprise solution portfolio to their customer base.

Through the program ‘Winning Together’, Kaspersky and Ingram Micro have further strengthened their partnership. As it has been Kaspersky’s tradition, they decided to conduct these programs to not just communicate their strategy and demonstrate key products, but also to bring the Ingram Micro partners on board with Kaspersky.

At the meeting, Mr. Anand Shringi, Channel Head, South Asia, Kaspersky and Mr. Ebenezer Stephan, Regional Head, Kaspersky deliberated in detail Kaspersky’s profile for the partners. They spoke about their very successful partner program Kaspersky Sales Army, which is an exclusive incentive program to appreciate the partner sales & pre-sales team’s hard work and to reward them. They also gave the delegates comprehensive information about Kaspersky’s endpoint offerings including their Endpoint Security for Business, Hybrid Cloud Security, etc.

Anand Shringi, Channel Head, South Asia, Kaspersky said “Kaspersky has been greatly supported by our partners, and we always appreciate the same. Engaging with them is an important step in engaging with our end-customers. Our partner programs are crucial to the fabric of Kaspersky. At these programs, we focused on recruiting new partners and

showcasing Kaspersky B2B Enterprise products and services to the partners. We also spoke about our much- appreciated Sales Army program for the partners to understand the incentives and rewards system. We are positive of growth, profits, and partner and customer satisfaction” Sharing his views on the engagement with Kaspersky, Navneet Singh Bindra – Executive Director & Head of Advanced Solutions, Ingram Micro India said, “Becoming Kaspersky’s partner is a strategic decision that we have taken to widen our offerings and to take best-in-class cybersecurity solutions to our customers. We look forward to having a fruitful partnership with Kaspersky as their national distributor and conduct many successful partner engagement programs in the future.”

Atos opens its first lab in Germany

Peter Heuman Assumes Role as NEXT Biometrics CEO

Atos, a global leader in digital transformation, recently opened its German Artificial Intelligence (AI) Laboratory in Munich, Germany.

“Artificial Intelligence solutions have the power to be true game changers: For individual companies as well as entire economies, the holistic implementation of digital techniques leveraging AI is key to their success in the future “, said Thierry Breton, CEO and Chairman of Atos during the opening ceremony.

“Our AI Lab is the right platform for the collaborative development of tangible digital use cases that deliver longterm value as quickly as possible,” he added.

The German AI lab is also part of Atos’ global AI network as an element of its partnership with Google Cloud, which was initiated in 2018. The lab is aimed at companies and organizations that want to promote and develop the use of AI across their businesses. Atos and Google Cloud offer the necessary technological and industry-specific technical expertise as well as concrete use cases.

NEXT Biometrics announces that Peter Heuman has been appointed chief executive officer of NEXT Biometrics as from 16 September 2019.

Chairman Magnus Mandersson comments, “Peter is a results-driven modern executive with a demonstrated track record of successfully growing several international businesses. We are confident that he brings the level of strategic foresight, technological expertise, leadership and focus on our customer’s needs to drive NEXT Biometrics’ dedicated growth strategy forward.” Peter Heuman (43) is a proven industry leader with fifteen years of international management experience. He held the position as CEO at stock-listed media-tech company Done Management & Systems AB and gained strong experience in the payment industry as Managing Director Mobile Financial Services at Ericsson. He also served on the Board of Directors of iConectiv, a US-based IT and operations technology company.

BISINFOTECH|OCTOBER 2019|VOL 1|ISSUE 10

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