BPM - BATCH PROCESS MODULE Flexibility to optimize your process • Sputter • De-Gas • Soft Etch The Radiance Batch Process Module (BPM) can be equipped with up to 6 process stations for Sputter, DeGas or Soft Etch. Modules are available for direct handling of either 200mm or 300mm nominal substrate sizes or for use with substrate carriers in the case of irregular substrate shapes or mixed batches. Process flexibility is key to the BPMs design philosophy and substrates or carriers are mounted on a turntable which can be heated or cooled according to customer specifications. Source substrate separation is variable within a defined range and each process station can be configured for up to 4 gas inlets giving you the freedom to optimize the basic environment whatever your process.
BPM configured with single SSC cathode
Module Capability
Applications
Co-Sputtering
• Alloys • Rate enhancement • Co-sputtering with up to 6 sources possible
IAD / PIAD
• Stress Control • Densification
Multilayer Deposition
Highly Repeatable Coatings in Optics. Sensors & Optoelectronics
In situ process metrology options include broadband optical monitoring for the most accurate end point termination, pyrometry for direct substrate temperature measurement in sensitive processes and film stress measurement in thick or complex stack designs. Hinged flanges enable access to individual sources and a simple lift mechanism enables the whole chamber to be opened for access to the central substrate table. All internal shielding and chamber parts can be exchanged with ease and an integrated heater ensures rapid conditioning during pump down. The BPM can be specified in combination with other batch or single process modules (SPMs) via a range of standard Radiance transport platforms.