SSC – SPUTTER SOURCES High rate deposition of metals, dielectrics and TCOs • 200 or 300mm diameter • DC, DC Pulsed, Mid Frequency or RF • No uniformity shapers The SSC series cathodes are prepared for deposition of metals, dielectrics and TCOs. Proprietary tunable rotating magnet systems ensure deposition processes can be optimised for the best combination of target life, film thickness uniformity and process cost according to customers exact needs. Process options include DC, DC Pulsed, Mid Frequency or RF. Cathode / power supply switching options can be configured according to process and budget constraints.
SSC cathode configured for RF sputter
Uniformity shapers have been eliminated, maximizing deposition rates and avoiding a potential source of substrate contamination through particle shedding. In situ plasma emission monitoring in combination with closed loop gas inlet control ensures reactive processes achieve the correct film stoichiometry. Broad band optical monitoring available on either the Single Process Module (SPM) or Batch Process Module (BPM) ensures correct end point termination in complex optical stacks. Water cooled foils behind the target enable efficient target cooling and eliminate the possibility of water leakage into the process module during cathode maintenance or target exchange. A simple target clamping ring keeps target change times to an absolute minimum.
Up to 5 SSC sources on a single Batch Process Module
SSC – SPUTTER SOURCES
Target with clamping ring and cooling foil for safe operation and rapid target change
SSC200
SSC300
Nominal target diameter
200mm
300mm
Target Form
Single piece or bonded to backing plate according material
Single piece or bonded to backing plate according material
Sputter Modes
DC, DC Pulsed, Mid Frequency, or RF
DC, DC Pulsed, Mid Frequency, or RF
Process Control
Magnetron speed Magnetron height
Magnetron speed Magnetron height
Target Lifetime
Magnet systems optimised according to application
Magnet systems optimised according to application
Process Options
Single or co-sputter, PIAD in combination with Plasma Source
Single or co-sputter, PIAD in combination with Plasma Source
Target Cooling
Indirect
Indirect
3D surface diagram showing film thickness uniformity
Deposition on 200mm wafer with Âą1.5% uniformity
Evatec Ltd. Lochrietstrasse 14 CH-8890 Flums Switzerland Tel: + 41 81 720 1080 Fax: + 41 81 720 1081 info@evatecnet.com www.evatecnet.com Product descriptions, photos and data are supplied within the brochure for general information only and may be superseded by any data contained within Evatec quotations, manuals or specifications.