PANEL SOLUTIONS
THIN FILM SOLUTIONS FOR GLASS & ORGANIC SUBSTRATES
MARKET DRIVERS
“INCREASING MINIATURIZATION” MINIATURIZATION SMALLER, THINNER, DENSER... The future of electronics is heading towards higher reliability, more functionality and increasing miniaturization. The efficient use of smaller housing volumes and tiny surfaces is gaining in importance. In addition to miniaturization in general, the thinning of electronic devices such as smart phones and tablets has been a relentless trend over the last two decades. Notwithstanding this trend for reduced ticknesses however, smart phones and tablets in general have retained the same display sizes. Packaging CPU(s) and Packages on carrier is becoming challenging and system integration into PCB (embedding) may be one solution we will see for future performance applications.
Typical thickness of (smart) phones in mm 24
“THICKNESS REDUCED BY A FACTOR OF 4 SINCE THE YEAR 2000”
22 20
(mm)
18 16 14 12 10 8 6 2000 2001 2002 2003 2004 2005 2006 2007 2008 2009 2010 2011 2012 2013 2014 2015
Year 2
2016
PANEL PROCESSING
BETTER DEVICES WILL DEMAND BETTER PRODUCTION SOLUTIONS FROM IMPROVING THERMAL MANAGEMENT TO INCREASING DATA TRANSFER RATES THERMAL MANAGEMENT HEAT SPREADING, TEMPERATURE MANAGEMENT Increasing clock frequencies and packaging density on the silicon chip, in the package and on the printed circuit board all contribute to the trend to higher operating temperatures. The development of semiconductor circuits with minimized power loss is in itself not enough to solve this problem. Thermal management within electronic circuits by spreading and deploying heat with dielectric ceramics or heat pipes is a major challenge for designers and manufacturers.
DEVELOPMENT OF ADVANCED DRIVER ASSIST SYSTEMS Development of Advanced Driver Assist Systems (ADAS) means that many vehicles now have a 360° view
Surround view
Traffic sign recognition
Adaptive cruise control
Emergency braking Pedestrian detection Collision avoidance
Blind spot detection Cross traffic alert Park assist
Park assist
Park assistance / surround view
of their immediate surroundings and are able to identify and avoid potential hazards either by warning the driver, or by automatically taking over an element of the vehicle
Long-range radar
Lane depature warning
LIDAR
such as braking or steering if the driver doesn’t react.
Camera
Looking at the next development stages and extracting
Ultrasound
Surround view
Short/medium range radar
the needs at product feature level regarding the vehicle brain (ECU) helps us define the technology challenges. Performance: How to track the huge and increasing number of operations per second (DMIPS). Power Dissipation: How to deal with the heat generated by an increasing computational power. Upgradeability: Which strategies must be adopted
PERFORMANCE 5G, RADAR, LIDAR The evolution of cellular networks has allowed users to experience faster data speeds and lower latency. Todays’ infrastructure and devices enable individuals’ increasing use of data-heavy services and applications. The rise
to upgrade the hardware architecture from older
in the volume of data being carried by cellular networks has been driven
ECUs to the next generation.
largely by consumer demand for video and moves to the use of cloud
Miniaturization: How to meet the goals when
services. Many other data-intensive applications, both consumer-oriented
available space within the car for electronic
and business-to-business, are also becoming closer. Examples include
components is decreasing.
virtual and augmented reality, 3D and ultra-HD video, and “haptic” feedback
Cost: How to decrease the cost of electronic modules essential for wider adoption in the market.
applications where information is given to the user through their sense of touch.
3
MARKET DEVELOPMENTS PCB & substrate manufacturer
OSAT Foundaries
Organic substrates
Silicon / Glass interposer
High-end PCBs Growth opportunity Technology evolution
Economics of scale
Opportunity Wafer design rule
More functionality & advanced technology nodes
PCB design rule
100µm
10µm
5µm
1µm
100nm
10nm
WINDOWS OF OPPORTUNITY “SI TECHNOLOGY AND ORGANIC SUBSTRATE PROCESSING ARE COMING TOGETHER”
TECHNOLOGICAL EVOLUTION, GROWTH OPPORTUNITY AND ECONOMIES OF SCALE Electroless copper processes currently have their limits at somewhere < 10µm line space. Even though improvements for electroless copper process are being developed, there is an increasing demand for dry-processing (PVD) because of miniaturization. Better adhesion on smoother surfaces, better particle performance and similar cost of ownership are the important criteria. Evatec maintains a giant manufacturing solution pool from its activities in Advanced Packaging, Wireless, MEMS, Power Devices, Optoelectronics and Photonics and is ready to support and guide customers for these technological developments.
4
PANEL PROCESSING
EVATEC IS YOUR PARTNER Delivering proven PVD manufacturing solutions in Advanced Packaging
Flip Chip substrates
System in Board integration (SIB)
Fan-out with mold compound
Package with glass interposer
ADVANCED PACKAGING DEVELOPMENTS
“EVATEC IS READY WITH PRODUCTION SOLUTIONS ACROSS CURRENT AND UPCOMING TECHNOLOGIES”
FC-CARRIER, EMBEDDING, FAN OUT, GLASS INTERPOSER Driven by the needs of miniaturization, different
Advanced Packaging methods have emerged. Classic Flip Chip carriers are still a major vehicle for packaging. Embedding in laminate (PI, LCP, FR4) is the system integration in High End PCBs. Active and/or passive components are positioned in the stack up so that they are completely integrated into its construction. Fan-Out PLP - embedding in mold compound and generating economies of scale for FOWLP. Active and passive components are assembled on a reconstructed panel, molded and detangled by redistribution layers. Glass interposers as an alternative for costly silicon interposers.
5
EVATEC KNOW-HOW
Technological evolution is driving our industry. Decreasing process nodes of front end processes, lower processing temperatures, reduced contact resistance and improved shield kit life time are just some of the parameters and conditions that underpin ongoing improvement.
DEGASSING ORGANIC SUBSTRATES OF MANY DIFFERENT KINDS ATMOSPHERIC BATCH DEGAS A batch degasser concept, where a batch of substrates are simultaneously degassed in multiple heated slots with nitrogen laminar flow, is the preferred solution for the degassing of organic substrates (e.g. Epoxy Mold compounds, FR4, Polyimide, LCP) The advantages of Evatec’s atmospheric batch degasser are much faster and better controlled heating of the substrates along with a simpler design. Diffusion of volatile components from the bulk material to the surface is driven only by temperature. Desorption is driven by the concentration gradient which is the same whether desorption takes place in vacuum or in atmosphere. However, the advantage in atmosphere is that the concentration gradient can be always kept high if a laminar flow of inert
gas is applied, while in vacuum the degassing of the volatile components has to take place by less efficient molecular diffusion. On completion of degas, the substrates can be transferred manually or automatically to the next vacuum based process step according to customers’ preferred production approach. Rapid transfer excludes any possibility of atmospheric water adsorption as they cool. Careful process engineering means that subsequent steps like etch and deposition can be carried out at temperatures lower than the original degas temperature to avoid transport of any additional volatile components to the substrate surface.
FR4+PI samples during 20nm etch
Fanout Mold samples during 20nm etch
Plasma Off Ar Off 1.E-06 Ar On
Plasma On
1.E-07
30
50 Without BD
6
Effective outgassing improves subsequent process performance
1.E-05
Sum. VC’s partial pressure (mbar)
Sum. VC’s partial pressure (mbar)
1.E-05
1.E-08
Excellent uniformity of only ± 4ºC using atmospheric batch degas technology
70 With BD
90
Time (s)
110
130
150
Plasma Off
Ar Off
Plasma On
Ar On 1.E-06
1.E-07
1.E-08
5
25 Without BD
45 With BD
65
Time (s)
85
105
125
Outgassing beahviour with / without pretreatment on batch degasser
PANEL PROCESSING
LEADING THE WAY WITH ADVANCED PROCESS CONTROL (APC) KNOW-HOW AND PROCESS CONTROL
LOW TEMPERATURE PROCESSES ARCTIC CHILLING, HIS PROCESS KNOW-HOW
LOW CONTACT RESISTANCE
Artic Cooler
Airlock
Atm. Batch Degas
160 140
Etch 100Å
Etch 100Å
Ti 1kÅ
Cu 2kÅ
Tmax = 120ºC
120 100 80 60
0
10
20
0
50
100
150
Time [min]
200
250
300
Transfer
Transfer
Transfer
Transfer
0
Transfer
20
Transfer
40 Transfer
Temperature [ºC]
Evatec has the know-how and experience in delivering processes with extraordinary low temperature loading. For example, Aluminium Nitriode (AlN) is a thermo-conductive dielectric material which is usually deposited at temperatures around 400ºC to give the required grain structures for good “in plane” thermal conductivity. However, deposition of AlN using Evatec’s own custom HIS process and temperature management options can achieve good lateral thermo conductivity at much lower temperatures.
350
400
Organic materials like EMC, FR4, PBO, Polyimide, LCP contain many volatile compounds that are released during vacuum processing. Without correct preparation prior to metallization, these volatile compounds contaminate the contact pads that should be connected by the Redistribution Layer (RDL). Preparing these organic materials well for vacuum processing is an essential factor for producing low and stable contact resistance (Rc) values.
FINE TUNED DEGAS, ETCH AND SPUTTER PROCESSES The Evatec Atmospheric Batch Degasser (ABD) provides a clear technical and economic advantage when processing materials with volatile compounds. Stable etching processes and well aligned PVD processes (with or without active cooling) are key for low temperature processing and low contact resistance (Rc). H20
H20 H20
Time [sec]
Step 1: Degas process to eliminate absorbed moisture
Example of a low temperature process set up.
Zone 3 Zone 2 Zone T
t* Region not accessible
Columnar grains
1
Cutout to show structure
0.5
Zone 1
0.2
0.1 Porous, tapered crystallites seperated by voids, tensile stress Densly packed fibrous grains
Ar+ Fine-grained, nanocrystalline, with prefered orientation
Ion etching zone
10-1 1 Transition from tensile (low E*) to compressive stress (high E*)
T 120ºC
Recrystallized grain structure
T*
Line separating net deposition and net etching
10
Region of possible low-temperature, 102 low-energy, ion-assisted epitaxial growth Region not accessible
103
E*
Ar+
CO CO2 CH CxHy MxOy x y
Ar+
CO H2O
Step 2: Sputter etch to remove the native metal oxide
Dense film reduction of deposition by sputtering
Zone diagram derived from Thornton‘s diagram by Andre Anders (2010). Diagram shows how effects of process temperature and energy on film structure are interchangeable. Fine grained nanocrystalline structures can be achieved at lower process temperatures with higher energy processes.
Step 3: Sputter deposition of Ti-Cu barrier / seed layer
Typical metallization process sequence
7
PVE & PVD PROCESS KNOW HOW THERMAL CONDUCTIVE FILMS HIGH END LAYERS FOR TEMPERATURE SPREADING e.g. ALN, ALON, SIC
Triple the in plane thermal conductivity of the whole system with 2x 5µm AlN films on 1mm thick PCB Cu stuctures 5µm AlN 50 W/mK
Thermal management and the avoidance of hot spots is extremely critical for electronic systems and has a strong influence in prolonging lifetime and improving device performance. Boards must be kept cool under all operating conditions.
1mm PCB 0.25 W/mK
We can define three requirements for the production of high performance sputtered layers for conduction of heat away from the device:
3 x-plane
100
2.5 in-plane
80
2
60
1.5 RC - Rocking Curve
40
1
20
0.5
0
0
Increasing process temperature
Evatec’s HIS process achieves good structures at low temperatures AlN grown by DC sputter at low temperatures exhibits columnar structures.
8
AlN grown by DC sputter at high temperatures typically 400ºC is fine-grained and well oriented.
FWHM [º]
Evatec has the know-how for selection of the right materials and sputter conditions to meet these requirements.
Thermal conductivity of Evatec AlN (on 300mm Si wafer) 120
In-plane thermal conductivity [W/mk]
1. Layers should be produced from a high thermal conductivity material >50 W/mK. 2. Layers should have good dielectric constant >3 to isolate the contact path from the conductive core layers. 3. The sputter process should fabricate the thermal conductive film at low temperature to not exceed the Tg of the PCB material (typically <150ºC ) during the deposition time.
PANEL PROCESSING
TSV SOLUTION AND VIA METALLIZATION
FERROMAGNETIC INDUCTORS AND SHIELDINGS Evatec‘s HIS technology provides very high directionality combined with a superior film texture. In 10x100μm vias for Ti and Ta the bottom coverage is >10% and the sidewall coverage is >2%. The minimal sidewall coverage for Cu 10x200μm vias is >1% which is sufficient for electroplating. Successful electroplating following the TSV metallization process on 300mm wafers using Evatec’s CLUSTERLINE®300 can be seen by X-Ray tomography. The TSV process and the know-how for metabolizing critical topographies can be deployed to panel sized applications (e.g. on the PNL).
ADHESIVE LAYERS
METLALLIZATION OF EMBEDDED COMPONENTS FOR IMPROVED DEVICE PERFORMANCE The majority of todays’ PCB and IC-substrate manufacturing uses chemical seed layers for seeding the initial metal layer. To ensure a good bond of this chemical seed layer, surface treatments are done to make the surface more rough. This rougher surface (Ra typically between 2-5µm) enhances the adhesive bond of the chemical seed layer, but is detrimental for high frequency needs. Furthermore fine line patterning requires surfaces with lower roughness. Smooth surfaces (far below 1µm Ra) are beyond the capabilities of chemical seed layer deposition and require sputtering. Adhesive layers applied to different material types with varying roughness have been studied with the main objective of achieving a good adhesive bond. Boxplot - Tests for seed layer adhesion on typical substrate materials after Evatec PVE and PVD processes
The HIS process has been tailored to give industryleading CoO for directional PVD compared with other technologies.
1.000
800
[N/m]
High specific deposition rates. High throughput. Lower consumables cost. (planar target, standard shields) Longer target life.
1.200
600
400
200 8 data sets Ra ˜ 50nm
3 data sets Ra ˜ 100nm
2 data sets Ra ˜ 600nm
ABF (100nm Ti + 500nm Cu)
Panasonic MC-100MS/EX (100nm Al + 1500nm Cu)
0
Cross section of liner plated TSVs AR 20:1
Kapton HN (50nm Cr + 500nm Cu)
Kapton HN (50nm Cr + 500nm Cu) after 5x reflow
Substrate and seed layer combinations
ETCH PROCESSES Process temperature control is the most important parameter when etching organic substrates such as ABF, EMC, FR4, PBO or PI. Evatec process know-how ensures that the etch rates, the etch uniformity and the thermal budget of the processed substrates are in balance. Evatec can provide physical or chemical plasma etch processes (O2, H2, Ar or N) or a combination of these etch modes in one module.
9
PRODUCTION SOLUTIONS
PNL The cluster-like PNL system with its atmospheric handling and atmospheric batch degasser is designed for best in class particle and processing performance. Production on the Evatec PNL system ensures low process temperatures, low contact resistance and best in class adhesion strength on various substrates and contact pads.
KEY FEATURES Single panel processing Etch/clean module Up to 4 modules (3 PVD & 1 etch) Atmospheric Batch Degasser OHT integration MES integration (SECS/GEM) Reactive processes Arctic cooling DC and DC pulsed sputter HIS processes
10
Rotatable magnetron cathodes
PANEL PROCESSING
MSP & LLS EVO II The MSP and LLS EVO II batch systems are ideal for rigid or flexible panel substrates. In combination with a manually loaded degas station and our low process temperatures, low contact resistance and best in class adhesion strength on various substrates and contact pads can be achieved. KEY FEATURES
SOLARIS The Evatec SOLARIS platform is suitable for smaller panel formats. Every format that fits into the 15” carrier (e.g. 265mm x 265mm) can be processed in this throughput optimized equipment with its “inline” manufacturing concept.
Batch panel processing RF etch Up 7 sources (6 PVD and 1 etch) MES (SECS/GEM) Reactive processes DC, DC pulsed and RF sputter HIS processes Rotatable magnetron cathodes and planar magnetron sources
KEY FEATURES
Single panel processing with carrier Glow discharge or RF etch Up to 5 modules (4 PVD and 1 etch) Atmospheric Batch Degasser OHT integration MES (SECS/GEM)
Reactive processes Cooling station DC, DC pulsed and RF sputter HIS processes Planar magnetron sources
11
PANEL SOLUTIONS
EVATEC SOLUTIONS FOR PANEL PROCESSING OVERVIEW Substrate size Key features
Up to 620 x 620mm (24.4” x 24.4”) rigid or flexible
PNL
SOLARIS
MSP
LLS
Up to Ø 15” (e.g. 265 x 265mm) rigid or flexible
Materials
Single panel processing Etch/clean module Up 4 modules (3 PVD & 1 etch) Atmospheric Batch Degasser OHT integration Single panel processing with carrier Glow discharge or RF etch Up 5 modules (4 PVD & 1 etch) Atmospheric Batch Degasser OHT integration
MES integration (SECS/ GEM) Reactive processes Arctic cooling DC and DC pulsed HIS Rotatable magnetron cathodes MES (SECS/GEM) Reactive processes Cooling station DC, DC pulsed and RF HIS Planar magnetron sources
up to 6x 610x610mm (24” x 24”) rigid or flexible
Batch panel processing RF etch Up to 7 sources (6 PVD & 1 etch) MES (SECS/GEM) reactive processes
DC, DC pulsed and RF HIS Rotatable magnetron cathodes and planar magnetron sources
Up to 4x 305 x 457mm (12” x 18”) flexible
Batch panel processing Ion milling or RF etch Separate etch and PVD chamber Up 5 PVD sources MES (SECS/GEM)
Reactive processes DC, DC pulsed and RF HIS Rotatable magnetron cathodes and planar magnetron sources
Typical substrates: FR4, LCP, PI, molded compound, glass, Si, passivated substrates (e.g. PI, PBO, SiN, SiO2) Typical contact pads: Al, Cu, AlSiCu Typical sputter materials: e.g. Ti, TiW, Cu, CrCu, Ni, NiV, NiCu, Au, Al, AlN, TaN, Ta2N, TiW-silicide, NiCr, Cermet, Au-TaTa2O5-Ta-Au, SiCr, Pt, Fe, Mo, Cr, Ag, TiOxNy, SiO2, WTiAu, TiN-Al, AlCu4, AlSiCu, Cr-Ni-Au, Cr-NiV-Ag, Cr-Cu, ITO, ZNo, Ag, Ti
ABOUT EVATEC Evatec offers complete solutions for thin film deposition and etch in the semiconductor, optoelectronics and photonics markets.
Our team is ready to offer process advice, sampling services and custom engineering to meet our customers individual needs in platforms from R&D to prototyping and true mass production.
Our technology portfolio includes standard and enhanced evaporation, a range of advanced sputter technologies as We provide sales and service through our global network well as plasma deposition & etch. of local offices. For more information visit us at www.evatecnet.com or contact our head office.
Evatec AG Hauptstrasse 1a CH-9477 Trübbach Switzerland
Tel: +41 81 403 80 00 Fax: +41 81 403 80 01 info@evatecnet.com www.evatecnet.com
Product descriptions, photos and data are supplied within the brochure for general information only and may be superseded by any data contained within Evatec quotations, manuals or specifications. Edition 1: Printed July 2017