Invited Paper
New advances with REBL for maskless high-throughput EBDW lithography Paul Petric*, Chris Bevis, Mark McCord, Allen Carroll, Alan Brodie, Upendra Ummethala, Luca Grella, Anthony Cheung, and Regina Freed KLA-Tencor Corporation, One Technology Drive, Milpitas, CA USA 95035 ABSTRACT REBL (Reflective Electron Beam Lithography) is a program for the development of a novel approach for highthroughput maskless lithography. The program at KLA-Tencor is funded under the DARPA Maskless Nanowriter Program. A DPG (digital pattern generator) chip containing over 1 million reflective pixels that can be individually turned on or off is used to project an electron beam pattern onto the wafer. The DARPA program is targeting 5 to 7 wafers per hour at the 45 nm node, and this paper will describe improvements to both increase the throughput as well as extend the system to the 2x nm node and beyond. This paper focuses on three specific areas of REBL technology. First, a new column design has been developed based on a Wien filter to separate the illumination and projection beams. The new column design is much smaller, and has better performance both in resolution and throughput than the first column which used a magnetic prism for separation. This new column design is the first step leading to a multiple column system. Second, the rotary stage latest results of a fully integrated DPG CMOS chip with lenslets will be reviewed. An array of over 1 million micro lenses which is fabricated on top of the CMOS DPG chip has been developed. The microlens array eliminates crosstalk between adjacent pixels, maximizes contrast between on and off states, and provides matching of the NA between the DPG reflector and the projection optics. Keywords: Ebeam, direct write, rotary stage, DPG, maskless, lithography, TDI, gray level, reflective electron optics
1. INTRODUCTION EBL (electron beam lithography) since its beginning has fallen short in lithography for HVM (high volume manufacturing) because of insufficient throughput except for mask making 1. High resolution lithography and personalization for specialized products 2 is another arena where EBDW has proven useful because resolution and maskless capability have been more important than throughput. Quick-Turn-Around 3 4 5 6 and small lot manufacturing 7 have also proven to be quite successful. SCALPEL 8 9 and PREVAIL 10 11 12 13 were two competing Electron Projection Lithography (EPL) programs that demonstrated very good progress but did not utilize one of EBL’s most important assets, maskless capability. Currently there are primarily three maskless EBDW programs under development: MAPPER 14, IMS 15 and REBL 16 17 18. This paper describes the latest advances in the REBL Nanowriter development program. REBL (Reflective Electron Beam Lithography) is a program for the development of a novel approach for high throughput maskless lithography. The program at KLA-Tencor is jointly funded by KLA-Tencor and DARPA under the Maskless Nanowriter Program. The program is specifically targeting 5 to 7 wafer levels per hour at the 45 nm node. The system is being designed, however, for extension to the 2x nm node and beyond. Figure 1 shows a concept diagram of the current REBL system. REBL utilizes several novel technologies to generate and expose lithographic patterns at throughputs that could make ebeam maskless lithography feasible for HVM. The DPG incorporates CMOS on-chip circuitry in order to provide the extremely high data rates without excessive interconnect. The exposure strategy uses a TDI (time *E-mail: paul.petric@kla-tencor.com
Alternative Lithographic Technologies III, edited by Daniel J. C. Herr, Proc. of SPIE Vol. 7970, 797018 · © 2011 SPIE · CCC code: 0277-786X/11/$18 · doi: 10.1117/12.882636
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