Product News PROLITH v8.0
With PROLITH v8.0’s new multi-measurement capability, lithographers can determine best overall process settings.
PROLITH v8.0 can easily identify outof-spec features.
PROLITH v8.0 can create an overlapping process window in one step that simultaneously accounts for all critical dimensions and measurements.
PROLITH v8.0 Benefits • Helps determine best overall process settings • Optimizes total feature performance on the most advanced device layouts • Provides critical feature data from the exact location required • Enables investigation of process and technology tradeoffs including LIL • Provides faster analyses and decisions with multi-measurement capability
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Spring 2004
As feature sizes continue to shrink, lithography processes are being pushed to their limits. Lithography simulation essentially must solve complex problems in both reticle and wafer manufacturing as lithographers push existing 248-nm and 193-nm technologies to smaller and smaller feature sizes through the use of increasingly complex techniques, such as off axis illumination, phase-shifted reticles, and double exposure processes. This level of sophistication demands that simulation tools be accurate, versatile, easy to use, and fast in order to support decision making across a wide range of technologies, processes, and materials. Leading the way in this critical emerging area of lithography management is KLA-Tencor’s PROLITH software, the industry’s leading lithography simulation tool. PROLITH’s optical lithography modeling capabilities enable customers to maximize yield, more rapidly implement new processes and technologies, and increase their lithography equipment utilization. The newest PROLITH release, version 8.0, allows lithographers to be even more efficient in resolving lithography simulation problems. With a new multi-measurement capability, lithographers can determine the best overall process settings, enabling creation of an overlapping process window that simultaneously accounts for all critical dimensions and measurements. PROLITH v8.0 enables measurement of up to 11 different locations on a cross-section and up to 22 additional, top-down dimensions with the PROLITH 3D option. These additional measurements take no additional simulation time. Additionally, metrology planes can be added or moved using a table or by drawing or dragging on a graph. Whether measuring aerial images, resist profiles, or anything in between, additional measurement information significantly helps shrink decision time. PROLITH v8.0 also includes a simulation capability for liquid immersion lithography (LIL), enabling determination of the potential performance advantages of this new process technology in meeting specific device and technology requirements. Other new features/benefits: • Quick viewing of full-chip GDSII or MEBES design files • Evaluation of the impact of using a different polarization setting for each pass on the exposure tool, which helps determine which exposure process gives the best lithography process results • Measurement of features on diagonals or on any angle, optimizing total feature performance on today’s most advanced device layouts • Metrology data along planes that do not start or stop at a simulation grid point. New flexibility assures necessary information from the exact location desired • Wider range of template files allows designation of default PROLITH input values so they correspond to common technology nodes, making starting point closer to actual process • Improved PROLITH Programming Interface (PPI) documentation. PPI now includes low-level commands for working with multiple metrology planes Yield Management Solutions