Product News Surfscan SP2
UV laser surface inspection KLA-Tencor’s Surfscan SP2 inspection system provides the increased sensitivity and throughput needed to enable current and next-generation substrate qualification, as well as process tool qualification and monitoring, at the 65- and 45-nm nodes, with extendibility to the 32-nm node. Incorporating revolutionary UV laser technology, new darkfield optics and advanced algorithms, the Surfscan SP2 finds defects as small as 30 nm on all critical layers—meeting the sensitivity requirements for all critical layers below the 45-nm mode. Spot migration, enabled by the Surfscan SP2’s increased sensitivity, coupled with a new wafer handler and software platform, provides up to a five-fold increase in wafer final inspection compared to the prior industry benchmark system, the Surfscan SP1DLS. The Surfscan SP2 is also the only production-worthy solution that provides consistently reliable and accurate defect detection on engineered substrates, including SOI, strained silicon and strained silicon-on-insulator. The Surfscan SP2 provides improved defect detection on engineered substrates using its unique UV laser, which emits at a specific wavelength that eliminates the interference effects associated with traditional visible-wavelength inspection tools. By eliminating these effects, the Surfscan SP2 causes engineered substrates to behave like polished wafers during inspection, which increases inspection sensitivity and provides more consistent results. For traditional silicon substrates, the Surfscan SP2 delivers the highest performance with the lowest cost of ownership of any wafer inspection system.
Surfscan SP2
SpectraCD 100
Optical CD metrology SpectraCD 100 is KLA-Tencor’s latest-generation optical CD metrology system for advanced patterning process control. SpectraCD 100’s long-term precision, ability to non-destructively measure features down to 30 nm, production throughput (up to 60 wafers per hour), and accurate 3-D profile metrology capabilities deliver an effective inline process control and product dispositioning tool for critical patterning steps at the 90- and 65-nm nodes. SpectraCD 100 utilizes the latest-generation broadband spectroscopic ellipsometry technology with reflective optics to provide up to a ten-fold improvement in sensitivity to detecting certain process issues, such as resist footers in gate structures. SpectraCD 100’s new 3-D modeling capability enables measurement of contact holes, and provides more accurate information on sidewall angle and height for tighter process control and better prediction of electrical performance. In addition to monitoring all layers served by the previous-generation SpectraCD system, such as resist lines, shallow trench isolation (STI) etch, gate etch and trench etch, SpectraCD 100 can monitor a wide variety of new front-end layers that require higher sensitivity. These include DRAM gate, spacer, bi-layer resist, step height, deep trench and chemical mechanical planarization (CMP) layers with liners.
SpectraCD 100
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Summer 2004
Yield Management Solutions
AIT
Fusion XUV
UV Illumination laser-scanning patterned wafer inspection The AITFusion XUV ultraviolet (UV) illumination laser-scanning system for inspection of patterned wafers builds on the capabilities of KLA-Tencor’s widely adopted and production-proven AITFusion UV. Hardware and software improvements enable the AITFusion XUV to offer higher throughput and sensitivity, across all major process steps, to meet the stringent demands associated with 65-nm device geometries and their associated materials. Like its predecessor, the AITFusion XUV provides detection capability for current-layer defects at speeds up to three times faster than the prior-generation AIT XP system. This includes layers with grain, high color variation, or other noise sources, such as chemical mechanical planarization (CMP) layers, copper/low-k interconnects, and multi-layer film stacks. With its improved Auto-Positioning System (APS), the AITFusion XUV also provides better focus, tracking performance, and die-to-die registration—while delivering cost of ownership (CoO) that’s among the lowest in the industry.
AIT
Fusion XUV
Klarity SSA
Spatial signature analysis Klarity SSA is an add-on process monitoring capability for KLA-Tencor’s proven family of Klarity yield analysis software. Supported by all KLA-Tencor inspection tools, Klarity SSA employs a sophisticated, proprietary algorithm to perform automated detection, classification and root-cause analysis of spatial signatures (i.e., defect clusters and patterns), which can indicate an out-of-spec process or a process tool problem. Klarity SSA automatically detects and reports on excursion wafers that are currently “beneath the radar,” i.e., wafers that are within spec based on raw defect count, or on random defect plus cluster count. The capability complements KLA-Tencor’s existing SPC technology while adding an additional data filter that allows greater insight into the manufacturing process. Klarity SSA
Klarity ACE XP
Advanced yield analysis and reporting Klarity ACE XP is an advanced yield analysis and reporting system, which integrates all yield-relevant data from throughout the fab into a highly flexible and robust framework that for the first time allows customers to capture, retain and share yield learning and best-known methods within and across fabs. This capability helps to speed up root-cause analysis and improve yield management training on the fab floor. Klarity ACE XP is an open architecture platform that supports existing IP and legacy analysis systems, as well as enables new analysis capabilities to be easily added to address future manufacturing requirements. Klarity ACE XP can access and cross-correlate all fab data types—including defect, WIP tracking, equipment condition, CD measurement, inline parametric test, bin or wafer sort test, and final test—to determine the root cause of yield problems, as well enable failure prediction. New capabilities include a drag-and-drop visual interface that allows the assembly of recipes from a palette of functional building blocks, and a powerful data-mining tool that is specifically designed for semiconductor production applications and accommodates up to six different sets of analyses. Summer 2004
Klarity ACE XP
www.kla-tencor.com/magazine
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Accelerating Yield
Nothing is insurmountable.
Surfscan SP2
™
Cost-effective 65 nm production has arrived. Introducing an epic achievement in wafer surface inspection. Surfscan SP2 enables next-generation substrate and process tool qualification at the lowest cost of ownership. It’s the giant leap that bridges the development to production gap. ➤ Exclusive UV technology enables a single tool purchase for three technology nodes ( 65 nm to 32 nm ), with: • More than 5x throughput increase for Wafer Qualification (Wafer Manufacturers) • More than 2x throughput increase for Tool Qualification (IC Manufacturers) ➤ For product details and insight into new materials challenges, go to:
w w w. k l a - t e n c o r. c o m / S P 2 ©2004 KLA-Tencor Corporation.
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