KLA Yavne

KLA Yavne includes units which develop market-leading, advanced software and hardware solutions for the manufacturing of printed circuit boards and flat panel displays. KLA Yavne includes three main business divisions – PCB (printed circuit boards), FPD (flat panel displays) and Frontline (advanced pre-production and production software solutions for printed circuit board manufacturing). Our employees conceive, design, manufacture and service a broad range of performancedriven solutions that enable our customers to massproduce the world’s most advanced electronics.

PCB (Printed Circuit Board)

KLA's printed circuit board (PCB) division is a leading provider of solutions used in the multiple processes involved in PCB manufacturing, such as automated optical inspection (AOI), automated optical shaping (AOS), direct imaging for solder mask (DI SM), via formation (VF) and more.

Supplying enabling technologies for advanced production, PCB solutions are aimed at multiple applications and production levels from advanced IC substrates (ICS), to high-density interconnects (HDI), multi-layer boards (MLB) and flex PCBs. The PCB division’s solutions are installed in leading manufacturers facilities worldwide and are endorsed by top-tier designers (OEMs).

Shahar Michal PCB VP/General Manager Flat Panel Display (FPD)

Tom Bailey, FPD VP/General Manager

The flat panel display (FPD) division is a leading supplier of value-added, innovative, technological solutions for the manufacturing of flat panel displays of all shapes and sizes. With a wide range of automated solutions for the inspection, yield management, test and repair of current and future technologies, we set new standards for high quality flat panel display production and process monitoring. Our FPD solutions are utilized in every leading FPD fab around the world.

Frontline

Eran Lazar, Frontline VP/ General Manager

The Frontline software division is the world leader in advanced pre-production and production software solutions for printed circuit board manufacturing. With over two decades of experience and over 15,000 software installations worldwide, we offer our customers worldwide innovative solutions for transforming complex PCB designs into outstanding end products, using leading technologies like cloud, AI, and advanced algorithms. Our technological and project management expertise, coupled with the passion and drive of our people, enable us to provide unrivaled solutions in the market.

ERC (EPC Research & Central Engineering)

Mor Azarya, Head of ERC

ERC is the Electronics, Packaging & Components group’s central organization. It acts both as Central Engineering, developing common subsystems and technologies across products, and as a research and incubation unit for advanced and enabling future technologies.

The ERC team’s expertise spans across the complex fields of optics, lasers, 3D, materials, AI, opto-mechanics, motion and more.

With state-of-the-art labs and equipment, the ERC team provides differentiating technologies, helping the company keep its competitive advantage in a challenging and rapidly-changing market, as well as enabling and encouraging innovation.

FPD-PCB Operations

Amitay Sarder, Head of FPD & PCB Operations

The Operations sites, which serve the FPD and PCB divisions, are spread out across a few countries: Israel, Germany, Italy, USA, Korea, China and Japan. The global operations team, comprised of manufacturing, supply chain management, engineering, quality, and global service supply is responsible for supplying all of our products. We are also responsible for providing new products (NPIs) to the market while cooperating with the divisions' R&D teams. The operations team is continuously working to build our products Better, Faster, Cheaper.