Product News Surfscan SP2
UV laser surface inspection KLA-Tencor’s Surfscan SP2 inspection system provides the increased sensitivity and throughput needed to enable current and next-generation substrate qualification, as well as process tool qualification and monitoring, at the 65- and 45-nm nodes, with extendibility to the 32-nm node. Incorporating revolutionary UV laser technology, new darkfield optics and advanced algorithms, the Surfscan SP2 finds defects as small as 30 nm on all critical layers—meeting the sensitivity requirements for all critical layers below the 45-nm mode. Spot migration, enabled by the Surfscan SP2’s increased sensitivity, coupled with a new wafer handler and software platform, provides up to a five-fold increase in wafer final inspection compared to the prior industry benchmark system, the Surfscan SP1DLS. The Surfscan SP2 is also the only production-worthy solution that provides consistently reliable and accurate defect detection on engineered substrates, including SOI, strained silicon and strained silicon-on-insulator. The Surfscan SP2 provides improved defect detection on engineered substrates using its unique UV laser, which emits at a specific wavelength that eliminates the interference effects associated with traditional visible-wavelength inspection tools. By eliminating these effects, the Surfscan SP2 causes engineered substrates to behave like polished wafers during inspection, which increases inspection sensitivity and provides more consistent results. For traditional silicon substrates, the Surfscan SP2 delivers the highest performance with the lowest cost of ownership of any wafer inspection system.
Surfscan SP2
SpectraCD 100
Optical CD metrology SpectraCD 100 is KLA-Tencor’s latest-generation optical CD metrology system for advanced patterning process control. SpectraCD 100’s long-term precision, ability to non-destructively measure features down to 30 nm, production throughput (up to 60 wafers per hour), and accurate 3-D profile metrology capabilities deliver an effective inline process control and product dispositioning tool for critical patterning steps at the 90- and 65-nm nodes. SpectraCD 100 utilizes the latest-generation broadband spectroscopic ellipsometry technology with reflective optics to provide up to a ten-fold improvement in sensitivity to detecting certain process issues, such as resist footers in gate structures. SpectraCD 100’s new 3-D modeling capability enables measurement of contact holes, and provides more accurate information on sidewall angle and height for tighter process control and better prediction of electrical performance. In addition to monitoring all layers served by the previous-generation SpectraCD system, such as resist lines, shallow trench isolation (STI) etch, gate etch and trench etch, SpectraCD 100 can monitor a wide variety of new front-end layers that require higher sensitivity. These include DRAM gate, spacer, bi-layer resist, step height, deep trench and chemical mechanical planarization (CMP) layers with liners.
SpectraCD 100
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Summer 2004
Yield Management Solutions