Spring00 productnews

Product News eV300 Automated SEM Review System

The eV300 automated SEM review system is designed for defect review and analysis in a high-volume wafer production environment. Capable of handling both 200 mm and 300 mm wafers, the system delivers a four-fold increase in productivity compared with manual SEM review systems. This, combined with its superior defect classification and analysis accuracy, makes it ideal for both in-line monitoring and engineering analysis applications at 0.18 µm and smaller geometries. The eV300 offers three operating modes to provide optimum imaging on all process layers and materials. It also incorporates a new imaging capability, which features a flexible 0-45 degree wafer tilt and 360 degree continuous rotation. This enables exceptional accuracy in classifying and analyzing defects by allowing the operator to select the optimum orientation for defect review. In addition, the eV300 is the only automated SEM tool that offers 19 keV beam landing energy, which enables unsurpassed elemental analysis of copper-related defects. circle RS#044 Pattern Quality Confirmation (pQC™) Software

KLA-Tencor’s new Pattern Quality Confirmation software (pQC) combines inline metrology with real time process inspection, enhancing the 8100 family of critical dimension scanning-electron microscopes (CD SEMs). As device geometries shrink, the simple width of a feature is no longer adequate to monitor the quality of the patterning process. Additional information on the overall shape and integrity of the pattern is required. pQC delivers the ability to detect small changes in pattern fidelity caused by slight process variations.

Users can realize a significant increase in production yield as pQC enables detection of yield-limiting variations that can go undetected by traditional CD SEM measurements. These feature changes include variations in sidewall slope, scumming, footing, bridging, and partially closed contacts. With pQC, the 8100 product family plays an even greater role in KLA-Tencor’s Process Parametric Control system. circle RS#009

PMC-Net Data Collection, Analysis and Reporting System

PMC-Net is the industry’s first software solution to connect all yield, process and test-floor related data into a single, automated, customizable and easy-to-use data collection, analysis and reporting system. PMC-Net fully automates the yield management and process control functions throughout the fab, enabling semiconductor manufacturers to speed time to market and time to profit. PMC-Net incorporates a centralized database that stores all yield-relevant data from across the fab in a single format, eliminating data incompatibility issues. PMC-Net also includes the PMC-Net Applications Suite™, an expanding range of modular and customizable yield analysis programs using a unique decision flow analysis software architecture that facilitates wafer lot disposition, increases productivity and enables excursion identification in real time. In addition, PMC-Net incorporates a proprietary integration technology that facilitates real-time communication across all KLA-Tencor tools, ensuring integration quality and facilitating tool software upgrades. These benefits translate into accelerated yield learning rates and reduced time to corrective action for yield and process excursions. circle RS#043 66

Spring 2000

Yield Management Solutions

Surfscan SP1SNT Comprehensive Unpatterened Surface Inspection System

The new Surface NanoTopography“ (SNT) feature enables the Surfscan SP1 to provide precise quantitative measurements of topography variations with nanometer sensitivity over millimeter ranges on unpatterned wafer surfaces.

As a result, semiconductor manufacturers can obtain vital data on wafer surface quality and improve process monitoring both of which are critical capabilities for the development of 0.13 µm and smaller devices, and the production of 0.18 µm devices. A new wafer handling system developed by KLA-Tencor, known as Edge Handling, is a key enabler of the SNT technology. Edge Handling leaves the backside of the wafer untouched during the inspection process. Previously, vacuum chucks were used to hold wafers on the backside during inspection, which distorts the wafer shape and increases the likelihood of backside contamination during the inspection process. circle RS#013

ASET-F5x Thin Film Measurement System

The ASET-F5x is the enhanced version of KLA-Tencor’s award-winning ASET-F5 thin film measurement system. It includes a single wavelength ellipsometry (SWE) option to complement the industry-leading spectroscopic ellipsometry (SE), and dual-beam spectrophotometry (DBS) technologies incorporated in the ASET-F5. These combined capabilities provide the accuracy, repeatability, and system-to-system matching required for the production of advanced integrated circuits (IC’s) with geometries as small as 0.10 µm. In addition, the ASET-F5x is a bridge tool capable of handling either 200 or 300 mm wafers.

A critical component of KLA-Tencor’s process module control (PMC) solutions, the ASET-F5x, when used in combination with KLA-Tencor’s Quantox oxide monitoring system, provides a complete solution for advanced gate process control. circle RS#042 IMPACT XP Automatic Defect Classification (ADC)

IMPACT XP, the latest addition to KLA-Tencor’s comprehensive suite of automatic defect classification solutions, enables fabs to implement critical ADC technology more quickly and achieve consistently accurate classification results.

Incorporating several new features, including its new SmartGallery™ technology, IMPACT XP provides users with the ability to quickly set up classifiers tailored to address yield-limiting defects specific to each processing step. As a result, chipmakers can more quickly respond to rapid new product or new fab ramp-up requirements and out-of-control excursions in high-volume manufacturing.

Other advanced features of the IMPACT XP include real-time classification (RTC‘) with noise filtering capabilities, new optics support, which enables higher resolution of defect images for enhanced classification at smaller geometries, and an optional defect sizing module. Available on KLA-Tencor’s brightfield and darkfield inspection platforms, and off-line optical and SEM review tools, IMPACT XP allows customers to deploy the defect classification methodology that is best suited for a given process layer and for the customers’ unique production requirements while sharing a common ADC setup methodology.

KLA-Tencor is the only supplier in the world to provide all components of a true ADC solution which includes capability for in-line, on-line, and off-line circle RS#045 classification of defects.

Spring 2000

Yield Management Solutions

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