Winter05 product news

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Product News 2365

High-resolution imaging system The 2365 brightfield inspection system for patterned wafers uses selectable ultraviolet (UV) illumination and advanced noise suppression to detect critical defects at 65-nm design rules, delivering 2x better throughput than previous-generation tools. Incorporating new optics and illumination enhancements, as well as a shorter wavelength and advanced signal processing algorithms, the 2365 provides the sensitivity, flexibility, and production-worthy performance needed for inline monitoring of product wafers. The tool features KLA-Tencor’s inline automatic defect classification (iADC) technology and nuisance filtering to improve yield correlation. Its superior sensitivity to all defect types makes the 2365 ideal for new technologies (such as copper, low-k dielectrics, and 193-nm resists) in advanced 200-mm and 300-mm fabs. The 2365 is particularly effective for critical etch and chemical-mechanical planarization (CMP) layers, photolithography, and engineering analysis.

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High-resolution DUV imaging system The 2371 system is the next-generation, ultra-broadband brightfield inspector designed to meet the needs of sub-65-nm design rule development and ramp for patterned wafers. Incorporating flexible broadband deep ultraviolet (DUV) illumination and optical modes (High Performance Edge Contrast and Edge Contrast Plus), the 2371 provides increased defect detection, resolution, and sensitivity. Advanced DUV optics make the tool the sensitivity leader for all critical process steps. Able to process both 200mm and 300-mm wafers, the 2371 facilitates quicker advanced process development and 300-mm ramps. Features such as iADC, new set-up and sensitivity algorithms, and superior review optics enable faster time-toresults. These and other capabilities make the 2371 the tool of choice for advanced process development in photolithography and etch line qualification and monitoring for sub-65-nm nodes.

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www.kla-tencor.com/magazine

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