Product News 2365
High-resolution imaging system The 2365 brightfield inspection system for patterned wafers uses selectable ultraviolet (UV) illumination and advanced noise suppression to detect critical defects at 65-nm design rules, delivering 2x better throughput than previous-generation tools. Incorporating new optics and illumination enhancements, as well as a shorter wavelength and advanced signal processing algorithms, the 2365 provides the sensitivity, flexibility, and production-worthy performance needed for inline monitoring of product wafers. The tool features KLA-Tencor’s inline automatic defect classification (iADC) technology and nuisance filtering to improve yield correlation. Its superior sensitivity to all defect types makes the 2365 ideal for new technologies (such as copper, low-k dielectrics, and 193-nm resists) in advanced 200-mm and 300-mm fabs. The 2365 is particularly effective for critical etch and chemical-mechanical planarization (CMP) layers, photolithography, and engineering analysis.
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High-resolution DUV imaging system The 2371 system is the next-generation, ultra-broadband brightfield inspector designed to meet the needs of sub-65-nm design rule development and ramp for patterned wafers. Incorporating flexible broadband deep ultraviolet (DUV) illumination and optical modes (High Performance Edge Contrast and Edge Contrast Plus), the 2371 provides increased defect detection, resolution, and sensitivity. Advanced DUV optics make the tool the sensitivity leader for all critical process steps. Able to process both 200mm and 300-mm wafers, the 2371 facilitates quicker advanced process development and 300-mm ramps. Features such as iADC, new set-up and sensitivity algorithms, and superior review optics enable faster time-toresults. These and other capabilities make the 2371 the tool of choice for advanced process development in photolithography and etch line qualification and monitoring for sub-65-nm nodes.
Winter 2005
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Product News SpectraFx 200
Advanced optical thin film metrology SpectraFx 200, KLA-Tencor’s next-generation optical thin-film metrology system, enables cost-effective control of IC manufacturers’ advanced film processes at the 65-nm and 45-nm nodes. Based on KLA-Tencor’s proven spectroscopic ellipsometry (SE) technology, SpectraFx 200 non-destructively delivers robust, highly accurate measurements of in-die process variation on product wafers using Dielectric Pattern Metrology (DPM), advanced resolution optics, and a range of sophisticated new options, including vacuum ultraviolet (VUV) 150-nm SE. With the SpectraFx 200, chipmakers can qualify and monitor their most advanced film processes—including those involving delicate materials and new engineered substrates—to achieve comprehensive optical metrology control. SpectraFx 200
eS31
Electron-beam inspection system The eS31 provides e-beam inspection from development to production for advanced engineering analysis and electrical line monitoring at the 65-nm node and below. With benchmark throughput, superior sensitivity, and state-of-the-art charge control, it delivers defect detection solutions for small physical defects and electrical defects that other inspection methods cannot detect. The eS31 enables fabs to distinguish between yield-killing defects of interest (DOI) and nuisance defects while achieving 2x improvement in throughput over previous-generation tools. Chipmakers can achieve faster time to market on their advanced products, and also monitor for electrical excursions in production to achieve higher yields and lower their cost per good die.
eS31
Puma 9000
Next-generation high-resolution imaging technology The Puma 9000 series of products combines high-resolution imaging with traditional laser scattering technology for critical defect detection at sub70-nm nodes. An innovation in patterned wafer inspection technology, the Puma 9000 series delivers higher performance at throughput for cost-effective line monitoring. The systems feature new Streak™ technology that enables extremely high data rates and small pixel sizes, allowing inspection strategies that do not compromise sensitivity for throughput. The increased resolution extends the tools’ capabilities beyond traditional laser scattering applications as well as critical etch layers. The Puma 9000 series is built on the highly successful KLA-Tencor 23xx platform, with many ease-of-use features facilitating rapid integration into the production environment. Flexible configurations are available, offering application-specific solutions at the lowest possible cost of ownership (CoO).
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Winter 2005
Yield Management Solutions
PROLITH 8.1
Advanced lithography simulation tool PROLITH 8.1 is the semiconductor industry’s leading lithography process optimization tool. Fabs rely on PROLITH to maximize yield, rapidly implement new processes and technologies, and increase their lithography equipment utilization. The tool reduces process development time and effort, saving money and enabling fabs to get new products to market faster. At the same time, it also enables fabs to rigorously determine design rules. Only PROLITH offers the proven, fully integrated capability of calibration to experimental data. And, its Mask Topography option is the world’s first multi-algorithm, three-dimensional electromagnetic field (EMF) simulator for a desktop PC. PROLITH 8.1
Candela Series
Optical surface analyzers The Candela Series of Optical Surface Analyzers (OSA) are non-destructive laser-based systems used for development and manufacturing process control of magnetic hard disks, compound semiconductors, and transparent wafers. The patented OSA technology simultaneously measures reflectance, scattered light, phase shift, and surface topography across the entire wafer surface. These data are displayed as high-resolution images, or analyzed to detect and classify particles, residues, and surface defects.
Candela Series
Winter 2005
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