1. Introduction This publication is intended as study material for wafer or die level reliability testing and electronics failure analysis. The contents are a part of dissemination activities of CHARM project, in which Lapland University of Applied Sciences is a project partner. Challenging environments tolerant Smart systems for IoT and AI (CHARM) is an ECSEL JU project, where 37 partners from 10 countries develop IoT solutions to withstand harsh industrial environments. The project partners develop new condition monitoring technologies, new sensors, novel package solutions and new connectivity to surroundings, where currently available technologies are not able to perform. The results of the project aim beyond state-of-the-art for European value chain of electronics and IoT. The six Use Cases in CHARM project represent different industry sectors, where harsh conditions limit the use of already existing technology (Figure 1). During the project, technologies to endure severe chemical, thermal and mechanical stresses are developed and validated in their industry end-use demonstrators.
Figure 1. CHARM project key challenges.
Guidelines for reliability testing on circuit level
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