Volume 23, Number 1
SPRING 2019
A Quarterly Publication of The Microelectronics Packaging & Test Engineering Council
SMART SOLUTIONS FOR YOUR MANUFACTURING AND QUALITY CHALLENGES. page 15
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Packaging & Assembly for High-Temperature Electronics Part II – Materials Behavior – Thermomechanical & Thermal page 22
RMIT University researchers have developed a new type of transistor that eliminates the use of any semiconductor making it faster and less prone to harmful heating. Instead of sending electrical currents through silicon, these transistors send electrons through narrow air gaps, where they can travel unimpeded as if in space. This promising proof-of-concept design for nanochips could revolutionize electronics.
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INSIDE THIS ISSUE
10 13 Future trends in IC Devices and Advanced Packaging.
Managing thermal loads is an increasing challenge as power densities are being maximized.
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Wire bonding is generally considered the most cost-effective and flexible interconnect technology.
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The rise of AI has invigorated the semiconductor industry, driving global growth.