Volume 14, Number 2
SUMMER 2010 A Publication of The MicroElectronics Packaging & Test Engineering Council INDUSTRY NEWS National Semiconductor and Green Energy Solar have developed GESOLAR brand modules with embedded SolarMagic™ power optimization technology from National. page 14
STATS ChipPAC Ltd. has announced that its low cost flip chip (LCFC) technology now utilizes copper column bump to deliver a powerful packaging solution at a dramatically reduced cost for its customers. page 14
2010 MEPTEC and SMTA
Medical Electronics Symposium Successful Strategies for the Medical Electronics Sector A Special Two Day Symposium at Arizona State University Tempe, AZ September 22nd and 23rd
Unisem has announced the introduction of a new high density leadframe packaging technology, the Leadframe Grid Array (LFGA). page 14
Sonoscan has recently demonstrated acoustic imaging of defects in the seal that surrounds and protects the cavities in MEMS devices. page 16 SUSS MicroTec has introduced the next generation of its MA100e mask aligner, a dedicated lithography solution for manufacturing highbrightness light emitting diodes (HB-LEDs). page 17
SEMICON West returns to Moscone Center in San Francisco July 13 through 15. www.meptec.org
MEMBER COMPANY PROFILE
T
o date, A.M. Fitzgerald & Associates has served over 70 customers of all sizes and has developed new MEMS products for applications as diverse as long wavelength infrared imaging, tissue scaffolds, microphones, biological and chemical sensors, pressure sensors and optical waveguide switches.
A.M. Fitzgerald & Associates, a MEMS Semiconductor equipment billings increase product development firm located in Bur- 236.0% over May 2009 level. page 16 lingame, CA, bridges the gap between new product concept and foundry production. The company offers fully integrated engineering services to get a client from the proverbial cocktail napkin sketch all the way to the foundry’s doorstep. Founded in 2003 by Dr. Alissa M. Fitzgerald, AMFitzgerald is now recognized as the leading MEMS product development firm FOR in the emerging area of MEMS design and MAY prototyping services. page 8
Bookto-Bill Ratio
1.12
SUMMER 2010 / MEPTEC Report 1