Volume 23, Number 2
SUMMER 2019
A Quarterly Publication of The Microelectronics Packaging & Test Engineering Council
Advanced Materials Challenge Failure Analysis page 16
Destructive Wire Bond Shear Testing page 26
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Packaging & Assembly for High-Temperature Electronics Part III – Materials Behavior – Electrical page 20 University of Twente researchers have succeeded in connecting two parts of an electronic chip using an on-chip optical link. Using CMOS technology, the intrachip connection via light is instantaneous and provides electrical isolation. This approach can be a safe way of connecting high-power electronics and digital control circuitry on a single chip without a direct electrical link.
page 23 -Corp.
INSIDE THIS ISSUE
9
Just like waves that travel in “groups”, 5G will be another group of disruptive waves.
11
Will we continue to see a large number of OSATs driven by the IDM and fabless companies?
12
Zeiss and Xperi outlined their own expertise in solving specific industry challenges.
30
Much has been written, promoted, and hyped about what is now called Heterogeneous Assembly.