Volume 22, Number 4
WINTER 2018
A Quarterly Publication of The Microelectronics Packaging & Test Engineering Council
THE BODY ELECTRIC
2019 Medical Electronics Symposium May 21 & 22, 2019
Lorain County Community College, Elyria, Ohio
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page 11 DARPA’s CHIPS Program for IP Reuse and Heterogeneous Integration page 15 Packaging & Assembly for High-Temperature Electronics Part I – Devices and Materials page 19
Tufts University researchers have developed a “smart” bandage that will actively monitor the condition of wounds and deliver drug treatments to improve healing. The bioelectronics bandage features integrated pH and temperatures sensors that electronically trigger drug release when it senses that wounds are not healing properly.
page 28 -Corp.
INSIDE THIS ISSUE
12 24 SoC Silicon and Software 2018 Design Cost Analysis
ISO 9001 is viewed by most people as the minimum table stakes of good business practice.
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Ensuring the reliability of package designs has become essential to long-term performance.
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Advancements in “connected” medical electronics are revolutionizing the health care industry.