New Room Temperature Curable Gap Filler from Henkel is Optimized for Electronic Assembly Applications

FOR EXCEPTIONAL DESIGN FLEXIBILITY: HENKEL LAUNCHES BERGQUIST GAP FILLER TGF 2900LVO

As modern vehicles become increasingly dependent on sophisticated electronics, manufacturers require reliable solutions, while ensuring efficient and cost-effective assembly of key automotive electronics components such as control modules. As an expert partner to automotive OEMs and component manufacturers, Henkel Adhesive Technologies is expanding its portfolio of advanced materials to meet this demand with the launch of its new thermal liquid gap filler that has been optimized for a wide range of electronic assembly applications.

Bergquist gap filler TGF 2900LVO is a silicone-based, 2-component room temperature curable gap filler suitable for use in a wide range of electronic assembly applications.

“Representing a new generation of Henkel gap fillers, TGF 2900LVO demonstrates superior performance that makes it an outstanding choice for automotive control modules. These designs are ever evolving and find a versatile solution in the possibility of ultra-thin bondline thickness of TGF 2900LVO, lowering the overall thermal resistivity of the system,” said Bart Van Eeghem, Business Development Manager at Henkel. “Thereby this new Henkel product meets exactly the needs of our customers. The versatility and longer working time allow to reduce the complexity of the supply chain and facilitating processability and flexibility.”

To learn more visit www.henkel.com.

SEMICON West Makes Two Big Moves – Shifts to October in 2024, Begins Annual Rotation with Phoenix in 2025

A FIXTURE IN THE SAN FRANCISCO Bay Area for more than 50 years, SEMICON West is moving to Phoenix for a five-year annual rotation starting in 2025 and shifting from its long-standing July event dates to October beginning in 2024, SEMI has announced. The event, North America’s premier microelectronics exhibition and conference, will be held again in Arizona in 2027 and 2029, with all three appearances at the Phoenix Convention Center.

“SEMI is excited to bring SEMICON West to Phoenix, a booming semiconductor manufacturing hub, in October 2025,” said Joe Stockunas, president of SEMI Americas, host of the exhibition and conference. “Greater Phoenix is home to more than 75 semiconductor companies including SEMI members EMD Electronics, Intel and Taiwan Semiconductor Manufacturing Company (TSMC), and the sector employs more than 100,000 with more jobs on the way. SEMI thanks the Greater Phoenix Economic Council (GPEC), Arizona Commerce Authority (ACA), and the city of Phoenix for their tremendous support as we make this important move,” Stockunas added.

In November, the state of Arizona announced a $100 million investment in semiconductor industry research and development under the U.S. CHIPS and Science Act to consolidate the state’s competitive position. And in December, TSMC announced plans to triple its fab investments in Phoenix to $40 billion, facilities that are expected to create 13,000 high-tech jobs, and produce leading-edge 3-nanometer chips at the new factory by 2026.

Greater Phoenix is also a rich source of new talent for local semiconductor companies. The Arizona State University engineering program is the largest in the United States, with more than 30,000 students, including 7,000 focused on microelectronics-related fields. The Maricopa Community Colleges have also made significant investments in quick-start programs to bring even more technicians online.

Phoenix will first host SEMICON West Oct. 7-9, 2025. The event will continue to be held at the Moscone Center in San Francisco on the alternating years and over the long term. The event changes do not affect this year’s SEMICON West, scheduled for July 11-13 at the Moscone Center.

Visit www.semi.org to learn more. ◆

 HAVIV ILAN TO BECOME NEXT TI PRESIDENT AND CEO

TEXAS INSTRUMENTS www.TI.com

(TI) has said that its board of directors has selected Haviv Ilan to become the company’s next president and chief executive officer (CEO), effective April 1. Ilan, a 24-year veteran of TI, succeeds current CEO and president, Rich Templeton, who will transition out of these roles over the next two months but will remain the company’s chairman. The transition is a well-planned succession that follows Ilan’s promotion to senior vice president in 2014, executive vice president and chief operating officer in 2020 and election to the board of directors in 2021.

 INTEL BOARD OF DIRECTORS APPOINTS

FRANK D. YEARY AS NEW INDEPENDENT CHAIR

INTEL CORPORATION announced that Frank D. Yeary has been appointed as the new independent chair of its board of directors. This follows Dr. Omar Ishrak’s decision to step down as chair. Ishrak will remain on Intel’s board as an independent director and continue to serve on the audit and finance committee and corporate governance and nominating committee. www.intel.com ◆

Yeary has served as a director of Intel since 2009. He also is a managing member at Darwin Capital Advisors. Yeary also serves on the board of Mobileye, PayPal Holdings, among others. In the past Yeary served as vice chancellor of UC Berkeley and spent 25 years in the finance industry.