WEDGE & BALL

wearables, mobile and automotive applications are continuing to demand application specific higher resolution, accuracy, and range of operation for existing sensors. Complexities in production testing of MEMS & sensor devices is continuing to grow. New complexities are demanding streamlining and efficiency improvements to existing test equipment technologies, manufacturing processes, and systems.

Acknowledgment

The author expresses his gratitude to Amkor’s package design teams to allow sharing block level representations to surface production test complexities. The author also thanks Amkor’s sensor mass production test site manager Mon Lopez for providing feedback and areas of improvements that allow consistent test factory throughput.

Author Biography

Vineet Pancholi joined Amkor in Jan. 2019 and currently leads test technology development for 5G RF and high-speed digital production test methodologies. Before joining Amkor, Vineet worked in test development at Microchip Technology. Prior, he spent 19 years at Intel in a variety of test roles, including tester supplier management, test technology development (burn-in, final and system level test) and RF tester architect. Vineet holds a patent on semiconductor device testers and has earned master’s degrees in physics and electrical engineering from Arizona State University. ◆

References

[1] Heterogeneous Integration Roadmap [2021] Chapter 11 – MEMS and Sensor Integration

[2] Amkor’s MEMS and Sensor Packages & Applications

[3] Amkor’s MEMS and Sensors Technology Sheet

[4] Amkor’s Automotive Brochure

[5] Amkor’s Test Services Brochure

[6] Heterogeneous Integration Roadmap [2021] Chapter 17 – Test Technology

MICROELECTRONIC SUB-ASSEMBLY MANUFACTURING IN THE SILICON HEARTLAND

SMART MICROSYSTEMS is excited to reside in America’s Silicon Heartland as the Midwest region of the US is now poised to create the next international semiconductor boom. As part of the semiconductor supply chain, SMART Microsystems provides services for microelectronic sub-assembly manufacturing. In addition to process development expertise, SMART Microsystems has in-house Test & Inspection capabilities making it a comprehensive resource for the development and manufacture of the next generation of products that require microelectronic sub-assemblies.

Manufacturing

Test & Inspection

Wafer Dicing • Die Attach • Wire Bonding

Heavy Gauge Wire and Ribbon Bonding

Encapsulation and Dispensing

Test & Inspection and Failure Analysis

Reliability and Environmental Life Test

Super UV Weathering Chamber Testing

141 Innovation Drive, Elyria, Ohio 44035

Telephone: 440.366.4203 info@smartmicrosystems.com