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A Liquid Cooled Heat Sink

Small in size, Big

in performance

Microfins (liquid cooled)

8Xfaster in temperature change

4Xsmaller in size

2Xbetter thermal resistance

As more features are integrated into semiconductors, such as processors used in computer graphics, high speed computing etc., these devices require higher power to function. In today’s electronic products, liquid cooling has become a solution for many high power applications such as transportation, blade servers, solar cell conditioners, digital cinema projectors, high power laser generators etc. Microfins is “the real cool ready solution” for high power semiconductors requiring better transient response. It contains microscale copper channels for fluid flow and removes heat with very high efficiency. Microfins removes heat from the device under operation and maintains the desired temperature uniformly at rates 8X faster, 4X smaller in size and 2X better thermal resistance than any air-cooled devices in the market today.

How does Microfins work? Microfins is formed in copper plates using a proprietary process that creates a microscale structure with extremely high heat transfer coefficient and low resistance to fluid flow. This is embedded in a high temperature plastic housing measuring 56 x 67 x 36 mm, containing a micro pump. The working fluid operates in single- or two-phase regime depending on the application. A small pump circulates the fluid through the Microfins in the housing acquiring heat from the device in operation and maintaining a uniform temperature on the surface of the device. The cooled fluid is pumped to a heat exchanger, converted to a cool temperature, and returned to the Microfins, thus completing the cycle.


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