A Liquid Cooled Heat Sink
Small in size, Big
in performance
Microfins (liquid cooled)
8Xfaster in temperature change
4Xsmaller in size
2Xbetter thermal resistance
As more features are integrated into semiconductors, such as processors used in computer graphics, high speed computing etc., these devices require higher power to function. In today’s electronic products, liquid cooling has become a solution for many high power applications such as transportation, blade servers, solar cell conditioners, digital cinema projectors, high power laser generators etc. Microfins is “the real cool ready solution” for high power semiconductors requiring better transient response. It contains microscale copper channels for fluid flow and removes heat with very high efficiency. Microfins removes heat from the device under operation and maintains the desired temperature uniformly at rates 8X faster, 4X smaller in size and 2X better thermal resistance than any air-cooled devices in the market today.
How does Microfins work? Microfins is formed in copper plates using a proprietary process that creates a microscale structure with extremely high heat transfer coefficient and low resistance to fluid flow. This is embedded in a high temperature plastic housing measuring 56 x 67 x 36 mm, containing a micro pump. The working fluid operates in single- or two-phase regime depending on the application. A small pump circulates the fluid through the Microfins in the housing acquiring heat from the device in operation and maintaining a uniform temperature on the surface of the device. The cooled fluid is pumped to a heat exchanger, converted to a cool temperature, and returned to the Microfins, thus completing the cycle.
Single / Two Phase Micro Channel Cooling Capability Temp vs time for max cooling
100
80
Temp [°C]
60
Temp
40
T_min
20
0 0
-20
30
60
90
120
150
180
210
240
270
300
330
360
390
420
Time [s]
Microfins outperforms conventional heat sinks because of a proprietary manufacturing process that enables this new heat transfer technology. The superior performance results are shown below: -
Microfins is ideal for high power semiconductor devices and equipment requiring quick temperature changes and response for testing purposes. As an example, it has the ability to lower the temperature from 95°C to 25°C in 60 seconds. 8X Faster In Temperature Change Heat Sink
Microfins
• 23oC hotter than Microfins • 80W device can be cooled • Doubling air flow rate only below 50oC o improves 3 C • Excellent margin for controlling • Poor controllability limits higher device transients power capability • Room for growth into higher power & smaller “device under test” 4X Smaller In Package Size
Heat Sink (Air Cooled)
2X Better Thermal Resistance
Microfins (Liquid Cooled)
Heat Sink (Air Cooled)
Microfins (Liquid Cooled)
KESI located in Phoenix, Arizona designs, manufactures and sells standard products as well as customized solutions for a wide range of applications. For more information, contact customer service at the following address: For further information, kindly contact:KES Systems, Inc. 1407 West Drivers Way, Tempe, AZ 85284 Tel: (480) 747-9237 | Email: sales@sunright.com