p. 5 Editor’s Foreword Sizing the market – risk managment
p. 6
Defining Standards High voltage power supply standard
Advertiser Index Page Advertiser
39
Abaco Systems – We never forget those who serve
1
Atrenne Integrated Solutions – 717-SM ATR for harsh environments requiring high level processing and throughput. Behlman Electronics – 3 Phase. 3U. 1 Choice.
3 24
Dawn VME Products, Inc. – Dawn VITA 62 6U AC/DC Power Supply
19
Elma Electronic – VPX SOSA development platform
9
Milpower Source – VPX power conversion
40
Pentek, Inc. – We didn’t break the mold, we shattered it
6
Vector Electronics & Technology, Inc. – VME, VXS, cCPI chassis, backplanes, and accessories
21
VEROTEC Electronics Packaging – Verotec Integrated Packaging
VITA EDITORIAL DIRECTOR Jerry Gipper jerry.gipper@opensysmedia.com GROUP EDITORIAL DIRECTOR John McHale john.mchale@opensysmedia.com TECHNOLOGY EDITOR Mariana Iriarte mariana.iriarte@opensysmedia.com DIRECTOR OF E-CAST LEAD GENERATION AND AUDIENCE ENGAGEMENT Joy Gilmore joy.gilmore@opensysmedia.com ONLINE EVENTS SPECIALIST Sam Vukobratovich sam.vukobratovich@opensysmedia.com CREATIVE DIRECTOR Stephanie Sweet stephanie.sweet@opensysmedia.com SENIOR WEB DEVELOPER Aaron Ganschow aaron.ganschow@opensysmedia.com WEB DEVELOPER Paul Nelson paul.nelson@opensysmedia.com CONTRIBUTING DESIGNER Joann Toth joann.toth@opensysmedia.com EMAIL MARKETING SPECIALIST Drew Kaufman drew.kaufman@opensysmedia.com
SALES/MARKETING SALES MANAGER Tom Varcie tom.varcie@opensysmedia.com (586) 415-6500 MARKETING MANAGER Eric Henry eric.henry@opensysmedia.com (541) 760-5361 STRATEGIC ACCOUNT MANAGER Rebecca Barker rebecca.barker@opensysmedia.com (281) 724-8021 STRATEGIC ACCOUNT MANAGER Bill Barron bill.barron@opensysmedia.com (516) 376-9838 STRATEGIC ACCOUNT MANAGER Kathleen Wackowski kathleen.wackowski@opensysmedia.com (978) 888-7367 SOUTHERN CAL REGIONAL SALES MANAGER Len Pettek len.pettek@opensysmedia.com (805) 231-9582 SOUTHWEST REGIONAL SALES MANAGER Barbara Quinlan barbara.quinlan@opensysmedia.com (480) 236-8818 INSIDE SALES Amy Russell amy.russell@opensysmedia.com ASIA-PACIFIC SALES ACCOUNT MANAGER Patty Wu patty.wu@opensysmedia.com
ECASTS It’s Not About the Data: Transforming into a Connected Company Through industrial IoT Aril 30, 2019 • 11 a.m. EST https://buff.ly/2TPRYty
BUSINESS DEVELOPMENT EUROPE Rory Dear rory.dear@opensysmedia.com +44 (0)7921337498
WWW.OPENSYSMEDIA.COM PRESIDENT Patrick Hopper patrick.hopper@opensysmedia.com EXECUTIVE VICE PRESIDENT John McHale john.mchale@opensysmedia.com
Safety and Security – A Common Theme for Mission-Critical Systems Aril 30, 2019 • 3 p.m. EST https://buff.ly/2FXgrJB
EXECUTIVE VICE PRESIDENT Rich Nass rich.nass@opensysmedia.com CHIEF FINANCIAL OFFICER Rosemary Kristoff rosemary.kristoff@opensysmedia.com EMBEDDED COMPUTING BRAND DIRECTOR Rich Nass rich.nass@opensysmedia.com ASSISTANT MANAGING EDITOR Lisa Daigle lisa.daigle@opensysmedia.com SENIOR EDITOR Sally Cole sally.cole@opensysmedia.com ECD EDITOR-IN-CHIEF Brandon Lewis brandon.lewis@opensysmedia.com ASSOCIATE TECHNOLOGY EDITOR Laura Dolan laura.dolan@opensysmedia.com SENIOR TECHNOLOGY EDITOR Alix Paultre alix.paultre@opensysmedia.com TECHNOLOGY EDITOR Curt Schwaderer curt.schwaderer@opensysmedia.com
EVENT International Microwave Symposium June 2-7, 2019 Boston, Massachusetts https://ims-ieee.org/
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CREATIVE PROJECTS Chris Rassiccia chris.rassiccia@opensysmedia.com PROJECT MANAGER Kristine Jennings kristine.jennings@opensysmedia.com FINANCIAL ASSISTANT Emily Verhoeks emily.verhoeks@opensysmedia.com SUBSCRIPTION MANAGER subscriptions@opensysmedia.com CORPORATE OFFICE 1505 N. Hayden Rd. #105 • Scottsdale, AZ 85257 • Tel: (480) 967-5581 REPRINTS WRIGHT’S MEDIA REPRINT COORDINATOR Wyndell Hamilton whamilton@wrightsmedia.com (281) 419-5725
www.vita-technologies.com
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SPRING 2019 | VOLUME 37 | NUMBER 1
@VitaTechnology
On the cover The VITA Technologies 2019 Resource Guide showcases technologies based on VITA standards, including FMC, OpenVPX, XMC, and related rugged boards, systems, and components. Featured on the cover: Atrenne, A Celestica Compnany. 717-SM ATR for harsh environments requiring high level processing and throughput.
FEATURES
10 Special Features
Embedded Tech Trends 2019 Wrap-up » p. 10
By Jerry Gipper, Editorial Director
Jerry Gipper
Embedded Tech Trends 2019 Wrap-up Hall of Fame
16 Technology Feature Mars Exploration Rover
By Jerry Gipper, Editorial Director
SpaceVPX-enabling the next generation of satellite constellations By Jennifer Keenan, Mercury Systems, Inc.
DEPARTMENTS
5 Editor’s Foreword Mars Exploration Rover » p. 16
By Jerry Gipper, Editorial Director
Jerry Gipper
Sizing the market – risk management
6 Defining Standards
Phil Keohen, Rantec
High voltage power supply standard
8 VITA Standards Update
Jerry Gipper
VITA Standards activity updates
26 Guest Blogs Milestone in abstracting the hardware: Realizing the promise of FACE
By Mark Grovak, Curtiss-Wright Defense Solutions
Keep pace with a standardized development process
SpaceVPX-enabling the next generation of satellite constellations » p. 22
By Jennifer Keenan, Mercury Systems, Inc.
By Nick Butler, National Instruments
28 VITA Technologies Resource Guide OpenVPX
VME
VPX
VPX/OpenVPX
All registered brands and trademarks within VITA Technologies magazine are the property of their respective owners. ™VPX and its logo is a registered product/trademark of VITA. © 2019 OpenSystems Media © 2019 VITA Technologies enviroink.indd 1
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www.vita-technologies.com
Editor’s Foreword By Jerry Gipper, Editorial Director @VitaTechnology
jgipper@opensystemsmedia.com
Sizing the market – risk management We just wrapped up the latest VITA working group updates and meetings in Las Vegas, right at the beginning of March Madness. Walking the Strip and through the casinos got me to thinking about why people visit Las Vegas. Many are there for the shows and people watching. Many, many others are there for the gambling opportunities. This got me to thinking further about the risks in gambling, particularly sports, which then led me to thinking about the risks that we face in the embedded computing industry.
choose to join in the efforts either as an observer or active participant. VITA does not judge the merits of the efforts but rather lets the market decide what will win.
COMPARING OUR MARKET DATA DILEMMA TO THE SPORTS GAMBLING INDUSTRY WHERE BIG DATA IS EXTENSIVELY USED MAKES ME WONDER HOW WE CAN FUNCTION AT ALL.
The computing industry is a challenging business with many risks. Quickly evolving technology fills the future with uncertainty. New innovation leap frogs existing products every day putting huge efforts to waste in short time. Promising opportunities fade away as the market is attracted to the next big thing. Reducing risk is foremost on the minds of companies in this industry. Participating in standards organizations and the development process of new standards is one way that companies use to reduce risk. Open standards, in particular, offer the allure of large ecosystems with many contributors and participants in both the development of the standards and the resulting technologies and ecosystem. Organizations such as VITA have a long history of developing standards that are widely accepted and long lived in the industry. Companies that develop and use products based on these standards are reasonably comfortable in a suitable market niche that exists to supporting a product line. VITA has a liberal policy for accepting what projects are considered for standards development. It requires three or more companies coming together to sponsor the formation of a working group. No business case is required to form a working group. Other members can www.vita-technologies.com
The availability of market data is a common inquiry. Companies from both the supply and demand sides like to have an idea of market size, key players, trends, and other items of interest. Getting this market data is very challenging in markets the size of those addressed by most VITA technologies. The small size and specialized markets mean that there are usually very low numbers of participants in the ecosystem. Compounding the problem is the inability for many companies, particularly public ones, from sharing data that can be used in making business decisions. Comparing our market data dilemma to the sports gambling industry where big data is extensively used makes me wonder how we can function at all. Sports now captures every piece of data imaginable with new data becoming available every season with the use of technology. It seems ironic that the very technology that we are developing is used to enable other industries to generate and analyze so much data, yet we are flying blind. VITA struggles with assisting in the gathering and analysis of useful market data. Companies resist sharing too much product shipment data and design wins. The small size of the industry makes it
unattractive to most market research firms, the cost to gather and analyze data is far greater than the potential for report sales. A gambling strategy is to cover all your bets, but that can be very expensive if it means developing several overlapping products, developing with complicated technologies, or participating in a variety of markets. Most companies don’t have the resources to make even a fraction of this possible, instead needing to put teams on the next big opportunity, further increasing risk by chasing tails. In my role as executive director of VITA, I am especially interested in ideas that help us to collect market data that can be used to help guide business and product strategies. Simply collecting shipment data is not possible for a variety of reasons; public company restrictions, lack of time to provide data, small sample size, and so on. Unfortunately, most of the forecasting is based on observations and speculation based on casual conversations with industry participants. In a brief discussion with John Reardon, at RTC Media, during Embedded Tech Trends, we talked about the lack of interest from the investment community in companies in the critical embedded computing industry. Investors tend to stay away even though most of the companies in the industry have stellar performance records. Part of the reason they stay away is the very lack of data I have mentioned. Without solid data on the markets served, it is hard for them to take on the investment risks. I am forever optimistic that this data problem can be solved. Unfortunately, even in this time of technology and high speed, social media conversations, nothing beats a real conversation faceto-face with other humans!
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Defining Standards By Phil Keohen, Rantec
High voltage power supply standard The popular VPX for high performance computing is a multifaceted, multilayered family of standards covering everything from modules to chassis to systems to architectures. The range of applications targeted by this technology require many dot standards to cover all cases. A recently fast-tracked standards effort illustrates type of work underway at VITA to make the VPX technology more robust. Power supplies can be plug-in modules to VPX systems. This requires connector technology for both the power supply modules and the reciprocating backplanes. Sealed connectors are typically required for high voltage applications in harsh environments. The recently accredited ANSI/VITA 86-2019 High Voltage Input Sealed Connector Power Supply standard defines an environmentally sealed connector pair, which is compatible with the backplane footprint as defined in the ANSI/VITA 62.0 Modular Power Supply Standard for 3U power supplies operating in harsh environments operating off a high voltage input. The modules defined in ANSI/VITA 86 rely heavily on the VITA 62 standard and are further adapted for applications where VPX power supplies are used in harsh airborne environments. Power supply vendors are expected to comply with VITA 47 environmental considerations to ensure survivability in the harsh environment of many of the deployments they will encounter. This makes the VITA 86 efforts ever more important in addressing these challenging environmental conditions when using VPX technology in military applications. VITA 86 defines both the mechanical and electrical requirements for commercial-off-the-shelf (COTS) modules intended for creating modular power supplies. The primary focus is to support VPX and OpenVPX standards when designing systems meeting ANSI/VITA 47 environmental conditions with COTS modules that are compatible with the VPX specifications. As part of the work to create VITA 86, a new connector system was defined, optimized for the harsh environmental needs of VITA 47. This connector mechanically fits within the envelope defined in VITA 62 and VITA 48.2 for 3U Plug-In modules. It also supports the electrical requirements as defined in those standards. This facilitates the production of backplanes and allows system designers to define where and how many power supply modules are to be used within any given system without redesigning the backplane. The Rantec Power Systems, Inc. Ruggedized Sealed Power Connector (RC-V86) family of high-power military interconnect systems is designed for the harshest environments in a 3U form factor needing higher input voltages up to 500VDC,
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FIGURE 1
The Rantec RC-V86
while withstanding the effects of harsh airborne environments including altitude, corrosion, shock, and vibration. The RC-V86 (Figure 1) is a reliable interconnect solution with low contact resistance and capable of withstanding a high number of mating cycles. This connector was selected as the reference connector for the VITA 86 standard. Environments: ›› Operating Temperature: -55 °C to +85 °C per MIL-STD810G, Method 501.5/502.2, II ›› Storage Temperature: -65 C to +125 °C per MIL-STD-810G, Method 501.5/502.2, I ›› Temperature Shock: -65 °C to +125 °C per MIL-STD-810G, Method 503.5, I-C ›› Operational Altitude: -1,500ft to 70,000ft per MIL-STD -810G, Method 500.5, II ›› Mating Durability: 500 mating cycles ›› Shock: Sustain up to 300G 3ms half-sine shocks per MIL-STD-810G, Method 509.5 ›› Vibration: 43.92 GRMS 15-2,000HZ random vibration per MIL-STD-810G, Method 514.6, I ›› Salt fog for 500 hours per MIL-STD-810G, Method 514.6, Procedure I ›› Fluid contamination per MIL-STD-810G, Method 504.1, ›› Humidity per MIL-STD-810G, Method 507.5, II, and relative humidity of 100 percent The initial effort focused on 3U VPX modules, but future updates to the standard are under consideration for 6U VPX power supply modules. VPX considers and supports a wide range of environmental and performance characteristics. VITA 86 helps in providing the necessary standards to meet those characteristics. For additional information please visit, www.rantec.com or contact Phil Keohen at pkeohen@rantec.com or (805) 596-6015. www.vita-technologies.com
VITA Standards Update By Jerry Gipper jgipper@opensystemsmedia.com
VITA Standards activity updates The March VITA working groups meeting was held in Las Vegas. This update is based on the results of that meeting. Contact VITA if you are interested in participating in any of these working groups. Visit the VITA website (http://www.vita.com) for details on upcoming face-to-face meetings.
ANSI accreditation Accredited as an American National Standards Institute (ANSI) developer and a submitter of Industry Trade Agreements to the IEC, VITA provides its members with the ability to develop and promote open technology standards. The working groups meet face-to-face every two months to address embedded bus and board industry standards issues. The following standards have recently been ANSI and VITA ratified via public ballot. ›› ANSI/VITA 46.0-2019 VPX Baseline Standard ›› ANSI/VITA 57.1-2019 FPGA Mezzanine Card (FMC) Standard ›› ANSI/VITA 86-2019 High Voltage Input Sealed Connector Power Supply Standard These standards are available for download by VITA members and are posted at the VITA Store for purchase by non-members.
VSO study and working group activities Standards within VITA may be initiated through the formation of a study group and developed by a working group. A study group requires the sponsorship of one VITA member, and a working group requires sponsorship of at least three VITA members. Several working groups have current projects underway; the following roundup summarizes those projects:
VITA 40: Service and Status Indicator Standard Objective: This standard defines the colors, behaviors, placement, and labeling of service indicator lamps for boards, field replaceable units, and enclosures. Status: This standard was withdrawn several years ago. VITA has been requested to revive the standard. The original document has been updated to the current format for VITA standards. Minor updates have been made to correct errors in the original document. The solicitation for balloters on VITA 40 has been submitted for the ANSI balloting stage.
VITA 46.30: VPX: Higher Data Rate Objective: The VITA 46.30 standard defines a standard for a VPX connector that supports higher data rates, to at least 25 Gbaud – for protocols such as 100GBASE-KR4 Ethernet and PCIe Gen 4. The higher data rate connectors compliant to VITA 46.30 are intermateable with legacy VITA 46.0 connectors and follow the same form factor.
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Status: The working group has a draft document in the balloting stage. They are starting the VITA 46.31 standard that will define connector featuring a short solder tail intended to be soldered into a blind via.
ANSI/VITA 47: Environments, Design and Construction, Safety, and Quality for Plug-in Units Objective: Supplying vendors’ certification of commercial-offthe-shelf (COTS) plug-in units to this standard will facilitate the cost-effective integration of these items into larger systems. Status: ANSI/VITA 47-2007 has been opened for revision to improve interoperability, create less reliance on individual supplier ruggedization guidelines, and make sure environments are concurrent with recent VPX updates. The working group has placed the document in the ANSI ballot stage. The various dot standards are in final working group review. Several dots standards have been started to support the original VITA 47.0 standard. ›› VITA 47.1: Defines the requirements common across the family of standards. ›› VITA 47.2: Defines the unique requirements related to products meant to align with the applications defined in IPC J-STD-001, Class 2. ›› VITA 47.3: Defines the unique requirements related to products meant to align with the applications defined in IPC J-STD-001, Class 3.
VITA 51.4: Reliability Component Derating Objective: The goal of this study group is to develop a new component derating standard. Status: The study group has been meeting to discuss the scope and outline potential sources of data for this activity.
VITA 57.x: FMC, FPGA Mezzanine Card Objective: This standard describes FMC I/O modules and introduces an electro-mechanical standard that creates a low overhead bridge. This is between the front panel I/O, on the mezzanine module, and an FPGA processing device on the carrier card, which accepts the mezzanine module. Status: A new study group has been formed, VITA 57.5 Physical Tools to Aid in FMC+ Development, to define a set of development tools. Interested parties are invited to join this study group. www.vita-technologies.com
VITA 62.x: Modular Power Supply Standard Objective: The VITA 62.0 standard describes requirements for building a power supply module that can be used to power a VPX chassis. The modules fit within the standard envelope defined for VPX modules in the VITA 48.0 standards. Status: The original standard is being revised to be in line with additions made to the VPX standards. Additional working groups are on dot standards. VITA 62.1 is focused on a three-phase high voltage power supply for 3U and VITA 62.2 is developing a 270-volt connector standard. Both working groups have draft documents in review.
Status: The working group is developing the draft document.
VITA 68.2: VPX: Compliance Channel Objective: This standard defines a VPX compliance channel including common backplane performance criteria required to support multiple fabric types across a range of defined baud rates. This allows backplane developers to design a backplane that supports required Bit Error Rates (BER) for multiple fabric types. This also allows module developers to design plug-in modules that are interoperable with other modules when used with a compliant backplane. Status: The working group is updating the draft of this standard.
ANSI/VITA 65: OpenVPX Architectural Framework for VPX Objective: The OpenVPX architectural framework standard is a living document that is regularly updated with new profile information and corrections.
VITA 78.1: SpaceVPX Lite Systems
Status: New profiles based on work with SOSA are being developed. The working group is nearing completion of review for additions, deletions, and changes to the next release.
Objective: This document leverages the work done on ANSI/ VITA 78 to create a standard with an emphasis on 3U module implementations. The most significant change from SpaceVPX is to shift the distribution of utility signals from the SpaceUM to the System Controller to allow a radial distribution of supply power to up to eight payload modules.
VITA 66.5: VPX: Optical Interconnect, Spring-Loaded Contact on Backplane
Status: The working group has developed a draft document of the standard that is currently under review.
Objective: This document describes an open standard for configuration and interconnect within the structure of VITA 66.0 enabling an interface compatible with VITA 46 containing blind mate optical connectors with fixed contacts on the Plug In Module and floating displacement on the backplane.
Copies of all standards reaching ANSI recognition are available from the VITA online store (www.vita.com/Purchase). For a more complete list of VITA standards and their status, go to www.vita.com/Standards.
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VITA Technologies Resource Guide Spring 2019 |
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SPECIAL FEATURE
Embedded Tech Trends In-Depth
Embedded Tech Trends 2019 Wrap-up By Jerry Gipper, Editorial Director
T
he theme for 2019 was “The Future is Now!” The presenters were encouraged to talk about how the technology that has been in development the past years now has reached deployment status, bringing us into the future. Embedded Tech Trends is a small, but extremely effective forum where suppliers of components, boards, and system level solutions can meet exclusively with members of relevant industry media to discuss technologies, trends, and products. The following is short synopsis of the presentations:
In January, Embedded Tech Trends 2019 was held San Diego, California at the Andaz. Located in the heart of the famous Gas Lamp district, the attendees had ready access to great dining and local SoCal activities like the San Diego zoo and the USS Midway.
and the opportunities for optical interconnect in space are flourishing. Designing for space applications presents additional challenges compare to designing for earth environment. Blanchette discussed many of the challenges in dealing with optical technology in space. (Video 1.)
Re-imagining Product Lifecycles: The Future of Obsolescence By Ethan Plotkin, CEO, GDCA, Inc. Obsolescence is at the tail end of the product lifecycle, the portion that no one wants to deal with but is critical to mission readiness. Plotkin knows the issues well. In his talk, he presents new ways to re-imaging solutions to dealing with the entire product lifecycle to better position for part obsolescence.
Preparing for the Next Wave of High-speed Fabrics in Embedded Computing By Burrell Best, Signal Integrity Applications Architect, Samtec, Inc. In an ever-increasing connected world, the embedded systems of tomorrow will need to process huge amounts of data. A new generation of low latency, high-speed fabrics will also be required as the future capabilities of the compute devices and memory
Optical Interconnect Design Challenges in Space By Guillaume Blanchette, Space Industry Manager, Reflex Photonics Inc. High throughput communication satellites are being deployed at a high rate
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VIDEO 1 – For Reflex Photonics’ presentation: Optical Interconnect Design Challenges in Space https://buff.ly/2OKtfpn
www.vita-technologies.com
SPECIAL FEATURE
EMBEDDED TECH TRENDS IS A SMALL, BUT EXTREMELY EFFECTIVE FORUM WHERE SUPPLIERS OF COMPONENTS, BOARDS, AND SYSTEM LEVEL SOLUTIONS CAN MEET EXCLUSIVELY WITH MEMBERS OF RELEVANT INDUSTRY MEDIA TO DISCUSS TECHNOLOGIES, TRENDS, AND PRODUCTS.
technologies that are enabling these systems increases. The speeds at which these new fabrics must operate will pose real challenges for interconnect manufactures and system designers. Best expanded on the fabrics emerging today and identified the challenges interconnect manufactures will have to overcome in order to usher in this new era of embedded computing.
AI in Military & Industrial Applications By Emil Kheyfets, Aitech Defense Systems, Inc. Embedded computing systems are smarter with each generation. Kheyfets explains the difference between artificial intelligence, machine learning, and deep learning. He goes further into the computing technologies that make these levels of intelligence possible in military and aerospace applications.
The Convergence of Cybersecurity and Anti-Tamper By David Sheets, Curtiss-Wright Defense Solutions Cybersecurity is topmost on many system architects, but balancing security, antitamper protection, and reliability is difficult at best. Sheets walks us through strategies and tactics that can help defend against cyberattacks in this never-ending war.
Inside-the-box Optical Links: High-speed Interconnect Solutions By Laurence Pujol, Product Manager of optical interconnect solutions, Radiall VPX chassis have to deal with more and more applications requiring massive data transfer with low latency. This trend boosts the use of inside-the-box high speed optical links. Pujol went into an overview of optical interconnect solutions compliant with harsh environments including transceivers, disconnects, and fiber management.
Securing the Supply Chain: The New Imperative By Chris Cummins, COO, Abaco Systems The recent revelation by Bloomberg of possible cybersecurity infiltration of the embedded computing market by potentially unfriendly powers has focused attention on the need for total security of the supply chain – especially where boards are destined for deployment in mission critical environments. There are numerous steps that embedded computing manufacturers can – and should – take to eliminate any potential sources of failure or jeopardized missions caused by malicious insertion of compromised components. Beyond this, there are hardware technologies available that can minimize the possibility of a cyber attack. Cummins outlined the areas of risk and describes strategies to minimize or, ideally, eliminate those risks.
Back to the Future
Trends in Packaging and Infrastructure for DoD Modular Systems
By Nigel Forrester, Technical Product Marketing, Concurrent Technologies, Plc Security is a major challenge with today’s technology. Forrester presented several ways to keep up with the latest security requirements while still enabling you to use your legacy operating systems and applications.
By Ken Grob, Elma Electronic Inc. The Department of Defense (DoD) has embraced open, modular systems. Grob discusses key trends in computer packaging
www.vita-technologies.com
VITA Technologies Resource Guide Spring 2019 |
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Embedded Tech Trends In-Depth
SPECIAL FEATURE
and system infrastructure that is influencing the direction of technology and standards key to the industry. (Video 2.)
VIDEO 2 – Elma’s presentation: Trends in Packaging and Infrastructure for DoD Modular Systems https://buff.ly/2UrguFN
Making AI Fly By Devon Yeblonski, Principal Product Manager, Sensor Processing, Mercury Systems, Inc. Artificial intelligence (AI) is proving to be as disruptive as tank, radar and submarines technologies when they were introduced into the defense domain. Nations are competitively seeking battlefield dominance with their AI-augmented military systems as new technologies are enabling AI processing to move from the data center to the remote, contested tactical edge. Yeblonski introduced the technologies that are making this transition possible. (Video 3.)
VPX and Defense Open Systems Architectures By Mark Littlefield, Vertical Product Manager, Defense Kontron America VPX is an attractive platform for Open Systems Architectures (OSA) – and that’s why efforts like SOSA [Sensor Open Systems Architecture] are focused on it. However, it’s also quite challenging because of its scalability and its wide range of product/board types and the needs of different target applications. Littlefield examined the challenges that we’re facing in developing a truly useful, general, and sustainable OSA with VPX, how we’re overcoming them, and what impacts it’s having on our market.
Achieving Safety-Critical Determinism with Multicore Processors By Richard Jaenicke, Green Hills Software Safety-critical applications have been slow to adopt multicore processors, which have long been used in general embedded processing to achieve higher throughput and improved size, weight, and power (SWaP). Contention among cores for shared resources such as lastlevel cache, memory, and I/O make it difficult to achieve the tight determinism required for flight control and other high-assurance applications. Jaenicke
reviewed the requirements and challenges of multicore interference and then discusses an approach to enable strict deterministic behavior while utilizing the full parallel execution capability of multicore processors.
Securing Tactical Systems TODAY By Rob Persons, Sr. Sales Architect, Artesyn Embedded Technologies Data encryption in naval tactical systems is critical for maintaining data security. As programs use more commercially available products in these systems, the security requirements do not go away but as Persons discusses, it can be managed with today’s commercial processors.
VIDEO 3 – Mercury Systems’ presentation: Making AI Fly https://buff.ly/2CYq60J
PICMG: What’s Past is Prologue By Jessica Isquith, President, PICMG PICMG is celebrating its 25th anniversary. Isquith updates us on the adoption of PICMG standards and what initiatives are underway for new standards, particularly in the area of the industrial internet of things (IIoT) and next generation performance.
The Emergence of Optics in Levels of Electronic Packaging By Mark Benton, Engineering Manager, Rugged Fiber Optics, TE Connectivity Optics plays a significant role in next generation rugged embedded computing, with the drive toward higher speeds and smaller form factors. Benton explores the levels of electronic packaging – from the chips to the external cabling – showing how copper interconnect solutions are evolving and where optics technology breaks through.
New Solutions for Rugged Optical Communication By Patrick Mechin, CEO, Techway All is moving to high-speed serial into Embedded systems. This trend is originated by the insatiable need for huge data from application. It is fueled by modern sensors and is fully supported by FPGA [field programmable gate array] technology. Mechin presents how we leverage VITA standards to address this need with rugged optical communication.
High-Sped Serial Backplane Architectures: VPX, CPCI-Serial, xTCA – A Comparison By Hendrik Thiel, HEITEC AG Thiel provides an overview of the currently leading high-speed serial backplane architectures for demanding embedded applications, including VPX, CompactPCI Serial, and xTCA. In addition to a comparison of their technical features, he covers the acceptance in various market segments and the availability of off-the-shelf boards and systems. Based on that, a relative positioning of the architectures is revealed.
Switch to 25/100Gbs By Franck Lefèvre, Sales Director, Interface Concept Integration challenges of rapid interfaces like PCI Gen4 and 25 Giga Ethernet in designs (like boards, backplanes, systems), requires new skills and resources for
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www.vita-technologies.com
suppliers that were not required with VME and first gen VPX devices. Lefèvre tells us more about the challenges facing our industry.
Intelligent Interconnects with Integrated Electronics By Ritch Selfridge, Director of Engineering, Amphenol Aerospace Interconnects are key to ensuring secure distribution of power and signals while facilitating platform manufacturing and maintenance. Integrating electronic sensors and processing elements enables intelligent interconnect structures that have the potential to reduce weight via intelligent interconnect management and reduce downtime with interconnect structure health monitoring. Selfridge dares us to dream about interconnects will become intelligent autonomous data and power delivery systems.
Tackling Tomorrow’s Enclosure Thermal and Ruggedization Challenges Today By Justin Moll, VP of U.S. Market Development, Pixus Technologies Inc. From commercial to weatherproof to full MIL-spec systems, the thermal and density requirements of open standard enclosure systems continue to bring new challenges. Particularly with OpenVPX, solving thermal issues in both commercial and MIL-grade systems demands creative design solutions. Moll provides examples of transforming a commercial enclosure to a rugged MIL chassis with powerful cooling.
A Modern Yet Traditional Approach to Embedded Systems By Dave Caserza, Embedded Computing Architect, Elma Electronic, Inc. Embedded computing applications require a very wide range of performance. Caserza explains how many applications don’t need the processing performance, especially at high cost. CompactPCI Serial is an ideal modern technology for simpler needs.
VPX Power – VITA 62: Past, Present, and Future By Jerry Hovdestad, Orbit Power Group, Behlman Electronics Hovdestad leads us in a brief history of plug-in power, starting with pre-VPX, pre-VME power, and continues on to show early VPX offerings. Hovdestad discussed original capabilities and the relation to VITA 62 and how capabilities have evolved over the years. The need to generate VITA 62.1, VITA 62.2 and VITA 86 is explained in addition to the current increased power demands and the associated cooling challenges.
Open Technologies, Open Markets: The Value of Standards Participation By Dylan Lang, Standards Manager, Samtec, Inc. Today’s embedded systems continue to provide flexible design opportunities while driving many bleeding edge technologies. As a result, the need for embedded systems and standards is greater than ever before. Open-market organizations like VITA facilitate the development of embedded standards. In the efforts to drive standards from idea to reality, active participation is key both for individual companies and the embedded industry. Lang elaborates on the challenges facing standard development and the benefits of overcoming them.
Jump Starting RFSoC Technology for Radar and Mil-Aero Applications By Rodger Hosking, Vice President and Cofounder, Pentek, Inc. Systems-on-a-chip (SoC) integrate key functionality into a single semiconductor package. The Xilinx RFSoC integrates RF data converters and FPGA functionality into an SoC specifically targeted at RF applications. Hosking walks us through the market opportunities, design challenges, and module designs opened up by this SoC.
Best Practices for Protecting the Supply Chain By Steve Edwards, Curtiss-Wright Defense Solutions Counterfeit parts are a threat to all stated Edwards in his opening remarks. He continued in his presentation to discuss best practices for supply chain management and www.vita-technologies.com
IN THE EFFORTS TO DRIVE STANDARDS FROM IDEA TO REALITY, ACTIVE PARTICIPATION IS KEY BOTH FOR INDIVIDUAL COMPANIES AND THE EMBEDDED INDUSTRY. how to protect your system throughout the entire development and product lifecycle.
Aviation Safety and Security – Can they Coexist? By Scott Engle, Director of Business Development and Capture, Mercury Systems, Inc. We all want to be safe and secure. For safety-critical system to be truly safe, they must also include security, the two are not mutually exclusive. Engle elaborates on how safety and security can peacefully co-exist in today’s complex computer systems.
OpenVPX Advancements By Greg Rocco, MIT Lincoln Laboratory OpenVPX is a living standard quickly adapting to the needs of the market. Greg Rocco is the father of OpenVPX. He reviewed the latest enhancements and changes to OpenVPX.
Successful Application of Open Architecture Development By Michael Hackert, NAVAIR Open standards architectures are being widely embraced in many key programs. A lot of work has occurred in the past few years to make the standards and resulting products suitable for DoD applications. Hackert reviewed that work and hints at several acquisition success stories. All of these presentations, with video, are posted at www.EmbeddedTechTrends.com. It is highly recommended that you view the videos to get the maximum information.
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SPECIAL FEATURE
Hall of Fame 2019
Hall of Fame By Jerry Gipper, Editorial Director www.vita.com/VITA-Technologies-Hall-of-Fame
Since the announcement of VMEbus in 1981 there have been a great number of people and ideas that have had an impact on the development and advancement of open standards used in critical embedded computing systems. The intention of the VITA Technologies Hall of Fame is to honor and preserve the remembrance of those people and technologies that have had the greatest influence on the VITA open standards industry. Many others are to come – innovators and influencers, who have made a significant impact on developing, designing, creating the technology, and ferrying the technical specifications into open standards. These are the people who have overcome the technical and procedural problems, the products that set new expectations. It is our pleasure to honor these primary contributors to this industry. Lollie Wheeler
LOLLIE WHEELER
“Hello – VITA, this is Lollie,” is what you heard when you called VITA. Lollie Wheeler was the voice answering the VITA phone for most of 30 years. Lollie was employee number three at VITA. She was good friends with Betty, who was in search of some assistance with the rapidly growing organization. Lollie immediately jumped in helping with whatever needed to be done.
The first edition of the VITA VMEbus Compatible Products Directory was published in 1985. 174 companies and more than 2,700 products were listed in that first edition. Lollie was the go-to person for this new VITA product directory. This directory was printed four times per year; with all the new products and companies joining the VMEbus boom, there was plenty of work to be done with each edition. Collecting inputs and vetting each of them was a tireless task carried out by Lollie with each edition. Eventually the printed directory went paperless on the emerging internet where VITA was an early pioneer. When the directory went on-line the quarterly printed
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publishing became obsolete. However there still remained much to be done as each entry had to be approved, updates made to the database, and members reminded to keep their content fresh. The staff grew, leadership changed, and Lollie emerged as the behind the scenes manager of VITA. Members knew her as the go-to person for questions about memberships and dues, product directory inputs and changes, assistance in obtaining copies of specifications, and any other miscellaneous requests that came her way. Lollie followed each request to its satisfactory conclusion, never leaving items unresolved. www.vita-technologies.com
FIGURE 1 IP-MP-SERIAL DS Industry Pack. Photo Courtesy of Abaco Systems
IP Modules As VMEbus became the industrial bus of choice in the 1980s, the standard IC [integrated circuit] moved from a 20-pin MSI DIP to a VLSI [very-large-scale integration] high pin count surface mount device. Although the functionality of standard boards increased dramatically, the average selling price remained at about $2,500. This high per-slot cost prompted manufacturers to continue to place as much functionality on each board as possible, to keep the total slot and total system costs as low as possible. This trend increased the basic functionality granularity (the smallest purchasable function) 10 to 50-fold. It was no longer practical to purchase separately a small number of serial lines or a small amount of memory. Many manufacturers attempted to remedy this problem by offering proprietary “daughter modules” for their processor boards. At least 20 different such proprietary offerings were on the market by the end of the 1980s. At this time, GreenSpring Computers, under the technical direction of Kim Rubin, created a module with the specific design and intent that it become an open, widely accepted standard. GreenSpring Computers introduced the module and its specification as an open standard at BUSCON in 1988. Lollie managed the accounting, responded to requests for VITA standards, and scheduled countless VITA Standards Organization (VSO) meetings. Lollie kept a very low profile but she has had her finger on the pulse of the organization throughout the years. Behind the scenes she ensured that the member dues were collected, which could be a full-time job in itself. She made sure that standards were delivered anywhere in the world. And that the VSO meetings ran smoothly. Coordinating the logistics for six VSO meetings each year in hotels all over the country was a challenge with all the conditions that hotels put on achieving your numbers for the meetings, let alone ensuring that all the attendees are satisfied.
When the modules were introduced, GreenSpring incorporated features that were found in only a few, if any, other modules:
Ray Alderman, Chairman of the Board at VITA and Executive Director of VITA between 1998 and 2013, frequently refers to John Rynearson as the “Brains” of VITA, himself as the “Muscle,” and Lollie as the “Heart.” Anyone that has ever had the opportunity to engage with Lollie will certainly agree with that analogy.
At the start of 1994 a formal standards committee, VITA 4, was put together under the VITA Standards Organization, which had received accreditation as a standards organization under ANSI. Most of the committee’s work was done via internet, a new concept at the time, which proved effective. The purpose of the committee was to validate and clarify the existing specification. In particular, timing details for 32 MHz and DMA operation were clarified. Also, the specification was reformatted, with numbering added for easier reference and formality. The ANSI/VITA 4-1995 (S2011) IP Modules standard is still available. (Figure 1.)
www.vita-technologies.com
› Up to four modules fit on one VME or PC-AT board, for high modularity › Bus and processor independent; supported both Motorola and Intel byte ordering › Simple, synchronous interface made Modules and Carriers easy to design › Rugged mechanical mounting, for ease of use and high reliability › Defined ID space for configuration management The concept caught on, and by 1994 over 80 companies were designing and offering products to this standard, on at least seven standard buses. GreenSpring called their modules “IndustryPacks,” but each manufacturer was free to use whatever trade name they wished. The term “IP Modules” is commonly used, a term that is now in the public domain. In 1991, the Motorola Computer Group incorporated the IP Module specification into its 68040 based MVME162, implementing four IP Module positions in a single VME slot. This helped propel the acceptance of the specification.
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TECHNOLOGY FEATURE
VMEbus
Mars Exploration Rover By Jerry Gipper, Editorial Director A self-portrait of NASA’s Curiosity Mars rover shows the robot at a drilled sample site called “Duluth” on the lower slopes of Mount Sharp. Photo courtesy of NASA.
T
his mission has held a special place in my heart for many years. I remember learning about it at the turn of the millennium, going so far as to register myself and my family on the NASA website as mission participants. I received certificate number 3505972 on November 15, 2002, with the promise that a compact disc with our names would be included on the Mars Exploration Rover 2003 mission. (Figure 1.)
I was saddened in February with the news from NASA that the Opportunity Rover mission on Mars was formally concluded. What was originally supposed to be a 90-day, 1,000-meter, exploratory excursion had turned into a nearly 15-year, 28.4-mile odyssey across the surface of Mars, far beyond the expectations of anyone.
FIGURE 1 Mars Exploration Rover – 2003 Mission Participation Certificate
In late June of 2003, my family and I were vacationing in Iowa to visit friends and relatives. We had plans to continue to Orlando, Florida for the second part of our vacation. The Spirit rover had already launched on June 10th with the
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www.vita-technologies.com
TECHNOLOGY FEATURE
Space Center facility tour ending at the Apollo/Saturn V Center where we had burgers under the Apollo/Saturn V display. We spent the afternoon touring more of the facility and the Space Shuttle positioned the entrance to KSC. On our way out, we spotted a sign displaying upcoming launches. It turned out that late in the day, NASA had rescheduled the Opportunity launch for that evening. I understood that the launch would be between 10:00 pm and 11:15 pm.
Opportunity to follow on July 1. Weather and technical issues plagued the initial launch plans, causing delays. We headed to Orlando on July 5. We did the obligatory visit to Disney World on the 6th. I wanted to visit the Kennedy Space Center on the 7th. The kids were not as excited as they thought it would be too boring. They relented with the promise that we would visit Universal Studies the following day. We did the Kennedy
FIGURE 2
A self portrait of the Opportunity Rover. Opportunity used its panoramic camera to take the images combined into this mosaic view of the rover. Photo courtesy of NASA.
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We decided to go to Cocoa Beach for dinner instead of heading back to our hotel in Orlando. We enjoyed a late dinner, shopped at Ron Jon’s Surf Shop, and then headed to the beach to watch the launch. From our vantage point, we had a clear view of the launch pad. There were bright lights and vapor clouds around the launch structure. The night was getting late and the kids were getting tired. As the clocked ticked past 11:00 pm, I feared the launch had been scrubbed. Just as we turned to go to the car, a bright flash of light appeared at the launch site. We could see the Delta II Heavy rocket slowly lift from the pad. Several seconds later we could hear and feel the launch. We watched in awe as the rocket headed downrange. Just after separation of the first stage, the rocket disappeared into the clouds over the Atlantic. We headed back to the hotel full of amazement from the thrill of viewing our first space launch. After a long journey to Mars, the probes landed in January 2004 at widely separated equatorial locations on Mars. The Mars Exploration Rovers mission with Spirit and Opportunity was quite incredible, especially considering that it was originally planned to only function up to 90 days. There are many factors that led to such a long and successful mission, primarily the work of the engineering teams to keep the electronics running with all of their manipulation from earth. But as executive director of VITA and a career VMEbus fan, I like to think that the VMEbus electronics at the heart of the avionics system had a key role to play. (Figure 2.)
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VMEbus
TECHNOLOGY FEATURE
VMEbus Brains The avionics or ‘brains’ of each rover were in the Rover Electronics Module (REM) (Figure 3) inside the rover body. These electronics controlled the rover movement and instrument deployment. The REM was housed in the Warm Electronics Box (WEB), with all the instrumentation and communications electronics, to protect from the wild temperature extremes on Mars. Digging deeper you find that the REM was a ruggedized VMEbus chassis. The specific slot count is difficult to pin down but from photos it appears to be six to eight slots in size. The computer in both Spirit and Opportunity was a 32-bit RAD6000 microprocessor, a radiation-hardened version of the PowerPC chip used in some models of the Macintosh computers at the time, operating at a speed of 20 million instructions per second. The RAD6000 was a direct transfer of the IBM RISC System/6000 single chip CPU to the Lockheed Martin radiation hardened process. Lockheed Martin developed a VMEbus single board computer that utilized the RAD6000 and its related memory components used in the Spirit and Opportunity rovers. Variations of the VME single board computer (SBC) were also used in the Mars Pathfinder and Surveyor rover missions prior to the Spirit and Opportunity rovers. This was the rover mission standard SBC for several years. Onboard memory included 128 MB of DRAM with error detection and correction, augmented by 256 MB of flash memory and 3 MB of EEPROM, which allowed the system to retain data even without power. The memory was designed to tolerate the extreme radiation environment from space and to safeguard against power-off cycles so the programs and data would remain and not accidentally erase when the rover hibernated during the long cold Martian nights. The remaining slots in the VME chassis were used to interface with and control the onboard cameras, batteries, tools, and experiments. The expansion slot design of VMEbus made it ideal for adding the electronics necessary to complete the mission.
The cards in the VME chassis could acquire images from cameras, drive 44 motors of various types, and process data from three spectrometers. The multiprocessor architecture allowed communication, image acquisition, and operation of payload elements to proceed simultaneously. VxWorks was the real-time operating system running on the RAD6000. The Mars Exploration Rovers’ software packages were developed using Tornado 1.0.1 for Mars Exploration Rover (a special release) and debugger with updates spanning VxWorks releases from 5.1 through 5.5. The main computer performed regular rover health maintenance. Its software made sure that all systems were functioning properly and that it could continue to communicate with its Earth-bound controllers. The main software control loop essentially kept the rovers “alive” by constantly checking the rovers to ensure that they were both able to communicate throughout the surface mission and that they remained thermally stable (not too hot or too cold) at all times. It did so by periodically checking temperatures, particularly in the rover body, and responding to potential overheating conditions, recording power generation and power storage data throughout the Mars sol (a Martian day), and scheduling and preparing for communication sessions. Both rovers operated with few glitches during their mission. Memory management issues confounded Earth based engineers during the early days of Spirit’s mission, but they were corrected enabling the mission to continue. Radia tion hits occasionally messed up memory cells, but the error correction built into the memory architecture corrected these faults. Several software upgrades during the mission added more capability and improved the rover intelligence to make them more functional.
Thermal management
FIGURE 3
Mars Exploriation Rover instruments diagram. Photo courtesy of NASA
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The rover’s batteries, electronics, and computer, stayed safe inside the WEB, packed inside the rover body, and like a warm coat, the WEB walls helped www.vita-technologies.com
keep heat in when the night temperatures on Mars could drop to -96° Celsius (-140° Fahrenheit). The rovers were able to release excess heat through radiators.
experiments at the same time was difficult if not impossible due to the limited power budget. The rovers would rest and work in alternating cycles to gather power for specific planned tasks. Close coordination between charging, driving, communications, and processing were required.
Several methods were used to keep the rovers at the right temperature:
The power system for the Mars Exploration Rover included two rechargeable batteries that provided energy for the rover when the sun was not shining, especially at night. One of the boards in the VMEbus backplane was dedicated to battery control. This board collected power-related measurements every five to 10 minutes and sent the data back to Earth each day. Over time, the batteries degraded and were not able to recharge to full power capacity making power management even more critical. It was anticipated that dust on the solar panels would greatly affect the capability of the solar
› Preventing heat escape through a sputtered gold paint film. › Preventing heat escape through insulation called “aerogel.” A unique material that is both extremely powerful and lightweight, aerogel is 99.8 percent air and has earned the name “solid smoke.” › Keeping the rover warm through heaters, eight radioisotope heater units (RHU) which each continuously generated 1 W of thermal energy from the decay of radioisotopes, along with electrical heaters that operated only when necessary. › Making sure the rovers were not too hot or cold through thermostats and heat switches. › Making sure the rovers didn’t get too hot through the heat rejection system.
Power system challenges The main source of power for each rover came from a multichannel solar array that looked almost like “wings.” Power was an extremely rare resource, so power management and consumption were foremost on the minds of the designers and mission controllers. The power system was designed so that on each day of the surface mission, solar illumination of the rover array was sufficient to allow the rover to wake up, conduct routine data sampling establishing system status, communicate for at least one hour at X-band, communicate at least twice at UHF, shut down, and survive the nighttime portion of the cycle to wake up the next day. When fully illuminated with sunlight, the rover solar arrays generated about 140 watts of power for up to four hours per sol. The rovers needed about 100 watts (equivalent to a standard light bulb in a home) to drive. Driving and conducting www.vita-technologies.com
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VMEbus
TECHNOLOGY FEATURE
arrays to generate power, projected to reduce production to about 50 watts of power. Fortunately, dust was not as big of a problem until years later, becoming fatal to Opportunity during the global dust storm that caused loss of power generation capability and eventually communication links to earth. (Figure 4.)
reaching the rover’s solar panels. Engineers lost contact on June 10 and persistently sent more than a thousand signals and commands to the rover over eight months until they realized the mission was over on February 13.
Final resting place Even though we bid farewell to the intrepid Opportunity rover in February at the conclusion of its 15-year mission, it still had one last gift to give. Last May, Opportunity took a look around Perseverance Valley on the inner slope of Endurance Crater’s western rim. The valley is about the length of two football fields and it’s full of descending shallow troughs. Ironically, Perseverance Valley became Opportunity’s final resting place when a planet-encircling dust storm took over Mars in June, blocking the sun from
FIGURE 4
Spirit and Opportunity. Infographic comparing the two rovers. Photo courtesy of NASA.
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“This final panorama embodies what made our Opportunity rover such a remarkable mission of exploration and discovery,” says Opportunity project manager John Callas of NASA’s Jet Propulsion Laboratory. (Figure 5).”To the right of center, you can see the rim of Endeavour Crater rising in the distance. Just to the left of that, rover tracks begin their descent from over the horizon and weave their way down to geologic features that our scientists wanted to examine up close. And to the far right
FIGURE 5
and left are the bottom of Perseverance Valley and the floor of Endeavour crater, pristine and unexplored, waiting for visits from future explorers.” Then, the storm hit. Those parts of the panorama are black and white because the rover couldn’t complete the task using its filters. By-the-way, on the drive from the airport to our house at the end of our vacation, I asked the kids “What was your favorite
part of the two-week vacation?” Both of them immediately exclaimed “The day at the Space Center and the rocket launch.” It still makes my heart happy! References 1. Mars Exploration Rover mission, American Geophysics Union, 2003 2. Mars Exploration Rover Spirit End of Mission Report December 2015
This 360-degree panorama is composed of 354 images taken by the Opportunity rover’s Panoramic Camera (Pancam). Photo courtesy of NASA.
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TECHNOLOGY FEATURE
SpaceVPX
SpaceVPXenabling the next generation of satellite constellations By Jennifer Keenan, Mercury Systems, Inc.
H
istorically, our military forces utilized geosynchronous equatorial orbit (GEO) satellites for their reconnaissance and communications networks. These satellites orbit at an altitude of approximately 22,300 miles above the Earth’s surface and therefore have a large field of view. They orbit over the equator at the same rate as the Earth’s rotational period, appearing to be stationary in the sky. Three GEO satellites placed 120 degrees apart longitudinally can provide full Earth coverage with the exception of a small section around each of the north and south poles. GEO satellites, also favored for meteorology, TV and radio broadcast,
Almost 5,000 artificial satellites orbit our planet with just over 1,900 of them operational. These satellites provide us with communication networks, Global Navigation Satellite System (GNSS) coverage, technological research, as well as scientific and Earth observation data.
have typically been custom-designed units taking more than ten years to develop and averaging more than $500 million to build with at least an equal amount spent on launch and operation. With the speed of advancements by adversaries and new emerging technologies, these 15- to 20-year lifespan custom satellites limit the United States’ ability to easily and routinely add new capabilities or technology to their satellite program. Due to these challenges, NASA and other government agencies determined they needed a new approach to maintain space and military superiority.
Space: The Final Frontier, but let’s not go that far Commercial companies with massive amounts of funding like SpaceX, OneWeb, and Planet led the way of the small satellite movement with the primary goals of providing global imagery and the infrastructure to deliver internet coverage to all areas of the globe. They provide these services to not only the U.S. government but also to public and private companies. These smaller low Earth orbit (LEO) satellites occupy much lower altitudes of just 1,200 miles above the Earth or less. While there are some satellite constellations in medium Earth orbit (MEO) (the area between GEO and LEO) such as the GNSS GPS, BeiDou, GLONASS and Galileo constellations, the majority of existing and new constellations will continue to be in LEO. (Figure 1.)
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MERCURY SYSTEMS, INC. www.mrcy.com
TECHNOLOGY FEATURE
FIGURE 1
Altitude classifications for geocentric orbits.
These satellites in LEO can more effectively be replaced if system failure occurs or if destroyed by collision with other satellites or space debris. The U.S. government can routinely take advantage of leading-edge technologies to acquire, process, store, and disseminate larger amounts of real-time data improving and augmenting current capabilities and satellite networks such as the U.S. global positioning system (GPS). To achieve lower development costs and shorten development schedules, designers of these satellites are taking advantage of what other military and communications systems designers have been doing for over 30 years, designing with open standards.
VITA launches into space It only makes sense that to stay ahead of our adversaries, the U.S. government would realize the value of these smaller, more agile LEO satellite constellations to provide more reconnaissance data at a fraction of the cost and time of their geostationary counterparts. Additionally, in LEO, satellites travel at different longitudes providing full Earth coverage with substantially better signal strength – 1,300x that of geostationary satellites – so data arrives faster with lower latency. The Defense Advanced Research Programs Agency (DARPA) launched the Blackjack program in early 2018 to create a constellation of LEO satellites that will provide similar functionality to geostationary satellites at a cost of about $6 million instead of more than $1 billion. These satellites will be “good enough” and use commercial-off-the-shelf (COTS) components with reduced screening, acceptance testing, and life expectancy compared to their GEO counterparts that encounter higher levels of radiation. www.vita-technologies.com
The SpaceVPX VITA 78 specification is the first open standard developed specifically for space applications and builds off the success of the OpenVPX platform that has been widely adopted for military embedded systems due to its high-performance computing capabilities, interoperability and scalability. SpaceVPX strengthens the OpenVPX specification with additional key features for spacecraft and other high- reliability applications such as airborne weapons and mission-critical ground computing systems exposed to ionizing radiation. These include fault tolerance by mitigating vulnerabilities of a single point failure, dual redundant power and management distribution and diagnostic support. The standard intends to maintain compatibility with OpenVPX components and connector pinouts. SpaceVPX using the RapidIO interconnect protocol for high-performance computing will deliver improvements over other architectures used for space systems using older interfaces with slower data rates like CompactPCI (cPCI) or lacking processor to processor interconnect like PCI Express (PCIe) by enabling multiprocessor fabrics, low latency, and low power. An ideal interconnect for SWaP-optimized [size, weight, and power] systems, RapidIO enables more functionality through connectivity of many different types of processors, from general purpose to digital to FPGAs [field programmable gate arrays], in one system that previously could only be accomplished with multiple, big box application-specific systems. Now complete systems to acquire, process, store and disseminate data can be developed in a small 3U SpaceVPX chassis using standard 100mm x 160mm 3U SpaceVPX single board computers (SBC). System architects can take advantage of the latest innovations from commercial technology leaders by simply upgrading SBCs that integrate the newest high-performance processors and high-density storage from an ecosystem of suppliers without a system redesign. Conversely, systems developed using custom architectures require a substantial redesign effort to implement next generation interconnect and processing technologies. VITA Technologies Resource Guide Spring 2019 |
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TECHNOLOGY FEATURE
Storage is always an issue – Until now Logically, new high-capacity data storage solutions are necessary to support the growing data acquisition and processing demands of the LEO constellation expansion. Dedicated data recording systems previously developed are unsuitable for these SWaP-constrained, lower cost satellites. As a result, a high-density, modular SpaceVPX solid-state-drive (SSD) was developed to satisfy this need. Taking its expertise in secure SSD devices (Figure 2), sensor-processing solutions, and the OpenVPX standards for terrestrial military applications, Mercury Systems began development of a family of SpaceVPX products including the first space-grade storage drive in a 3U SpaceVPX form factor.
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FIGURE 2
Mercury’s TRRUST-Stor VPX RT Radiation-Tolerant SSD
Similar to a traditional military-grade SSD, this drive uses high endurance, large geometry Single Level Cell (SLC) NAND flash, and integrates an internally developed NAND controller containing error correction (ECC) algorithms. Providing fault tolerance and data integrity, the advanced ECC algorithms counter radiation-induced NAND flash errors by correcting byte errors and failing devices while automatically replacing worn NAND blocks. All other components in the drive are radiation tolerant by design to 100 Krad. With 100 percent authority over the NAND controller, these devices are customizable in feature and form factor to meet mission specific requirements. Designed to meet the SpaceVPX specifications, these devices provide high-speed data rates (>9000 Gb/s) not seen in competing storage products using older standards or custom solutions through the Serial RapidIO (SRIO) interface. With interoperability, scalability and cost at the heart of open standards, these devices operate with the ecosystem of SpaceVPX products, providing a path to routine system upgrades not available with custom storage devices. To learn more about the VITA 78 SpaceVPX specification, visit www.vita.com/Tutorials. Jennifer Keenan is the Senior Product Marketing Manager for the Microelectronics Secure Solutions group in Phoenix, Arizona. Jennifer has a bachelor’s degree in Marketing from Florida State University. To learn more about Mercury’s SpaceVPXcompliant products and other devices for space applications, visit www.mrcy.com/space-qualifiedmicroelectronics/ or contact us at space.qualified@mrcy.com. www.vita-technologies.com
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Most popular topics: Managing SWaP COM Express MIL-STD-1553 Cockpit Display Systems Thermal Management Shock and Vibration Testing Radar Software Defined Radio
FPGAs COTS VPX UAVs Counterfeit parts Data Security
Milestone in abstracting the hardware: Realizing the promise of FACE By Mark Grovak, Curtiss-Wright Defense Solutions The Future Airborne Capability Environment (FACE) Consortium, part of The Open Group, was formed to establish a standard common operating environment to support portable capability-based applications across Department of Defense (DoD) avionics systems. Key to the common operating environment envisioned by FACE is the definition of an interface for operating systems and board support packages (BSP) that enables the hardware portion of a system to be abstracted, greatly increasing the portability and reusability of software applications. With the wide adoption of FACE, system integrators can reap tremendous benefits in interoperability and cost. The FACE Consortium is a government/industry partnership that manages technical standards and business strategies for acquisition of affordable software systems; it exists to promote innovation and rapid integration of portable capabilities across global defense programs. To be verified in accordance with the FACE Technical Standard and FACE Conformance Policy, software needs to be approved by an approved FACE Verification Authority. FACE conformance does not cover hardware, although hardware solutions can be designed to comply with FACE-approved software applications. U.S. Army Aviation, with thousands of helicopters to maintain and deploy, has been a leading advocate of the new standards, as has NAVAIR. The last few years have seen a number of vendors demonstrating FACE-approved software running on a wide range of open architecture hardware designed to be compliant with the FACE standards. To demonstrate the true promise of FACE, though, requires the same FACE-approved application simultaneously operating in systems that are running different processor architectures (i.e., Intel, Power, ARM, etc.). Such a demonstration would establish the true abstraction of the underlying hardware that the effort seeks. Each year, the U.S. Army hosts the FACE Technical Interchange Meeting (TIM), enabling FACE Consortium members to demonstrate FACE-certified software products and products aligned to the FACE Technical Standard. The Army FACE TIM 2018 (held on September 18 in Huntsville, Alabama) allowed vendors to showcase their FACE efforts for the warfighter. While the FACE target audience is the Army community, other customer communities are also invited, and previous events have seen hundreds of Army, Navy, and Air Force attendees. At the 2018 FACE TIM, Curtiss-Wright, Green Hills Software (GHS), and Harris Corp. publicly demonstrated what is believed to be the first working example of a FACE-conformant software application running simultaneously on two completely different 3U OpenVPX single-board computers, each of which was based on different processor infrastructures (Intel and power architecture). The demo featured Harris’s FACE-approved FliteScene Digital Moving Map software running on top of GHS’s certified
26 | VITA Technologies Resource Guide Spring 2019
BLOG FACE-conformant INTEGRITY-178 tuMP real-time multicore operating system. The commercial off-the-shelf (COTS) module hardware solutions showcased in the demonstration included Curtiss-Wright’s NXP Power Architecture QorIQ Quadcore AltiVec-enabled T2080 processor-based VPX3-152, a DO-254 safety-certifiable 3U OpenVPX single-board computer (SBC), and the VPX3-1258, a 4th-generation Intel Core i7 (Haswell) processor-based 3U OpenVPX SBC.
THE PROMISE OF FACE: TO DELIVER GREATER FLEXIBILITYTO SYSTEM DESIGNERS WHILE SIMPLIFYING LOGISTICS, BOOSTING INTEROPERABILITY, AND ELIMINATING COSTLY PROPRIETARY SOLUTIONS. The demonstration of the two completely different hardware instantiations highlighted how the use of a FACE-conformant software infrastructure enables operators of different aircraft types to run common capabilities on hardware that is SWaP-C [size, weight, power, and cost]-optimized for each individual platform. Today, as 3U VPX becomes the industry standard (replacing the ubiquitous 6U VME form factor), leading COTS vendors offer a wide range of 3U OpenVPX processors based on Intel, PowerPC, and ARM architectures, some available as DO-254 safety-certifiable solutions, that can be embedded in a rugged chassis for applications in fighters, cargo aircraft, and helicopters. As the FACE-conformant OS supports all of these processor types, it enables designers to choose their optimal mix of processors and OS when integrating a FACE-conformant SWaP-C-optimized system. For some applications, the 3U LRU approach may prove too heavy, hot, or costly to meet unique platform requirements; for example, on small unmanned aerial vehicles or in environments where space and power on a larger platform is very limited. For those cases, non-backplane-based small-form-factor (SFF) LRUs can reduce SWaP-C. When the SFF subsystem can also host a FACE-conformant OS, the system integrator gains the added flexibility to run the exact same applications on both the SFF and larger 3U VPX systems and still meet restrictive SWaP-C limitations. The promise of FACE: To deliver greater flexibility to system designers while simplifying logistics, boosting interoperability, and eliminating costly proprietary solutions. With the demonstration of the same FACE-compliant OS and application software running on heterogeneous hardware platforms, the promise becomes a reality. Mark Grovak is Director, Avionics Business Development, at Curtiss-Wright Defense Solutions. www.vita-technologies.com
Keep pace with a standardized development process By Nick Butler, National Instruments Standardization has been an objective in test organizations for decades. In 1961, D.B. Dobson and L.L. Wolff of Radio Corporation of America (RCA) published a paper, “Standardization of Electronic Test Equipment.” The paper presented the principles, criteria, and techniques used in the investigation and prototyping of multipurpose missile system test equipment. The goal of most early technology standardization efforts was to limit the variety of equipment used in test solutions across the organization. The key objective RCA achieved was the design and deployment of a modular hardware set. Modular hardware leads to higher equipment reuse, more integrated test solutions, fewer obsolete components, and an easier process for technology replacement. The RCA paper described the process of identifying shared inputs and outputs across multiple functional components and missile programs to define the requirements of its modular hardware system. It was this process of identifying and separating common elements that can be addressed together that became the basis of abstraction. Larger instrumentation standardization efforts and a move toward commercial off-the-shelf (COTS) technology have led to modular hardware standards like VXI, PXI, PXIe, and AXIe that are used in test organizations across many industries. Standard modular hardware platforms abstract redundant elements like power supplies, cooling, and user interfaces to single points within the system.
Software as the backbone of standardization Security requirements and fast-paced changes are compelling modern test organizations to go far beyond just hardware standardization; they’re now also focusing on software layers and the practices used to develop them. Test engineering teams must begin the process of adopting and standardizing on iterative software development to keep pace with product development teams and maintain project schedules in an industry that is quickly modernizing. In the report Design and Acquisition of Software for Defense Systems, the Defense Science Board (DSB) states, “many of the capabilities provided by our weapons systems are derived from the software of the system, not the hardware. This shift from hardware-enabled capabilities to software-enabled capabilities is increasing quickly.” The best test software engineering teams are building abstracted test software that delivers even more benefits than abstracted hardware provides. An abstracted software platform comprises layers that perform specific functions, which enables teams to repair and upgrade each module individually while isolating other layers by maintaining the same inputs and outputs. “With dozens of legacy business lines, software standardization has to address the history of each group,” said www.vita-technologies.com
BLOG Mark Keith, chief engineer at Honeywell Aerospace. “The purpose [of abstraction] is to minimize or eliminate the need for software modifications when that obsolete hardware is replaced.”
Modern software development for test The test organization must also implement practices that drive faster and more flexible delivery to manufacturing and the customer. To deliver all the demanded features, modern software engineering teams are moving to continuous iterative software development practices like Agile. As stated in the DSB report, “The main benefit of iterative development is the ability to catch errors quickly and continuously, integrate new code with ease, and obtain user feedback throughout the development of the application.” Iterative software development is now an industry-standard practice, and the report says that it “will help the [Department of Defense (DoD)] to operate in today’s dynamic security environment, where threats are changing faster than Waterfall development can handle.”
Standardizing on iterative development Iterative software development requires a well-orchestrated team that works cooperatively and – much like the abstraction of hardware platforms and software architectures – includes shared and repeated concepts and tasks. Teams that collaborate on code bases must agree and standardize on tools for source code control, unit test frameworks, code analysis, work management, and deployment. A growing additional concern is cybersecurity. The DSB states: “Checking a software system’s code base daily keeps manageable the number of changes required to comply with a large base of cyber rules.” In the report Contracting Strategy for F-22 Modernization, the Inspector General of the DoD states, “According to a Program Office official, the DoD is at risk of losing its technological edge against U.S. adversaries and it needs to find innovative ways to bring capabilities to the warfighters faster.” Iterative development is a proven method for accelerating technology development across multiple industries, not only defense and aerospace. While test engineering teams have been focusing on hardware standardization and tiered software architectures, research and development organizations have moved toward iterative product development. All aspects of standardization are important and valuable to test organizations, but standardization must be refined to work with the engineering practices under development today. Test organizations that adopt Agile software development practices are poised to capitalize on this approaching opportunity. Nicholas Butler is head of Aerospace and Defense Marketing at National Instruments. VITA Technologies Resource Guide Spring 2019 |
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2019 RESOURCE GUIDE INDEX Company
Category
Page
Annapolis Micro Systems, Inc.. . . . . . . . . . . . . . . . . . . . . . .
OpenVPX. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
28
Annapolis Micro Systems, Inc.. . . . . . . . . . . . . . . . . . . . . . .
OpenVPX. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
29
Annapolis Micro Systems, Inc.. . . . . . . . . . . . . . . . . . . . . . .
OpenVPX. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
30
Annapolis Micro Systems, Inc.. . . . . . . . . . . . . . . . . . . . . . .
OpenVPX. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
31
Inteface Concept . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
OpenVPX. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
32
Pixus Technologies . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
OpenVPX. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
32
Amphenol Military & Aerospace . . . . . . . . . . . . . . . . . . . . .
OpenVPX. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
33
Vector Electronics & Technology, Inc.. . . . . . . . . . . . . . . . . .
VME . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
34
Atrenne, A Celestica Company . . . . . . . . . . . . . . . . . . . . . .
VPX. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
35
Interface Concept . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
VPX. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
35
Dawn VME Products . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
VPX/OpenVPX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
36
Atrenne, A Celestica Company . . . . . . . . . . . . . . . . . . . . . .
VPX/OpenVPX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
37
Phoenix International . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
VPX/OpenVPX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
38
OpenVPX
Wild100 Systems are built for extreme environments, with Air, Conduction, AFT, and/or LFT cooling.
Wild100™ EcoSystem Brings 100GbE to OpenVPX In 2018, Annapolis was the first company to bring 100Gb bandwidth to OpenVPX. The Wild100 EcoSystem is 2.5X faster than existing technology, and enables PCIe Gen-4, 100 Gbps Ethernet, and InfiniBand high-speed bandwidths. This breakthrough capability is made possible by 25Gbps+ FPGA transceivers and high-density MULTIGIG RT3 interconnects. The Wild100 EcoSystem is a growing, interoperable portfolio of rugged high-performance OpenVPX COTS boards and systems that are used for the most challenging data acquisition, digital signal processing, and data storage applications. It is VITA 65 compliant and SOSA-aligned, MADE IN designed and built in USA, and ideallysuited for rugged embedded defense and U. S. A. commercial applications.
Annapolis Micro Systems, Inc.
www.annapmicro.com/product-category/openvpxsystems/
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FEATURES ĄĄ Higher ADC/DAC bandwidths (10+ GSps)
ĄĄ Superior ADC/DAC density (1,000s of coherent synchronized channels
per system)
ĄĄ 100Gb backplane, switches, and FPGA processing boards ĄĄ Storage capacity up to 128 TB per 6U slot ĄĄ Blind mate optical and/or RF connections (VITA 66/67), for systems
that are easier to field and maintain
ĄĄ Optional hot swappability ĄĄ Includes Open Project Builder™ – VHDL or GUI-based ĄĄ Aligned with SOSA™ technical standard www.annapmicro.com
wfinfo@annapmicro.com 410-841-2514
www.vita-technologies.com
WC6C40 is the first 6U Chassis and Backplane with 100GbE capability
6U Chassis & Backplane Deliver 100Gb Bandwidth The Wild100™ 16-Slot 19" Top-Loading Chassis (WC6C40) is the first 6U OpenVPX COTS Chassis and Backplane with 100GbE capability. Its superior bandwidth and speed addresses the most challenging real-time beamforming, phased array radar surveillance, EW, SIGINT, and high-resolution processing. High Performance The Chassis and Backplane design is 2.5X faster than existing technology, and enables PCIe Gen-4, 100 Gbps Ethernet, and InfiniBand high-speed bandwidths. Superior speed and bandwidth is made possible by 25Gbps+ FPGA transceivers and high-density MULTIGIG RT3 interconnects. Rugged WC6C40 is built from the ground up to perform at the highest levels in harsh environments. It is designed and tested for high reliability, utilizing high-performance air cooling for thermal control. Maintainable In addition to performance and reliability, WC6C40 is readily maintainable. Board management is simplified with optional VITA 66/67 backplane connectivity and hot swappability.
FEATURES ĄĄ General Features
• • • • • • • • •
16 6U OpenVPX Slots – 10 Payload – 1 Switch – 1 Clock – 4 VITA 62 Power Supply delivering up to 3840W Top-Loading OpenVPX Card Cage Integrated JTAG access/control from chassis manager to each slot P3 & P6 in payload/clock slots can be configured for VITA 66/67 use Optional hot swappability
ĄĄ High-Speed OpenVPX Backplane
• • • • •
25 Gbps Line Rates on Data and Expansion Planes 40/100GBase-KR4 Ethernet 10GBase-KX4 XAUI SDR, DDR and QDR 4x Infiniband 2.5-10 Gbps AnnapMicro Protocol (Low FPGA utilization protocol for FPGA-FPGA connections) • 8x PCIe Gen 1, 2 or 3 • 1000Base-x on Control Plane
Proven Wild100 EcoSystem WC6C40 is part of the Wild100 EcoSystem. The 100Gb EcoSystem is an integrated and agile VITA 65-compliant system architecture for high-end data digitization, signal processing, and storage. Designed & Manufactured in USA All Annapolis products are engineered and manufactured under one roof in the United States. This co-location MADE IN of engineering and manufacturing allows for more aggressive design, and better quality U. S. A. control and production flexibility.
Annapolis Micro Systems, Inc.
ĄĄ Mechanical and Environmental
• • • •
High-Performance Air Cooling Operating Temperature: 0 to +55°C Storage Temperature: -20 to +70°C VITA 46.11-Compliant Chassis Management
www.annapmicro.com/products/16-slot-beamformer-chassis-2/ www.vita-technologies.com
www.annapmicro.com wfinfo@annapmicro.com 410-841-2514
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OpenVPX
VITA Technologiess Resource Guide
OpenVPX
WILD FMC+ GM60 ADC & DAC with RFSoC The WILD FMC+ GM60 ADC & DAC is the industry’s first COTS Mezzanine to feature the Xilinx® Zynq® UltraScale+™ RF System-on-Chip (RFSoC) technology (ZU25DR, ZU27DR, or ZU28DR). This breakthrough RFSoC combines FPGA processing and A/D and D/A Converters in a single chip, giving the GM60 card remarkable density and performance. For maximum performance, pair one GM60 with an Annapolis WILDSTAR 3U OpenVPX or PCIe Baseboard, or pair two GM60 with a 6U OpenVPX Baseboard. Annapolis WILDSTAR Baseboards utilize up to three high-performance FPGAs, in addition to the GM60 Mezzanine’s RFSoC. Also designed for standalone use, the GM60 is ideal for applications limited by Size, Weight, Power, and Cost (SWaP-C). This WILD FMC+ card operates within a tight envelope; it is slimmer than a 3U OpenVPX board, with about 45% less depth.
GM60 shown mounted to 3U Baseboard with blindmate RF out the backplane (VITA 67.3)
FEATURES ĄĄ
ĄĄ
ĄĄ
ĄĄ
ĄĄ
The standalone GM60 is ideal for SWaP-C applications
ADC • Channels: 4 • Max Sample Rate: 4.0 GSps • Resolution: 12 bit • Other configurations available DAC • Channels: 4 • Max Sample Rate: 6.4 GSps • Resolution: 14 bit • Other configurations available I/O Connectors (optional 50Ω SSMC or VITA 67) • Four analog outputs • Four analog inputs • One clock input • One trigger input Mechanical and Environmental • Integrated heat sink and EMI/crosstalk shields • Air- or conduction-cooled Clock Synchronization • Software-selectable external clock input or onboard PLL clock MADE IN • All ADCs and DACs across multiple mezzanine cards easily synchronized U. S. A. www.annapmicro.com
Annapolis Micro Systems, Inc.
www.annapmicro.com/products/wild-fmc-gm60-adc-dac/
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wfinfo@annapmicro.com 410-841-2514
www.vita-technologies.com
VITA Technologiess Resource Guide
OpenVPX
WILDSTAR 6XB2 6U Board features 25Gb/s RT3 connectors
WILDSTAR™ FPGA Boards with 100Gb Capability The 6XB2 (6U) and 3XBM (3U) WILDSTAR Boards are the first OpenVPX COTS FPGA Baseboards with capability for 100GbE over copper on the VPX backplane. Both boards are VITA 65-compliant and align with the SOSA™ technical standard. High Performance These high-performance boards combine the latest Xilinx Kintex UltraScale or Virtex UltraScale+ FPGAs with a powerful Zynq UltraScale+ MPSoC. They are 2.5X faster than existing technology, and enable PCIe Gen-4, 100 Gbps Ethernet, and InfiniBand high-speed bandwidths. Superior speed and bandwidth is made possible by 25Gbps+ FPGA transceivers and high-density MULTIGIG RT3 interconnects. Rugged Annapolis rugged FPGA boards are designed from the ground up to perform at the highest levels in the harshest environments. They are designed and tested for reliability, utilizing high-performance air, conduction, or air-flow-through cooling for thermal control. Proven Wild100 EcoSystem WILDSTAR boards are part of the Wild100 EcoSystem. The 100Gb EcoSystem is an integrated and agile VITA 65-compliant system architecture for high-end data digitization, signal processing, and storage. Designed & Manufactured in USA All Annapolis products are engineered and manufactured under one roof in the United States. This co-location MADE IN of engineering and manufacturing allows for more aggressive design, and better quality U. S. A. control and production flexibility.
Annapolis Micro Systems, Inc.
www.annapmicro.com/product-category/fpga-boards-2/ www.vita-technologies.com
WILDSTAR 3XBM 3U Board, shown with optional VITA 67.3 blindmate RF
FEATURES ĄĄ General Features
• • • • • • •
Up to two Xilinx® Kintex® UltraScale™ or Virtex® UltraScale+™ FPGAs – Gen3/Gen4 PCIe, 150G Interlaken and 100Gb Ethernet Hard Cores – FPGAs programmable from attached flash, JTAG or Annapolis-provided software API Xilinx Zynq® UltraScale+ MPSoC Motherboard Controller A Full Board Support Package using Open Project Builder™ for fast and easy Application Development • – BSP options include 40/100GbE IP and both VxWorks 7 • and Linux support • Multiple levels of hardware and software security
ĄĄ OpenVPX Backplane I/O
• 12 (3U) or 38 (6U) HSS I/O lanes to VPX backplane for 72 (3U) or 182 (6U) GB/s of full duplex bandwidth • 16 (3U) or 32 (6U) LVDS lines to VPX backplane • RT3 connectors deliver 25Gb/s, for a total of 100Gb per Fat Pipe • Backplane Protocol Agnostic connections support 10/40/100Gb Ethernet, IB capable, AnnapMicro, Aurora protocol and userdesigned protocols • Radial Backplane Clock Support for OpenVPX backplane signals AUXCLK and REFCLK, to enable ADC/DAC synchronization
ĄĄ Front Panel I/O
• • • • •
WILD FMC+ (WFMC+™) next generation I/O site(s) – Accepts standard FMC and FMC+ cards (complies to FMC+ specification) – Supports stacking (2 I/O cards per site) – Up to 32 HSS and 100 LVDS pairs connections to FPGA
ĄĄ Mechanical and Environmental
• Air, conduction, or air-flow-through cooled: -55°C to +85°C Operating • Available in extended temperature grades • Optional blind mate optical and/or RF (VITA 66/67) • Hot swappable • RTM available for additional I/O • Developed in alignment with the SOSA™ Technical Standard www.annapmicro.com wfinfo@annapmicro.com 410-841-2514
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OpenVPX
IC-INT-VPX3e-3U OpenVPX Intel® Xeon® D processing board Based on Intel®’s Xeon® D-15xx processor (Broadwell-DE SoC), this IC-INT-VPX3e is a 3U OpenVPX Single Board Computer delivering high performance for military and industrial applications. It is the key building block of the next High Performance Embedded Computing systems (HPEC), and can be combined with one of Interface Concept 10 Gbs Ethernet switches and front end processing FPGA boards (software/firmware libraries), to constitute a system as a whole. Main features include two banks of DDR4 with ECC (up to 32 GB), 4 x PCIe x4 ports, 2*10G Base-KR, 1*1000Base-T Ethernet ports, 1*RS232 console port. The IC-INT-VPX3e is equipped with an on-board Xilinx® Kintex®-7 FPGA, interfaced with the SoC (PCIe x4) to add core functions (IC provides various IPs and integrate specified customer services). This SBC provides USB ports, SATA ports, and GPIOs, taking advantage of the Intel SoC media capabilities. It features one SATA SSD for storage (up to 16 GB). An optional XMC slot is available to support legacy or custom-design mezzanines. The IC-INT-VPX3e is VITA 46.0 standard compliant. It is available air-cooled and conductioncooled versions.
Interface Concept
www.interfaceconcept.com
FEATURES ĄĄ Intel® Xeon® D-15xx processor ĄĄ DDR4 with ECC (up to 32 GB) ĄĄ Xilinx® Kintex®-7 FPGA ĄĄ 4*PCIe x4 ports ĄĄ VITA 46.0 standard compliant ĄĄ XMC slot ĄĄ Air-cooled and conduction-cooled versions
www.interfaceconcept.com
info@interfaceconcept.com 510-656-3400 www.linkedin.com/company/interface-concept
OpenVPX
2000W OpenVPX 16-slot RiCool Chassis Platforms The Pixus 2000W RiCool Chassis Platform holds up to 16 slots along with 16 RTMs (rear transition modules) of 3U or 6U OpenVPX boards. The powerful RiCool blowers reside directly above the card cage provide up to 392 CFM across the slots. The frontto-rear approach cools 125W/slot with higher power requirements optional.
FEATURES ĄĄ 16-slot OpenVPX with full RTM capability ĄĄ Power up to 2000W and beyond ĄĄ 125W/slot cooling, higher options available ĄĄ 9U overall chassis height (for 6U boards) ĄĄ 6U overall chassis height (for 3U boards) ĄĄ Taller chassis options for increased cooling www.pixustechnologies.com
Enclosures Cases Subracks Backplanes Chassis Integrated Systems Components
Pixus Technologies
www.pixustechnologies.com
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info@pixustechnologies.com 916-297-0020
@pixustech www.vita-technologies.com
VITA 46 & 67
Looking for a one place for all of your VPX/VITA needs? Amphenol Military and Aerospace now has you covered! SV Microwave offers a complete line of COTS VITA 67 coaxial/ RF motherboard, daughtercard, contacts and 6" and 12" cable assemblies through distribution. SV cables VITA 67 contacts with male 2.92mm (SMK) connectors to Ø.047 and Ø.086 coaxial cable types. SV’s unique connector retention mechanism makes installing and removing the cable assemblies easier than the competition! Additionally, SV’s floating SMPM coaxial contacts ensure excellent RF performance in any mating condition. These parts are also designed for side-by-side implementation with VITA 46 hardware and are cabled to Ø.047 and Ø.086 coaxial cable types. Amphenol Aerospace’s R-VPX is a ruggedized, high-speed, board-to-board interconnect system capable of data rates in excess of 10 Gbps, meeting and exceeding VITA 46 standards. This connector system gives users modularity and flexibility by utilizing PCB wafer construction with customized wafer-loading patterns.
Amphenol Military & Aerospace Operations is perfectly aligned to provide the latest technologies, cost-effective manufacturing and supply chain management, and local support to solve any military and aerospace interconnect need.
FEATURES and benefits VITA 46: ĄĄ ĄĄ
ĄĄ ĄĄ
ĄĄ ĄĄ
Qualified to VITA 46 for Open VPX applications Fully intermountable and intermateable to existing VITA 46 connectors Meets and exceeds VITA 47 performance requirements Supports Ethernet, Fiber Channel, InfiniBand, and other protocols Modular COTS lightweight connector system Can be combined with high power modules, RF modules (VITA 67) and Optical modules (VITA 66)
VITA 67: ĄĄ
High performance RF addition to the VPX platform
ĄĄ
High density form factor
ĄĄ
Excellent RF performance to 40 GHz & beyond
ĄĄ
Half-width (4 port) and full-width (8 port) formats
ĄĄ
COST parts readily available through distribution
ĄĄ
Can be combined with high power modules, Ruggedized modules (VITA 46) and Optical modules (VITA 66)
www.amphenolmao.com/Products
Amphenol MAO
www.amphenolmao.com/Products www.vita-technologies.com
marketing@svmicro.com @AmphenolMAO
561-840-1800
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OpenVPX
VITA Technologiess Resource Guide
VME
A FINE TECHNOLOGY GROUP
cPCI, PXI, VME, Custom Packaging Solutions VME and VME64x, CompactPCI, or PXI chassis are available in many configurations from 1U to 12U, 2 to 21 slots, with many power options up to 1,200 watts. Dual hot-swap is available in AC or DC versions. We have in-house design, manufacturing capabilities, and in-process controls. All Vector chassis and backplanes are manufactured in the USA and are available with custom modifications and the shortest lead times in the industry. Series 2370 chassis offer the lowest profile per slot. Cards are inserted horizontally from the front, and 80mm rear I/O backplane slot configuration is also available. Chassis are available from 1U, 2 slots up to 7U, 12 slots for VME, CompactPCI, or PXI. All chassis are IEEE 1101.10/11 compliant with hot-swap, plug-in AC or DC power options. Our Series 400 enclosures feature side-filtered air intake and rear exhaust for up to 21 vertical cards. Options include hot-swap, plug-in AC or DC power, and system voltage/temperature monitor. Embedded power supplies are available up to 1,200 watts. Series 790 is MIL-STD-461D/E compliant and certified, economical, and lighter weight than most enclosures available today. It is available in 3U, 4U, and 5U models up to 7 horizontal slots. All Vector chassis are available for custom modification in the shortest time frame. Many factory paint colors are available and can be specified with Federal Standard or RAL numbers.
For more detailed product information, please visit www.vectorelect.com
FEATURES ĄĄ
Made in the USA
ĄĄ
Most rack accessories ship from stock
ĄĄ
Modified ‘standards’ and customization are our specialty
ĄĄ
Card sizes from 3U x 160mm to 9U x 400mm
ĄĄ
System monitoring option (CMM)
ĄĄ
AC or DC power input
ĄĄ
Power options up to 1,200 watts
VISIT OUR NEW WEBSITE! WWW.VECTORELECT.COM
or call 1-800-423-5659 and discuss your application with a Vector representative.
Made in the USA Since 1947
www.vectorelect.com
Vector Electronics & Technology, Inc. www.vectorelect.com
34 | VITA Technologies Resource Guide Spring 2019
inquire@vectorelect.com 800-423-5659
www.vita-technologies.com
717-SM Series ATR Proven ATR enclosure design for rugged and high level processing applications. The 717-SM Series ATR is the latest proven design in Atrenne’s extensive enclosure design portfolio. Designed to perform in the harshest environments, it can be deployed in a range of land, sea and air applications. Typical applications involve SIGNIT, ISR and EW where high level processing and throughput is required. The ATR is highly customizable for customer-specific application and requirements. Configurable for up to 7 slots of 3U VPX or CompactPCI modules, this ATR enclosure also comes with an additional 3U Vita 62 compliant power supply slot. The 717-SM Series continues to provide the industry with a baseline of proven and qualified designs where performance and reliability are at the highest levels as demanded by the most discerning customer.
Atrenne, A Celestica Company www.atrenne.com
FEATURES ĄĄ
Configuration: Up to 7 slots of 3U VPX or CompactPCI modules
ĄĄ
Cooling: Air assisted, conduction cooled
ĄĄ
Operating Temperature: Min. -54 °C to Max. + 55 °C
ĄĄ
Altitude (1000 ft): 50
ĄĄ
Module Cooling: Conduction
ĄĄ
Mounting: Base or slide panel
ĄĄ
Construction: Dip brazed aluminum www.atrenne.com/products/717-sm-series-atr
sales@atrenne.com 800-926-8722 @AtrenneOfficial www.linkedin.com/company/atrenne-integrated-solutions/
VPX
IC-FEP-VPX6e – 6U VPX UltraScale™ FPGA board (2*FMC+ sites) Based on two Xilinx UltraScale™ FPGAs, the IC-FEP-VPX6e is a Front-End Processing (FEP) board ideal for applications requiring DSP intensive processing power. Each FPGA is coupled with two DDR4 SDRAM memory banks (supporting up to 2400 MT/s transfers), two optional DDRII SRAM memory banks and SPI Mirror flash memories for local bit streams storage and for user parameters. The board is controlled by a QorIQ® LS1046A processor integrating quad 64-bit Arm® Cortex A72 cores with high-performance Data Path Acceleration Architecture (DPAA). The Gen2/3 PCIe PCI Express advanced switch allows versatile coupling between the processor, the FPGAs and the P1 VPX connector fabric links (Non-transparent configuration is possible). Thanks to Interface Concept Multiware software package and its simplified API, the IC-FEP-VPX6e can be easily integrated in heterogeneous multi-domains PCIe architectures. Both FMC+ sites are VITA 57.4 standard compliant. The IC-FEP-VPX6e is is available in air-cooled and conduction-cooled grades (VITA 46.0 standard compliant).
Interface Concept
www.interfaceconcept.com www.vita-technologies.com
FEATURES ĄĄ 2*Kintex® UltraScale™ KU115 ĄĄ QorIQ® LS1046A processor ĄĄ 4 GB DDR4 ECC ĄĄ 256 MBytes of NOR Flash ĄĄ Gen2/3 PCIe switch ĄĄ Giga Ethernet L2 switch ĄĄ 2*FMC+ sites
www.interfaceconcept.com
info@interfaceconcept.com 510-656-3400 www.linkedin.com/company/interface-concept VITA Technologies Resource Guide Spring 2019 |
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VPX
VITA Technologiess Resource Guide
VPX/OpenVPX
PSC-6238 800 Watt 3U OpenVPX Conduction Cooled Power Supply The PSC-6238 is designed to operate in a military environment over a wide range of temperatures at high power levels, is extended shock and vibration compliant per MIL-STD-810F and features an onboard real-time clock with switchable Battleshort and NED (Nuclear Event Detect) functions. Dawn’s PSC-6238 is a wedge lock conduction cooled module on a 1 inch pitch with an operating temperature of -40°C to +85°C at the wedge lock edge. The up to 800 Watt power output true 6-channel supply provides full Open VPX support and is current/load share compatible with up to 4 PSC-6238 units. The PSC-6238 front I/O panel includes a 3-color LED status indicator, VBAT battery access and a USB port for status display, access menu control and firmware upgrade. Dawn’s embedded RuSH™ Rugged System Health Monitor technology provides for intelligent monitoring and control of critical system performance parameters including voltage, current, temperature and control of power sequencing and shutdown of all voltage rails.
Dawn VME Products www.dawnvme.com
FEATURES ĄĄ
True 6 Channel supply provides full OpenVPX support
ĄĄ
Wedge lock conduction cooled module
ĄĄ
Up to 800 Watts power output with 1 inch pitch form factor
ĄĄ
Onboard embedded RuSH™ technology actively monitors voltage, current, temperature and provides protective control
ĄĄ
Factory programmable power sequencing of all voltage rails
ĄĄ
Shutdown control for each power rail
ĄĄ
Over Voltage, Over Current and Over Temp protection www.dawnvme.com
sales@dawnvme.com 800-258-DAWN (3296) • 510-657-4444
VPX/OpenVPX
Fabric Mapping Modules Dawn OpenVPX backplane Fabric Mapping Modules simplify topology customization. Dawn VME Products FABRIC MAPPING MODULES automate optimization of OpenVPX backplane topologies. Newly patented FMM micro-overlays quickly customize off-the-shelf OpenVPX backplanes to mission requirements. Fabric Mapping Modules allow designers to work with flexible configurations of high speed links. Off-the-shelf backplanes can be quickly customized to mission requirements without the time and expense required for new backplane designs, a critical advantage when schedules are compressed by late system changes. Dawn engineers have successfully used Fabric Mapping Modules to solve many OpenVPX application problems in the design phase. Fabric Mapping Modules provide a natural migratory development environment for moving from the lab to the field with high speed OpenVPX backplanes.
FEATURES ĄĄ Off-the-shelf backplanes can be quickly customized to mission
requirements
ĄĄ Optimize the communication topology between slots within a system’s
backplane
ĄĄ Customize inter-slot communications to meet unique system
requirements
ĄĄ Improve signal integrity between system cards beyond requirements of
PCI Express, Serial Rapid I/O and 10Gbit (XAUI) Ethernet standards
ĄĄ Directly connect PCI Express or SerialRapid I/O to multiple cards or
cards and switches
ĄĄ Link SATA from a CPU card to a Solid State Drive (SSD) carrier ĄĄ Enable XMC cards to talk to other XMC cards or other I/O like
PCI Express links
ĄĄ Facilitate rear backplane I/O connections and low profile connector
interface systems when normal transition modules do not fit the system application envelope
www.dawnvme.com
Dawn VME Products www.dawnvme.com
36 | VITA Technologies Resource Guide Spring 2019
sales@dawnvme.com 800-258-DAWN (3296) • 510-657-4444
www.vita-technologies.com
COTS Rugged Chassis and Backplanes Imagine being able to deploy your electronics design in the harshest military, aerospace and industrial environments in the world. Atrenne Integrated Solutions specializes in providing rugged, deployed chassis enclosures, backplanes, and related accessories and services. If you’ve heard of Mupac, Carlo Gavazzi, SIE Computing, Hybricon, Xtech, CBT or AbelConn, then you already know Atrenne. Since acquiring these businesses, we have the industry’s most extensive intellectual property library of chassis designs accumulated throughout our 40+ year history. If your application has challenging shock, vibration, size, temperature/cooling, altitude, humidity, safety, EMI/EMC, 10 Gbaud signaling or other requirements, chances are we already have a platform design that we can use as a starting point. Working with Atrenne lowers your lifecycle cost, reduces technical risk, shortens your schedule, converts fixed costs to variable and allows your team to focus precious resources on your unique value-add.
FEATURES ĄĄ
Our design library includes: • 1/4, 1/2, 3/4, 1, 1.5+ ATR enclosures
ĄĄ
• 1U to 14U high Rackmount enclosures • Small form factor enclosures • Baseplate, forced-air, heat-exchanger, and liquid-cooled
chassis supporting 3U/6U air and conduction-cooled modules
• Backplanes with 10 Gbaud signaling in a range of
topologies and much more…
Atrenne can also serve as your one-stop-shop partner for value-add, build-to-print manufacturing of board CCA’s. We can design/build or manufacture fabricated metal components, custom I/O and cabling/wire harnesses. Additional services include connector obsolescence management, full assembly/integration and testing.
ĄĄ
ĄĄ
Benefits: • ATR, Rackmount, Small Form Factor, and Lab Development Chassis/Backplanes • VPX /OpenVPX, VXS, VME64x, VME, CompactPCI and other embedded form factors • 25+ VPX backplanes including pass-through backplanes ready for cabling to a desired topology • From legacy wire-wrap backplanes to advanced 10 Gbaud signaling • Backplanes with central switched, distributed, daisy chain and many other topologies Technical Specs: • Supported standards include: ARINC 404A, MIL-STD-1275, MIL-STD-167, MIL-STD-461, MIL-STD-704, MIL-STD-810, MIL- STD-91403, RTCA/DO-160, … • 110/120 VAC, 28/48 VDC Power Supplies • Hybrid cooling methodologies • Red/Black Tempest Compartments • Lightening protection (bulk cable injection or pin injection) Supported Architectures: • VPX, VME, CompactPCI and embedded form factors Application Areas: • Rugged enclosures/backplanes for mil-aero and industrial applications including: C4ISR, EW, Avionics, Image Processing/Surveillance, Mobile Systems, Secure Communications, Rugged Servers, Sonar & Detection systems, Computing, Communications, Medical www.atrenne.com
Atrenne, A Celestica Company www.atrenne.com
www.vita-technologies.com
sales@atrenne.com 800.926.8722 @AtrenneOfficial www.linkedin.com/company/atrenne-integrated-solutions
VITA Technologies Resource Guide Spring 2019 |
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VITA Technologiess Resource Guide
VPX/OpenVPX
VITA Technologiess Resource Guide
VPX/OpenVPX
VP1-250-SSDX This 3U VPX SATA solid state disk module delivers high capacity, high performance data storage for military, aerospace and industrial applications requiring rugged, secure and durable mass data storage. Configurable with SLC or MLC SSDs of up to 16TB capacity, the VP1-250-SSDX is available in air cooled and conduction cooled configurations and supports AES 256 encryption. When used with supporting devices, the VP1-250-SSDX supports the “purge” signal to destroy the media or the "Zeroize" that performs a DOD-approved erasure of the media. The VP1-250-SSDX’s outstanding performance and versatility is enabled by Phoenix International’s state-of-the-art technology which provides very high transfer and I/O rates, enhanced endurance and maximum data integrity. Phoenix International is an AS 9100 rev D/ISO 9001-2015 certified, NIST SP 800-171 compliant, Small Business manufacturer of Rugged COTS data storage products.
Phoenix International www.phenxint.com
FEATURES ĄĄ
SLC or MLC SATA Solid State Disk
ĄĄ
VITA 48/REDI Conduction Cooled
ĄĄ
Operational Altitude to 80,000 Feet
ĄĄ
Operational Temperature from -40 °C to +85 °C
ĄĄ ĄĄ
Solid State Disks (SSDs) up to 8TB (SLC) or 16TB (MLC) Optional AES 256/FIPS 140-2 Encryption
Made in the USa
www.phenxint.com
info@phenxint.com
714.283.4800
VPX/OpenVPX
VP1-250-SSDX This 3U VPX SATA solid state disk module delivers high capacity, high performance data storage for military, aerospace and industrial applications requiring rugged, secure and durable mass data storage. Configurable with SLC or MLC SSDs of up to 16TB capacity, the VP1-250-SSDX is available in air cooled and conduction cooled configurations and supports AES 256 encryption. When used with supporting devices, the VP1-250-SSDX supports the “purge” signal to destroy the media or the "Zeroize" that performs a DOD-approved erasure of the media. The VP1-250-SSDX’s outstanding performance and versatility is enabled by Phoenix International’s state-of-the-art technology which provides very high transfer and I/O rates, enhanced endurance and maximum data integrity. Phoenix International is an AS 9100 rev D/ISO 9001-2015 certified, NIST SP 800-171 compliant, Small Business manufacturer of Rugged COTS data storage products.
Phoenix International www.phenxint.com
38 | VITA Technologies Resource Guide Spring 2019
FEATURES ĄĄ
SLC or MLC SATA Solid State Disk
ĄĄ
VITA 48/REDI Conduction Cooled
ĄĄ
Operational Altitude to 80,000 Feet
ĄĄ
Operational Temperature from -40 °C to +85 °C
ĄĄ ĄĄ
Solid State Disks (SSDs) up to 8TB (SLC) or 16TB (MLC) Optional AES 256/FIPS 140-2 Encryption
Made in the USa
www.phenxint.com
info@phenxint.com
714.283.4800
www.vita-technologies.com
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RFSoC
Unparalleled Performance
Unbelievably Fast Integration
The combination of Pentek’s new Quartz™ architecture, and the processing power packed into the new Zynq® UltraScale+™ RFSoC FPGA, smashes the boundaries of high-performance embedded computing. Pre-loaded with a host of IP modules, this OpenVPX board is ready for out-of-the-box integration into high-performance systems. Optical streaming interfaces, a unique modular design and the Navigator™ development platform means fast, high-speed deployment. • Powerful Zynq Ultrascale+ FPGA with built-in wideband A/Ds, D/As & ARM processors • Dual Optical 100 GigE interfaces for extreme system connectivity • Robust Factory-installed IP for DRFM,radar range gate engine, waveform and chirp generation, real-time data acquisition and more • QuartzXM™ eXpress Module speeds migration to other form factors • Board Resources include PCIe Gen.3 x8 and 18 GB DDR4 SDRAM • Navigator Design Suite BSP and FPGA design kit for seamless integration with Xilinx Vivado®
Model 5950 Eight-Channel A/D & D/A RFSoC in 3U VPX Conduction Cooled
Unleash the Power of the RFSoC. Download the FREE White Paper! https:/www.pentek.com/go/mesrfsoc
All this plus FREE lifetime applications support! Pentek, Inc., One Park Way, Upper Saddle River, NJ 07458 Phone: 201-818-5900 • Fax: 201-818-5904 • email: info@pentek.com • www.pentek.com Worldwide Distribution & Support, Copyright © 2018 Pentek, Inc. Pentek, Quartz and Navigator are trademarks of Pentek, Inc. Other trademarks are properties of their respective owners.