SMT Today issue 4

Real 3D Optical Inspection for PCBA

Jaroslav Neuhauser explores 3D AOI technology

Reliability Rules

Mike Konrad takes a look at the meaning of ‘rules’ within the Electronics Assembly Industry

red carpet Who’s doing what, where?

inside SMT Hybrid Packaging Nuremberg, Germany 6th - 8th may 2014

meet the CEos Page 6

Tetsuro Nishimura, Nihon Superior Co. Ltd. (cover) David Raby of STI Electronics Inc. Bob Black of Juki Automation Systems Inc. Don Miller of Nordson YESTECH Chris Larocca of OK International Inc. Volker Pape of Viscom AG

| MAY 2014 ISSUE

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welcome to smt today Welcome to May’s edition of SMT Today – the leading global magazine solely focusing on the electronics industry providing the best content and largest distribution through the latest technology channels.

In March we were at the very successful IPC APEX EXPO in Las Vegas and, as a team, were delighted to meet up with many of our readers and contributors where we shared what SMT Today offers in the form of media exposure, inclusion in a quality printed magazine, multi-platform compatibility and complimentary videoing capabilities. A number of videos with industry leaders and technology experts were also taken during the show and these are now available for viewing on our website at www.smttoday.com We’ve brought the publication of this issue forward to coincide with the SMT Hybrid Packaging Exhibition in Nuremberg, a platform on which the industry’s leading companies will show the latest trends and developments as well as up-to-date solutions.

In this issue we’re focusing on 2D and 3D Inspection and are very pleased to include an article by Keith Bryant and Jaroslav Neuhauser from Saki Europe on “Real” 3D Automatic Optical Inspection.

In addition, we’re delighted to welcome Gene Weiner, one of the most respected industry heavyweights who will be contributing a regular column entitled ‘Industry Insights’.

Lin Ramsay Editor

The next issue of SMT Today will be published in July and will focus on Printing vs Dispensing so, if you’ve any articles that you’d like included, please don’t hesitate to send them to me at lin@smttoday.com

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inside this issue...

4

SMT Hybrid Packaging 2014 Take a look into some of the featured products

SMT Hybrid Packaging 2014, Nuremberg

Technology Today

Industry experts share their knowledge 6

Meet the CEOs

15

Real 3D Automatic Optical Inspection for PCBA

10

46 Competition Raises Standards

6

Meet the CEOs

20 22 24 26 28

32

New Products

Reliability Rules

Cracking the Code of the IPC Assembly Specifications DEK Launches Gemini Platform

National Electronics Week ADEC EXPO, South Africa A First Look at Black Chrome Solder Tips It’s A Panel Game!

36 The Advantages and Disadvantages of Vapour Phase Soldering 44

NEW UK 2014

48

Selective Soldering with a PLUS of Flexibility

46

Competition Raises Standards

Industry Insight

Gene Weiner, takes a look at bypassing 2.5D

New Products

Exciting new industry innovations

22

4

Industry News

32

What’s happening in the world of electronics

Red Carpet

14 38 52

Photo gallery of industry personalities and events

DEK Launches Gemini Platform

Page 3

SMT Hybrid Packaging 2014 Nuremberg, Germany

Page 4

6th - 8th may

Balver Zinn/Cobar

Metcal

Microtronic

PRODUCT SN100C® and SN100CS+ booth #9-312

PRODUCT MX-500 booth #9-327

PRODUCT LBT-210 booth #9-430A

Metcal will be highlighting the new MX-500.

This Soldering and Rework System has been re-imagined, adding features and a new look to a bench top icon. Built upon SmartHeat™ Technology, the new MX-500 assures extremely responsive and highly controlled heating delivering the exact energy needed to ensure a precise and reliable solder connection. Additionally, the MX-500 retains switchable dual port, 40W operation while introducing numerous new features in a new housing.

Balver Zinn SN100CS+® is a new variant (250ppm instead of the standard 50ppm Ge) of the unique and highly regarded lead-free solder Balver Zinn SN100C®.

Germanium is an anti-oxidant that will react with metal oxides on the surface of the solder in such a way that it will reduce dross formation. Due to the higher amount of germanium in the Balver Zinn SN100CS+® this alloy is recommended for applications without nitrogen.

Microtronic’s LBT-210 automatic and PC-controlled solderability tester is a revolutionary system that meets today’s current industry challenges. The system is operated by using solder paste and a temperature profile. A component is placed on printed solder paste and heated through the same temperature profile that is used in production. All force parameters and values during the heating cycle are monitored and saved. This is the only known existing method of simulating and qualifying the solder profile of an in-line production solder furnace in conjunction with different solder pastes and components.

SN100CS+® has all the advantages that have made SN100C® so popular, including substantially reduced copper dissolution rates. The lower surface tension of solder, deoxidized with germanium, will provide better wetting and flow properties.

| MAY 2014 ISSUE

SMT Hybrid Packaging is Europe’s leading event on system integration in micro electronics.

Scheduled to take place between the 6th and 8th May 2014 in Nuremberg, Germany, the show floor promises to be full of technologically advanced products and innovations.

To get the most from the show and to stay updated on the newest trends and developments, we have gathered a sampling of the products and systems that will be available at the exhibition. From SMT equipment to components and services, read on to find out how these technologies can help your company advance to the top of its competition.

SEHO

Techcon Systems

Viscom

PRODUCT SelectLine booth #9-209

PRODUCT TS9200 Jet Tech booth #9-327

PRODUCT S3088 Ultra booth #7-203

The patented Synchro concept, an innovative highlight of the new selective soldering system SEHO SelectLine, guarantees maximum throughput. Typically, to increase production volume, additional soldering modules need to be added, or the machine has to be equipped with a dual conveyor to allow parallel processing of boards. These measures, of course, are associated with a large investment in equipment. The Synchro concept is an intelligent software feature that co-ordinates the soldering process for two PCBs in such a way that the total throughput is nearly doubled without the need for significant investment.

The assemblies can enter the soldering area independently and are not linked to the same cycle. With the new Synchro concept, cycle times can be reduced by nearly 50%.

The TS9000 Series Jet Tech Valve is a piezoelectric driven, non-contact dispense valve capable of handling fluid viscosities to 2 million Cps and offers a fast jetting action in producing hundreds of accurate deposits less than one second. The Jet Tech features a compact size and modular design that can be integrated into robotic systems, and adjustable parameter settings allowing the operator to change the jetting properties for different fluid types and optimize the process for repeatable dispensing. A variety of nozzles shape and sizes, along with different tappet configurations, provides a wide spectrum of output jet deposits.

The Viscom S3088 Ultra combines the flexibility of the AOI systems of the Viscom S3088 family with the strengths of the high-performance camera module XM3D. The S3088 AOI systems are designed to flexibly cover various requirements, from small series production to highvolume/low-mix manufacturing. The XM3D camera module allows especially fast inspections, with both high-resolution angled views and 3D analyses.

Through high-resolution angled views, the S3088 Ultra reliably recognizes critical defects.

With the OnDemandHR function, the optical resolution of 16 µm (standard resolution) can be converted to 8 µm (high resolution).

meet the CEOs the people who make it happen Our industry is driven by a global network of CEOs with the energy and vision that brings new technology and innovation down the line. Every edition, we will introduce you to the faces behind the companies.

STI Electronics Inc.

David Raby is the President & CEO of STI Electronics Inc., a full-service organization providing training services,

electronic and industrial distribution, analytical and failure analysis, prototyping, and small- to medium-volume PCB assembly. Since 1982, the company has been the premier full service organization for training, consulting, laboratory analysis, prototyping, and small- to medium-volume PCB assembly in the electronics industry. Raby and his team also produce a complete line of solder training kits and training support products. Additionally, STI distributes products for the electronics and industrial markets.

Juki Automation Systems

Bob Black is the President & CEO of Juki Automation Systems Inc., a world-leading provider of automated assembly products and systems and part of Juki Corporation. Black and his experienced team have built Juki Automation Systems into a global leader in high-speed SMT Assembly equipment and have shipped more than 27,000 machines worldwide since 1987. Juki has built its global image with a combination of top-quality and high-reliability machines with a reputation for world-class service and support that result in the lowest production costs for its customers. The pioneer of the modular assembly system in 1993, Juki offers flexible solutions designed for both high-volume and high mix environments. Additionally, Juki Americas offers selective solder and stamp soldering machines backed by the largest field service group in the industry. The company recently introduced a complete line solution to include screen printers, reflow ovens and wave solder systems.

Nordson YESTECH

Don Miller is the President of Nordson YESTECH, which is a subsidiary of Nordson Corporation. Headquartered in Carlsbad, California, USA, Nordson YESTECH is a leading provider of automated optical and high-resolution X-ray

inspection systems, with integrated yield enhancement solutions for the printed circuit board assembly and advanced semiconductor packaging industries. Nordson YESTECH is operated and managed by Miller and a team of industry experts with a history of success, bringing powerful and cost-effective inspection to the electronics market.

The company has sales offices and customer support centers in North America, Asia and Europe.

OK International Inc.

Chris Larocca is the President of OK International Inc., a leading global manufacturer of bench tools, equipment

and related products that are used in the electronics and industrial assembly marketplace. Larocca is committed to understanding the product needs of the company’s customers. He and his team ensure that OK International supplies professional grade products that are innovative, reliable, price competitive and easy to use. Through a global sales channel, the company provides expert product support and responsive customer service, with localization to meet regional market needs.

Viscom AG

Volker Pape is the co-founder and CEO of Viscom AG, a leading manufacturer of optical and X-ray inspection

systems. Viscom has successfully marketed its inspection solutions since 1984 and has grown from a pioneer in the field of industrial image pro­cessing to a leader using a staff of several hundred employ­ees today. The focus is high-quality inspection systems for the electronics industry, especially automatic optical inspection systems (AOI), for solder paste inspection (3-D SPI), place­ment and solder joint inspection, as well as X-ray inspection (AXI). In this sector, the company has become one of the leading suppliers worldwide and market leader in Europe. Headquartered in Germany, Viscom’s inspection systems are used in virtually every branch of industry - from automotive electronics to aerospace technology, to industrial electronics and the semiconductor industry.

Page 6

| MAY 2014 ISSUE

director

spotlight

an interview with Tetsuro Nishimura Nihon Superior Co. Ltd. was founded in 1966 when it began marketing unique flux products imported from the United States. The company made its mark on society by gathering the most advanced soldering and brazing technologies and products from around the world and supplying them to companies in the metaljoining industry.

A turning point for the company came when it started developing its own soldering materials and with the success of its unique SN100C lead-free solder alloy, Nihon Superior has become a major player in the global market. To support the growing demand for its products, Nihon Superior has established manufacturing and sales centres in Japan, China and other Asian countries as well as the United States and formed business partnerships with companies in other markets. Our editor recently spoke with Tetsuro Nishimura, President, to gauge the company’s thoughts on current and future issues.

Q. How is the current market in Japan? Where do you see it in five years from now?

A.

Very quiet. We have had some changes in the economy. For example, tax has increased from 5% to 8% and that has caused some big movement.

It was busy before, but now it is weak and during the next five years we expect that there will be more big changes in the Japanese economy.

Q. How important is a global customer base to Nihon Superior? What advantages does this bring customers?

director

spotlight

A. They are absolutely important for us. They have different ways of thinking and different rules and the new ideas and agendas are great for new products. In order to get additional information and to deliver the latest information to our customers, we opened a new Research and Development Centre in Malaysia last September. In May of this year, to support customers worldwide, we will also open a new sales company in Malaysia, Nihon Superior Asia Sdn. Bhd. (NSA). This will cover sales from the Philippines to India, including Singapore, Malaysia and Indonesia. We also expect NSA to be the hub base for all sales and technical support throughout the South East Asian countries through the connection with our subsidiaries in Thailand and office in Vietnam.

Q.

How has 2014 started for Nihon Superior? Do you anticipate much growth this year?

A.

The market is weak, but it has been busy for us so far. We may face difficulty for the next half year, but this is a good chance for us to settle down and develop something new. We estimate to be plus 10% by the end of this year.

Q. What new markets will the company focus on entering? Why these?

A.

We are trying to develop semiconductors and vehicle markets.

We have especially developed the home appliance markets so far, and we have been expanding the results to other markets little by little. Now is the time to expand the results widely to products with high-reliability requests. We have developed a Sn-Zn+a solder alloy for soldering Ag electrode on vehicle glass.

This solder LF-Z3 drastically holds down Ag erosion that occurs even with high Ag solders. With this solder, and an exclusive use flux, we find it may enable one of the tasks of lead-free soldering on vehicle products to be cleared. ____________________________________

‘‘

With this solder, and an exclusive use flux, we find it may enable one of the tasks of leadfree soldering on vehicle products to be cleared

____________________________________ We have also developed new products such as “Alconano” nano silver paste.

This has already been accepted at Shindengen Electric Manufacturing Co.,

Page 8

Ltd. for power modules for robots. We believe that these results will be a foothold for the new market.

Q. In order to enter these new markets, will you expand your network of global licensees? How do you decide which companies to bestow with this honor?

A. We will consider it very carefully but in a positive way, whether it will expand the new market or just cause unnecessary competition. ____________________________________

‘‘

SN100C (031) is designed to improve the efficiency of electronics assembly. It offers fast sequential soldering by reducing flux spattering and excellent spreading

____________________________________

Q.

Congratulations Mr. Nishimura – we understand that Nihon Superior won an industry award at the IPC APEX EXPO for SN100C 031. Can you briefly describe this product and tell us how it meets industry challenges?

A. SN100C (031) is designed to improve the efficiency of electronics assembly.

It offers fast sequential soldering by reducing flux spattering and excellent spreading. This allows shorter solder time consumed per joint and improves working efficiency, especially for those at mass production. Also, at the same time, it has a high reliability. It is SVHC-free, which means it contains no ingredients in the EU REACH Regulation list of Substances of Very High Concerns. It also has less cracking of flux residue after soldering which helps to prevent solder corrosion in high humidity circumstances.

Q. Speaking of new products, are you

experiencing success with the Alconano range of nano-silver products? What prompted the company to create and introduce this platform?

A.

Yes. As mentioned above, we received approval from Shindengen Electric Manufacturing Co. Ltd. for power modules. There are other cases coming up constantly, and we are trying to follow up and find the best answer to customers. Since, in most cases, our customers are trying to build up new technologies, it is more like a challenge for us too. There are many tasks to be cleared but at the same time, we gain a lot from them. The curiosity and the inquiring mind to new products and new markets led us here. ____________________________________

Since, in most ‘‘ cases, our

customers are trying to build up new technologies, it is more like a challenge for us too

____________________________________

Q. By the end of 2014, what goals do you hope to accomplish for the company?

A.

First of all, we would like to get Nihon Superior Asia on the road. We believe this will be helpful for both our customers and ourselves. Eventually, we would like to strengthen the linkage with our R&D center in Malaysia and Japan to respond to expectations from our customers.

Our aim, to expand SN100C and other NS products worldwide, has never changed and will remain unchanged. We are always watching carefully for customers’ requests and thinking hard about what solutions we can provide.

| MAY 2014 ISSUE

Reliability Rules by michael konrad, President of Aqueous Technologies Corp

Like many other languages, the English language contains single words with multiple meanings. Take the word “rule” for example. It has many meanings. Rule can be defined as “a statement that tells you what is allowed or what is not allowed in a particular game, situation, etc.” It is also defined as “a piece of advice about the best way to do something,” “an accepted procedure, custom or habit” or “to be preeminent; be in charge”, to name a few.

In the world of the electronics assembly industry, there are many rules, each with its own definition. Let’s start with the “Rule of Thumb.”

Rule of Thumb Noun: “A rough and practical approach based on experience rather than a scientific or precise one based on theory.”

The rule of thumb has long dictated if an assembly looks clean, it is clean. In the late 1980s, assemblers en masse defected from rosin and water-soluble fluxes and transitioned to “no-clean” fluxes. The promise, mostly delivered, was that there would be no visible residues after soldering.

The formally popular flux types all left visible residues until cleaned. No-clean fluxes almost miraculously left behind little to no visible residues.

IPC Approved Resistivity of Solvent Extract (Cleanliness) Tester

Page 10

Assemblers, now happy citizens of the “No-Clean Nation,” enjoyed many years of blissful tranquility until one day, when the rules changed.

Q.

Rule

A. The Rules have changed.

Noun: “A statement that tells you what is allowed or what will happen within a particular system (such as a language or science).”

There are many residue species commonly found on an electronics assembly. These residues are accumulated over a circuit board’s long journey into usefulness.

Residues from board fabrication are very common. Just because the board is bare does not mean it is clean. On the contrary, bare boards may be surprisingly dirty, covered with invisible forms of contamination, some benign and others harmful. ____________________________________

‘‘

just because the board is bare does not mean it is clean.

On the contrary, bare boards may be surprisingly dirty

“We have successfully not cleaned our assemblies for the past 20 years. Why are we experiencing problems now?

Remember the days when a circuit board’s geography resembled “fly-over” country?

Available board real estate was in ample supply. Additionally, components 20 years ago were Land-of-the-Giant sized compared to many modern components.

Circuit boards were large and component spacing was vast. Those were the days.

Back then, there was a considerably higher level of tolerable residues. Today, with the drive toward miniaturization, both component-to-component and component-to-board spacings have never been lower. Miniaturization, combined with increased product lifespans and reliability expectations, has resulted in the reduction of tolerable residue limits. In other words, a specific volume of residues on an assembly a few years ago would go unnoticed while the identical volume today would be catastrophic. The closer things are together, the more likely residues will have a detrimental affect.

____________________________________ Additionally, there are residue stowaways from component fabrication. I recall a paper presented by Research in Motion (Blackberry) whereby they described an issue involving silicon mold-release that transferred from the component reel to the component, to the circuit board, reeking havoc on the soldering process.

Finally, there are assembly residues, perhaps the most prolific of all of the residue types.

The assembly process is rife with potential residue sources. Human-derived residues including hand oils, equipment transfer residues, food products (potato chip residues are exceptionally nasty), hand lotion residues and, of course, flux residues. Here is one rule most assemblers forget. If one does not remove flux residues, one does not remove any residues. So, even with the most utopian belief that no-clean flux leaves no residues, there remains a virtual farmer’s market of other residues on the board.

Dendritic growth caused by a combination of residues, moisture and electrical current. Photo courtesy of Foresite

Q. How do I justify cleaning a noclean flux? Doesn’t “No-Clean” mean “Don’t Clean”?

A.

Forget the term “No-Clean”. Re-label the solder paste jars “Low-Residue”.

| MAY 2014 ISSUE

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feature continued...

The most commonly removed (cleaned) flux is no-clean. That is a fact. More assemblers clean assemblies reflowed with no-clean solder paste than any other type of solder paste. Some of the assemblies reflowed with no-clean solder paste arguably do not need to be cleaned while others absolutely must be cleaned.

There are many factors to determine if an assembly should be cleaned. Factors include: • The cost of failure • The climatic environment where the assemblies shall live • Geographic component layout Cost of Failure If your product fails due to the presence of harmful residues (or any other fatal defect), what happens? While some assembly failures can lead to very dramatic results (death, destruction, etc.), others can lead to loss of profits and reputation. While some failures may be considered helpful, most do not fall into that category. Some assemblies can handle residues without failing and others cannot. How can a label on a solder paste jar know whether or not your assembly can handle the residues created by a no-clean process? The fact is the label is misleading. A more appropriate definition would be “low residue.” It is then up to the technology owner to determine how much residue is acceptable on a specific assembly.

Climatic Environment Where the Assemblies Shall Live Residue-related assembly failures typically are the result of three combined factors: residues, moisture and electrical current.

The right combination of these three ingredients will result in electrical migration (dendritic growth) or electrical leakage, neither of which is desirable.

To eliminate any chance of electrical migration or leakage failures, all one has to do is eliminate one of the three factors.

1.

Eliminate electrical current - Obviously, while effective, eliminating electrical current is not an option.

2.

Eliminate moisture - Moisture acts as a catalyst for electrical migration or leakage when it comes into contact with electrical current and corrosive or conductive residues. While a good board baking process can eliminate moisture,

Page 12

unless an assembly is encapsulated, moisture can return to the assembly, causing the previously described failures. A common belief is that to prevent the re-introduction of moisture, the assembly can be conformally coated or potted. While this is true when assemblies are deeply potted, it is not true when assemblies are conformally coated. Conformal coat, while providing an effective barrier to fluids, most often is permeable. A small amount of moisture can penetrate a conformal coating, which can result in undercoat corrosion and electrical migration and leakage.

3.

Eliminate residues - With a residuefree assembly, electrical current and moisture alone do not have anything with which to form a current path.

No current path means no electrical migration or electrical leakage.

Geographic Component Layout Consider the amount of spacing between component-to-component and component-to-board. Remember, as the spacing decreases so does the volume of tolerable residue.

test is required. Perhaps a better concept is to internally reject the current (yet obsolete) cleanliness pass/fail standards and replace them with lower, more conservative standards.

The current IPC pass/fail standard for post-reflow cleanliness is 10 ug NaCl (eq) /inch2 (1.56 ug NaCl cm2). A more realistic approach to cleanliness standards considers the component spacing on the assembly, the amount of electrical current, the cost of failure and the climatic environment (moisture) where the assembly will be functioning. By taking into consideration these four factors, one may determine the “safe” and tolerable amount of residues.

For some assemblers, the current IPC standard works well. These assemblies have measurable space between conductors, adequate stand-off heights that are less likely to trap residues, will be operating in a climate-controlled/low humidity environment, and the cost of failure is not prohibitively high. For other assemblers, fewer residues would be more prudent.

Q.

How exactly do I determine how much residue is on my assembly?

Perhaps, in this context, the most practical definition of the word “rule” is:

A. This answer involves both good news and bad news.

Rule:

The good news is there are fast, easy and affordable testing systems that are capable of determining how much residue is on an assembly. There are also well-defined cleanliness standards, originally published as military standards, then subsequently morphed into IPC standards.

Noun: “A piece of advice about the best way to do something.”

The bad news is the cleanliness standard most used today was actually developed in the 1970s.

The 1970s is the time before surface mount. Back when Fantasy Island was topping the TV charts, a cleanliness standard was borne. It has never changed.

The volume of acceptable, tolerable residues back in the 1970s was many times more than would be acceptable today. Some have suggested that a new

| MAY 2014 ISSUE

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industry insight by gene weiner, IPC Hall of Famer Gene Weiner takes a look at bypassing 2.5D and reviews this year’s IPC APEX EXPO, held in Las Vegas.

Bypassing 2.5D

IPC APEX EXPO

Did Nvidia’s announcement that it would use 3D packaging with silicon-throughvias on some forthcoming Pascal graphics processors, to make more memory available with minimal delays, signal the start of a general acceptance of stacked memory chips? ____________________________________

2014 was the best in many years.

Attendance was good.

Record conference attendance was coupled with steady traffic on the show floor.

Even Thursday morning saw potential buyers visiting exhibitors in their booths.

Capital equipment buyers were twice as optimistic as in the previous year - about 65% stated that they planned to buy equipment this year versus about 30% last year. Exhibitors stated that they were making sales and getting commitments for future trials in their booths during the show - even though there was little in the way of new systems to be seen in the hall. One independent equipment sales rep stated that he had more customer meetings at this show than at the five previous events combined. ____________________________________

‘‘

Samsung, Intel, and TSMC will spend more than 50% of the entire IC industry’s billion CapEx of $62.2 billion in 2014

____________________________________ Samsung, Intel and TSMC will spend more than 50% of the entire IC industry’s billion Capital Expenditure of $62.2 billion in 2014. The questions are, “How much will they spend to help their supply chains develop the new packaging and materials needed for their now products?* How will these be selected? What other support will they provide? Will they leave this challenge up to their competition to provide the solutions if they can afford to find them?”

It seems like the obstacles to overcome are indeed steep for those wishing to enter tomorrow’s electronic packaging industry. ____________________________________

‘‘

It seems like the obstacles to overcome are indeed steep for those wishing to enter tomorrow’s electronic packaging industry

____________________________________ *Note that China spends about $300 billion on R&D versus $450 billion in the U.S. and is increasing its spend by 20% per year. At this rate it will surpass the U.S. in research and development spending by 2022.

Page 14

‘‘

Capital equipment buyers were twice as optimistic as in the prior year - about 65% stated that they planned to buy equipment this year versus about 30% last year

____________________________________ New product introductions and improvements abounded.

EarthOne Circuit Technologies Corporation and eSurface® Technologies created quite a stir with its sponsorship of the Tuesday luncheon to announce a new additive printed circuit board process.

It was interesting to learn of the rapid growth of HzO and its vacuum applied conformal (and other protective) coatings. Michael Mummert told us of the progress his company has made this past year. The company, grown from a handful of employees to about 50,

| MAY 2014 ISSUE

beefed up its management staff, moved into larger quarters in Utah this past year, and established a branch in Zuhai, China to service its customers there. He stated that millions of boards have now been processed through their system, which is said to meet all current IPC requirements and have a longer protective life than those materials currently applied by plasma deposition. The process is marketed in a variety of ways including leased equipment, license, OEM licenses, and coating services for a fee. ____________________________________

‘‘

The company grown from a handful of employees to about 50, beefed up its management staff, moved into larger quarters in Utah this past year, and established a branch in Zuhai, China

____________________________________

Gene Weiner IPC Hall of Famer Gene Weiner started in our industry in 1956 as President of Weiner International Associates, and has over 50 years successful business and corporate officer experience.

Weiner International activities are geared to identifying and seizing new opportunities, expanding market boundaries, globalizing and localizing business, lowering manufacturing costs, expanding spheres of influence, improving individual and corporate performance. Gene has a wealth of knowledge and experience, and has his finger on the pulse of the industry today.

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Real 3D Automatic Optical Inspection for PCBA

by Jaroslav Neuhauser, Technical Manager, Saki Europe and Keith Bryant, SMT Today’s technology editor

The newest state-of-the-art full 3D Automatic Optical Inspection (AOI) delivers many benefits compared to the conventional 2D AOI system i.e. improved real defects detection together with lowest false call rate, easier programming and shorter programming time, more accurate data in the Statistical Process Control (SPC) database and easy interpretation of the defects for operators. Let’s explore 3D AOI technology in more detail.

Development of AOI Technology There are many ways to optically inspect PCBAs (Printed Circuit Board Assemblies).

Previously, all of the methods were based on 2D imaging which is sufficient for the detection of many PCBA defects.

However, there are some types of faults where 2D imaging has its limitations, especially lifted lead detection, nonwetting, lifted chips, tombstoning, or BGA, QFN or CSP co-planarity issues, plus bare board flatness. ____________________________________

‘‘

another solution was to implement angled views (or side cameras) to enhance the detection of lifted lead inspection

implement angled views (or side cameras) to enhance the detection of lifted lead inspection. This approach seemed to be more successful. However, the density of mounted components and taller packages started to restrict the areas where only the angled view was possible to be used. Angled cameras provide only local information of the component and one of the most difficult issues is to find a balance between the cycle time and the number of components inspected in angled view.

A typical Programmer’s question is: “Which component will be inspected in angled view?”

The answer from Quality Assurance would be: “Every component, for sure!”

Production Department responds: “No way! We have no time to slow down the production line as the production plan is full!”

So the typical conclusion of the dialogue is to use the angled view for the most critical and potentially problematic components.

But, which are those components?

How do you anticipate a single defect occurrence? Can the angle view be used?

Some vendors started to use point laser triangulation but this method proved unsuitable for high reflective object inspection, e.g. soldering, as it provides only very local information of the selected component and cycle time is raised dramatically typically one second per measurement. Another solution was to

Page 16

Real 3D AOI Advantages Real 3D AOI delivers height information over the entire PCBA including all soldering points. Just by considering the height of the components, the presence/absence or position offset become independent on PCB and components surface colour and brightness.

It also suppresses any difference between the PCB and component vendors and differences among the production batches of components.

Generally, as all SMD components have a rectangular or circular shape, the height information enables automatic generation of the inspection library. ____________________________________

Programming ‘‘ methods and

parameters are also simpler and more understandable

____________________________________ 2D imaging started with orthogonal black and white and later colour CCD or CMOS camera systems with diffusive nondirectional lighting. Then the orthogonal, or structured angled lighting for soldering inspection, was added to improve the performance. However, there were still defects, which remained undetected.

Figure 2: Real 3D Non-Filtered Reconstructed Image

____________________________________

Figure 1: Example of Blind Area in Angled View

There are many locations on almost every PCBA where the side camera has a ‘Blind Spot’ like on the figure above. In this case, the side camera is not an option and just orthogonal inspection has to be used.

Now, the answer is clear! Cover the full PCBA surface in 3D without compromising the cycle time… Real 3D AOI.

Therefore the programming time is reduced dramatically and the fine tuning phase of programming is almost eliminated.

Programming methods and parameters are also simpler and more understandable, as we are talking about dimensions and height – simply everybody can easily imagine the geometrical dimensions. Real 3D AOI is capable of classifying more accurately what really happens on a PCBA including the correct and clear classification of lifted leads, non-wetted joints, board warp, etc.

In addition, the visual appearance on the

| MAY 2014 ISSUE

verification station graphical user interface for operators, 3D view, can be rotated and zoomed in real time, enabling an operator to classify the defect reliably, consistently and quickly.

Technology

PCBA inspection, as much taller components are mounted. Simple range extension is not a solution, because the height resolution and accuracy would become low. To rectify this issue, two different stripe pattern pitches/ frequencies are used.

Figure 8: LCoS Components

Real 3D AOI uses Phase Measurement Profilometry (PMP) technology to acquire height information in the entire Field of View (FOV). This technology is well proven in Solder Paste Inspection (SPI) machines after the printing process. However, there are several important differences compared to SPI technology.

Zero Reference Plane Compensation One of the most important matters in 3D inspection is to accurately calculate the Zero Reference Plane. If this was not calculated accurately, all the results would become inaccurate too.

The projector unit projects the stripe pattern image onto the PCBA at an exact angle.

With the knowledge of the projection angle, the height can be accurately calculated at each point and the PCBA surface reconstructed to the 3D view.

3D AOI systems have to calculate not only the reference height, but also consider the reference plane angle. Compensation of PCBA surface warpage is essential for accurate detection of slight chip lifting or BGA/QFN co-planarity check. The compensation has to be done for each FOV independently, because the PCBA can be warped and bent irregularly. ____________________________________

Shadow behind Tall Components As the projector is not projecting the stripe pattern orthogonally, the shadowing effect comes up behind the tall components. In those areas where the stripe pattern can’t be seen by the camera and therefore the height can’t be measured. In this instance more projections have to be used. In practice, four projections (North, East, South and West) are usually used. The reconstruction algorithm identifies the shadowed areas and automatically uses the other projection(s) without shadowing instead.

Multiple Reflections Due to shiny objects and high density of components on PCBA, the multiple reflection effect can happen. ____________________________________

Figure 6: Wide and Fine Stripe Pattern Pitch

The wide one (low frequency) is used for inspection of tall components, the fine one (high frequency) for inspection of tiny components and solder joints. Such a machine provides high resolution in the range of 0mm to 2.5mm - solder joint area and also covers a wide range of tall connectors and capacitors.

____________________________________ Any multiple reflection causes inability to measure the height or creates an inaccurate height calculation.

The reconstruction algorithm automatically selects the projection(s) with the smallest error in order to maximize the final reconstructed image quality.

Height Measurement Range In the case of SPI inspection, the typical height measurement range is up to 450μm.

However, such a range is insufficient for

warpage is essential for accurate detection of slight chip lifting or BGA/QFN coplanarity check

____________________________________ As an example of chip body inspection the component height and angle (inclination X and inclination Y) is investigated after the reference plane compensation.

any multiple ‘‘ reflection causes

inability to measure the height or creates an inaccurate height calculation

Compensation ‘‘ of PCBA surface

Figure 7: Old vs. New Projector Comparison

In the old concept of stripe projection, the pitch and lighting intensity was fixed and the pattern was mechanically moved by piezo motor (refer to overhead projector). This approach needs more projections compared to the latest technology, so takes much more time.

The new, state-of-theart projector is using LCoS (Liquid Crystal on Silicon) components for stripe pattern generation. Based on the above process, the stripe pattern is actually generated by software. The pitch and even the brightness (amount of the reflected light) can be changed easily providing much more flexibility.

Figure 10: Chip Body Inspection

The inspection window is set to body size. In this case, the average height result is 499μm and it is within tolerance for the 0402 chip resistor. Tombstoning (or Inclination in X direction) equals to 15μm and Billboarding (or Inclination in Y direction) equals to 8μm. Both are within tolerances. Please refer to figure 10.

feature continued...

3D AOI Programming We have already mentioned that programming and debugging time is much shorter and programmer skills needed for making the program are ‘by design’ minimized.

3D vs 2D Programming 3D programming is a very friendly way to build a programme, because of its simplicity. However, for several defect types, there is no way to discover them in 3D i.e. printed polarity mark, reading the text printed on the component body etc.

Then, 2D programming comes into the equation. The state-of-the-art Real 3D AOI systems combine 2D and 3D programming in a very smart way and offers the best and most suitable inspection algorithm for each situation. ____________________________________

When using conventional 2D AOI, the programmer has to define the inspection windows or areas of interest. However, this step is not necessary for Real 3D AOI systems.

Programme Debugging A programmer has full statistical control for each parameter in 3D AOI system.

Histograms of the sample values for the components of the same part number all around the PCBA are available for studying with the component variance available on either a machine or offline programming station. The data is logged into the SPC database, so the programmer has a full picture about past production.

Figure 13: Operator Interface (Lifted Component Body)

‘‘

The state-ofthe-art Real 3D AOI systems combine 2D and 3D programming in a very smart way and offers the best and most suitable inspection algorithm for each situation

____________________________________ Automatic Component Shape Recognition

Figure 12: Sample Value Histogram Example

Conclusion

Operator Interface

The height information is very accurate; therefore it can be easily used for automated component geometry recognition.

Another huge advantage of Real 3D AOI technology is the visualization of defects for operators on the production line. An operator has a chance to investigate the defect by using the 2D or 3D image, depending on the type of defect. He/ she can easily judge whether they see a real defect without having the actual PCB physically in front of them. 3D images simply make their work much easier and more reliable. ____________________________________

In the last decade, visual inspection performed by operators has been replaced by 2D AOI systems. Nowadays, Real 3D AOI technology is well on its way to replacing the 2D AOI systems, plus 2.5D and Pseudo 3D. Although it is clear that Real 3D AOI technology is still quite new, the potential of 3D imaging and 3D programming is huge. Today, there is significant market demand for Real 3D AOI in High-Tech segments i.e. military and aerospace, automotive and telecommunications. Sooner or later 3D AOI demand will spread to the other segments of the market setting the standard in the global SMTA industry.

Yield improvement to increase profits is becoming a common mantra in our industry and this technology is a huge step forward in achieving this. As more packages change to BTC (Bottom Terminated Components) and QFNs become a common sight on boards, co planarity becomes a big issue for the assemblers as does board flatness.

they can easily ‘‘ judge whether

Figure 11: Automated Component Geometry Recognition

Page 18

they see a real defect without having the actual PCB physically in front of them

____________________________________

| MAY 2014 ISSUE

Cracking the Code of the IPC Assembly Specifications

by Bob Doetzer, Circuit Technology

The IPC assembly specifications have become the worldwide standard for virtually every company involved in printed circuit board (PCB) fabrication, assembly, repair and prototyping. That is without question. What is in question amongst most in the industry is what exactly each specifications primary focus/ purpose is. This is compounded by the many acronyms and combination of letters and numbers that are used for the specifications and revision levels. As an IPC Master Training Center, we get calls every day from customers wanting to get IPC certified but do not know which specification is best for their situation. So this should clear it up for everyone. ____________________________________

‘‘

All specifications are inter-related and use criteria from all the specifications in each one

____________________________________ There are five primary assembly specifications: IPC-600H, IPC-A-610E, IPC/WHMA-A-620B, IPC-7711/7721B and IPC-J standard 001E. The last letter in all these refers to the revision level. For example, the J standard is at revision E, which supercedes revision D. Any time there are substantive changes or additions, a new revision comes out. All specifications are inter-related and use criteria from all the specifications in each one. However, the main focus of each is: IPC-600H Acceptability of Printed Circuit Boards This is for bare board fabrication and inspection. The specification includes general technical information and pictures of internal and external defects as well as minimal acceptable and preferred conditions. This certification class is all

Page 20

classroom study and includes no handson work.

IPC-A-610E Acceptability of Electronic Assemblies This is typically for final QC at an assembly house and incoming inspection of assembled PCAs from an assembly facility or EMS partner. This also is very pictorial and empirical in its documentation of good and bad solder connections for all types of SMT and TH components. All aspects of workmanship standards and inspection criterion are covered. This certification is all classroom study and includes no hands-on work.

IPC/WHMA-A-620B Requirements & Acceptance for Cable & Wire Harness Assemblies This is for people terminating wires and building wire/cable harnesses. It includes all types of crimp, solder and solderless connections and what constitutes a robust reliable assembly. It is mostly classroom work but there is an optional hands-on module for applying the practices learned.

The optional Space Addendum is available for NASA contracts.

IPC-7711/7721B Rework, Modification and Repair of Electronic Assemblies This is an intensive hands-on five day curriculum that will make the student extremely proficient in repair of most SMT and TH devices as well as laminate repair. The 7711 portion is component removal and replacement. The 7721 portion is repair of damaged TH barrels/ annular rings, SMT lands and PCB traces, including inner layers of multilayer boards.

IPC-J-001E Requirements for Soldered Electrical and Electronic Assemblies This is the most comprehensive specification and focuses on process control for building reliable electronics.

The certification course involves mostly classroom work but hands-on skills comprise approximately 20 percent of the five-day curriculum. This generally is considered the highest level specification and also has the optional Space Addendum. To further the confusion, the J-001 also includes J standards-002 through J-006 specifications. ____________________________________

‘‘

If we want to bring work back from low cost regions of the world we need to be more efficient

____________________________________ All of these specifications are available in Certified IPC Specialist (CIS) level or “worker proficiency” and Certified IPC Trainer (CIT) or “instructor certified.” The CIT is a more rigorous curriculum, higher level certification qualifies the student to then train others to the CIS level. All certifications are valid for two years then require re-certification. Perhaps the most important question is why invest in these training classes? Some do because they are contractually required but most companies now see the value in proper training. If we want to bring work back from low cost regions of the world we need to be more efficient, build it right the first time with better quality, quicker delivery to market and less field returns.

This will make us more competitive in real “true” cost and more profitable in the long run. The most successful companies realize that training is an investment, not an expense.

So hopefully this clears up the alphabet soup of IPC specifications. As always, contact our knowledgeable staff with any questions and they will be happy to help. www.circuit-technology.co.uk

| MAY 2014 ISSUE

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DEK Launches Gemini Platform

by Karen Moore-Watts, Global Marketing Director, dek Back-to-Back Print Configuration Designed to Double Productivity

At NEPCON China, DEK unveilled its latest print platform innovation: Gemini.

The back-to-back (B2B) printing system delivers modular processing on-demand, enabling high-volume electronics manufacturers to dramatically increase output levels while ensuring exceptional accuracy, quality and yield.

Based on the proven Horizon iX series, Gemini provides a familiar graphical user interface (GUI) that requires no relearning for current DEK customers. The short learning curve allows for immediate leverage of Gemini’s powerful capability, producing as many as 300 boards per hour. Gemini delivers this throughput rate without sacrificing anything, as the system is capable of managing a 508 mm x 508 mm print area in an industry standard frame, yet the footprint is far more compact than that of other B2B printers on the market.

“The demand for a highly-capable printing solution to support dual-lane pick and place processes is increasing – particularly for manufacture of mobile products,” says Karen Moore-Watts, DEK Global Marketing Director. “Until now, space requirements,

Page 22

serviceability challenges and re-deployment issues have been problematic for side-byside and back-to-back printing systems.

Gemini has resolved all of these challenges with a high-volume, small footprint, independently controlled B2B solution.”

opportunities. Customers were invited to sit down with DEK technologists in one-on-one sessions to discuss individual manufacturing requirements and preparation for future electronics developments.

Flexibility and convenience are at the heart of the Gemini platform, as each printer in the system has all key maintenance elements located at the front of the machine for quick and easy access. What’s more, the printers in the Gemini system offer independent functionality, allowing one printer to continue running while managing product changeover on the other. These features – in addition to its exceptional processing performance - make Gemini the best market solution for B2B printing and all show delegates were invited to see a live Gemini demonstration.

Show delegates also learned more about DEK’s yield and control-enhancing support products. VectorGuard High Tension stencils, brand new understencil cleaning fabrics that provide exceptional fine-pitch cleaning capability and high performance understencil cleaning chemistries. All of these capabilities were demonstrated during the event.

Combined with superbly capable and flexible platforms, such as the Horizon 03iX, which was also on display, the company demonstrated unparalleled value of ownership, process control and productivity gains through the use of DEK products.

“DEK’s display at NEPCON China shared our comprehensive printing offer – from the award-winning, proven Horizon iX platform to robust process support products to the latest in highthroughput B2B printing,” says MooreWatts in summary. “We understand the challenges facing our customers today and the manufacturing complexity they will confront in the future; DEK is already well-placed to deliver the solutions to meet those requirements.”

The development of next-generation printing products like Gemini is possible only because of DEK’s immense printing experience and broad knowledge base. The expertise of the DEK team was also highlighted at NEPCON China through the DEK Print Lab which is a tangible compilation of DEK resources, expertise and knowhow, all available to help customers solve today’s printing challenges and prepare for tomorrow’s

| MAY 2014 ISSUE

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National Electronics week adec expo, south africa

by Keith Bryant, SMT Today’s Technology Editor South Africa’s only platform for the global electronics industry.

Returning to the Johannesburg area, this two-day show is really the only platform for SMT-related businesses in South Africa.

There was a new location for 2014 as well, so there were many differing views on how the show would turn out. ____________________________________

‘‘

The visitor numbers were not huge, but the quality was high and even by the end of day 1 there were machines with sold signs on them

____________________________________ I arrived 2 hours after the 9.00 am start and the halls were both quite busy. Yes 2 halls, one for the capital equipment and one mostly focused on components.

Visitors that I talked to had no hassles getting to the venue either by car or the Gautrain, a fast monorail that is a legacy from the Soccer World Cup.

Page 24

There was a strong showing of European sales guys there to support their local distributors. We even had 6 guys from Panasonic Asia taking care of their systems on one of the larger stands. This was one of the few global branded stands, another being XJTAG with their normal showing of nice young ladies, the majority of stands were the local guys, with equipment from their principals.

The visitor numbers were not huge, but the quality was high and even by the end of day 1 there were machines with sold signs on them, which is not seen too often these days. There was also a good free seminar programme including CyberOptics presenting their unique technologies.

The first day drew to a close with free drinks and nibbles for 2 hours after the event closed. This worked well and was a great networking opportunity for all who attended. It was held in the atrium area so it kept everyone in close proximity to the food and the bar. This worked better than the US shows where they bring beer carts and food onto the show floor a couple of hours before the show closes. This effectively signals the end of the working day and

people have a beer on their stands, with very little opportunity for networking or business interaction. ____________________________________

both exhibitors ‘‘ and visitors felt

that it was a worthwhile event

____________________________________ Day 2 was not quite as busy, but again a good level of visitor, quite a few traveling in from the Cape Town area and from Durban. So the show was bringing in a good audience from the key areas for SMT in South Africa.

At the end of the day both exhibitors and visitors felt that it was a worthwhile event and was definitely needed to keep South Africa on the map and up to speed with new technology. Some sales were closed, some new networking was done and old friends were reunited. So a good time was had by all who came, but there was room for more visitors.

| MAY 2014 ISSUE

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3/4/14 11:56 AM

A First Look at Black Chrome Solder Tips

by Gary Goldberg, President and CEO, Promation Inc

molten solder to the joint and aid in heat transfer. And while copper is actually better for soldering, it is also highly susceptible to being dissolved rapidly by solder alloys.

Therefore, iron is most widely used.

For the purpose of this study, PROMATION developed some black chrome tips and used these tips in a side by side test comparison with our standard tip technology. Our soldering test was performed using a SAC305 solder (noclean) with a 3.2 percent flux core, sample PCBs with a 1.7 mm pad with multi-pin connectors with 0.8 mm pins and a hot iron soldering robot from PROMATION. The tips selected were a 2.4 mm half V configuration, one with standard plating and one with black chrome plating. For the purpose of this study, the soldering temperature was set to 375°C. ____________________________________

Over the past year we have been hearing more and more about black chrome soldering tips and some of the benefits this technology can provide to the high-volume soldering processes. This article provides insight about these tips as well as some of our observations when using them with table top production soldering robots. ____________________________________

‘‘

The electrolyte contains chromic acid and nickel chloride plus a carboxylic acid

____________________________________ Black chrome (chromium) plating consists of chrome that turns black after the addition of a contaminant, according to National Metal Finishing. Back in 1953 a hard, bright chromium-base electrodeposit was developed that can be applied at a high rate of deposition. The electrolyte contains chromic acid and nickel chloride plus a carboxylic acid. When this bright deposit is treated with hydrochloric acid (for a few seconds) a black finish results.

Page 26

This finish is non-smudging, very adherent and uniform. These deposits will withstand heating in high vacuum to temperatures of more than 930°F (500°C) and can be applied to most metals without the use of special equipment. ____________________________________

‘‘

A typical soldering tip consists of a solid copper core, a plated layer of iron, a plate of nickel behind the working surface and a plated chrome layer

____________________________________ A typical soldering tip consists of a solid copper core, a plated layer of iron, a plate of nickel behind the working surface and a plated chrome layer. Black chrome attaches best to nickel, which adheres best to copper; however, the key working layer and the one that affects tip life the most is the layer of iron. The working surface of the tip must be wet in order to transfer

‘‘

The standard tip showed more signs of oxidation and was prone to burnt flux residue buildup on the tip and shaft

____________________________________ Each of the test boards consisted of 420 through-hole soldering joints (pin connectors).

Tip cleaning was done after 105 joints were soldered, simulating a high-volume production environment using an air/wet sponge combo cleaner.

At first glance, both tips seem to perform equally well, but through extensive testing, which consisted of recreating a production-like high-volume environment, we observed a slight advantage in quality when using the black chrome tip.

The standard tip showed more signs of oxidation and was prone to burnt flux residue build-up on the tip and shaft.

Over time, it resulted in a minor decline of soldering operations even when tip maintenance was properly addressed.

| MAY 2014 ISSUE

In contrast, the black chrome tip demonstrated proficiency in maintaining higher quality soldering throughout the entire test, achieving a superior Class 3 type soldering connection. The complete assembly and inspection processes involved in this study were performed in accordance with IPC J-STD001-E. Additionally, we observed the black chrome tip demonstrates an improved ability to localize the dispensed solder, forming target solder fillets throughout the soldering process. Using an automatic solder feeder, we were able to ensure and consistently deliver a set amount of solder to each joint. The plating construction on the black chrome tip’s shaft was seen to have provided an added benefit. The reduction of wet-able area on the tip surface naturally directs the solder more towards the joint area, thus reducing the overall migration of solder up the tip. ____________________________________

Using an ‘‘ automatic solder

feeder, we were able to ensure and consistently deliver a set amount of solder to each joint

____________________________________ Due to the majority of the black chrome tip’s shaft being plated, we witnessed the solder only traveling to the source side of the board upon contact, increasing the accuracy of the amount of solder being dispensed into every solder joint.

Additionally, we noticed that the activated flux did not accumulate as much on the black chrome tip since the solder was only allowed to localize at the end of the tip. As

a result, smaller amounts of activated flux were left behind. ____________________________________

Localization ‘‘ of solder on the

surface of the tip for robotic soldering is key to achieving repeatability and quality work

____________________________________ Localization of solder on the surface of the tip for robotic soldering is key to achieving repeatability and quality work.

Totaling all variables and defects (for both the standard tip and black chrome tips), the black chrome tip resulted in a lesser defect rate (2.67 percent improvement) in accordance with IPC J-STD001-E. ____________________________________

‘‘

test results, summarized by FOURCAD, Inc., both tips soldered well with the black chrome tip ____________________________________

Based upon the accumulated test results, summarized by FOURCAD, Inc., both tips soldered well with the black chrome tip showing a slight advantage in reduction of overall defects throughout our multiple test runs.

It’s A Panel Game!

by Keith Bryant, SMT Today’s Technology Editor

Welcome to the first article in the series … yes this was where I got stuck, not much of a start! My problem is that there are so many Design For ….. titles out there - Manufacture, Assembly, Test, even DFX, so what to choose? Well none of them, design is an important thing, of course, but specification also plays a big part.

There is also the bigger picture which encompasses process and equipment choices, all affect the final product.

So the feature has become bigger than ‘Design For’, it is now all about IP, that is Improving Profits!

De-construction is a buzzword at the moment, everything from food to mobile phone design. So I have de-constructed this series and when you strip away the different layers the basic aim of everything, improved design, easier testing, etc. is all about adding to the bottom line! So welcome to the first article in the series of Improving Profits!

I would like to thank Graphic PLC for their help with this article and future ones too.

I started my journey in this industry at Graphic many moons ago and, returning recently, I was amazed to see so many

familiar faces. I was also amazed to see the complexity of product that is now considered standard production. ____________________________________

‘‘

let’s get rid of a big misconception, printed circuit board manufacturers do not actually make printed circuit boards ____________________________________

First, let’s get rid of a big misconception, printed circuit board manufacturers do not actually make printed circuit boards!

They process and manufacture panels that contain circuit boards, which are cut from the panels as one of the final manufacturing steps. This is key to understanding this article, because it is all about yield from these panels. Put simply - it’s about how much you throw in the bin at the end of the day. Of course, there will always be waste but the customer actually pays for the panel area, not the circuit area, so improving panel yield has a huge effect on circuit

cost. The difference between a poor panel yield of 40% and a good yield of 80% is massive. There are certain manufacturing constraints determining the panel sizes that any circuit board manufacturer will use, some of these are: • The size of the plating tanks and their clamping systems • The distance between the heads of the drilling machines • The size of the multilayer press and its tooling and location system There are others but this gives you an idea, a good board shop will optimise these constraints to ensure efficient use of material around their factory, but there are several factors which affect panel yields that are beyond their control: • Circuit size and shape, obviously • Supplied panelisation, if multi-circuit layout is required • Unbalanced copper on outer layers • Test coupons (i.e. IPC, controlled impedance) Circuit Size and Shape I know that sometimes circuit size cannot be changed but, if you look at this at the base design stage, an efficient size can be chosen up front and fixing holes, boxes, etc. can be designed around it. However, in many cases, small dimensional changes are possible and even these can produce big savings. Squares and rectangles are obviously preferable as the panels are invariably this shape. I have seen many circular printed circuit boards that were not densely populated, so could actually have been made square with locating holes in each corner. If the maths is done correctly, they will still fit perfectly inside the tube and the cost should be much less.

Supplied Panelisation This can save assembly costs so should be encouraged where possible, but it needs some thought too. Most production systems can cope with some circuits on the panel turned through 90

Page 28

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feature continued... and 180 degrees (if L shaped etc.), but inverting them is often a step too far. Also, try to minimise the space between circuits, but leave enough to keep the panel rigid during assembly. You should specify on the drawings if you are happy for the manufacturer to use the outer frame of the panel for their tooling, plating robbers etc. ____________________________________

‘‘

if there are 50 small circuits on a panel and 1 scrap circuit makes the panel scrap then this adds to the costs

____________________________________ Another thing to consider is if you are prepared to accept scrap circuits on the panels and if so how many circuits per panel and how many panels per batch.

Again, if there are 50 small circuits on a panel and 1 scrap circuit makes the panel scrap then this adds to the costs. If you cannot stop components being placed on the bad circuit it may be cheaper to assemble it than throw it away, rather than scrap the panel. These are commercial decisions but need to be considered and, of course, all failed circuits must be clearly marked and not included in yield calculations.

Unbalanced copper on outer layers This is an interesting one and not understood by many people. In PCB manufacture, copper is added to the tracking by electrolytic plating. If the PCB contains fine tracks and ground planes, the plating thickness will vary in each area, too much on the tracks and too little on the larger areas, cross hatching the ground plane areas can help. But often the PCB manufacturer has to add “robber bars” to ensure even and correct thickness plating, this also affects panel size and utilisation.

Test coupons These can be a good idea on high reliability products, controlled impedance and mixed material multi-layers, but they take up space and the testing of them can be expensive. So please think carefully before you ask for them, all good suppliers will process test coupons for their own quality standards and approvals anyway.

Page 30

Some Scary Numbers

Conclusions

IPC is a great Standards organisation and has raised the quality of product in our industry for many years. However, companies need to understand the differences between Class 1 and Class 3 and not choose the release to the highest level just as a safety net. Also it is possible to get products produced in accordance to the standard but not released. This gives you a high quality product without the additional costs of testing. Again it depends on what the board will be used for and so it needs to be an informed decision. IPC requires the coupon shown, to increase in length for each layer, each drill size needs to be included in the coupon. In addition, if it contains buried vias, each via stack needs its own test coupon.

Simply put, start talking to the company chosen to make the volume bare board production right at the start, sort out circuit size and copper distribution, then work with the assembler to look at efficient finished panel sizes. Please remember that a few prototypes can be made from an inefficient design for not a lot extra, but a 20% saving on bare PCB cost, on even a small volume, is a significant saving for your company. ____________________________________

These coupons are on each panel produced and for IPC Class 2, 8 panels have to be fully tested including micro-sections. For Class 3 release, it is 125 Panels!

The most common additional test Graphic does is for impedance-matched designs. They use a TDR (Time Domain Reflectometry) coupon to determine the impedance of specific features. Other test coupons added sometimes are IST (Interconnection Stress Testing) for multilayer structural integrity testing.

There are also a number of Graphic specific in-process test coupons used to monitor key process areas such as etch rate, plating and registration.

‘‘

a few prototypes can be made from an inefficient design for not a lot extra, but a 20% saving on bare PCB cost, on even a small volume, is a significant saving for your company

____________________________________ Unless you really need it do not ask for release to IPC or Mil or any other standard, I recommend the phrase “make in accordance to ……..” to be included on the order. This gives the quality without the onerous additional waste of material and cost of testing loads of coupons. There will still be test coupons, micro-sections and other tests performed, but at the level required by the bare PCB manufacturer to satisfy their Quality System.

| MAY 2014 ISSUE

Precision and Reliability You Can Count On • 17,100 CPH Chip (Laser Centering/IPC9850)

KE-3020V High-Speed Flexible Mounter

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Flexibility and Quality You Can Trust.

Supporting our customers with the largest and most experienced service group in the Americas.

Global Headquarters

Tokyo, Japan Tel: (+81) 3 3480 1111 Email: inqsmt@juki.co.jp

American Headquarters Morrisville, NC, U.S.A. Tel: (+1) 919 460 0111 Email: sales@jas-smt.com

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Solothurn, Switzerland Tel: (+41) 32 626 29 29 Email: info-europe@jas-smt.com

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www.jas-smt.com

MW/JA/31/Juki_April2014-SMT-Today.indd 1

4/15/14 11:07 AM

new products exciting new industry innovation Keeping you informed of the latest developments in technology and innovation within our global electronics industry.

Metcal Debuts New Features on Scorpion Rework System Metcal recently unveiled brand new features for the Scorpion Rework System, including an Automatic Placement Package capable of 50mm of motorized travel in the Z-axis and a full 360° in (Theta). The Automatic Placement Package offers fine motor control in the Z-axis and during alignment of the component to the pad. The company will also introduce a new force feedback control during the placement process, enabling the unit to accurately pick and place components without disturbing the component or solder.

Juki Releases New RP-1 Automatic Screen Printer Juki Corporation introduces the RP-1 Automatic Screen Printer. The printer achieves high-accuracy positioning of ±10 μm and high-speed printing within six seconds plus printing time.

The RP-1 high-speed and high-precision printer is equipped with the Motion Screen feature that automatically corrects the printing position by moving the screen. HighSpeed Cleaning and an Automatic Solder Dispenser are also available as options.

The Scorpion Rework System is also now available in a Mobile version with a 1080p, high definition, camera system that enables the operator to align and position components accurately before placement.

This version is ideal for use with smaller packages commonly used in mobile devices up to 25mm x 25mm. New digital controls have also been implemented to control the light levels of both the top and bottom LED lighting modules.

Now standard on all Scorpion Rework Systems, Metcal has added a new polarized filter feature. New upgrade kits, including a Side-View Camera, Contactless IR Sensor, and Thermal and Airflow Calibration Kits are also available.

With the Hioki UA1780 Fit-Line Software application, users can generate highquality test data even without PCBs. The software supports the newly debuting Hioki FA1240 platform with simple, intuitive Windows 7 based operation.

Additionally, the new UA1780 FitLine software application uses Gerber data files rather than CAD, which can sometimes be difficult for customers to obtain, if not non-existent. Key features include component libraries as well as reverse net generation, providing valuable component connectivity information and empowering the customer to create highly efficient test programs. The Hioki UA1780 Fit-Line application is backwards compatible with the previous generation Hioki 1240 Flying Probe Testers. ____________________________________

BTU Lowers Operating Costs with ENERGY PILOT

The Automatic Solder Dispenser keeps the volume of solder paste on the screen at a constant and minimum necessary amount. This prevents smears and smudges, reducing mounting defects drastically. Additionally, the HighSpeed Cleaning feature utilizes a blade to quickly wipe away solder from the bottom of the screen.

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UA1780 Fit-Line Inspection Data Creation System from Seika Supports the New HIOKI FA1240 Flying Probe Tester

ENERGY PILOT is a feature in the latest release of BTU’s windows-based WINCON™ operating system.

The ENERGY PILOT saves manufacturers money whenever the oven is idle.

Standby mode can save more than 25%. Sleep mode can be used for longer interruptions saving over 40%. Long idle periods fully shut down the oven using

| MAY 2014 ISSUE

V810 SEries

Advanced 3D X-ray inspection (AXI) Superior AXI Solution for SMT Line.

Highly Compatible with X6000 & 5DX

V510 G2 Series

Advanced Optical Inspection (AOI) A One Stop Solution for SMT Line.

ViTrox designs and manufactures innovative, leading-edge and cost-effective automated vision inspection equipment and system-on-chip embedded electronics devices for the semiconductor and electronics packaging industries.

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new products continued... hibernate mode. Recovery times are minimized using remote product sensors and SMEMA. Operation is fully automatic and results in an overall reduction in electrical, air and nitrogen consumption.

The feature is easily upgradeable on older BTU reflow ovens.

The INTELLIMAX furnace controller and WINCON operating system have been powering BTU ovens and furnaces for the past decade. Together they provide precise control, powerful analytical tools, and intuitive interface, all designed for the harshest industrial environments. The latest INTELLIMAX2 and WINCON 6.1 are available for upgrade on most BTU systems in the field. ____________________________________

Count On Introduces PB Swiss Tools’ VDE-design Torque Tools Excessive torque can cause damage while insufficient torque can pose a safety risk. In electrical work, it is extremely important to be able to control the tightening torque for screws. As a result, the Torque tools with MecaTorque VDE design have been added to the ElectroTool series, guaranteeing safe and controlled tightening of the screws for all electrical work up to 1000 V AC/1500 V DC. The blades are secured in the handle and are not removable like other Torque tool models. This allows them to be coated for safe work on electrical devices.

The PB Swiss Tools MecaTorque VDE series is available in Phillips (#1 and #2), Pozidriv (#1 and #2), Phillips/Slotted (#2) and Pozidriv/Slotted (#2) sizes. The fixed connection of matching blade and handle guarantees a high degree of safety at work.

The MecaTorque VDE torque range can be adjusted as required with easy recalibration using a standard testing device.

All of the torque handles are supplied with test certificate ±6 percent according to EN ISO 6789. PB Swiss Tools offers a warranty of three years against manufacturing.

With more than 130 years of experience, PB Swiss Tools is a global leader of hand tools manufactured for use in the industrial marketplace, even for the most hazardous jobs. All PB Swiss Tools are 100 percent Swiss-made and come with an unlimited lifetime guarantee. Work with the best.

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Sono-Tek Corporation Releases Next-Generation Ultrasonic Generator

• Graphic user interface with intuitive wheel encoder enables full on-screen control of all functions

Sono-Tek Corporation (OTC BB: SOTK) is pleased to introduce its nextgeneration ultrasonic generator. The ECHO ultrasonic generator is designed for the highest degree of accuracy and control of ultrasonic spray processes using Sono-Tek ultrasonic nozzle technology. ECHO provides the highfrequency electrical energy required to operate all frequencies of Sono-Tek ultrasonic nozzles. As with the SonoTek standard broadband ultrasonic generator, the ECHO automatically locks onto the ultrasonic nozzles’ operating frequency with phase-lockedloop technology.

• Uses advanced phase-locked-loop control technology to automatically lock onto a nozzle’s optimal operating frequency

The ECHO offers a multitude of connectivity inputs and outputs, triggering capabilities and fine-tuning spray controls, including the users’ choice of load leveling or power leveling mode for the greatest repeatability of spray possible. Some other advanced features of the ECHO generator include: • New load leveling feature automatically compensates for changes in flow rate and liquid characteristics such as viscosity, resulting in the most stable spray characteristics and consistent drop sizes • Power resolution of .01 Watts – valuable for applications such as medical coatings that require a high degree of control • Operates over a frequency range of 25 - 250 kHz (frequency is user selectable through the display interface for any Sono-Tek ultrasonic nozzle)

| MAY 2014 ISSUE

• ±4 percent accuracy allows for increased repeatability and faster response time The ECHO’s modern digital LCD display of parameters and extreme accuracy over full power range make it a phenomenal upgrade to current users of the broadband ultrasonic generator, and the ECHO’s flexible connectivity and userfriendly interface make it a breeze to set up for users who are new to Sono-Tek’s ultrasonic technology.

“The new ECHO generator is a gamechanging technology for long time users of Sono-Tek ultrasonic spray systems and first time users alike,” says Steve Harshbarger, Sono-Tek’s President. “This product will allow users to enhance their spray processes and improve efficiency and repeatability more than ever before.”

Sono-Tek ultrasonic spray systems are proven in a wide range of precision spray applications worldwide, including implantable medical device coatings such as stents, printed circuit board spray fluxing, solar and fuel cell manufacturing, and glass, food and other industrial coatings across any width production lines. Sono-Tek’s environmentally friendly ultrasonic spray systems feature up to 80 percent reduction in spray material, and dramatic reductions in waste and energy consumption.

Engineered Material Systems Introduces 535-10M-49 UV Cure Adhesive 535-10M-49 is an ultra-low stress, low shrinkage, ionically clean, low glass transition temperature UV cure adhesive.

The material is designed to eliminate any warpage of components in disk drive assemblies, lens bonding in camera modules, chip encapsulation in smart cards and a variety of general bonding applications in photonics assembly.

platform validates the overall variables associated with component placement and solder paste printing. Combining both inspection capabilities within one platform, the LineMaster DM detects absence/presence, polarity, OCV, misalignment, RDI and solder joint inspection for AOI and the most accurate and repeatable true 3D volumetric measurements for SPI. Features include real-time SPC, customized data reports, offline CAD/Gerber programming and a defect repair station, all wrapped together with an affordable price tag similar to purchasing both inspection capabilities for the same price as one solution alone. ____________________________________

This new non-conductive UV cured adhesive cures rapidly when exposed to high intensity UV light. 535-10M-49 is a low outgassing, extremely flexible, high strength epoxy adhesive that does not contain antimony.

535-10M-49 was developed to pass the rigorous reliability requirements in micro-electronic assembly applications.

It is the latest addition to Engineered Material Systems’ extensive line of electronic materials for semi-conductor, photovoltaic, circuit assembly, printer head, camera module, disk drive and photonic applications. ____________________________________

ASC International Releases New Dual Mode Inspection Platform “ASC is very excited about the recent release of the LineMaster DM,” said Steve Arneson, ASC’s National Business Manager. “All indications from our current customer base have pointed towards an immediate acceptance for this “Dual Mode” capability. The long time internal battle of manufacturers trying to decide which technology provides the most value add to the production process has now been eliminated. By incorporating both technologies into one affordable solution, manufacturers can realize significant cost savings through the implementation of the LineMaster DM.” The new LineMaster DM incorporates SPI and AOI into one platform for “Dual Mode” performance. The solid AOI/SPI

cleaned. Many users have found that their conventional cleaning systems are 8090% effective, leaving the smallest, most sensitive apertures partially occluded.

Using the Gensonic these apertures can be cleared and renewed. This system is effective as a localised cleaner, applied during the print cycle while the stencil is in the printer, preventing expensive and time-consuming shutdowns required to clean problem apertures.”

With more than 5,000 users worldwide, the Gensonic is a system that should be on everyone’s production line.

Also available in Gen3’s manufactured product line is the Ionic Contamination Systems, also known as the CM Series, Dip and Spray Coating Systems, Wizard Thermal Profiling, SIR and CAF Testing Systems, Solderability Testing, Solder Dross Recovery and Solder Paste Inspection. ____________________________________

Gen3 Systems’ Revolutionary Cleaning Technology The Gensonic Stencil Cleaning System, which received the European Product of the Year award at Productronica 2013, is a manually operated ultrasonic transducer unit for cleaning stencil apertures.

The Gensonic can be used either in conjunction with our Stencil Cleaning Centres or it is portable enough to be taken directly to the printer, thereby greatly reducing production downtime and printer resetting.

The key features of the Gensonic System are: • Safe and simple to use • No risk of stencil damage • Typical 3-minute cleaning cycle • Suitable for both stainless steel and plastic stencils • Cleans solder paste or SMD adhesives • Accepts both foils and framed stencils Dr. Beverley Christian of Blackberry quoted in a technical paper titled ‘Cleanliness of Stencils and Cleaned Misprint Circuit Boards – Précis,’ “Solder pastes, especially lead-free pastes tend to become compacted and trap particles, blocking fine apertures and deforming aperture corners. Using proven industry cleaning solution and the Gensonic ultra-sonic transducer directly on the stencil, even the smallest tightest pitch apertures can be cleared and perfectly

Nordson YESTECH Debuts FX-940 Inline PCB Inspection System with 3D Inspection Capability Nordson YESTECH’s advanced nine megapixel color camera imaging technology offers high-speed PCB inspection with exceptional defect coverage. With one top-down viewing camera, four side-viewing cameras and 3D inspection, the FX-940 inspects solder joints and verifies correct part assembly, enabling users to improve quality and increase throughput.

Configurable for all line positions, the FX940 is equally effective for paste, pre / post-reflow and final assembly inspection.

Fast and intuitive off-line programming maximizes machine utilization and realtime SPC monitoring provides a valuable yield enhancement solution.

The FX-940 utilizes a standard package library to simplify training and ensure program portability across manufacturing lines. Advanced Fusion Lighting and newly available image processing technology integrates several techniques including 3D inspection, colour inspection, normalized correlation and rule-based algorithms to provide complete inspection coverage with an unmatched low false failure rate.

The Advantages and Disadvantages of Vapour Phase Soldering

by Patrick McWiggin, Technical Director, SolderStar Ltd

In the beginning of SMT, Vapour Phase Soldering was the preferred re-flow soldering technology for a number of reasons including its excellent heat transfer capabilities and its ability to heat large masses evenly and quickly whilst the peak temperature is controlled. However there were some disadvantages like fast temperature rise and nearly no influence on the temperature profiles.

To combat these process challenges, SolderStar developed a new profiling system designed specifically for Vapour Phase machines. The latest evolution of Vapour Phase machines now offer much more user controlled soldering, the main advantages of a vapour phase system such as fixed peak temperature remain, but freely adjustable temperature gradients and profiles are now possible, automatically controlled time above liquidus and a perfect automatic inert gas atmosphere.

The original ‘dream’, sold by the manufactures of vapour phase soldering machines, was that profiling was not needed. The reality of course in production is ‘You Can’t Manage What You Don’t Measure’. Because of this, SolderStar developed a solution that gave users the ability to understand and control the production process and quality.

Machine Types and Profiling Methods There are several machines that benefit from SolderStar thermal profiling, one being medium size production machines.

These are batch based and the PCBs are loaded into the basket. The basket then moves through the machine and enters the Vapour Phase chamber for preheating and soldering and exits again once complete.

This style of machine is harder to profile as some have internal thermocouple ports internally wired to the outside world. An external profiler can be used to capture the profile, although this is more difficult and not ideal for daily production testing.

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These machines can also come with a vacuum stage. If this is employed, the soldering stage uses a sealed chamber and it is not possible to get wires inside. A true pass through profiler is needed, this is where SolderStar’s system comes into its own. ____________________________________

‘‘

This style of machine is harder to profile as some have internal thermocouple ports internally wired to the outside world

____________________________________ Another machine process is in-line, these are much more difficult to profile with long wires in the same way a long conventional re-flow oven is not profiled with long wires, they snag and the results are not always accurate. Again, if vacuum is employed you cannot use long wires.

The SolderStar PRO - VP system allows users of batch and, in-line vapour phase soldering systems to fully profile their products in the same way as a conventional re-flow machine. The system includes the SolderStar PRO data-logger combined with a sealed light-weight heat shield capable of operating in the pre-heat, vapour re-flow and vacuum stages of the machine. Once data capture is complete the heat shield can be opened and the data logger removed, allowing rapid cool down cycles and minimising the risk of overheating the profiling unit.

SolderStar’s product has an external data logger with long wires making them a perfect choice for manufacturers with different soldering processes, wave etc. as one data logger does it all. There is also added ‘down the wire’ logging capabilities, via a USB connection, with live data which can be viewed by the engineer as the PCB

passes through the machine. The pass through profiling unit is SolderStar’s main unit and is the only way to profile machines with vacuum stages, and really is a far superior method for any Vapour Phase machine, other than laboratory machines.

The Profiler’s Enemy - High Thermal Transfer!

Because of the use of Galden vapour in the machines, the thermal transfer is very high compared to a conventional re-flow oven, and subsequently the thermal protection of the data logger is paramount to survive overheating. The vapour must also not be allowed inside the profiling unit as it will ultimately damage the electronics and insulation used. As vacuums are employed the problems increase. The system must also be able to withstand any pressure difference seen in the process.

There are two approaches to this problem:

The 1 box approach A data logger electronic PCB inside a sealed box.

Advantages – it is physically smaller.

Disadvantages - as it is perfectly sealed to withstand the vacuum, needs to be strong and hence thermal mass/weight is high.

When it exits the machine it is very hot.

As the unit is sealed and if it is simply left it will continue to heat and damage the battery and or electronics. Force cooling is needed such as a water bath or similar.

| MAY 2014 ISSUE

SolderStar’s Conclusion to the Internal Testing 1.

Thermal performance is adequate for most vapour phase processes, with the original spec. of 250C for 9 minutes likely to be achieved.

2. New ‘O’ ring provides sufficient seal 3. Both the red and green traces almost exactly overlay in the ramp up and peak stages, The ramp up slope and time are the same with the system inside and outside the barrier.

The 2 box approach data logger is used that can be separated from the protective shield when it exits the machine.

Advantages – better protection thermally and has rapid cool down. Only one calibrated unit is needed each year, rather than multiple units.

Disadvantages - It is physically larger.

Most engineers are concerned that the measurement instrument being in the process will take energy away from the vapour cloud and affect the measurement and not be a true reflection of the PCB profile.

SolderStar’s approach to the problem of ‘physically larger’ was to look laterally at the problem. The actual problem is the thermal mass of the object. They produced a ‘thin’ wall protective shield which has a large surface area, but exceptionally low thermal mass. The lightweight skin of the shield heats rapidly, and once up to temperature the condensing on the shield is minimal.

SolderStar undertook internal testing of the system on an Asscon Quicky 450.

The test was done using the smallest scale machine. It allowed a profile to be captured with long wires, so no instrument in process chamber, and then with the instrument inside.

The purpose of the test was to; 1. Further validate the thermal performance of the new VP heat shield 2. Perform a ‘leak test’ evaluation of the new ‘O’ Ring seal 3. Monitor any effect of the thermal shield on the process

The vapour energy within a machine like the Quicky, is less than the machines this profiling system is likely to be used within.

The light weight shield is heated rapidly and energy thermal absorption minimised, at no point did the vapour ‘collapse’ and the process be impacted.

The SolderStar system has been proven not just through in-house testing, but also through use by manufacturers, including Rehm and IBL. Real-time telemetry Another technology that had to be investigated, was real-time telemetry that could reliably function within the vacuum stages of the process. To see the profile in real-time is difficult in any industrial machine as the RF energy is greatly attenuated by the metalwork. SolderStar’s approach was to use a system that has ‘mesh networking’ technology which is ‘self-healing’ and reliable with a network/data link. It allows routers/ repeaters to be used to relay the signal in machines where other systems would not work. As no signal is 100% guaranteed they employ an intelligent ‘2 way‘ protocol, if a ‘dead spot’ is encountered, the data logger buffers the data then offloads once the link is re-established.

Conclusion Vapour Phase soldering has become competitive for high volume productions.

State-of-the-art machines offer high throughput in combination with high quality results. The vapour, like all gases, is tending to equally fill out a given sphere, such as a Vapour Phase process chamber.

The equal temperature distribution over the boards is automatically provided by this physical effect, while in a convection oven the cross profile can vary in temperature. The physical limitation of the maximum temperature in a vapour phase system does not require further controlling mechanisms to avoid overheating. This feature provides the highest benefits in long-term reliability of the soldered electronic boards. In a convection oven the creation of temperature profiles needs thorough preparation, overheating cannot be securely avoided.

The excess heat needed to ensure a perfect solder result, in vapour phase soldering, is only 5°C to 10°C over the melting point of the solder paste. Other re-flow methods require 30°C to 35°C excess heat for the same task due to its lower heat transfer rate.

Lower soldering temperatures limits the stress for components, avoids delamination on PCB substrates and reduces the risk of popcorning. The vapour phase process provides an oxygen free atmosphere leading to the best possible wetting. The energy consumption is lower than convection as the energy remains in the hot liquid. Optimised insulation reduces the introduction of heat into the surroundings and thus enables the saving of all conditioning costs in the plant.

Considering today’s and future complex components and processes, vapour phase is a perfect choice.

Industry News Keep up to date with what’s new With each issue we’ll keep you up-to-date with the latest industry news from around the globe.

recognizes an IPC member company in the electronics assembly industry that has taken the initiative to actively contribute to enhancing the industry while demonstrating support of IPC though participation in technical and/or management programs.

along with financial terms that can make a positive impact on their bottom line,” said Michelle Ogihara, Senior Sales manager, SMI. “We look forward to a thriving relationship with Marlin Business Services Corp. and Union Bank.”

STI Electronics has been an IPC member since 1985 and, although a small-sized EMS company, has had a big impact on IPC. Nearly all of its staff members are active with IPC, with six employees actively engaged in dozens of standards development committees. Additionally, the company has several IPC specialists in its CM and Engineering Division as well as a multitude of certified trainers. A leader in the industry that is always helping set the bar high, STI Electronics served as a primary development partner for IPC’s Certification Quality Initiative that was launched in 2013.

Marlin’s wide range of flexible financing options available to customers is accessible, affordable and delivered promptly with credit decisions made within hours.

“Union Bank is excited to facilitate the alliance with Marlin and Seika Machinery as Marlin provides customized financial solutions and streamlined financing for Seika’s customers,” said Union Bank Vice President and Program Manager Paul Knowlton. ____________________________________

____________________________________

Marlin Business Services Corp., Union Bank And Seika Machinery, Inc. Launch New Financing Program STI Electronics, Inc. Receives IPC Stan Plzak Corporate Recognition Award STI Electronics, Inc., a full service organization providing training services, electronic and industrial distribution, analytical and failure analysis, prototyping, and small- to medium-volume PCB assembly, was bestowed with the highest corporate honor during a luncheon at the IPC APEX EXPO®. IPC – Association Connecting Electronics Industries® presented STI Electronics with the IPC Stan Plzak Corporate Recognition Award.

Named after a former IPC Board Chairman who was a founding member of the Electronics Manufacturing Services Industry Management Council, the Stan Plzak Award

Page 38

The strategic alliance facilitated by Union Bank will enable SMI’s customers to quickly and cost-effectively acquire the latest advanced machinery, including SMI’s line up of new inspection equipment, quality assurance products, surface mount technology and green technology. It will also enable Marlin to grow its presence in this industry segment.

“Marlin is proud to partner with SMI and offer an attractive and convenient financing program to their customers,” said Allen Snelling, Marlin’s Vice President, National Account Sales.

“We look forward to supporting SMI’s machinery sales as the U.S. manufacturing sector continues to expand.”

“We are pleased to offer our valued customers the combined benefits of acquiring superior advanced machinery

| MAY 2014 ISSUE

OK International Closes on Minority Investment in 3D Printing Company OK International announced that it has closed on a minority investment and product development agreement with 3D printing company TierTime Technology Co. Ltd of Beijing, China. OK International also announced that it has launched Quant 3D, a new brand focused on 3D printing for the professional and industrial markets. The Quant 3D brand will encompass both bench top and industrial 3D printers for prototyping and manufacturing applications.

The investment in TierTime aligns with OK International’s strategic focus to develop innovative and industry leading products for the industrial and commercial manufacturing markets. In addition to the Quant 3D bench top printers currently available, the two companies entered into a technology agreement to co-develop a line of 3D industrial printers that are scheduled to be launched later this year.

“We are very excited about this investment in TierTime Technology, which represents OK International’s entrance into this rapidly growing segment which some industry experts predict will grow 17% annually over the next several years,” said Christopher Larocca, President of OK International.

“TierTime is a technology leader in the 3D printing market and provides a strong platform for our 3D printing business.

By leveraging our expertise in thermal management and material dispensing, we intend to develop and market a broad line of industrial printers across multiple 3D printing technologies.”

According to a recent market report, published by Transparency Market Research, the global 3D printing market reached US$2.2B in 2012, and is expected to exceed US$7.2B by 2019, growing at a compound annual growth rate of 16.8% from 2013 to 2019. ____________________________________

Libra Industries Names Juki Its Strategic Partner of the Year Libra Industries, a privately held electronics manufacturing services provider, announces that it recently presented Juki with its first annual Strategic Partnership Award. Rod Howell, Libra Industries’ President, presented the award to Bob Black, President & CEO of Juki Automation Systems, in the Juki booth during the recent IPC APEX EXPO. Libra Industries and Juki have been working together for more than 25 years. Today Libra Industries runs four Juki lines in its Ohiobased manufacturing facility. Libra Industries selected Juki for the first award because of the attentive, consistent customer service it has received over the years.

“Juki provides over-the-top customer service,” commented Howell. “They are one of the most, if not the most, user-friendly and responsive strategic partners we have

ever dealt with. Between Bob Black with Juki and Dave Trail with Horizon Sales, if Libra needs something – even if it is outside of their offering – they make it happen.”

Black commented, “All of us at Juki really appreciate the recognition given to us

by Libra Industries. They have been a fantastic customer for more than 20 years and we really appreciate their loyalty to Juki. We look forward to supporting the continuing growth of their business in the years to come.” ____________________________________

First Meeting of NEPCON 2014 Advisory Panel Held in Shanghai The first meeting of the NEPCON 2014 Advisory Panel was recently held at the offices of the exhibition organizers, Reed Exhibitions Shanghai. The five Advisory Panel members – Jian Zhu, Director, Alcatel Shanghai Bell; Zhaochen Huang, VP, Production, UT Star; Fred Fong, Senior Consultant, Powertech Industrial (former Technology Director, Asia-Pacific, Jabil Circuit); Edward Tung, Managing Director, East West Group, former VP and GM, Flextronics Technology); and Haley Fu, Managing Director, AP, iNEMI – met for discussions with Thomas Huang, Assistant VP, Reed Exhibitions; Morris Dong, Project Director of NEPCON China, South China, and West China and Lewis Tang, Marketing Director, Reed Exhibitions.

The Panelists talked about the development of the Chinese electronics industry, future trends, marketing opportunities/challenges, participant invitations and complementary activities like forums, keynote speaker nominations, and more. These topics related to the entire NEPCON series of events in China (NEPCON China, NEPCON West China,

and South China). The talks were highly constructive and yielded a number of interesting insights on several key issues.

The organizers of the NEPCON China series, Reed Exhibitions, should be congratulated for the scope and reputation of the shows they have built up in China,” said Mr. Jian after the meeting.

“The establishment of the Advisory Panel is a testament to the hard work Reed has done, and continues to do, to make the series a consistent and outstanding success.” NEPCON has achieved great results in the industry,” added Mr. Fong. “It is renowned within electronics manufacturing for providing insights into the future development of the industry, while perfectly matching the needs of visitors to those of participating exhibitors, and vice versa.”

“The Advisory Panel meeting was a great success,” said Mr. Dong. “The Panel provided us with some very useful information on how we can enhance the organization of the NEPCON series of events in China. These were highly beneficial to us and enhanced our understanding of new industry developments. I found the key messages delivered by the Panel members really inspirational. We are very pleased to have access to the full expertise and experience of such esteemed industry professionals. Further, we are confident that, with their input, we can continue to deliver powerful events for the electronics manufacturing industry.”

Since 1982, when NEPCON was first introduced to China, the series has grown into the leading event in electronics manufacturing to offer a combination of global resources and local talent support.

It is the only event officially backed by the Ministry of Industry and Information Technology (MIIT) and the Surface Mount Technology Association (SMTA).

industry news continued...

“We have been very pleased to enjoy a pattern of positive developments and sustained growth over the last few years in the Americas,” stated Robert Conway, on behalf of the Board of Directors of Parable Trust Limited. “We have been receiving excellent customer service feedback, and we recently installed the largest order in the history of our group in the Americas.

As with all of our strategic regions, the Americas supplied significant influence toward our recent ‘2014 Global Flexible SMT Company of the Year’ Award from Frost and Sullivan.”

Mictrotek Laboratories to Open European Test Lab at Gen3 Systems’ Facility The European Test Lab will be located at Gen3 Systems’ facility in Farnborough, UK. Graham Naisbitt will be the Operations Director - Europe.

“The new facility will be fully ISO 17025 qualified and brings together, for the first time in Europe, the most comprehensive test capability for the electronics industry,” commented Naisbitt. “In addition to providing test results and data interpretation, Microtek provides specialised client services such as failure analysis and test program development.

Our technical staff will produce customized test programs that aid in identifying the cause of manufacturing problems. Microtek can also assist in mediating and resolving customer-supplier disputes.”

In conjunction with the opening of the new European Test Lab, Gen3 Systems will merge its Test Services division. Initially this will involve SIR, ECM and CAF testing, Solderability, Cleanliness and Materials Characterisation test services, and will strongly link to the new Microtek Laboratories, East Coast lab in Baltimore MD. ____________________________________

John Perrotta Promoted to President of Europlacer Americas’ Europlacer, a manufacturer of marketleading flexible SMT placement machines, announces that it has promoted John Perrotta to President, Europlacer Americas’, with immediate effect.

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“It is clear that there has been significant improvement in our delivery and that our value proposition is well received.

We continue to invest in our customers and expect to see growth in revenue and market share in the coming years,” continued Mr Conway.

these positions, we had the right people for the job already in the organization,” commented Charles Scott, President and CEO. “Both Blair and Steve have a diverse background in operational and management roles that will help us continue the high standard of service and commitment that we provide to our customers.”

The recent changes will support the company’s ongoing effort to strengthen its core services and capabilities. Computrol continuously invests in versatile, high-speed manufacturing equipment and technology, as well as continuing training programs for employees. Computrol has a long history of providing electronics contract manufacturing services and support to bluechip customers ranging from military and medical electronics, to telecommunications and computer peripherals.

____________________________________

____________________________________

Computrol Announces Several Promotions

Speedprint Appoints Manufacturers’ Representative for the Mid-Atlantic

Computrol, Inc., a world-class provider of mid- to low-volume, high-mix electronic manufacturing services to OEMs, announces several internal promotions.

Charles Scott III has been promoted to president of Veris, a part of the Armstrong International family (Computrol’s parent company). As a result, Computrol has promoted Blair Carpender to general manager at the Orem, Utah facility. Also, Steve Dillon has been promoted to production manager at the company’s Meridian, Idaho office.

“It is great to have such talented and experienced people on our team at Computrol so that when we needed to fill

| MAY 2014 ISSUE

Speedprint Technology announces the appointment of Production Solutions Associates as its newest manufacturers’ representative.

Production Solutions Associates will represent Speedprint’s leading-edge stencil print technology throughout Maryland, West Virginia and Delaware.

“I am very pleased to add Production Solutions to the existing team of professional Speedprint representatives,” commented Mark Brawley, Speedprint VP. “Dale is well entrenched in his territory and I look forward to working with him to spread the Speedprint value proposition to his customers.”

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industry news continued... confidence the Nordson Corporation has in Nordson DAGE and this Research and Development facility.”

Phil Vere, President of Nordson DAGE, added further, “Excellence of our engineered products is at the core of Nordson DAGE’s success. This is a large R & D investment and will provide the platform for the growth into new markets and applications.”

Left: Sir Bob Russell, MP Right: Joseph Stockunas

____________________________________

Nordson DAGE Expands into New Research and Development Facility

Mr. Stockunas commented, “This Nordson DAGE Research and Development facility is a key component of the growth expectations for Nordson and a centre of collaboration for its market leading Bond Test and X-ray inspection products, all of which have been created from the ideas developed here. This site provides opportunities for us to grow to the next level as a Company and this investment confirms the level of

Page 42

Walkos graduated from Kent State University with a Bachelor’s of Science in Aerospace Technology degree and John Carroll University with a Master’s in Business Administration.

He attended the ABB Executive Management Development Course at the Fuqua School of Business at Duke University and has his Six Sigma Green Belt. ____________________________________

BALVER ZINN Grants Sub-License to Estaños & Soldaduras Senra, S.L.U.

Joseph Stockunas, Group Vice President, Advanced Technology – Electronic Systems, together with invited dignitaries and guests, attended the official opening by Sir Bob Russell, Member of Parliament for Colchester.

The move to the new location in Phoenix Square, Colchester, had been planned in line with new R & D programs with subsequent headcount expansion to further drive Nordson DAGE’s Bond Test and X-ray product development programs.

The move has doubled the space and added important capability including a new clean room facility. The Nordson DAGE Research and Development team have already accumulated many patents for their innovative, market leading products and this move will allow acceleration of future developments to meet the exacting demands of our Bond Testing and X-ray inspection customers. Examples are the newly launched XM8000 Wafer X-ray Metrology system that leverages Nordson DAGE’s unique X-ray technology for fully automatic semi-conductor wafer measurements and the 4000 Optima Bondtester, both of which are used as an integral part of the fabrication and packaging of integrated circuits or, as part of quality control and product acceptance.

while building long-term vendor relationships.

He will ensure that Libra Industries’ supply chain strategy and execution is conducted in a world-class manner to achieve best-inclass performance.

BALVER ZINN today announced that it has granted a sub-license to Estaños Senra S.L. for the popular SN100C® alloy patented by Nihon Superior Co. Ltd. for manufacturing and sales throughout Spain.

Estaños & Soldaduras Senra, S.L.U., with more than 25 years’ experience, is one of the leading Spanish alloy manufacturers of tin-silver alloys, tin-copper, high silver content filler rods, copper phosphorus rods, as well as a complete line of flux, for the mentioned products.

Libra Industries Expands Management Staff Libra Industries, a privately held electronics manufacturing services provider, announces that Joseph Walkos has joined its management staff as the Supply Chain Manager. He will be in charge of the supply chain and stores, reporting directly to Jen Altstadt.

Walkos joins Libra Industries from SaintGobain Corporation, where he held a managerial position that was responsible for purchasing, planning, inventory control, MRP processes and logistics. He has extensive leadership in supply chain holding management positions with Steris, ABB, Danaher and Pioneer-Standard Electronics.

In his new role at Libra Industries, Walkos will manage the supply chain functions and develop the processes and systems necessary to achieve desired cost, profitability and customer service objectives

| MAY 2014 ISSUE

“We believe in continuous improvement and with granting the sub-license to Estaños & Soldaduras Senra, S.L.U. we are another step forward with SN100C®, stated Josef Jost, President of BALVER ZINN. “We welcome Estaños & Soldaduras Senra, S.L.U to our team and we look forward to strengthening our relationship in this important region.”

Sublicensing is an important step to ensuring the known quality of SN100C®.

Not every producer can guarantee a process that is constant and clean. To ensure the right microstructure of the alloy SN100C® for solder wires, bars and at least long-term solder bath stability, are several necessary process steps.

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NEW UK 2014

by Keith Bryant, SMT Today’s Technology Editor

OK, so it is not NEW anymore as it is in its 7th year, but National Electronics Week UK held at the NEC Birmingham is the only Electronics Manufacturing focussed event in the UK. The location is very central with great road and rail links and also very close to an airport. In fact, it is the only exhibition I visit in the world which is a very short walk from a main line (not underground) rail station and an International airport, so the location is great. ____________________________________

Despite being a ‘‘ mainly UK show I

met visitors from Holland and France, all saying how easy it was to get there

____________________________________ Despite being a mainly UK show I also met visitors from Holland and France, all saying how easy it was to get there, but they had not spent 1 hour in stationary traffic on the M6 motorway that morning!

A 3-day event, it opened with a queue for registration, which is always good to see. From 11.00 am until 3.00 pm it was a very busy day, with lots of traffic in the aisles and stands full of people. As day 2 is normally the busy one the exhibitors left after day 1 happy with the day and with great expectations.

Day 2 was as busy as day 1 if not more so, however the SMART Group and NPL seminar area ran at standing room only for all the Cleaning and Coating presentations on both days.

Page 44

This feature area was well supported by suppliers and very well attended throughout the whole show, lots of time was spent demonstrating equipment and chatting to visitors about issues they had. I firmly believe areas like this and even events with a technology focus, are the way forward in engaging with potential customers. I’ve noticed that the successful equipment suppliers are focussing on this type of event and reaping the rewards. ____________________________________

lots of time ‘‘ was spent

demonstrating equipment and chatting to visitors about issues they had

____________________________________ After day 2 there were a few long faces where the expectations after day 1 had not materialised, but all agreed it was a good 2 days and the quality of the visitors was excellent.

Mike Nelson of ETEK Europe said, “This how is a key part of the UK calendar and we are confident that from the enquiry level so far it will be a success”.

Day 3 was always going to be quieter as last days tend to be, but it was still busy and exhibitors went home happy, feeling it was value for money. The visitors that I spoke to were a little disappointed that there were not many new and exciting exhibits but understood that this is really a regional event. They were happy with the location, the number and variety of the exhibits and the interactions with exhibitors. One or two remarked that they would like to see more feature areas and places where they could get unbiased advice. ____________________________________

The visitors ‘‘ that I spoke to

were a little disappointed that there were not many new and exciting exhibits but understood that this is really a regional event

____________________________________ In summary NEW UK 2014 was a good event for visitors and exhibitors. Alan Colquhoun from BAE Systems said, “We have a good number of leads for our contract manufacturing business and have talked with many potential customers”.

So let’s hope that business in the UK and Europe continues to blossom and NEW 2015 is even more of a success an all fronts.

| MAY 2014 ISSUE

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Competition Raises Standards

by Keith Bryant, SMT Today’s Technology Editor

The IPC Hand Soldering Championship was held at IPC APEX a few weeks ago and was very high profile at the show.

From a personal perspective this was good to see. In a world full of high tech equipment, working with our hands is a skill often overlooked, but it continues to be a key focus for the IPC. As the acknowledged leader in global quality and manufacturing standards running Hand Soldering Competitions shows a real commitment to the basics.

Today I am writing this on the SMART Group and NPL Cleaning and Contamination feature area at the National Electronics Week UK show and dropping in to the first UK heat of the IPC competition. Again a competition excellently run with very experienced IPC Trainers doing the judging and Lars Wallin managing the event. ____________________________________

‘‘

excellently run with very experienced IPC Trainers doing the judging and Lars Wallin managing the event

____________________________________ A good number of competitors entered and support from the UK industry was superb, so it was a great success, a good sign for the first one.

____________________________________

‘‘

running Hand Soldering Competitions shows a real commitment to the basics

____________________________________ IPC APEX brought together the winners of the regional heats which included people from India, China, Singapore and Europe, a true global event. The atmosphere was friendly but competitive and all the contestants enjoyed the whole occasion.

Page 46

would be representing the UK in the World Final at APEX US next year.

All of the event sponsors were happy and I was pleased that SMT Today was Media Sponsor for the event and am sure we will be partnering with the IPC here next year. ____________________________________

PC Hand Soldering ‘‘ Competition will make its next stop in Russia

____________________________________ In its ‘World Tour’, the IPC Hand Soldering Competition will make its next stop in Russia at EXPO Electronica, again the winner will be at APEX next year. This is also a first time event, so the final will be even bigger and better in 2015. I really applaud the IPC for this initiative, bringing focus to the unsung heroes that our industry could not function without.

The lure of pitting your skill against the best soldering iron hands in the UK proved too much for some and you will see a picture here of my good friend Bob Willis trying his hand, just for fun, of course. But I have to say that the old man still has the skills!

The soldering stations were kept busy throughout the show and the winner announced on the last day. In what the judges described as a “very tight competition”, all of the contestants should be congratulated. Andrew Smith, a Rapid Prototyping Engineer from CIL, came out victorious and will be the first confirmed contestant at next year’s IPC APEX US event in San Diego.

With a very high score of 167 out of 176 he was only 12 points ahead of Helen Reynolds, also from CIL. Andrew was “over the moon” with his success and “totally blown away” when he realised he

| MAY 2014 ISSUE

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Selective Soldering with a PLUS of Flexibility

by Heike Schlessmann, Marketing Manager, SEHO Systems

actually measures the quantity of each drop that is jetted onto the printed circuit board (PCB).

Flexible Preheat Process A reproducible and effective pre-heating process is essential to activating the flux and achieving optimum wetting activity.

The pre-heat area of the SelectLine can be configured individually by length and type.

It scores particularly high because of its energy efficiency. Quartz heating elements, that can be activated individually, ensure an effective heat transfer to the PCBâ&#x20AC;&#x2122;s bottom side. If needed, additional infrared heaters can be installed for topside heating.

Controlled via the software, both preheating systems are matched to guarantee reproducible temperature profiles.

Time plays a key role in modern electronic production. With the SelectLine, SEHO developed a selective soldering system featuring mini-wave processes. Its revolutionary design provides the highest precision and solder joint quality as well as a high degree of flexibility: no changeover is required to dynamically process a variety of assemblies with short cycle times.

Up to three nozzle heads that are installed on the high precision XY axis system ensure a defined flux application in the smallest areas. Therefore, throughput can be increased significantly when processing panels. As an alternative, two different flux types, controlled via software can be used simultaneously.

For selective soldering systems from SEHO, 100 percent process control starts with flux deposition. Both the filling level in the flux container and the function of the drop jet nozzles are continuously controlled. Highest process reliability is offered with the flux quantity control, which

In case of processing high mass assemblies, the preheat module may also be equipped with convection heating, ensuring a complete and effective heat transfer with homogeneous temperature distribution within the preheat zone.

To constantly keep assemblies on the same temperature level during long soldering cycles, a topside heating may also be integrated into the soldering area.

Of course, all heating circuits can be monitored and a touchless pyrometer can be installed for precise control of the preheat temperature profile.

Twin-Select: Dual solder pot concept with two electromagnetic soldering units installed on separate z axes

The SelectLine machine concept is consistently modular, thus ensuring clear cost benefits. Fluxer, various preheat modules and soldering modules may be equipped individually and, depending on the requirements, can be configured to a complete manufacturing line.

High Precision Fluxing Process Selective soldering systems from SEHO are equipped with a micro drop jet fluxer that focuses on two points: maximum precision and minimum flux consumption.

Page 48

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feature continued...

Soldering to Perfection The soldering area — which is the heart of the SelectLine — scores highly due to its outstanding flexibility and precision.

The electro-magnetic soldering unit with exceptionally stable and precise wave height as well as innovative solder nozzles ensures an efficient energy transfer and, therefore, guarantees perfect soldering results. ____________________________________

‘‘

This permanently provides two different solder alloys, eliminating changeover times

____________________________________ Process management is pushed to its highest flexibility with the dual solder pot concept Twin-Select. Two electromagnetic soldering units are installed on separate Z-axes and can be programmed independently. This permanently provides two different solder alloys, eliminating change over times. Additionally, the Twin-Select concept can reduce cycle times substantially if the soldering units are equipped with solder nozzles that have different diameters. Connectors, for example, can be soldered in one pass using a larger solder nozzle while fine

structures on the same assembly are soldered with a small solder nozzle.

Innovative Solutions – Patented by SEHO Maximum throughput requirements are met with the new, innovative Synchro concept, which is patented by SEHO. Typically, to increase production volume, additional soldering modules need to be added, or the machine has to be equipped with a dual conveyor to allow parallel processing of boards. These measures, of course, are related to a large investment in equipment. ____________________________________

‘‘

Typically, to increase production volume, additional soldering modules need to be added

____________________________________ The Synchro concept is an intelligent software feature that co-ordinates the soldering process for two PCBs in such a way that the total throughput is nearly doubled without the need for significant investment. The same soldering program is loaded for both soldering units synchronous, working in an infinite loop.

The assemblies can enter the soldering

area independently and are not linked to the same cycle. With the new Synchro concept, cycle times can be reduced by nearly 50 percent.

Soiled solder nozzles remarkably affect the reproducibility of soldering processes. This is avoided with another innovative feature from SEHO. The automatic ultrasonic cleaning for wetted miniwave solder nozzles. What previously had to be made manually and with aggressive chemicals is now automatically and environmentally friendly performed through the machine.

The solder nozzles get a gentle cleaning and they are completely re-wetted.

Besides a significantly longer solder nozzle lifetime, this unique feature guarantees process improvements and significant time savings.

100 Percent Process Control The ability to reduce production costs, while maintaining consistent high quality, is essential for electronic production.

Considering that manual repair soldering processes are not only expensive and time consuming but also provide poor reproducibility, the target becomes a zero-fault process. A controlled, reliable selective soldering process represents the first and most important step towards a zero-fault production. ____________________________________

‘‘

Cameras for visual process control provide additional safety and can be integrated into the offline teach program for fast parameter optimization

____________________________________ Selective soldering systems from SEHO provide a comprehensive hardware and software package to control the process sequence nearly 100 percent. Precision starts with the positioning of assemblies. Reproducible soldering results are ensured with the automatic position correction using fiducial recognition. This software tool automatically compensates various types of mis-alignment such as offset or linear shrinkage within the PCB.

Page 50

| MAY 2014 ISSUE

Faulty assemblies can be removed from the inline production automatically and directly passed on to a repair workplace.

Besides clear cost benefits, particularly in terms of floor space requirements and board handling, evaluation of trend and series defect information enables early process optimization, notably reducing error rates.

Another innovation from SEHO is the machine communication software mcServer. The selective soldering process becomes transparent and can be traced completely. In addition, it also meets the requirements of Industry 4.0. This software feature allows comprehensive control of the soldering process with real-time access to all connected machines that are installed in different production sites worldwide. Additionally, it is possible to directly link to cameras that are integrated in a machine.

mcServer software: Ensures full traceability of the selective soldering process and meets Industry 4.0 requirements

Additionally, loading of the correct soldering program and appropriate infeed of PCBs is controlled. ____________________________________

Flux quantity ‘‘ control guarantees

flux deposition with utmost precision and is exactly dosed

____________________________________

The automatic Z-height correction recognizes warped assemblies caused by previous thermal or mechanical load, and automatically calculates correct Z values for all points of the soldering program.

Flux quantity control guarantees flux deposition with utmost precision and is exactly dosed. In the preheat area a touchless pyrometer control, as well as monitoring of all heating circuits, ensures reproducible temperature profiles.

Special attention in terms of process control is given to the soldering area.

The mcServer machine communication software collects, analyzes and archives all information about the machine and production processes using a straightforward user interface.

With its specific serial number, the entire process for a single PCB can be traced. Production statistics, user statistics or AOI statistics can be generated as easily as comprehensive reports for documentation. ____________________________________

Stable wave heights are ensured using a measuring needle or a high-precision laser micrometer. Because the solder level in the solder pot can affect the stability of the wave, it is controlled and solder wire is supplied automatically if needed. ____________________________________

With its specific serial number, the entire process for a single PCB can be traced

‘‘

Faulty assemblies can be removed from the inline production automatically and directly passed on to a repair workplace

____________________________________ Cameras for visual process control provide additional safety and can be integrated into the offline teach program for fast parameter optimization. The zero-fault production turns into reality with the integration of an AOI system.

Here, solder joint inspection is performed immediately after the soldering process.

‘‘

____________________________________ Using appropriate interfaces, every machine can be integrated into each specific MES/ERP system for superordinate control of the process.

Conclusion Absolutely unique is the 100 percent process control that is provided by all selective soldering systems from SEHO. Features range from flux quantity control through automatic position correction and z-height correction to continuous wave height control and the unrivalled opportunity to integrate a system for automated optical inspection directly into the selective soldering process.

SEHO’s selective soldering systems increase flexibility, process control and precision in the production process while decreasing defects, time and cost.

red carpet out & about in the industry In this feature we follow our industry movers and shakers throughout the world.

Time to take a bow...

Page 52

PROMATION Inc. successfully completed a robotic soldering class on the TT and G series robots. To ensure that the company’s sales teams in Mexico are updated on the latest innovations, the company conducted a two-day sales training class at its facilities in Kenosha, WI.

Libra Industries’ New Product Introduction (NPI) team completed the move from Plant One to Plant Two. In conjunction with the move, the team acquired additional equipment. With the added equipment and dedicated focus on quick-turn prototypes, Libra Industries’ NPI team was able to build and ship seven new prototype assemblies within the first two weeks at Plant 2.

Graham Naisbitt (right) from Gen3 Systems is announced as Operations Director – Europe for Microtek’s new European Test Laboratory based in the UK. Photographed with Mike Shepherd, President/CEO of Microtek Laboratories Inc.

Gheorghe Rebegel, Etek-Europe’s Eastern European Sales Manager, accepts the Distributor of the Year Award (2013) from Josh Petras, Business Director of Inspection Products, Nordson DAGE at IPC APEX EXPO.

| MAY 2014 ISSUE

what’s happening in your business? send your event pictures to red@smttoday.com

Speedprint Technology established a strategic partnership with 4Tech Electronics in Detroit, MI. 4Tech is a re-manufacturer of surface mount and through-hole placement equipment who has integrated and supports Speedprint screen printers. (photo Dan Trinka)

CyberOptics Corp. promoted Eugene Sitoh to the position of Asia Sales Manager. He is fully positioned to take over the Asia sales management activities that include growing the company’s Asia revenue and customer base along with managing its Asia sales channel.

STI Electronics Inc. hosted a successful open house at its new IPC approved training center in Houston, TX on Wednesday April 23, 2014. The training center is located at 9920 W. Sam Houston Parkway S., Suite 420.

Viscom completely redesigned its website.

Located at www.viscom.com, the fresh layout offers intuitive navigation with a high degree of user-friendliness.

Jaltek Systems, located in Bedfordshire, UK, has selected MIRTEC’s MV-7 OMNI 2D/3D In-Line AOI Machine. The MV-7 OMNI 2D/3D met Jaltek Systems’ demand for the very latest in state-of-the-art 2D/3D inspection technology at an affordable price point. (photo Zane Wall)

Horizon Sales recorded more than $1.7 million in orders for Juki in a two-week period ending March 13, 2014. The orders were from two companies in Ohio and one in Michigan, and included more than five pick-and-place machines, three printers and three ovens as well as conveyors and feeders.

We hope you have enjoyed our fourth edition and found it an interesting and enjoyable read.

This magazine is just one part of our exciting communication portfolio showcasing the latest news, product developments, industry profiles and upcoming events. To make sure you donâ&#x20AC;&#x2122;t miss our next edition, you can subscribe online at smttoday.com/subscribe and we will send you a complimentary copy of our printed version. Alternatively, you can read it online at smttoday.com or download it to your mobile, tablet or iPad.

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