Global SMT & Packaging South East Asia - July/August 2011 (#2.4)

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South East Asia

Covering India, Thailand, Malaysia, Singapore, The Philippines and Hong Kong

Volume 2 Number 4 July/August 2011

Cost factors of the cleaning process A review of halogen/halide-free test methods and classifications for soldering materials Improved efficiency using root cause failure analysis

Ravi Pagar Interview Inside

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Contents

South East Asia

Volume 2, No. 4 July/August 2011

Global SMT & Packaging is distributed by controlled circulation to qualified personnel. For all others, subscriptions are available at a cost of $19.99 for the current volume (six issues).

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Contents EDITORIAL 2

All about the tablets Pradeep Chakraborty

6

Technology Focus 6

Cost factors of the cleaning process—part 1 Thomas Kucharek, Application Technology, Zestron Europe

10

A review of halogen/halide-free test methods and classifications for soldering materials Jasbir Bath, Christopher Associates; Gordon Clark, Koki Solder; et al

12

18 Improved efficiency using root cause failure analysis

Gerry Padnos, Juki Automation Systems 30

X-ray inspection of semiconductor devices that use copper wire interconnections David Bernard, Ph.D., and Evstatin Krastev, Ph.D., Nordson DAGE

32

34 Solder paste stencil manufacturing methods &

their impact on precision and accuracy

Ahne Oosterhof, Oosterhof Consulting 38 Bare board contamination

Sheila Hamilton, Teknek

Special Features

32 Interview—Ravi Pagar, element14

regular columns

24 2H’11: Uncertainty prevails but modest growth

remains likely

Walt Custer and Jon Custer-Topai

Other Regular Features 4 Industry News 54 New Products 60 International Diary

Visit www.globalsmtseasia.com for the latest news and more, every day.

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Global SMT & Packaging South East Asia – May/June 2011 – 1

Editorial

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Editorial Offices Europe Global SMT & Packaging Trafalgar Publications Ltd Unit 18, 2 Lansdowne Crescent Bournemouth, Dorset BH1 1SA United Kingdom Tel: +44 7766 951665 United States Global SMT & Packaging PO Box 7579 Naples, FL 34102, USA Tel: +1 (239) 245-9264 Fax: (239) 236-4682 China Global SMT & Packaging Electronics Second Research Institute No.159, Hepin South Road Taiyuan City, PO Box 115, Shanxi, Province 030024, China Tel: +86 (351) 652 3813 Fax: +86 (351) 652 0409 Editor-in-Chief Trevor Galbraith Tel: +44 7924 581 523 (Europe) Tel: +1 (239) 245-9264 x101 (US) editor@globalsmt.net Managing Editor Heather Lackey Tel: +1 (239) 245-9264 x105 hglackey@globalsmt.net Technical Editor Pradeep Chakraborty Tel: +91-9945127632 pchakraborty@trafalgarmedia.com

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Pradeep Chakraborty Technical Editor

All about the tablets

I

t’s all about tablets, isn’t it, today?

Wherever you go, you can’t miss them!

I have been meeting senior officials from leading technology firms, and invariably, the discussions seem to lean toward tablets. While not everyone may be planning to release a tablet soon, the interest is very much there.

Why, even at this year’s pre-Computex 2011 press conference, Stephen Su, general director of IEK (Industrial Economics & Knowledge Center), Taiwan, said that tablets were moving from ‘experience’ to ‘industry.’ Tablets will likely provide more innovative user-interface experiences as well. More cost will be spent on the user interface on tablets, as far as BoM is concerned, he added.

Tablets are also likely to change the transactional model of the ICT industry and emerge as the new ‘service platform’ for the integration of ICT and the other industries as well.

There is likely to be a crossover evolution among mobile devices. The use of messaging and applications seem to have overtaken voice in smartphone usage. Also, there seems to be much more use of heavy media content on the Apple iPad than the iPhone.

While smartphones will likely impact growth of mobile phones, PMPs and PNDs, it is the tablet that will likely affect the netbook and e-reader, and gradually impact the notebook.

There have been a range of tablets announced or to be announced—at least, as per Warren East, CEO, ARM. Presenting at an industry meet in India, he presented an example, featuring the likes of the ASUS Memo, HTC Flyer, HP TouchPad, LG G-Slate, RIM Playbook, Dell Streak 7, and so on.

By the way, tablet applications revenues were projected to top $15 billion in 2015.

However, there still seems to be no one to

2 – Global SMT & Packaging South East Asia – May/June 2011

at least beat the Apple iPad, at least, up until now!

Now, East also highlighted one other thing—that ~5.1 billion people on earth do not have access to the Internet. Mobile devices are currently said to be connecting ubiquitous environments, cloud computing storage and services. It presents all of us the opportunity to reshape the value chain and create growth.

First, what are tablets? Before the Apple iPad came into being, there was no such thing heard of. I do recall seeing one at Geneva, during ITU Telecom World 2003, but that seems to have ‘died its death.’

Now, following the Apple iPad, there are a whole lot of tablets on offer, as though they are the next big thing!

Perhaps, they are!

In the backdrop of all of these, when you look at the Indian electronics industry, what do you find? There are many users of tablets, but there are very few of those from Indian companies.

I recall one that was showed to me exclusively, by a local company in Bangalore, India. It was more of an introductory model, at that time.

Then came Olive Telecom, with its OlivePad. Last heard, it is selling for considerably less than the Apple iPad. It runs on the Android Froyo 2.2 operating system, and makes use of the Qualcomm MSM7227 chipset and the ARM 600MHz processor. It also comes with a six-month free subscription to Zenga TV. However, there are, at the moment, no or very few other releases from Indian firms. So, are Indian technology firms missing out on the ‘tablet rush’? For the moment, it appears to be so.

Oh, just in case, I also wonder how folks are using these tablet PCs as mobile phones! It may seem odd to use a big tablet PC as a mobile phone. Well, that’s up to the user, isn’t it?

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Title Industry news

Industry news

ZESTRON wins “Best of Conference” award

Umut Tosun, application technology manager at ZESTRON, provider of high precision cleaning products and services for the electronics manufacturing industry, was awarded “Best of Conference” for his presentation of “Fluid Flow Mechanics: Key to Low Standoff Cleaning” at the SMTA’s SE Asia Technical Conference held in Penang, Malaysia, on May 19-20, 2011. This is the second industry recognition ZESTRON has received recently. At the end of May, ZESTRON North Asia’s process engineer, Jerry Ji, was awarded the “Best Paper of Technology Conference One (CE11)” for his presentation of the technical study titled “pH-Neutral vs. Alkaline Cleaning Agents” at the SMTA China East Technical Conference during NEPCON Shanghai. www.zestron.com

Thai consumer electronics market expected to increase to $11.4 bn by 2015

Thailand’s consumer electronics devices market is projected at about US$8.3bn in 2011, according to a new report from Research and Markets (“Thailand Consumer Electronics Report Q3 2011”).

This is expected to increase at a CAGR of about 7 percent to US$11.4bn by 2015, driven by the growing affordability and popularity of flat-screen TV sets, low-cost smartphones and other digital lifestyle products.

According to the report, in 2011, consumer electronics spending is expected to grow 13 percent, driven by an improving economy, and salary increases for civil servants and others. Government support through consumers through initiatives such as the Pracha Wiwat programme should help to boost consumer disposable incomes and consumer confidence.

In 2010, demand for consumer electronics devices recovered strongly after political turmoil had earlier affected sales of smartphones and some other high-end products. www.researchandmarkets.com

BTU International selects TSM Solutions as new Malaysia rep

BTU International, Inc., a supplier of advanced thermal processing equipment and processes to the alternative energy and electronics manufacturing markets, has

announced the selection of TSM Solutions as its new representative in Malaysia. TSM will represent BTU’s award-winning line of Pyramax™ convection reflow ovens. BTU has had direct support offices in Malaysia for 14 years and has a number of key customers in the country. TSM Solutions will further strengthen the company’s presence. www.btu.com

World Micro opens Asian hub in Penang, Malaysia

Electronics distributor World Micro, Inc., has sealed an agreement with the Northern Corridor Implementation Authority (NCIA), the statutory body responsible for the development of the Northern Corridor Economic Region of Malaysia to formalize the opening of its Asian distribution hub in Penang, Malaysia. World Micro’s Asian presence is expected to improve Malaysia’s ability to rid the global supply chain of counterfeit electronic parts through various training programs, provide excess inventory disposition programs to local and regional businesses and help support the economic growth within the region. Through collaboration with the NCIA, World Micro will conduct training, development and counterfeit awareness programs for small and medium enterprises as well as large multinational corporations throughout Malaysia. www.worldmicro.com

TÜV Rheinland expands in India

Bangalore-based TÜV Rheinland India is substantially expanding its capabilities in India to meet the growing market demand and provide services as a one-stop shop. In the area of electro magnetic compatibility (EMC) & wireless testing, the company will be adding a 10 meters anechoic chamber in addition to its existing electrical & electro magnetic compatibility (EMC) labs in Bangalore. The 10 meters anechoic chamber enables the company to test any electronics/wireless products for their radiations in the range 9 KHz to 40GHz according various national/international standards such as CISPR, FCC, ETSI etc. www.ind.tuv.com

PLCs, SCADA & DCS to take the Automation & Control market in Malaysia forward

Research and Markets has added Frost

4 – Global SMT & Packaging South East Asia – March/April 2011

& Sullivan’s new report “Automation and Control Market in Malaysia” to their offering. This study provides an understanding of the automation market in Malaysia, one of Southeast Asia’s developed regions.

It discusses the techniques such as PLC, SCADA, HMI, DCS and MES in detail. It also covers the major end-users such as oil and gas, water, electronics and semiconductor manufacturers. The study also provides information on the latest developments in the automation industry and the market share of major players besides providing information on the challenges faced by manufacturers of these automation equipments. www.researchandmarkets.com

Panasonic establishes R&D center in India

Panasonic Corporation has established Panasonic Research & Development Center India (PRDCI) in Gurgaon in the northern state of Haryana. As Panasonic’s first R&D base in India, PRDCI will contribute to the company’s business expansion in the growing market with efficient R&D tailored to local needs. Panasonic has been making a company-wide effort to cultivate its business in India, having enhanced its product lineup and marketing structure as well as opened a B-to-B showroom there. The company further plans to build full-scale manufacturing facilities called Panasonic Techno Park in Jhajjar, Haryana, in the fiscal year ending March 2013. PRDCI will help realize an integrated operation of product development, manufacturing and sales with its effective, locally-oriented R&D initiatives. www.panasonic.net

Altera and RV-VLSI join hands to promote FPGA/SOPC training in India, set up joint lab centre

Setting up of state-of-the-art Innovation Lab to promote research, faculty enrichment and skill upgrading of students.

Altera Corporation, known for programmable logic solutions, headquartered in San Jose, CA, USA, and RV-VLSI, a research and training center, a unit of the Rashtriya Shikshana Samithi Trust, Bangalore, have forged a partnership to set up an Innovation Lab, the first of its kind facility in India, involving a joint investment worth US $ 1 million. The Innovation Lab will promote the use of advanced design practices among corporates, academic research institutions, and students,

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Industry news

thereby fostering an ecosystem for product creation, enhancing job opportunities for IT professionals and familiarizing Altera products to Indian customers. The Lab also plans to work closely with universities in India to upgrade the skills of faculty in the areas of VLSI design methodologies and embedded system design. www.altera.com

Research consortium to address advanced packaging challenges

The Institute of Microelectronics (IME), a research institute of the Agency for Science, Technology and Research (A*STAR) has launched its 11th Electronic Packaging Research Consortium (EPRC11) to address various technology challenges in advanced packaging technology in semiconductor in enabling smaller and smarter devices. Since IME initiated the first EPRC in 1996, this resource and cost-sharing platform has injected invaluable R&D capabilities into the operations of many local enterprises and multi-national companies in the electronic packaging industry and its value chain. EPRC11 consists of 23 company members spanning the whole supply chain of the industry from system, integrated device manufacturer, foundry, assembly & test, to equipment and material companies. The consortium will engage in four projects over its 18-month durationL multiple chip embedded wafer level packaging, through silicon via (TSV) interposers, fine pitch flip chip with Cu pillar, and high performance materials for advanced packaging. www.ime.a-star.edu.sg

Hitachi opens investment discussions with Hi-Rel Electronics

Hitachi, Ltd. and Hi-Rel Electronics Pvt. Ltd. have agreed to open discussions regarding a business alliance, including Hitachi’s investment on Hi-Rel and creation of a new manufacturing facility. The aim of this move is to bolster both companies’ power electronics businesses in India.

This will be achieved by fusing the strengths of each company ‘Hitach’s mediumand high-voltage control technologies, advanced manufacturing technologies, and wealth of experience and expertise in systems integration in large-scale plants, and Hi-Rel’s industrial-use UPS technologies, low-voltage and small- and medium-sized control technologies, existing manufacturing facilities, and nationwide sales and service network in India. The two companies will hold discussions with a view to entering into a final agreement around the end of September 2011. www.hitachi.com, www.hirel.net

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ON Semiconductor opens global distribution center in Singapore

ON Semiconductor, supplier of high performance silicon solutions for energy efficient electronics, has opened its new Singapore hub for global distribution. The US$3.5 million state-of-the-art facility was built and implemented in partnership with DHL. The Singapore Global Distribution Center (GDC) is dedicated to shipping finished goods to its worldwide customer base, acts as a global customer sample center, stores die and wafers for shipment to assembly and test operations, and serves as a local hub for consolidation and delivery of products to customers in South Asia.

This facility is now the largest distribution facility serving the semiconductor industry located in Singapore. More than half of the 38 billion devices ON Semiconductor produces and ships annually are expected to pass through the company’s Singapore GDC. www.onsemi.com

Ellsworth Adhesives authorized Cytec distributorin Thailand

Ellsworth Adhesives has become an authorized distributor for the Cytec Conap product line for the electronics and filter markets in Thailand, Australia and New Zealand. Cytec Conap is a leading manufacturer of polyurethane and epoxy potting compounds and polyurethane and acrylic conformal coatings. Cytec Conap products are proven systems with outstanding performance in the most demanding electronic and electrical applications. The Cytec Conap product line offers a reliable, cost effective solution for the aerospace, automotive, consumer, industrial and marine industries. www.ellsworth.com

Aehr Test Systems sells ownership in Singapore’s ESA Electronics

Aehr Test Systems, provider of semiconductor test and burn-in equipment, has divested its shareholdings in ESA Electronics Pte Ltd, a Singapore private limited company, to IPCO International Limited, a Singapore company, representing 12.5 percent of the outstanding shares of ESA Electronics. As a result, Aehr Test has no remaining ownership in ESA Electronics. ESA Electronics is in the business of distributing and servicing semiconductor back-end equipment, designing and manufacturing burn-in boards for semiconductor back-end stress test and managing electronics turnkey projects. ESA Electronics has been a sales representative of Aehr Test in Southeast Asia since 1992.

ESA Electronics will continue as a sales

representative of Aehr Test after the sale of Aehr Test’s ESA Electronics shares to IPCO International. www.aehr.com

Sono-Tek Corporation expands customer service globally

Sono-Tek Corporation, manufacturer of precision ultrasonic coating equipment, has expanded its customer services with new laboratory facilities in China, Korea, Germany and Taiwan. The new testing facilities will enable customers to test small samples of their liquids in a controlled environment, simulating process conditions as much as possible in order to prove concept and ensure compatibility of liquids. Emerging applications such as advanced energy coatings and specialty medical device coatings often find these services particularly valuable. www.sonotek.com

Flextronics Global Services continues rapid expansion into new and emerging markets

Flextronics Global Services (FGS), a business unit of Flextronics, has made a second strategic market expansion since opening new facilities in Europe and India in October 2010. FGS has expanded its new markets in Mumbai, India and Istanbul, Turkey in response to growing customer demand for post-manufacturing supply chain services in these regions. FGS’ new facility in Mumbai will support repair service requirements for a leading global OEM of smart phones and will serve as a satellite operation for FGS’ core facility in Bangalore. FGS’ new facility in Turkey will serve as the inbound hub operation for a global brand and leading computing OEM. The facilities in Mumbai and Turkey are both fully operational. www.flextronics.com

Scapa Group establishes new Indian subsidiary

Scapa, a producer of adhesive components and bonding solutions for consumers, distributors and OEMs in the automotive, industrial, electronics and medical sector, has esablished a new, wholly-owned subsidiary, Scapa Tapes India, to support the fast developing Indian market, the GDP of which is expected to increase more than 8 percent in the future years. The company will combine the existing sales offices at Mumbai and New Delhi into the new Indian division. Other subsidiaries of Scapa are located in Malaysia, Korea and China. www.scapa.com

Global SMT & Packaging South East Asia –July/August 2011 – 5

Cost factors of the cleaning process—part 1

Cost factors of the cleaning process—part 1 Thomas Kucharek, Application Technology, Zestron Europe

Companies are constantly striving to reduce costs incurred during electronics production in order to increase cost effectiveness. Generally rising costs or the need to preserve competitiveness relative to lowwage countries further reinforce this development. Being part of the value chain and production, cleaning processes for electronic assemblies are also subject of cost analyses.

The following article, the first in a three-part series, presents a detailed summary of all cost factors relevant to the acquisition and operation of cleaning processes. A detailed analysis for optimizing individual cost factors in batch spray systems and inline processes will be conducted in two additional studies.

T

he cost of a cleaning process depends on different factors. These can vary significantly depending on the application or the cleaning equipment.

Therefore, total costs have to be calculated relative to the throughput or to the number of cleaned parts in order to determine a cleaning process’s true costs. So, the general rule is: (investment and/or depreciation + operating costs) = costs per cleaned part No. of cleaned parts

The result of this calculation shows the cost incurred for each cleaned assembly depending on production output. Naturally, every company’s objective is to keep these costs at a minimum.

However, to establish the cost per cleaned part and to reduce it by implementing appropriate process improvements, the factors influencing a cleaning process’s investment and operating costs must first be determined.

Therefore, over the past few months, extensive studies on the subject of “cost factors of the cleaning process” have been conducted at Zestron’s worldwide Technical Centers using different machine types (Figure 1).

The study’s objectives were: 1. to identify all major cost drivers in cleaning processes, 2. to determine factors influencing the cost drivers, and 3. to identify approaches for realizing cost reductions.

Step one, identifying the major cost drivers, can be illustrated quite quickly. As already

mentioned above, a distinction is made between the investment and the depreciation of a new process and the operating costs of an existing cleaning application.

With a new investment, users must consider the following factors as they have a major impact on the cleaning process’s type as well as size and therefore on later investment costs: • Expected production throughput • Necessary degree of automation • Equipment size and/or available floor space • Type of cleaning medium Subsequently, operating costs occur during electronics production due to: • the consumption by equipment peripherals such as exhaust systems, etc., • the operating staff and maintenance costs, and • the consumption of cleaning media and energy Figure 2 illustrates and compares all relevant cost factors of a cleaning process.

After identification of the major cost drivers, a more detailed analysis will determine the other influencing factors and possible options for cost optimization.

1. Cost factor: cleaning equipment

When the cost factor “cleaning equipment” is discussed, the initial investment in the cleaning machine is often considered first and is naturally the greatest cost factor

Figure 1. Zestron’s Technical Centers in Germany, the US and China.

6 – Global SMT & Packaging South East Asia – July/August 2011

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Cost factors of the cleaning process—part 1

Equipment peripherals

Machine size Cleaning medium Solvent or water-based cleaner

New investment

Energy consumption

Production through put

Process operating costs

Degree of process automation

New Investment

2. Cost factor: equipment peripherals Process maintenance

Staff costs

Process Operation

Figure 2. Comparison of the investigated costs.

when installing a new cleaning process.

The selection of the equipment should be based on the expected throughput and the user should first decide for one of the three basic machine types: ultrasonic benchtop, batch machine (i.e. one-chamber spray-in-air equipment), or inline machine.

Table 1 illustrates the different application areas and serves as a basic guide.

Apart from the expected throughput, there are further requirements that the user should evaluate before selecting the equipment. The approved investment budget should not be exceeded and the machine’s size must be suitable for the available footprint. Furthermore, the cleaning machine’s level of automation must be considered for the purchase decision since it influences subsequent operational costs of the process. The user must turn to the operational costs of the cleaning process once the equipment has been purchased.

optimization is the drip-off time.

Apart from the exhaust system, the most important cost-driving factor of inline machines is the drag out of cleaning medium into the rinse stages. A suitable configuration of the air knives thus represents a prerequisite for potential savings.

Looking at the operating process, costs are incurred at various points depending on machine types construction. On the other hand, these can also provide options for savings.

Using the smallest process, the benchtop, cleaning and rinsing takes place in separate process tanks. Savings are thus realized primarily through the optimal positioning of the parts to be cleaned and the drip-off mechanism.

For batch machines, such as one-chamber spray-in-air machines, existing pipes, spray bars and pumps are often used for cleaning and rinsing. The drag out of the cleaning medium due to dead volumes in the machine thus influences the process costs. However, drag out does not just occur due to the machine’s construction, but also due to the configuration of the parts to be cleaned. Since the assembly geometry cannot be changed, the main option for

In reference to the cleaning equipment’s periphery, the study’s results reveal that costs during the process operation essentially arise through processing, drag out and exhaust. The equipment periphery is structured differently depending on the machine type. Table 2 shows the peripheral systems that were investigated.

In summary, this means the following: 1. The cost aspect “equipment periphery” is virtually non-existent with ultrasonic benchtops, since typically neither the cleaner nor the water are treated 2. The biggest cost driver in the batch process investigation, such as onechamber spray-in-air machines, proved to be the processing or production of deionized water for rinsing. Using either an ion exchanger or reverse osmosis are reasonable depending on the amount of deionized water consumed. Costs also arise for processing the cleaning agent in closed loop, e.g. through filter changes.

3. In inline processes for high-volume production, peripheral equipment costs have the largest impact

Cleaning equipment

Ultrasonic benchtop

Batch process, e.g. one-chamber spray-in-air equipment

Inline process

Throughput per shift

approx. 50–100

approx. 500–1,500

> 3,500

Investment volume

1,000–5,000€

20,000–80,000€

> 100,000€

Foot print

<1 m

1 m to 3 m

>10 m2

Degree of process automation

none (manual)

medium (manual loading/unloading of cleaning goods)

high (fully automated, completely integrated into the production process

2

2

2

Table 1. List of common cleaning systems. (These data are merely a guide).

Ultrasonic benchtop Not available

Batch process, e.g. one-chamber spray-in-air equipment

Inline process

• Deionized water treatment (e.g. activated carbon, mixed bed resin) • Processing of the cleaning medium (filtration)

• Machine exhaust • Deionized water treatment (e.g. activated carbon, mixed bed resin) • Processing of the cleaning medium (filtration)

Table 2. Cost-relevant periphery by cleaning equipment.

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Global SMT & Packaging South East Asia –July/August 2011 – 7

Cost factors of the cleaning process—part 1

on the total process cost. This is mainly due to the vapor losses through the machine’s exhaust system. As the investigation shows, the exhaust gas temperature and the spray nozzles’ atomization of the cleaning medium are the decisive factors. Furthermore, the results show that cost savings are possible by optimizing the treatment cycle of the cleaning agent and the rinse water.

The energy consumption and maintenance costs of the above mentioned cleaning processes were also investigated in the study.

In addition to the operating costs incurred by machine peripherals during cleaning, the results for energy consumption and equipment maintenance are listed below.

3. Cost factor: energy consumption and equipment maintenance

Depending on the cleaning process, the amount of operational costs varies considerably. Figure 3 illustrates this.

Ultrasonic benchtop processes suitable for the lowest throughput exhibit the lowest total operating cost in this context since relatively little power is needed to heat the bath and additional costs for compressed air and for drying are not necessary. On the other hand, staff costs comprise the largest share of the operating costs since all process steps such as cleaning, rinsing and drying must be conducted manually. In addition, due to the low bath volume, this type of process does not have an integrated filtration system so that frequent bath changes are required and can lead to further maintenance costs.

In batch cleaners, the cleaning agent, and, if necessary, the rinse water must be reheated after each cleaning step. Due to this and the drying of the entire cleaning chamber, considerably higher energy costs arise in batch systems compared to benchtops. In addition, discharging the water after each rinse causes further operational costs. As this type of process is mainly automated, staff costs usually only occur for loading, unloading and maintaining the machine. Furthermore, the integration of a treatment process for the cleaning agent, such as filtration, maximizes the bath life, so that expensive bath changes are required considerably less often than with benchtop systems.

In the studies, the consumption of water, energy and compressed air by inline systems had the greatest effect on the over-

Figure 3. Relationship of operating costs for the different machines per part.

Cost advantages Solvents

Cost disadvantages

• long bath life • short process times

• high evaporation losses • expensive exhaust treatment • explosion protected equipment required

Traditional surfactants

• low evaporation losses • low application concentrations

• short bath lives, thus expensive bath changes needed

Moder, waterbased cleaners (e.g. MPC® media)

• low application concentrations • long bath life • low evaporation losses

• filtration for enhanced bath life required, thus cost for filter changes, etc.

Table 3. Cost consideration of the operating process.

all process costs (as expected). In general, these are closed loop circulation systems and the processing cost for rinse water is relatively high. Furthermore, most inline systems must be operated continuously to ensure consistent process results and even during times when no parts have to be cleaned. Due to this, continuous energy expenditures arise and are generated by the cleaning bath’s circulation and heating as well as by the exhaust system after the rinse stage and before drying. Additionally, costs are incurred when blowing off the cleaned parts, as air knives are integrated into the line multiple times. Due to the inline system’s permanent operation, comparatively high maintenance and repair costs occur as well. However, operator costs are relatively low due to the fact that inline machines are completely integrated into the production line and therefore easier to operate and monitor by a single person.

In summary, it can be stated that operating costs increase relative to the throughput and the equipment size. At the same time, the study confirms that personnel costs decrease as the cleaning process’s degree of automation increases.

Furthermore, immersion systems and spray processes only incur costs during cleaning, whereas operating costs for inline systems arise even during idle phases.

After all costs associated with the cleaning equipment have been carefully

8 – Global SMT & Packaging South East Asia – July/August 2011

Figure 4. Comparison of bath lives.

considered, as a next step, a suitable cleaning agent must be selected. The relevant cost factors in this area will be shown in the following part of the study.

4. Cost factor: cleaning medium

In the industry, primarily three types of cleaning agents are used for the cleaning of electronic assemblies. These include alcohols, conventional surfactants and modern

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Cost factors of the cleaning process—part 1

water-based cleaning media. When a new cleaning machine is purchased and the tank has to be filled with a cleaning agent for the first time, companies often focus on the cleaning medium’s price per liter.

However, this is not the only fact that determines the ultimate costs of the cleaning agent.

For example, the bath life is crucial, i.e. how long the cleaning agent can be used before a bath change is required. Thus, a cleaning agent with a short bath life may be more expensive in the long run, despite its favorable price per liter, than a cleaning medium with a higher purchase price providing a longer bath life.

Based on their respective chemical properties, the three types of cleaning agents mentioned above have individual cost advantages and disadvantages during the cleaning process, as Table 3 shows.

Most solvents exhibit long bath lives and short process times due to their excellent drying properties (see Figure 4). However, there are cost disadvantages due to high evaporation losses, the necessary explosion protection for the cleaning equipment, which typically has an impact on the initial investment or even an expensive filtration of the exhausted air.

Conventional surfactants do not have these problems. At the same time, they are sold at an appealing price per liter and are often used with low application concentrations. Nevertheless, their bath life is mostly quite short, which leads to frequent bath changes and increases the costs due to the higher cleaner consumption (Figure 4).

On the other hand, modern waterbased cleaning media provide very long bath lives (Figure 4) and can also be operated at low application concentrations.

Costly evaporation losses, as with solvents, are neglected. Also a long bath life can be achieved via a filtration cycle in the cleaning machine for additional costs.

At this point, to choose the right cleaning agent, users should seek advice from a cleaning expert, who can determine the most cost effective solution. Similarly, it is crucial to choose a cleaning agent that is suitable for removing the specific contamination and thus ensures the best possible cleaning results.

Summary

To determine the cost per cleaned part and to take appropriate measures to reduce costs, all cost drivers and their parameters must be identified. Therefore this article has provided a fundamental basis.

The results of the previously men-

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tioned technical studies point out that the throughput during assembly cleaning essentially represents the basis for the equipment selection. At the same time, however, operating costs for energy consumption and maintenance are also largely determined by the equipment choice while specific measures for realizing significant savings cannot be taken.

Once the cleaning process is implemented, the cleaner, the equipment periphery and the process parameters prove to be the only cost factors that can be influenced

and thus optimized. Therefore, these three factors will be specifically investigated in two subsequent studies focusing on batch and inline processes to even better understand them and to detail possible savings potentials. These types of cleaning processes involve the highest cost cases due to their technology’s complexity and thus have the most potential for savings.

Global SMT & Packaging South East Asia –July/August 2011 – 9

A review of halogen/halide-free test methods and classifications for soldering materials

A review of halogen/ halide-free test methods and classifications for soldering materials Jasbir Bath, Christopher Associates; Gordon Clark, Koki Solder; Tim Jensen, Indium Corporation; Renee Michalkiewicz, Trace Laboratories; Brian Toleno, Henkel Electronic Materials

Over the last few years, there has been an increase in the evaluation and use of halogen-free soldering materials.

In addition, there has been increased scrutiny into the level of halogens and refinement of the definition and testing of halogen-free soldering materials. The challenge has been that there has been no common standard across the industry in terms of halogen-free definitions and the corresponding test methods to determine these. This has created confusion in the industry as to what end users want and what soldering materials suppliers can actually provide.

This paper reviews the status of halogen-free and halide-free in terms of definitions, test methods and the limitations and accuracy of test methods used to determine if a soldering material is halogen/halidefree or not. The different industry standards, both currently available and in the process of being drafted, are also discussed.

Keywords: Halogen-free, Halide-free, Classifications, Standards This paper was originally presented at IPC APEX Expo 2011.

I

n the electronics industry, there is a significant push toward halogenfree products. This movement is due to legislation from various countries, and public outcry from well publicized negative third world recycling practices, as well as non-government organizations (NGOs) testing and publishing information on electronic devices regarding their content of various potentially hazardous materials. Halogenfree products are also being mandated by certain OEMs as a means to lessen potential chemical effects on the environment.

In electronics assemblies, halogens can be found in the plastics for cables and housings, board laminate materials, components, and soldering fluxes and pastes. In solder pastes and fluxes, the halogenated compounds are used as activators that remove oxides to promote solder wetting. Eliminating the halogenated compounds can have a significant negative effect on the board assembly process. Process assembly challenges are not the only issues electronics assemblers face as they become halogen-free. The use of proper test methodologies to determine that the soldering products are actually halogen-free is currently not well defined as there are a variety of test methods and standards in the industry.

Halide content has been measured either qualitatively or quantitatively with halide testing being specified for more than

10 â&#x20AC;&#x201C; Global SMT & Packaging South East Asia â&#x20AC;&#x201C; July/August 2011

fifty years with standards such as the United States Federal Specification QQ-S-571 standard1 followed by MIL-F-142562 and IPC-SF-8183 standards and currently in standards such as IPC J-STD-0044. The specifications have listed requirements for the halide content of flux-containing soldering materials.

The terms halogen and halide have caused confusion in the electronics industry with definitions to try and clear up the confusion provided by standards such as JEITA ET-73045 and IPC-J-STD-0044.

The term halogen refers to all halogen family elements and halogen compounds including those which are present in nature.

The JEITA ET-7304 standard5 specifically targets the halogen families of chlorine (Cl), bromine (Br) and fluorine (F) used as the activators for soldering materials. The term halide is defined as the halide ion or halide salt compound having an ionic character (e.g. Cl-, Br-, F-).

Covalently bonded halogens do not disassociate in water, and therefore the chloride, bromide and fluoride are still attached (covalently bound) to other species (typically organic), and will not be detected by techniques such as ion chromatography or titration. Ionically bonded halogens do disassociate in water into the negatively charged halide ion (Cl-, Br-, F-, etc.) and the positively charged species (H+, Na+ etc.). Test methods used to look

Process assembly challenges are not the only issues electronics assemblers face as they become halogen-free.

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Title

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Global SMT & Packaging South East Asia –July/August 2011 – 11

A review of halogen/halide-free test methods and classifications for soldering materials

for ionic species, such as ion chromatography, will only detect halides.

A better understanding of the test methods, what they are capable of detecting in terms of halides and halogens, and how they relate to the various halogen-free definitions and standards is required. A variety of these test methods and standards will be discussed in the following sections as well as some test preparation techniques.

Halogen-free definition and standards

A variety of halogen-free definitions and standards have been developed in the electronics industry based on PCB laminates, components and soldering materials. The developed standards for PCB Laminates include IEC 61249-2-216, JPCA-ES-017 and IPC-41018. All three standards indicate less than 900 ppm Cl (<0.09wt %), less than 900 ppm Br (<0.09wt %) and less than 1500 ppm total Cl and Br (<0.15wt % Cl + Br).

The developed standards for components include JEDEC JEP709 standard9. This standard indicates that a solid state device must meet the following requirements to be defined as low halogen in terms of less than 1000 ppm Br (from BFR[Brominated flame retardants] sources), less than 1000 ppm Cl (from CFR[Chlorinated flame retardants], PVC[Polyvinyl Chloride] and PVC co-polymers sources). For the PCB laminates used in components the Cl and Br limits would follow the guideline in IEC 61249-2 standard6.

The developed standards for soldering materials include JEITA ET-70345 and IPC J-STD-0044. The JEITA ET-7034 standard5 states halogen content less than 1000 ppm Cl, less than 1000 ppm Br and less than 1000 ppm F. An updated draft of the JEITA standard, JEITA ET-7034A10, also includes iodine (I) with a value of less than 1000 ppm. In contrast, the IPC J-STD-0044 document does not currently have a requirement for halogen content.

J-STD-004 standard4 only specifies a halide content less than 500 ppm total halide.

The amendment to J-STD-0044 currently being added does include optional testing for halogen content and is leaning towards the 900 ppm Cl, 900 ppm Br and 1500 ppm total halogen content suggested requirements.

Test Methods used to determine halide /halogen content

The test methods used to analyze for halides and halogens are outlined in the following section.

Silver Chromate paper test for bromide and chloride (halide) The Silver Chromate paper test method based on IPC J-STD-0044 and IPC TM-650 2.3.3311 is a qualitative test in which a sample of flux is applied to Silver Chromate Paper and allowed to remain on it for one minute.

If the paper changes color then it indicates the presence of chloride or bromide. This test only identifies the halogen in the ionic form (halide) and is prone to false positives from chemicals such as amines, cyanides, and isocyanates. It also provides no indication as to the total halogen present.

Fluoride spot test for fluoride (halide) The fluoride spot test method based on IPC J-STD-0044 and IPC-TM-650 2.3.35.112 is a qualitative test and is designed to determine the presence (if any) of fluoride(s) in the soldering flux by visual examination after placement of a drop of liquid test flux in a zirconium-alizarin purple lake. This method only detects the presence of the fluoride ion.

Although the following test methods,

titration and ion chromatography, which are discussed in the next section are used to measure ionic halide, they may be used following oxygen combustion to determine total halogen content.

Titration method for chloride, bromide and fluoride (halide) These are quantitative tests that assess the chloride and bromide (IPC-TM650 2.3.3513) and fluoride (IPC-TM-650 2.3.35.214) present in a flux expressed as chloride equivalents. A flux or flux extract is titrated to its endpoint using the appropriate IPC test methods. The test methods are an improvement over Silver Chromate paper test and fluoride spot test methods in that it provides a value for how much halide is present. However, this test method detects only halides and not total halogens unless an oxygen combustion method is used to prepare the sample prior to titration. Additionally, there are a wide variety of organic chemicals that can falsely be identified as halides.

Halogen content variation based on reporting

Solder Paste (100g flux and 900g solder metal) Flux (base material) Flux Residue (50% of 100g) (as 50% of the flux volatilized during reflow)

Mass (g)

Mass of halogen (g)

Halogen content (in ppm)

1000

0.045

45

100

0.045

450

50

0.045

900

Table 1. Halogen content variation based on different reporting values for the solder paste, flux and reflowed flux residue.

Anions by ion chromatography

Result (mg/kg)

Reporting Limit (mg/kg)

Weight (g)

Bromide

1210

72

0.000607

Chloride

<162

162

<0.000081

Fluoride

<72

72

<0.000036

Iodide

<700

700

<0.00035

Table 2. Solder paste extracted by centrifuge, prepared with oxygen bomb and analyzed via ion chromatography17. Oxygen bomb combustion test method: EPA SW-846 5050/9056/ SW505018.

Anions by ion chromatography

Result (mg/kg)

Reporting Limit (mg/kg)

Weight (g)

Bromide

2110

55.7

0.00105

Chloride

<125

125

<0.0000625

Fluoride

<55.7

55.7

<0.0000278

Iodide

<700

700

<0.00035

Table 3. Solder paste reflowed at 240°C, prepared with oxygen bomb and analyzed via ion chromatography17. Oxygen bomb combustion test method: EPA SW-846 5050/9056 / SW505018.

12 â&#x20AC;&#x201C; Global SMT & Packaging South East Asia â&#x20AC;&#x201C; July/August 2011

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A review of halogen/halide-free test methods and classifications for soldering materials

Ion chromatography for chloride, bromide, fluoride and iodide (halide) This is a quantitative test method (IPC J-STD-0044 and IPC-TM-650 2.3.2815) for chloride, bromide, fluoride and iodide that can identify the total quantity of halides present in a flux. Based on the retention time in the ion exchange column, a chromatogram is developed and peaks are identified as various ions based on previously developed standards. This test method allows a quantification of how much halide ions are present and which particular halide is present. The challenge with ion chromatography testing by itself is that No.

Combustion Method

1 2

Sample No.

1st

2nd

3rd

4th

5th

Average

%RD

Test 1

-

13.1

12.7

12.4

11.3

11.3

12.2

6.6

Test 2

-

273

273

270

268

274

272

1.1

Test 3

-

1170

1190

1170

1200

1170

1180

1.4

Test 1

Residue after reflow

16.6

11.7

13.9

15.0

16.6

14.8

13.9

Test 2

Residue after reflow

44.8

33.9

32.6

34.2

32.7

35.6

14.5

Test 3

Residue after reflow

78.1

73.2

78.2

79.0

80.4

77.8

3.5

Table 4. Cl-concentration measured on raw flux and reflowed flux residue using ion chromatography only (not oxygen bomb combustion then ion chromatography)5.

Amount of sample mg

Combustion temperature °C

Combustion time S

Conditions

Cl (mg/ kg = mass ppm)

Br (mg/ kg = mass ppm)

Quartz tube

5

1000

300

Combustion tube 1

333

301

Quartz tube

10

900

300

Combustion tube 2

327

295

3

Quartz tube

10

1000

120

Combustion tube 3

355

335

4

Quartz tube

10

1000

300

Combustion tube 4

345

322

5

Quartz tube

10

1000

600

Combustion tube 5

355

341

6

Quartz tube

10

1100

300

Combustion tube 6

332

305

7

Quartz tube

20

1000

300

Combustion tube 7

348

329

8

Oxygen flask

10

No Setting

Time allowed to stand: 20 mins

Flask 1

347

295

9

Oxygen flask

20

Time allowed to stand: 20 mins

Flask 2

351

275

10

Oxygen flask

40

Time allowed to stand: 20 mins

Flask 3

334

305

11

Oxygen bomb

100

Time allowed to stand: 20 mins

Bomb 1

320

283

12

Oxygen bomb

200

Time allowed to stand: 20 mins

Bomb 2

342

305

13

Oxygen bomb

400

Time allowed to stand: 20 mins

Bomb 3

334

306

No Setting

Table 5. A comparison of three common combustion methods using various combustion temperatures and times on the measured Cl and Br values for soldering flux5.

it only identifies the ionic halide species and the covalently bonded halogen are not detected again, unless the sample has been prepared using an oxygen combustion method prior to ion Chromatography testing. In addition, there are chemicals that have similar retention times to Cl- and Br- which can result in non-halides being misidentified as a halide.

There is a growing practice of running ion chromatography on reflowed flux residue in terms of sample preparation before ion chromatography testing. There are two reasons that people typically utilize this type of method. First, they are examining the flux residues remaining on the PCB for any species that may lead to an increased occurrence of corrosion or dendrite growth from halide ions that do not volatilize. Secondly, any covalently bound halogens contained in the flux may disassociate during the reflow process and

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Average or Standard Deviation

Cl (mg/kg = ppm)

Br (mg/kg = ppm)

Quartz tube

Average

344.4

317.7

Oxygen flask

Average

335.0

286.0

Oxygen bomb

Average

338.0

305.5

Standard deviation

11.1

18.8

Oxygen flask

Standard deviation

15.5

11.8

Oxygen bomb

Standard deviation

5.7

0.7

Combustion method

Quartz tube

Table 6. Average of the test result analysis values showing better repeatability for the oxygen bomb versus the quartz tube or oxygen flask test methods5.

then the subsequent extraction and chromatography testing will detect these dissociated halogens as well as the halides that do not volatilize. However, if all of the covalently bound halogens are not disassociated, then the amount of halogens will be underreported.

The IPC J-STD-004 standard4 mentions in Appendix B-10 that the IPC-TM-650 2.3.28 test method15 is intended for the

detection of ionic halides only and is not be confused with total halogen content determination [ionic halide plus non-ionic (covalent) halogen]. Total halogen content should be tested by oxygen bomb combustion testing using a test method such as EN14582 standard16 followed by ion chromatography testing which is mentioned in the next section.

Global SMT & Packaging South East Asia –July/August 2011 – 13

A review of halogen/halide-free test methods and classifications for soldering materials

Oxygen bomb combustion testing followed by ion chromatography testing (halogen) The use of oxygen bomb combustion followed by ion chromatography testing is growing in popularity in the electronics industry. The oxygen bomb test method involves subjecting a sample of flux or solder paste to an oxygen bomb combustion in which all of the organic materials are burnt off at very high temperature.

This process breaks the covalent bonds for all halogens.

The remaining ash consists of the ionic halides and other inorganic materials.

The dissolved ash is then run through ion chromatography to determine the total halide content of a material even if it originally contained covalently bonded halogens. Since most halide restrictions are based on the finished circuit board assembly, there has been a discussion on whether the oxygen bomb combustion test followed by ion chromatography test should be run on the reflowed flux residue rather than the unreflowed flux.

To determine the halogen content of the flux residue, one could begin by testing the flux or the flux portion of a solder paste through TGA (thermo-gravimetric analysis) equipment using a simulated reflow profile. This will provide an approximate value for the amount of flux residue remaining after reflow. Then, after testing the raw flux through oxygen bomb combustion followed by ion chromatography testing, a simple conversion could be done using the safe assumption that no halogen present will volatilize. For example, if the oxygen bomb combustion followed by ion chromatography test results show 450 ppm of Chloride present and the TGA results shows that the flux volatilizes 50% during reflow, it would be determined that there will be 900 ppm Cl- in the flux residue. Table 1 shows a hypothetical example of the halogen content variation based on different reporting values for the solder paste, flux and reflowed flux residue.

In a study run by Jensen et al.17 using oxygen bomb combustion testing followed by ion chromatography testing, they found the bromide concentration of the raw flux was lower than the reflowed sample. Many companies running the halogen content test are currently using raw flux for testing, as this seems to be the easiest to implement. It is important that those interpreting the results understand that there will likely be a higher ppm level in the flux residue due to the decreased mass of the tested sample.

Results of the study are reported in Tables 2 and 317.

The oxygen bomb combustion test procedure mentioned in EN 14582 standard15 indicates that methods such as ion chromatography can be used for the determination of halides after oxygen bomb combustion testing. There are various other oxygen bomb combustion test methods which can be used in addition to EN 1458216, including EPA SW-846 5050/905618 and JPCA ES-0120037 standards. JEITA ET-7304 standard5 mentions that any of these three oxygen bomb combustion test methods can be used. Most laboratories typically use EN 14582 standard16 which appears to gaining in popularity.

To determine the halogen content of the flux residue, one could begin by testing the flux or the flux portion of a solder paste through TGA equipment.

Results and Discussion

Halogen-free definitions and standards For the definition of halogen-free for PCB Laminates when the IEC 612492-21 standard6 was being developed, there were discussions about the ability of the test methods to repeatability detect low chlorine and bromine levels in PCB laminates using the semi-open flask test method, which was the method used to detect bromine and chlorine in PCB laminates.

In some cases, a lower level of chlorine and bromine (200-300 ppm) was being pushed for by certain groups. Because of the difficulty in repeatability detecting these low levels of chlorine and bromine, certain other groups were pushing for a 1500 ppm to 2000 ppm range.

As a compromise, the maximum level

14 â&#x20AC;&#x201C; Global SMT & Packaging South East Asia â&#x20AC;&#x201C; July/August 2011

of both chlorine and bromine agreed upon in IEC 61249-2-21 standard6 as was already indicated in previous sections, was less than 900 ppm chlorine and less than 900 ppm bromine for a halogen-free PCB laminate with a total value of chlorine and bromine not to exceed 1,500 ppm.

This halogen-free definition was also used for halogen-free PCB Laminates included in JPCA-ES-017 and IPC-41018 standards. As already mentioned, the test method used for detection of bromine and chlorine in PCB laminates was the semi-open flask method. It has been found that this method of detection is not as accurate as the oxygen bomb combustion test methods and there are discussions to consider the inclusion of the use of the oxygen bomb test method for laminates in IPC 4101 standard8.

For the definition of halogen-free soldering materials, the JEITA ET-7304 standard5 discussed whether the value of 900 ppm should be used for both chlorine and bromine as is used for copper clad PCB laminate materials or if the 1000 ppm limit mentioned in the European Union RoHS legislation for the two brominated flame retardants PBDE (Polybrominated Diphenyl Ethers) and PBB (Polybrominated Biphenyls) should be used. The JEITA ET-7034 standards group decided that a difference of 100 ppm was not significant either technically or environmentally, so the 1000 ppm limit should be adopted for bromide and chloride. The committee who wrote the JEITA ET-7304 standard5 are also looking to add Iodine (I) into their standard in addition to chlorine, bromine and fluorine10.

For IPC J-STD-004 standard4, when quantitative requirements were placed on halide content, a product was deemed halide-free if the halide content measured was less than 0.05 wt% or 500 ppm. The 500 ppm definition most likely came from the typical detection limit for halides at that time and the fact that raw materials containing trace halide naturally typically fell below this limit.

The reasons why the IEC 61249-2215, JEITA ET-70345, and IPC J-STD-0044 standards were not in line with each other included different times of standard publication, different materials involved, and different reasons as to why the determinations were being run (I.e. environmental safety concerns versus determination of flux activity level).

Halogen testing data In order to understand halogen-free

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A review of halogen/halide-free test methods and classifications for soldering materials

Method Utilized

chlorine (ppm)

bromine (ppm)

Fluorine (ppm)

Lab 1

EN14582 (Oxygen bomb)16

ND

ND

ND

Lab 2

EN14582 (Oxygen bomb)16

748

ND

2010

Lab 3

IEC612249-2-21 (Combustion flask)6

606

ND

1460

Table 7. Halide testing of an adhesive material from three test laboratories showing differences in test results19.

NC-A Sample (13,000 ppm bromine)

NC-B Sample (0 ppm bromine)

Lab 1

11700

0

Lab 2

10906

0

Lab 3

7627

73

Lab 4

12700

0

Lab 5

10000

0

Lab 6

10993

0

Mean

10654

12

Standard Deviation

1735

30

Table 8. Solder paste bromine test data from six different test laboratories using the EN 1458216 oxygen bomb combustion test method for two no-clean solder pastes20.

NC-A Sample (13,000 ppm bromine)

NC-B Sample (0 ppm bromine)

Lab 1

11700

0

Lab 2

10906

0

Lab 4

12700

0

Lab 5

10000

0

Lab 6

10993

0

Mean

10993

0

(Lab 3 removed)

11260

0

Standard Deviation (Lab 3 removed)

1006

0

Table 9. Solder paste bromine test data from six different test laboratories using the EN 1458216 oxygen bomb combustion test method for two no-clean solder paste with the outlier Laboratory 3 test data remove20.

material testing detection methods, published data relating to halogen-free testing was reviewed. The JEITA ET-7304 standard5 has data which included: • Ion chromatography testing of raw flux (unsoldered) versus flux residue(reflowed) • Preparation using three combustion methods (quartz tube, oxygen flask, and oxygen bomb) at various temperatures and times Ion chromatography only, raw flux versus flux residue testing: The JEITA ET-7304 standard5 study compared raw flux with reflowed flux residue. Three samples were tested with five replicates

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each. Based on the information provided, it was assumed that the samples were either simply diluted versus reflowed and diluted and the chloride concentration was determined via ion chromatography. The samples were not prepared using an oxygen bomb combustion method. The analysis showed that the chloride concentration of the reflowed samples was less than that of the raw flux. Data is presented in Table 4.

Various paste and flux suppliers have completed specific analyses to try and address concerns that they have with halogen determination. There is still some debate as to whether the worst case ppm halogen in the unreflowed sample should be reported or that of the flux after reflow should be used. The after reflow

value more closely describes the amount of halogen that would be present on a soldered assembly.

Comparison of different combustion methods: Another study that was performed which indicated in the JEITA ET-7304 standard5 was a comparison of three common combustion methods, quartz tube, open flask and oxygen bomb with varying combustion temperatures and times. The data presented was assumed to be performed in a single laboratory. The sample tested was a soldering flux. A statistical analysis of the data showed that 95% of the Cl results, regardless of combustion method chosen fell in the range of 340 ppm + 22 ppm. The Br results showed a slightly larger range at a 95% confidence interval (307 ppm + 39 ppm). The oxygen bomb combustion method had the tightest range of results, as shown in Tables 5 and 6, so was the most repeatable of the test methods evaluated from the study.

As the JEITA test standard results5 were from a single laboratory, one of the major points of concern for those who are required to report halogen content would be the potential lack of repeatability between laboratories reportedly using the same test methodology. Toleno et al.19 reported findings of their lab-tolab comparative analysis. Based on the adhesive material tested, halogens were not intentionally added, but it was known that there are halogens naturally present in the material. The samples of the same lot batch of material were sent to three different labs for analysis to determine the amount of halogens present. As can be seen in Table 7, two laboratories using the same method obtained very different results, whereas two laboratories using two different methods obtained results within experimental error of one another. Therefore, not only is the test method important, but also the sample preparation and halide ion detection methodology used.

In another study by Seelig et al.20 data was presented from a global round robin study of six laboratories using the EN 1458216 oxygen bomb combustion test method. A paste was prepared with 13,000 ppm bromine (NC-A sample) and a control paste prepared with 0 ppm bromine (NC-B sample). The pastes were oxygen bomb combusted and analyzed via ion chromatography.

Comparative data from the six laboratories is shown in Table 8. Laboratory 3 data shows a variation in reported bromine value for the NC-A paste sample compared with the other five laboratory results. In

Global SMT & Packaging South East Asia –July/August 2011 – 15

A review of halogen/halide-free test methods and classifications for soldering materials

Table 9, the results for Laboratory 3 were omitted showing a relatively close set of bromine data results for NC-A sample paste for the five laboratories.

These findings are very useful, but a study of results for solder pastes that were closer to the halide-free pass/fail limit of 900 ppm Br and 900 ppm Cl would be more beneficial in determining the probability of false failures being reported. It would also be beneficial to know the accuracy limit, reproducibility (inter-laboratory and laboratory-to-laboratory) and uncertainty limits surrounding the acceptance levels of 900 ppm Br and 900 ppm Cl and total Br and Cl of 1500 ppm.

Based on this data review, an industrywide gage repeatability and reproducibility study is needed prior to establishing preferred halide test methodology and halogen-free pass/fail test limits.

Conclusions

In terms of trends for halogen-free definitions and standards, most of the standards for components, boards and materials use either 900 ppm or 1000 ppm Br or Cl as the definition for halogen-free. Many OEMs use the 900 ppm Br, 900 ppm Cl and 1500 ppm total Br + Cl criteria in specifying halogen-free products. This is close to the restriction requirements for substances such as PBDE (Polybrominated Diphenyl Ethers) and PBB (Polybrominated Biphenyls) and lead mentioned in the European Union RoHS legislation which indicates less than 1000 ppm.

The differences between halogen-free definitions have varied based on different dates of standard publication from around the world as well as different amounts of data available in the determination of halogen-free. As the halogen-free definitions varied, the test methods by which to measure these halogens have also varied.

There has been a movement to use oxygen bomb combustion testing followed by ion chromatography analysis. Based on the data reviewed, there have been variations seen in test results for halogens in soldering materials based on laboratory to laboratory test differences.

Future Work

Future work would include conducting round robin testing to address inter-laboratory test variation. Testing would take place using raw and reflowed flux samples.

The samples would be prepared for analysis using the EN14582 oxygen bomb test method15 as this would appear to be the most repeatable. The proposed round robin

testing would include samples which were halogen-free as well as samples containing 900 ppm Chloride and 900 ppm bromide.

At least one of the halogen containing compounds could be run multiple times at each laboratory over several days to determine test method reproducibility.

The main focus of this study would be to determine the source of any inter-laboratory variability and how to resolve these discrepancies.

As already indicated, work should be done to standardize the halogen-free definitions between IEC, JEITA and IPC standards. Also, the determination of halogen content using the oxygen bomb combustion test method followed by ion chromatography testing on different soldering, board and component materials would be of benefit.

Acknowledgements

The authors would like to thank the various persons involved in developing the data and standards discussed in this paper.

References

1. US Federal Specification QQ-S-571 Solder, Electronic (95 to 485 deg. C) 2. MIL-F-14256 standard, Military Specification: Flux, Soldering, Liquid, Paste Flux, Solder Paste and SolderPaste Flux (For Electronic/Electrical Use).

3. IPC-SF-818 standard, General Requirements for Electronic Soldering Fluxes, 1991.

4. IPC J-STD-004 standard, Requirements for Soldering Fluxes, 2008.

5. JEITA ET-7304 standard, Definition of Halogen-Free Soldering Materials, 2009.

6. IEC 61249-2-21 standard, ED. 1.0 B: 2003 Materials for printed boards and other interconnecting structures – Part 2-21: Reinforced base materials, clad and unclad – Non-halogenated epoxide woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper clad, 2003.

7. JPCA-ES-01 standard Halogen-free copper clad laminate test method, 2003.

8. IPC 4101 standard, Specifications for Base Materials for Rigid and Multilayer Printed Boards, 2009.

9. JEDEC JEP709 standard: A guideline for defining low halogen solid state devices (removal of BFR (Brominated Flame Retardant)/CFR (Chlorinated Flame Retardant)/PVC (Polyvinyl Chloride)), 2010.

10. JEITA ET-7304A draft standard,

16 – Global SMT & Packaging South East Asia – July/August 2011

Definition of Halogen-free Soldering Materials, 2010.

11. IPC TM-650 2.3.33, Presence of Halides in Flux, Silver Chromate Method, 2004.

12. IPC TM-650 2.3.35.1 Fluorides by Spot Test, Fluxes – Qualitative, 2004.

13. IPC TM-650 2.3.35 Halide Content, Quantitative (Chloride and bromide), 2004.

14. IPC TM-650 2.3.35.2 Fluoride Concentration, Fluxes – Quantitative, 2004.

15. IPC TM-650 2.3.28 Ionic Analysis of Circuit Boards, ion chromatography Method, 2004.

16. EN 14582 standard Characterization of waste. Halogen and sulfur content.

Oxygen combustion in closed systems and determination methods.

17. T. Jensen et.al., Internal company study on Oxygen bomb combustion testing of solder paste.

18. EPA SW-846 5050/9056 standard, Bomb/ion chromatography method.

19. B. Toleno et.al., Internal company study on Oxygen bomb combustion testing of adhesives.

20. K. Seelig et.al., The Call for HalogenFree Electronic Assemblies, www. aimsolder.com

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Global SMT & Packaging South East Asia –July/August 2011 – 17

Improved efficiency using root cause failure analysis

Improved efficiency using root cause failure analysis Gerry Padnos, Juki Automation Systems, Inc. Morrisville, North Carolina, USA

A PCB fails final test. Why? Was it the solder paste? The screen printer? The PCB assembly machine? The reflow oven or none of the above?

Unplanned downtime is a costly fact of life. In order to minimize the length of downtime it is necessary to have clear details on exactly what the source of the problem is, not just the symptoms. This information allows operators and maintenance personnel to go directly to take corrective steps more quickly and minimize downtime.

There are many machines involved in the assembly of a complete PCB: screen printers, conveyors, pick and place systems, reflow ovens, and Automated Optical Inspection (AOI). Some of this equipment has the ability to check its results before, during or immediately after it has completed its task.

Until now there have been few realtime tools for the pick and place systems.

In many cases, high speed movement on these machines makes it extremely hard to “see” exactly what is happening.

Components misplaced by the assembly system could be caused by many different factors. Without tools to provide a clear view of very high speed placement, it is difficult to determine the cause of misplacement.

How much easier would this task be if operators and maintenance personnel were armed with detailed information on the nozzles, feeders, and actual images of the picking and placing of parts on the PCB? This paper will discuss tools available for the placement machine to assist in root cause failure analysis (RCFA).

This paper was originally presented at IPC APEX Expo 2011.

Introduction

Root cause failure analysis (RCFA) is the process of determining the source of a problem. In many industries, especially those involving complex machinery, it is common to use root cause failure analysis when problems occur. Why is RCFA so important? Efficiency and accuracy. When it comes to the complicated and expensive machines used in the PCB assembly process, downtime equals increased costs, lost profits, missed deliveries, lost opportunities or all of these. Better efficiency is one of the few ways to compete with lower labor cost manufacturers. With so many machines’ specifications looking so similar on paper, features that allow end users to improve efficiency in the production process are gaining importance in the selection process. The use of RCFA tools can assist in improving utilization, efficiency and maximizing profitability.

Several systems to improve the production efficiency of the placement machine have been introduced over the years. There are tools designed for the direct improvement of utilization and indirect improvement. Twenty years ago, few pick and place machines had quick change feeder trolleys.

Why were they invented? To improve efficiency so the operator could change from one product to another faster. Intelligent feeders help the operator setup feeder trolleys offline and reduce the need for “buddy system” reviews of the feeder setup.

Splicing feeders and tray changers that can have parts replenished without stopping the machine also were created. All of these systems were designed to directly improve machine utilization and are now common in the industry. Other tools such as self-calibrations are indirect efficiency improvement tools. They reduce the chances of an error or the time needed for maintenance, but do not directly impact utilization. One thing these systems all have in common is that they are designed to improve the efficiency of the known or expected downtime.

RCFA deals more with the unplanned downtime due to unknown or unexpected causes. A failure has occurred. The goal is to find the problem as quickly as possible and get the machine back into production.

These tools can be separated into two categories also: after the fact and real time.

After-the-fact tools include self-diagnostics that can be run after a problem occurs to see if a system is performing properly.

Figure 1. Component present in tape and uncovered by cover tape.

18 – Global SMT & Packaging South East Asia – July/August 2011

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Improved efficiency using root cause failure analysis

Several tools exist to monitor machine performance in real-time such as tombstone detection and nozzle inspection, but these do not provide any insight into the cause of a problem. They only detect that there is a problem. Few systems exist to monitor the machine’s performance in real-time and provide useful information as to the cause of a problem. Unplanned downtime could be dramatically reduced with better root cause failure analysis tools.

The key to improving efficiency when unplanned downtime occurs is root cause failure analysis; determining the exact source of the problem. Knowing exactly what is causing a problem will allow maintenance personnel to focus their efforts on a clear target rather than just following a checklist of possible problems. Many people have had the unpleasant, inefficient experience of talking to phone tech support personnel who run down a checklist of “possible causes” for different problems.

But the reason the checklist is needed is that there is no data available about the root cause of the problem. Without knowing the root cause of any problem, maintenance personnel are essentially working with blindfolds on. New systems designed specifically to give better insight into problems can significantly reduce the time technicians need to spend diagnosing problems, and improve equipment utilization.

Figure 2. Image of component in tape allows technician to verify component presentation angle.

Defect prevention in assembly lines

One of the most common errors from the placement machine is missing or incorrectly placed components. There are two main types of defect prevention systems found in typical assembly lines: systems built into a machine to check itself and stand alone equipment whose sole function is to check for defects. An example of a system within a machine to check itself would be post-print inspection on a screen printer. This system checks for defects after the printer has completed its task of applying solder paste to the PWB. This “post print inspection” cannot say why there isn’t enough solder paste in a certain location, only that there isn’t. Wouldn’t it be much more useful to know why there isn’t enough solder paste on the board? Clogged apertures, dry paste, squeegee pressure and many more problems could be the cause.

Similarly, typical placement machines have several features to prevent defects, but most cannot provide insight as to why the defect occurred in the first place. Vacuum sensors are commonly used to detect when a component falls off the nozzle or isn’t

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Figure 3. Images before and after picking. Note that position on nozzle can be seen in the after image to confirm acceptable pick location

released on the board. Lasers can check for tombstoning, dropped components, and even incorrect or damaged nozzles.

But there are times within the production cycle when these sensors cannot provide useful root cause information. If the vacuum sensor reports an error, why did it occur? All the technician knows is that the required vacuum level was not achieved.

Was the component not aligned with the pick position? Is there a problem with the vacuum system? Is the nozzle damaged? Is the feeder feeding correctly? Was the component even present at the pick position?

All of these possibilities have to be considered, but each takes time to evaluate.

An example of a machine that is used solely to check for defects would be an AOI or SPI machine. These systems all check for problems that were caused by another machine in the line. They detect missing, incorrect or misplaced components, sat-

isfactory solder joints, etc. AOI machines provide very useful evaluation of the final PCB, but also have limitations. Like the systems described above, they cannot tell why a component is missing or incorrectly placed. If an image shows a component placed at the wrong angle, why did this happen? Was the feeder loaded incorrectly? Was the production program written correctly? Was the component properly oriented in the tape, tube or tray? The images from AOI are only of the results, not the process. In addition, typically there is only one AOI machine for the entire line so when a component is missing, the operator doesn’t even know which placement machine should have placed the component. The key to improving the efficiency of troubleshooting a missing or misplaced part is having actual images to see what happened during the pick and place process.

Global SMT & Packaging South East Asia –July/August 2011 – 19

Improved efficiency using root cause failure analysis

Reasons for failures

Focusing specifically on the placement machine, there are many reasons why a component may not be placed correctly on the PCB: • Damaged nozzle, • Feeder malfunction, • Component incorrectly packaged (wrong orientation in feeder), • Incorrect pick position teaching, • Incorrect component data, • Improper board support, or • Components sticking to the nozzle.

Figure 4. Top: Image showing solder paste prior to component placement. Middle: Image showing solder paste prior to component placement. Bottom: Component placed on PCB correctly.

20 – Global SMT & Packaging South East Asia – July/August 2011

Due to the high speed of today’s placement systems, it is extremely difficult for an operator to know which of the above is actually causing the problems. Therefore they are required to follow a pre-defined list of troubleshooting steps to eliminate one possible cause after another. Throughout the process, they are completely unaware of the root cause. In the end, if they haven’t found the problem, they just guess or use experience. This process is clearly imprecise and inefficient. Throughout the troubleshooting period, the machine is down and the line is stopped.

The time required to precisely locate the source of the problem could be dramatically reduced through better RCFA tools. One example is the use of simple pictures taken during the pick and placement process. Images of the various stages of the pick and place process instantly show the technician what happened and where the problem came from. This is made possible using tiny embedded high speed microcameras along with sophisticated image analysis. Along with the visual analysis by the technician, the software can provide automatic alerts when an error occurs and perform some RCFA on its own.

By capturing a series of images during the pick and placement operations, the technician can quickly see the following.

While some of the questions below are the results and not the cause, they still help reduce the time the technician needs to diagnose the root cause of the problem.

1. Was the nozzle damaged when it picked the part?

2. Was the component present in the tape?

3. Was the component in the correct/ expected orientation prior to pick?

4. Was the cover tape properly peeled back?

5. Did the nozzle lift the part out of the tape successfully?

6. Does the position of the part on www.globalsmtseasia.com

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Global SMT & Packaging South East Asia –July/August 2011 – 21

Improved efficiency using root cause failure analysis

the nozzle indicate the pick position is good?

7. Was the part present and properly oriented on the nozzle just prior to placement?

8. Was sufficient solder paste present on the pads?

9. Did the nozzle come down enough/too much when placing the part?

10. Did the component release properly when the nozzle moved up after placement?

In the time it takes to view a few pictures, the technician can accurately determine all of these points. The adage of a picture being worth a thousand words, or maybe a thousand seconds, is appropriate for this situation. Checking just a single item without the pictures would take as long as checking for all of these points with pictures.

Compare the process of isolating the problem for a missing component using improved RCFA tools versus manually in Table 1.

Technology

While RCFA is not necessarily a new concept, recent technology developments have made it much more affordable and effective.

The use of digital cameras has exploded in recent years. Cell phones drove the widespread miniaturization of cameras to the point where it has become practical to embed them into very small spaces, including the placement head of a pick and place machine. Cameras are now widely used in situations where it isn’t practical or possible for a human to watch something 100% of the time. Reports show that London has 10,000 security cameras throughout the city. Why? To help law enforcement find information that is simply not available using people on the street because it isn’t practical or economical. This is why cameras are well suited. The days when a placement machine moved so slowly that a human could observe the process are long past. The movement of the typical pick and place machine is faster than any other machine in the production line, making it difficult to monitor the activity of the machine. The machine also moves over a large physical space making it impossible for a single camera to accurately see what actions are happening. Small, high speed cameras are needed and they have to be able to move with the placement head as parts are picked in one location and placed in another. Watching by eye would be extremely difficult due to the speed and design of most placement machines.

Item

Using improved RCFA tools

Task with manual RCFA

Was the nozzle damaged when it picked the part?

1. Look at nozzle image for damage. Software identifies the nozzle used for the missing component automatically.

1. Look up which nozzle was used for the missing component 2. Remove the nozzle from the machine and examine it

Was the component present in the tape?

1. Look at tape pocket

1. Almost impossible to determine during highspeed assembly.

2. In some cases slow the machine down to watch.

Was the component in the correct/expected orientation prior to pick?

1. Look at orientation of component in tape in “before” pick image

1. Almost impossible to determine during highspeed assembly.

2. In some cases slow the machine down to watch.

Was the cover tape properly peeled back?

1. Look at “before” pick image

1. Stop production and use teach camera to check pick position. If cover tape is present, it is likely the cause.

Did the nozzle lift the part out of the tape successfully?

1. Look at the before/after pick images. Software automatically detects when the part isn’t picked.

1. Use vacuum sensing and/or laser presence check.

Does the position of the part on the nozzle indicate the pick position is good?

1. Look at “after” pick image

1. Almost impossible to see on high speed machine

Was the part present and properly oriented on the nozzle just prior to placement?

1. Look at “before placement” image

1. Almost impossible to see on high speed machine

Was sufficient solder paste present on the pads?

1. Look at pads in “before placement” image

1. Use SPI machine or function on screen printer OR 2. Check after using AOI or visual inspection

Did the nozzle come down enough/too much when placing the part?

1. Look at “during placement” image

1. Almost impossible to see on high speed machine

Did the component release properly when the nozzle moved up after placement?

1. Look at “after placement” image

1. Use vacuum and/or laser release check sensor

Table 1. Isolating the problem for a missing component using improved RCFA tools versus manually.

A component may appear to bounce after placing, but did it happen because the part temporarily stuck to the nozzle? Or was there too much placement force and the component? The still images can show what is otherwise impossible to see.

The size, field of view, and resolution are all critical technologies for the camera.

22 – Global SMT & Packaging South East Asia – July/August 2011

It must be small enough to fit inside the placement head without adding significant weight which would impact the throughput or design of the placement head. The field of view must be wide enough to capture the component in the feeder and the component in the up position after being picked. At the same time, the resolution

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Improved efficiency using root cause failure analysis

very high speed communication between the camera software and placement hardware.

Conclusion

New tools are invented constantly to “make life easier”. In a production environment, this often translates to “more efficient”. A compound miter saw makes a carpenter more efficient in his work. E-mail makes communications more efficient. Root cause failure analysis is a tool that can be used in many situations and industries to improve efficiency of troubleshooting. Technicians can quickly find the source of problems so they can be fixed fast and fixed right the first time. Airplane black boxes and cockpit recorders allow investigators to determine what happened even when there is no one to tell them anything. Cars now have some similar functions. Now imagine if every airplane or car had a camera and showing the interior for crash analysis. It would probably be even more effective than a simple voice recording. Similarly useful tools are now available for the high speed SMT assembly line with the same benefits; clear and quick understanding of the root cause of the problem, which leads to improved efficiency in fixing the problem.

While some sensors and self-diagnostic tools exist, they are generally do not focus on finding the root cause. Root cause failure analysis tools such as embedded micro cameras to show the exact details of the pick and place process along with powerful analysis software can save a huge amount of time versus methods commonly used today and dramatically increase efficiency and equipment utilization.

Figure 7. Example of micro-cameras embedded into placement head.

Figure 8. Analysis software showing results of all placements on a PCB along with statistical data.

must be high enough to allow the image processing software to accurately detect even subtle differences required for accurate analysis.

While the images are the key to locating the root cause, the software is also critical in warning the operator of an error and providing analysis that may not be possible by eye. Powerful software analyzes each image to detect when the component is not picked, is not placed, and even calculates the amount of board deflection during placement. Through communication with the placement machine, it can also show trends such as identifying the feeders, nozzles, or placement sites experiencing the most problems. Although it is common

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for a placement machine to identify feeder experiencing higher than normal errors, nozzle and placement errors are not as easy for typical placement systems to identify.

The analysis of the images is what makes these functions possible or more accurate.

This information can also help the operator determine the root cause of problems more quickly.

Finally, the software must be accurately synchronized with the movement of the placement machine. Images must be captured in very high speed at very specific points in time; the exact moment the nozzle goes down to pick the part, the moment the head goes down to place the part, etc. This requires synchronization and

Global SMT & Packaging South East Asia –July/August 2011 – 23

2H’11: Uncertainty prevails but modest growth remains likely

2H’11: Uncertainty prevails but modest growth remains likely

A

s we enter the second half of 2011, the near-term outlook is not clear.

Arguments can be made for either a double-dip recession or a 2H’11 upturn.

We believe the later, but uncertainty still exists.

Per Chart 1 we are currently at the “zero growth” portion of the business cycle. The global economy and electronic equipment are still expanding at modest single digit rates, but electronic component and material growth rates are near “break even.”

Converting Chart 1 to real data, Chart 2 shows three-month (3/12) growth rates for global electronic equipment, printed circuit board and semiconductor shipments compared to the global purchasing managers’ index (PMI) as a leading indicator. The PMI suggests that “things will get worse before they get better”—at least short term.

shipments should increase in the second half of this year, both due to normal seasonality and Japan’s recovery efforts from its March earthquake. It would appear that regional end-market growth rates may “bottom” in the single digit range in 2011 (except for Japan).

Electronic components

World semiconductor shipments peaked in early 2011 (Chart 5) but should soon see a seasonal upturn. Gartner recently predicted 5.1% chip growth for 2011 (Chart 6).

Printed circuit boards are behaving similarly. Current regional PCB growth rates (Chart 7) are approaching zero (except for Japan) but normal seasonality suggests a 2H’11 rebound leading to 5% global PCB growth in 2011 vs. 2010 (Chart 8).

Chart 9 summarizes recent forecasts for the electronic supply chain. Assuming that Japan continues to recover and/or its critical components are available to world assemblers (from Japan or another source) and also that the world avoids major turmoil and/or an economic meltdown we still see 2011 as a low growth (but not disastrous) year.

Per Chart 3 Taiwan/China electronic equipment shipments increased 8.1% (3/12 basis) in May 2011. In April (latest data available), Europe was up 10.6%, Japan was down 20.2% and the USA rose 2.8% (Chart 3). Recent performance is not encouraging but globally (Chart 4) electronic equipment

%Growth

End markets

China’s top 100 companies produced 26.82 million computers, 73.67 million colored TV sets, and 174.52 million cell phones in 2010.—Ministry of Industry and Information Technology

Computers & peripherals • Worldwide PC shipment forecast was • • • •

Forecasts

World electronic equipment production

20050118

Walt Custer and Jon Custer-Topai

•

•

•

adjusted down to 9.3% y/y growth and 385 million units by Gartner.

Global PC shipments declined 1.1% y/y to 84.3 million in 1Q’11.—Gartner Workstation shipments fell 4.8% q/q and grew 18.6% y/y to 860 thousand units in Q1’11.—Jon Peddie Research Worldwide notebook shipments declined 13.2% m/m to 15.4 million units in April.—DRAMeXchange Worldwide server shipments grew 8.5% to 2.3 million units; revenue increased 17% y/y to 12.6 billion in 1Q11.— Gartner Computer hard drive revenue for PCs and servers are projected to grow 4.1% to US$28.1 billion in 2011.—IHS iSuppli Total disk storage systems capacity shipments grew 46.3% y/y to 4,956 petabytes in 1Q’11, sales revenue increased 13.2% y/y to $5.6 billion.—IDC Worldwide enterprise storage sys-

20110619

World Global PMI, Electronic Equipment, PCB & Semiconductor Shipments

BUSINESS CYCLE Supply Chain Effect OEM PCBs

Inventory Increases

Converted @ Constant 2008 Exchange Rates

CEM Raw Material

3/12 rate of change

PCB El Equip

1.5

"0" Growth Global PMI

SIA

1.3

We are here

1.1

0

0.9 0.7 0.5

Expansion

3 6 9123 6 9123 6 9123 6 9123 6 9123 6 9123 6 9123 6 9123 6 9123 6 9123 6 9123 6 02 03 04 05 06 07 08 09 10 11 00 01

Inventory Reductions Time

CALENDAR YEAR

Recession

Source: Custer Consulting Group

Chart 1.

24 – Global SMT & Packaging South East Asia – July/August 2011

Chart 2.

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2H’11: Uncertainty prevails but modest growth remains likely

• • •

•

tems market is expected to grow from $30.8 billion in 2010 to $37.3 billion in 2015.—IDC Worldwide external controller-based disk storage market grew 14.1% y/y to $5 billion in 1Q11.—Gartner DSL, PON, and Ethernet FTTH equipment market declined 2% to $1.96 billion in 1Q’11.—Infonetics Research Ethernet switching market revenue was down 12% sequentially and 9% y/y to $4.2 billion in 1Q’11.—Infonetics Research Worldwide Ethernet switch market declined 9.1% y/y in 1Q’11; router market grew 6.9% y/y.—IDC

Mobile communications • Worldwide smartphone shipments are

expected to grow from 472 million in 2011 to 982 million units in 2015.— IDC • Worldwide mobile communication device sales grew 19% y/y to 428 million units in 1Q’11.—Gartner • Mobile broadband network infrastructure annual investment is expected to

grow from $22 billion in 2011 to $48 billion in 2014.—Strategy Analytics

Consumer electronics • Global total set top box shipments

(including DTT, IPTV, cable, and satellite connections) are set to grow from 177m in 2009 to over 207m in 2014.— Business Insights • Global TV shipments were down 29% Q/Q and 1% y/y to 55.2M units 1Q11.—DisplaySearch

EMS, ODM & related assembly activity

China’s ODMs and EMS providers raised factory prices by between 5-10% to balance increasing material and operation costs, but the end result caused them to lose market share in 1Q’11.—IHS iSuppli Automated Circuit Design • added two new Juki lines and 13,500 SF to its existing facility.

• purchased four PCB vertical carrier carts with 20 carriers from Bliss Industries.

20110619

20110619

Global Electronic Equipment Shipment Growth

1.6

3/12 rate of growth in local currency

1.5 1.4

190 180 170 160

Thousands

$ Billions

2010/2009 growth +20.9% 1Q'11/1Q'10 growth +4.6%

155

150

1.2

140 130

1.1

120

1

110

105

100 90

0.9 0.8

0.6

World Electronic Equipment Monthly Shipments Converted @ Constant 2008 Exchange Rates

Taiwan/China Europe Japan USA 0 Growth

1.3

0.7

Badger Technologies is adding 16,600 SF and renovating its existing facility in Farmington, NY. Becom Electronics is investing HUF 480 million (EUR 1.8 million) to construct a new production hall in Hungary.

Flextronics • donated $250K for Japanese Disaster Relief.

• plans to lay off 254 workers in Massachusetts by Aug. 31, 2011 as a result of Verizon Wireless contract termination.

Foxconn/Hon Hai • expanded production by 50% at its LCD manufacturing facility in Nitra, Slovakia.

• halted plans to manufacture tablet computers in Hengyang, China.

• was removed from Hong Kong’s benchmark Hang Seng index.

• invested in WIMM Labs.

• is building a US$2.5 billion LCD monitor factory in Chongqing, China.

• laid off 225 employees from its FIHTK, CDMA handset design subsidiary in Korea.

55

80 70

Europe = Eurostat EU27 NACE C26 (computer, electronic & optical products)

60

CALENDAR YEAR

5 1 3 5 7 9111 3 5 7 9111 3 5 7 9111 3 5 7 9111 3 5 7 9111 3 5 7 9111 3 5 7 9111 3 5 7 9111 3 5 7 9111 3 5 7 9111 3 5 7 9111 3 5 02 03 04 05 06 07 08 09 10 11 00 01

1 4 7 10 1 4 7 10 1 4 7 10 1 4 7 10 1 4 7 10 1 4 7 10 1 4 7 10 1 4 7 10 1 4 7 10 1 4 7 10 1 4 7 10 1 4 02 03 04 05 06 07 08 09 10 11 00 01

CALENDAR YEAR Source: Custer Consulting Group

Chart 3.

20110530

30

Chart 4.

20110622

World Semiconductor Sales

World Semiconductor Shipments

US$ Billions (3-month average)

Total

Monthly US$

Record high

350 300

25

250

20

$ Billions

-10.5% 255

+31.1%

299

+5.1%

315

228

200

15

150

10

2009 recession much sharper but shorter than 2001

5 0

1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 00 01 02 03 04 05 06 07 08 09 10 11

50 0

2008

2009

2010

2011

Gartner 6/11

SIA

Chart 5.

www.globalsmtseasia.com

100

Chart 6.

Global SMT & Packaging South East Asia –July/August 2011 – 25

2H’11: Uncertainty prevails but modest growth remains likely

20110619

1.9 1.8 1.7 1.6 1.5 1.4 1.3 1.2 1.1 1 0.9 0.8 0.7 0.6 0.5 0.4

Chart 7.

Regional PCB Shipment Growth 3/12 rate of growth in local currency

Taiwan/China Europe Japan N America 0 Growth

Chart 8.

20110619

60

50

World PCB Shipments (with forecast) Converted @ Constant 2008 Exchange Rates $ Billion Assumptions: Europe = composite European SIA & local PCB assoc data Japan & N. America from JPCA & IPC data Taiwan/China based upon 44 rigid & flex company composite Rest of Asia growth = Taiwan/China 44 company composite Data scaled to match Henderson Ventures annual totals 2008 based upon sum of monthly totals

+5% +19% -20%

40

30

20 1 4 7 10 1 4 7 10 1 4 7 10 1 4 7 10 1 4 7 10 1 4 7 10 1 4 7 10 1 4 7 10 1 4 7 10 1 4 7 10 1 4 7 10 1 4 02 03 04 05 06 07 08 09 10 11 00 01

CALENDAR YEAR

Sources: IPC, JPCA, Taiwan/China composite; modified SIA chip shipments to approximate Europe

• plans to invest $12 billion in Brazil over

next five years.

• had a large explosion and fire at its Chengdu, China, factory.

• is investing US$80 million in its Chinese subsidiary Zhengzhou of Henan Province.

• is splitting into small firms to be competitive.

• was Taiwan’s largest enterprise in terms of revenue in 2010.

Hanza received a 34 MEUR defense order from Saab.

IEC Electronics and Benchmark Electronics joined the Aerospace Industries Association.

IMI acquired EPIQ assets in Bulgaria, Mexico & Czech Republic.

Incap • became a supplier of electronic modules for Aidon’s smart metering and smart grid devices.

• received contract to manufacture electronics for sauna heaters made by Tulikivi.

Jabil Circuit • hired 670 workers and expanded operations in Hungary to increase production of high-speed mobile data transmission networks.

• received a manufacturing contract for Electro Precipitation Integrated Water Systems from Latitude Solutions.

Kimball Electronics purchased a SMT line with SIPLACE SX placement machines and SIPLACE CPP MultiStar heads in Tampa, Florida.

Kitron • received a $3.9 million (NOK 22.5 million) contract from Lockheed Martin to produce Integrated Backplane Assembly for the F-35 low rate initial production program.

• received US$ 3.2 million contract

31.6 38.6 31.2 29.4 31.7 37.6 42.9 51.7 54.3 51.1 41.0 49.0 51.5 13579111357911135791113579111 357911135791113579111357911135 791113579111357911135791113579111 01 02 03 04 05 06 07 08 09 10 11 12 99 00

CALENDAR YEAR Source: Custer Consulting Group - base year expanded by monthly growth of N. American, European, Japanese & Taiwan/China monthly PCB shipments

from Kongsberg Defense Corporation to deliver electronics for common remotely operated weapon station.

Melecs opened a EUR 3 million manufacturing facility in Gyor, Hungary.

Nortech Systems named Jill Hesselroth VP of global supply chain and John Shelander senior business development manager of aerospace systems operations.

On-Track Technology added a Rehm Thermal Systems VXS422 convection reflow solution.

Partnertech received a U.S. development and production contract from Tomra Systems.

Protonic Holland BV added a new Mydata MY100DX14 pick-and-place machine.

Sanmina-SCI • former president and COO, Hari Pillai, will continue working for the company in an advisory capacity through May 5, 2013 for $335,000 per year.

• received Strategic Supplier of the Year award from Ciena.

Scanfil • EMS closed its Vantaa, Finland, operations.

• changed its name to Sievi Capital plc.

SMT Holding ceased operations at its Changchun factory and scaled down operations in Suzhou and Dalingshan.

TES Electronics Solutions, Langon, France, was broken up and sold off to three different companies by order of the Tribunal de Commerce de Rennes.

The Paragon Electronics Group received a contract to manufacture traffic signals and controllers for Peek Traffic.

TPV will invest US$90 million to establish a factory in Chengdu, China, with production to begin in 4Q’12.

Videoton • added three complete Fuji NXT insertion lines, welding machines and auto-

26 – Global SMT & Packaging South East Asia – July/August 2011

matic optical test equipment.

• acquired direct majority ownership in STS Technology Kft, Győr, Hungary.

Wistron is setting up a plant to produce notebook and desktop PCs, LCD TVs and communications devices in Chongqing City, China.

PCB fabrication

Japanese are investing more than $1.0 billion in overseas PCB expansion in FY2011.—Dr. Hayao Nakahara Taiwan’s PCB production value is expected to increase 13.5% y/y to US$6.15 billion in 2011 due to order transfers resulting from March 11 Japan earthquake.—IEK World PCB production value will reach $59 billion in 2012 based on WSTS Semiconductor projection of $338 billion.—Dr. Hayao Nakahara All Flex added 5,000 SF plus capital equipment to its second production facility in Bloomington, Minnesota.

American Standard Circuits received polyimide qualification under MILPRF-55110, amendment 3 and MILPRF-31032.

APCB is building a second plant next to its existing plant in Kunshan, China.

Aspocomp • appointed Tero Päärni as head of sales and marketing and Antti Kangas quality manager at Aspocomp Oulu Oy. • purchased 10% of the shares in Aspocomp Oulu from TTM Technologies’ subsidiary MTG. MTG paid EUR 14.5 million for 20% of the shares in Meadville Aspocomp Holdings.

AT&S • bought a plater from Atotech for its Cu18 IP2 line.

• is building a microvia (conventional ANYLAYER boards and ALIVH

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2H’11: Uncertainty prevails but modest growth remains likely

board) plant in Chongqing, China.

Bare Board Group released “Printed Circuit Boards for Dummies.”

Beta Layout acquired Sprig Circuits.

Camtronics Vale Limited was acquired by PhotonStar LED Group.

Cicor • Electronic Solutions Division appointed Erich Trinkler executive VP and head of the Cicor Electronic Solutions division.

• established Suzhou Cicor Technology in Suzhou, China.

Compeq is moving its rigid-flexible PCB plant in Taoyuan, Taiwan, to its HDI board plant in Huizhou, China.

Eurotech acquired Dynatem.

Founder Technology is building a second plant next to its existing plant in Chongqing, China.

Global Brands Manufacture is expanding its monthly PCB production capacity from 4.1 to 4.7 million SF/month.

Gold Circuit Electronics is investing US$24 million to expand its monthly HDI production capacity in Changshu, China, from 50,000 to 200,000 SF by 4Q’11.

Graphic Plc • installed a hybrid collimation accutray system for solder mask imaging at its Crediton, England facility.

• received a special ‘suppler recognition award’ from BAE systems.

GUH is investing RM16 million to expand 2-sided and 6-layered PCB bare board production in Penang and Suzhou, China to 50,000 m2 in 2H’11.

HannStar Board • is building PCB plants in Chongqing, China, with 3,000,000 SF/month capacity.

• transferred over-booked orders to Global Brands Manufacture.

Ibiden is spending RM1billion to build second 40,000 m2/month smart phone motherboard plant in Penang, Malaysia.

Kinsus Interconnect Technology received NT$40-50 million (US$1.39-1.73 million)/ month in revenues from FC CSP substrate orders from Intel.

Meiko Electronics will install an automotive circuit board production line in Hanoi, Vietnam, in fiscal 2011.

MFlex added a 290,000 SF facility in Chengdu and 610,000 SF plant in Suzhou, China.

Multek • named Bill Beckenbaugh CTO. • was certified to manufacture PCBs with Shocking Tech’s Voltage Switchable Dielectric™ (VSD) material.

Nippon Mektron exhibited a stretchable flexible printed circuit board prototype.

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Panasonic is investing Global Electronic Supply Chain Forecast 10 billion yen in Taoyuan 2011 vs 2010 County, Taiwan, to increase its ALIVH highHenderson Ventures 3 Combined GDP density multilayer board manufacturing capacity.

Prestwick Circuits GPS 6 Henderson Ventures Electronic Equipment was named PCB global strategic partner for TT Custer 5 Rigid & Flex PCBs electronics.

Consulting Group Shanghai Unitech added more laser drills after Gartner 5 Semiconductors receiving large-volume HDI board orders that -2 0 2 4 6 % Change pushed PCB production lines to capacity.

Chart 9.

Taiwan PCB Techvest • and T-Flex Techvest PCB are jointly ASM Assembly Systems (formerly Siemens investing US$17.0 million to estabElectronics Assembly Systems) introduced lish a 1.2 million SF/month PCB JV in Suining, China.

SIPLACE Setup Center 4.0 for setup verifi• will ramp up total capacity of its plants cation and fill level management. in China by 20% to 6.6 million SF/ Baotek increased its production capacity month by the end of 2011. for fiberglass fabrics to 6.5 million meters TC Cosmotronic expanded inner layer in July. imaging, inner layer develop/etch/strip, BTU International inner layer AOI and alternative oxide • received Best Presentation award application and added CAM and film plotfrom SMTA China for “Lowering Your Reflow Cost”. ting in Fullerton, California.

• Zeping Zheng received “Officer of the Transline Technology acquired Hi Year 2011” award from SMTA China.

Electronics.

Cadence Design Systems acquired Altos TTM Technologies • acquired remaining 20% stake in Design Automation.

Meadville Aspocomp Holdings.

Christopher Associates • Guangzhou facility was awarded • released multiple camera retrofit kit for Nadcap AS9100B accreditation for Marantz AOI systems.

• won 2011 NPI award for its Akila XR-3 aerospace quality.

X-Ray inspection system.

Unimicron is building a plant for its Csun China subsidiary Suzhou Top German subsidiary RUWEL International Creation Machines received orders for in Kunshan, China. wet processing equipment from Advanced Wus Printed Circuit will open a plant in Semiconductor Engineering, Foxconn Kunshan, China, in 2012.

Electronics, Gold Circuit Electronics, Kinsus Interconnect Technology, Nanya Materials & process PCB and Wus Printed Circuit. equipment Dow Corning named Robert Hansen SMT equipment market is expected to be CEO. Stephanie Burns remains chairman. in excess of $6.5 billion by the year 2017.— Enthone Global Industry Analysts • appointed Robert Haskins Sr. VP and 3M named George Buckley COO. regional managing director, Asia.

Agilent Technologies introduced the first • was named “Top 10 International modular embedded controller for AXIe Electroplating Brand” systems based on the AdvancedTCA bus.

• Amy Tsang, Enthone Asia techniAir Products cal director—Performance Coatings • acquired Poly-Flow Engineering. was named one of the “Top 10 Most • opened an electronic materials facility Influential People.” in Banwol, Korea.

Essemtec introduced Traqu, a high-resoluAlpha-Cookson Electronics received the tion digital inspection device for 3-D meaIPC APEX Expo Best Poster Paper award. surement and analysis in processes such as Arlon Materials for Electronics introsolder paste inspection. duced GenClad 280 bond-ply, woven fiberFulltech is increasing its electronic grade glass reinforced, ceramic-filled composite fiberglass yarn capacity to 81,000 tons material. by year end 2011 with the addition of an 20110619

Global SMT & Packaging South East Asia –July/August 2011 – 27

2H’11: Uncertainty prevails but modest growth remains likely

800,000 m2/month fiber glass fabric plant.

Head Invest acquired JOT Automation.

Hitachi Chemical is investing 2 billion yen to double dry film photoresist manufacturing capacity in China to 200 million m2 per year.

Indium Corporation VP of technology Dr. Ning-Cheng Lee was recognized for Best Presentation of Technology Conference One at NEPCON China (Shanghai) 2011

by SMTA. Keithley Instruments moved hundreds of manufacturing jobs from Solon, Ohio, to China.

Kurabo is investing 6 billion yen to build a flexible circuit substrate manufacturing plant in Mie Prefecture, Japan.

LORD Corporation introduced a low cost underfill encapsulant developed specifically for the semiconductor packaging and assembly industries.

LPKF • introduced its ProtoMat S-Series entry-level milling machine for rapid PCB prototyping.

• Laser & Electronics acquired 100% shareholding of external stakes in subsidiaries LPKF Motion & Control in Suhl and in LPKF Distribution in Portland.

Marantz Business Electronics separated from its parent company D&M Europe BV in a management buyout. Its PCBA division will continue under the name of MEK Europe BV. Maskless Lithography appointed former Foxconn executive Richard Chenoweth, VP of global sales and marketing, and former Sanmina-SCI executive, William Pappani, CFO. MIRTEC • Europe appointed LTHD as Its exclusive distributor for Romania.

• received a 150 machine order at SMT/ PCB NEPCON KOREA. Mitsubishi Electric is expanding its PCB laser drilling system manufacturing capacity by 50% in 2H’11.

Mitsubishi Gas Chemical restored BT-based laminate production to preearthquake volume.—Dr. Hayao Nakahara Mitsui Metal is building an ultra-thin copper foil manufacturing line in Malaysia with a monthly capacity of 600,000 m2.

Nordson • ASYMTEK introduced its Select Coat SC-280 film coater.

• DAGE established its Chinese website www.nordsondage.com/china.

• MARCH introduced MaxVIA™ plasma treatment system.

• opened a demo center in Dongguan, China.

Orbotech • completed public offering of 7,705,000 ordinary shares at $12.50 per share.

• Orbotech Pacific opened an office in Suzhou, China.

Panasonic Electric developed a halogenfree laminate series “MEGATRON2” with a low tangent loss of 0.010 for high-speed multilayer circuit boards.

Park Electrochemical promoted Christopher Mastrogiacomo to Ex. VP and COO and Mark Carlson to director of sales—Americas.

QSX Instruments introduced Quickshot XRF analyzer line for RoHS testing requirements.

Rehm Thermal Systems introduced its CondensoX soldering system.

Rogers opened a new production facility in Suzhou, China.

Royce & Associates purchased a $7.5 million stake in BTU International.

Seika Machinery appointed Koichi Koba executive VP and promoted Isao Muraoka to president and CEO. SIPLACE established a branch office in Bundang, Korea.

Taiwan Glass is expanding its combined capacity for fiberglass yarns in Taiwan and China to 115,000 tons in 2011-2012.

Tanaka Precious Metals began sale of SEA silver bonding wire.

Technic • received exclusive sales and distribution rights in the US, Canada and Mexico for STS vibratory technology.

• named STS Switzerland its European representative for its plating equipment products.

Tongtai Machine & Tool secured orders for NT$460 million for PCB drilling machines from tablet PC manufacturers.

Topoint is investing US$6 million to set up a new PCB drilling plant in Suzhou, China.

Universal Instruments relocated its European headquarters to Bratislava, Slovakia.

Veeco opened its China Training Center in Shanghai, China.

VJ Electronix moved into 1500 m2 facility in the Suzhou Industrial Park near Shanghai, China.

Semiconductors & other components

Semiconductor market is expected to grow by 7.6% to $338.4 billion in 2012.— WSTS IDC cut semiconductor annual revenue growth forecast to between 4-5% from 6-8%.

28 – Global SMT & Packaging South East Asia – July/August 2011

European semiconductor distribution grew 33.5% y/y to 1.81 billion Euros in 1Q’11.—DMASS Japan’s April chip sales fell 26.4% m/m and 18.8% y/y to $2.94 billion due to the March 2011 earthquake.—WSTS Worldwide semiconductor capital equipment spending is projected to grow 10.2% to $44.8 billion in 2011.—Gartner SEMI • Worldwide semiconductor manufacturing equipment billings increased 61% to US$12 billion in 1Q’11.

• Semiconductor fab equipment spending is expected to rise 31% y/y to $44 billion in 2011.

• Worldwide semiconductor manufacturing equipment sales grew 148% y/y in 2010 to $39.54 billion; semiconductor materials sales grew 25% y/y to $43.55 billion.

• Worldwide semiconductor manufacturing equipment sales are expected to grow 16% y/y to $45.81 billion in 2011.

• Worldwide silicon wafer area shipments increased 3% y/y to 2.29 billion square inches in 1Q’11 Semiconductor average content per automobiles is expected to increase 15% to USD 350 in 2011 to $425 per vehicle in 2014.—IC Insights Worldwide PC microprocessor unit shipments were up 7.4% y/y in 1Q11; IDC upgraded 2011 forecast to 10.3% growth.

Connector industry’s sales grew +28.4% in 2010, its largest y/y growth in history.— Bishop & Associates Global NAND flash market grew 9.9% q/q to US$5.36 billion in 1Q’11.— DRAMeXchange Worldwide DRAM revenues fell 4% q/q to US$8.3 billion in 1Q’11.—DRAMeXchange Walt Custer is an independent consultant who monitors and offers a daily news service and market reports on the PCB and assembly automation and semiconductor industries. He can be contacted at walt@ custerconsulting.com or visit www. custerconsulting.com.

Jon Custer-Topai is vice president of Custer Consulting Group and responsible for the corporation’s market research and news analysis activities. Jon is a member of the IPC and active in the Technology Marketing Research Council. He can be contacted at jon@custerconsulting.com.

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Title

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Global SMT & Packaging South East Asia –July/August 2011 – 29

X-ray inspection of semiconductor devices that use copper wire interconnections

X-ray inspection of semiconductor devices that use copper wire interconnections

David Bernard, Ph.D., and Evstatin Krastev, Ph.D., Nordson DAGE, Aylesbury, Buckinghamshire UK

Copper wire is increasingly being used to replace gold as the interconnection of choice. This article discusses the use of x-ray inspection to check for the presence and alignment of interconnection wires.

I

n addition to the standard electronic packages that have been available for many years, new packages continue to become available which have increased complexity in terms of their functionality as well as their construction. Until recently, whatever the package, be it a simple SOIC or a more complicated package on package (PoP) configuration (perhaps with multiple stacked die), all of the internal interconnections within the packages were made with gold wires. However, copper wire is now increasingly being used to replace gold as the interconnection of choice, primarily because of its reduced cost (Figures 1 and 2). Part of the quality control standards used during device manufacture is to check for the presence and alignment of the interconnection wires, especially after the outer package has been molded. This is accomplished, non-destructively, by x-ray inspec-

tion. X-ray inspection also will be used once the device has been assembled onto the printed circuit board for failure analysis or counterfeit prevention applications, so that, once again, the insides of the package can be investigated non-destructively prior to further, possibly destructive, investigation.

X-ray inspection is an analytical technique that provides images based on the relative absorption of the x-rays by the various material densities contained within the sample. Thicker, and more dense materials (e.g. solder paste), absorb the x-rays far more completely compared to thin¬ner, and lower density materials (e.g. fiberglass with embedded copper tracks), thereby providing a range of gray scale densities in the image to enable analysis of distinct features/flaws.

The use of gold, with its high density,

Figure 1. Flat panel detector x-ray image of equivalent components: 35 μm diameter copper wire interconnections (left) and 30 μm diameter gold wire interconnections (right).

30 – Global SMT & Packaging South East Asia – July/August 2011

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X-ray inspection of semiconductor devices that use copper wire interconnections

has been sufficient to provide well contrasted x-ray images for analysis, even though the interconnec¬tion wire diameters used have continued to shrink (now to 25 μm, or less).

However, as copper has less than half the density of gold, copper wires will appear far less distinct in the x-ray image (see images). This reduction in clarity will be even harder to see once the device has been assembled onto a board, as it will have to be seen against the background densities of the package and other parts of the board (Figure 2).

To combat this issue, and the continuing challenges of newer, smaller and less dense components, x-ray inspection systems are now available with alternative imaging detectors and improved x-ray tubes. With x-ray detectors, the image intensifier (II), so long the detector of choice in electronics, may now need to be replaced with a flat panel CMOS area array detector (FP detector). With x-ray tubes, there is the need for a tube with more x-ray power at lower accelerating voltages (kV), so as to retain a good relative absorption through these thin, lower density materials but, vitally, the tube must also retain the resolution (or minimum feature recognition) at this higher power because of the need to image reduced feature sizes. There are a variety of FP detectors and different x-ray tube types available in the market. However, the performance of each different tube/

detector combination in an inspection system is not necessarily equal for all electronics applications.

Generally, a good quality FP detector will provide a bet-ter contrasted image than the best IIs and will do so more quickly, as the FP has less noise than an II. This may al-low faster inspection times.

However, the gain within a FP detector is much lower than for an II. This means FP based x-ray systems have to operate, typically, at much higher tube powers. If the tube resolution then suffers, as is the case with some x-ray tube types, then observing the smallest features may not benefit from FP imaging. In addition, the FP detector elements are usually much larger than in IIs. Therefore, there will be less image detail at the highest magnifications using a FP. It should also be noted that the CMOS elements in the FP detec-tor will be damaged by the radiation used for inspection unless there is intrinsic shielding within the detector. The specification of the individual FP will advise if this is the case.

The best advice is always to try the system before any purchase, using good and ‘good bad’ examples of the types of components and assemblies that are to be inspected regularly. Overall, x-ray inspection of copper wire interconnections within electronic components is possible but it may require a newer system specification to accomplish it.

Figure 2. Flat panel detector x-ray images of QFN components assembled onto a PCB. Device with copper wire interconnections (left); device with gold wire interconnections (right).

From One Engineer To Another ®

Dr. Ning-Cheng Lee, Vice President of Technology nclee@indium.com

“ Voiding under low stand-off components, such as QFNs, can be effectively minimized through material and process optimization. Let me show you how.”

Find out: indium.us/D154 • answers • blogs • tech papers • one-on-one • support • live chat

scan code with mobile device

ASIA • CHINA • EUROPE • USA

www.indium.com ©2011 Indium Corporation

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Global SMT & Packaging South East Asia –July/August 2011 – 31

Title Interview

Interview—

Ravi Pagar, element14

Leading supplier of electronic components, element14, has launched “the knode”—said to be an amalgamation of design engineering and knowledge.

In an interview, Ravi Pagar, director-India, element14, outlines the knode, a solution where design engineers can get trusted information on processes, and which acts as a knowledge source for them. Pradeep Chakraborty recently had the opportunity to speak with Mr. Pagar about the knode.

What is the initiative all about? How will the knode bring together all software tools, development tools and kits, operating systems?

The name for the solution was derived from the meaning of “node”—any point on a circuit where two or more circuit elements meet. The element14 knode brings knowledge (KNO) and design engineering (DE) together in one place.

The element14 knode was developed completely in-house by the element14 development team. It is the result of the need to create a solution that positively impacts the overall design flow and simultaneously streamlines working with component manufacturers and suppliers.

It is one place where design engineers can quickly and easily get trusted information for their design process. It acts as a virtual workspace for the design engineering community.

Experts, design tools, IP, unique valueadded design solutions, development platforms, components, services, hardware, software and up-to-date technical information have all been integrated into one convenient place: the element14 knode—knowledge for design engineers.

What else does the knode do to fulfill engineers’ needs for full suite of design tools and integrated solutions?

The element14 knode is poised to have a dramatic impact on the overall engineering design cycle and workflow, cutting design

times from weeks and months to days and hours in some cases. In fact, most engineers go to vendor websites to research products for a design, which is a very timeconsuming process. By providing one place to get trusted information, element14 has eliminated the need for engineers to search hundreds of suppliers’ websites to receive the information they need to complete a design project.

32 – Global SMT & Packaging South East Asia – July/August 2011

The project-based area of the element14 knode is password protected, and access is limited to the user/design engineer.

How will these innovative solutions directly relate to different stages and functional requirements of the product design flow?

The element14 knode offers value-added engineering solutions through a complete design ecosystem combining an online delivery environment that helps today’s www.globalsmtseasia.com

Interview Title

engineers streamline the time-consuming and complex design ecosystem, from hardware assembly and manufacture to sourcing electronic components, to accessing technical information and libraries for hardware and software design tools.

It brings together development platforms, tools, software, IP cores, services, components and up-to-date technical information from domain experts and the global element14 engineering community, giving design engineers the ability to research, design, develop and manufacture in a single, intelligent environment.

By providing one place to get trusted information, element14 has eliminated the need for engineers to search hundreds of suppliers’ websites to receive the information they need to complete a design project.

What are the benefits that this new initiative can bring to the customers?

Designers can use the element14 knode to quickly research, evaluate and purchase solutions, software and services.

The availability of reliable technical information and solutions can save the designer hundreds of hours typically spent in searching and validating information.

Further, the innovative search engine returns all relevant and related contents for the search performed—in one click. The search bar allows users to enter keywords by supplier, architecture or part number, while search results can also be refined using categories and tag filters such as core architecture and silicon manufacturers.

Some of the features available include the expert Learning Centre, development platforms and kits, operating systems and stacks, development tools, CAD tools, PCB services and test equipment.

The element14 knode Learning Centre provides a library of rich content to help a user research various technologies, platforms and associated core components.

This includes “How To” videos, application notes, technical documentation and much more. Forums host discussions in areas ranging from product/technology and applications to design recommendations, and technical support and designers can post questions to subject matter experts from element14’s enhanced technical support team and from suppliers across a number of industries and design environments.

Design engineers can access operating systems, RTOS, stacks and middleware for application software execution and interoperability.

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The element14 knode also provides access to a comprehensive suite of software development tools for embedded systems: These include integrated development environments (IDEs), compilers and debuggers and the latest software design solutions from leading technology providers.

Through the knode, PCB design tools are available that enable designers to develop PCBs within a highly productive, scalable and easy-to-use environment.

The element14 knode delivers high quality, low risk solutions for PCB fabrication and assembly in partnership with industry leaders. element14’s partners not only provide rapid turn-around manufacturing using advanced technology and the application of state-of-the art design for manufacture (DFM) and test software, but they also deliver fabrication services at globally-competitive, affordable prices.

The element14 knode offers leading hardware analysis solutions for embedded systems or prototypes including oscilloscopes, multi-meters, signal generators and more.

Finally, a wide variety of development platforms and kits are available.

What are the full range of services and tools that element14 will provide through this global industry first initiative?

The element14 Knode is a portal for design solutions. It improves engineering design productivity by providing a single resource for all design needs. It streamlines the process of working with component suppliers. It raises the quality of the design by providing fast access to accurate technical information and community expertise. It enhances the overall design experience by unifying community, content and commerce in a sequence that is logical to engineers.

Providing resources that support the complete design flow from concept to

final production, the element14 knode is the industry’s first ecosystem helping design engineers accelerate design and development, bringing products to market faster than ever before. By not having to spend days and sometimes weeks researching technical resources and solutions, more engineering effort can be focused on application design and IP creation.

How has the experience and success with element14 platform contributed to the creation of the element14 knode?

The element14 knode is the culmination of feedback we have received from both our suppliers and design engineers to create a solution that positively impacts the overall design flow and simultaneously streamlines working with component manufacturers and suppliers. It is one place where they can quickly and easily get trusted information for their design process.

We are very excited about the launch and the impact it is poised to have on today’s workflows.

Why do you think this new service will be a landmark addition to element14’s existing propositions?

The element14 knode is another industry first for us, one that further extends our leadership and offers an exciting new approach to design solutions in the web 2.0 era. Innovation is vital for design engineers as they constantly seek smaller, faster, better, cheaper, more environmentally friendly design solutions to meet the needs of their end customers. As their partner in innovation, we are re-defining the delivery of the solutions they need.

The services offered in the element14 knode v1.0 release include an engineeringfocused alternative to standard search engines, an online ‘Learning Centre,’ design solutions that eliminate the need to visit multiple vendor-specific sites, development platforms and kits, operating systems and stacks, development and CAD tools, PCB services, and test solutions. The knode provides a full life-cycle electronics design flow solution from concept to production, easing design and accelerating reducing risk and time-to-market.

Thank you, Mr. Pagar.

Pradeep Chakraborty

Global SMT & Packaging South East Asia –July/August 2011 – 33

Solder paste stencil manufacturing methods & their impact on precision and accuracy

Solder paste stencil manufacturing methods & their impact on precision and accuracy Ahne Oosterhof, Oosterhof Consulting, Hillsboro, OR, USA, and Stephan Schmidt, LPKF Laser & Electronics, Tualatin, OR, USA

Stencil positional accuracy is a function of the manufacturing process (Machines, Methods, Materials and Men). The various parameters that influence positional accuracy will be discussed. These include different lasers systems, various metals and processes, temperature variations and the effect of mounting a stencil in a frame. The total effect will be shown with measurement results from a number of stencils made according to todayâ&#x20AC;&#x2122;s practices using available laser systems and processes. Additional problems may arise when stencils are not used correctly in the printing process. There are several parameters that influence the matching (or mismatching) of the location of the solder paste bricks coming from the stencil with the location of the pads on the circuit board.

In the past, stencils were chemically etched, and before that silk screening was used, but those processes have been replaced by more modern ones. These days most stencils are either laser-cut in stainless steel using an infra-red (IR) beam or electro-formed from nickel. Stencils have also been manufactured using polyimide, cut with an ultra-violet beam (UV) or IR1.

Keywords: Solder Paste Stencils, Lasers, Laser-Cutting, ElectroForming, Scanner

Stencil manufacturing

For each method used to manufacture the stencil the important parameters are (1) the quality of the equipment used to manufacture the stencil, (2) the control over the process to fabricate the stencil, (3) the quality and behavior of the metal during the manufacture, (4) the temperature differences during the various processes and (5) the varying tension on the materials in the different process steps.

Laser cutting

The machine used to cut the stencils consists of two systems, the laser and the moving mechanism. It is very important that the laser has a small and very stable beam. The size of the beam determines whether very small Figure 1. Stencil cut using a laser cutting system with stable (top) and non-stable (bottom) positioning system. details can be cut faithfully. If the beam is not stable in size and the frequency, allowing higher cutting speed main power concentration moves around, without resulting in a scalloped cut line. the kerf will not be exactly where it is supTo verify that the laser beam is stable posed to be, circular apertures are not and produces constant power, close examiround and straight wall apertures will have nation of the aperture size, shape and wall wavy sides (Figure 1). is required.

Most of these lasers produce a stream With a 40 to 100x microscope it is easy of high power pulses to cut through the to see whether the walls of an aperture are metal. Early lasers were pulsing at low freproperly formed. quencies, resulting in a scalloped cut when Various designs of the movement the metal was moved too quickly. Present system exist. Early systems had a stationday lasers employ a much higher pulse

34 â&#x20AC;&#x201C; Global SMT & Packaging South East Asia â&#x20AC;&#x201C; July/August 2011

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Solder paste stencil manufacturing methods & their impact on precision and accuracy

Figure 2. Stencil cut as loose sheet (left) vs. cut in frame (right).

ary laser beam while the table holding the metal sheet or stencil frame moved in both X and Y-axis. In some of the later systems the beam moves in X-axis and the table moves in the Y-axis. The next step is to hold the metal stationary and move only the beam in the X and Y axes.

The reduction in mass that has to be moved makes it easier to increase the cutting speed without sacrificing the ability to faithfully reproduce the detailed shapes of the stencil apertures.

In each design it is very important that X and Y-axes move perpendicularly to each other and that both move in a perfectly straight line (Figure 1). And of course the movement system has to be perfectly calibrated to assure control over the amount of movement to within a few micrometers.

Most laser systems advertise location precision of 5-10 µm over a given distance.

Metal

The metal used for laser cutting has typically been stainless steel, type 302 or type 304, produced in a rolling mill. The resulting sheets are very uniform in thickness, but the specified thickness can typically vary by about 12 µm (0.5 mil). In order to improve paste release a number of postprocesses have been tried, for example electro-polishing or chem-polishing, but not always resulting in improvements.

Other metals are now being introduced like nickel sheets and very fine grain stainless steels. Especially these last ones have shown to bring significant improvements in the printing process. [Ref #2]

Electro forming

Stencils made using the electro-forming (EF) process consist of pure nickel.

The EF process starts with a film that represents the aperture pattern to be man-

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ufactured. Making the film introduces additional process steps with their inherent possibility of errors as the film material is both temperature and moisture sensitive. The film image is transferred in a photo process to a mandrel on which a metal layer is grown in an electro-chemical process. To get a uniform thickness stencil requires that the chemical actions in the bath are exactly the same over the full area of the stencil. This may at times be difficult, especially when the aperture density various greatly. Also the growth of the metal immediately around an aperture can be faster resulting in a small ridge or “dam” around the aperture. This dam has been used as a seal between the stencil and the pad on the board. However, if this dam is not exactly aligned with the pad or it gets damaged, paste can leak through, which may result in solder balls.

The process also has to be well controlled so that it can be stopped at the proper moment when the sheet has grown to the desired thickness. After that it has to be “peeled” of the mandrel without causing any damage to the sheet and then mounted in a frame.

Tension

When sheets are laser cut, they are typically clamped and tensioned in one direction or they are cut already mounted in a frame.

If the sheets are mounted in the frame after cutting, the tension in both X and Y directions will often differ from the tension during cutting.

The same, but more so, is true for stencils made with the electro-forming process.

A stainless steel 125 µm (5 mil) stencil manufactured without any stress on the metal and then placed in a frame exerting a stress of 35 Newton/cm (common mesh tension) sees a strain (percentage change in

length) of 0.0131%. For a stencil image (or panel image) where apertures are 0.5 m (20 inch) apart, this can cause an error of up to 65 µm (2.5 mil)

Temperature

Most stencil manufacturers produce stencils in air-conditioned rooms where the temperature is about 20˚ C (68˚ F). In nonair-conditioned, small rooms the temperature can easily vary by 5˚ C (9˚ F) or more.

Similar variations can exist at the location where the stencils are being used.

The coefficient of thermal expansion of steel is approximately 17 and of nickel 13 ppm/˚ C. This number indicates the expansion or contraction of the metal in µm per meter for each degree C. If we have a stencil image (or panel image) where apertures are 0.5 m (20 inch) apart and the temperature difference between fabricating the stencil and using the stencil is 5˚ C, the change in dimension in a steel stencil can be 42 µm (1.7 mil). For a nickel stencil it would be about 32 µm (1.3 mil).

While laser cutting, the hot beam can cause a local temperature rise in the metal, which can lead to discoloration (innocent) or even deformation through local expansion of the metal (troublesome). Proper control of the beam and cooling of the metal (airflow or liquid cooling) can minimize this problem.

Impacts on use

For newer components, such as CSPs and very small passive components, the space between pads on the board can be less than 200 µm (8 mils) To prevent significant errors as described above, it is imperative to employ the best stencil manufacturing equipment and practices possible. That also means working in a controlled environment, both

Global SMT & Packaging South East Asia –July/August 2011 – 35

Solder paste stencil manufacturing methods & their impact on precision and accuracy

Figure 3. Apertures with some debris.

at the stencil manufacturer and user locations. To prevent errors due to possible tension differences it is desirable to cut the stencil while mounted in the frame. In short, as a stencil user it is becoming necessary to know what equipment and what process is being used and what checks are being made by the stencil manufacturer.

Figure 2 shows an example of one stencil cut from a sheet and then mounted and another cut in the frame on the same laser.

A definite change in the error trend can be observed.

Stencil verification

The simplest way to determine the precision of a stencil is to scan it and determine the location and size of each aperture.

Systems are available allowing such a test to be made with high accuracy (+/-5 µm or 0.2 mil) within a few minutes. A computer program can determine the centroid and size of each of the scanned apertures and

compare those to the original design. The resulting data can be used for an easy gono-go determination or used to perform a statistical analysis.

The scanned, new, laser cut stencil may have remaining loose particulate in some of the apertures. This interferes with the centroid and area calculation but can easily be recognized and therefore excluded from the results (Figure 3).

A large stencil (about 460 mm x 300 mm/18” x 12”) with about 21,000 apertures has been selected for these tests.

These stencils have been measured using a well-calibrated scanner (ScanCheck) with a resolution of 6,000 pixels per inch (12,000 with interpolation).

The resulting numbers are then compared to the cutting data and errors beyond a given specification are presented. All data that has been collected can be exported for further analysis, as is done in this report.

For this analysis only the location errors along the long stencil axis have been used.

Comparative measurements

A number of stencils have been produced using different methods, machines and processes. These stencils were produced using the commonly available laser cutting and electro forming production methods.

Four different laser system brands for a total of seven different types of machines were selected. Of these stencils, five have been produced both as sheets and in a frame and two are only cut in a frame for a total of thirteen laser cut and one electroformed stencils.

The stencils were produced in several different commercial facilities and

the environmental conditions were not recorded, therefore a temperature effect cannot be established separately from the machine accuracy and tension effects.

A specification of +/- 10 µm was used and for each stencil the extent and the distribution of the location errors was calculated. This above mentioned specification limit is a commonly used value for allowable tolerance by many large EMS companies. The value of Cp indicates how often this distribution of the data fits between the specification limits. Figure 4). For these very large and complicated stencils only one showed a Cp value greater than 1 (Figure 5). In the individual graphs the short green bars represent the three sigma limits. At those points the error rate is 2,750 ppm. Of course more desirable would be using Six Sigma where the error rate would be only 0.002 ppm.

As the stencil can be shifted and aligned to the board in the printer, the Cpk value, which uses the worst half of the distribution and the deviation of the mean from the center of the specification, has not been determined.

Results

The resulting Cp values for the whole group of stencils are shown in Figure 5.

The yellow bars show the Cp values for the stencils that were cut as loose sheets and the blue bars show the range for the stencils cut in the frame. For the measured apertures we see an error range (brown bars) varying from 35 to 185 µm (1.4 to 7.3 mil).

The data shows a noticeable grouping based on the chosen manufacturing tech-

Figure 4. Sample bell curve surrounding measured data. Red vertical bars show spec limits of +/- 10 µm.

36 – Global SMT & Packaging South East Asia – July/August 2011

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Solder paste stencil manufacturing methods & their impact on precision and accuracy

and calibration methods used. Figure 7 shows the change in the spread of the data for two stencils cut in the frame on two different laser systems.

Conclusion

Figure 5. Analysis of measurements.

niques. In general stencils that are cut in a mounted frame show significantly higher aperture positional accuracy then stencils that were cut as loose sheets and subsequently mounted into a frame.

In Figure 6, the distribution of the data for a stencil cut in the frame and as a sheet using the same laser is shown. The noticeable change in the spread of the data shows the result of the change in tension between while cutting the stencil versus the tension after the stencil has been mounted in a frame.

Another factor for the change in positional accuracy is the choice of laser cutting system. In general we can observe that most newer generation systems (less than 3 years old) provide a higher positional accuracy compared to the older systems (3-15 years old). However even among new laser systems we can observe significant difference in aperture positioning accuracy between different laser systems. These differences are probably related to system architecture

When printing on a board with components that have large pads and large spaces between pads, a significant alignment error between the stencil apertures and board pads may not cause serious issues. It is like a form of overprinting and many solders, in their molten state, will wick back onto the pad.

However, many of today’s boards have tiny parts with very small and closely spaced pads were such errors might cause bridging. On top of that, today’s lead-free solder does not spread as well as lead containing solders.

Therefore the size of the errors encountered in several of these stencil samples will lead to production errors at an unacceptable level.

For a stencil with optimum aperture positioning accuracy we can conclude that it is critical to choose the best manufacturing method based on three main factors: 1. Laser cutting shows better results than photo based processes, 2. Stencils cut in a frame show very little distortion and 3.

Stencils cut on modern lasers showed significantly better positioning accuracy.

Note that additional printing errors can come from among others low mesh

Figure 6. Cutting in frame vs. cutting as loose sheet.

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tension, inadequate squeegee pressure or insufficient board support.

Acknowledgements

The authors would like to thank Florian Roick of LPKF Laser & Electronics (www. lpkfusa.com), Mike Scimeca of FCT Assembly (www.fctassembly.com), and Frank Kurisu of Solder Mask, Inc. (www. soldermask.com) for their kind contributions to this article.

References

1. Ahne Oosterhof, et al, “Stencil cutting”, Industrial Laser Solutions, June 2007.

2. Robert F. Dervaes, Fine Line Stencil, Inc.; Jeff Poulos, Alternative Solutions, Inc.; and Scott Williams, Ed Fagan, Inc., “Conquering SMT stencil printing challenges with today’s miniature components”, Global SMT & Packaging, April 2009.

Figure 7. Identical stencils cut on two different modern laser systems.

Global SMT & Packaging South East Asia –July/August 2011 – 37

Bare board contamination

Bare board contamination Sheila Hamilton, Teknek, Renfrewshire, Scotland, UK

Market trends

Technology and processing developments within SMT are moving bare board cleaning from a nice-to-have feature to an absolute necessity if yields are to be protected and/or improved.

This article examines the causes and impact of contamination and what solutions are available to tackle the problem.

There are a number of factors that mean bare board cleaning is becoming a necessity including: • Sourcing from low cost economies where cleanliness standards are less stringent • The adoption of laser marking, which is a considerable source of contamination • On-going miniaturisation • Rising material, labor and fuel costs squeezing margins, leading to demand for higher yield • Adoption of 3D solder-paste inspection

ronment or people.

Solder paste printing

It is generally held that 75% of end of line faults are related to the solder-paste print process. It therefore stands to reason that a key component in solder-paste print be properly prepared for this crucial process step.

3D solder paste inspection (SPI)

Environmental Dust, clothing and hair fiber

In an effort to improve quality and meet customer quality expectations there has been widespread adoption of 3D solderpaste inspection technology. 3D SPI can identify 100% of solder defects and will helpfully classify them as excessive, insufficient, offset, misshaped or bridging. There are many factors within the printing process that can influence these fault codes, including stencil design, printer set-up and paste. What about contamination?

People People are a considerable source of contamination including skin, hair and clothing fiber

What influence does contamination have on yields at SPI?

Board contamination

In general the contamination found on boards can be categorized as follows:

Packaging Boards are typically packaged in shrinkwrap and often with paper separating sheets, both of which can contribute loose contamination to the board surface.

Manufacturing process The PCB manufacturing process typically does not conclude in a clean room and will involve much handling during AOI, repair, punching, routing and packaging. These steps will leave residual contamination.

Laser marking This increasingly used process generates significant amounts of carbonated debris that constitutes a risk to your print process and end of line yields.

Finally, when packaged boards are separated, they generate considerable amount of electro-static charge that will attract local contamination, be that from the envi-

38 – Global SMT & Packaging South East Asia – May/June 2011

Established and sophisticated electronics assembly businesses manage the print process very closely and will typically have yields in the 91-94% range. The need to improve these yields is relentless as margins are undermined by competition and increasing input costs. How then do we drive yields further in a well-run, controlled assembly environment?

A significant part of the answer in this scenario is to understand the influence of contamination and seek to address it through cleaning of the bare board.

Symptoms of contamination include: • Stencil apertures becoming blocked and causing misprints • Craters after reflow caused by contamination having volatized • Tomb-stoning (Manhattan Effect) • Poor solder wetting • Poor joint integrity • Dry solder joints • Excess or insufficient solder www.globalsmtseasia.com

Bare board contamination

Process Improvement

With over 10 years of experience in this application, Teknek can say with absolute confidence that removing contamination as a variable will add 4-6% to yield at SPI. Time and time, again this assertion is proven in the field with leading automotive, OEMs and EMS companies around the world.

The effect of cleaning the boards is usually measured using SPI equipment after the boards have been printed. Trials have shown a dramatic reduction in board failures with contact cleaning before the solder paste print process. In one study using a Koh Young S.P.I., Teknek found that: • Overall failure rates fell from an average of 9.5% to 5%—an improvement of 47%.

• Excessive solder dropped from an average of 3.4 to 1.3%—a 62% improvement.

• Bridging falls from an average of 1% to 0.7%—an improvement of 30%.

• Insufficient solder falls from an average of 2.1% to 0.8%—an improvement of 61%

Boards that fail SPI

When a board fails SPI there are two possible outcomes.

Scrap Some assemblers are required to scrap boards that fail SPI. This may be because of the safety critical nature of the end product or simply that they understand the full cost of rework. If the failure occurs during the first pass then the costs are easily assessed e.g. the board, paste, time, labor and disposal. On the second pass the same equation applies but will include components and more line time so the numbers are considerably higher.

Rework Each time a board is reworked, the quality and reliability is compromised. Misprinted boards can be washed down and wiped clean, but this will leave residual traces of solder paste, which are in turn a threat to inspection and end of line yields. (These will not necessarily be detected at the final electrical inspection at the end of the line.)

Contact cleaning technology

Now that we have established that PCBs arriving from the manufacturer are not pristine, what strategies can be put in place to reduce wastage, improve quality and increase yields?

A bare board is fed into a contact cleaning system at the start of an automated production line to remove surface contamination prior to the stencil printing process.

Many manufacturers have tried brush, vacuum and blower systems to remove debris from the boards, but the most effective way to achieve clean PCBs is to use specialist contact cleaning equipment to clean the boards. This equipment uses a series of specially formulated elastomer rollers that make intimate contact with the bare board, gently removing dry unattached particles from the surface. (These rollers will remove contaminant particles down to one micron in size.) A reverse wound, pre-sheeted, adhesive roll then runs in contact with the elastomer rolls and transfers the particles to the adhesive. Once saturated a layer of the adhesive is removed, exposing fresh adhesive and the cycle starts again. Adhesive life is related to the contamination levels but our experience indicates a typical user will get between 400 and 600 panels for each sheet of adhesive. The adhesive sheets can also be used to investigate the root cause of the contamination—a useful diagnostic tool in its own right!

The cleaning device should also incorporate anti-static systems to eliminate any charge as the boards move through the production line. Static monitoring sensors are available to measure static levels within your pre-determined criteria.

Contact cleaning equipment will provide the highest levels of board cleanliness through the physical contact with the board. This contact overcomes the challenge presented to non-contact system by the “boundary layer.”

Return on investment

Our experience indicates that in most cases the return of investment can be measured in months rather than years. This will be a function of the preceding yields and those after installation of a bare board cleaner.

Also included in the equation should be the cost of rework or scrap for SPI failure and the associate material, labour and overhead

40 – Global SMT & Packaging South East Asia – July/August 2011

With contact cleaning, two tacky rubber rollers lift contaminants off both sides of the PCB at once. The rubber rolls then pass off the contaminants to the adhesive rolls.

losses. This of course can be broadly calculated during an initial consultation. The very best way to get certainty is to arrange a trial installation that will enable you to directly compare yields at SPI and end of line with the cleaner against the norm without.

Adoption

The benefits of bare board cleaning are accepted by most automotive electronics businesses, yet the broader EMS market has been slower to adopt. Often they will cite a lack of customer demand for this feature. Bare board cleaning is a significant opportunity for the assembly businesses in respect to margins and is a clear indication to prospective customers that you are in control of your process and capable of meeting their high quality requirements.

As the surface mount industry faces greater miniaturisation and demand for increased yield, contact cleaning will become increasingly accepted as a standard process in a line. It is important that the concept is fully understood and used as a tool in the quest for continuing yield control of a modern SMT line.

Sheila Hamilton is Technical Director of Teknek and is responsible for keeping the company at the forefront through product performance, capability and applications.

Sheila joined Teknek in 1987 as technical director after working as a product designer (yachting equipment) and power station engineer. She has also run her own consultancy in the field of electronics component packaging. Sheila has a BSc in Mechanical Engineering from Glasgow University and a MBA from Strathclyde University. In addition, she is a recipient of two Smart Awards in the field of Electromagnetic Interference.

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Title

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Global SMT & Packaging South East Asia –July/August 2011 – 41

Title New products

New products Christopher Associates Inc. releases multiple camera retrofit kit for Marantz AOI systems

DataPlace system is based on proven pickand-place technology for fast, reliable labeling of circuit board assemblies for inline or standalone applications. www.cotinc.com

Solder paste deposition made easier

by Ovation’s Magna-Print™ DeFlex

In another technology development breakthrough, Ovation Products announces that it has designed an enhancement to its proven Magna-Print™ universal blade holding system that makes paste deposition even more robust. Current market-available paste deflectors are rigid and can only be adjusted using a tool, which takes time and lacks precision. Magna-Print DeFlex and Magna-Print blades are simply and easily changed into and out of the universal blade holder with ease – no special tools are required. www.ovation-products.com Christopher Associates Inc. announced the availability of a retrofit kit for the Marantz automatic optical inspection systems to add eight additional cameras. The combination of advanced lighting and angled cameras offers an unparalleled ability to capture defects while reducing false calls.

The Marantz Multi-Cam option takes AOI to the next level, and includes real-time image processing and integrated software upgrades to offer even older systems the ability to inspect the most advanced technology. www.christopherweb.com

Count On Tools now offers custom label nozzles for Amistar DataPlace systems

Tower-XL stores more 13” reels

Tower is a fully automatic, modular and secure storage system for SMD components. The Tower-XL can store a maximum of 336 reels with 13” diameters, where the conventional Tower can store only 196.

The footprint of the Tower-XL is 12 cm wider, which offers the additional room for larger reel storage cassettes. In total, the new Tower can store 406 trays and reels.

When storing a reel, the Tower controls reel diameter and barcode. The access time for each reel is less than 12 seconds. www. essemtec.com

New, versatile epoxy resists high temperatures & harsh conditions

Master Bond is pleased to announce the release of EP42HT-2FG, a new food grade

Count On Tools Inc. now offers custom label nozzles for Amistar DataPlace systems. Count On Tools’ custom engineered nozzle service covers all types of labels.

Each nozzle is built based on the customer’s specific labeling requirements. The Amistar

42 – Global SMT & Packaging South East Asia – July/August 2011

epoxy system. EP42HT-2FG has been independently tested and certified by a leading national laboratory to meet the stringent requirements of FDA CFR 175.300. It also was toxicologically evaluated to meet the NSF/ANSI 51.4.1 (2009) standard for food equipment materials. www.masterbond. com

Juki launches KE-1070/KE-1080 modular machines

Juki Corporation announces that its KE-1070/KE-1080 modular placement systems have greatly exceeded sales forecasts since their release in late 2010. The KE-1070/KE-1080 machines are intended to meet the need for reliable, cost-efficient placement solutions for the mid-range market. KE-1070/KE-1080 machines are built using the same topology as the popular KE-2070/KE-2080 machines that have had tremendous success in the marketplace. www.jukiamericas.com

Speedprint Launches the SP700avi screen printer in North America

Speedprint, part of the Blakell Europlacer Group, introduces the Speedprint SP700avi Screen Printer to the North American market.

The SP700avi features unique Look Down/Look Down vision that facilitates optimized board-to-stencil alignment, yielding 20 µm performance at 2 Cpk. Additionally, the system is fully equipped, as standard, with many features such as auto stencil load/unload, fully programmable vacuum assisted stencil cleaner and optical inspection of the paste bead.

2-D post-print bridge detection and various tooling solutions also are available as options. www.speedprint-tech.com

www.globalsmtseasia.com

New products

Ellsworth Adhesives offers Devcon flame retardant products

JST Corporation’s new LED lighting subminiature connector

SEHO debuts rapid cooling function for MaxiReflow

The new LEA Series wire-to-board, crimp style disconnectable connectors recently introduced by JST Corporation provide optimum performance and subminiature size for low current, low voltage conditions required by LED light bars. These highly reliable, side entry SMT connectors are polarized and incorporate positive locking features including an audible click to prevent accidental disconnection. Molded in a RoHS compliant 94V0 9T Nylon (SMT headers) resin, the LEA Series is available in a 2 circuit size. www.jst.com

Ellsworth Adhesives now offers Devcon flame retardant products including Devcon 5 Minute I-FR and Devcon 10 Minute Epoxy I-FR. Devcon flame retardant products are ideal for applications requiring a self-extinguishing structural system. The products are recommended for potting inserts and edge sealing for the aerospace industry. www.ellsworth.com

SEHO Systems GmbH has equipped the successful MaxiReflow soldering system with a new feature that will lead to remarkable time savings, thus contributing to reduced manufacturing costs. The new rapid chamber cooling feature can help reduce changeover time to a minimum.

Upon changing the soldering program, the system automatically compares the nominal temperatures of the new program with the actual temperatures. If the new program’s temperatures are lower than a previously defined temperature delta, the system automatically starts the rapid chamber cooling function. www.seho.de

Condensation soldering is now more flexible than ever with CondensoX!

Rehm Thermal Systems is presenting its CondensoX Soldering System, which allows users to adapt vapour phase soldering to manufacturing conditions. Able to be implemented into existing SMD lines, the CondensoX-series is an advanced condensation reflow soldering system designed to meet the challenges of leadfree solder alloys for small and high thermal mass PCBs. The CondensoX combines vacuum profiling and thermal profiling in one machine. www.rehm-group.com

www.globalsmtseasia.com

SIPLACE Precedence Finder— reliability from the first board on

As part of the current SIPLACE setup concepts campaign, ASM Assembly Systems is introducing the SIPLACE Precedence Finder. Some analysis and optimization processes can from time to time have a negative effect on the throughput of SMT lines.

The SIPLACE Precedence Finder helps to considerably improve this. From the very first board on, the software analyses the size and position of all components, PCBs, and nozzles and optimizes the placement sequence to prevent components from colliding with each other. www.siplace.com

Microscan introduces three new machine vision innovations

Microscan introduces the AutoVISION™ family of machine vision products. The product line includes the Vision HAWK and Vision MINI smart cameras, as well as the new AutoVISION™ machine vision software interface. The Vision HAWK and Vision MINI smart cameras feature compact, fully-integrated hous-

ings, and can be operated by either the intuitive AutoVISION interface or the more advanced Visionscape® platform.

This format allows users to set up jobs in AutoVISION™ and later migrate to Visionscape® if the application grows in complexity. www.microscan.com

LPKF introduces new laser for depaneling

LPKF has added another laser system to its repertoire.

The MicroLine 1000 S presents a compact, cost-effective method for UV-laser depaneling of thin-rigid and rigid-flex assembled PCBs. With UV-laser cutting of assembled and/or unassembled PCBs, those with limited space will benefit.

The UV laser beam can cut along delicate components or circuit paths without interference. The tool-less method makes any contour possible. Changes to the cutting paths are made by programming the software included with the machine or directly in the CAD software. www.lpkfusa.com

New spray fluxer for wave soldering systems

Etek Europe’s branded spray fluxer for wave soldering systems, the EcoSpray, is a quality and cost effective system with full back up from the Etek Service and Support Division. Ecospray is available in three sizes; 12", 17" and 20". www.etek-europe.com

Global SMT & Packaging South East Asia –July/August 2011 – 43

Title

International Diary electronica India + productronica India September 13-16 Bangalore, India electronica-india.com NEPCON Vietnam October 6-8 Hanoi, Vietnam nepconvietnam.com

electronicAsia October 13-16 Hong Kong electronicasia.com

India Telecom New Delhi, India December 7-9 www.indiatelecom.org

EPTC Electronics Packaging Technology December 7-9 Singapore www.eptc-ieee.net

Hong Kong Electronics April 13-16, 2012 Hong Kong hkelectronicsfairse.com

Six inents t n o C www.globalsmt.net

Volume 10 Number 2, February 2010 ISSN 1474 - 0893

The Global Assembly Journal for SMT and Advanced Packaging Professionals

Volume 10 Number 1, January 2010 ISSN 1474 - 0893

Global SMT & Packaging Southeast Asia Vol. 1 No. 1

The Global Assembly Journal for SMT and Advanced Packaging Professionals

www.globalsmt.net

SMT

Global Technology Awards

Southeast Asia

The Global Assembly Journal for SMT and Advanced Packaging Professionals

Volume 1 Number 1 Spring 2010

BGA ASSEMBLY RELIABILITY...PWB QUALITY IS THE KEY METALLIZATION OPTIONS FOR OPTIMUM CHIP-ON-BOARD ASSEMBLY

Fred Hume Interview Inside

One Magazine 2010 Company Milestones

Guidelines for establishinG a lead-free wave solderinG process for hiGh-reliability

Also Global SMT & Packaging’s 10th anniversary

10.2-EU-temp.indd 1

2/9/10 10:14 AM

TRACK, TRACE & CONTROL: HIGH PRODUCTION OUTPUT AT LOW COSTS

10.1-EU-temp.indd 1

1/6/10 5:46 PM

FAILURE DEFINITION—NOT AS EASY AS IT SOUNDS

SOUNDS FAILURE DEFINITION—NOT AS EASY AS IT

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Industry News New Products

Bryan Gass Interview Inside Interview Inside Bryan Gass

TWISTED WIRE INTERCONNECT SYNERGY, THE OCCAM PROCESS AND SYNERGY,WIRE THE OCCAM PROCESS AND TWISTED INTERCONNECT

NEW PRODUCTS | INDUSTRY NEWS | INTERNATIONAL DIARY

International Diary International Diary New Products

Spring 0102 g2010 nirpS

NEW PRODUCTS | INDUSTRY NEWS | INTERNATIONAL DIARY

investiGation and development of tin-lead and lead-free solder pastes to reduce headin-pillow defects

in-pillow defects and lead-free solder pastes to reduce headinvestiGation and development of tin-lead

Industry News

PRODUCTION OUTPUT AT LOW COSTS TRACK, TRACE & CONTROL: HIGH

10.1-EU-temp.indd 1

process challenGes and solutions for smt assembly embeddinG chip-on-board into mainstream embeddinG chip-on-board into mainstream smt assembly process challenGes and solutions for

1/6/10 5:46 PM

solderinG process for hiGh-reliability Guidelines for establishinG a lead-free wave

Also Global SMT & Packaging’s 10th anniversary

2010 Company Milestones

Mike Konrad Interview Inside

NEW PRODUCTS

INDUSTRY NEWS

INTERNATIONAL DIARY INTERNATIONAL DIARY INDUSTRY NEWS

NEW PRODUCTS

Interview Inside Mike Konrad

Interview Inside Fred Hume

CHIP-ON-BOARD ASSEMBLY METALLIZATION OPTIONS FOR OPTIMUM IS THE KEY BGA ASSEMBLY RELIABILITY...PWB QUALITY

Global Technology Awards ISSN 1474 - 0893 Volume 10 Number 2, February 2010

Advanced Packaging Professionals The Global Assembly Journal for SMT and

ISSN 1474 - 0893 Volume 10 Number 1, January 2010

SMT

Advanced Packaging Professionals The Global Assembly Journal for SMT and 1 .oN 1 .loV aisA tsaehtuoS gnigakcaP & TMS labolG

Advanced Packaging Professionals The Global Assembly Journal for SMT and

Volume 1 Number 1 Spring 2010

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Presenting...

The 2010 GLOBAL Technology Awards The ONLY global awards program in the industry A GLOBAL Technology Award sends the message that your product or service is an innovation and quality leader in an industry crowded with competing products.

Sponsored by Global SMT & Packaging magazine, the GLOBAL Technology Awards are now in their sixth year of recognizing and celebrating innovation in the electronics manufacturing industry. Entries are being accepted now through July 31st.

Entries are invited from equipment, materials and EMS companies of all sizes.

In addition to the award statue, winners receive publicity in a special awards issue of each of Global SMT & Packaging magazine’s five editions (US, Europe, China, Korea & South East Asia) as well as on the Global SMT & Packaging and GLOBAL Technology Award websites and in the Global SMT & Packaging email newsletters.

Winners also receive a small poster for use at trade shows and an image and logo for use in advertising, websites and other promotional materials.

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Global SMT & Packaging South East Asia –July/August 2011 – 45