advanced
sample preparation preparation sample solutions... solutions... Selected Area Polishing...
Backside-thinning of packages for photo emission, thermal emission and i-r microscopy Thinning single dies on wafers, multi-chip modules and hybrids Frontside decapsulation (makes subsequent chemical decapping more controllable) Retains ‘Live’ Parts - i.e. lead-frame left intact Small Footprint, ‘Benchtop’ design Easy to operate - no software or CNC-machine code knowledge required Clean, quiet operation Affordable for all f.a. labs Scratch-free flat mirror finishes Close-up of A.S.A.P. Tool
Cross-Sectioning, Delayering and Back-Grinding
A.S.A.P. - 1 Automated Selected Area Polisher Cross-sectioning Delayering Back-grinding for backside analysis Polishing wafers Thinning TEM samples Pre-FIB thinning ‘True flat lapping’ mechanism makes sub-micron work a reality
MULTIPOL 8 FA Precision Polisher
6170.1 Quick Release Microscopy Fixture
Package mounted in 6304.1 Crosssectioning fixture
Quick Release fixture provides fast, easy transfer of sample to/from the microscope Standard 3" Capability (4" max. when using 10 inch polishing plates)
Call for more information or to schedule a demonstration
THE CUTTING & POLISHING SPECIALISTS...
1025 E Chestnut Ave Santa Ana, CA 92701 Toll Free (US) 1 877 542 0609 Tel: 1 714 542 0608 Fax: 1 714 542 0627 e-mail: info@ultratecusa.com
www.ultratecusa.com
enabling
failure analysis Selected Area Preparation Prepares All sizes of die — both packaged and wafer-level Accurately removes package and wafer materials, and then polishes Substrates thinned to less than 25 microns Pre-FIB thinning (saves time and money) Provides key advantages for decapsulation applications (for example on BGA, ceramic, flip chip, power device, MCM) Fast, Intuitive Operation ‘Die tilt’ is easily accommodated during the process Bench-top and quiet
Delayering and Cross-Sectioning
ASAP - 1 Selected Area Preparation System
True flat lapping approach allows for unsurpassed flatness Significant flatness improvement over ‘off the lap’ machinery Advanced Delayering Cross-sectioning for optical, SEM, TEM and DUV microscopy ‘Quick Release’ Fixtures Standard 3” wafer capability (optional 4” max)
MULTIPOL 8 FA Precision Polisher
Call us for a free CD-ROM!
6170.1 Quick Release Microscopy Fixture
Package mounted in 6304.1 Crosssectioning fixture
Single die mounted in 6307.1 Stub-type cross-sectioning fixture
Toll Free (US) 1 877 542 0609 Tel: 1 714 542 0608 Fax: 1 714 542 0627 e-mail: info@ultratecusa.com
www.ultratecusa.com