advanced
sample preparation preparation sample solutions... solutions... Selected Area Polishing...
Backside-thinning of packages for photo emission, thermal emission and i-r microscopy Thinning single dies on wafers, multi-chip modules and hybrids Frontside decapsulation (makes subsequent chemical decapping more controllable) Retains ‘Live’ Parts - i.e. lead-frame left intact Small Footprint, ‘Benchtop’ design Easy to operate - no software or CNC-machine code knowledge required Clean, quiet operation Affordable for all f.a. labs Scratch-free flat mirror finishes Close-up of A.S.A.P. Tool
Cross-Sectioning, Delayering and Back-Grinding
A.S.A.P. - 1 Automated Selected Area Polisher Cross-sectioning Delayering Back-grinding for backside analysis Polishing wafers Thinning TEM samples Pre-FIB thinning ‘True flat lapping’ mechanism makes sub-micron work a reality
MULTIPOL 8 FA Precision Polisher
6170.1 Quick Release Microscopy Fixture
Package mounted in 6304.1 Crosssectioning fixture
Quick Release fixture provides fast, easy transfer of sample to/from the microscope Standard 3" Capability (4" max. when using 10 inch polishing plates)
Call for more information or to schedule a demonstration
THE CUTTING & POLISHING SPECIALISTS...
1025 E Chestnut Ave Santa Ana, CA 92701 Toll Free (US) 1 877 542 0609 Tel: 1 714 542 0608 Fax: 1 714 542 0627 e-mail: info@ultratecusa.com
www.ultratecusa.com