ULTRA TEC General FA CAtalog

E

P S U L AT I

O

R P R E PA

O

NS

S

DE

AT I

SI

C

R O C E S SI N

K

G

B AC

D

EP

CA

ON

N -S E C TI O

N

G SS

IN

G

IN

SIO N S

O

AW

D

CI

CR

PR

E

U M A BL

E

Proven Machinery For Analytical Success Enabling Failure Analysis…

ULTRA TEC has been providing advanced solutions to technical customers for over 20 years. We offer extensive background experience in supplying products capable of optical quality surfaces for optoelectronic, Q.A., materials science and medical applications.

Our involvement with electronic failure analysis began as being OEM designer and manufacturer of a range of saws and polishers. These systems rapidly achieved industry acceptance and became standard lab equipment through the 1990’s.

Since launching the ULTRA TEC brand in 1997 we have introduced innovative products for key sample preparation disciplines, including Selected Area Preparation – in support of the industry’s move to BACKSIDE ANALYSIS – and benchmark offerings for cross-sectioning. With new enhancements to the MULTIPOL product we are pleased to provide the first polishing system with sub-micron parallelism alignment.

Key to success throughout this growth period has been our willingness to work alongside our customers to provide custom features, as well as fine-tuning standard solutions. Our commitment is backed with full internal design, manufacturing, assembly and test departments.

Our applications laboratory allows for the development of new processes and offers an important customer interface through extensive in-house application development, sample preparation and product training.

Along with our worldwide team of experienced representatives and distributors, we look forward to enabling the electronic failure analysis and testing community for many years to come.

Thank you for choosing ULTRA TEC!

…Setting Sample Preparation Standards.

TEC Notes

On-Line Resources

Industry Newsletters

ULTRA TEC is proud to employ a continuous product improvement program.

Items may vary in appearance or specifications from those shown.

Technical Articles

All non-ULTRA TEC brands, products, processes and trademarks mentioned or illustrated in this brochure remain the property of the respective owners.

2

Application &&Solution Guide GUIDE APPLICATION SOLUTION Precision Sawing

ULTRATRIM – P10

ULTRASLICE – P10

MANUAL TOOL – P13

ULTRAPOL BASIC – P13

MANUAL TOOL – P13

ULTRAPOL – P15

ASAP-1 – P16

ARC-lite – P19

ASAP-decap – P21

ASAP-1 – P16

Deprocessing

MULTIPOL – P11

Cross-Sectioning

MEASURING MICROSCOPE – P14

Backside Preparation

INFRATEC-1 – P20

Decapsulation

Consumables

SAW BLADES – P22

LAPPING FILM – P23

3

ASAP TOOLS – P27

COLLOIDAL SILICA – P25

Applications Guide PRECISION SAWING The production of quality cross-sections on package-level, wafer-level and board-level devices, generally begins with a saw cut. The quality of the precision sawing operation dictates the level of surface damage and the amount of surface features that are retained. The resulting surface may be an end in itself – a good sawed surface offers sufficient information for generating a Selected Area Preparation process – or a starting point for polishing.

By optimizing the control of all parameters that affect cut quality, ULTRA TEC’s precision saws achieve an unbeatable match of performance and cost-effectiveness. Our saws range from a manually-fed trim saw to an advanced ‘Z-spindle’ semiautomatic unit that allows for multiple passes and precise height control. All our systems feature coolant provision for enhanced surface finishes and feed and speed controls.

Typical cross-sectional image from sawed surface.

Annotations added with Adobe Photoshop.

Rapid manual cross-sectioning of a BGA with ULTRATRIM.

1-714-542-0608

Cross-section sawing of a ceramic PGA with ULTRASLICE 6000.

4

Applications Guide DEPROCESSING As electronic device sizes become smaller, the deprocessing operation becomes more exacting. Over the last few years, metallization layers have moved into the sub-micron realm. This means that the one-micron resolution limit available with mechanical indicators has become essentially obsolete.

ULTRA TEC has developed methods to ensure that sub-micron parallelism can be maintained – even down to 0.1 microns for die sizes less than 9mm.

To tackle the other key weakness of previous systems in the marketplace – namely sample edge rounding – ULTRA TEC’s MULTIPOL system uses a true flat lapping CMP approach, as exemplified by multi-wafer CMP systems used in front-end operations. Using a harder, zero-nap, polyurethane-based pad material, allows for improved overall sample flatness and removes edge rounding.

Optical and mechanical measuring tools ensure parallel deprocessing on MULTIPOL polishing system.

Understanding that the majority of mechanical deprocessing in the world still takes with manual tools on manual polishers, ULTRA TEC are pleased to work alongside acknowledged preparation experts, Accelerated Analysis, to offer cost-effective manual tools. The new ULTRAPOL Basic manual polishing system provides the perfect polishing platform for optimized, no frills polishing consistency.

SEM image of a die deprocessed through Metal 1. Remaining is the polysilicon gate material and the metal in the contacts.

Courtesy of Accelerated Analysis.

www.ultratecusa.com

5

Applications Guide CROSS-SECTIONING Successful cross-sectioning techniques maintain the important information within the die or package, while being sufficiently controllable and reproducible so as to reveal the required features.

Non-encapsulated cross-sectioning, particularly on die-level devices, is faster and and easier to perform than encapsulated techniques – and can yield suitable results for SEM analysis.

ULTRA TEC’s offerings for cross-sectioning encompass manual tools and techniques, through to semi-automatic approaches, with advanced wedge angle and low-inertial sample loading controls. Our systems suit both encapsulated and nonencapsulated sample types.

Techniques are available for the various key process steps of precision sawing, grinding, and polishing that allow for low-relief preparation of materials of often widely disparate hardnesses and mechanical properties.

SEM cross-sectional image shows a void – this allows determination of an incorrect process step.

Cross-section of FIB-edit. Image courtesy of NP Test.

Note: The application of AR coating with ARC-lite system enabled accurate backside navigation of the device prior to cross-sectioning.

Toll Free (US) 1-877-542-0609

6

Applications Guide

The increasing number metallization layers used in modern IC’s has caused frontside techniques to become inadequate for complete failure analysis.

Backside imaging, i.e. imaging through the silicon substrate, allows access to all the transistors within an IC and so can complete the analytical picture.

Backside imaging is possible as pure silicon is transparent at near infra-red wavelengths. Dopants added to the silicon substrate reduce this transparency.

This means that to image a modern die effectively with a backside microscope generally requires the planar thinning, and subsequent polishing, of the substrate to make imaging and thus backside analysis possible.

To enable backside analysis on packaged or encapsulated dice requires decapsulation and heat sink milling prior to substrate thinning. ULTRA TEC has developed processes and equipment that allow for effective low damage backside preparation techniques for dice of all sizes and with all encapsulation techniques.

% Transmission

BACKSIDE PREPARATION

Remaining Silicon Thickness (microns)

DETERMINISTIC vs. REACTIVE PROCESSES Incremental Steps

Process does not react to substrate's material properties

Target

Deterministic Action – high speed milling

Gradually Wearing Away Surface

Process reacts to substrate's material properties - low damage process

Preset Positive Stop

Target

Reactive Action – ASAP-1

Advanced controls on ASAP-1 accommodate for package die tilt and allow for the preparation of extremely thin and parallel substrates.

www.ultratecusa.com

7

Condition

Temperature Rise During Process

High Speed Milling M/C – Dry Grind

600 oC to 700 oC

High Speed Milling M/C – Wet Grind

100 oC to 200 oC

ASAP-1 Dry Grind

20 oC to 40 oC

ASAP-1 Wet Grind

5 oC to 15 oC

Applications Guide BACKSIDE PREPARATION …continued

Optimizing All Backside Microscopes BEFORE ARC

After producing a mirror polish on the decapsulated and substrate-thinned package/die, the resulting sample may be backside imaged under NIR. However, the glare from the polished surface reflected into standard objective lenses often means that good image contrast is impossible. The addition of an antireflective coat (ARC) provides both improved contrast and moreover a significant increase in the photon efficiency evident from emission sites. Until recently ARC required expensive sputtering equipment and subsequent baking at highly elevated temperatures.

After extensive research and development to help our customers optimize the entire backside sample preparation process, ULTRA TEC introduced a technology solution that put quality ARC’s within easy reach of every sample preparation laboratory.

The industry’s first product to feature the technology is ARC-lite.

The system offers a fast (less than one minute), one-step, room temperature, chemical process that can be modified by the user to enhance coatings for the various observation wavelengths.

The range of imaging fluids includes a standard solution, and also a highly thermal stable, "FIB friendly", solution.

AFTER ARC

Imaged with OptoMetrix LSM

Imaged with IC Diagnostics system

Imaged with AIC/Micromanipulator system

Imaged with Hypervision system

Imaged with Semicaps system

Standard application of AR imaging fluid to a packaged part.

Imaged with NP Test system

Imaged with FEI system

Series of images showing backside imaging coupled with emission overlays.

Images courtesy of IC Diagnostics Corporation. (www.icdiagnostics.com)

Imaged with TnP Instruments system

1-714-542-0608

8

Applications Guide DECAPSULATION Topside Decapsulation, by primarily chemical means, is a well-established application that is carried out with manual protocols, or more frequently with automated acid etch systems. These methods produce fast and effective results on standard plastic packaged parts.

Several factors, however, make acids incapable of processing all package styles. For instance, when the package contains materials that are slow or impossible to remove with acids, or when the total packaging cross-sectional thickness is large – thus exacerbating the non-directionality of acid attack and potentially leading to harmful corrosion of bond pads and wires – it has been found that initial mechanical decapsulation offers key advantages.

After finding more and more decapsulation applications that benefit from initial mechanical operations, ULTRA TEC have developed processes for MCM, Stacked die CSP/MCP's, power devices etc. based on the ASAP product platforms. The new ASAP-decap system provides control of all required parameters to increase electrical survivabilty and yield on many decapsulation applications.

Stacked Die Decap Sequence STEP 1 Mould Decap

STEP 2 Die Removal

2 Step Decap process for Stacked die CSP or MCP yields repeatable results in 5 minutes or less.

Stacked BGA CSP encapsulated in a standard “MCP” workholder, after mechanical decap, ready for topside analysis.

Mechanically decapsulated plastic package

www.ultratecusa.com

Precision decapsulated PCB – Image courtesy of George Gaut, Skyworks Solutions, Inc.

9

Precision Sawing ULTRATRIM & ULTRASLICE ULTRATRIM

Rapid and low-cost manual cross-section sawing of wafer-level, package-level and surface mount devices. ULTRATRIM can be used to provide fast results for analysis in the development of Selected Area Preparation Protocols by obtaining the thickness of package layers with ULTRA TEC’s Measuring Microscope. The system also allows for QC checks on PCB’s, checking plated through-holes etc.

Order Code

Description

8505.1

ULTRATRIM Diamond Saw – 0.5 inch arbor, 0.25hp motor, integral coolant reservoir, manual table feed, one 4 inch o.d. blade, 110V only

8505.2

ULTRATRIM Diamond Saw – as above, but configured for 220 - 240V

ULTRASLICE 6000

ULTRASLICE provides unmatched versatility and accuracy for the slicing and low-volume dicing of electronic components.

The advanced 'Z-spindle' upgrade is an unique feature that allows for fine tuning of cutting depth – perfect for multiple sawing passes and for opening sealed metal packages without destroying components. The New 'Delicut' Sawing mode ensures that a constant sample loading value is not exceeded – making sure that the important features within the sample are preserved for subsequent polishing.

Description

8560.3

ULTRASLICE 6000 Precision Sawing System – Saw Base Unit (with tachometer, ammeter) Y axis motorized traveling table – with automatic cut-out, X-stage, Recirculating Coolant System & Splash Guard, One 4" diamond blade (7412.1), Pair 2" dia. flanges. Dual Cutting Modes ('Delicut' Constant feed and constant speed).

Configured for 100-220/240V operation.

8573.1

Z-Spindle (Upgrade) – Adds moveable Z-direction, with 0.0002" (5 micron accuracy) – available on new systems only

3567.1 3518.4 3577.1 3575.1 3548.1 3552.1

Z-Stage (1.75 inch vertical travel) Substrate Holder (+ 4 substrates) Internal Splash Guard Vise (for samples up to 2" dia)

3552.2

Optional Z-Spindle

Toll Free (US) 1-877-542-0609

Order Code

10

Odd Shape Clamp (samples up to 1.25" high) Saddle Clamp, Single Saddle Clamp, Dual

Deprocessing MULTIPOL MULTIPOL provides optical standards of flatness and parallelism to be achieved with the use of a reciprocating sweep mechanism.

Sample loading is fully variable, as are the sweep and rotation speeds. The versatility of the system is extended by a range of precision jigs, accessories and polishing plates.

All parts that come into contact with polishing media are produced from either stainless steel or heavy duty plastic and are quickly detachable for ease of cleaning and avoiding cross contamination. A spindle lock allows plates to be changed conveniently.

P ro d u c t H i g h l i g h t s Order Code

Description

6108.1

MULTIPOL 8 Lapping and Polishing Machine. System includes Process Timer, Plate and oscillation speed control, Reciprocating Yoke and Rollers, 6199.8 8 inch (200mm) Stainless Steel plate

6158.1

Fluid Recirculation pump

6206.8

Polyurethane-faced 8 inch (200mm) polishing plate

6230.1

Plastic Drip Tray

www.ultratecusa.com

6184.1 Sample Loading Guage

Bench-top CMP planarization quality Interfaces with ULTRACOLLIMATOR to enable sub-micron parallelism alignment Range of workholders enables all polishing techniques

See over for Precision polishing jigs and accessories.

6245.1 Precision Micromount

'True Flat' Lapping and Polishing with 'Ride the lap' design

6170.1 Quick Release Microscopy Fixture

11

Package mounted in 6304.1 Crosssectioning fixture

Die mounted in 6307.1 Stub-type cross-sectioning fixture

Deprocessing PRECISION POLISHING JIGS Intelligent Sample Fixtures Polish To Optimal Flatness & Parallelism MULTIPOL Precision polishing jigs provide unsurpassed angular and sample loading control.

Workholding solutions include a 'Quick Release' Microscopy fixture, and cross-sectioning fixtures for package level and unencapsulated die-level samples.

P ro d u c t H i g h l i g h t s

The interrelationship between precision jig and the MULTIPOL base system's true flat lapping design allows for the the use of advanced alignment tools to be used. The standard Precision Micromount accessory offers 1 micron read-out – perfect in itself for aligning for backside and cross-sectioning applications – and fine-tunable for sub-micron alignment with the ULTRACOLLIMATOR for industry-leading deprocessing capability.

Intelligent sample fixtures – accurate calibration in two circles of movement "See through" design allows for direct calibration to the sample – NOT to the mounting plate as with other systems Unmatched control of sample load Larger jigs available for large packages & wafers Versatility enhanced with a range of workholders

IPIP TTEECCHTT

Ensuring Parallel Deprocessing

Mechanical

Order Code

Description

6166.2

Standard Precision Polishing Jig with 1 micron resolution digital indicator: Includes jig, stand, weight kit, 2 inch conditioning ring and 2 inch sample mounting plate

6166.3

Precision Polishing Jig with 1 micron resolution digital indicator: Includes jig, stand, weight kit, 3 inch conditioning ring and 3 inch sample mounting plate

6304.1

Vise Attachment for Edge polishing / cross-sectioning

6170.1 6170.5 6307.1

"Quick Release" Plate for Microscopy preparations "Quick Release" Interface for Microscopy preparations "Quick Release" Single Die stub-type holder for cross-sectioning

6313.1

"Quick Release" vise for cross-sectioning Sample Loading Gauge Precision Micromount Assembly, with 1 micron resolution digital indicator

Optical

6184.1 6245.1

Precision micromount to 1 micron precision

1-714-542-0608

ULTRACOLLIMATOR sub-micron precision

6182.1

12

ULTRACOLLIMATOR – Optical Parallelism Alignment system

Deprocessing / Cross Sectioning MANUAL TOOLS Manual polishing tools remain important to the lab needing good delayering and/or cross-sectioning results on a very tight budget. ULTRA TEC is proud to be associated with the polishing experts at Accelerated Analysis, and to offer their advanced manual tools for use with our ULTRAPOL Basic polisher.

Order Code

Description

1209.1

ULTRAPOL Basic Polisher – Configured for 100220/240V operation. 0-500 RPM. Includes 8 inch (200mm) polishing system with speed control and solenoid-controlled coolant system

UPF101

Accelerated Analysis Manual Cross Section Fixture includes 5 aluminum and 5 stainless steel sample mounts

ULTRAPOL Basic Manual Polisher

P ro d u c t H i g h l i g h t s Works with all 8" (200mm) surfaces

Accelerated Analysis Manual Parallel Polish Fixture includes alignment mirror and 3 parallel polish sample mounts.

Small footprint

1503.1

Disc Holding Band

Speed Control and high torque motor

2239.1

ULTRAPOL Spare 8 " (200mm) anodized aluminum plate

Coolant speed control

UPF201

UPF201 Accelerated Analysis Manual Parallel Polish Fixture

UPF101 Accelerated Analysis Manual Cross Section Fixture

“Cost-Effective Polishing Tools from Industry Experts”

www.ultratecusa.com

13

Cross-Sectioning MEASURING MICROSCOPE ULTRA TEC's Measuring Microscope offers elegant features that allow fast, accurate measuring and analysis of cross-sections, planarized layers and micro-sections.

Illumination is in-built, as are micrometer measurements in X, Y and Z directions. A range of high quality objectives – down to 1.25x are available.

The system incorporates a "Quick Focus" module, which uses a vernier-style optical readout, to take the guesswork out of focusing. Cross-sectional measurements may be made even more convenient with the addition of a video caliper.

All images taken with 1.25x objective Order Code 6680.1

3-Stacked Die CSP

BGA Package

6652.1 6652.2 6654.1 6641.1 6642.1 6601.1 6602.1 6605.1 6620.1 6650.1 6657.1

Description Measuring Microscope (configured for 100 to 220-240V operation, including: - Trinocular head (correct image) with “C” mount tube and 2 off WF10 x 18mm eyepieces.

- Base (280mm x 320mm) with pillar stand - Coarse (with Z-direction micrometer), semicoarse and fine focus controls.

- Illuminator – 6V-15W tungsten - 10x objective (M-Plan) mounted in 5-way nosepiece (6610.1) - X-Y Stage, with 25mm micrometer travel (0.010mm accuracy) in each direction Camera, “C” Mount (NTSC) Camera, “C” Mount (PAL) Fiber optic Illuminator, with dual gooseneck Video Caliper – single horizontal axis Video Caliper – dual horizontal and vertical axes 1.25x MACRO Objective 2.5x Objective 5x Objective 20x Objective 50x Objective Replacement Illumination tungsten bulbs (Pack of 5)

PQFP Package

Toll Free (US) 1-877-542-0609

Quick Focus Module

14

Video Caliper (6642.1) allows for fast, accurate measurement without a computer.

Cross-Sectioning ULTRAPOL Cross-section & flat polishing with ultimate pressure control and angular versatility ULTRAPOL End & Edge Polisher offers ultimate versatility for sample load control and producing wedge-angles for cross-sectioning, SEM, TEM and pre-FIB thinning applications. A range of workholders extend the application for all key microscopy applications.

The micropositioner head may be calibrated in two-circles to ensure the correct features and or finish thickness can be revealed for analysis.

ULTRAPOL accepts polishing films, papers, pads and cloths to achieve the finest surfaces on most sample types, materials and chemistries.

Description

Order Code 6390.1

ULTRAPOL End & Edge Polishing System - Configured for 100-220/240V. Includes advanced base unit with timer, tachometer, solenoid coolant system, speed control and process-end indicator. Micropositioner head includes, advanced angular control, low inertial mass loading system with auxiliary weight kit, oscillation control, 1 micron Z-control and "Quick Release" workholder mounting system.

4065.1

SEM Stub Non-encapsulated Cross-sectioning Workholder

4066.1

Pyrex stub TEM / Pre-FIB thinning workholder

2024.1

Encapsulated Mount Workholder (0.5 to 1.5 inch diameter encapsulated samples)

4079.2 2770.2

Thin Plate Cross-section workholder - holds package level devices Wafer holder plate - holds up to 2" diameter sections (stainless steel)

4080.1

Odd Shape Sample Holder

4065.1 SEM Stub type workholder

www.ultratecusa.com

2024.1 Encapsulated mount workholder

15

P ro d u c t H i g h l i g h t s Low inertial pressure polishing ensures minimal damage Unmatched ability to produce wedge angles Range of workholders enables all key applications

4066.1 TEM/pre-FIB workholder

Selected Area Preparation ASAP-1 Backside Preparation & Mechanical Decapsulation The ability to produce accurate, reproducible, thinned dice for backside analysis is now available for every laboratory. Flip-chip and power chip mechanical decap is now straightforward and accurate. The die, whether in packaged or wafer form, is mounted on a traveling table that oscillates within X and Y direction limits set by the user.

Utilizing a rotating tool, controlled in the Z-Direction, accurate, reproducible grinding can be carried out to a specific thickness, finishing with a scratch-free mirror polish (when required). The SAP process yields a surface suitable for imaging and backside microscopy. Damage and heating of the substrate is minimal during processing due to the extreme low damage nature of the process.

This leads to improved sample yield.

P ro d u c t H i g h l i g h t s Package and wafer-level – all sizes of die Low damage method allows for extremely thin samples Accurately decaps, then thins substrate and polishes Intuitive and easy to use Short set-up and process times Easy Die tilt adjustment during the process Bench-top and quiet

Backside Emission Microscope image with 20x objective. Courtesy George Gaut, Skyworks Solutions, Inc., & MEFAS (www.mefas.com)

1-714-542-0608

Laser Scan Backside Image Courtesy Semicaps (www.semcaps.com)

16

Whole die imaged under backside NIR with 2x objective lens

Selected Area Preparation ASAP-1 Convenient Features

Setting sweep amplitude

ECTHIP EC TT

LQFP TQFP MQFP QFN

Adjusting for die tilt

Preparing the widest range of packages & samples

Plastic u-BGA F-BGA L-BGA T-BGA P-BGA FC-BGA

Setting Z-spindle

Wafer SOIC SSOP TSOP MSOP TO-202 TO-92 TO-3 TO-220 TO-66 SOT

BGA

Leadless

Ceramic

Flip-chip

Stack-die MCP CSP

PDIP

TEM samples

PLCC

8� Wafer Wafer shards

PGA

Small packages

GaAs / InP

Photonic Packages Pre-FIB Hermetic seals SIP ZIL

Pre-FIB CDIP CLCC

Flip-chip

Power Devices

Thick heat sink

Multi-layer PCB

If your package type is not listed here, please contact us to see how we can help.

www.ultratecusa.com

17

Selected Area Preparation ASAP-1 IPIP TTEECCHTT

Selected Area Preparation of Wafers Backside preparation of a single die on a full wafer is often required for yield enhancement or failure analysis purposes. To make this possible, a wafer stage is available for ASAP-1. The standard tilt table is removed to allow for the wafer stage.

Preparation is generally a four step process (1 grind and 3 polishing steps). This yields an optimized polished surface ready for backside imaging.

Frontside probing on a standard or inverted probe station can be used to bias the wafer for backside analysis, but the thinned wafer must be made strong enough to withstand the pressures exerted by probe tips, while still being optically transparent for backside analysis.

ULTRA TEC has developed a special technique for re-strengthening wafers using a UV curing optical epoxy and glass cover slip. A typical re-strengthened wafer cavity is shown in the photograph to the right.

Description

Order Code 6360.1

6361.8 6383.1 Analog height indicator

ASAP-1 Selected Area Preparation System, 100240V, 50/60Hz, Standard Features include Motorized and variable amplitude X-Y table, tool spindle drive with 5 micron Z-direction resolution, compound sine tilt table, sample set-up and loading kit and set of 2mm tools.

Wafer Preparation Kit - allows for the selected area preparation of up to 8" (200mm) diameter wafers. Includes mounting plate, Platen, Wafer thickness indicator.

Squaring package on 6371.1 mounting plate

Spares & Accessories

6383.5 Digital height indicator

6362.1

Z-Direction upgrade to 1 micron resolution

6364.1 6371.1

Independent Table direction speed upgrade Spare Standard Sample Mounting Plate

6383.1

Analog Height Indicator Stage (5 micron resolution)

6383.5 6366.1

Digital Height Indicator Stage (1 micron resolution) Heated Sample Relaxation Stage

6386.1

Repetitive Sample Holding Square Wax-in Sample Mounting Plate MCP / Small-BGA Workholder Wafer Clamps (set of 2)

6372.1 6327.1 3533.1

Toll Free (US) 1-877-542-0609

18

MCP mounted in 6327.1 workholder and 6386.1 square

Backside Preparation ARC-lite Anti-reflective coating system for backside analysis

P ro d u c t H i g h l i g h t s Fast and convenient – 45 second process Up to 30% more transmitted photon efficiency

ARC-lite offers fast (less than 1 minute), reliable, room temperature AR coatings on package and wafer level devices. The samples produced are NIR optimized and require no subsequent baking.

Up to 60% improved contrast under NIR Bench-top, quiet, room temp. process All package types and sizes ARC can be done in-house – NO baking Optimizes emission microscopy, laser, FIB, voltage, thermal and other backside techniques

ARC-lite reaches maximum functionality when used with ULTRA TEC's ASAP-1 Selected Area Preparation System – The sample mounting plate can be conveniently transferred between ARClite, ASAP-1 and INFRATEC-1.

Description

Order Code 6340.1

ARC-lite - Anti-reflective coating tool configured for 100220/240V. Includes main system, one sample holder, one 4 oz applicator bottle of ARC-lite Standard Imaging fluid, one 8oz bottle of ARC-lite Solvent.

6341.1

Standard ARC-lite mounting plate (also fits ASAP-1 and INFRATEC-1 systems).

100x Objective

5x Objective

Before

www.ultratecusa.com

After ARC-lite process

Before

19

After ARC-lite process

Backside Preparation INFRATEC-1 Backside Microscope Validation of backside sample preparation & substrate thickness INFRATEC-1 allows for fast, convenient backside imaging. Validation of sample preparation and remaining silicon thickness can be obtained in the preparation lab, without moving the sample to an emission or other backside microscope.

The sample mounting plate can be conveniently transferred between INFRATEC-1, ARC-lite and ASAP-1.

P ro d u c t H i g h l i g h t s Integration from 0.1 to 15 seconds ensures imaging effectiveness Uses standard mounting plates from for ease of transfer between equipment Small footprint

INFRATEC-1 Backside image of a mechanical decapped, thinned and polished packaged i.c. – taken with 20x objective.

INFRATEC-1’s X-Y table accepts sample mounting plates directly from selected area preparation systems.

Advanced 3-wavelength Laser Illuminator

Affordable for every lab

Order Code

Depth Measurement IPIP Focal T T C H E C of Remaining Silicon T E T The calibrated focus block on INFRATEC-1 allows for accurate measurement of remaining silicon thickness by using the following formula: F * n = = t Where, F is the difference in focus from polished surface to circuit n is the Refractive index of silicon (approx. 3.66) t is the silicon thickness This formula can be used to ensure silicon is not over-thinned. It also gives information on the need for die tilt correction within a packaged die.

1-714-542-0608

20

Description

6420.1

INFRATEC-1 Microscope System configured for 100220/240V operation, supplied with 10x broadband objective, integration control and NIR light source

6443.1 6444.1 6446.1

13" Monitor (NTSC) – PAL also available 4" Low-res 'in-situ' monitor PC Imaging and Archival Software and Frame Grabber Card

6472.1

Laser Illumination System – 3 independent Illumination wavelength – 680nm (visible), 1064nm (optimized NIR for emission microscopy and backside imaging) and 1300nm (optimized NIR for laser scan and thermal analyses).

2.5x Objective lens

6462.1 6405.1

5x Objective lens

6402.1 6465.1 6410.1

20x Objective lens 50x Objective lens 100x Objective lens

Decapsulation ASAP - decap MECHANICAL DECAP ASAP – decap produces parts with vertical walls & unmatched control of material removal depth – to 5 microns accuracy. This helps ensure the electrical survivability of decapsulated parts.

Mechanical Decapsulation offers key advantages for several performance issues seen with chemicalonly approaches. For instance, thick packages are just as effective to decap as thin packages; very small cavities can be opened; and traditionally ‘difficult’ materials may be processed quickly and easily by mechanical means.

The processed parts can be either an end in themselves or the starting point for either manual etch stations or automated decapsulation systems.

The system furthermore provides a key starting point for Reactive Ion Etch (RIE or ‘Dry Decap’) Processes – enabling them to be time-competitive with wet methods.

P ro d u c t H i g h l i g h t s One-step process – finish at wire bond loop height Works on all package materials – no selective etch rates Suits all single die, MCM and stacked die packages Easy Mechanical Cavity Size Setting – may be changed during process to navigate bond wires, other features Produces Vertical (Etch) Walls

ECTHIP EC TT

Accurate and Repeatable

Mech-Chem Decapsulation

BEFORE

No Corrosion to bond wires or pads – improves Electrical Survivability

AFTER

Order Code

Order #

6395.1

Package after 120 seconds Mechanical Decap on ASAP–decap. 1 step diamond tool process.

Process Endpoint is approx. 15 microns above front-side circuitry.

www.ultratecusa.com

Packaged Part after an additional 8 second chemical Decapsulation process. Using nitric acid @130oC.

21

Description ASAP - decap Mechanical Decapsulatation System configured for 100-220/240V operation. Standard Features include Motorized and variable amplitude X-Y table, Milling Tool spindle drive with 5 micron Z-direction resolution, Set-up Kit and set of 2mm and 3mm tools.

6396.1

Tilt Table Upgrade

6397.1

Perspex Enclosure for Working Area

6397.5

As above, with electro-mechanical Interlock

Consumables SAW BLADES O.D. Electro-metallic Blades

E-M blades are economically priced and offer fast cutting rates

Blade Thickness (over Diamond) inches

Order Code

O.D. (inches)

5412.2

4

0.012

5512.2

5

0.012

5612.2

6

0.012

5625.2

6

0.025

5820.2

8

0.020

5831.2

8

0.031

Premium Metal-bond (Sintered) O.D. Blades

Metal-bond blades have a wide diamond rim and offer excellent surface finish and longevity

– set of 2 Order Code

Approx. Diameter

3525.1

2

3525.2

2.5

3525.3

3

3525.4

4

3525.5

5

(inches)

Blade Thickness (over Diamond) inches

Order Code

O.D. (inches)

7312.1

3

0.012

7318.1

3

0.018

7335.1

3

0.035

7412.1

4

0.012

7417.1

4

0.017

7435.1

4

0.035

7512.1

5

0.012

7517.1

5

0.017

7535.1

5

0.035

7615.1

6

0.015

7620.1

6

0.020

7635.1

6

0.035

7820.1

8

0.020

7840.1

8

0.040

Notes All our standard blades have 0.5� arbors. Other spindle sizes are available.

Blades shown are formulated for cutting a wide range of materials.To optimize cutting parameters for your application please contact us.

Toll Free (US) 1-877-542-0609

Flanges (Cheek Plates)

22

Premium metal-bond blades are supplied in a protective case with a dresser stick

Consumables DIAMOND LAPPING FILM

ULTRAFILM 8” (200mm) Diameter

Diamond Premium Lapping & Polishing Films Micron Size

Adhesive-Back Order Code

Plain-Back Order Code

0.1

M.8230.1

M8430.1

5

0.5

M.8231.1

M8431.1

5

1

M.8232.1

M8432.1

5

3

M.8233.1

M8433.1

5

6

M.8237.1

M8437.1

5

9

M.8235.1

M8435.1

5

15

M.8236.1

M8436.1

5

30

M.8238.1

M8438.1

5

Pack Quantity

SEM image of 1 um diamond lapping film – Magnification 300x

SEM image of 15 um diamond lapping film – Magnification 300x – Images courtesy of MAL (www.fa-mal.com)

DISC Holding Band

Order Code 1503.1

www.ultratecusa.com

Description Disc Holding Band – Suits ULTRAPOL and other 8 inch (200mm) machines

23

Consumables ABRASIVE FILM

ULTRAFILM 8” (200mm) Diameter

Silicon Carbide Lapping & Polishing Films Micron Size

Adhesive-Back Order Code

Plain-Back Order Code

Pack Quantity

1

M.8221.1

M8421.1

100

3

M.8222.1

M8422.1

100

5

M.8223.1

M8423.1

100

9

M.8224.1

M8424.1

100

16

M.8226.1

M8426.1

100

30

M.8228.1

M8428.1

100

ULTRAFILM 8” (200mm) Diameter

Aluminum Oxide Lapping & Polishing Films Micron Size

1-714-542-0608

Adhesive-Back Order Code

Plain-Back Order Code

Pack Quantity

0.3

M.8211.1

M8411.1

100

0.5

M.8229.1

M8429.1

100

1

M.8212.1

M8412.1

100

3

M.8214.1

M8414.1

100

5

M.8215.1

M8415.1

100

9

M.8216.1

M8416.1

100

16

M.8218.1

M8418.1

100

30

M.8220.1

M8420.1

100

24

Consumables COLLOIDAL SILICA & FLUIDS Colloidal Silica Order Code

Description

Approximate Micron Size

Size

WHITE COLLOIDAL SILICA - Standard 2383.1

Standard Colloidal Silica

0.04

1 gallon (3.8l)

2394.1

Non-crystallizing Colloidal Silica

0.04

1 gallon (3.8l)

2394.2

Non-crystallizing Colloidal Silica

0.04

32 oz. (950ml)

2395.1

Ultrafine Collidal Silica

0.02

1 gallon (3.8l)

Cutting & Lapping Oil

BLUE COLLOIDAL SILICA - Aggressive 2397.1

Non-crystallizing Blue Colloidal Silica

0.05

1 gallon (3.8l)

2397.2

Non-crystallizing Blue Colloidal Silica Ultrafine Blue Colloidal Silica

0.05

32 oz. (950ml)

0.02

1 gallon (3.8l)

2398.1

CEMENTS & ENCAPSULANTS Cements & Encapsulants Description

Order Code

Size

2387.1

Crystalwax Stick - standard wax for die & wafer mounting

70ml

2304.1

Loctite '404' Adhesive, for Xybove tip Reapplication

2306.1

Paraffin Wax, for temporary package encapsulation

1 oz 450g

2307.1

2-part Cold Encapsulating Epoxy

2308.1

UV Curing Epoxy, for Wafer-cavity strengthening

makes 1 pint 1 oz

Note: Regarding 'Glob Top' Compounds for encapsulationo of plastic and ceramic packages – since most suitable compounds need to be stored at below 0 C, it is usually best for the customer to source locally, direct from the manufacturer. More details of suitable 'Glob Top' compounds may be found at: www.loctite.com/electronics & www.thermoset.com

www.ultratecusa.com

25

Order Code

Description

2396.1

Cutting & Lapping Oil

Size 1 gallon (3.8L)

Consumables ARC-lite FLUIDS

ARC-lite Imaging Fluids Description

Order Code 6341.4

4 oz. Applicator bottle of ARC-lite standard imaging fluid

6344.8

8 oz. Applicator bottle of ARC-lite Solvent

6343.4

4 oz. Applicator bottle of FIB-Friendly ARC-lite imaging fluid

6326.1

Syringe and Flilter Pack for Point of Application Filtration – Pack of 10

IPIP TTEECCHTT

Methods for Optimizing AR Coatings

Optimizing Coating Parameters for Various Imaging Wavelengths The speed control on ARC-lite provides a fast and convenient method of controling coating thickness of the resulting AR-coat. Shown below are the surface hues that obtain the optimized ARC performance.

Primary Observation Wavelength

Surface Hue (after coating)

980 nm and below

Baby Blue

1064 nm

Baby Blue / Yellow

1200 nm and above

Gold / Purple

Point of Application Filtration of AR Imaging Fluid To ensure contamination is alleviated when applying ARC-lite imaging fluids, use a syringe and filter method. Fill a syringe with imaging fluid and then apply the fluid drops though the screw-on filter, directly to the backside surface to be coated.

Toll Free (US) 1-877-542-0609

26

Consumables ASAP TOOLS Standard ASAP Tools Order Code

Application

Tool type

Lubricant Used

Approx. Tool Lifespan (# Parts)

1

5210.D

Coarse Diamond

Water or Extender

30

2

5215.D

Decapsulating Package Materials Copper Paddle Removal

Milling Tool

Extender

8

3

5260.D

Medium Diamond

Water or Extender

20

Extender + Diamond Paste Extender Diamond Paste

Step

Substrate Thinning

4

5295.D

Initial Polish

XYLEM

5

5295.D

Medium Polish

XYLEM

6

5299.D

Final Polish

XYBOVE

Colloidal Silica

Accessories & Consumables Order Code 5200.D

30 30 6

Tools: Scope of Use

Description Boxed Consumable Set – 1 off each standard ASAP-1 tool (Steps 1 to 6) + 1 off 5298.D tips

Tool Diameter (= D)

Cavity / Die Size Range (X or Y diameter)

1 mm

2 mm to 5 mm

2 mm

5 mm to 9 mm

2394.4

Colloidal Silica (4 oz. bottle)

2396.4

Extender Fluid (4 oz. bottle)

2382.5

Step 4 Blue Diamond Paste (5 gram tube)

2385.5

Step 5 Yellow Diamond Paste (5 gram tube)

5298.9

XBOVE Material for Self-Application (1 inch square)

5298.D

XYBOVE Replacement Tips, for final polish (Set of 6)

5297.D

XYBOVE Tool Blank -- for use with 6316.1 Xybove Re-application tool.

* The “D” in the ASAP-1 Tool part numbers refers to the diameter of the polishing tool. – See “Tools: Scope of Use” chart.

– When ordering, replace the “D” with the required diameter.

6316.1

XYBOVE Tip Re-application Tool - includes main precision stage. Punch and transfer tools for 1mm, 2mm, 3mm and 5mm Xybove tips.

* Approx. # cycles/tool have been determined empirically. Actual longevity of each tool depends on many factors and will vary.

5208.D

Very Coarse Diamond Decapsulation Tool, for faster removal of ceramics Modelling Putty (1 lb), used for producing a lubricant reservoir around large, exposed dice

2342.1 2352.1

9 mm to 15 mm

5 mm

15 mm upwards

Notes

Fumehood and lab furniture solutions are available for customers who have acid and wet chemistry applications.

Cotton Buds (200) for cleaning

www.ultratecusa.com

3 mm

27