What’s New in Electronics Dec 11 Jan 12

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Dec 2011/Jan 2012

Chief Editor Janette Woodhouse Publisher Geoff Hird Art Director/Production Manager Julie Wright Art/Production Tanya Scarselletti, Katie Dean, Colleen Sam Circulation Manager Sue Lavery circulation@westwick-farrow.com.au Copy Control Mitchie Mullins

on the cover 4 Plugging the influx of counterfeit connectors 6 Reliability drive for vehicle connectors

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10 short circuits 18 Removing the bugs from embedded software 22 European PV market faces sharp decline 29 Tiny soldering iron can control chemical patterns 34

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March 2011 Total CAB Audited Circulation (Aust + NZ) 6,403 (84% personally requested) Printed and bound by SOS Print & Media Group +61 2 9549 2100 Print Post Approved PP247345/00005 ISSN No. 0728-3873 All material published in this magazine is published in good faith and every care is taken to accurately relay information provided to us. Readers are advised by the publishers to ensure that all necessary safety devices and precautions are installed and safe working procedures adopted before the use of any equipment found or purchased through the information we provide. Further, all performance criteria was provided by the representative company concerned and any dispute should be referred to them. Information indicating that products are made in Australia or New Zealand is supplied by the source company. Westwick-Farrow Pty Ltd does not quantify the amount of local content or the accuracy of the statement made by the source.

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DEC/JAN 2011/12 - What's New in Electronics

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on the cover

Analyser features minimum phase noise, maximum bandwidth The R&S FSW signal and spectrum analyser from Rohde & Schwarz is claimed to outperform all comparable high-end instruments available.

For the first time, developers can view multiple measurement applications at a glance as well as analyse signal interactions - two important features that make complex measurement tasks significantly easier.

The high-end analyser is available in three models that cover the frequency ranges 2 Hz to 8 GHz, 13 or 26.5 GHz. The instrument was specially designed to meet the requirements of development laboratories in the aerospace, defence and communications industries.

The 12.1″ touchscreen is the first feature that catches the attention.

The MultiView function allows users to display the results of different applications at the same time, enabling them to keep track of even the most complex signal analyses and find errors more easily.

An additional benefit is the elimination of switching between measurement applications.

At 10 kHz carrier offset, the analyser achieves a phase noise specification of less than -137 dBc (1 Hz), which is up to 10 dB less than other instruments. This is especially important for developers of RF components and complete systems for radar applications.

By taking advantage of the analyser’s phase noise specification, they can achieve more stable radar signals. Equipped with the FSWK6 option, the instrument also supports analysis of pulsed signals, eg, for radar applications.

Its broad analysis bandwidth, of up to 160 MHz, allows it to measure wideband, hopping and chirp signals and makes it ready, today,

4 What's New in Electronics - DEC/JAN 2011/12

for the requirements of tomorrow’s wireless standards, such as the 802.11ac.

Developers can also detect spurious emissions quickly due to its low inherent noise and ability to rapidly analyse wide frequency ranges, even when using narrow resolution bandwidths.

The analyser is suitable for developers of wireless communications base stations and components. They find the broad 160 MHz demodulation bandwidth and multi-standard radio analysis function especially useful.

The combination of these two features in a single instrument makes it possible, it is believed, for the first time, to simultaneously measure multiple mobile radio and wireless standards at different frequencies.

Users can see signal interaction among the standards.

Rohde & Schwarz www.rohde-schwarz.com

www.electronicsonline.net.au

Hello faster update rates.

Goodbye status quo.

Now with a built-in Arbitrary Waveform Generator The InfiniiVision oscilloscope not only gives greater signal visibility thanks to patented MegaZoom technology. The 3000-X Series now includes an arbitrary waveform generator (AWG) enabling design and test engineers to easily capture/generate a waveform stimulus. With Agilent’s BenchLink Waveform Builder software, you can do even more advanced customization, with algebraic expression editing, freehand drawing and a large library of functions.

That’s thinking ahead. That’s Agilent.

© 2011 Agilent Technologies, Inc.,

FREE 3000-X Series when you buy a 1 GHz 7000B See product demo videos www.agilent.com/find/infiniivisionscopes Contact 1800 629 485 or tm_ap@agilent.com

Plugging the influx of counterfeit connectors

© iStockphoto.com/Ola Dusegård

Just about any product that has earned a reputation for quality or exclusivity has attracted imitators. In itself, that would not necessarily be a bad thing if the imitation was manufactured under licence to the same specifications and the manufacturer did not represent it as a genuine article.

© iStockphoto.com/Madarakis Geogios

component challenge

Certified second sources have become an important part of the connector landscape.

Unfortunately, the market is flooded with counterfeit products that have been crafted to look identical to the name brand item, but are manufactured using inferior materials and workmanship.

Respect for intellectual property is not much of a concern to these folk and the original designers suffer - as well as the unwitting consumer.

Crafty counterfeit suppliers thrive as consumers trying to save a few dollars are willing to believe they are getting a great deal by buying faux products - either knowingly or by mistake.

Rogue manufacturers can profitably divert business from innovators without incurring the costs of product development, skilled manufacturing processes, quality materials and establishment of name brand recognition.

Suppliers of knock-off products ignore copyright laws that are intended to protect intellectual property and proprietary designs, and use identifying logos to convince users that they are getting a bargain on a name-brand product.

Counterfeiting continues to grow and in“OEMs are also seeing parts that cludes nearly every industry. We’ve all heard have been removed from recycled about the $10 fake Rolex watches and cheap handbags with designer labels. But the dangers e-trash, cleaned, relabelled and extend beyond fashion. sold as new components.”

Bogus media, including CDs and DVDs, have severely impacted the entertainment industry. Counterfeit consumer electronics, including mobile phones, video players and cameras, look nearly identical to the genuine article, but fail quickly and don’t meet warranty coverage.

A watch that fails after a few months or a pair of shoes that begins to come apart can be annoying but does little harm except to the expectations of the buyer.

Other forms of counterfeiting have much more serious implications.

The stability of our information structure is at risk. Estimates suggest as many as 20% of Windows operating systems are counterfeit. Since these fakes may not receive Microsoft’s automatic updates, hackers are able to infect a growing number of computers through these faulty systems.

Footwear is the number-one counterfeited product in America, with more than $100 million worth of bogus product seized. Counterfeit boots manufactured in Asia have been found with enough cadmium and lead to qualify as hazardous waste material.

6 What's New in Electronics - DEC/JAN 2011/12

Bob Hult, Bishop & Associates

Toys tainted with lead have become a concern to parents.

Exceptional profit potential has opened the door to medications counterfeiters who offer formulations with reduced potency, pills tainted with dangerous contaminants and even useless placebos.

Estimated global sales of counterfeit drugs in 2010 exceeded US$75 billion, up 90% since 2005. Patients who rely on the effectiveness of prescribed drugs are at serious risk when taking these fakes.

In the late 1980s, manufacturers of military aircraft began to notice bolts that were failing incoming inspection tests. They often were improperly marked or had no markings at all. Subsequent investigation proved that bolts constructed with inferior steel and improperly formed posed a serious risk of failure in critical applications.

Fake bolts have been found in off-road equipment, trucks, forklifts and other heavyduty applications. A failed bolt can cause equipment or structural collapse, resulting in death. Counterfeit motor vehicle parts have also experienced a growth spurt.

The primary sources of these unauthorised products appear to be China, India and, to a lesser degree, Mexico. A recent Wall Street Journal article profiled imitation retail outlets popping up in China that are designed to look exactly like IKEA and Apple stores, but sell a mix of authentic and copied products.

Electronic components have not been immune from the counterfeiting craze. Highvolume commodity products represent a growing segment of the counterfeit market.

Semiconductor chips that range from memory to processors have been reverse www.electronicsonline.net.au

component challenge

engineered and sold without authorisation.

In some cases, they are illegally marked with a recognised supplier’s logo and part number.

Reject chips that have failed to perform to specification or died during burn-in have also found their way into the market.

OEMs are also seeing parts that have been removed from recycled e-trash, cleaned, relabelled and sold as new components. The majority of these chips have been channelled through unauthorised distributors.

Failure of critical components used in military equipment has attracted the attention of the Department of Defense as well as the Senate Armed Services Committee.

The high unit value of components used in military and avionics applications has made this segment particularly profitable to counterfeiters. A report issued by the Department of Commerce found that 39% of companies contracted by the DoD encountered counterfeit electronics from subcontractors.

The expanding use of commercial offthe-shelf components in mil/aero equipment introduces an additional challenge to ensure that only authentic parts that fully satisfy the product specification are used.

Low-cost imitation components also pose an increasing threat to the consumer electronics market by damaging the quality image of a trusted manufacturer, while draining earned profits to the supplier.

It appears that just about every type of electronic component is susceptible to counterfeiting, including capacitors, batteries and relays.

A contractor recently reported difficulty in installing structured cabling. Although the cable jacket had the proper UL logo, closer examination found it consisted of aluminium wire that had been plated with copper.

Contractors now weigh their cable if they suspect fake UTP Cat 5 wire, as aluminium will weigh about 1/3 less than solid copper.

Monster cables are recognised as high performance/value cable assemblies, an ideal target for forgers who take shortcuts in fabricating lower-cost knock-offs.

In one case, the counterfeiter eliminated a critical shield that protects the transition between the cable shield and the HDMI connector. The overmoulded strain relief looks identical to the monster assembly.

Although there have been few reports of bogus electronic connectors, they represent a US$45 billion global industry, which makes it increasingly likely to attract more attention from counterfeiters.

Knock-off connectors may be manufactured using a variety of shortcuts. Connectors from rogue manufacturers have been found to scrimp on plating thicknesses and consistency.

Connector failure after a few years of service can often be traced to the elimination of the critical nickel underplate that separates the base contact material from the plating on the mating surface.

Connectors that exhibit poor contact true position due to loose manufacturing tolerances can stub or fail to mate entirely. Once introduced into the supply stream, these faux interconnects are difficult to identify, as they are often visibly identical with the original, down to individual mould marks.

To date, the most common way fake connectors are detected in the supply chain is when a failed interface is returned to the brand name supplier for analysis.

As the market for higher performance connectors heats up, it may be more difficult for unauthorised manufacturers to sell fakes. At less than 1 Gbps data rates, mechanically identical connectors often perform well. As bandwidth increases into the multigigabit range, however, transmission line effects become dominant, making tightly controlled impedance, insertion loss and crosstalk critical criteria.

Subtle differences in design of the contact and connector body can result in variations in high-speed signal propagation. The cost of duplicating connectors to this degree will require more technical resources than would be available to the typical counterfeiter.

It remains to be seen if the higher price per range of high-performance backplane and mezzanine connectors will attract counterfeiters to this product segment.

The trend towards outsourcing compo- “The most common way fake nents as well as system manufacturing may provide increased opportunities for connector connectors are detected in the counterfeiters. supply chain is when a failed The majority of commercial commodinterface is returned to the brand ity interfaces, such as universal serial bus, HDMI and D-subminiature connectors, is name supplier for analysis.� manufactured in Asia. The necessary manufacturing technology has been transferred to offshore suppliers and their subcontractors, enabling them to duplicate a particular interface.

It is also possible that unauthorised production overruns could be channelled into the grey market and end up competing for business with the name brand connector.

Contract manufacturers, also in Asia, may find lower-cost alternatives to qualified parts to be very attractive and ignore the differences in quality.

Connector manufacturers have taken a more aggressive stance in protecting their intellectual property by patenting new products early in the design cycle and actively pursuing infringement.

Production runs are closely monitored to ensure that excess inventory is not available to the grey market. New policies have been introduced that ensure obsolete, production overruns and scrapped product are accounted for.

The electronics industry has begun stepping up to the challenge of bogus electronic components. A consortium of organisations, including NEMA, UL, CSA and the National Association of Electrical Distributors (NAED), has formed the Anti-Counterfeit Products Initiative, with the objective of exposing the extent and impact of counterfeit electronic components.

Recognising that the majority of bogus parts is entering the market through electronic distributors, the Electronic Components Industry Association (ECIA) has created a website that lists inventories of authorised manufacturers.

Engineers and buyers can avoid grey market components by ensuring that suppliers provide only authentic parts documented on this list.

The ERAI organisation monitors, investigates and reports issues affecting the global electronic supply chain. It has become a primary source of in-depth information on counterfeit, substandard and high-risk components. In August 2011, ERAI published an extensive report on counterfeit electronic parts and laid out a series of actions to mitigate

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DEC/JAN 2011/12 - What's New in Electronics

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component challenge

the risk.Large electronic distributors, including Digi-Key, have partnered with ECIA to sponsor a website that lists products sold only by authorised distributors and that carry the full manufacturer’s warranty.

Panduit recently joined the Communications Cable and Connectivity Association (CCCA) effort to stem the proliferation of counterfeit wire and cable in the structured cabling industry.

OEM procurement managers are adopting defensive strategies to prevent introduction of bogus components into their end products.

These may include: • Establishment of a rigorous qualification process for all their approved vendors; • Development of detailed mechanical and electrical specifications; • Commitment to extensive incoming inspection procedures; • Procurement only from authorised distributors; • Inclusion of a quality clause in purchase agreements with all approved vendors; • Closer monitoring of quality at both the component supplier and contract manufacturer levels.

The battle between legitimate manufacturers and imposters is likely to continue, as pressure to reduce costs remains a basic mantra within the electronic industry.

The street corner peddler selling fake watches from a pushcart has morphed into a cadre of sophisticated manufacturers that sees no conflict with marketing faux electronic components. It uses the internet to market its illicit wares to a global market.

Greater vigilance throughout the supply chain on the part of both suppliers and consumers can help to limit this growing threat.

Bishop & Assoc comments: • Counterfeit electronic components are increasingly entering the supply chain, but it is difficult to quantify the extent of the problem;

Ruggedised connectors

• Far from a victimless crime, counterfeit manufacturers often violate child labour laws, steal earned profits, ignore copyrights, reduce US job opportunities and put potentially dangerous products on the market; • The majority of bogus parts is manufactured in China and unauthorised distributors offer them directly via the internet; • Counterfeit or substandard electronic components may be based on design or materials that will result in delayed failure, making field repair much more expensive; • Governments have largely been unsuccessful in protecting intellectual property rights via legislation; • Multiple government and industry organisations have established policies and suggested practices to fight the growing threat of bogus electronic components; • High-value components destined for military, avionic and space applications are targets of counterfeit component manufacturers and raise national security issues.

Robin Pearce, Bishop & Associates rpearce@bishopinc.com

AC/DC converter Recom has released a range of isolated AC/DC power supply modules with low standby input currents and suitable for low power applications or standby power supplies.

The RAC01 and RAC02 offer 1 or 2 W output from a universal input voltage of 90-265 VAC and yet draw 30 mW in standby. The RAC03 offers a higher output of 3 W yet draws 80 mW when unloaded.

The devices offer high efficiency, well regulated, short-circuit protected DC outputs with 3.3, 5, 9, 12, 15 or 24 V voltage options and a line and load regulation of typically ±2%. The conversion efficiency is up to 78%, which enables the company to guarantee an operating temperature range of -25 to +85°C for the 1 W part, reducing to +80°C for the 2 and 3 W converters.

Neutrik’s etherCON series is a ruggedised and lockable RJ45 connector system designed to withstand the demands of professional audio and video network applications.

The range has been expanded with the addition of the NE8MC6-MO self-terminating connector for CAT6 cable.

This model features a robust metal shell, push-pull locking system, CAT6 RJ45 plug and chuck-style strain relief. The connector can accommodate STP and UTP cables from 5.5 to 6.5 mm O/D and solid or stranded wire cables from AWG22 to AWG28. It is also dust and water resistant to IP65. Other features include CAT6 compliance to TIA/EIA 568B, ISO/IEC 11801, EN 50173 specifications and data rates up to 10 Gbps plus high noise immunity and EMI protection.

Amber Technology Limited Contact info and more items like this at wf.net.au/L682

Cutter Electronics Contact info and more items like this at wf.net.au/K365

Scalable Mini-ITX iBASE’s CMI211-6COM scalable Mini-ITX system is equipped with a Mini-ITX motherboard with either an Intel or AMD processor with a TDP of up to 65 W. In addition to the I/O ports on the board installed, the device also offers 6 x COM and 2 x USB ports. This system will support 1 x 2.5″ SATA HDD drive plus 1 x PCI slot.

A wall-mount kit is included and comes in black, matching the chassis colour. Operating temperature ranges from -20 to +80°C. The system withstands operating vibrations of 0.25 g/5-500 Hz/ random. The system is equipped with a 180 W Flex ATX power supply with an input frequency of 47-63 Hz. Backplane Systems Technology Pty Ltd Contact info and more items like this at wf.net.au/L653

8 What's New in Electronics - DEC/JAN 2011/12

www.electronicsonline.net.au

industrial design

Reliability drive for vehicle connectors Ted Worroll and Mike Gardiner, product managers at ITT Interconnect Solutions

Rugged connectors are meeting the rapidly changing requirements of the modern motor vehicle platform. Today’s vehicles are heading into new territory, due to smart and adaptable interconnect products.

There is one requirement in the industry that remains steadfast - reliability. While consumer demands drive many trends in the dynamic motor vehicle industry, including cost, comfort, size, style, safety and functionality, the need for advanced, rugged components in this harsh environment application, remains a constant.

Many connecters were developed based on industrial connector designs. The original industrial designs were developed to address many of the same environmental factors that are “As electronic designs continue found in the vehicle environment, including to replace mechanical control high temperatures, vibration, shock, and fluid exposure. systems, connectors must evolve Engineers adapted the industrial designs to eliminate reliability concerns.” to meet vehicle requirements. However, the increasing complexity of vehicle electronics - particularly control systems and sensors - has created demands for interconnects that vary greatly from the traditional pin-and-socket connectors.

Designers using the latest technologies to enhance systems, such as safety features, user interfaces and electric vehicle charging, must implement high-performance, ultra-dependable connectors.

In addition to meeting reliability and quality standards, connectors in today’s vehicles are required to have an increased I/O count and density, while reducing their PCB footprint and cost.

A significant challenge in the evolution of these connectors is meeting reliability and durability standards. Today’s vehicles rely heavily on electronics to control critical systems, including steering, braking, airbags and GPS. This means that electronic components used in safety-critical systems must be ultra-reliable and durable. Failures in any critical system could have disastrous results.

10 What's New in Electronics - DEC/JAN 2011/12

While today’s electronic systems have demonstrated reliability, they cannot be visually inspected and physically tested like traditional rod-and-gear mechanics.

As electronic designs continue to replace mechanical control systems, connectors must evolve to eliminate reliability concerns.

Temperature: Under-the-bonnet applications must perform at both ends of the temperature spectrum, from sub-freezing temperatures before ignition to high operating temperatures when an engine is running.

Temperature stresses are common in vehicle applications and these require connectors that can operate at temperatures between -55 to +125°C, but these aren’t the only concerns.

Current electronic fabrication processes require connectors that can withstand processing temperatures for RoHS compliance up to +260°C (for a limited time during processing). This elevated processing temperature requirement has emerged in response to the European initiatives that eliminated lead from soldering, elevating the processing temperatures during electronics fabrication.

Shock and vibration: Interconnects for vehicle electronics have incorporated much of the experience from industrial applications with regard to shock and vibration. www.electronicsonline.net.au

© iStockphoto.com/Maxim Leonchuk

industrial design

It can be challenging to find interconnect solutions that are able to withstand both low and high frequency vibrations typical of motor vehicle applications.

So there is critical need to find an interconnect partner with the ability to work on a project from the beginning to ensure that a reliable solution ends up in the finished product. Examples of vibration include low frequency sources caused by out of balance wheels on a vehicle to high frequency vibration caused by engines.

Shock loads vary, with some extreme, undampened shock resulting in hundreds of Gs of force on impact surfaces.

Sealing: Many electronics traditionally used in vehicles were developed for environments not typically subjected to moisture and chemicals. Fortunately, some manufacturers have been able to use their industrial experience to implement sealing techniques designed to meet IP65 (splash), IP67 (submersion) and IP69 (spray) specifications.

Manufacturers have employed anti-corrosive materials to ensure connectors survive in wet and corrosive environments for applications found on vehicle engines, batteries and on systems exposed to the external environment.

Beyond the performance and environmental exposure issues for connectors, there are important quality concerns as well.

Conditions, such as bent pins from connector misalignment during assembly, are an old problem that affects reliability, raises assembly costs and leads to production delays.

However, even this issue is being addressed through the latest plug-only landed contact designs, which minimise these types of quality issues.

There has been a significant move away from traditional pin-andsocket connectors towards newer pressure contacts that can be better controlled in under-bonnet environments.

These plug-only landed contact systems include pressure contacts designed to mate directly to pads on a PCB, yet are able to withstand the thermal shock, vibration and hostile environments common in vehicles.

In these systems, all the contacts are in a plug-side connector, so OEMs can have receptacles integrated into their housing with essentially no connectors and no contacts The advantages include: • Increased density (due to requiring only a pad on the PCB); • Cost reduction (from the removal of contacts); • Simplification of the connection in the plug-side to provide the total solution.

New connector designs provide a plug-only solution that is scalable, sealed, rugged, high-density, smaller and has lower total installed costs.

Environmental concerns and the rising cost of oil have spurred consumer demand for more compact, fuel-efficient vehicles.

Technological advancements have enabled motor vehicle manufacturers to address “New connector designs provide a this demand with the mass-production of plug-only solution that is scalable, environmentally friendly vehicles, such as sealed, rugged, high-density, smaller hybrid and electric cars.

Since the introduction of electric vehicles, and has lower total installed costs.” a primary concern from many sceptical consumers has been the reliability of charging.

Not only is the operating life of the rechargeable lithium-ion battery being questioned but the lengthy battery recharging process is also an issue.

These obstacles have undoubtedly delayed the mass-production of electric vehicles by major manufacturers. With recent interconnect technology advancements, however, the charging of a lithium-ion battery can be reduced from the standard eight hours down to four hours.

With the release of the SAE Electric Vehicle J1772 charging specification in January 2010 (a standard adopted in both the US and Japan for Level 1 and Level 2 electric vehicle charging), the market needed a robust coupler capable of passing the UL 2251 certification.

In addition, the application required a high amperage charging solution that could provide fast, easy and safe charging of any electric vehicle.

Manufacturers have provided a high amperage solution that reduces the Level 2 charge time by 50%. With a single inlet design that allows for Level 1 and Level 2 charging, this interconnect system has proved its ability to meet both electrical and mechanical UL specifications.

It features high-efficiency power contact to provide flexible functionality, with minimal modifications, across a power curve ranging from a low of 15 A/120 V to a high of 75 A/240 V. The interconnect solution uses standard ITT VEAM CIR series backshells, flange gaskets and mounting plates, providing an enhanced cable management system that incorporates robust technology and ground pin contacts on the inlet side.

Anti-freeze drain holes enable outdoor use in extreme environments.

Manufacturers are continuously developing new connector designs and technologies to keep pace with vehicle demands.

When designing for the industry, engineers must always take into account the severe environmental conditions that connectors are subjected to every day.

As electronics are increasingly used in safety-critical applications, it is even more important that connectors are rugged and reliable.

Robin Pearce, Bishop & Associates rpearce@bishopinc.com

www.electronicsonline.net.au

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newproducts ADCs reclassified Linear Technology has announced new export classification control numbers for its families of high-performance, high-speed ADCs with sample rates of up to 200 MS/s at 12-bit, 125 MS/s at 14-bit and 10 MS/s at 16-bit resolutions.

New US Export Administration Regulations have allowed these devices to be reclassified to the less stringent ECCN# 3A991. The company has available a wide range of low-power ADCs that maximise desired system performance. For highperformance communications applications, the LTC2207-14 14-bit 105 MS/s ADC achieves 77.3 dB SNR and 98 dB SFDR. At 16-bit 10 MS/s, the LTC2202’s 81.6 dB SNR and 100 dB SFDR performance is suitable for CCD (charge-coupled device) and infrared cameras, X-ray and cytometry/ spectroscopy applications. element14 Contact info and more items like this at wf.net.au/L247

GNSS receiver module Fastrax has unveiled the IT600, including GPS, Russian-based Glonass, Japanese QZSS and SBAS in a single receiver module.

In addition to currently supported global navigation satellite systems (GNSS), the device is designed to also support other positioning systems such as European-based Galileo and Chinese Compass/ Beidou2 in the future.

The receiver module is specifically designed to serve the needs of the motor vehicle industry. Enabling both GPS and Glonass generally doubles the number of visible satellites compared with using GPS only. The module can use an analog gyro and odometer pulse and can later be complemented with a digital 3-axis gyro and differential wheel pulse from a vehicle’s CAN interface to compensate for possible unavailability of GNSS signals.

It features 32 dedicated tracking channels that are dynamically assigned to acquire and track a mix of GPS, Glonass, QZSS, Galileo and Compass/Beidou2 signals. The module is able to operate normally with only one of the GNSS or use several systems simultaneously.

Glyn Ltd Contact info and more items like this at wf.net.au/J995

Slimline wallbox The Verotec Slimline Wallbox is a low-profile 2.5U x 19″ enclosure suitable for telecom/datacom networking applications where equipment can be mounted vertically to overcome space restrictions.

Options include various cable entry gland configurations and key locks and it is supplied with a drilling template for wall mounting.

Its features include: height of 500 x 335 mm wide x 115 mm deep; wall mounting slot in back panel; multiaccess gland facilities; internal protection plate for additional security.

Lektronics Pty Ltd Contact info and more items like this at wf.net.au/L977

Connection system A method of achieving ‘platedthrough’ holes without an electroplating system, permits quick and cost-effective conductivity of circuit board holes.

Three sizes of 0.8, 1.0 and 1.2 mm are available. A flat finish to both sides makes it SMT-friendly and being hollow (unlike pins) they are suitable for through-hole components.

Pure copper is used for optimum conductivity.

Each kit contains tooling and sufficient bails for 250 holes, one size per pack, and additional packs of bail-bars are available, 10 strips of 25 bails = 250 holes, one size per pack.

The manual system applies a conductive coating to the walls of a circuit board hole while maintaining a flat surface on both sides of the board. After hand-setting, the holes are left with a solder-plated copper wall and a solder-filled barrel. If a through-hole is not required, top and bottom pads are just soldered.

Where a through-hole is necessary, the solder core is removed with a de-soldering tool or wick after soldering both sides.

Bail-bars consist of lengths of solder wire which have been electroplated with pure copper then over-plated with tin and scored at intervals of approximately 2 mm. Each bail-bar is divided into 25 bails.

An insertion tool is used to insert the end of the bail-bar into the hole. The bail-bar is snapped off to leave one bail in the hole.

Satcam Contact info and more items like this at wf.net.au/L609

tel: 08 8240 2244

Standard and modified diecast aluminium, metal and plastic enclosures

www.hammondmfg.com 12 What's New in Electronics - DEC/JAN 2011/12

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newproducts Scope waveform option

BNC connectors

An arbitrary waveform generator has been added to the 3000 X-series oscilloscopes. Agilent is including this free software upgrade - which is used with the integrated WaveGen 20 MHz function generator option.

The generator provides standard stimulus output waveforms to a device under test as well as userdefinable frequencies, amplitudes, offset, and pulse widths and arbitrary waveform capability. WaveGen’s output is routed to a BNC on the front panel of the oscilloscope below the display.

With the upgraded software, users can capture waveforms with their oscilloscopes and convert them to stimulus files - and edit the captured waveforms using the built-in waveform editor within the scope.

Agilent Technologies Australia Pty Ltd Contact info and more items like this at wf.net.au/P090

Low-profile enclosure The Verotec Slimline Wallbox is a low-profile 2.5U x 19″ enclosure suitable for telecom/datacom networking applications where equipment can be mounted vertically to overcome space restrictions.

Dimensions are height, 500 x width 335 x depth 115 mm.

Options include various cable entry gland configurations and key locks. A drilling template for wall mounting is supplied. Other features include a wall-mounting slot in the back panel; multiaccess gland facilities; internal protection plate for additional security.

Lektronics Pty Ltd

Amber Technology Limited Contact info and more items like this at wf.net.au/L686

Contact info and more items like this at wf.net.au/L691

The World’s First Mixed Domain Oscilloscope

Canare has released a range of 75 â„Ś BNC connectors designed to offer good 3 GHz performance.

The BCP-B series BNCs exceed the 3 Gbps HD-SDI requirements specified in SMPTE424M and are designed specifically to achieve performance-optimising cable matching.

The design features an elongated sleeve, rugged die-cast body to reduce both weight and cost, gold-plated centre pin with snap-lock and an alignment mark on the shell to allow simple visual confirmation that the connector is correctly in place.

Industrial Computer Solutions Specialist • Industrial PDAs & Tablets • Full Function Panel PCs • 19Ë? Rackmount Servers • Single Board Computers

analog

digital

RF

• Industrial Networking

MDO4000 Mixed Domain Oscilloscope

Two domains: Time and Frequency at one glance.

Built-in spectrum analyzer Transform the way you test, only from Tektronix

Time Domain

Ph: 02 9457 6011 sales@icp-australia.com.au www.icp-australia.com.au

Frequency Domain

4 analog channels • 500MHz and 1 GHz bandwidth models 16 digital channels 1 RF channels • 50 kHz-3 GHz and 50 kHz-6 GHz frequency range models • Ultra-wide capture bandwidth up to 3GHz • Unique RF analysis tools: automated markers, spectrogram display, RF vs. time traces, advanced RF triggers

Parallel bus triggering and analysis Serial bus triggering and analysis options Built on the award-winning MSO4000B mixed signal oscilloscope platform

Learn more at www.tektronix.com/revolutionary. www.tektronix.com

Industrial Computer Hardware Provider Since 1989 • Panels PCs & Monitors • Embedded PCs • Industrial Keyboards & Mice • Vehicle Computing • Military Grade PCs

TekMark Australia • Tel: 1300 811 355 Email: enquiries@tekmarkgroup.com Nichecom • New Zealand • Tel: +64-4-232-3233 Email: tektronix@nichecom.co.nz Š 2011 Tektronix, Inc. All rights reserved. Tektronix products are covered by U.S. and foreign patents, issued and pending. TEKTRONIX and the Tektronix logo are registered trademarks of Tektronix.

Ph: 02 9457 6400 sales@backplane.com.au www.backplane.com.au

14 What's New in Electronics - DEC/JAN 2011/12

www.electronicsonline.net.au

newproducts Motion controller ACS Motion Control has developed a PC-based machine and motion control solution that meets high-performance motion control requirements while minimising costs.

Designated the SPiiPlusSC (soft controller), it features motion control software that uses the processing power of a modern PC and the connectivity of a real-time open industrial ethernet network.

It enables a standard PC to run the machine host application, the graphical user interface and the real-time motion controller and PLC without adding any hardware.

The control software runs on one of the multi-core PC processors and provides high-speed host-to-controller communication over shared RAM and virtual TCP/IP. The controller manages all motor drives and I/O processes using one of the standard ethernet ports of the PC as the etherCAT master communications channel. The system simplifies connectivity by eliminating the dedicated controller hardware.

The controller is available in two versions: the SPiiPlusSC-HP for complex and performance demanding applications, with up to 64 axes; and the SPiiPlusSC-LT, an economical version that addresses the needs of one to eight axes. Both versions provide the same servo and motion performance.

The controller is complemented by a full range of etherCAT motor drives and of I/O modules that can provide thousands I/O points. In addition, the open architecture can support ACS and other vendors’ qualified etherCAT components. Programming in both PLCOpen IEC61131-3 languages and the ACSPL+ multitasking motion language is fully supported.

Full API libraries are also included for Windows-based host programming. A full controller simulator allows the user to develop the motion application and front end without any hardware.

The controller is suitable for applications including SMT assembly systems, semiconductor manufacturing and inspection equipment, FPD manufacturing and inspection, solar panel manufacturing, packaging machines, medical body scanners, robotics, wide-format printing and high-precision, motion-centric machinery.

Automated Handling & Packaging Pty Ltd Contact info and more items like this at wf.net.au/L369

Energy meters Carlo Gavazzi energy meters - the WM30 and WM40 and their range of optional add-on modules, include BACnet IP, MODBUS TCP/IP, MODBUS-RTU and iFIX SCADA. The BACnet and MODBUS options are also available with or without onboard memory.

With the large LCD display, that can be user configured, all the most critical parameters are available at a glance. Combined with the touchpad, navigation through the parameter list including energy, currents, voltages, frequency, power, power factor and harmonic analysis is available.

Complete with Class 0.5 (kWh accuracy, phase asymmetry measurement, temperature input and harmonic analysis up to 32nd harmonics, the meters can also be integrated into the company’s plug-and-play trending and analysis software - PowerSoft.

NHP Electrical Engineering Products Pty Ltd Contact info and more items like this at wf.net.au/L375

www.electronicsonline.net.au

Well Connected

Wide range of Cable Assemblies including: • FFCs and FPCs • Custom-Made such as Moulded RS232 Data Communications • Automotives • Waterproof & RF Cable Assemblies • Locally made Cable Assemblies for prototyping 3 Small Volumes 3 Quick Turnaround • UL Approved and RoHS Compliant Cable Assemblies Semiconductor IC’s Resistors Capacitors Potentiometers Crystals

Oscillators Filters LED’s & LCD’s Relays Sensors

Switches Connectors Fasteners Enclosures GPS Modules

Ampec Technologies Pty Ltd Sydney: Web: E-mail:

(02) 8741-5000 www.ampec.com.au sales@ampec.com.au

newproducts Mixed domain scope Tektronix has introduced what it claims is the first mixed domain oscilloscope that delivers the functionality of a scope and a spectrum analyser in a single instrument.

The MDO4000 mixed domain oscilloscope series gives users the ability to capture time-correlated analog, digital and RF signals for a complete system view.

More than 60% of oscilloscope users also use a spectrum analyser to troubleshoot embedded system designs with integrated wireless functionality, requiring them to work in both the time and frequency domain.

The instrument allows users to capture time-correlated analog, digital and RF signals across four analog, 16 digital and one RF channel.

The RF input frequency range extends to 6 GHz and provides a capture bandwidth of ≥1 GHz at all centre frequencies, 100 times wider than other spectrum analysers. Users can see up to four decoded serial and/or parallel buses at one time on the same display.

Due to this time correlation between domains, engineers can now make accurate timing measurements to understand delays and latencies between command/control events in their design and changes in the RF spectrum.

The oscilloscope also allows designers to see the RF spectrum of a signal at any point in time within a long acquisition to see how the spectrum changes over time or with device state.

By moving the Spectrum Time throughout the time domain acquisition, designers can see the RF spectrum for any point in their acquisition while simultaneously seeing their analog, digital and/or decoded buses at the same point in time.

Similarly, RF time domain traces are used to show how the amplitude, frequency or phase of the RF input signal changes relative to time. The RF time domain traces are shown in the same window as the analog, digital and serial/parallel bus decoded waveforms, providing instant insight into device operation.

In addition to the standard RF power level trigger, an optional module (MDO4TRIG) allows additional trigger types to use the RF power level as a source, enabling users to further isolate an RF event of interest.

Users can trigger on a specific pulse width, or look for a timeout event or runt, or even include the RF input in a logic pattern defined along with the analog and digital channels.

This ability to trigger on whatever the user is interested in regardless of whether it’s analog, digital, RF or some combination is a claimed industry first for the series.

TekMark Australia Pty Ltd Contact info and more items like this at wf.net.au/P087

16 What's New in Electronics - DEC/JAN 2011/12

Low power module

The SOM-7564 module adopts the open PCI-Express standard that allows connection to third-party chips giving developers even greater flexibility and functionality.

The module is the company’s first to comply with the COM R2.0 type 10 specification. The compact design is about the size of a business card, making it suitable for applications in point-of-sale, transportation, medical and factory devices.

The device is designed with only the CPU on module, an Atom processor E6xx series, which allows users to choose an I/O hub specifically to fulfil their requirements. The company specially designed the SOM-AB5500 application board with this IOH connected to the CPU on SOM-7564 through a PCIe x1 interface. SOM-AB5500 is a 3.5″ carrier board with a smart battery manager that delivers ultralow power consumption and diverse I/O options.

It supports 24-bit LVDS and I/O: 3 PCIe x1, GbE (more I/Os with SOMAB5500: 2 SATA II, 5 USB 2.0 and 4 serial ports (COM1 supports RS232/422/485 while the rest support RS232 only). iManager 2.0 provides a suite of programmable APIs such as multilevel watchdog, hardware monitor and smart fan. Since this is a built-in solution on chip, iManager ensures functions operate even if the OS fails.

Advantech Australia Pty Ltd Contact info and more items like this at wf.net.au/L969

www.electronicsonline.net.au

newproducts Stackable smart switch

New shape enclosures

A 10-gigabit smart switch is claimed to be the first targeted at mid-market networks.

The ProSafe 48-port gigabit stackable smart switch (GS752TXS), with 10-gigabit connectivity, is suitable for high-performance networking demands, including data replication and back-up and video on demand.

It is purposely designed for mid-enterprise users seeking virtualisation solutions to improve server use, availability and application management. The device boasts Layer 2 management features, superior switching performance and advanced security measures, yet is simple to use.

Its stacking capability improves network redundancy and reliability while allowing for network expansion.

The scalable design gives businesses the flexibility to stack up to six switches, creating up to 228 network ports, with full redundancy. The stack can also be configured and managed as one single switch.

The 1590 family of die-cast enclosures has been extended with the 1590TRP and STP models. The first applications have been for audio equipment, guitar stomp boxes, industrial remote controllers, desktop switch arrays and handheld test equipment controllers.

The octagonal 1590TRP is 133 mm across the flats and 39 mm high and will house a circular PCB up to 126 mm in diameter. The two trapezoidal units are also 39 mm high. The smaller portrait format unit is 112 mm long, narrowing from 79 to 62 mm; the larger landscape format one is 95 mm deep and narrows from 151 to 122 mm.

All three types are available in natural finish and in a smooth gloss polyester powder paint which does not chip after machining and provides a good surface for labels and silk screening.

The painted colours are black; cobalt blue, RAL 5013; green, RAL 6024; light grey, RAL 7035; orange, RAL 2009; and red, RAL 3011. A lap joint seals the units to IP54, protecting against the ingress of dust and water, and the painted finish is only applied to the external surfaces, maintaining RFI integrity.

Netgear Australia Contact info and more items like this at wf.net.au/L378

Hammond Electronics Pty Ltd Contact info and more items like this at wf.net.au/L942

www.electronicsonline.net.au www.electronicsonline.net.au

DEC/JAN 2011/12 - What's New in Electronics

17

© iStockphoto.com/Daniel Schoenen

Imec and its 16 European project partners have launched the European FP7 project X10D, aimed at developing tandem organic solar cells with an increased conversion efficiency and lifetime and a decreased production cost.

The ultimate goal of the project is to bring organic photovoltaic technologies towards introduction into the competitive thin-film PV market.

Organic solar cells hold the promise of low-cost production and high throughput. However, current OPV technologies are unstable when exposed to the ambient environment and their power conversion efficiencies are not sufficient to be viable alternatives to the current dominance of silicon photovoltaic technologies.

By applying new designs and architectures, materials and manufacturing technologies, the project aims at increasing the power conversion efficiency to achieve at least 12% on cell level (1 cm²) and 9% on module level (100 cm²).

Moreover, the project has set its goal to guarantee a minimum of 20 years lifetime for OPV modules on glass and 10 years on foil, and to decrease the cost below 0.70 E/W-peak.

The project gathers the available OPV knowledge and expertise from universities, research institutes and companies in Europe. Furthermore, it brings together a complete and unique OPV research and development consortium covering both solutionprocessed as well as small moleculebased OPV expertise.

Each segment of the value chain is represented in the project: materials development and upscaling, device development and upscaling, large-area deposition equipment and processes, novel transparent conductors, laser scribing equipment and processes, encapsulation technologies, energy, life cycle, and cost analysis and finally end users.

New joint venture to manufacture power modules in China The new company, Mitsubishi Electric GEM Power Device (Hefei) Co, Ltd, will begin operations in January 2012 in Hefei economic and technological development area, Anhui Province, China.

The company plans to expand its workforce to about 800 by December 2015.

The production will be initially two to three different types of power module packages with targeted applications in the consumer and industrial market segments.

Mouser and IR deal Mouser Electronics has signed a worldwide distribution agreement with International Rectifier.

For design engineers, Mouser’s agreement means faster, more streamlined access to IR’s power management technology that enables applications to work smarter, run cooler and raise productivity-per-watt. Users will have access to detailed product knowledge microsites for IR’s newest products including digital, analog and mixed-signal ICs, power systems and discrete power components.

18 What's New in Electronics - DEC/JAN 2011/12

TCO market forecast to rise

© iStockphoto.com/Ravi Tahilramani

Organic solar cells collaboration

NanoMarkets’ report, ‘Emerging Markets for Non-ITO Transparent Conductive Oxides’ addresses the markets for ‘alternative’ transparent conductive oxides (TCOs) and predicts that by 2016 the market for these alternative TCOs will reach US$925 million.

The report analyses applications for these alternatives to indium tin oxide materials in: LCD, e-paper, plasma and OLED displays; touch-screen sensors; thin-film and organic photovoltaics, OLED lighting; low e-windows and smart windows; and solar control film, antistatics and RFI/EMI shielding.

The report also discusses the opportunities for TCOs as an alternative to amorphous silicon in thin-film transistors.

Materials covered in the report include FTO, ATO, AZO, GZO, IZO, multicomponent amorphous TCOs (MATCOs) and p-type materials.

The report states that fluorine-doped tin oxide could be the next ITO. It is already the dominant transparent conductor used for the CdTe versions of photovoltaics. In addition, FTO has been extensively used in low-emittance (low-e) architectural windows, which are used to control costs in commercial buildings.

NanoMarkets believes that there are opportunities for these materials in thin-film transistor channels. In fact, there are already signs that they will be used in TFT channels for improved economics and performance in the AMOLEDs that are now rapidly penetrating the mobile display industry and will soon be used in TVs. In addition, the arrival of p-type TCOs suggests a future of completely transparent electronics and PV and LEDs constructed from non-toxic materials.

NanoMarkets expects antinomy tin oxide (ATO) in its nanomaterial form to break into new markets. It is already gaining ground on nano-ITO in heat shielding and antistatics and NanoMarkets believes that it will even be able to compete with conducting polymers. www.electronicsonline.net.au

EUV sensors for lithography

Simpler sensors coming to touch screens

© iStockphoto.com/Tom Nance

Y H Y P H P A A R G O G H O T I H LLIIT L

© iStockphoto.com/Oleksiy Mark

Imec has qualified a chipset consisting of custom high-quality EUV sensor dies that are now being integrated in ASML’s NXE:3100 EUV lithography tools in the field, improving the tools’ overlay and critical dimension tool performance.

With this achievement, imec confirms that its CMORE business line is ready to provide its partners with custom specialty chip solutions.

The sensors were processed according to ASML’s custom designs and specifications, with focus on superior lifetime and sensitivity to direct and high EUV irradiation doses. Two of the sensors are designed to calibrate, align, and focus the tool’s lens systems.

They have been integrated in functional sensor modules and are being integrated in the NXE machines in the field. A third sensor is designed to monitor the EUV dose. The next milestone in progress is to build and qualify the different sensors for the NXE:3300 by the end of this year.

Via its CMORE initiative, the organisation offers companies all the services needed to turn innovative ideas into smart packaged microsystem products.

The CMORE toolbox contains a wide variety of device technologies on 200 mm (eg, CMOS, Si-photonics, MEMS, image sensors, packaging) as well as design, testing and reliability.

Next to these EUV sensors, imec CMORE is developing several other customer chip solutions. They include technology from all imec’s strategic areas such as bio-sensing, energy- and power management and highend specialty imaging - photolithography among others.

Services range from feasibility studies over design and technology development to prototyping and low-volume manufacturing.

And through its alliances, imec can also offer a path to transfer the technology to a foundry for volume production.

Projected capacitive, the predominant touch-screen technology, has many different structures. Over the next few years, these structures will be simplified as sensor substrate layers are reduced, according to the DisplaySearch Touch Panel Market Analysis: October 2011 Update.

These simpler touch-panel structures will bring the benefit of thinner and lighter devices.

“Two approaches are emerging to simplify projected capacitive sensor designs,” said Jennifer Colegrove, Vice President of Emerging Display Technologies for DisplaySearch. “One is sensoron-cover and the other is in-/on-cell.”

In-cell and on-cell sensors are typically integrated during the display manufacturing process, whereas sensor-on-cover involves coordination between touch sensor and cover glass makers.

While Apple products use glass-based sensors with ITO (indium tin oxide, the typical transparent conductor) layers on both sides, most sensors use one or two layers of ITO on the same side of the glass; this is required for sensor-on-cover because the outer side is the exterior of the product.

As projected capacitive touch-screen shipments grow by more than 100% Y/Y, cover glass has become a key component in touch screens. Regardless of the type used - sensor-on-cover or in/ on-cell - cover glass is a must for projected capacitive touch for both cosmetic and protection purposes.

Cover glass finishing is very labour-intensive and, depending on the processes required and specifications, has yield rates in the 70% range. Process challenges will be an increasingly strategic issue for the industry. Depending on the technology and supply chain, cover glass finishers and touch module makers will be working together by contract or informal relationship, while tier-one touch module makers are integrating and expanding their in-house cover glass finishing capacities.

The touch-screen supply chain is evolving differently in each region, based on variations in technologies and supply chain variables. Although sensor patterning and lamination processes are mostly automated, manpower is still necessary, especially for inspection.

Japan, with high labour costs as well as a complex supply chain, tends to have the highest cost structure. China offers the lowest prices for mature mobile phone sensors, and Taiwan has lower prices for tablet PC sensors, due to greater availability of glass and better access to Gen 4.5 and larger equipment for sensor deposition and photolithography.

For popular mobile PC sizes (9.7 and 10.1″), average selling prices per unit are in the range of $1.00-1.50 per inch. However, DisplaySearch anticipates prices will fall as popularity increases. ASPs of regular notebook sizes (>11.6″) are still higher due to challenges in scaling production.

Other key findings from the analysis include: curved or shaped cover glass - referred to as 2.5D if along one axis and 3D if along both axes - is a new design trend. Many touch-enabled smartphones look very similar, so brands are looking to use curved cover glass to differentiate their products. Due to its more complicated processes and costs, DisplaySearch expects curved cover glass to be used primarily in high-end models; while touch module makers are likely to outsource larger-sized sensors if volumes increase, DisplaySearch expects tier-one touch module makers to integrate cover glass finishing because it is critical for sensor-on-cover production and for decreasing substrate weight and thickness; moving into the holiday season, DisplaySearch forecasts that the tablet PC market will be increasingly important for the touch panel industry, particularly as lower-priced products, like the Amazon Kindle Fire, enter the market.

www.electronicsonline.net.au

DEC/JAN 2011/12 - What's New in Electronics

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© iStockphoto.com/Henrik Jonsson

Downturn predicted in PV revenues OLED lighting project Global PV equipment spending (including c-Si ingot-to-module and thin-film panel) is now projected to fall by more than 45% in 2012, down from a historic peak of US$13.1 billion this year, according to the latest Solarbuzz PV Equipment Quarterly report.

As a result, PV equipment suppliers are being forced to redefine their product roadmaps to align with the projected upturn in spending after 2012.

Almost half PV equipment spending in 2011 has been stimulated by new entrants to the industry or from existing tier-two or tierthree manufacturers seeking to increase revenues simply by adding more capacity. The majority of this investment has turned out to be supplemental to the capacity required to meet short-term industry demand.

Consequently, revenues available to PV equipment suppliers have been temporarily inflated by US$6 billion during 2011. The scale of this over-investment will not only drive the magnitude of the revenue declines during 2012, but will also prolong the spending downturn period into 2013.

According to Solarbuzz: “Aspirations of rapid market entry or market-share gains from lower-tier cell manufacturers have been key factors behind the surplus in equipment spending during 2011. However, the second strong cycle of thin-film investments also peaked this year. This saw considerable funding being allocated to next-generation PV technologies.”

Having posted positive revenue growth between Q3’09 and Q1’11, PV equipment spending during both Q2’11 and Q3’11 has declined by single-digit percentage points, as the slowdown in new capacity expansion starts to impact equipment suppliers’ revenues.

While strong Y/Y growth of 21% during Q3’11 will be highlighted during company reporting later this quarter, the leading forward indicators show sharp declines in new order intake, resulting from PV manufacturers’ concerns over capacity and demand levels forecast for 2012.

Double-digit Q/Q revenue declines are now forecast between Q4’11 and Q2’12.

The only PV equipment suppliers that will be shielded from rapid declines in revenues through 2012 are those with strong order backlogs aligned with polysilicon expansion phases in progress across the Asia Pacific region.

This will actually drive Y/Y growth in revenues for a select group of companies meeting this upstream demand. Conversely, many other PV equipment suppliers will experience Y/Y revenue declines of 30-70%. Equipment suppliers that benefitted most from the c-Si wafer, cell and module expansions of 2011 will be the hardest hit during 2012, as new expansion plans are pushed out or postponed.

© iStockphoto.com/Miklos Voros

Sapphire market back in check Following the massive material shortage in 2010, sapphire and finished wafer prices remained high through early 2011, according to a Yole Développement report.

The situation was aggravated as wafer and LED manufacturers, preparing for a massive intake of LED in the LCD TV market, started building up sapphire inventory for fear that supply might remain short.

But a softer than expected LED TV market and an increasing sapphire capacity, coming from established vendors, worked together to rapidly bring supply and demand back into balance this summer. This has triggered a fast drop in wafer prices that have now returned to their pre-shortage levels.

20 What's New in Electronics - DEC/JAN 2011/12

Imec and its project partners have launched IMOLA (intelligent light management for OLED on foil applications), a project under the EU’s 7th framework program for ICT (FP7).

The project’s goal is to make large-area OLED-based lighting modules with built-in intelligent light management. These systems will be used in future energy-efficient wall, ceiling and car dome lighting, where the light intensity can be adjusted intelligently, eg, according to the time of the day or weather conditions.

OLEDs (organic light-emitting diode) are paper-thin, flexible and lightweight electronic devices. They consist of organic materials which emit light in response to an electric current. They consume up to 70% less energy compared with conventional light sources. This makes them a prime candidate for the next generation of energysaving lighting, but before flexible large-area OLED lighting can be commercialised, more R&D is needed to solve some outstanding challenges.

These areas, which mainly concern the driving electronics, power distribution, integration and miniaturisation, as well as sensors and application intelligence, will be tackled by IMOLA. The consortium includes industrial and academic partners who are leaders in their field of expertise. Next to Imec, the project coordinator, the partners involved in IMOLA are TNO/Holst Centre (Netherlands), Philips Technologie (Germany), NXP Semiconductors (Netherlands, Belgium), Hanita Coatings RCA (Israel), Henkel Electronic Materials (Belgium), Centro Ricerche Plast-optica (Italy) and the FER department of the University of Zagreb (Croatia). www.electronicsonline.net.au

newproducts Jack plug The Neutrik timbrePLUG is a ¼″ jack plug that has been developed for performing musicians. The company recognised that an electric guitar’s sound is not only influenced by the instrument itself (pickups, strings, timber etc) but also by the choice of connection cable and amplifier.

Different types and lengths of instrument cable can noticeably influence a guitar’s characteristic sound. Fitting the timbrePLUG to the instrument end of the cable allows musicians to adjust the ‘timbre’ of their guitar sound from neutral, clear sound to warm characteristics in four steps by turning a knob on the plug.

The plug is designed to withstand the rigours of the most demanding live performances with a slim right-angle design, chuck-type strain relief and a robust all-metal construction with machined onepiece contacts.

Medical sealed connectors Fischer Connectors has released interconnect solutions, UltiMate original series, designed for a broad range of harsh environment applications. The series offers rugged, compact, lightweight, sealed connectors and cable assembly solutions for medical electronic equipment.

Major features include rugged, miniature and ultra-light design, robust keying, good shielding and sealing of IP68/69K even unmated with Fischer’s new facilitated cable assembly solutions.

The series is suitable for medical applications where reliability and ruggedness are paramount. Its four robust mechanical codings are complete with visual coding to prevent accidental misconnection and allow easy mating even in the dark.

The push-pull connector is available in a wide range of body styles, sizes and configurations including multipole contacts from two to high-density 42 poles.

The connector can withstand temperature fluctuations from -55 to +135°C and can be sterilised. Made of special high resistant aluminium, they are 50% lighter than typical brass connectors.

Amber Technology Limited

Soanar Limited

Contact info and more items like this at wf.net.au/L684

Contact info and more items like this at wf.net.au/L611

www.electronicsonline.net.au

DEC/JAN 2011/12 - What's New in Electronics

21

Removing the bugs from embedded software

© iStockphoto.com/Vlad Kochelaevskiy

industrial design

Magnus Unemyr and Mark Moran of Atollic

Releasing a product with bugs is potentially very expensive, especially considering the cost of field upgrades, recalls and repairs. Less quantifiable, but at least equally important, is the damage done to reputation and consequent loss of user goodwill.

Figure 1.

However, many embedded products are released without all the testing that is necessary and/or desirable. Consequently, software quality is receiving increasing focus in embedded application development.

Most existing software testing tools can only execute the tests on a PC, the use of which is limited when testing an embedded application because the actual system will have numerous differences, including hardware interfaces, timing issues and memory constraints among many others.

Therefore, it is important to run as many software tests as possible on the actual embedded hardware to minimise inter-platform differences.

The challenge is to find automated in-target software testing tools that can be easily integrated into developers’ embedded development environments. These tools should be able to analyse the application source code, auto-generate a test suite and automatically run it on the target board.

However, a test report showing 100% success may not be sufficient, as the test procedure itself may not have been applied to more than a small fraction of the code. Understanding the quality of test procedures thus becomes critical in judging whether a product is ready for release.

However, new and advanced tools for embedded test automation and test quality measurement are now emerging.

A key element of the software testing process is ‘unit testing’. Unit tests call up C programing functions with different combinations of input parameter values to drive the code through different execution paths.

Other than for trivial functions, writing unit tests by hand is labour intensive, costly and tedious, and leaves the possibility that many possible execution paths remain untested.

A detailed analysis of how input parameters drive the code is therefore required, so that as many as possible of the important execution paths throughout a function are actually exercised by a test suite.

Another challenge faced by development teams is maintaining the synchronisation of unit tests with code under development. This problem is often exacerbated when delivery schedules become compressed with project progression.

22 What's New in Electronics - DEC/JAN 2011/12

If source code and unit tests become out of sync, the tests will become less useful and especially when they are most needed.

The unit test tools available to PC developers are less useful to embedded developers as they rarely manage compilation, downloading and execution of the test suites on embedded boards.

Tools that create the unit tests automatically, build them into the embedded application and allow them to run on the target via a convenient pathway such as a JTAG debugger will result in optimal usage of time and maximum productivity.

An effective approach is to use a full embedded test automation system that is integrated into the C/C++ development IDE (integrated development environment), so that synchronisation is easy to maintain and ancillary tools such as JTAG debug probes can be used to full effect.

Such tools have not been common previously, but new tools now meet these demanding criteria and bring very powerful in-target test automation capabilities to software developers.

The new breed of professional embedded test automation tools can analyse the source code and generate and execute suitable test suites automatically on the target board. An example is Atollic TrueVerifier, which auto-generates a test suite (implemented in C source code) and makes many function calls with different combinations of input parameters, thus driving a large number of different execution paths.

The illustration below, Figure 1, shows how a trivial C function can be tested, by calling it many times with different input parameters. The selection of input parameter values is selected and generated automatically by the testing tool.

Once the test suite has been generated (as C source code), it must be compiled, linked and executed on the target system. Many low-cost unit test tools exist that only run unit tests on a Windows PC. www.electronicsonline.net.au

industrial design

Figure 2.

Figure 3.

The inability of these tools to integrate with the embedded tool development environment results in additional inefficiency of not being able to execute the tests on the target board.

However, TrueVerifier integrates seamlessly into a professional embedded IDE, enabling easy synchronisation of test with code development and also takes advantage of integration with tools such as JTAG debug probe. Once code has been developed and tested, the focus shifts to quantitatively understanding what actually happened during testing. Code coverage measurement, which is performed using dynamic execution flow analysis, is commonly used to study which parts of the code have been tested.

There are many different types of code coverage analysis from the very simple up to very stringent types, such as MC/DC, which is often used for measuring the test quality of safety-critical software, for example, in flightcontrol and aerospace applications generally.

However, many other projects can also benefit from this advanced test analysis.

Some code coverage analysis types are: • Statement or block coverage will measure how many of the C-statements or code blocks have been executed during a test session. But it does not measure how branches affect which C-statements or code blocks are executed; • Function coverage only measures which or how many of the C-functions have been called during a test session. But it does not measure which, or how many, of the function calls in a code section are actually executed, or the quality of the testing of the function itself; • Function call coverage measures which or how many of the function calls in a code section have actually been called during a test session;

• Branch coverage measures whether all code blocks and alternative branch paths have been executed in a code section (such as both the if- and the else- part in an if-else statement). Branch coverage typically requires a code section to be executed a sufficient number of times, so that all alternative branch directions will be tested. As all branch paths must be executed, all corresponding code blocks are executed as well; • MC/DC (modified condition/decision coverage) is a very advanced type of code coverage analysis. This is applied to applications of which the highest reliability is expected. It extends branch coverage with the additional requirement that all sub-expressions in complex decisions (such as in a complex if-statement) must drive the branch decision independently of the other sub-expressions.

Until recently, there have been few test-quality measurement tools available and they have been limited by one or more of the following problems: testing using weak types of code coverage analysis only; testing in PC environments and not on the embedded target; very expensive; difficult to use; and lacking integration with other embedded development tools.

One of the software features is the analysis conducted on the embedded target. Con- “If source code and unit tests necting to the target via a JTAG probe, the become out of sync, the tests will embedded application is run directly on the become less useful and especially target board with the code coverage information recorded for later inspection and when they are most needed.” quantitative analysis.

As an example of the tool’s capabilities, Figure 2 shows a trivial code section that contains three blocks: a red code block, which is always executed; a green block, sometimes executed depending on the branch decision made in the if-statement; and a blue block, again, always executed.

The branch decision in the if-statement drives the selection of one out of the two possible execution paths: either directly from the red to the blue code block, or passing from red to blue via the green code block.

Figure 3 shows how the easy-to-use in-target TrueAnalyzer tool, using only two mouse-clicks, detects all the different types of code coverage, including statement/block coverage, function coverage, function call coverage, branch coverage and MC/DC. Both tools are integrated in the TrueStudio C/C++ IDE and it is this new generation of test tools that will truly enable software developers to be confident of delivering high-quality software.

Glyn Ltd Contact info and more items like this at wf.net.au/L918

www.electronicsonline.net.au

DEC/JAN 2011/12 - What's New in Electronics

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newproducts Fanless media player iBase’s SI-08 high-end fanless media player for digital signage applications features AMD’s G-series dual-core with an integrated and robust 80 Core DirectX 11 GPU in the processor.

It can support Direct X11, Direct Compute 11, Open CL 1.1 and resolutions up to 2560 x 1600 along with the latest graphical APIs including open GL 4.0.

Also included is UVD3 hardware video decoder which can handle full HD playback of MPEG2, MPEG4, H.264, WMV9 and VC-1 video streams without drawing on CPU or GPU resources. The device is 200 x 150 x 34.8 mm and is encased in a black and white metal chassis with integrated mounting brackets. Near-universal display compatibility is ensured by the hybrid-DVI connector that interfaces with DVI, HDMI and VGA displays.

The systems are supplied with an AMD G-series dual-core accelerated processing unit, 2 GB of DDR3 memory, 160 GB hard drive storage, one RS232 serial port and 1x mPCIe slots for an optional Wi-Fi or Bluetooth board. Maximum power consumption is an efficient 25 W. Backplane Systems Technology Pty Ltd Contact info and more items like this at wf.net.au/L938

24 What's New in Electronics - DEC/JAN 2011/12

Dual serial port IESM board The IESM daughterboard for the FXT003/009 modem offers flexibility by including a high-accuracy GPS module (Sierra Wireless XM0110 SiRFstar 4 GPS chip) together with two additional serial ports.

Developed to allow users to add a second satellite communications link and connect other hardware to the Fastrack Xtend, the board extends the use of the modem beyond cellular coverage without the need to move to a whole new platform.

By using the Q9612 Iridium SBD modem or the Q1200 Orbcomm 2-way modem, satellite can then be used as a back-up communications link on the Fastrack Xtend 3G or GPRS modem satellite.

A configuration software option for the FXT modem which allows set-up of LCR rules for managing data will also be offered.

The board comes with a custom backplate for the FXT modem and a dual serial cable.

M2M Connectivity Contact info and more items like this at wf.net.au/L948

www.electronicsonline.net.au

newproducts Thermal imager NEC Avio has announced its S30 fixed-mount type infrared thermal imager with compact form factor and aluminium IP67 protected housing.

The S30W/H is controlled and operated over the ethernet. Still and moving IR images can be acquired and monitored remotely and it includes a software development kit to facilitate integration.

There are two choices of measuring temperature ranges: S30W (-20 to +350°C) or S30H (0 to 600°C).

In addition to thermal imaging, it is equipped with a visible light camera (with analog video output). Still images, acquired through ethernet, are embedded with visible images recorded in SIX format. For real-time video monitoring on a PC, a video capturing device is required. Features include: UFPA detector 160 x 120 pixels; two temperature ranges (must be specified) -20 to +350°C (S30W) or 0 to 600°C (S30H); contact output for sending alarm to external device; IP67 environmental protection with DLC on objective lens; frame rate of 8.5 Hz; NETD of 0.2°C (S30W), 0.5°C (S30H).

CIRCUIT BOARDS?

For all your prototype requirements ...

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Applied Infrared Sensing Contact info and more items like this at wf.net.au/L381

Power MOSFET Vishay has introduced an 8 V p-channel TrenchFET power MOSFET featuring what is claimed to be the lowest onresistance for a p-channel device in the 1.6 by 1.6 mm footprint area with a profile under 0.8 mm. In addition, the SiB437EDK is said to be the only device offering an on-resistance rating down to 1.2 V. The MOSFET will be used for load switching in handheld devices such as smart phones, MP3 players, portable media players, digital cameras, eBooks and tablet PCs. The compact footprint and ultra-thin 0.65 mm maximum profile of the device’s thermally enhanced Thin PowerPAK SC-75 package enable smaller, slimmer end products, while its low on-resistance translates into lower conduction losses, saving power and maximising battery run times. The on-resistance ratings of 1.5 and 1.2 V allow the device to work with the lower-voltage gate drives and lower bus voltages common in handheld devices, without level-shifting circuitry. The MOSFET is particularly useful when the battery charge in a handheld device is low and needs to consume as little power as possible.

It offers an ultra-low on-resistance of 34 mΩ at 4.5 V, 63 mΩ at 1.8 V, 84 mΩ at 1.5 V, and 180 mΩ at 1.2 V. It is halogen-free in accordance with the IEC 61249-2-21 definition and compliant with RoHS Directive 2002/95/EC. The MOSFET offers typical ESD protection of 2000 V. Braemac Pty Ltd Contact info and more items like this at wf.net.au/L373

Single board computer The KINO-QM670, a Mini-ITX single board computer, features the socket G2 for Intel Core i7/i5/i3 processors.

The SBC features the VGA integrated into the QM67 chipset, plus 18-/24-bit, dual-channel LVDS support with a dual HDMI output supporting up to 1080p. The board features 3D micro-architecture enhancements supporting DX 10.1 and OGL 3.0.

The SBC features rich media acceleration for hardware decoding and encoding. It supports an Intel gigabit ethernet with AMT 7.0 and has enhanced options for connectivity including high-speed I/O interfaces for PCIe Gen2 add-on cards, USB 3.0 ports and SATA 6 Gbps ports supporting RAID 0/1/5/10.

ICP Electronics Australia Pty Ltd Contact info and more items like this at wf.net.au/P040

www.electronicsonline.net.au

Model 3000

… to fullyfeatured

QCJ5

Quick Circuit allows you to make your own prototype circuit boards and perfectly machined panels.

Shouldn’t there be one on your bench?

Tel +61 2 9807 7081 satcam@satcam.com.au

www.satcam.com.au DEC/JAN 2011/12 - What's New in Electronics

25

NEW White Papers

now available online!

Automated Test Outlook 2011: Key technologies and methodologies impacting the test and measurement industry This report details key trends, methodologies and technologies impacting test engineering organisations in every industry. The Automated Test Outlook combines input from academic and industry research, business intelligence and customer advisory boards. Read this white paper for more information.

How to minimise losses in converter-fed induction motors This study presents a technique developed to minimise losses in totally enclosed fan-cooled (TEFC) induction motors fed by frequency converters in applications with constant torque loads, especially at low speeds, in which the ventilation system is inefficient.

Why should a disconnection device be dedicated to a surge arrester?

A surge arrester is subject to electrical surges caused by lightning strikes and overvoltage throughout its service life. The surge arrester evacuates the current by creating an irreversible internal short-circuit. This white paper explains why a disconnection device should be dedicated to a surge arrestor.

Legacy remote control tools: not built for today’s helpdesk This paper explores the challenges and hidden costs of supporting a remote workforce with legacy tools. In addition, it identifies best practices that decision-makers can use to choose enterprise helpdesk support tools that better meet the needs of remote employees, while helping to reduce costs.

For these and more White Paper downloads, visit www.sustainabilitymatters.net.au/white_papers

newproducts Network storage The Iomega StorCenter PX series of network storage products has been created specifically for use in small to medium-sized businesses.

Powered by EMC storage, the series features four-bay and six-bay desktop models and a four-bay rackmount model, each available in scalable configurations.

There is an optional use of SSD drives, as well as data protection features such as multiple RAID levels with hot swap drives, UPS support, user quotas, device-to-device replication and certification for most virtualisation environments.

The series ranges from diskless with no included storage to 18 TB capacity. The series also includes personal cloud technology, empowering users to protect and share data from virtually anywhere.

Features include: optional solid state drives, dual Core Intel processor, 2 GB memory and dual GbE NICs; multiple RAID levels - 0, 1, 10, 5, 5+1 (hot spare) and 6, all with automatic RAID rebuild and hot-swap functionality; scalable configurations include fully populated, partially populated and diskless options and 7200 rpm SATA HDDs and SSD drives are available; active directory support and remote access for anytime, anywhere data availability; certified for VMware vSphere 4.0, Citrix XenServer and Windows Server 2003/2008/2008 R2; cross-platform file sharing with Windows, Mac and Linux computers and simultaneous iSCSI block access for the most efficient storage use; all major network file protocols supported; cloud technology that connects the network storage device to other individuals and/ or devices via the internet; Windows active directory trusted domains, MSCS and hyper-V live migration support; data replication and device-to-device copy jobs keeps data backed up and secure; with the embedded AXIS video hosting system, the series supports up to 12 AXIS IP security cameras.

The series features two desktop models, each available in flexible configurations.

The px4-300d consists of four HDD bays and up to 12 TB of storage, and the px6-300d has six HDD bays and up to 18 TB of storage. Empty bays in both models are fitted with a drive carrier that can accommodate 2.5 and 3.5″ HDD drives, as well as SSD drives.

Ingram Micro Contact info and more items like this at wf.net.au/K717

Resonator oscillator Crystek’s CVCO55CXT-6250-6250 coaxial resonator oscillator is a coaxial-based VCO with an internal frequency doubler. The f a m i l y ’ s f r e q u e n c y- d o u b l i n g 2X fundamental technology achieves lower current consumption.

The device operates at 6250 MHz with a tuning voltage range of 0.5 to 4.5 VDC. This coaxial VCO features a typical phase noise of -100 dBc/Hz at 10 KHz offset and has good linearity and an output power of 2.0 dBm typ into a 50 Ω load with a supply of +8.0 VDC and a current consumption of 35 mA (max).

Wireless Components Contact info and more items like this at wf.net.au/L231

26 What's New in Electronics - DEC/JAN 2011/12

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newproducts Fanless panel PC Avalue’s APC-18W5 TFT fanless plastic multitouch fully flat panel PC with an Atom Dual Core Solution is suitable for a wide selection of industrial automation.

It features a D525 1.8 GHz CPU. The processor has a low power consumption and good performance. The system supports pulse width modulation automatic control function, so it can automatically adjust the LED backlight brightness to reduce power consumption.

The PC is lightweight at 59 mm thick. The design features an IP55 front side help to make it easy to clean and it supports VESA mounting from the back to make it compatible with most mounting accessories.

The PC has increased connectivity with the 1 x Intel 82574L gigabit ethernet, optional dial 82574L plus 1x Mini PCIe slot. The panel has a wide voltage range of +12 to +28 input and ErP power. The backlight is controlled by PWM, with timer-power-on.

The projected capacitive touch supports multitouch and has onboard 1 GB up to 2 GB and, 1x SODIMM up to 4 GB DDR3.

The system has programmable front buttons which allow the solution to be configured to meet specific application demands. Accessible from the back is a 1 COM Port, 2 USB ports, 1 gigabit ethernet port, PS2 keyboard/mouse, lineout and a VGA port to drive a second display.

The system internally supports additional USB and Wi-Fi and further expansion can be implemented through 2x Mini-PCIe slots.

Backplane Systems Technology Pty Ltd Contact info and more items like this at wf.net.au/P024

Solid-state drive Crucial m4 solid-state drives in capacities ranging from 64 to 512 GB are now available.

Designed for both business and general use, the range incorporates Micron’s 25 nm NAND flash technology in a 2.5inch form factor.

The device also supports the SATA 6 Gbps interface.

The drives reach read speeds of up to 415 MBps, a 17% increase over earlier models.

Write speeds on the 512 GB capacity can be up to 260 MBps, a 20% boost.

Lexar Media Pty Ltd Contact info and more items like this at wf.net.au/K364

www.electronicsonline.net.au

Portable laptop monitors NextComputing has released a portable monitor for laptop users who require multiple high-resolution displays.

The ViewPort 17″ LED backlit monitor provides a second or third monitor that can connect to any laptop.

The display has: full resolution (1920 x 1200) WUXGA+ display; high colour-depth, 8-bit (16.7 million colours) LED backlit display offering true-tolife visuals; rugged aluminium alloy housing; leather carrying handle; and adjustable height and tilt angle.

The ViewPort portable laptop monitor is available either as a single monitor, with handle included, or as a pair, for users who need three displays, including their laptop.

When used alone, the monitor is supplied with a protective aluminium alloy LCD cover.

When used as a pair, the second monitor attaches to the first monitor facing inward. This not only protects the two LCDs from damage, but allows both monitors to be carried with a single handle, much like a briefcase.

Metromatics Pty Ltd Contact info and more items like this at wf.net.au/P023

DEC/JAN 2011/12 - What's New in Electronics

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www.electronicsonline.net.au

© iStockphoto.com/Howard Oates

alternative power

European PV market faces sharp decline Rapidly falling prices in the first half of this year have been unable to stimulate the faltering European photovoltaic market, according to the latest Solarbuzz European PV Markets report.

Signs of a strengthening market in June 2011 were hit by the cancellation of the anticipated mid-year incentive tariff reductions in Germany.

“For the past decade, Europe has played a dominant role in creating the demand growth that has fuelled global manufacturing capacity expansion,” noted Alan Turner, vice president of European market research for Solarbuzz.

“This was underpinned by aggressive, uncapped feed-in tariff programs that are now being scaled back to reduce costs. Policy adjustments are becoming more frequent, creating uncertainty for investors in PV systems.”

The downturn in European major markets left module shipments from manufacturers running well ahead of end-market demand.

The resulting increase in downstream inventories quickly spread to the upstream, causing production plans to be reined in.

Market growth of 169% across Europe in 2010 was led by three countries, Germany, Italy and the Czech Republic. Each country delivered gigawatt-scale markets and, combined, represented 89% of European demand.

Italy’s market share is forecast to rise from 32% in 2010 to 39% in 2015 to become the largest market in Europe, while the combined

share of the two largest markets, Italy and Germany, is forecast to fall from 80% in 2010 to 71% in 2015.

Growth of the Italian market in 2010 came despite installed system prices of up to 33% higher than in Germany (depending on system size).

Even with high prices, solar PV project investment returns of up to 20% could still be made, a clear indicator both of the generous level of incentive tariff rates and the headroom for future tariff reductions.

France, Spain, Belgium and Greece constituted a strong second-tier of markets in the 100-1000 MW size range in 2010. Here, forecast project internal rate of returns will generally meet or exceed user expectations in most major market “Smaller markets offering growth segments in 2011.

However, by 2012, only in Greece will potential include Slovakia, this be the case for large ground-mounted Bulgaria, Ukraine and Britain.” installations. Smaller markets offering growth potential include Slovakia, Bulgaria, Ukraine and Britain.Based on an assessment of countries over the next 18 months, incentive tariffs for residential systems are set to fall by at least an average 17%, with commercial roof-mounted systems of 100 kW falling by 23% and ground-mounted 1 MW installations falling by 34%.

Residential tariffs in Greece and Britain show the least reduction among the major markets in Europe through 2012, according to current policy plans, while tariffs for large ground-mounted systems fall to the lowest levels in Belgium, Spain and France.

Over the next five years, customer segmentation changes across Europe will see the residential segment double its share. In addition, investor groups’ share will fall by almost half, while commercial (including agricultural) users remain the dominant market segment.

www.electronicsonline.net.au

DEC/JAN 2011/12 - What's New in Electronics

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newproducts

By June 2011, average distributor prices for crystalline silicon modules from Chinese producers had fallen to an average $1.76/W. This is 20% down from average distributor prices at the end of 2010, following relatively stable pricing through 2010 with a slight upturn during the second half of the year.

By contrast, their European and Japanese counterparts saw prices start to decline in July 2010 and have continued ever since, reducing their price premiums of 20-25% for most of Q1’10 to 10-15% for most of Q1’11.

Module sales in 2010 were split: 38% from manufacturers/brokers to installers; 37% via the wholesaler channel; and 25% direct.

Tightening of PV incentive policies across “European and Japanese Europe is creating an extremely challenging time counterparts saw prices start to for downstream companies. Many are now facing over-valued inventories, weaker sales and potential decline in July 2010 and have cash flow problems.

Sales channel positioning, geographical dicontinued ever since” versification and acquisition activity feature strongly in the current reassessment of business models, but so too does differentiation by the larger wholesalers through a relentless pursuit of higher module quality.

Longer term, major regulatory challenges lie ahead before grid parity can stimulate self-sustaining markets, despite fast reducing solar electricity costs.

Over the short term, German utilities are concerned that PV generation capacity is creating unacceptable risks for its overall grid stability. As a result, utilities are placing intense focus on electricity storage and smart-metering technology, which will add costs, complexity and cause delays to PV deployment. Turner added, “The uncertainty over the path of European incentives,

Figure 1: Forecast changes to customer segmentation in Europe 2010 vs 2015 green world scenario.

industry pricing and regulatory constraints will ensure that this region is now entering a very challenging period. Business models that worked based on a limited number of high growth European markets, together with high prices, will be sorely tested as this region changes to a more fragmented market structure with considerably tighter downstream margins.”

Solarbuzz http://solarbuzz.com/

Press-fit interconnects The latest additions to the Searay family of interconnects are a right angle design for perpendicular and high-speed micro backplane applications and a press-fit design that combines the flexibility and convenience of press-fit tails with superior signal integrity and mechanical performance.

Both designs use a 1.27 x 1.27 mm grid array to achieve maximum grounding and routing flexibility and feature the signal integrity-optimised Edge Rate contact system.

The terminals and sockets (SEAM-RA/SEAF-RA series) are optimised to reduce skew and impedance mismatch and have low insertion and extraction forces. Terminals and sockets are available in 4-, 6-, 8- or 10-row configurations, with up to 500 I/Os. Right angle arrays mate with Searay surface mount (SEAM/SEAF series) and right angle (SEAMRA/SEAF-RA) sockets and terminals and with Searay high density flex data links (SADL series) and high speed twinax cables (SEAC series).

Press-fit terminals (SEAMP series) are available in 4-, 6-, 8- or 10-row configurations, offering up to 500 I/Os. The terminals mate with a choice of Searay interfaces: surface mount sockets (SEAF series) in three standard stack heights, high density flex data links (SADL series) for cable-to-board applications or the new right angle sockets (SEAF-RA series) for multilayer PCB designs such as high-speed micro backplane applications.

Additional pin counts, plating options and guide posts, as well as the required application tooling, are also available.

The company has also introduced a 0.8 mm micro pitch version of its SEAM8/SEAF8 series, offering high-speed performance and the grounding and routing flexibility of the 1.27 mm pitch arrays, while requiring 50% of the board space.

Measurement arm Faro Technologies has introduced the Edge, a FaroArm. It is a portable measurement arm that allows manufacturers to verify their product quality by performing inspections, tool certifications, CAD-to-part analysis and reverse engineering.

The latest generation improves production, quality and reverse engineering processes by rapidly verifying or scanning parts with confidence and accuracy.

The arm also simplifies the user experience with improved performance, portability and reliability.

The device features what is claimed to be the first-ever integrated personal measurement assistant. With its built-in touch screen and onboard operating system, it provides stand-alone basic measurement capability.

A laptop is no longer needed to perform quick and simple dimensional checks or to optimise system performance with its onboard diagnostic routines.

Samtec ANZ

Laser & Survey Solutions

Contact info and more items like this at wf.net.au/P015

www.laserandsurveysolutions.com.au

30 What's New in Electronics - DEC/JAN 2011/12

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newproducts Data logger

ATX motherboard

The WISE-5800 intelligent web-based data logger PAC controller from ICP DAS is designed for remote monitoring.

It has various functions such as automatic logic control and remote monitoring, and no programming is required. The rule engine will check whether the rules are valid or not and determine the execution of actions under specific conditions, for example, setting up I/O channel values, performing scheduled or timer tasks, or sending an email message/ CGI command under specific conditions.

Through the Modbus TCP protocol, it allows integration with SCADA packages to give real-time control and I/O channels monitoring or system status on WISE controllers.

It provides more support in I/O functions and allows the user to connect with a wide range of XW-boards and I-7000 remote I/O modules that enables users to choose the most suitable I/O modules in applications.

With the microSD card it provides data logger function to real-time record the I/O data of the controller and send the data files by FTP or email to a control centre. Then the data file can be sent either at a scheduled time or under specific conditions.

Support is offered for SNTP protocol to connect with SNTP time server for time synchronisation through a network to ensure accurate system time settings.

An industrial-grade ATX motherboard is suitable for cost-sensitive industrial applications requiring high-performance and expansion capability for factory automation, medical image processing, digital surveillance and telecommunications applications.

The AIMB-769 is designed with Intel G41 and the ICH7 to support Intel LGA 775 Intel Core 2 Duo, Core 2 Quad, Pentium Dual-Core and Celeron 400 series processors with FSB up to 1333 MHz and DDR3 800/1066 MHz SDRAM up to 4 GB. The board supports four SATAII ports with transmission speed up to 300 MBps and two onboard serial ports (COM ports) with DC power. It has one PCIe x16, one PCIe x1 and five PCI expansions. It features the Intel Graphics Media Accelerator 4500 with shared memory up to 352 MB. It can provide 2D/3D graphic processing power without an add-on graphic card.

ICP Electronics Australia Pty Ltd

Contact info and more items like this at wf.net.au/L654

Contact info and more items like this at wf.net.au/L856

www.electronicsonline.net.au

Advantech Australia Pty Ltd

DEC/JAN 2011/12 - What's New in Electronics

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newproducts Server for the cloud

Digital multimeter The UNI-T model UT58E 19999 count digital multimeter measures AC and DC voltage, DC and AC current, resistance, capacitance, frequency and temperature. In addition, a diode and transistor test, continuity function and continuity buzzer are provided.

The instrument is powered by a 9 V battery, has a display size of 60 x 54 mm and is provided with test leads, battery, temperature probe, multi-purpose socket and carrying holster.

The UT58 has low battery indication, data hold, and backlit display. The DC voltage range is 200, 2000 mV, 20, 200, and 1000 V. AC voltage is measured in four ranges; 2, 20, 200 and 1000 V. DC current is measured in three ranges; 20 mA, 200 mA and 20 A. AC current is measured in three ranges; 20 mA, 200 mA and 20 A. Resistance is measured in five ranges; 200 Ω, 2000 Ω, 20 kΩ 2 M?, and 200 MΩ. Temperature is measured from -40 to +1000°C and frequency is measured to 20 kHz and capacitance on four ranges, 2 nF, 20 nF, 2 µF and 20 µF. Power Parameters Pty Ltd Contact info and more items like this at wf.net.au/L738

Highly accurate resistors Vishay has released a video that demonstrates the stability of the FSR secondary standard resistor for laboratory calibration standards and digital multimeters.

Using an 8.5-digit ohmmeter, the demo shows the ability of an FSR device, built on bulk metal foil, to withstand rough handling with no change whatsoever in its resistance value.

Even after being dropped on the floor, buried in potting soil, and doused with water, the device shows the same ohmic value out to the fifth decimal place in before-and-after tests.

Constructed as a direct plug-in device that fits most DMMs, the resistors extend the frequency range by up to 10 times with reliable accuracy at the box terminals.

The FSR is produced with infinite resolution for any required resistance value, not just typical ‘standard’ values. The device is available with up to six significant digits (eg, 9.99962) and a wide resistance range from 1 Ω to 150 kΩ, with any resistance value within this range available at any tolerance.

For increased reliability, the FSR features an RF-shielded case, while its hermetically sealed resistive element eliminates the effects of humidity.

For test equipment designers, the FSR maintains a long-term stability of ±0.0005% (5 ppm) at +25°C for one year, temperature coefficient of resistance (TCR) to ±0.3 ppm/°C from +15°C to +45°C (max TCR: 10 ppm total deviation over temperature range, 30 ppm for low values) and resistance tolerance to ±0.005% (50 ppm).

The FSR is supplied within 0.005% of any desired resistance value and each unit is marked with the exact measured resistance value within 10 ppm accuracy relative to certified primary resistance standards.

Braemac Pty Ltd Contact info and more items like this at wf.net.au/L770

The XenServer 6 is a key component of the Citrix cloud computing and virtualisation strategy and brings new optimisations, improved scalability and better performance for cloud infrastructure, desktop virtualisation and networking.

New features include: optimisations for cloud and service delivery networking that includes full integration of Open vSwitch, a core technology used to build next-generation cloud networks based on the OpenFlow standard; optimisations for desktop virtualisation that includes HDX enhancements for improved TCO and optimised user experience for virtual desktops using highly graphical applications. Physical GPUs can be centrally pooled and assigned to a virtual desktop, enabling direct access and optimal graphics performance; ‘Ten to Xen’ - in further simplifying the management requirements for XenServer, users can still install the product and be up and running in minutes; full support for Microsoft System Center 2012; Open Source Xen Hypervisor Engine that includes advancements for latency-sensitive workloads and improved support for very large systems.

Citrix Systems Asia Pacific Pty Ltd Contact info and more items like this at wf.net.au/P021

Available from Hi-Q Electronics Limited

SUNON FANS

sales@hiq.co.nz NZ 0800 800 293

www.hiq.co.nz

Large stock range • AC and DC axial fans • DC brushless blowers •

32 What's New in Electronics - DEC/JAN 2011/12

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newproducts Supercap charger

Full-size CPU card

© OPTIMO 2008

Contact info and more items like this at wf.net.au/L250

93 MONTAGUE ST. STH MELBOURNE VIC 3205 AUSTRALIA PH. (03) 9686 7766 | W. WWW.OD.COM.AU | E. PRODUCTION@ OD.COM.AU

element14

DATE. 14.09.2010 JOB SIZE. 297mm(h) x 70mm(w) JOB NO. REV. CLIENT. JOB NAME. 024965r03_EBMP_Electronics_Ads

Linear Technology has introduced the LTC3226, an inductorless supercapacitor charger with backup PowerPath controller for Li-ion or other low-voltage system rails in applications that require shortterm backup power.

The device employs a low-noise dual mode (1x/2x) charge-pump architecture with constant input current to charge two supercapacitors in series from a 2.5 to 5.5 V input to a programmable capacitor charge voltage between 2.5 and 5.3.

Charge current is resistor-programmable up to 150 mA. The device’s automatic cell balancing and voltage clamping features maintain equal voltages on both cells without requiring balancing resistors.

This protects each supercapacitor from overvoltage damage that could otherwise be caused by mismatches in cell capacitance or leakage, while minimising current drain on the capacitors.

The device has two modes of operation: normal and backup. Operating mode is determined by a programmable power fail comparator. In normal mode, power flows from VIN to VOUT through a low loss external FET diode and the charge pump stays on to top of the supercapacitor stack.

In backup mode, the charge pump is turned off and the internal LDO is turned on to supply the VOUT load current from the stored supercapacitor charge while the external diode prevents reverse current flow into VIN. Up to 2 A of backup current may be provided from the supercapacitor through the internal LDO. The charger operates with a low 55 µA quiescent current when the output voltage is in regulation. The basic charging circuit requires few external components and takes up little space; the IC is offered in a 3 x 3 mm QFN package. The device’s high 900 kHz operating frequency reduces the size of external components. Internal current limit and thermal shutdown circuitry allow the device to survive a continuous shortcircuit from the PROG, VOUT or CPO pins to ground.

Other features include CAP PGOOD and VIN PFO\ (power fail) outputs as well as a VOUT RST\ output for system housekeeping.

The iBase IB960 1.3 full-size CPU card is based on the Intel Q67 Express Chipset and delivers improved performance-per-watt for industrial applications.

The card supports secondgeneration Core i7/i5/i3 Pentium QC/DC processors and up to 3.4 GHz processors. It is supplied with 2x DDR3 DIMM sockets and features a maximum system memory of 8 GB and shared VGA memory of 1024 MB. The processor integrated Gfx Gen 5.7 graphic device provides enhanced graphics and supports dual-independent displays of CRT, DVI-D and LVDS. Connectivity and expansion capabilities are provided by 9x USB plus 2x COM and 4x SATA II and 2x SATA III ports. The cord also features a watchdog timer, digital I/O, 1x mini PCI-E slot and PCI-E to PATA for platforms that require PATA slots on the system.

Backplane Systems Technology Pty Ltd

ACmaxx ACmaxx Principles Save 75% of power supplied • Increase air performance by 40% • Use global supply voltages 85-265 Volts •

The engineer’s choice. www.ebmpapst.com.au

Ph: 1800 764 440 or (03) 9360 6400

Contact info and more items like this at wf.net.au/L966

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DEC/JAN 2011/12 - What's New in Electronics

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nano working

Tiny soldering iron can control chemical patterns Researchers with the US Department of Energy’s Lawrence Berkeley National Laboratory (Berkeley Lab) have shed light on the role of temperature in controlling a fabrication technique for drawing chemical patterns as small as 20 nm.

The technique could provide an inexpensive, fast route to growing and patterning a wide variety of materials on surfaces to build electrical circuits and chemical sensors or study how pharmaceuticals bind to proteins and viruses.

One way of directly writing nanoscale structures onto a substrate is to use an atomic force microscope tip as a pen to deposit ink molecules through molecular diffusion onto the surface.

Unlike conventional nanofabrication techniques that are expensive, require specialised environments and usually work with only a few materials, this technique, called dip-pen nanolithography, can be used in almost any environment to write many different chemical compounds.

A cousin of this technique - called thermal dip-pen nanolithography - extends this technique to solid materials by turning an AFM tip into a tiny soldering iron.

Dip-pen nanolithography can be used to pattern features as small as 20 nm, more than 40,000 times smaller than the width of a human hair.

What’s more, the writing tip also performs as a surface profiler, allowing a freshly writ surface to be imaged with nanoscale precision immediately after patterning.

“Tip-based manufacturing holds real promise for precise fabrication of nanoscale devices,” says Jim DeYoreo, interim director of Berkeley Lab’s Molecular Foundry, a DOE nanoscience research centre. “However, a robust technology requires a scientific foundation built on an understanding of material transfer during this process. Our study is [believed to be] the first to provide this fundamental understanding of thermal dip-pen nanolithography.”

In this study, DeYoreo and coworkers systematically investigated the effect of temperature on feature size. Using their results, the team developed a new model to deconstruct how ink molecules travel from the writing tip to the substrate, assemble into an ordered layer and grow into a nanoscale feature.

“By carefully considering the role of temperature in thermal dip-pen nanolithography, we may be able to design and fabricate nanoscale patterns of materials ranging from small molecules to polymers with better control over feature sizes and shapes on a variety of substrates,” says Sungwook Chung, a staff scientist in Berkeley Lab’s Physical Biosciences Division, and Foundry user working with DeYoreo.

DeYoreo and Chung collaborated with a research team from the University of Illinois at Urbana-Champaign that specialises in fabricating specialised tips for AFMs. Here, these collaborators developed a silicon-based AFM tip with a gradient of charge-carrying atoms sprinkled into the silicon such 34 What's New in Electronics - DEC/JAN 2011/12

that a higher number reside at the base while fewer sit at the tip.

This makes the tip heat up when electricity flows through it, much like the burner on an electric stove.

This ‘nanoheater’ can then be used to heat up inks applied to the tip, causing them to flow to the surface for fabricating microscale and nanoscale features.

The group demonstrated this by drawing dots and lines of the organic molecule mercaptohexadecanoic acid on gold surfaces. The hotter the tip, the larger the feature size the team could draw.

“We are excited about this collaboration with Berkeley Lab, which combines their remarkable nanoscience capabilities with our technology to control temperature and heat flow on the nanometre scale,” says co-author William King, a University of Illinois professor of mechanical sciences and engineering.

“Our ability to control the temperature within a nanometre-scale spot enabled this study of molecular-scale transport. By tuning the hotspot temperature, we can probe how molecules flow to a surface.”

“This thermal control over tip-to-surface transfer developed by Prof King’s group adds versatility by enabling on-the-fly variations in feature size and patterning of both liquid and solid materials,” DeYoreo adds.

Chung is the lead author and DeYoreo the corresponding author of a paper reporting this research. The paper is titled ‘Temperaturedependence of ink transport during thermal dip-pen nanolithography’.

Lawrence Berkeley National Laboratory www.lbl.gov

www.electronicsonline.net.au

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