Uninterrupted growth CEG Elettronica

MUNK

Established in 1970, MUNK GmbH is an internationally recognised partner in the electrochemical industry, manufacturing DC and AC power supplies for electrochemical processes. With a focus on sustainable, long-lasting solutions we help our customers, such as Atotech, to make investments in the future.

Our innovative products are based on an extensive knowledge of designing rectifiers for industrial applications in the range of 2 to 1000 volts and 10 to 100,000 amps. Our specialist services include: electroplating; aluminium, magnesium and titanium anodising; e-coating; water treatment; electrolysis for copper, zinc and chlorine; and melting.

Our mission statement – ‘Action, not reaction’ – perfectly sums up our dedication to continuous innovation. We are constantly pushing the boundaries of what our products can offer.

layer. The PallaBond process allows the direct deposition of palladium on copper, without using any nickel.

PallaBond is suitable for key press, high frequency, flexible PCB gold, aluminum and copper wire bonding applications. The process proves superior solder joint strength for lead free and eutectic soldering and is compatible with many new base materials and soldermask types owing to its short deposit time and low temperature needs. Lastly, the PallaBond process operates at a thickness of less than 300 namometres, ideal for very fine lines and spaces.

PallaBond also features several environmental benefits, such as less water and energy consumption owing to reduced process steps and line lengths. Most importantly, the new PallaBond process is free of toxic or hazardous materials such as Thiourea, Lead and Nickel.

In summary, PallaBond is an environmentally friendly process, which has demonstrated outstanding technical advantages, operates at higher yield and is enabling manufacturers to lower their operating costs drastically compared to standard ENEPIG (Electroless Nickel, Electroless Palladium and Immersion Gold).

Imminent market introduction

Alpha and beta site tests are running in Korea, Taiwan, Japan and Europe and are expected to be completed by the end of the first quarter of 2014. Sample plating is currently available at Atotech in Berlin, Germany.

PallaBond will be introduced to the markets by the beginning of 2014; in Europe this will be via APL Oberflächentechnik GmbH – an owner managed surface technology and Service Company specialised in immersion Tin. With the introduction of PallaBond, APL will be able to provide a multi-functional surface for the PCB as well as for the microelectronic industries.

Innovation to future-proof the company

With 1965 patents worldwide,12 R&D centres, investments of €75.6 million as well as more than 68 different cooperations with universities and research partners, Atotech has an impressive track record and potential for innovation.

The company’s excellence in research and development results in the large number of patent applications and granted patents. To secure the technological edge, the company is consistently increasing investment expenditures dedicated to patenting the direct sales products. This not only ensures the stability of any future technology, but also protects processes and equipment.

Each year, Atotech invests approximately 10 per cent of annual sales in research and development to ensure the constant development of high quality and environmentally responsible plating solutions that fulfil the requirements of all customers – today and in the future. n

UNINTERRUPTED GROWTH

Italy’s CEG Elettronica produces Uninterruptable Power Supplies or UPS, battery chargers and rectifiers. The main industrial sectors it supplies include oil & gas, electrical energy power stations, chemical and petrochemical industries, rails, marine industry and steelworks.