Partner Universities This EPSRC Centre for Innovative Manufacturing brings together four centres of excellence: • Cambridge Innovation and Knowledge Centre at the University of Cambridge • Centre for Plastic Electronics at Imperial College London • Welsh Centre for Printing and Coating at Swansea University • Organic Materials Innovation Centre at the University of Manchester
Sponsor
www.largeareaelectronics.org
Getting Involved • our research programme is strongly influenced by industry input and we welcome discussions with any company interested in working with us • we are looking for industry partners to participate in collaborative projects leveraging our expertise • we invite proposals for short feasibility projects in our annual Pathfinder Call • the EPSRC Centre acts as a national hub for the LAE community and organises networking events for industry and academia
Contact Luigi G. Occhipinti, PhD National Outreach Manager luigi.occhipinti@eng.cam.ac.uk +44 (0)1223 332838
www.largeareaelectronics.org
About Large-Area Electronics
About the EPSRC Centre
Technical Programme
Large-Area Electronics (including printable, flexible or
The EPSRC Centre for Innovative Manufacturing in
Theme 1: Advanced Manufacturing Processes
organic electronics) is a new way of making electronics
Large-Area Electronics addresses key manufacturing
Concepts for high-resolution high-yielding, high-volume
using novel electronic materials, often formulated as
research challenges aimed at meeting end-user needs
methods to increase functional device performance and
inks, deposited by low-temperature processes such as
for multifunctional large-area electronic systems.
reduce cost.
printing and coating. This approach offers advantages of lower-cost manufacturing plants producing systems in high volume with new form factors and features. Largearea electronics (LAE) elements may be combined with
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Photo credit: Inhabitat
light-weight.
Displays, lighting and smart windows (emissive or reflective)
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Photo credit: BodyTel
Electronic circuits (analogue and digital)
Thin and flexible photovoltaics, energy harvesting and storage devices
advanced manufacturing processes aimed at
Theme 2: System Integration
ongoing reduction in manufacturing cost and
Addressing the need for multifunctional systems in
improvement in system performance
applications where printing-based manufacturing makes
support the scale-up of technologies and processes
Advanced Manufacturing Processes
economic sense. •
developing innovative approaches to multifunctional system manufacture of large-area electronics using
promote the adoption of LAE technologies by the
processes that minimise cost •
developing novel approaches to high-throughput functional testing
System Integration
Adhesion lithography
Printed re-chargeable batteries
Printed capacitors
Energy harvesting sub-system
Contactprinted
Topology defined patterning
Printed antennas
High-speed printed diodes
Multi-sensor sub-system
Customisable
Advanced rheology
Printed FET gas sensors
Solution processed analogue electronics
Neuromorphic computing circuits
LAE + Silicon
Laser annealing
Transparent electrodes
Device Processes and Components
Photo credit: EC project FP7 247710 Interflex
Multi-functional integrated smart systems on foil
developing novel multi-functional materials manufacturability
develop a long-term research programme in
wider UK electronics manufacturing industry
Sensors (optical, physical, chemical, biological)
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systems and patterning processes for improved
by UK manufacturing industry; and •
developing high resolution patterning processes for higher device and system performance
address the technical challenges of manufacturing multifunctional LAE systems
bare silicon dice to form complete electronic systems that retain form factor benefits of thinness, flexibility and
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The objectives of the EPSRC Centre are to:
Manufacturing Processes & Supporting Science
High-speed testing
Testing Methods
Sub-Systems
System Integration Demonstrators