Bridging the gap between sensor and application

In today’s challenging environment, it is essential that integrated circuit (IC) packaging companies can adapt and evolve their technologies for development processes and manufacturing performance to reach optimal customer satisfaction – in terms of costs, labor productivity, equipment, capacity, quality and yields.

In all relevant markets – be they industrial, automotive, medical or space – the application of IC packaging is the key to success for the final product. Expertise and creative functional package design that can combine and merge technologies in order to deliver multiple system benefits are required to meet advanced customer requirements for smaller pitch, special package shapes or sizes, higher IOs numbers, certain materials, etc.

Sencio B.V. is a world-class competence center offering development and manufacturing of functional semiconductor assembly solutions for MEMs and sensor systems. From design, package development and prototyping, industrialization up to volume manufacturing, Sencio works together with its customers to create a product that fits the desired mission profile. Sencio’s plastic transfer molding package solutions are a cost-effective way to bridge the gap between sensor and application. Sencio holds a wealth of experience and expertise in the assembly of optical, pressure, gas, magnetic and power sensors. From standard packages such as QFN, LGA/BGA and XSON to functional packages, Sencio can provide packaging for RF, radar, 5G components, offering the option for integrating various chip technologies such as Si, GaAs, GaN, SiGe and passive components such as capacitors, striplines, PIN diodes and shielding to realize comprehensive System in Package (SiP) results.

Sencio’s nCapsulate functional packa- ging solution achieves high versatility and compatibility with Sencio’s other technologies from exposed die molding to multi-die packaging SiP, among many others. Freeform encapsulate packaging provides the opportunity to shape products to the exact application requirements. Embedding mechanical systems in electronics using nCapsulate offers highly practical solutions for system challenges such as improved alignment, mounting and sealing features, increased measurement accuracy and improved thermal contact. We are bridging the gap between application and electronics system.