Smt today issue 1

exploring Aoi & x-ray Don Miller Nordson YESTECH

the art of screen printing Michael L Martel Speedline Technologies

red carpet Who’s doing what, where?

inside. productronica 2013 preview

meet the CEo’s Page 8 Thorleif Brandsberg of Tresky Tetsuro Nishimura of Nihon Superior Co. Ltd Josef Jost of Balver Zinn Gmbh & Co. KG Markus Walter of SEHO Systems GmbH Jürg Schüpbach of JUKI Europe | NOVEMBER 2013 ISSUE

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welcome to smt today Welcome to this new magazine which is part of our new media offering, solely dedicated to the European Electronics industry, it’s technology, it’s innovation and most importantly, it’s people.

We aim to bring a fresh approach to the industry, integrating the best of traditional communication alongside the very latest technology to engage and keep our readers in touch with what’s happening, new products and expert reviews.

I hope you enjoy our first edition and look forward to meeting you at the show and sharing ideas on what we can add to our creative mix for edition two.

Lin Ramsay’s career has largely involved working for the UK-based subsidiaries of two major multi-national companies in the computer and aerospace industries. These roles have primarily included responsibilities in the administration and business related functions across European countries and within complex cross-functional business groups.

Lin Ramsay Editor

Lin has held management positions within many disciplines such as project/event management, customer service, training and development, recruitment and responsibility for public relations and communications within a leading global aerospace company.

Her most recent experience has included the design, development, editorship and publication of a number of communication packages on behalf of a global aerospace company.

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NEXT EDITION January 2014 Book your space now and have your products and services exposed to the right people at the right time.

inside this issue...

Productronica 2013 Who to see and where

10

Technology Today

Industry experts share their knowledge

Exploring AOI and X-Ray

28 Staying Competitive

4

16

The Art of Screen Printing

32

Red Carpet

10

Exploring AOI and X-Ray

16

The Art of Screen Printing

by Don Miller, Nordson YESTECH

by Michael L Martel, Speedline Technologies

30 Understencil Wipe Cleaning Yields Improvements

by Mike Bixenman, DBA, Kyzen, Nashville

Special Features

Exclusive industry reports and features 8

Meet the CEO’s

14

Sharing Innovation

20

Company Spotlight

28

Staying Competitive

by Mike Nelson, Etek Europe

SMS Electronics

by Chris Herd, Evolvi SMT

New Products

Exciting new industry innovation

22 New Products & Innovations

Industry News

22

What’s happening in the world of Electronics

Red Carpet

26

Photo gallery of industry personalities and events

32 Page 3

productronica 2013 who to see and where It’s here again, the industries leading international trade fair for innovative electronics production hits its 20th Anniversary. Your chance to gain a comprehensive overview of the entire market under one roof.

Aqueous Technologies Corp.

EvolviSMT

Aqueous Technologies will demonstrate the Trident XLD Zero Discharge Defluxing and Cleanliness Testing System and Zero Ion Ionic Contamination Tester. The Trident XLD is an environmentally-responsible fully automated system that removes all flux types including no-clean, resin and water soluble. The Zero-Ion is designed to test electronics assemblies for ionic contamination.

Evolvi are a leading force within the Second User equipment purchase and supply chain. They are continually identifying equipment suitable for customers throughout the world. If you are planning to buy second user equipment or have SMT or IM production Pick and Place equipment, Screen Printing, Reflow, Wave Soldering, PCB Wash, AOI, X-ray or even board handling equipment to dispose of, contact Evolvi.

Hall A4, Booth 558

____________________________________

Nordson DAGE Hall A2, Booth 438

Nordson DAGE will debut the XD7600NT Diamond FP X-ray inspection system with QuickView CT, which uses the latest technology to provide the highest quality in X-ray imaging on the market today. Also on display, the new XD7500VR Jade FP provides superior X-ray image quality and uses the latest flat panel detector to provide high-quality real-time imaging. ____________________________________

Nordson YESTECH Hall A4, Booth 503

Nordson YESTECH’s new high-speed FX SL advanced AOI inspection system for populated printed circuit boards will be on display with live demonstrations. The system offers high-speed “capture on the fly” inspection and uses a flexible and comprehensive set of inspection tools.

Configurable for all line positions, the FX Series is equally effective for paste, pre-/ post-reflow and final assembly inspection. ____________________________________

Page 4

Hall A3, Booth 233

Designed for ultimate flexibility and zero changeover, the system provides socket density of up to 96 programming sockets, enables concurrently installed media options and picks and places today’s smallest devices. ____________________________________

Kyzen

Hall A4, Booth 416

____________________________________

MIRTEC Europe Hall A2, Booth 578

MIRTEC will exhibit its line of 3D AOI and SPI systems: MV-9 Series 25 Mega Pixel 2D/3D AOI System, MV-9UP LED Inspection System with a 15 Mega Pixel camera and 6 μm Confocal-Sensor, MS15 Series 25 Mega Pixel 3D SPI System, MV-7xi In-Line AOI System, and MV-3L Desktop AOI System. Also, the WSI Nano Inspection System, MIRTEC Intelli-Sys production quality software and the new E-Learning tool will be shown. ____________________________________

Data I/O

Hall A2, Booth 471

On display in the booth, Data I/O’s PSV7000 is capable of programming up to 2000 devices/hour with tray, tape and tube, and even with large file sizes.

Kyzen will showcase AQUANOX® A8820 Advanced Aqueous Stencil Cleaner, which is an engineered Micro Cell Technology (MCT™) cleaning fluid designed to remove wet solder paste and uncured chip bonder adhesive from stencils used in surface mount printing processes. The cleaner effectively removes common solder pastes and fluxes, and demonstrates a favourable compatibility profile with stencil cleaning systems. ____________________________________

Speedline Technologies Hall A3, Booth 119

Speedline Technology will present the SP710avi and SP210avi Screen Printers.

The SP710 will be equipped with a dual syringe Advanced Dispense unit for precise deposition of solder paste or adhesive materials. It also will include a list of standard machine features as well as inherent benefits such as SMarT-Cal, the product-based machine calibration that maintains a large process window. ____________________________________

| NOVEMBER 2013 ISSUE

Hall A4, Booth 417

BOFA will be exhibiting a range of it’s latest fume extraction systems for the electronics industry at Productronica.

There will be a full range of FumeCAB’s and iQ solder fume extractors on display at the exhibition. ____________________________________

Europlacer

Hall A2, Booth 439

See Europlacer’s ii-Feed Cart that has a capacity of up to 33 separate component channels and accepts any mix of 8, 12, 16 or 24 mm smart iiFeed Elements. The flexible cart has a component range that begins at 01005 but remains fully compatible with previous machine generations. Any generation of Europlacer’s tape trolleys can be used on the same machine. ____________________________________

SEHO Systems GmbH Hall A4, Booth 578

Visitors to SEHO Systems GmbH’s booth can look forward to numerous soldering highlights and a PLUS of innovations and services. The focus will be on increased efficiency and productivity in electronics manufacturing. Also, the company will debut the new product family SelectLine, a fully modular selective soldering system. ____________________________________

BTU International Hall A3, Booth 134

BTU will show the DYNAMO, which is specifically targeted for consumer electronics applications. DYNAMO’s simplified configuration delivers 24/7, with high uptime and reduced cost of ownership. With 8, 10, and 12 zone air or nitrogen models available, DYNAMO represents BTU quality and reliability. Backed

by BTU’s unparalleled worldwide service and applications team, DYNAMO is a value-driven workhorse. ____________________________________

Getting around...

Test and measurement, quality assurance

Metcal

Production logistics and material-flow technology

Hall A4, Booth 221

Component mount technology

Metcal will debut two products: The updated MX-500 Soldering and Rework System builds on the features that make it an icon in the industry while adding features and updating its appearance with an exciting new look. HCT2-120 Hot Air Pencil is a handheld convection tool ideally suited for applications that use smaller components and ICs.

Soldering technology and joining Product finishing Electronic manufacturing services (EMS) PCB and other circuit carrier manufacturing Semiconductor/display manufacturing Hybrid components manufacturing

____________________________________

Micronano production Materials processing

Techcon Systems

Organic and printed electronics

Hall A4, Booth 221

Techcon Systems will show the TS9000 Series Jet Tech valve, which is a piezoelectric-driven, non-contact dispense valve capable of handling fluid viscosities to 2 million Cps and offers a fast jetting action producing hundreds of accurate deposits less than one second.

Also on display: Bench Top Robot, TS6500CIM Series cartridge mixer, consumable products, TS7000 IMP Series Auger Valves, TS5540 Series Spray Valves, TS5622 Diaphragm Valves Series and TS350 dispenser ____________________________________

Photovoltaics production, production technologies for batteries and electrical energy storage Technologies for cable processing and connectors Coilware production, LED production and discrete devices Battery storage—System technology A1 B1 B2 B3 All Halls

BOFA International Ltd

Productronica Forum Speakers Corner Innovation Forum Forum Battery storage—System technology

Manufacturing and process software Production subsystems, operating equipment/ materials, environmental and clean-room technology, services

Nihon Superior Co. Ltd.

Gen3 Systems Ltd.

EVS International

Nihon Superior will show the SN100C alloy that delivers a silver-free, stable microstructure that accommodates the long-term and impact strains to which a solder joint can be subjected. The eutectic character of the SN100C alloy and the associated high fluidity provides faster wetting and increased spreadability over SAC305, which is beneficial in wave soldering, hand soldering and reflow.

Gen3 will exhibit a range of systems including the Gensonic Stencil Cleaning system, which will be displayed with a 24” stencil frame, the MUST System 3, the CM11+ Contaminometer Cleanliness Tester, the Z-CHECK 3D non-contact solder paste precision measuring system, the Solder-Saver and Delta T Wizard Thermal Profiling.

EVS will debut the EVS 500. This new concept in dross recovery dispenses with air-driven pistons and the chamber, teeth and pistons design. The new patented technology inverts the solder/dross separation pot, and adds an innovative 180° rotating facility. As no teeth are used to separate the solder/dross, the ingot coming from the machine is very clean.

____________________________________

____________________________________

Hall A4, Booth 451

____________________________________

Hall A4, Booth 470

Hall A4, Booth 141

make the most of your stay in Munich eating out

nightlife

heritage

RESTAURANT MARK’S

THE MANDARIN BAR

THE BAVARIAN STATE OPERA

Cuisine: French and Asian Michelin-starred restaurant Mark’s boasts tables laid with white linen, silverware and accompanied by five star service.

Opening Times: 1am close A stylish bar with live music in the lobby area of the Mandarin Oriental Hotel. This bar offers evening cocktails, accompanied by live piano music.

Opera House Maintaining its fame throughout several centuries, The Bavarian State Opera is one of the oldest opera houses in the world.

+49 89 2909 8875 Neuturmstrasse 1, 80331

+49 89 2909 8829 Neutrumstrasse 1, 80331

+49 89 218501 Max-Joseph-Platz 2, 80539

SCHWARZ & WEIZ

CLUB BABY!

DEUTSCHES MUSEUM

Cuisine: Traditional & international The perfect place to impress a client, this gastronomic kitchen serves both local and international cuisine to a sophisticated crowd.

Opening Times: 11pm to 5am This exclusive & boutique club boasts the finest house & electro music.

Club Baby! offers a glamorous night out in an intimate atmosphere.

Technology & Science Museum Founded in 1903 by engineer Oskar von Miller, the Deutsches Museum boasts over 786,000 square feet of exhibition space.

+49 89 599 482 952 Bayerstrasse 12, 80335

+49 16 090 900 224 Maximilansplatz 5, 80333

+49 892 179 475 Museumsinsel 1, D, 80538

TANTRIS

SCHUMANN’S BAR

ALLIANZ ARENA

Cuisine: Seafood With beautiful architecture & design, the menu at Tantris is a collaboration between Asian cuisine and art. The majority of dishes are from the ocean.

Opening Times: 3am close An iconic bar in the city, Schumann’s Bar has been open for more than two decades with a clientele of famous faces, from tennis players to models.

Football Stadium Designed by the Swiss architects Herzog and de Meuron, the Allianz Arena homes both FC Bayern München and SV 1860 München.

+49 89 3619 5922 Johann-Fichte-Str. 7, 80805

+49 8922 9060 Odeonsplatz 6-7, 80539

+49 89 350 948 350 Werner-Heisenberg-Allee 25, 80939

Share your Munich experience with us...

Send your photos and stories in to red@smttoday.com and we’ll feature them on our social pages and the best will get a special place in next editions Red Carpet. Remember to keep them clean!

Page 6

| NOVEMBER 2013 ISSUE

Global SMT Productronics new system launch Ad 4 203x275 oct 2013 a.indd 1

11/10/2013 10:57:21

meet the CEO’s the people that make it happen Our industry is driven by a global network of CEO’s with the energy and vision that brings new technology and innovation down the line. Every edition, we will introduce you to the faces behind the companies.

Tresky

Thorleif Brandsberg is the CEO of Tresky, a leading manufacturer of micro-assembly systems. As a global solutions provider for the microelectronics industries, Tresky provides a wide range of products from simple and inexpensive to fully automatic die bonders and strives to perfect the art of creating pick-and-place systems. Based in Switzerland, the company supports many applications and has the extensive experience and modular setup to meet its customers’ needs.

Nihon Superior Co. Ltd.

Tetsuro Nishimura is the president of Nihon Superior Co. Ltd., a supplier of advanced soldering materials to the global market. The family-owned company strives to widen the range of applications for which it can provide solutions, and is known globally for its innovative SN100C lead-free solder alloy.

Nihon Superior is also committed to scientific research and giving back to the industry.

Balver Zinn Gmbh & Co. KG

Josef Jost is the president of Balver Zinn GmbH & Co. KG, a family-owned and operated company.

Today, the company is among the leading providers of specialist anodes with various alloys as well as soft solders, special wires and fluxes, and solder paste developed by the Cobar manufacturing facility of Balver Zinn. The company’s products yield excellent results in the PCB industry and are used in electronics, solar and electrical engineering applications.

SEHO Systems GmbH

Markus Walter is the CEO of SEHO Systems GmbH, a leading manufacturer of soldering technology.

Company solutions are based on performance, flexibility, efficiency and technical progress. SEHO’s business activities and production organization are oriented according to the principles of sustained future-compatible development and production of machines. With its advanced systems and technologies, the company provides customers with a sustained and resource-economising production to provide them with a competitive advantage.

JUKI Europe

Jürg Schüpbach is the CEO of JUKI Europe, a world-leading provider of automated SMT assembly products and systems. The company’s innovative, reliable customer solutions are developed to meet customers’ individual demands and are designed to give “Lowest Cost of Ownership.” JUKI has built its global image with a combination of top-quality and high-reliability machines with a reputation for worldclass service and support.

Page 8

| NOVEMBER 2013 ISSUE

exploring aoi & x-ray

by Don Miller, Nordson YESTECH Manufacturers of advanced PCB assemblies know that simultaneously producing cost-competitive products and meeting the quality expectations of customers are vital to their success.

Driven by advancing board complexities and the desire to improve yields by effectively using real-time process information, manufacturers are increasing their adoption of automated test and inspection technologies.

Figure 1. Test Coverage Example

Two of the guiding philosophies for the implementation of test and inspection technologies are prevention and detection.

Prevention places the priority on process control and elimination of defects by implementing corrective action. Detection focuses inspection efforts on ensuring that no defective assemblies escape from the factory floor.

Different inspection goals will dictate the need for process information at varying levels of detail. Having a wellunderstood set of goals helps ensure that the selected technologies can be used to maximum benefit.

A comprehensive test and inspection strategy often will use a combination of automated optical inspection (AOI), automated x-ray (AXI), in-circuit test, and functional test to ensure inspection coverage and yield rates are maximized (Figure 1). The sum of results from multiple inspection techniques far outweighs the capabilities of any one system alone. In addition, the process can be streamlined by delegating the

Page 10

inspection duties of the equipment to what it is best suited for, eliminating total dependency on any one method.

With improvements in inspection technology come enhanced defect analysis and ultimately more accurate data. Although data collection is a critical aspect of process improvement, to ensure the process remains in control, you also must enforce a plan that provides immediate feedback.

systems can be placed in various in-line and off-line configurations, it is important to thoroughly analyze the factors that influence the overall yields to determine the best fit for your process.

A return-on-investment model is an excellent tool for estimating the benefits of the AOI system in different process configurations. The goal of this exercise is to reduce the cost per function and improve the current yield rates.

The benefits of this plan are quickly realized by minimizing the response time and cost caused by a process anomaly. AOI and AXI systems can address multiple tasks in various locations of the manufacturing process and have become the leading technologies in the quest to identify defects and improve process yields (Figure 2).

If the main objective of your plan is to deploy a better defect detection system, then placing the machine at the end of the manufacturing line or in an off-line location will be best for your model. If you are more interested in defect prevention, then you will want to insert the AOI system further upstream in the process.

Automated Optical Inspection

Depending on individual requirements, the best results could be achieved by placing the machine at one or more of the following locations: post-print, prereflow, or post-reflow. In any of these scenarios, the reduction or reallocation of labor is of particular interest, especially when considering research has shown that, on average, human inspection is only approximately 50% efficient when detecting visible defects on PCBs.

When comparing the speed, efficiency, and flexibility of AOI to other test and inspection methods, the benefits are clear.

For example, a typical manufacturing line may use two to four inspectors to visually identify and repair component and solder defects. ____________________________________

‘‘

two of the guiding philosophies for the implementation of test and inspection technologies are prevention and detection

____________________________________ In contrast, an AOI system requires only one operator to detect and repair defects as well as collect all necessary data for yield improvements. This can either reduce the per-shift requirement for labor or enable reallocation of resources to another part of the manufacturing process. Because AOI

There are many factors behind this inefficiency, but it is primarily the repetitive and demanding nature of the work that makes concentration difficult to maintain.

The monotony also can result in a high staff turnover with consequent costs in hiring and training personnel.

In contrast to human inspection, AOI delivers both accurate and repeatable results. In many installations, it has been tested with efficiency as high as 99%.

AOI Essentials Various characteristics of AOI systems are essential for today’s inspection requirements:

| NOVEMBER 2013 ISSUE

Magnification pixel counts and optical and digital magnification are important criteria that often determine the ultimate capabilities of an inspection system. To accurately inspect small devices, such as 01005s, the combined optical and digital magnification must provide the necessary amount of resolution and information to the AOI software inspection algorithms.

But, higher magnification leads to a smaller field of view (FOV) and longer image acquisition times and more data to process. As cycle times shorten, the AOI system must offer a balance between magnification and image acquisition speed.

The pixel size is determined by the properties of the imaging sensor and the optics of the AOI system. Take, for example, a typical 1.3-megapixel CMOS sensor with an array size of 1,280 x 1,024 fitted with a lens that produces a field of view of 32 mm x 25.6 mm, which has a pixel size of 25 µm. If you consider that a 01005 resistor is 200 x 400 µm, the projected image of the component would be 8 x 16 pixels.

This may not be enough information for the inspection algorithms to provide sufficient defect detection. However, the same sensor with a lens that has an FOV of 16 x 12.8 mm results in a pixel size of 12.5 µm, which would display the component at 16 x 32 pixels. This x4 increase in area now may be enough information for the inspection algorithms to accurately detect the defect conditions.

Optics for increased accuracy and repeatability, the use of telecentric optics has become increasingly popular in AOI equipment. Traditional lenses exhibit varying magnification for objects at different distances from the lens and can show the apparent shape of objects changing with distance from the center of the FOV. Telecentric lenses have the same magnification at all distances. An objectspace telecentric lens creates images of the same size for objects at any distance and has constant angle of view across the entire FOV. Because their images have constant magnification and geometry, telecentric lenses are useful for metrology applications when an AOI system must determine the precise size of objects independently from their position within the FOV and even when their distance is affected by some degree of unknown variations.

Programmable Lighting in any machine vision application, lighting is critical to achieving the desired results. Trying to find one light source that will enable detection

Figure 2. PCB Assembly Process and Inspection Points

of all defect conditions is nearly impossible given the ever-changing environment of electronics manufacturing. ____________________________________

‘‘

axi is the logical choice for inspecting complicated boards

____________________________________ To ensure the widest defect coverage for component and PCB configurations, a dynamic light source is crucial. With the reduction in cost of light-emitting diodes, AOI equipment manufacturers can configure light arrays that are highly customizable within the inspection software. With multiple colors at various angles, AOI users have the flexibility to enhance the contrast of the image to easily identify a multitude of defect conditions.

Even within a given component type, the possibilities are endless. There are many variations of color and surface properties along with the variations of paste composition, pad size and material, and PCB color and texture. Programmable lighting is an invaluable tool for ensuring the widest range of defect detection.

Positional Accuracy as component size decreases, the positional accuracy of both manufacturing and inspection equipment becomes critical. As a rule of thumb, the AOI system should have subpixel accuracy. This will ensure the system is sufficiently accurate to detect small deviations in position that can lead to a 01005 defect.

Network-Capable Software Two important functions of an AOI system are data collection and retrieval. The data can be in the form of a text output, a database, an image collection, or a combination of

several formats. Collecting the data is a basic function of most AOI systems; however, retrieving the information often is more complex and depends on the configuration of the manufacturing line.

In a networked environment, the AOI can simultaneously inspect a PCB assembly while transmitting results from the previous assembly to a downstream review/rework station. The downstream station not only is communicating with the AOI system, but it also is storing inspection results and review operations into a statistical process control (SPC) database. Inspection results can be viewed in real time or archived for later review.

While most automated test equipment is designed for post-reflow or end-ofline inspection, an AOI system can be implemented almost anywhere within the process. This flexibility allows the overall inspection plan to be fine-tuned by moving or adding AOI equipment to different manufacturing line locations until the desired yield is achieved.

Automated X-Ray Inspection AXI is becoming increasingly popular because, like AOI, it is a noninvasive inspection solution that provides realtime process data and can be used effectively for defect detection and yield improvements. X-ray images of solder joints can be analyzed automatically to detect structural defects such as insufficient solder, voiding shorts, opens, and other defects that can account for upwards of 90% of the total defects on a complicated board. But unlike AOI, X-ray imaging is not hindered by hidden solder joints, component shields, and highdensity double-sided boards.

This key advantage of inspecting hidden solder joints makes AXI the logical choice for inspecting complicated boards, especially ones with BGAs, CGAs, CSPs, or components that are under RF shields. This is a critical advantage of AXI considering a significantly large number of boards fall into this category with the increasing popularity of array-style packaging. Additionally, many cell phones and wireless communications products are placing RF shields over unsoldered components at pick-and-place, using the reflow processes to solder them to the board.

AXI can be useful at many stages of the assembly process, but time and resource constraints usually limit most products to a single X-ray inspection. For that reason, it should be implemented where it will provide the maximum benefit to the process.

Since automatic analysis of finished solder joints is AXI’s strength, most systems are placed after the solder process whether wave or reflow. At this point, all solder joints on the board are present and can be covered in a single test. Also, by waiting until the completion of the assembly process, any other defects such as damaged or missing components will be detected.

AXI Types 2-D or Transmission X-Ray with the 2-D technique, X-rays are generated at a fixed-point source, pass through the PCB assembly, and form an image on an electronic detector. The image is converted into a digital image and transferred to a computer where the analysis takes place.

This technology is widely used for singlesided boards in automotive and other high-reliability applications. ____________________________________

‘‘

A critical challenge for axi systems has historically been to accurately identify defects within the allowed cycle time

the X-ray source and detector to move in a circular pattern 180 degrees out of phase.

Only features in one plane are in focus, and components and solder joints not in the plane are sufficiently blurred out.

The tomosynthesis technique creates 3-D images by reconstructing multiple transmission images taken from different angles. These images are digitally combined to create slices at any depth.

Both techniques are commonly used today in X-ray inspection applications for more complicated double-sided electronic assemblies (Figure 3).

A critical challenge for AXI systems has historically been to accurately identify defects within the allowed cycle time.

To maximize throughput and defect coverage, some systems today permit selective 2-D or 3-D inspection on the same assembly. Specific components or regions of interest can be selected for 3-D inspection without significantly impacting overall inspection time.

Another recent development is the portability of data between AXI and AOI systems from some suppliers. The capability to share libraries, inspection programs, and SPC data between AOI and AXI systems can greatly enhance machine usage and defect coverage.

Conclusion The flexibility of today’s AOI and AXI systems extends beyond placement within the manufacturing process. There has been a steady progression in performance and usability since the introduction of the machines in the early 1980s. Initial versions were very expensive, limited in capability, difficult to program, and required many hours or days to create and maintain inspection programs. Unless running in a high-volume, low-mix production line, it was difficult to justify these technologies as a viable solution.

Thanks to the rapid evolution of hardware and software technologies, the latest generation of AOI and AXI systems has overcome most of these limitations.

Operators now can quickly and easily create inspection programs and manage daily runtime operations with very little intervention. As a result, both high-mix and high-volume manufacturing lines can recognize immediate yield-improvement automated inspection results.

In addition to real-time process feedback, many proponents of automated inspection have praised the substantial time reduction on first-article inspection and line changeovers. By using the latest network and communications methods, there are unlimited possibilities in how data is recorded and retrieved.

In-line or off-line review stations can seamlessly convert the inspection results into an efficient rework process by identifying the defective areas of the PCB assembly and recording the actions performed by the operator. The operator’s actions and machine data then can be analyzed via Web-based SPC and statistical quality control software packages to create an instant snapshot of the process via standard Internet browsers on a desktop PC. Finally, AOI and AXI have been following the trend of most recent technologies to provide more performance for less cost.

The resulting price/performance ratio of these systems has become a driving factor in the ever-increasing acceptance of these technologies. Whether highvolume or high-mix, both large and small companies can quickly realize the value in automated optical and X-ray inspection.

When considering the power of AOI and X-ray systems that can be used in multiple process locations with unlimited data collection and reporting capabilities, the benefits are compelling

____________________________________ Advanced image processing software now is available to distinguish components and conduct automated inspection of solder defects. Transmission X-ray is the most common form of X-ray inspection for electronic assemblies.

3-D X-ray technology provides clear images of single layers or slices of the board to facilitate unimpeded inspection of double-sided boards in a single pass.

The laminographic 3-D technique requires

Page 12

Figure 3. Tomosynthesis Slice Analysis

| NOVEMBER 2013 ISSUE

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sharing innovation bringing companies together is the way forward

When it comes to bringing the industry’s leading technology companies together to share knowledge and expertise, Etek Europe are leading the way with a programme of highly successful Technology Days.

After lunch; Joe Perault from PARMI, a Global leader in Solder Paste Inspection presented PARMI’s methods and technologies for accomplishing industry requirements for SPI machines to reduce printing defects and improve process.

Joe showcased PARMI’s new process enhancement tools that take SPI beyond simple pass/fail reporting and assist process engineers to finely tune their process, demonstrated with Speedline’s latest technology from MPM showing closed loop capabilities.

With their purpose built Technology Centre based in Prestwick, on the West Coast of Scotland, Etek Europe hosts a series of Technology Days which bring together industry experts from all over the World.

The one day event which SMT Today attended in October showcased the industry’s leading screen printing technologies, hosted by Etek’s managing Director Mike Nelson. Guests were treated to a series of talks on stencil production and its development plus exclusive, practical demonstrations.

Fraser Shaw from Tannlin opened the series of talks and gave a fascinating introduction to Stencil production and its developments, Stencil fundamental requirements and Stencils from the users perspective. Following Fraser was Bruce Seaton from Speedline; Bruce focused on printing trends, challenges and machinery solutions showcasing the latest technology from MPM in Etek’s dedicated Demonstration Centre.

“The Etek Technology Days are aimed at bringing the industry’s leading experts together, as well as offering our customers a great opportunity to come to our Technology Centre. Allowing our customers to learn first-hand about leading technologies available on the market.” commented MIke Nelson, Managing Director of Etek Europe.

Page 14

Managing Director Graham Fraser from Fraser Technologies demonstrated what defects typically relate to stencil cleanliness and the options available for successful, cost effective cleaning. Graham explained that a recent IPC report showed that 75% of production issues come from the print process - cleaning can reduce defects and save money.

Mike Nelson takes some time from the day to speak exclusively to SMT Today.

SMT Today: Thank you for inviting us along to your Technology Day Mike. Tell me why is it important to have these Technology days?

Mike Nelson: As an industry, innovations and development move at such at a pace it’s difficult to keep up. The Technology Day brings together a range of industry experts that are at the cutting edge of what’s happening within the industry.

It also lets our customers discover and learn first-hand what’s happening now and in the future. It brings together clients from different sectors letting them network and work together.

SMT Today: I noticed the Evolvi SMT banners around the Centre, what’s this?

Mike Nelson: Evolvi SMT is our partner company. We have, for many years, been involved in buying, selling and installing all the major brands of used SMT equipment, from single machines to entire factories.

Adding this expertise to the vast experience of the Evolvi team, we can source the best options available from our Global Network and provide them to the end user with a comprehensive Etek backed warranty.

SMT Today: Finally, what does the future hold for Etek Europe?

To conclude the day, Mike Nelson commenced a guided tour of Etek’s 12,000 sq. ft. Technology Centre and guests were treated to an expert from the whisky industry who provided a unique experience, bringing both guests and speakers together to taste and learn about a collection of rare Scottish whiskies.

The Technology Day proved a huge success and we look forward to attending more in 2014 and hope that others take the same approach as Etek Europe and maximise the collective knowledge within our industry through events like this.

Mike Nelson: Our biggest investment has been our purpose built Technology Centre, which boasts one of the largest collections of Electronic Manufacturing and Test Equipment in Europe.

Our customers are invited to visit and test the latest Technology offerings from our award winning Global Suppliers. We are now planning to open our next 12,000 sq/ft in September 2014. This will be our refurbishment and remanufacturing centre for aerospace, automotive, medical and defence as well as OEM’s and CEM’s

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the art of screen printing by michael l. martel, Speedline Technologies More than a decade ago, indeed, more on the order of fifteen years or so, the new mantra in stencil printing was to ‘take the art out of the art of screen printing.’ It was the age of the ‘lightsout, turnkey’ manufacturing ‘flowline’.

Screen printing solder paste had become stencil printing, and advances in PCB assembly technology now made it possible to better automate equipment to achieve higher yields with better quality consistency without the constant intervention of operators. I remember being told, “We have to take the artful operator out of the process; it’s not about art anymore. If we want high-volume repeatability, it’s got to be all about automation.”

That was then. The landscape has of course changed dramatically. The artful operator is back, but the range in skill levels and training varies widely. Technology for printing has advanced; when’s the last time anyone used a D-cut or trailing edge polyurethane blade to print solder paste?

Most printing is done with metal blades, and in order to meet the challenges of advancing technology while maintaining quality levels approaching Six Sigma, the printer operator must be skilled and knowledgeable about process variables, materials, process tweaking, and more. ____________________________________

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it’s a worthy challenge. printing is tougher today than it has ever been

____________________________________ Increasingly, we hear of a customer being unhappy with a certain printer, only to go in and find that the problem isn’t with the printer, but with the operator, who would benefit from some in-depth training. In one instance, an operator was setting up their process with a broken PCB that was taped together, and then was subsequently unhappy with the registration of subsequent production boards!

The moral of the story is that you can supply the best equipment in the world,

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but if the operator lacks skills and training, today, results may be less than what one wants, and of course the equipment will take the blame. The requirement for the artful operator has returned. But what can one do, given the simple fact that skill levels vary widely among today’s operators in different parts of the world? The answer, perhaps, is to make the equipment as forgiving of process and operator-based variables as one can. This way, even if different operators set up a printer with slightly different parameters, they will still get good results.

It’s a worthy challenge. Printing is tougher today than it has ever been, with everfiner features or fine pitch printing through ever-smaller apertures, step stencils for special requirements, and perpetuallytroublesome hybrid applications such as pin-in-paste, or more appropriately pastein-hole, where printing paste into a deep through-hole for reflow attachment of PTH parts never intended for reflow presents a variety of potential headaches. To make the process more forgiving, one has to widen the process window, and smaller boards, tighter tolerances, and less forgiving board topographies aren’t helping matters!

Printing with Metal Blades Skilled printer operators using superior metal blade alloys, varying angle of attack, etc. can achieve acceptable results against the most challenging printing applications, but there are shortcomings that include considerable materials waste, which translates into significant cost, less fill volume as apertures become smaller, and unacceptable variation in the consistency of results. Fine pitch and fine-feature printing applications, e.g., 200µ - .50 Area Ratio (AR) and 150µ - .375 AR, have been pushing blade printing technology to its limits. When printing fine pitch or fine features especially, good aperture fill volume is the key to well-

formed solder joints without insufficiencies.

With fine feature devices, the primary printing defect is poor or insufficient aperture fill. Without proper or complete fill, the solder paste may not adhere to the pad, and pull away/remain in the aperture; or it may result in a ‘starved’ solder joint (or incomplete joint) if undetected by the downstream SPI machine.

Enclosed media stencil printing solder paste

Some of the causes of insufficient aperture fill are the same causes identified for other print defects, e.g., pause in printing/raised paste viscosity; squeegee speed too high or too low; squeegee pressure too low; not enough paste on stencil; and others.

Aperture fill results from downward pressure on the paste by the squeegee, forcing solder paste into the apertures.

Pressure is generated by compression of the bead of paste, from the squeegee blade’s angle of attack as it moves across the stencil and rolls the bead of solder paste before it. Changes in the diameter and uniformity of roll size directly affect paste pressure and thus aperture filling effectiveness. Because operators replenish paste on the stencil sporadically, the roll size can still change significantly during the

| NOVEMBER 2013 ISSUE

entire print chamber during operation and allow a positive pressure to be generated inside. Silicone dams seal the opposite ends of the chamber. ____________________________________

‘‘

It may not be possible to completely remove the need for the ‘artful operator’

____________________________________

Figure 1. Enclosed media print head cross-section

course of the shift, and data show that a 100g change in solder roll size will cause approximately a 7% change in maximum paste filling pressure. This is a significant change, enough to dramatically alter the solder paste print quality, particularly on small apertures.

Paste in Hole Paste-in-Hole (PIH) printing, a.k.a. throughhole printing, pin-in-paste, intrusive reflow, etc., has always been a way to accommodate traditional through-hole components on a mixed-technology SMT assembly using reflow soldering rather than wave to make the through-hole connections. Paste is printed in such a manner to as to fill the through-holes, the through-hole components are inserted, and the assembly is reflowed. ____________________________________

The Enclosed Media Solution Enclosed media print head technology was designed to make printing easier and more repeatable with fewer delicate variables than squeegee blade printing. It compensates for many of the shortcomings associated with metal blade printing for more challenging and changing applications including fine pitch printing and PIH, and many others.

Enclosed media technology was developed to provide the same required pressurization of the solder paste as the squeegee blade’s angle of attack, but uniformly across the length of the print head while printing, regardless of the amount of paste in the enclosed chamber. The key to consistency and uniformity in printing results, where the stencil or print application requirements were anything but uniform, was determined to be direct, fast-response control of paste

Rather than indirectly or pneumatically, pressurization is accomplished mechanically by a motor-driven plunger or piston that is separated from the paste by a membrane. The plunger applies pressure directly to the volume of paste in the chamber, and a series of transducers sense the pressure and are part of a closed-loop system of very tight pressure control, which maintains chamber pressure actively at +/- 0.1 psi from set point. With Enclosed Media printing, solder paste isn’t exposed to the air, so it doesn’t have the opportunity to dry out. Paste savings of up to 50% are commonplace. Results with fine pitch printing are excellent; for example, whereas with metal squeegee blades, the finer the aperture, the less percentage of desired volume could be depended upon, with enclosed media, the trend was just the opposite, with print volumes over 50% for 150 Micron apertures with a 0.375 Area Ratio.

‘‘

squeegee blades are replaced with metal blades that function as both scraper and seal

____________________________________ One of the biggest issues with PIH is getting enough metal into the hole. On top of that, PIH has become tougher with shrinking board topographies because often, high paste volume PIH holes are too close to lowvolume requirement fine pitch SMT pads.

Fine-pitch aperture fill volume percentages are a function of paste pressure, as mentioned above, generated by the rolling bead of paste driven across the stencil foil surface by the metal printing blade. More pressure results in better aperture fill for fine pitch, and may be required for more thorough print-filling of PIH holes, but when one has a high paste volume requirement such as an array of through-holes next to fine pitch, the paste pressure in the bead will be reduced by the through-hole requirement and thus rob needed pressure from the fine pitch apertures, with the result being poor aperture fill.

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Table 1. Volume and Standard Deviation Comparison with Squeegee Blades

pressure. This would have to be closedloop controlled so that pressurization could respond to such demands, for example, as are made by through-hole fills that require a very high volume of paste.

The enclosed media print head (Figure 1) maintains solder paste in a closed print chamber that can be pressurized to force the solder paste out of the chamber and onto the substrate. Conventional squeegee blades are replaced with metal blades that function as both scraper and seal. These blades are aligned in a leading edge configuration at 45 degrees, as opposed to a typical trailing edge squeegee configuration. The inwardly- inclined blades are 10mm apart at the point of contact with the stencil. When the head is lowered onto the stencil, the stencil foil will close the

Table 1 shows the results of comparative tests between printing with an enclosed media print head and metal blade squeegees. Note that the finer the aperture, the more the quality and consistency of squeegee blade printing deteriorates compared to the performance of enclosed media.

It’s a forgiving process; recovery is typically immediate after printing pauses, because the print head rests on the stencil and does not allow paste inside to dry out. Even with varying set-up settings by different operators, consistent, good results are obtained, often from the first print, and without further adjustment or ‘tweaking’.

The controlled uniformity of solder paste pressure that is provided by enclosed

| NOVEMBER 2013 ISSUE

media printing simplifies PIH printing. In many instances it can eliminate the need for step stencils, overprinting, and 2-print methods, all less than optimum ‘fixes’ for getting enough solder into the throughholes . Enclosed media printing saves considerable material costs and paste waste over step stencil printing.

is mechanically controlled and maintained so that aperture fill is optimum even for fine feature device patterns in close proximity to paste-hungry PIH holes. Paste pressure is not dependent on squeegee angle of attack or speed. It is a closed system where paste replenishment in the plenum is automatic via a closed-loop sensor system.

Since the pressure can be adjusted, hole fill can be optimized, and other process variables maintained as constant values without the need to tweak. Chamber pressure is actively maintained at +/- 0.1 psi from set point.

Figure 2 is a plot of chamber pressure during a simulated production run. Interboard pressure data illustrates how tight, closed-loop chamber pressure control is maintained consistently board to board regardless of paste consumption requirements (large apertures & small).

Figure 2. Chamber Pressure Consistency Plot

Throughput is increased through less frequent underwiping, which also saves solvent (in solvent systems) and paper. In an enclosed media system, paste pressure

Conclusion It may not be possible to completely remove the need for the ‘artful operator’ from the printing phase of PCB assembly.

But because 70% of soldering defects can

be traced to the SMT solder paste printing process, it’s vital to widen the print process window, compensate for varying operator skill levels, and bring higher process repeatability back to the print process through enabling innovations such as enclosed media printing technology

Michael L. Martel Michael L. Martel is a product marketing engineer for Speedline Technologies. He has worked in the electronics manufacturing and assembly industry since 1983 as a sales manager, writer, rep, magazine editor, and marketer, as well as an SMT process engineer for a Massachusetts company.

In addition to printing and dispensing, his areas of focus include reflow and selective soldering and rework.

He is a graduate of the University of Rhode Island and a U.S. Coast Guard veteran.

Visit us at Productronica!

Stand A2.371 and Stand A2.520

203-SCS_Global SMT_210x418.5mm 4c_REV - Oct-Nov 2013.indd 1

11/1/2013 9:19:42 AM

company

spotlight

manufacturing in the uk going from strength to strength Recently voted the Number 1 company for growth in Nottinghamshire, UK based SMS Electronics are considered to be one of Europe’s leading SMS providers with over 100 years of history.

From their UK site in the East Midlands, SMS Electronics service a wide ranging customer base, spanning diverse market sectors including Medical, Communications, Industrial, Military, Sciences and Security.

Formed in November 2002 following the management buy out of Siemens Manufacturing Services, with over 7,000 square metres of manufacturing floor space utilising State of the Art equipment, SMS have over 100 years of manufacturing history as both an Original Equipment Manufacturer (OEM) and Electronic Manufacturing Services (EMS) provider.

Having recently taken the number one slot in the Sunday Times HSBC International Track 100 as Britain’s fastest growing privately owned company when it comes to export sales as well as an inclusion in the Sunday Times Profit Track 100, it is clear there is demonstrable strong growth in the business. Further evidence of this is in the recent growth of the Product Services division of the company. ____________________________________

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number one slot in the sunday times HSBC International track 100

____________________________________ SMS Product Services was formed in October 2007 through the acquisition of seven business units from a Blue Chip Telecommunications company.

Manufacture and repair of electronic equipment has been in continual existence for over one hundred years at their Nottingham based facility. The SMS team of highly trained and experienced electronic engineers, supported by IPC A610 accredited repairs staff utilising state-of-the-art equipment, allows SMS Product Services to operate in many market sectors.

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Many companies struggle to justify the cost of a dedicated resource, especially when considering the expense of modern day test equipment and specialist engineers.

An increasing number of businesses are focusing their attention on core activities by outsourcing warranty and non-warranty work to SMS Product Services. SMS offer access to a highly trained and skilled workforce able to deliver fast and efficient product turnaround. Quality and cost effectiveness are inherent in all processes and service delivery.

equipment, control equipment, audio equipment, automotive electronics, video communications and PC’s.

SMS Product Services offers a full life-cycle solution for all electronic products. Product Services customers can be assured products will be managed from inception through to end of life. All processes are well established and designed to meet the most demanding requirements for flexibility and rapid turnaround and continual improvement of capabilities is embedded into the company ethos, to keep abreast with the constant changes in technology and manufacturing processes

Specialist Third Party Vendor Management

Services

SMS Product Services quality systems provide complete repair histories and traceability of all repaired items, a facility available to customers on request.

The Repair Centre provides high quality volume repair solutions and covering a wide variety of technologies and market sectors. In addition, SMS Product Services provides a single point of customer contact for all customer orders and enquiries, supported by a highly experienced team dedicated to delivering customer satisfaction.

Repair of complex electronic equipment SMS Product Services have considerable expertise in the repair of complex electronic equipment, working closely with both manufacturers and service suppliers.

We also provide high quality component level repair solutions for a wide variety of electronic equipment and assemblies, such as but not restricted to: PBX / PABX

System assembly and configuration SMS Product Services offer a product pre-delivery, configuration and test service. The service is offering is an endto-end solution from system component receipt and marshalling to system build, test and dispatch.

SMS customers can benefit from vast experience in managing multiple repair vendors, providing a single shipping address for all repair items and full traceability throughout the repair process thereafter.

Reporting and Performance Management

Warehousing, Logistics and Distribution A logistics team offers a dedicated support service for customers who need to store, distribute and deliver equipment anywhere in the UK. WEEE - Recovery, Waste Recycling Unit and Certified Disposal SMS Product Services recover, recycle and certify disposal of waste electrical and electronic equipment, in line with current WEEE regulations through all SMS recycling partners

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SMS Electronics Ltd SMS House, Technology Drive, Beeston Nottingham, United Kingdom NG9 1AD T 0044 115 943 1616 E sales@smselectronics.co.uk

building partnerships smselectronics.co.uk

OUR KEY MARKET SECTORS

medical

communications

industrial

military

sciences

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europe’s leading EMS provider with over 100 years of history

new products exciting new industry innovation Keeping you informed of the latest developments in technology and innovation within our global electronics industry.

Tannlin launch the new T11, the latest innovation in Laser Stencil Machines Following on their pedigree of laser innovation that developed the highly successful T range of Laser systems comes the all new T11. The T11 is the latest, highly integrated laser stencil cutting machine, incorporating a simultaneous inspection system to guarantee perfect laser cut apertures for the highest performance stencils in electronics assembly processing. ____________________________________

PROMATION Offers Safety Guard on G Soldering Robot Aqueous Technologies Debuts Zero Discharge Defluxing and Cleanliness Testing System The Trident XLD is the industry’s environmentally responsible fully automated defluxing and cleanliness testing system. The Trident XLD is capable of removing all flux types including noclean, rosin and water soluble. The Trident XLD is capable of operating with a variety of environmentally safe defluxing chemistries frequently required for specific types of flux removal. The Trident XLD provides automatic cleaning, cleanliness testing, drying, chemical dosing, complete assembly specific SPC via bar-code scanning, and operates without sending any water to the drain.

The Trident XLD is exceptionally fast, with an average total cycle time of less than 30 minutes. The system can clean one month’s worth of production while consuming less than ten gallons (38 litres) of water, all of which is lost to normal evaporation.

Hall A4, Booth 558

PROMATION Inc. announces the release of a wraparound safety guard for the company’s G Series soldering robot.

A Keyence light curtain is used to activate a safety net at the front of the work cell.

The robot control system integrates into the guard to activate and deactivate the light curtain for loading and unloading. ____________________________________

Techcon Systems Develops New High Output Series Nozzle Techcon Systems, a leading provider of precision fluid dispensing products, has designed a new High Output Series dispensing nozzle in an effort to continuously provide high-quality and high-performance products to meet new market and application demands. The new High Output Series nozzle has the same external dimensions and orifice size as the standard series nozzle; however, the internal material path is designed with minimal flow restriction to provide the highest material throughput possible.

JUKI release LED Mounter JX300LED, a specialized model with efficient function and performance for LED board production.

Today the demand of LED, used for lighting device or LCD display for television and computer, is significantly increasing for its energy saving and long-life characteristic.

JUKI already has Flexible Compact Mounter JX-100LED for LED productions, but this new JX-300LED has enlarged its PCB size capacity and improved the placement speed.

As a standard feature, JX-300LED is now capable for production of maximum 1200 mm PCB, to meet the high demand sized LED lighting device and middle/large sized LCD backlight. As an option, it will be able to produce maximum 1500mm sized PCB, the largest capability in the industry.

Additionally, high accurate placement of light diffuser lens, a production technology recently being widely used for LCD backlight production, is now possible by using our original laser sensor to identify the boss* on the lens to determine the correct direction. Through the improvements of PCB conveyance, the placement speed also has been significantly advanced.

Due to its improved board size capability and high-speed operation, JX-300LED is acquiring a great reputation in the growing market of LED board production and expanding its sales gradually.

Hall B, Stand 333 ____________________________________

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Say Hello T. +44 (0)1292 280 022 E. studio@bigbluedogdesign.com w. bigbluedogdesign.com

Providing expert marketing for the Electronics Industry +44 (0)1292 280 022

Take a look for yourself...

1. aessolutions.co.uk 2. smselectronics.co.uk 3. tannlin.com

2

3 1

Branding. Websites. Marketing.

new products continued...

Engineered Material Systems Introduces DF-3020 Antimony Free Dry Film Negative Photoresist Engineered Material Systems, Inc., a leading global supplier of negative photo resist materials for MEMs and IC cooling applications, is pleased to introduce the DF-3020 Dry Film Negative Photoresist for use in micro-electro-mechanical systems (MEMS). This material formulation has been optimized for hot roll lamination and processing on MEMS and IC wafers.

SEHO & IVT Industrial Vision Technologies Debut Automated Optical Inspection of THT Assemblies SEHO Systems GmbH, a worldwide leading manufacturer of automated soldering systems and customer-specific solutions, introduces an AOI system for optical inspection of THT assemblies that has been developed in cooperation with partner company IVT Industrial Vision Technologies GmbH.

DF-3020 is available for sampling in 20um thickness, ±1 μm and can be manufactured from 5 to 25 μm thick.

The cured chemistry can withstand harsh environments including resistance to extreme moisture conditions and corrosive chemicals. The DF-3020 film is tougher (less brittle) than most negative photoresists in the market with a glass transition temperature of 165°C (by DMA Tan Delta) and a moderate modulus of 4 GPa at 25°C. The cured chemistry is hydrophobic in nature, providing chemical and moisture resistance.

The SEHO ViproInline represents the speed and precise inspection of throughhole solder connections and can be flexibly integrated into a fully automated production line after the wave or selective soldering process for the detection of soldering and placement faults.

The ViproInline features a camera lighting unit that is designed for bottom-side inspection of through-hole assemblies.

Besides typical soldering and placement faults such as bridges, open solder joints, poor meniscus or missing pins, the unit also reliably detects solder balls and washed off neighboring SMD components.

The orthogonal sensor head allows fast and reliable analysis with its vertical viewing direction. Images are captured with a special 5 megapixel RGB area scan camera that ensures short picture acquisition time.

The multi-color LED lighting consists of centrically focused and diffused lighting from the side, thus assisting the position finding of the components and highlighting the attributes specific to solder joints. This concept ensures optimum conditions for testing and enhances the performance and testing speed remarkably.

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DF-3020 is compatible with and can be used in contact with the EMS line of spin coatable photoresists. DF-3020 is the latest addition to Engineered Materials Systems’ full line of film and liquid negative photo resists formulated for making microfluidic channels on MEMS devices and integrated circuits.

____________________________________

FCT Assembly Launches New Technology for Paste Printing FCT Assembly announces its new NanoSlic™ stencil. NanoSlic™ is the world’s most advanced stencil technology for solder paste printing.

The new NanoSlic™ stencil is based on the proven Slic™ stencil with its advanced foil composition and FCTA’s state-ofthe-art laser cutting process. Then, a permanent nano coating is applied that is based on a revolutionary chemistry platform called Hybrid-T Technology™.

The coating imparts a highly hydrophobic and oleophobic surface to the bottom of the stencil and aperture walls.

The robust coating should last the life of the stencil. The technology is comprised of a specifically engineered nano coating applied over its proven Slic™ stencil. The NanoSlic™ technology is surprisingly cost-effective, making improved yields available to all levels of the industry. The technology can be used with current assembly equipment and processes.

Using the newly developed NanoSlic™ coating system, NanoSlic™ is sprayed onto the stencil surface and aperture walls, reducing bridging and significantly improving paste release, permitting consistent printing of the smallest area ratios. ____________________________________

send us details of your new product developments and innovation We want to help you share your exciting new products with the world. Send us your images, detailed description, benefits and launch dates and we’ll do the rest...

send to lyianne@smttoday.com

| NOVEMBER 2013 ISSUE

Inspired Design Precision Engineered

Component Racking ESD Workbenches Kitting Trolley PCB Trolley Screen Rack Bespoke Solutions

Increasing Efficiency and Reducing Downtime We provide twenty first century manufacturing all under one roof to specialist engineering skills and capabilities throughout the PCB and Electronic industries. Our designing and manufacturing has made the company highly respected with a reputation for trustworthiness, competitive pricing and reliability.

Etek Technology Centre, Dow Road, Prestwick Aerospace Park, KA9 2TU, UK

World Wide Distributor

CALL +44(0)1292 834 000 sales@etek-europe.com

etek-europe.com

Industry News Keep up to date with what’s new Other than this months big news of SMT Today’s launch, there has as always been lots of innovation, product developments and changes in the industry.

More news available online at smttoday.com

Kyzen Adds Leading Representative to Expand its Coverage in North & South Carolina

BTU International Receives Seven Unit Order for the DYNAMO BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing and alternative energy markets, announces that it has been awarded seven unit order for its DYNAMO™ from a top Chinese consumer electronics manufacturer.

“The DYNAMO delivers unmatched process repeatability, which pairs perfectly with the needs of the consumer electronics manufacturer,” said Jim Griffin, vice president of sales and service at BTU International. “This combined with BTU’s reputation for quality and reliability has resulted in a very strong introduction for the DYNAMO,” added Griffin.

BTU International will be exhibiting at stand A3-134. ____________________________________

Kyzen announces that it appointed Circuit Technology Incorporated (CTI) as its representative throughout North and South Carolina effective immediately.

The company represents and supports Kyzen’s full line of cleaning chemistries, and support equipment and services.

Founded by Bob Doetzer in Raleigh, NC in 1994, CTI is a manufacturer’s representative group and IPC Master Training Center. The products represented by the company are used in electronics manufacturing and cover nearly every facet of circuit board production and repair, as well as IPC training. In 2008, Robbie Smith joined the company as a partner and now both Doetzer and Smith cover North and South Carolina, with more than 20 related lines including Speedline, Aqueous Technologies, AIM, Nordson DAGE, Nordson YESTECH and Juki.

“We are pleased to welcome Circuit Technology as the newest representatives to our worldwide representative network.

Their experience and knowledge in the SMT and semiconductor industries is second to none. We look forward to a lengthy and prosperous relationship by providing customers with complete solutions without compromising performance or integrity,” said Debbie Carboni, National Manager for Kyzen’s electronics division.

CTI will represent Kyzen’s full line of assembly, semiconductor, stencil, rework and maintenance cleaning chemistries for SMT and wafer applications throughout North and South Carolina.

Kyzen will be exhibiting at stand A4-416.

Pictured left: Circuit Technology Inc.’s Robbie Smith and Bob Doetzer

____________________________________

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Indium Corporation Features New, High-Reliability Solder Alloy SACM™ at Productronica

SACM™ is a high-reliability solder alloy that increases the drop-shock performance in portable electronics by 800%, without compromising on thermal cycling. SACM is doped with manganese and contains less silver than other Pb-free alloys. The manganese provides increased strength, and the reduced silver content provides a more stable cost structure, especially beneficial for cost-sensitive applications.

The platform consists of Indium8.9 Series solder pastes using Indium Corporation’s patent-pending SACM™ solder alloy technology for board-side interconnect, and SACM™ solder balls (spheres) for package-level interconnect.

Indium8.9HF halogen-free, Pb-free solder paste is one of the standard flux vehicles for SACM™. Indium8.9HF provides excellent soldering performance under high temperature and long reflow processes. It offers unprecedented stencil print transfer efficiency to work in the broadest range of processes.

Indium Corporation will be exhibiting at stand A4-402. ____________________________________

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Metcal Announces Global Rebranding

Metcal, a product group of OK International, announces that it has begun a global rebranding. The OKi brand that comprises soldering and desoldering, hand-held convection, fume extraction and fluid dispensing tools and equipment, will be unified globally under the Metcal brand name.

“The rebranding makes the Metcal product line even more accessible to a wider audience by carrying forward the value proposition created by the OKi brand, now leveraging the globally recognized Metcal name,” commented Gary Stoffer, Global Director of Sales and Marketing.

Tannlin launch Blueprint Tannlin UK Ltd, the industry leading expert in stencil production, system design and manufacture of Laser stencil machines for the electronics assembly industry are delighted to announce the launch of Blueprint, a dynamic online solution providing customers with total visibility, traceability and control of their projects.

With an ethos of continual innovation to provide both solutions and service to customers, Tannlin understand how critical it is to have control and traceability of the full process. Blueprint was developed to allow Tannlin to efficiently manage order entry, production scheduling and manufacturing processes.

Grown from an in-house application to an on-line platform the system enables Tannlin to work closer and more effectively with customers.

____________________________________ Contact Tannlin for a test drive of Blueprint at info@tannlin.com ____________________________________

Ersa CAD Assistant 3D Is Now Available

BPM Microsystems announce support for the iCE40 family of FPGAs from Lattice Semiconductor Corporation (NASDAQ: LSCC). The iCE40 FPGA family is supported on BPM Microsystems’ 7th and 8th Generation platforms.

Nordson DAGE, a division of Nordson Corporation, and ETEK Europe Limited announce a strategic partnership for the distribution of Nordson DAGE marketleading X-ray systems in the UK. “We have worked with ETEK for several years in parts of Eastern Europe and their success in this region made them the obvious choice”, said Keith Bryant, Sales and Marketing Director, Nordson Inspection Products.

Metcal will be exhibiting at stand A4-221.

BPM Microsystems Now Supports Lattice’s iCE40 Family of FPGAs

Nordson DAGE and ETEK Europe Form a Strategic Alliance for the Distribution of X-ray systems in the UK

Kurtz Ersa North America, a leading supplier of electronics production equipment, has released a breakthrough in solder program editing. The Ersa CAD Assistant 3D provides offline program generation while the machine is in operation. Simultaneously, the software offers comfortable ways to quickly and easily get to the desired solder program.

“Lattice programmable solutions are important to our customers,” said Colin Harper, director of sales and marketing at BPM Microsystems. “We support thousands of Lattice programmable devices for customers around the world. It really made sense for BPM Microsystems to provide a solution for the iCE40 family as well.”

Ersa’s solder program editor is built according to specific equipment configurations and clearly displays the data set for the CNC axis systems in a table. A plausibility check prevents errors from occurring during program creation.

Both CAD files of PCBs (.dxf and .step) and image files (.jpg and .bmp) can be used as basis in the program generation with CAD Assistant 3D.

____________________________________

____________________________________

“With a huge demonstration and conference facility in the UK, ETEK are the ideal choice of Technology Partner to grow our business in this region. They have a long history of superb customer relationships with all of the major UK companies and also the SME’s. Already they have four fully Nordson DAGE trained X-ray engineers and a very strong sales and support team. Both parties are very excited about the opportunities and as the UK market is picking up it is an ideal time to start this partnership.”

Mike Nelson, Managing Director of ETEK Europe Limited, commented “The ETEK team is very honoured to add Nordson DAGE X-ray systems to our UK portfolio.

We have worked with Nordson DAGE for many years and have sold and supported many systems.

ETEK will have a range of Nordson DAGE X-ray systems in our Technology Centre, which will allow us to offer customers a great chance to inspect and evaluate these superior systems first hand.”

Nordson Dage will be exhibiting at stand A2-438. ____________________________________

Staying competitive in today’s SMT assembly marketplace by chris herd, evolvi smt When it comes to sourcing and buying SMT equipment you need to know what your buying is going to last and stand the test of time.

In the current economic restraints of banks lending on equipment and assets, sometimes second user equipment is the answer.

If budgets are not available for new equipment, or if older equipment will not last until capital can be approved in next years budget, second user equipment can be the answer. ____________________________________

‘‘

second user equipment can compliment the purchase of new

____________________________________ As new technologies and miniaturisation drives some customers to replace older equipment, sometimes second user can compliment the purchase of new. This helps manufacturers have capable and fast machines to build the latest challenging technology.

In most manufacturing processes, high quality equipment purchased in the past three to four years will be capable of around 65-70% speed and complexity of the latest systems. ____________________________________

‘‘

larger OEMs and CEMs, can transfer large quantities of equipment within their Global network of manufacturing factories

____________________________________ Nowadays most companies are depreciating their capital assets over five to seven years, sometimes business requirements change and subsequently they may be left with excess equipment.

Putting this equipment to the second user market is one option to dispose of it.

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For some of the larger OEMs and CEMs, they can transfer large quantities of equipment within their Global network of manufacturing factories. Smaller and mid size customer may need help to dispose or purchase alternative equipment.

With over 20 years industry experience and the last five working solely within the Second User Equipment supplier sector, I am delighted to have been recently appointed general manager at Evolvi SMT. ____________________________________

‘‘

Evolvi bring to market a unique business model, created directly from customer feedback ____________________________________

Evolvi bring to market a unique business model, created directly from customer feedback on what is required from a second user equipment supplier in today’s environment.

Providing various equipment solutions to customers based on their limitation whether it’s footprint, budget or specific equipment manufacturer needs. This

allows the customer to choose the solution that best meets their requirements.

Our many years of experience in buying, selling and installing all major brands of used SMT equipment, from single machines to entire factories, plus our long list of satisfied customers, is your assurance of receiving complete satisfaction when you do business with us.

We understand that not all equipment is purchased on price alone. The added value of what a supplier offers to its customers is as important. Our aim is not only offering the customer with equipment, matching their requirements but to excel in providing the on going continual customer care and offering outstanding service agreements, capped off by our warranty.

Herd explains: “One of the largest concerns that customers have regarding the purchase of used equipment, is the level of support they require and expect. Evolvi is proud to offer first class service by some of the best-trained and qualified service engineers within Europe. Our Engineering Team have many years experience working with various manufactures and models across the full range of all SMT equipment types. Offering all aspects of support from installation, training, breakdown support and maintenance, our returning customers are testament to the outstanding support provided by Evolvi.”

Evolvi are continually identifying equipment suitable for our customers throughout the world. We will source the best options available from our Global Network - all with a comprehensive warranty, guaranteeing you maximum ROI. In summary, I certainly believe there to be a strong case for used SMT Equipment and it’s clearly visible that if purchased wisely, it will add real value to the bottom line Evolvi will be exhibiting at stand A3-233.

| NOVEMBER 2013 ISSUE

time to take a new look at used Staying competitive in today’s SMT assembly marketplace means managing costs and getting the best value for your equipment investment.

Evolvi provide, warranty backed, quality Used SMT Equipment at affordable prices, delivered anywhere in the world.

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Understencil Wipe Cleaning Yields Improvements

By Mike Bixenman, D.B.A., Kyzen, Nashville Understencil wiping has gained growing interest over the last several years. Due to the use of ever smaller components and increasingly dense interconnections in the design of printed-circuit boards (PCBs), stencil cleanliness is more important than ever, both inside the aperture wall and on the seating surface of the stencil.

In most stencil printing processes, dry wiping the stencil’s bottom side has been followed by vacuum assist in an effort to remove excess solder paste from the aperture walls. As stencil apertures shrink in size, more frequent wiping is needed to assure that stencils are free of excess solder paste that can hamper their process performance.

Two technology approaches are being applied with greater frequency to improve print performance and better understand the behavior of flux-stencil interactions.

The first of these is a nanoscale fluxrepellent coating (for more details, see “Surface Modulation Technology,” Aculon, www.aculon.com). The coating is used balls from stencil’s bottom side and aperture walls. ____________________________________

The use of ‘‘ nanocoating was

found to reduce the flux buildup on the bottom side of a stencil

____________________________________ As the PCB and stencil separate, the flux releases more easily from a nanocoated than an untreated stencil. The repellent treatment prevents the flux from wicking out around the aperture edges. Preventing flux from wicking on the stencil’s bottom side also prevents solder paste particles from wicking onto it too, thereby improving the gasketing between the stencil and the PCB. Earlier this year, Shea Engineering Services and Vicor studied the effects of Aculon NanoClear nanocoating on flux flow.

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The use of nanocoating was found to reduce the flux buildup on the bottom side of a stencil. In this case, the flux was tightly aligned with the apertures. When no wipe was used on a stencil without nanocoating, the flux spread away from the apertures. The nanocoating provides repellency action, keeping the bottom side of the stencil cleaner after repeated prints without underwiping. When a dry wipe is performed after 10 prints, the repellency action is even more obvious. When a dry/ vacuum/dry cycle has been applied to the bottom side of a nanocoated stencil, the wipe removes excess flux, but has left some smears behind. On the stencil without nanocoating, a heavier residual buildup occurs around the apertures with a thicker film of flux spread across the entire bottom surface of the stencil.

Automatic Wiping Automatic solvent wiping was not an option during this test, so hand wipes with solvents were followed by a dry/ vacuum/dry wipe cycle on the printer.

The nanocoating enabled much better cleaning with the mimicked solvent wipe.

For those considering the best approach to an understencil wipe, many factors impact wipe frequency requirements. In general, miniature, high-density designs require more frequent wipes because they present more opportunity for errant paste to remain in the stencil’s apertures or to stick to the stencil’s bottom surface after separation. Wipe frequencies can range from every print on a highly miniaturized product to every 10 to 20 prints on a lowdensity design. Wipe frequencies also depend on many wipe process variables: dry, solvent-based, vacuum, wiper-type, paper/fabric-type and advance rate, wiper speed, and wipe sequence.

Joint Study Performed Earlier this year, Kyzen and Indium Corporation also performed a study to characterize the relationship between wipe processes and bottom side stencil flux/paste flow. A highly dense PCB and a stencil with nanocoating were used to study the effects of the understencil wiping process. After each print, the stencil was removed from the stencil printer. The apertures were examined to inspect buildup in both the apertures and bottom side of the stencil. Some trace solder balls were found following the first print, with a buildup on the bottom side of the stencil after additional prints. As expected, solder flux combined with solder balls increases with additional prints. A risk is that flux and stray solder balls can be deposited next to the stencil aperture on subsequent prints and get transferred to the PCB. Also, small apertures become clogged at a faster rate.

In the dry wipe studies, there appeared to be streaking on the bottom side of the stencil. On closer examination, the flux vehicle tended to become wiped over the bottom side of the stencil. This effect correlates with what Shea Engineering and Vicor saw from their research. Increasing the numbers of prints increased the level of flux spread on the bottom side of the stencil. As the board being printed is sandwiched to the stencil, there is a risk that the errant flux can be deposited onto the surface of the board. There may or may not be a reliability risk.

Isopropyl alcohol (IPA) is the common solvent choice when a wet wipe is used.

Historically, the choice of IPA made sense as most solder flux formulations were based on IPA. However, solder paste manufacturers are moving away from IPA-based fluxes for several reasons, the most notable of which is higher soldering

| NOVEMBER 2013 ISSUE

temperature alloys. IPA is a flammable solvent with a flash point (the minimum temperature required for a substance to produce flammable vapors) of +12°C (54°F), which can be a risk factor.

Flammability Considerations In addition to the flammability considerations, IPA is also becoming an inefficient solvent for modern solder pastes. When natural rosins were the primary constituents of solder paste flux, IPA was an excellent choice of solvent.

Because rosin is highly soluble in IPA, the IPA readily evaporated, and the IPA was extremely affordable. Current fluxes, however, especially no-clean formulations, contain materials not as soluble in IPA as rosin, and require more specialized solvents. The solder paste used for the Kyzen-Indium research was a leadfree, no-clean formulation. Following the IPA/dry wipe action, the bottom side of the stencil was dry and mostly clean.

Similar to the dry wipe, there appears to be flux streaks over the bottom side of the stencil. There also appears to be flux streaks on the bottom side of the stencil in the third sequence of the IPA/dry/ vacuum sequence. ____________________________________

Increasing the ‘‘ numbers of prints

increased the level of flux spread on the bottom side of the stencil

____________________________________ As part of the studies, a solvent-based stencil cleaning agent effective at cleaning no-clean, rosin-based, wet solder pastes was evaluated. The engineered cleaning agent works upon the flux resin components within the wet solder pastes.

The engineered solvent composition cleans and removes solder paste that tends to adhere to the aperture walls and bottom of the stencil. Using this solvent helped maintain the bottom-side of the stencil free of flux stains. Unlike IPA, this solvent is formulated within the combustible range.

Due to its lower vapor pressure, it dries somewhat slower than IPA. Following the dry + vacuum wipe process, the bottom side of the stencil was dry, but for slower evaporating solvents, a second dry wipe may be a good practice.

The last solvent studied was a solvent-water azeotrope engineered composition, with uniform evaporate rate, nonflammability, and low-VOC

content. The potential risk of using this type of wipe solvent is its effectiveness at removing noclean flux resins and drying effectiveness following the wipesequence.

When used in the wipe/dry/vac process, it did not appear to clean the no-clean flux vehicle as well as the engineered solvent wipe. Of greater concern was a light film of the solventwater azeotrope on the bottom side of the stencil after the wipe sequence.

Using an engineered cleaning agent to wipe the bottom side of the stencil presents some risk. Chemically assisted wiping can contaminate the solder paste.

To mitigate this risk, understencil wipe cleaning solvent must both clean and readily dry from subsequent dry wipe and vacuum processes.

Desirable properties of an understencil cleaning agent include (1) the capability to rapidly dissolve the solder paste flux vehicle; (2) material compatibility with the nanocoating and equipment; (3) being nonflammable; (4) having low odor; and (5) having sufficient volatility to rapidly evaporate and dry post cleaning. Deficiencies in any of these properties can reduce process repeatability and reproducibility.

Two new, separate engineering studies, researched the behavior of flux and solder paste flow and removal. Both visualized the flux behavior on the bottom of the stencil. One characterized the effects of nanocoating treatments; the other characterized the effects of underwipe process variables. Research by Vicor and Shea Engineering Services found that a nanocoated stencil produced better print quality than an uncoated stencil. Less flux was found to bleed out onto the bottom side of the stencil, and print definition was improved. The results were presented at the recent SMTA International conference and the complete study will be published at APEX International in March 2014 (for

For a stencil without nanocoating, the flux spread away from the apertures.

more details, see C. Shea and Whittier, “Evaluation of Stencil Foil Materials,” Supplier and Coating, SMTAI, 2012). ____________________________________

Solvent-aqueous ‘‘ understencil wipe

solvents appeared to clean well but were slower to dry

____________________________________ Research by Indium and Kyzen revealed that recent understencil wipe solvents worked well with the flux compositions of lead-free solder pastes, and removed fluxes more effectively than IPA. Engineered understencil wipe solvents removed the flux stains and left a dry surface following the wipe sequence. Solvent-aqueous understencil wipe solvents appeared to clean well but were slower to dry, and may require additional dry wipe and vacuum steps to ensure complete removal.

This study will be published at SMTAsponsored technical sessions during 2013 and 2014

Nanocoating helped to reduce the flux buildup on the bottom side of a stencil.

red carpet out & about in the industry A chance to look back at some highlights of 2013, award winners and our industry movers and shakers. Time to take a bow...

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Nihon Superior President, Tetsuro Nishimura, received an appreciation award for sponsoring the FIRST® Robotics Competition at SMTAI.

Keith Bryant of Nordson DAGE accepted the 2013 SMT China Vision Award in the category of AOI Inspection & Testing - AXI for its Jade FP X-ray Inspection System.

Guests enjoy a professional Whisky Tasting Experience at the latest Technology Day at Etek Europe’s Head Office in Scotland.

Earlier in 2013, Viscom was awarded a 2013 NPI Award in the category of Software – Process Control for its SPI-AOI Uplink function.

During NEPCON China 2013, BTU International, Inc.’s DYNAMO was named ‘The Best Emerging Exhibit of the Year.

ViTrox Technologies achieve another Award for Its V810 X-Ray Inspection System during NEPCON China - EM Asia Innovation Award.

| NOVEMBER 2013 ISSUE

what’s happening in your business? send your event pictures to red@smttoday.com

David Raby, President and CEO of STI Electronics Inc., accepted the SMTA Corporate Award on behalf of his company.

BOFA won the PPMA Group Industry award for Outstanding Sales/Company Growth. Accepted by Tony Lockwood, Sales & Marketing Director at BOFA.

Jettie Fross joined NCAB Group as its newest sales person. She will handle key accounts in California.

Production Manager at ACD, was promoted to Director of Manufacturing Operations.

MP Anna Soubry presents the AS9100 Quality Management Certification to Mark Goldby, Managing Director of SMS Electronics.

Juki Automation Systems awarded Circuit Technology, Inc. (CTI) Representative of the Year 2013 – Best Performance and Best Selective Solder Sales 2013.

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