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Research & Reviews Journal of Embedded System & Applications September–December 2016
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Research & Reviews: Journal of Embedded System & Applications ISSN: 2395-6712(online), ISSN: 2321-8533(print)
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It is my privilege to present the print version of the [Volume 4 Issue 3] of Journal of Research & Reviews:A Journal of Embedded System & Applications, 2016.The intension of RRJoESA is to create an atmosphere that stimulates vision, research and growth in the area of Embedded System & Applications. Timely publication, honest communication, comprehensive editing and trust with authors and readers have been the hallmark of our journals. STM Journals provide a platform for scholarly research articles to be published in journals of international standards. STM journals strive to publish quality paper in record time, making it a leader in service and business offerings. The aim and scope of STM Journals is to provide an academic medium and an important reference for the advancement and dissemination of research results that support high level learning, teaching and research in all the Science, Technology and Medical domains. Finally, I express my sincere gratitude to our Editorial/ Reviewer board, Authors and publication team for their continued support and invaluable contributions and suggestions in the form of authoring writeups/reviewing and providing constructive comments for the advancement of the journals. With regards to their due continuous support and co-operation, we have been able to publish quality Research/Reviews findings for our customers base. I hope you will enjoy reading this issue and we welcome your feedback on any aspect of the Journal.
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Research & Reviews: Journal of Embedded System & Applications
Contents
1. Automatic Farming using Soil Moisture Sensor and PIC Microcontroller Akshay Saini, Saket Kumar, Gautam Chutani
1
2. Performance and Degradation Analysis of Poly-Crystalline PV Modules Installed in Tropical Conditions P. Greeshma, N. Ramchander
5
3. Wireless Charging of Electric Vehicles S.Priya
11
4. A Review on Minimization of Makespan of Flow Shop Scheduling Problem Anand N. Barai, Manhar S. Kagthara
16
5. A Review on Project Information System for Improving Efficiency of Project Development Cycle Sagar S. Mehta, Prasad S. Puranik, Satish B. Sharma
22
6. Design and Development of Metallic Isolators for Wedge Lock Mounted Printed Circuit Boards (PCBs) P. Anil Kumar, P. Bangaru Babu
27
Research & Reviews: A Journal of Embedded System & Applications ISSN: 2395-6712(online), ISSN: 2321-8533(print) Volume 4, Issue 3 www.stmjournals.com
Automatic Farming using Soil Moisture Sensor and PIC Microcontroller Akshay Saini, Saket Kumar, Gautam Chutani Department of Computer Science Engineering, Dronacharya College of Engineering, Farrukhnagar, Gurgaon, Haryana, India
Abstract Water must be properly utilized as it is a very precious resource. Agriculture is one of those areas which consume a lot of water. Irrigation is a time consuming process and must be done on a timely basis. Our objective is to develop an auto-irrigation system which measures the moisture of the soil and automatically turns on or off the water supply system. Once installed this project requires very less human involvement. The circuit is based on PIC microcontroller and also a soil moisture sensor. Up to 60 percent of water used in irrigation can be saved using proper configured soil moisture sensor. The designed system can be used in turf grass or with small garden plants. Keywords: Auto-irrigation, moisture sensor, water pump, PIC microcontroller
INTRODUCTION The automatic irrigation system of this system uses soil moisture sensor to detect the moisture level and 44 keypad for various crops control. When the moisture content of the soil is reduced then the sensor sends detected value to the microcontroller. Then the water pump is automatically ON according to the moisture level. The main aim of this paper is to reduce the human intervention for farmers and use solar energy for irrigation purpose. The entire system controlled by the PIC microcontroller. The proper methodology is to be enforced for the irrigation system owing to lack of rain and insufficiency of water in soil. Agricultural field continuously desires and depends on the water level of the soil. Planned irrigation system ought to be followed to avoid the matter of decrease in wetness level of soil by continuous extraction of water from soil. And improper use of water ends up in wastage of great quantity of water. For this purpose, automatic plant irrigation system is meant victimization wetness device and alternative energy. The planned system derives power from daylight through photovoltaic cells. Hence, the system cannot rely upon the electricity. During this planned model by exploitation daylight energy, power
the irrigation pump. The circuit includes of soil wetness detector square measure inserted within the soil to sense whether or not the soil is wet or dry. A PIC microcontroller is employed to manage the full system. Once the wetness level of the soil is low then the detector detects the soil condition and offers condition to the relay unit connected to the switch of the motor. It'll ON in dry condition and throw the motor once the soil is in wet condition. The wetness level of the soil is detected by the detector inserted into the soil which provides signal to the microcontroller whether or not the land wants water or not. The signal from the detector received through the output of the comparator and it's preceded with instruction from the program keep within the microcontroller. Once the soil is dry motor ON and in wet condition motor is OFF. This condition of motor ON and OFF is displayed on a 162 liquid crystal display. A PV cell solar cell may be a system converts light-weight energy into electricity. Solar cell is otherwise called “solar cells”. This is often utilized in straightforward and complex application. The only system of
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Research & Reviews: A Journal of Embedded System & Applications ISSN: 2395-6712(online), ISSN: 2321-8533(print) Volume 4, Issue 3 www.stmjournals.com
Performance and Degradation Analysis of PolyCrystalline PV Modules Installed in Tropical Conditions P. Greeshma*, N. Ramchander Department of Electrical and Electronics Engineering, B.V. Raju Institute of Technology, Narsapur, Telangana, India Abstract In this paper, practical field performance of poly-crystalline solar photovoltaic (PV) modules, which were installed at rooftop of the department of electrical engineering BVRIT, has been studied and the correlation between efficiency, temperature and degradation rate of modules as per STC conditions has been presented. The nominal output power of the PV module considered for the study is 240 Wp and the panel is compressed of 60 cells in a 10×6 matrix connected in series. After few operation years under tropical environment, the degradation rate of electrical characteristics such as I-V and P-V curves, open-circuit voltage (Voc), shortcircuit current (Isc), maximum output current (Imax), maximum output voltage (Vmax), maximum power output (Pmax) and fill factor (FF) are evaluated at standard test conditions (STC). Through this study, it has been noticed that the efficiency of solar panel is linearly inversely proportional to temperature and degradation rate in a linear fashion. Keywords: Open-circuit voltage, short-circuit current, maximum output voltage, maximum power output, fill factor, efficiency, degradation rate
INTRODUCTION Practical field study of performances of three identical monocrystalline solar modules, single power of 60 W, with different inclinations (horizontal, optimally inclined oriented toward South and vertically oriented toward South) in real meteorological conditions, in Nis, Serbia are presented. The efficiency, performance ratio and fill factors are measured and compared [1]. Two identical BP-SX320 panels with polycrystalline silicon cells with nominal output power of 20 W, and each of the panels is comprised of 36 cells in a 49 matrix connected in series. The efficiency of the solar panel is inversely proportional to temperature in a linear fashion and the decrease rate of efficiency per temperature increase is determined as 0.0024 (%/°C) [2]. The effects of temperature and radiation intensity on the parameters of a copper indium diselenide (CIS) photovoltaic module have been studied. An outdoor experimental setup is
installed to carry out a series of I-V curve measurements under different irradiance and temperature conditions for the module [3]. NREL study suggests that a more reasonable thumb of rule will be degradation less than 0.5% per year. The quality of module is of immense importance. It is safe to assume no degradation for the first three years and then a maximum of 0.5% per year over the life of modules [4]. In this paper, the performance of a single polycrystalline PV module is studied under outdoor (tropical condition) installation. The performance parameters include the efficiency and degradation rate of module. Here, the study period is considered from April 2013 to June 2015. By considering open circuit voltage (Voc), short circuit current (Isc), solar irradiance and module temperature, the degradation rate of polycrystalline module is calculated. The irradiance is measured using the pyranometer.
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Research & Reviews: A Journal of Embedded System & Applications ISSN: 2395-6712(online), ISSN: 2321-8533(print) Volume 4, Issue 3 www.stmjournals.com
Wireless Charging of Electric Vehicles S. Priya* Department of Electrical and Electronics Engineering, Jeppiaar Institute of Technology, Chennai, Tamil Nadu, India Abstract The embedded technology plays a vital role in present world of electronics Applications. Embedded system is a computer system, made from a combination of hardware and software that is used to perform a specific task. This paper aims to reduce the manpower, less operating time & more efficient without the use of man power. This paper puts forth the first step in achieving the desired target. With the advent in technology, the existing systems are developed to have in built intelligence. Using WPT (Wireless Power Transfer) we can charge a battery employed in the vehicle up to 12 V, at a distance of 5–10 cm distance between the transmitter and the receiver. This is a very prospective technology which can soon replace diesel run vehicles. Keywords: Electric vehicle, wireless power transfer, microcontroller
*Author for Correspondence E-mail: priyas@jeppiaarinstitute.org
INTRODUCTION
BLOCK DIAGRAM
The mere development of the Plug-in electric vehicle brought about a sudden revolution in the world of transport. Applying electricity replacing the diesel power can revolutionize the transport and energy utilisation. Plugged in vehicles involve manual interruption and so replacing it by wireless charging can bring about a great automation in the field of transport and recharging vehicles [1]. We use stationary wireless charging employing primary side power flow controller using PIC microcontroller for controlling the communication part. We employ inductive coupling for implementing the wireless charging [2]. In the proposed system, we are using PIC microcontroller which is interfaced with 2-axis robot and LCD. Here, we use wireless transmitter which is used to transfer the supply from one node to another node as shown in Figure 1. In the vehicle section, the receiver module will be present. When the communication should happen between transmitter and receiver led will be indicating the battery charging. These transfer distance may be 5 to 10 cm, because of coil cost may high. Also Vehicle control through keys. We can monitor the status on the LCD [3-4]. It is shown in Figure 2.
Power Supply
Wireless Transmitter
Fig. 1: Bus STOP Section.
Fig. 2: Vehicle Section. Power Supply Unit The supply of 5V DC is given to the system which is converted from 230V AC supply. Firstly, the step down transformer will be used here for converting the 230V AC into 12V AC. The microcontroller will support only the DC supply, so the AC supply will be converted into DC using the bridge rectifier. The output of the rectifier will have ripples so we are using the 2200uf capacitor for filtering those ripples. The output from the filter is
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Research & Reviews: A Journal of Embedded System & Applications ISSN: 2395-6712(online), ISSN: 2321-8533(print) Volume 4, Issue 3 www.stmjournals.com
A Review on Minimization of Makespan of Flow Shop Scheduling Problem Anand N. Barai*, Manhar S. Kagthara Department of Mechanical Engineering, Atmiya Institute of Technology and Science, Rajkot, Gujarat, India Abstract When in real world, a large number of jobs and machines are taken into consideration, at that time the proper scheduling plays a vital role. Most of the industries are facing problems regarding proper scheduling. In this review paper, there are different techniques suggested for minimization of makespan for flow shop scheduling problem. Makespan is the total length of the scheduling when all jobs are done. Dispatching rule is better approach to solve the flow shop scheduling problem. Keywords: Scheduling, flow shop scheduling, Gantt chart, makespan
INTRODUCTION Nowadays, most of industries are facing problems related to scheduling. Scheduling is a term used in our day to day life; although we may not always have a good definition of the term in our mind. A schedule is a tangible plan or document such as bus schedule, production schedule, class schedule etc. Schedule shows us a plan for the timing of certain activities and answers the question, “If all goes well, when will a particular event take place?” [1]. Scheduling is a decision-making process that concerns the allocation of limited resources to a set of tasks with the view of optimizing one or more objectives (Figure 1). In today’s world of global competition, effective scheduling has
become vital in order to meet customer requirements as promptly as possible while maximizing the profits. Hence, it plays an important role in most manufacturing and production system as well as in most information processing environments [1]. The purposes of scheduling are to maximize the efficiency of the operation, minimize the production time and reduce the costs. Suppose that, there are “m” number of machines Mj (j=1, 2, 3…, m) which have to process n jobs Ji (i=1, 2, 3…, n). A schedule is for each job an allocation of one or more time interval to one or more machines. Schedules may be represented by Gantt chart as shown in Figure 2. Gantt charts may be machine oriented or job oriented.
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Research & Reviews: A Journal of Embedded System & Applications ISSN: 2395-6712(online), ISSN: 2321-8533(print) Volume 4, Issue 3 www.stmjournals.com
A Review on Project Information System for Improving Efficiency of Project Development Cycle Sagar S. Mehta1,*, Prasad S. Puranik1, Satish B. Sharma2 1
Department of Mechanical Engineering, Atmiya Institute of Technology and Science, Rajkot, Gujarat, India 2 Sci/Engr SD’, Space Application Centre, Indian Space Research Organization, Ahmedabad, Gujarat, India
Abstract Project information system (PIS) is commonly viewed as a consequential implement for project management. Project management is characterized as an effort that results from the utilization of knowledge, skills, tools and techniques applied to set project activities in order to meet project objectives. Their main purpose is to manage different projects throughout their life cycle. The system supports, all the application processes for incentive programs as well as the documentation and procedures required, and avails to manage the project itself when it is approved. Project information systems (PIS) are software applications that avail managers to track projects from their conception to their execution. They provide them with pertinent information and collaborative implements. Keywords: Project information system, project development life cycle
INTRODUCTION In particular, industries share a common tendency to issue hard copy documentation for recording purposes. This makes communication and coordination even more complicated and burdensome due to the necessity of completing whole cycles of amendments, revisions, confirmations and acknowledgments (Alshawi and Ingirige, 2003). Attention is therefore shifting towards the need to manage the flow of activities throughout the whole life cycle and, in particular, those that actually add value (Alshawi and Ingirige, 2003).
In particular, PIS can help practitioners to detect latent issues before they occur, meet deadlines, and collaborate more easily and at a greater extent. A good number of project managers use PIS, but most of them are yet unaware of the potential benefits they could bring in. This is mainly due to a lack of an understanding of what such software really is and how it can influence projects from their conception to their completion (Archibald, 1992). The present work presents an integrated solution that tries to give answers to most of the above mentioned issues within inter-
organizational processes or, in other words, the extended enterprise (Dyer, 2000). The potential gain in efficiency can lead to consequential cost savings. In brief, PIS are proposed to help administrators, managers and specialists in defining, characterizing and finishing projects, reverencing deadlines and, last but not least, collaborating. They also keep involved people apprised, assuring that they know what the others are doing at any given time and allowing appropriate countermeasures in the case of failures or delays.
This lets project managers effectively delegate tasks, monitor progress and assess the overall risk. Conclusively, they avail managers create working profiles and work-packages to assign the right task to the right person by denotes of an effective resource management. A salient aspect in this context regards the data management feature. At present, most firms use different tools, such as spreadsheets and paper based data collection, which are certainly not intended for dealing with the advancement of complex tasks.
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Design and Development of Metallic Isolators for Wedge Lock Mounted Printed Circuit Boards (PCBs) P. Anil Kumar1,*, P. Bangaru Babu2 1
Department of Mechanical Engineering, SDAT Division, Directorate of ENTEST, Research Centre Imarat, Defense Research Development Organization, Hyderabad, Telangana, India 2 Department of Mechanical Engineering, National Institute of Technology, Warangal, Telangana, India
Abstract Wedge lock interfaces are preferred for mounting printed circuit boards (PCBs) in electronic packages of air borne vehicles. Merits of this particular mounting configuration are high mounting stiffness, high vibration dissipation and low thermal interface resistance. However, good amount of vibration dissipation occurs only in the close vicinity of wedge locks provided integral to PCBs; because of which electronic components can be mounted only near the wedge locks on PCB. This practical constraint doesn’t allow the electronics designer to aim for high population density of electronic components over PCB. To overcome this limitation, a metallic isolator is designed, developed and experimentally evaluated in random vibration environment. Proposed metallic isolator is configured such that it replaces existing wedge locks one to one without seeking for additional space. Further, this isolator ensures vibration levels within limits everywhere on PCB. With this isolator, designer can use almost entire space on PCB effectively for populating electronic components. Keywords: Electronic packaging, finite element analysis of chassis, chassis boundary conditions
INTRODUCTION It is proposed to design a metallic isolator for electronic package consisting of PCBs mounted in wedge lock configuration which is experiencing vibration response higher than qualification limit as shown in Figure 1.
For better understanding, PCB with components along with wedge lock are shown in Figure 2. Wedge lock is preferred for mounting PCBs because it provides more damping in vibration. From the measured vibration levels at different locations on PCB during test, it is observed that vibration levels are within the allowable limits (i.e. <30 gm) only, in the vicinity of wedge locks on PCB due to the damping provided by wedge locks (Safe). But away from wedge locks, vibration levels are observed to be high on PCB (Unsafe).
Fig. 1: Package with PCB Mounted in Wedge Lock Configuration.
Hence, very little space only is permitted for mounting components on a wedge lock mounted PCB which is not in favour of the designer. Ideal choice for the designer would be utilization of entire space on PCB for mounting components which seeks for some modification that result into complete safe zone on PCB.
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