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INDIUM
Why do most EVs use Indium Corporation materials?
There are currently over two million electric vehicles on the road with Indium Corporation’s Rel-ion™ suite of products. So, why do most EVs use Indium Corporation materials? Rel-ion™ products are engineered to meet three very important criteria. First—they’re reliable. They are designed to meet the higher quality standards that meet the evolving demands of automotive electrification. Second—they’re scalable. They are readily available and capable of meeting supply chain expectations. Finally—they’re proven. Most Rel-ion™ products have more than a decade of running inside of EVs.
Rel-ion™ materials solutions also deliver reliability for its customers by addressing electrical, mechanical, and thermal stresses that can negatively impact the performance of the final product. Rel-ion™ materials effectively eliminate or reduce common solder paste defects such as dendritic growth, voiding, head-inpillow defects, and cracking.
Electrical
Dendrites and Corrosion – Meets stricter surface insulation resistance (SIR) with rework solutions to pass SIR unheated Leakage Current – Contains low Alpha particle solution for >650-volt GaN dies
Electrical Continuity – Eliminates non-wet opens and head-in-pillow defects
Mechanical
Solder Delamination – Provides precision bondline control, increased creep resistance, and increased fatigue resistance
Thermal
Longer Mission Profiles – Shows increased operating temperatures and longer thermal and power cycles
Hot Spots – Reduces voiding, increases CPU/GPU thermal requirements, and provides materials for power modules, IGBT, and DSC modules
ADAS Autopilot Battery Cells Battery Management Systems DC-DC Converters DC Fast Charging (DCFC) Energy Storage
Rel-ion™ materials deliver reliability to EV modules, components, and systems, such as:
IGBT Infotainment Inverters On-Board Battery Chargers Power MOSFET Telematics (tcu)
InSIDER Series
Driving e-Mobility: Rel-ion Technical Webinars
Advanced Automotive Electronics Assemblies/The Requirements for InSIDER Series Electrical Reliability in Automotive Applications Increasing – Presented by Andreas Karch (Now Available On-Demand) Voiding Mechanisms & Solutions For High Density Automotive Electronics – Presented by Dave Sbiroli(Now Available On-Demand) Building More Reliable Assemblies for Higher Mission Profiles – Presented by Karthik Vijay (June 28th) Design Considerations for Board Layout & Material Selection – Co-presented by Jonas Sjoberg and Ângelo Marques (September 21st) Advanced Best Practices For SMT Assembly & Root Cause Analysis – Presented by Dave Sbiroli (October 12th) Automotive Electronics Assemblies Advanced Automotive Electronics Assemblies for e-Mobility for e-Mobility © INDIUM CORPORATION
Advanced Automotive Electronics Assemblies/The Requirements for Electrical Reliability in Automotive Applications Increasing Andreas Karch (Now Available On Voiding Mechanisms & Solutions For High Density Automotive Electronics (Now Available On-Demand
Advanced Automotive Building More Reliable Assemblies for Higher Electronics Mission Profiles –Assemblies for e-Mobility Design Considerations for Board Layout & Material Selection – Co-presented by
Marques (September 21
© INDIUM CORPORATION
Best Practices For SMT Assembly & Root Cause
Analysis – Presented by
Advanced Automotive Electronics Assemblies/The Requirements for Electrical Reliability in Automotive Applications Increasing Andreas Voiding Mechanisms & Solutions For High Density InSIDER Series Automotive Electronics (Now Available On Building More Reliable Assemblies for Higher Mission Profiles Design Considerations for Board Layout & Material Selection Marques Best Practices For SMT Assembly & Root Cause Analysis
Advanced Automotive Electronics Assemblies for e-Mobility
InSIDER Series
Advanced Automotive Electronics Assemblies/The Requirements for Electrical Reliability in Automotive Applications Increasing Andreas Karch (Now Available On Voiding Mechanisms & Solutions For High Density Automotive Electronics (Now Available On-Demand
Advanced Building More Reliable Assemblies for Higher Automotive Mission Profiles –Electronics Assemblies Design Considerations for Board Layout & Material for e-Mobility Selection – Co-presented by Marques (September 21 Best Practices For SMT Assembly & Root Cause © INDIUM CORPORATION Analysis – Presented by
Advanced Automotive Electronics Assemblies/The Requirements for Electrical Reliability in Automotive Applications Increasing Andreas Karch (Now Available On Voiding Mechanisms & Solutions For High Density
Automotive Electronics – Presented by
(Now Available On-Demand) Building More Reliable Assemblies for Higher
Mission Profiles – Presented by
Design Considerations for Board Layout & Material
Selection – Co-presented by Jonas Sjoberg
Marques (September 21st) Best Practices For SMT Assembly & Root Cause
Analysis – Presented by Dave Sbiroli (October 12
Automotive Applications Increasing – Presented by
Are you looking for Andreas Karch (Now Available On-Demand)
Mission Profiles in the rapidly evolving – Presented by Karthik Vijay (June 28th) Design Considerations for Board Layout & Material Selection – Co-presented by Jonas Sjoberg and Ângelo electric vehicle market—
Marquesincluding how to ensure (September 21st)
and thermal reliability?
© INDIUM CORPORATION
As part of its popular InSIDER Series of webinars, Indium Corporation is now offering a unique webinar series— Driving e-Mobility: Rel-ion™ Technical Webinars—lead by global industry technical experts in advanced materials and the automotive market. Register for upcoming webinars or access the on-demand archive at no cost at https://www.indium.com/ corporate/media-center/webinars/ rel-ion.php.
To learn more about Indium Corporation’s suite of proven products for EV and other automotive applications, visit indium.com/relion.
