Global SMT & Packaging July 2010 EU edition

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www.globalsmt.net

The Global Assembly Journal for SMT and Advanced Packaging Professionals

False top coatings of a counterfeit component revealed layer by layer Wafer-level solder sphere placement and its implications Steps toward closing the software quality gap

Volume 10 Number 7 July 2010 ISSN 1474 - 0893

David David Raby Raby Interview Interview Inside Inside NEW NEW PRODUCTS PRODUCTS INDUSTRY INDUSTRY NEWS NEWS INTERNATIONAL INTERNATIONAL DIARY DIARY


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