DESIGN WORLD JULY 2022

www.designworldonline.com

July 2022

inside: MOTION CONTROL:

Part 2 of 2: Brighter future

for laser-based materials processing p.

44

LINEAR MOTION: Choosing linear and angle

encoders for semiconductor machinery p.

50

MECHANICAL: When the chips are down:

fixing the global semiconductor shortage

p. 62

A look at

the top 10

programming

languages page 56

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highlights was hearing Jon Hirschtick’s keynote. Hirschtick is General Manager, Onshape and Atlas, PTC — and is famous in engineering circles as being the fellow who created Solidworks. He was also a member of the famed MIT Blackjack Team, which was the basis for the 2008 feature film, 21.

Hirschtick feels that as CAD tools themselves get more powerful, a lot of things that used to be external simulations will be able to be done right in the so ware.

Even today, he said they have customers using their built-in kinematics and animation, where it used to take separate packages.

“What we’d like to see is more and more tools,” he said. “More tools are going to cloud systems and you see things like Ansys [buying] a cloud native simulation company. When these tools come to cloud, you might say, ‘Well, what’s the difference?’ The difference is now they’re on tap for everyone you want to give them to. Now you can share them across your whole team. So, I would like to see a new world where more and more of the advanced stuff comes into the cloud in the core CAD tools.”

He also said that this means engineers will have the opportunity to use much more computing power than could be had in a single desktop computer today.

Instead, he sees an engineer firing up their computer and the simulation will simply stream to them. Additionally, he believes that the digital twin concept will mean more IoT usage, so we can actually connect the physical to the digital twins.

Hirschtick related seeing a recent experiment where a university used the CAD model to drive the physical machine and vice versa.

“Is that something that could have been done 10 or 20 years ago?” he asked.

“Maybe, but it would’ve been a lot harder. Today, with everything in the cloud, you don’t really worry about configuring so much of that. It’s a much more straightforward process. We’re going to see more of that in our connected world.”

Lastly, he praised the security aspects of the cloud. The biggest security risk, he contends, are the files and so ware in your laptop.

“How many of you have your company’s digital master files right now on a laptop? You’re carrying them around. Think about that,” Hirschtick said. “How is your laptop security against defenses? With the cloud, the beauty is we … eliminate the most vulnerable parts of the process, which is the data and so ware on the local computer. Because there isn’t any. If you take one of our customer’s laptops, sorry, evil person — there is no data to steal.” DW Paul J. Heney - VP, Editorial Director pheney@wtwhmedia.com

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Teschler on Topic

Always 10 years away When I was a college freshman I had the opportunity to take a guided tour of KMS Fusion. KMS was one of the first private companies that tried to build a fusion reactor. That tour was a bit more than 50 years ago, and I don’t recall much about it. My only remaining memories are of a room filled with capacitors that took about a day to charge up, and of our tour guide—one of the Ph. D.s who worked there—mentioning it would take about ten years before they were able to achieve a sustainable fusion reaction.

Of course, that prediction turned out to be a bit optimistic. But I suspect the KMS Ph. D.s would have scoffed back then if someone had told them they would all reach retirement age without ever seeing a sustainable fusion reaction, Fusion reactor proponents have long displayed the same kind of optimism as the KMS Ph. D.s. Atomic Energy Commission fusion program director Robert L. Hirsch in 1971 told Congress that vigorous funding would make it possible to build a demonstration fusion reactor by 1995. That enthusiasm is present today. Two years ago, a project called the Spherical Tokamak for Energy Production began in the U.K., and proponents claim it could be operating by 2040. ITER (initially

the International Thermonuclear Experimental Reactor) is under construction in France with operation planned for 2035. And researchers at a demonstration reactor in Japan claim a fusion generator there should be feasible no later than the 2050s.

No question that a fusion reactor is a major engineering undertaking.

But history chronicles numerous engineering projects that were massive yet successful and completed within a reasonable time frame. So you might wonder why that hasn’t been the case when it comes to fusion reactors.

Insight into this question comes from L.J. Reinders, a Ph. D. who worked in high-energy physics for 12 years and who now, among other things, writes about fusion. He points out that unlike other areas of physics, investigations of fusion reactors became politicized relatively early.

In the 1960s, independent research labs themselves decided what fusion research problems to pursue. But in the 1970s, the Atomic Energy Commission steered the fusion community away from fundamental research and toward the creation of commercial energy from fusion.

It was just too soon to think about commercializing fusion, Reinders argues, because numerous fundamental issues in plasma physics had

yet to be resolved. And in fact, that’s still the case today. To cite just one example, consider the rationale for building the ITER. The temperature of the plasma in which fusion must take place has to be about ten times as hot as the core of the sun. ITER uses magnetic fields to confine the plasma and keep it away from the walls of the containment vessel; if it touches the walls it loses energy and cools off. The point of building the huge ITER reactor is to move the container walls farther from the plasma so it takes longer for energy to leak away—increase the plasma radius by a factor of two and confinement times should improve fourfold—or so scientists think.

But this factor-of-two/fourfold relationship is based strictly on observations in smaller reactors.

Scientists are basically relying on a scaling law to predict what will happen in ITER. As Reinders points out, the trouble is that scaling laws, being just experimentally observed patterns or regularities, do not always work out, or the scaling just stops at a certain point.

We won’t find out whether ITER actually works until the $20 billion reactor starts operating. But don’t be surprised if a kid who is a college freshman today writes a column similar to this one 50 years from now. DW

Leland Teschler • Executive Editor lteschler@wtwhmedia.com On Twitter @ DW_LeeTeschler

6

July 2022 www.designworldonline.com

Lee.Teschler.Column 7-22_V1_LT MS.indd 6

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Green Engineering

Maintenance- ee bearings perform in new wind-assisted propulsion system Paul J. Heney

• VP, Editorial Director

The plain and radial deep groove ball bearings withstand even rough seawater while protecting the environment thanks to lubrication-free dry operation. | Courtesy igus GmbH

Speci ing materials for maritime applications is particularly difficult for engineers.

Systems must withstand high loads, seawater, and high humidity — and equent repair opportunities are unlikely. Now, eco- iendly technology om a Spanish sailmaker is poised to revolutionize the shipping industry.

Based in Barcelona, bound4blue has designed wind-assisted propulsion systems that reduce fuel consumption by up to 40% for more sustainable and economically efficient shipping. igus, the Germany-based manufacturer of specialty plastics, contributed critical components to Bound 4 Blue’s systems: maintenance- ee, corrosion-resistant bearings that keep operating costs down.

The International Chamber of Shipping has set the ambitious goal of climate neutrality for the industry by 2050. In response to this and other climate initiatives, bound4blue has developed two autonomous rigid sail systems designed to be integrated onto a wide range of vessels. The plan will dramatically curtail environmentally harmful emissions om global shipping.

8

July 2022

Green.Engineering 7-22_Vs1.indd 8

www.designworldonline.com

DESIGN WORLD

6/29/22 10:27 AM

The bound4blue WINGSAIL and eSAIL systems are mounted on the deck of a ship and automatically align with the wind — similar to a classic sail. These complementary propulsion systems reduce the main engine power required and deliver fuel consumption and pollutant emissions reductions of up to 40%. The company ensures a payback period of less than five years.

The collapsible WINGSAIL uses the same aerodynamic principles as an airplane wing to create lift and reduce drag. The eSAIL is based on active boundary layer control using suction, allowing it to provide 6-7 times more lift than a conventional sail.

For the gear shafts and support rods of the sails, bound4blue engineers chose cylindrical plain bearings from igus’ iglide series.

Unlike metal bearings, these polymer

bearings do not corrode even in direct contact with seawater and require no added lubrication. The specific material chosen for this application, iglide X, has high-temperature resistance and high compressive strength. The bearing can withstand temperature extremes from -100° to 250°C. For their pilot system, a sensor instrument for measuring atmospheric pressure, bound4blue selected radial deep groove ball bearings from igus’ xiros series. These xiros B180 bearings consist of four mainly injectionmolded components: inner and outer rings made of high-performance plastic and a stainless-steel cage and balls. Requiring no added lubrication, the bearings are resistant to seawater and can be used in temperature ranges between -40° and 80°C. They

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The minimal maintenance requirements of the bound4blue systems mean that ships can continue to meet their standard dry-dock schedules. Additionally, fuel consumption and harmful emissions will be drastically lowered — without added operating costs. DW igus

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Contents 7 • 2022

•

vol 17 no 7

•

designworldonline.com

62 62 _MECHANICAL

44 _MOTION CONTROL

Brighter future for laser-based materials processing

July 2022

Highly sought-after chips require precise manufacturing conditions where noise, vibration, and dust are kept to a minimum. Here, Chris Johnson, managing director at specialist bearings supplier SMB Bearings, explains the crucial part that bearings play in manufacturing semiconductor chips.

78_ How ultrasonic welding can change your carbon footprint 82_ Adhesives Choices: Epoxies versus hybrids or acrylics 86_ From mining to adhesives: The growth of a global conglomerate

50 _LINEAR MOTION Choosing linear and angle encoders for semiconductor machinery

The manufacture and testing of semiconductors involves the competing requirements of nanometer positioning and high throughput.

Here, the right encoder can help motion designs deliver on both counts.

66 _TEST & MEASUREMENT Scanning for defects with sound waves

A supplement of Design World

Inside:

| Courtesy of 3M

New modular controllers offer flexible solutions for linking a laser to multi-axis positioning, making it easier for system integrators to design and build advanced systems for a new age of laser applications.

Engineering

When the chips are down: fixing the global semiconductor shortage

Reducing Risks A practical understanding of

hydrogen embrittlement Page 74

COVER_FE 7-22_FINAL_V4_MF.indd 71

7/5/22 12:55 PM

71-93

High-speed, non-destructive ultrasonic scanning identifies minute defects in specialty metals and alloys using advanced, phased array scanning acoustic microscopy (SAM).

56 _ELECTRONICS The top 10 programming languages

Job postings for computer programmers reveal which programming language skills are in greatest demand.

10

2022

2022

2022

2022

2022

GOLD NATIONAL AWARD

BRONZE NATIONAL AWARD

GOLD REGIONAL AWARD

SILVER REGIONAL AWARD

BRONZE REGIONAL AWARD

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asbpe.org

asbpe.org

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CONTENTS 7-22_Vs1.indd 10

ON THE COVER

Get with the program: Here are the top 10 programming languages based on what employers want to see from | istockphoto.com new applicants.

DESIGN WORLD

7/5/22 8:32 PM

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7. 22 • conten t s departments 04

Insights

06

Teschler on Topic

08

Green Engineering

14

Design For Industry

28

Design Notes

37

Internet of Things

40 Sensor Notes

12

CONTENTS 7-22_second.page_Vs1.indd 12

July 2022

94

Product World

96

Ad Index

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DESIGN WORLD

7/5/22 8:29 AM

DESIGN WORLD

Follow the whole team on twitter @DesignWorld

OPERATIONS

VP, Editorial Director Paul J. Heney pheney@wtwhmedia.com @wtwh_paulheney Senior Contributing Editor Leslie Langnau llangnau@wtwhmedia.com @dw_3dprinting Executive Editor Leland Teschler lteschler@wtwhmedia.com @dw_leeteschler Executive Editor Lisa Eitel leitel@wtwhmedia.com @dw_lisaeitel

Web Development Manager B. David Miyares dmiyares@wtwhmedia.com @wtwh_webdave

Senior Editor Mary Gannon mgannon@wtwhmedia.com @dw_marygannon Managing Editor Mike Santora msantora@wtwhmedia.com @dw_mikesantora CREATIVE SERVICES

VP, Creative Services Mark Rook mrook@wtwhmedia.com @wtwh_graphics Senior Art Director Matthew Claney mclaney@wtwhmedia.com @wtwh_designer Senior Graphic Designer Allison Washko awashko@wtwhmedia.com @wtwh_allison Graphic Designer Mariel Evans mevans@wtwhmedia.com @wtwh_mariel

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DIGITAL MARKETING

VP, Digital Marketing Virginia Goulding vgoulding@wtwhmedia.com @wtwh_virginia

Angled NEMA Cords for Tight Spaces— American-Made!

Customer Service Representative Renee Massey-Linston renee@wtwhmedia.com

Digital Marketing Manager Taylor Meade tmeade@wtwhmedia.com @WTWH_Taylor Digital Marketing Coordinator Jill Bresnahan jbresnahan@wtwhmedia.com @WTWH_Jill Webinar Coordinator Halle Kirsh hkirsh@wtwhmedia.com

Interpower® offers eight different cord angles with the NEMA 5-15 cord. When limited space makes connecting a cord to the mains power impossible, an angled cord allows just the right angle to reduce strain on both cord and plug. Eight different angles allow cords a path to connectivity.

Digital Production Manager Reggie Hall rhall@wtwhmedia.com Digital Production Specialist Nicole Johnson njohnson@wtwhmedia.com Digital Design Manager Samantha King sking@wtwhmedia.com

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Angled 5-15 cords navigate narrow spaces in any industry—medical, IT, food service or the office, anywhere tight boundaries push the bend radius of a cord. They work great in accessory power strips where strain reliefs and cable exits may interfere with neighboring outlets.

Marketing Graphic Designer Hannah Bragg hbragg@wtwhmedia.com

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WTWH Media, LLC 1111 Superior Ave. 26th Floor Cleveland, OH 44114 Ph: 888.543.2447

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Design for Industry Food & Beverage

Open platform pneumatic valve system solves interoperability

challenges

Customers of automation systems increasingly demand open platform communications.

The AVENTICS Series Advanced Valve Systems with OPC UA is a digital twin solution that solves interoperability challenges while improving productivity and efficiency. Its Advanced Electronic System (AES) helps users solve interoperability challenges and access data more easily while the integration of the digital twin can improve productivity and efficiency.

A valve system with integrated OPC UA functionality simplifies communication with upper systems because data and analytics are received via the valve system and communicated directly to upper systems, no gateway necessary unless deeper analysis or local dashboards are required. This configuration can cut costs for users since it’s more complex and expensive to receive analytics om a valve system without OPC UA. OPC UA functionality also expands the connected capabilities of the valve system itself, making it easier for users in industries such as automotive, food and beverage, packaging, pulp and paper industries, and more to digitally transform. When organizations undergo digital transformation, key protocols such as OPC UA embedded in technologies enable device monitoring and machine connectivity when sending data om a valve system to an upper system. The AES is simple to integrate and connect to new or existing applications and machines and provides easy access to data and analytics without changing the programmable logic controller (PLC).

This valve system makes the transition to IIoT simpler. With OPC UA, engineers don’t need to change a whole system or architecture to access valve data. They now have the flexibility to continue using their own cloud systems and so ware to gain easy access to data and analytics without disrupting or modi ing the PLC. DW Emerson | Emerson.com 14

July 2022

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Design for Industry O f f- H i g h w a y

Drives stand up to tough environments These parallel axis and right-angle MAXXDRIVE and MAXXDRIVE XT industrial gear units are reliable with up to 2,495,900 lb-in. of torque, ratios om 5.54 – 30,000:1, and 2.5 – 8,075 HP. They are low maintenance, ensure a long service life, are adaptable to fluctuating ambient conditions, and suit heavyduty applications.

They offer configurable, complete solutions that are specifically tailored to application needs with 11 case size options, a range of components and add-ons, and the ability to be configured with 2, 3, or 4 gear stages. These gear units provide the necessary power in heavy-duty applications such as conveyor belt systems, mixers, agitators, crushers, and bucket elevators.

16

July 2022

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DESIGN WORLD

6/29/22 9:22 AM

All drive housings are optimized for strength, rigidity, and high axial and radial load capacities to withstand the tough environments and loads they are o en put under during operation. All bearings and sealing surfaces are machined in a single process for quiet operation and reduced wear over time. The MAXXDRIVE XT design is further enhanced with a larger surface area by way of its cooling fin geometry. This allows for increased heat dissipation efficiency, maximizing thermal ratings and effectively eliminating the need for auxiliary cooling systems.

The internal gear components are hard-finished and rated to international standards. The units also feature large roller bearings that increase load capacity, reduce iction, and provide a long service life for components.

The drives are versatile with a range of standard configuration options and extensive input, foot, flange, and sha mounting options, as well as NEMA and IEC adapter compatibility. The MAXXDRIVE XT also offers a symmetrical, mirror-image design that reduces the number of replacement gear units that need to be stocked.

Various cooling and heating options provide the drives with flexible temperature management that works to extend lubricant life and efficiency.

MAXXDRIVE units also offer a wide range of options including a fixing element kit, protective cover, torque support, monitoring sensors for temperature, vibration, speed, and oil level, oil heater or cooler, and many others. Additionally, these units can also be outfitted with NORD’s Endurance Package, which adds additional performance and safety features to further protect operators, transported materials, and gear unit components. DW

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Design for Industry O f f- H i g h w a y

Easy drive-belt design The Gates Design Power is a new so ware platform offering multiple digital design tools to support the engineering and specification of belt-drive systems across an array of applications.

This digital toolkit consists of six modules, including four all-new applications and upgraded versions of Gates digital tools, Design IQ, and Design Flex Pro. Among the programs is the industry-first Mobility Drive Analysis tool aimed at making it easier for engineers om bicycle, scooter, motorcycle, and power sports OEMs to design Gates clean, quiet, durable, and low-maintenance Carbon Drive belt systems into their next-generation vehicles, further accelerating conversion om chain and other technologies.

The platform includes sophisticated beltperformance models to ensure that users are designing robust, application-specific drive 18

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This digital toolkit consists of six modules, including four all-new applications and upgraded versions of Gates digital tools, Design IQ, and Design Flex Pro. systems, ultimately improving safety and operating costs, while reducing energy consumption and downtime in their operations.

Added features in the new platform improve the design process and make it easy for engineers to design belt drives.

New collaboration functionality enables customer engineers to partner with Gates application engineering experts to efficiently create the optimal drive design. A state-of-the-art, built-in knowledge base provides design guidance for more advanced users, and the platform now automatically synchronizes with Gates product catalog, giving design engineers direct access to Gates’ latest products, specifications, ratings, and list prices. Users also now have the ability to store multiple designs in a single project file, tracking design derivatives and iterations, and noting who made what changes along the way.

Gates Design Power is available globally as a ee download.

Development of the Design PowerTM platform is ongoing, and additional features and enhancements are planned to roll out over the next 12 months, including mobile device compatibility.

DW

Gates Industrial Corporation Gates.com/DesignPower

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Design for Industry Packaging

Tips on medical packaging Automation of the thermoforming process has been embraced in the medical packaging industry more quickly than in other markets, driven by stringent quality requirements and the need for high levels of repeatability. Automation has also brought other benefits of strategic importance to medical packaging producers, including facilitating higher and more predictable throughput, as well as helping to address the challenges of attracting, training, and retaining a quality manufacturing workforce.

Thermoformed medical packaging protects items ranging om implantable medical devices to surgical instruments, to disposable catheters and syringes. The selection of materials and the forming and sealing processes are crucial to ensuring that the integrity of the sterile barrier system is maintained during shipping and handling until the product is opened by the user.

A challenge is that medical items are o en delicate. Therefore, the packaging must protect the products om damage during shipping and handling, securely holding each item in place and separating multiple items packaged together om damaging each other. For sharp objects, such as 20

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POWER TRANSMISSION

RETAINING DEVICES & maintenance & assembly tools

The most challenging aspect of medical packaging design is often the complex geometries required to isolate individual items into separate compartments and to lock each item in place. Properly designed and manufactured, undercuts allow each part to be snapped into place and held securely. needles, screws, and drills, the packaging must be designed to protect the safety of the people handling and opening the package.

Ensuring an effective and durable sterile barrier starts with material selection. PETG and HIPS are o en chosen. Polyethylene terephthalate glycol-modified (PETG) is created by adding a glycol modifier to PET making it slightly so er for tighter seals and also more suitable for withstanding high-temperature sterilization processes.

High-impact polystyrene (HIPS) is also commonly used for thermoforming in medical packaging. HIPS plastics are impact-resistant and clear and they have excellent hygienic qualities.

The shape of the packaging typically differs for medical products. The entire package must withstand the temperature and pressure extremes of the sterilization process. The flange must have the required thickness and rigidity, and smooth surface, to accept and maintain a hermetic seal to the Tyvek lid. The sidewalls must also have adequate and consistent strength and thickness to prevent cracking and leakage during transport and handling.

The most challenging aspect of medical packaging design is o en the complex geometries required to isolate individual items into separate compartments and to lock each item in place. Properly designed and manufactured, undercuts allow each part to be snapped into place and held securely.

The thermoforming machinery should be enclosed to minimize exposure to airborne particulates that can cause gaps during the hermetic sealing process. It is imperative to eliminate static that will attract particulates and to ensure that the cutting process does not generate particulates that can migrate to the product.

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Design for Industry Packaging These various special requirements for medical packaging have led to the wide-scale adoption of Form/Cut/Stack thermoforming systems. Simpler and less costly Contact Heat systems are suitable for only a small action of medical packaging applications because they lack plug assist capabilities required for complex geometries and the higher clamping forces that Form/Cut/Stack systems offer. Contact Heat systems are primarily used for simple package designs and low production volumes.

Form/Cut/Stack systems are usually enclosed and can be fully automated and precisely monitored and controlled, especially machines with 100% servo motors and drives.

Precise control and repeatability are critical to the calibration and production consistency required by the strict standards and government regulations for medical packaging, such as ISO 11607:2019 and Title 21 CFR Part 11.

In addition to the benefits of better product quality and higher production quantity, another factor driving increased investment in automation is the increas-

ing challenge of recruiting, training, and retaining manufacturing employees.

Medical packaging manufacturing faces the same workforce challenges as all industries.

Automation addresses these workforce issues in several ways. For high volume production, robotics are increasingly employed to automatically perform downstream packaging and palletizing functions. But the autonomous operation of these functions is only one element of automation.

The procedures for changing tooling between SKUs, replacing roll stock, and the right tooling are key tasks with thermoforming equipment. Thermoforming equipment should be designed with procedures and tools for streamlining these processes and preventing errors and with ergonomic aids for li ing and correctly positioning heavy objects.

The whole concept of a form/cut/ stack thermoforming machine is to integrate and automate multiple functions in a single system. Medical packaging manufacturers have been at the fore ont of the trend toward automation, initially

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GN Thermoforming Equipment www.gnplastics.com

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Design for Industry Packaging

Plug-and-play conveyor platform Efficient material feed and discharge play a crucial role in realizing the productivity potential of manufacturing cells, assembly, and packaging stations. Rapidly changing process environments in many industries require flexible, adaptable conveyor systems. The Light Conveyor Platform (LCP) is a plug-and-play modular system that helps system integrators implement scalable belt conveyor sections easily.

LCP-based belt conveyors can be easily assembled om factory-preassembled and predefined modules without any engineering effort, and can be put into operation quickly and safely via an autonomous machine control system, optionally without an additional programmable logic controller (PLC). Depending on customer requirements and application, however, connection to an external PLC with user-specific programming is also possible.

The LCP is designed to transport smaller conveyed goods, as well as boxes or polybags weighing up to 50 kilograms. The conveyors, which can also handle inclines or declines, are driven by compact and energyefficient drum motors that are more than 85% efficient. The modular system can be planned and assembled easily and conveniently on the PC monitor using Interroll’s Layouter tool. DW Interroll www.interroll.com 24

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Design for Industry Semiconductor

Smart LIN motor pre-driver assists high power mechatronic miniaturization The MLX81346 is a single chip LIN pre-driver for power needs up to 2000 W. It enables motor control miniaturization and efficient silent drive with field-oriented control (FOC).

As well as being able to support operation up to 1000 W om a 12 V supply, the MLX81346 is also positioned to reach 2000 W om a 48 V supply. Its high-voltage capabilities come om the silicon-on-insulator (SOI) technology it relies on.

The pre-driver has a 16-bit embedded microcontroller unit (MCU), a 64 KB flash memory, plus a LIN so ware stack and LIN interface (for connecting to in-vehicle networking in astructure). It has 12 GPIOs including 3x high-voltage I/Os, 2 UARTs, SPI and I2C.

The MLX81346 takes up minimal board space. It can be supplied in either a 32-pin QFN (5 x 5 mm) or a 48-pin TQFP48 (7 x 7 mm) packages. This compact pre-driver was developed as a SEooC (Safety Element out of Context) with ASIL B capability. An operational temperature range of -40° to 150°C is supported. All essential circuit protection functions are also incorporated. DW

Melexis www.melexis.com/MLX81346

It’s not a web page, it’s an industry information site So much happens between issues of R&D World that even another issue would not be enough to keep up. That’s why it makes sense to visit rdworldonline.com and stay on Twitter, Facebook and Linkedin.

It’s updated regularly with relevant technical information and other significant news for the design engineering community.

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Semiconductor

Compact motorized mirror mounts

Motorized kinematic mirror mounts provide a means to control the pitch and yaw axes of a mirror, usually to direct or deflect a laser beam. To achieve large angles up to 16° while keeping the dimensions as small as possible, the N-480 series kinematic motorized optical mirror mounts are equipped with long travel, high resolution piezo motors. The miniature motors are capable of 20 nm steps which translates into angular resolution as small as 0.3 µrad.

These compact piezo motor actuators can be controlled either manually or through so ware.

Piezo motors are self locking and provide high stability, a prerequisite for many kinematic mirror mount applications, such as optical path alignment, where excellent long-term angular stability is required.

Piezo motors are available for open-loop and closed-loop control.

Closed-loop control provides higher accuracy and better repeatability. For most applications, open-loop actuators are sufficient, especially when an independent signal, such as optical power, can be used to close the loop externally The N-480 compact motorized optical mounts provide tip/tilt angles up to 16° in θX and θY and are offered for optics diameters of ½-in., 1-in., and 2-in.

The N-480 precision mirror mounts are available for ambient conditions and vacuum to 10-6 hPa. The E-872.401 compact piezo motor controller is available to drive the mirror mounts.

For highly dynamic laser beam control and high bandwidth applications, piezo-flexure actuated and voice-coil-driven fast laser steering mirror mounts are also offered. DW

PI ww.pi-usa.us

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Design Notes

Automated foodservice to disrupt restaurant industry Edited by Mike Santora • Managing Editor

The Hyphen Makeline delivers a modular, industrial-hardened solution to help restaurants put kitchen operations on autopilot. | Beckhoff Automation

Now an industrial-appliance-sized design called the Makeline om food services company Hyphen is leveraging so ware, rugged automation, and networked controls to help labor-strapped restaurants meet modern business demands.

“We founded the business in July 2018 to leverage automation technology in modern restaurants,” said Daniel Fukuba, Co-Founder and CTO of Hyphen. “Shortly therea er, we built the first completely automated food truck. During the COVID-19 pandemic, we pivoted and designed our new Makeline system to give restaurants the in astructure to adapt toward digital-first ordering.”

The Hyphen Makeline assembles salads and other menu items served in a bowl — handling hundreds of ingredients at various temperatures. The system connects to Hyphen’s cloud services to route digital orders via MQTT. A er receiving an order, the Makeline 28

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activates dispensers to fill the bowls, conveying them through connected modules inside the enclosure. The machine also controls food safety and provides data insights about peak ordering times and customer habits.

From the outside, it looks like a traditional makeline, and restaurant staff can still load ingredients and manually serve those who prefer to order in person.

Clean control architecture eliminates messy situations Hyphen wanted the Makeline to fit into existing restaurant facilities; as Fukuba explained, “You can already buy mature industrial equipment off the shelf to process 300,000 pounds of salad per day. On the other end of the continuum, there are vending machines with

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DESIGN WORLD

6/29/22 10:36 AM

Angled NEMA Cords— Multidirectional Power Made in America Interpower® offers eight different cord angles with the NEMA 5-15 cord. When limited space makes connecting a cord to the mains power impossible, an angled cord allows just the right angle to reduce strain on both cord and plug. Eight different angles allow cords a path to connectivity.

NEMA 5-15 angled cords are critical space-savers for any industry—medical, IT, food service or the office, anywhere tight boundaries push the bend radius of a cord. They work great in accessory power strips where strain reliefs and cable exits may interfere with neighboring outlets.

prepackaged goods. In between, there’s no automation to handle the capacities and product variety for restaurant-based food service.” That’s partly because it’s technologically difficult to cram the necessary capabilities into a form factor small enough for standard kitchens.

The Makeline must fit more than 70 actuators plus the cloud-connected controls and I/O into what is essentially a restaurant-grade kitchen appliance.

In addition to minimizing footprint, the system needed to meet hygienic standards, and Hyphen also required DESIGN WORLD

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process controls, time and temperature holding information, and the ability to audit and log the food storage environment. The machines would need to accommodate 500 different ingredients, which all interact differently depending on the menu item.

In early 2020, the Hyphen controls engineering team started to explore EtherCAT and PC-based control technologies om Beckhoff Automation.

“The Makeline’s requirements called for vendor agnostic, easy-to-interface systems,” said Bradley Hwang, Controls

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Design Notes A C6030 ultra-compact IPC serves as both machine controller and IoT gateway for the Makeline. PC-based automation and EtherCAT technologies from Beckhoff help the new system from Hyphen make 350 meals per hour with 99% order accuracy. | Beckhoff Automation Engineer at Hyphen. “Beckhoff simplified seamless communication om the PLC runtime up to the cloud so the so ware team could develop a completely new layer between that and third-party services.” Hyphen engineers and the Beckhoff sales and application engineering team at the nearby Silicon Valley Technical Center collaborated to create a solution.

The EJ series I/O Terminals allow Hyphen to implement TwinSAFE functional safety in a pluggable, space-saving form factor. | Beckhoff Automation

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EtherCAT and I/O: more than a slice The EtherCAT industrial Ethernet system proved indispensable for Hyphen. The speed and modularity of EtherCAT helped optimize system communication, and the network doesn’t need switches, which reduced cost and space requirements. Each Makeline module features pluggable EJ series EtherCAT I/O technology for functional safety, which mount to a custom-design PCB board.

www.designworldonline.com

These pluggable TwinSAFE terminals are roughly 50% smaller than traditionally wired I/O slices and reduce potential wiring errors.

“Most industrial electrical cabinets with this amount of I/O are massive, but that wasn’t an option for this product. With the EJ safety modules, we could connectorize communication, power supply, and more on a spacesaving circuit board, allowing easy and repeatable assembly,” Hwang explained.

Using TwinSAFE technology om Beckhoff lets engineers apply safety devices for doors and potential hazards in a simple programmable way sans hardwiring needed by traditional safety systems. TwinSAFE uses the Safety over EtherCAT (FSoE) protocol to communicate via a black-channel approach.

Control so ware and hardware serve up performance TwinCAT three automation so ware provided a comprehensive engineering and runtime platform for the Makeline.

TwinCAT supports many programming methods. This made it easier for Hyphen to bridge the gap between its controls and app-development technologies. “We want to be able to scale the Makeline om 10 units to 10,000 without having to scale the workforce proportionally,” Hwang said. “TwinCAT allows us to use Structured Text, collaborate with version control, and leverage so ware-oriented processes like GitHub.” The Makeline relies on one C6030 Industrial PC (IPC) for all operations.

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capabilities to enhance system performance by designating individual processes in the quad-core CPU, such as PLC or IoT, to one specific core in the IPC. The C6030 is suitable as an IoT gateway and machine controller.

The C6030 resides in a base cell with a CP3924 multi-touch Control Panel. The 24-in. pole-mounted display provides a user interface for the environment, according to Fukuba: “We develop the HMI screens like modern web apps, so the multi-touch capabilities and display fidelity give us the responsiveness that we want in the UI. This user- iendliness means any restaurant employee can operate the Makeline.”

will arrive at design engineers by the end of 2021. The machines can produce 350 meals per hour with 99% accuracy, and it improves portioning precision om the industry average of +/-15% down to +/-2%.

The control hardware, IoT, and networking technologies om Beckhoff helped Hyphen deliver the technical capabilities while meeting footprint requirements. The engineering team plans to continue working with Beckhoff sales and support to add more automation technologies in the future and is already testing TwinCAT Vision as a solution for greater quality control and inspection. DW

A recipe for disruption Hyphen began conceptualizing the Makeline in mid-2020, and its first units

Beckhoff www.beckhoff.com

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EtherCAT networking and hardware deliver fast cycle times with minimal footprints. | Beckhoff Automation

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Design Notes

The system absorbs the short-term energy bursts that occur with flight simulation and vehicle design for later use.

How to build a smart energy management system Edited by Mike Santora • Managing Editor

The Moog DE2020 smart energy management system has helped Moog’s Gen3 motion system (designed for certi ing commercial and military flight crews and developing motor vehicle designs) reduce surge power by 65% without sacrificing performance.

With more than 1,000 motion systems installed worldwide, Moog’s team drew on this experience to develop not only the new Gen3 motion base but also the DE2020 technology.

With the DE2020 system, engineers used proprietary Moog technology in Formula 1 race cars to design an energy recovery system for the Gen3 motion system. The system absorbs the short-term energy bursts that occur with flight simulation and vehicle design for later use. The DE2020 eliminates the need to

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size electrical power to handle peak loads, even if the peaks rarely occur during a work cycle. The result saves energy, reduces costs, and streamlines cable design and power connections for Gen3 motion system users.

“During normal operations, a motor or motion system generates a regular load.

But during acceleration, a system requires more short-term energy, while the release of energy om mechanical inertia or braking mostly converts to heat without being used,” DESIGN WORLD

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said Tim Herget, a staff systems engineer for Moog.

The DE2020 system meets peak loads by drawing power om the Gen3 motion base’s capacitor banks while using energy gains om braking and mechanical inertia to recharge the capacitors. By doing this, the DE2020 prepares the capacitors for the next peak.

This system can also compensate for fluctuations in the mains by using a prefilter in combination with the capacitor bank. Or, in the event of a sudden power failure, the DE2020 can supply the Gen3 system with enough energy to reach the safe return to home position.

The Gen3 control cabinet, half the size of prior designs, houses Moog’s DM2020 multi-axis servo drive, which controls the motion system’s actuators. Moog engineers achieved the compact design using a common DC bus managed by the DE2020 system. The DM2020 ensures high speeds and faster cycle times through a control board and so ware that handles various motor and actuator types. The DM2020 synchronizes the axes through an EtherCAT connection between the modules; with a standard DC bus configuration, the DM2020

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The DE2020 system meets peak loads by drawing power from the Gen3 motion base’s capacitor banks while using energy gains from braking and mechanical inertia to recharge the capacitors.

enables an energy exchange between the axes, reducing energy consumption.

The Gen3 motion system also uses Moog’s fastest, most-recent planetary roller screws, which carry high loads while precisely accelerating or braking.

Depending on the type of payload the Gen3 system underpins, its actuators can move approximately 15 tons om 2.2 meters (7.22- ) to 4 meters (13- ) and tilt the payload +/- 27° at a rate of 70 cm (28-in.) per second.

www.designworldonline.com

Moog engineers expect the Gen3 system to reduce unplanned maintenance by approximately 22% and provide users with more than 99.5% uptime.

“In redesigning the Gen3 system, we evaluated every component, especially the actuators, to ensure that the motion system contains fewer parts and customers can easily swap out or repair worn components,” added Herget. “Customers can replace the dampening elements during operation without removing or recalibrating the actuator. The power connection and encoder assemblies are replaceable too.”

Moog engineers see the DE2020 and DM2020 technology improving other applications for industrial automation, test benches, handling, robotics, or replacing hydraulic and pneumatic systems at an industrial facility. DW

Moog | www.moog.com

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Design Notes

Tokyo Denki University.

Magnetic encoders help

two-wheeled robotic vehicle stay balanced

Edited by Mike Santora • Managing Editor

In the design of a self-balancing two-wheeled robotic vehicle, accurate highspeed measurement of angular rotation is a key requirement. Furthermore, minimizing component weight and size is an equally vital consideration. Engineering students at Tokyo Denki University found the answer in the RM08 rotary magnetic encoder om Renishaw’s associate company, RLS. Background Tokyo Denki University was established in 1907 by two young engineers, Seiichi Hirota and Shinkichi Ogimoto. Their founding principle was to promote engineering education as a basis for national economic development.

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Working in the University’s Robotics and Mechatronics Department, Jun Ishikawa is a researcher in several technological fields, including robot control system development. He challenged his engineering students to create a two-wheeled, self-balancing robotic vehicle. For this project, his students chose the RM08 rotary magnetic position feedback encoder om RLS. DESIGN WORLD

6/29/22 10:39 AM

Background Ishikawa asked the university students to solve a classic control theory problem — the inverted pendulum. The basis for the wellknown Segway personal transporter, the inverted pendulum, has its center of mass located above the pivot point.

Unlike a suspended pendulum, which will naturally return to a stable equilibrium position a er being displaced, the inverted pendulum is inherently unstable. Imagine holding a pool cue or a broom handle upright on the palm of your hand — it would tend to fall over without continuous adjustments to the position of your hand.

A shorter inverted pendulum accelerates away om the vertical position faster than a longer one, requiring more equent position adjustments and presenting a more challenging control problem — balancing a pen on your hand is trickier than balancing a pool cue.

One solution to the problem, as implemented by Segway, is to mount the pivot point on a wheeled platform. This type of vehicle takes inertial inputs om an IMU (inertial measurement unit) which comprises two sensors: an accelerometer and a gyroscope.

In this case, both vertical-axis and horizontal-axis accelerometers are used to determine the angular acceleration due to gravity. By constantly monitoring the pendulum’s tilt angle and angular velocity,

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Design Notes The encoder coupled to the motor shaft.

a PD (proportionalderivative) control system can be used to drive the wheels forwards or backward to maintain balance.

Adopting a similar approach in their own control system, Ishikawa’s students needed to design and integrate what was effectively a three-part solution, comprising tilt-angle sensing, control logic, and motor drive circuitry.

When designing PCBs for this control application, small size and low weight are crucial for integration within the handlebars. PCB architectures have been optimized to ensure that all the required functionality is delivered in the smallest package size.

Solution The PCB control board sits at the top of the pendulum, inside the handlebars, and carries all the electronic circuitry required, including a solid-state gyroscope, microcontroller, DC motor drive, and power management components.

In the wheeled platform, at the bottom, there are two axles: a horizontal axle linking the wheels and a vertical axle driven by a compact DC motor. Simple bevel gearing at the intersection between the axles enables the motor to drive the wheels in either direction.

For effective control, the system must maintain orientation within a small range of angles that are nearly vertical.

If the vehicle tilts by more than 30° in either direction, stability might be lost.

To maintain the vehicles balance, the wheels must be driven continuously with carefully calculated acceleration and speed.

To achieve the required level of motion control performance, the students needed a high-resolution position encoder to enable monitoring

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and regulation of the motor output. It also had to be small and light enough to accomodate the vehicle’s slim vertical structure.

A er much consideration, the solution came in the shape of the RM08 rotary magnetic encoder om RLS. This noncontact, ictionless rotary magnetic encoder weighs just 2 g, including cabling, and has an aluminum sensor housing measuring 8 mm in diameter with a thickness of only 3 mm.

The students designed a narrow nylon collar to act as a mechanical linkage between the motor sha and the magnetic actuator of the RM08 encoder, which added less than 0.5 g to the assembly. The RM08 encoder produces a 12-bit resolution output (4,096 steps per revolution), is suitable for high-speed operation up to 30,000 rpm, and delivers an accuracy of ±0.3 º. www.designworldonline.com

Results Using the RM08 high-speed rotary magnetic encoder to measure angular rotation at 12-bit resolution, the students could design a motion control scheme for a two-wheeled robotic vehicle capable of self-balancing and staying upright.

The RM08 encoder is IP68-rated and designed for integration into a wide range of high-reliability, high-volume OEM applications.

Importantly, the rotary magnetic encoder also addressed the vehicle’s demanding physical design constraints.

Being a highly compact and lightweight component, it helped the students overcome space and load-carrying limitations. DW

Renishaw www.renishaw.com

DESIGN WORLD

6/29/22 10:41 AM

Internet of Things

Industry must protect IoT controls Industrial systems are moving into hackers’ focus worldwide and pose enormous risks.

With the increasing use of intelligent machines integrated into an entire manufacturing network, the risk of hacker attacks is rising enormously. An IT study reveals that many industrial companies are barely aware of this risk and therefore have not implemented compliance rules for the acquisition and operation of IoT equipment.

Just over half of the more than 300 business representatives surveyed said they dispose of compliance rules for IoT security at their companies, while 35% have no rules at all. The figures were obtained by the IT company ONEKEY as part of its “IoT Security Report 2022.”

(ONEKEY specializes in IT security.)

“Connected manufacturing is as efficient as it is dangerous. Plants have many hardware devices that use their own firmware and are more than ever the focus of hackers,” warned Jan Wendenburg, CEO of ONEKEY.

An IT study reveals that many industrial companies are barely aware of this risk and therefore have not implemented compliance rules for the acquisition and operation of IoT equipment.

The majority of companies rely on threat analyses (50%) and contractual requirements for suppliers (42%) to secure IoT in astructures.

“This settles the question of liability in case of doubt – but companies do not realize that a determined attack on manufacturing equipment can threaten a company’s existence within a few days,” said Wendenburg.

Role model process industry The confidence of the more than 300 business representatives surveyed as part of the study in their own IT security measures shows the uncertainty: only 26% consider their own IoT security to be fully

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sufficient, 49% only partially sufficient. Almost 15%, on the other hand, consider their own measures to be insufficient or deficient. Even penetration testing is not fully trusted — only 14% see it as an efficient way to test the security of an in astructure; 68% see it as partially efficient.

“The problem needs to be addressed at the root, right during the production of devices, machines and endpoints. The IT industry could take a cue om the process industry — the pharmaceutical industry, for example. There, it is a legal requirement to provide complete traceability and transparency for every component of a product. This should equally be standard in the IT sector to eliminate the risks posed by easily hackable firmware in production equipment and other endpoints. Every piece of unknown so ware on a device or a simple component of a device is a black hole with full risk of being attacked by a hacker or entire groups,” said Wendenburg. This so ware bill of materials, also called “SBOM,” is also supported by 75% of the respondents.

Study reinforces demand for proof of origin Meanwhile, the damage can quickly run into the millions: 35% of the IT managers and decision-makers surveyed for the study consider an annual damage of up to 100 million euros to be realistic, another 24% even up to 500 million, and 17% more than 500 million euros.

“Since the figures were requested between January and February 2022, a far more dramatic picture can be painted now. Since we know that IT attacks are also part of warfare, we must protect ourselves even better.

Especially, since we can expect a further increase in industrial espionage as a result of sanctions. Here, too, weaknesses in firmware can favor the intrusion of hackers and can even make them almost invisible, because classic security measures o en fail when hacked via industrial systems or devices,” explained Wendenburg. DW

ONEKEY | www.onekey.com

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Internet of Things

Prevent power drop during switch firmware upgrades When deploying managed PoE switches in an industrial network, upgrading firmware is an inevitable action to enhance switch performance. However, upgrading typically requires devices powered by a switch’s PoE to be shutdown for up to 15 minutes or more. As a result, data om these Powered Devices (PDs) that businesses rely upon to make informed decisions cannot be captured. PoE-powered PDs at risk include IP cameras, sensors, PLCs, VoIP phones, PoE lighting, and non-PoE switches.

A solution to this issue involves integrating Persistent PoE technology into 802.3bt PoE managed switches. This patented technology ensures power is continuously carried to PDs during firmware upgrades so data collection is not terminated, plus it prevents connected PDs om rebooting once power is restored. Uninterrupted PD availability is mission critical in IP video surveillance, Intelligent Traffic Systems, Smart Factories, remote kiosks, and automated parking — all applications that would benefit om Persistent PoE. As enterprises modernize, they’re increasingly adopting PD devices and facing greater exposure to the danger of lost PoE power that will compromise data collection and video monitoring. This Persistent PoE technology mitigates the risk. Customers can opt for LMP-1204G-SFP-bt, LMP-0702G-SFP-bt, or LMP-C602G-SFP-bt series managed switches, featuring a mix of 6 to 12 Ethernet and SFP fiber ports combined with 802.3bt PoE++ delivering up to 90 W per port with the reliability of Persistent PoE. DW Antaira www.antaira.com

WHAT DO YOU THINK? Connect and discuss this and other engineering design issues with thousands of professionals online

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NEWS

Consortium to develop power consumption management standard A key objective of the future mechanical and plant engineering sectors is to achieve climate-neutral production. This is backed by the European Union’s “European Green Deal,” which aims to make Europe climateneutral by 2050. To achieve this goal, and to implement many other use cases, energy consumption data in production is an important prerequisite.

ODVA, OPC Foundation, PI, and VDMA founded the “Power Consumption Management” group in May 2022. In this group, the OPC UA interface standard for energy consumption data is being developed.

Karsten Schneider, Chairman of PI, is looking forward to cooperation with the ODVA, the OPC Foundation, and VDMA: “The acquisition and analysis of energy consumption in machines and plants is an immensely important topic for the future.”

“The four organizations are working at full speed to harmonize and standardize energy consumption information on the shop floor,” says Andreas Faath, head of VDMA Machine Information Interoperability Department. “With this, a crucial building block, supporting the goal of global climate-neutral production in all sectors of the machinery and plant engineering industry, is under development.”

“Rapid transition to environmentallysustainable energy use is the greatest challenge of our time and, as such, I am glad that we are proceeding together: PI and ODVA contributing their in-depth know-how on energy interfaces at the field level, with the internationally

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recognized OPC UA data modelling standard defining semantics and secure data transport, serving as the foundation of the Global Production Language developed by the VDMA,” said Stefan Hoppe, President OPC Foundation.

“ODVA is pleased to be an active contributor to this key initiative to

ODVA, OPC Foundation, PI, and VDMA founded the “Power Consumption Management” group in May 2022. In this group, the OPC UA interface standard for energy consumption data is being developed. optimize energy usage and thereby reduce the detrimental impact on the environment om waste,” said Dr. Al Beydoun, President and Executive Director of ODVA. “This Power Consumption Management collaboration will help ensure end users have a highly standardized and interoperable means to reach their environmental, social, and corporate governance (ESG) goals.”

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The results of the working group will be published as a new OPC UA specification. Future releases of the OPC UA for Machinery specification will leverage these results, ensuring that energy information om all machines and components on the shop floor can be provided in a standard way as part of the Global Production Language.

“The activity is based, in particular, on the existing standards of the participating organizations; but also on other standards om the OPC Foundation, the VDMA, and external research,” said Heiko Herden, VDMA and elected chairperson of the new joint working group. “In combination with other OPC UA for Machinery use cases, such as status monitoring or job management, the calculation of the product and production-specific carbon footprint will be possible.”

Within the VDMA, over 600 member companies develop the Global Production Language. OPC UA Companion Specifications, for numerous sectors of the mechanical and plant engineering industry, are being created by an additional 40 working groups.

The basic specification, “OPC UA for Machinery,” is a special case. Here, important building blocks are defined across all domains. Other specifications can be based on these building blocks.

DW

ODVA www.odva.org

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Sensor Notes

What sensors are used in

AR/VR systems?

Hardware components of the experimental INREX-VR system for immersive neurorehabilitation. | MDPI sensors

A wide range of sensor technologies is required to support augmented reality and virtual reality (AR/VR) systems. Today’s AR/VR implementations mostly focus on visual and audio interfaces and rely on motion tracking and listening/ voice recognition sensors. That’s beginning to change with new types of sensors and various types of haptics being introduced. This FAQ begins by reviewing basic position sensing technologies used in AR/VR systems, presents a proposed AR/VR system for neurorehabilitation, reviews how thermal sensing technologies are being developed to provide more complete AV/VR environments, and closes by looking at emerging haptics technologies for thermal- and touch-based feedback.

In a virtual reality environment, the system creates the complete “reality” and only needs to know about the person’s relative movements and orientation. A basic VR system uses an inertial measurement unit (IMU) that can include an accelerometer, a gyroscope, and a magnetometer. AR involves the creation of an environment that integrates the existing surroundings with virtual elements. An AR system needs to know where the person is, but also needs to know what the person is seeing, what the person is hearing, how the environment is changing, and so on. As a result, AR uses more complex sensing, beginning with an IMU and adding time-of-flight sensors, heat mapping, structured light sensors, and more.

Both AR and VR are immersive environments; especially for VR, complete immersion

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is necessary for a good user experience.

The potential for motion sickness is a challenge when developing AR/VR systems. To avoid motion sickness, AR/VR devices must capture user movements quickly and accurately. That means the IMUs, and other motion sensor technologies, must be highly stable with very low latencies. IMUs used in AR/ VR systems combine an accelerometer, a gyroscope, and a magnetometer to facilitate error correction and produce accurate results quickly, enabling the system to track head movement and position.

In addition, both AR and VR systems can benefit om various forms of user feedback and interaction, including gesture and voice recognition. Gesture

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recognition can be based on real-time video analysis (which can be energy and compute-intensive) or more advanced technologies such as e-field sensing, LIDAR, and advanced capacitive technologies.

One key for AR environments is the ability to accurately, quickly, and continuously present computergenerated images of the actual environment. Most AR headsets rely on one or more particular types of imaging sensors, including time of flight (ToF) cameras, vertical-cavity surface-emitting laser (VCSEL) based light detection and ranging (LiDAR), binocular depth sensing, or structured-light sensors. Some use a combination of these sensors.

ToF cameras combine a modulated IR light source with a charged coupled device (CCD) image sensor. They measure the phase delay (time of flight) of the reflected light to calculate the distance between the object being illuminated and the camera. Thousands, or millions,

of these measurements combine into a “point cloud” database that represents a three-dimensional image of the surrounding area. A more recently developed technology, VCSEL-based LiDAR, can produce higher fidelity point clouds. Additionally, VCSEL technology is used in smart glasses and other wearable devices to create more compact, lowerpower displays and gesture recognition systems.

Structured light sensors project a defined pattern of light (IR or visible) onto the surroundings. The distortion of the patterned light is analyzed mathematically to triangulate the distance to various points in the surroundings: the camera pixel data (a type of primitive point cloud) is analyzed to calculate the difference between the projected pattern of light and the returned pattern, — considering camera optics and other factors to determine the distances to various objects and surfaces in the surroundings. While a single

A range of technologies are being developed to implement thermal sensing and thermal haptics in AR/VR environments. | Advanced Functional Materials

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Sensor Notes structured light sensor can be used, more accurate results are realized when two structured light sensors are used and their outputs are combined.

Additional sensors found in AR systems include directional microphones (which may be displaced in the future by bone-connection directional audio transducers), various biosensors such as thermal sensors, ambient light sensors, and forward and rear-facing video cameras. Plus, a wireless link is needed to download all sensor data and upload the video information for the real-time creation of an immersive and dynamic environment.

Neurorehabilitation AR/VR technologies are being developed for a range of medical applications. In one instance, a system for immersive neurorehabilitation exercises using virtual reality (INREX-VR) is being developed based on VR technologies.

The INREX-VR system captures realtime user movements and evaluates joint mobility for both upper and lower limbs, recording training sessions and saving electromyography data.

A virtual therapist demonstrates the exercises, and sessions can be configured and monitored using telemedicine connectivity.

The INREX-VR so ware was developed to use off-the-shelf VR hardware and is suited for patients suffering om a neurological disorder, therapists responsible for supervising the rehabilitation of patients, and trainees.

The system can evaluate the emotional condition of the user through heart-rate monitoring and their level of stress using skin conductance. Facial recognition can also be implemented when the system is used with the VR headset.

Heating up future AR/VR Devices that can add a thermal dimension to AR/VR environments are a hot topic. A variety of both thermal sensing and thermal haptics technologies are being pursued. Thermal sensing

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technologies that are being proposed for AR/VR systems include thermoresistive, pyroelectric, thermoelectric, and thermogalvanic.

While these sensors convert thermal energy into electric currents or voltages, the power levels are too low to support energy harvesting but are sufficient to enable thermal sensing. In particular, polymer composites and conducting polymers are expected to find use in future thermal sensors. The mechanical flexibility of polymers makes them especially suitable for wearable thermal sensors. Some of the proposed polymerbased thermos sensors can function in both contact and non-contact modes, further increasing their flexibility. Stability of performance and reaction delays resulting om thermal hysteresis are two challenges before thermos-sensors are ready for use in AV/VR systems.

Thermal haptics or thermal stimulation is another emerging area of AR/VR that will provide an enhanced level of immersion in AR/VR environments.

Thermal haptics are expected to rely on technologies such as thermoresistive heaters or Peltier devices, which control the temperature or a target area but are more power-hungry than polymer-based thermal sensors. On the plus side, active thermal haptics may have faster response times than the proposed polymerbased thermal sensors. With thermal haptics, users will be able to feel the temperature of a virtual object and have a more realistic interaction with their environment.

Thermoresistive heaters may have lower hysteresis compared with Peltier devices, but thermoresistive heaters only provide heating, while Peltier devices can provide both heating and cooling. A critical factor in developing thermal haptics will be the need for user controls that enable the selection of a range of temperatures that provide stimulation without causing discomfort or burns. New materials will be needed for wearable Peltier devices that are both flexible and lightweight. Materials

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development is a key activity to enable both thermal sensing and thermal haptics in future AR/VR systems.

Ultrasound Haptics Ultrasound-based haptics have been developed based on the precise control of a series of speakers that send out precisely timed ultrasound pulses. The time differences are designed so that the ultrasound waves om the various speakers arrive at the same place, at the same time, and create a pressure point that can be felt by human skin. The focal point where the ultrasound waves meet can be controlled in real-time and changed om moment to moment based on hand positioning or other factors.

A tracking camera serves the dual purposes of gesture recognition and provides the exact position of a person’s hand, enabling the focal point to be positioned at a specific spot on the hand. By controlling the motion of the focal point, it’s possible to create multiple tactile effects. Haptic feedback is expected to find use in AV/VR systems beyond gaming, for example, in system controls and interactions for shopping kiosks and vending machines, automotive interiors, building automation, and other areas.

Sensors are a vital area of technology that enable compelling and immersive AR and VR environments. Due to the greater complexity of creating AR environments that stitch together the surrounding reality with virtual elements, AR sensor systems are more complex. New sensor modalities are being developed to increase the realism of AR/VR systems, including thermal sensors and thermal and touch haptics. DW

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Part 2 of 2:

future for laser-based materials processing New modular controllers offer flexible solutions for linking a laser to multi-axis positioning, making it easier for system integrators to design and build advanced systems for a new age of laser applications.

Dr. Cliff Jolliffe • Head of Automation Market Segment | Physik Instrumente (PI) GmbH

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Modular controllers offer an easy and straightforward way to link a laser to multi-axis positioning systems. For instance, PI’s ACS Laser Control Module (LCM) introduces a modular way to construct motion systems, based on the EtherCAT industrial network. It doesn’t rely on encoder data and allows drives to select specified axes requirements. This new approach offers system integrators — particularly those who are new to the field — a far quicker and easier way to significantly expand their capabilities when it comes to laser control and gives them the flexibility to add high-performance multi-axis capabilities only when they are needed, simplifying the system architecture of the drives.

The LCM doesn’t change the types of drive used for motion but simply connects to the existing network. The simple architecture of an add-on module is suitable for laser control. There’s no need to change the drive types, which greatly simplifies the cabinet design. Plus, there are no changes to the existing hardware, which reduces stock requirements for spare parts. There’s also no additional wiring except a simple Ethernet cable. This approach makes it really quick, easy, and extremely cost effective to construct a universal drive offering high performance that covers every eventuality.

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M o t i o n

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The diagram shows the simple connectivity of an Ethernet cable in a drive system using EtherCAT. | courtesy PI

A typical setup shows XY linear motor stages and a vertical stage supporting a laser head. | courtesy PI

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Sharper performance, simple connectivity The ability to use any type of feedback is hugely advantageous from a system integrator’s point of view because it offers the potential to mix axes with or without encoder data, combine incremental and absolute encoders, or incorporate kinematic systems that cannot interpret direct output from encoders.

This means that a total system solution that uses the right technology to solve the problem can be created.

Multi-axis control systems use output encoder pulses from each axis and feed these back to a central location using wiring. This sometimes involves complex encoder cables that split the signal between one axis drive and the central controller, adding complexity and wiring to the system. In contrast, the new modular concept adds PEG (position event generation) to an entire drive system using the well-recognized industry standard EtherCAT — integrated with a simple Ethernet cat5e cable — taking the individual path information directly from each motion device on the EtherCAT bus and linking the positional information from multiple axes to a single PEG output. This data is then used to generate laser control events along the combined vector path, controlling the laser attached to the system.

However, when it comes to using no feedback in these systems, some things have to be considered.

Using stepper-motor-driven stages for laser control must be undertaken with caution. Open-loop positioning does not provide

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information when a motor has lost position due to a potential fault, but it does open up the method for lower cost and less demanding motion applications. In addition, there are certain situations where absolute encoders are ideal because they do not require referencing at machine power-up. This can help avoid collisions of stages or parts with obstacles in the machine layout, letting the system intelligently create regions where the stages should not enter, or provide additional flexibility when unusual or oversized parts need to be processed.

In systems where the threedimensional coordinate system is made up of complex kinematics, or paths created from nonlinear devices such as rotary stages, it’s necessary to create motion path data that is not related directly to encoder feedback. The LCM can function without the use of encoder data, so it works well with either of these scenarios.

In the case of gantries, in general they have two motors to move the bottom axes, guided by two encoders directing the base of the system; other control signals also come from side encoders. However, these encoders may generate different readings and there is the potential for firing in the wrong place. The risk of this happening increases with wider gantry systems with a long cross axis or high dynamics.

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effect of having potentially two conflicting feedback sources that could lead to inaccurate firing. ACS controllers provide PI gantries with additional controller algorithms that, in real time, enhance stability and positional accuracy across the whole travel ranges of the system.

These facilitate low following error and disturbance rejection that again ensure the laser is fired at the right position.

Opening up control options for new laser technology Laser material processing is now a significant aspect of industrial manufacturing — used for tasks ranging from heating for hardening, melting for welding and cladding, and the removal of material by drilling and cutting — and many of the new technologies would benefit from a system that could synchronize laser pulse control with motion.

For example, high intensity femtosecond laser processing, which is becoming more common as more industry-proven commercial lasers become available, is considered a cold process because the material being processed does not heat up during the interaction. This type of processing includes texturing of surfaces to decrease reflectivity, provide hydrophobic surfaces, or create chemically-reactive surfaces.

It’s of particular interest in the automotive industry, where the push for improved efficiency is driving the reduction of friction of moving components, to lessen the use of lubricants and improve durability.

Another useful property of the ‘cold’ ablation of high intensity lasers is the ability to drill clean, small, deep holes in materials without damaging the surrounding material. This technology is now commonly used in the medical industry for fabricating vascular stents and it’s been widely adopted for holes with diameters of microns and a large depth-to-diameter ratio. Other applications include the dicing of glass that allows the processing of the back of a surface without damaging the front. This DESIGN WORLD

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application is simply not possible using conventional mechanical diamond blade dicing techniques.

Micromachining and welding are commonly carried out by nanosecond fiber lasers. Although the fiber laser has longer pulse duration than femtosecond lasers, it can be used with careful control of pulses and processing parameters. In this type of laser processing, the energy is eventually converted into heat that dissipates out of the laser spot, beyond the duration of the laser pulse. Essentially, fiber lasers keep costs lower; so if the process is controlled and the results are suitable for the application, they make a lot of sense.

In all of these applications and more, controlling the pulse duration, frequency, and placement is key to changing the laser process capabilities, quality, and intermolecular interactions.

An example of a simple laser-on profile.

| courtesy PI

Speed according to minimum and maximum laser power. | courtesy PI

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Basic modes of operation The simplest method of laser control is to define the switch-on and switch-off positions. Here, the laser power control is set by the laser itself or an additional analog input is used for power related to speed.

The next method to consider is distance-based pulse control, which is when the laser expects to see a trigger at a fixed distance, along the path. The user defines the switch-on and switch-off positions, as before, but the firing signal is not continuously on.

The controller may use this pulse to create a single shot from the laser or a combination of pulses for a particular laser processing recipe. Another method is based on the fact that the pulse trigger positions are not at a fixed distance but at user-specified points along the path. This is typically called random position pulsing or array-based pulsing. Some lasers have quite capable internal pulsing mechanisms and would prefer a simple gating or on/off; others require a pulsewidth modulation (PWM) type input. This is useful for controlling laser power based on speed.

To improve application and process throughput, both pulse and PWM input can be controlled by advanced laser control capabilities from the laser firing controller. The different methods can also be combined to offer even greater flexibility, precision, and throughput.

The combination of high resolution, multiple axes and high speed within one system can be problematic for a user to calculate the distance along the outputting vector path. However, laser firing modules like the LCM calculate the vector path for you. This makes it simple to define a fixed distance along the path, even when the path may be physically in one direction or a combination of multiple axes. In addition, modules like the LCM can subdivide the resolution of the encoder so that the firing position occurs below the natural

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resolution of the system, potentially improving placement accuracy.

It’s also possible to define a series of pulses that occur after the initial pulse.

This can be used where an event may require a series of pulses or a laser may expect an addition excitation pulse, or multiple pulses to build an average power level from the laser.

Rather than telling the system to fire at fixed discrete positions, it’s also possible to define an array of positions where firing occurs. This can be used when an event may trigger a single shot or an alternative processing regime; for example, due to a material or process change (cutting versus welding).

Some users may simply need to tell a laser where to turn itself on or off.

The laser power may be controlled, for example, by an analog input (typically a 0 to 10 V signal). Alternatively, laser power can be controlled by a combination of modes — for example, fixed-distance pulsing or PWM. Windowing can be overlaid with these methods to simplify the laser processing areas. This typically uses an array method to define the start and end of the window.

With PWM mode, which is a method common in electronics, it directly controls laser power by using PWM to adjust the duty cycle. Hybrid modes are also available that combine PWM with pulsing at user-defined intervals, allowing nonlinear or varying firing events. In addition, zones of operation can be created, giving even tighter control over where firing or modulation takes place. DW

Physik Instrumente (PI) GmbH www.pi-usa.us/en/

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An example showing an LCM fixed-distance firing — defined by distance not time. | courtesy PI

Shown here is PWM mode, where increasing duty cycle is based on increased speed. | courtesy PI

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Choosing

linear and angle encoders for semiconductor machinery The manufacture and testing of semiconductors involves the competing requirements of nanometer positioning and high throughput. Here, the right encoder can help motion designs deliver on both counts.

By HEIDENHAIN CORPORATION staff engineers

Semiconductor manufacturing and testing equipment can have the best motion-control bandwidth, artificial intelligence capabilities, and optics in the world, but none of that matters if the processes fail to reach nanometerlevel positioning precision without degrading throughput. In fact, that is the main challenge of semiconductor testing especially — that the design objective of getting precise measurements is in direct conflict with the design objective of making those probes as quickly as possible.

Of course, motion drive capabilities and structural integrity are key to the successful operation of equipment for semiconductor manufacture. Just as important as maximum motion-system axis speed is short settling times — especially if a process involves measuring precise points on a wafer at each stop. Here, suitable encoder performance is essential to meeting the challenging combination of speed, accuracy, and stability for such advanced processes.

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LIP 300-series exposed linear encoders from HEIDENHAIN operate with no mechanical contact between the scanning head and scale or scale tape. Accuracy is to ±0.5 µm; measuring steps reach 0.001 µm (1 nm); and interpolation error is to ±0.01 nm.

Choosing the right linear-motion feedback solution To meet a machine’s requirements, design engineers currently have a variety of motion feedback solutions from which to choose for both linear and rotary movements.

Despite the growing array of new feedback technologies, the parameters that ultimately dictate the best encoder choice are similar for all solution types. Here are some points to consider when deciding on the right product.

1 What environmental conditions must the encoder endure? Will the machine axis in question be subject to vibration, vacuum conditions, or extreme temperatures?

2 What level of feedback and positioning accuracy will the machine axis require?

3 At what speed will this accuracy be reached?

4 How much interpolation error can the involved machine operation allow?

5 Are there any mechanical restrictions that may restrict the available space or method of encoder mounting?

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Check the axis requirements (and find suitable solutions) Defining machine design parameters effectively narrows down the logical options for encoder feedback. An early choice may be the type of encoder — whether mechanical, optical, magnetic, or induction. For example, if a process takes place in a vacuum and is very space restricted, then the suitable choices for an encoder will be narrowed down to products having one or more of the following features: • A short and squat scanning head • Adhesive-based or press-fit scale installation • A scale consisting of two thin metal layers (one with the graduation imprinted) for forgiving attachment to some machine section subject to temperature fluctuations July 2022

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ASCERTAINMENT OF ACCURACY OVER ONE INTERVAL

MEASURING STEP

INTERVAL WIDTH

BASELINE ERROR

MAX BASELINE ERROR Fl SINGLE INTERVALS

Shown here is the ascertainment of linear-encoder accuracy over one interval.

In contrast, high-precision equipment operating in vacuum settings (such as that for photomask fabrication) may necessitate a high-accuracy encoder exhibiting minimal outgassing. From there it’s a matter of referencing all remaining catalog specifications to make the final encoder choice.

Another key encoder element (for both linear and angle encoders) is the measuring standard — or the scale-tape graduation. A scale’s line count gets a lot of attention, but how these lines are created (applied to the scale) at defined intervals is also important. The design of the encoder graduation determines both upfront performance capabilities and maintaining consistent quality over time. That’s why some encoder suppliers have developed their own methods of scale-tape manufacture. That in turn has led to the availability of scale-tape graduation designs having 3D structures with very high edge definition.

Encoders manufactured this way have a high resistance to contamination that can otherwise disrupt front and backend semi-conductor work.

The structures have a very low height … and that in turn leaves practically no surface for dust, dirt, or liquid to accumulate.

HEIDENHAIN MULTI-DOF LIP 6031 Dplus, GAP 1081, and MKV 1/9×30 products are capable of simultaneously making multiple measurements and corrections on the fly. In contrast with conventional encoders (that measure one degree of motion) these new feedback components satisfy demanding requirements of semiconductor industry equipment.

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Testing encoders for nanometer positioning The semiconductor industry is unforgiving of motion components exhibiting any unreliability. Specified encoders are expected to be thoroughly tested and capable of meeting very specific standards. Most manufacturer catalogs are loaded with extensive test descriptions, results, and verified specifications to give design engineers confidence that each component will perform to listed values.

Case in point: Some linear-encoder manufacturers test intervals on their linear-encoder scales so OEMs and end users can more accurately anticipate their performance in the field. In this interval-testing process, the manufacturer quality team first defines the interval width for which the accuracy is to be stated. Then the team continually measures the encoder scale with the chosen interval width over its

The semiconductor industry is unforgiving of motion components exhibiting any unreliability.

Specified encoders are expected to be thoroughly tested and capable of meeting very specific standards.

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Fabco-Made NFPA Versatile, rugged cylinders—when you need them

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entire measuring length … with the width consisting of very small and well-defined measuring steps.

Finally, uncompensated baseline errors over each interval width are evaluated. The worst value (in other words, the largest baseline error detected over all measured intervals) is then provided as the maximum baselineerror value on that linear encoder.

Such verification of encoder performance, proprietary measuring standards, and commitment to encoder R&D mean that the evolution of encoder technologies will continue unabated — which will be especially useful to the semiconductor industry. DW Encoders qualify as angle encoders when accuracy is better than ±5 in. and line count exceeds 10,000. In fact, some angle encoders from HEIDENHAIN have up to 360,000 signal periods and accuracy to ±0.4 in. Measuring steps are as fine as 0.00001° or 0.036 in. (incremental) or 29 bits — approximately 536 million positions per revolution (absolute).

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The

top 10

programming languages Leland Teschler • Executive Editor

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Job postings for computer programmers reveal which programming language skills are in greatest demand.

Every year, a software bootcamp web site called Coding Dojo announces the top

programming languages based on what employers are looking for from applicants. For its study, Coding Dojo looked on a job site called Indeed to discover which languages crop up most often in job descriptions compared to those from previous years.

It is interesting to review Coding Dojo’s list, particularly for engineers who are in mid-career — some of the most popular languages were only invented a few years ago. With that in mind, here are languages in highest demand, according to Coding Dojo, along with a brief description of them for those who haven’t darkened the halls of academia in a while.

No. 9: Ruby Ruby was conceived in the early 1990s and really got going late in that decade, by which time it was said to be more widely used than Python in Japan. Ruby is sometimes described as a good first language to learn. It is used for a lot of web-based tasks such as building static websites, or web scraping and crawling.

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| istockphoto.com

No. 10: Assembly code Assembly code, of course, refers to any low-level programming language that has a strong correspondence between its instructions and the architecture’s machine code instructions. Assembly code gets converted to machine code by a utility called an assembler, which often supports additional facilities such as constants, comments, symbolic labels, and macros called assembler directives. And of course, each assembly language is specific to a particular computer architecture. Assembly language uses a specific mnemonic to represent each machine instruction, directive, register, flag, and so forth. Assembly language instructions usually consist of an opcode mnemonic followed by an operand which might be a list of data, arguments, or parameters.

Electrical engineers of a certain age generally once graduated with familiarity with only two languages, Fortran and assembly code. Their assembly code work likely took place on a PDP-11 minicomputer or something similar. Today, assembly code work generally is confined to embedded devices where memory space and other hardware resources are at a premium, or to run specific routines within larger systems implemented in a higher-level language as a way to boost machine performance. For example, just under 2% of version 4.9 of the Linux kernel source code is written in assembly while more than 97% is written in C.

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The Ruby syntax resembles that of Perl. It is an interpreted language and also object-oriented: every value is an object, including classes and instances of types that many other languages designate as primitives (such as integers, booleans, and “null”). Methods defined at the top level scope become methods of the Object class and are also visible in all scopes, effectively serving as “global” procedures.

Ruby is a multi-paradigm programming language: Besides being object oriented, it allows procedural programming (defining functions/ variables outside classes makes them part of the root, ‘self’ Object), with functional programming (it has anonymous functions, closures, and continuations; statements all have values, and functions return the last evaluation). It has support for introspection, reflection and metaprogramming, as well as support for interpreter-based threads. Ruby features dynamic typing, and supports parametric polymorphism.

NO. 8: Go You can thank programmers at Google for creating the Go language back in 2007. Their primary motivation seems

to have been frustration with the complexity of the C++ language. They devised Go to improve programming productivity where multicore, networked machines and large codebases are involved.

Go is, of course, compiled and is syntactically similar to C but with memory safety, garbage collection, structural typing, and CSP (communicating sequential processes)style concurrency. However, it is said to be more readable and usable than C with the goal of making the language specification simple enough to hold in a programmer’s head, partly by omitting features often found in other languages.

In that regard, its syntax adopts patterns often found in dynamic languages where numerous programming behaviors execute at run time whereas more static languages generally build the same behaviors into their compilation. Go also has optimizations for specific kinds of programming problems: There are built-in concurrency primitives, lightweight processes for multitasking, and channels for message passing and synchronization.

To complicate matters somewhat, there is another computer language called Go!, with an exclamation point. Go and Go! are completely unrelated.

Top programming language skills in demand, 2022 (via Codingdojo.com) Language 1. Java 2. Python 3. SQL 4. Javascript 5. C++ 6. C# 7. C 8. Go 9. Ruby 10. Assembly 58

No. of job postings 89,365 jobs (no. 3 in 2021) 76,634 (no. 1) 66,981 (no. 2) 58,947 (no. 6) 46,143 (no. 7) 43,546 (no. 8) 40,212 (previously unranked) 39,048 (previously unranked) 14,653 (no. 10) 11,239 (previously unranked)

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No. 7: C First devised in the early 1970s, C originally was conceived for constructing utilities running on the Unix operating system. It’s perhaps best known for providing low-level access to memory and language constructs that map efficiently to machine instructions.

All its executable code resides within subroutines, also called functions. The language has a small, fixed number of keywords that include flow control primitives, numerous arithmetic, bitwise, and logic operators, and weakly enforced data typing.

Numerous other languages have borrowed ideas from C, particularly its control structures. Ditto for borrowing C syntax. And, in fact, a lot of compilers and interpreters of other languages are written in C. C syntax makes prodigious use of graphic characters such as ( ) + < > / { } [ ] % $ # and so forth. The language remains widely used for a variety of reasons, including its fast execution on most platforms, and that the code generated after compilation of a C program doesn’t demand many computer hardware features. Moreover, C code can call libraries written in assembler and may be called from assembler. In a nutshell, C makes for efficient algorithms and data structures because the abstraction from hardware is minimal and overhead is low.

No. 6: C# C#, or C sharp, came out of Microsoft in the early oughts. C# applications have economical memory and processing power requirements, but the language isn’t intended to directly compete with ordinary C. Still, it is designed as a general-purpose object-oriented language intended to handle applications in both embedded systems and big hosted environments.

Whereas C has 32 keywords, C# has 86. The C# syntax is also quite different from that of C. C is generally described as supporting a top-down structure, where the most outline of the tasks and algorithms are defined first, and DESIGN WORLD

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•• •• the detailed specifications are ironed later. C# is generally described as supporting a bottom-up structure, where individual elements of the system first get specified in detail, then get linked together to form ever-larger subsystems.

Perhaps the most important difference between C and C#, though, is that C# requires the open-source .NET software framework to be present.

C does not.

No. 5: C++ C++ is basically the object-oriented version of C. It is the creation of a Danish programmer who first released it in the 1980s. It is meant as an extension of C and was initially dubbed C with Classes by its creator. The syntax is a lot like that of C but as the original name suggests, it provides classes while going farther than other OOP

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languages by supporting what are called deterministic destructors, a technique for freeing up resources once objects are done with them. C++ also originated the resource acquisition is Initialization (RAII) concept, a similar resource handling concept.

Most C code can easily be made to compile correctly in C++ but there are a few differences that cause some valid C code to be invalid or behave differently in C++. Recently defined C++ standards also introduce some incompatibilities, and there are specific steps required when a function declaration or definition is to be called in both C and C++. Such complexities make it difficult to write C++ programs that are easily portable between differing systems.

No. 4: JavaScript If you are creating web pages you are probably programming in JavaScript.

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All major web browsers contain a dedicated JavaScript engine to execute the code. JavaScript is a high-level just-in-time complied language, a long way of saying it is a scripting language.

This means the code is compiled during the execution of the page rather than before it. JavaScript engines were originally used only in web browsers, but are now fundamental in some servers and in numerous applications.

The most widely used runtime system for JavaScript is Node.js — temporarily notorious when it was recently found to be at risk for remote code execution attacks.

JavaScript has a lot of the same structured programming syntax as C such as if statements, while loops and do-while loops, switch statements, and so forth. The run-time environment (e.g., a web browser) typically provides objects and methods by which scripts

EE Classroom on Silicon Carbide

Silicon Carbide (SiC) has made its mark in bringing faster, a smaller, and more reliable components than its fellow semiconductors to market. While SiC components have been around for a couple of decades, there is still a lot to learn and a lot to consider when choosing the most suitable WBG semiconductor for your device.

LET US HELP with tutorials, from looking at how WBG semis stack up in power conversion efficiency to an overview of SiC FETs and MOSFETs.

Check out our EE Classroom to learn more:

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interact with the environment (such as a web page). JavaScript is the dominant client-side language of the Web. Consequently, transpilers have been created to convert code written in other languages into equivalent JavaScript.

Note there is a similar language called Java that is sometimes confused with JavaScript. Java came out of Sun Microsystems in the 1990s. As you might expect, the two languages are related. Both have a C-like syntax.

But Java isn’t a script language. It is more along the lines of a traditional object-oriented language. JavaScript was designed with Java’s syntax and standard library in mind. In particular, all Java keywords were reserved in original JavaScript, and JavaScript’s standard library follows Java’s naming conventions, and JavaScript’s Math and Date objects are based on classes from Java 1.0.

However, the two languages are more different than similar. Java has static typing, while JavaScript’s typing is dynamic. Java is loaded from compiled bytecode, while JavaScript is loaded as human-readable source code.

No.3: SQL SQL or structured query language is used for programming and designing with data held in a relational database management system, which might be characterized as a spreadsheet on steroids. It came out of IBM in the 1970s.

SQL language has several elements that include clauses, expressions, predicates, queries, and statements.

These are all specific to handling common tasks in data manipulation.

Expressions, for example, can produce tables consisting of columns and rows of data.

Superficially, SQL source code can look a little like that of other high-level languages such as Basic or Cobol, but it is completely different from these languages. Basic, for example, is considered an imperative programming language because it uses statements

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that change the program’s state, whereas SQL is declarative language in that it’s statements just handle computation logic. That said, over the years, extensions to SQL have added capabilities such as control-of-flow constructs and even object-oriented programming.

A point to note is that SQL implementations are typically incompatible between vendors because they don’t necessarily follow language standards. And widely used implementations of SQL commonly don’t support basic features of standard SQL such as date or time data types.

Consequently, you can rarely port SQL code between database systems without first modifying it.

No. 2: Python Python may be new to you if you graduated before the early 1990s.

Created by a researcher in the Netherlands, it is a high-level interpreted language that includes facilities for programming paradigms that include object-oriented and functional programming as well as procedural programming. The name is a tribute to the British comedy group Monty Python. In the same vein, its tutorials and reference materials occasionally are written with a playful approach.

Python is considered a scripting language and is meant to be easily readable. Its formatting is visually uncluttered and often uses English keywords where other languages use punctuation. Unlike languages such as C, it does not use curly brackets to delimit blocks, and semicolons after statements are allowed but rarely used. It has fewer syntactic exceptions and special cases than C. Python was also designed to be highly extensible via modules. This aspect has made it particularly widely used as a means of adding programmable interfaces to existing applications.

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No. 1: Java Java is an object-oriented language designed to have as few implementation dependencies as possible. It does so via what’s called a Java virtual machine JVM. Java code gets compiled into a bytecocde, basically an intermediate representation, rather than into machine code for a specific architecture.

The bytecode then runs on a JVM regardless of the underlying computer hardware.

Java syntax resembles that of C and C++ but with fewer low-level facilities. The Java runtime provides dynamic capabilities, such modifying its own code, typically not found in compiled languages. All code is written inside classes, and every data item is an object, with the exception of the primitive data types, (i.e. integers, floating-point numbers, Boolean values, and characters), which are not objects for performance reasons.

There are some special Java classes which turn up frequently. Java Applets were small application programs that were embedded in other applications (typically web pages). But they haven’t been used much since 2017. Java Servlets run on servers and generate responses to requests from clients.

This usually means generating HTML pages in response to HTTP requests.

JavaServer Pages also generate responses, typically HTML pages, to HTTP requests. JavaServer Pages basically embed Java code in HTML pages. A Swing in Java is a GUI library by which it is possible to specify a specific look and feel. Similar to Swing is JavaFX which specifically works on desktop computers and web browsers.

DW

References

Coding Dojo, www.codingdojo.com Indeed job posting site, www.indeed. com

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M e c h a n i c a l

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When the chips are down: fixing the global According to Deloitte, we can expect the global shortage of semiconductor chips to continue well into 2022 as supply catches up with rising demand. These highly sought-after chips require precise manufacturing conditions where noise, vibration, and dust are kept to a minimum. Here, Chris Johnson, managing director at specialist bearings supplier SMB Bearings, explains the crucial part that bearings play in manufacturing semiconductor chips.

semiconductor shortage Edited by Mike Santora

• Managing Editor

Semiconductor chips store data and programs on almost every modern digital device we use — whether a smartphone, our work computers, or games consoles. According to ASML, in 2020, more than one trillion chips were produced worldwide, which equates to about 130 chips for every person on earth. Despite their ubiquity in the products we rely on, the manufacturing process is complex and requires precision.

Manufacturing any chip involves multiple processes. First, silicon wafers are sliced and polished before being covered with a light-sensitive “photoresist” coating. The chip wafer is then inserted into a lithography machine where it’s exposed to deep ultraviolet (DUV) or extreme ultraviolet (EUV). Once the degraded resist is removed, the necessary patterns are etched in the wafer. After the components have been fabricated onto the wafer, they are diced into dye, tested, and packaged. Bearings can be found on various semiconductor processing equipment, and their configurations will facilitate the specific process involved.

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Manufacturing any chip involves multiple processes. First, silicon wafers are sliced and polished before being covered with a lightsensitive “photoresist” coating. The chip wafer is then inserted into a lithography machine where it’s exposed to deep ultraviolet (DUV) or extreme ultraviolet (EUV).

Cleanroom environments To accomplish this complex production process, manufacturers must operate in delicate, cleanroom working conditions.

The environment must be enclosed, with airborne particles, room temperature, air pressure, noise, and lighting all tightly controlled. The site will often be compliant with ISO 14644-1 Class 5 or lower, which specifies a minimum allowed particle count of 3,520 particles 0.5µm or smaller. Cleanrooms must also comply with ISO 14644-2 and any industry-

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specific requirements.

Semiconductor fabrication plants need to conform to the most rigorous protocols. A single wafer can go through as many as 200 steps before it reaches industry standard, which means the production site must be completely sterile, with the air free of particulates that could damage the chips.

Meeting these stringent industry standards means installing powerful cleanroom heating, ventilation, and air condition (HVAC) and filtration systems

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to purify and circulate the air to remove any particles up to the allowed limits. Furthermore, some machines in these cleanrooms may come with their own exhaust systems to remove unclean air and particles.

Avoiding outgassing Airborne molecular contamination (AMC) is a concern in precision manufacturing, especially when producing microelectronics like semiconductors. The release of vapor from equipment materials in cleanrooms like silicon, germanium, and gallium arsenide, is the

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If bearings are inadequately lubricated or filled with the incorrect grease, manufacturers should contact a supplier who can offer relubrication services to prevent outgassing and disruptive noise.

The global shortage of semiconductor chips may be destined to continue into 2022, but making small changes at the mechanical level can help manufacturers stay on track by preventing machine downtime and unplanned rework caused by disruptive surroundings.

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most significant contamination source for volatile organic compounds (VOC), which can negatively impact production tools and increase costs.

Maintaining steady semiconductor production means constantly monitoring AMC levels to identify contamination sources and prolong the service life of the cleanroom’s equipment and filtration units. Bearing material and lubricant can help facility managers avoid complications by minimizing outgassing potential. In terms of material, we recommend using stainless steel for vacuum or cleanroom applications because it exhibits low outgassing. Although nitrile rubber is often a popular choice, there can be issues if surfaces are sensitive to contamination.

Plastic bearings made from PEEK and full ceramic silicon nitride alternatives maybe be considered, but the choice will depend on the application’s requirements.

If we turn to lubricants, most greases will vaporize, contaminating the environment and preventing the grease from lubricating sufficiently. Those www.designworldonline.com

working in semiconductor manufacturing environments should select special lowvolatility, perfluorinated greases with low outgassing rates as these are designed for cleanroom conditions. If the machinery is operating at low speeds, using no lubricant at all, or opting for a “dry” lubricant like molybdenum disulfide, is also an option.

Reducing vibration The heating, cooling, and filtration processes used to achieve the clean air needed means investing in pumping, pipes, ducts, and fan systems — all of which generate unwanted vibration unless sufficiently isolated. Vibrations both in and outside a cleanroom can severely impact the final image transposed onto the wafer.

High-quality bearings, correctly matched to the application, are essential to minimize excess noise and vibration.

In cleanrooms, they must be low noise to prevent disruptive vibration that could disturb susceptible machinery, like lithography machines. Rough or damaged balls or raceways, poor roundness, and DESIGN WORLD

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inadequate lubrication all create noise that can impede semiconductor production. Therefore, regularly monitoring surface finish and the roundness of the balls and bearing rings is a must.

As with outgassing, lubrication is also critical for controlling vibration. Using finely filtered low-noise greases is recommended since these contain fewer, smaller solid particles that generate noise when they pass between the balls and raceway.

If the dicing equipment, probing machine, or other equipment is being used for long periods, a low-noise lubricant is also recommended to keep the bearing running quietly and maintain rollability. Lubrication should be carefully considered based on the cleanroom’s internal environment and temperature and the application’s speed requirements. If bearings are inadequately lubricated, or filled with the incorrect grease, manufacturers should contact a supplier who can offer relubrication services to prevent outgassing and disruptive noise.

The global shortage of semiconductor chips may be destined to continue into 2022, but making small changes at the mechanical level can help manufacturers stay on track by preventing machine downtime and unplanned rework caused by disruptive surroundings. Selecting low-noise bearings and applying the necessary lubrication can help facility managers and engineers in semiconductor fabrication plants avoid disturbing highly sensitive equipment, limit outgassing, and maintain a steady semiconductor production at a time when the industry desperately needs resilience. DW

SMB Bearings | www.smbbearings.com

High-quality bearings, correctly matched to the application, are essential to minimize excess noise and vibration.

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Scanning for defects with sound waves High-speed, non-destructive ultrasonic scanning

identifies minute defects in specialty metals and alloys using advanced, phased array scanning acoustic microscopy (SAM).

Hari Polu • President • OKOS High purity metals and alloys such as aluminum, zinc, cobalt, copper, titanium, zirconium, molybdenum, magnesium, and stainless steel are central to many different industries, including electronics, aerospace, and medical devices, among others.

Due to the critical nature of many of the components made from these materials, high purity alloys need to be highly consistent, with extremely low levels of impurities and contaminations. Consequently, when working with these materials, the quality level has to be extremely high. This, in turn, is driving non-destructive inspection using scanning acoustic microscopy (SAM) to identify small inclusions and other defects as small as 50 microns.

SAM is widely accepted in the semiconductor industry as a failure analysis and reliability detection metrology technique. Now the same technology, with variations in instrumentation and adaptation for different use cases, is being applied to high purity metals and alloys.

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Scanning acoustic microscopy (SAM) systems, such as this model CF-300 from OKOS, identify small inclusions and other defects as small as 50 microns.

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SAM is a non-invasive and non-destructive ultrasonic testing method.

The testing is already the industry standard for 100% inspection of semiconductor components to identify defects such as voids, cracks, and the delamination of different layers within microelectronic devices.

The challenge, however, is performing 100% inspection at sufficient throughput speeds to remove materials with defects that do not meet strict quality requirements. As with other inspection systems, increasing scanning speed traditionally meant sacrificing scanning image resolution. Fortunately, recent advances in SAM technology have significantly improved throughput speeds and defect detectability.

While a conventional 5 MHz sensor could take up to 45 minutes to inspect an 8 to 10-in. square or disc alloy, an advanced phased array with 64 to 128 sensors and innovative software to render the images reduces inspection time to five minutes with more granular detection of small impurities or defects.

By dramatically increasing inspection speed, the specialty metals industry is no longer limited to selective sample testing during in-process quality control.

Although SAM has long been used for this type of inspection, the testing involved a handheld unit or a multi-point inspection. Now it’s more feasible to

conduct 100% inspection of the entire surface or interface.

In addition, these advances also facilitate the detection of not just gross defects, but much smaller defects, to drive highly consistent, high-yield products.

Advanced, phased array SAM systems make it possible for specialty metals divisions to move to a higher level of failure analysis because of the level of detection and precision involved. In the past, detecting a 500-micron defect was the goal; now it’s a 50-micron defect, an order of magnitude change. And with high purity metals, the expectation is to inspect every item, not just a few samples.

Scanning acoustic microscopy SAM is a non-invasive and nondestructive ultrasonic testing method.

The testing is already the industry standard for 100% inspection of semiconductor components to identify defects such as voids, cracks, and the delamination of different layers within microelectronic devices. Now, the same rigor of failure analysis and quality testing is being applied to specialty metals and alloys to detect subsurface

Next-generation SAM systems, such as OKOS’s MACROVUE system, detects minute flaws in specialty metals and alloys for 100% inspection of all materials.

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flaws, dis-bonds, cracks, and other irregularities.

Scanning acoustic microscopy works by directing focused sound from a transducer at a small point on a target object. The sound hitting the object is either scattered, absorbed, reflected, or transmitted. By detecting the direction of scattered pulses as well as the time of flight, the presence of a boundary or object can be determined as well as its distance.

To produce an image, samples are scanned point by point and line by line.

Scanning modes range from single layer views to tray scans and crosssections. Multi-layer scans can include up to 50 independent layers. Depthspecific information can be extracted and applied to create two- and threedimensional images without the need for time-consuming tomographic scan procedures and more costly X-rays.

The images are then analyzed to detect and characterize flaws such as cracks, inclusions, and voids.

When high throughput is required for 100% inspection, ultra-fast single or dual gantry scanning systems are used along with 128 sensors for phased array scanning. Multiple transducers can also be used to simultaneously scan for higher throughput.

In tests with some companies on a sample of aluminum and steel, the equipment was able to scan the material in three minutes. Before, the tests would take 40 minutes to do just one part.

The importance of software As important as the physical and mechanical aspects of conducting a scan are, the software is just as critical to improving the resolution and analyzing the information to produce detailed scans. Multi-axis scan options enable A, B, and C-scans, contour following, off-line analysis, and virtual rescanning for composites, metals, and alloys, which result in highly accurate internal and external inspection for defects and thickness measurement via the inspection software.

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Some SAM basics Scanning acoustic microscopy (SAM) is based on the principle of the scanning acoustic microscope. It is one of a number of acoustic microscopy methods, all of which are classed as nondestructive because they use sound waves and thus do not alter or damage the object under test in any way. The sound waves used are generally very high to ultra-high frequency ranging from 5 MHz to 400 MHz and higher. A note about frequencies and image resolution; generally speaking, the higher the frequency the greater the resolution of the image.

Conversely, lower frequencies penetrate the object further but do not provide high resolution, so there is a trade off here.

Specifically, SAM uses a transducer that generates sound waves and focuses these waves at a point on the object under test. To detect a flaw in an object, the scattered sound waves are detected and the time of flight of the wave is calculated, which determines the distance and thereby the imperfection detected in the object.

This process is repeated many times in order to get an accurate image of the material under test. Scanning modes can include single layer views to more complex cross-sectional views. Scans involving multiple layers can also be used to extract information for creating detailed 2D or 3D images.

OKOS decided early on to deliver a software-driven, ecosystem-based solution. The company’s ODIS Acoustic Microscopy software supports a wide range of transducer frequencies from 2.25 to 230 MHz. Estimates are that the company’s software-driven model enables them to drive down the costs of SAM testing while delivering the higher quality of inspection results at faster speeds.

In the electronics, aerospace, medical device, and other industries, there is an increasing demand for inspection equipment that can perform non-destructive imaging and materials analysis. With more sensors and advanced software to www.designworldonline.com

interpret the information at extremely high resolutions, specialty metals manufacturers can inspect 100% of the materials at a level one to two orders of magnitude better to discover flaws that were previously undetected. DW OKOS | www.okos.com

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86_ From mining to adhesives: The growth of a global conglomerate

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A reason to reconnect In May, I attended my first trade show in nearly three years. After months behind a screen, connecting with others via conference calls and Zoom meetings, it took leaving my home office before I realized how much I missed meeting new people and interacting with others — in person. Kudos to Fastener Fair USA for hosting such a well-run event in Detroit this year. It was wonderful meeting and learning from so many high-quality exhibitors.

People, like myself, are starting to get out again and it’s nice to reconnect. Here are just a few highlights that I took away from the Fair…

• There’s a reason to celebrate! Case in point: Advance Components is celebrating 50 years of supplying fasteners. This womenowned business has been a top U.S. industrial fasteners master distributor since 1972. Check out the company’s online FastenerLab for “everything you’ve always wanted to know about fasteners but were afraid to ask.” (And be sure to visit their booth at the International Fastener Expo in Vegas this October for some retro ’70s fun!). advancecomponents.com • Fasteners are the future. I interviewed Earl Price in 2020 when he developed the ForeverLok anti-vibration design (learn more at tinyurl.com/ForeverLok). Price, who once owned an ice-skate shop in Michigan, figured he could design a fastener that more reliably

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secured skate blades to the boot… and he was right. Little did he expect to become a part of the fasteners market — or exhibit at a trade show. Yet his company, Multi Piece Fasteners, had a booth at the Fastener Fair, with a new ForeverLok design on display. It seems no matter how dependable fasteners are, there’s always room for improvement. foreverlok.com • Possibilities abound. “There are many different tools available to the fastener industry,” shared Mason Fischer Paul, an engineer with the Würth Additive Group. “And that means you’re not tied to just one.” Würth showcased its 3D-printing capabilities at the Fair — serving as another valuable tool for designers and manufacturers. For example, manufacturing a fastener prototype is typically time-consuming and costly. 3D printing saves on both. It can also be ideal for manufacturing components with complex geometries. Today, you have plenty of options. wurthindustry.com There was so much more, including new security fasteners, coatings, threadlockers, automated inspection technologies, packaging options, and then some. It was a pleasure seeing everyone at the Fastener Fair and I’m looking forward to the next in-person event.

| AdobeStock.com

For those who questioned the likelihood of such events making a comeback after the pandemic, it’s understandable. In 2019, statistics showed that the B2B trade show market in the U.S. was worth $15.58 billion.

That clearly dipped in 2020 and 2021, but things are looking up. The market is expected to recover by 2024, nearing about $14.5 billion by then. And according to the Fastener Fair, pre-registration was up by 30% in Detroit compared to its event in Cleveland last November.

Until then, feel free to share your news, insights, and new products with us at fasteners@wtwhmedia.com FE

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A practical understanding

of hydrogen embrittlement fastener failure Randy Lammers • Technical Instructor | Co-host YouTube series Würth Knowing Würth Industry North America The head of a 5/8-inch-diameter, zinc-plated socket cap screw bursts off

a piece of recently produced equipment and shoots, much like a bullet, across a manufacturing plant, through a metal toolbox — just missing a nearby worker. A 5/16inch wave washer fractures, causing a product recall of about $400,000. A hardened wood screw breaks, causing a chair to collapse and resulting in the loss of life.

Unfortunately, there are many other high-cost examples of product failures, leading to equipment malfunction, personal injury, or worse because of fastener fractures.

These can result from hydrogen-assisted cracking, more commonly known as hydrogen embrittlement or HE. This is a complex scientific subject with much research and several papers written to explain the phenomenon, along with ongoing testing and investigation. Despite years of accumulated insight, there are still risky choices made concerning HE in the fastener industry.

Hydrogen-assisted cracking in fastener applications Atomic hydrogen is one of the smallest-known elements and is all around us. The potential damage, at a micro-level, in hardened steel fasteners that have been electroplated is of particular concern. Hydrogen atoms are introduced to the steel

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An engineer at work at the WINA Quality Lab. in high concentrations during the pre-cleaning and electrolytic process of applying metallic materials (most commonly, zinc).

After electroplating, a layer of chromate/passivate is added to provide additional corrosion protection and good aesthetic values. This high concentration of introduced hydrogen provides an opportunity for these atoms to accumulate and become trapped within the steel’s molecular structure.

Depending on the metallic plating’s permeability, the plated surface finish acts like a barrier to hydrogen effusion.

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Externally applied load and/or internal residual tensile stress leads to a widening of the steel’s grain boundaries. And hydrogen atoms are highly mobile. Now consider such widened grain boundaries, where free hydrogen atoms accumulate to such a degree that pressure is created within the boundary. This accumulation of pressure can cause the grain boundary to crack open in susceptible hardened steel.

Eventually, the molecular structure of the steel is compromised and can no longer withstand the applied www.fastenerengineering.com

stress. The structure fails from internally cracked grain boundaries and a sudden burst of the total structure occurs. Granted, this fracturing process takes time. Typically, a delayed failure occurs one to 48 hours after fastener installation, once sufficient stress has been applied.

What is susceptible hardened steel?

Consider which is stronger, a candy cane or a piece of soft chewy taffy? Certainly, a candy cane is hard and has high tensile strength, but it’s also brittle. Taffy is soft, easily stretches in tensile pull, and is ductile. Now, think about creating pressure within the structure of a July 2022

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This is what hydrogen embrittlement looks like on a bolt.

candy cane. What would happen? It would likely explode or burst, which is how a hydrogen embrittlement fracture is described — as a burst.

What’s more: the surface of a hydrogen embrittlement rupture looks similar to rock candy. So, the hardness of a candy cane is highly susceptible to failure because of HE cracking.

What would happen if you applied the same pressure within the structure of a piece of taffy? It would likely stretch and relax, thanks to its soft ductile capabilities. The hardness of taffy would be considered non-susceptible.

This provides a simplified analogy of the correlation between steel hardness and susceptibility to an HE fracture.

For susceptible material hardness, reference ASTM F1941 and ISO 4042 specifications for electroplating fasteners. ASTM F1941 places the threshold above 39 HRC and ISO 4042 above 390 HV. When electroplating fasteners with material hardness in the susceptible category, specifications mandate the parts are baked after electroplating and before the addition of chromate/ passivate and/or any topcoat materials.

Baking facilitates the outgassing of the permeated hydrogen atoms.

Temperatures of 375-425° F (190-220° C) are applied for eight to 24 hours, depending on the fastener type, size, and strength, in combination with the

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plating system and process.

In recent studies, the practice of baking susceptible materials for four hours has proven inadequate for most fasteners.

To further avoid HE, some industry and company standards have placed the susceptible material hardness threshold at 32-34 HRC (~320 HV) as a precaution against manufacturing errors in raw material, fastener production, and electroplating process. SAE J429 Grade 8 and ISO 898 Property Class 10.9 have material hardness above this threshold and would fall into this susceptible category.

Unfortunately, these errors are common when buying from a supply chain with unknown sources and controls within the supply chain. It’s advisable to consider materials in this lower hardness range as susceptible, which should be baked when electroplated.

High-risk items: • Inch series socket cap screws, including button head and flat head • Metric property class 12.9 fasteners • Any spring action washer including wave, conical, Belleville, and helicallock washers

A close-up of hydrogen embrittlement at work.

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Now, what is the risk of electroplating fasteners with a material hardness above 39 HRC (390 HV)? The introduction of ASTM F1941 states in part: “With normal methods of depositing metallic coatings from aqueous solutions, there is a risk of delayed failure due to hydrogen embrittlement for case hardened fasteners and fasteners having a hardness above 39 HRC. Although this risk can be managed by selecting raw materials suitable for the application of electrodeposited coatings and by using modern methods of surface treatment and post heat-treatment (baking), the risk of hydrogen embrittlement cannot be completely eliminated. Therefore, the application of a metallic coating by electrodeposition is not recommended for such fasteners.”

Consequently, it’s advisable to avoid using any fastener with a hardness above 39 HRC (390 HV) that has been electroplated.

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A hydrogen embrittlement fracture in steel is commonly described to occur as a “burst.”

• Any spring steel clips • Retaining rings • Spring pins • Any part above 39 HRC (390 HV) that will or might experience tensile stress

What can you do?

Use low to non-hydrogen generating finishes, such as mechanically applied zinc, thermal diffusion zinc, or zinc-flake coatings. If the high strength of an inch series socket cap screw is not required for the application, use readily available metric property class 8.8 or stainless steel. There are less risky solutions to every potential HE part. Do research to ensure the ideal choice.

In conclusion, HE is a delayed failure not seen during assembly. It’s advisable to bake parts between 34 to 39 HRC (320 – 390 HV) when purchasing through an unknown or uncontrolled supply chain. Avoid electroplating fasteners with a hardness above 39 HRC (390 HV).

Hydrogen embrittlement is a complex scientific subject. Further investigation and studies are ongoing.

Stay informed as more information on this phenomenon is released. This is a serious topic and failure is typically paired with a high cost. The risk is not worth the reward. FE

WHAT DO YOU THINK? Connect and discuss this and other engineering design issues with thousands of professionals online

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Branson Ultrasonic solutions from Emerson are used to produce medical test strips, collection swabs, and complete, sealed test packages. Ultrasonic technology can also create a clean weld site and consistent join quality for various package shapes and sizes, including plastic containers, cartons, and more.

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How can

ultrasonic welding reduce your carbon footprint?

Patrick O’Sullivan • Product Specialist Branson Welding and Assembly at Emerson When it comes to fastening, joining, and assembling plastic materials, heat

sealing has been a commonly accepted joining technique since the 1950s. It’s a fast, efficient process that’s still used extensively today.

However, as companies are under increasing pressure to become more sustainable and reduce their overall carbon footprint, it’s worth questioning if heat sealing is the best environmental option.

Ultrasonic sealing or welding has been in existence for nearly as long (since the ’60s) and has proven just as fast and reliable. What’s more: it offers several notable advantages.

For example, it: • Consumes less electricity • Reduces the amount of plastic material required for a reliable seal • Seals bio-derived and recycled materials more effectively • Yields less waste • Uses zero adhesives, solvents, or other consumables.

Together, these features mean that ultrasonic welding can cut the carbon footprint of an assembly line by up to 75%.

• All images courtesy of Emerson

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Weld Surface In a conduction heat seal, a heated bar (red) is applied to either side of the mating surfaces (blue) to melt the plastic, and then pressure is applied to weld them into a bond.

Weld Surface In an ultrasonic weld, mechanical vibrations applied between two sealing surfaces create frictional heat that melts the surfaces, which are then compressed into a welded seal.

Heat versus ultrasonics Heat seals are a relatively simple process. Component surfaces are held together and heated sealing bars are applied on one or both sides. Heat flows (conduction) from the bars through the material to the seal interface, where the mating surfaces melt to form a bond. The conduction sealing controls — including the temperature, pressure, and dwell time — are based on the melt characteristics of the plastics to be joined.

Ultrasonic welding generates and applies heat and pressure differently. It generates heat by applying a vibration with a precise frequency and amplitude between the surfaces of the thermoplastic layers. It does so while controlling parameters such as force, pressure, and speed to optimize the weld results. The frictional heat melts the interior of these surfaces and, under pressure, creates a permanent bond.

Comparing energy use Since the heat required for heat sealing is generated by a resistance-heated bar, the sealing elements are held at operating temperatures for 100% of the time. This generates a lot of heat that’s transferred into the weld zone and the surrounding environment — meaning, energy is wasted.

Ultrasonic seals generate heat by high-frequency friction, with seals completed in as little as 100 milliseconds. The tooling is cool except during that brief time. Much more

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energy is required for resistance heating than for generating the ultrasonic sealing vibrations. The Energy Comparison table below shows the potential to reduce electricity use by 25%.

Energy Comparison

Seals per minute Equipment Energy use (W/hr) Daily energy use (W/16-hr day) Energy savings

ULTRASONIC SEALING

100

100

2 units x 50 seals/min.

1 unit x 100 welds/min

4 x 500W cartridge heaters = 2,000W/hr 32,000

1,500W power supply + 1,500W max.

24,000 assuming continuous operation At least 25%

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Comparing material To provide a high-quality closure, heat sealing generally produces a 0.5-inch seal. Let’s assume a package gets a 0.5-inch seal at the top and bottom. That means a full inch of material goes into the sealing area alone.

On the other hand, two comparable ultrasonic welds require only 0.25 of an inch of total package length (0.125 inches each on the top and bottom), resulting in a savings of 0.75 of an inch per package. The Material Comparison table shows the potential material savings using a six-inch bag as an example.

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HEAT SEALING

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Selecting the right adhesive can be a challenge

Material Comparison PACKAGE:

HEAT SEALS

ULTRASONIC SEALS

6

5.25

0.5 (1.)

0.125 (0.25)

Internal package height (in.)

5

5

Production rate (million)

24

24

Material savings/package

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0.75 in.

Net material savings

—

24 million x 0.75 in/36 or about 500,000 yards/year

Overall package height (in) Width per seal (x2) (in.)

Hard to bond surfaces can be difficult Application properties exceed standard adhesive offerings Two sides of adhesive are sometimes better than one

For heat-sensitive materials, which include non-fossil-fuel-derived biopolymers and some recycled materials, the high temperatures and longer cycle times involved with heat sealing can also lead to material damage.

This problem is eliminated with ultrasonics since heating is minimal and momentary. It can also be precisely set by the welder control.

One more consideration: unlike heat sealers, ultrasonic welders are unaffected by contamination in the weld area. Any product or residual oils in the sealing area during the filling process are squeezed out when the package is compressed and ultrasonic energy is applied. With heat sealing, the seal integrity can be compromised and, if so, the entire package and its contents must be discarded.

Ultrasonic welding offers important environmental and sustainability advantages compared to heat sealing and other technologies, including chemical sealants. However, the choice of which technology represents the ideal solution for a given manufacturing application is not always clear. Source an expert in the field that offers quality technology and support for your specific application. FE

CS Hyde Company specializes in adhesive lamination of hard to bond substrates like high performance polymer films.

With our in house lamination services we are able to produce single or double sided adhesive products utilizing 3M™ transfer adhesives.

Common adhesives we apply include 3M™ VHB®, Acrylic, High-Bond, Optically clear, and High Temperature silicone.

A food safety testing device performs safely while providing 100% contamination protection.

Ultrasonic welding is is used to create a strong bond that keeps contamination out.

Your worldwide source for high performance Tapes, Films, Fabrics, and Silicone

800-461-4161 sales@cshyde.com www.cshyde.com DESIGN WORLD

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Adhesive Choices: Epoxies versus hybrids or acrylics Jake Klaus • Marketing Director • Infrastructure Division – Adhesives Technology Corp.

Industrial adhesives come in as many colors, consistencies, and formulations as there

are specification requirements for these products. This means for every IBC, IRC, FBC, LABC, LARC, AC308, NSF 61 requirement, there’s a fast cure, high strength, medium strength, long pot life, non-sag, ultra-tensile-strength-super-non-sag-seismic-tested-for-cracked-anduncracked-or-medium-cracked-concrete adhesive solution that’s best for the job.

With all the options on the market, which one is ideal for your application? Given all the adhesive choices and variables for a project (such as the curing environment and potential budget constraints), it’s a conversation that could last for days. So, for now, we’re focusing on two major classes of products: epoxies and hybrids or acrylics.

The formulas An epoxy is formed by blending epoxy resin with some type of amine. After this combination cures for a moderate amount of time (>6 hours at 75° F), it forms long cross-linked polymer chains, known for strength, durability, and water resistance.

Epoxies are sensitive to the mix ratio (typically, 1:1 or 3:1) between the resin and hardener, so must be blended well to achieve full performance. It’s worth noting that low temperatures increase viscosity and reduce molecular mobility, which hampers the cross-linking (curing) of most epoxies.

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There are plenty of adhesive solutions available, so it’s important to narrow down the options based on your application. Consider factors such as temperature, bond strength, project time (to allow for curing), and the overall budget.

Vinyl ester — a type of hybrid adhesive — is formed by freeradical polymerization, made by the esterification of an epoxy resin with acrylic or methacrylic acids. This process happens rapidly (<1 hour at 75° F) due to curing via a chain reaction that can occur at both low and elevated temperatures.

Vinyl esters and hybrid urethanemethacrylates are less sensitive to the mix ratio (typically, 10:1) between the resin and catalyst. But they’re usually affected by the presence of moisture during cure, and much more so than DESIGN WORLD

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their epoxy counterparts.

In many cases, an epoxy or a hybrid will meet your specification requirement, so it’s important to know the key differentiating factors between these two primary classes of adhesives.

Temperature and bond strength The temperature at an installation site is often an important and relevant factor when deciding what type of adhesive to select.

Epoxies become harder to dispense at lower temperatures and cure very www.fastenerengineering.com

slowly as temperatures approach the 40° F mark.

At extremely high temperatures, epoxies are easy enough to dispense, but they begin to lose some of their performance properties, which may be far from ideal for certain applications.

When temperatures are either very high or low, a vinyl ester, acrylic, or hybrid can offer an alternative.

Applications that carry critical safety considerations tend to specify products based on their bond strength, and not every solution will meet these stringent requirements. Typically, epoxies outperform their acrylic and vinyl ester counterparts in this arena.

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A contractor dispenses Adhesives Technology Corp.’s ULTRABOND HS-1CC. Made in the USA, HS-1CC is currently the world’s strongest 1:1 anchoring epoxy and the first anchoring epoxy formulated to be IBC/IRC compliant in bulk and cartridge delivery systems.

Some hybrid adhesives also carry high bond strength numbers but are unlikely to compete with epoxies at the highest end of the bond strength chart. Therefore, when bond strength requirements are paramount, an epoxy is typically going to win the specification. This said, acrylic adhesives and hybrid formulations carry other beneficial characteristics that could make them ideal for your project, particularly when factors other than bond strength are important.

Additional considerations Although temperature and bond strength often dictate adhesive

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selection, there is a myriad of other factors to consider. For example, epoxies are moisture insensitive and some can be applied underwater.

But if time is a factor and you need a product that will install and cure quickly, think vinyl esters, hybrids, and acrylics. They cure fast for shorter return to service or load times. Now, what if you need to anchor in a large or deep hole? Epoxies are typically your best choice, thanks to lower viscosity options and longer working times. If you have a large job to cover, epoxies can also be used with bulkdispensing systems and are available in several size offerings.

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For every engineer and contractor on the job, there’s an accountant somewhere watching the budget, so cost is also a factor in deciding which adhesive is going to work. Generally speaking, epoxies will carry a lower cost per ounce. Epoxies also offer a longer shelf life, with some exceeding 24 months.

Acrylics and hybrids carry a larger price tag and usually come with a shelf life of 12 to 18 months.

However, they can make up the cost per ounce difference by providing less downtime on the project and higher constructability rates.

Clearly, you have options. There are often several formulations that will meet the specification for a given project so when in doubt, reach out to an adhesives manufacturer and leverage their knowledge.

Choosing the ideal adhesive for the job conditions can ensure a successful project that’s completed on time and on budget. FE

Comparing adhesives

Precision Laser or Ultrasonic Welds for Critical Plastic Components

Epoxies:

• Higher bond strengths • Moisture insensitive – some can be applied underwater • Longer working times • Longer shelf life • Better in large holes or deep embedment applications • Bulk-dispensing systems available • More diverse packaging options

Two market-leading weld platforms from Emerson meet growing demand for the assembly of complex plastic parts. Using patented Simultaneous Through-Transmission Infrared (STTIr®) technology, Branson™ GLX Laser welders deliver ultra-clean, aesthetically superior welds on parts with complex 3-D contours and delicate embedded electronics or sensors.

Branson™ GSX Ultrasonic welders feature an advanced electro-mechanical actuation system that welds even smaller, thinner parts with exceptional consistency and industry-low trigger force. Both welders offer real-time production monitoring and data collection to ensure superior quality.

Vinyl esters / acrylics / hybrids:

• Extremely fast cure for faster bolt-up times • Dispenses easily, even in freezing temperatures • Historically performs better in long-term creep • Perform better in elevated temperatures

Learn more at: Emerson.com/Branson

The Emerson logo is a trademark and a service mark of Emerson Electric Co. © 2020 Emerson Electric Co.

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From mining in Minnesota to a global corporation

How 3M continues to innovate Michelle Froese • Editor

When a handful of colleagues set up shop in Minnesota more than a century ago,

no one would have predicted their efforts would lead to a multinational conglomerate corporation, with global corporate operations in 70 countries and sales offices in another 200 locations. The founders of 3M Company — an acronym for Minnesota Mining and Manufacturing — were simply mining for corundum, a mineral ideal for making sandpaper and grinding wheels.

However, their mining efforts fell short, and corundum was never found. After a couple of years of persistence, they finally decided to purchase the necessary abrasive minerals from another source and constructed their first manufacturing building in 1905 — a two-story sandpaper plant in Duluth.

Bad luck seemed to follow. Not long afterward, the floor collapsed in the new facility as a result of the weight of the equipment and raw materials. Still, the 3M team persisted. In 1910, they hit a break. The company moved to a more central location in St. Paul, which helped visibility, and a few years later launched its first exclusive product: 3M Three-M-ite Abrasive Cloth. It could be used for commercial and industrial wood or metal sanding jobs.

“It’s a unique story,” shares Scott Buss, director, Global Key Accounts, Industrial Adhesives and Tapes Division at 3M. “While 3M started as a mining company struggling with sales, particularly in relation to mineral anorthosite, it eventually managed to successfully sell abrasives to the automotive industry — and to Ford, in particular.”

The Three-M-ite cloth was just the start. Afterward, the company introduced the world’s

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3M Bonding Process Centers support manufacturers with automated assembly solutions, with options to engage in interactive, remote, or in-person experiences. There’s a U.S. location in St. Paul, MN. first water-resistant and coated abrasive, 3M Wetordry Waterproof Sandpaper. It quickly became of interest to the auto industry because it let manufacturers use the product with water to reduce dust and decrease the friction that typically marred into a vehicle’s finish.

“Around then, one of our lab employees had overheard that two-tone cars were becoming a thing. To achieve the dual-tone look, an area of a vehicle was typically masked off using animal or natural-based glue and newspaper,” explains Buss. “So, they’d brush and mask off a car and then paint it. Long story short, this led to the invention of DESIGN WORLD

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masking tape.”

If you ever wondered how or when the Scotch brand tape products were developed, it started with masking tape for the auto industry and advanced from there.

“A few years later, 3M developed transparent tape using cellophane, which is no longer made with cellophane, so I’ll refer to it as ‘magic tape’ or what most now call Scotch Tape,” he says. 3M keeps the exact recipe for its Scotch Tape (yes, the one used on wrapping paper) a trade secret. Not long after that, the company invented the iconic, snail-like designed www.fastenerengineering.com

handheld tape dispenser.

This is the origin of how 3M became associated with tapes and bonding — and, eventually, adhesives.

“So much of what we’ve accomplished, and continue to accomplish, relates to assembling things and holding them together. We’ve noticed gaps in technology where we could invent a better or a previously non-existent solution,” he says. “But our work with adhesives really began early on and with learning how to best get minerals to bond to paper. To make sandpaper, the abrasive side needed to stick and hold up.”

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Bonding tape has advanced to offer reliable use in several different applications. Here, 3M X-Series Hi-Tack Transfer Tape is applied for recreational vehicle panel bonding.

Buss says demand for more industrial adhesives accelerated in the ’40s. “For example, 3M launched a neoprene rubber adhesive when natural rubber became short, primarily because of World War II.” It was initially used to bond hoses and gaskets. “This ability to assemble parts without a conventional fastener slowly began to gain more recognition and interest.”

In the ’50s and ’60s, structural adhesive films started being used in the aerospace sector to bond wings, fuselage components, and helicopter blades. “As an accepted practice, I’d say the aerospace industry was really one of the pioneering areas for adhesive use,” he shares.

Today, 3M’s tapes and adhesives are found in aerospace, automotive, electronics, medical devices, office supplies, and other consumer products.

The company currently has four large business groups — transportation and electronics, safety and industrial, health care, and consumer goods — with another 22 different divisions beneath them.

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global business management team and primarily focused on product assembly using liquid adhesives or pressuresensitive tapes.” He’s seen the changes in industry demands and the evolution of adhesives over time.

“Today, you have multi-material designs with one purpose: to decrease costs. To meet this goal, there are application-dependent considerations,” he says. “One is to reduce weight, say for fuel efficiency in an airplane.

Another is to distribute stress, which could mean energy absorption in the case of a vehicle crash. Then, there’s miniaturization, particularly in the Continued growth electronics sector like for smartphones.

Buss has certainly witnessed the Trends, such as light-weighting and growth. He began his career with 3M miniaturization, mean new materials as a process engineer in the industrial sector, primarily manufacturing pressure- have to be introduced.”

Tapes and adhesives provide a sensitive tapes. Then, he moved into solution that typically reduces the an application engineering role where weight of an application, at least he became more of a technical liaison, helping solve questions and applications compared to mechanical fasteners, and offers micro-dispensing options for on behalf of customers. those miniature assemblies. They also “I stayed in that sector for about 28 years, working in business development, meet multi-material designs.

“Take vehicles, for example, marketing, and sales. Now, I’m part of the “What’s nice is that the material science 3M offers crosses from division to division and industry to industry. So, because all of the technology is owned by the company, it’s accessible to each division” he says.

Essentially, this allows for a large toolbox of R&D and product innovation to draw from. Considering more than 60,000 3M products are used in homes, businesses, schools, hospitals, and other industries, it’s clearly made sense to share this insight throughout the company.

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Advanced Fastening and Sealing Technologies

PRE-APPLIED

THERMOSEAL

™

Thermoseal is an ND Industries pre-applied process in which a proprietary hybrid medium strength sealant is applied to fasteners, giving them excellent sealing and threadlocking capabilities.

Thermoseal is designed for high temperature, high pressure applications where other thread locking materials fail. In addition, it may also provide a lower coefficient of friction than alternative preapplied thread lockers to help with ease of installation.

PRE-APPLIED PROCESS FEATURES How It Works Thermoseal is a dual-encapsulated dry film adhesive which is inert on-part until engagement with the mating fastener.

During installation, shearing forces cause the microsphere capsules to rupture, mixing the two components, initializing the reaction and curing to form a strong chemical bond and effective seal.

High Pressure Seal Thermoseal processed fasteners exhibit exceptional sealing properties and the ability to withstand pressures in excess of 5800 psi (40MPa) under challenging conditions. Thermoseal can replace the need for PTFE tape due to its better reproducibility and installation speed.

CONTACT US

ND Industries 7-22.indd 89

Surface Insensitive

Chemical Resistant Upon fastener installation Thermoseal cures to a cross-linked molecular structure; making it one of the most resistant types of adhesives. Oil, gasoline, salt spray, acids, solvents, and water have virtually no effect on parts when introduced after final cure.

Long Shelf Life

Thermoseal processing is compatible with most fastener sizes, configurations, materials and finishes. The use of an acrylic based microsphere adhesive ensures that a strong reliable lock and seal is formed.

Thermoseal processed fasteners have an on-part life of 1 year and will remain inert until a cure is activated by engagement with a mating thread.

Email: info@ndindustries.com www.ndindustries.com

CERTIFICATIONS & ACCREDITATIONS

Surpasses DIN & IFI Thermoseal processed fasteners meet or exceed all torque requirements of DIN 267-27, IFI 125, IFI 525, as well as automotive adhesive coated fastener performance specifications.

Product Specifications Break Away Torque: >20 Nm Prevailing Torque: <2.5 Nm Lubricity: 0.19 Temp Range: -40°C to 220°C

AS9100:2009, Rev. C • QPL-18240F • QSLM • ITAR • ISO-9001:2015 • ISO/IEC 17025:2005 CE Directive 2006/42/EC • ISO-14121 • ISO-12110-1/12110-2 • IEC-EN 60204-1

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Fastening + Joining

they were originally made of steel.

Conventional fasteners or welding made sense because these options do better with thicker or similar materials. But now, cars are made of plastic, aluminum, and a mix of alloys and composites.

Adhesives and tapes can join this range of materials…so, you can bond two different metals and not worry about galvanic corrosion, right? They also offer some energy absorption or vibration dampening,” he says. “It just makes sense.”

Despite early adoption by the aerospace industry, however, educating product designers and engineers about advances in adhesives has always been a large part of Buss’ job. It’s typically not taught in school.

“I was trained as a mechanical engineer and at the time, there were not too many young engineers and students learning about chemical bonding or attachment in my program or within the industry.” Buss went to the University of Minnesota. “While we were taught how to bend metal and how to

select fasteners correctly, there was unfamiliarity with chemical bonding and some disbelief about its advantages.”

So that’s been the main focus of his career at 3M, especially during the last 15 years. “It’s important to us that we offer technical support and properly educate customers, ensuring they understand and fully realize the potential of an adhesive or a tape.

By sharing insight from aerospace, transportation, and electronic markets, we can show how certain types of assemblies are well-suited to adhesives and can also derive benefits aside from just bonding.”

Additional benefits could include better overall aesthetics, process flow or production efficiency, or a performance benefit (such as lightweighting for fuel efficiency in a vehicle) that would not be available through other fastening methods.

“However, I’m in no way suggesting it’s a competition between assembly methods. Mechanical fasteners, welding, and adhesives or tapes should

all be complementary to one another and be used when and where ideal depending on the application,” Buss says. “Chemical bonding has advanced and offers several advantages that many design engineers are unaware of but could benefit from.”

And 3M is showing no signs of slowing down as it continues to innovate new options. This includes formulas with lower odor (common in chemicals) for improved worker comfort, reduced or non-flammability (so the adhesives are safer to store and transport), and greater sustainability features (such as fewer volatile organic compounds).

“There’s always new applications, new materials to bond or temperature ranges to comply with, or greater strength and durability measures to ensure,” adds Buss. “So, we’re always working to ensure success and extend what’s possible.” FE

Finding the ideal adhesive or tape for bonding typically involves testing them in an application. As substrates

have different characteristics, it’s important to fully understand the adhesion process and a product’s features before choosing one for your assembly.

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Selecting the Optimal Washer Flat: Generally used for load disbursement Tab/Lock: Designed to effectively lock an assembly into place Finishing: Often found on consumer products Wave: For obtaining loads when the load is static or the working range is small Belleville: Delivers the highest load capacity of all the spring washers Fender: Distributes a load evenly across a large surface area Shim Stacks: Ideal for simple AND complex applications

Boker’s Inc. 3104 Snelling Avenue Minneapolis, MN 55406-1937 Phone: 612-729-9365 TOLL-FREE: 800-927-4377 (in the US & Canada)

bokers.com

Why custom converting is beneficial for adhesive applications CS Hyde Company specializes in converting adhesive tapes, polymer films, fabrics, and silicone.

We utilize high tech converting technology to provide custom solutions for adhesive applications like low surface energy substrates, thin bond lines, or adhesive waste reduction. We specialize in single or doublesided adhesive systems as well as liner application or zone adhesive application. Adhesive can be laminated in house utilizing 3M™ transfer adhesives. Commonly laminated materials include PTFE, Mylar, PEEK, Nylon, and more. We offer rotary tool die cutting services ideal for kiss cut parts in peel and stick applications.

For specialized parts like VHB™ mounting gaskets, we utilize digital knife cutting machinery to produce rapid prototype parts, while reducing waste through an automatic nesting program.

CS Hyde Company www.cshyde.com Lake Villa, IL 60046

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Emerson electric actuators provide application flexibility Emerson high performance electric actuators offer superior application flexibility Emerson has launched a versatile range of precise and highly repeatable rod-style cylinders. Typically only one screw type is available, but the AVENTICS SPRA Electric Actuators offer a precision ball screw, which provides exceptional durability and accuracy, a cost-effective lead screw and roller screws for precision, speed and heavy loads. Compliance with the ISO-15552 standard, four sizes, a wide range of accessories and mounting options and an online calculation tool and configurator allows configuration to exacting application requirements that help improve sustainability and efficiency.

Read More: Emerson.com/AVENTICS TM

Contact Info : 160 Park Ave., Florham Park, NJ 07932 www.emerson.com/en-us

NBK Suggests and Supplies Solutions with Specialty Screws NBK’s history and craftsmanship date back to 1560 when the company first began. Our predecessors were proud to offer their advanced knowledge, state-of-the-art technology and using this today, we have developed various products.

One of NBK’s strengths in the high-tech sector is our Specialty Screws such as vacuum application screws, anti-galling screws, specialty metal screws such as Inconel and Hastelloy, and more.

Furthermore, NBK deals with unique functional screws like low-profile screws, small head diameter screws, captive screws, miniature screws (less than M2), ball transfer screws, ball plungers, clamping screws, and more. We are proud to support our customer’s projects with NBK’s Specialty Screws and their unlimited matching applications. We also offer customized screws!

NBK America LLC 307 East Church Road, Suite 7 King of Prussia, PA 19406 Phone: 484-685-7500 https://www.nbk1560.com/en-US/ 92

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A family-owned business since 1955, ND Industries specializes in the development of innovative materials and processes which increase the safety and reliability of fastener assemblies.

Headquartered outside Detroit, Michigan, ND serves a global market with divisions across the continental US, facilities in Taiwan, and licensees around the world. ND’s core business revolves around the application of a wide variety of custom formulated materials onto fasteners and assemblies to aid in functions such as locking, sealing, masking, lubricating, and noise and vibration damping. ND also manufactures a line of bottled adhesive and sealant products under the Vibra-Tite brand name for MRO and retail use.

ND Industries, Inc. www.ndindustries.com info@ndindustries.com

Fastener Engineering This area has long been one of the most read and sought after by our engineering audience! From screws to bolts and adhesives to springs, these critical but often overlooked components are the key to every successful design.

FastenerEngineering.com will serve readers in the mechanical design engineering space, providing news, product developments, application stories, technical how-to articles, and analysis of engineering trends. This site will focus on key issues facing the engineering markets around fastener technology, along with technical background on selected components.

Engineering September 2019

A supplement of Design World

covering nuts, bolts, rivets, screws, u-clips, eye bolts, washers and more.

ADDITIONAL RESOURCES: • Special print section in select issues of Design World • Fastener Engineering monthly newsletter

LEARN MORE AT: FASTENERENGINEERING.COM DESIGN WORLD

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Product World Battery pole and busbar connectors Phoenix Contact phoenixcontact.com New battery pole and busbar connectors make it safer for workers to install energy storage systems (ESS). Both connectors are touch-proof and pluggable, with ratings up to 1,500 V DC and 350 A. While most of today’s ESS do not require 1,500 V capability, these high-voltage connectors will meet future demands. ESS designers can use the connectors in tandem or separately based on the specific application requirements. The battery pole connectors are installed on the front of battery modules, while the battery busbar connectors are installed on the back.

The battery pole connectors rotate 360°, so they can accommodate the best angle to arrange heavy cabling.

They have mechanical coding that protects against polarity reversal and prevents incorrect mating. The busbar connectors have a drawer-style, slide-in connection, eliminating the need for field wiring. Users can scale the modular connection system to meet application requirements, eliminating the constraints of cabling and allowing higher power distribution.

Switching power supplies IDEC Corporation lp.idec.com/powersupply.html The PS3V power supply family switching power supplies provide an excellent price/performance ratio and build upon the previous generation’s reputation for reliability and functionality while adding new features like push-in connections for simplified installation. The PS3V accepts a wide input voltage range from 85 to 264VAC, providing an output of 5, 12, and 24VDC with capacities ranging from 15 to 150 W, depending on the model. The output voltage is user adjustable ±10%, and the 24VDC versions deliver efficiencies ranging from 83 to 88%.

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A robust yet compact metal housing protects the PS3V power supply, and it can be mounted in four orientations by direct panel mount or DIN rail bracket. Mounting brackets are the same as the previous PS3X series, providing easy upgrade options. Models are available with traditional screw terminals or push-in terminals for rapid one-step wiring. An operating temperature range from -25 to +70° C ensures these power supplies work in the most challenging environments.

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For further information about products on these pages visit the Design World website @ www.designworldonline.com

Electromechanical cylinders Bosch Rexroth boschrexroth-us.com The EMC-HP is a high-force, high-precision, low-maintenance version of Bosch Rexroth’s electromechanical cylinders (EMCs). Designed for heavy loads up to 100 kN, the new actuators are robust, compact, and low-maintenance. Based on the reliable planetary screw drive, users will benefit from continuous power even under harsh conditions. This is thanks to the new oil-bath lubrication and the optional water cooling directly on the screw itself. As with the other members of the EMC family, a fully digital process, from selection to ordering, shortens the engineering time.

The new EMC-HPs are currently being launched on the market in three sizes, 115, 130, and 160 (housing diameter) with protection class IP65 and are suitable for a range of different heavy-duty applications with strokes of up to 1,500 mm: from pressing, forming, and riveting to tensioning, positioning, and testing.

Each EMC-HP uses planetary screw assembly (PLSA) to meet high standards for control accuracy and dynamics. Thanks to a dynamic load capacity (Cdyn) of up to 189.5 kN, high loads can be quickly and accurately moved as part of an energy-efficient process even in complex motion profiles — with axial forces of up to 100 kN and at speeds of up to 0.83 m/s.

Infrared temperature sensors AutomationDirect automationdirect.com New infrared pyrometers from Optris use noncontact sensing to determine the surface temperature of an object based on its emitted infrared radiation. They can read the temperature of inaccessible or moving objects without difficulty. The Optris CS LT series infrared pyrometers are suitable for temperature measurement in small and narrow environments. They feature rugged stainless-steel construction, a broad measuring range (-50° to 1030° C [-58° to 1886° F]), and a rating for use in ambient temperatures up to 80° C (176° F) without the need for additional cooling.

Optris CSmicro series miniature infrared pyrometers can be used in ambient temperatures up to 120° C (248° F); their small size allows them to be installed in tight spaces. The infrared pyrometers are CE marked, RoHS compliant, and have a 2-year warranty.

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Ad Index AllMotion ..................................................................4 Altech Corporation ..............................................17,19 AutomationDirect .................................................1 B&R Industrial Automation ...............................15 Bay Associates Wire Technologies, Inc. ......9 Canfield Connector ..............................................65 Chieftek Precision ................................................12 Del-tron ....................................................................47 DeviceTalks .............................................................70 Digi-Key Electronics .............................................11 Dodge Industrial ...................................................7 Exair Corp ................................................................5 Fabco-Air, Inc. ........................................................53 FAULHABER Micromo ........................................61 FESTO .......................................................................43 Interpower ...............................................................13,29 Kingway USA .........................................................22 METCASE ................................................................27 Misumi USA, Inc. ...................................................BC Opto 22 ....................................................................3 PBC Linear ..............................................................2 Permco .....................................................................IBC Rotor Clip .................................................................54 Smalley Steel Ring ...............................................35 Sorbothane ............................................................65 THK America, Inc ...................................................IFC Trim-Lok ...................................................................23 US Tsubaki ..............................................................25 Whittet-Higgins .....................................................21

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Engineering July 2022

A supplement of Design World

Inside: 78_ How ultrasonic welding can change your carbon footprint 82_ Adhesives Choices: Epoxies versus hybrids or acrylics

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86_ From mining to adhesives: The growth of a global conglomerate

Reducing Risks A practical understanding of

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