The potential to be one of the most consequential technology shifts shaping our future.
EVER EVOLVING WIFI
Taking the next steps with Wi-Fi 6E - Wi-Fi 7 radio compliance regulations.
PUSHING YOUR BUTTONS
Simon Chaput and Boreas Technologies puts Canada on the haptics map.
INFLECTION POINT
Advances in automotive technology are driving many trends and updates in vehicles.
0201HT Series
Lowest Profile, High Q Chip Inductors
16
• Measure just 0.58 x 0.46 mm and only 0.28 mm tall
• Exceptionally high Q and lower DCR than thin-film types
• 14 inductance values from 0.5 to 13 nH
• Ideal for high-frequency applications such as cell phones, wearable devices, and LTE/5G IoT networks
A wireless journey: from Nortel to present day
The landscape of wireless technology is ever evolving, marked by continuous advancements that propel the industry forward. Today, innovations in wireless designs and technology are transforming how we connect, communicate and conduct business. Never was that more evident than during the pandemic. To fully appreciate the current breakthroughs on Canadian soil today, it is essential to look back at the historical benchmarks set by Nortel and BlackBerry, which both ascended to the global stage back in the day.
In the 1980s and 1990s, Nortel Networks, formerly known as Northern Telecom, emerged as a global leader in telecommunications. Nortel played a pivotal role in the development of digital and wireless communications technologies. One of its significant achievements was the advancement of digital switching technology, which replaced the old analog systems and greatly improved the efficiency and reliability of telecommunications networks. Nor tel’s innovations didn’t stop there. The company was at the forefront of the early development of Code Division Multiple Access (CDMA) technology, a critical advancement that allowed multiple signals to occupy a single transmission channel, significantly enhancing the capacity and quality of wireless communications. This technology laid the foundation for the mobile phone networks we rely on today.
Rise & fall of BlackBerry
In the early 2000s, Research In Motion (RIM), later rebranded as BlackBerry, revolutionized mobile communication with its introduction of the BlackBerry
smartphone. Known for its secure email capabilities and physical QWERTY keyboard, BlackBerry quickly became a staple in the business world. At its peak, BlackBerry dominated the smartphone market, capturing the imagination of millions of user s worldwide.
However, BlackBerry’s success was short-lived as it failed to anticipate the shift towards touchscreen interfaces and app-centric ecosystems introduced by competitors like Apple and Google. Despite its decline, BlackBerry’s contributions to mobile security and enterprise communications remain influential.
Modern advancements
Today, the advancements in wireless technology are more dynamic and transfor mative than ever. Several key developments are worth noting:
• 5G Technology: The rollout of 5G networks represents a quantum leap in wireless communication. With its ultra-high-speed, low-latency capabilities, 5G is set to revolutionize industries such as autonomous vehicles, telemedicine, and the Internet of Things (IoT). Companies are racing to deploy 5G infrastructure to harness these benefits.
• Wi-Fi 6: The latest iteration of Wi-Fi technology, Wi-Fi 6, offers significant improvements in speed, capacity, and efficiency. It addresses the growing demand for high-performance wireless connectivity in environments with a high density of devices, such as smart homes and offices. Wi-Fi 6’s ability to handle multiple devices simultaneously with minimal interference is a game-changer for consumer and enterprise applications.
• Mesh Networking: Mesh networks, which use multiple nodes to create a seamless
and robust wireless network, are gaining traction. This technology enhances coverage and reliability, particularly in large or complex environments.
• IoT Integration: The integration of IoT devices into wireless networks is transforming industries from manufacturing to healthcare. These devices rely on advanced wireless technologies to communicate and operate efficiently. Innovations in low-power wide-area networks (LPWAN) are enabling IoT devices to function over long distances with minimal energy consumption, expanding the possibilities for smart cities and connected ecosystems.
• Edge Computing: As wireless networks become more sophisticated, edge computing is emerging as a critical component. By processing data closer to the source rather than relying on centralized cloud servers, edge computing reduces latency and enhances real-time decision-making capabilities.
The Road Ahead
The advancements in wireless technology continue to accelerate, driven by a combination of technological innovation and market demand. As we look to the future, the legacy of pioneers like Nortel and BlackBerry serves as a reminder of the importance of vision and adaptability in this fast-paced industry.
For electronics engineers and businesses, staying abreast of these advancements is crucial. Embracing new technologies, understanding their implications, and integrating them effectively will be key to maintaining competitiveness in an increasingly connected world.
STEPHEN LAW Editor slaw@ept.ca
Canada’s information leader for electronic engineers and designers
JULY/AUGUST 2024
Volume 46, Number 5
READER SERVICE
Print and digital subscription inquiries or changes, please contact Angelita Potal Tel: (416) 510-5113 Fax: (416) 510-6875
Email: apotal@annexbusinessmedia.com
Mail: 111 Gordon Baker Rd., Suite 400 Toronto, ON M2H 3R1
EDITOR Stephen Law slaw@ept.ca · (416) 510-5208
WEST COAST CORRESPONDENT Mike Straus · mike@brandgesture.ca
SENIOR PUBLISHER Scott Atkinson satkinson@ept.ca · (416) 510-5207
ACCOUNT MANAGER Joanna Malivoire jmalivoire@ept.ca · direct 866-868-7089
MEDIA DESIGNER Svetlana Avrutin savrutin@annexbusinessmedia.com
AUDIENCE DEVELOPMENT MANAGER Anita Madden amadden@annexbusinessmedia.com (416) 510-5183
GROUP PUBLISHER Paul Grossinger pgrossinger@annexbusinessmedia.com
CEO Scott Jamieson sjamieson@annesbusinessmedia.com
EP&T is published eight times per year by ANNEX BUSINESS MEDIA 111 Gordon Baker Road, Suite 400 Toronto, ON M2H 3R1 Tel (416) 442-5600 Fax (416) 510-5134 annexbusinessmedia.com
SUBSCRIPTION RATES Canada – $59.67 one year; $95.88 two years USA – $136.68 (CAD) per year International – $187.17 (CAD) per year
Single copy – Canada $15.00
ISSN 0708-4366 (print) ISSN 1923-3701 (digital)
PUB. MAIL AGREEMENT NO. 40065710 Return undeliverable Canadian addresses to: EP&T Circulation Department, 111 Gordon Baker Rd. Suite 400, Toronto, ON M2H 3R1
EP&T. All rights reserved. Opinions expressed in this magazine are not necessarily those of the editor or the publisher. No liability is assumed for errors or omissions or validity of the claims in items reported. All advertising is subject to the publisher’s approval. Such approval does not imply any endorsement of the products or services advertised. Publisher reserves the right to refuse advertising that does not meet the standards of the publication. Occasionally, EP&T will mail information on behalf of industry-related groups whose products and services we believe may be of interest to you. If you prefer not to receive this information, please contact our circulation department.
PRINTED IN CANADA
NEWSWATCH
AUGMENTED REALITY
VUEREAL UNVEILS ADVANCED AR DISPLAY TECHNOLOGY
VueReal, a Waterloo-based pioneer in MicroSolid Printing, has launched its ColourFusion microDisplay, an innovative augmented reality (AR) display that sets a new standard in visual clarity and colour precision. The solution is relevant for multiple industries spanning consumer electronics, automotive, aerospace, medical, and industrial.
Enabled by VueReal’s MicroSolid Printing platform, the microDisplay integrates cutting-edge full color microLED technology, an image quality enhancement algorithm, and LCOS (Liquid Crystal on Silicon) systems to deliver high resolution, high grayscale and color depth, high contrast, and unprecedented low power consumption through a power-saving algorithm and variable frame rates.
At the core of the solution is VueReal’s MicroSolid Printing platform, which addresses the foremost challenge in the mass adoption of microLED displays—the efficient transfer of microLEDs from wafer to backplane. VueReal’s patented process excels in transferring millions of micrometer-sized LEDs with unparalleled throughput, scalability, and high yield.
The ColourFusion microDisplay technology utilizes VueReal’s proprietary MicroSolid Printing to fabricate full color microLED displays, known for their exceptional brightness and energy efficiency. By enhancing these displays with LCOS technology, VueReal has achieved a breakthrough in effective resolution that surpasses existing AR displays in the market.
PHOTONICS
ONE SILICON CHIP PHOTONICS CHIP ASSISTS DRONE NAVIGATION
One Silicon Chip Photonics (OSCP) says it has developed an inertial optical system that matches the accuracy of navigational sensor s used in the aerospace industry at a fraction of the cost. While these chips do not have any moving parts, the firm says it is more accurate than commercial-grade Micro-Electro-Mechanical Systems Iner tial Measurement Units (MEMS IMUs) and they enable
ColourFusion microDisplay is an augmented reality display that sets a new standard in visual clarity.
Source: VueReal
highly accurate navigation even when GPS signals are not available.
Montreal-based OSCP, has partnered with French multinational company Thales, which is developing autonomous rail systems and has been testing OSCP’s prototype in the field. Using sensors like OSCP’s in rail transport will increase vehicle autonomy which — along with moving block signaling — has the potential to increase rail capacity by up to 50% and cut energy consumption by 15%, according to Thales.
In addition to rail transport and military applications, drones and AVs are also increasingly being used in agriculture, mining, mapping and survey work, as well as in trucking, delivery and other transport industries.
Using OSCP sensors in rail transport will increase autonomy - and the potential to increase rail capacity by 50%.
Matrix Technology Ltd, a Markhambased industrial materials and specialty wire harness manufacturer, has acquired X-ACT Engineering Technologies, a Calgary-based specialty cable assembly solution provider, with an additional location in Houston,TX.
Celebrating its 50th year of operations, the move by Matrix solidifies its commitment to serving diverse markets, including the oil & gas, military and general industrial markets. With more than 25-years of operations, X-ACT has earned a stellar reputation for its specialty wire harness solutions catering to industrial and military applications. The integration of both industry players expands the combined footprint to 125,000-square-feet, while also uniting an energized workforce.
The newly formed Matrix/XACT Group will be guided by chief executive
officer Bill Dubé, who brings more than 30 years of manufacturing operations experience to the position.
AUTOMOTIVE
STELLANTIS RECALLS VEHICLES TO FIX SOFTWARE GLITCH
Car maker Stellantis has recalled nearly 1.2 million vehicles in Canada and the U.S. to fix a software glitch that can disable the rearview cameras. A company investigation found that the vehicles have radio software that can inadvertently shut down the cameras. About 126,500 vehicles in Canada are affected by the recall.
Stellantis, formerly Fiat Chrysler, will fix the problem with an online software update that some vehicles have already received. The company says it has no reports of injuries or crashes, but it still is urging owners to follow the recall instructions.
SEMICONDUCTORS
GOV’T COMMITS $100M TO SEMIS IN BROMONT
Source: IBM Canada
The federal and Quebec governments are spending close to $100 million to boost the country’s manufacturing capacity for semiconductors, which are vital in technologies ranging from artificial intelligence to quantum computing.
Ottawa will invest $59.9 million to help fund IBM Canada’s semiconductor packaging facility in the town about 70 kilometres southeast of Montreal. The investment will also go toward the Bromont-based MiQro Innovation Collaborative Centre, a research group that tries to speed up the commercialization of components in digital technologies.
The Province of Quebec has offered IBM Canada $38.9 million in loans to help the company buy equipment, increase capacity at its Bromont plant, and create a new generation of switches.
Visit ept.ca for the latest new products, news and industry events.
Merging power and data ecosystems enable data centres on wheels
BY DENIS SOLOMON, TEKTRONIX
The merger of the power and computing segments of the electronics industr y is an incipient trend, but it is irreversible, and it has the potential to be one of the most consequential technology shifts shaping our near future.
The drive trains of hybrid and fully-electric vehicles are, of course, characterized by power electronics – some of the most sophisticated power electronics systems devised. These systems work in concert with suites of digital electronics in the service of a wide range of vehicular functions, from driver-assist features to controlling comfort systems in passenger cabins
Modern vehicles – paragons of power electronics – are some of the most computationally rich edge devices being made. Power electronics and data center electronics coming together in modern vehicles isn’t just a combination; it’s an integration. That observation is the heart, though not the whole, of the new trend we see.
Integrating these two previously distinct engineering disciplines will require new tools and techniques, and that was the impetus behind the recent acquisition of Elektro-Automatik (EA) by Tektronix, a Fortive company. Tektronix is a leading provider in test and measurement (T&M) solutions, and EA is a leading supplier of high-power electronic test solutions for energy storage, mobility, hydrogen, and renewable energy applications. Together,Tektronix and EA will develop some of the tools necessary to build the most effective, efficient new vehicles.
This is where the electronics industry is heading. At CES 2024, Intel CEO Pat Gelsinger noted that the BOM (bill of materials) of every automobile represented by electronics is 4- or 5 percent today, will be 12 percent by 2025, and will be 20 percent by 2030.
“Everything about the car – as we think about this digital transformation – it needs more compute, it needs faster memory, we have to become more power-performance efficient, and every aspect of it is becoming more silicon-centric,” Gelsinger said. “This transition – as you quote my mentor, Andy Grove – ‘it’s in a period of disruption.’”
Today’s vehicles already incorporate a rich complement of sensors, and successive model years will be equipped with more. These
sensor s produce boggling volumes of data, data that is most valuable when processed in real time. That takes considerable computation power.
Even if it is a stretch to describe any single vehicle as a data center on wheels, what happens when you aggregate all the computational power of every vehicle on the road?
The amount of processing power is staggering, easily exceeding some of the largest data centers. The amount of real-time data that is generated, meanwhile, is unimaginably vast.
The power of data
What is important for this new trend, is that as the amount of data increases, its potential usefulness expands exponentially. Advanced driver assist systems (ADAS) are already helping to keep motorists and pedestrians safer than ever before. But the good that any isolated vehicle’s ADAS systems can do is limited to that vehicle and its viewable surroundings.
What if every vehicle could know what every other vehicle knows? The enhanced safety inherent in isolated ADAS systems is instantly multiplied. Say, for example, any single vehicle detects a pedestrian still in a crosswalk after a light changes, or if the Department of Transportation has just barred access to a street, or if poorly secured cargo from a delivery truck just spilled in the two left lanes. That vehicle would proceed with caution.
That information could be just as useful to other vehicles not in sight however. That could include vehicles about to approach the otherwise unexpected conditions from around a corner, for example, or those heading for the area but still hundreds of yards or even miles away. Those vehicles might, for example, advise their drivers to take alternate routes.
This type of activity is illustrative of vehicle to vehicle communications and of V2V’s conceptual cousins (vehicle to grid, vehicle to home, and the broadly inclusive vehicle to everything – V2G, V2H and V2X, respectively).
Automotive manufacturers have already begun designing vehicles with the ability to talk to each other. The expected benefit is sharply reducing collisions with other vehicles (cars, trucks, scooters, bicycles, etc.), pedestr ians, and stationary objects.
Some limited level of traffic management should be possible with V2V, with vehicles coordinating among themselves, but what about V2X (vehicle to everything)? What if vehicles can communicate with other systems – notably with municipal systems and other infrastr ucture?
If municipalities actively tap into real-time V2X road data, it would be possible to perform holistic, city-wide traffic management. Traffic management can become that much more efficient when traffic lights and other road systems are included.
Smart cities
And traffic doesn’t just mean vehicles anymore – if vehicles are detecting pedestrians anyway, it means foot traffic could be tracked and potentially managed too. Imagine being able to dynamically coordinate both vehicle and foot traffic before and after stadium events, or at dinnertime near a local restaurant row.
City resources – traffic control, lighting, emergency infrastructure – can be allocated, moved, activated or deactivated based on need, with the assurance that it’s all being done in response to actual ground conditions at that very moment. Imagine being able to coordinate with commercial delivery vehicles when necessary. It should be possible to use real-time road data to make all emergency response operations (police, fire, medical, disaster, etc.) faster, safer, and more effective.
Data ideally should flow both ways. Data from municipal systems – traffic management, lighting, safety surveillance cameras – can all be used by vehicles to operate more efficiently. Urban planning should become better informed with an ongoing source of rich, real-time traffic and environmental data.
This vast new trend we see is in fact a gestalt of these and other trends:
• Vehicles becoming rich with electronics (including those with internal combustion engines [ICE])
• E-mobility, including EVs
Photo: Tektronix
• Vehicle to everything (V2X) communications
• Smar t cities and IoT
These are familiar trends, true, but they are all being worked on mostly separately. Together, however, they complement and amplify each other in very real ways. They have synergy, in the old, dictionary-definition sense of the word.
V2X is an idea that’s been kicking around for some time, but it has never been widely implemented. There are several reasons for this, but an important factor is that V2X got tangled up with the fitful progress of 5G network build-outs and technology development.
V2X was one of the most important use cases proposed for 5G when it was first being formulated roughly 10 years ago. The build-out of 5G by communications service providers started out slowly, however, and many automotive OEMS began exploring alternative V2X communications options.
Now, many years later, 5G network coverage is sufficient to support widespread V2X in most places; furthermore, some of the newer 5G technology revisions have made 5G better suited for V2X. A growing number of major car manufacturers have
begun designing 5G connectivity into their vehicles.
V2G becomes integral to this trend, as EVs will not only draw power from the grid but also return it. During peak demand, data centers and other operations that represent heavy draws on the grid can pull energy from networks of connected vehicles.This will help balance the grid and ideally reduce dependency on carbon-emitting energy sources.
The smar t city is another enticing concept that has been slow to develop for the simple reason that few cities have the financial wherewithal to implement and maintain wide-scale new technology projects.
Now, modern vehicles automatically make their environs smart, given their growing capabilities, expanding number, and computational power – with little or no municipal investment required. Cities should be able to tap into the real-time V2X data to become even smarter. Urban areas will become more responsive to citizen needs, optimizing resources, and reducing environmental footprints through intelligent data and energy management.
All of this hinges on the marriage of digital electronics, sensors, processing power, and memory with power electronics in the form of EVs. The fusion of these technologies will be underpinned by artificial intelligence (AI) and machine learning (ML) algorithms. AI/ ML will optimize the data flow among vehicles, and also between vehicles and data centers, ensuring efficient use of resources and enhancing the capabilities of autonomous systems.
This integration should also produce yet another benefit: energy efficiency. The heat generated by onboard computing systems can be shunted to battery systems. EV battery performance is commonly compromised by frigid temperatures; waste heat from digital electronics can be used to improve battery performance when it’s cold.
Conversely, the excess energy from the
vehicle’s power system can support data processing activities, leading to an eco-friendly and energy-efficient solution.
As these technolog ies merge, security and privacy will remain paramount. Robust cybersecurity measures will be essential to protect sensitive data transmitted among vehicles and between vehicles and data centers. Privacy-preserving techniques will be vital in maintaining individual anonymity amidst the vast data exchange.
Enabling the trend
Power electronics and data center electronics are two engineering disciplines that have thus far remained mostly distinct. But if they are going to both be contained within a single product – EVs, their merger cannot be merely conceptual. To reap all of the potential benefits, it is necessary to integrate the two.
Building a technology ecosystem that encompasses cars, cities, data centers and communications systems that behaves optimally requires a holistic approach.
T&M is integ ral to every step of a product’s lifecycle.Together, Tek and EA will enable a more connected world where power and data communications are integrated into a single, streamlined process.
Summary
We have a big, transformative trend that involves the convergence of several others, which have yet to reach their full potential. In part, this is because they depend on the merger of the power and computing segments of the electronics industry. Understandably, the ability to enable this gestalt of trends, or megatrend, is only just beginning to come together too; Tek working hand-inglove with EA is a prime example.
Denis Solomon is the Automotive Market Segment Leader at Tektronix, responsible for Tektronix & Keithley automotive solutions. https://www.tek.com/en
The next step of Wi-Fi evolution
Wi-Fi 6E and 7 with Automated Frequency coordination (AFC)
BY JUAN M. GONZALEZ, GLOBAL DIRECTOR FOR THE CENTER OF EXCELLENCE WITHIN NEMKO GROUP
Wi-Fi technology has been incredibly innovative, its worldwide economic value is projected to be around $5 trillion USD by 2025. Wi-Fi has changed how we interact and share information. From its creation to the most recent versions, Wi-Fi has constantly surpassed limits in speed and availability.
This article examines the considerable advancements heralded by the emergence of Wi-Fi 6E and Wi-Fi 7 technologies and their radio compliance regulations.
These latest developments on Wi-Fi were enabled with the release of spectrum and standards from both the FCC (FCC15.247 rules update) and ISED (RSS-248 standard release), where Wi-Fi 6E and Wi-Fi 7 devices can now access the UNII-5 to UNII-8 bands, which adds 1.2 GHz of contiguous spectrum (5925MHz to 7125MHz) for WiFi operations, enabling gigabit speeds, lower latency, and higher capacity.
However, these new bands for Wi-Fi are not a greenfield spectrum, and Wi-Fi devices must use a novel mechanism called Automated Frequency Coordination (AFC) system, which dynamically assigns available frequencies and power levels based on geographic location and the presence of protected incumbents.
The Journey to Wi-Fi 6E and Wi-Fi 7
The evolution of Wi-Fi began with the release of the first 802.11 protocol in 1997, which saw updates like 802.11b & 802.11a in 1999 and continued to evolve until the introduction of 802.11ax at the end of 2019. Over two decades, Wi-Fi operated on approximately 600 MHz of non-continuous spectrum, supporting billions of devices. This changed with the FCC’s 2020 release and ISED’s 2021 release, which added 1.2 GHz of continuous spectrum for Wi-Fi 6/6E, and the later development of Wi-Fi 7.
The main drivers for the advancement of Wi-Fi technology have been:
• The demand for higher data rates and increased bandwidth.
• The need to manage increased user density to prevent network congestion.
• The Inter net of Things (IoT) is pushing for lower latency connections.
• Improvements in antenna design, which have enhanced signal propagation and
The new requirements for the 6GHz band are only appliable for Standard Power Access Point (AFC Controlled) and Fixed Client Device (AFC Controlled).
coverage. These factors have collectively pushed the boundaries of Wi-Fi technology, leading to the development of more advanced and efficient wireless communication standards that meet the growing demands of modern connectivity.
Navigating the spectrum
We have praisedWi-Fi6E andWi-Fi7 for their amazing features, such as the superhighway, huge bandwidth, greater performance, more security, enhanced user experiences, and so on. It sounds perfect, right?
Most of this is true, but there are also some challenges and limitations with any innovative technology, and one important aspect is coexistence with registered users working in the same 6GHz frequency range.
The reality with the Wi-Fi6E and Wi-Fi7 operating in the 6GHZ Band: The 6Ghz band is not an empty space in the radio spectrum waiting to be filled. There are already m any existing users (Fixed communications, Mobile communications, and Fixed Satellite Ser vices S-E and E-S).
To prevent overcrowding the Spectrum and ensure Co-existence between the newly added 6GHz spectrum for Unlicensed
operation, the FCC, ISED, and other agencies have imposed some significant rules and conditions for proper operation. For situations where there is possible interference with existing 6GHz incumbents, the Wireless Innovation Forum and Wi-Fi Alliance, in coordination with the FCC and ISED, worked together and created a mechanism to coordinate the spectrum use to avoid interference issues.
For 6GHz operation, this mechanism is called an Automated Frequency Coordination (AFC) System. The basic idea in WiFi6E and Wi-Fi7 is that a new wireless device (Only applicable for Standard Power Access point and Fixed Client Devices due their higher transmitting power levels) will check a registered database to verify its operation will not affect a registered user where the AFC system automatically determines and provides lists of frequencies that are available for use by Standard Power Access Points and Fixed Client Devices operating in the 5.925-6.425 GHz (UNII-5) and 6.525-6.875 GHz bands (UNII-7).
Test requirements/standards for Canada
In the USA, Wi-Fi6E and Wi-Fi7 devices that use the 6Ghz band (5925-7125 MHz)
must follow the regulations of FCC Title 47 Subpart E. This subpart covers the rules for Unlicensed National Information Infrastructure (U-NII) devices that operate in the 5.15-5.35 GHz, 5.47-5.895 GHz bands, and 5.925-7.125 GHz bands. This means that the same standard that applies to Wi-Fi 5GHZ bands and all the technical requirements (from Power Limits “Clause a” to Device Security “Clause i”) also applies to the new 6GHz band.
New 6GHz band
The additional/new requirements for the 6GHz band are only appliable for Standard Power Access Point (AFC Controlled) and Fixed Client Device (AFC Controlled), and they are described in clauses (k), (l), (m) & (n). Out of the 16 Sub-sections in section (k) of the standard, which covers “Automated Frequency coordination (AFC) System,” only Sub-Sections 1, 8, and 9 are relevant to End User Devices such as “Standard Power Access Point and Fixed Client Device.” The other Sub-Sections only pertain to AFC Systems. Sections (l), (m), and (n) of the standard specify the incumbent protection requirements by AFC System for (l) Fixed Microwave Services, (m) Radio Astronomy Services & (n) Fixed-Satellite Services.
The relevant Standard for Canada (ISED) is RSS-248. This Standard establishes the regulations for Radio Local Area Network (RLAN) Devices Operating in the 5925-7125 MHz Band, and it was designed specifically for the 6GHz bands that are used by Wi-Fi 6E and Wi-Fi7 devices. If we compare RSS-248 and FCC 15.407 requirements, we can see that all Testing required by RSS-248 is also required by FCC 15.407, but RSS-248 Issue 2 does not include Very Low Power Devices (Which FCC 15.407 standard recently added).
Conclusion
In this article, we have examined the latest developments in Wi-Fi technology, with a specific focus on spectrum access and radio compliance. We explored the exciting innovations in Wi-Fi 6E and Wi-Fi 7, as well as the challenges and opportunities associated with accessing the 6 GHz band
through Automated Frequency Coordination (AFC).
These advancements promise faster, more reliable, and versatile wireless networks, catering to a wide range of applications across diverse domains.
However, it is essential to recognize that as technology evolves, so do the regulatory complexities. Remaining informed about the latest compliance requirements is crucial
for seamless integration and optimal performance. Wi-Fi’s journey toward a smarter, interconnected world continues, and we trust that this article has offered valuable insights into its future.
Juan M. Gonzalez is global director for the Center of Excellence within Nemko Group, specialists in finding solutions for Wi-Fi 6E and 7 testing and compliance. For more info contact: juan.gonzalez@nemko.com
Boréas: Switching it up with haptics
BY STEPHEN LAW, EDITOR EP&T
In the past few years, the haptics sector has undergone a transformation of sorts, expanding beyond its niche beginnings into a burgeoning field poised for mainstream adoption. Bromont Quebec-based BoréasTechnologies clearly stands at the forefront of this evolving technology - seizing new market opportunities with its innovative solutions.
In today’s world of creating electronic devices, haptics is playing a growing role in creating immersive and intuitive user experiences. Boreas has been pivotal in these developments, championing the advantages of piezoelectric actuators over traditional Linear Resonant Actuators (LRA) and Cylindrical Resonant Motors (CRM). Their innovations have led to the miniaturization of force-sensing and vibration systems, making haptic feedback more precise and responsive.
“We are seeing a trend in terms of industrial design toward either seamless or removing buttons or more advanced user experience. This means more designers are considering how they can use haptics – adding value to what they deliver to the customer,” said Simon Chaput, president and founder of Boréas Technologies.
Read the differentiation
“Today, most tech devices are multi use, such as a smartphone. When using it, you’re taking a picture, or you may be gaming on it - two different user experiences. Haptics is able to read that differentiation - between alternate use cases of the same device. While before it was more like you have one device that could do many things through its display, but the user experience was still not quite there,” Chaput explained.
As the haptics landscape continues to evolve, Chaput remains dedicated to pushing the boundaries of what is possible, ensuring that haptics not only meet but exceed the expectations of a rapidly growing market.
“A few years ago, we realized that we actually need to be more than just a chip supplier. We really need to add a complete engineering team, including mechanical engineers and software engineers - to be able to design a complete system. We spent a lot of our time on mobile application, and we’re also working to implement our technology into PC, tablet and IoT designs,” Chaput stated.
Cultural or regional preferences can influence the design and implementation of haptic feedback into a smar tphone or any other interface, according to Chaput.
“There can be regional differences or preferences around the world. Take a global company like Samsung as an example. They sell their phones in North America and in Korea, but they feel slightly different in use. That’s because Samsung knows Koreans like it to feel slightly different than users in North America,” explained Chaput.
“So, this regionalization of use may have the OEM provide default settings, which lets the user change it a little bit. For us, it means that if we’re talking to a design team that is based in Korea, or in China or in the US, we also need to change our demonstrator a little bit to use waveforms or effects that may be more appealing to people from that region. A lot of what we’re doing is educating the market,” said Chaput.
For the engineers responsible for implementing haptics into a design, Chaput says the main challenge remains the interaction between the mechanical and the electrical teams. Unlike in the past, where electronics was more or less designed in isolation – Chaput says that there needs to be communication or “synching” between the mechanical team (exter nal design) and the electronic team (internal circuitry) today.
Automotive certified
Boreas has marked some milestone achievement in the past couple of years – now boasting 50 employees, with more than half involved with engineering. Having launched multiple haptic buttons recently, the firm continues to add to its portfolio of more than 30 technology patents. While keeping all R&D within Canada, Chaput has established local support in both Taiwan and China, as well as the U.S. –to be closer to its international customers. The firm also recently qualified for CQ 100, necessary to do business in the automotive space. As a result, Boréas developed its third-generation, piezo-based haptics for automotive, consumer and mobile applications. The BOS1211 chip lets automotive OEMs and Tier 1 suppliers add highly responsive, customizable tactile feedback to the buttons and sliders in the car’s central display and steering wheel — offering much faster response time and localized feedback, as well as extended frequency range — to touch interactions. This is a dramatic improvement over older haptic technologies, such as linear resonant actuators (LRAs), which have much slower startup and ramp-down time as well as a very limited frequency range.
Gated by their larger size and inherent performance problems, LRAs deliver a ‘mushy’ feel to the touch because the LRA isn’t localized to the actual button that’s pressed. In contrast, piezo haptic buttons and sliders deliver “crisp” effects that can be customized to mimic the feel of mechanical buttons because they can be located under a specific button, according to Chaput.
“What we are able to provide them with our technology is really combining the best of both worlds, like adding haptics to either a screen or smart surface where you get the same feeling as a mechanical switch,” Chaput noted. “But you also get the reconfigurability of the touchscreen. So I think we think that this will be kind of the sweet spot in terms of providing something that is easy to use, provides premium feeling, and is also very configurable.”
Photo: Boreas Technolgies
You would be hard pressed to find another cord maker who changes 100 lb. die molds up to 40 times a week just to meet our country-specific cord set orders, including IEC 60320 cords and components. More common is for cord makers across the globe to run one mold for weeks at a time to produce hundreds of thousands of the same cord—without all our quality checks! Interpower testing exceeds the testing requirements set by household agencies such as UL, CSA, and VDE. We test our cords throughout every phase of the manufacturing process. And test them again before shipping!
“We test more than the standards require for our own benefit. We do so because it lends better reliability to our design.”
—Ron Barnett: Interpower Product Development Manager
Interpower cords come ready to use right out of the box to safely connect to your mains power. No reconfiguration is needed.
You will also find a few robots with ridiculous names working alongside dedicated humans who actually make our cords and components. You will find a can-do culture, superior raw materials, and a quality plan ensuring your built-to-last power cords work every time. Want your cords hanked, coiled, tied, bagged or boxed? Need them with special barcodes or labels? Done. Interpower offers other value-added options such as lengths, colors, and cord clips.
At Interpower, what we say about our cord sets and components is actually what we make. In a world with overburdened electrical grids, you’re going to need reliable cords whether plugging into a standard country-specific wall socket, an accessory power strip or power distribution unit, or a generator.
• 1-week U.S. lead-times
• In-stock cords ship the same day
• Quick-change molding process
• No minimum orders
Scan the QR Code to Learn More
‘We’re at an inflection point’ – experts discuss automotive electronics
BY MATT MCWHINNEY, GROUP BIZ DEV MANAGER & KIRK ULERY, DISTRIBUTION BIZ DEV MANAGER, MOLEX AND SHAWN LUKE, TECHNICAL MARKETING ENGINEER, DIGIKEY
Changes in the automotive industry are a hot topic. Advances in technology are driving many trends and updates in vehicles, ranging from wide-scale trends like zero-emission cars and autonomy to niche trends like miniaturization, energy storage methods and more.
Today, vehicles have more electronics than ever before. Consumers and transportation professionals alike are demanding more capabilities from their vehicles: advanced safety features, infotainment options, enhanced secur ity, and passenger ease and comfort, among others.
Power and interconnect components are fundamental to driving vehicles—and many other modes of transportation—forward. Three automotive component experts from two industry-leading electronics companies—Shawn Luke, technical marketing manager at Dig iKey, and Matt McWhinney and Kirk Ulery, business development managers at Molex—recently discussed the driving factors in current automotive design.
As automakers rush to make cars smarter and more connected, the number of electronic components needed to power them will continue to increase. In fact, according to Statista, electronics are expected to make up 50% of the cost of a new car by 2030.
“The explosion of electronic features in vehicles offers such a blank canvas,” Ulery said.
“Wherever we end up in terms of electrified vehicles and other propulsion systems, electronics will be far and away one of the most key components in vehicles moving forward.”
Electrification enables innovation
The electrification of automobiles has opened the door to innovative new vehicle designs. Without the need to accommodate a traditional internal combustion engine, auto manufacturers have more flexibility for where to distribute batteries and charging ports, the ability to increase the amount of space for passengers or cargo, and more.
This has led to an increased number of new EV manufacturers entering the market, offering a wide variety of makes and models. At this point, many are still expensive and lack standardization across the space. However, this increased variety offers consumers more style and customization options, and the cost of the vehicles will likely decrease as technology advances and production ramps up.
“It will still be some time before there is a common layout for electric vehicle design because it’s a horse race for new technologies and innovations,” McWhinney predicted.
“Designs in the automotive industry tend to be very rugged, reliable and well-proven, but in this period of rapid change, there are a lot of platforms that are still in their infancy – essentially very expensive prototypes.”
Regardless of the manufacturer, make, or model, all electric vehicles require reliable power transmission and high-speed data transmission to enable real-time, software-guided decision making. The advancement of microprocessors has also led to a paradigm shift in automotive design with the introduction of the software-defined vehicle platform, which manages the functionality and behavior of vehicle systems. With less reliance on hardware comes increased modularity, flexibility and connectivity – fewer par ts and wires are needed to manage an extremely complex system.
“We’re at an inflection point where we can’t really add any more wiring to vehicles,” Ulery explained. “Automotive has started to borrow from the computer industry, in that we now have a two-wire Ethernet standard that can run in the gigahertz range, so we’re able to reduce the amount of wiring in the vehicle. The 48-volt [electrical system] is another example – you can now go to smaller wires, and with zonal architectures in the software-defined vehicle, you can have one controller and those devices are all in the same bus with a single wire to connect them all. We’re going to see less copper connector content, but vehicles will be better eng ineered and more capable for the higher connectivity speed requirements you’ll see in future vehicles.”
It’s electric (or Hybrid)
Although automakers are focusing efforts on producing battery electric vehicles, U.S. consumers are hedging their bets while charging infrastructure and vehicle ranges catch up. In 2023, The Associated Press reported that the growth rate of hybrid
vehicle purchases in the U.S. increased by 76%, and the growth of electric vehicle sales has stalled.
“We’ve had fits and starts on electrification in North America,” Ulery said. “If you’re going more than 100 miles at a time, you know charging infrastructure needs to be addressed.” “The hottest ticket in town on a lot of platforms is simply getting a hybrid,” McWhinney added. “The economy, and maybe even political administrations, will have an impact in terms of how electric vehicles are adopted.
Still, electric options are growing in adoption beyond consumer vehicles. As commercial fleets set their sights on sustainability, some of the vehicles used for final-mile delivery, public transportation, and light- and medium-duty vehicles used in truckyards are turning to battery electric, plug-in electric and alternative fuels like hydrogen.
“At the 2024 Work Truck Week in Indianapolis, basically everything smaller than a semi-truck was available with an electric motor, and there were quite a few hydrogen-powered systems, which from an environmental standpoint are zero-emission,” Ulery added.
Specifying automotive components
Modern passenger vehicles contain an average of 80 sensors, 100 electronic units and a whole lot of wiring. Each of these components must meet a rigorous set of standards in order to perform well in the demanding environments a car experiences – weather and moisture, varying road conditions, high temperatures, vibrations and more.
“Ruggedness and reliability are huge for transportation,” Luke said. “Some of the components in vehicles need to last for
decades. With long timeframes like that, it might take a long time to get a fleet ready for the changes that are happening with components, such as USB-C standards for charging cables, which consumers expect to find when traveling in a car or plane.”
There are several certifying bodies that set the standards for the parts used by auto manufacturers, including the Automotive Electronic Council (AEC) and the US Council for Automotive Research (USCAR). These organizations define performance requirements and carefully review and certify components that are approved for use in automotive settings. Recognized globally, AEC-qualified (AECQ) components are typically high-quality, rugged and reliable parts that can take a beating on the road without sacrificing performance.
Some additional considerations to keep in mind when selecting components for automotive designs include:
• Modular ity: is the part easy to replace by the owner or a repair shop if needed?
• Contact Geometr ies: how many times can the component be plugged in and unplugged?
In short, does the connector do its job?
• Efficiency: does the part use energy wisely, or does it dissipate extra power?
• Use Case: is the part built to specification to meet the use case? Under-qualified parts may only survive rather than function, and over-qualified parts may limit design flexibility.
• Convenience for Assembly: will the assembly line be able to install the part repeatedly at scale based on where it’s located in the vehicle?
• Safety: if the part fails while the vehicle is in motion, is there a backup in place to prevent an accident?
“There are two sides to the coin when it comes to risk assessment and specifications for automotive components,” McWhinney said. “With the advent of not only survivability, but functionality, sometimes the specification needs to be redefined or re-upped. On the flip side, perhaps that specification is over spec and there’s too much cost built in, or it limits design flexibility. Specsmanship is increasingly important as architectures are evolving.”
“What’s great about the interconnect space is that you can make modular pieces that can be swapped out,” Luke added. “It feels so much like table stakes, but it’s underrated how important the interconnect is in automotive design.”
Above all, the experts agreed, in automotive designs, safety must come first.
“The thing we can’t over-emphasize enough is the safety aspect,” Ulery said. “When your computer doesn’t work, you simply reboot it. You can’t do that when you’re running a computing bus in your vehicle and you’re cruising at high speeds. That’s a completely extra level that we have to consider in everything we do.
“We’re always looking at the latest and greatest when it comes to components – how we can add the newest features for the best performance, and we want to do it quickly, but we’re dealing with people’s lives, so we have to make sure that the reliability is ironclad.”
The road ahead
Looking to the road ahead, consumers will likely continue to demand increasingly advanced features for safety and comfort, as well as electric vehicles and other modes of transit that reduce reliance on fossil fuels.
“Electrification is simply not stopping,” McWhinney said. “If anything, it’s probably speeding up.”
Throughout it all, the trend of miniaturized automotive electronic components will continue, according to McWhinney.
“The advancement of microelectronics has led to more microprocessors being installed in vehicles that are ramping toward the software-defined vehicle platform,” he said. “That doesn’t mean every element in vehicles will be dynamically controlled directly at that point by software, but the rearchitecting of the control systems in that direction has vast implications.”
A larger number of microprocessors in vehicles could fuel many innovations that rely heavily on incredibly fast data processing on the edge, including autonomy. While still several years away, autonomous vehicles could be commonplace as soon as 2030. Most people are already familiar with and comfortable using semi-autonomous features like cruise control in cars or “autopilot” in planes. In the intervening years, the dr iver or pilot will likely still need to be engaged in the process and working.
The transportation and automotive industries will continue to drive innovation for many years to come, and suppliers like Molex and DigiKey will continue to provide the components and services necessary to accelerate that progress.
Matt McWhinney and Kirk Ulery are business development managers at Molex, leading global provider of connector solutions.
Shawn Luke is a technical marketing engineer at DigiKey, both a leader and continuous innovator in the high service distribution of electronic components and automation products worldwide.
The key to unrestricted access
Explore millions of components for your next design
Although a trek to this active volcanic island is strictly prohibited, you have unlimited access to millions of electronic components, from well over a thousand leading brands engineers know and trust. Discover the hottest components for design.
mouser.com
BAYONET COUPLING CONNECTORS MEET
MIL-DTL-26482 REQUIREMENTS
WEALD ELECTRONICS
LMH range of bayonet coupling connectors provide a cost-effective combination of price, size, weight, contact size, robustness and reliable quick-connect and are designed to perform to the requirements of MIL-DTL-26482 (previously MIL-C-26482) Series 1 and Patt 105. LMH series connectors are also manufactured to IECQ-CECC spec BS/ CECC 75201-003 and BS 9522 F0017. Devices are available for signal and power applications and are manufactured with bonded insulators and contacts that are 100% pressure-tested during assembly to provide a reliable environmental seal even when unmated.
ESS Spring Pin sockets can be customized for specific test height, force, plating finish, materials, etc. The spring pin functions as the interface between the IC package and the circuit board. These contacts support up to 34GHz bandwidth with standard designs, and with customization, impedance can be matched for highest electrical performance. IC packages have various application
requirements, which is why customization is critical to meet the specific IC test requirements.
Degson DG238 lighting connector optimizes efficiency by simplifying designs and moving away from timely traditional wiring methods. Easy to use and tool-free connection, product’s compact design is suitable for different conductor types (solid, stranded). Featuring double wiring holes, product accommodates AWG 22 ∼ 14 AWG wire ranges. Devices provide fast wiring, with push-in termination technology.
INTERCONNECT SPEEDS UP WIRING PROCESS, INCREASES EFFICIENCY
PHOENIX CONTACT
Push-X technology speeds up wiring processes and increases efficiency. The system is suitable for all types of conductors, whether rigid or flexible, with or without ferrules. The wiring process releases a pretensioned spring, establishing a safe and gas-tight conductor connection. This means that even the smallest flexible
conductors can be connected without using tools. The technology permits one-hand operation. The orange actuating push button, which is clearly marked with an X, indicates by its force-guided position whether a conductor is connected. https://www.phoenixcontact. com/en-ca/push-x-technology
WIRED
INTERCONNECT DEVICES SERVE HARSH ENVIRONMENTS
L-COM
Bulgin Series of wired connectivity products for harsh environments consist of power entry modules, circular power connectors, circular data connectors, push-button switches, battery holders and fuse holders. Products provide ingress protection ratings such as IP69K, IP68 and IP66, making them suitable for applications such as industrial, commercial, marine/wastewater, transportation, medical, agricultural and food processing. The flangemount power entry modules (PEMs) are C14 style ac outlets with a choice of 6.3mm quick-connect or 2.8mm solder terminal connections.
https://www.l-com.com/ bulgin-products
WIRE-TO-BOARD CONNECTOR HAS 0.5MM TAB-WIDTH I-PEX
ISH18 wire-to-board connector provides a 0.5mm tab-width, with high resistance to heat and vibration. Device has a narrower 1.8mm pitch compared to firm’s existing ISH connectors, which deliver a 2.0 mm pitch. Product’s
terminal shape ensures low-insertion forces, even with a high-pin count of 40 pins. Product withstands 125℃ temperatures, as do the other products in the ISH series.
https://www.i-pex.com
TINY CONNECTOR
DELIVERS BLIND-MATE PANEL MOUNTING HIROSE ELECTRIC
HR34P Series panel mount miniature connector guides itself into the correct mating position with blind mating ability. Constructed with self-aligning elements, device is commonly used for rack-to-panel connectivity in base stations, industrial machinery, medical equipment and more. Connector is suitable for applications where the electrical receptacle is recessed or hidden in a way. The circular connector features a floating screw design that provides a degree of play to absorb misalignment when mating. A gap between the panel and the screw enables floating of ±0.5 mm in X and Y directions.
https://www.hirose.com/en/ product/series/HR34P
MILAERO CONNECTORS REDUCE SIZE, WEIGHT GLENAIR
Series 806
Mil-Aero connectors provide size and weight savings while meeting key performance benchmarks for use in harsh vibration, shock and environmental. Products feature mechanical design innovations including durable mechanical insert retention, radial seals and triple-ripple grommet seals. The reduced thread pitch and re-engineered ratchet prevents decoupling problems. Product series feature size 22HD and 20HD contacts, as well as size 8 power and high speed El Ochito, quadrax, and fiber optic options.
9169-000 Series single-piece wire-to-board card-edge connectors provide robust beryllium copper compression contacts and insulation displacement contacts that make it easy to establish reliable, high-signal-integrity connections in a wide range of harsh environment lighting, industrial, and consumer electronics applications. Devices combine two field-proven solderless contact technologies that make it easy to establish high-integrity connections and deliver electrical and mechanical performance in harsh-environments. https://www.kyocera-avx.com/ products/connectors/wire-toboard/9169-000-series/
RUGGED CONNECTOR
ACCOMMODATE MICROCOAX CABLE TYPES
AMPHENOL RF
TNC portfolio of reverse polarity, rugged connectors accommodate micro-coax cable types including 0.81mm, 1.13mm, 1.32mm dual shielded, 1.37mm and RG-178. Devices support frequencies up to 9GHz and feature a hex shaped body that supports the use of a torque wrench for mating and unmating. RP-TNCs on ultra-flexible micro-coaxial cable types are suitable for industrial, wireless, military and broadband applications.
https://www.amphenolrf.com
COAX/OPTICAL HYBRID MODULES ENABLE HIGH-SPEED VIDEO PROCESSING
TE CONNECTIVITY
NanoRF 75 Ohm coax/optical hybrid modules is engineered to help meet the high-speed, high-density requirements of next-generation video capture and processing in aerospace, defense and marine applications. Module features a 75-ohm matched impedance in both contact construction and interface, minimizing signal loss during cable
transitions. Devices feature spring-mounted backplane contacts, providing float to help ensure accurate contact alignment and reliable, low-loss signal transmission, even under extreme conditions. Module delivers a first-of-its-kind blend of high-speed coaxial and fiber-optic connections for video signals up to 18 GHz, all within a small form factor compatible with existing VPX architectures. www.te.com
USB C PLUGS & SOCKETS SAVE SPACE, ACCELERATE DATA TRANSFER
EMX ENTERPRISES
Keystone Electronics series of USB Type C Plugs and Sockets deliver faster data transfer speeds, increased power transmission and smaller pcb footprints. USB-C technology is now the new standard for charging a whole range of electrical devices and firm’s USB 3.1 ‘Type ‘C’ interconnects are suitable for use with future high-tech devices such as HD video, data and
charging ports without separate power adapters. Possessing a small footprint, the USB’s deliver pcb real estate reductions to accommodate a variety of devices allowing them to be plugged in backwards, upside down.
WIRE-TO-BOARD CARDDATA-SIGNAL HYBRID CONNECTORS SAVE SPACE
MOLEX
MX-DaSH family of data-signal hybrid connectors unify power, signal and high-speed data connectivity in a single connector system. The wire-to-wire and wire-to-board connectors support the transition to zonal architecture and address the full range of emerging applications requiring reliable data transmission. Devices are available with sealed and unsealed options to optimize next-gen automotive architectures with assorted environmental and design requirements.
https://www.molex.com/en-us/ products
With a strong legacy of excellence and innovation, the LEMO Group is a global leader in providing highperformance custom interconnect solutions. From the depth of the oceans to the far reaches of outer space, no matter how harsh the environment may be, our connectors and cable solutions are chosen, wherever connections are too critical, precious, or vital to fail. Offering over 90,000 product combinations that continue to grow through custom specific designs, our subsidiaries and 20 distributors have
built a global network of strong, dedicated local resources with unmatched technical expertise and understanding of customer requirements. Thanks to our global network, we serve more than 150,000 customers in over 80 countries worldwide. All our staff of 2000 people are united to accomplish the same mission: to guarantee to our customers interconnect solutions that exceed their current requirements and anticipate their future expectations.
One-to-One local engineering expertise and technical support for system integration
Strong supply chain and global distribution network Custom interconnect solutions for specific project requirements including rapid prototyping Certified interconnect solutions in compliance with industry standards
Vertical integration ensuring reliable, highquality interconnect solutions and sustained availability
LEMO Solution Portfolio
6 12345
ORIGINALS
REDEL
OPTIMA
SUPREME
SPECIALTIES
CABLES
SERVICES
Cable assembly services (single-end, double-end,
Custom solution (connector, cable, device)
Signal integrity end-to-end services
Many standard features include:
• Solder, crimp or print contacts (straight or elbow)
• Multipole types from 2 to 114 contacts
• Temperature range: -55 C to 250 C
• Mating Cycles: >5000
• High packing density for space savings
• Multiple key options to avoid cross mating of similar connectors
• 360° screening for full EMC shielding
• High Speed: up to 10 Gb/s
• Watertight connections IP 68 rated
• Pressure rated from 30 Bars to 120 Bar (special assembly needed).
LEMO products are designed and manufactured according to rigorous and controlled processes. Inspection and traceability of products are systematically ensured in compliance with our standards. LEMO’s commitment to quality excellence of interconnect solutions has been recognized within the industry.
Reliable connections when failure is not an option
For over 75 years, we have been there for you to provide solutions wherever your connections are too precious to fail. We look forward to keeping innovation alive for you, with you.
What defines performance in high-speed digitizers?
How to optimize your selection for any application
BY ANDREW DAWSON, VITREK LLC
Today’s advanced, PC-based digitizers for high-speed data acquisition are necessary for myriad applications – ranging from signal analysis, lidar, ultrasound imaging and non-destructive testing, to communications, particle physics, mass spectroscopy and more. This article describes the unique performance parameters engineers should use when selecting a high-speed dig itizer.
Tech platforms help solve problems
Today’s highest-performance high-speed digitizers are installed on a shared electrical bus, such as a PXI or VXI bus within a dedicated instrument chassis or a PCI Express (PCIe) bus within most modern PCs. Modular digitizers may be integrated with other modular instruments under the control of a custom software application to create custom automated test equipment.
A 4-channel, 16-bit, 1000 MS/s digitizer card is shown in Figure 1. On the bottom of the card is the PCIe edge connector used to install it in a PCIe slot within the host PC. Once installed, the card’s SMA signal connectors emerge from the back of the PC chassis.
Specs to differentiate digitizers
Digitizer companies generally advertise three key specifications: channel count, vertical resolution and maximum sampling rate to indicate perfor mance.
Channel count
The channel count is simply the number of separate electrical signals that a digitizer can acquire. Generally, a digitizer is equipped with only a single acquisition sequencer, so that signals from all channels, while different, are all acquired in an identical fashion – namely, using the same sampling rate and trigger.
Vertical resolution (Bit depth)
Vertical resolution, specified in bits, reveals the number of discrete digital levels into which the vertical input voltage range of a digitizer is divided. This number of levels is equal to 2B, where B is the number of bits of resolution. For example, an 8-bit digitizer divides the vertical input range into 28 = 256 discrete levels. By contrast, a 16-bit digitizer
Fig.2. Figurative illustration of the relative accuracy of a 4-bit, an 8-bit digitizer ((typical of DSOs) and the 16-bit depth characteristic of the higher-end digitizers.
divides the vertical input range into 65536 levels, which proportionately increases the sensitivity to signal features by a factor of 256.
Figure 2 shows how bit depth impacts signal clarity
The value of high resolution is evident in applications where there are signals with high dynamic range—that is signals combing both high and low amplitude components such as those mentioned in the introduction.
More than vertical performance
In the process of converting an analog signal into a digital one, distortion can occur. A pure sine wave, together with a sine wave that has been compromised by the addition of broadband signal noise and by signal distortion - can manifest as attenuation near the input range limits, which is the typical precursor to signal clipping.
Consequently, the true measure of the vertical performance of a digitizer is not its
nominal vertical resolution but the ENOB (Effective Number of Bits). ENOB is the effective resolution that is achievable in practice accounting for signal distortion and random noise introduced by the digitizer.
The 16-bit RazorMax PCI Express (PCIe) digitizer in the example (Figure 1) exhibits the industry’s best ENOB of up to 12.1 bits.
Absolute vs. relative accuracy
There is an important distinction between the absolute and relative accuracy of digitizers. The absolute accuracy of a digitizer descr ibes how close its measured voltage values correspond to true absolute voltage reference standards. By contrast, relative accuracy specifies the fidelity of the shape of the acquired waveform with no reference to absolute reference standards. Using onboard calibration techniques, a high-speed dig itizer may achieve absolute accuracies of an order of 0.1% of the full-scale input voltage range. In most digitizer applications, however, users are principally concerned with relative accuracy, which is specified by the Dynamic Parameters. The fidelity of a signal acquired by a digitizer device may be compromised by three distinct factors:
Addition of random noise by the digitizer to the acquired signal.
Distortion of the acquired signal by the digitizer.
Irregularities in uniformity of the time intervals between samples acquired by the digitizer arising from imperfections in the ADC clocking signal.
Maximum sampling rate
The sampling rate, usually measured in Mega Samples per second (MS/s), refers to the number of samples acquired by a digitizer per unit time. Nyquist sampling criterion requires the sampling rate to be at least twice the maximum frequency that a signal contains.
Importance of Frequency Response
While the sampling rate is a key digitizer specification, an often-overlooked element of its time-domain performance is its frequency response curve. This curve is measured by acquiring a fixed amplitude
Fig. 3. Frequency response curve of the Gage digitizer shown in Fig. 1. The vertical red line indicates the 600 MHz analog input bandwidth (or -3dB roll-off frequency) of the digitizer.
sine wave with a digitizer and determining apparent measured sine wave amplitudes over a broad frequency range.
The frequency response curve for the RazorMax PCIe digitizer is shown in Figure 3. Frequency response curves function to show the analog input bandwidth, which is the frequency beyond which the digitizer attenuates a sine wave signal by 3dB or more. The bandwidth can be viewed as the -3dB roll-off frequency of the low-pass filter that a digitizer effectively presents to an input signal.
A common digitizer rule-of-thumb requirement is that the maximum frequency component within a signal acquired by a digitizer must be less than the digitizer’s bandwidth.
It is worth noting that the Nyquist sampling criterion employs and suffers from a similar simplification as the digitizer bandwidth rule-of-thumb. The Nyquist criterion requires 2X oversampling of the maximum signal frequency (or signal bandwidth) under the assumption that a signal has a brick wall spectrum, with no frequency components above the signal bandwidth frequency. A real signal will roll off more gently than a brick wall, so determining the required sampling rate becomes more nuanced. Often 5X or 10X over-sampling factors are employed to ensure that high-frequency signal components beyond the signal bandwidth are accurately acquired.
In the example of Figure 3, although a 200MHz signal is well below the 300MHz bandwidth of the digitizer, there is still an attenuation factor of -1dB, which corresponds to an amplitude decrease of about 11%. This significant attenuation may or may not be acceptable to the user, depending upon the application.
Conclusion
To maximize flatness in the pass band of the frequency response, engineers might maximize digitizer bandwidth so that higher signal frequencies could be acquired
without attenuation. However, a digitizer’s bandwidth and ENOB are antipathetic –as one improves, the other degrades. Higher bandwidth reduces the low-pass filtering effect upon a signal. This lets through more high-frequency noise, which in turn degrades the ENOB.
Consequently, digitizer engineers must determine the optimal operating point that provides both sufficient ENOB performance
and sufficient bandwidth. In addition to knowledge of its ENOB, consideration of its frequency response curve is paramount to the optimal selection of a digitizer for a given application.
Andrew Dawson is engineering manager and application specialist at Vitrek, LLC, providers of global solutions for high voltage test and measurement. https://vitrek.com
To Be Powerful
Strip Series B340
High-Performance Stripping Machine
The B340 exemplifies precision and performance excellence. Equipped with high-quality X-blades, it accurately processes an extensive range of wires and cables. Its unparalleled mechanical precision, repeat accuracy, and short process cycles drive exceptional productivity. Additionally, its ergonomic design and intuitive interface ensure effortless configuration and operation.
High-resolution 5” color touch screen
Fast and intuitive operation
Highly sensitive trigger mechanism - ideal for small and flexible cables
Rotary cutting mechanism for exact stripping
Wire Solutions for a Connected World schleuniger.com
CONNECTORS
HARWIN EXPANDS ITS BACKSHELL PRODUCTION
Harwin has announced a multi-million dollar investment that will include significantly increased capabilities for connector backshell production. The eightfold capacity expansion includes installation of a fully automated ‘lights-out’ manufacturing system installed at the company’s newly refurbished manufacturing facility in Portsmouth, UK.
The announcement comes as part of a strategic program to further reduce lead times and address growing customer demand for complete interconnect solutions that combine reliable, high-performance connectivity with mechanical protection and end-to-end EMC shielding.
Backshell production will be based around eight new 5-axis, high-speed milling machines built into a manufacturing cell driven by a WorkPartner automation system that supports 24/7 manuf acturing.
PRODUCTION
DIVERSE ADDS INDIUM
Quebec-based distributor Diverse Electronics has reached an ag reement to become an authorized distributor of Indium
Corp., manufacturer of solders, fluxes, brazes and thermal interface materials, serving the global PCBA, semiconductor, and electronics markets.
“Global in scope, but with local facilities in upstate New York, Indium is designed to support every customer with the solder products and processes optimized for their specific applications,” said Rick Masciotra, president & CEO of Diverse Electronics.
“With proven solder products, drive to provide expert recommendations for specific applications, and patented award-winning technologies, Indium is the ideal partner,” he added.
AUTOMATION & CONTROLS
PEPPERL+FUCHS UNVEILS NORTH AMERICAN OFFICE
The Pepperl+Fuchs US Division is getting a new home. The new 25,000-square-foot office building will house approximately 120 employees and will be constr ucted in Twinsburg, Ohio, just a short distance from the current location.
As a global leader in factory and process automation, Pepperl+Fuchs’ new office has been designed to meet the needs of both employees and the world’s changing work environment. Work21@ Pepperl+Fuchs is a new, future-oriented concept that is at the heart of the construction of the new headquarters
and focuses on collaboration between colleagues.
The new building’s open workspace will facilitate access to coworkers from different departments and encourage activity-based working over function-based working. This type of workspace allows for multiple tasks and activities in one area, more knowledge sharing and interaction, and improved corporate communication.
ALPHA CONTROLS TO RELOCATE, EXPAND
Marking its 45th anniversary, leading instrumentation distributor & service provider Alpha Controls & Instrumentation has announced its plans to relocate and expand the firm’s head office and calibration laboratory before the end of 2024.
Construction has already begun on their new home in partnership with RMG Contract Interiors Inc. and is set to be completed by the fall season. The new office will remain in Markham ON, but, will provide significantly more square footage to advance the operations and accommodate continued business growth.
“Moving into this new space will ensure that we are in the best position to continue providing the right technology solutions and support to our customers. This move represents another significant milestone for Alpha Controls, and we couldn’t be more excited,” says President of Alpha Controls, David Sand.
WÜRTH ELEKTRONIK TO BUILD U.S. HQ
Würth Elektronik a German-based manufacturer of electronic and electromechanical components as well as custom magnetics, has commenced construction of a new 70,000-square-foot headquarters in the U.S.A. This new facility
underscores the company’s commitment to innovation and grow in the electronics industry.
The state-of-the-art building will feature an eco-friendly design, an employee fitness room, and an outdoor terrace.
“The building was designed around our people, specifically with the employee experience in mind: maximized daylight accessibility, alternative workspaces, and an outdoor terrace are some of the most exciting features,” says Toby Kangas, project manager of the new building at Würth Elektronik.
The company also plans to pursue Leadership in Energy and Environmental Design (LEED) Silver certification for the new facility.
CIRCUIT PROTECTION
SAGER AND LITTELFUSE SIGN DISTY DEAL
Sager Electronics, a leading North American distributor of electronic components, announced the addition of Littelfuse to its line card, including its Har tland Controls brand products, such as mission critical electrical contactors, relays, auxiliar y and switches.
Littelfuse and their Hartland Controls brand, joins C&K – a global leader of high-quality electromechanical switches – and Carling Technologies – a market leader in industrial control, industrial automation, circuit breakers, and control application switches – as part of Sager Electronics’ expanded portfolio of Littelfuse offerings.
NXP’s MCX portfolio is accompanied by the firm’s FRDM development boards, a low-cost, scalable hardware platform supported by the MCUXpresso Developer Experience. Designed to promote creative freedom while developing for a variety of end applications, these compact boards enable flexible and rapid prototyping. FRDM-MCXN947 is a compact and scalable development board for rapid prototyping of MCX N94/54x MCUs. Product provides industry standard headers for easy access to the MCU’s I/Os, integrated open-standard serial interfaces, external flash memory and an on-board MCU-Link debugger.
Developers can use NXP’s Expansion Board Hub , to find add-on boards from NXP and its broad partner ecosystem, with related MCUXpresso SDK-compatible drivers and examples. These add-on boards, also known as shields, come with standard, pre-populated headers to easily connect to the FRDM boards. Developers can quickly create solutions leveraging audio, connectivity, motor control, machine learning, graphics, touch, voice, sensing and more. The new Application Code Hub enables engineers to easily find MCU software examples, code snippets and application software packs developed by NXP’s in-house experts.
Key features
• Microcontroller:
- MCX-N947 Dual Arm® Cortex® -M33 cores @150MHz each with optimized performance efficiency
- Up to 2MB dual-bank flash with optional full ECC RAM, External flash
• Accelerators:
- eIQ® Neutron Neural Processing Unit, DSP Accelerator (PowerQuad), Smart DMA co-processor for camera, display and fast IO , and Power Line Communications (PLC) Controller
• Connectivity:
- Ethernet Phy and connector
- HS USB Type-C connectors
- SPI/I2C/UART connector (PMOD/mikroBUS, DNP)
- WIFI connector (PMOD/mikroBUS, DNP)
- CAN-FD transceiver
• On-board MCU-Link debugger
• Sensor: P3T1755 I3C/I2C Temp Sensor, Touch Pad
• Expansion Options:
- Arduino Header (with FRDM expansion rows)
- FRDM Header
- FlexIO/LCD Header
- SmartDMA/Camera Header
- Pmod *DNP
- mikroBUS
Scan here for more information: www.nxp.com/FRDM
NXP dev board is designed to provide creative freedom when developing a variety of end applications.
UPCOMING IN EP&T
September Special CEM Directory
Playing an integral role in the eco system of the electronics industry in Canada, CEM’s represent one of the most important players in any design cycle. EP&T’s September edition will feature a complete Source Guide for those looking to connect with a Contract Electronics Manufacturer (CEM) or provider in Canada. This special section will list all the major CEMs in Canada, serving as a perfect guide to engineers seeking a design and manufacturing partner.
ONLINE
September 3-6
Contract Manufacturing Week
Join us as we highlight new Canada’s Electronics Manufacturing industry and feature information on manufacturers in Canada.
September 16 – 20
Semi -Conductor Week
Join EP&T for Semiconductor Week 2024 as we highlight new technologies and products, and share the latest information and applications with our audience of Canadian electronics decision makers!
October
The Canadian Electronics Report
Canada’s only national industry report on the electronics engineering and design sector this report is based on the results of a nationwide survey of all players comprising the ecosystem.
ELECTRONICS MARKET
EPTECH 2024
Get Ahead of the Game!
Pre-Register Now for EPTECH Trade Shows!
Hello Tech Enthusiasts!
Are you ready to dive into the heart of the latest tech trends and innovations? EPTECH Trade Shows are just around the corner, and we’re thrilled to invite you to join us for an electrifying experience! Pre-registration is now open, and here’s why you shouldn’t miss out:
Beat the Rush: Skip the queues and breeze through the entrance with your pre-registration badge. Say goodbye to waiting and hello to instant access!
Exclusive Updates: By pre-registering, you’ll be the first in line to receive exciting updates, insider tips, and sneak peeks at what’s in store for this year’s EPTECH events. Stay ahead of the curve!
Networking Opportunities: Connect with fellow industry professionals, potential collaborators, and leading experts in the tech sphere. Pre-registration gives you the chance to plan your networking strategy and make meaningful connections.
Don’t miss your chance to secure your spot at EPTECH Trade Shows. Pre-register today and gear up for an unforgettable journey into the world of technology!
