EPT March 2024

TRANSFORMING IOT

Tech advancements and innovation take the Internet of Things next level p.12

ACHIEVING SUSTAINABILITY

Choosing low power IoT devices is driving energy efficiency p.14

CONNECTIVITY REVOLUTION

How 5G is reshaping the future of manufacturing p.16

DIGITAL TWINS

Surge in IoT market drives move to create virtual clone of real-world system p.10

10

12

14

16

‘Twinning’

The

Delivering

Integrating

Embracing the Internet of Things

A revolution in electronic engineering

In the realm of electronic engineering and design, there’s a seismic shift underway, one that’s reshaping the very fabric of our technological landscape: the rise of the Internet of Things (IoT). This transformative phenomenon holds immense implications for engineers and designers, offering boundless opportunities and challenges alike. As we stand on the cusp of this ever-evolving tech sector, it’s imperative for professionals in this field to understand and harness its power.

At its core, IoT represents the interconnectedness of everyday objects through the internet, enabling them to collect, exchange and analyze data autonomously. From smart thermostats and wearable fitness trackers to industrial sensors and autonomous vehicles, the applications of IoT are as diverse as they are far-reaching. This proliferation of connected devices is not merely a trend; it’s a fundamental paradigm shift that’s reshapi ng industries and redefining the way we interact with the world around us.

patient monitoring systems. The ability to gather real-time data from distributed sensors opensup avenues for optimizing processes, enhancing efficiency and driving innovation across various sectors.

Moreover, IoT is blurring the lines between hardware and software, challenging traditional disciplinary boundaries and necessitating a multidisciplinary approach to product development. Electronic engineers must collaborate closely with software developers, data scientists and user experience designers to create seamless IoT ecosystems that deliver value to end-users. This convergence of disciplines underscores the need for engineers to broaden their skill sets and embrace a holistic approach to product design.

IoTHowever, amidst the promise of IoT lies a host of complex challenges that designers must navigate. Security emerges as a paramount concern, as the interconnected nature of IoT devices introduces new vulnerabilities and attack vectors.

is blurring the lines between hardware and software, challenging traditional disciplinary boundaries and necessitating a multidisciplinary approach to product development.

For electronic engineers, the emergence of IoT presents a myriad of opportunities to innovate and create ground-breaking solutions. By embedding sensor s, microcontrollers and communication modules into devices, they can unlock a wealth of possibilities, from enabling predictive maintenance in industrial machinery to revolutionizing healthcare with remote

Safeguarding sensitive data, mitigating cyber threats, and ensuring the integrity of IoT ecosystems demand robust secur ity measures and proactive risk management strategies.

Interoperability also emerges as a significant hurdle, as the proliferation of disparate IoT devices g ives rise to compatibility issues and fragmentation within ecosystems. Engineers must prioritize standards-based approaches and interoperable protocols to facilitate seamless communication and integration between devices

from different manufacturers. Embracing open standards and fostering collaboration within the industry are essential steps towards achieving interoperability and realizing the full potential of IoT.

Furthermore, the exponential growth of IoT brings with it unprecedented challenges in terms of scalability, power consumption and resource constraints. Designing energy efficient, scalable IoT solutions requires careful consideration of hardware architectures, communication protocols, and optimization techniques. Engineers must strike a delicate balance between performance, power consumption, and cost-effectiveness to deliver sustainable IoT solutions that meet the demands of today’s interconnected world.

In addition to technical challenges, ethical and societal considerations loom large in the realm of IoT, as these devices become increasingly pervasive. Questions surrounding data privacy, consent and surveillance come to the fore. Industry drivers bear a responsibility to prioritize ethical design practices, uphold user privacy rights and foster transparency in data collection and usage. By embedding ethical principles into the design process, they can build trust with users and ensure that IoT tech serves the greater good.

For sure, the rise of IoT heralds a new era of possibility and transfor mation. As stewards of technological advancement, designers must rise to the occasion, driving forward the evolution of IoT with ingenuity, integrity and foresight.

STEPHEN LAW

Editor slaw@ept.ca

Canada’s information leader for electronic engineers and designers

MARCH 2024

Volume 46, Number 2

READER SERVICE

Print and digital subscription inquiries or changes, please contact

Angelita Potal

Tel: (416) 510-5113 Fax: (416) 510-6875

Email: apotal@annexbusinessmedia.com

Mail: 111 Gordon Baker Rd., Suite 400 Toronto, ON M2H 3R1

EDITOR Stephen Law slaw@ept.ca · (416) 510-5208

WEST COAST CORRESPONDENT Mike Straus · mike@brandgesture.ca

SENIOR PUBLISHER Scott Atkinson satkinson@ept.ca · 437-995-4651

ACCOUNT MANAGER Joanna Malivoire jmalivoire@ept.ca · direct 416-881-0731

SALES MANAGER Chander Verma cverma@annexbusinessmedia.com cell 437-218-0941

ACCOUNT COORDINATOR

Shannon Drumm sdrumm@annexbusinessmedia.com

MEDIA DESIGNER Lisa Zambri lzambri@annexbusinessmedia.com

AUDIENCE DEVELOPMENT MANAGER

Anita Madden amadden@annexbusinessmedia.com (416) 510-5183

GROUP PUBLISHER Paul Grossinger pgrossinger@annexbusinessmedia.com

PRESIDENT/COO Scott Jamieson sjamieson@annesbusinessmedia.com

EP&T is published eight times per year by

ANNEX BUSINESS MEDIA

111 Gordon Baker Road, Suite 400 Toronto, ON M2H 3R1

Tel (416) 442-5600

Fax (416) 510-5134

annexbusinessmedia.com

SUBSCRIPTION RATES

Canada – $59.67 one year; $95.88 two years

USA – $136.68 (CAD) per year

International – $187.17 (CAD) per year

Single copy – Canada $15.00

ISSN 0708-4366 (print)

ISSN 1923-3701 (digital)

PUB. MAIL AGREEMENT NO. 40065710

Return undeliverable Canadian addresses to:

EP&T Circulation Department, 111 Gordon Baker Rd. Suite 400, Toronto, ON M2H 3R1

© 2024 EP&T. All rights reserved. Opinions expressed in this magazine are not necessarily those of the editor or the publisher. No liability is assumed for errors or omissions or validity of the claims in items reported. All advertising is subject to the publisher’s approval. Such approval does not imply any endorsement of the products or services advertised. Publisher reserves the right to refuse advertising that does not meet the standards of the publication. Occasionally, EP&T will mail information on behalf of industry-related groups whose products and services we believe may be of interest to you. If you prefer not to receive this information, please contact our circulation department.

PRINTED IN CANADA

CREATION EXPANDS MARKHAM EMS FACILITY

Global electronic manufacturing services (EMS) provider Creation Technologies recently held a ribbon-cutting ceremony to mark the opening of it newly expanded facility in Markham, Ontario. The event celebrated the move to a new custom-built, state-of-the-art space spanning 118,500-square-feet. The location represents a 54% larger physical footprint for Creation Technologies in Markham.With more than 300 employees currently working at the facility, the site joins a list of recent site expansions in Changzhou, China, St. Paul, MN and Rochester, NY.

“We are excited about the opportunities that our expanded Markham f acility brings. Our dedicated team and the support of the local community have been instrumental in reaching this milestone,” said Stephen DeFalco, chairman & CEO of Creation Tech.

AUTOMOTIVE

AUTOMOTIVE SEMIS TO HIT $84B BY 2028

The semiconductor chip market is expected to see robust growth, increasing from US$43 billion in 2022 to US$84.3 billion in 2028, with an impressive 11.9% CAGR during the period, according to Eric Mounier, Ph.D., director of market research at Yole Intelligence.

“In 2022, each car contains around US$540 worth of semiconductor

chips, which is projected to rise to about US$912 by 2028. This is driven by the adoption of ADAS and electrification, increasing the number of chips per vehicle from 850 to 1,080,” Mounier said.

Key drivers are numerous and include electrification, requiring new substrates like SiC, advanced technology nodes as small as 16nm/10nm for ADAS components and a growing demand for memory, especially DRAM and computing power for Level 4 and 5 autonomous vehicles.

ADAS

and electrification have helped increase the number of chips employed in every vehicle.

At the wafer level, Yole Intelligence reported that shipments are expected to increase from 37.4 million units in 2022 to 50.5 million in 2028. It includes memory, processors, and MCU s leading the way for 12-inch wafers. SiC devices will continue to grow due to EV /HEV adoption, while advanced nodes below 16nm will be driven by ADAS technology. OEMs are increasingly embracing vertical integration to electrify their operations, with strategies varying by industry segment and region. Power

electronics and semiconductors are vital focuses, with some OEMs making direct investments.

IOT

AVNET LEVERAGES AWS FOR IOT DESIGNS

OEMs can quickly build intelligent Internet of Things (IoT) devices on Amazon Web Services (AWS) thanks to Avnet’s latest IoTConnect release. This full-featured update incorporates native support for LoRaWAN gateways and devices, as well as support for Amazon Sidewalk enabled devices. Amazon Sidewalk is a long-range, low-bandwidth, community network designed to connect billions of IoT devices securely and seamlessly. Avnet’s IoTConnect provides a seamless “single pane of glass” user experience for onboarding and connecting these new types of devices.

Building on several releases of IoTConnect powered by AWS, this feature release helps OEMs create IoT products with a broader range of low-power wireless technologies.

IoTConnect now supports both traditional IoT devices that use IPbased networks, as well as devices that use LoRaWAN or Amazon Sidewalk wireless networks. By integrating support for these additional low-power wireless networks, OEMs can manage all their devices within the same cloudbased user framework in IoTConnect. Avnet’s IoTConnect platform is an evolved and simplified alternative to building a microservices-based IoT platform from scratch.

Photo: Creation Technologies; Yole

CONNECTED DEVICES

IN HOME CONNECTED DEVICES CLIMB IN U.S.

The average number of connected devices per US internet household reached 17 in Q3 2023, according to new research released by Parks Associates at CES 2024. The information was generated from the research group’s quarterly consumer survey of 8,000 US internet households, finding the average number of connected devices per US inter net household reached 17 in Q3 2023.

Parks Associates’ Consumer Electronics Dashboard, an ongoing service that visualizes the most important metrics for consumer electronics (CE) devices in the home, also notes that for the first time, smartphone ownership surpassed TV ownership, with 90% of households reporting ownership of a smartphone compared to 88% with a TV.

“Smartphones are ubiquitous now, and connected consumer electronics such as wireless earbuds, tablets and smart TVs are commonplace,” said Sarah Lee, research analyst, Parks Associates.” Today, these devices are essential for entertainment purposes and daily personal communications, which can include school, work and family.This necessity drives continued purchases, as every year CE companies roll out innovative and advanced models that drive the consumer desire to upgrade.”

PRODUCTION

KURTZ ERSA PARTNERS WITH COMTREE IN CANADA

Tech devices today are essential for personal communication and entertainment purposes, which drives consumer ‘buy-in’.

Kurtz Ersa Inc., a leading supplier of electronics production equipment, has partnered with manufacturer’s agent Comtree Inc, to strengthen its availability of spare parts across Canada.

Comtree will now stock an extensive range of spare parts at its Mississauga warehouse location.The collaboration ensures that Canadian customers can access a comprehensive inventory of soldering consumables with hundreds of common products readily available in stock, according to Ernie Grice at Kurtz Ersa.

“We are delighted to partner with Comtree, a company with a proven track record of excellence in providing capital equipment solutions. This collaboration reflects our commitment to ensuring that our Canadian customers have swift access to high-quality spare parts, further enhancing their experience with our advanced soldering technology,” Grice said.

ACQUISITION

CML MICRO ACQUIRES MWT

CML Micro has acquired MwT, a leading MMIC and mmWave supplier based in California. The deal will bring together the capabilities of CML Micro and MwT, positioning the expanded company at the forefront of emerging markets and providing a broader and deeper RF & mmWave device portfolio for wireless communications.

The strategic move expands CML Micro’s product portfolio, bolstering

the SµRF product brand with a broader range of GaAs and GaN MMICs as well as introducing Discrete Devices and Hybrid Amplifier Products. This influx of new products and capabilities also strengthens CML Micro’s ability to meet evolving needs in communication applications with higher frequenc y devices and increased module capabilities.

The acquisition will also strengthen CML Micro’s engineering operation across the organisation, bringing upgraded research and development capabilities and system-level understanding with valuable benefits in product manufacturing and packaging techniques.

SOFTWARE

EMA AND HAWK RIDGE SYSTEMS CONVERGE ECAD/MCAD

EMA Design Automation Inc. and Hawk Ridge Systems have entered a strategic partnership to provide the engineering community with a full ECAD/MCAD design experience, leveraging best-in-class tools and support for the entire electronic product design flow.

EMA Design Automation is a leading electronic design automation (EDA) value-added reseller (VAR), and Hawk Ridge Systems is a provider of 3D design, manufacturing and 3D printing solutions in the U.S. and Canada.

Through this partnership, Hawk Ridge Systems will now sell and distribute Cadence and EMA ECAD design solutions to their customers. These state-of-the-art solutions were developed with 30+ years of electronics design expertise and support from EMA.

As electronic product design continues to grow in complexity and scale, the traditional silos between electrical and mechanical domains are inhibiting teams from meeting their design goals and timelines, explains Manny Marcano, president of EMA Design Automation.

“End-to-end solutions are needed, along with deep domain expertise, to help customers develop fully connected flows to solve their design challenges,” he added.

Visit ept.ca for the latest new products, news and industry events.

SR&ED program: Current landscape & looking ahead

BY PETER EVAGELOU, MANAGER, R&D & GOVERNMENT INCENTIVES, GRANT THORNTON LLP

The Scientific Research and Experimental Development (SR&ED) program is the largest source of federal support for Research and Development (R&D) in Canada. Each year, more than 16,000 claimants receive over $3 billion in tax credits from the program, many of which are small to medium sized businesses.

The SR&ED program has been around in different forms for decades, evolving based on government mandates and the economic landscape at the time. As early as 1944, companies could deduct an amount equal to 100% of current expenditures related to scientific research from their taxable income, and in 1963, a formal definition of ‘scientific research,’ was introduced into income tax legislation Although the wording isn’t identical to the definition contained within the Income Tax Act today, many parallels can be drawn.

For years, organizations such as the Council of Canadian Innovators have advocated for changes to streamline and modernize SR&ED, including updates to:

Broaden the definition of eligible expenditures to include the preparation and examination phase of protecting intangible assets (i.e., intellectual property). Ensure that SR&ED explicitly covers commercialization and continuous improvement activities.

Develop education tools and resources to support auditors that work with data-intensive and advanced technology companies

The Government of Canada has announced that it will launch consultations in 2024 on modernizing SR&ED with a focus on how to better target the program to ensure that the support helps to position Canada as an R&D leader (Update on federal innovation policies and initiativesCanada.ca).

The federal government also noted that the Canada Innovation Corporation (CIC)—a funding agency announced in the 2022 federal budget to dr ive Canadian business investment in R&D—will need to be fully established before it takes over the National

IRAP). The federal government stated that this transition should take place by no later than 2026-2027; however, this delay represents four years from when the CIC was initially announced, emphasizing the need for other R&D incentive programs to be streamlined and refined in the interim.

IRAP

a funding agency announced in the 2022 federal budget to drive Canadian business investment in R&D—will need to be fully established before it takes over the National Research Council of Canada Industrial Research Assistance Program

The SR&ED program today has been criticized for having a high compliance burden and lengthy claim preparation process. Despite being a lucrative incentive, strict and complicated eligibility criteria make accessing the SR&ED program a significant barrier for many, sometimes discouraging companies with eligible costs from claiming altogether.

Given the sheer volume of claims received on an annual basis, the Canada Revenue Agency (CRA) does not have the resources to conduct a detailed review of each claim to assess whether it is ineligible or noncompliant.

The CRA has also stated that it commonly sees incomplete or incorrectly filled forms, lack of supporting documentation, not disclosing certain types of financial assistance, and disclosure of inaccurate information. Perhaps the most problematic for claimants is the lack of supporting documentation.

This is where SR&ED consultants come in. As experts in the field, SR&ED consultants not only play a role in preparing and defending claims, but also informally as “frontline auditors”. According to the CRA, the best for m of supporting documentation is contemporaneous—i.e., documentation that was generated as the SR&ED project was being carried out.

Documentation that is dated, signed, and specific to the work performed are the best supporting evidence that you can provide. For larger claims where disputes on claim eligibility sometimes land in Tax Court, many judgements are made based on the contemporaneous documentation that was generated and maintained as the project occurred.

To ensure that you have a sufficient level of documentation available to support your claim in the event of a CRA review, you should:

Implement project management software: There are several project management software systems available depending on your industry and the nature of your R&D work. For example, consider employing a system like JIRA, Confluence, Trello, and Basecamp to help you track projects as they occur

Use a time tracking system :

Whether you update a simple excel sheet on a daily or weekly basis or use a more complex system like Harvest or Clockify, ask your team to track their activities throughout the year to effectively differentiate between tasks that are SR&ED eligible and those that are not.

Conduct regular technical meetings and reviews: Schedule weekly or monthly meetings held by R&D staff. A dedicated notetaker should capture technological challenges being experienced, work that is planned or undertaken to overcome those challenges, and any key learnings or takeaways from the experimentation/ testing conducted.

Ultimately, no two companies are exactly alike so there isn’t a one size fits all solution that can be applied. Since the CRA doesn’t prescribe certain forms of documentation that must be available, your approach should be sufficient once you provide a reasonable methodology that supports how the expenditures claimed were calculated and include an adequate level of documentation of suppor t.

Grant Thornton LLP is a Canadian accounting and advisory firm providing services.

https://www.grantthornton.ca/service/tax/ research-development-government-incentives/

Research Council of Canada Industrial Research Assistance Program (NRC

Photo: Credit: Olivier Le Moal / iStock / Getty Images Plus

Ionocom: Delivering decades of electronics innovation

BY MIKE STRAUS, WEST TECH CORRESPONDENT

With more than 20 years of expertise in design and development, electronics contract design company Ionocom Communications Inc. has carved out its distinct domain, focusing on circuit design, printed circuit boards (pcbs), embedded firmware, and PC-based softw are. Situated in North Vancouver, the company boasts a wealth of experience spanning analog and digital designs, alongside proficiency in microcontrollers and low-power design solutions.

Ionocom’s two full-time partners include Nick Massey and Matthew Kendall, a pair of electronics engineers who formerly worked for Racal Research in the United Kingdom. Founded in 1950, Racal was an electronics design company whose products included voice loggers, data recorders, point of sale terminals, and militar y equipment.

“Nick and I came to Vancouver in the mid-1990s,” Kendall says. “We worked for a subsidiary that Racal purchased in Vancouver for several years before it shut down in 2000. We found ourselves in Vancouver wondering what to do, and that’s when we decided to start a consulting company doing contract design of electronic products.”

Massey’s work specialized in tactical radio systems and RF transmitters, while Kendall’s focus was on RF hardware and cellular systems. Between the pair of them is 50 years of experience in electronic design.

Work in many fields

Since its formation in 2000, the company has completed more than 100 projects for clients ranging from start-ups to large multinational corporations. The firm’s work spans consumer electronics, professional audio, radio communications, industrial, and

military applications.

“We were lucky to get a couple of good clients early on,” Kendall notes. “One client developed batter y packs for military use, and we still have that client more than 20 years later. The battery and alternative energy scene is strong in Vancouver, so that’s been a gateway to some other clients that focus on alternative power or batteries in some way.”

Some of the company’s projects include computer mice, keyboards, and iPod accessories. One particular project the company completed was a keyboard encoder designed for use with Palm and PocketPC PDAs; the encoder used an infrared link between the PDA and the keyboard and was powered by a single AA cell. More than 100,000 of thes keyboard units were made.

Several of the company’s projects are variations on an FM transmitter that enables audio from an iPod to be received by a car radio. One such transmitter permits the use of the iPod display itself as the FM radio interface, eliminating the need for a separate LCD screen. Combined with a compact layout, this provided the client with the smallest device on the market, making it a perfect companion piece of technology for an iPod

Nano.

Kendall says that Vancouver has been a good place to operate an electronics business; there’s a strong tech sector in the local area. While running a small business comes with a feast-orfamine cycle, he explains, the company has done fairly well at maintaining a consistent flow of business throughout the COVID-19 pandemic.

Simulation and design

Equipped with a wide array of RF and digital test equipment Ionocom’s work also spans radio and power testing, while also leveraging custom automated test prog rams and, a times, assemble prototype units on-site.

The company uses industry-standard CAD tools for schematic capture, simulation, and design; they also provide firmware development and mechanical design services that include embedded processors. Ionocom also has the capacity to upgrade and enhance existing designs, or to even design subsystems within a larger project. The company has extensive experience with microcontrollers, from 8-bit to 32-bit, and can even port prototypes from the Arduino platform.

“One of the nice things about

running a company like this is that we get to work on a variety of projects,” Kendall notes. “We try to include projects that have some aspect of wireless, because that’s our background and specialization. We have a lot of test equipment and tools that other companies don’t have.”

Kendall says that wireless applications are more popular than ever before, not only among engineers but also among hobbyists. Wireless development technolog ies like Arduino and the Raspberry Pi are making development more accessible; as a result, clients are now coming to Ionocom with fully fleshed-out prototypes build out of Arduinos or Raspberry Pis.

“I see going forward more projects incorporating wireless as a given,” Kendall explains. “We almost never develop chip-level wireless solutions; we’re almost always dropping modules onto boards. Our wireless knowledge is now more deployed toward things like antenna system design.”

Kendall and Massey also own a side business called Merifix, which manufactures low-cost test fixtures. Merifix has a completely automated process where eng ineers can upload designs to a website and have an automated system drill the fixtures, which ship same-day. The entire process costs under $200 to the end-user.

“We’ve shipped those fixtures to Canada, the United States, Europe, Australia, and even New Zealand,” Kendall notes. “We usually ship to engineers who are doing low-volume production and need a test fixture to prog ram a microcontroller; it’s opened up the accessibility of test fixtures.”

Ionocom is an electronic services provider located in North Vancouver BC www.ionocom.com

Matthew Kendall

Nick Massey

Photo: Ionocom

Energy solutions get a boost from AI

Moving faster from research to application - accelerating scientific discovery

BY KARYN HEDE, SENIOR SCIENCE COMMUNICATOR, PNNL

The urgent need to meet global clean energy goals has world leader s searching for faster solutions.To meet that call, the U.S. Department of Energy’s Pacific Northwest National Laboratory has teamed with Microsoft to use high-performance computing in the cloud and advanced artificial intelligence to accelerate scientific discovery on a scale not previously demonstrated. The initial focus of the par tnership is chemistry and materials science—two scientific fields that underpin solutions to global energy challenges.

“The intersection of AI, cloud and high-performance computing, along with human scientists, we believe is key to accelerating the path to meaningful scientific results,” said PNNL’s deputy director for science and technology

Tony Peurrung. “Our collaboration with Microsoft is about making AI accessible to scientists. We see the potential for AI to surface a material or an approach that is unexpected or unconventional, yet worth investigating. This is a first step in what promises to be an interesting journey to accelerate the pace of scientific discovery.”

How is this AI development different?

The two organizations are laser-focused on leveraging what AI does best—synthesizing billions of information bits—more than any human could possibly absorb—and quickly presenting conclusions based on its analysis. Microsoft’s Azure Quantum Elements platform uses advanced AI models pur pose-built to aid scientific discovery. PNNL researchers are now testing its ability to identify promising new materials for energy applications. The two organizations have committed to leveraging advanced AI models to find viable materials

and the chemistries needed to provide energy-on-demand while preserving the Earth’s resources for future generations.

“We are at the dawn of a new era of scientific discovery that can transform our world for the better. With novel AI and hyperscale capabilities, we can speed up research and unlock the discovery of new molecules that can address some of the most pressing issues of our time, from clean energy to eliminating toxic chemicals and beyond. We are honored to work with world-class scientific institutions like Pacific Northwest National Laboratory. Our breakthrough in using AQE to find new battery materials is just one of the many examples of how our innovative approach to materials research can improve our daily lives,” said Jason Zander, Executive Vice President of Strategic Missions and Technologies at Microsoft.The newly executed agreement between the two organizations formalizes the next phase of PNNL’s ongoing

relationship with Microsoft. Over the next several years, the Microsoft-PNNL partnership envisions a transformative journey toward pioneering breakthroughs in scientific discovery and sustainable energy—leveraging cutting-edge computing and artificial intelligence technologies to address some of the world’s most pressing challenges. The partnership will have an initial emphasis in computational chemistry and material science.

Energy storage materials

PNNL created these promising energy storage materials within its Energy Sciences Center. There, materials scientists Vijay Mur ugesan, Shannon Lee, Dan Thien Nguyen and Ajay Karakoti synthesized and tested the compound. The entire process, from receiving the simulated candidates through producing a functioning battery, took less than nine months, a blink of an eye compared with traditional methods. To make

the compound competitive with published benchmarks, additional optimization is required and initial investigations suggest new pathways to further explore the functional properties of the promising material.

“The new battery results are just one example—a proof point if you will,” said PNNL’s Chief Digital Officer Brian Abrahamson. “We recognized early on that the magic here is in the speed of AI assisting in the identification of promising materials, and our ability to immediately put those ideas into action in the laboratory. We are excited to take this to the next level in the partnership between Microsoft and PNNL. We plan to push the boundaries of what’s possible through the fusion of cutting-edge technology and scientific expertise.”

Pacific Northwest National Laboratory (PNNL) is operated by Battelle for the U.S. Department of Energy’s Office of Science. https://www.pnnl.gov

Materials scientist Vijay Murugesan and his team are studying promising battery electrolyte materials identified through a collaboration with Microsoft.

Photo by Andrea Starr, Pacific Northwest National Laboratory

How digital twins ground the IoT in reality

‘Twinning’ market is hot on the heels of a surge in the Internet of Things

BY CHARLENE WAN, VICE-PRESIDENT OF BRANDING, MARKETING & INVESTOR RELATIONS AT AMBIQ

Distributed computing and system modeling often involve a degree of abstraction that defies easy use. The ties between real-world assets and their data-based analogs can be frustratingly elusive. Many representations come with inherent disconnects that make it tough to apply their insights

But what if the data analogs were more closely linked to the source? Digital twins make the internet of things (IoT) a bit more practical by using real-time embedded sensor data to further decision-making.

The concept of digital twinning is almost exactly how it sounds: A twin is a virtual clone of a real-world system or object — but there’s a key distinction. Simulations and system modeling are nothing new. Digital twins stand out by incorporating onthe-fly data into the process. These representations integrate closely with IoT sensors to update their underlying parameters as events develop.

Why is this such a huge leap forward? In short, there’s no such thing as a perfect numer ical model, but digital twins track how systems evolve in real life, self-correcting to produce accurate results.

Engineering problem-solvers IoT imbues digital twins with enhanced dimensionality that benefits many industries. People leverage twinning to simulate factories and extend asset lifetimes. Urban planners model cities, construction, and

population factors. This versatility is the ideal answer to many engineering problems.

Digital twin models work well with machine learning techniques and endpoint intelligence. For instance, dynamic programming and reinforcement techniques are geared for the same type of mathematical optimization that drives twinning.

Many AI applications are solutions in search of a problem. People know AI is powerful, but as with any nascent technology, they don’t always have the facts to support exploration. With digital twins, the two domains naturally overlap, making it easier to justify computing expenditures.

Dynamic physical system

Digital twins are helpful for problems that benefit from multiple-time-scale analysis. For instance, many dynamic physical systems exhibit inconsistent responses to stimuli over different time frames. These responses can be difficult to quantify, but research has shown that twins powered by sensor data and machine learning adapt to variability well, producing robust, accurate results.

IoT’s proliferation also boosts risks. More devices mean more attack surfaces and increased cybersecurity workloads for engineers. Digital twins aren’t just for simulating systems like manufacturing lines or wind turbines. They also improve operational awareness of the IT frameworks they run on. By integrating networking, performance, and OS data into a

Digital twins allow for accurate experimentation even when the actual infrastructure doesn’t.

model, engineers can try new things without losing sight of the security side effects.

The risk reduction benefits also extend to physical-world hazards. For instance, one study used digital twins to model aerial firefighting operations, which often involve mixed aircraft fleets and dangerous maneuvering.

Boosting experimental efficiency

Virtual infrastructure also lends itself to practical cost-benefit analysis and experimentation. Siemens is a great example of how this plays out in the real world. In 2018, the company awarded the non-profit BRIDG in-kind grants worth $30 million to explore digital twinning to reduce semiconductor development lifecycles. The investment makes sense,

Photo: Roman Barkov /iStock /Getty Images

considering that machine-learning-aided twins can be millions of times f aster than physical modeling.

Digital twins allow for accurate experimentation even when the actual infrastr ucture doesn’t. They make it easier to discover behavioral patterns and analyze changes predictively, even in the face of changing conditions.

Choosing IoT technology

Digital twins fall into a few categories, depending on who you ask. While some observers break things down using a product-production-performance scheme, others stick to a component-asset-system-process model or other taxonomy.

The unifying theme behind most classification systems is that they reflect distinct magnification levels. For instance, a specific model might

analyze a product or a process. The optimal amount of granularity boils down to the user’s intentions and the type of IoT technology producing the data.

Not every connected device produces viable — or valuable — digital twin data. Compatible IoT hardware must include some form of high-fidelity embedded sensors. This goes beyond installing a few calibrated feedback devices in a smart building or a vehicle fleet. IoT sensors for twinning should satisfy stringent performance standards: low power consumption, ruggedness, and compatibility with secure communication protocols are the bare minimum.

Major twinning players

Modern digital twin implementations mirror the diversity of IoT networks. Sensors that use SPI, Bluetooth LE,

and other common protocols aren’t always interchangeable, but they’re compatible enough that engineers can often mix and match software and hardware.

With a bit of forward-thinking system design, there’s no shortage of backends and frameworks at your beck and call. The good news is that there are just as many vendors to match. Players like IBM, Amazon/ AWS, and Microsoft/Azure provide customizable frameworks geared toward enterprise use cases. As cloud-native computing giants, they also accommodate integration with existing networks.

Some engineers may prefer a less generalized approach, but this isn’t a huge hurdle. There are quite a few startups focused on specific sectors, like cmBuilder.io, SpaceIQ, and others in building information modeling and AIBODY in the physiology-as-a-service niche — human dig ital twinning.

No matter the market, there’s likely an existing digital twin framework. If not, engineers can always dig down to the hardware level. Offerings from vendors like Siemens, Bosch, GE, and Schneider Electric make it possible to implement a model in-house.

Future of digital twinning

$30 million

In 2018, the company awarded the non-profit BRIDG in-kind grants to explore digital twinning to reduce semiconductor development lifecycles.

The digital twin market is hot on the heels of the IoT surge. According to IoT Analytics, the sector’s CAGR could hit 30 percent from 2023–2027, and almost 30 percent of global manufacturers had already implemented dig ital twin strategies by late 2023.7 The field may still be young, but the value is there.

Twinning stands to redefine not only how engineers explore new ideas but also how they validate ongoing projects. No simulation is perfect, but building digital twins on a foundation of dependable sensor networks can make IoT models far more useful.

Ambiq is an Austin TX-based developer of ultra-low power SoCs for IoT endpoint devices that demand complex operations and longer battery life.

https://ambiq.com/

Electronics innovation in 2024

Transforming the IoT with technology advancements

BY ADAM KIMMEL, R&D MANAGER, TTI

The electronics industry is at the centre of the IoT, connecting systems and technology that operated independently in the past. The re-emergence of AI is accelerating innovation even further, from applications ranging from autonomous vehicles to robotic manufacturing and advanced healthcare technology. Electronics innovation is vital to maintaining the high rate of advancement in technology.

Three applications—next-generation sustainable materials, miniatur ization and immersive technology—are transforming how electronics innovation is evolving.

Next-gen sustainable materials

Many companies publicly state sustainability goals to reduce their carbon footprint to zero. 2050 was a popular timescale, but increased regulatory pressure has led many businesses to pull that date up to 2030 or before.

It’s become a competitive advantage as well, further driving change. And because sustainability goals include Scope 1, 2 and 3 emissions (carbon footprint up and down the value chain), using sustainable electronics materials allows the entire supply chain to improve its carbon footprint.

Materials like graphene and carbon nanotubes (CNTs) in electronics deliver sustainability for manufacturers and OEMs. Graphene is one of the strongest materials on the planet, exhibiting electron mobility, thermal and electrical conductivity and absorption orders of magnitude

better than incumbent materials. These properties make graphene an advantaged material for consumer electronics like phones and computers, along with faster transistors.

Graphene’s high electrical conductivity and structural integrity improve d urability of smartphone screens, while improving the speed of computer circuitry with higher processing density. Its raw material is graphite, the natural state of carbon.

However, while graphite is widely available, its inherent stability requires substantial energy to separate it to make graphene. Ensuring this energy comes from renewable sources is essential to preserve a lower carbon footprint and responsibly/sustainably sourcing the graphite material.

Graphene is a single-layer sheet with carbon atoms arranged in a hexagonal, honeycomb lattice structure. Conversely, carbon nanotubes roll g raphene into a tube to leverage cylindrical strength. The materials have similar electronic and mechanical properties, but their shape affects which geometr y best suits a given application, such as energy storage or quantum computing.

Carbon nanotubes are stronger than graphene sheets, making them ideal reinforcement elements for composite materials. Conversely, graphene’s larger surface are improves material contact with surrounding components and provides higher homogeneity in material blends.

Graphene sheets transfer properties to material blends more readily due to their higher surface area and pack together closer than the round cylinder shapes. Nanotubes have

improved column strength, improving axial load strength.

In 1975, Gordon Moore, a founder of Intel, predicted that the number of elements on a single chip would double every two years beginning in 1980. “Moore’s Law” is an empirical relationship that represents development in sophisticated wearable technolog ies through miniaturization: getting more from less space and mater ials, delivering portability, longevity and energy efficiency gains. An example of miniaturization is reduced case sizes on surface mount components.

SWAP maximizes processing

MRMixed Reality (MR), like augmented (AR) and virtual reality (VR) provide a third application for electronics innovation.

While the number of transistors per unit area of pcb has increased over time, the overall case size has decreased, further increasing processing density. Optimizing the size, weight and power (SWaP) of electronics for maximizing processing density can also maximize manufacturing throughput due to smaller-scale components. Capital equipment can fit higher numbers of smaller parts in a given manufacturing run, delivering this improvement.

Graphene is a single-layer sheet with carbon atoms arranged in a hexagonal, honeycomb lattice structure. Conversely, carbon nanotubes roll graphene into a tube to leverage cylindrical strength

Microelectronics are essential building blocks for electronics innovation. By further down-sizing them, manuf acturers can realize compound benefits. Smaller components can have increased integration, limiting heat loss and inefficiency. These advantages improve both cost and sustainability. Developing electronics that consume smaller spaces enhances user exper ience and offers

Carbon

Photo Creditvchal / iStock / Getty Images Plus; TTI

improved flexibility from modular solutions. This approach improves the scale economy of components while ensuring the modules’ output voltages don’t exceed a safe level.

Miniaturization is an enabling technology for industrial automation, improving factory throughput and energy storage, an increasing area of need as more [intermittent] wind and solar renewable energy comes online.

Higher efficiency and a smaller footprint compound how much renewable energy can be stored and supplied, increasing the importance of miniaturized equipment.

Immersive technology

A third application for electronics innovation is immersive technology (mixed reality–MR), like augmented (AR) and virtual reality (VR). These trends have wide-ranging applications, enhancing quality, efficiency

and training through nearly every industry, from gaming to healthcare. Design engineers in each application can experience the output of their design during the concept phase, making it much easier to uncover, diagnose, and correct a product feature. This approach saves time and cost in prototype creation, evaluation, inspection and testing before implementing the design change, MR requires a seamless interface between humans and technology to provide the best experience. And because consumers and businesses experience a new product virtually before purchasing, this allows them an immersive experience. Enhancing sensor and camera technology provides a more natural experience.

Conclusion

Businesses, regulators and consumers are pushing technology size,

Adam Kimmel has spent almost 20-years as a practicing engineer, R&D manager and technical consultant.

efficiency, performance and cost. In addition to component innovation, it is imperative that latency and data processing happen as fast as possible.

As processing moves to the edge, electronics manufacturers should ensure the improvements at the component level will not negatively impact performance in IoT applications like autonomous driving.

Ensur ing the devices are ready for 5G while designing in forward compatibility for 6G is a consideration as network technology improves to enable edge computing.

Adam Kimmel has spent nearly 20 years as a practicing engineer, R&D manager and technical consultant. He has degrees in chemical and mechanical engineering, and is the principal and founder of ASK Consulting Solutions, a technical content writing firm.

Choosing low power IoT devices to achieve sustainability

Shaping the future of energy efficiency and reality of landfills

BY DEEPAL MEHTA, SR. DIRECTOR, MARKETING AND BUSINESS

The number of active IoT devices globally is expected to grow from 7.6 billion in 2019 to 24.1 billion in 2030, according to reports from Transforma Insights. There are many reasons for such growth, but, what’s particularly exciting is the fact that many technology advances have lined up recently to enable IoT capabilities previously unseen.

Harnessing such technology advances as making strides in battery life, the combination of battery and Wi-Fi in IoT devices, the use of the cloud that complements rather than takes over, sensor technology at the edge, the growing use of artificial intelligence (AI) and machine learning (ML), will fuel growth and deliver the next wave of more meaningful and useful IoT devices.

Battery life

Customers currently expect IoT devices to have a battery life of at least 10 years, compared to the nottoo-distant past when expectations were that they would last at most a few years. The battery life of an IoT device determines its performance and efficiency.

Manufacturers are now using integrated circuits (ICs) with deep sleep modes that consume less power, slow clock speeds, feature reduced instruction sets, and have minimal current draw. Efficient techniques such as system level power savings and cloud connectivity optimizations result in longer life and smaller battery size. Battery life measurement and optimization are key design considerations of IOT applications.

IoT devices now demand ultra-low power Wi-Fi at BLE power levels. Today’s multi-protocol wireless solutions are beginning to integrate Wi-Fi, BLE and Thread to enable a myriad of new applications. The

BEVELOPMENT, INNOPHASE IOT

use of Integrated (Wi-Fi + BLE5.0) delivers long range operation suitable for smart door locks, remote security cameras, connected sensors, and space constrained products inside and outside of the home.

IoT at the edge

According to a recent report by Gartner, by 2025, 75% of enterprise-generated data will be created and processed at the edge. Edge computing reduces latency, dramatically increases efficienc y, and improves security, revolutionizing IoT data processing and storage. Processing data locally reduces the amount of data that goes to the cloud for processing and storage, saving power and increasing batter y life) Cloud-based systems are not replaced, but are complemented, yielding efficiency and increased data analysis when edge computing combines with the

cloud. An example of its importance is seen with latency. Edge computing reduces latency to 5-10 milliseconds from 25-35 milliseconds in already deployed devices.

Direct-to-cloud connectivity means that no intermediate gateway is needed for IoT applications. Cloud services are available on-demand and are used to efficiently meet the ever-growing demand for IoT.

Energy efficiency, sustainability

The IoT battery-based Wi-Fi market is expected to reach 1 billion units by 2025, according to ABI Research. Battery-based IoT devices are now capable of efficiently monitoring energy-consumption and controlling it in real time. Examples include smart homes that make automatic adjustments to lower energy demand and increase efficiency. IoT provides

Photo Credit: ipopba / iStock / Getty Images Plus; InnoPhase IoT

insights that are timely, precise, and accurate. For example, IoT sensor-based smart thermostats automatically adapt room temperature based on occupancy and the habits of residents, and provide finer-grained temperature zones and vent control throughout the home. Increasingly, these technologies are becoming battery based.

Wireless modules and SoCs are solving the most critical issue impeding growth—the drastic reduction of power consumption in battery-based IoT devices. For example, InnoPhase IoT’s Talaria TWO Wi-Fi + BLE platform is untethering products, allowing select IoT devices to be battery-based for the first time.

Modules integ rate wireless connectivity and microcontrollers at the edge for IoT designs based on direct-to-cloud and ultra-low power. The entire module family employs a Talaria TWO Multi-Protocol SoC, with Wi-Fi and BLE5 for wireless data transfer, an embedded Arm Cortex-M3 for system control and user applications plus advanced security.

It’s the only digital power radio architecture delivering the world’s lowest power Wi-Fi solution available in a semiconductor device. InnoPhase IoT’s sensor-to-cloud customer applications based on the platform offer IoT products with approximately10 years of battery life. It also offers WiFi provisioning through BLE, secure over-the-air updates, and efficient power management features, making

it an ideal choice for building reliable and long-lasting IoT devices.

The challenge for OEMs and ODMs is finding providers with sufficient proven use cases combined with a toolbox of the right technologies, available today, that can move IoT devices into new applications fast. And that challenge will be heightened as the Matter platform continues to expand. Simple, interoperable, reliable, and secure, Matter relies on IP connectivity and suppor ts protocols such as Wi-Fi and Thread, and BLE for commissioning purposes.

These technologies, coming together are providing the efficiency and sustainability IoT demands. They also go far in solving the next problem—keeping batteries out of landfills.

Reality of Landfills

Untethering IoT devices and achieving long battery life are at the heart of today’s IoT efforts. Long IoT battery life is important on many levels. Not only does it determine device performance and efficiency, but batteries often are also installed in remote or hard-to-access locations, where replacing/recharging them is difficult.

There’s also an important disconnect between battery and device life. While most IoT sensor s and sensor nodes have an expected battery lifespan of between one and three years, for example, IoT device life cycles are 10 to 20 years or even more. As battery lifespan becomes more in line with device life, there will be fewer to

dispose of.

Today, approximately 5% of lithium-ion batteries are recycled. Between 2017 and 2030 estimates are that approximately 8 to 11 million tons of lithium-ion batteries will be disposed of in landfills as waste. Eliminating batteries, or dramatically curtailing their use is obviously important and will become even more so as regulations are created and upheld.

75% of enterprisegenerated data will be created and processed at the edge.

Driving IoT growth

The enabling of battery based IoT devices that operate efficiently and sustainably at the edge is taking place now. Until recently, approximately 5% of IoT devices were battery powered. That number is rapidly exploding to 10-20% in the next couple of years and growing to as much at 50% over the next 3-5 years.

Driving the growth of the IoT revolution towards multi-billions of devices in a sustainable and responsible manner without having explosive g rowth of landfills is the calling for our industry today. For IoT device designers, it’s important to choose a partner with expertise to bring together all the underlying advanced technologies to bring energy efficiency and sustainability to exciting new use cases—not tomorrow, but today.

InnoPhase IoT specializes in extreme low-power wireless IoT solutions and developed an award-winning Talaria TWO Wi-Fi + BLE platform.

https://innophaseiot.com

InnoPhase IoT’s low-power Wi-Fi video camera reference kit with Talaria TWO INP1014 module.

CE-link’s solar-powered Wi-Fi video camera with InnoPhase IoT’s Talaria TWO INP1014 module.

Connectivity revolution

How 5G is reshaping the future of manufacturing

BY DIJAM PANIGRAHI, CO-FOUNDER & COO, GRIDRASTER INC.

Gone are the days when we expected a seamless collaboration environment interconnected by a powerful network. Recently, it has gone from an impossible to do list to a reality with the introduction of 5G technology in a number of business applications. When it comes to the world of manufacturing, now is the right time to make investments for business expansion opportunities.

How is 5G different?

The true potential of 5G can only be realized when it is integrated with Industry 4.0 technologies like the Internet of Things (IoT), artificial intelligence (AI), edge computing, and AR/ VR. 5G will generate real-time data that can be translated into real-world applications in production. Based on data analysis, these technolog ical capabilities not only improve productivity and efficiency, but also enable more informed decisions. From manufacturing to supply chain strategies and logistics, sensors will harness the potential of 5G to create a connected, intelligent ecosystem that will transform the way companies operate in today’s business environment.

5G technology offers several advantages that make it particularly well-suited for use with automation technolog ies.

5G networks provide extremely low latency, reducing the delay between sending and receiving data. This is crucial for real-time communication and control in automation applications. Low latency ensures quick response times, making it suitable for time-sensitive tasks in industrial automation and robotics.

It offers significantly higher data transfer rates compared to previous generations of mobile

networks. This increased bandwidth allows for the seamless transfer of large amounts of data, which is essential for high-definition spatial data & video streaming, complex sensor data, and other data-intensive applications commonly found in automation.

Connection to IoT

There can also be support for a significant number of simultaneous device connections per square km. This is essential for the Internet of Things (IoT) and the increasing number of interconnected devices in automated systems. In industrial settings, for example, there may be a multitude of sensors, actuators, and devices communicating with each other, and 5G’s capacity to handle a large number of connections is crucial.

5G networks are designed to be highly reliable. This is important for automation systems, where a consistent and dependable connection is necessary for smooth operations. Reliability is especially critical in applications such as autonomous vehicles, smart factories and critical infrastructure.

What’s more, 5G introduces the concept of network slicing, allowing network operators to create virtual, dedicated slices of the network optimized for

richer and more complex experiences. With higher bandwidth and low latency, AR applications on smartphones can deliver more detailed and interactive content for enterprises and manufacturers, especially for supply chains.

Picker s and packers in warehouses can use 5G-powered AR devices to receive visual cues and directions for locating items. This can significantly speed up the picking process and reduce errors. AR can also assist in inventory management by providing real-time stock level info.

VR simulations can be used to train warehouse staff on new processes or layouts. It can also help in planning and optimizing warehouse layouts for better efficiency.

specific use cases. This customization enables the tailoring of network parameters to meet the specific requirements of automation applications, ensuring optimal perfor mance and resource allocation.

5G’s eMBB capability provides high-speed and high-capacity data transfer, supporting applications that require large amounts of bandwidth. This is beneficial for high-quality video streaming, augmented reality (AR), and virtual reality (VR) applications often integrated into automation processes.

High speed connectivity

5G’s hallmark is its remarkable speed, offering data rates that are exponentially f aster than its predecessor, 4G. This highspeed connectivity is a boon for AR and VR applications, which demand a continuous and seamless flow of data. In VR, users can exper ience ultra-high-definition content without lag or buffering, leading to a more immersive experience. AR applications, on the other hand, benefit from real-time data streaming, enhancing the overlay of digital information and 3D digital twins onto the physical world.

This technology also transforms the landscape of mobile AR applications by enabling

Other key areas where 5G significantly impacts AR/VR include supply chain visibility strategies, employee training programs through advanced simulation and modelling, design and prototyping for engineering teams, and communication and collaboration with off-site customer s.

Naturally, 5G complements edge computing by bringing computing resources closer to the source of data generation. This is beneficial for automation applications that require quick decision-making and processing of data at the edge of the network, reducing latency and improving overall system efficiency.

The combination of low latency, high bandwidth, massive device connectivity, reliability, network slicing, eMBB, and support for edge computing makes 5G technology well-suited for various automation and virtual-enabled technologies across industries. It enables faster, more responsive, and more efficient automated systems, resulting in improved decision making, more efficient operations, and a more competitive overall organization in today’s global economy.

Dijam Panigrahi is co-founder & COO of GridRaster Inc., provider of cloud-based AR/VR and 3D AI platforms. www.gridraster.com

Photo Credit:metamorworks / iStock / Getty Images Plus

Navigating the inventory waves

BY JOSH PUCCI, SVP GLOBAL SALES, SOURCEABILITY

The manufacturing industry is in a major state of oversupply of electronic component inventory stemming from pandemic-fueled shortages and subsequent over-correction. Rising interest rates are also adding a layer of complexity to inventory planning. Purchasers of electronic components have two immediate objectives: They must effectively predict demand shifts using concrete data to minimize risk to their bottom lines, while also ensuring that their existing inventory does not go to waste. Many of these products have expiration dates and lead times of up to two years, which poses a risk for holding inventory. Customers are constantly looking for ways to effectively predict market shifts and avoid over/underbuying.

Making market forecasting easier by:

• Leveraging advanced analytics and visibility into real market transactions and allowing companies to identify supply chain cost-saving opportunities.

• Using par t data from suppliers to analyze historical inventory fluctuation trends and pricing history and providing market availability during the procurement process.

• Using intuitive obsolescence monitoring tools and workflows to find, manage and resolve component risks and optimize the supply chain.

• Giving buyers, engineers and any staff members access to crucial information that is continuously updated using automated technology.

Within the next three to five years, we can expect this to set a new standard for supply chain operations. Humans will always be involved and review the final data, but AI is a useful tool that helps speed up the process and it will become a natural part of the workflow.

To address existing obsolescence concerns, an opportunity presents itself for stockpiled components to find a second life. Board-level and chip-level components are typically evergreen products that can be saved for many years when properly stored. When manufacturers have the proper storage space, they can engage in cost-reduction programs.

At this point, companies can expect product flow normalization no sooner than the second half of H2 2024. However, demand will bounce back eventually, and short-term forecasts remain optimistic. In three to five

years, demand will be driven back up by more applications that require electronic components (e.g. autonomous driving infrastructure and IoT-powered smart home devices).

Star ting now, customers will be willing to take advantage of favorable pricing when their inventory comes back into a normal range.

24MM LITHIUM COIN CELL HOLDER IS TOPLOADING

EMX ENTERPRISES

Keystone Electronics lithium coin cell holder maximizes pcb capacity when installing high capacity 2477 lithium coin cells in high-density applications. The top-loading design allows for minimal footprint board layouts without restricting battery access in devices. Available in rugged, thru-hole version and retains larger cells securely in severe shock and vibration environments.

www.emx.ca

CHIP FUSE BOOSTS

BREAKING CAPACITY RATING

SCHURTER

UST 1206 series slow-blow chip fuse delivers improved rated current values up to 25A, adding another

breaking capacity rating to its specification. Products deliver high melting I²t values, which exhibit improved inrush withstand performance. Breaking capacity ratings span over the current range of 7 to 25A at 63Vdc/32Vac and include: 100A at 63Vdc to a new rating of 750A at 32Vdc and 150A @ 24Vac. Rated operating temperature is55°C to +90°C.

https://www.schurter.com/en

CLB MODULE TAILORS HARDWARE SOLUTIONS

MICROCHIP TECHNOLOGY

PIC16F13145 microcontrollers (MCUs) address the need for increasing levels of customization in embedded applications, offering a tailored hardware solution. Outfitted with a new Core Independent Peripheral (CIP)—the Configurable Logic Block (CLB) module enables the creation of hardware-based, custom combinational logic functions directly within the MCU. Because of its integration into the MCU, the CLB

allows designers to optimize the speed and response time of embedded control systems, eliminating the need for external logic components and reducing Bill of Materials (BOM) cost and power consumption. The process is further simplified by a graphical interface tool, which helps synthesize custom logic designs using the CLB.

www.microchipdirect.com

AI SOM POWERS AUTONOMOUS MACHINES

NVIDIA Jetson AGX Orin Series system-on-modules (SoM) serve as an AI computer for energy-efficient autonomous machines and can

deliver up to 275 TOPS of AI performance with power configurable between 15W and 60W. SoM supports multiple concurrent AI application pipelines with firm’s Ampere architecture GPU, next-generation deep learning and vision accelerators, high-speed IO, and fast memory bandwidth. It can be used to solve problems such as natural language understanding, 3D perception, and multi-sensor fusion.

https://www.nvidia.com/en-us

FACE & PLUG SEAL KITS DELIVER IP54 RATING

INTERPOWER

designers to customize lengths during the design and prototyping phase.

https://learn.bivar.com/uhf

OSCILLOSCOPE PROBES COVER UP TO 52GHZ BANDWIDTHS

KEYSIGHT TECHNOLOGIES

C14 inlet Face Seal Kit and the Plug Seal Kit have received an Ingress Protection rating of ‘54’ (IP54) in UL’s test report. The IP54 rating (solid particle ingress level 5, liquid ingress level 4) prevents corrosive dust and solid particles from reaching the terminals while preventing liquids from short circuiting the terminals. Kits are available in four separate part numbers. The Face Seal Kit comes in two options: C14 Screw-mount Quick Disconnect Kit, part #83050000; and the Solder Tab Kit, part #83050010.

https://www.interpower.com/ic

SILICONE FLEXIBLE LIGHT PIPE FEATURES UNIBODY DESIGN

BIVAR

UHF Series Silicone Flexible Light Pipe boasts an all-new unibody lens with ingress protection, improving light pipe efficiency. Device simplifies the design process and elevates the entire user experience, making it easier to harness the power of light pipes. Product delivers IP67 Rating, with robust protection against ingress without the hassle of cumbersome hardware. Device’s adaptive silicone lens construction features a patent-pending rib design making it flexible and adaptive, allowing

InfiniiMax 4 Series high-frequency oscilloscope probes cover bandwidths up to 52GHz. As the industry’s only solution with a high-impedance probe head operating at more than 50GHz, the InfiniiMax 4 series provides digital designers with a turn-key probing solution for high-speed digital, semiconductor,

and wafer applications. Probes addresses challenge of devices getting smaller and faster by providing a high-impedance probing solution for system verification without loading the device under test (DUT) that accelerates highspeed digital design, validation and testing.

https://www.keysight.com/us/ en/product/MX0032A/infiniimax-4rcrc-probe-amp-52-ghz-with-40ghz-bessel-thomson.html

DC-AC PURE SINE WAVE INVERTERS SERVE INDUSTRIAL APPLICATIONS

ABSOPULSE

CSI 200-XX/24-F3 series of rugged, high- performance dc-ac inverters are designed for 24Vac industrial applications. Units deliver 200VA pure sine wave output voltage, while using field-proven, microprocessor

controlled high-frequency PWM technology to deliver 24Vac isolated, pure sine wave output voltage. Products operate from a nominal input of 24Vdc or 48Vdc. Custom input/output voltages are available on request. High frequency conversion enables compact construction, low weight, and high efficiency.

https://absopulse.com/ruggedconvection-cooled-dc-ac-puresine-wave-inverters-for-24vac-industrial-applications-200va-300va/

ANGLED PCB TERMINAL BLOCKS CONNECT QUICKLY

PHOENIX CONTACT

SPTA-THR 2,5 series pcb terminal blocks include angled, reflow-solderable versions for automated assembly processes. Devices deliver fast connection with Push-in spring connection and are suitable for multi-row arrangement on the pcb. Devices manage currents of up to 32A and voltage up to 400V. Devices provide 0.2 to 4mm² conductor cross-sections, with a 5mm pitch.

Tool-free products are available in 2 to 12-pos, while supplied in box or tape-on-reel packaging.

https://www.phoenixcontact. com/en-pc/products/pcb-terminal-block-spta-thr-15-2508-r32-1071199

BACK FLIP FPC/FFC CONNECTOR SAVES SPACE

HIROSE

TF07V Series space-saving, back flip FPC/FFC connector includes a 0.5mm pitch version that offers dual contact functionality to simplify flex routing. Device has a height of

2.1mm, making it suitable for consumer electronics, industrial robotic, and medical applications that require connectivity solutions combining miniaturization and ruggedization. While delivering

higher reliability, the top and bottom contact design offers board design flexibility and ease of assembly while the back flip design increasing the FPC/FFC retention in the vertical direction.

https://www.hirose.com/en/ product/series/TF07V

650V SUPER JUNCTION N-CHANNEL MOSFETS SERVE HIGH-VOLTAGE, FAST-SWITCHING APPLICATIONS

CENTRAL SEMICONDUCTOR

650V Super Junction N-Channel MOSFETs are designed for high-voltage, fast-switching applications. The latest additions, available in TO-220FP packaging, include:

CDMSJ2204.7-650 (4.7A); CDMSJ2207.3-650 (7.3A); CDMSJ22010-650 (10A); CDMSJ22013.8-650 (13.8A); CDMSJ22029-650 (29A). Devices feature a die structure that supports high-voltage with comparatively low on-resistance and fast switching speeds.

https://my. centralsemi.com/ product/partpage2.

php?part=CDMSJ22029-650

RESISTOR BOOSTS ELECTROLYTIC CORROSION RESISTANCE

KOA RN73R high precision, high reliability thin film resistor replaces firm’s RN73 series with improved electrolytic corrosion resistance and higher stability. Product series is designed for tough environments and suitable for high precision

circuits for automotive, aerospace and other challenging applications. Despite product’s ultra-thin film, devices deliver improved moisture resistance due to an additional inner protective layer.

https://www.newark.com/b/koa

FISHEYE CAMERA DELIVERS 180° FIELD-OF-VIEW

2PI OPTICS

High-resolution fisheye sensor is based on optical metalens technology, anticipated to further miniaturize the cameras used in advanced driver-assistance systems (ADAS), AR/VR, UAVs, robotics and other industrial applications. The flat lens produces crisp, 180-degree panoramic images, replacing bulky and costly conventional wide-FOV

lenses. Metasurface-enabled cameras and 3-D depth sensor modules can be configured for a diverse spectrum of specifications, targeting different markets.

https://www.2pioptics.com

REGISTERING CLOCK DRIVER ADVANCES DATA CENTRE SERVER PERFORMANCE RAMBUS

Gen4 DDR5 Registering Clock Driver (RCD) boosts the data rate to 7200 MT/s, setting a new benchmark for performance and enabling a 50% increase in memory bandwidth over today’s 4800 MT/s DDR5 module solutions. State-of-the-art device supports the rapid pace of server main memory performance improvements to meet the demands of generative AI and other advanced data centre workloads. Memory interface chips including the RCD, Serial Presence Detect (SPD) Hub and Temperature Sensors are

important in achieving a new level of performance for leading-edge servers.

https://www.rambus.com/ memory-interface-chips/ddr5dimm-chipset/

THERMOELECTRIC COOLING MODULES BOOST FAN, HEATSINK PERFORMANCE

JARO THERMAL

Active thermoelectric cooling (TEC) chip modules work synergistically with existing fan-to-sink products. Devices provide swift, additional performance to fans and heatsinks. Firm’s TEC technology leverages the

Peltier Effect, utilized for cooling or heating purposes, depending on the direction of the electrical current. Devices take up very little space, as they are attached to the fans themselves.

https://jarothermal.com

EPOXY MEETS ISO 10993-5 FOR NON-CYTOTOXICITY

MASTER BOND

Supreme 11AOHTMed two component epoxy features thermal conductivity and electrical insulation. System fully passes ISO 10993-5 testing for non-cytotoxicity and is recommended for bonding and sealing in medical device applications. Product has reliable electrical insulation properties with a volume resistivity exceeding 1014 ohm-cm at 75°F. It also exhibits thermal conductivity of around 4 to 5 BTU·in/ ft²·hr·°F (0.58-0.72 W/m/K). The system provides high bond strength properties with a lap shear strength of 3,200-3,400 psi, a tensile strength of 7,000-8,000 psi and a compressive strength of 20,000-22,000 psi.

https://www.masterbond.com/ properties/biocompatible-adhesives

DISTRIBUTION

MOUSER LAUNCHES CYBERSECURITY RESOURCE HUB

Global electronic component distributor Mouser Electronics has taken a deep dive into the complex world of cybersecurity, encouraging and urging engineers to stay informed on the emerg ing design challenges in this critical domain. Cybersecurity is an ever-evolving field, with a continuous influx of threats and vulnerabilities emerging every day.

In today’s interconnected world, the need to integrate security at the foundational level of design is essential. Solutions like biometric authentication and artificial intelligence (AI) can enhance identification accuracy across both consumer devices and industrial systems housing highly sensitive data.

Mouser has developed a comprehensive security resource c enter that provides in-depth articles, eBooks, and blogs that examine practical tips for embedded system security and address security concerns associated with 5G and Industry 4.0.

SAGER, TAOGLAS SIGN DISTRIBUTION AGREEMENT

Sager Electronics has added Taoglas to its line card, a global provider of advanced antenna and RF solutions, offering a range of IoT products and services that enable seamless

position to support our customers across a very broad range of applications,” said Lew LaFornara, TTI senior VP product & supplier marketing.

DIGIKEY ADDS MORE THAN 450 SUPPLIERS

connectivity for a wide range of applications.

“Communications function is a critical part of the application design process –you can’t get ‘smart’ connectivity without an antenna.

Taoglas’ expertise in RF technologies really sets them apart,” noted Holly Myers, director of supplier marketing and product management for Sager Electronics

TTI SIGNS DISTY DEAL WITH FCL COMPONENTS

TTI Inc. has signed an agreement to become an authorized distr ibutor of FCL Components America Inc. (FCAI), including thousands of standard and customized electromechanical relays.

“TTI welcomes the new alignment to our line card as we recognize the tremendous growth opportunities FCL Components’ extensive product offering creates for our customer base in the Americas. Bringing this complementary product set on board greatly strengthens our

DigiKey has expanded its vendor portfolio in 2023 by adding more than 450 new suppliers across its core business. The global distributor added more than 1.7 million accessible parts, including 230,000+ par ts with inventory available to sell, across its core business in 2023.

“2023 was a year of record-breaking innovation as we continued to offer the newest technologies and reinforce our position as the distribution leader of a vast and expanding selection of components across many product groups,” said Mike Slater.

“As we look forward to 2024, inventory is stabilizing and returning to a state of normalcy, suppor ting DigiKey’s commitment to accelerate progress for every designer, buyer and builder by offering the largest supplier portfolio and widest product offering. We are excited to announce that these products are cur rently available to the global engineering community.”

PRODUCTION SERVICES STENTECH EXPANDS PARTS DIVISION IN CANADA

StenTech Inc., global specialists in SMT printing solutions, is expanding its parts division in Canada and the United States. The firm specializes in laser cut and chemically etched precision metal parts, suitable for projects from initial prototypes to fullscale production.

“This strategic move allows

StenTech to offer extended capabilities and services to our current customer s as well as opening up to a far-reaching broader market that includes all industries across North America,” notes StenTech CEO Brent Nolan.

SEMICONDUCTORS

NORDIC SEMI, ARM REAFFIRM PARTNERSHIP

Nordic Semiconductor has signed a multi-year Arm Total Access (ATA) license with leading semiconductor design and softw are platform company, Arm.

The ATA license guarantees Nordic access to the widest range of Arm IP, tools, support, and training for its current and future products, including multiprotocol,Wi-Fi, cellular IoT, and

DECT NR+ solutions

The new deal extends the long-term partnership between the companies, stretching back to the launch of the Arm-powered Nordic nRF51 Series multiprotocol Systems-on-Chip (SoCs) in 2012. Since then, Nordic has shipped billions of chips using Arm technology.

Photo Credit:: Mouser; Taoglas;FCL; DigiKey; Stentech;Nordic Semi

Harvester Board maximizes IoT node efficiency

VENDOR: VISHAY INTERTECHNOLOGY

BC COMPONENTS 196 HVC ENYCAP V-HARVESTER BOARD

The 196 HVC ENYCAP V-Harvester board maximizes IoT node efficiency by helping to replace regular batteries with a rechargeable photovoltaic (PV) energy-harvesting backup solution. Board is an HVC system backup demonstration circuit that enables developers to extend overall product life expectancy by implementing a longer, more sustainable maintenance-free, energy supply source for use in a variety of host system applications.

The V-Harvester board is a photovoltaic (PV) harvesting backup circuit with a supercapacitor voltage of 4.2V. The MAL219699005E3 is a stand-alone board charged using TEMD5080X01 micro PV cells or with micro USB. The V-Harvester board is equipped with a 4F / 4.2V 196 HVC ENYCAP hybrid energy storage capacitor and operates from -20°C to 85°C temperature range. The board controller uses Low Dropout Regulators (LDO) to change the supply voltage to the target voltage when there is a power demand at the interface. The 196 HVC ENYCAP V-Harvester Board includes a set of jumpers and is available in 64mm × 69mm dimensions.

Features

Equipped with 196 HVC ENYCAP™ hybrid energy storage capacitor

Charged using TEMD5080X01 micro PV cells or with micro USB

• 5 .5VIN input voltage

• 4 .2V supercapacitor voltage

• -20°C to 85°C operating temperature range

• 64mm × 69mm dimensions

Applications

• Automotive

• Avionics, military, and space

• Computer

• Consumer Ind ustrial

• Medical Telecommunications

• Power MOSFETS

Load and signal switches

• Switching diodes and rectifiers

• Capacitors

• Resistors

• NTC and PTC thermistors Ind uctors/EMI filters

Scan here to view and download the full data sheet in pdf format.

Photo: Vishay Intertechnology

ELECTRONICS MARKET

EPTECH 2024

EPTECH is back! Connecting you with the electronics market throughout Canada.

Eptech is an efficient table top show, which allows exhibitors to easily set up their display and showcase innovative products to OEM’s throughout Canada. Book today to to reserve a great position. Receive exclusive face-to-face networking opportunities with attendees including OEM’s, designers, engineers and project managers.

Exhibitors also have the opportunity to host on-site seminars to discuss new products and solutions for electronics projects.

TO REGISTER VISIT:

Eptech.ca

Toronto April 17

Quebec City May 7

Vancouver June 4

Montreal September 10

Calgary October 3

Mississauga October 22

Hammond has over 20 million dollars of in-stock inventory and over 16,000 unique product skus to choose from.

TRANSFORMERS

Low voltage power transformers, high-end audio transformers and chokes, medical grade isolation.

Diecast aluminum, extruded aluminum, and plastic enclosures in thousands of sizes and configurations.