Flexible power sources serve a range of applications p.12
WHAT’S THE DIFF?
3D printing vs. pcb printing in the world of additive fabrication p.16
4 EDITORIAL
Transformative tech brings flexibility to design process
6 WEST TECH REPORT
Symroc goes seismic with its low frequency monitoring
7 THINK GREEN
Tektronix’ purchase of Elektro-Automatik makes for greener testing
In every issue
5 NEWSWATCH
26 NEW PRODUCTS
28 SUPPLY SIDE
29 AD INDEX
30 DEV BOARDS
Eggtronic eval board boosts performance in wireless charger
COVER STORY THAT’S A STRETCH
8 10 12 16
Discovering the advantages of printing functional inks on substrates.
ASIC OR FPGA?
When it comes to hardware design, system engineers have more than one architecture to choose from.
THIN, PRINTED INTEGRATED
Flexible batteries suit wearable and smart label markets.
3D VERSUS PCB PRINTING
Two technologies that stand out for their transformative potential.
Try to be more flexible
FPE adds innovation to electronic design process
In an industry that thrives on the synergy between form and function, the advent of flexible a nd printable electronics represents a seismic shift for electronic designer s. These emerging technologies are not just the next big thing— they’re a transformative force that promises to redefine the boundaries of creativity, functionality and manufacturability.
Flexible Printed Electronics or FPE refers to lightweight, bendable electronic components printed on flexible substrates, enabling a range of innovative applications. And, this market is experiencing rapid growth, fueled by trends towards miniaturization, increasing demand for wearable technology and advancements in materials and printing techniques.
Currently valued at several billion dollars, the market is witnessing significant interest from sector s such as consumer electronics, automotive, healthcare and smar t packaging. As manufacturers focus on enhancing performance and reducing costs, the adoption of flexible electronics is set to rise. Innovations in conductive inks and substrate materials are also facilitating this transition.
Flexible electronics includes circuits and devices that can bend, stretch, and conform to various shapes without losing functionality. Unlike traditional rigid silicon-based circuits, flexible electronics are built on substrates like plastic, metal foil, or even paper, offering a remarkable degree of physical adaptability.
The implications for design quite profound. Imagine wearables that truly conform to the human body, electronic devices integrated seamlessly into
clothing, or medical sensors that wrap around limbs with precision. These are no longer futuristic concepts; they are achievable realities thanks to flexible electronics.
For designers, this means an unprecedented freedom to innovate. The constraints of rigid circuit boards are no longer a bottleneck. Instead, you can explore organic, flowing shapes and create products that integrate more naturally into users’ lives. Whether you’re working on consumer electronics, healthcare devices, or even automotive interfaces, the ability to design around human or environmental contours rather than imposing rigid structures is a game-changer.
New techniques
Complementing the flexibility in form is the innovation in production methods—namely, printable electronics. Using techniques such as inkjet printing, screen printing, or gravure, electronic circuits can be produced on a wide range of substrates with the same ease as printing on paper.
This technology democratizes the production of electronics in two significant ways. First, it reduces the cost of manufacturing. Traditional semiconductor f abrication is capital-intensive, requiring clean rooms, expensive machinery, and significant overhead. Printable electronics, however, can be produced using less costly mater ials and methods, opening the door to smaller firms and even startups to innovate without the burden of massive upfront investment. Second, printable electronics support rapid prototyping and customization. Designers can experiment with circuit layouts, test iterations quickly, and refine their designs in real-time. This agility is particularly valuable in today’s fast-paced market where consumer preferences
shift rapidly, and the ability to pivot and respond can be a key competitive advantage.
With wearables, healthcare and the automotive industry serving as fertile ground for flexible implementation, the possibilities extend into the realm of the Inter net of Things (IoT). With printable electronics, designers can create low-cost, disposable sensors that can be deployed in vast quantities to collect data in real-time across large areas, from smart cities to agricultural fields. The low production cost and versatility of these sensors make IoT deployment more scalable and economically viable.
Challenges and considerations
While the potential of these technologies is vast, it’s important to acknowledge the challenges that come with adopting these technologies. Durability, for instance, is a key concer n. Flexible devices are subjected to mechanical stresses—bending, stretching, twisting—that rigid electronics are not. Ensuring that these devices maintain their functionality over time requires new materials and design approaches.
Moreover, the integration of flexible / printable techniques into existing production lines is not without hurdles. Standardization is still in its infancy, and designer s must navigate a landscape where material properties, manuf acturing processes, and performance characteristics can vary significantly.
For designers, this means staying ahead of the curve not just in terms of creative application, but also in understanding the technical nuances of these emerging technologies.
STEPHEN LAW Editor slaw@ept.ca
Canada’s information leader for electronic engineers and designers
SEPTEMBER 2024
Volume 46, Number 6
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The future of the smartphone industry is set to be transformed as worldwide generative AI (GenAI) smartphone shipments are forecast to grow 363.6% year over year in 2024 to 234.2 million units, according to a new International Data Corporation (IDC) forecast.This represents 19% of the overall smartphone market in 2024.
IDC defines GenAI smartphones as devices that feature a system-on-a-chip (SoC) capable of running on-device GenAI models more quickly and efficiently leveraging a neural processing unit (NPU) with 30 tera operations per second (TOPS) or more performance using the int-8 data type.
Despite the challenges of elongated refresh cycles and macroeconomic uncertainties, GenAI capabilities on the smartphone will drive upgrades and represent a significant opportunity for both vendors and application developers alike. The dramatic growth seen in 2024 will carry into 2025 with shipments of GenAI smartphones expected to grow 73.1% year over year.
MEDTECH
AI-POWERED ANTENNA DIAGNOSES BONE FRACTURES
A University of Waterloo engineer has paired inexpensive wireless communication antennas with artificial intelligence (AI) to improve how doctors can detect bone fractures
Determining bone fractures using traditional diagnostic methods such as x-rays, computed tomography (CT) scans, and magnetic resonance imaging (MRI) takes time — such equipment is not readily available in ambulances or primary care facilities and, with health care services in high demand, many people have to wait for an x-ray or scan once they arrive at the hospital.
Unlike conventional medical imaging methods that produce images requiring expert interpretation, the system detects cracks and breaks clearly, providing straightforward information that is crucial in emergencies. It works by positioning two antennas on opposite sides of the suspected fracture site, with one antenna transmitting low-frequency microwaves through the bone to the other. The received data is then analyzed by a deep neural network — an AI model trained on extensive datasets of human body parts and bone fracture types.
EDUCATION
SIEMENS
GIFT HELPS USASK DEVELOP CHIP DESIGN TALENT
An example of Dr. Omar Ramahi’s lab set-up shows a cow leg bone sitting between a dipole antenna and a horn transmitting antenna. The horn transmitting antenna sends a microwave signal towards the bone which is then received and classified based on the type of fracture in the bone.
The University of Saskatchewan (USask) has received a gift from Siemens to create a tenured professor chair in the USask College of Engineering for research and teaching that develops local talent in the large, fast-growing industry of electronic design automation (EDA).
EDA software is used to create electronic chips, which are used in almost all modern electronic devices. Siemens’ EDA software is used by the world’s largest technology companies to make better performing, higher quality electronic chips more quickly.Their Saskatoon office is a centre of excellence for research, development and customer applications, that employs engineers and computer scientists.
The Siemens EDA Chair, based in the Department of Electrical and Computer Engineering, will develop and teach undergraduate and graduate courses in EDA. The chair will also
supervise and mentor undergraduate research interns, master’s and PhD students, as well as visiting students and post-doctoral fellows.
AUTOMOTIVE
KEYSIGHT AND NXP SET AUTOMOTIVE SECURITY STANDARD
Keysight Technologies and device security research lab Riscure Security Solutions, have successfully completed the first Car Connectivity Consortium (CCC) Digital Key Applet (DKA) certification for NXP Semiconductors, global provider of secure connectivity solutions for embedded applications. The two companies worked together to evaluate and certify NXP’s automotive Digital Key solution, helping further the development of this new standard.
The CCC DKA program focuses on securing digital key solutions for the automotive industry that safeguard the privacy and security of users. This is achieved by implementing stateof-the-art public key protocols, hardware-based key storage, and wireless transmission standards to securely authorize user access in proximity of the key with the vehicle.
COMPUTING
AVNET CONSOLIDATES EMBEDDED OPTIONS
Avnet has launched a product brand Tria and corresponding business called Tria Technologies to consolidate its compute design and manufacturing. The new brand will represent embedded compute boards, systems and associated design and manufacturing services at Avnet.
“The new brand embodies Avnet’s unique ability to deliver standalone modular embedded compute solutions in a world where OEMs are increasingly looking to move from their own chip-down manufacturing to part- or full- pre-made embedded compute platforms,” said Thomas Staudinger, president of Embedded Solutions, Avnet.
Photo: da-kuk/E+/Getty Images
Symroc goes seismic with its low frequency monitoring
Sensors leverage wireless communication while boosting performance
BY MIKE STRAUS, WEST COAST CORRESPONDENT
Boasting clients and partners like CP, CN, and Natural Resources Canada, Calgary-based Symroc has revolutionized the world of seismic monitoring. Co-founder and CEO Wilson Howe says the company began as an engineering project management solutions company; a few years in, the company found an opportunity in ground motion monitoring. Howe notes that ground sensors at the time were lacking an easy-toinstall solution, especially for low-frequency data acquisition.
“My business partner and I had an idea, and then we tested that idea in our lab,” Howe explains. “When we tested the idea, it showed good results. Then we showed our information to the National Research Council of Canada, who supported us fairly quickly through the IRAP program. With that support, we started a full research team to develop the technology. Everything we do today is based on that initial hardware.”
Overcoming traditional hurdle
Howe says he and his business partner were struck by the problems with traditional seismic monitoring systems: Namely, their inconvenience and their lack of performance. Ground movement is typically measured via geophones and seismometers; seismometers are large, power-hungry, difficult-to-install, and require a great deal of supporting infrastructure, all of which makes for high installation and operating costs.
Meanwhile, traditional geophones don’t perform well below 1Hz, making it difficult to detect low-frequency vibrations. In response to those challenges, Howe and his business partner developed a system that’s easy to install, that uses wireless communication, and performs as well as seismometer s but at a lower cost.
Howe notes that initially, the company faced challenges in explaining its technology
“There’s a lot of education and explanation involved to get people to understand the issue,” Howe says.
Wilson Howe, CEO & co-founder of Symroc says that his technology enables sensors to clearly identify a seismic event, such as an earthquake.
“The market in general has a lot of uncertainty in terms of how fast changes can happen. But we’ve proven that our system performs well every time we have a project.”
Symroc’s sensor systems have moving parts in the design that are integrated with a digital system. An internal feedback system supports the design, enabling the sensors to provide real-time data. On-board electronic systems provide for recording, and on-board timestamp systems ensure the accuracy of data down to 1 microsecond. Howe explains that this technology enables Symroc sensors to clearly identify a seismic event in a similar way that earthquake monitoring stations work. However, with Symroc’s low-power methodology, the company can set up small earthquake monitoring stations freely.
Symroc ’s sensors provide bandwidth coverage ranging from 0.001Hz to 1600Hz, with >120dB dynamic range across the entire passband. The sensor systems can operate for years with a 50-100W solar panel, will operate in temperatures ranging from -40 to +70 degrees Celsius, and are outdoor-proof. The system’s built-in transmission module enables wireless data transmission through LTE, WiFi, radio frequency, satellite, Bluetooth, and wireless cell data networks.
Howe says Symroc’s sensors have several use cases, most notably in fracking. In northern British Columbia, there’s a significant amount of oil and gas dr illing and fracking activity. Howe notes that part of the problem with fracking is understanding how subsurface injection activities are related to earthquakes. While the best way to monitor for fracking earthquakes is with high-density ground monitoring stations, the oil and gas industry currently lacks a good system for such monitoring.
“Most of these companies are still using traditional earthquake monitoring systems, which are bulky, power-hungry, and are supplied by just one supplier in Canada,” Howe notes. “We worked with the National Resource Council of Canada to
develop an earthquake sensor system for fracking, and we’re showing the best results in the industry. When people can see location details, they can correlate it with their work and try to adjust the speed and volume of the injection. They can adjust the operation parameters to help mitigate larger events.”
Another use case where Symroc’s technology is in use is structural monitoring, particularly for older railway br idges. Symroc’s seismic sensors are in use by CN Rail and CP Rail for structural monitoring. In a recent rail project, Symroc’s sensors could identify how the bridge was moving under the train load, and using that information, Symroc trained its system to detect any changes to normal operations. This application is very useful for preventative maintenance repairs, enabling railway companies to identify abnormal bridge movements before an event occurs.
Disruptive solutions
Howe says that the company is now looking at several areas where Symroc’s sensors could serve as disruptive solutions to help solve challenges. The next milestone, he says, will be seeing a shift in the industry’s approach from reactive to proactive.
“Part of the uncertainty in the industry is related to how fast adoption can happen when it’s government regulators responsible for these areas,” Howe explains. “Our sensors are very much related to critical infrastructure and public safety, which isn’t a typical private company demand. We do see things change pretty fast when incidents happen, but it’s not ideal to work that way. You can’t plan for when disasters happen.”
Howe says that Symroc is eagerly anticipating the day when the industry shifts its safety approach to a proactive model. Until then, Symroc is focused on providing its clients with exceptional service on every project.
Symroc is a Calgary-based provider of low-power, low-frequency seismic sensor technology. www.symroc.com
Tektronix’ addition of Elektro-Automatik seeks to ‘green-up’ test options
BY STEPHEN LAW, EDITOR – EP&T
Taking a big step to expand its capabilities in the rapidly evolving clean energy sector, earlier this year Tektronix Inc. announced its acquisition of EA Elektro-Automatik, a leading EU-based manuf acturer of power supplies and electronic loads. The move is expected to bring significant benefits to both companies, as well as their shared customer base, especially in the automotive powertrain, battery chemistry and design spaces.
James Hitchcock, general manager of Keithley Instruments, a Tektronix company, elaborated on the motivations behind the acquisition:
“Tektronix has been engaged with our engineers for many years - especially in the automotive powertrain and the battery chemistry and design space. Our isolated probing and main Series scopes were used by engineers designing new solutions for electric vehicles for years. However, our customers faced challenges with higher energy requirements at the module or pack level, which we couldn’t address. This led us to explore opportunities in this space. We found that EA Elektro-Automatik’s products aligned with our values of high quality and performance, making them a perfect fit,” said Hitchcock.
Integrating strengths
The merger of the two test brands is poised to create substantial synergies and open new market opportunities, according to Hitchcock.
“Tektronix will benefit from access to EA’s technologies, enabling us to build out comprehensive solutions for customers in the decarbonization and energy sectors,” he highlighted. “By integrating EA’s bi-directional power supplies, loads, and power supplies with Tektronix and Keithley’s measurement capabilities, we can address power efficiency and integrity measurements from microvolt levels for IoT devices to megawatt levels, a range we previously couldn’t cover. This integration allows us to deliver deeper value in the clean energy market.”
James Hitchcock, general manager of Keithley Instruments, a Tektronix company, shares his insights relateing to the acquisition of AE ElektroAutomatik
For EA Elektro-Automatik, the acquisition offers significant advantages as well, as the brand will gain access to Tek’s advanced measurement technologies, enabling them to develop more complete solutions for battery testing and emulation. Incorporating Tektronix’s switching and measurement technologies into EA’s systems will also allow them to offer a full suite of solutions, enhancing their existing power source capabilities.
Understanding needs
Addressing potential concerns about product line integration and market overlap, Hitchcock noted, “Currently, our primary focus is on supporting our customers. We haven’t decided on brand integration yet. Interestingly, there is minimal overlap between EA’s and Tektronix’s product portfolios. EA focuses on industrial power sourcing, while Tektronix and Keithley cater to engineering R&D benches requiring precise voltage and current measurement. By understanding our customers’ needs, we can position the right product at the right time, avoiding cannibalization.”
The acquisition also has the potential to redefine standards in electronic testing, particularly in the battery market.
“One of our customers’ challenges is understanding battery quality
over time and validating it throughout its lifecycle. The combination of Tektronix and EA will provide all the tools needed to characterize batteries fully,” explained Hitchcock. “With Tektronix’s expertise in measurement standards and reporting, and EA’s sourcing capabilities, we can support our customers in developing and adhering to emerging standards, such as Europe’s battery passport concept.”
Ultimately, the strategic acquisition positions both Tektronix and EA Elektro-Automatik at the forefront of innovation in the electric vehicle and clean energy sectors, promising to deliver comprehensive, high-quality solutions that meet the evolving needs of their customers.
“Tektronix and EA are here for the full design lifecycle and product realization, from early stage research and education, learning about new capabilities, new chemistries, new topologies, and techniques for power efficiency – right through to validation and automation into production,” notes Hitchcock. “The commitment that Tektronix brings is applications support and partnership to solve challenging problems to realize new products into the energy ecosystem. That’s the unique value proposition that that we bring as a company.”
The Keithley Series 2200 offers five dc power supply models that have voltage outputs from 20V to 72V to address a wide range of power requirements.
The added touch in making electronics
Additive manufacturing for flexible and stretchable printed electronics
BY STEVE PASCHKY, SARALON
The design and manufacturing processes for traditional (rigid) electronics are well-established, offering reliable solutions to various industries. However, there is an increasing demand for smar ter everything highlighting the need for more complex electronics that are easier to integrate on almost every surface through a resource efficient process that facilitates rec ycling and minimizes the use of toxic chemicals.
Evolution – pushing boundaries
Building on existing foundations of electronics industry, flexible hybrid and Printed Electronics emerge as the natural evolution of electronics technologies rather than a revolution or complete depar ture. In fact, the core electronics principles remain the same while materials and manufacturing processes differ.
As the name suggests, Printed Electronics (PE) involves printing functional inks on the chosen substrates. These functional inks include conducting , sensing, heating, electroluminescent, electrochromic, even
inks for printable batteries, etc. The variety and availability of these inks are continually expanding and depending on the application, different materials like silver, copper, carbon and others are used.
Printed Electronics is an additive manufacturing technique that minimizes material waste and facilitates rapid prototyping , customization, and potentially lower production costs. Conventional printers, primarily screen-printers, are used to create complex circuits by layering functional inks on a single substrate. This integration of different functionalities without the need for new machinery or production systems makes PE the promising approach for meeting the demands of modern electronics.
The transformative impact of PE is not only due to enabling experimentation with various ink materials and functionalities, but also encouraging the use of diverse substrate materials. While thin flexible plastic substrates such as PET, PC, and PI are commonly used, more peculiar alternative substrates like paper, stretchable TPU, and textiles are also within the realm of PE possibilities.
Stretchable electronics on TPU substrate using Saral StretchSilver 800 and Saral SilverGlue Alpha 600.
Key application areas / emerging innovation trends
The inherent flexibility of printed and hybrid electronics allows for innovative form factors, such as bendable, stretchable, and conformable devices that can be integrated into unconventional surfaces and environments. Among the emerging areas for printed electronics, wearables, automotive, and smar t packaging sectors are rapidly adopting the technology on a commercial scale. These industries are heavily investing in PE due to its several advantages mainly its huge advantages in supporting invisible electronics on complex geometr ies, eliminating the difficulties of bulky electronics integrations, and direct printing on lightweight substrates, leading to substantial weight reduction.
2
Printed shoe sole sensing system consisting of pressure, temperature and humidity sensors.
Automotive industry is a major driver of Printed Electronics growth and a significant focus on differentiation within the automotive industry is directed toward interior design. From printable sensors for increasing safety and comfort and printable heaters for EV thermal management and battery performance enhancement to stretchable and thermoformable conductive inks for electronics on more complex geometries like steering wheel and 3D shapes, PE industry is increasingly addressing gaps and overcoming challenges that traditional electronics struggle with. PE significantly reduces weight and simplifies wiring complexities.
Fig 1
Fig
Photo: Sralon
Wearable PE devices hold great promise for addressing healthcare needs, particularly in Remote Patient Monitoring (RPM) and elderly care systems. These solutions are in general preventive, using advanced sensing and monitor ing systems to collect real-time data, predict, and prevent emergencies. Specially in elderly care, wearables must ensure safety and comfort without disrupting daily lives of older adults. PE enables the development of comfortable, simple, effective, and also aesthetically pleasing healthcare wearables.
Another rapidly g rowing wearable market is Remote Patient Monitoring (RPM) devices. The idea here is to replace episodic doctor visits and occasional data capture with continuous streams of data.This introduces a new paradigm where RPM is a means to gain predictive insights into health status by inferring trends from a large set of basic sensor data.
Printed Electronics (PE) offers significant advantages in this context, enabling the integration of smart solutions into flexible, bendable, and stretchable surfaces that conform
easily to the human body. PE allows for the creation of invisible electronics and non-bulky sensing devices, essential for wearables.
There are two primary strategies for embedding sensors in PE wearable devices: Either sensing inks are directly printed on the chosen substrate to create printed sensing nodes and surfaces, or printable conducting adhesive inks are applied to attach sensors (as SMD) on flexible and stretchable substrates.
Recyclable & eco-friendly
Smart packaging and logistics systems increasingly demand electronics in thin, flexible formats, ideally on recyclable and eco-friendly substrates like paper. Printed batteries are well-suited for this market, consisting of non-toxic functional inks printed on ultra-thin flexible substrates. Additionally, printed sensors and RFID tags are widely adopted PE technologies in this sector. According to a recent IDTechEx repor t, the flexible battery market for smart labels and RFID tags is projected to reach US$14.3 million by 2025, with an expected annual growth rate of 23.9% over the next decade.
The future holds numerous possibilities and opportunities. Another compelling example is the smart textiles industry, which is increasingly adopting PE techniques to directly print stretchable conducting inks, sensors, heaters, and other elements onto fabrics, thereby adding advanced smart functionalities to them.
A growing and diverse range of OEMs are now considering the use of functional inks for printed and hybrid electronics. These include research institutes and universities developing new applications, conventional electronics manufacturers seeking innovative solutions, PE and hybrid electronics developing pilot projects, print houses, and contract manufacturers.
Close collaboration across various industries, such as advanced materials, electronics, information and communications technologies, printing, and advanced manufacturing is crucial for staying competitive in emerging smart markets.
Steve Paschky is co-founder, sales & marketing director at Saralon, German-based developers of functional inks for clients in the flexible hybrid and printed electronics space. https://www.saralon.com/en
Fig 3 Temperature logger with integrated printed battery.
ASIC or FPGA?
Selecting the right IC for your application
BY ROSS TURNBULL, SWINDON SILICON SYSTEMS LTD.
When it comes to hardware design, system engineers have more than one architecture to choose from. Both Application Specific Integrated Circuits (ASICs) and Field Programmable Gate Arrays (FPGAs) can offer benefits, but which one is best for your application? Here, Ross
Turnbull, Director of Business Development and Product Engineering at ASIC design and supply company Swindon Silicon Systems, explains what to consider.
To start understanding the differences between an ASIC and an FPGA, we begin by defining the two. An ASIC is a type of IC that has been designed
If time-to-market is of the utmost priority, an FPGA will likely be the preferred route. Unlike ASICs, they are typically sourced off-the-shelf.
uniquely for its target application, whereas an FPGA is typically a standard part that is user-configurable and can fulfil multiple purposes. FPGAs can be reprogrammed one or more times to perform a variety of tasks.
At first glance, the distinction between the two seems simple: one has been carefully optimised, the other built for flexibility. But when it comes to choosing between an ASIC and an FPGA for your specific application, the differences can be a lot more nuanced. So, what factors should you consider?
Getting to market?
Ross Turnbull, director of business development and product engineering at Swindon Silicon Systems, a UK-based ASIC design and supply company.
If time-to-market is of the utmost priority, an FPGA will likely be the preferred route. Unlike ASICs, which involve a rigorous custom design process, FPGAs are typically sourced off-the-shelf. Equipped with a standard interface, FPGAs can be easily reprog rammed by the customer for specific functions, enabling quick and easy product integration. This makes them ideal for dynamic fields where the environment and expectations are changing quickly, and these factors are prioritised over cost considerations. But if you’d like the optimized performance of an ASIC without an extensive timeframe, there are routes available to make this possible. ASIC designers have access to one or more libraries of foundry and third-party IP. These IP blocks can be used to form the basis of a custom IC design, shortening development time without losing the optimisation benefits of an ASIC. Software can also be developed in parallel to the hardware, further shortening the project timeline.
Digital, analog or both?
FPGAs are best suited to realise digital circuitry. While it’s possible to include analogue blocks onto the FPGA silicon to provide both digital and analogue compatibility, these blocks often don’t have the desired performance.
In this scenario, the ASIC provides a distinct advantage. A variety of analogue components including analogue to digital converters (ADCs), amplifiers, voltage regulators, filters and synthesizer s can be combined with digital devices in a mixed-signal ASIC solution. Advanced communication protocols such as Bluetooth Low Energy (BLE) can also be incorporated into the design.
Photo: Swindon Silicon Systems Ltd.
While FPGAs can perform a wider variety of tasks, an ASIC will always offer the superior performance
Cost & volume
The cost factor depends largely on the scale of production required. ASIC design and development stages mean that they typically have a higher non-recurring engineering cost (NRE) than FPGAs. However, ASICs will often have a lower cost per unit. This is due to the removal of unneeded functionalities, reducing overall silicon size and bill of materials. As a result, while the initial cost and time investment for ASIC design is higher, it typically offers a much better ROI on for larger or longer production volumes.
While a reprogrammable FPGA will be able to perform a wider variety of tasks, an ASIC will always offer the superior performance for the exact task it’s been designed for. This tailored approach means that the ASIC can offer significant technical advantages over FPGAs and other solutions on the market. For instance, wearable applications requiring a compact chip with an extended batter y life will likely benefit from the ultra-low power circuitry that can be best achieved with an ASIC.
Decline and obsolescence
FPGA supply, like many other off-theshelf solutions, is determined by the manufacturer. If supply drops below a minimum level, the manufacturer may halt production of new FPGA chips and issue a notification of obsolescence. Following this, it’s down to the customer to identify an alternative. This could be the purchase of leftover chips or sourcing a similar product from a different supplier. Either way, obsolescence is often a tricky area to navigate and a headache for purchasing and procurement professionals.
An ASIC is slightly different. Rather than the manufacturer deciding to halt production, the equivalent in ASIC terms would be the silicon process going obsolete. When designing a custom IC, the supplier will take care to ensure the silicon process chosen meets the expected lifetime of the product. But in the unlikely event obsolescence occurs earlier than expected, a reputable ASIC company will work with the customer to find an alternative solution.
It’s possible to port the design onto a newer silicon process instead. Wafers can also be purchased and stored for several decades in dry nitrogen cupboards. Depending on the needs of the customer,
these steps can be taken alongside the commencement of a new ASIC project. The benefit of this rounded approach is it means the customer will always have sufficient product to fulfil orders between the old and new ASIC.
At first, the differences between an ASIC and FPGA can seem quite straightforward. But when it comes to identifying how each one might benefit your specific application, it requires a much more thought-out
approach. Considering cost, time-to-market, obsolescence, and other key factors is essential to ensure you have a chip that meets all your product’s needs, both for the current and future iterations.
Swindon Silicon Systems Ltd. is a UK-based custom integrated circuit (IC) solutions firm with five decades of experience in the design, production test and supply of ASICs for industrial and automotive applications. https://www.swindonsilicon.com/
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Flexible battery applications range from smart labels to wearables
IDTechEx explores the limits of this emerging component sector
BY DANIEL PARR, TECHNOLOGY ANALYST AT IDTECHEX, CAMBRIDGE UK
Since the conception of flexible battery technologies, suppliers have searched for strong application markets for their products. In the last five years, niches have finally begun to materialize, though the specific use case depends on battery technology. Some of the earliest examples of commercialized flexible batteries were thin-film solid-state micro-power batteries that used the LiPON electrolyte developed by Oak Ridge National Laboratory in Tennessee.
In the last decade, other flexible battery options have been semi-commercialized, including zinc-carbon, zinc-silver, and primary lithium chemistries. Bulk solid-state and advanced lithium-ion technologies are now also on the brink of commercialization, and opportunities for their products are being searched for.
Two broad categories of flexible battery technology can be identified as lower and higher capacity. To the first belongs thin-film and micro-battery technologies: zinc-carbon, zinc-silver, primary lithium, and thin-film
solid-state. Of these, zinc-carbon, zinc-silver, and thin-film solid-state may be rechargeable or non-rechargeable, while primary lithium is always non-rechargeable. Printing is the most common manufacturing method for zinc chemistries, while
lithium chemistries use alternative manufacturing methods such as sputtering.They are defined either by their chemistr y (zinc-carbon, zinc-silver, primary lithium) or by their electrolyte (thin-film solid-state). All are expensive to scale up in terms of size and capacity, and their areal energy density is limited, making them best suited for micro-power applications.
The second category includes advanced lithium-ion and bulk solid-state technologies -the less mature flexible batter y technologies. Both are based on rechargeable lithium-ion technologies. Advanced lithium-ion, in this case, describes a battery structure that is similar in chemistry to traditional lithium-ion cells but with innovations that enhance flexibility, e.g., cell packaging or electrolyte. Both liquid electrolyte batteries and semi-solid polymer electrolyte batteries can be included in this category. Bulk solid-state describes a non-thin battery with a solid-state electrolyte, though it need not be 100% solid. Examples of solid-state electrolytes include ceramics and sulfides.
Advantages are self-evident
The advantages of flexible batteries are self-evident. A battery that can be rolled, stretched, and bent without losing functionality could prove a significant advantage in the right use case. However, flexible batteries are competing with significantly cheaper traditional technologies such as coin cells. For comparison, coin cells can be less than US$0.50/Wh, while the cheapest flexible battery options are around US$3/Wh. In fact, some technologies cost tens of dollars per Wh. In most use cases, the price of flexible batteries is too high to warrant their use. Instead, suppliers have needed to find niches where extreme flexibility is required and which are relatively price-insensitive, high-end, specific form-factor applications.
FIG 2 Smart labels and wearables requirements lead to the use of different flexible battery technologies.
FIG 1
Differentiation of the six major flexible battery technologies.
Smart labels have become the primary niche for the first category of low-capacity batteries. Thin batteries, usually printed, are integrated into labels, tags, and sensors that are used for quality control and logistics in industry settings. For example, RFID tags with temperature sensors or chemical sensors are used to monitor produce. The advantage of these tags is significant - produce that would otherwise be lost in transit due to poor temperature control can be saved, reducing waste. Other types of smart labels are used to communicate the position and condition of shipments.
Not all smart labels use flexible batteries, however increasingly flexible battery companies have targeted this application. Thinness is the major driver of flexible battery uptake in this instance. Thin labels require thin batteries, which happen to be flexible. While flexibility is an advantage when the label is applied to a curved or irregular surface, in most cases, it is not a requirement. Zinergy and CCL Design (after the acquisition of Imprint Energy) are two flexible battery players who have increasingly targeted this niche. The flexible battery market for smart labels and RFID tags is valued at US$14.3
million in 2025 and is expected to grow with a CAGR of 23.9% over the next decade.
Meanwhile, companies supplying the second category of higher-capacity batteries are increasingly focusing on wearables applications. Wearables include a diverse range of products, from hearables and smartwatches to XR headwear and e-textiles. Unlike consumer electronics, products worn on the body frequently require tailored form factors as they must be comfortable when worn.
Aligning with wearables
As a result, wearables companies have shown interest in curved and flexible battery options in the past as a means of removing unnecessary bulk. However, the flexible batteries of the past were unable to meet wearable product requirements for energy density and lifetime. Only recently has flexible battery supply begun to align with the demand for wearables.
Advanced lithium-ion and bulk solid-state flexible batteries have begun to move from the development stage into semi-commercialization, finally providing energy storage solutions that can meet energy density and lifetime requirements while still retaining a
flexible form factor. Suppliers of both technologies have targeted wearables opportunities, especially wrist-worn wearables and electronic headwear.
Low-end, mass-produced hearables and wrist-worn wearables make up the largest proportion of the overall wearables market but present no opportunity for flexible batteries, and the high cost of flexible battery options cannot be justified for low-cost, mass-produced products. However, the wearables market still presents significant opportunities at the high end.
LiBEST, for example, is a Korean company that, since 2024, has focused on advanced lithium-ion batter ies for XR headsets and high-end hearables, where products are price-insensitive and bulkiness is not favored. The total wearables market for flexible batteries (which includes skin patches) is valued at US$43.3 million in 2025 and is expected to grow with a CAGR of 21.6% over the next decade.
The overall flexible battery market remains small, at just US$71.7 million in 2025, compared to a global lithium-ion battery market of over US$50 billion.
www.IDTechEx.com/Flex
Practical considerations for cross-domain measurements in ‘RF to Bits’ systems
Testing of ‘direct RF’ sampling transceivers in wide-band RADAR and AESA devices
BY NORM KIRCHNER & DAN BAKER, NI / EMERSON T&M
For decades, the design of RF systems has been split into well-defined subsystems: RF subsystem interfaces were analog RF on one side (for the cable or antenna connection) and either RF, IF or IQ analog on the other side.
Stimulus-response devices like a VNA or VST (combination of VSA & VSG) were specifically designed and well suited to fully validate and produce those designs. Similarly, digital designers have used VHDL or Verilog for their FPGA or ASIC designs, and mixed-signal oscilloscopes to verify timing and signal integrity.
While traditional converter technology (DAC/ADC) crossed the boundary between analog and digital, sample rates and digital bandwidths were not significant enough to push the boundaries of traditional techniques.
Digital interfacing
Many digital interfacing standards have been created over the last several decades; helping to enable the increasing bandwidth demands of modern RF systems. While the pace of new interfaces is emerging quickly for commercial wireless, aerospace and defense applications often need relatively longer consistency in interfaces.
In the early 2000’s, a typical ADC interface would be a wide parallel bus, likely employing DDR (double data rate) LVDS with source synchronous timing (e.g. the clock traveled along with the data). This made it possible to close timing on the interface, but difficult to achieve a deterministic system delay.
By the early 2010’s, ADC interfaces had moved over to JESD204B, a high-speed serial bus. This made interface timing easier for these multi GS/s converters, but introduced even more indeterminism in the system delay. JESD204B subclass 1 added a provision for deterministic system latency at the expense of complicated clocking.
These (and many other) interfaces were used within the baseband subsystem, but often not exposed at a system interface boundary.
Standards such as FMC and FMC+ were introduced to attempt to unify the digital interface between FPGA/ASIC and the ADC/DACs, but these were often limited to R&D applications and each vendor had their own flavor.
As modularized sub-systems embrace a “Direct RF to Bits” approach, the digital interfaces used will likely come in many varieties (lane rates, bit widths, voltage levels, connector types, etc) in addition to the protocol being used (JESD204B/C, 100GbE, propr ietary, etc).
Worlds Colliding
Those highly orthogonal domains, and the boundary between them, are rapidly disappearing with the introduction of direct sampling RF-to-bits devices in the marketplace. RFSoC and chiplet based designs, capable of sampling above 60GSa/s, are seeing the convergence of RF and digital into a single atomic RF component.
To complicate matters further, these devices are not simply high-rate, single channel, single direction devices like an ADC, but rather multi-channel fully duplex transceivers, like the Eelctra line from Jariet with 4 TX and 4 RX up to 64 GSa/s, or the Apollo MxFE chipset from ADI with 8 TX and 8 RX channels and rates up to 28 GSa/s, enabling RF transmit and receive up through
K band and above without any traditional mixers or local oscillators.
State of the art RADAR, EW, and military communications systems are paving the way to leverage these cross-domain RF platforms in beamforming active electronic scanned array (AESA) systems, typically comprised of over one-thousand antenna elements and hundreds of transmit receive modules (TRM). This convergence of cross-domain RF to digital devices is being driven by a desire to reduce SWaP-C (size, weight, power, cost) and enable high channel count systems with capabilities far beyond what the RF designers of yesteryear could have imagined.
Along with the advantages noted above, the total reduction in discrete testable components will significantly reduce the diversity and number of unique test systems required to bring a design to life.
However, as with all new technology, new challenges arise. This cross-domain convergence fundamentally challenges the tool flow traditionally employed by subsystem developers.
For example: how do you measure the S-Parameters of a transceiver when one side is digital and the other RF? How do you validate your digital implementation? How do you adapt and scale your instrumentation and measurement techniques?
Photo: NI Emerson
Functional but painful
In this new world of RF-To-Bits based systems, where RF engineers are questioning how to test, digital design teams are being asked to create some type of mock digital instrumentation to enable the RF validation of their components and systems.
While creating a digital system that can connect to the digital interface of their system-under-test (SUT) is well within a digital eng ineers capabilities, developing a system of hardware, software, and measurement science capable of supporting the testing and production needs of an organization would be the functional equivalent of asking analog designers to create their own oscilloscopes. It’s possible, but painful.
Counter to the points made above, this can be a very attractive approach for organizations, because the first implementations of dig ital connectivity are already achieved by those same digital engineers. A time investment has already been made and teams are looking to simply move onto the next stage of development. The platforms commonly used are FPGA development boards and converter evaluation boards from vendors like AMD or ADI.
While a functional implementation, these development platforms are not designed to meet the multitude and variety of demands of a practical test or production system. Common challenges include:
• Test departments not equipped with High-Speed-Serial (HSS) interfaces.
• Home-g rown digital solutions costly and difficult to produce at scale, maintain and deploy over a program’s lifecycle.
• Evaluation boards not designed or manufactured to be long term scalable solutions.
• Memor y and data transfer size and rates limit test time performance.
• Not suited for the scalability of production or SUT connectivity demands.
Scalable, modular, reusable & extensible
One of the keys to success in any program leveraging a direct sampling RF system is the selection of instrumentation that can scale with the needs of a program and an organization. As the number of analog ports for single components grow exponentially, and the bandwidth of the digital streams increases to hundreds of gigabits per second, PXI based modular RF instruments and instrument-grade open-FPGA digital processors are an exceedingly natural fit. These devices are purpose-built to co-exist within a mixed domain test system and enable the scalability of quality RF measurements.
The PXI platfor m allows for RF instruments, like a PXIe-5842 VST from NI, to be used along with NI’s Digital Signal Transceiver (DST) to allow synchronization and control of both RF and digital instruments in the same system. This allows engineers to perform measurements like Power Added Efficiency, S-Parameters and Pulse measurements on Direct RF using a single setup and connection.
Devices like the PXIe-7903 FlexRIO FPGA, based on the Xilinx Virtex UltraScale+ FPGA, VU11P, can service line rates up to 28.2Gbps on 48 TRX lines across 12 discrete connectors. When combined with modular RF instruments like the PXIe5842 VST + 5633 VNA, capable of 4GHz of instantaneous bandwidth and tunable to 26.5GHz, engineers can achieve the full instrumentation experience, even for “RF to Bits” systems under test.
Synonymous to using analog instruments, engineers testing these digital systems would greatly benefit from a feature rich experience
when interfacing to the digital ports of their SUT. Features like automatic triggering and synchronization to align with the analog, responsive interactive GUIs for rapid development and debug and an API purpose built for high-speed automation. Each of these capabilities and more will enable and accelerate an engineer’s workflow, whether it be in design or production.
Conclusion
In summary, adapting to the evolving requirements of ‘Direct RF’ systems, with a forward-looking plan that recognizes the requirement to provide an open, flexible and feature rich solution, will lead to faster development, cost savings, greater insights, and improved quality.
Emerson’s Test and Measurement business, formerly NI, a leading provider of software-connected automated test and measurement systems. https://www.ni.com/en.html
3D printing vs. pcb printing — What’s the difference?
BY SHUXUAN JIANG, VOLTERA
In the world of additive fabrication, two technologies stand out for their transfor mative potential: 3D printing and printed circuit board (pcb) printing. They share the fundamental principle of additive manufacturing, but are different in a number of ways.
In this article, we will delve into the main differences between traditional 3D printing and additive pcb printing in order to clarify their distinct roles in modern manufacturing.
3D Printing
How does 3D printing and pcb printing work?
With 3D pr inting, printers create objects by layering material, typically thermoplastic, from the bottom up. You begin with designing a model using computer-aided design (CAD) software. Next, you export the .stl file to your 3D printer software which will slice the model into thin horizontal layers, generating G-code for each layer. Depending on the type, your 3D printer will then extrude or solidify material layer by layer to form the final object.
PCB printing
Additive pcb printing shares similarities with 3D printing in terms of its workflow. Using electrical computer-aided design (ECAD) software, you design your project, then export the Gerber file and upload it to your printer’s software. Pcb fabricators,
such as V-One, will then interpret the Gerbers and deposit conductive materials to construct the layers of a printed circuit board.
Key differences between 3D printing and pcb printing
Materials and substrates
The most apparent difference lies in the materials used. Traditional 3D printers work with a wide array of materials, including plastics such as PLA, PETG, TPU, ABS, and resin, as well as nylons and metals. In contrast, pcb printers utilize conductive inks, such as silver, copper, or graphite, and more to create functional circuit boards.
While you can print a three-dimensional object directly on the heated bed of a 3D printer, pcb printing requires fixing a substrate to the bed. Depending on your specific needs, you can choose more rigid substrates such as FR1, FR4, or more flexible ones such as TPU, paper or fabric.
Precision
3D printers are generally used for larger objects and may not achieve the fine detail required for pcb manufacturing. The accuracy of desktop 3D pr inters varies, ranging from ± 0.1 mm to ± 0.5mm.
In contrast, pcb printers are designed for high precision, which is cr ucial for the intricate pathways and components of circuit boards.
Notably, machines that use direct-ink-writing technology, enable the production of features as small as 100 µm.
Capabilities and applications
3D printers are handy when it comes to producing complex geometries and shapes. Some industries use 3D printing to manufacture the final product, such as architectural models, automotive parts, and dentures. However, these 3D printed projects, on their own, cannot perform functions such as sensing, monitoring, moving, amplifying, controlling, or mirroring, which require a printed circuit board and a range of electronic components. In order to test and iterate electronics projects, you will need a pcb printer. The applications of pcb printers range from simple personal projects such as a weather station that monitors temperature, humidity, and atmospher ic pressure, to complex R&D endeavors such as a prototype for robotic arms capable of performing surgeries.
Costs
Due to the differences in all the aforementioned aspects, these technologies are available at varying costs. Desktop 3D printers can be priced anywhere from USD $200 to $2,500, whereas desktop pcb printers tend to range from USD $5,200 to $27,800.
Conclusion
3D printing allows for the creation of a broad spectrum of objects, whereas pcb printing offers a specialized, rapid, and cost-effective solution for circuit board production. Despite their differences, 3D printing and pcb printing can be highly complementary. Leveraging these technologies together will streamline the electronics prototyping process. As the technology continues to evolve, there is tremendous potential for further integration and innovation in both fields.
https://www.voltera.io/
RFID tag printed on paper using nano copper ink.
Pcb printers utilize conductive inks, such as silver, copper or graphite to create functional circuit boards.
AirBorn gets flexible in MilAero, medical, industrial design spaces
Toronto-based flexible circuit manufacturer delivers personalized support
BY STEPHEN LAW, EDITOR – EP&T
Electronic designers looking for a supplier that demonstrates flexibility, might get more than expected when dealing with AirBorn Flexible Circuits Inc. (AFC), a Toronto-based developer of rugged connectors, custom assemblies and eng ineering services for defense, space, aerospace, medical and industrial applications.
Operating as Strataflex since the mid1950s, the Toronto electronic assembler was purchased in 2008 by AirBorn Inc. –headquartered in Georgetown, Texas. Since then, the firm has been producing integrated component and flex circuit design solutions to a large base of North-American and European customers. From initial CAD models to full-scale production, AirBorn guides the customer’s application through the design, prototyping, testing and qualification process – before ramping into full scale production.
“We have expanded from the early days of just being a component supplier. We’ve taken that business model and grown it to include cable assemblies, flexible circuits and flex assemblies, all the way to complete box build integration,” says Billy Rhea, product director of embedded systems with AirBorn, based out of the firm’s HQ.
AFC develops many of its client’s designs using a wide range of connectors, terminations, components, and devices, providing
automatic and Mil-certified precision hand soldering. Some of the relevant military standards (MIL-STD) they typically adhere to include: MIL-PRF-31032; MIL-P-50884; MIL-STD-883; MIL-STD-202; MILSTD-810; IPC-6013 and AS9100.
Approved vendors
“If a customer has an existing design, we can just build to their specification. If they need
help designing, we can do that as well. We also conduct services that include manufacturability, repairability, reliability, and testability. We also help the customer create a bill of mater ial (BOM) if they need it – especially If they don’t have approved vendors,” states Peter Pialis, director of engineering at the Toronto facility. “The customer literally just takes out the flex assembly, plugs it in, and they’re good to go.”
EXPERT INTERCONNECT MANUFACTURER SINCE 1980
Gain a competitive advantage with Data Cable
We build connectivity solutions for a diverse group of industries including: Defence • Medical • Robotics • UAVs • Forestry • Mining • Nuclear & Power Agriculture • Transportation • Industrial Equipment • Satellite & Communications
WHAT CAN WE BUILD FOR YOU?
31 Robb Boulevard Orangeville, ON, L9W 3L1 Canada
TOLL FREE: 1-877-395-5133
EMAIL: information@datacable.ca
WEBSITE: www.datacable.ca
Photo: Airborn Flexible Circuits Inc.
Primarily focused on applications relating to defense, space, aerospace, medical and industrial industries, AirBorn produces highly reliable, flexible, printed circuit and assembly solutions including single-sided, double-sided, multi-layer, rigid-flex and sculptured flex. The benefits of flex, is it provides certain designs with a customizable solution for wire harnesses, including repeatability, consistency, and cost-effectiveness for high-volume orders.
“Most people don’t understand what flex can do in their design, which is quite surprising. We recently hosted a lunch and learn for 20 design eng ineers and they were not aware of the benefits flexible circuits can bring to their design.” says Pialis.
AirBorn also provides a full range of integrated services comprising design, DFm, DFt, prototypes, production manufacturing, hand and automated assembly, as well as testing. This also includes fully populated flexible circuit assembly (adding PCB components to the flex circuit). AirBorn will often add a flexible circuit into the customer’s finished product, sometimes as much as up to 100-feet long.
60% reduction in mass
“Integration of high-speed AirBorn connector product into our flex options has allowed customer s to replace these big, heavy cable assemblies,” adds Rhea. “They’re using high-end twinax, coax type of cables that can be replicated in flexible circuits. We’re implementing that into a flex and sculpting it – putting in whatever format they need. As a result, we’ve seen as much as 60% reduction in mass, which translates to a huge saving for them over space and weight. We’re getting great performance out of that flex, especially the military and space customers, and they are raving over it.”
AirBorn employs a team of product engineers, who conduct product realization
– from specifications to an actual manufactured product. The product development also leverages process engineers, led by electrical engineers, chemical engineers, and mechanical engineers.
“We’ve got multiple design engineers on staff to help with customer’s design applications. Some clients already have their Gerber files ready when they come through our door, others just want to know, ‘can we build it’,” notes Rhea.
Raw materials
AirBorn uses a variety of raw materials to produce flexible circuits, tailored to meet the specific needs of their customers. Some of the primary raw materials include:
• Polyimide Films: Kapton and Apolong;
• Copper Foils: Electro-deposited (ED) Copper and Rolled-Annealed (RA) Copper;
• Adhesives: Acrylic, Epoxy and Pressure-Sensitive Adhesives (PSAs);
• Coverlays: Polyimide Coverlays, and Flexible Solder Masks;
• Conductive Inks and Pastes: Dielectric, as well as Silver and Carbon Inks;
• Reinforcement Mater ials: Stiffeners and Bondplys;
• Protective Coatings: Conformal Coatings and encapsulants;
• Specialty Films and Laminates: PTFE (Teflon) Films, and Liquid Crystal Polymer (LCP) Films.
S upported by on-going investment in new equipment, AirBorn’s 37,000-sq. ft. production space boasts state-of-the-art automated optical inspection (AOI) systems; Laser cutting and drilling machines; Roll-to-roll processing equipment; Soldering and reflow ovens; Vacuum lamination presses; X-ray inspection systems; Etching and plating equipment; and clean room facilities.
While 90% of the Toronto facility serves U.S.-based clients, AirBorn’s goal remains focused on increasing market share of home-grown design customers.
“Our biggest selling point is our design service capabilities, and our customer service,” Rhea concludes. “We are equipped to expand our business with the Canadian military market, based on our current success in the US as a second- or third-tier type supplier for players like Lockheed, Raytheon, BAE and Boeing.”
Electronic Manufacturing Services Guide 2024
Playing an integral role in the eco system of the electronics industry in Canada, Contract Electronics Manufacturers (CEMs) or Electronic Manufacturing Services (EMS) providers represent one of the most important players in any design cycle.
CEMs are crucial in the ecosystem for electronic engineers and designers across Canada. They provide essential services such as prototyping, production, and testing, allowing engineers and designers to focus on innovation and development. CEMs offer advanced manufacturing capabilities, cost efficiency, and scalability, which are vital for bringing new electronic products to market quickly and reliably. By partnering with CEMs, Canadian electronic engineers and designers can
WESTERN CANADA
BRITISH COLUMBIA
Active Electronic Manufacturing
PCB assembly line includes high-speed pick and place machines.
Sales and technical support centre for North American clients of BRIO Technology, an EMS provider in Northern China.
Head office:
181 Whitehall Drive
Markham, ON L3R 9T1 Canada
Ph: 1-866-502-3378
email: sales@artaflex.com
website: https://artaflex.com
leverage specialized expertise and state-of-the-art facilities, fostering growth and competitiveness in the electronics industry.
Flexible and adaptable to a wide variance of needs and services from its customer base, CEMsconstantly demonstrate the ability to meet the requirements of a vast array of industry sectors. Whether high or low complexity, volume production or prototyping, Original Equipment Manufacturers (OEMs) turn to their contract manufacturing partners for their expertise in everything from engineering services, supply chain management, printed circuit board assembly, testing and final integration capabilities.
This guide is designed to serve our OEM readership base as a helpful source to locating a contract manufacturing partner in Canada.
BC-based designs and assemblies high performing PCBs. 8170 Winston St, Burnaby, BC V5A 2H5
Tel: 604-765-0880
https://denatechnologies.com
Dorigo Systems Ltd.
Full turnkey CEM.
5085 North Fraser Way, Burnaby, BC V5J 0J2
Tel: (604) 294-4600
Fax: 604-294-4609
Sales@dorigo.com https://www.dorigo.com
Artaflex Inc.
Artaflex Inc. is a multinational, integrated, electronics manufacturing services (EMS) company serving high-mix, high reliability Original Equipment Manufacturers (OEMs). With multiple facilities in the United States and Canada, Artaflex and its numerous brands of companies, offers expert electronic manufacturing services, complex system integration, custom cable and harness interconnect, advanced test, and clean room capabilities to its customers: enabling the delivery of highquality products and services in a timeframe that meets todays ever shortening delivery cycles. Artaflex is a market leader in customer service and operational excellence. Artaflex’s customer-focused teams provides customers a virtual extension of their own operations department through expertise in supply chain management, manufacturing, and engineering. Artaflex is focused on total cost of ownership through the evolution of its value proposition.
Artaflex Kanata
360 Terry Fox Drive
Kanata, ON K2K 2P5 Canada
Ph: 1-888-773-7832
email: sales@artaflex.com
website: https://artaflex.com
GS Networks
360 Terry Fox Drive
Kanata, ON K2K 2P5 Canada
Ph: 1-877-225-2555
email: gsninfo@gsnetworks.ca
website: https://gsnetworks.ca
Artaflex Buffalo
330 Fillmore Ave.
Tonawanda, NY, 14150 U.S.A.
Ph: 1-866-502-3378
email: sales@artaflex.com
website: https://artaflex.com
EMS2020 Technologies Ltd.
Electronic manufacturing company
570 Ebury Pl, Delta, BC
Tel: (604) 525-3133
sales@ems2020tech.com http://ems2020tech.com
Enigma Interconnect Corp.
Manufacturer of quality bare pcbs. 8070 Winston St, Burnaby, BC V5A 2H5
Tel: 604-420-3313
https://www.enigmacorp.com
Euro Solutions
Makes flexible, customized electronics manufacturing solutions.
Unit E104 - 19720 94a Ave, Langley City, BC V1M 3B7
LEACH has provided PCB assembly since 1999. We provide DFM improvements, sourcing and supply-chain management, high-mix engineering and flexible production. We specialize in PCB assembly, IC programming, function testing, box build, global logistics and delivery. Primarily focused within the communications, industrial, medical, RF/GPS, automotive and lighting markets.
Canada Office: 107- 7188 Progress Way, Delta, BC VG4 1M6
China Factory: Floor 2 & 4, Block 2 Wandl Industrial Park, Guanlan, Shenzhen Guangdong Province, China 518110
Kingstec Technologies Inc
One-stop engineering, manufacturing and logistics business partner.
2335 Argentia Road, Mississauga, Ontario L5N 8K4
Tel: 905- 712-2171
http://www.kingstec.com
Mektronix
Specializes in setting up SMT lines, including equipment specification, line/plant layout, training and process development.
186 Manitoba Street, Stouffville, Ont L4A 4Y3
Tel: (705) 795-4467
https://www.mektronix.com
Microart Services Inc.
Electronic manufacturing and design services company providing pcb layout, bare board, pcb assembly testing and box build for proto-type and low-to-mid volume productions.
190 Duffield Dr, Markham, ON L6G 1B5
Tel: 905-752-0800
Toll Free: 1-833-722-3278
Email: inquiries@microartservices.com
https://microartservices.com
M.I.S. Electronics Inc.
End-to-end EMS player and pcb board specialists.
174 West Beaver Creek Rd., Richmond Hill, ON L4B 1B4
Tel: 905-707-2305
https://miselectronics.com
NeuronicWorks
Design engineering & manufacturing company specializing in the development of custom electronics and software products.
210 Lesmill Rd, North York, ON M3B 2T5
Tel: (416) 546-1575
info@neuronicworks.com
https://neuronicworks.com
OCM Manufacturing Inc.
Electronics manufacturing services (EMS) for low-to mid-volume products, plus turnkey product development for industrial controls.
Fundamental link between applied research and the rapid commercialization of microelectronic products.
45 Boulevard de l’Aéroport, Bromont, QC J2L 1S8
Tel: (450) 534-8000
https://www.c2mi.ca/en
Cancino Technologies
Comprehensive electronics manufacturing services including in-house pcb assembly, electronics design, and pcb layout services, supporting the entire lifecycle of electronic products from prototype to volume production.
535 Av. Lépine, Dorval, QC H9P 2S9
Tel: 514-631-7667
https://www.cancinotec.com
Dynamic Source Manufacturing (DSM) supports global businesses by bringing their products to market efficiently and with peace of mind, collaborating with them on the entire production cycle. With electronics manufacturing facilities in Canada and the USA, our success is built on trust, integrity, and focusing on our partners to make connections that last.
We serve diverse industries like automotive, communications, energy, and security & defense. Along with our ISO 9001:2015 certification, we are certified through Canada’s Controlled Goods Program and the USA’s International Traffic in Arms Regulations.
We proudly hold ourselves to a high standard to provide you with an exceptional customer experience. Connect with us today.
Manufacturer of high reliability electronics solutions for harsh environments – including automotive, aerospace, industrial & medical electronics assembly solutions.
3000 Industrial Boulevard, Sherbrooke, QC J1L 1V8
Tel: 819-821-4524
https://cmac.com
Circuits Imprimés De La Capitale
Comprehensive range of services, including quick prototype production, CAD design, pcb assembly, conformal coating, technical validation and pcb system integration.
925 Avenue Newton #104, QC, G1P 4M2
Tel: 418-877-9047
https://www.pcbcic.com/en
Digico
Specialists in complex electronic material, including printed circuits, cables and harness, conformal coating, performing client test and electromechanical integration.
950 rue Bergar, Laval, QC, H7L 5A1
Tel: 450-967-7100
http://www.digico.cc/en
Diverse Electronics
Authorized electronic components and electromechanical parts distributor.
Electronic manufacturing service provider, SMT and through hole, PCB and box level, consignment and turnkey.
9995H rue de Châteauneuf, Brossard, QC, J4Z 3V7
Tel: 450-465-1818
Email: info@optimont.com https://www.optimont.com
Orbit Technologies Inc.
Specializes in pcb design, manufacturing and assembly services.
2020 Trans-Canada Hwy, Suite 107, Dorval, QC H9P 2N4
Tel: 514-856-0451
Toll-Free: 1-855-344-0451
sales@orbittech.com https://www.orbittech.com
Prodexport Technologie Inc.
Specializes in the manufacturing of electronic products.
4780 Rue Saint-Félix, Entrée #1, Local 205, Saint-Augustin-deDesmaures, QC G3A 2J9
Tel: 418-266-7977 http://prodexport.ca
RS Electronics
Pcb assembly services ranging from low to mid-volume production.Sservices include turnkey solutions, component procurement and pcb fabrication.
5580 Rue Vanden Abeele, Saint-Laurent, QC H4S 1P9
Tel: 438-833-8477 https://rspcbassembly.com
Starbord Technologies Inc.
Provider of smart assembly solutions and consultant, offering a comprehensive range of industryleading solutions for assembly, test, inspection and automation.
Montreal QC Tel: 514-234-2568 1-855-234-4768 info@StarbordTech.com https://starbordtech.com
Varitron
End-to-end services in electronic design and manufacturing services. 4811 Ch de la Savane, Saint-Hubert, QC J3Y 9G1 Tel: 450-926-1778 #245 plavoie@varitron.com https://varitron.com
ATLANTIC PROVINCES
NOVA SCOTIA
Allendale Electronics Ltd. 41 S Water St, Lockeport, Nova Scotia B0T 1L0 Tel: 902-656-2652 https://www.allendale-electronics.com/
Sunsel Systems Manufacturing Corp.
433 Cutler Ave, Dartmouth, Nova Scotia B3B 0J5 902-444-7867 ext. 433 North America: +1-855-718-4787 sunsel@sunsel.ca https://www.sunsel.ca
NEW BRUNSWICK
CE3 Electronics Inc.
Specializes in advanced pcb assembly and complex cable and wire harness manufacturing. 1055 Aviation Ave., Dieppe, New Brunswick E1A 9S5 Tel: 506-858-7817 info@ce3electronics.com www.ce3electronics.com
POWER FACTOR CORRECTION CHOKES
BOOST CURRENTS
ITG ELECTRONICS
PFC383637B Series power factor correction chokes (PFCs) are designed for comparatively high-wattage applications. Devices can handle up to 3,300 Watts and include CCM PFC boost converters with switching frequencies from 60-200Khz. Solutions are suitable for Inductance ranges from 180360uH, and have footprints up to 37.5 x 36.5mm and maximum heights of 36mm. Products feature a flat wire and square core construction to save space and increase power density. Devices are up to 50% smaller.
www.ITG-Electronics.com/ category/3
SMALL-SIGNAL MOSFETS ARE AECQ101-QUALIFIED TAIWAN SEMICONDUCTOR
TQM Family of AEC-Q101-qualified, small-signal MOSFETs includes 10 new parts that meet the AEC-Q101 global automotive standard for reliability. Devices are available in N-MOS or P-MOS and in single- or dual-channel configurations. All come in industry-standard packages and provide leading >2KV ESD withstanding capability.
http://www.tscus.com
400 - 750W RUGGEDIZED BUCK DC-DC CONVERTERS
CONDUCTION COOL
TDK LAMBDA
RGB series of 400 to 750W rated, ruggedized, non-isolated dc-dc converters operate from input voltages of 9 to 18V, 18 to 32V or 18 to 60V. The buck step-down converters deliver output voltages adjustable from 0.8 to 8V or 3.3 to 24V with output currents of up to 60A (depending on the power level). Efficiencies of up to 98.5% allow the product to deliver high usable power in demanding thermal environments with case temperatures of -40C to +115oC, while providing a longer battery life.
https://www.emea.lambda.tdk. com/uk/products/rgb
EPOXY MEETS NASA LOW OUTGASSING SPECS MASTER BOND
Supreme 11AOHTLP two-component epoxy provides thermal conductivity and electrical insulation. The system is specifically designed for bonding
larger parts since it has a working life of 60-90 minutes (at room temperature for a 100-gram batch), making it suitable for demanding situations where more time for fixturing is needed. Product has reliable electrical insulation properties with a volume resistivity exceeding 1014 ohm-cm at 75°F.
POWER SUPPLIES WITH ETHERCAT INTERFACE DELIVER REAL-TIME DATA PULS
240W and 480W DIN rail power supplies equipped with integrated EtherCAT interface enable efficient and time-saving configuration, operation monitoring and remote control. Devices provide a wide range power supply and application data, such as voltage and current characteristics on the input and output side. Products are connected directly to an EtherCAT controller without requiring additional gateways, which allows easy and fast access to all measured values and power supply functions. https://products.pulspower.com/ en/power-supplies-with-ethercat
MOBILE SPEAKERS ARE IP67/68 RATED RALTRON
RSP-900 line of mobile speakers with IP67/68 ratings for use in IoT, wearable, headset/hearing, smart home, consumer and medical devices. Speakers can withstand immersion in water up to 50+ meters. Available in solder pad or spring termination with sizes ranging from as small as 12x5.5x3mm to 38x13x3.7mm. Devices feature sound pressure levels (SPL) from 87.5db to 103db. https://www.raltron.com/speakers
MODULAR CONNECTOR SYSTEM PERMITS CUSTOMIZATION
LEMO
Redel MP series (‘M’ for modular and ‘P’ for plastic) Push-Pull connector series provides a modular system allows engineers to easily configure, design with flexibility. Product series features a broad range of standard modules for power, signal, data, fibre optic and fluidic connectivity that can be combined into one single hybrid connector. Product series also includes high contact density modules, which allows up to 144 contacts in a compact connector by using the Card Edge concept. These pcb modules can be further customized with the integration of intelligence, such as an EPROM. https://www.lemo.com/en/ solutions/highlights/redel-mp-series
CONTROLLERS UPGRADE FEATURES, CAPABILITIES
WAGO
PFC100 family of four second generation (G2) controllers include increased memory, and are programmed with CODESYS 3.5 and can be easily configured using the controller’s Web Based Management System. With TLS encryption, VPN capabilities and a built-in Firewall these controllers are equipped with optimum security standards. Products support multiple fieldbus protocols enabling gateways between many of these interfaces. www.wago.us
ELASTOMER SOCKET VERIFIES PERFORMANCE OF AI CHIP IRONWOOD
To verify the performance of high power artificial intelligence chip, 80+ GHz bandwidth elastomer socket can be used with heatsink/axial flow fan to remove 250+ watts of heat generation. Elastomer socket is transparent such that the performance is equivalent to direct solder version. Self inductance of elastomer is 0.1nH and the socket can be operated from -55C to +160C. https://www.ironwoodelectronics.com/press/elastomer-socketfor-ai-chip
COMPACT TACT SWITCH DELIVERS SURFACE MOUNT DESIGN E-SWITCH
TL1030 Series tactile switch features a surface mount design and a compact size of 3.5 x 2.9mm. There are four different operating force options to
choose from: 160, 200, 350 (200,000 life cycles) and 500gf (100,000 life cycles). Device also comes with (or without) a ground terminal and has an electrical rating of 50mA at 12Vdc. Product’s precision and versatility makes it suitable for portable devices and advanced technology applications. Available in tape and reel packaging. https://www.e-switch.com/ wp-content/uploads/2024/07/ TL1030.pdf
FAULT LOCATOR TROUBLESHOOTS
ELECTRONIC ASSEMBLIES
POLAR INSTRUMENTS
GRS200 fault locator uses the proven passive analog signature analysis and compares a faultless electronic assembly with the board under test. This method detects typical faults in electronics production, service and repairs quickly and without extensive circuit knowledge. Product detects missing or reversed components, incorrect component values or component types, counterfeit components, as well as short circuits or opens can be recognized very easily. System consists of analog signature hardware and powerful software with LIVE signature analysis, program mode and CAD data display. https://www.polarinstruments. eu/en/
PCB TERMINAL BLOCKS DELIVER PUSH-IN SPRING TECHNOLOGY
DEGSON newly developed pcb terminal blocks with ‘push-in’ spring technology respond to market demands. The outlet direction and operating direction are on the same side, which can integrate pcb terminal blocks into the front of the device to save device space. At the same time, the front of the product integrates test holes, allowing customers to easily and safely perform electrical test.
FLOATING BOARD-TOBOARD CONNECTOR IS TINY HIROSE ELECTRIC
BM54 Series board-to-board connector combines floating functionality and miniature size to meet automotive specifications. Product series features compact design, while boasting a tiny width class for its category. The space-saving device features a small form
factor, a 0.4mm pitch, and a stacking height of 3.0 to 4.5mm. Suitable for pcbs with multiple connector sets, connector delivers a wide floating range of ±0.4 mm in XY direction. By absorbing board misalignment errors, floating simplifies assembly and improves assembly work efficiency.
https://www.hirose.com/en/ product/pr/BM54
400VDC INLET CONNECTORS OPERATE TO
IEC TS 62735 SCHURTER
400Vdc family now includes GC21 and GH21/GI21 400Vdc appliance Inlet connectors that operate in accordance with IEC TS 62735, on the device side – and are IECcompliant. Dc connector systems are standardized according to IEC TS 62735-1 for efficient power distribution in data centres, for power distribution strips and UPS applications back in 2019. GI21 model is designed for pure dc operation, while the GH21 is a hybrid version and can therefore accept both ac and dc current. Both units are hot plug-capable for disconnection under load up to 2 .6 kW and up to 105°C operating temperature. Use of bio-based plastics on the appliance side.
https://www.schurter.com/en/ datasheet/GC21
ROBOTICS
NVIDIA ACCELERATES HUMANOID ROBOTICS DEVELOPMENT
In an effort to accelerate humanoid development on a global scale, NVIDIA is providing leading robot manufacturers, AI model developers and software makers with a suite of services, models and computing platforms to develop, train and build the next generation of humanoid robotics.
Among the offerings are new NVIDIA NIM microservices and frameworks for robot simulation and learning, the NVIDIA OSMO orchestration service for running multi-stage robotics workloads, and an AI- and simulation-enabled teleoperation workflow that allows developers to train robots using small amounts of human demonstration data.
“The next wave of AI is robotics and one of the most exciting developments is humanoid robots,” said Jensen Huang, founder and CEO of NVIDIA, a global leader in accelerated computing. “We’re advancing the entire NVIDIA robotics stack, opening access for worldwide humanoid developers and companies to use the platforms, acceleration libraries and AI models best suited for their needs.”
SOFTWARE
ULTRA LIBRARIAN, FOOTPRINTKU AI PARTNER ON EDA
Ultra Librarian, an Accelerated Designs brand and the world’s largest online CAD library with
over 16 million parts and counting, is pleased to announce a strategic partnership with Footprintku AI, the leader in DFMaware CAD library development. This partnership aims to solve one of the largest manufacturing issues plaguing hardware design teams today, CAD library DFM.
“The CAD library is the core building block of any PCB design flow.These libraries need to accurately represent all aspects of the par ts being designed, ensuring the manufacturing systems being used to ultimately build the boards can r un without issue,” said Manny Marcano, president, Accelerated Designs LLC.
“Working with Footprintku AI will enable us to further enhance the DFM capabilities of our library across all the CAD tools we support, giving design teams the security that they can go to manufacturing with confidence.”
The two companies will work to bring Footprintku AI’s pioneering technologies in Design-for-Manufacturing (DFM) processes into the Ultra Librarian CAD library. As part of the Ultra Librarian Virtual Librarian Service (VLS), this collaboration will provide a new on-demand DFMaware library for companies looking to enhance and validate their libraries for DFM.
EDUCATION
NEWARK EXPANDS EDUCATIONAL OFFERINGS
Digilent and NI engineering teaching solutions are now available from Newark to empower educator s and researchers with a suite of hardware and software tools to support learning experiences in both traditional and remote lear ning environments.
Digilent excels in providing affordable and portable devices for learning circuits and digital logic remotely, making them a perfect fit for the recent rise of remote and hybrid learning environments. Their products are lightweight, USB-connected, and cater to the needs of both students and educators.
Digilent’s popular products, like the Analog Discovery 3 and the Analog Discovery Studio, allow students to use a Windows/ Mac/Linux machine to become one of many real-world test devices like an oscilloscope, logic analyser, pattern generator, and more. Powered by Digilent’s own WaveForms software, these tools – small enough to fit in a backpack – give professors and students the flexibility to teach or learn in a way that’s best for them.
SEMICONDUCTORS
DIGIKEY IMPROVES MEMORY, ADDS KINGSTON TECH
DigiKey has partnered with Kingston Technology to distribute its memory and storage solutions globally.
As the world’s largest independent manufacturer of memory products, Kingston offers a wide variety of options, including eMMC, eMCP, ePoP, UFS and DRAM components for industrial and embedded OEM customers of all sizes. The company also provides an industrial SSD line of SATA and NVMe solid state drives (SSDs) created specifically for system designers and builders.
With this agreement, DigiKey can now offer Kingston’s products worldwide for immediate shipment, including embedded products, USB drives, enterprise solid state drives (SSDs), industr ial SSDs, and Kingston memory modules for use in IoT, networking and communications, embedded, infotainment, bio-medical, industrial.
ENVIRONMENTAL ENVIROPASS OPENS COMPLIANCE LAB IN MONTREAL
Environmental compliance consultancy Enviropass marked the g rand opening of its new stateof-the-art laboratory in Montreal. This cutting-edge facility marks a significant milestone in Enviropass’s commitment to providing top-tier services and advancing sustainable practices across various industries.
The new lab features the latest technology and instruments to handle environmental testing and analysis. The facility also offers comprehensive testing services, including chemical analysis, material characterization, and product compliance testing, ensuring that businesses meet critical environmental standards such as RoHS, packaging, and battery regulations.
DigiKey has partnered with Kingston Technology to offer its memory and storage solutions.
30W wireless charger evaluation board will speed the prototyping and development of ultra-high-efficiency, low-component-count wireless power transfer applications ranging from electric bikes and scooters through home appliances and industrial tools to drones and domestic robots.
The eval board is a high-performance wireless charger in which the transmitter works with a direct ac input, eliminating the need for external adapters. The receiver supports CC/ CV battery charging (other options are fixed voltage, and USB-C Power Delivery output), eliminating the need for a standalone PMIC.
The key components of the board include the EPIC (Eggtronic Power Integrated Controller), which includes a RISC-V core, a rich set of analog and digital peripherals, a patented interconnection matrix to run multiple virtual ASICs inside the chip, and a number of proprietary peripherals. EPIC is designed to be the perfect controller for Eggtronic-patented power conversion and wireless power architectures, reducing the number of ICs on pcbs and improving performance. This integration also reduces the Bill of Materials (BOM) by minimizing the number of ICs required.
The eval board achieves an overall efficiency higher than 82% from ac input to dc output, and above 91% dc to dc (coil-tocoil) efficiency at 30W - an efficiency that is similar to conventional corded power adapters at the same time as offering the convenience of wireless power.
Key features of eval board.
• Up to 30W continuous output power
AC/DC stage Integrated - Single EPIC controls both AC/DC and transmitter.
CC/CV battery charger capabilities integrated with the receiver EPIC IC.
The new board is based on a series-resonance wireless power transfer, which can be compatible with the Qi standard.
Operating with up to 92% efficiency and delivering up to 300W, eval board delivers all the benefits of wireless power transmission with performance comparable to top-tier wired ac adapters, while reducing both active and passive component counts by 50%.
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Don’t miss your chance to secure your spot at EPTECH Trade Shows. Pre-register today and gear up for an unforgettable journey into the world of technology!
Calgary
October 3
Mississauga
October 22
WE ARE IN-STOCK
Hammond has over 20 million dollars of in-stock inventory and over 16,000 unique product skus to choose from.
TRANSFORMERS
Low voltage power transformers, high-end audio transformers and chokes, medical grade isolation.
SMALL ENCLOSURES
Diecast aluminum, extruded aluminum, and plastic enclosures in thousands of sizes and configurations.
15A and 20A heavy duty outlet strips for commercial/industrial, rack mount, and benchtop applications.
ELECTRICAL ENCLOSURES
Junction, wall mount, and freestanding enclosures in painted steel, stainless steel, aluminum and non-metallic.
RACK MOUNTING SOLUTIONS
19” racks, cabinets, and accessories for test & measurement, data communications and more.
